TPS3110XXX [TI]
UltraLow Supply-Current/Supply-Voltage Supervisory Circuits; 超低电源电流/电源电压监控电路
| 型号： | TPS3110XXX |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | UltraLow Supply-Current/Supply-Voltage Supervisory Circuits |
| 文件： | 总23页 (文件大小：526K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS3103xxx
TPS3106xxx
TPS3110xxx
www.ti.com
SLVS363E–AUGUST 2001–REVISED SEPTEMBER 2007
UltraLow Supply-Current/Supply-Voltage Supervisory Circuits
1
FEATURES
DESCRIPTION
2
•
Precision Supply Voltage Supervision Range:
0.9 V, 1.2 V, 1.5 V, 1.6 V, 2 V, and 3.3 V
The TPS310x and TPS311x families of supervisory
circuits provide circuit initialization and timing
supervision, primarily for DSP and processor-based
systems.
•
•
•
High Trip-Point Accuracy: 0.75%
Supply Current of 1.2 μA (typical)
RESET Defined With Input Voltages as Low as
0.4 V
During power-on, RESET is asserted when the
supply voltage (VDD) becomes higher than 0.4 V.
Thereafter, the supervisory circuit monitors VDD and
keeps the RESET output active as long as VDD
remains below the threshold voltage (VIT). An internal
timer delays the return of the output to the inactive
state to ensure proper system reset. The delay time
starts after VDD has risen above VIT. When VDD drops
below VIT, the output becomes active again.
•
Power-On Reset Generator With a Delay Time
of 130 ms
•
•
•
Push/Pull or Open-Drain RESET Outputs
SOT23-6 Package
Package Temperature Range: –40°C to +85°C
APPLICATIONS
•
All the devices of this family have a fixed-sense
threshold voltage (VIT) set by an internal voltage
divider.
Applications Using Low-Power DSPs,
Microcontrollers, or Microprocessors
Portable- and Battery-Powered Equipment
Intelligent Instruments
Wireless Communication Systems
Industrial Equipment
•
•
•
•
•
The TPS3103 and TPS3106 have an active-low,
open-drain RESET output. The TPS3110 has an
active-low push/pull RESET.
The product spectrum is designed for supply voltages
of 0.9 V up to 3.3 V. The circuits are available in
SOT23-6 packages. The TPS31xx family is
characterized for operation over a temperature range
of –40°C to +85°C.
Notebook/Desktop Computers
TPS3106
DBV PACKAGE
(TOP VIEW)
TPS3103
DBV PACKAGE
(TOP VIEW)
3.3 V
1.6 V
1
2
3
1
2
3
VDD
6
5
VDD
6
5
RSTVDD
GND
RESET
GND
MR
VDD
VCORE
DSP
RESET
VIO
R3
RSTSENSE
SENSE
PFO
PFI
TPS3106K33DBV
R1
R2
4
4
MR
MR
RSTVDD
SENSE
TPS3110
DBV PACKAGE
(TOP VIEW)
RSTSENSE
GND
GND
GND
1
2
3
6
5
VDD
RESET
GND
WDI
Typical Application Circuit
4
SENSE
MR
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2001–2007, Texas Instruments Incorporated
TPS3103xxx
TPS3106xxx
TPS3110xxx
www.ti.com
SLVS363E–AUGUST 2001–REVISED SEPTEMBER 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
(2)
PRODUCT
NOMINAL SUPPLY VOLTAGE
THRESHOLD VOLTAGE, VIT
TPS3103E12DBVR
TPS3103E15DBVR
TPS3103H20DBVR
TPS3103K33DBVR
TPS3106E09DBVR
TPS3106E16DBVR
TPS3106K33DBVR
TPS3110E09DBVR
TPS3110E12DBVR
TPS3110E15DBVR
TPS3110K33DBVR
1.2 V
1.5 V
2.0 V
3.3 V
0.9 V
1.6 V
3.3 V
0.9 V
1.2 V
1.5 V
3.3 V
1.142 V
1.434 V
1.84 V
2.941 V
0.86 V
1.521 V
2.941 V
0.86 V
1.142 V
1.434 V
2.941 V
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Custom threshold voltages are available. Minimum order quantities apply. Contact factory for details and availability.
