TPS53832A [TI]
用于 DDR5 服务器 DIMM 的低电流 PMIC,具有日志记录自动清除功能;型号: | TPS53832A |
厂家: | TEXAS INSTRUMENTS |
描述: | 用于 DDR5 服务器 DIMM 的低电流 PMIC,具有日志记录自动清除功能 双倍数据速率 服务器 集成电源管理电路 |
文件: | 总6页 (文件大小:733K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TPS53832A
ZHCSQJ0 –OCTOBER 2022
适用于DDR5 On-DIMM 电源的TPS53832A 集成式数字降压转换器
1 特性
3 说明
• 单器件设计,支持DDR5 应用
• 3 个输出,可支持VDD (1.1V)、VDDQ (1.1V) 和
VPP (1.8V),并具有可选的第4 个输出(VDD2)
• 对于3 个输出,VDD(SWA 双相)为7A、
VDDQ(SWC) 为3.5A,VPP(SWD) 为3.5A,具有
3 路输出
• 对于4 个输出,VDD1(SWA) 为3.5A、
VDD2(SWB) 为3.5A、VDDQ(SWC) 为3.5A,
VPP(SWD) 为3.5A
TPS53832A 是适用于 DDR5 DIMM 自载电源的 D-
CAP+™ 模式集成式降压转换器,该转换器具有可配置
电流能力,可为 DIMM 模块上的 DRAM 芯片提供
VDD、VDDQ 和 VPP 电压。高电流轨可以配置为两相
或 2 个输出,从而提供高达 7A(或 3.5A + 3.5A)的
电流,并采用D-CAP+™ 模式控制。该转换器还采用内
部补偿以方便使用并减少外部元件。
该转换器提供全套遥测功能,包括输入电压、输出电压
和输出电流。此外,还提供过压、欠压、过流限制和过
热保护。
• 差分遥感:VDD、VDDQ 和VPP
• D-CAP+™ 控制,可实现快速瞬态响应
• 宽输入电压:4.5 V 至15 V
TPS53832A 采用耐热增强型35 引脚QFN 封装,工作
温度范围为-40°C 至+105°C。
• 可编程内部环路补偿
• 每相逐周期电流限制
器件信息
封装(1)
• 可编程频率:500 kHz 至1.375 MHz
• 支持用于电压、电流、功率、温度和故障状况遥测
的I2C 和I3C 总线接口
封装尺寸(标称值)
器件型号
TPS53832A
RWZ
5.00mm x 5.00mm
• 过流、过压和过热保护
• 持久寄存器(黑盒)功能
• 低静态电流
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
• 5mm × 5mm、35 引脚、QFN PowerPad™ 封装
2 应用
• 用于服务器的DDR5 On-DIMM 电源
图3-1. 简化版应用
本文档旨在为方便起见,提供有关TI 产品中文版本的信息,以确认产品的概要。有关适用的官方英文版本的最新信息,请访问
www.ti.com,其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SLUSEX5
TPS53832A
ZHCSQJ0 –OCTOBER 2022
www.ti.com.cn
Table of Contents
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Device and Documentation Support..............................3
5.1 接收文档更新通知....................................................... 3
5.2 支持资源......................................................................3
5.3 Trademarks.................................................................3
5.4 Electrostatic Discharge Caution..................................3
5.5 术语表......................................................................... 3
6 Mechanical, Packaging, and Orderable Information....4
4 Revision History
注:以前版本的页码可能与当前版本的页码不同
DATE
REVISION
NOTES
October 2022
*
Initial Release
Copyright © 2022 Texas Instruments Incorporated
2
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Product Folder Links: TPS53832A
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ZHCSQJ0 –OCTOBER 2022
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5 Device and Documentation Support
5.1 接收文档更新通知
要接收文档更新通知,请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册,即可每周接收产品信息更
改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。
5.2 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料,可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范,并且不一定反映 TI 的观点;请参阅
TI 的《使用条款》。
5.3 Trademarks
D-CAP+™, PowerPad™, and TI E2E™ are trademarks of Texas Instruments.
所有商标均为其各自所有者的财产。
5.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
5.5 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
Copyright © 2022 Texas Instruments Incorporated
Submit Document Feedback
3
Product Folder Links: TPS53832A
TPS53832A
ZHCSQJ0 –OCTOBER 2022
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6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2022 Texas Instruments Incorporated
4
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Product Folder Links: TPS53832A
PACKAGE OPTION ADDENDUM
www.ti.com
17-Jun-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS53832ARWZR
ACTIVE
VQFN-HR
RWZ
35
3000 RoHS & Green
SN
Level-2-260C-1 YEAR
-40 to 105
TPS
53832A
Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
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