TPS53820RWZR [TI]
适用于 Intel CPU 电源且带 SVID 的集成降压转换器 | RWZ | 35 | -40 to 125;
| 型号： | TPS53820RWZR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 适用于 Intel CPU 电源且带 SVID 的集成降压转换器 | RWZ | 35 | -40 to 125 开关 转换器 |
| 文件： | 总10页 (文件大小：414K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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TPS53820
ZHCSKW5 –FEBRUARY 2020
适用于 Intel® CPU 电源且带 SVID 接口的集成降压转换器
1 特性
3 说明
1
•
•
•
•
•
•
•
•
•
可支持 Intel VR13.HC SVID POL 应用的 单芯片
TPS53820 器件是一款 D-CAP+ 模式集成降压转换
器，可适用于 Intel CPU 电源的低电流 SVID 电源轨。
它最多可提供两路输出来为低电流 SVID 电源轨（如
VCCANA (5.5A) 和 P1V8 (4A)）供电。该器件采用 D-
CAP+ 模式控制，可提供快速的负载瞬态性能。内部补
偿可简化使用并减少外部器件。
可支持 VCCANA (5.5A) 和 P1V8 (4A) 的两个输出
针对快速瞬态响应提供 D-CAP+™控制
宽输入电压范围（4.5V 至 15V）
差动遥感
可编程内部环路补偿
每相逐周期电流限制
该器件还提供针对输入电压、输出电压、输出电流和温
度报告的遥测功能。此外，还提供过压、过流和过热保
护。
可编程开关频率范围为 800kHz 至 2MHz
用于电压、电流、功率、温度和故障条件遥测的
I2C 系统接口
TPS53820 器件采用耐热增强型 35 引脚 QFN 封装，
工作温度范围为 –40°C 至 125°C。
•
•
•
过流、过压和过热保护
低静态电流
5mm × 5mm、35 引脚 QFN、PowerPAD 封装
表 1. 器件信息(1)
器件型号
TPS53820
封装
RWZ (35)
封装尺寸（标称值）
2 应用
5mm × 5mm
•
适用于 Intel 服务器平台的低电流 SVID 电源轨
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
图 1. 简化应用
12V
VIN
BOOT_SWA1
VCCANA
SWA1
3.3V
VIN_3.3V
AVSP
AVSN
Enable1
Enable2
EN1
EN2
BOOT_SWB
SWB
SCLK
P1V8
SVID Interface
SDIO
ALERT#
BVSP
BVSN
I2C_CLK
I2C Interface
I2C_DIO
I2C_ALERT#
VLDO_1.8V
ADDR
AGND PGND
1
本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。 有关适用的官方英文版本的最新信息，请访问 www.ti.com，其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLUSE33
TPS53820
ZHCSKW5 –FEBRUARY 2020
www.ti.com.cn
4 修订历史记录
注：之前版本的页码可能与当前版本有所不同。
日期
修订版本
说明
2020 年 1 月
*
初始发行版。
2
版权 © 2020, Texas Instruments Incorporated
TPS53820
www.ti.com.cn
ZHCSKW5 –FEBRUARY 2020
5 器件和文档支持
5.1 商标
针对快速瞬态响应提供 D-CAP+ is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
5.2 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
版权 © 2020, Texas Instruments Incorporated
3
TPS53820
ZHCSKW5 –FEBRUARY 2020
www.ti.com.cn
6 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更，恕不另行通知，且
不会对此文档进行修订。如需获取此数据表的浏览器版本，请查阅左侧的导航栏。
4
版权 © 2020, Texas Instruments Incorporated
TPS53820
www.ti.com.cn
ZHCSKW5 –FEBRUARY 2020
6.1 Package Option Addendum
6.1.1 Packaging Information
Package
Drawing
Lead/Ball
Finish(3)
(1)
(2)
(4)
Orderable Device
TPS53820RWZR
TPS53820RWZT
Status
Package Type
VQFN-HR
Pins
35
Package Qty
3000
Eco Plan
MSL Peak Temp
Op Temp (°C)
Device Marking(5)(6)
TPS53820
Green (RoHS & no
Sb/Br)
ACTIVE
ACTIVE
RWZ
RWZ
NiPdAu
NiPdAu
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
–40 to 125
–40 to 125
Green (RoHS & no
Sb/Br)
VQFN-HR
35
250
TPS53820
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
space
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest
availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the
requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified
lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used
between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by
weight in homogeneous material)
space
(3) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the
finish value exceeds the maximum column width.
space
(4) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
space
(5) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
space
(6) Multiple Device markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief
on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third
parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for
release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
版权 © 2020, Texas Instruments Incorporated
5
TPS53820
ZHCSKW5 –FEBRUARY 2020
www.ti.com.cn
6.1.2 Tape and Reel Information
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
Reel
Diameter
(mm)
Reel
Width W1
(mm)
Package
Type
Package
Drawing
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
Device
Pins
SPQ
TPS53820RWZR
TPS53820RWZT
VQFN-HR
VQFN-HR
RWZ
RWZ
35
35
3000
250
330.0
180.0
12.4
12.4
5.3
5.3
5.3
5.3
1.1
1.1
8.0
8.0
12.0
12.0
Q2
Q2
6
版权 © 2020, Texas Instruments Incorporated
TPS53820
www.ti.com.cn
ZHCSKW5 –FEBRUARY 2020
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
Device
Package Type
Package Drawing Pins
SPQ
3000
250
Length (mm) Width (mm)
Height (mm)
35.0
TPS53820RWZR
TPS53820RWZT
VQFN-HR
VQFN-HR
RWZ
RWZ
35
35
367.0
210.0
367.0
185.0
35.0
版权 © 2020, Texas Instruments Incorporated
7
PACKAGE OPTION ADDENDUM
www.ti.com
3-Jun-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS53820RWZR
TPS53820RWZT
ACTIVE
VQFN-HR
VQFN-HR
RWZ
35
35
3000 RoHS & Green
250 RoHS & Green
Call TI | SN
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
-40 to 125
-40 to 125
TPS
53820
Samples
Samples
ACTIVE
RWZ
SN
TPS
53820
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
3-Jun-2023
Addendum-Page 2
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