AVAILABLE OPTIONS
DEVICE
TPS3103
TPS3106
TPS3110
RESET OUTPUT
RSTSENSE, RSTVDD OUTPUT
SENSE INPUT
WDI INPUT
PFO OUTPUT
Open-drain
Open-drain
Open-drain
ü
ü
Push-pull
ü
ABSOLUTE MAXIMUM RATINGS(1)
Over operating free-air temperature range, unless otherwise noted.
VALUE
UNIT
V
(2)
Supply voltage, VDD
–0.3 to +3.6
MR Pin, VMR
–0.3 to VDD + 0.3
V
All other pins(2)
–0.3 to +3.6
V
Maximum low output current, IOL
Maximum high output current, IOH
5
mA
mA
mA
mA
–5
Input clamp current, IIK (VI < 0 or VI > VDD
)
±10
±10
(3)
Output clamp current, IOK (VO < 0 or VO > VDD
Continuous total power dissipation
Operating temperature range, TA
Storage temperature range, TSTG
Soldering temperature
)
See Dissipation Rating Table
–40 to +85
–65 to +150
+260
°C
°C
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to GND. For reliable operation, the device must not be operated at 3.6 V for more than t = 1000h
continuously.
(3) Output is clamped for push-pull outputs by the back gate diodes internal to the IC. No clamp exists for the open-drain outputs.
2
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Copyright © 2001–2007, Texas Instruments Incorporated
TPS3103xxx
TPS3106xxx
TPS3110xxx
www.ti.com
SLVS363E–AUGUST 2001–REVISED SEPTEMBER 2007
DISSIPATION RATINGS
TA ≤ +25°C
DERATING FACTOR
TA = +70°C
TA = +85°C
PACKAGE
POWER RATING
ABOVE TA = +25°C
POWER RATING
POWER RATING
DBV
437 mW
3.5 mW/°C
280 mW
227 mW
RECOMMENDED OPERATING CONDITIONS
Over operating free-air temperature range, unless otherwise noted.
MIN
MAX
3.3
UNIT
V
(1)
Supply voltage, VDD
0.4
0
Input voltage, VI
VDD + 0.3
V
High-level input voltage, VIH at MR, WDI
Low-level input voltage, VIL at MR, WDI
Input transition rise and fall rate at Δt/ΔV at MR, WDI
Operating temperature range, TA
0.7 × VDD
V
0.3 × VDD
100
V
ns/V
°C
–40
+85
(1) For proper operation of SENSE, PFI, and WDI functions: VDD ≥ 0.8 V.
ELECTRICAL CHARACTERISTICS
Over operating free-air temperature range (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VDD = 3.3 V, IOH = –3 mA
VDD = 1.8 V, IOH = –2 mA
VDD = 1.5 V, IOH = –1 mA
VDD = 0.9 V, IOH = –0.4 mA
VDD = 0.5 V, IOH = –5 μA
VDD = 3.3 V, IOL = 3 mA
VDD = 1.5 V, IOL = 2 mA
VDD = 1.2 V, IOL = 1 mA
VDD = 0.9 V, IOL = 500 μA
VDD = 0.4 V, IOL = 5 μA
0.8 × VDD
V
V
V
V
VOH
High-level output voltage
0.7 × VDD
VOL
Low-level output voltage
Low-level output voltage
0.3
VOL
RESET only
TPS31xxE09
TPS31xxE12
TPS31xxE15
TPS31xxE16
TPS31xxH20
TPS31xxK33
0.1
0.866
1.151
1.445
1.534
1.857
2.963
0.854
1.133
1.423
1.512
1.829
2.919
0.860
1.142
1.434
1.523
1.843
2.941
Negative-going input
threshold voltage(1)
VIT–
TA = +25°C
V
Negative-going input
threshold voltage(1)
VIT – (S)
SENSE, PFI
VDD ≥ 0.8 V, TA = +25°C
0.542
0.551
0.559
V
0.8 V ≤ VIT < 1.5 V
1.6 V ≤ VIT < 2.4 V
2.5 V ≤ VIT < 3.3 V
20
30
50
VHYS
Hysteresis at VDD input
mV
Temperature coefficient of VIT−, PFI,
SENSE
T(K)
TA = –40°C to +85°C
–0.012
15
–0.019
%/K
mV
VHYS
Hysteresis at SENSE, PFI input
MR
VDD ≥ 0.8 V
MR = VDD, VDD = 3.3 V
–25
–25
25
25
IIH
High-level input current
nA
SENSE, PFI,
WDI
SENSE, PFI, WDI = VDD
VDD = 3.3 V
,
(1) To ensure the best stability of the threshold voltage, a bypass capacitor (ceramic, 0.1 μF) should be placed close to the supply
terminals.
