TPS543C20ARVFR [TI]
具有自适应内部补偿功能的 4V 至 16V、40A 同步 SWIFT™ 降压转换器 | RVF | 40 | -40 to 125;型号: | TPS543C20ARVFR |
厂家: | TEXAS INSTRUMENTS |
描述: | 具有自适应内部补偿功能的 4V 至 16V、40A 同步 SWIFT™ 降压转换器 | RVF | 40 | -40 to 125 转换器 |
文件: | 总46页 (文件大小:6161K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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TPS543C20A
ZHCSJ36 –NOVEMBER 2018
具备自适应内部补偿功能的 TPS543C20A4 VIN 至 16 VIN、40A 可堆叠、同
步降压 SWIFT™ 转换器
1 特性
2 应用
1
•
•
•
•
内部补偿高级电流模式控制 40A POL
•
•
•
•
无线和有线通信基础设施设备
输入电压范围:4V 至 16V
输出电压范围:0.6V 至 5.5V
企业服务器、交换机和路由器
企业级存储、SSD
集成 3.4/0.9mΩ 堆叠式 NexFET™功率级,带有无
损低侧电流检测功能
ASIC、SoC、FPGA、DSP 内核和 I/O 电源轨
3 说明
•
•
固定频率 - 同步到外部时钟和/或同步输出
TPS543C20A 采用内部补偿的仿真峰值电流模式控制
方式,具有适用于 EMI 敏感型 POL 的时钟同步固定频
率调制器。内部积分器和直接放大式斜坡跟踪环路在较
宽频率范围内消除了对外部补偿的需求,从而使系统设
计具有灵活、密集和简单的特点。可选的 API 和体制
动功能有助于分别通过显著减少下冲和过冲来提高瞬态
性能。具有低损耗开关特性的集成式
可通过引脚搭接进行编程的开关频率
–
–
独立模式下为 300kHz 至 2MHz
堆叠模式下为 300kHz 至 1MHz
•
•
通过双倍堆叠实现高达 80A 负载,并具有电流共
享、电压共享和 CLK 同步功能
可通过引脚搭接进行编程的基准电压介于 0.6V 至
1.1V 之间,精度达 0.5%
•
•
•
•
•
差分遥感
NexFET™MOSFET 有助于提高效率和提供高达 40A
的输出电流(采用 5mm × 7mm 的 PowerStack™封
装,带有方便布局的散热垫)。两个 TPS543C20A 器
件可以堆叠在一起,以便提供高达 80A 的负载点。
安全启动至预偏置输出电压
高精度打嗝电流限制
异步脉冲注入 (API) 和体制动
40 引脚 5mm × 7mm LQFN 封装,具有 0.5mm 间
距和单个散热垫
器件信息
使用 TPS543C20A 并借助 WEBENCH® 电源设计
器创建定制设计方案
器件编号
封装
封装尺寸(标称值)
•
TPS543C20A
LQFN-CLIP (40)
5.00mm x 7.00mm
1. 如需了解所有可用封装,请参阅数据表末尾的可订
购产品附录。
简化原理图
VIN
VOUT
ILIM
RSP
RSN
BOOT
SW
RAMP
RT
TPS543C20A
VSEL
+
LOAD
t
BP
SS
MODE
AGND
PGND
GND
1
本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。 有关适用的官方英文版本的最新信息,请访问 www.ti.com,其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SLUSDE0
TPS543C20A
ZHCSJ36 –NOVEMBER 2018
www.ti.com.cn
目录
1
2
3
4
5
6
7
特性.......................................................................... 1
9
Application and Implementation ........................ 24
9.1 Application Information............................................ 24
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Device Comparison Table..................................... 3
Pin Configuration and Functions......................... 3
Specifications......................................................... 5
7.1 Absolute Maximum Ratings ...................................... 5
7.2 ESD Ratings ............................................................ 5
7.3 Recommended Operating Conditions....................... 6
7.4 Thermal Information ................................................. 6
7.5 Electrical Characteristics........................................... 7
7.6 Typical Characteristics............................................ 11
Detailed Description ............................................ 14
8.1 Overview ................................................................. 14
8.2 Functional Block Diagram ....................................... 14
8.3 Feature Description................................................. 15
8.4 Device Functional Modes........................................ 15
9.2 Typical Application: TPS543C20A Stand-alone
Device ...................................................................... 24
9.3 System Example ..................................................... 30
10 Power Supply Recommendations ..................... 32
11 Layout................................................................... 33
11.1 Layout Guidelines ................................................. 33
11.2 Layout Example .................................................... 34
11.3 Package Size, Efficiency and Thermal
Performance............................................................. 35
12 器件和文档支持 ..................................................... 37
12.1 器件支持................................................................ 37
12.2 接收文档更新通知 ................................................. 37
12.3 社区资源................................................................ 37
12.4 商标....................................................................... 37
12.5 静电放电警告......................................................... 37
12.6 术语表 ................................................................... 37
13 机械、封装和可订购信息....................................... 38
8
4 修订历史记录
注:之前版本的页码可能与当前版本有所不同。
日期
修订版本
说明
2018 年 11 月
*
最初发布版本
2
Copyright © 2018, Texas Instruments Incorporated
TPS543C20A
www.ti.com.cn
ZHCSJ36 –NOVEMBER 2018
5 Device Comparison Table
DEVICE
OUTPUT CURRENT
TPS543B20
TPS543C20
TPS543C20A
25 A
40 A
40 A
6 Pin Configuration and Functions
RVF Package
40-Pin LQFN-CLIP With Thermal Pad
Top View
RSP
RSN
NC
1
32
31
30
29
28
27
26
25
24
23
22
21
VSHARE
ISHARE
ILIM
2
3
NC
4
AGND
BP
NC
5
NC
6
GND
Thermal
Pad
BOOT
SW
7
VDD
8
PVIN
PVIN
PVIN
PVIN
PVIN
SW
9
SW
10
11
12
SW
SW
Not to scale
Copyright © 2018, Texas Instruments Incorporated
3
TPS543C20A
ZHCSJ36 –NOVEMBER 2018
www.ti.com.cn
Pin Functions
PIN
I/O/P(1)
DESCRIPTION
NO.
NAME
The positive input of the remote sense amplifier. Connect RSP pin to the output voltage
at the load. For multi-phase configuration, the remote sense amplifier is not needed for
slave devices.
1
RSP
I
The negative input of the remote sense amplifier. Connect RSN pin to the ground at load
side. For multi-phase configuration, the remote sense amplifier is not needed for slave
devices.
2
RSN
NC
I
3,4,5,6
—
Not connected
Bootstrap pin for the internal flying high-side driver. Connect a typical 100-nF capacitor
from this pin to SW. To reduce the voltage spike at SW, a BOOT resistor with a value
between 1 Ω to 10 Ω may be placed in series with the BOOT capacitor to slow down
turnon of the high-side FET.
7
BOOT
I
8,9,10,11,12
SW
B
Output of converted power. Connect this pin to the output Inductor.
13,14,15,16,17,18,19,
20
PGND
G
These ground pins are connected to the return of the internal low-side MOSFET
Input power to the power stage. Low impedance bypassing of these pins to PGND is
critical. A 10-nF to 100-nF capacitor from PVIN to PGND close to IC is required.
21,22,23,24,25
26
PVIN
VDD
I
I
Controller power supply input
Ground return for the controller. This pin should be directly connected to the thermal pad
on the PCB board. A 10-nF to 100-nF capacitor from PVIN to GND close to IC is
required.
27
28
GND
BP
G
O
Output of the 5 V on board regulator. This regulator powers the driver stage of the
controller and must be bypassed with a minimum of 2.2 µF to the thermal pad (power
stage ground, that is, GND). Low impedance bypassing of this pin to PGND is critical.
29
30
31
32
33
AGND
ILIM
G
O
I
GND return for internal analog circuits.
Current protection pin; connect a resistor from this pin to AGND sets current limit level.
Current sharing signal for multi-phase operation. Float this pin for single phase
Voltage sharing signal for multi-phase operation. Float this pin for single phase.
The enable pin turns on the switcher.
ISHARE
VSHARE
EN
B
I
Open-drain power-good status signal which provides start-up delay after the FB voltage
falls within the specified limits. After the FB voltage moves outside the specified limits,
PGOOD goes low.
34
PGD
O
For frequency synchronization. This pin can be configured as sync in or sync out by
MODE pin and RT pin for master and slave devices.
35
SYNC
B
36
37
VSEL
SS
I
Connect a resistor from this pin to AGND to select internal reference voltage.
Connect a resistor from this pin to AGND to select soft-start time.
