TPS3831K33 [TI]
Ultralow Power, Supply Voltage Supervisor; 超低功耗，电源电压监控器
| 型号： | TPS3831K33 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Ultralow Power, Supply Voltage Supervisor |
| 文件： | 总24页 (文件大小：906K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS3831
TPS3839
www.ti.com
SBVS193B –JUNE 2012–REVISED APRIL 2013
Ultralow Power, Supply Voltage Supervisor
Check for Samples: TPS3831, TPS3839
1
FEATURES
DESCRIPTION
The TPS3831 and TPS3839 (both referred to as the
2
•
•
•
•
•
•
•
Ultralow Supply Current: 150 nA (typ)
Operating Supply Voltage: 0.6 V to 6.5 V
Valid Reset for VDD > 0.6 V
TPS383x) are ultralow current (150 nA, typical),
voltage supervisory circuit that monitor a single
voltage. Both devices assert an active-low reset
signal whenever the VDD supply voltage drops below
the factory-trimmed reset threshold voltage. The reset
output remains asserted for 200 ms (typical) after the
VDD voltage rises above the threshold voltage. These
devices are designed to ignore fast transients on the
VDD pin. Note that the TPS3831 includes a manual
reset input.
Push-Pull RESET Output
Factory-Trimmed Reset Threshold Voltages
Temperature Range: –40°C to +85°C
Packages: 1-mm × 1-mm X2SON or 3-Pin
SOT23
APPLICATIONS
The ultralow current consumption of 150 nA makes
these voltage supervisors ideal for use in low-power
and portable applications. The TPS383x are specified
to have the correct output logic state for supply
voltages down to 0.6 V.
•
•
•
•
•
•
Portable and Battery-Powered Equipment
Industrial Equipment
Cell Phones
Glucose Monitors
Metering
The TPS383x feature precision factory-trimmed
threshold voltages and extremely low-power
operation. The TPS3831 is available is a 4-pin 1-mm
× 1-mm (DQN) X2SON package. The TPS3839 is
available in a 3-pin SOT23 (DBZ) package or a 4-pin
1-mm × 1-mm (DQN) X2SON package.
Televisions
TYPICAL APPLICATION
DBZ PACKAGE
SOT23-3
(TOP VIEW)
3.3 V
GND
1
2
C1
0.1 mF
VDD
3
VDD
RESET
Microprocessor
RST
TPS383xK33
MR
RESET
GND
TPS3831
DQN PACKAGE
1-mm ´ 1-mm X2SON
(TOP VIEW)
TPS3839
DQN PACKAGE
1-mm ´ 1-mm X2SON
(TOP VIEW)
TPS3831
Only
VDD
VDD
1
4
1
4
RESET
RESET
Thermal
Pad
Thermal
Pad
MR
2
3
GND
NC
2
3
GND
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012–2013, Texas Instruments Incorporated
TPS3831
TPS3839
SBVS193B –JUNE 2012–REVISED APRIL 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE INFORMATION(1)
PACKAGE
PRODUCT
TPS3831A09
TPS3831G12
TPS3831E16
TPS3831G18
TPS3831L30
TPS3831K33
TPS3831G33
TPS3831K50
THRESHOLD VOLTAGE (V)
PACKAGE-LEAD
X2SON-4
X2SON-4
X2SON-4
X2SON-4
X2SON-4
X2SON-4
X2SON-4
X2SON-4
SOT23-3
X2SON-4
SOT23-3
X2SON-4
SOT23-3
X2SON-4
SOT23-3
X2SON-4
SOT23-3
X2SON-4
SOT23-3
X2SON-4
SOT23-3
X2SON-4
SOT23-3
X2SON-4
DESIGNATOR
DQN
DQN
DQN
DQN
DQN
DQN
DQN
DQN
DBZ
0.900
1.100
1.520
1.670
2.630
2.930
3.080
4.380
TPS3839A09
TPS3839G12
TPS3839E16
TPS3839G18
TPS3839L30
TPS3839K33
TPS3839G33
TPS3839K50
0.900
1.100
1.520
1.670
2.630
2.930
3.080
4.380
DQN
DBZ
DQN
DBZ
DQN
DBZ
DQN
DBZ
DQN
DBZ
DQN
DBZ
DQN
DBZ
DQN
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS(1)
Over operating free-air temperature range, unless otherwise noted.