Copyright © 2001–2007, Texas Instruments Incorporated
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TPS3106xxx
TPS3110xxx
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SLVS363E–AUGUST 2001–REVISED SEPTEMBER 2007
ELECTRICAL CHARACTERISTICS (continued)
Over operating free-air temperature range (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
MR
MR = 0 V, VDD = 3.3 V
–47
–33
–25
μA
IIL
Low-level input current
SENSE, PFI,
WDI
SENSE, PFI, WDI = 0 V,
VDD = 3.3 V
–25
25
nA
nA
High-level output current
at RESET(2)
IOH
Open-drain
VDD = VIT + 0.2 V, VOH = 3.3 V
200
3
VDD > VIT (average current),
VDD < 1.8 V
1.2
2
VDD > VIT (average current),
VDD > 1.8 V
4.5
IDD
Supply current
μA
VDD < VIT, VDD < 1.8 V
VDD < VIT, VDD > 1.8 V
22
27
Internal pull-up resistor at MR
Input capacitance at MR, SENSE, PFI, WDI VI = 0 V to VDD
70
100
1
130
kΩ
CI
pF
(2) Also refers to RSTVDD and RSTSENSE.
SWITCHING CHARACTERISTICS
At RL = 1 MΩ, CL = 50 pF, and TA = –40°C to +85°C, unless otherwise noted.
PARAMETER
TEST CONDITIONS
DD ≥ 1.1 × VIT, MR = 0.7 × VDD, See Timing Diagrams
MIN
TYP
MAX UNIT
tD
Delay time
V
65
130
195
40
ms
Propagation delay time,
high-to-low level output
VDD to RESET or
RSTVDD delay
tPHL
VIH = 1.1 × VIT, VIL = 0.9 × VIT
VIH = 1.1 × VIT, VIL = 0.9 × VIT
μs
Propagation delay time,
low-to-high level output
VDD to RESET or
RSTVDD delay
tPLH
tPHL
tPLH
tPHL
tPLH
40
40
μs
μs
μs
μs
μs
Propagation delay time,
high-to-low level output
SENSE to RESET or
RSTSENSE delay
VDD ≥ 0.8 V, VIH = 1.1 × VIT, VIL = 0.9 × VIT
VDD ≥ 0.8 V, VIH = 1.1 × VIT, VIL = 0.9 × VIT
VDD ≥ 0.8 V, VIH = 1.1 × VIT, VIL = 0.9 × VIT
VDD ≥ 0.8 V, VIH = 1.1 × VIT, VIL = 0.9 × VIT
Propagation delay time,
high-to-low level output
SENSE to RESET or
RSTSENSE delay
40
Propagation delay time,
high-to-low level output
PFI to PFO delay
PFI to PFO delay
40
Propagation delay time,
low-to-high level output
300
MR to RESET.
RSTVDD,
RSTSENSE delay
Propagation delay time,
low-to-high level output
tPHL
V
DD ≥ 1.1 × VIT, VIL = 0.3 × VDD, VIH = 0.7 × VDD
DD ≥ 1.1 × VIT, VIL = 0.3 × VDD, VIH = 0.7 × VDD
1
1
5
5
μs
μs
MR to RESET.
RSTVDD,
RSTSENSE delay
Propagation delay time,
low-to-high level output
tPLH
V
TIMING REQUIREMENTS
At RL = 1 MΩ, CL = 50 pF, and TA = –40°C to +85°C, unless otherwise noted.