O
Frequency setting pin. Connect a resistor from this pin to AGND to program the
switching frequency. This pin also selects sync point for devices in stackable
applications
38
RT
O
Enable or disable API or body brake function, choose API threshold, also selects the
operation mode in stackable applications
39
40
MODE
RAMP
B
B
Ramp level selection, with a resistor to AGND to adjust internal loop.
Package thermal tab, internally connected to PGND. The thermal tab must have
adequate solder coverage for proper operation.
Thermal Pad
Thermal Tab
—
(1) I = Input, O = Output, B = Bidirectional, P = Supply, G = Ground
4
Copyright © 2018, Texas Instruments Incorporated
TPS543C20A
www.ti.com.cn
ZHCSJ36 –NOVEMBER 2018
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN
MAX
18
UNIT
VIN
–0.3
VIN to SW(3)
25
VDD
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–5
18
BOOT
34.5
6.5
7
DC
BOOT to SW
< 10 ns
Input voltage(1)
V
VSEL, SS, MODE, RT, SYNC, EN, ISHARE, ILIM
7
RSP
3.6
0.3
0.3
20
RSN
PGND, GND
DC
SW to PGND(4)
< 10 ns
20
BP, RAMP
–0.3
–0.3
–0.3
–55
7
Output voltage
PGD
7
V
VSHARE
3.6
150
150
Junction temperature, TJ
Storage temperature, Tstg
°C
°C
–55
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to the network ground terminal unless otherwise noted.
(3) VIN to SW must not exceed 25 V.
(4) SW to PGND must not exceed 20 V.
7.2 ESD Ratings
VALUE
±2500
±1500
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
V(ESD)
Electrostatic discharge
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions.
Copyright © 2018, Texas Instruments Incorporated
5
TPS543C20A
ZHCSJ36 –NOVEMBER 2018
www.ti.com.cn
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1)
MIN
4
MAX
UNIT
VIN
16
22
DC
–0.1
VIN to SW(3)
< 10 ns
22
VDD
4
–0.1
–0.1
–0.1
16
BOOT
23.5
5.5
6
DC
BOOT to SW
< 10 ns
Input voltage(2)
V
VSEL, SS, MODE, RT, SYNC, EN,
ISHARE, ILIM
–0.1
5.5
RSP
–0.1
–0.1
–0.1
–0.1
–5
1.7
0.1
0.1
18
RSN
PGND, GND
DC
SW to PGND
< 10 ns
18
BP, RAMP
PGD
–0.3
–0.3
–0.3
–40
–55
7
Output voltage(2)
7
V
VSHARE
3.6
125
125
Junction temperature, TJ
Storage temperature, Tstg
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.
(2) All voltage values are with respect to the network ground terminal unless otherwise noted.
(3) See Layout Guidelines for VIN capacitor placement requirement to reduce MOSFET voltage stress.
7.4 Thermal Information
TPS543C20A
THERMAL METRIC(1)
RVF (LQFN)
40 PINS
28.9
UNIT
RθJA
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
Junction-to-ambient thermal resistance EVM (TPS543C20AEVM-054:6-
layer, 2-oz Cu per layer, 2.75 inch by 3 inch)
12
RθJC(top)
RθJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
18.9
4.1
1.3
4.1
1
°C/W
°C/W
°C/W
°C/W
°C/W
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
ψJB
RθJC(bot)
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6
Copyright © 2018, Texas Instruments Incorporated
TPS543C20A
www.ti.com.cn
ZHCSJ36 –NOVEMBER 2018
7.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
MOSFET RDS(ON)
RDS(on)HS
HS FET
LS FET
VBST – VSW = 5 V, ID = 20 A, TJ = 25°C
VDD = 5 V, ID = 20 A, TJ = 25°C
3.4
0.9
mΩ
mΩ
RDS(on)LS
Power stage driver dead-time
from Low-side off to High-side
on(1)
tDEAD(LtoH)
VDD ≥ 12 V, TJ = 25°C
VDDN ≥ 12 V, TJ = 25°C
12
15
ns
ns
Power stage driver dead-time
from High-side off to Low-side
on(1)
tDEAD(HtoL)
INPUT SUPPLY and CURRENT
VVIN
Power stage voltage
4
4
16
16
VVDD
VDD supply voltage
TA = 25°C, no load, power conversion
enabled (no switching)
IVDD
VDD bias current
4.3
4.3
mA
mA
TA = 25°C, no load, power conversion
disabled
IVDDSTBY
VDD standby current
UNDERVOLTAGE LOCKOUT
VVDD_UVLO
VDD UVLO rising threshold
3.8
0.2
3.2
0.2
1.6
300
0
V
v
VVDD_UVLO_HYS VDD UVLO hysteresis
VVIN_UVLO
VVIN_UVLO_HYS
VEN_ON_TH
VHYS
VIN UVLO rising threshold
VIN UVLO hysteresis
EN on threshold
V
v
1.45
270
–1
1.75
330
1
V
EN hysteresis
mV
µA
IEN_LKG
EN input leakage current
INTERNAL REFERENCE VOLTAGE
VINTREF
Internal REF voltage
RVSEL = OPEN
1000
mV
V
VINTREFTOL
VINTREF_VSEL
OUTPUT VOLTAGE
Internal REF voltage tolerance
TJ = –40°C to 125°C
Programable by VSEL (pin 36)
–0.5%
0.6
0.5%
1.1
Internal REF voltage range
IRSP
RSP input current
VRSP = 600 mV
–1
1
µA
DIFFERENTIAL REMOTE SENSE AMPLIFIER
fUGBW
A0
Unity gain bandwidth(1)
Open loop gain(1)
5
8.5
MHz
dB
75
SR
SLew rate(1)
Input common mode range(1)
±10
V/µs
V
VICM
–0.2
–1
1.7
1
VRSN-VGND = 0 mV
VOFFSET
Input offset voltage(1)
mV
VRSN-VGND = ±100 mV
–1.9
1.9
(1) Specified by design. Not production tested.
Copyright © 2018, Texas Instruments Incorporated
7
TPS543C20A
ZHCSJ36 –NOVEMBER 2018
www.ti.com.cn
MAX UNIT
Electrical Characteristics (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
SWITCHING FREQUENCY
TEST CONDITIONS
MIN
TYP
VIN = 12 V, VVO = 1 V, RT = 66.5 kΩ
VIN = 12 V, VVO = 1 V, RT = 48.7 kΩ
VIN = 12 V, VVO = 1 V, RT = 39.2 kΩ
VIN = 12 V, VVO = 1 V, RT = 28.0 kΩ
VIN = 12 V, VVO = 1 V, RT = 22.6 kΩ
VIN = 12 V, VVO = 1 V, RT = 19.1 kΩ
VIN = 12 V, VVO = 1 V, RT = 15.4 kΩ
VIN = 12 V, VVO = 1 V, RT = 8.06 kΩ
DRVH rising to falling
300
400
500
700
850
1000
1200
2000
30
VO switching frequency
maximum frequency for multi-
phase is 1MHz
FSW
kHz
tON(min)
Minimum on-time(1)
Minimum off-time(1)
ns
ns
tOFF(min)
DRVH falling to rising
250
INTERNAL BOOTSTRAP SWITCH
VF
Forward voltage
VBP-VBST, TA = 25°C, IF = 5 mA
0.1
0.2
V
VSEL
RVSEL = 0 kΩ
0.6
0.7
RVSEL = 8.66 kΩ
RVSEL = 15.4 kΩ
RVSEL = 23.7 kΩ
RVSEL = 34.8 kΩ
RVSEL = 51.1 kΩ
RVSEL = 78.7 kΩ
RVSEL = OPEN
RVSEL = 121 kΩ
RVSEL = 187 kΩ
0.75
0.8
0.85
0.9
VSEL
Internal reference voltage
V
0.95
1
1.05
1.1
SOFT START
RSS = 0 kΩ
0.5
1
RSS = 8.66 kΩ
RSS = 15.4 kΩ
RSS = Open
2
4
VO rising from 0
V to 95% of
final set point
RSS = 23.7 kΩ
5
tSS
Soft-start time
ms
RSS = 34.8 kΩ
8
RSS = 51.1 kΩ
RSS = 78.7 kΩ
RSS = 121 kΩ
RSS = 187 kΩ
12
16
24
32
POWER ON DELAY
tPODLY Power-on delay time
Delay from enable to switching
512
µs
8
Copyright © 2018, Texas Instruments Incorporated
TPS543C20A
www.ti.com.cn
ZHCSJ36 –NOVEMBER 2018
Electrical Characteristics (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
PGOOD COMPARATOR
TEST CONDITIONS
MIN
TYP
MAX UNIT
OV warning threshold on RSP
pin, PGOOD fault threshold on
rising
VREF = 600 mV
VREF = 600 mV
VREF = 600 mV
VREF = 600 mV
108
84
112
88
116
VPG(thresh)
%VREF
UV warning threshold on RSP
pin, PGOOD fault threshold on
falling
92
