TPS544B25RVFR [TI]

具有 PMBus 和频率同步功能的 4.5V 至 18V、20A 同步 SWIFT™ 降压转换器 | RVF | 40 | -40 to 125;
TPS544B25RVFR
型号: TPS544B25RVFR
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

具有 PMBus 和频率同步功能的 4.5V 至 18V、20A 同步 SWIFT™ 降压转换器 | RVF | 40 | -40 to 125

转换器
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中文:  中文翻译
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TPS544C25, TPS544B25  
ZHCSDR8 MAY 2015  
TPS544x25 4.5V 18V20A 30A SWIFT™  
同步降压控制器(具有 PMBus™和频率同步功能)  
1 特性  
3 说明  
1
符合 PMBus 1.2 标准的转换器:20A 30A  
TPS544x25 器件是采用 5mm × 7mm 封装且符合  
PMBus 1.2 规范的非隔离式直流/直流转换器,具有集  
成的 FET,能够在高频下运行并输出 20A 30A 的电  
流。集成式 NexFET™功率级和经优化的驱动器提供的  
高频、低损耗开关支持密度极高的电源解决方案。  
PMBus 接口通过 VOUT_COMMAND 支持 AVS 功  
能,同时支持灵活的转换器配置以及关键参数(包括输  
出电压、电流和可选的外部温度)监控功能。对故障状  
况的响应可设置为重新启动、锁存或忽略,具体取决于  
系统要求。  
输入电压范围:4.5V 18V  
输出电压范围:0.5V 5.5V  
5mm × 7mm LQFN 封装  
单个散热焊盘  
集成 5.5mΩ 2.0mΩ 堆叠 NexFET™功率级  
用于通过 PMBus 进行自适应电压调节 (AVS) 和裕  
量调节的 500mV 1500mV 基准  
电压不低于 600mV 时的精度为 0.5%  
无损低侧金属氧化物半导体场效应晶体管  
(MOSFET) 电流感测  
器件信息  
具有输入前馈功能的电压模式控制  
差分远程感应  
器件名称  
封装  
封装尺寸  
TPS544B25RVFT  
TPS544C25RVFT  
LQFN (40)  
LQFN (40)  
5.00mm x 7.00mm  
5.00mm x 7.00mm  
单启动至预偏置输出  
输出电压和输出电流报告  
使用 2N3904 时的外部温度监视晶体管  
可通过 PMBus 接口进行编程  
.
.
VOUT_COMMAND AVS VOUT 转换率  
具有热补偿功能的过流保护  
UVLO、软启动和软停止  
PGOODOVUVOT 电平  
故障响应  
效率  
100  
95  
90  
85  
80  
75  
70  
65  
60  
接通和关闭延迟  
热关断  
引脚配置适用的开关频率:200kHz 1MHz  
与外部时钟频率同步  
封装兼容 20A30A 转换器  
V
V
V
V
V
= 0.5  
= 1.0  
= 1.5  
= 2.5  
= 3.3  
OUT  
OUT  
OUT  
OUT  
OUT  
2 应用范围  
测试和测量仪器  
以太网交换机、光交换机、路由器、基站  
服务器  
0
4
8
12  
16  
20  
24  
28  
32  
Load Current (A)  
No Snubber  
企业级存储固态硬盘 (SSD)  
高密度电源解决方案  
V
= 12 V  
L = 470 nH  
= 0 Ω  
IN  
f
= 500 kHz  
R
= 0.3mΩ  
R
BOOT  
SW  
DCR  
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,  
intellectual property matters and other important disclaimers. PRODUCTION DATA.  
English Data Sheet: SLUSC81  
 
 
TPS544C25, TPS544B25  
ZHCSDR8 MAY 2015  
www.ti.com.cn  
目录  
8.5 Supported PMBus Commands ............................... 36  
8.6 Register Maps......................................................... 39  
Applications and Implementation ...................... 77  
9.1 Application Information............................................ 77  
9.2 Typical Applications ................................................ 77  
1
2
3
4
5
6
7
特性.......................................................................... 1  
应用范围................................................................... 1  
说明.......................................................................... 1  
修订历史记录 ........................................................... 2  
Device Comparison Table..................................... 3  
Pin Configuration and Functions......................... 3  
Specifications......................................................... 5  
7.1 Absolute Maximum Ratings ...................................... 5  
7.2 ESD Ratings ............................................................ 5  
7.3 Recommended Operating Conditions....................... 5  
7.4 Thermal Information.................................................. 6  
7.5 Electrical Characteristics........................................... 7  
7.6 Typical Characteristics............................................ 12  
Detailed Description ............................................ 18  
8.1 Overview ................................................................. 18  
8.2 Functional Block Diagram ....................................... 18  
8.3 Feature Description................................................. 19  
8.4 Device Functional Modes........................................ 36  
9
10 Power Supply Recommendations ..................... 86  
11 Layout................................................................... 87  
11.1 Layout Guidelines ................................................. 87  
11.2 Layout Example .................................................... 88  
12 器件和文档支持 ..................................................... 90  
12.1 器件支持 ............................................................... 90  
12.2 相关链接................................................................ 91  
12.3 社区资源................................................................ 91  
12.4 ....................................................................... 91  
12.5 静电放电警告......................................................... 92  
12.6 Glossary................................................................ 92  
13 机械、封装和可订购信息....................................... 92  
8
4 修订历史记录  
日期  
修订版本  
注意  
2015 5 月  
*
初始发行版。  
2
Copyright © 2015, Texas Instruments Incorporated  
 
TPS544C25, TPS544B25  
www.ti.com.cn  
ZHCSDR8 MAY 2015  
5 Device Comparison Table  
DEVICE NAME  
CURRENT OPTION (A)  
TPS544B25RVFR  
TPS544B25RVFT  
TPS544C25RVFR  
TPS544C25RVFT  
20  
30  
6 Pin Configuration and Functions  
RVF Package  
40-Pin LQFN  
(Top View)  
40 39 38 37 36 35 34 33  
32  
31  
30  
29  
28  
27  
26  
CNTL  
ADDR1  
ADDR0  
DATA  
1
2
3
4
5
6
7
8
9
VOUTSt  
VOUTS+  
VSET  
VDD  
CLK  
BP6  
BP3  
SMBALERT  
BOOT  
PGND  
25  
24  
23  
SW  
SW  
VIN  
VIN  
VIN  
SW 10  
SW  
22  
21  
11  
SW 12  
VIN  
VIN  
Thermal Tab  
13 14 15 16 17 18 19 20  
Pin Functions  
NAME  
ADDR0  
ADDR1  
AGND  
NO.  
3
DESCRIPTION  
Sets low-order 3-bits of the PMBus address. Connect a resistor between this pin and AGND.  
Sets high-order 3-bits of the PMBus address. Connect a resistor between this pin and AGND.  
Analog ground return for controller device. Connect to GND at the thermal tab.  
2
38  
Output of the 3.3-V on-board regulator. This regulator powers the controller and should be bypassed with a  
minimum of 2.2 µF to AGND. BP3 is not designed to power external circuit.  
BP3  
27  
Output of the 6.5-V on-board regulator. This regulator powers the driver stage of the controller and should  
be bypassed with a minimum of 2.2 µF to GND. TI recommends using an additional 100-nF typical bypass  
capacitor for reduce ripple on BP6.  
BP6  
28  
Bootstrap pin for the internal flying high-side driver. Connect a typical 100-nF capacitor from this pin to the  
SW pin.  
BOOT  
CLK  
7
5
1
PMBus CLK pin. See Supported PMBus Commands section.  
PMBus CNTL pin. See Supported PMBus Commands section. The CNTL pin has an internal pull-up and  
floats high when left floating.  
CNTL  
Copyright © 2015, Texas Instruments Incorporated  
3
TPS544C25, TPS544B25  
ZHCSDR8 MAY 2015  
www.ti.com.cn  
Pin Functions (continued)  
NAME  
COMP  
DATA  
DIFFO  
FB  
NO.  
35  
4
DESCRIPTION  
Output of the error amplifier. Connect compensator network from this pin to the FB pin.  
PMBus DATA pin. See Supported PMBus Commands section.  
Output of the differential remote sense amplifier.  
33  
34  
13  
14  
15  
16  
17  
18  
19  
20  
26  
Feedback pin for the control loop. Negative input of the error amplifier.  
GND  
Power stage ground return.  
PGND  
Power ground return for controller device. Connect to GND at the thermal tab.  
Power good output. Open drain output that floats up when the device is operating and in regulation. Any  
fault condition causes this pin to pull low. Please refer to Table 6 for the possible sources to pull down  
PGOOD pin.  
PGOOD  
36  
Frequency-setting resistor. Connect a resistor from this pin to AGND to program the switching frequency.  
Do not leave this pin floating.  
RT  
40  
SMBALERT  
6
8
SMBus alert pin. See SMBus specification.  
9
Switched power output of the device. Connect the output averaging filter and bootstrap capacitor to this  
group of pins.  
SW  
10  
11  
12  
For switching frequency synchronization or output voltage reset. The SYNC function allows synchronizing  
the oscillator to an external source that is either slower of faster than the nominal free running oscillator  
frequency. To use the SYNC function, VSET pin should be pulled up to BP3 or set the FORCE_SYNC bit  
in register MISC_CONFIG_OPTIONS (MFR_SPECIFIC_32) (F0h) if VSET function is used; if  
synchronization is not required, pull the SYNC pin to BP3. If the VSET pin is connected to AGND through a  
valid resistor to configure default output voltage, SYNC/RESET_B is configured as RESET_B function  
when FORCE_SYNC is not set. Then the logic low on the SYNC/RESET_B pin restores the output voltage  
to default value set by VSET without power cycling. When SYNC/RESET_B is configured as RESET_B  
function, there is an internal 200kΩ pull-up resistor to BP3.  
SYNC/RESET_B  
39  
External temperature sense signal input or alternatively used to set default soft-start time by connecting a  
resistor from this pin to AGND. Do not leave this pin floating. Disable TSNS by pulling TSNS to AGND and  
unsetting SS_DET_DIS in OPTIONS (MFR_SPECIFIC_21) (E5h) in applications where neither is needed.  
TSNS/SS  
VDD  
37  
29  
Input power to the controller. Connect a low impedance bypass with a minimum of 1 µF to AGND. The  
VDD voltage is also used for input feed-forward. VIN and VDD must be the same potential for accurate  
short circuit protection.  
21  
22  
23  
24  
25  
VIN  
Input power to the power stage. Low impedance bypassing of these pins to GND is critical.  
Load voltage sensing, positive side. This sensing provides remote sensing for the PMBus interface  
reporting and the voltage control loop.  
VOUTS+  
VOUTS–  
31  
32  
Load voltage sensing, negative or common side. This sensing provides remote sensing for the PMBus  
interface reporting and the voltage control loop.  
Optionally configures default output voltage setting by connecting a resistor from this pin to AGND. See Set  
Default Output Voltage by VSET for details. If VSET is not used, pull this pin up to BP3. Do not leave this  
pin floating.  
VSET  
30  
Package thermal tab. Connect to GND. The thermal tab must have adequate solder coverage for proper  
operation.  
Thermal tab  
4
Copyright © 2015, Texas Instruments Incorporated  
TPS544C25, TPS544B25  
www.ti.com.cn  
ZHCSDR8 MAY 2015  
7 Specifications  
7.1 Absolute Maximum Ratings  
over operating free-air temperature range (unless otherwise noted)  
(1)  
MIN  
–0.3  
–0.3  
–0.3  
–5  
MAX  
18  
19  
25  
25  
37  
7
UNIT  
VIN, VDD  
VIN, VDD <2 ms transient  
VIN – SW (VIN to SW differential)  
VIN – SW (VIN to SW differential, <10 ns transient due to SW ringing)  
BOOT  
–0.3  
–0.3  
–0.3  
–0.3  
–0.3  
–0.3  
–1  
Input voltage range  
V
BOOT – SW (BOOT to SW differential)  
BOOT – SW (BOOT to SW differential, <10 ns transient)  
7.5  
5.5  
3.6  
7
CLK, DATA  
VSET, ADDR0, ADDR1, TSNS/SS  
FB, SYNC/RESET_B, CNTL, VOUTS–, VOUTS+, RT  
SW  
25  
25  
7
SW <100 ns transient  
BP6, COMP, DIFFO, PGOOD  
SMBALERT  
–5  
Output voltage range  
–0.3  
–0.3  
–0.3  
–40  
–55  
V
5.5  
3.6  
150  
150  
BP3  
Operating junction temperature range, TJ  
Storage temperature range, Tstg  
°C  
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings  
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended  
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
7.2 ESD Ratings  
VALUE  
UNIT  
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)  
±2000  
Electrostatic  
discharge  
V(ESD)  
V
Charged device model (CDM), per JEDEC specification JESD22-C101, all  
pins(2)  
±1500  
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process  
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.  
7.3 Recommended Operating Conditions  
over operating free-air temperature range (unless otherwise noted)  
MIN  
4.5  
TYP  
12  
MAX  
18  
UNIT  
V
VDD  
VIN  
TJ  
Controller input voltage  
Power stage input voltage  
Junction temperature  
4.5  
12  
18  
V
–40  
125  
°C  
Copyright © 2015, Texas Instruments Incorporated  
5
TPS544C25, TPS544B25  
ZHCSDR8 MAY 2015  
www.ti.com.cn  
7.4 Thermal Information  
TPS544x25  
PQFN (RVF)  
40 PINS  
27.4  
THERMAL METRIC(1)  
UNIT  
RθJA  
Junction-to-ambient thermal resistance  
RθJC(top)  
RθJB  
Junction-to-case (top) thermal resistance  
Junction-to-board thermal resistance  
18.3  
4.2  
°C/W  
ψJT  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
Junction-to-case (bottom) thermal resistance  
1.4  
ψJB  
4.2  
RθJC(bot)  
1.0  
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.  
6
Copyright © 2015, Texas Instruments Incorporated  
TPS544C25, TPS544B25  
www.ti.com.cn  
ZHCSDR8 MAY 2015  
7.5 Electrical Characteristics  
TJ = –40°C to 125°C, VVIN = VVDD= 12 V, RRT = 40.2 kΩ; zero power dissipation (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
INPUT SUPPLY  
VVDD  
VVIN  
Input supply voltage range  
Power stage voltage range  
Input operating current  
4.5  
4.5  
18  
18  
12  
V
IVDD  
Not switching  
9.5  
4.5  
mA  
UVLO  
Factory default setting  
V
V
VIN_ON  
Input turn on voltage  
Input turn off voltage  
Programmable range, 15 different settings  
Accuracy  
4.25  
–5%  
7.75  
5%  
Factory default setting  
4
VIN_OFF  
Programmable range, 15 different settings  
Accuracy  
4
7.5  
5%  
–5%  
ERROR AMPLIFIER AND FEEDBACK VOLTAGE  
Default setting  
Setpoint range(1)  
940.5  
0.5  
950  
959.5  
1.5  
mV  
V
VFB  
Feedback pin voltage  
VFB = 600 mV, 0°C TJ 85°C(2)  
0.6 V VFB 1.5 V(1)  
0.5 V VFB < 0.6 V(1)  
–0.5%  
–1.0%  
–1.5%  
80  
0.5%  
1.0%  
1.5%  
Feedback pin voltage  
accuracy  
VFB(ACC)  
%
AOL  
GBWP  
IFB  
Open-loop gain(1)  
Gain bandwidth product(1)  
FB pin input bias current  
Sourcing  
dB  
MHz  
nA  
15  
VFB = 0.95 V  
VFB = 0 V  
–75  
1
75  
12  
ICOMP  
mA  
Sinking  
VFB = 1.2 V  
1
VSET  
IVset  
VSET pin current  
9.5  
10.5  
950  
µA  
mV  
V
VVset  
Initial VOUT setting  
VSET disable threshold  
RVset = 34.8 kΩ  
VVset(dis)  
OSCILLATOR  
2.41  
Adjustment range(2)  
Switching frequency  
Ramp peak-to-peak(1)  
Valley voltage(1)  
200  
425  
1000  
575  
kHz  
kHz  
FSW  
RRT = 40.2 kΩ  
500  
VVDD/8.5  
0.75  
VRMP  
VVDD/9.3  
VVDD/7.6  
V
VVLY  
SYNCHRONIZATION  
VIH(sync)  
High-level input voltage  
Low-level input voltage  
2.0  
V
VIL(sync)  
0.80  
100  
Sync input minimum pulse  
width  
Tpw(sync)  
fSYNC  
ns  
Synchronization frequency  
200  
1200  
20%  
kHz  
SYNC pin frequency range  
ΔfSYNC  
-20%  
from free running frequency(1)  
RESET_B  
3.3-V and 5-V logic  
2.1  
1.2  
VIH(reset)  
High-level input voltage(1)  
Low-level input voltage  
1.8-V logic (factory default)  
3.3-V and 5-V logic  
V
0.8  
0.5  
VIL(reset)  
1.8-V logic (factory default)  
Minimum RESET_B pulse  
width  
tPW(reset)  
RVSET = 34.8 kΩ  
RVSET = 34.8 kΩ  
200  
ns  
Output voltage after reset  
triggered  
Vvout_command(reset)  
950  
mV  
(1) Specified by design. Not production tested.  
(2) The parameter covers 4.5 V to 18 V of VDD.  
Copyright © 2015, Texas Instruments Incorporated  
7
 
TPS544C25, TPS544B25  
ZHCSDR8 MAY 2015  
www.ti.com.cn  
Electrical Characteristics (continued)  
TJ = –40°C to 125°C, VVIN = VVDD= 12 V, RRT = 40.2 kΩ; zero power dissipation (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
BP6 REGULATOR  
VBP6  
Regulator output voltage  
Regulator dropout voltage  
IBP6 = 10 mA  
5.85  
50  
6.4  
6.9  
V
VBP6(do)  
VVIN – VBP6, VVDD = 4.5 V, IBP6 = 25 mA  
VVDD = 12 V  
200  
400  
mV  
Regulator short-circuit  
current(1)  
Regulator UVLO voltage(1)  
IBP6SC  
150  
3.73  
320  
mA  
V
VBP6UV  
Regulator UVLO voltage  
hysteresis(1)  
VBP6UV(hyst)  
mV  
BOOTSTRAP  
VBOOT(drop)  
Bootstrap voltage drop  
IBOOT = 5 mA  
125  
3.4  
mV  
BP3 REGULATOR  
VBP3  
3-V regulator output voltage  
VVDD 4.5 V, IBP3 = 5 mA  
3.0  
3.2  
35  
V
3-V regulator short-circuit  
current(1)  
IBP3SC  
mA  
PWM  
Minimum controllable pulse  
width(1)  
tON(min)  
100  
ns  
SOFT-START  
Factory default setting  
5
100  
0
ms  
%
Programmable range, 16 discrete  
settings(1)(3)  
TON_RISE  
Soft-start time  
0
100  
10  
Accuracy, TON_RISE = 1 ms  
Factory default setting  
-10  
ms  
TON_MAX_FAULT_ Upper limit on the time to  
Programmable range, 16 discrete  
settings(1)(4)  
Accuracy(1)  
0
100  
10  
LIMIT  
power up the output  
–10  
%
ms  
%
Factory default setting  
Programmable range, 16 discrete settings(1)  
Accuracy(1)  
TON_DELAY  
Turn-on delay  
0
100  
10  
–10  
SOFT-STOP  
Factory default setting(5)  
0
0
ms  
Programmable range, 16 discrete  
settings(1)(5)  
TOFF_FALL  
Soft-stop time  
Turn-off delay  
0
100  
10  
Accuracy, TOFF_FALL = 1 ms  
Factory default setting  
–10  
%
ms  
%
TOFF_DELAY  
Programmable range, 16 discrete settings(1)  
Accuracy(1)  
0
100  
10  
–10  
SS PIN FOR INITIAL SOFT-START PROGRAMMING  
ISS  
SS pin current  
9.5  
10.5  
12  
µA  
V
VSS(ivlow)  
VSS(ivhigh)  
SS pin invalid low voltage  
SS pin invalid high voltage  
0.03  
2.40  
(3) The setting of TON_RISE of 0 ms means the unit to bring its output voltage to the programmed regulation value as quickly as possible,  
which results in an effective TON_RISE time of 1 ms (fastest time supported).  
(4) The setting of TON_MAX_FAULT_LIMIT and VOUT_UV_FAULT_LIMIT of 0 means disabling TON_MAX_FAULT and  
VOUT_UV_FAULT response and reporting, respectively.  
(5) The setting of TOFF_FALL of 0 ms means the unit to bring its output voltage down to 0 as quickly as possible, which results in an  
effective TOFF_FALL time of 1 ms (fastest time supported).  
8
Copyright © 2015, Texas Instruments Incorporated  
TPS544C25, TPS544B25  
www.ti.com.cn  
ZHCSDR8 MAY 2015  
Electrical Characteristics (continued)  
TJ = –40°C to 125°C, VVIN = VVDD= 12 V, RRT = 40.2 kΩ; zero power dissipation (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
REMOTE SENSE AMPLIFIER  
(VOUTS+ – VOUTS–) = 0.6 V  
–5  
–7  
5
7
Error voltage from DIFFO to  
VDIFFO(err)  
(VOUTS+ – VOUTS–) = 1.2 V  
(VOUTS+ – VOUTS–) = 3.0 V  
mV  
(VOUTS+ – VOUTS–  
)
–15  
0.995  
2
15  
ARSA  
Differential gain  
1.005  
V/V  
BWRSA  
Closed-loop bandwidth(1)  
MHz  
Maximum DIFFO output  
voltage  
VDIFFO(max)  
VBP6–0.2  
V
DIFFO sourcing current  
DIFFO sinking current  
1
1
IDIFFO  
mA  
POWER STAGE  
High-side power device on-  
resistance  
RHS  
V
VDD 12 V, TJ = 25°C  
5.5  
2.0  
mΩ  
Low-side power device on-  
resistance  
VVDD 12 V, (BOOT - SW) = 6.5 V, TJ  
=
RLS  
25°C  
CURRENT SENSE AMPLIFIER  
Minimum LDRV pulse width  
tLS(minCS)  
for valid overcurrent and  
current mornitoring(1)  
400  
ns  
LOW-SIDE CURRENT LIMIT PROTECTION  
Off time between restart  
7 ×  
TON_RISE  
tOFF(OC)  
ms  
attempts(1)  
Factory default setting  
Programmable range  
Factory default setting  
Programmable range  
Factory default setting  
Programmable range  
Factory default setting  
Programmable range  
36  
24  
34  
22  
TPS544C25  
TPS544B25  
TPS544C25  
TPS544B25  
5
5
4
40  
36  
IOUT_OC_FAULT_ Output current overcurrent  
LIMIT  
fault threshold  
A
39.5  
IOUT_OC_WARN_  
LIMIT  
Output current overcurrent  
warning threshold  
4
35.5  
Output current overcurrent  
fault accuracy  
I
OUT 20 A  
–10%  
+10%  
IOC(acc)  
Output current overcurrent  
warning accuracy  
I
OUT 20 A(1)  
–10%  
+10%  
HIGH-SIDE SHORT CIRCUIT PROTECTION  
High-side short-circuit  
protection peak current  
threshold  
TPS544C25  
TPS544B25  
40  
33  
75  
66  
IHSOC  
A
POWER GOOD (PGOOD) AND OVERVOLTAGE/UNDERVOLTAGE WARNING  
PGOOD and over/under  
VPG(hyst)  
votlage warning threshold  
hysteresis at DIFFO pin  
VOUT_SCALE_LOOP = 1.0  
15  
30  
75  
mV  
RPGOOD  
PGOOD pull-down resistance VDIFFO = 0 V, IPGOOD = 5 mA  
PGOOD pin leakage current VPGOOD = 5 V  
45  
60  
15  
Ω
IPGOOD(lk)  
µA  
VOUT_SCALE_LOOP = 1.0, factory default  
setting  
1165  
527  
600  
350  
1201  
1237  
1797  
650  
VOUT_OV_WARN_ Overvoltage warning threshold  
LIMIT at DIFFO pin  
VOUT_SCALE_LOOP = 1.0, programmable  
range(1)  
VOUT_SCALE_LOOP = 1.0, factory default  
setting  
631  
mV  
VOUT_UV_WARN_ Undervoltage warning  
LIMIT  
threshold at DIFFO pin  
VOUT_SCALE_LOOP = 1.0, programmable  
range(1)  
1428  
Over/under votlage warning  
VUVOV(warnhyst)  
threshold hysteresis at DIFFO VOUT_SCALE_LOOP = 1.0(1)  
pin  
15  
75  
Copyright © 2015, Texas Instruments Incorporated  
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TPS544C25, TPS544B25  
ZHCSDR8 MAY 2015  
www.ti.com.cn  
Electrical Characteristics (continued)  
TJ = –40°C to 125°C, VVIN = VVDD= 12 V, RRT = 40.2 kΩ; zero power dissipation (unless otherwise noted)  
PARAMETER  
OUTPUT OVERVOLTAGE AND UNDERVOLTAGE FAULT PROTECTION  
VOUT_SCALE_LOOP = 1.0, factory default  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
1243  
529  
550  
346  
1281  
1330  
1799  
610  
setting  
VOUT_OV_FAULT_ Overvoltage fault threshold at  
LIMIT DIFFO pin  
VOUT_SCALE_LOOP = 1.0, programmable  
range(1)  
VOUT_SCALE_LOOP = 1.0, factory default  
setting  
594  
mV  
VOUT_UV_FAULT_ Undervoltage fault threshold at  
LIMIT  
DIFFO pin  
VOUT_SCALE_LOOP = 1.0, programmable  
range(1)(4)  
1426  
Over/under votlage fault  
VUVOV(flthyst)  
threshold hysteresis at DIFFO VOUT_SCALE_LOOP = 1.0(1)  
pin  
15  
75  
OUTPUT VOLTAGE TRIMMING  
Factory default setting  
1.0  
VOUT_  
TRANSITION_  
RATE  
mV/µs  
Output voltage transition rate  
Programmable range, 8 discrete settings  
Accuracy  
0.067  
–10%  
1.5  
10%  
Factory default setting  
1
VOUT_SCALE_  
LOOP  
Feedback loop scaling factor  
Programmable range, 3 discrete settings  
Factor default setting  
0.25  
1
486  
VOUT_SCALE_LOOP = 1.0, programmable  
range(1)  
256  
512  
768  
1536  
3072  
Output voltage programmable  
register value, multiply by 2-9  
to get output voltage  
VOUT_COMMAND  
VOUT_SCALE_LOOP = 0.5, programmable  
range(1)  
VOUT_SCALE_LOOP = 0.25, programmable  
range(1)  
1024  
TEMPERATURE SENSE AND THERMAL SHUTDOWN  
Junction thermal shutdown  
TSD  
135  
15  
0
145  
20  
155  
25  
temperature(1)  
°C  
V
Junction thermal shutdown  
THYST  
hysteresis(1)  
Voltage range on TSNS/SS  
VTSNS  
1.00  
pin(1)  
Factory default setting  
Programmable range  
Factory default setting  
Programmable range  
125  
100  
External overtemperature fault  
OT_FAULT_LIMIT  
limit(1)  
120  
165  
External overtemperature  
OT_WARN_LIMIT  
°C  
warning limit(1)  
100  
15  
140  
25  
External overtemperature  
TOT(hys)  
20  
fault, warning hysteresis(1)  
MEASUREMENT SYSTEM  
Output voltage measurement  
range  
MVOUT(rng)  
0.5  
5.8  
V
Output voltage measurement  
MVOUT(acc)  
accuracy  
–2.0%  
2.0%  
Output voltage measurement  
MVOUT(lsb)  
1.953  
mV  
A
bit resolution(1)  
Output current measurement  
range  
MIOUT(rng)  
0
40  
I
OUT 20 A  
–15%  
–3  
15%  
3
Output current measurement  
accuracy  
MIOUT(acc)  
3 A IOUT < 20 A(1)  
A
Output current measurement  
bit resolution(1)  
MIOUT(lsb)  
MTSNS(rng)  
MTSNS(acc)  
MTSNS(lsb)  
62.5  
mA  
External temperature sense  
range(1)  
–40  
–5  
165  
5
External temperature sense  
accuracy(1)  
-40°C TJ(sensor) 165°C  
°C  
External temperature sense bit  
resolution(1)  
1
10  
Copyright © 2015, Texas Instruments Incorporated  
TPS544C25, TPS544B25  
www.ti.com.cn  
ZHCSDR8 MAY 2015  
Electrical Characteristics (continued)  
TJ = –40°C to 125°C, VVIN = VVDD= 12 V, RRT = 40.2 kΩ; zero power dissipation (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
PMBus INTERFACE ADDRESSING  
IADD  
Address pin bias current  
9.5  
10.5  
12  
µA  
V
VADD(ivlow)  
Address pin illegal low voltage  
0.05  
Address pin illegal high  
voltage  
VADD(ivhigh)  
2.40  
PMBus™ INTERFACE  
3.3-V/5-V logic  
2.1  
1.2  
Input high voltage, CLK,  
DATA, CNTL  
VIH  
V
1.8-V logic (factory default)  
3.3-V/5-V logic  
0.8  
0.5  
Input low voltage, CLK, DATA,  
CNTL  
VIL  
V
1.8-V logic (factory default)  
Input high level current, CLK,  
DATA  
IIH  
-10  
10  
µA  
Input low level current, CLK,  
DATA  
IIL  
-10  
5
10  
10  
µA  
µA  
V
ICNTL  
VOL  
CNTL pin pull-up current  
Output low level voltage,  
DATA, SMBALERT  
VDD > 4.5 V, input current to DATA,  
SMBALERT = 4mA  
0.4  
Output high level open drain  
leakage current, DATA,  
SMBALERT  
IOH  
Voltage on DATA, SMBALERT = 5.5V  
-10  
10  
µA  
Output low level open drain  
leakage current, DATA,  
SMBALERT  
IOL  
Voltage on DATA, SMBALERT = 0.4V  
Slave mode  
4.0  
10  
mA  
PMBus operating frequency  
range  
IPMB  
400  
kHz  
Copyright © 2015, Texas Instruments Incorporated  
11  
TPS544C25, TPS544B25  
ZHCSDR8 MAY 2015  
www.ti.com.cn  
7.6 Typical Characteristics  
VIN = VDD = 12 V, TA = 25 ºC, RRT = 40.2 kΩ (unless otherwise specified). Safe operating area curves were measured using a  
Texas Instruments Evaluation Module.  