PARAMETER
tT(OUT) Time-out period
TEST CONDITIONS
MIN
0.55
20
TYP
1.1
MAX UNIT
at WDI
at VDD
at MR
V
DD ≥ 0.85 V
1.65
s
VIH = 1.1 × VIT, VIL = 0.9 × VIT–, VIT– = 0.86 V
V
V
V
V
DD ≥ VIT + 0.2 V, VIL = 0.3 × VDD, VIH = 0.7 × VDD
DD ≥ VIT, VIH = 1.1 × VIT − (S), VIL = 0.9 × VIT − (S)
DD ≥ 0.85 V, VIH = 1.1 × VIT − (S),VIL = 0.9 × VIT − (S)
DD ≥ VIT, VIL = 0.3 × VDD, VIH = 0.7 × VDD
0.1
20
tW
Pulse width
at SENSE
at PFI
μs
20
at WDI
0.3
4
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TPS3103xxx
TPS3106xxx
TPS3110xxx
www.ti.com
SLVS363E–AUGUST 2001–REVISED SEPTEMBER 2007
FUNCTIONAL BLOCK DIAGRAMS
TPS3103
VDD
VIT-
+
_
MR
RESET
PFO
Reset Logic
and Timer
+
_
PFI
0.551 V
GND
TPS3106
VDD
VIT-
+
_
MR
RSTVDD
Reset Logic
and Timer
RSTSENSE
Reset Logic
and Timer
+
_
SENSE
GND
0.551 V
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TPS3110
VDD
VIT-
+
_
MR
RESET
Reset Logic
and Timer
+
_
SENSE
0.551 V
Watchdog
Logic and
Control
WDI
GND
Table 1. TPS3103 FUNCTION TABLE
MR
L
V(PFI) > 0.551 V
VDD > VIT
RESET
PFO
L
0
1
0
0
1
1
X(1)
L
L
L
X
H
H
H
H
H
0
L
L
1
H
L
L
0
H
1
H
H
(1) X = Don’t care.
Table 2. TPS3106 FUNCTION TABLE
MR
L
V(SENSE) > 0.551 V
VDD > VIT
RSTVDD
RSTSENSE
X(1)
X
0
1
0
1
L
L
L
L
H
0
H
0
H
L
L
H
1
H
H
H
1
H
(1) X = Don’t care.
Table 3. TPS3110 FUNCTION TABLE(1)
MR
L
V(SENSE) > 0.551 V
VDD > VIT
RESET
X(2)
X
0
1
0
1
L
L
L
L
H
H
0
H
0
H
1
H
1
(1) Function of watchdog-timer not shown.
(2) X = Don’t care.
6
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TPS3103xxx
TPS3106xxx
TPS3110xxx
www.ti.com
SLVS363E–AUGUST 2001–REVISED SEPTEMBER 2007
PIN DESCRIPTIONS
TPS3106
DBV PACKAGE
(TOP VIEW)
TPS3103
DBV PACKAGE
(TOP VIEW)
TPS3110
DBV PACKAGE
(TOP VIEW)
1
2
3
6
5
1
2
3
VDD
6
5
VDD
1
2
3
6
5
VDD
RSTVDD
GND
RESET
GND
MR
RESET
GND
WDI
RSTSENSE
SENSE
PFO
PFI
4
SENSE
4
MR
4
MR
TERMINAL FUNCTIONS
TERMINAL
DEVICE
ALL
DESCRIPTION
NAME
NO.
GND
2
GND
Manual-reset input. Pull low to force a reset. RESET remains low as long as MR is low and for
the timeout period after MR goes high. Leave unconnected or connect to VDD when unused.
MR
ALL
3
PFI
TPS3103
TPS3103
4
5
Power-fail input compares to 0.551 V with no additional delay. Connect to VDD if not used.
Power-fail output. Goes high when voltage at PFI rises above 0.551 V.
PFO
TPS3103,
TPS3110
RESET
1
5
1
Active-low reset output. Either push-pull or open-drain output stage.
Active-low reset output. Logic level at RSTSENSE only depends on the voltage at SENSE and
the status of MR.
RSTSENSE
RSTVDD
TPS3106
TPS3106
Active-low reset output. Logic level at RSTVDD only depends on the voltage at VDD and the
status of MR.