PGOOD threshold on rising and
UV warning threshold de-
assertion threshold at RSP pin
VPGD(rise)
95
%VREF
%VREF
PGOOD threshold on falling and
OV warning threshold de-
VPGD(fall)
105
assertion threshold at RSP pin
RPGD
PGOOD pulldown resistance
IPGOOD = 5 mA, VRSP = 0 V
Delay for PGOOD going in
Delay for PGOOD coming out
30
45
60
Ω
1.024
ms
µs
tPGDLY
PGOOD delay time
2
0.8
15
PGOOD output low level voltage
at no supply voltage
VPGD(OL)
IPGLK
VDD=0, IPGOOD = 80 µA
VPGOOD = 5 V
V
PGOOD leakage current
µA
CURRENT SHARE ACCURACY
Output current sharing accuracy
I
OUT ≥ 20 A/phase
OUT ≤ 20 A/phase
–15%
15%
among stackable devices,
defined as the ratio of the current
difference between devices to
total current(sensing error
only)(1)
ISHARE(acc)
I
±3
A
CURRENT DETECTION
VILIM VTRIP voltage range
Rdson sensing
0.1
1.2
V
A
RILIM= 33.2 kΩ
OC tolerance
35
±10%
25
Low-side FET current protection
threshold and tolerance
IOCP
RILIM= 23.7 kΩ
OC tolerance
A
Low-Side FET current protection
threshold and tolerance
IOCP
±15%
–23
IOCP_N
Negative current limit threshold
Valley-point current sense
A
A
Clamp current at VTRIP clamp at
lowest
ICLMP_LO
25°C, VTRIP = 0.1 V
5.5
6.5
7.5
Copyright © 2018, Texas Instruments Incorporated
9
TPS543C20A
ZHCSJ36 –NOVEMBER 2018
www.ti.com.cn
Electrical Characteristics (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
HIGH-SIDE SHORT-CIRCUIT PROTECTION
High-side short circuit protection
IHSOC
55
A
fault threshold(1)
OV / UV PROTECTION
VOVP
OVP threshold voltage
OVP response time(1)
UVP threshold voltage
UVP delay(1)
OVP detect voltage
113
79
117
83
121 %VREF
tOVPDLY
VUVP
tUVPDLY
tHICDLY
OVP response time with 100-mV overdrive
UVP detect voltage
1
µs
87 %VREF
UVP delay
1.5
5.5
µs
Hiccup delay time
Regular tSS setting
7 × tSS
ms
BP LDO REGULATOR
BP
LDO output voltage
VIN = 12 V, ILOAD = 0 to 10 mA
Wakeup
4.5
5
3.32
3.11
V
V
VBPUVLO
BP UVLO threshold voltage
Shutdown
VLDOBP
ILDOMAX
LDO low dropout voltage
LDO overcurrent limit
VIN = 4.5 V, ILOAD = 30 mA, TA = 25°C
VIN = 12 V, TA = 25°C
365
mV
mA
100
SYNCHRONIZATION
VIH(SYNC)
VIL(SYNC)
tPSW(SYNC)
High-level input voltage
2
V
Low-level input voltage
Sync input minimum pulse width
Synchronization frequency
Dual-phase
0.8
100
ns
300
300
2000
1000
FSYNC
kHz
Sync to SW delay tolerance,
percentage from phase-to-
phase(1)
tSYNC to SW
FSYNC = 300 kHz to 1 MHz,
FSYNC = 300 kHz
10%
5
tLose_SYNC_delay Delay when lose sync clock(1)
µs
°C
THERMAL SHUTDOWN
Shutdown temperature
Hysteresis
155
165
30
Built-in thermal shutdown
TSDN
threshold(1)
10
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7.6 Typical Characteristics
VIN = VDD = 12 V, TA = 25°C, RRT = 40.2 kΩ, TA= 25°C (unless otherwise specified)
10
9
8
7
6
5
4
3
2
1
0
100%
95%
90%
85%
80%
75%
70%
.9 Vout
1 Vout
1.5 Vout
2.5 Vout
3.3 Vout
1 Vout
0.9 Vout
1.5 Vout
2.5 Vout
3.3 Vout
0
5
10
15
20
25
30
35
40
0
5
10
15
20
25
30
35
40
Output Current (A)
Output Current (A)
D001
D005
VIN = 5 V
500 kHz
25°C
25°C
25°C
VIN = 5 V
500 kHz
25°C
25°C
25°C
Figure 2. Efficiency vs Output Current
Figure 3. Power Loss vs Output Current
100%
10
.9 Vout
1 Vout
1.5 Vout
2.5 Vout
3.3 Vout
5 Vout
9
95%
90%
85%
80%
75%
70%
8
7
6
5
4
3
2
1
0
0.9 Vout
1 Vout
1.5 Vout
2.5 Vout
3.3 Vout
5 Vout
0
5
10
15
20
25
30
35
40
0
5
10
15
20
25
30
35
40
Output Current (A)
Output Current (A)
D002
D006
VIN = 12 V
500 kHz
VIN = 12 V
500 kHz
Figure 4. Efficiency vs Output Current
Figure 5. Power Loss vs Output Current
100%
12
5 Vin
9 Vin
12 Vin
14 Vin
16 Vin
5 Vin
9 Vin
12 Vin
14 Vin
16 Vin
95%
90%
85%
80%
75%
70%
10
8
6
4
2
0
0
5
10
15
20
25
30
35
40
0
5
10
15
20
25
30
35
40
Output Current (A)
Output Current (A)
D003
D007
VOUT = 1 V
1 MHz
VOUT = 1 V
1 MHz
Figure 6. Efficiency vs Output Current
Figure 7. Power Loss vs Output Current
6
5
4
3
2
1
0
800
700
600
500
400
300
200
0.6 VOUT
1 VOUT
1.5 VOUT
2.5 VOUT
3.3 VOUT
5 VOUT
0.6 VOUT
1 VOUT
1.5 VOUT
2.5 VOUT
3.3 VOUT
5 VOUT
0
5
10
15
20
25
30
35
40
0
5
10
15
20
25
30
35
40
Output Current (A)
Output Current (A)
D007
D010
VIN = 12 V
500 kHz
25°C
VIN = 12 V
500 kHz
25°C
Figure 8. Output Voltage vs Output Current
Figure 9. Switching Frequency vs Output Current
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Typical Characteristics (continued)
VIN = VDD = 12 V, TA = 25°C, RRT = 40.2 kΩ, TA= 25°C (unless otherwise specified)
1.05
14 VIN
12 VIN
9 VIN
5 VIN
4 VIN
1
0.95
0
5
10
15
20
25
30
35
40
Output Current (A)
D019
VOUT = 1 V
1 MHz
25°C
Figure 10. Output Voltage vs Output Current
Figure 11. Start-Up From EN
Figure 12. Output Voltage Start-Up and Shutdown
Figure 13. Output Voltage Ripple at Steady State
12
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Typical Characteristics (continued)
VIN = VDD = 12 V, TA = 25°C, RRT = 40.2 kΩ, TA= 25°C (unless otherwise specified)
15 A to 25 A to 15 A, 10-A Step at 40 A/µs
Figure 14. Output Voltage Transient Response
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8 Detailed Description
8.1 Overview
The device is 40-A, high-performance, synchronous buck converter with two integrated N-channel NexFET™
power MOSFETs. These devices implement the fixed frequency non-compensation mode control. Safe pre-bias
capability eliminates concerns about damaging sensitive loads. Two devices can be paralleled together to
provide up to -A load. Current sensing for over-current protection and current sharing between devices is done
by sampling a small portion of the power stage current providing accurate information independent on the device
temperature.
Advanced Current Mode (ACM) is an emulated peak current control topology. It supports stable static and
transient operation without complex external compensation design. This control architecture includes an internal
ramp generation network that emulates inductor current information, enabling the use of low ESR output
capacitors such as multi-layered ceramic capacitors (MLCC). The internal ramp also creates a high signal to
noise ratio for good noise immunity. The has 10 ramp options (see Ramp Selections for detail) to optimize
internal loop for various inductor and output capacitor combinations with only a simple resistor to GND. The is
easy to use and allows low external component count with fast load transient response. Fixed-frequency
modulation also provides ease-of-filter design to overcome EMI noise.