VALUE
MIN
–0.3
–0.3
MAX
7
UNIT
V
VDD
Voltage
On RESET
7
V
Current
RESET pin
10
mA
°C
°C
kV
V
Operating ambient, TA
Storage, Tstg
–40
–65
+85
+150
2
Temperature(2)
Human body model (HBM)
Charge device model (CDM)
Electrostatic discharge (ESD) rating:
500
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.
(2) As a result of the low dissipated power in this device, it is assumed that the junction temperature is equal to the ambient temperature.
2
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TPS3839
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SBVS193B –JUNE 2012–REVISED APRIL 2013
THERMAL INFORMATION
TPS3831
TPS3839
TPS3839
THERMAL METRIC(1)
UNITS
DBZ (SOT23-3) DQN (X2SON)
3 PINS
286.9
105.6
123.4
25.8
4 PINS
249.9
N/A
θJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
θJCtop
θJB
N/A
°C/W
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
6.0
ψJB
107.9
N/A
N/A
θJCbot
N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
ELECTRICAL CHARACTERISTICS
At TA = –40°C to +85°C, 0.9 V < VDD < 6.5 V, and C1 = 0.1 µF, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
VDD
V(VO)
IDD
Input supply voltage range
Minimum VDD voltage for valid output
Supply current (into VDD pin)
0.9
6.5
0.6
500
0.4
0.4
0.4
V
V
IOL = 1 µA
Output not connected
150
nA
V
VDD = 0.9 V to 1.2 V, IOL = 120 µA
VDD = 1.2 V to 2.8 V, IOL = 0.5 mA
VDD = 2.8 V to 6.5 V, IOL = 2 mA
VDD = 0.9 V to 1.2 V, IOH = –50 µA
VDD = 1.2 V to 3.3 V, IOH = –0.5 mA
VDD = 3.3 V to 6.5 V, IOH = –2 mA
VOL
Low-level output voltage (RESET pin)
High-level output voltage (RESET pin)
V
V
VDD – 0.4
VDD – 0.4
VDD – 0.4
0.3VDD
V
VOH
V
V
VIL
Low-level input voltage (MR pin)
High-level input voltage (MR pin)
MR pin pull-up resistance
V
VIH
RMR
0.7VDD
30
V
10
20
±1.0%
0.900
1.100
1.520
1.670
2.630
2.930
3.080
4.380
54
kΩ
Negative-going input threshold accuracy TA = +25°C
TPS3839A09
TPS3839G12
TPS3839E16
0.874
1.073
1.482
1.628
2.564
2.857
3.003
4.271
0.914
1.117
1.543
1.695
2.669
2.974
3.126
4.446
V
V
V
TPS3839G18
Negative-going threshold voltage
TPS3839L30
V
VIT–
V
TPS3839K33
TPS3839G33
TPS3839K50
TPS3839A09
TPS3839G12
TPS3839E16
V
V
V
mV
mV
mV
mV
mV
mV
mV
mV
11
15
TPS3839G18
17
Vhys
Hysteresis voltage
TPS3839L30
26
TPS3839K33
TPS3839G33
TPS3839K50
29
31
44
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TPS3839
SBVS193B –JUNE 2012–REVISED APRIL 2013
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TIMING REQUIREMENTS
PARAMETER
MIN
TYP
200
20
MAX
UNIT
ms
µs
td
RESET delay time (power-up delay)
120
350
tpd_vdd
tpd_mr
Propagation delay, VDD falling (power-down delay)
Propagation delay from MR low to RESET low
46
ns
TIMING DIAGRAM
VDD
0.6 V
0.0 V
RESET
td = Reset Delay
= Undefined State
td
td
td
VIT- + VHYS
VIT-
MR
0.7VDD
0.3VDD
Time
Figure 1. MR and VDD Reset Timing
4
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TPS3831