TPS3106,
TPS3110
A reset will be asserted if the voltage at SENSE is lower than 0.551 V. Connect to VDD if
unused.
SENSE
VDD
4
6
ALL
Supply voltage. Powers the device and monitors its own voltage.
Watchdog timer input. If WDI remains high or low longer than the time-out period, then reset is
triggered. The timer clears when reset is asserted or when WDI sees a rising edge or a falling
edge.
WDI
TPS3110
5
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TPS3106xxx
TPS3110xxx
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TIMING DIAGRAMS
Timing Diagrams for TPS3103
VDD
VIT
0.4 V
t
tD
SENSE
VIT - (S) = 0.551 V
t
tD
tD
tD
tD
t
RESET
Output Condition
Undefined
Output Condition
Undefined
t
MR
t
PFI
VIT - (S) = 0.551 V
t
PFO
Output Condition
Undefined
Output Condition
Undefined
t
8
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TPS3103xxx
TPS3106xxx
TPS3110xxx
www.ti.com
SLVS363E–AUGUST 2001–REVISED SEPTEMBER 2007
Timing Diagram for TPS3106
VDD
VIT
0.4 V
tD
t
tD
RSTVDD
Output Condition
Undefined
Output Condition
Undefined
t
SENSE
VIT - (S) = 0.551 V
t
tD
RSTSENSE
Output Condition
Undefined
Output Condition
Undefined
t
tD
MR
t
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Timing Diagram for TPS3110
VDD
VIT
0.4 V
tD
t
t
SENSE
VIT - (S) = 0.551 V
tD
tD
tD
tD
tD
RESET
Output Condition
Undefined
Output Condition
Undefined
t(TOUT)
WDI
x = Don’t Care
MR
t
TYPICAL CHARACTERISTICS
TPS3110E09
SUPPLY CURRENT
vs
TPS3110E09
LOW-LEVEL OUTPUT VOLTAGE
vs
SUPPLY VOLTAGE
LOW-LEVEL OUTPUT CURRENT
20
18
16
14
12
10
8
0.30
TA = 85°C
SENSE = VDD
MR = Open
VDD = 0.9 V
SENSE = GND
MR = GND
WDI = GND
0.25
0.20
0.15
0.10
0.05
0
RESET = Open
WDI: Triggered
TA = 25°C
TA = 0°C
TA = 85°C
TA = 25°C
TA = 0°C
TA = -40°C
6
TA = -40°C
4
2
0
0
0.5
1.0
1.5
2.0
2.5
3.0
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
VDD - Supply Voltage - V
IOL - Low-Level Output Current - mA
Figure 1.
Figure 2.
10
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TPS3106xxx
TPS3110xxx
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TYPICAL CHARACTERISTICS (continued)
TPS3110E09
LOW-LEVEL OUTPUT VOLTAGE
vs
TPS3110E09
HIGH-LEVEL OUTPUT VOLTAGE
vs
LOW-LEVEL OUTPUT CURRENT
HIGH-LEVEL OUTPUT CURRENT
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.90
0.85
0.80
0.75
0.70
0.65
0.60
VDD = 3.3 V
SENSE = GND
MR = GND
WDI = GND
TA = 85°C
TA = 25°C
TA = 85°C
TA = 0°C
TA = -40°C
TA = 25°C
TA = 0°C
VDD = 0.9 V
TA = -40°C
SENSE = VDD
MR = VDD
WDI : Triggered
0
0
2
4
6
8
10 12 14 16 18 20
0
-0.1
-0.2
-0.3
-0.4
-0.5
IOL - Low-Level Output Current - mA
IOH - High-Level Output Current - mA
Figure 3.
Figure 4.
TPS3110K33
HIGH-LEVEL OUTPUT VOLTAGE
vs
MINIMUM PULSE DURATION AT VDD
vs
THRESHOLD OVERDRIVE VOLTAGE
HIGH-LEVEL OUTPUT CURRENT
3.4
3.2
50
VDD = 3.3 V
MR : Open
SENSE = VDD
45
40
35
30
25
20
15
10
SENSE = VDD
MR = VDD
WDI : Triggered
3.0
2.8
2.6
2.4
2.2
TA = -40°C
VDD = 3.3 V
TA = 0°C
TA = 25°C
TA = 85°C
VDD = 0.9 V
5
0
2.0
0
-5
-10
-15
-20
-25
0
0.1
0.2
0.3
0.4
0.5
VDD - Threshold Overdrive Voltage - V
IOH - Low-Level Output Current - mA
Figure 5.