100  
95  
90  
85  
80  
75  
70  
65  
60  
100  
95  
90  
85  
80  
75  
70  
65  
60  
VOUT = 0.5 V  
VOUT = 1.0 V  
VOUT = 1.5 V  
VOUT = 2.5 V  
VOUT = 3.3 V  
VOUT = 0.5 V  
VOUT = 1.0 V  
VOUT = 1.5 V  
VOUT = 2.5 V  
0
2
4
6
8
10 12 14 16 18 20 22 24 26 28 30 32  
Load Current (A)  
0
2
4
6
8
10 12 14 16 18 20 22 24 26 28 30 32  
Load Current (A)  
D001  
D001  
VIN = 5 V  
fSW = 500 kHz  
L = 470 nH  
No Snubber  
VIN = 12 V  
fSW = 500 kHz  
L = 470 nH  
No Snubber  
RDCR = 0.3 mΩ  
RBOOT = 0 Ω  
RDCR = 0.3 mΩ  
RBOOT = 0 Ω  
Figure 1. Efficiency vs. Output Current  
Figure 2. Efficiency vs. Output Current  
3
2.8  
2.6  
2.4  
2.2  
2
8.5  
8
VDD = 4.5 V  
VDD = 12 V  
VDD = 18 V  
VDD = 4.5 V  
VDD = 12 V  
VDD = 18 V  
7.5  
7
6.5  
6
5.5  
5
1.8  
1.6  
4.5  
4
-40 -25 -10  
5
20 35 50 65 80 95 110 125  
-40 -25 -10  
5
20 35 50 65 80 95 110 125  
Junction Temperature (èC)  
Junction Temperature (èC)  
D001  
D001  
Figure 3. Low-Side MOSFET On-Resistance (RDS(on)  
)
Figure 4. High-Side MOSFET On-Resistance (RDS(on)  
)
vs. Junction Temperature  
vs. Junction Temperature  
601  
952  
951.5  
951  
600.5  
600  
950.5  
950  
599.5  
599  
949.5  
949  
948.5  
948  
598.5  
598  
947.5  
947  
VDD = 4.5 V  
VDD = 12 V  
VDD = 18 V  
VDD = 4.5 V  
VDD = 12 V  
VDD = 18 V  
597.5  
597  
946.5  
946  
-40 -25 -10  
5
20 35 50 65 80 95 110 125  
-40 -25 -10  
5
20 35 50 65 80 95 110 125  
Junction Temperature (èC)  
Junction Temperature (èC)  
D001  
D001  
VFB = 600 mV  
VFB = 950 mV  
Figure 5. Feedback Voltage vs. Junction Temperature  
Figure 6. Feedback Voltage vs. Junction Temperature  
12  
Copyright © 2015, Texas Instruments Incorporated  
TPS544C25, TPS544B25  
www.ti.com.cn  
ZHCSDR8 MAY 2015  
Typical Characteristics (continued)  
VIN = VDD = 12 V, TA = 25 ºC, RRT = 40.2 kΩ (unless otherwise specified). Safe operating area curves were measured using a  
Texas Instruments Evaluation Module.  
12  
11.5  
11  
1.01  
1.0075  
1.005  
1.0025  
1
10.5  
10  
9.5  
9
0.9975  
0.995  
0.9925  
0.99  
8.5  
8
7.5  
7
-40 -25 -10  
5
20 35 50 65 80 95 110 125  
-40 -25 -10  
5
20 35 50 65 80 95 110 125  
Junction Temperature (èC)  
Junction Temperature (èC)  
D001  
D001  
Figure 7. Normalized Switching Frequency  
vs. Junction Temperature  
Figure 8. Non-Switching Input Current (IVDD  
)
vs. Junction Temperature  
6.9  
6.8  
6.7  
6.6  
6.5  
6.4  
6.3  
6.2  
6.1  
6
3.4  
3.35  
3.3  
3.25  
3.2  
3.15  
3.1  
3.05  
3
5.9  
-40 -25 -10  
5
20 35 50 65 80 95 110 125  
-40 -25 -10  
5
20 35 50 65 80 95 110 125  
Junction Temperature (èC)  
Junction Temperature (èC)  
D001  
D001  
IBP6 = 10 mA  
VVIN = VVDD= 12 V  
IBP3 = 5 mA  
VVIN = VVDD= 12 V  
Figure 9. BP6 Voltage vs. Junction Temperature  
Figure 10. BP3 Voltage vs. Junction Temperature  
4.6  
4.55  
4.5  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
4.45  
4.4  
4.35  
4.3  
-40  
-20  
0
20  
40  
60  
80  
100 120 140  
-40 -25 -10  
5
20 35 50 65 80 95 110 125  
Junction Temperature (èC)  
Junction Temperature (èC)  
D001  
D001  
VIN_ON = 4.5 V  
Figure 11. PGOOD Pull-Down Resistance  
vs. Junction Temperature  
Figure 12. Turn-On Voltage vs. Junction Temperature  
Copyright © 2015, Texas Instruments Incorporated  
13  
TPS544C25, TPS544B25  
ZHCSDR8 MAY 2015  
www.ti.com.cn  
Typical Characteristics (continued)  
VIN = VDD = 12 V, TA = 25 ºC, RRT = 40.2 kΩ (unless otherwise specified). Safe operating area curves were measured using a  
Texas Instruments Evaluation Module.  
4.2  
4.15  
4.1  
2
1.5  
1
4.05  
4
0.5  
0
3.95  
3.9  
-0.5  
-1  
3.85  
3.8  
-1.5  
-2  
-40 -25 -10  
5
20 35 50 65 80 95 110 125  
-40  
-20  
0
20  
40  
60  
80  
100 120 140  
Junction Temperature (èC)  
Junction Temperature (èC)  
D001  
D001  
VIN_OFF = 4.0 V  
IOUT = 20 A  
VVIN = VVDD= 12 V  
Figure 13. Turn-Off Voltage vs. Junction Temperature  
Figure 14. READ_IOUT Accuracy vs. Junction Temperature  
0.25  
70  
60  
50  
40  
30  
20  
0
-0.25  
-0.5  
-0.75  
-1  
10  
TPS544C25  
TPS544B25  
0
-40  
-20  
0
20  
40  
60  
80  
100 120 140  
-40 -25 -10  
5
20 35 50 65 80 95 110 125  
Junction Temperature (èC)  
Junction Temperature (èC)  
D001  
D001  
VVIN = VVDD= 12 V  
BOOT - SW = 6.5 V  
VVIN = VVDD= 12 V  
Figure 15. READ_VOUT Accuracy vs. Junction Temperature  
Figure 16. High-Side Overcurrent Protection  
vs. Junction Temperature  
4
3.5  
3
2.5  
2
1.5  
1
0.5  
0
-0.5  
-1  
-1.5  
-2  
-2.5  
-3  
40  
35  
30  
25  
20  
15  
10  
5
TPS544C25  
TPS544B25  
-3.5  
-4  
-40 -25 -10  
0
5
20 35 50 65 80 95 110 125  
-40 -25 -10  
5
20 35 50 65 80 95 110 125  
JunctionTemperature (°C)  
Junction Temperature (èC)  
D001  
D001  
OCF = 20 A  
VVIN = VVDD= 12 V  
VVIN = VVDD= 12 V  
OCF = 36 A  
OCF = 24 A  
(TPS544C25)  
(TPS544B25)  
Figure 17. Overcurrent Fault Protection (OCF) Accuracy  
vs. Junction Temperature  
Figure 18. Overcurrent Fault Protection (OCF)  
vs. Junction Temperature  
14  
Copyright © 2015, Texas Instruments Incorporated  
TPS544C25, TPS544B25  
www.ti.com.cn  
ZHCSDR8 MAY 2015  
Typical Characteristics (continued)  
VIN = VDD = 12 V, TA = 25 ºC, RRT = 40.2 kΩ (unless otherwise specified). Safe operating area curves were measured using a  
Texas Instruments Evaluation Module.  
120  
100  
80  
60  
40  
20  
0
120  
100  
80  
60  
40  
20  
0
400 LFM  
200 LFM  
100 LFM  
Natural convection  
400 LFM  
200 LFM  
100 LFM  
Natural convection  
0
0
0
2
4
6
8
10 12 14 16 18 20 22 24 26 28 30 32  
Output Current (A)  
0
0
0
2
4
6
8
10 12 14 16 18 20 22 24 26 28 30 32  
Output Current (A)  
D001  
D001  
VIN = 5 V  
VOUT = 1.0 V  
fSW = 1 MHz  
VIN = 5 V  
VOUT = 1.0 V  
fSW = 300 kHz  
Figure 19. Safe Operating Area  
Figure 20. Safe Operating Area  
120  
100  
80  
60  
40  
20  
0
120  
100  
80  
60  
40  
20  
0
400 LFM  
200 LFM  
100 LFM  
Natural convection  
400 LFM  
200 LFM  
100 LFM  
Natural convection  
2
4
6
8
10 12 14 16 18 20 22 24 26 28 30 32  
2
4
6
8 10 12 14 16 18 20 22 24 26 28 30 32  
Output Current (A)  
Output Current (A)  
D001  
D001  
VIN = 5 V  
VOUT = 1.0 V  
fSW = 500 kHz  
VIN = 5 V  
VOUT = 1.5 V  
fSW = 300 kHz  
Figure 21. Safe Operating Area  
Figure 22. Safe Operating Area  
120  
100  
80  
60  
40  
20  
0
120  
100  
80  
60  
40  
20  
0
400 LFM  
200 LFM  
100 LFM  
Natural convection  
400 LFM  
200 LFM  
100 LFM  
Natural convection  
2
4
6
8 10 12 14 16 18 20 22 24 26 28 30 32  
2
4
6
8
10 12 14 16 18 20 22 24 26 28  
Output Current (A)  
Output Current (A)  
D001  
D001  
VIN = 5 V  
VOUT = 1.5 V  
fSW = 500 kHz  
VIN = 5 V  
VOUT = 3.3 V  
fSW = 300 kHz  
Figure 23. Safe Operating Area  
Figure 24. Safe Operating Area  
Copyright © 2015, Texas Instruments Incorporated  
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TPS544C25, TPS544B25  
ZHCSDR8 MAY 2015  
www.ti.com.cn  
Typical Characteristics (continued)  
VIN = VDD = 12 V, TA = 25 ºC, RRT = 40.2 kΩ (unless otherwise specified). Safe operating area curves were measured using a  
Texas Instruments Evaluation Module.  
120  
100  
80  
60  
40  
20  
0
120  
100  
80  
60  
40  
20  
0
400 LFM  
200 LFM  
100 LFM  
Natural convection  
400 LFM  
200 LFM  
100 LFM  
Natural convection  
0
2
4
6
8
10 12 14 16 18 20 22 24 26 28  
Output Current (A)  
0
2
4
6
8
10 12 14 16 18 20 22 24 26 28 30 32  
Output Current (A)  
D001  
D001  
VIN = 5 V  
VOUT = 3.3 V  
fSW = 500 kHz  
VIN = 12 V  
VOUT = 1.0 V  
fSW = 300 kHz  
Figure 25. Safe Operating Area  
Figure 26. Safe Operating Area  
120  
100  
80  
60  
40  
20  
0
120  
100  
80  
60  
40  
20  
0
400 LFM  
200 LFM  
100 LFM  
Natural convection  
400 LFM  
200 LFM  
100 LFM  
Natural convection  
0
2
4
6
8
10 12 14 16 18 20 22 24 26 28 30 32  
0
2
4
6
8 10 12 14 16 18 20 22 24 26 28 30 32  
Output Current (A)  
Output Current (A)  
D001  
D001  
VIN = 12 V  
VOUT = 1.0 V  
fSW = 500 kHz  
VIN = 12 V  
VOUT = 1.5 V  
fSW = 300 kHz  
Figure 27. Safe Operating Area  
Figure 28. Safe Operating Area  
120  
100  
80  
60  
40  
20  
0
120  
100  
80  
60  
40  
20  
0
400 LFM  
200 LFM  
100 LFM  
Natural convection  
400 LFM  
200 LFM  
100 LFM  
Natural convection  
0
2
4
6
8 10 12 14 16 18 20 22 24 26 28 30 32  
0
2
4
6
8 10 12 14 16 18 20 22 24 26 28 30 32  
Output Current (A)  
Output Current (A)  
D001  
D001  
VIN = 12 V  
VOUT = 3.3 V  
fSW = 300 kHz  
VIN = 12 V  
VOUT = 1.5 V  
fSW = 500 kHz  
Figure 30. Safe Operating Area  
Figure 29. Safe Operating Area  
16  
Copyright © 2015, Texas Instruments Incorporated  
TPS544C25, TPS544B25  
www.ti.com.cn  
ZHCSDR8 MAY 2015  
Typical Characteristics (continued)  
VIN = VDD = 12 V, TA = 25 ºC, RRT = 40.2 kΩ (unless otherwise specified). Safe operating area curves were measured using a  
Texas Instruments Evaluation Module.  
120  
100  
80  
60  
40  
400 LFM  
200 LFM  
100 LFM  
Natural convection  
20  
0
0
2
4
6
8
10 12 14 16 18 20 22 24 26 28 30 32  
Output Current (A)  
D001  
VIN = 12 V  
VOUT = 3.3 V  
fSW = 500 kHz  
Figure 31. Safe Operating Area  
Copyright © 2015, Texas Instruments Incorporated  
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TPS544C25, TPS544B25  
ZHCSDR8 MAY 2015  
www.ti.com.cn  
8 Detailed Description  
8.1 Overview  
The TPS544x25 devices are PMBus 1.2 compliant 20-A and 30-A, high-performance, synchronous buck  
converters with two integrated N-channel NexFET™ power MOSFETs, enabling high power density and minimal  
PCB area. These devices implement the industry standard fixed switching frequency, voltage-mode control with  
input feed-forward topology that responds instantly to input voltage change. These devices can be synchronized  
to the external clock to eliminate beat noise and reduce EMI/EMC. The integrated PMBus interface capability  
provides precise current, voltage and on-board temperature monitoring, as well as many user-programmable  
configuration options including Adaptive Voltage Scaling (AVS) through standard VOUT_COMMAND.  
8.2 Functional Block Diagram  
VDD  
BP6  
BP3  
BOOT  
VIN  
SW  
Linear  
Regulators  
HSFET  
LSFET  
Driver  
Control  
Anti-Cross-  
Conduction  
BP6  
RT  
Pre-Bias  
Oscillator  
SYNC/RESET_B  
Ramp  
PWM  
GND  
CLK  
S
R
Q
Q
OC Event  
Average IOUT  
RESET_VOUT  
+
Current  
Sense,  
OC Detection  
COMP  
FB  
Error Amplifier  
Fault  
VREF for  
Soft-Start and  
+
DATA  
OC Threshold  
Reference  
DAC  
VOUT_COMMAND  
SMBALERT  
CNTL  
PMBus Engine  
VSET  
ADC, PMBus Commands,  
IC Interface, EEPROM  
VOUT Sense  
OV/UV Detection  
ADDR0  
ADDR1  
PGOOD  
PGND  
DIFFO  
AGND  
750 kW  
Temperature  
Sensing  
VOUTS+  
VOUTSœ TSNS/SS  
18  
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ZHCSDR8 MAY 2015  
8.3 Feature Description  
8.3.1 Linear Regulators BP3 and BP6  
The TPS544x25 devices have two on-board linear regulators to provide suitable power for the internal circuitry of  
the device. Externally bypass pins BP3 and BP6 for the converter to function properly. BP3 requires a minimum  
of 2.2 µF of capacitance connected to AGND. BP6 requires a minimum 2.2 µF of capacitance connected to  
GND. TI recommends using a 4.7-µF capacitor and an additional 100-nF to reduce the ripple on the BP6 pin.  
NOTE  
Place bypass capacitors as close as possible to the device pins, with a minimum return  
loop back to ground and the return loop should be kept away from fast switching voltage  
and main current path. Refer to Layout for details. Poor bypassing can degrade the  
performance of the regulator.  
The use of the internal regulators to power other circuits are not recommended because the loads placed on the  
regulators might adversely affect operation of the controller.  
8.3.2 Input Undervoltage Lockout (UVLO)  
The TPS544x25 devices provide flexible user adjustment of the undervoltage lockout threshold and hysteresis.  
Two PMBus commands, VIN_ON (35h) and VIN_OFF (36h) allow the user to set these input voltage turn-on and  
turn-off thresholds independently, with a minimum of 4-V turn-off to a maximum 7.75-V turn-on. See the  
command descriptions for more details.  
8.3.3 Turn-On and Turn-Off Delay and Sequencing  
The TPS544x25 devices provide many sequencing options. Using the ON_OFF_CONFIG command, the device  
can be configured to start up whenever the input voltage is above the undervoltage lockout (UVLO) threshold, or  
to additionally require a signal on the CNTL pin and/or receive an update to the OPERATION command via the  
PMBus interface . When the gating signal as specified by ON_OFF_CONFIG is asserted, a programmable turn-  
on delay can be set with TON_DELAY to delay the start of regulation. Similarly, a programmable turn-off delay  
can be set with TOFF_DELAY to delay the stop of regulation once the gating signal is de-asserted. Delay times  
are specified in ms, from 0 to 100 ms.  
Figure 32 shows control of the start-up and shutdown operations of the device, when the device is configured to  
respond to both CNTL and the OPERATION command. The device can also be configured to use either the  
CNTL signal, or the OPERATION command independently, or convert power whenever sufficient input voltage is  
present.  
TON_DELAY  
TOFF_DELAY  
TON_RISE  
TOFF_FALL  
VIN  
OFF  
ON  
OFF  
OPERATION[7]  
CNTL  
V
OUT  
Time  
Figure 32. Turn-On Controlled By Both Operation(1) and Control  
(1)  
8.3.4 Voltage Reference  
A reference DAC (digital-to-analog converter) with 500 mV to 1500 mV range and 2-9 V (1.953 mV) resolution  
connects to the non-inverting input of the error amplifier. The tight tolerance on the reference voltage allows the  
user to design power supply with very high DC accuracy.  
(1) Bit 7 of OPERATION is used to control power conversion.  
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Feature Description (continued)  
8.3.5 Differential Remote Sense  
The TPS544x25 devices implement a differential remote sense amplifier to provide excellent load regulation by  
cancelling IR-drop in high current applications. The VOUTS+ and VOUTS– pins should be kelvin-connected to  
the output capacitor bank directly at the load, and routed back to the device as a tightly coupled differential pair.  
Ensure that these traces are isolated from fast switching signals and high current paths on the final PCB layout,  
as these can add differential-mode noise. Optionally, use a small coupling capacitor (1-nF typical) between the  
VOUTS+ and VOUTS– pins to improve noise immunity. The output of the differential remote sense amplifier  
(DIFFO) is used for output voltage setting and error amplifier frequency compensation local to the device as  
shown in Figure 33.  
Additionally, the voltage at the DIFFO pin is digitized, averaged to reduce measurement noise and continually  
stored in the READ_VOUT register, enabling output voltage telemetry.  
R2  
C1  
VOUTS+  
DIFFO  
FB  
R1  
+
VOUTSt  
COMP  
R3  
C2  
+
C3  
VREF  
To PWM  
RBIAS  
Figure 33. Output Voltage Setting  
8.3.6 Set Output Voltage and Adapative Voltage Scaling (AVS)  
A voltage divider from the DIFFO pin to the FB pin is typically required to set the nominal output voltage like the  
one formed by R1 and RBIAS resistors shown in Figure 33. To allow PMBus devices to map between the  
commanded voltage and the voltage at the control circuit input (VOUT divided down to match a reference voltage),  
the device uses the VOUT_SCALE_LOOP command.  
VREF = VOUT_COMMAND × VOUT_MODE × VOUT_SCALE_LOOP (V)  
where  
VOUT_SCALE_LOOP = RBIAS/(RBIAS+R1) (as shown in Figure 33)  
(1)  
(2)  
VOUT = VOUT_COMMAND × VOUT_MODE = VOUT_COMMAND × 2-9 V.  
The output voltage can be set and adjusted dynamically using the VOUT_COMMAND through the PMBus  
interface. See the PMBus command description for full details on the implementation.  
NOTE  
The VOUT_SCALE_LOOP is limited to only 3 possible options: 1 (default, no bottom  
resistor required for the divider), 0.5, and 0.25.  
When VOUT_SCALE_LOOP = 1 (default), no bottom resistor RBIAS is needed. The  
reference voltage is equal to the output voltage, which allows tighter system DC  
accuracy by removing the resistor divider tolerance.  
It is required that the user make sure the divider ratio RBIAS /( RBIAS +R1) matches the  
programed VOUT_SCALE_LOOP and the user should program VOUT_SCALE_LOOP  
prior to any other VOUT related commands in order for the proper range checking to  
work and to avoid Invalid Data and output overvoltage and undervoltage scenarios.  
20  
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Feature Description (continued)  
The range of valid VOUT_COMMAND values is dependent upon the configured VOUT_SCALE_LOOP as shows  
in Table 1.  
Table 1. FB Resistor Divider Ratio and VOUT_COMMAND Data Valid Range  
OUTPUT VOLTAGE  
RANGE (V)  
VOUT_COMMAND  
DATA VALID RANGE  
RESISTOR DIVIDER  
RBIAS: R1 (IN  
VOUT_SCALE_LOOP  
Figure 33)  
MIN  
0.5  
1
MAX  
MIN  
256  
MAX  
1
Unnecessary  
1.5  
3
768  
1536  
3072  
0.5  
1:1  
1:3  
512  
0.25  
2
6
1024  
There are several commands that are used in commanding the output voltage of a device with a PMBus  
interface. These include:  
VOUT_MODE  
VOUT_COMMAND  
VOUT_MAX  
MFR_VOUT_MIN  
VOUT_SCALE_LOOP  
VOUT_OV_FAULT_LIMIT  
VOUT_OV_WARN_LIMIT  
VOUT_UV_WARN_LIMIT  
VOUT_UV_FAULT_LIMIT  
Figure 34 shows how the output voltage related commands are applied. The TPS544x25 devices implement  
relational check to make sure the VOUT_COMMAND is not programmed to exceed the VOUT_MAX,  
MFR_VOUT_MIN, VOUT_OV_WARN_LIMIT , and VOUT_UV_WARN_LIMIT. The VOUT_OV_WARN_LIMIT  
should also be smaller than VOUT_OV_FAULT_LIMIT and the VOUT_UV_WARN_LIMIT should be greater than  
VOUT_UV_FAULT_LIMIT. Violation of these relational check rules will set corresponding status bits and trigger  
SMBALERT. See the PMBus command description for full details.  
In order for the relational checking to operate properly and to avoid error flagging, the VOUT_SCALE_LOOP  
should be changed first, if needed. Any changes to other registers should be made such that the values in all the  
registers conform to the limits for the current VOUT_SCALE_LOOP setting.  
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Slew Rate Control for  
Margining and AVS  
Range 0.067 to 1 mV/us  
8 Discrete Settings  
Range: 1 ms to 100 ms Range: 1 ms to 100 ms  
TOFF_FALL  
Digital Controlled Fall  
TON_RISE  
Digital Soft Start  
VOUT_TRANS_RATE  
Resistor divider may  
or may not be used  
on FB  
FB  
Range: 0 ms to 100 ms for both  
16 discrete settings  
VREF Range:  
0 V to 1.5 V for  
2-mV resolution  
Slew  
Rate  
Decode  
TON_DELAY  
TOFF_DELAY  
Default: 0.95 V.  