TPS3839
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SBVS193B –JUNE 2012–REVISED APRIL 2013
PIN CONFIGURATIONS
TPS3831 DQN PACKAGE
1-mm × 1-mm X2SON
(TOP VIEW)
TPS3839 DQN PACKAGE
1-mm × 1-mm X2SON
(TOP VIEW)
VDD
1
4
RESET
VDD
1
4
RESET
Thermal
Pad
Thermal
Pad
MR
2
3
GND
NC
2
3
GND
TPS3839 DBZ PACKAGE
SOT23-3
(TOP VIEW)
GND
1
2
VDD
3
RESET
PIN ASSIGNMENTS
PIN NUMBER
TPS3839DQN
3
NAME
TPS3839DBZ
TPS3831DQN
DESCRIPTION
GND
1
3
Ground
Manual reset. Pull this pin to a logic low to assert the RESET
output. After the MR pin is deasserted, the RESET output
deasserts after the reset delay (td) elapses.
MR
NC
N/A
N/A
N/A
2
2
N/A
No internal connection.
Active-low reset output. RESET has a push-pull output drive and is
capable of directly driving input pins. RESET is low as long as VDD
remains below the factory threshold voltage, and until the delay
time (tD) elapses after VDD rises above the threshold voltage.
RESET
2
1
1
Thermal pad
VDD
N/A
3
Available
4
Available
4
Connect to ground or floating copper plane for mechanical stability.
Supply voltage
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SBVS193B –JUNE 2012–REVISED APRIL 2013
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DEVICE INFORMATION
FUNCTIONAL BLOCK DIAGRAM
VDD
Delay
RESET
VREF
GND
VDD
MR
(TPS3831 Only)
Figure 2. TPS383x Block Diagram
APPLICATION CIRCUIT
3.3 V
C1
0.1 mF
VDD
Microprocessor
RST
TPS383xK33
MR
RESET
GND
TPS3831
Only
Figure 3. Typical Application Circuit
6
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TPS3831
TPS3839
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SBVS193B –JUNE 2012–REVISED APRIL 2013
TYPICAL CHARACTERISTICS
At TA = +25°C and C1 = 0.1 µF, unless otherwise noted.
200
190
180
170
160
150
140
130
120
110
100
220
VDD = 1.2 V
VDD = 3.3 V
VDD = 5.0 V
VDD = 6.5 V
TPS3839K33
210
200
190
180
−40
−15
10
35
60
85
−40
−15
10
35
60
85
Temperature (°C)
Temperature (°C)
G001
G002
Figure 4. SUPPLY CURRENT vs INPUT VOLTAGE AND
TEMPERATURE
Figure 5. RESET DELAY vs TEMPERATURE
0.2
0
1.8
1.6
1.4
1.2
1
VDD = 1.8 V
−0.2
−0.4
−0.6
TA = −40°C
TA = 0°C
TA = +25°C
TA = +85°C
−0.8
TPS3839A09
TPS3839K50
−1
−40
0.8
−15
10
35
60 85
0
0.5
1
1.5
2
2.5
3
3.5
Temperature (°C)
IOH (mA)
G003
G004
Figure 6. PERCENTAGE CHANGE IN THRESHOLD
VOLTAGE vs TEMPERATURE
Figure 7. VOH vs IOH AND TEMPERATURE FOR VDD = 1.8 V
vs
3.5
4
VDD = 3.3 V
VDD =4.0 V
3.5
3
2.5
1.5
0.5
TA = −40°C
TA = 0°C
TA = +25°C
TA = +85°C
TA = −40°C
2.5
TA = 0°C
TA = +25°C
TA = +85°C
2
0
2
4
6
8
10
0
2
4
6
8
10
12
IOH (mA)
IOH (mA)
G005
G006
Figure 8. VOH vs IOH AND TEMPERATURE FOR VDD = 3.3 V
Figure 9. VOH vs IOH AND TEMPERATURE FOR VDD = 4.0 V
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TYPICAL CHARACTERISTICS (continued)
At TA = +25°C and C1 = 0.1 µF, unless otherwise noted.