8.2 Functional Block Diagram
VDD
PVIN
BP
BOOT
BP
Linear Regulators
BP3
MODE
API
SW
SYNC
RT
Driver
Phase Managment
PWM
Q
S
R
Control:
Anti-Cross-
Conduction,
Prebias
Oscillator
BP
Stacked NexFET
Power Stage
PGND
ACM Controller
Overcurrent
Detection,
Current sensing
OC Event
Average Iout
GND
VSHARE
ISHARE
Phase
Balance
AGND
Fault
Control
RSP
RSN
Fault
Start and Reference
EN
SS
VSEL
PGD
ILIM
REMOTE SENSE AMP
RAMP
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8.3 Feature Description
The device is a high-performance, integrated FET converter supporting current rating up to 40-A thermally. It
integrates two N-channel NexFET™ power MOSFETs, enabling high power density and small PCB layout area.
The drain-to-source breakdown voltage for these FETs is 25-V DC and transient. Avalanche breakdown occurs if
the absolute maximum voltage rating exceeds 25 V. In order to limit the switch node ringing of the device, TI
recommends adding a R-C snubber from the SW node to the PGND pins. Also a 10~100nF capacitor from VIN
(Pin 25) to GND (Pin2 7) is mandatory to reduce high side FET stress. Refer to Layout Guidelines for the
detailed recommendations.
The typical on-resistance (RDS(on)) for the high-side MOSFET is 3.4 mΩ and typical on-resistance for the low-
side MOSFET is 0.9 mΩ with a nominal gate voltage (VGS) of 5 V.
8.4 Device Functional Modes
8.4.1 Soft-Start Operation
In the TPS543C20A device, the soft-start time controls the inrush current required to charge the output capacitor
bank during start-up. The device offers 10 selectable soft-start options ranging from 0.5 ms to 32 ms. When the
device is enabled the reference voltage ramps from 0 V to the final level defined by VSEL pin strap configuration,
in a given soft-start time, which can be selected by SS pin. See Table 1 for details.
Table 1. SS Pin Configuration
SS TIME (ms)
RESISTOR VALUE (kΩ)(1)
0.5
1
0
8.66
15.4
23.7
OPEN
34.8
51.1
78.7
121
2
5
4
8
12
16
24
32
187
(1) The E48 series resistors with no more than 1% tolerance are recommended.
8.4.2 Input and VDD Undervoltage Lockout (UVLO) Protection
The provides fixed VIN and VDD undervoltage lockout threshold and hysteresis. The typical VIN turnon threshold
is 3.2 V and hysteresis is 0.2 V. The typical VDD turnon threshold is 3.8 V and hysteresis is 0.2 V. No specific
power-up sequence is required.
8.4.3 Power Good and Enable
The has power-good output that indicates logic high when output voltage is within the target. The power-good
function is activated after soft-start has finished. When the soft-start ramp reaches 90% of setpoint, PGOOD
detection function will be enabled. If the output voltage becomes within ±8% of the target value, internal
comparators detect power-good state and the power good signal becomes high after a delay. If the output
voltage goes outside of ±12% of the target value, the power good signal becomes low after an internal delay.
The power-good output is an open-drain output and must be pulled up externally.
This part has internal pull up for EN. EN is internally pulled up to BP when EN pin is floating. EN can be pulled
low through external grounding. When EN pin voltage is below its threshold, enters into shutdown operation, and
the minimum time for toggle EN to reset is 5 µs.
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8.4.4 Voltage Reference
VSEL pin strap is used to program initial boot voltage value from 0.6 V to 1.1 V by the resistor connected from
VSEL to AGND. The initial boot voltage is used to program the main loop voltage reference point. VSEL voltage
settings provide TI designated discrete internal reference voltages. Table 2 lists internal reference voltage
selections.
Table 2. VSEL Pin Configuration
DEFAULT Vref (V)
RESISTOR VALUE (kΩ)(1)
0.6
0.7
0
8.66
15.4
23.7
34.8
51.1
78.7
OPEN
121
0.75
0.8
0.85
0.9
0.95
1.0
1.05
1.1
187
(1) The E48 series resistors with no worse than 1% tolerance are
recommended
8.4.5 Prebiased Output Start-up
The device prevent current from being discharged from the output during start-up, when a pre-biased output
condition exists. No SW pulses occur until the internal soft-start voltage rises above the error amplifier input
voltage, if the output is pre-biased. As soon as the soft-start voltage exceeds the error amplifier input, and SW
pulses start, the device limits synchronous rectification after each SW pulse with a narrow on-time. The low-side
MOSFET on-time slowly increases on a cycle-by-cycle basis until 128 pulses have been generated and the
synchronous rectifier runs fully complementary to the high-side MOSFET. This approach prevents the sinking of
current from a pre-biased output, and ensures the output voltage start-up and ramp-to regulation sequences are
smooth and monotonic.
8.4.6 Internal Ramp Generator
Internal ramp voltage is generated from duty cycle that contains emulated inductor ripple current information and
then feed it back for control loop regulation and optimization according to required output power stage, duty ratio
and switching frequency. Internal ramp amplitude is set by RAMP pin by adjusting an internal ramp generation
capacitor CRAMP, selected by the resistor connected from MODE pin to GND. For best performance, we
recommend ramp signal to be no more than 4 times of output ripple signal for all Low ESR output capacitor
(MLCC) applications, or no more than 2 times larger than output ripple signal for regular ESR output capacitor
(Pos-cap) applications. For design recommendation, see the design tool at www.ti.com/WEBENCH.
RAMP
RRAMP
Duty Cycle
RAMP
SLOPE
Slope
Compensation
10 Selections
CRAMP
Figure 15. Internal Ramp Generator
16
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8.4.6.1 Ramp Selections
RAMP pin sets internal ramp amplitude for the control loop. RAMP amplitude is determined by internal RC,
selected by the resistor connected from MODE pin to GND, to optimize the control loop. See Table 3.
Table 3. RAMP Pin-Strapping Selection
CRAMP (pF)
1
RESISTOR VALUE (kΩ)(1)
0
1.42
1.94
2.58
3.43
4.57
6.23
8.91
14.1
29.1
8.66
15.4
23.7
34.8
51.1
78.7
121
187
Open
(1) The E48 series resistors with tolerance of 1% or less are
recommended.
8.4.7 Switching Frequency
The converter supports analog frequency selections from 300 kHz to 2 MHz, for stand alone device and sync
frequency from 300 kHz to 1 MHz for stackable configuration. The RT pin also sets clock sync point (SP) for the
slave device.
Switching Frequency Configuration for Stand-alone and Master Device in Stackable Configuration
Master
MODE
TPS543C20
SYNC
RT
Figure 16. Standalone: RT Pin Sets the Switching Frequency
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Master
Slave
VSHARE
ISHARE
VSHARE
ISHARE
MODE
MODE
RT
RT
SYNC
SYNC
Figure 17. Stackable: Master (as Clock Master) RT Pin Sets Switching Frequency, and passes it to Slave
Resistor RRT sets the continuous switching frequence selection by
20 ´ 109
¦
´ 2
SW
RRT
=
-
¦
2000
SW
where
•
•
R is the resistor from RT pin to GND, in Ω
ƒSW is the desired switching frequency, in Hz
(1)
8.4.8 Clock Sync Point Selection
The device implements an unique clock sync scheme for phase interleaving during stackable configuration. The
device will receive the clock through sync pin and generate sync points for another device to sync to one of them
to achieve phase interleaving. Sync point options can be selected through RT pin when 1) device is configurated
as master sync in, 2) device is configured as slave. See Table 5 for control mode selection.
System Clock
or
Master Clock
0
1/2
0
Slave clock
1/2
Figure 18. 2-Phase Stackable with 180° Clock Phase Shift
18
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Table 4. RT Pin Sync Point Selection
CLOCK SYNC OPTIONS
0 (0° Interleaving)
RESISTOR VALUE (kΩ)
0
1/4 (90° Interleaving)
1/3 (120° Interleaving)
2/3 (240° Interleaving)
3/4 (270° Interleaving)
1/2 (180° Interleaving)
8.66
15.4
23.7
34.8
OPEN
8.4.9 Synchronization and Stackable Configuration
The device can synchronize to an external clock which must be equal to or higher than internal frequency setting.
For stand alone device, the external clock should be applied to the SYNC pin before VDD ramps up. A sudden
change in synchronization clock frequency causes an associated control loop response, resulting in an overshoot
or undershoot on the output voltage.
In dual phase stackable configuration:
1. when there is no external system clock applied, the master device will be configured as clock master,
sending out pre-set switching frequency clock to slave device through SYNC pin. Slave receives this clock as
switching clock with phase interleaving.