EEPROM backup.  
Default overridden  
by RSET resistor.  
on VREF  
Pull up to BP3  
when not used.  
VSET  
Step Control  
+
Range  
Limit  
COMP  
DAC  
+
ADC  
VOUT_COMMAND  
VREF  
Relational Check  
VOUT_COMMAND with:  
RSET  
VOUT_MAX  
Default: 1.5 V  
Default: 0.5 V  
VOUT_SCALE_LOOP  
MFR_VOUT_MIN  
Possible values:  
0.25, 0.5, 1.0  
Default: 1.0  
VOUT_OV_WARN_LIMIT  
VOUT_UV_WARN_LIMIT  
Default: 1.201 V  
Default: 0.631 V  
Figure 34. Conceptual View Of How Output Voltage Related Commands Are Applied  
8.3.6.1 Increasing the Output Voltage  
The order below is optimum for programming the output voltage upwards (not all commands may be necessary).  
(40h) VOUT_OV_FAULT_LIMIT  
(42h) VOUT_OV_WARN_LIMIT  
(24h) VOUT_MAX (ordering with respect to VOUT_OV_FAULT_LIMIT and VOUT_OV_WARN_LIMIT is  
irrelevant. Just set VOUT_MAX prior to VOUT_COMMAND)  
(21h) VOUT_COMMAND  
(A4h) MFR_VOUT_MIN (ordering with respect to VOUT_UV_FAULT_LIMIT and VOUT_UV_WARN_LIMIT is  
irrelevant. Just set MFR_VOUT_MIN after VOUT_COMMAND)  
(43h) VOUT_UV_WARN_LIMIT  
(44h) VOUT_UV_FAULT_LIMIT  
8.3.6.2 Decreasing the Output Voltage  
The order below is optimum for programming the output voltage downwards (not all commands may be  
necessary).  
(44h) VOUT_UV_FAULT_LIMIT  
(43h) VOUT_UV_WARN_LIMIT  
(A4h) MFR_VOUT_MIN (ordering with respect to VOUT_UV_FAULT_LIMIT and VOUT_UV_WARN_LIMIT is  
irrelevant. Just set MFR_VOUT_MIN prior to VOUT_COMMAND)  
(21h) VOUT_COMMAND  
(24h) VOUT_MAX (ordering with respect to VOUT_OV_FAULT_LIMIT and VOUT_OV_WARN_LIMIT is  
irrelevant. Just set VOUT_MAX after VOUT_COMMAND)  
(42h) VOUT_OV_WARN_LIMIT  
(40h) VOUT_OV_FAULT_LIMIT  
22  
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8.3.6.3 Set Default Output Voltage by VSET  
In order to power up the converter to a default VOUT_COMMAND rather than that stored in EEPROM without  
reprogramming, the initial boot-up output voltage can also be set by the resistor connected from VSET pin to  
AGND. The E48 series resistors with no worse than 1% tolerance suggested for setting the output votlage are  
shown in Table 2. VOUT_SCALE_LOOP can be set only at a value of 1 (no bottom resistor is needed in the  
feedback resistor divider) if the VSET pin is used. If VSET pin is not used, pull it up to BP3. If TPS544x25  
devices re-start after losing power completely, the VOUT_COMMAND value set by external resistor overwrites  
any value stored from previous VOUT_COMMAND operation.  
Table 2. VSET Resistors for Boot-up VOUT_COMMAND Value  
BOOT-UP DEFAULT  
VOUT_COMMAND (V)  
RESISTOR VALUE  
(kΩ)  
0.95  
0.80  
0.85  
0.90  
0.95  
1.00  
1.05  
1.10  
1.20  
Short to AGND  
8.66  
15.4  
23.7  
34.8  
51.1  
78.7  
121  
187  
VOUT_COMMAND value  
stored in EEPROM  
(VSET pin pulled up to BP3)(1)  
(1) sets iv_vset bit in STATUS_MFR_SPECIFIC (80h)  
If the resistor connected from VSET pin to AGND is used to set the output voltage, the SYNC/RESET_B pin is  
configured as RESET_B pin on default. Reset the output voltage to the boot-up voltage when SYNC/RESET_B is  
logic low. See Reset VOUT for more details.  
If the VSET pin voltage higher than the VSET disable threshold (2.41 V minimum), the VSET function is disabled,  
the boot-up default VOUT_COMMAND are restored from the internal EEPROM of the TPS544x25 devices.  
When VSET is not used, the SYNC/RESET_B pin is configured as SYNC pin on default and the switching  
frequency synchronizes to the external clock applied to SYNC/RESET_B pin. In order to use both VSET and  
SYNC function, the FORCE_SYNC bit in register MISC_CONFIG_OPTIONS (MFR_SPECIFIC_32) (F0h) should  
be set to 1. The aforementioned interaction between VSET and SYNC/RESET_B pin funcationality is listed in  
Table 3. See Switching Frequency and Synchronization for more details.  
The VSET pin configuration also affects the PMBus logic threshold in the TPS544x25 devices. See OPTIONS  
(MFR_SPECIFIC_21) (E5h) for details.  
Table 3. Interaction between VSET and SYNC/RSET_B Pin Funcationality  
VSET Used(1)  
FORCE_SYNC  
SYNC/RSET_B FUNCTIONALITY  
No  
No  
0
1
0
1
SYNC  
SYNC  
Yes  
Yes  
RESET_B  
SYNC  
(1) VSET pin voltage < 2.41 V  
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8.3.7 Reset VOUT  
Without power cycling, the VOUT_COMMAND value and the corresponding output voltage can be reset to the  
default value set by VSET. To reset VOUT_COMMAND, the VSET pin should be used in combination with  
SYNC/RESET_B pin. The default VOUT_COMMAND value is set by the resistor connected between VSET and  
AGND and latched when the TPS544x25 devices are powered up from VDD. When the SYNC/RESET_B pin is  
pulled low, the digital core sets VOUT_COMMAND value back to the default value. The Figure 35 shows the  
timing diagram for resetting the output voltage. When RESET_B is asserted low, after a short delay (less than 2  
µs), the output voltage begins transitioning from its current value to the default value configured by VSET per the  
slew-rate set in VOUT_TRANSITION_RATE. The VOUT_COMMAND value is not updated to any  
VOUT_COMMAND programming while SYNC/RESET_B is held low.  
V
SYNC/RESET_B  
Pre-AVS V  
OUT  
V
OUT  
Default V  
SET .  
(B)  
(A)  
Response Delay  
Time  
(A) VOUT_COMMAND adjustment through the PMBus interface ;  
(B) Reset back to default VOUT_COMMAND value determined by VSET resistor at power up. The slew rate is  
defined by VOUT_TRANSITION_RATE.  
Figure 35. Output Voltage Reset  
8.3.8 Switching Frequency and Synchronization  
A resistor from the RT pin to AGND sets the switching frequency. Equation 3 calculates the RRT resistor value.  
ꢀ.01 × 1010  
224  
=
37  
where  
RRT is the timing resistor in Ω  
fSW is the switching frequency in Hz  
(3)  
The TPS544x25 devices are designed to operate between 200 kHz and 1 MHz.  
The TPS544x25 devices can also synchronize to an external clock which is ±20% of the free-running frequency.  
The external clock should be applied to the SYNC/RESET_B pin. A sudden change in synchronization clock  
frequency causes an associated control loop response, resulting in an overshoot or undershoot on the output  
voltage.  
If a resistor is connected from VSET pin to AGND to program the initial boot-up voltage, the clock  
synchronization function is disabled on default, the SYNC/RESET_B pin is configured to RESET function which  
can reset VOUT when SYNC/RESET_B is logic low.  
In order to use both VSET and SYNC function, the FORCE_SYNC bit in register MISC_CONFIG_OPTIONS  
(MFR_SPECIFIC_32) (F0h) should be set to 1, as shown in Table 3. While the output in regulation and an  
external clock being applied to SYNC/RESET_B pin, set the FORCE_SYNC bit on the fly causes a sudden  
change in switching frequency and results in an overshoot or undershoot on the output voltage.  
24  
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8.3.9 Soft-Start and TON_RISE Command  
To control the inrush current needed to charge the output capacitor bank during start up, the TPS544x25 devices  
implement a soft-start time. When the device is enabled, the feedback reference voltage, VREF, ramps from 0 V  
to the final level defined by VOUT_COMMAND and VOUT_SCALE_LOOP at a slew rate defined by the  
TON_RISE command. The rise times specified are defined by the slew rate needed to ramp the reference  
voltage from 0 V to its final value at each given rise time.  
The actual rise time of the converter output is slightly less than the rise time defined by TON_RISE. This  
difference occurs because switching does not occur until the error amplifier output reaches the valley of the PWM  
ramp. During soft-start, the error amplifier output voltage starts at 0 V, and must reach the valley of the PWM  
ramp, 0.75 V typical, before switching can begin. As soons as it reaches the valley of the PWM ramp, the  
converter output voltage rises quickly until the feedback voltage, VFB, reaches the reference voltage VREF, from  
which point they track through the end of the soft-start period.  
t
t
ON(rise)  
ON(delay)  
CNTL  
V
REF  
V
OUT  
COMP slews up  
to PWM ramp  
PWM Ramp  
COMP  
Time  
Figure 36. Soft-Start Timing  
The TPS544x25 devices support several soft-start times between 1 ms and 100 ms selected by the TON_RISE  
command. The value of TON_RISE can be set through the PMBus interface or alternatively by the resistor  
connected from TSNS/SS pin to AGND. To use the TSNS/SS pin for TON_RISE setting, the SS_DET_DIS bit in  
OPTIONS (MFR_SPECIFIC_21) (E5h) register should be set to 0 to enable the soft-start time detection.  
Table 4. TSNS/SS Pin Configuration  
SS_DET_DIS  
TSNS/SS FUNCTIONALITY  
0
1
SS  
TSNS  
The E48 series resistors with no worse than 1% tolerance suggested for TON_RISE setting are shown in  
Table 5. Issuing TON_RISE command after start-up overwrites the TON_RISE value set by external resistor. If  
TPS544x25 re-starts after losing power completely, the TON_RISE value set by external resistor overwrites any  
value stored from previous TON_RISE operation.  
Table 5. Soft-Start Resistors  
RESISTOR VALUE  
TON_RISE (ms)  
(kΩ)  
Short to AGND (sets iv_ss bit in  
STATUS_MFR_SPECIFIC (80h))  
5
1
2
8.25  
14.7  
22.6  
34.8  
51.1  
78.7  
3
5
7
10  
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Table 5. Soft-Start Resistors (continued)  
RESISTOR VALUE  
TON_RISE (ms)  
(kΩ)  
121  
187  
27  
52  
TSNS/SS pin pulled up to BP3 (sets iv_ss bit in  
STATUS_MFR_SPECIFIC (80h))  
5
8.3.10 Pre-Biased Output Start-Up  
The TPS544x25 devices prevent current from being discharged from the output during start-up, when a pre-  
biased output condition exists. No SW pulses occur until the internal soft-start voltage rises above the error  
amplifier input voltage (FB pin), if the output is pre-biased. As soon as the soft-start voltage exceeds the error  
amplifier input, and SW pulses start, the device limits synchronous rectification after each SW pulse with a  
narrow on-time. The low-side MOSFET on-time slowly increases on a cycle-by-cycle basis until 128 pulses have  
been generated and the synchronous rectifier runs fully complementary to the high-side MOSFET. This approach  
prevents the sinking of current from a pre-biased output, and ensures the output voltage start-up and ramp-to-  
regulation sequences are smooth and monotonic. These devices respond to a pre-biased output over-voltage  
condition immediately upon VDD powered up and BP6 regulator voltage above its own UVLO of 3.73 V typical.  
8.3.11 Soft-Stop and TOFF_FALL Command  
As shown in Figure 32, the TPS544x25 devices implement TOFF_FALL command to define the time for the  
output voltage to drop from regulation to 0. There might be negative current in the TPS544x25 devices during the  
TOFF_FALL time in order to discharge the output voltage. The setting of TOFF_FALL of 0 ms means the unit to  
bring its output voltage down to 0 as quickly as possible, which results in an effective TOFF_FALL time of 1 ms  
(fastest time supported). This feature can be disabled in ON_OFF_CONFIG for the turn-off controlled by CNTL  
pin or bit 6 of OPERATION if the regulator is turned off by OPERATION command, in that case, both high-side  
and low-side FET drivers are turned off immediately and the output voltage will be discharged by the load.  
8.3.12 Current Monitoring and Low-Side MOSFET Overcurrent Protection  
The TPS544x25 devices sense average output current using an internal sense FET. A sense FET conducts a  
scaled-down version of the power-stage current. Sampling this current in the middle of the low-side drive signal  
determines the average output current. This architecture achieves excellent current monitoring and better  
overcurrent threshold accuracy than inductor DCR current sensing with minimal temperature variation and no  
dependence on power loss in a higher DCR inductor. Use the IOUT_CAL_OFFSET command to improve current  
sensing and overcurrent accuracy by removing board layout-related systematic errors post assembly. The  
devices continually digitize the sensed output current, and average it to reduce measurement noise. The devices  
then store the current value in the read-only READ_IOUT register, enabling output current telemetry.  
26  
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VDD  
VIN  
Terminate  
PWM Pulse  
PWM  
Logic  
+
HFET  
Peak Current  
Comparator  
HDRV  
Three  
Consecutive  
Cycle  
SW  
HSOC  
LSOC  
Current Sense  
Amplifier  
Counter  
LFET  
+
OCF/OCW  
Comparators  
SenseFET  
Average  
Current  
IOUT_OC_  
FAULT_RESPONSE  
Sensing  
Hiccup/  
Latch-off  
LDRV  
OCF/OCW  
IOUT_CAL_  
OFFSET  
Thresholds  
OCW  
OCF  
READ_IOUT  
STATUS_IOUT  
SMBALERT  
PMBus Engine  
AGND  
PGND  
GND  
Figure 37. SenseFET Average Current Sensing and Overcurrent Protection  
The TPS544x25 devices also implement low-side MOSFET overcurrent protection with programmable fault and  
warning thresholds. The IOUT_OC_FAULT_LIMIT and IOUT_OC_WARN_LIMIT commands set the low-side  
overcurrent thresholds.  
As shown in Figure 37, if an overcurrent event is detected in a given switching cycle, the device increments an  
overcurrent counter. When the device detects three consecutive overcurrent (either high-side or low-side) events,  
the converter responds, flagging the appropriate status registers, triggering SMBALERT if it is not masked, and  
entering either continuous restart hiccup, or latch-off according to the IOUT_OC_FAULT_RESPONSE command.  
In continuous restart hiccup mode, the devices implement a seven soft-start cycle time-out, followed by a normal  
soft-start attempt. When the overcurrent fault clears, normal operation resumes, otherwise, the device detects  
overcurrent and the process repeats. The IOUT_OC_FAULT_RESPONSE can also be set to ignore the OC fault  
for debug purpose. The fault response scheme is summarized in Table 6.  
8.3.13 High-Side MOSFET Short-Circuit Protection  
The TPS544x25 devices also implement a fixed high-side MOSFET overcurrent (HSOC) protection to limit peak  
current, and prevent inductor saturation in the event of a short circuit. The devices detect an overcurrent event by  
sensing the voltage drop across the high-side MOSFET when it is on. If the peak current reaches the IHOSC level  
on any given cycle, the cycle terminates to prevent the current from increasing any further. High-side MOSFET  
overcurrent events are counted using the method shown in Figure 37. If the devices detect three consecutive  
overcurrent events (high-side or low-side), the converter responds, by flagging the appropriate status registers;  
triggering SMBALERT if it is not masked; and entering either continuous restart hiccup, or latch-off according to  
the IOUT_OC_FAULT_RESPONSE command. For accurate high-side MOSFET overcurrent protection, the VIN  
and VDD pins must be the same potential; split rail operation is not supported. The  
IOUT_OC_FAULT_RESPONSE can also be set to ignore the OC fault for debug purpose. When the  
IOUT_OC_FAULT_RESPONSE is set to ignore, the device continues to have cycle-by-cycle HSOC protection.  
The fault response scheme is summarized in Table 6.  
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8.3.14 Over-Temperature Protection  
An internal temperature sensor protects theTPS544x25 devices from thermal runaway. The internal thermal  
shutdown threshold, TSD, is fixed at 145°C typical. When the devices sense a temperature above TSD, an over-  
temperature fault internal (OTFI) bit in STATUS_MFR_SPECIFIC is flagged, and power conversion stops until  
the sensed junction temperature falls by the thermal shutdown hysteresis amount, THYST, (20°C typical). The  
SMBALERT will be triggered if it is not masked.  
The TPS544x25 devices also provide programmable external over-temperature fault and warning thresholds  
using measurements from an external temperature sensor connected on the TSNS/SS pin as shown in  
Figure 38. The temperature sensor circuit applies two bias currents to an external NPN transistor, and measures  
ΔVBE to infer the junction temperature of the sensor. The TPS544x25 devices are designed to use a standard  
2N3904 NPN transistor as a temperature sensor. Other sensors may be used, but the devices assume an  
ideality factor, n, of 1.008 for use with the 2N3904 transistor. The devices then digitize the result and compare it  
to the user-configured over-temperature fault and warning thresholds. When an external over-temperature fault  
(OTF) is detected, power conversion stops until the sensed temperature falls by 20°C. The  
READ_TEMPERATURE_2 (8Eh) register is continually updated with the digitized temperature measurement,  
enabling temperature telemetry. The OT_FAULT_LIMIT (4Fh) and OT_WARN_LIMIT (51h) commands set over-  
temperature fault and warning thresholds via the PMBus interface. When an overtemperature event is detected,  
the device sets the appropriate flags in STATUS_TEMPERATURE (7Dh) and triggers SMBALERT if it is not  
masked.  
TI recommends including a 1-nF capacitor between the TSNS/SS pin and AGND to reduce temperature  
measurement noise. Optionally, external temperature sensing can be disabled by terminating TSNS/SS to AGND  
with a 0-Ω resistor. This termination forces the external temperature measurement to –40°C, and prevents  
external over-temperature faults tripping. The internal temperature sensor, and internal over-temperature fault  
remain enabled regardless of the TSNS/SS pin termination.  
NOTE  
The READ_TEMPERATURE_2 (8Eh) value remains at 25°C when SS_DET_DIS in  
OPTIONS (MFR_SPECIFIC_21) (E5h) is set to 0 since the TSNS/SS pin is configured to  
set TON_RISE time and not used for external temperature sensing (see Table 4).  
The device response upon over-temperature fault can be set to Latch-off, Restart and Ignore in  
OT_FAULT_RESPONSE. The fault response scheme is summarized in Table 6.  
Internal Temp  
OT Fault Internal  
+
Sensor  
Thermal  
Shutdown  
145°C  
OT_FAULT_RESPONSE  
OT_FAULT_LIMIT  
OT_WARN_LIMIT  
OT  
Fault  
READ_TEMPERATURE_2  
STATUS_TEMPERATURE  
STATUS_MFR_SPECIFIC  
SMBALERT  
TSNS/SS  
Sampling and  
Temperature  
Conversion  
∆VBE  
Measurement  
PMBus Engine  
CT  
QT  
Figure 38. Over-Temperature Protection  
28  
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8.3.15 Output Overvoltage and Undervoltage Protection  
The TPS544x25 devices include both output overvoltage protection and output undervoltage protection  
capability. The devices compare the DIFFO pin voltage to internal selectable pre-set voltages, as defined by the  
VOUT_OV_FAULT_LIMIT and VOUT_UV_FAULT_LIMIT command . As the output voltage rises or falls from the  
nominal voltage, the DIFFO voltage tracks the output voltage.  
If the DIFFO pin voltage rises above the output overvoltage protection threshold VOUT_OV_FAULT_LIMIT, the  
device terminates normal switching and turns on the low-side MOSFET to discharge the output capacitor and  
prevent further increases in the output voltage. The device also declares an OV fault, flagging the appropriate  
status registers, triggering SMBALERT if it is not masked. Then the device enters continuous restart hiccup, or  
latch-off according to the VOUT_OV_FAULT_RESPONSE command. The TPS544x25 devices respond to the  
output over-voltage condition immediately upon VDD powered up and BP6 regulator voltage above its own  
UVLO of 3.73 V typical. The VOUT_OV_FAULT_RESPONSE can also be set to ignore the output overvotlage  
fault and continue without interruption. Under this configuration, the control loop continues to respond and adjust  
PWM duty cycle in order to keep output voltage within regulation.  
If the DIFFO pin voltage falls below the undervoltage protection level defined by VOUT_UV_FAULT_LIMIT after  
soft-start has completed, the device terminates normal switching and forces both the high-side and low-side  
MOSFETs off, and awaits an external reset or begins a hiccup time-out delay prior to restart, depending on the  
value of the VOUT_UV_FAULT_RESPONSE command. The device also declares a UV fault, flagging the  
appropriate status registers, triggering SMBALERT if it is not masked. The VOUT_UV_FAULT_RESPONSE can  
also be set to ignore the output undervotlage fault and continue without interruption for debug purpose.  
The fault response scheme is summarized in Table 6.  
8.3.16 TON_MAX Fault  
The TON_MAX_FAULT_LIMIT command sets an upper limit, in ms, on how long the unit can attempt to power  
up the output without reaching the output undervoltage fault limit. The TPS544x25 devices differentiate a startup  
UV fault and  
a
regulation UV fault by implementing the TON_MAX_FAULT_LIMIT  
.
The  
TON_MAX_FAULT_LIMIT can allow the TPS544x25 devices more time than the soft-start time defined by  
TON_RISE to come into regulation and the UV detection is essentially delayed up to the  
TON_MAX_FAULT_LIMIT time. Refer to PMBus command section TON_MAX_FAULT_LIMIT for more details.  
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8.3.17 Power Good (PGOOD) Indicator  
When the output voltage remains within the PGOOD window after the start-up period, PGOOD as an open-drain  
output is released, and rises to an externally supplied logic level. The PGOOD window is defined by  
VOUT_OV_WARN_LIMIT and VOUT_UV_WARN_LIMIT, which can be programmed through the PMBus  
interface, as shown in Figure 39. The PGOOD hystersis window scales with respect to VOUT_SCALE_LOOP,  
i.e. the OVW and UVW hystersis window of VOUT_SCALE_LOOP  
= 0.5 is twice the size of  
VOUT_SCALE_LOOP = 1 and just half of the size of VOUT_SCALE_LOOP = 0.25. The The PGOOD pin pulls  
low upon any fault condition on default. Please refer to Table 6 for the possible sources to pull down PGOOD  
pin.  
The PGOOD signal can be connected to the CNTL pin of another device to provide additional controlled turn-on  
and turn-off sequencing.  
OV Fault  
OV Warn  
OVW  
Hysteresis  
VOUT_COMMAND  
UV Warn  
(@DIFFO)  
UV Fault  
UVW  
Hysteresis  
V
OUT  
PGOOD  
(non-latch)  
Time  
(1) VOUT is measured at the DIFFO pin.  
Figure 39. PGOOD Threshold and Hysteresis  
NOTE  
Pulling PGOOD pin high before the TPS544x25 devices gets input power could cause  
PGOOD pin going high due to the limited pull-down capability in un-powered condition. If  
this is not desired, increase the pull-up resistance or reduce the external pull-up supply  
voltage.  
30  
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8.3.18 Fault Protection Responses  
Table 6 Summarizes the various fault protections and associated responses.  
Table 6. Fault Protection Summary  
FAULT  
RESPONSE  
SETTING  
ACTIVE DURING  
TON_RISE  
SOURCE OF  
SMBALERT  
SMBALERT  
PGOOD  
FAULT or WARN  
PROGRAMMING  
FET BEHAVIOR  
MASKABLE  
Latch-off  
Restart  
Ignore  
Both FETs off  
Both FETs off, then restart after cooling down(1)  
Low  
External Over Temp Fault  
OT_FAULT_LIMIT (4Fh)  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Low  
FETs still controlled by PWM  
High  
Latch-off or  
Restart on Fault  
Low  
External Over Temp Warn  
OT_WARN_LIMIT (51h)  
Threshold fixed internally  
PWM maintains control of FETs  
Ignore Fault  
Latch-off  
Restart  
High  
Both FETs off  
Internal Over Temp Fault  
(Junction Thermal  
Shutdown)  
Both FETs off, then restart after cooling down(1)  
Both FETs off, then restart after cooling down(2)  
3 PWM counts, then both FETs off  
Low  
Ignore  
Latch-off  
Low  
Low  
High  
Low  
3 PWM counts, then both FETs off, restart after  
7×TON_RISE  
Low-Side OC Fault  
Low-Side OC Warn  
High-Side OC Fault  
IOUT_OC_FAULT_LIMIT (46h)  
IOUT_OC_WARN_LIMIT  
HSOC_USER_TRIM[1:0]  
Restart  
Ignore  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
FETs still controlled by PWM  
PWM maintains control of FETs  
3 PWM counts, then both FETs off  
Latch-off or  
Restart on Fault  
Ignore Fault  
Latch-off  
High  
Low  
3 PWM counts, then both FETs off, restart after  
7×TON_RISE  
Restart  
Ignore  
Low  
Cycle-by-cycle peak current limit  
High  
High-side FET OFF, low-side FET response configured  
byOV_RESP_SEL: latch ON or turn on till Vout reach  
VOUT_UV_FAULT_LIMIT  
Latch-off  
High-side FET OFF, low-side FET response configured  
by OV_RESP_SEL: latch ON or turn on till Vout reach  
VOUT_UV_FAULT_LIMIT. Then restart after  
7×TON_RISE  
VOUT OV Fault  
VOUT_OV_FAULT_LIMIT  
VOUT_OV_WARN_LIMIT  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Low  
Low  
Restart  
Ignore  
PWM maintains control of FETs  
Latch-off or  
Restart on Fault  
VOUT OV Warn  
PWM maintains control of FETs  
Ignore Fault  
(1) Once the external over-temperature fault is tripped, the device shuts off both FETs and restarts until the external sensed temperature falls 20°C from the OT_FAULT_LIMIT.  
(2) The internal Over Temperature Fault (Junction Thermal Shutdown) cannot be ignored, the device shuts off both FETs and restarts after the internal die temperature drops below the  
threshold.  