1.6
1.6
1.4
1.2
1
TA = −40°C
TA = 0°C
TA = +25°C
TA = +25°C
TA = −40°C
TA = 0°C
TA = +25°C
TA = +85°C
1.4
1.2
1
0.8
0.6
0.4
0.2
0
0.8
0.6
0.4
0.2
0
VDD = 1.8 V
4
VDD = 3.3 V
8 10
0
1
2
3
5
0
2
4
6
IOL (mA)
IOL (mA)
G007
G008
Figure 10. VOL vs IOL AND TEMPERATURE FOR VDD = 1.8 V
Figure 11. VOL vs IOL AND TEMPERATURE FOR VDD = 3.3 V
1.4
50
TA = −40°C
TA = 0°C
Reset Occurs Above Line
45
1.2
1
TA = +25°C
TA = +85°C
40
35
30
25
20
15
10
0.8
0.6
0.4
0.2
0
VDD = 4.0 V
10
0
2
4
6
8
0
5
10
15
20
25
30
35
IOL (mA)
VDD voltage drop below VIT− (%)
G009
G010
Figure 12. VOL vs IOL AND TEMPERATURE FOR VDD = 4.0 V
Figure 13. MAXIMUM PULSE DURATION vs PERCENT OF
THRESHOLD OVERDRIVE
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TPS3839
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SBVS193B –JUNE 2012–REVISED APRIL 2013
APPLICATION INFORMATION
VDD TRANSIENT REJECTION
The TPS383x (TPS3831 and TPS3839) has built-in rejection of fast transients on the VDD pin. Transient
rejection depends on both the duration and amplitude of the transient. Transient amplitude is measured from the
bottom of the transient to the negative threshold voltage (VIT–) of the device, as shown in Figure 14.
VDD
VIT-
Transient
Amplitude
Transient
Duration
(tW)
Figure 14. Voltage Transient Measurement
Figure 15 shows the relationship between the transient amplitude and duration required to trigger a reset. Any
combination of duration and amplitude greater than that shown in Figure 15 generates a reset signal.
50
Reset Occurs Above Line
45
40
35
30
25
20
15
10
0
5
10
15
20
25
30
35
VDD voltage drop below VIT− (%)
G010
Figure 15. TPS3839 Transient Rejection
INPUT CAPACITOR
The TPS383x uses a unique sampling scheme to maintain an extremely low average quiescent current of 150
nA. The TPS383x typically consumes only about 100 nA of dc current. However, this current rises to
approximately 15 µA for around 200 µs while the TPS383x samples the input voltage. If the source impedance
back to the supply voltage is high, then the additional current during sampling may trigger a false reset as a
result of the apparent voltage drop at VDD. For high VDD source or trace impedance applications, it is
recommended to add a small 0.1-µF bypass capacitor near the TPS3839 VDD pin. This bypass capacitor
effectively keeps the average current at 150 nA and reduces the effects of a high-impedance voltage source.
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MANUAL RESET (MR) INPUT (TPS3831 Only)
The manual reset (MR) input allows a processor, or other logic devices, to initiate a reset (TPS3831 only). A logic
low (0.3 VDD) on MR causes RESET to assert. After MR returns to a logic high and VDD is greater than the
threshold voltage, RESET is deasserted after the reset delay time, td, elapses. Note that MR is internally tied to
VDD with a 20-kΩ resistor; therefore, this pin can be left unconnected if MR is not used. If a logic signal driving
MR does not go fully to VDD, there will be some additional current draw into VDD as a result of the internal pull-
up resistor on MR. To minimize current draw, a logic-level FET can be used, as illustrated in Figure 16.