2. when a system clock is applied, both master and slave devices will be configured as clock slave, they sync
to the external system clock as switching frequency with proper phase shift
8.4.10 Dual-Phase Stackable Configurations
8.4.10.1 Configuration 1: Master Sync Out Clock-to-Slave
•
•
Direct SYNC, VSHARE and ISHARE connections between master and slave.
Switching frequency is set by RT pin of master, and pass to slave through SYNC pin. SYNC pin of master will
be configured as sync out by it’s MODE pin.
•
Slave receives clock from SYNC pin. Its RT pin determines the sync point for clock phase shift.
Master
Slave
VSHARE
ISHARE
VSHARE
ISHARE
MODE
MODE
23.7 k
F_SW
51.1 k
RT
RT
SYNC
SYNC
Open
Sync Point
Figure 19. 2-Phase Stackable with 180° Phase Shift: Master Sync Out Clock-to-Slave
8.4.10.2 Configuration 2: Master and Slave Sync to External System Clock
•
•
•
•
Direct connection between external clock and SYNC pin of master and slave.
Direct VSHARE and ISHARE connections between master and slave.
SYNC pin of master is configured as sync in by its MODE pin.
Master and slave receive external system clock from SYNC pin. Their RT pin determine the sync point for
clock phase shift.
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Master
Slave
VSHARE
ISHARE
VSHARE
ISHARE
MODE
MODE
34.8 k
51.1 k
Open
RT
RT
SYNC
SYNC
0 k
Sync Point
Sync Point
System Clock
Figure 20. 2-Phase Stackable with 180° Phase Shift: Master and Slave Sync to External System Clock
8.4.11 Operation Mode
The operation mode and API/body brake feature is set by the MODE pin. They are selected by the resistor
connected from MODE pin to GND. Mode pin sets the device to be stand-alone mode or stackable mode. In
stand-alone mode, MODE pin sets the API on/off or trigger point sensitivity of API (1× stands for most sensitive
and 4× stands for least sensitive). In stackable mode, the MODE pin sets the device as master or slave, as well
as SYNC pin function (sync in or sync out) of the master device.
Table 5. MODE Pin-Strapping Selection
CONTROL MODE
SELECTION
RESISTOR VALUE (kΩ) and API/BB
API/BODY BRAKE
NOTE
Threshold(1)
API OFF
BB OFF
Open
API ON
BB OFF
15.4, API = 35 mV
Standalone
API/body brake
•
•
Sync pin to receive clock
RT pin to set frequency
121, API = 15 mV, BB = 30 mV
187, API = 25 mV, BB = 30 mV
8.66, API = 35 mV, BB = 30 mV
78.7, API = 45 mV, BB = 30 mV
API ON
BB ON
(API Threshold Setting)
•
•
Sync pin to send out clock
RT pin to set frequency
(Master sync out)
(Master sync in)
(Slave sync In)
23.7
34.8
51.1
API OFF
BB OFF
•
•
Sync pin to receive clock
RT pin to set sync point
•
•
Sync pin to receive clock
RT pin to set sync point
(1) The E48 series resistors with tolerance of 1% or less are recommended.
8.4.12 API/Body Brake
is a true fixed frequency converter. The major limitation for any fixed frequency converter is that during transient
load step up, the converter needs to wait for the next clock cycle to response to the load change, depending on
loop bandwidth design and the timing of load transient, this delay time could cause additional output voltage
drop. implements a special circuitry to improve transient performance. During load step up, the converter senses
both the speed and the amplitude of the output voltage change, if the output voltage change is fast and big
enough, the converter will issue an additional PWM pulse before the next available clock cycle to stop output
voltage from further dropping, thus reducing the undershoot voltage.
20
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During load step-down, implements a body-brake function, that turns off both high-side and lowside FET, and
allows power to dissipate through the low-side body diode, reducing overshoot. This approach is very effective
while having some impact on efficiency during transient. See Figure 21 and Figure 22.
Vout œ API enabled
Vout œ API disabled
Vout œ Body Brake disabled
Vout œ Body Brake enabled
LOAD
LOAD
Switch Node
Switch Node
Figure 21. Undershoot Comparison with API ON/OFF
Figure 22. Overshoot Comparison with Body Brake
ON/OFF
8.4.13 Sense and Overcurrent Protection
8.4.13.1 Low-Side MOSFET Overcurrent Protection
The utilizes ILIM pin to set the OCP level. The ILIM pin must be connected to AGND through the ILIM voltage
setting resistor, RILIM. The ILIM terminal sources IILIM current, which is around 11.2 μA typically at room
temperature, and the ILIM level is set to the OCP ILIM voltage VILIM as shown in Equation 2. In order to provide
both good accuracy and cost effective solution, supports temperature compensated MOSFET RDS(on) sensing.
VILIM mV = RILIM (kW) ì IILIM (mA)
Consider RDS(on) variation vs VDD in calculation
(2)
Also, performs both positive and fixed negative inductor current limiting.
The inductor current is monitored by the voltage between GND pin and SW pin during the OFF time. ILIM has
1200 ppm/°C temperature slope to compensate the temperature dependency of the RDS(on). The GND pin is used
as the positive current sensing node.
The device has cycle-by-cycle over-current limiting control. The inductor current is monitored during the OFF
state and the controller maintains the OFF state during the period that the inductor current is larger than the
overcurrent ILIM level. VILIM sets the peak level of the inductor current. Thus, the load current at the overcurrent
threshold, IOCP, can be calculated as shown in .
IOCP = V
(16 × RDS(on)) - I
2
ILIM
IND(ripple)
V
(VIN - VOUT ) × VOUT
1
ILIM
=
-
16 × RDS(on) 2 × L × ƒSW
×
V
IN
where
•
RDS(on) is the on-resistance of the low-side MOSFET.
(3)
Equation 3 is valid for VDD ≥ 5 V. Use 0.58 mΩ for RDS(on) in calculation, which is the pure on-resistance for
current sense.
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If an overcurrent event is detected in a given switching cycle, the device increments an overcurrent counter.
When the device detects three consecutive overcurrent (either high-side or low-side) events, the converter
responds, entering continuous restart hiccup. In continuous hiccup mode, the device implements a 7 soft-start
cycle timeout, followed by a normal soft-start attempt. When the overcurrent fault clears, normal operation
resumes; otherwise, the device detects overcurrent and the process repeats.
8.4.13.2 High-Side MOSFET Overcurrent Protection
The device also implements a fixed high-side MOSFET overcurrent protection to limit peak current, and prevent
inductor saturation in the event of a short circuit. The device detects an overcurrent event by sensing the voltage
drop across the high-side MOSFET during ON state. If the peak current reaches the IHOSC level on any given
cycle, the cycle terminates to prevent the current from increasing any further. High-side MOSFET overcurrent
events are counted. If the devices detect three consecutive overcurrent events (high-side or low-side), the
converter responds by entering continuous restart hiccup.
8.4.14 Output Overvoltage and Undervoltage Protection
The device includes both output overvoltage protection and output undervoltage protection capability. The
devices compare the RSP pin voltage to internal selectable pre-set voltages. If the RSP voltage with respect to
RSN voltage rises above the output overvoltage protection threshold, the device terminates normal switching and
turns on the low-side MOSFET to discharge the output capacitor and prevent further increases in the output
voltage. Then the device enters continuous restart hiccup.
If the RSP pin voltage falls below the undervoltage protection level, after soft-start has completed, the device
terminates normal switching and forces both the high-side and low-side MOSFETs off, then enters hiccup time-
out delay prior to restart.
8.4.15 Overtemperature Protection
An internal temperature sensor protects the devices from thermal runaway. The internal thermal shutdown
threshold, TSD, is fixed at 165°C typical. When the devices sense a temperature above TSD, power conversion
stops until the sensed junction temperature falls by the thermal shutdown hysteresis amount; then, the device
starts up again.
8.4.16 RSP/RSN Remote Sense Function
RSP and RSN pins are used for remote sensing purpose. In the case where feedback resistors are required for
output voltage programming, the RSP pin should be connected to the mid-point of the resistor divider and the
RSN pin should always be connected to the load return.
When feedback resistors are not required as when the VSEL programs the output voltage set point, connect the
RSP pin to the positive sensing point of the load and the RSN pin should always be connected to the load return.
RSP and RSN pins are extremely high-impedance input terminals of the true differential remote sense amplifier.
The feedback resistor divider should use resistor values much less than 100 kΩ. A simple rule of thumb is to use
a 10-kΩ lower divider resistor and then size the upper resistor to achieve the desired ratio.