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Table 6. Fault Protection Summary (continued)  
FAULT  
RESPONSE  
SETTING  
ACTIVE DURING  
TON_RISE  
SOURCE OF  
SMBALERT  
SMBALERT  
MASKABLE  
FAULT or WARN  
VOUT UV Fault  
PROGRAMMING  
FET BEHAVIOR  
PGOOD  
Latch-off  
Restart  
Ignore  
Both FETs off  
VOUT_UV_FAULT_LIMIT  
Both FETs off, then restart after 7×TON_RISE  
PWM maintains control of FETs  
No  
No  
Yes  
Yes  
Yes  
Yes  
Low  
Latch-off or  
Restart on Fault  
VOUT UV Warn  
VOUT_UV_WARN_LIMIT  
PWM maintains control of FETs  
Low  
Ignore Fault  
Latch-off  
Restart  
Both FETs off  
Both FETs off, then restart after 7×TON_RISE  
PWM maintains control of FETs  
Both FETs off  
tON Max Fault  
VIN UVLO  
TON_MAX_FAULT_LIMIT  
VIN_ON, VIN_OFF  
No  
Yes  
Yes  
Yes  
Yes  
Low  
Low  
Ignore  
Shut down  
Yes  
32  
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8.3.19 Switching Node  
The SW pin connects to the switching node of the power conversion stage and acts as the return path for the  
high-side gate driver. When configured as a synchronous buck stage, the voltage swing on SW normally  
traverses from below ground to well above the input voltage. Parasitic inductance in the high-side FET and the  
output capacitance (COSS) of both power FETs form a resonant circuit that can produce high frequency ( > 100  
MHz) ringing on this node. The voltage peak of this ringing, if not controlled, can be significantly higher than the  
input voltage. Ensure that the peak ringing amplitude does not exceed the absolute maximum rating limit for the  
pin.  
In many cases, a series resistor and capacitor snubber network connected from the switching node to GND can  
be helpful in damping the ringing and decreasing the peak amplitude. Provide provisions for snubber network  
components in the layout of the printed circuit board. If testing reveals that the ringing amplitude at the SW pin  
exceeds the limit, then include snubber components. See SLUP100 for more information about snubber circuits  
design.  
Placing a BOOT resistor in series with the BOOT capacitor slows down the turn-on of the high-side FET and can  
help to reduce the peak ringing at the switching node as well.  
8.3.20 PMBus General Description  
Timing and electrical characteristics of the PMBus interface specification can be found in the PMB Power  
Management Protocol Specification, Part 1, revision 1.2 available at http://pmbus.org. The TPS544x25 devices  
support both the 100-kHz and 400-kHz bus timing requirements. The devices do not stretch pulses when  
communicating with the master device.  
Communication over the PMBus interface can support the Packet Error Checking (PEC) scheme if desired. If the  
master supplies clock (CLK pin) pulses for the PEC byte, PEC is used. If the CLK pulses are not present before  
a STOP, the PEC is not used.  
The devices support a subset of the commands in the PMBus 1.2 Power Management Protocol Specification.  
See Supported PMBus Commands for more information  
The devices also support the SMBALERT response protocol. The SMBALERT response protocol is a mechanism  
by which a slave device (such as the TPS544x25 devices ) can alert the bus master that it is available for  
communication. The master processes this event and simultaneously accesses all slaves on the bus (that  
support the protocol) through the alert response address (ARA). Only the slave that caused the alert  
acknowledges this request. The host performs a modified receive byte operation to ascertain the slave address.  
At this point, the master can use the PMBus status commands to query the slave that caused the alert. By  
default these devices implement the auto alert response, a manufacturer specific improvement to the  
SMBALERT response protocol, intended to mitigate the issue of bus hogging. See Auto ARA Response for more  
information. For more information on the SMBus alert response protocol, see the System Management Bus  
(SMBus) specification.  
The devices contain non-volatile memory that stores configuration settings and scale factors. However, the  
device does not save the settings programmed into this non-volatile memory. The STORE_DEFAULT_ALL (11h)  
command must be used to commit the current settings to non-volatile memory as device defaults. The settings  
that are capable of being stored in non-volatile memory are noted in their detailed descriptions.  
8.3.21 PMBus Address  
The PMBus specification requires that each device connected to the PMBus have a unique address on the bus.  
The TPS544x25 devices each have 64 possible addresses (0 through 63 in decimal) that can be assigned by  
connecting resistors from the ADDR0 and ADDR1 pins to AGND. The address is set in the form of two octal (0-  
7) digits, one digit for each pin. ADDR1 is the high order digit and ADDR0 is the low-order digit. These address  
selection resistors must be 1% tolerance or better. Using resistors other than the recommended values can result  
in devices responding to adjacent addresses.  
The E48 series resistors with no worse than 1% tolerance suggested for each digit value are shown in Table 7.  
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Table 7. Required Address  
Resistors  
DIGIT  
RESISTOR VALUE (kΩ)  
0
1
2
3
4
5
6
7
8.66  
15.4  
23.7  
34.8  
51.1  
78.7  
121  
187  
The TPS544x25 devices also detect values that are out of range on the ADDR0 and ADDR1 pins. If the device  
detects that either pin has an out-of-range resistance connected to it, the device continues to respond to PMBus  
interface commands, but does so at address 127 decimal, which is outside of the possible programmed  
addresses. It is possible but not recommended to use the device in this condition, especially if other devices are  
present on the bus or if another device could possibly occupy the 127 decimal address.  
Certain addresses in the I2C address space are reserved for special functions and it is possible to set the  
address of the devices to respond to these addresses. The user is responsible for knowing which of these  
reserved addresses are in use in a system and for setting the address of the devices accordingly so as not to  
interfere with other system operations. The devices can be set to respond to the global call address or 0. It is  
recommended not to set the devices to this address unless the user is certain that no other devices respond to  
this address and that the overall bus is not affected by having such an address present.  
8.3.22 PMBus Connections  
The TPS544x25 devices support both the 100-kHz and 400-kHz bus speeds, 1.8-V or 3.3-V and 5-V PMBus  
interface logic level. See the PMBus Interface section of the Electrical Characteristics and PMBus command  
OPTIONS (MFR_SPECIFIC_21) (E5h) for more information.  
8.3.23 Auto ARA (Alert Response Address) Response  
By default, the TPS544x25 devices implement the auto alert response, a manufacturer specific improvement to  
the standard SMBALERT response protocol defined in the SMBus specification. The auto alert response is  
designed to prevent SMBALERT monopolizing in the case of a persistent fault condition on the bus. The user  
can choose to disable the auto ARA response, and use the standard SMBALERT response as defined in the  
SMBus specification, by using bit EN_AUTO_ARA of the OPTIONS (MFR_SPECIFIC_21) (E5h) register.  
In the case of a fault condition, the slave device experiencing the fault pulls down the shared SMBALERT line, to  
alert the host that a fault condition has occurred. To establish which slave device has experienced the fault, the  
host issues a modified receive byte operation to the alert response address (ARA), to which only the slave  
pulling down on SMBALERT should respond. The SMBus protocol provides a method for address arbitration in  
the case that multiple slaves on the same bus are experiencing fault conditions. Once the host has established  
the address of the offending device, it must take any necessary action to release the SMBALERT line. For more  
information on the standard SMBus alert response protocol, see the System Management Bus (SMBus)  
specification.  
In the case of a non-persistent fault (a single-time event, such as an invalid command or data byte), the host can  
ascertain the address of the slave experiencing a fault using the standard ARA response, and simply issue  
CLEAR_FAULTS (03h) to release the SMBALERT line, and resume normal operation. However, in the case of a  
persistent fault (one which remains active for some time, such as a short-circuit, or thermal shutdown), once the  
device issues a CLEAR_FAULTS (03h) command, the fault immediately re-triggers, and SMBALERT continues  
to be pulled low. In this case, the device holds low the SMBALERT line until the host masks the SMBALERT line  
using SMBALERT_MASK and then issues the CLEAR_FAULTS (03h) command. Because the SMBALERT line  
remains low, the host cannot be alerted to other fault conditions on the bus until it clears SMBALERT. Figure 40  
and Figure 41 illustrate this response.  
34  
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SMBALERT is not released until CLEAR_FAULTS  
is issued by the host  
SMBALERT  
STATUS_CML  
DATA  
No Faults  
Invalid Command  
No Faults  
PAGE  
HOST  
ARA Slave Address  
HOST SLAVE  
CLEAR_FAULT  
HOST  
Figure 40. Example Standard ARA Response to Non-Persistent Fault  
SMBALERT is low until host masks fault, and issues CLEAR_FAULTS  
if the fault condition persists  
SMBALERT  
STATUS_IOUT  
DATA  
No Faults  
OC FAULT  
ARA Slave Address  
HOST SLAVE  
MASK_SMBALERT  
HOST  
CLEAR_FAULTS  
HOST  
Short  
Circuit  
Figure 41. Example Standard ARA Response to a Persistent Fault  
In order to mitigate the problem of SMBALERT bus hogging described previously, the devices implement the  
Auto ARA response. When Auto ARA is enabled, the devices releases SMBALERT automatically after  
successfully responding to access from the host at the alert response address. In this case, even when the  
device is experiencing a persistent fault, it does not hold the SMBALERT line low following successful notification  
of the host, and the host can be alerted to other faults on the bus in the normal manner. Examples of the auto  
ARA response are illustrated in Figure 42 and Figure 43.  
SMBALERT is  
released when slave  
successfully responds to ARA  
SMBALERT  
STATUS_CML  
DATA  
No Faults  
Invalid Command  
No Faults  
PAGE  
HOST  
ARA Slave Address  
HOST SLAVE  
CLEAR_FAULT  
HOST  
Figure 42. Example Auto ARA Response to Non-Persistent Fault  
Host must mask SMBALERT or it will re-assert when  
CLEAR_FAULTS is issued, if the fault condition persists  
SMBALERT is  
released when slave  
SMBALERT  
STATUS_IOUT  
DATA  
successfully responds to ARA  
No Faults  
OC FAULT  
ARA Slave Address  
HOST SLAVE  
MASK_SMBALERT  
HOST  
CLEAR_FAULTS  
HOST  
Short  
Circuit  
Figure 43. Example Auto ARA Response to Persistent Fault  
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8.4 Device Functional Modes  
8.4.1 Continuous Conduction Mode  
The TPS544x25 devices operate in continuous conduction mode (CCM) at a fixed frequency, regardless of the  
output current. For the first 128 switching cycles, the low-side MOSFET on-time is slowly increased to prevent  
excessive current sinking in the event the device is started with a pre-biased output. Following the first 128 clock  
cycles, the low-side MOSFET and the high-side MOSFET on-times are fully complementary.  
8.4.2 Operation with CNTL Signal Control  
According to the value in the ON_OFF_CONFIG register, the TPS544x25 devices can be commanded to use the  
CNTL pin to enable or disable regulation, regardless of the state of the OPERATION command. The CNTL pin  
can be configured as either active high or active low (inverted) logic.  
8.4.3 Operation with OPERATION Control  
According to the value in the ON_OFF_CONFIG register, the TPS544x25 devices can be commanded to use the  
OPERATION command to enable or disable regulation, regardless of the state of the CNTL signal.  
8.4.4 Operation with CNTL and OPERATION Control  
According to the value in the ON_OFF_CONFIG register, the TPS544x25 devices can be commanded to require  
both a signal on the CNTL pin, and the OPERATION command to enable or disable regulation.  
8.5 Supported PMBus Commands  
The commands listed in Table 8 are implemented as described to conform to the PMBus 1.2 specification.  
Default behavior and register values are also shown.  
Table 8. Supported PMBus Commands and Default Values  
DEFAULT  
REGISTER  
VALUE  
CMD  
CODE  
PMBus 1.2  
COMMAND NAME  
PMBus COMMAND  
DESCRIPTION  
DEFAULT BEHAVIOR  
NVM  
Can be configured via  
ON_OFF_CONFIG to be used to OPERATION is not used to  
turn the output on and off with or enable regulation  
without input from the CTRL pin.  
01h  
OPERATION  
00h  
No  
Configures the combination of  
CNTL pin input and OPERATION  
command for turning output on  
and off.  
02h  
03h  
10h  
ON_OFF_CONFIG  
CLEAR_FAULTS  
WRITE_PROTECT  
CNTL only. Active High  
16h  
n/a  
Yes  
No  
Clears all fault status registers to  
Write-only  
0x00 and releases SMBALERT.  
Used to control writing to the  
volaile operating memory  
Allow writes to all registers  
(PMBus and restore from  
00h  
Yes  
EEPROM).  
Stores all current storable  
register settings into EEPROM as Write-only  
new defaults.  
11h  
12h  
19h  
STORE_DEFAULT_ALL  
RESTORE_DEFAULT_ALL  
CAPABILITY  
n/a  
n/a  
No  
No  
No  
Restores all storable register  
Write-only  
settings from EEPROM.  
Provides a way for a host system  
Read only. PMBus v1.2,  
to determine key PMBus  
400 kHz, PEC enabled  
B0h  
capabilities of the device.  
1Bh  
20h  
21h  
SMBALERT_MASK  
VOUT_MODE  
Mask Warn or Fault status bits  
Read-only output mode indicator. Linear, exponent = –9  
Default Regulation Setpoint 950mV  
Mask PGOODz only  
n/a  
17h  
Yes  
No  
VOUT_COMMAND  
01E6h  
Yes  
36  
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Supported PMBus Commands (continued)  
Table 8. Supported PMBus Commands and Default Values (continued)  
DEFAULT  
REGISTER  
VALUE  
CMD  
CODE  
PMBus 1.2  
COMMAND NAME  
PMBus COMMAND  
DESCRIPTION  
DEFAULT BEHAVIOR  
NVM  
Sets the maximum output  
voltage. VOUT_MAX imposes a  
higher bound to any attempted  
VOUT setting from  
24h  
VOUT_MAX  
1.5V  
0300h  
No  
VOUT_COMMAND and VSET  
pin default.  
Sets the rate at which the output  
should change voltage.  
27h  
29h  
VOUT_TRANSITION_RATE  
VOUT_SCALE_LOOP  
1 mV/us  
1
D03Ch  
F004h  
No  
Sets output sense scaling ratio  
for main control loop.  
Yes  
Sets value of input voltage at  
which the device should start  
power conversion.  
35h  
36h  
VIN_ON  
4.5 V  
4.0V  
F012h  
F010h  
Yes  
Yes  
Sets value of input voltage at  
which the device should stop  
power conversion.  
VIN_OFF  
Can be set to null out offsets in  
the current sensing circuit.  
39h  
40h  
41h  
42h  
43h  
44h  
45h  
IOUT_CAL_OFFSET  
0.0000 A  
1.281 V  
Restart  
1.201 V  
0.631 V  
0.594 V  
Restart  
E000h  
0290h  
BFh  
Yes  
Yes  
Yes  
No  
Sets output overvoltage fault  
threshold.  
VOUT_OV_FAULT_LIMIT  
VOUT_OV_FAULT_RESPONSE  
VOUT_OV_WARN_LIMIT  
VOUT_UV_WARN_LIMIT  
VOUT_UV_FAULT_LIMIT  
VOUT_UV_FAULT_RESPONSE  
Sets output overvoltage fault  
response.  
Sets output overvoltage warning  
threshold.  
0267h  
0143h  
0130h  
BFh  
Sets output undervoltage warning  
threshold.  
No  
Sets output undervoltage fault  
threshold.  
Yes  
Yes  
Sets output undervoltage fault  
response.  
Sets the value of the output  
current that causes an  
overcurrent fault condition.  
36 A (TPS544C25)  
24 A (TPS544B25)  
F848h  
F830h  
46h  
47h  
4Ah  
4Fh  
50h  
IOUT_OC_FAULT_LIMIT  
Yes  
Yes  
No  
Sets response to output  
IOUT_OC_FAULT_RESPONSE overcurrent faults to latch-off,  
hiccup mode or ignore.  
Restart  
BFh  
Sets the value of the output  
current that causes an  
overcurrent warning condition.  
34 A (TPS544C25)  
22 A (TPS544B25)  
F844h  
F82Ch  
IOUT_OC_WARN_LIMIT  
OT_FAULT_LIMIT  
Sets the value of the sensed  
temperature that causes an  
overtemperature fault condition.  
125 °C  
Restart  
007Dh  
BFh  
Yes  
Yes  
Sets response to over  
temperature faults to latch-off,  
hiccup mode or ignore.  
OT_FAULT_RESPONSE  
Sets the value of the sensed  
temperature that causes an  
overtemperature warning  
condition.  
51h  
60h  
61h  
OT_WARN_LIMIT  
TON_DELAY  
TON_RISE  
100 °C  
0 ms  
0064h  
0000h  
0005h  
No  
Yes  
Yes  
Sets the turn-on delay.  
Sets the time from when the  
output starts to rise until the  
voltage has entered the  
regulation band.  
5 ms  
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Supported PMBus Commands (continued)  
Table 8. Supported PMBus Commands and Default Values (continued)  
DEFAULT  
REGISTER  
VALUE  
CMD  
CODE  
PMBus 1.2  
PMBus COMMAND  
DESCRIPTION  
DEFAULT BEHAVIOR  
NVM  
COMMAND NAME  
TON_MAX_FAULT_LIMIT  
TON_MAX_FAULT_RESPONSE  
Sets an UPPER limt in  
milliseconds, on how long the  
unit can attempt to power up the  
output without reaching the  
output undervoltage fault limit.  
The time begins counting as the  
device enters the soft-start  
period.  
62h  
63h  
100 ms  
0064h  
BFh  
No  
Sets the soft start timeout fault  
response.  
Restart  
Yes  
64h  
65h  
TOFF_DELAY  
TOFF_FALL  
Sets the turn-off delay.  
0 ms  
0 ms  
0000h  
0000h  
Yes  
Yes  
Sets the soft stop fall time.  
Returns one byte summarizing  
the most critical faults.  
78h  
79h  
STATUS_BYTE  
STATUS_WORD  
Read only  
Read only  
Current status  
Current status  
No  
No  
Returns two bytes summarizing  
fault and warning conditions.  
Returns one byte detailing if an  
output fault or warning has  
occurred  
7Ah  
7Bh  
7Ch  
7Dh  
7Eh  
STATUS_VOUT  
Read only  
Read only  
Read only  
Read only  
Read only  
Current status  
Current status  
Current status  
Current status  
Current status  
No  
No  
No  
No  
No  
Retyrns one byte detailing if an  
overcurrent fault or warning has  
occurred  
STATUS_IOUT  
Returns one byte of information  
relating to the status of the  
converter's input related faults.  
STATUS_INPUT  
STATUS_TEMPERATURE  
STATUS_CML  
Returns one byte detailing if a  
sensed temperature fault or  
warning has occurred.  
Returns one byte containing  
PMBus serial communication  
faults.  
Returns one byte detailing if  
internal overtemperature or  
address detection fault has  
occurred.  
80h  
STATUS_MFR_SPECIFIC  
Read only  
Current status  
No  
Returns the output voltage in  
volts.  
8Bh  
8Ch  
READ_VOUT  
READ_IOUT  
Read only  
Read only  
Current status  
Current status  
No  
No  
Returns the output current in  
amps.  
Read-only, 25 C  
whenSS_DET_DIS in  
OPTIONS  
(MFR_SPECIFIC_21) (E5h)  
= 0.  
Returns the sensed temperature  
in degrees Celsius.  
8Eh  
98h  
READ_TEMPERATURE_2  
PMBUS_REVISION  
0019h  
12h  
No  
No  
Returns PMBus revision to which  
the device is compliant.  
Read only  
0.5 V  
Sets the minimum output voltage.  
MFR_VOUT_MIN imposes a  
lower bound to any attempted  
VOUT setting from  
A4h  
MFR_VOUT_MIN  
0100h  
No  
VOUT_COMMAND and VSET  
pin default.  
38  
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Supported PMBus Commands (continued)  
Table 8. Supported PMBus Commands and Default Values (continued)  
DEFAULT  
REGISTER  
VALUE  
CMD  
CODE  
PMBus 1.2  
COMMAND NAME  
PMBus COMMAND  
DESCRIPTION  
DEFAULT BEHAVIOR  
NVM  
This Read-only Block Read  
command returns a single word  
(16 bits) with the unique Device  
Code identifier for each device  
for which this IC can be  
configured. The BYTE_COUNT  
field in the Block Read command  
is 2 (indicating 2 bytes follow):  
Low Byte first, then High Byte.  
TPS544C25  
0027h  
ADh  
IC_DEVICE_ID  
No  
TPS544B25  
0028h  
This Read-only Block Read  
command returns a single word  
(16 bits) with the unique Device  
revision identifier. The  
BYTE_COUNT field in the Block  
Read command is 2 (indicating 2  
bytes follow): Low Byte first, then  
High Byte.  
AEh  
D0h  
IC_DEVICE_REV  
Read only  
0000h  
0000h  
No  
MFR_SPECIFIC_00  
User scratch pad.  
Yes  
Sets user selectable options.  
Options register: Disable SS  
detection, Enable Auto Alert  
Response Address response  
(ARA), ADC averaging, Enable  
Data limit override, Enable ADC,  
Enable Vout Scan Mode, Enable  
auto PMBus rail logic level  
detection and Force PMBus rail  
logic level.  
Enable SS detection, auto  
ARA, ADC conversion,  
PMBus auto detection, 8x  
average for V/I/T reporting,  
and force 1.8V logic  
E5h  
OPTIONS (MFR_SPECIFIC_21)  
00C7h  
Yes  
The SYNC/RESET_B pin  
operates as RESET_B if  
VSET detection is valid;  
default trim for HS OC; for  
OVP response, the LS FET  
latches on when an OV  
fault is detected, and turns  
off as soon as the sensed  
output (at DIFFO pin) drops  
below the UV fault  
Sets miscellaneous user  
MISC_CONFIG_OPTIONS  
(MFR_SPECIFIC_32)  
selectable options. Options  
register: Force SYNC, HSOC  
user trim, OVP response options.  
F0h  
0001h  
Yes  
threshold.  
8.6 Register Maps  
This family of devices supports the following commands from the PMBus 1.2 specification.  
Register Access Legend:  
r- read  
w - write  
superscript E – the bit is backed up with Non-volatile EEPROM  
8.6.1 OPERATION (01h)  
The OPERATION command turns the device output on or off in conjunction with input from the CNTL signal. It is  
also used to set the output voltage to the upper or lower margin voltages. The unit stays in the commanded  
operating mode until a subsequent OPERATION command or a change in the state of the CNTL pin instructs the  
device to change to another mode.  
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COMMAND  
Format  
OPERATION  
Unsigned binary  
Bit Position  
Access  
7
r/w  
ON  
0
6
r/w  
OFF  
0
5
r
4
r
3
r
2
r
1
r
0
r
Function  
X
X
X
X
X
X
X
X
X
X
X
X
Default Value  
8.6.1.1 On  
This bit is an enable command to the converter.  
0: output switching is disabled. Both drivers placed in an off or low state.  
1: output switching is enabled if the input voltage is above undervoltage lockout, OPERATION is configured  
as a gating signal in ON_OFF_CONFIG, and no fault conditions exist.  
8.6.1.2 Off  
This bit sets the turn-off behavior when commanding the unit to turn off via OPERATION[7] ( the “ On“ bit).  
0: Immediately turn off the output (not honoring the programmed turn-off delay (TOFF_DELAY) and ramp  
down (TOFF_FALL)) when commanded off via OPERATION[7] ( the “ On“ bit).  
1: Use the programmed turn-off delay (TOFF_DELAY) and ramp down (TOFF_FALL) when commanded off  
via OPERATION[7] – aka “soft off”.  
NOTE  
The device ignores any values written to read-only bits. Additionally, both “on” and “off”  
bits being set at the same time is not allowed and considered invalid data per section 12.1  
of the PMBus Specification Part II; any attempt to do so causes the device to set the ’cml’  
bit in the STATUS_BYTE and the ‘ivd’ bit in the STATUS_CML registers, and triggers  
SMBALERT signal.  
8.6.2 ON_OFF_CONFIG (02h)  
The ON_OFF_CONFIG command configures the combination of CNTL pin input and serial bus commands  
needed to turn the unit on and off. The contents of this register can be stored to non-volatile memory using the  
STORE_DEFAULT_ALL (11h) command. The default value in ON_OFF_CONFIG register is to have the device  
power up by CNTL pin only with the active high polarity and use the programmed turn-off delay (TOFF_DELAY)  
and ramp down (TOFF_FALL) for powering off the converter.  
COMMAND  
Format  
ON_OFF_CONFIG  
Unsigned binary  
Bit Position  
Access  
7
r
6
r
5
r
4
r/wE  
pu  
1
3
2
r/wE  
cpr  
1
1
r/wE  
pol  
1
0
r/wE  
cpa  
0
r/wE  
cmd  
0
Function  
X
X
X
X
X
X
Default Value  
8.6.2.1 pu  
The pu bit sets the default to either operate any time power is present or for power conversion to be controlled by  
CNTL pin and PMBus OPERATION command. This bit is used in conjunction with the 'cpr', 'cmd', and 'on' bits to  
determine start up.  
BIT VALUE  
ACTION  
0
Device powers up any time power is present regardless of state of the CNTL pin.  
Device does not power up until commanded by the CNTL pin and/or OPERATION  
command as programmed in bits [3:0] of the ON_OFF_CONFIG register.  
1
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8.6.2.2 cmd  
The cmd bit controls how the device responds to the OPERATION command. This bit is used in conjunction with  
the 'cpr', 'pu', and 'on' bits to determine start up.  
BIT VALUE  
ACTION  
0
1
Device ignores the “on” bit in the OPERATION command.  
Device responds to the “on” bit in the OPERATION command.  
8.6.2.3 cpr  
The cpr bit sets the CNTL pin response. This bit is used in conjunction with the 'cmd', 'pu', and 'on' bits to  
determine start up.  
BIT VALUE  
ACTION  
Device ignores the CNTL pin. Power conversion is controlled only by the OPERATION  
command.  
0
1
Device requires the CNTL pin to be asserted to start the unit.  
8.6.2.4 pol  
The pol bit controls the polarity of the CNTL pin. For a change to become effective, the contents of the  
ON_OFF_CONFIG register must be stored to non-volatile memory using the STORE_DEFAULT_ALL command  
and the device power cycled. Simply writing a new value to this bit does not change the polarity of the CNTL pin.  
BIT VALUE  
ACTION  
0
1
CNTL pin is active low.  
CNTL pin is active high.  
8.6.2.5 cpa  
The cpa bit sets the CNTL pin action when turning the converter off.  
BIT VALUE  
ACTION  
0
Use the programmed turn-off delay (TOFF_DELAY) and ramp down (TOFF_FALL).  
Immediately turn off the output (not honoring the programmed turn-off delay  
(TOFF_DELAY) and ramp down (TOFF_FALL)).  
1
8.6.3 CLEAR_FAULTS (03h)  
The CLEAR_FAULTS command is used to clear any fault bits that have been set. This command clears all bits  
in all status registers simultaneously. At the same time, the device negates (clears, releases) its SMBALERT  
signal output if the device is asserting the SMBALERT signal. The CLEAR_FAULTS command does not cause a  
unit that has latched off for a fault condition to restart. If the fault is still present when the bit is cleared, the fault  
bit is immediately reset and the host notified by the usual means.  
NOTE  
To get a reliable clear fault result, the clear_fault command should be issued (8 ×  
TON_RISE + TON_DELAY) after the switcher shuts down.  