VDD
20 kW
MR
TPS3831
GND
Figure 16. Using Logic-Level FET to Minimize Current Draw
BIDIRECTIONAL RESET PINS
Some microcontrollers have bidirectional reset pins that act both as an input and an output. A series resistor
should be placed between the TPS383x output and the microcontroller reset pin to protect against excessive
current flow when both the TPS383x and the microcontroller attempt to drive the reset line. Figure 17 shows the
connection of the TPS3839K33 with a microcontroller using a series resistor to drive a bidirectional reset line.
3.3 V
VCC
VDD
Microprocessor
TPS3839K33
47 kW
RST
RESET
GND
Figure 17. Connection to Bidirectional Reset Pin
10
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TPS3839
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SBVS193B –JUNE 2012–REVISED APRIL 2013
APPLICATION EXAMPLE: SINGLE ALKALINE CELL MONITORING
Low operating voltage and threshold options make the TPS383x well-suited for monitoring single-cell, alkaline-
battery applications. Figure 18 shows the TPS3839A09 used to disable a boost converter when the cell voltage
reaches 0.9 V, which is the end of the discharge voltage for a single alkaline battery cell. When the cell voltage
reaches 0.9 V, the TPS61261 enable pin is driven low. This setting disables the TPS61261 and places it in a
low-current shutdown state. The combination of the TPS3839 and TPS61261 consumes only 250 nA (typical)
from the discharged battery.
VIN
L
VOUT
FB
3.3 V at 40 mA
4.7 mH
10 mF
10 mF
VDD
TPS61261
TPS3839A09
One-Cell
Alkaline
EN
RI
RESET
GND
5 kW
GND
Figure 18. Disabled Boost Converter
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REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current verison.
Changes from Revision A (September 2012) to Revision B
Page
•
Changed VDD test conditions for high-level output voltage parameter ................................................................................. 3
Changes from Original (June 2012) to Revision A
Page
•
Changed data sheet status from product preview to production data .................................................................................. 1
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PACKAGE OPTION ADDENDUM
www.ti.com
21-May-2013
PACKAGING INFORMATION
Orderable Device
TPS3831A09DQNR
TPS3831A09DQNT
TPS3831E16DQNR
TPS3831E16DQNT
TPS3831G12DQNR
TPS3831G12DQNT
TPS3831G18DQNR
TPS3831G18DQNT
TPS3831G33DQNR
TPS3831G33DQNT
TPS3831K33DQNR
TPS3831K33DQNT
TPS3831K50DQNR
TPS3831K50DQNT
TPS3831L30DQNR
TPS3831L30DQNT
TPS3839A09DBZR
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
ACTIVE
X2SON
X2SON
X2SON
X2SON
X2SON
X2SON
X2SON
X2SON
X2SON
X2SON
X2SON
X2SON
X2SON
X2SON
X2SON
X2SON
SOT-23