Figure 6.
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TYPICAL CHARACTERISTICS (continued)
NORMALIZED THRESHOLD VOLTAGE
vs
FREE-AIR TEMPERATURE
1.008
1.006
1.004
1.002
1.000
0.998
0.996
0.994
0.992
-50
0
50
100
TA - Free-Air Temperature - °C
Figure 7.
12
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Copyright © 2001–2007, Texas Instruments Incorporated
TPS3103xxx
TPS3106xxx
TPS3110xxx
www.ti.com
SLVS363E–AUGUST 2001–REVISED SEPTEMBER 2007
APPLICATION INFORMATION
The TPS31xx family has a quiescent current in the 1-μA to 2-μA range. When RESET is active, triggered by the
voltage monitored at VDD, the quiescent current increases to about 20 μA (see the Electrical Characteristics).
In some applications it is necessary to minimize the quiescent current even during the reset period. This is
especially true when the voltage of a battery is supervised and the RESET is used to shut down the system or
for an early warning. In this case the reset condition will last for a longer period of time. The current drawn from
the battery should almost be zero, especially when the battery is discharged.
For this kind of application, either the TPS3103 or TPS3106 is a good fit. To minimize current consumption,
select a version where the threshold voltage is lower than the voltage monitored at VDD. The TPS3106 has two
reset outputs. One output (RSTVDD) is triggered from the voltage monitored at VDD. The other output
(RSTSENSE) is triggered from the voltage monitored at SENSE. In the application shown in Figure 8, the
TPS3106E09 is used to monitor the input voltage of two NiCd or NiMH cells. The threshold voltage (V(TH) = 0.86
V) was chosen as low as possible to ensure that the supply voltage is always higher than the threshold voltage
at VDD. The voltage of the battery is monitored using the SENSE input. The voltage divider was calculated to
assert a reset using the RSTSENSE output at 2 × 0.8 V = 1.6 V.
VTRIP
ǒ Ǔ
R1 + R2
* 1
VIT S
(
)
(1)
where:
VTRIP is the voltage of the battery at which a reset is asserted and
VIT(S) is the threshold voltage at SENSE = 0.551 V.
R1 was chosen for a resistor current in the 1-μA range.
With VTRIP = 1.6 V:
R1 ≡ 1.9 × R2
R1 = 820 kΩ, R2 = 430 kΩ
VDD
R3
TPS3106E09DBV
R1
MR
2 Cell
NiMH
RSTVDD
SENSE
Reset Output
RSTSENSE
GND
R2
Figure 8. Battery Monitoring with 3-μA Supply Current for Device and Resistor Divider
Copyright © 2001–2007, Texas Instruments Incorporated
Submit Documentation Feedback
13
TPS3103xxx
TPS3106xxx
TPS3110xxx
www.ti.com
SLVS363E–AUGUST 2001–REVISED SEPTEMBER 2007
WATCHDOG
The TPS3110 device integrates a watchdog timer that must be periodically triggered by a positive or negative
transition of WDI. When the supervising system fails to retrigger the watchdog circuit within the time-out interval,
RESET becomes active for the time period (tD). This event also reinitializes the watchdog timer.
MANUAL RESET (MR)
Many μC-based products require manual-reset capability, allowing an operator or logic circuitry to initiate a reset.
Logic low at MR asserts reset. Reset remains asserted while MR is low and for a time period (tD) after MR
returns high. The input has an internal 100-kΩ pull-up resistor, so it can be left open if it is unused.
Connect a normally open momentary switch from MR to GND to create a manual reset function. External
debounce is not required. If MR is driven from long cables or if the device is used in noisy environments,
connecting a 0.1-μF capacitor from MR to GND provides additional noise immunity.
If there is a possibility of transient or DC conditions causing MR to rise above VDD, a diode should be used to
limit MR to a diode drop above VDD
.