In the case of OV fault with “latch off” response, the LS FET latches on when the fault  
is detected. If the OV_RESP_SEL bit in (F0h) MFR_SPECIFIC_32 is set to 1, then the  
LS FET releases when the output voltage falls below the VOUT_UV_FAULT_LIMIT.  
Otherwise, it remains on until the CLEAR_FAULTS command is issued. The CLEAR  
FAULTS command causes the LS FET to turn off.  
To clear an OV fault, two CLEAR_FAULTS commands need to be issued and the OVF  
cannot be cleared the first time, but the second time.  
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8.6.4 WRITE_PROTECT (10h)  
The WRITE_PROTECT command is used to control writing to the PMBus device. The intent of this command is  
to provide protection against accidental changes. This command is not intended to provide protection against  
deliberate or malicious changes to the device configuration or operation. All supported command parameters  
may have their parameters read, regardless of the WRITE_PROTECT settings. Write protection also prevents  
protected registers from being updated in the event of a RESTORE_DEFAULT_ALL. The contents of this register  
can be stored to non-volatile memory using the STORE_DEFAULT_ALL command.  
COMMAND  
Format  
WRITE_PROTECT  
Unsigned binary  
Bit Position  
Access  
7
r/wE  
bit7  
0
6
r/wE  
bit6  
0
5
r/wE  
bit5  
0
4
X
X
X
3
X
X
X
2
X
X
X
1
X
X
X
0
X
X
X
Function  
Default Value  
8.6.4.1 bit5  
8.6.4.2 bit6  
8.6.4.3 bit7  
BIT VALUE  
ACTION  
0
Enable all writes as permitted in bit6 or bit7  
Disable all writes except the WRITE_PROTECT, OPERATION, ON_OFF_CONFIG,  
and VOUT_COMMAND. (bit6 and bit7 must be 0 to be valid data)  
1
BIT VALUE  
ACTION  
0
Enable all writes as permitted in bit5 or bit7  
Disable all writes except for the WRITE_PROTECT, and OPERATION commands. (bit5  
and bit7 must be 0 to be valid data)  
1
BIT VALUE  
ACTION  
0
Enable all writes as permitted in bit5 or bit6  
Disable all writes except for the WRITE_PROTECT command. (bit5 and bit6 must be 0  
to be valid data)  
1
In any case, only one of the three bits may be set at any one time. Attempting to set more than one bit results in  
an alert being generated and the cml bit is STATUS_WORD being set. An invalid setting of the  
WRITE_PROTECT command results in no write protection.  
Data Byte  
ACTION  
Value  
1000 0000  
0100 0000  
Disables all WRITES except to the WRITE_PROTECT command.  
Disables all WRITES except to the WRITE_PROTECT, and OPERATION commands.  
Disables all WRITES except to the WRITE_PROTECT, OPERATION,  
ON_OFF_CONFIG, and VOUT_COMMAND commands.  
0010 0000  
8.6.5 STORE_DEFAULT_ALL (11h)  
The STORE_DEFAULT_ALL command stores all of the current storable register settings in the EEPROM  
memory as the new defaults on power up.  
It is permissible to use this command while the device is switching. Note however that the device continues to  
switch but ignores all fault conditions until the internal store process has completed. Issuing  
STORE_DEFAULT_ALL also causes the device to be unresponsive via PMBus for a period of ~100ms.  
EEPROM programming faults cause the device to NACK and set the 'cml' bit in the STATUS_BYTE and the  
'mem' bit in the STATUS_CML registers.  
42  
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8.6.6 RESTORE_DEFAULT_ALL (12h)  
The RESTORE_DEFAULT_ALL command restores all of the storable register settings from EEPROM memory to  
those registers which are unprotected according to current setting of WRITE_PROTECT. Issuing  
STORE_DEFAULT_ALL also causes the device to be unresponsive via PMBus for a period of ~100ms.  
NOTE  
Do not use this command while the device is actively switching, this causes the device to  
stop switching and the output voltage to fall during the restore event. Depending on  
loading conditions, the output voltage could reach an undervoltage level and trigger an  
undervoltage fault response if programmed to do so. The command can be used while the  
device is switching, but it is not recommended as it results in a restart that could disrupt  
power sequencing requirements in more complex systems. It is strongly recommended  
that the device be stopped before issuing this command.  
8.6.7 CAPABILITY (19h)  
The CAPABILITY command provides a way for a host system to determine some key capabilities of this PMBus  
device.  
COMMAND  
Format  
CAPABILITY  
Unsigned binary  
Bit Position  
Access  
7
r
6
r
5
r
4
3
r
2
r
1
r
0
r
r
ALRT  
1
Function  
PEC  
1
SPD  
Reserved  
Default Value  
0
1
0
0
0
0
The default values indicate that the device supports Packet Error Checking (PEC), a maximum bus speed of 400  
kHz (SPD) and the SMBus Alert Response Protocol using SMBALERT.  
8.6.8 SMBALERT_MASK (1Bh)  
The SMBALERT_MASK command may be used to prevent a warning or fault condition from asserting the  
SMBALERT signal.  
NOTE  
The command uses the SMBus Write Word command protocol to overlay a “mask byte”  
with an associated/designated status register. It uses the SMBus Block Write/Block Read  
protocol – with a block size = 1, to read the mask settings for any given status register. If  
the host in the Block_Count field of the Block Write portion sends a block size unequal to  
1 the device returns a NACK. The device always returns a Block Count of 1 upon reads of  
SMBALERT_MASK.  
The bits in the mask byte align with the bits in the corresponding status register. For example, if the  
STATUS_TEMPERATURE command were sent with the mask byte 01000000b, then an Over Temperature  
Warning condition would be blocked from asserting SMBALERT. Please refer to the PMBus v1.2 specification -  
section 15.38 (SMBALERT_MASK Command) and the SMBus specification Block Write/Block Read protocol for  
further details.  
There are 19 maskable SMBALERT sources in the TPS544x25. Each of these 19 status conditions has an  
associated EEPROM backed mask bit. These sources are represnted and identified in the status register  
command descriptions by a particular status bit denoted as having EEPROM backup (e.g. a bit access of r/wE).  
Writes and reads to SMBALERT_MASK command code accepts only the following as valid STATUS_x  
command codes:  
STATUS_WORD  
STATUS_VOUT  
STATUS_IOUT  
STATUS_INPUT  
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STATUS_TEMPERATURE  
STATUS_CML  
STATUS_MFR_SPECIFIC  
Attempting to write a mask byte for any STATUS_X command code other than this list causes the device to set  
the ’cml’ bit in the STATUS_BYTE and the ‘ivd’ bit in the STATUS_CML registers, and triggers SMBALERT.  
Attempting to read a mask byte for any STATUS_x command code other than this list returns 00h for the mask  
byte. Refer to these individual command descriptions for further details on their specific smbalert masking  
capabilities.  
There is  
1
unique status bit in the TPS544x25 that warrants special clarification: PGOOD_Z  
(STATUS_WORD[10]) is maskable as an SMBALERT source via SMBALERT_MASK commands to  
STATUS_WORD. If the user wants to write, or read, the mask bit for PGOOD_Z, they must put ‘79h’ in the  
STATUS_x COMMAND_CODE field of the SMBALERT_MASK command. PGOOD_Z SMBALERT_MASK bit  
default to 1.  
8.6.9 VOUT_MODE (20h)  
The PMBus specification dictates that the data word for the VOUT_MODE command is one byte that consists of  
a 3-bit mode and 5-bit exponent parameter, as shown below. The 3-bit mode sets whether the device uses the  
Linear or Direct modes for output voltage related commands. The 5-bit parameter sets the exponent value for the  
linear data mode. The mode and exponent parameters are fixed and do not permit the user to change the  
values.  
COMMAND  
Bit Position  
VOUT_MODE  
7
r
6
5
r
4
r
3
r
2
1
r
0
r
Access  
r
Mode  
0
r
Exponent  
1
Function  
Default Value  
0
0
1
0
1
1
8.6.9.1 Mode:  
Value fixed at 000, linear mode.  
8.6.9.2 Exponent  
Value fixed at 10111, Exponent for Linear mode values is –9 (equivalent of 1.95mV/count).  
8.6.10 VOUT_COMMAND (21h)  
The VOUT_COMMAND command sets the output voltage in volts. The contents of this register can be stored to  
non-volatile memory using the STORE_DEFAULT_ALL command. The exponent is set be VOUT_MODE at –9  
(equivalent of 1.953 mV/count). The programmed the output voltage is computed as:  
VOUT = VOUT_COMMAND × VOUT_MODE (V) = VOUT_COMMAND × 2–9 (V)  
(4)  
The range of valid VOUT_COMMAND values is dependent upon the configured VOUT_SCALE_LOOP (29h) as  
follows:  
VOUT_SCALE_L  
Vout Range (volts)  
VOUT_COMMAND data valid range  
OOP  
1
0.5 – 1.5  
1 – 3  
256 - 768  
512 - 1536  
1024 - 3072  
0.5  
0.25  
2 – 6  
There are 2 “invalid data” situations that are possible and checked in hardware. They are handled differently:  
The first case is if the value programmed to VOUT_COMMAND exceeds the value stored in either  
MFR_VOUT_MIN (A4h) or VOUT_MAX (24h). In this case, VOUT_COMMAND is set to the appropriate  
MFR_VOUT_MIN or VOUT_MAX value (which ever was violated). See the command descriptions for  
MFR_VOUT_MIN (A4h) or VOUT_MAX (24h) for the specific status bits set in either case.  
The second case is if VOUT_COMMAND is attempted to be programmed outside the OV and UV warn limits.  
44  
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In this case, the VOUT_COMMAND value remains unchanged. Specifically, the following relationships must  
be maintained:  
VOUT_COMMAND < VOUT_OV_WARN_LIMIT  
VOUT_COMMAND > VOUT_UV_WARN_LIMIT  
In this second case where VOUT_COMMAND is attempted to be programmed outside the OV or UV Warn limits,  
it causes the device to set the ’cml’ bit in the STATUS_BYTE and the ‘ivd’ bit in the STATUS_CML registers, and  
triggers SMBALERT signal.  
When using the VSET function, at initial power-up. the Mantissa value decoded according to the appropriate  
VSET resistor is written into the VOUT_COMMAND register as the initial default. Note this overwrites any value  
restored from EEPROM when the device VDD is powered up.  
COMMAND  
Format  
VOUT_COMMAND  
Linear, unsigned binary  
Bit Position  
Access  
7
r
6
r
5
r
4
r
3
2
1
0
7
6
r/wE  
5
r/wE  
4
r/wE  
3
r/wE  
2
r/wE  
1
r/wE  
0
r/wE  
r/wE r/wE r/wE r/wE  
r/wE  
Mantissa  
1
Function  
Default Value  
0
0
0
0
0
0
0
1
1
1
0
0
1
1
0
8.6.10.1 Exponent  
Value fixed at 10111, Exponent for Linear mode values is –9 (equivalent of 1.95mV/count, specified in  
VOUT_MODE command).  
8.6.10.2 Mantissa  
This is the Mantissa for the linear format. Default value is: 0000 0001 1110 0110 (bin) 486 (dec) (equivalent Vout  
default = 0.95V).  
8.6.11 VOUT_MAX (24h)  
The VOUT_MAX command sets the maximum output voltage. The purpose is to protect the device(s) on the  
output rail supplied by this device from a higher than acceptable output voltage. VOUT_MAX imposes an upper  
bound to any attempted output voltage setting:  
a) programmed VOUT_COMMAND  
b) VSET pin default  
If any attempt is made to program the output voltage (using the VOUT_COMMAND ) in excess of the value in  
VOUT_MAX, the device also:  
Clamps the output voltage at the programmed VOUT_MAX value  
Sets the OTH (other) bit in the STATUS_BYTE  
Sets the VFW bit in the STATUS_WORD  
Sets the VOUT_MAX_Warning bit in the STATUS_VOUTregister  
Notifies the host via the SMBALERT pin  
The exponent is set be VOUT_MODE at –9 (equivalent of 1.953 mV/count). The programmed output voltage is  
computed as:  
MAXIMUM VOUT allowed = VOUT_MAX × VOUT_MODE (V) = VOUT_MAX × 2–9 (V)  
(5)  
There are 2 “invalid data” situations that are possible and checked in hardware. They are handled differently:  
If the commanded VOUT_MAX is outside the valid data range for the VOUT_SCALE_LOOP configured, but,  
is still relationally correct (above VOUT_COMMAND). In this case, that value is not accepted; but,  
VOUT_MAX is set to the highest allowed value.  
The second case is the opposite, where the attempted write value is within the absolute range of  
VOUT_MAX; but, is not relationally correct (it is below VOUT_COMMAND). In this case, VOUT_MAX remains  
unchanged.  
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Both cases equally cause the device to set the ’cml’ bit in the STATUS_BYTE and the ‘ivd’ bit in the  
STATUS_CML registers, and triggers SMBALERT signal.  
COMMAND  
Format  
VOUT_MAX  
Linear, unsigned binary  
Bit Position  
Access  
7
r
6
r
5
r
4
3
2
1
0
7
6
5
4
3
2
1
0
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
Function  
Mantissa  
8.6.11.1 Exponent  
Value fixed at 10111, Exponent for Linear mode values is –9 (equivalent of 1.95 mV/count, specified in  
VOUT_MODE command).  
8.6.11.2 Mantissa  
The range of valid VOUT_MAX values is dependent upon the configured (29h) VOUT_SCALE_LOOP as follows.  
If VOUT_SCALE_LOOP = 1:  
default: 0000 0011 0000 0000 (bin) 768 (dec) (equivalent output voltage default = 1.5V)  
Minimum : 0000 0001 0001 1010 (bin) 282 (dec) (equivalent VOUT_MAX = 0.55V)  
Maximum: 0000 0011 0000 0000 (bin) 768 (dec) (equivalent VOUT_MAX = 1.5V)  
If VOUT_SCALE_LOOP = 0.5:  
default: 0000 0110 0000 0000 (bin) 1536 (dec) (equivalent output voltage default = 3V)  
Minimum : 0000 0010 0011 0100 (bin) 564 (dec) (equivalent VOUT_MAX = 1.1V)  
Maximum: 0000 0110 0000 0000 (bin) 1536 (dec) (equivalent VOUT_MAX = 3V)  
If VOUT_SCALE_LOOP = 0.25:  
default: 0000 1100 0000 0000 (bin) 3072 (dec) (equivalent output voltage default = 6V)  
Minimum : 0000 0100 0110 1000 (bin) 1128 (dec) (equivalent VOUT_MAX = 2.2V)  
Maximum: 0000 1100 0000 0000 (bin) 3072 (dec) (equivalent VOUT_MAX = 6V)  
8.6.12 VOUT_TRANSITION_RATE (27h)  
The VOUT_TRANSITION_RATE command sets the rate of change in mV/µs of any output voltage change  
during normal operation (also includes vout changes in TOFF_DELAY state. In contrast Soft Start transition rate  
is controlled by TON_RISE and the TOFF_FALL transition rate is controlled by TOFF_FALL command).  
Only 8 fixed output voltage transition rates are available in the device. As such, the range of programmed  
vout_transition rates are sub-divided into 8 “buckets” that then selects one of the 8 fixed VOUT transition rates.  
Programmed values are rounded to the nearest “bucket/transition rate” as outlined in the table below.  
COMMAND  
Format  
VOUT_TRANSITION_RATE  
Linear, two’s complement binary  
Bit Position  
Access  
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
5
r/w  
4
3
2
1
0
r
Exponent  
0
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
Function  
Mantissa  
1
Default Value  
1
1
1
0
0
0
0
0
0
1
1
1
0
0
8.6.12.1 Exponent  
default: 11010 (bin) -6 (dec) (0.015625)  
These default settings are not programmable.  
8.6.12.2 Mantissa  
default: 000 0011 1100 (bin) 60 (dec) (equivalent VOUT_TRANSITION_RATE = 1mV/µs)  
46  
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NOTE  
It is possible to use VOUT_TRANSITION_RATE to slew Vref faster than the voltage loop  
can track. This causes a control related overshoot/undershoot response on the output  
voltage.  
VOUT_TRANSITI  
VOUT_TRANSITION Mantissa (d)  
ON rate (mV/µs)  
Greater than  
Less than or equal to  
0.067  
0.1  
5
5
7
0.143  
0.222  
0.333  
0.5  
7
12  
17  
25  
47  
79  
12  
17  
25  
47  
79  
1
1.5  
8.6.13 VOUT_SCALE_LOOP (29h)  
VOUT_SCALE_LOOP is equal to the feedback resistor ratio ( RBIAS /( RBIAS +R1) in the configuration shown in  
Figure 33). It is limited to only 3 possible options/ratios: 1 (default, no RBIAS needed), 0.5, and 0.25. Attempting to  
write a value unequal to one of these three options cause the device to set the ’cml’ bit in the STATUS_BYTE,  
and the ‘ivd’ bit in the STATUS_CML registers. Additionally, SMBALERT is asserted and the value of  
VOUT_SCALE_LOOP remains unchanged. The contents of this register can be stored to non-volatile memory  
using the STORE_DEFAULT_ALL command.  
NOTE  
Construct the feedback resistor ratio appropriately (see Table 1).  
Program the VOUT_SCALE_LOOP setting before the output is turned on.  
In order for the range checking to work properly and to avoid Invalid Data scenarios:  
VOUT_SCALE_LOOP should be changed first, if needed.  
Any changes to these registers should be made such that:  
The values in all the registers conform to the limits for the current VOUT_SCALE_LOOP setting  
The order below is optimum for programming the output voltage upwards (not all commands may be  
necessary)  
(40h) VOUT_OV_FAULT_LIMIT  
(42h) VOUT_OV_WARN_LIMIT  
(24h) VOUT_MAX (ordering with respect to VOUT_OV_FAULT_LIMIT and VOUT_OV_WARN_LIMIT  
is irrelevant. Just set VOUT_MAX prior to VOUT_COMMAND)  
(21h) VOUT_COMMAND  
(A4h)  
MFR_VOUT_MIN  
(ordering  
with  
respect  
to  
VOUT_UV_FAULT_LIMIT  
and  
VOUT_UV_WARN_LIMIT is irrelevant. Just set MFR_VOUT_MIN after VOUT_COMMAND)  
(43h) VOUT_UV_WARN_LIMIT  
(44h) VOUT_UV_FAULT_LIMIT  
The order below is optimum for programming the output voltage downwards (not all commands may be  
necessary)  
(44h) VOUT_UV_FAULT_LIMIT  
(43h) VOUT_UV_WARN_LIMIT  
(A4h)  
MFR_VOUT_MIN  
(ordering  
with  
respect  
to  
VOUT_UV_FAULT_LIMIT  
and  
VOUT_UV_WARN_LIMIT is irrelevant. Simply set MFR_VOUT_MIN prior to VOUT_COMMAND)  
(21h) VOUT_COMMAND  
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(24h) VOUT_MAX (ordering with respect to VOUT_OV_FAULT_LIMIT and VOUT_OV_WARN_LIMIT  
is irrelevant. Simply set VOUT_MAX after VOUT_COMMAND)  
(42h) VOUT_OV_WARN_LIMIT  
(40h) VOUT_OV_FAULT_LIMIT  
COMMAND  
Format  
VOUT_SCALE_LOOP  
Linear, two’s complement binary  
Bit Position  
Access  
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
r
5
4
r
3
r
2
r/wE  
1
r/wE  
0
r/wE  
r
Exponent  
1
r
Mantissa  
0
Function  
Default Value  
1
1
1
0
0
0
0
0
0
0
0
1
0
0
8.6.13.1 Exponent  
default: 11110 (bin) -2 (dec) (equivalent LSB=0.25)  
These default settings are not programmable.  
8.6.13.2 Mantissa  
default: 000 0000 0100 (bin) 4 (dec) (equivalent VOUT_SCALE_LOOP voltage = 1)  
For VOUT_SCALE_LOOP = 1.00, mantissa = 004h. (4 × 2–2 = 1.00)  
For VOUT_SCALE_LOOP = 0.50, mantissa = 002h. (2 × 2–2 = 0.50)  
For VOUT_SCALE_LOOP = 0.25, mantissa = 001h. (1 × 2–2 = 0.25)  
8.6.14 VIN_ON (35h)  
The VIN_ON command sets the value of the input voltage at which the unit should start operation assuming all  
other required startup conditions are met. Values are mapped to the nearest supported increment. Values  
outside the supported range are treated as invalid data and cause the device set the CML bit in the  
STATUS_BYTE and the invalid data (ivd) bit in the STATUS_CML registers, and trigger SMBALERT signal. The  
value of VIN_ON remains unchanged on an out-of-range write attempt. The contents of this register can be  
stored to non-volatile memory using the STORE_DEFAULT_ALL command.  
The supported VIN_ON values are shown in Table 9:  
Table 9. Supported VIN_ON Values  
VIN_ON Values (V)  
4.25  
5.5  
4.5 (default)  
4.75  
6
5
5.25  
6.5  
5.75  
7
6.25  
7.5  
6.75  
7.25  
7.75  
VIN_ON must be set higher than VIN_OFF. Attempting to write either VIN_ON lower than VIN_OFF or VIN_OFF  
higher than VIN_ON results in the new value being rejected, SMBALERT signal being asserted along with the  
CML bit in STATUS_BYTE and the invalid data bit in STATUS_CML.  
The data word that accompanies this command is divided into a fixed 5-bit exponent and an 11-bit mantissa. The  
four most significant bits of the mantissa are fixed, while the lower 4 bits may be altered.  
COMMAND  
Format  
VIN_ON  
Linear, two's complement binary  
Bit Position  
Access  
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
r
5
4
r
3
r/wE  
2
r/wE  
1
r/wE  
0
r/wE  
r
Exponent  
1
r
Mantissa  
0
Function  
Default Value  
1
1
1
0
0
0
0
0
0
1
0
0
0
1
48  
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8.6.14.1 Exponent  
default: 11110 (bin) -2 (dec) (equivalent LSB=0.25V)  
These default settings are not programmable.  
8.6.14.2 Mantissa  
default: 000 0001 0010 (bin) 18 (dec) (equivalent VIN_ON voltage = 4.5V)  
Minimum : 000 0001 0001 (bin) 17 (dec) (equivalent VIN_ON voltage = 4.25V)  
Maximum: 000 0001 1111 (bin) 31 (dec) (equivalent VIN_ON voltage = 7.75V)  
8.6.15 VIN_OFF (36h)  
The VIN_OFF command sets the value of the input voltage at which the unit should stop operation. Values are  
mapped to the nearest supported increment. Values outside the supported range is treated as invalid data and  
causes the device to set the CML bit in the STATUS_BYTE and the invalid data (ivd) bit in the STATUS_CML  
registers, and trigger SMBALERT signal. The value of VIN_OFF remains unchanged during an out-of-range write  
attempt. The contents of this register can be stored to non-volatile memory using the STORE_DEFAULT_ALL  
command.  
The supported VIN_OFF values are shown in Table 10:  
Table 10. Supported VIN_OFF Values  
VIN_OFF Values (V)  
4 (default)  
5.25  
4.25  
5.5  
4.5  
5.75  
7
4.75  
6
5
6.25  
7.5  
6.5  
6.75  
7.25  
VIN_ON must be set higher than VIN_OFF. Attempting to write either VIN_ON lower than VIN_OFF or VIN_OFF  
higher than VIN_ON results in the new value being rejected, SMBALERT being asserted along with the cml bit in  
STATUS_BYTE and the invalid data bit in STATUS_CML.  
The data word that accompanies this command is divided into a fixed 5 bit exponent and an 11 bit mantissa. The  
4 most significant bits of the mantissa are fixed, while the lower 7 bits may be altered.  
COMMAND  
Format  
VIN_OFF  
Linear, two's complement binary  
Bit Position  
Access  
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
r
5
4
r
3
r/wE  
2
r/wE  
1
r/wE  
0
r/wE  
r
Exponent  
1
r
Mantissa  
0
Function  
Default Value  
1
1
1
0
0
0
0
0
0
1
0
0
0
0
8.6.15.1 Exponent  
default: 11110 (bin) -2 (dec) (equivalent LSB=0.25V)  
These default settings are not programmable.  
8.6.15.2 Mantissa  
default: 000 0001 0000 (bin) 16 (dec) (equivalent VIN_OFF voltage = 4.0V)  
Minimum : 000 0001 0000 (bin) 16 (dec) (equivalent VIN_OFF voltage = 4.0V)  
Maximum: 000 0001 1110 (bin) 30 (dec) (equivalent VIN_OFF voltage = 7.50V)  
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8.6.16 IOUT_CAL_OFFSET (39h)  
The IOUT_CAL_OFFSET is used to compensate for offset errors in the READ_IOUT results and the  
IOUT_OC_FAULT_LIMIT and IOUT_OC_WARN_LIMIT thresholds. The units are amperes. The default setting is  
0 A. The resolution of the argument for this command is 62.5 mA and the range is +3.9375 A to -4.0 A. Values  
written outside of this range alias into the supported range. This occurs because the read-only bits are fixed. The  
exponent is always –4 and the 5 msb bits of the Mantissa are always equal to the sign bit. The contents of this  
register can be stored to non-volatile memory using the STORE_DEFAULT_ALL command.  
COMMAND  
Format  
IOUT_CAL_OFFSET  
Linear, two's complement binary  
Bit Position  
Access  
7
r
6
r
5
4
r
3
r
2
r/wE  
1
r
0
r
7
r
6
r
5
r/wE  
4
r/wE  
3
r/wE  
2
r/wE  
1
r/wE  
0
r/wE  
r
Exponent  
1
Function  
Mantissa  
0
Default Value  
1
1
0
0
0
0
0
0
0
0
0
0
0
0
8.6.16.1 Exponent  
default: 11100 (bin) -4 (dec) (lsb=62.5mA)  
These default settings are not programmable.  
8.6.16.2 Mantissa  
MSB is programmable with sign, next 4 bits are sign extend only.  
Lower six bits are programmable with a default value of 0 (dec).  
8.6.17 VOUT_OV_FAULT_LIMIT (40h)  
The VOUT_OV_FAULT_LIMIT command sets the value of the output voltage that causes an output overvoltage  
fault. Attempts to write values outside of the acceptable range is treated as invalid data, causing the device to set  
the CML bit in the STATUS_BYTE and the invalid data (ivd) bit in the STATUS_CML registers as well as assert  
the SMBALERT signal. Additionally, the value of VOUT_OV_FAULT_LIMIT remains unchanged. Maintaining  
values within “acceptable range” also means:  
VOUT_OV_WARN_LIMIT < VOUT_OV_FAULT_LIMIT < (922d/VOUT_SCALE_LOOP)  
The contents of this register can be stored to non-volatile memory using the STORE_DEFAULT_ALL command.  
Note the lower 4 bits can not be backed up in EEPROM.  