DQN
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
3
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
A3
A3
A5
A5
A4
A4
A6
A6
A7
A7
A8
A8
A9
A9
BA
BA
PZDI
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DQN
DQN
DQN
DQN
DQN
DQN
DQN
DQN
DQN
DQN
DQN
DQN
DQN
DQN
DQN
DBZ
250
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
3000
Green (RoHS
& no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
21-May-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
TPS3839A09DBZT
TPS3839A09DQNR
TPS3839A09DQNT
TPS3839E16DBZR
TPS3839E16DBZT
TPS3839E16DQNR
TPS3839E16DQNT
TPS3839G12DBZR
TPS3839G12DBZT
TPS3839G12DQNR
TPS3839G12DQNT
TPS3839G18DBZR
TPS3839G18DBZT
TPS3839G18DQNR
TPS3839G18DQNT
TPS3839G33DBZR
TPS3839G33DBZT
TPS3839G33DQNR
ACTIVE
SOT-23
X2SON
X2SON
SOT-23
SOT-23
X2SON
X2SON
SOT-23
SOT-23
X2SON
X2SON
SOT-23
SOT-23
X2SON
X2SON
SOT-23
SOT-23
X2SON
DBZ
3
4
4
3
3
4
4
3
3
4
4
3
3
4
4
3
3
4
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
PZDI
ZJ
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DQN
DQN
DBZ
DBZ
DQN
DQN
DBZ
DBZ
DQN
DQN
DBZ
DBZ
DQN
DQN
DBZ
DBZ
DQN
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
ZJ
3000
250
Green (RoHS
& no Sb/Br)
PZCI
PZCI
ZK
Green (RoHS
& no Sb/Br)
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
ZK
3000
250
Green (RoHS
& no Sb/Br)
PZBI
PZBI
ZE
Green (RoHS
& no Sb/Br)
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
ZE
3000
250
Green (RoHS
& no Sb/Br)
PZAI
PZAI
ZL
Green (RoHS
& no Sb/Br)
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
ZL
3000
250
Green (RoHS
& no Sb/Br)
PYZI
PYZI
ZG
Green (RoHS
& no Sb/Br)
3000
Green (RoHS
& no Sb/Br)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
21-May-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
TPS3839G33DQNT
TPS3839K33DBZR
TPS3839K33DBZT
TPS3839K33DQNR
TPS3839K33DQNT
TPS3839K50DBZR
TPS3839K50DBZT
TPS3839K50DQNR
TPS3839K50DQNT
TPS3839L30DBZR
TPS3839L30DBZT
TPS3839L30DQNR
TPS3839L30DQNT
ACTIVE
X2SON
SOT-23
SOT-23
X2SON
X2SON
SOT-23
SOT-23
X2SON
X2SON
SOT-23
SOT-23
X2SON
X2SON
DQN
4
3
3
4
4
3
3
4
4
3
3
4
4
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
ZG
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DBZ
DBZ
DQN
DQN
DBZ
DBZ
DQN
DQN
DBZ
DBZ
DQN
DQN
3000
250
Green (RoHS
& no Sb/Br)
PYYI
PYYI
ZF
Green (RoHS
& no Sb/Br)
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
ZF
3000
250
Green (RoHS
& no Sb/Br)
PYXI
PYXI
ZH
Green (RoHS
& no Sb/Br)
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
ZH
3000
250
Green (RoHS
& no Sb/Br)
PYWI
PYWI
ZI
Green (RoHS
& no Sb/Br)
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
ZI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
21-May-2013