22
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TPS543C20
TPS543C20
2
1
RSN
RSP
2
1
RSN
RSP
BOOT
5
BOOT
5
Load
Load
+
–
+
–
Copyright ©2017, Texas Instruments Incorporated
Copyright ©2017, Texas Instruments Incorporated
Figure 23. Remote Sensing With Feedback Resistors
Figure 24. Remote Sensing Without Feedback Resistors
8.4.17 Current Sharing
When devices operate in dual-phase stackable application, a current sharing loop maintains the current balance
between devices. Both devices share the same internal control voltage through VSHARE pin. The sensed
current in each phase is compared first in a current share block by connecting ISHARE pin of each device, then
the error current is added into the internal loop. The resulting voltage is compared with the PWM ramp to
generate the PWM pulse.
8.4.18 Loss of Synchronization
During sync clock condition, each individual converter will continuously compare current falling edge and
previous falling edge, if current falling edge exceeded a 1us delay versus previous pulse, converter will declare a
lost sync fault, and response by pulling down ISHARE to shut down all phases.
Declare fault and take action
Sync fault delay
Switching
pulses
Tp
Tp
Tdelay
Tp +
Figure 25. Switching Response When Sync Clock Lost
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The TPS543C20A device is a highly-integrated synchronous step-down DC/DC converter. The device is used to
convert a higher DC input voltage to a lower DC output voltage, with a maximum output current of 40 A. Use the
following design procedure to select key component values for this device.
9.2 Typical Application: TPS543C20A Stand-alone Device
PVIN
EN
EN
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGOOD
PGD
SYNC
VSEL
SS
RT
Thermal Tab
MODE
RAMP
+
-
Figure 26. 4.5-V to 16-V Input, 1-V Output, 40-A Converter
24
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9.2.1 Design Requirements
For this design example, use the input parameters shown in Table 6.
Table 6. Design Example Specifications
PARAMETER
Input voltage
VIN(ripple) Input ripple voltage
TEST CONDITION
MIN
TYP
MAX
UNIT
VIN
4
12
V
V
V
IOUT = A
0.4
VOUT
Output voltage
0.9
Line regulation
5 V ≤ VIN ≤ 16 V
0 V ≤ IOUT ≤ A
IOUT = A
0.5%
0.5%
Load regulation
VPP
VOVER
VUNDER
IOUT
tSS
Output ripple voltage
Transient response overshoot
Transient response undershoot
Output current
20
50
mV
mV
mV
A
ISTEP = 10 A
ISTEP = 10A
50
5 V ≤ VIN ≤ 16 V
VIN = 12 V
35
40
Soft-start time
4
ms
A
IOC
Overcurrent trip point(1)
45
η
Peak efficiency
IOUT = A, VIN = 12 V, VDD = 5 V
90%
500
fSW
Switching frequency
300
700
kHz
(1) DC overcurrent level
9.2.2 Detailed Design Procedure
9.2.2.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the TPS543C20A device with the WEBENCH® Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
•
•
•
•
Run electrical simulations to see important waveforms and circuit performance
Run thermal simulations to understand board thermal performance
Export customized schematic and layout into popular CAD formats
Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
9.2.2.2 Switching Frequency Selection
Select a switching frequency for the TPS543C20A. There is a trade off between higher and lower switching
frequencies. Higher switching frequencies may produce smaller solution size using lower valued inductors and
smaller output capacitors compared to a power supply that switches at a lower frequency. However, the higher
switching frequency causes extra switching losses, which decrease efficiency and impact thermal performance.
In this design, a moderate switching frequency of 500 kHz achieves both a small solution size and a high
efficiency operation is selected. The device supports continuous switching frequency programming; see
Equation 4. additional considerations (internal ramp compensation) other than switching frequency need to be
included.
Copyright © 2018, Texas Instruments Incorporated
25
TPS543C20A
ZHCSJ36 –NOVEMBER 2018
www.ti.com.cn
20 ´ 109
500 ´103
RRT
=
- 2 ´
= 39.5 kW
500 ´103
(4)
2000
In this case, a standard resistor value of 40.2 kΩ is selected.
9.2.2.3 Inductor Selection
To calculate the value of the output inductor (L), use Equation 5. The coefficient KIND represents the amount of
inductor-ripple current relative to the maximum output current. The output capacitor filters the inductor-ripple
current. Therefore, selecting a high inductor-ripple current impacts the selection of the output capacitor because
the output capacitor must have a ripple-current rating equal to or greater than the inductor-ripple current.
Generally, the KIND must be kept between 0.1 and 0.3 for balanced performance. Using this target ripple current,
the required inductor size can be calculated as shown in .
VOUT
IN ´ ƒSW
V
IN - VOUT
1 V ´ (12 V - 1V)
L =
-
=
= 458 nH
V
I
OUT ´KIND
12 V ´ 500 kHz ´ 40 A ´ 0.1
(5)
A standard inductor value of 470 nH is selected. For this application, Wurth 744309047 was used from the web-
orderable EVM.
9.2.2.4 Input Capacitor Selection
The TPS543C20A devices require a high-quality, ceramic, type X5R or X7R, input decoupling capacitor with a
value of at least 1 μF of effective capacitance on the VDD pin, relative to AGND. The power stage input
decoupling capacitance (effective capacitance at the PVIN and PGND pins) must be sufficient to supply the high
switching currents demanded when the high-side MOSFET switches on, while providing minimal input voltage
ripple as a result. This effective capacitance includes any DC bias effects. The voltage rating of the input
capacitor must be greater than the maximum input voltage. The capacitor must also have a ripple current rating
greater than the maximum input current ripple to the device during full load. The input ripple current can be
calculated using Equation 6.
V -V
VOUT
(
)
IN OUT
ICIN(rms) = IOUT(max)
´
´
= 16 Arms
V
V
IN
IN
(6)
The minimum input capacitance and ESR values for a given input voltage ripple specification, VIN(ripple), are
shown in Equation 7 and Equation 8. The input ripple is composed of a capacitive portion, VRIPPLE(cap), and a
resistive portion, VRIPPLE(esr)
.
IOUT (max ) × VOUT
CIN(min )
=
= 38.5 JF
VRIPPLE
× V
× f
;
IN max SW
:
cap
;
:
(7)
(8)
VRIPPLE(ESR)
ESRCIN (max )
=
= 7 m3
IRIPPLE
IOUT max + @
A
:
;
2
The value of a ceramic capacitor varies significantly over temperature and the amount of DC bias applied to the
capacitor. The capacitance variations due to temperature can be minimized by selecting a dielectric material that
is stable over temperature. X5R and X7R ceramic dielectrics are usually selected for power regulator capacitors
because they have a high capacitance to volume ratio and are fairly stable over temperature. The input capacitor
must also be selected with the DC bias taken into account. For this example design, a ceramic capacitor with at
least a 25-V voltage rating is required to support the maximum input voltage. For this design, allow 0.1-V input
ripple for VRIPPLE(cap), and 0.3-V input ripple for VRIPPLE(esr). Using Equation 7 and Equation 8, the minimum input
capacitance for this design is 38.5 µF, and the maximum ESR is 9.4 mΩ. For this example, four 22-μF, 25-V
ceramic capacitors and one additional 100-μF, 25-V low-ESR polymer capacitors in parallel were selected for the
power stage.
9.2.2.5 Bootstrap Capacitor Selection
A ceramic capacitor with a value of 0.1 μF must be connected between the BOOT and SW pins for proper
operation. It is recommended to use a ceramic capacitor with X5R or better grade dielectric. Use a capacitor with
a voltage rating of 25 V or higher.
26
Copyright © 2018, Texas Instruments Incorporated
TPS543C20A
www.ti.com.cn
ZHCSJ36 –NOVEMBER 2018
9.2.2.6 BP Pin
Bypass the BP pin to GND with 4.7-µF of capacitance. In order for the regulator to function properly, it is
important that these capacitors be localized to the TPS543C20A , with low-impedance return paths. See Power
Good and Enable section for more information.
9.2.2.7 R-C Snubber and VIN Pin High-Frequency Bypass
Though it is possible to operate the TPS543C20A within absolute maximum ratings without ringing reduction
techniques, some designs may require external components to further reduce ringing levels. This example uses
two approaches: a high frequency power stage bypass capacitor on the VIN pins, and an R-C snubber between
the SW area and GND.
The high-frequency VIN bypass capacitor is a lossless ringing reduction technique which helps minimizes the
outboard parasitic inductances in the power stage, which store energy during the low-side MOSFET on-time, and
discharge once the high-side MOSFET is turned on. For this example twin 2.2-nF, 25-V, 0603-sized high-
frequency capacitors are used. The placement of these capacitors is critical to its effectiveness.
Additionally, an R-C snubber circuit is added to this example. To balance efficiency and spike levels, a 1-nF
capacitor and a 1-Ω resistor are chosen. In this example a 0805-sized resistor is chosen, which is rated for 0.125
W, nearly twice the estimated power dissipation. See SLUP100 for more information about snubber circuits.