PFI, PFO
The TPS3103 has an integrated power-fail (PFI) comparator with a separate open-drain (PFO) output. The PFI
and PFO can be used for low-battery detection, power-fail warning, or for monitoring a power supply other than
the main supply, and has no effect on RESET.
An additional comparator is provided to monitor voltages other than the nominal supply voltage. The power-fail
input (PFI) will be compared with an internal voltage reference of 0.551 V. If the input voltage falls below the
power-fail threshold (VIT – (S)), the power-fail output (PFO) goes low. If it goes above 0.551 V plus approximately
15-mV hysteresis, the output returns to high. By connecting two external resistors, it is possible to supervise any
voltage above 0.551 V. The sum of both resistors should be approximately 1 MΩ, to minimize power
consumption and to assure that the current into the PFI pin can be neglected, compared with the current through
the resistor network. The tolerance of the external resistors should be not more than 1% to ensure minimal
variation of sensed voltage. If the power-fail comparator is unused, connect PFI to GND and leave PFO
unconnected. For proper operation of the PFI-comparator, the supply voltage (VDD) must be higher than 0.8 V.
SENSE
The voltage at the SENSE input is compared with a reference voltage of 0.551 V. If the voltage at SENSE falls
below the sense-threshold (VIT (S)), reset is asserted. On the TPS3106, a dedicated RSTSENSE output is
−
available. On the TPS3110, the logic signal from SENSE is OR-wired with the logic signal from VDD or MR. An
internal timer delays the return of the output to the inactive state, once the voltage at SENSE goes above 0.551
V plus about 15 mV of hysteresis. For proper operation of the SENSE-comparator, the supply voltage must be
higher than 0.8 V.
14
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Copyright © 2001–2007, Texas Instruments Incorporated
TPS3103xxx
TPS3106xxx
TPS3110xxx
www.ti.com
SLVS363E–AUGUST 2001–REVISED SEPTEMBER 2007
2 V
VDD
VDD
(1) (1)
MSP430
Low-Power mC
TPS3103H20
R1
R2
MR
PFI
Px.x
Analog
Circuit
RESET
PFO
RESET
Py.x
GND
GND
-2 V
R2
R1
V(NEG_TH) = 0.551 V -
(VDD - 0.551 V)
(1) Resistor may be integrated in mC.
Figure 9. TPS3103 Monitoring a Negative Voltage
3.3 V
1.5 V
VCORE
VIO
VDD
R1
R2
TPS3110K33
DSP
RESET
R1 + R2
R2
V(CORE_TH) = 0.551 V x
MR
RESET
SENSE
Px.y
WDI
GND
GND
GND
Figure 10. TPS3110 in a DSP-System Monitoring Both Supply Voltages
Copyright © 2001–2007, Texas Instruments Incorporated
Submit Documentation Feedback
15
PACKAGE OPTION ADDENDUM
www.ti.com
12-Sep-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SN0402002DBVR
TPS3103E12DBVR
ACTIVE
ACTIVE
SOT-23
SOT-23
DBV
6
6
TBD
Call TI
Call TI
DBV
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS3103E12DBVRG4
TPS3103E12DBVT
TPS3103E12DBVTG4
TPS3103E15DBVR
TPS3103E15DBVRG4
TPS3103E15DBVT
TPS3103E15DBVTG4
TPS3103H20DBVR
TPS3103H20DBVRG4
TPS3103H20DBVT
TPS3103H20DBVTG4
TPS3103K33DBVR
TPS3103K33DBVRG4
TPS3103K33DBVT
TPS3103K33DBVTG4
TPS3106E09DBVR
TPS3106E09DBVRG4
TPS3106E09DBVT
TPS3106E09DBVTG4
TPS3106E16DBVR
TPS3106E16DBVRG4
TPS3106E16DBVT
TPS3106E16DBVTG4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