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Jul-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS3831A09DQNR
TPS3831A09DQNT
TPS3831E16DQNR
TPS3831E16DQNT
TPS3831G12DQNR
TPS3831G12DQNT
TPS3831G18DQNR
TPS3831G18DQNT
TPS3831G33DQNR
TPS3831G33DQNT
TPS3831K33DQNR
TPS3831K33DQNT
TPS3831K50DQNR
TPS3831K50DQNT
TPS3831L30DQNR
TPS3831L30DQNT
TPS3839A09DBZR
TPS3839A09DBZT
X2SON
X2SON
X2SON
X2SON
X2SON
X2SON
X2SON
X2SON
X2SON
X2SON
X2SON
X2SON
X2SON
X2SON
X2SON
X2SON
SOT-23
SOT-23
DQN
DQN
DQN
DQN
DQN
DQN
DQN
DQN
DQN
DQN
DQN
DQN
DQN
DQN
DQN
DQN
DBZ
DBZ
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
3
3
3000
250
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
179.0
179.0
9.5
9.5
9.5
9.5
9.5
9.5
9.5
9.5
9.5
9.5
9.5
9.5
9.5
9.5
9.5
9.5
8.4
8.4
1.16
1.16
1.16
1.16
1.16
1.16
1.16
1.16
1.16
1.16
1.16
1.16
1.16
1.16
1.16
1.16
3.15
3.15
1.16
1.16
1.16
1.16
1.16
1.16
1.16
1.16
1.16
1.16
1.16
1.16
1.16
1.16
1.16
1.16
2.95
2.95
0.63
0.63
0.63
0.63
0.63
0.63
0.63
0.63
0.63
0.63
0.63
0.63
0.63
0.63
0.63
0.63
1.22
1.22
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q3
Q3
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Jul-2013
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS3839A09DQNR
TPS3839A09DQNT
TPS3839E16DBZR
TPS3839E16DBZT
TPS3839E16DQNR
TPS3839E16DQNT
TPS3839G12DBZR
TPS3839G12DBZT
TPS3839G12DQNR
TPS3839G12DQNT
TPS3839G18DBZR
TPS3839G18DBZT
TPS3839G18DQNR
TPS3839G18DQNT
TPS3839G33DBZR
TPS3839G33DBZT
TPS3839G33DQNR
TPS3839G33DQNT
TPS3839K33DBZR
TPS3839K33DBZT
TPS3839K33DQNR
TPS3839K33DQNT
TPS3839K50DBZR
TPS3839K50DBZT
TPS3839K50DQNR
TPS3839K50DQNT
TPS3839L30DBZR
TPS3839L30DBZT
TPS3839L30DQNR
TPS3839L30DQNT
X2SON
X2SON
SOT-23
SOT-23
X2SON
X2SON
SOT-23
SOT-23
X2SON
X2SON
SOT-23
SOT-23
X2SON
X2SON
SOT-23
SOT-23
X2SON
X2SON
SOT-23
SOT-23
X2SON
X2SON
SOT-23
SOT-23
X2SON
X2SON
SOT-23
SOT-23
X2SON
X2SON
DQN
DQN
DBZ
DBZ
DQN
DQN
DBZ
DBZ
DQN
DQN
DBZ
DBZ
DQN
DQN
DBZ
DBZ
DQN
DQN
DBZ
DBZ
DQN
DQN
DBZ
DBZ
DQN
DQN
DBZ
DBZ
DQN
DQN
4
4
3
3
4
4
3
3
4
4
3
3
4
4
3
3
4
4
3
3
4
4
3
3
4
4
3
3
4
4
3000
250
180.0
180.0
179.0
179.0
180.0
180.0
179.0
179.0
180.0
180.0
179.0
179.0
180.0
180.0
179.0
179.0
180.0
180.0
179.0
179.0
180.0
180.0
179.0
179.0
180.0
180.0
179.0
179.0
180.0
180.0
9.5
9.5
8.4
8.4
9.5
9.5
8.4
8.4
9.5
9.5
8.4
8.4
9.5
9.5
8.4
8.4
9.5
9.5
8.4
8.4
9.5
9.5
8.4
8.4
9.5
9.5
8.4
8.4
9.5
9.5
1.16
1.16
3.15
3.15
1.16
1.16
3.15
3.15
1.16
1.16
3.15
3.15
1.16
1.16
3.15
3.15
1.16
1.16
3.15
3.15
1.16
1.16
3.15
3.15
1.16
1.16
3.15
3.15
1.16
1.16
1.16
1.16
2.95
2.95
1.16
1.16
2.95
2.95
1.16
1.16
2.95
2.95
1.16
1.16
2.95
2.95
1.16
1.16
2.95
2.95
1.16
1.16
2.95
2.95
1.16
1.16
2.95
2.95
1.16
1.16
0.63
0.63
1.22
1.22
0.63
0.63
1.22
1.22
0.63
0.63
1.22
1.22
0.63
0.63
1.22
1.22
0.63
0.63