9.2.2.8 Output Capacitor Selection
There are three primary considerations for selecting the value of the output capacitor. The output capacitor
affects three criteria:
•
•
•
Stability
Regulator response to a change in load current or load transient
Output voltage ripple
These three considerations are important when designing regulators that must operate where the electrical
conditions are unpredictable. The output capacitance needs to be selected based on the most stringent of these
three criteria.
9.2.2.8.1 Response to a Load Transient
The output capacitance must supply the load with the required current when current is not immediately provided
by the regulator. When the output capacitor supplies load current, the impedance of the capacitor greatly affects
the magnitude of voltage deviation (such as undershoot and overshoot) during the transient.
Use Equation 9 and Equation 10 to estimate the amount of capacitance needed for a given dynamic load step
and release.
NOTE
There are other factors that can impact the amount of output capacitance for a specific
design, such as ripple and stability.
Copyright © 2018, Texas Instruments Incorporated
27
TPS543C20A
ZHCSJ36 –NOVEMBER 2018
www.ti.com.cn
2
L ´ DILOAD(max)
DILOAD(max) ´ 1- D ´ t
SW
(
)
DVLOAD(INSERT)
COUT(min_under)
=
+
2 ´ DVLOAD(INSERT) ´ (V -VVOUT
)
IN
(9)
2
LOUT
´
DI
LOAD(max)
(
)
2 ´ DVLOAD(release) × VOUT
COUT(min_over)
=
where
•
•
•
•
•
•
•
•
•
•
COUT(min_under) is the minimum output capacitance to meet the undershoot requirement
COUT(min_over)is the minimum output capacitance to meet the overshoot requirement
D is the duty cycle
L is the output inductance value (0.47 µH)
∆ILOAD(max) is the maximum transient step (10 A)
VOUT is the output voltage value (900 mV)
tSW is the switching period (2 µs)
VIN is the minimum input voltage for the design (12 V)
∆VLOAD(insert) is the undershoot requirement (50 mV)
∆VLOAD(release) is the overshoot requirement (50 mV)
(10)
•
This example uses a combination of POSCAP and MLCC capacitors to meet the overshoot requirement.
–
–
POSCAP bank #1: 2 × 330 µF, 2.5 V, 3 mΩ per capacitor
MLCC bank #2: 3 × 100 µF, 6.3 V, 1 mΩ per capacitor
9.2.2.8.2 Ramp Selection Design to Ensure Stability
Certain criteria is recommended for to achieve optimized loop stability, bandwidth and switching jitter
performance. As a rule of thumb, the internal ramp voltage should be 2~4 times bigger than the output capacitor
ripple(capacitive ripple only). is defined to be ease-of-use, for most applications, TI recommends ramp resistor to
be 187 kΩ to achieve the optimized jitter and loop response. For detailed design procedure, see the
WEBENCH® Power Designer.
28
Copyright © 2018, Texas Instruments Incorporated
TPS543C20A
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ZHCSJ36 –NOVEMBER 2018
9.2.3 Application Curves
Figure 27. Transient Response of 0.9-V Output at 12-VIN
,
Figure 28. Output Ripple and SW Node of 0.9-V Output at
12-VIN, -A Output
Transient is 15 A to 25 A to 15 A,
the Step is 10 A at 40 A/μs
Figure 30. Start up from Control, 0.9-V Output at 12-VIN
,
Figure 29. Output Ripple and SW Node of 0.9-V Output at
12-VIN, 0-A Output
10-mA Output
Figure 31. 0.5-V Prebias start up from Control, 0.9-V
Output at 12-VIN, 20-A Output
Figure 32. Output Voltage Start-up and Shutdown, 0.9-V
Output at 12-VIN, 0.5-A Output
Copyright © 2018, Texas Instruments Incorporated
29
TPS543C20A
ZHCSJ36 –NOVEMBER 2018
www.ti.com.cn
9.3 System Example
9.3.1 Two-Phase Stackable
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
RAMP
MODE
RT
SS
Slave
VSEL
SYNC
PGD
EN
LOAD
PVIN
+
œ
EN
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGD
SYNC
VSEL
SS
Master
RT
Thermal Tab
MODE
RAMP
Figure 33. 2-Phase Stackable
See Synchronization and Stackable Configuration section.
30
Copyright © 2018, Texas Instruments Incorporated
TPS543C20A
www.ti.com.cn
ZHCSJ36 –NOVEMBER 2018
System Example (continued)
9.3.1.1 Application Curves
Figure 35. Transient Response of 25-A to 50-A Load
Figure 34. Transient Response of 0.9-V Output at 12 VIN
,
Transient is 25 A to 50 A, Step is 25 A at 30 A/μs
at 30 A/μs Rise
Figure 36. Transient Response of 50-A to 25-A Load
Figure 37. Output Ripple and SW Node
of 0.9-V Output at 12 VIN, -A Output
at 30 A/μs Fall
Figure 39. Start up from Enable,
0.9-V Output at 12 VIN, 80-A Output
Figure 38. Output Ripple and SW Node
of 0.9-V Output at 12 VIN, 0-A Output
Copyright © 2018, Texas Instruments Incorporated
31
TPS543C20A
ZHCSJ36 –NOVEMBER 2018
www.ti.com.cn
System Example (continued)
Figure 40. 0.6-V Pre-Bias Start Up From Enable,
0.9-V Output at 12 VIN, 0-A Output
Figure 41. Output Voltage Start-up and Shutdown,
0.9-V Output at 12 VIN, 5-A Output
Figure 42. Master-Slave 180° Synchronization
10 Power Supply Recommendations
This device is designed to operate from an input voltage supply between 4 V and 16 V. Ensure the supply is well
regulated. Proper bypassing of input supplies and internal regulators is also critical for noise performance, as is
the quality of the PCB layout and grounding scheme. See the recommendations in Layout.
32
版权 © 2018, Texas Instruments Incorporated
TPS543C20A
www.ti.com.cn
ZHCSJ36 –NOVEMBER 2018
11 Layout
11.1 Layout Guidelines
•
It is absolutely critical that all GND pins, including AGND (pin 29), GND (pin 27), and PGND (pins 13, 14, 15,
16, 17, 18, 19, and 20) are connected directly to the thermal pad underneath the device via traces or plane.
The number of thermal vias needed to support 40-A thermal operation should be as many as possible; in the
EVM design orderable on the Web, a total of 23 thermal vias are used. The TPS543C20EVM-799 is available
for purchase at ti.com.
•
•
Place the power components (including input/output capacitors, output inductor, and TPS543C20 device) on
one side of the PCB (solder side). At least one or two innner layers/planes must be inserted, connecting to
power ground, in order to shield and isolate the small signal traces from noisy power lines.
Place the VIN decoupling capacitors as close to the PVIN and PGND as possible to minimize the input AC
current loop. The high frequency decoupling capacitor (1 nF to 0.1 µF) should be placed next to the PVIN pin
and PGND pin as close as the spacing rule allows. This helps surpressing the switch node ringing.
•
•
Place a 10-nF to 100-nF capacitor close to IC from Pin 25 VIN to Pin 27 GND.
Place VDD and BP decoupling capacitors as close to the device pins as possible. Do not use PVIN plane
connection for VDD. VDD needs to be tapped off from PVIN with separate trace connection. Ensure to
provide GND vias for each decoupling capacitor and make the loop as small as possible.
•
•
•
The PCB trace defined as switch node, which connects the SW pins and up-stream of the output inductor
should be as short and wide as possible. In web orderable EVM design, the SW trace width is 400 mil. Use
separate via or trace to connect SW node to snubber and bootstrap capacitor. Do not combine these
connections.
All sensitive analog traces and components such as RAMP, RSP, RSN, ILIM, MODE, VSEL and RT should
be placed away from any high voltage switch node (itself and others), such as SW and BOOT to avoid noise
coupling. In addition, MODE, VSEL, ILIM, RAMP and RT programming resistors should be placed near the
device/pins.
The RSP and RSN pins operate as inputs to a differential remote sense amplifier that operates with very high
impedance. It is essential to route the RSP and RSN pins as a pair of diff-traces in Kelvin-sense fashion.
Route them directly to either the load sense points (+ and –) or the output bulk capacitors. The internal circuit
uses the RSP pin for on-time adjustment. It is critical to tie the RSP pin directly tied to VOUT (load sense
point) for accurate output voltage result.
•
Use caution when routing of the SYNC, VSHARE and ISHARE traces for 2-phase configurations. The SYNC
trace carries a rail-to-rail signal and should be routed away from sensitive analog signals, including the
VSHARE, ISHARE, RT, and FB signals. The VSHARE and ISHARE traces should also be kept away from
fast switching voltages or currents formed by the PVIN, AVIN, SW, BOOT, and BP pins.