The VOUT_OV_FAULT_LIMIT takes a two-byte data word formatted as shown below:  
COMMAND  
Format  
VOUT_OV_FAULT_LIMIT  
Linear, unsigned binary  
Bit Position  
Access  
7
r
6
r
5
r
4
r
3
2
1
0
7
6
r/wE  
5
r/wE  
4
r/wE  
3
2
1
0
r/wE r/wE r/wE r/wE  
r/wE  
Mantissa  
1
r/w  
r/w  
r/w  
r/w  
Function  
Default Value  
0
0
0
0
0
0
1
0
0
0
1
0
0
0
0
8.6.17.1 Exponent  
Value fixed at 10111, Exponent for Linear mode values is –9 (equivalent of 1.95mV/count, specified in  
VOUT_MODE command).  
8.6.17.2 Mantissa  
default: 0000 0010 1001 0000 (bin) 656 (dec) (equivalent OVF 1.281 V or 134.8% of 0.95 V default reference  
(VOUT_COMMAND))  
50  
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ZHCSDR8 MAY 2015  
NOTE  
Changing the VOUT_OV_FAULT_LIMIT (or Warn, or UV Fault, or Warn limit) during  
regulation causes a brief overshoot/undershoot on the output voltage. This is due to the  
Vref DAC being shared with OVUV DAC.  
8.6.18 VOUT_OV_FAULT_RESPONSE (41h)  
The VOUT_OV_FAULT_RESPONSE command instructs the device on what action to take in response to a  
VOUT_OV_FAULT_LIMIT fault. The device also:  
Sets the OVF bit in the STATUS_BYTE  
Sets the VFW bit in the STATUS_WORD  
Sets the OVF bit in the STATUS_VOUT register, and  
Notifies the host by asserting SMBALERT  
The contents of this register can be stored to non-volatile memory using the STORE_DEFAULT_ALL command.  
Bits [2:0] are hard-wired to 0x7 (111b) to indicate the 7 × TON_RISE time delay in response to a output  
overvoltage fault.  
The default response to a output overvoltage fault is to shut down and restart with 7 × TON_RISE time delay.  
COMMAND  
Format  
VOUT_OV_FAULT_RESPONSE  
Unsigned binary  
Bit Position  
Access  
7
r/wE  
RSP[1]  
1
6
r
5
r/wE  
RS[2]  
1
4
r/w  
3
r/w  
2
r
1
r
0
r
Function  
0
0
RS[1]  
1
RS[0]  
1
X
1
X
1
X
1
Default Value  
8.6.18.1 RSP[1]  
This bit sets the output voltage over voltage response to either ignore or not. Default is 1.  
0:  
The PMBus device continues operation without interruption. Note: In this “ignore” fault response  
mode, the associated fault status bits is set. Additionally, SMBALERT remains triggered if it is not  
masked.  
1:  
The PMBus device shuts down and restarts according to RS[2:0].  
8.6.18.2 RS[2:0]  
These bits are output voltage over voltage retry setting. Default is 111b.  
000: A zero value for the Retry Setting means that the unit does not attempt to restart. The output  
remains disabled until the fault is cleared (See section 10.7 of the PMBus spec.)  
111: A one value for the Retry Setting means that the unit goes through a normal startup (Soft start)  
continuously, without limitation, until it is commanded off or bias power is removed or another fault  
condition causes the unit to shutdown.  
Any value other than 000 or 111 is not accepted. Attempting to write any other value is rejected, causing  
the device to assert SMBALERT along with the CML bit in STATUS_BYTE and the invalid data bit in  
STATUS_CML. Note, that since all 3 bits must be the same, only one (bit 5) is stored in EEPROM.  
8.6.19 VOUT_OV_WARN_LIMIT (42h)  
The VOUT_OV_WARN_LIMIT command sets the value of the output voltage that causes an output overvoltage  
warning condtion. Attempts to write values outside of the acceptable range is treated as invalid data, causing the  
device to set the CML bit in the STATUS_BYTE and the invalid data (ivd) bit in the STATUS_CML registers as  
well as assert the SMBALERT signal. Additionally, the value of VOUT_OV_WARN_LIMIT remains unchanged.  
Maintaining values within “acceptable range” also means:  
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VOUT_COMMAND < VOUT_OV_WARN_LIMIT < VOUT_OV_FAULT_LIMIT  
269d < VOUT_OV_WARN_LIMIT × VOUT_SCALE_LOOP  
The device also:  
Sets the oth bit in the STATUS_BYTE  
Sets the VFW bit in the STATUS_WORD  
Sets the OVW bit in the STATUS_VOUT register, and  
Notifies the host by asserting SMBALERT  
The VOUT_OV_WARN_LIMIT takes a two-byte data word formatted as shown below:  
COMMAND  
Format  
VOUT_OV_WARN_LIMIT  
Linear, unsigned binary  
Bit Position  
Access  
7
r
6
r
5
r
4
r
3
2
1
0
7
6
5
4
3
2
1
0
r/w  
r/w  
r/w  
r/w  
r/w  
Mantissa  
0
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
Function  
Default Value  
0
0
0
0
0
0
1
0
1
1
0
0
1
1
1
8.6.19.1 Exponent  
Value fixed at 10111, Exponent for Linear mode values is –9 (equivalent of 1.95mV/count, specified in  
VOUT_MODE command).  
8.6.19.2 Mantissa  
default: 0000 0010 0110 0111 (bin) 615(dec) (equivalent OVW 1.201 V or 126.4% of 0.95 V default reference  
(VOUT_COMMAND))  
Note: The default VOUT_OV_WARN_LIMIT is calculated from the EEPROM backed OVF limit by:  
VOUT_OV_WARN_LIMIT = VOUT_OV_FAULT_LIMIT - VOUT_OV_FAULT_LIMIT/16  
If the calculated value for VOUT_OV_WARN_LIMIT violates the requirement that VOUT_COMMAND <  
VOUT_OV_WARN_LIMIT, then the VOUT_OV_WARN_LIMIT value is set to VOUT_OV_FAULT_LIMIT - 1 LSB.  
NOTE  
Changing the VOUT_OV_WARN_LIMIT (or Fault, or UV Fault, or Warn limit) during  
regulation causes a brief overshoot/undershoot on the output voltage. This is due to the  
Vref DAC being shared with OVUV DAC.  
8.6.20 VOUT_UV_WARN_LIMIT (43h)  
The VOUT_UV_WARN_LIMIT command sets the value of the output voltage that causes an output undervoltage  
warning condtion. This warning is masked until the unit reaches the programmed output voltage. This warning is  
also masked when the unit is disabled. Attempts to write values outside of the acceptable range is treated as  
invalid data, causing the device to set the CML bit in the STATUS_BYTE and the invalid data (ivd) bit in the  
STATUS_CML registers as well as assert the SMBALERT signal. Additionally, the value of  
VOUT_UV_WARN_LIMIT remains unchanged. Maintaining values within “acceptable range” also means:  
VOUT_UV_FAULT_LIMIT < VOUT_UV_WARN_LIMIT < VOUT_COMMAND  
178d < VOUT_UV_WARN_LIMIT × VOUT_SCALE_LOOP < 732d  
The device also:  
Sets the oth bit in the STATUS_BYTE  
Sets the VFW bit in the STATUS_WORD  
Sets the UVW bit in the STATUS_VOUT register, and  
Notifies the host by asserting SMBALERT  
The VOUT_UV_WARN_LIMIT takes a two-byte data word formatted as shown below:  
52  
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ZHCSDR8 MAY 2015  
COMMAND  
Format  
VOUT_UV_WARN_LIMIT  
Linear, unsigned binary  
Bit Position  
Access  
7
r
6
r
5
r
4
r
3
2
1
0
7
6
5
4
3
2
1
0
r/w  
r/w  
r/w  
r/w  
r/w  
Mantissa  
0
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
Function  
Default Value  
0
0
0
0
0
0
0
1
1
0
0
0
0
1
1
8.6.20.1 Exponent  
Value fixed at 10111, Exponent for Linear mode values is –9 (equivalent of 1.95mV/count, specified in  
VOUT_MODE command).  
8.6.20.2 Mantissa  
default: 0000 0001 0100 0011 (bin) 323(dec) (equivalent UVW 0.631 V or 66.4% of 0.95 V default reference  
(VOUT_COMMAND))  
Note: The default VOUT_UV_WARN_LIMIT is calculated from the EEPROM backed UVF limit by:  
VOUT_UV_WARN_LIMIT = VOUT_UV_FAULT_LIMIT + VOUT_UV_FAULT_LIMIT/16  
If the calculated value for VOUT_UV_WARN_LIMIT violates the requirement that VOUT_COMMAND >  
VOUT_UV_WARN_LIMIT, then the VOUT_UV_WARN_LIMIT value is set to VOUT_UV_FAULT_LIMIT (rounded)  
+ 1 LSB.  
For the case when VOUT_UV_FAULT_LIMIT = 0 (which indicates it is disabled), the VOUT_UV_WARN_LIMIT  
default shall be the minimum value for the configured VOUT_SCALE_LOOP (179d/VOUT_SCALE_LOOP).  
NOTE  
Changing the VOUT_UV_WARN_LIMIT (or Fault, or OV Fault, or Warn limit) during  
regulation causes a brief overshoot/undershoot on the output voltage. This is due to the  
Vref DAC being shared with OVUV DAC.  
8.6.21 VOUT_UV_FAULT_LIMIT (44h)  
The VOUT_UV_FAULT_LIMIT command sets the value of the output voltage that causes an output undervoltage  
fault. This fault is masked until the unit reaches the programmed output voltage. This fault is also masked when  
the unit is disabled. Attempts to write values outside of the acceptable range is treated as invalid data, causing  
the device to set the CML bit in the STATUS_BYTE and the invalid data (ivd) bit in the STATUS_CML registers  
as well as assert the SMBALERT signal. Additionally, the value of VOUT_UV_FAULT_LIMIT remains  
unchanged. Maintaining values within “acceptable range” also means:  
176d/VOUT_SCALE_LOOP < VOUT_UV_FAULT_LIMIT < VOUT_UV_WARN_LIMIT  
A VOUT_UV_FAULT_LIMIT of 0000h shall be a means of disabling VOUT_UV_FAULT response and reporting  
completely and is the only exception to the above “acceptable range” requirements. Disabling means that the unit  
does not check for Vout_UVF faults; thus there is no setting of UVF status bits, nor associated SMBALERT  
triggering. Disabling VOUT_UV_FAULT_LIMIT (by setting it to 0000h) has no bearing on  
VOUT_UV_WARN_LIMIT checking – which is considered a completely separate function.  
The contents of this register can be stored to non-volatile memory using the STORE_DEFAULT_ALL command.  
Note the lower 4 bits can not be backed up in EEPROM.  
The VOUT_UV_FAULT_LIMIT takes a two-byte data word formatted as shown below:  
COMMAND  
Format  
VOUT_UV_FAULT_LIMIT  
Linear, unsigned binary  
Bit Position  
Access  
7
r
6
r
5
r
4
r
3
2
1
0
7
6
r/wE  
5
r/wE  
4
r/wE  
3
2
1
0
r/wE r/wE r/wE r/wE  
r/wE  
Mantissa  
0
r/w  
r/w  
r/w  
r/w  
Function  
Default Value  
0
0
0
0
0
0
0
1
0
1
1
0
0
0
0
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8.6.21.1 Exponent  
Value fixed at 10111, Exponent for Linear mode values is –9 (equivalent of 1.95mV/count, specified in  
VOUT_MODE command).  
8.6.21.2 Mantissa  
default: 0000 0001 0011 0000 (bin) 304(dec) (equivalent UVW 0.594 V or 62.5% of 0.95 V default reference  
(VOUT_COMMAND))  
NOTE  
Changing the VOUT_UV_FAULT_LIMIT (or Warn, or OV Fault, or Warn limit) during  
regulation causes a brief overshoot/undershoot on the output voltage. This is due to  
the Vref DAC being shared with OVUV DAC.  
Since the output undervoltage fault detection is masked until the unit reaches the  
programmed output voltage, if the output voltage did not reach the programmed value  
during the soft start time UPPER limit required by TON_MAX_FAULT_LIMIT, the  
device  
asserts  
a
TON_MAX  
fault  
and  
reponse  
according  
to  
TON_MAX_FAULT_RESPONSE instead of VOUT_UV_FAULT_RESPONSE  
8.6.22 VOUT_UV_FAULT_RESPONSE (45h)  
The VOUT_UV_FAULT_RESPONSE command instructs the device on what action to take in response to a  
VOUT_UV_FAULT_LIMIT fault. The device also:  
Sets the oth bit in the STATUS_BYTE  
Sets the VFW bit in the STATUS_WORD  
Sets the UVF bit in the STATUS_VOUT register, and  
Notifies the host by asserting SMBALERT  
The contents of this register can be stored to non-volatile memory using the STORE_DEFAULT_ALL command.  
Bits [2:0] are hard-wired to 0x7 (111b) to indicate the 7 × TON_RISE time delay in response to a output  
undervoltage fault.  
The default response to a output undervoltage fault is to shut down and restart with 7 × TON_RISE time delay.  
COMMAND  
Format  
VOUT_UV_FAULT_RESPONSE  
Unsigned binary  
Bit Position  
Access  
7
r/wE  
RSP[1]  
1
6
r
5
r/wE  
RS[2]  
1
4
r/w  
3
r/w  
2
r
1
r
0
r
Function  
0
0
RS[1]  
1
RS[0]  
1
X
1
X
1
X
1
Default Value  
8.6.22.1 RSP[1]  
This bit sets the output voltage under voltage response to either ignore or not. Default is 1.  
0:  
The PMBus device continues operation without interruption. Note: In this “ignore” fault response  
mode, the associated fault status bits are set. Additionally, SMBALERT continues to be triggered if  
it is not masked.  
1:  
The PMBus device shuts down and restarts according to RS[2:0].  
8.6.22.2 RS[2:0]  
These bits are output voltage under voltage retry setting. Default is 111b.  
000: A zero value for the Retry Setting means that the unit does not attempt to restart. The output  
remains disabled until the fault is cleared (See section 10.7 of the PMBus spec.)  
54  
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111: A one value for the Retry Setting means that the unit goes through a normal startup (Soft start)  
continuously, without limitation, until it is commanded off or bias power is removed or another fault  
condition causes the unit to shutdown.  
Any value other than 000 or 111 is not accepted. Attempting to write any other value is rejected, causing  
the device to assert SMBALERT along with the CML bit in STATUS_BYTE and the invalid data bit in  
STATUS_CML. Note, that since all 3 bits must be the same, only one (bit 5) is stored in EEPROM.  
8.6.23 IOUT_OC_FAULT_LIMIT (46h)  
The IOUT_OC_FAULT_LIMIT command sets the value of the output current, in amperes, that causes the  
overcurrent detector to indicate an overcurrent fault condition. The IOUT_OC_FAULT_LIMIT should be set equal  
to or greater than the IOUT_OC_WARN_LIMIT. Writing a value to IOUT_OC_FAULT_LIMIT less than  
IOUT_OC_WARN_LIMIT causes the device to set the CML bit in the STATUS_BYTE and the invalid data (ivd)  
bit in the STATUS_CML registers as well as assert the SMBALERT signal. The contents of this register can be  
stored to non-volatile memory using the STORE_DEFAULT_ALL command.  
The IOUT_OC_FAULT_LIMIT takes a two-byte data word formatted as shown below:  
COMMAND  
Format  
IOUT_OC_FAULT_LIMIT  
Linear, two's complement binary  
Bit Position  
Access  
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
r/wE  
5
r/wE  
4
r/wE  
3
r/wE  
2
r/wE  
1
r/wE  
0
r/wE  
r
Function  
Exponent  
Mantissa  
Default Value  
See Below  
8.6.23.1 Exponent  
default: 11111 (bin) -1 (dec) (0.5 amps)  
These default settings are not programmable.  
8.6.23.2 Mantissa  
The upper four bits are fixed at 0.  
The lower seven bits are programmable.  
The actual output current for a given mantissa and exponent is shown in Equation 6.  
Mantissa  
=
IOUT(oc) = Mantissa´ 2Exponent  
2
(6)  
The default values and allowable ranges for each device are summarized below:  
OC_FAULT_LIMIT  
DEVICE  
UNIT  
MIN  
DEFAULT  
MAX  
40  
TPS544C25  
TPS544B25  
5
5
36  
24  
A
A
36  
8.6.24 IOUT_OC_FAULT_RESPONSE (47h)  
The IOUT_OC_FAULT_RESPONSE command instructs the device on what action to take in response to an  
IOUT_OC_FAULT_LIMIT or a VOUT undervoltage (UV) fault. The device also:  
Sets the OCF bit in the STATUS_BYTE  
Sets the OCFW bit in the STATUS_WORD  
Sets the OCF bit in the STATUS_IOUT register, and  
Notifies the host by asserting SMBALERT  
The contents of this register can be stored to non-volatile memory using the STORE_DEFAULT_ALL command.  
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Bits [2:0] are hard-wired to 0x7 (111b) to indicate the 7 × TON_RISE time delay in response to an over current  
fault.  
The default response to an over current fault is to shut down and restart with 7 × TON_RISE time delay.  
COMMAND  
Format  
IOUT_OC_FAULT_RESPONSE  
Unsigned binary  
Bit Position  
Access  
7
r/wE  
RSP[1]  
1
6
r
5
r/wE  
RS[2]  
1
4
r/w  
3
r/w  
2
r
1
r
0
r
Function  
0
0
RS[1]  
1
RS[0]  
1
X
1
X
1
X
1
Default Value  
8.6.24.1 RSP[1]  
This bit sets the over current fault response to either ignore or not. Default is 1.  
0:  
The PMBus device continues operation without interruption. Note: In this “ignore” fault response  
mode, the associated fault status bits are set. Additionally, SMBALERT continues to be triggered if  
it is not masked.  
1:  
The PMBus device shuts down and restarts according to RS[2:0].  
8.6.24.2 RS[2:0]  
These bits are over current fault retry setting. Default is 111b.  
000: A zero value for the Retry Setting means that the unit does not attempt to restart. The output  
remains disabled until the fault is cleared (See section 10.7 of the PMBus spec.)  
111: A one value for the Retry Setting means that the unit goes through a normal startup (soft-start)  
continuously, without limitation, until it is commanded off or bias power is removed or another fault  
condition causes the unit to shutdown.  
Any value other than 000 or 111 is not accepted. Attempting to write any other value is rejected, causing  
the device to assert SMBALERT along with the CML bit in STATUS_BYTE and the invalid data bit in  
STATUS_CML. Note, that since all 3 bits must be the same, only one (bit 5) is stored in EEPROM.  
8.6.25 IOUT_OC_WARN_LIMIT (4Ah)  
The IOUT_OC_WARN_LIMIT command sets the value of the output current, in amperes, that causes the over-  
current detector to indicate an over-current warning. When this current level is exceeded the device:  
Sets the oth bit in the STATUS_BYTE  
Sets the OCFW bit in the STATUS_WORD  
Sets the OCW bit in the STATUS_IOUT register, and  
Notifies the host by asserting SMBALERT  
The IOUT_OC_WARN_LIMIT threshold should always be set to less than or equal to the  
IOUT_OC_FAULT_LIMIT. Writing a value to IOUT_OC_WARN_LIMIT greater than IOUT_OC_FAULT_LIMIT  
causes the device to set the CML bit in the STATUS_BYTE and the invalid data (ivd) bit in the STATUS_CML  
registers as well as assert the SMBALERT signal.  
The default IOUT_OC_WARN_LIMIT is always set to fixed, relative IOUT_OC_FAULT_LIMIT - 2 A. Since the  
IOUT_OC_WARN_LIMIT is not stored in EEPROM, the IOUT_OC_WARN_LIMIT register is set to 2 A less than  
the stored IOUT_OC_FAULT_LIMIT upon any RESTORE from EEPROM.  
The IOUT_OC_WARN_LIMIT takes a two byte data word formatted as shown below:  
COMMAND  
Format  
Bit Position  
IOUT_OC_WARN_LIMIT  
Linear, two's complement binary  
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
56  
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COMMAND  
Access  
IOUT_OC_WARN_LIMIT  
r/w  
r
r
r
r
r
r
r
r
r
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
Function  
Exponent  
Mantissa  
Default Value  
See Below  
8.6.25.1 Exponent  
default: 11111 (bin) -1 (dec) (0.5 amps)  
These default settings are not programmable.  
8.6.25.2 Mantissa  
The upper four bits are fixed at 0.  
Lower seven bits are programmable.  
The actual output warning current level for a given mantissa and exponent is:  
-°Æ¥©≥≥°  
)
= -°Æ¥©≥≥° × 2%∏∞ØÆ•Æ¥  
=
/54 (/#7 ꢀ  
2
(7)  
The default values and allowable ranges for each device are summarized below:  
OC_WARN_LIMIT  
DEVICE  
UNIT  
MIN  
4
DEFAULT  
MAX  
TPS544C25  
TPS544B25  
34  
22  
39.5  
35.5  
A
4
8.6.26 OT_FAULT_LIMIT (4Fh)  
The OT_FAULT_LIMIT command sets the value of the temperature, in degrees Celsius, that causes an over-  
temperature fault condition, when the sensed temperature from the external sensor exceeds this limit.  
The OT_FAULT_LIMIT must always be greater than the OT_WARN_LIMIT. Writing a value to OT_FAULT_LIMIT  
less than or equal to OT_WARN_LIMIT causes the device to set the CML bit in the STATUS_BYTE and the  
invalid data (ivd) bit in the STATUS_CML registers as well as asserts the SMBALERT signal. The contents of  
this register can be stored to non-volatile memory using the STORE_DEFAULT_ALL command.  
The OT_FAULT_LIMIT takes a two byte data word formatted as shown below.  
COMMAND  
Format  
OT_FAULT_LIMIT  
Linear, two's complement binary  
Bit Position  
Access  
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r/wE  
6
r/wE  
5
r/wE  
4
r/wE  
3
r/wE  
2
r/wE  
1
r/wE  
0
r/wE  
r
Exponent  
0
Function  
Mantissa  
1
Default Value  
0
0
0
0
0
0
0
0
1
1
1
1
0
1
8.6.26.1 Exponent  
default: 00000 (bin) 0 (dec) (represents mantissa with steps of 1 degree Celcius)  
These default settings are not programmable.  
8.6.26.2 Mantissa  
default: 000 0111 1101 (bin) 125 (dec) (125 °C)  
Minimum : 000 0111 1000 (bin) (equivalent OTF = 120 °C)  
Maximum: 000 1010 0101 (bin) (equivalent OTF = 165 °C)  
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8.6.27 OT_FAULT_RESPONSE (50h)  
The OT_FAULT_RESPONSE command instructs the device on what action to take in response to an  
OT_FAULT_LIMIT. The device also:  
Sets the OTFW bit in the STATUS_BYTE  
Sets the OTF bit in the STATUS_TEMPERATURE  
Notifies the host by asserting SMBALERT  
Once the over-temperature fault is tripped, the fault flag is latched until the external sensed temperature falls  
20°C from the OT_FAULT_LIMIT.  
The contents of this register can be stored to non-volatile memory using the STORE_DEFAULT_ALL command.  
Bits [2:0] are hard-wired to 0x7 (111b) to indicate the 7 × TON_RISE time delay in response to an over  
temperature fault.  
The default response to an over current fault is to shut down and restart with 7 × TON_RISE time delay.  
COMMAND  
Format  
OT_FAULT_RESPONSE  
Unsigned binary  
Bit Position  
Access  
7
r/wE  
RSP[1]  
1
6
r
5
r/wE  
RS[2]  
1
4
r/w  
3
r/w  
2
r
1
r
0
r
Function  
0
0
RS[1]  
1
RS[0]  
1
X
1
X
1
X
1
Default Value  
8.6.27.1 RSP[1]  
This bit sets the over temperature fault response to either ignore or not. Default is 1.  
0:  
The PMBus device continues operation without interruption. Note: In this “ignore” fault response  
mode, the associated fault status bits are set. Additionally, SMBALERT continues to be triggered if  
it is not masked.  
1:  
The PMBus device shuts down and restarts according to RS[2:0].  
8.6.27.2 RS[2:0]  
These bits are over temperature fault retry setting. Default is 111b.  
000: A zero value for the Retry Setting means that the unit does not attempt to restart. The output  
remains disabled until the fault is cleared (See section 10.7 of the PMBus spec.)  
111: A one value for the Retry Setting means that the unit goes through a normal startup (Soft start)  
continuously, without limitation, until it is commanded off or bias power is removed or another fault  
condition causes the unit to shutdown.  
Any value other than 000 or 111 is not accepted. Attempting to write any other value is rejected, causing  
the device to assert SMBALERT along with the CML bit in STATUS_BYTE and the invalid data bit in  
STATUS_CML. Note, that since all 3 bits must be the same, only one (bit 5) is stored in EEPROM.  
NOTE  
The programmed response here is also applied to internally detected Over Temperture  
faults – with the one exception of the “ignore” response. Internal OT faults are never  
ignored. Internal OT faults always respond in a shutdown and attempted re-start once the  
part cools.  
8.6.28 OT_WARN_LIMIT (51h)  
The OT_ WARN _LIMIT command sets the value of the temperature, in degrees Celsius, that causes an over-  
temperature warning condition, when the sensed temperature from the external sensor exceeds this limit. Upon  
triggering the over-temperature warning, the device takes the following actions:  
58  
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Sets the TEMPERATURE bit in the STATUS_BYTE  
Sets the OT Warning bit in the STATUS_TEMPERATURE  
Notifies the host by asserting SMBALERT  
Once the over-temperature warning is tripped, the warning flag is latched until the external sensed temperature  
falls 20°C from the OT_WARN_LIMIT.  
The OT_WARN_LIMIT must always be less than the OT_FAULT_LIMIT. Writing a value to OT_WARN_LIMIT  
greater than or equal to OT_FAULT_LIMIT causes the device to set the CML bit in the STATUS_BYTE and the  
invalid data (ivd) bit in the STATUS_CML registers as well as assert the SMBALERT signal.  
The default OT_WARN_LIMIT is mathematically derived from the EEPROM backed OTF limit by subtracting 25  
from (4Fh) OT_FAULT_LIMIT to reach the default OT_WARN_LIMIT. If the calculated OTW is less than 100 °C,  
then the default value is set to 100 °C. OTW=max(OTF-25, 100)  
The OT_WARN_LIMIT takes a two byte data word formatted as shown below:  
COMMAND  
Format  
OT_WARN_LIMIT  
Unsigned binary  
Bit Position  
Access  
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
6
5
r/w  
4
3
2
1
0
r
Exponent  
0
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
Function  
Mantissa  
1
Default Value  
0
0
0
0
0
0
0
0
1
1
0
1
0
0
8.6.28.1 Exponent  
default: 00000 (bin) 0 (dec) (represents mantissa with steps of 1 degree Celcius)  
These default settings are not programmable.  