1.22
1.22
0.63
0.63
1.22
1.22
0.63
0.63
1.22
1.22
0.63
0.63
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q2
Q2
Q3
Q3
Q2
Q2
Q3
Q3
Q2
Q2
Q3
Q3
Q2
Q2
Q3
Q3
Q2
Q2
Q3
Q3
Q2
Q2
Q3
Q3
Q2
Q2
Q3
Q3
Q2
Q2
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Jul-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS3831A09DQNR
TPS3831A09DQNT
TPS3831E16DQNR
TPS3831E16DQNT
TPS3831G12DQNR
TPS3831G12DQNT
TPS3831G18DQNR
TPS3831G18DQNT
TPS3831G33DQNR
TPS3831G33DQNT
TPS3831K33DQNR
TPS3831K33DQNT
TPS3831K50DQNR
TPS3831K50DQNT
TPS3831L30DQNR
TPS3831L30DQNT
TPS3839A09DBZR
TPS3839A09DBZT
TPS3839A09DQNR
TPS3839A09DQNT
X2SON
X2SON
X2SON
X2SON
X2SON
X2SON
X2SON
X2SON
X2SON
X2SON
X2SON
X2SON
X2SON
X2SON
X2SON
X2SON
SOT-23
SOT-23
X2SON
X2SON
DQN
DQN
DQN
DQN
DQN
DQN
DQN
DQN
DQN
DQN
DQN
DQN
DQN
DQN
DQN
DQN
DBZ
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
3
3
4
4
3000
250
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
203.0
203.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
203.0
203.0
180.0
180.0
30.0
30.0
30.0
30.0
30.0
30.0
30.0
30.0
30.0
30.0
30.0
30.0
30.0
30.0
30.0
30.0
35.0
35.0
30.0
30.0
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
DBZ
DQN
DQN
3000
250
Pack Materials-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Jul-2013
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS3839E16DBZR
TPS3839E16DBZT
TPS3839E16DQNR
TPS3839E16DQNT
TPS3839G12DBZR
TPS3839G12DBZT
TPS3839G12DQNR
TPS3839G12DQNT
TPS3839G18DBZR
TPS3839G18DBZT
TPS3839G18DQNR
TPS3839G18DQNT
TPS3839G33DBZR
TPS3839G33DBZT
TPS3839G33DQNR
TPS3839G33DQNT
TPS3839K33DBZR
TPS3839K33DBZT
TPS3839K33DQNR
TPS3839K33DQNT
TPS3839K50DBZR
TPS3839K50DBZT
TPS3839K50DQNR
TPS3839K50DQNT
TPS3839L30DBZR
TPS3839L30DBZT
TPS3839L30DQNR
TPS3839L30DQNT
SOT-23
SOT-23
X2SON
X2SON
SOT-23
SOT-23
X2SON
X2SON
SOT-23
SOT-23
X2SON
X2SON
SOT-23
SOT-23
X2SON
X2SON
SOT-23
SOT-23
X2SON
X2SON
SOT-23
SOT-23
X2SON
X2SON
SOT-23
SOT-23
X2SON
X2SON
DBZ
DBZ
DQN
DQN
DBZ
DBZ
DQN
DQN
DBZ
DBZ
DQN
DQN
DBZ
DBZ
DQN
DQN
DBZ
DBZ
DQN
DQN
DBZ
DBZ
DQN
DQN
DBZ
DBZ
DQN
DQN
3
3
4
4
3
3
4
4
3
3
4
4
3
3
4
4
3
3
4
4
3
3
4
4
3
3
4
4
3000
250
203.0
203.0
180.0
180.0
203.0
203.0
180.0
180.0
203.0
203.0
180.0
180.0
203.0
203.0
180.0
180.0
203.0
203.0
180.0
180.0
203.0
203.0
180.0
180.0
203.0
203.0
180.0
180.0
203.0
203.0
180.0
180.0
203.0
203.0
180.0
180.0
203.0
203.0
180.0
180.0
203.0
203.0
180.0
180.0
203.0
203.0
180.0
180.0
203.0
203.0
180.0
180.0
203.0
203.0
180.0
180.0
35.0
35.0
30.0
30.0
35.0
35.0
30.0
30.0
35.0
35.0
30.0
30.0
35.0
35.0
30.0
30.0
35.0
35.0
30.0
30.0
35.0
35.0
30.0
30.0
35.0
35.0
30.0
30.0
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
Pack Materials-Page 4
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