版权 © 2018, Texas Instruments Incorporated
33
TPS543C20A
ZHCSJ36 –NOVEMBER 2018
www.ti.com.cn
11.2 Layout Example
Place PVIN bypass
Bypass for internal regulators
BP, VDD. Use multiple vias
to reduce parasitic
capacitors as close as
possible to IC, with best
high frequency capacitor
closest to PVIN/PGND pins
inductance.
10nF to 100nF
at pin 25 and
27
EN
Signal
PVIN
10nF to
100nF at
pin 20 and
21
Internal AGND
Plane to reduce
the BP bypass
parasitics.
PGND
Kelvin Connect to
IC RSP and RSN
pins
EN
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
Connect GND to
Thermal Pad
Connect AGND to
Thermal Pad
PGD
SYNC
Thermal Pad
VSEL
SS
RSN
RT
MODE
RAMP
RSNSœ
Place best high
frequency output
capacitor between
AGND and GND
are only
connected
together on
Thermal Pad.
sense point
AGND
RSNS+
CBOOT
RBOOT
Optional RC
Snubber, tight
loop around
RSP
VOUT
pin 12 and 13
Sense point
should be
directly at the
load
L1
Minimize SW
For best efficiency, use a heavy
weight copper and place these
planes on multiple PCB layers
area for least
noise. Keep
sensitive
traces away
from SW and
BOOT on all
layers
图 43. Example Layout
34
版权 © 2018, Texas Instruments Incorporated
TPS543C20A
www.ti.com.cn
ZHCSJ36 –NOVEMBER 2018
11.3 Package Size, Efficiency and Thermal Performance
The TPS543C20A device is available in a 5 mm × 7 mm, QFN package with 40 power and I/O pins. It employs
TI proprietary MCM packaging technology with thermal pad. With a properly designed system layout, applications
achieve optimized safe operating area (SOA) performance. The curves shown in and are based on the orderable
evaluation module design.
110
100
90
110
100
90
80
80
70
70
60
60
50
50
Nat conv
100 LFM
200 LFM
400 LFM
Nat conv
100 LFM
200 LFM
400 LFM
40
40
30
30
5
10
15
20
25
30
35
40
5
10
15
20
25
30
35
40
Output Current (A)
Output Current (A)
D012
D011
VIN = 12 V
VOUT = 5 V
图 44. Safe Operating Area
500 kHz
VIN = 12 V
VOUT = 1 V
图 45. Safe Operating Area
500 kHz
图 46. Thermal Image at 1.0-V Output at 12 VIN, 40-A Output, at 25°C Ambient
版权 © 2018, Texas Instruments Incorporated
35
TPS543C20A
ZHCSJ36 –NOVEMBER 2018
www.ti.com.cn
Package Size, Efficiency and Thermal Performance (接下页)
tP
TP
TL
TS(max)
TS(min)
tL
rRAMP(up)
rRAMP(down)
tS
t25P
Time (s)
25
图 47. Recommended Reflow Oven Thermal Profile
表 7. Recommended Thermal Profile Parameters
PARAMETER
MIN
TYP
MAX UNIT
RAMP UP AND RAMP DOWN
rRAMP(up)
Average ramp-up rate, TS(MAX) to TP
3
6
°C/s
°C/s
rRAMP(down) Average ramp-down rate, TP to TS(MAX)
PRE-HEAT
TS
Pre-heat temperature
150
60
200
180
°C
s
tS
Pre-heat time, TS(min) to TS(max)
REFLOW
TL
TP
tL
Liquidus temperature
217
°C
°C
s
Peak temperature
260
150
40
Time maintained above liquidus temperature, TL
Time maintained within 5°C of peak temperature, TP
Total time from 25°C of peak temperature, TP
60
20
tP
s
t25P
480
s
36
版权 © 2018, Texas Instruments Incorporated
TPS543C20A
www.ti.com.cn
ZHCSJ36 –NOVEMBER 2018
12 器件和文档支持
12.1 器件支持
12.1.1 开发支持
12.1.1.1 使用 WEBENCH® 工具创建定制设计
单击此处,使用 TPS543C20A 器件并借助 WEBENCH® 电源设计器创建定制设计方案。
1. 首先输入输入电压 (VIN)、输出电压 (VOUT) 和输出电流 (IOUT) 要求。
2. 使用优化器拨盘优化该设计的关键参数,如效率、尺寸和成本。
3. 将生成的设计与德州仪器 (TI) 的其他可行的解决方案进行比较。
WEBENCH 电源设计器可提供定制原理图以及罗列实时价格和组件供货情况的物料清单。
在多数情况下,可执行以下操作:
•
•
•
•
运行电气仿真,观察重要波形以及电路性能
运行热性能仿真,了解电路板热性能
将定制原理图和布局方案以常用 CAD 格式导出
打印设计方案的 PDF 报告并与同事共享
有关 WEBENCH 工具的详细信息,请访问 www.ti.com.cn/WEBENCH。
12.1.2 文档支持
12.1.2.1 相关文档
请参阅如下相关文档:
《TPS543C20A 40A 单相同步降压转换器》
12.2 接收文档更新通知
要接收文档更新通知,请导航至 TI.com.cn 上的器件产品文件夹。单击右上角的通知我进行注册,即可每周接收产
品信息更改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。
12.3 社区资源
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范,
并且不一定反映 TI 的观点;请参阅 TI 的 《使用条款》。
TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在
e2e.ti.com 中,您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。
设计支持
TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。
12.4 商标
NexFET, PowerStack, E2E are trademarks of Texas Instruments.
WEBENCH is a registered trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止 MOS 门极遭受静电损
伤。
12.6 术语表
SLYZ022 — TI 术语表。
这份术语表列出并解释术语、缩写和定义。
版权 © 2018, Texas Instruments Incorporated
37
TPS543C20A
ZHCSJ36 –NOVEMBER 2018
www.ti.com.cn
13 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更,恕不另行通知,且
不会对此文档进行修订。如需获取此数据表的浏览器版本,请查阅左侧的导航栏。
38
版权 © 2018, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS543C20ARVFR
ACTIVE
LQFN-CLIP
RVF
40
2500
RoHS-Exempt
& Green
NIPDAU | SN
Level-2-260C-1 YEAR
-40 to 125
TPS543C20A
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
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Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Jan-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS543C20ARVFR
LQFN-
CLIP
RVF
40
2500
330.0
16.4
5.3
7.3
1.8
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Jan-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
LQFN-CLIP RVF 40
SPQ
Length (mm) Width (mm) Height (mm)
367.0 367.0 38.0
TPS543C20ARVFR
2500
Pack Materials-Page 2
PACKAGE OUTLINE
RVF0040A
LQFN-CLIP - 1.52 mm max height
S
C
A
L
E
2
.
0
0
0
PLASTIC QUAD FLATPACK - NO LEAD
5.1
4.9
A
B
PIN 1 INDEX AREA
7.1
6.9
C
1.52
1.32
SEATING PLANE
0.08 C
0.05
0.00
2X 3.5
(0.2) TYP
3.3 0.1
EXPOSED
THERMAL PAD
36X 0.5
13
20
12
21
41
SYMM
2X
5.3 0.1
5.5
32
1
0.3
40X
0.2
40
33
PIN 1 ID
(OPTIONAL)
0.1
C A B
SYMM
0.05
0.5
0.3
40X
4222989/B 10/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
4. Reference JEDEC registration MO-220.
www.ti.com
EXAMPLE BOARD LAYOUT
RVF0040A
LQFN-CLIP - 1.52 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(3.3)
6X (1.4)
40
33
40X (0.6)
1
32
40X (0.25)
2X
(1.12)
36X (0.5)
6X
(1.28)
(6.8)
(5.3)
41
SYMM
(R0.05) TYP
(
0.2) TYP
VIA
12
21
13
20
SYMM
(4.8)
LAND PATTERN EXAMPLE
SCALE:12X
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4222989/B 10/2017
NOTES: (continued)
5. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
www.ti.com
EXAMPLE STENCIL DESIGN
RVF0040A
LQFN-CLIP - 1.52 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
SYMM
(0.815) TYP
40
33
40X (0.6)
1
41
32
40X (0.25)
(1.28)
TYP
36X (0.5)
(0.64)
TYP
SYMM
(6.8)
(R0.05) TYP
8X
(1.08)
12
21
METAL
TYP
20
13
8X (1.43)
(4.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD
71% PRINTED SOLDER COVERAGE BY AREA
SCALE:18X
4222989/B 10/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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