8.6.28.2 Mantissa  
default: 000 0110 0100 (bin) 100 (dec) (100 °C) 25°C less than default OTF  
Minimum : 000 0110 0100 (bin) (equivalent OTF = 100°C)  
Maximum: 000 1000 1100 (bin) (equivalent OTF = 140°C)  
8.6.29 TON_DELAY (60h)  
The TON_DELAY command sets the time in milliseconds, from when a start condition is received to when the  
output voltage starts to rise. The contents of this register can be stored to non-volatile memory using the  
STORE_DEFAULT_ALL command.  
The TON_DELAY command is formatted as a linear mode two’s complement binary integer.  
COMMAND  
Format  
TON_DELAY  
Linear, two's complement binary  
Bit Position  
Access  
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
r/wE  
5
r/wE  
4
r/wE  
3
r/wE  
2
r/wE  
1
r/wE  
0
r/wE  
r
Exponent  
0
Function  
Mantissa  
0
Default Value  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
8.6.29.1 Exponent  
default: 00000 (bin) 0 (dec) (1 millisecond)  
These default settings are not programmable.  
8.6.29.2 Mantissa  
The upper four bits are fixed at 0. The lower seven bits are programmable with a default value of 000 0000 0000  
(bin) (0 ms).  
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Only 16 fixed TON_DELAY times are available in the device. As such, the range of programmed TON_DELAY  
settings are sub-divided into 16 “buckets” that then selects one of the 16 supported times. Programmed values  
are rounded to the nearest “bucket/transition rate” as outlined in the table Supported TON_DELAY Values:  
Table 11. Supported TON_DELAY Values  
EFFECTIVE  
TON_DELAY  
(ms)  
PROGRAMMED TON_DELAY MANTISSA (dec)  
Greater than  
Less than or equal to  
0 (50 us)  
0
1
1
2
0
1
2
3
2
3
4
3
4
5
4
5
6
5
6
7
6
9
10  
14  
19  
27  
37  
52  
72  
100  
9
12  
17  
22  
32  
44  
62  
86  
12  
17  
22  
32  
44  
62  
86  
8.6.30 TON_RISE (61h)  
The TON_RISE command sets the time in milliseconds, from when the reference starts to rise until the voltage  
has entered the regulation band. The contents of this register can be stored to non-volatile memory using the  
STORE_DEFAULT_ALL command.  
Programming a value of 0 instructs the unit to bring its output voltage to the programmed regulation value as  
quickly as possible. For TPS544x25, this results in an effective TON_RISE time of 1ms (fastest time supported).  
If the Soft-Start Detection feature is being used (bit in MFR_??), then the Mantissa value decoded or derived by  
from the appropriate SS resistor writes into the TON_RISE register as the initial default. Note: This write  
overwrites any value restored from the EEPROM restore operation at initial power-up.  
TON_RISE should always be set less than the TON_MAX_FAULT_LIMIT. Attempting to write a value to  
TON_RISE greater than TON_MAX_FAULT_LIMIT is not accepted and causes the device to set the ’cml’ bit in  
the STATUS_BYTE and the ‘ivd’ bit in the STATUS_CML registers and asserts the SMBALERT signal.  
There is one exception to this rule: when TON_MAX_FAULT_LIMIT is set to 0. This indicates that the  
TON_MAX_FAULT timer is disabled, which means that there is no limit and that the unit can attempt to bring up  
the output voltage indefinitely. If TON_MAX_FAULT_LIMIT = 0 (disabled), the relational cross check against  
TON_MAX_FAULT_LIMIT is also disabled.  
The TON_RISE command is formatted as a linear mode two’s complement binary integer.  
COMMAND  
Format  
TON_RISE  
Linear, two's complement binary  
Bit Position  
Access  
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
r/wE  
5
r/wE  
4
r/wE  
3
r/wE  
2
r/wE  
1
r/wE  
0
r/wE  
r
Exponent  
0
Function  
Mantissa  
0
Default Value  
0
0
0
0
0
0
0
0
0
0
0
1
0
1
60  
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TPS544C25, TPS544B25  
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8.6.30.1 Exponent  
default: 00000 (bin) 0 (dec) (1 millisecond)  
These default settings are not programmable.  
8.6.30.2 Mantissa  
The upper four bits are fixed at 0. The lower seven bits are programmable with a default value of 000 0000 0101  
(bin) (5 ms).  
The supported TON_RISE times over PMBus are shown in Table 12:  
Table 12. Supported TON_RISE Values  
Effective  
Programmed TON_RISE Mantissa (d)  
TON_RISE (ms)  
Greater than  
Less than or equal to  
1
2
1
2
1
2
3
3
4
3
4
5
4
5
6
5
6
7
6
9
10  
14  
19  
27  
37  
52  
72  
100  
9
12  
17  
22  
32  
44  
62  
86  
12  
17  
22  
32  
44  
62  
86  
8.6.31 TON_MAX_FAULT_LIMIT (62h)  
The TON_MAX_FAULT_LIMIT command sets an UPPER limt in milliseconds, on how long the unit can attempt  
to power up the output without reaching the output undervoltage fault limit. The time begins counting as soon as  
the device enters the soft-start state begins to ramp the output. In other words, the TON_MAX_FAULT_LIMIT  
timer starts at the beginning of the TON_RISE state.  
The TON_MAX_FAULT_LIMIT should always be set greater than the TON_RISE. Attempting to write a value to  
TON_MAX_FAULT_LIMIT less than TON_RISE is not accepted and causes the device to set the ’cml’ bit in the  
STATUS_BYTE and the ‘ivd’ bit in the STATUS_CML registers and asserts the SMBALERT signal.  
There is one exception to this rule: when TON_MAX_FAULT_LIMIT is set to 0. This setting indicates that the  
TON_MAX_FAULT timer is disabled, which means that there is no limit and that the unit can attempt to bring up  
the output voltage indefinitely. If TON_MAX_FAULT_LIMIT = 0 (disabled), the relational cross check against  
TON_MAX_FAULT_LIMIT is also disabled.  
The TON_MAX_FAULT_LIMIT command is formatted as a linear mode two’s complement binary integer.  
COMMAND  
Format  
TON_MAX_FAULT_LIMIT  
Linear, two's complement binary  
Bit Position  
Access  
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
5
4
3
2
1
0
r
Exponent  
0
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
Function  
Mantissa  
1
Default Value  
0
0
0
0
0
0
0
0
1
0
0
1
0
0
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8.6.31.1 Exponent  
default: 00000 (bin) 0 (dec) (1 millisecond)  
These default settings are not programmable.  
8.6.31.2 Mantissa  
The upper four bits are fixed at 0. The lower seven bits are programmable with a default value of 000 0110 0100  
(bin) (100 ms).  
Even though this register is not EEPROM backed, a RESTORE_DEFAULT_ALL command causes the  
TON_MAX_FAULT_LIMIT to restore to the default 100 ms value.  
The supported TON_MAX_FAULT_LIMIT times over PMBus are shown in Supported TON_MAX_FAULT_LIMIT  
Values:  
Table 13. Supported TON_MAX_FAULT_LIMIT Values  
Effective  
TON_MAX_FAUL  
T_LIMIT (ms)  
Programmed TON_MAX_FAULT_LIMIT Mantissa (d)  
Greater than  
Less than or equal to  
No Limit (timer  
disabled)  
0
1
2
0
1
1
2
3
2
3
4
3
4
5
4
5
6
5
6
7
6
9
10  
14  
19  
27  
37  
52  
72  
100  
9
12  
17  
22  
32  
44  
62  
86  
12  
17  
22  
32  
44  
62  
86  
8.6.32 TON_MAX_FAULT_RESPONSE (63h)  
The TON_MAX_FAULT_RESPONSE command instructs the device on what action to take in response to an  
TON_MAX_FAULT_LIMIT.  
The device also:  
Sets the oth bit in the STATUS_BYTE  
Sets the VFW bit in the STATUS_WORD  
Sets the TONMAXF bit in the STATUS_VOUT register, and  
Notifies the host by asserting SMBALERT  
The contents of this register can be stored to non-volatile memory using the STORE_DEFAULT_ALL command.  
Bits [2:0] are hard-wired to 0x7 (111b) to indicate the 7 × TON_RISE time delay in response to a  
TON_MAX_FAULT.  
The default response to a TON_MAX_FAULT is to shut down and restart with 7 × TON_RISE time delay.  
62  
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COMMAND  
Format  
TON_MAX_FAULT_RESPONSE  
Unsigned binary  
Bit Position  
Access  
7
r/wE  
RSP[1]  
1
6
r
5
r/wE  
RS[2]  
1
4
r/w  
3
r/w  
2
r
1
r
0
r
Function  
0
0
RS[1]  
1
RS[0]  
1
X
1
X
1
X
1
Default Value  
8.6.32.1 RSP[1]  
This bit sets the TON_MAX_FAULT response to either ignore or not. Default is 1.  
0:  
The PMBus device continues operation without interruption. Note: In this “ignore” fault response  
mode, the associated fault status bits are set. Additionally, SMBALERT continues to be triggered if  
it is not masked.  
1:  
The PMBus device shuts down and restarts according to RS[2:0].  
8.6.32.2 RS[2:0]  
These bits are TON_MAX_FAULT retry setting. Default is 111b.  
000: A zero value for the Retry Setting means that the unit does not attempt to restart. The output  
remains disabled until the fault is cleared (See section 10.7 of the PMBus spec.)  
111: A one value for the Retry Setting means that the unit goes through a normal startup (Soft start)  
continuously, without limitation, until it is commanded off or bias power is removed or another fault  
condition causes the unit to shutdown.  
Any value other than 000 or 111 is not accepted. Attempting to write any other value is rejected, causing  
the device to assert SMBALERT along with the CML bit in STATUS_BYTE and the invalid data bit in  
STATUS_CML. Note, that since all 3 bits must be the same, only one (bit 5) is stored in EEPROM.  
8.6.33 TOFF_DELAY (64h)  
The TOFF_DELAY command sets the time in milliseconds, from when a stop condition is received and when the  
output voltage starts to fall. The contents of this register can be stored to non-volatile memory using the  
STORE_DEFAULT_ALL command.  
The TOFF_DELAY command is formatted as a linear mode two’s complement binary integer.  
COMMAND  
Format  
TOFF_DELAY  
Linear, two's complement binary  
Bit Position  
Access  
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
r/wE  
5
r/wE  
4
r/wE  
3
r/wE  
2
r/wE  
1
r/wE  
0
r/wE  
r
Exponent  
0
Function  
Mantissa  
0
Default Value  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
8.6.33.1 Exponent  
default: 00000 (bin) 0 (dec) (1 millisecond)  
These default settings are not programmable.  
8.6.33.2 Mantissa  
The upper four bits are fixed at 0. The lower seven bits are programmable with a default value of 000 0000 0000  
(bin) (0 ms).  
Only 16 fixed TOFF_DELAY times are available in the device. As such, the range of programmed TOFF_DELAY  
settings are sub-divided into 16 “buckets” that then selects one of the 16 supported times. Programmed values  
are rounded to the nearest “bucket/transition rate” as outlined in the table Supported TOFF_DELAY Values:  
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Table 14. Supported TOFF_DELAY Values  
EFFECTIVE  
TOFF_DELAY  
(ms)  
PROGRAMMED TOFF_DELAY MANTISSA (dec)  
Greater than  
Less than or equal to  
0
1
0
1
0
1
2
2
3
2
3
4
3
4
5
4
5
6
5
6
7
6
9
10  
14  
19  
27  
37  
52  
72  
100  
9
12  
17  
22  
32  
44  
62  
86  
12  
17  
22  
32  
44  
62  
86  
8.6.34 TOFF_FALL (65h)  
The TOFF_FALL command sets the time in ms, from the end of the TOFF_DELAY time until the voltage reaches  
0 V. The contents of this register can be stored to non-volatile memory using the STORE_DEFAULT_ALL  
command.  
Programming a value of 0 instructs the unit to bring its output voltage down to 0 as quickly as possible. For  
TPS544x25, this results in actively ramping down the output voltage in 1 ms (the fastest supported ramp down).  
The TOFF_FALL command is formatted as a linear mode two’s complement binary integer.  
COMMAND  
Format  
TOFF_FALL  
Linear, two's complement binary  
Bit Position  
Access  
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
r/wE  
5
r/wE  
4
r/wE  
3
r/wE  
2
r/wE  
1
r/wE  
0
r/wE  
r
Exponent  
0
Function  
Mantissa  
0
Default Value  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
8.6.34.1 Exponent  
default: 00000 (bin) 0 (dec) (1 millisecond)  
These default settings are not programmable.  
8.6.34.2 Mantissa  
The upper four bits are fixed at 0. The lower seven bits are programmable with a default value of 000 0000 0000  
(bin) (0 ms).  
The supported TOFF_FALL times over PMBus are shown in Supported TOFF_FALL Values:  
Table 15. Supported TOFF_FALL Values  
Effective  
Programmed TOFF_FALL Mantissa (d)  
TOFF_FALL (ms)  
Greater than  
Less than or equal to  
64  
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Table 15. Supported TOFF_FALL Values (continued)  
Effective  
TOFF_FALL (ms)  
Programmed TOFF_FALL Mantissa (d)  
1
2
1
1
2
2
3
3
4
3
4
5
4
5
6
5
6
7
6
9
10  
14  
19  
27  
37  
52  
72  
100  
9
12  
17  
22  
32  
44  
62  
86  
12  
17  
22  
32  
44  
62  
86  
8.6.35 STATUS_BYTE (78h)  
The STATUS_BYTE command returns one byte of information with a summary of the most critical device faults.  
COMMAND  
Format  
STATUS_BYTE  
Unsigned binary  
Bit Position  
Access  
7
r
6
r
5
r
4
r
3
r
2
1
r
0
r
r
OTFW  
0
Function  
X
0
OFF  
X
OVF  
0
OCF  
0
X
0
CML  
0
oth  
1
Default Value  
A "1" in any of these bit positions indicates that:  
OFF:  
The device is not providing power to the output, regardless of the reason. In this family of devices,  
this flag means that the converter is not enabled.  
OVF:  
OCF:  
An output overvoltage fault has occurred. This bit directly reflects the state of STATUS_VOUT[7] –  
OVF. If the user wants this fault sourc to be masked and not trigger SMBALERT, they must do it by  
masking STATUS_VOUT[7]. Per the PMBus v1.2 spec sections 10.2.4 and 10.2.5, this bit is not  
clearable via a PMBus write. In contast, the bit is to be cleared by clearing the bit(s) in  
STATUS_VOUT that cause this bit to be set.  
An output over current fault has occurred. This bit directly reflect the state of STATUS_IOUT[7] –  
OCF. If the user wants this fault sourced to be masked and not trigger SMBALERT, they must do it  
by masking STATUS_IOUT[7]. Per the PMBus v1.2 spec sections 10.2.4 and 10.2.5, this bit is not  
clearable via a PMBus write. In contrast, the bit is to be cleared by clearing the bit(s) in  
STATUS_IOUT that cause this bit to be set.  
OTFW:  
A temperature fault or warning has occurred. Check STATUS_TEMPERATURE. Per the PMBus  
v1.2 spec sections 10.2.4 and 10.2.5, this bit is not clearable via a PMBus write. In contast, the bit is  
to be cleared by clearing the bit(s) in STATUS_TEMPERATURE that cause this bit to be set.  
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CML:  
A Communications, Memory or Logic fault has occurred. Check STATUS_CML. Per the PMBus v1.2  
spec sections 10.2.4 and 10.2.5, this bit is not clearable via a PMBus write. In contast, the bit is to  
be cleared by clearing the bit(s) in STATUS_CML that cause this bit to be set.  
oth:  
A fault or warning not listed through bits 1-7 has occurred, for example an undervoltage condition or  
an over current warning condition. Check other status registers. Per the PMBus v1.2 spec sections  
10.2.4 and 10.2.5, this bit is not clearable via a PMBus write. In contast, the bit is to be cleared by  
clearing the bit(s) in STATUS_VOUT and STATUS_IOUT that cause this bit to be set. The default  
for this bit is 1 because the default of STATUS_INPUT[3] LOW_Vin defaulting to 1.  
8.6.36 STATUS_WORD (79h)  
The STATUS_WORD command returns two bytes of information with a summary of the device fault and warning  
conditions. The low byte is identical to the STATUS_BYTE above. The additional byte reports the warning  
conditions for output overvoltage and overcurrent, as well as the power good status of the converter.  
COMMAND  
Format  
STATUS_WORD (low byte) = STATUS_BYTE  
Unsigned binary  
Bit Position  
Access  
7
r
6
r
5
r
4
r
3
r
2
1
r
0
r
r
OTFW  
0
Function  
X
0
OFF  
X
OVF  
0
OCF  
0
x
0
CML  
0
oth  
1
Default Value  
COMMAND  
STATUS_WORD (high byte)  
Format  
Unsigned binary  
Bit Position  
Access  
7
r
6
r
5
4
r
3
2
r
1
r
0
r
r
INPUT  
X
rE  
PGOOD_Z  
X
Function  
VFW  
0
OCFW  
0
MFR  
X
0
X
0
X
0
Default Value  
0
A "1" in any of the high byte bit positions indicates that:  
VFW:  
An output voltage fault or warning has occurred (OVF or OVW or UVW or UVF or  
VOUT_MAX_Warning or TONMAXF). Check STATUS_VOUT. Per the PMBus v1.2 spec sections  
10.2.4 and 10.2.5, this bit is not clearable via a PMBus write. In contast, the bit is to be cleared by  
clearing the bit(s) in STATUS_VOUT that cause this bit to be set.  
OCFW:  
An output current warning or fault has occurred (OCF or OCW). Check STATUS_IOUT. Per the  
PMBus v1.2 spec sections 10.2.4 and 10.2.5, this bit is not clearable via a PMBus write. In contast,  
the bit is to be cleared by clearing the bit(s) in STATUS_IOUT that cause this bit to be set.  
INPUT:  
INPUT fault or warning in STATUS_INPUT is present. Check STATUS_INPUT. Per the PMBus v1.2  
spec sections 10.2.4 and 10.2.5, this bit is not clearable via a PMBus write. In contast, the bit is to  
be cleared by clearing the bit(s) in STATUS_INPUT that cause this bit to be set.  
MFR:  
An manufacturer specific fault/warning condition has occurred (Internal over temperature fault or  
VOUT_MIN_Warning). Check STATUS_MFR_SPECIFIC. Per the PMBus v1.2 spec sections 10.2.4  
and 10.2.5, this bit is not clearable via a PMBus write. In contast, the bit is to be cleared by clearing  
the bit(s) in STATUS_MFR_SPECIFIC that cause this bit to be set.  
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PGOOD_Z:  
Power is Not Good, and the following condition is present: output over or under voltage warning or  
fault, TON_MAX_FAULT, over temperature warning or fault, over current warning or fault,  
insufficient input voltage. Please refer to the FAULT RESPONSE table for the possible sources to  
trigger PGOOD_Z. The signal is unlatched and always represents the current state of the device.  
Unless masked, it triggers SMBALERT; however, the default for this mask bit is 1, indicating that  
PGOOD_z cannot trigger SMBALERT by default. The user must clear the associated  
SMBALERT_MASK bit if SMBALERT triggering is desired for this condition.  
8.6.37 STATUS_VOUT (7Ah)  
The STATUS_VOUT command returns one byte of information relating to the status of the output voltage related  
faults.  
COMMAND  
Format  
STATUS_VOUT  
Unsigned binary  
Bit Position  
Access  
7
r/wE  
6
r/wE  
5
r/wE  
4
r/wE  
3
r/wE  
2
r/wE  
1
r
0
r
VOUT_MA  
X_Warning  
Function  
OVF  
0
OVW  
0
UVW  
0
UVF  
0
TONMAXF  
0
X
0
X
0
Default Value  
0
A "1" in any of these bit positions indicates that:  
OVF:  
The device has seen the output voltage rise above the output overvoltage fault threshold  
VOUT_OV_FAULT_LIMIT. This bit is writeable to clear and the EEPROM bit is for  
SMBALERT_MASK.  
OVW:  
The device has seen the output voltage rise above the output overvoltage warn threshold  
VOUT_OV_WARN_LIMIT. This bit is writeable to clear and the EEPROM bit is for  
SMBALERT_MASK.  
UVW:  
The device has seen the output voltage fall below the output undervoltage warn threshold  
VOUT_UV_WARN_LIMIT. This bit is writeable to clear and the EEPROM bit is for  
SMBALERT_MASK.  
UVF:  
The device has seen the output voltage fall below the output undervoltage fault threshold  
VOUT_UV_FAULT_LIMIT. This bit is writeable to clear and the EEPROM bit is for  
SMBALERT_MASK.  
VOUT_MAX_Warning:  
An attempt is made to program the VOUT_COMMAND in excess of the value in VOUT_MAX. This  
bit is writeable to clear and the EEPROM bit is for SMBALERT_MASK.  
TONMAXF:  
A TON_MAX_FAULT has occurred. This bit is writeable to clear and the EEPROM bit is for  
SMBALERT_MASK.  
8.6.38 STATUS_IOUT (7Bh)  
The STATUS_IOUT command returns one byte of information relating to the status of the output current related  
faults.  
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COMMAND  
Format  
STATUS_IOUT  
Unsigned binary  
Bit Position  
Access  
7
r/wE  
OCF  
0
6
r
5
r/wE  
OCW  
0
4
r
3
r
2
r
1
r
0
r
Function  
X
0
X
0
X
0
X
0
X
0
X
0
Default Value  
A "1" in any of these bit positions indicates that:  
OCF:  
The device has seen the output current rise above the level set by IOUT_OC_FAULT_LIMIT. This  
bit is writeable to clear and the EEPROM bit is for SMBALERT_MASK.  
OCW:  
The device has seen the output current rise above the level set by IOUT_OC_WARN_LIMIT. This bit  
is writeable to clear and the EEPROM bit is for SMBALERT_MASK.  
8.6.39 STATUS_INPUT (7Ch)  
The STATUS_INPUT command returns one byte of information relating to the status of the converter's input  
related faults.  
COMMAND  
Format  
STATUS_INPUT  
Unsigned binary  
4
Bit Position  
Access  
7
r
6
r
5
r
3
2
r
1
r
0
r
r
r/wE  
LOW_Vin  
0
Function  
X
0
X
0
X
0
X
0
X
0
X
0
X
0
Default Value  
A "1" in any of these bit positions indicates that:  
LOW_Vin:  
The unit is Off due to insufficient input voltage. The bit sets when the unit powers up and stays set  
until the first time VIN exceeds VIN_ON. During the initial power up, LOW_Vin is not latched and  
does not trigger SMBALERT. Once VIN does exceed VIN_ON for the first time, any subsequent VIN  
< VIN_OFF events are latched, trigger SMBALERT. This bit is writeable to clear and the EEPROM  
bit is for SMBALERT_MASK.  
8.6.40 STATUS_TEMPERATURE (7Dh)  
The STATUS_TEMPERATURE command returns one byte of information relating to the status of the external  
temperature related faults.  
COMMAND  
Format  
STATUS_TEMPERATURE  
Unsigned binary  
Bit Position  
Access  
7
6
r/wE  
OTW  
0
5
r
4
r
3
r
2
r
1
r
0
r
r/wE  
OTF  
0
Function  
X
0
X
0
X
0
X
0
X
0
X
0
Default Value  
A "1" in any of these bit positions indicates that:  
OTF:  
68  
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The measured external temperature value of READ_TEMPERATURE_2 is equal to or greater than  
the level set by OT_FAULT_LIMIT. This bit is writeable to clear and the EEPROM bit is for  
SMBALERT_MASK. However, once cleared, the bit is set again unless the value in  
READ_TEMPERATURE_2 has fallen 20°C from the OT_FAULT_LIMIT.  
OTW:  
The measured external temperature value of READ_TEMPERATURE_2 is equal to or greater than  
the level set by OT_WARN_LIMIT. This bit is writeable to clear and the EEPROM bit is for  
SMBALERT_MASK. However, once cleared, the bit is set again unless the value in  
READ_TEMPERATURE_2 has fallen 20°C from the OT_WARN_LIMIT.  
8.6.41 STATUS_CML (7Eh)  
The STATUS_CML command returns one byte of information relating to the status of the converter’s  
communication related faults.  
COMMAND  
Format  
STATUS_CML  
Unsigned binary  
Bit Position  
Access  
7
r/wE  
ivc  
0
6
r/wE  
ivd  
0
5
r/wE  
pec  
0
4
r/wE  
mem  
0
3
r
2
r
1
r/wE  
oth  
0
0
r
Function  
X
0
X
0
X
0
Default Value  
A "1" in any of these bit positions indicates that:  
ivc:  
An invalid or unsupported command has been received. This bit is writeable to clear and the  
EEPROM bit is for SMBALERT_MASK.  
ivd:  
An invalid or unsupported data has been received. This bit is writeable to clear and the EEPROM bit  
is for SMBALERT_MASK.  
pec:  
A Packet Error Check failed. This bit is writeable to clear and the EEPROM bit is for  
SMBALERT_MASK.  
mem:  
A fault has been detected with the internal memory. This bit is writeable to clear and the EEPROM  
bit is for SMBALERT_MASK.  
oth:  
Some other communication fault or error has occurred. This bit is writeable to clear and the  
EEPROM bit is for SMBALERT_MASK.  
8.6.42 STATUS_MFR_SPECIFIC (80h)  
The STATUS_MFR_SPECIFIC command returns one byte of information relating to the status of manufacturer-  
specific faults or warnings.  
COMMAND  
Format  
STATUS_MFR_SPECIFIC  
Unsigned binary  
Bit Position  
Access  
7
r/wE  
6
r
5
r
4
3
2
r
1
r/wE  
0
r
r/w  
r/w  
reset_ VOUT_MIN_Wa  
vout rning  
Function  
otfi  
illzero  
illmany1s  
iv_vset  
iv_ss  
X
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COMMAND  
STATUS_MFR_SPECIFIC  
Default Value  
0
0
0
0
0
0
0
0
A "1" in any of these bit positions indicates that:  
otfi:  
The internal temperature is above the thermal shutdown (TSD) fault threshold. This bit is writeable to  
clear and the EEPROM bit is for SMBALERT_MASK.  
illzero:  
The operation FSM has hit an illegal “ZERO” state. The FSM is a one-hot implementation, so all  
zeros in the state is illegal and should never occur. This event is informational only and would not  
trigger SMBALERT.  
illmany1s:  
The operation FSM for has hit an illegal “more than one hot” state. The FSM is a one-hot  
implementation, so a state where multiple state bits are HI is illegal and should never occur. This  
event is informational only and would not trigger SMBALERT.  
iv_vset:  
the VSET detection results in an “illegal high”. This condition is intended as “information only” - and  
does not trigger SMBALERT. To avoid initial turn-on events from clearing this condition and the user  
not being aware why the default vset value was used, this bit is only clearable via the  
CLEAR_FAULTS command or writing a logic 1 to this bit. Off and on events do not clear it as with  
the other, standard status bits.  
iv_ss:  
the TON_RISE/SS detection results in an “illegal low” or an “illegal high”. This condition is intended  
as “information only” - and does not trigger SMBALERT. To avoid initial turn-on events from clearing  
this condition and the user not being aware why the default vset value was used, this bit is only  
clearable via the CLEAR_FAULTS command or writing a logic 1 to this bit. Off and on events do not  
clear it as with the other, standard status bits.  
reset_vout:  
The SYNC/RESET_B pin voltage is low and the device is requested to reset the output voltage to  
the initial boot-up voltage set by VSET resistor. This event is informational only and would not trigger  
SMBALERT.  