12-Sep-2007
Orderable Device
TPS3106K33DBVR
TPS3106K33DBVRG4
TPS3106K33DBVT
TPS3106K33DBVTG4
TPS3110E09DBVR
TPS3110E09DBVRG4
TPS3110E09DBVT
TPS3110E09DBVTG4
TPS3110E12DBVR
TPS3110E12DBVRG4
TPS3110E12DBVT
TPS3110E12DBVTG4
TPS3110E15DBVR
TPS3110E15DBVRG4
TPS3110E15DBVT
TPS3110E15DBVTG4
TPS3110K33DBVR
TPS3110K33DBVRG4
TPS3110K33DBVT
TPS3110K33DBVTG4
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOT-23
DBV
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
12-Sep-2007
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
179
179
179
179
179
179
179
180
179
180
180
180
180
180
180
180
180
180
180
(mm)
8
TPS3103E12DBVR
TPS3103E12DBVT
TPS3103E15DBVR
TPS3103E15DBVT
TPS3103H20DBVR
TPS3103H20DBVT
TPS3103K33DBVR
TPS3103K33DBVR
TPS3103K33DBVT
TPS3103K33DBVT
TPS3106E09DBVR
TPS3106E09DBVT
TPS3106E16DBVR
TPS3106E16DBVT
TPS3106K33DBVR
TPS3106K33DBVT
TPS3110E09DBVR
TPS3110E09DBVT
TPS3110E12DBVR
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
SITE 48
SITE 48
SITE 48
SITE 48
SITE 48
SITE 48
SITE 48
SITE 40
SITE 48
SITE 40
SITE 40
SITE 40
SITE 40
SITE 40
SITE 40
SITE 40
SITE 40
SITE 40
SITE 40
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
8
8
3.2
8
3.2
8
3.2
8
3.2
8
3.2
9
3.15
3.2
8
9
3.15
3.15
3.15
3.15
3.15
3.15
3.15
3.15
3.15
3.15
9
9
9
9
9
9
9
9
9
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Oct-2007
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
180
180
180
180
180
(mm)
TPS3110E12DBVT
TPS3110E15DBVR
TPS3110E15DBVT
TPS3110K33DBVR
TPS3110K33DBVT
DBV
DBV
DBV
DBV
DBV
6
6
6
6
6
SITE 40
SITE 40
SITE 40
SITE 40
SITE 40
9
9
9
9
9
3.15
3.15
3.15
3.15
3.15
3.2
3.2
3.2
3.2
3.2
1.4
1.4
1.4
1.4
1.4
4
4
4
4
4
8
8
8
8
8
Q3
Q3
Q3
Q3
Q3
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
TPS3103E12DBVR
TPS3103E12DBVT
TPS3103E15DBVR
TPS3103E15DBVT
TPS3103H20DBVR
TPS3103H20DBVT
TPS3103K33DBVR
TPS3103K33DBVR
TPS3103K33DBVT
TPS3103K33DBVT
TPS3106E09DBVR
TPS3106E09DBVT
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
6
6
6
6
6
6
6
6
6
6
6
6
SITE 48
SITE 48
SITE 48
SITE 48
SITE 48
SITE 48
SITE 48
SITE 40
SITE 48
SITE 40
SITE 40
SITE 40
195.0
195.0
195.0
195.0
195.0
195.0
195.0
182.0
195.0
182.0
182.0
182.0
200.0
200.0
200.0
200.0
200.0
200.0
200.0
182.0
200.0
182.0
182.0
182.0
45.0
45.0
45.0
45.0
45.0
45.0
45.0
20.0
45.0
20.0
20.0
20.0
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Oct-2007
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
TPS3106E16DBVR
TPS3106E16DBVT
TPS3106K33DBVR
TPS3106K33DBVT
TPS3110E09DBVR
TPS3110E09DBVT
TPS3110E12DBVR
TPS3110E12DBVT
TPS3110E15DBVR
TPS3110E15DBVT
TPS3110K33DBVR
TPS3110K33DBVT
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
6
6
6
6
6
6
6
6
6
6
6
6
SITE 40
SITE 40
SITE 40
SITE 40
SITE 40
SITE 40
SITE 40
SITE 40
SITE 40
SITE 40
SITE 40
SITE 40
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
20.0
20.0
20.0
20.0
20.0
20.0
20.0
20.0
20.0
20.0
20.0
20.0
Pack Materials-Page 3
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improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
RFID
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lpw
Telephony
Low Power
Wireless
Video & Imaging
Wireless
www.ti.com/wireless
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