VOUT_MIN_Warning:  
an attempt is made to program the output voltage below the value in (A4h) MFR_VOUT_MIN. This  
bit is writeable to clear and the EEPROM bit is for SMBALERT_MASK.  
8.6.43 READ_VOUT (8Bh)  
The READ_VOUT commands returns two bytes of data in the linear data format that represent the output voltage  
of the controller. The output voltage is sensed at the remote sense amplifier output pin so voltage drop to the  
load is not accounted for. The data format is as shown below:  
COMMAND  
Format  
READ_VOUT  
Linear, two's complement binary  
Bit Position  
Access  
7
r
6
r
5
r
4
r
3
r
2
r
1
r
0
r
7
6
r
5
r
4
r
3
r
2
r
1
r
0
r
r
Function  
Mantissa  
0
Default Value  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
70  
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8.6.43.1 Exponent  
Value fixed at 10111, Exponent for Linear mode values is –9 (equivalent of 1.95mV/count, specified in  
VOUT_MODE command).  
8.6.43.2 Mantissa  
The output voltage calculation is shown below.  
Exponent  
OUT  
V
= Mantissa´ 2  
(8)  
8.6.44 READ_IOUT (8Ch)  
The READ_IOUT commands returns two bytes of data in the linear data format that represent the output current  
of the converter. The average output current is sensed according to the method described in Low-Side MOSFET  
Current Sensing and Overcurrent Protection. The data format is as shown below:  
COMMAND  
Format  
READ_IOUT  
Linear, two's complement binary  
Bit Position  
Access  
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
r
Exponent  
1
r
Function  
Mantissa  
0
Default Value  
1
1
0
0
0
0
0
0
0
0
0
0
0
0
The device scales the output current before it reaches the internal analog to digital converter so that resolution of  
the output current read is 62.5 mA. The maximum value that can be reported is 40 A. The user must set the  
IOUT_CAL_OFFSET parameter correctly in order to obtain accurate results. Calculate the output current using  
Equation 9.  
Exponent  
I
= Mantissa´ 2  
OUT  
(9)  
8.6.44.1 Exponent  
default: 11100 (bin) -4 (dec) (62.5 mA lsb)  
These default settings are not programmable.  
8.6.44.2 Mantissa  
The lower 10 bits are the result of the ADC conversion of the average output current, as indicated by the output  
of the internal current sense amplifier. The 11th bit is fixed at 0 because only positive numbers are considered  
valid. Any computed negative current is reported as 0 A.  
8.6.45 READ_TEMPERATURE_2 (8Eh)  
The READ_TEMPERATURE_2 command returns the external temperature in degrees Celsius.  
COMMAND  
Format  
READ_TEMPERATURE_2  
Linear, two's complement binary  
Bit Position  
Access  
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
r
Exponent  
0
r
Function  
Mantissa  
0
Default Value  
0
0
0
0
0
0
0
0
0
1
1
0
0
1
Copyright © 2015, Texas Instruments Incorporated  
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8.6.45.1 Exponent  
default: 00000 (bin) 0 (dec)  
These default settings are not programmable.  
8.6.45.2 Mantissa  
The lower 11 bits are the result of the ADC conversion of the external temperature.  
The default reading is 000 00011001 (bin) 25 (dec), corresponding to a temperature of 25°C.  
NOTE  
The READ_TEMPERATURE_2 (8Eh) value remains at 25°C when SS_DET_DIS in  
OPTIONS (MFR_SPECIFIC_21) (E5h) is set to 0 since the TSNS/SS pin is configured to  
set TON_RISE time and not used for external temperature sensing.  
8.6.46 PMBUS_REVISION (98h)  
The PMBUS_REVISION command returns a single, unsigned binary byte that indicates that these devices are  
compatible with the 1.2 revision of the PMBus™ specification.  
COMMAND  
Format  
PMBUS_REVISION  
Unsigned binary  
Bit Position  
Access  
7
r
6
r
5
r
4
r
3
r
2
r
1
r
0
r
Default Value  
0
0
0
1
0
0
1
0
8.6.47 MFR_VOUT_MIN (A4h)  
The MFR_VOUT_MIN command sets the minimum output voltage. The purpose is to protect the device(s) on the  
output rail supplied by this device from a lower than acceptable output voltage. MFR_VOUT_MIN imposes a  
lower bound to any attempted output voltage setting:  
programmed VOUT_COMMAND  
VSET pin default  
If any attempt is made to program the output voltage (using the VOUT_COMMAND ) below the value in  
MFR_VOUT_MIN, the device also:  
Clamps the output voltage at the programmed MFR_VOUT_MIN value  
Sets the oth (other) bit in the STATUS_BYTE  
Sets the MFR bit in the STATUS_WORD  
Sets the VOUT_MIN_Warning bit in the STATUS_MFR_SPECIFIC register, and  
Notifies the host via the SMBALERT pin.  
The exponent is set by VOUT_MODE at –9 (equivalent of 1.953 mV/count). The programmed output voltage is  
computed as:  
Minimum VOUT allowed = MFR_VOUT_MIN × VOUT_MODE (V) = MFR_VOUT_MIN × 2-9 (V)  
(10)  
There are 2 “invalid data” situations that are possible and checked in hardware. They are handled differently:  
If the commanded MFR_VOUT_MIN is outside the valid data range for the VOUT_SCALE_LOOP configured,  
but, is still relationally correct (below VOUT_COMMAND), then that value is not accepted; but,  
MFR_VOUT_MIN is set to the lowest allowed value.  
The second case is the opposite, where the attempted write value is within the absolute range of  
MFR_VOUT_MIN; but, is not relationally correct (it is above VOUT_COMMAND). In this case, the  
MFR_VOUT_MIN remains unchanged.  
Both cases equally cause the device to set the ’cml’ bit in the STATUS_BYTE and the ‘ivd’ bit in the  
STATUS_CML registers, and triggers SMBALERT signal.  
72  
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COMMAND  
Format  
MFR_VOUT_MIN  
Linear, unsigned binary  
Bit Position  
Access  
7
r
6
r
5
r
4
r
3
2
1
0
7
6
5
4
3
2
1
0
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
Function  
Mantissa  
8.6.47.1 Exponent  
Value fixed at 10111, Exponent for Linear mode values is –9 (equivalent of 1.95mV/count, specified in  
VOUT_MODE command).  
8.6.47.2 Mantissa  
The range of valid MFR_VOUT_MIN values is dependent upon the configured (29h) VOUT_SCALE_LOOP as  
follows.  
If VOUT_SCALE_LOOP = 1:  
default: 0000 0001 0000 0000 (bin) 256 (dec) (equivalent Vout default = 0.5V)  
Minimum : 0000 0001 0000 0000 (bin) 256 (dec) (equivalent VOUT_MAX = 0.5V)  
Maximum: 0000 0010 1110 0110 (bin) 742 (dec) (equivalent VOUT_MAX = 1.45V)  
If VOUT_SCALE_LOOP = 0.5:  
default: 0000 0010 0000 0000 (bin) 512 (dec) (equivalent Vout default = 1V)  
Minimum : 0000 0010 0000 0000 (bin) 512 (dec) (equivalent VOUT_MIN = 1V)  
Maximum: 0000 0101 1100 1100 (bin) 1484 (dec) (equivalent VOUT_MIN = 2.9V)  
If VOUT_SCALE_LOOP = 0.25:  
default: 0000 0100 0000 0000 (bin) 1024 (dec) (equivalent Vout default = 2V)  
Minimum : 0000 0100 0000 0000 (bin) 1024 (dec) (equivalent VOUT_MIN = 2V)  
Maximum: 0000 1011 1001 1000 (bin) 2968 (dec) (equivalent VOUT_MIN = 2.9V)  
8.6.48 IC_DEVICE_ID (ADh)  
This Read-only Block Read command returns a single word (16 bits) with the unique Device Code identifier for  
each device for which this IC can be configured. The BYTE_COUNT field in the Block Read command is 2  
(indicating 2 bytes follow): Low Byte first, then High Byte.  
COMMAND  
Format  
IC_DEVICE_ID  
Linear, binary  
Bit Position  
Access  
7
r
6
r
5
r
4
r
3
r
2
r
1
r
0
r
7
6
r
5
r
4
r
3
r
2
r
1
r
0
r
r
Default Value  
See below  
Device Identifier Code default:  
0027h – Code Identifier for TPS544C25 – 30A device  
0028h – Code Identifier for TPS544B25 – 20A device  
8.6.49 IC_DEVICE_REV (AEh)  
This Read-only Block Read command returns a single word (16 bits) with the unique Device revision identifier.  
The DEVICE_REV starts at 0 with the first silicon and is incremented with each subsequent silicon revision. The  
BYTE_COUNT field in the Block Read command is 2 (indicating 2 bytes follow): Low Byte first, then High  
Byte.  
COMMAND  
Format  
IC_DEVICE_REV  
Linear, tbinary  
Bit Position  
Access  
7
r
6
r
5
r
4
r
3
r
2
r
1
r
0
r
7
r
6
r
5
r
4
r
3
r
2
r
1
r
0
r
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COMMAND  
IC_DEVICE_REV  
Default Value  
See below  
Device Identifier Code default:  
0000b  
8.6.50 MFR_SPECIFIC_00 (D0h)  
The MFR_SPECIFIC_00 register is dedicated as a user scratch pad. Only the lower 8 bits are writeable for  
users. This is a read word command, with only the lower 8 bits accessible. Note it's NOT a read byte command.  
The contents of this register can be stored to non-volatile memory using the STORE_DEFAULT_ALL command.  
COMMAND  
Format  
MFR_SPECIFIC_00  
Unsigned binary  
Bit Position  
Access  
7
r
6
r
5
r
4
r
3
r
2
r
1
r
0
r
7
r/wE  
6
r/wE  
5
r/wE  
4
r/wE  
3
r/wE  
2
r/wE  
1
r/wE  
0
r/wE  
Function  
User scratch pad  
Default Value  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
8.6.51 OPTIONS (MFR_SPECIFIC_21) (E5h)  
The OPTIONS register can be used for setting user selectable options, as shown below. The contents of this  
register can be stored to non-volatile memory using the STORE_DEFAULT_ALL command.  
COMMAND  
Format  
OPTIONS  
Unsigned binary  
Bit Position  
Access  
7
r
6
r
5
r
4
r
3
r
2
r
1
r
0
r/wE  
7
r/wE  
6
r/wE  
5
r/wE  
4
3
2
r/wE  
1
r/wE  
0
r/wE  
r/w  
r/w  
SS_DET_ EN_AUTO  
EN_ADC_C PMB_VT PMB_HI_  
Function  
X
0
X
0
X
0
X
0
X
0
X
0
X
0
AVG_PROG[1:0] DLO VSM  
DIS  
_ARA  
NTL  
H
LO  
Default  
Value  
0
1
1
0
0
0
1
1
1
8.6.51.1 PMB_HI_LO  
This bit forces PMB rail logic levels.  
0: Force 3V/5V logic thresholds.  
1: Force 1.8V logic thresholds.  
8.6.51.2 PMB_VTH  
This bit configures automatic PMBus logic level detection.  
0: No automatic bus detection occurs.  
1: Allow the automatic bus detection to occur – VTH can result in 3V/5V or 1.8V depending upon comparator  
output.  
BUS DETECTION  
COMPARATOR ( < 2.4 V)  
PMB_VTH  
PMB_HI_LO  
VSET_USED  
FINAL VTH  
0
0
1
1
1
0
1
X
X
0
0
1
X
X
0
3V/5V  
1.8V  
X
X
X
3V/5V  
1.8V  
1
X
1.8V  
74  
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8.6.51.3 EN_ADC_CNTL  
This bit enables ADC operation used for voltage, current and temperature monitoring.  
0: Disable ADC operation.  
1: Enable ADC operation.  
NOTE  
The EN_ADC_CNTL bit must be set in order to enable output voltage, current and  
temperature telemetry. When the EN_ADC_CNTL bit is zero, the READ_VOUT,  
READ_IOUT and READ_TEMPERATURE_2 registers do not update continuously, and  
retain their previous values from the last time EN_ADC_CNTL was set.  
8.6.51.4 VSM  
This bit configures the measurement system for fast, vout-only measurement mode. Setting this bit disables  
READ_IOUT, and READ_TEMPERATURE_2, and insteasd allows the device to update READ_VOUT more  
frequently. This bit does not have EEPROM backup.  
0: Measure Vout, Temperature, and Iout.  
1: Measure only Vout.  
8.6.51.5 DLO  
This bit allows bypassing the normal valid data checks on register writes. This feature is included for flexibility  
during debug to quickly generate fault conditions and/or possibly work around any data limit protection  
mechanisms prohibiting output voltage programming. This bit does not have EEPROM backup.  
0: Normal PMBus data write restrictions.  
1: Data write restrictions are overridden for the following registers: SMBALERT_MASK, VOUT_COMMAND,  
VOUT_SCALE_LOOP, VOUT_OV_FAULT_LIMIT, VOUT_OV_WARN_LIMIT, VOUT_UV_WARN_LIMIT,  
VOUT_UV_FAULT_LIMIT,  
IOUT_OC_FAULT_LIMIT,  
IOUT_OC_WARN_LIMIT,  
OT_FAULT_LIMIT,  
OT_WARN_LIMIT, TON_MAX_FAULT_LIMIT, TON_RISE, TOFF_FALL, MFR_VOUT_MIN, VOUT_MAX,  
VIN_ON, VIN_OFF, and OPERATION.  
NOTE  
CAUTION: Users should use this bit with extreme caution. Setting this bit allows invalid  
data conditions to be programmed into the device which can lead to damage. Invalid data  
written into any register when DLO is enabled does NOT set the IVD bit; nor trigger  
SMBALERT. The invalid data is simply allowed to be programmed. Furthermore, invalid  
data programmed into a command/status register while DLO is enabled, does not trigger  
SMBALERT upon de-assertion of DLO. So, it is possible to exit DLO mode with invalid  
data in command/status registers. Use with extreme caution.  
8.6.51.6 AVG_PROG[1:0]  
These bits configure programmable digital measurement averaging. Bits provide programmable averaging for  
current (READ_IOUT), temperature (READ_TEMPERATURE_2), and voltage (READ_VOUT). The default (10b)  
yields 8x averaging for all three parameters; however, this default can be changed and stored in EEPROM, if  
necessary. Programming options are:  
AVG_PROG[1:0]  
ACCUMULATING AVERAGING  
00b  
16x  
0x – this ‘bypasses’ the averagers – every sample from measurement system updates  
corresponding READ_XXX CSR.  
01b  
10b  
11b  
8x  
32x  
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8.6.51.7 EN_AUTO_ARA  
This bit Enables auto Alert Response Address response. When this feature is enabled, and after the device has  
successfully responded to an ARA transaction, the hardware automatically masks any fault source currently set  
from re-asserting SMBALERT. This prevents PMBus “bus hogging” in the case of a persistent fault in a device  
that consistently wins ARA arbitration due to its device address. In contrast, when this bit is cleared, immediate  
re-assertion of SMBALERT is allowed in the event of a persistent fault and the responsibility is upon the host to  
mask each source individually.  
8.6.51.8 SS_DET_DIS  
This bit Disables Soft Start Detection when set. The READ_TEMPERATURE_2 value remains at 25°C when  
OPTIONS (MFR_SPECIFIC_21) (E5h) is set to 0 since the TSNS/SS pin is configured to set TON_RISE time  
and not used for external temperature sensing.  
8.6.52 MISC_CONFIG_OPTIONS (MFR_SPECIFIC_32) (F0h)  
This user-accessible register is used for miscellaneous options, as shown below. The contents of this register  
can be stored to non-volatile memory using the STORE_DEFAULT_ALL command.  
COMMAND  
Format  
MISC_CONFIG_OPTIONS  
Unsigned binary  
Bit Position  
Access  
7
r
6
r
5
r
4
r
3
r
2
r
1
r
0
r
7
r
6
r
5
r
4
r
3
r/wE  
2
r/wE  
1
r/wE  
0
r/wE  
Function  
X
X
X
X
X
X
X
X
X
X
X
X
FORCE_SYNC  
HSOC_USER_TRIM[1:0]  
OV_RESP_SEL  
Default  
Value  
0
0
0
0
0
0
0
0
1
1
0
0
0
0
1
1
8.6.52.1 OV_RESP_SEL  
This bit selects between two options for low-side FET behavior after an output overvoltage fault condition.  
Regardless of the setting of this bit, the low-side FET latches on when an output OV fault is detected (if the  
OV_FAULT_RESPONSE is not programmed to “ignore”).  
0: the low-side FET remains on until either the part initiates a new startup of the output voltage or the  
CLEAR_FAULTS command is given while the part is in the “DISABLE” operational state  
1: the low-side FET turns off as soon as the sensed output (at DIFFO pin) drops below the  
VOUT_UV_FAULT_LIMIT.  
8.6.52.2 HSOC_USER_TRIM[1:0]  
This trim is provided so that the customers can adjust the high-side overcurrent (HSOC) threshold in order to  
account for their application specific Vin sensing parasitics and component current handling spec requirements.  
HSOC_USER_TRIM[1:0]  
HSOC Change from Default  
00b  
01b  
10b  
11b  
0
+12.5%  
–25%  
–12.5%  
8.6.52.3 FORCE_SYNC  
This bit configures the SYNC/RESET_B pin functions in conjunction with VSET detection.  
0: the pin operates as RESET_B if VSET detection is valid, and SYNC otherwise.  
1: the SYNC/RESET_B pin operates as a SYNC pin regardless of the outcome of the VSET detection.  
76  
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9 Applications and Implementation  
9.1 Application Information  
The TPS544x25 devices are highly-integrated synchronous step-down DC-DC converters. These devices are  
used to convert a higher DC input voltage to a lower DC output voltage, with a maximum output current of 20 A  
or 30 A. Use the following design procedure to select key component values for this family of devices, and set  
the appropriate behavioral options via the PMBus™ interface.  
9.2 Typical Applications  
9.2.1 TPS544C25 4.5-V to 18-V Input, 0.95-V Output, 30-A Converter  
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Typical Applications (continued)  
S1  
TP12  
TP11  
U2  
R1  
3
2
4
5
1
8
7
6
V+  
R
V-  
NC  
NC  
NC  
BP3  
100k  
C1  
NC  
NC  
Q1  
MMBT3904  
33pF  
R21  
38.3k  
LM334SM/NOPB  
C2  
1000pF  
C3  
R2  
R20  
21.5  
J2  
10.5k  
1200pF  
Q2  
2N7002E-T1-E3  
1
3
5
7
9
2
TP7  
4
6
R3  
8
BP3  
10  
10.0k  
R4  
R7  
DNP  
TP3  
TP2  
R5  
R6  
PMBus  
40.2k  
D1  
Pink  
10.0k  
C4  
49.9  
R8  
R10  
10.0k  
GND  
R9  
DNP  
U1  
TPS544C25RVF  
GND  
300  
1200pF  
BP3  
R18  
10.0k  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
1
VOUTS-  
CNTL  
VOUTS-  
VOUTS+  
CNTL  
2
R11  
R12  
51.1k  
51.1k  
JP2  
VOUTS+  
VSET  
VDD  
BP6  
ADDR1  
ADDR0  
DATA  
CLK  
R19  
TP8  
3
DNP  
GND  
4
GND  
DATA  
CLK  
5
TP9  
C6  
1µF  
TP4  
TP5  
6
BP3  
SMBALERT  
BOOT  
SW  
BP3  
SMBALERT  
R13  
49.9  
VOUTS+  
7
PGND  
VIN  
GND  
8
C5  
R17  
0
R14  
0
C8  
2.2µF  
C7  
4.7µF  
9
330pF  
VIN  
SW  
R15  
49.9  
JP1  
10  
11  
12  
VIN  
SW  
VIN = 4.5V - 18V  
VOUTS-  
TP6  
VOUT = 0.95V @ 30A MAX ("C" version)  
C9  
GND  
GND  
GND  
TP1  
L1  
VIN  
SW  
J1  
0.1µF  
J3  
VIN  
SW  
470nH  
744301047  
TP13  
C10  
1000pF  
C12  
C21  
C22  
C23  
C19  
C20  
C27  
C28  
C11  
C13  
22µF  
C14  
22µF  
C15  
22µF  
C16  
22µF  
C17  
C18  
6800pF 6800pF  
TOP BOTTOM  
100µF  
100µF 100µF 100µF  
100µF 100µF 22µF 22µF  
100µF  
C24  
100µF  
C25  
DNP  
C26  
DNP  
R16  
1
J4  
TP10  
TP14  
FSW = 500KHz  
GND  
Figure 44. Typical Application Schematic  
9.2.2 Design Requirements  
For this design example, use the following input parameters.  
Table 16. Design Example Specifications  
PARAMETER  
Input voltage  
TEST CONDITION  
MIN  
TYP  
MAX UNIT  
VIN  
4.5  
12.0  
18.0  
0.4  
V
V
V
VIN(ripple)  
VOUT  
Input ripple voltage  
Output voltage  
IOUT = 30 A  
0.95  
Line regulation  
4.5 V VIN 18 V  
0 V IOUT 30 A  
IOUT = 30 A  
0.5%  
0.5%  
Load regulation  
VPP  
VOVER  
VUNDER  
IOUT  
tSS  
Output ripple voltage  
Transient response overshoot  
Transient response undershoot  
Output current  
20  
90  
mV  
mV  
mV  
A
ISTEP = 10 A  
ISTEP = 10 A  
90  
4.5 V VIN 18 V  
VIN = 12 V  
0
20  
30  
40  
Soft-start time  
5
ms  
A
IOC  
Overcurrent trip point  
Peak Efficiency  
36  
η
IOUT = 13 A, VIN = 12 V  
88%  
500  
fSW  
Switching frequency  
kHz  
78  
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TPS544C25, TPS544B25  
www.ti.com.cn  
ZHCSDR8 MAY 2015  
9.2.3 Design Procedure  
9.2.3.1 Switching Frequency Selection  
Select a switching frequency for the regulator. There is a trade off between higher and lower switching  
frequencies. Higher switching frequencies may produce smaller a solution size using lower valued inductors and  
smaller output capacitors compared to a power supply that switches at a lower frequency. However, the higher  
switching frequency causes extra switching losses, which decrease efficiency and impact thermal performance.  
In this design, a moderate switching frequency of 500 kHz achieves both a small solution size and a high-  
efficiency operation With the frequency selected, the timing resistor is calculated using Equation 11  
ꢀ.01 × 1010 ꢀ.01 × 1010  
24 =  
=
= ꢁ0.ꢀ ´3  
500 ´(∫  
37  
(11)  
9.2.3.2 Inductor Selection  
To calculate the value of the output inductor, use Equation 12. The coefficient KIND represents the amount of  
inductor ripple current relative to the maximum output current. The output capacitor filters the inductor ripple  
current. Therefore, choosing a high inductor ripple current impacts the selection of the output capacitor since the  
output capacitor must have a ripple current rating equal to or greater than the inductor ripple current. Generally,  
KIND coefficient should be kept between 0.2 and 0.4 for balanced performance. Using this target ripple current,  
the required inductor size can be calculated as shown in Equation 12  
6/54  
6
F 6/54  
0ꢀ9ꢁ 6 × (18 6 F 0ꢀ9ꢁ 6ꢂ  
).  
,1 =  
×
=
= 0ꢀtJꢃ  
:
;
18 6 × ꢁ00 ´ꢃ∫ × ꢄ0 ! × 0ꢀꢄ  
k6  
; × ¶37 o k)/54 ≠°∏ ; × +).$ o  
:
:
). ≠°∏  
(12)  
Selecting KIND = 0.3, the target inductance L1 = 200 nH. Using the next standard value, the 470 nH is chosen in  
this application for its high current rating, low DCR, and small size. The inductor ripple current, RMS current, and  
peak current can be calculated using Equation 13, Equation 14 and Equation 15. These values should be used  
to select an inductor with approximately the target inductance value, and current ratings that allow normal  
operation with some margin.  
6
). (≠°∏ ꢀ F 6/54  
6/54  
× ¶37 o  
ꢁꢂ9ꢃ 6 × (18 6 F ꢁꢂ9ꢃ 6ꢀ  
)
=
×
=
= ꢇꢂ8ꢇ !  
2)00,%  
:
;
,1  
18 6 × ꢃꢁꢁ ´ꢄ∫ × ꢅꢆꢁ Æꢄ  
k6  
:
;
). ≠°∏  
(13)  
1
1
¨
¨
)
=
()/54 ꢀ² + ()ꢁ)00,% ꢀ² = (3ꢂ !ꢀ² + × (3.83 !ꢀ² = 3ꢂ.ꢂ2 !  
,(≤≠≥ ꢀ  
12  
12  
(14)  
(15)  
1
2
1
:
)
; : ;  
= 3ꢂ ! + 3.83 ! = 31.9ꢃ !  
)
= ()/54 ꢀ +  
,(∞•°´ ꢀ  
ꢁ)00,%  
2
The Pulse PG077.401NL is rated for 45 ARMS current, and 48-A saturation. Using this inductor, the ripple current  
IRIPPLE= 3.85 A, the RMS inductor current IL(rms)= 30.02 A, and peak inductor current IL(peak)= 31.92 A.  
9.2.3.3 Output Capacitor Selection  
There are three primary considerations for selecting the value of the output capacitor. The output capacitor  
affects three criteria:  
how the regulator responds to a change in load current or load transient  
the output voltage ripple  
the amount of capacitance on the output voltage bus  
The last of these three considerations is important when designing regulators that must operate where the  
electrical conditions are unpredictable. The output capacitance needs to be selected based on the most stringent  
of these three criteria.  
9.2.3.3.1 Response to a Load Transient  
The desired response to a load transient is the first criterion. The output capacitor needs to supply the load with  
the required current when not immediately provided by the regulator. When the output capacitor supplies load  
current, the impedance of the capacitor greatly affects the magnitude of voltage deviation during the transient.  
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ZHCSDR8 MAY 2015  
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In order to meet the requirements for control loop stability, the TPS544C25 requires the addition of compensation  
components in the design of the error amplifier. While these compensation components provide for a stable  
control loop, they often also reduce the speed with which the regulator can respond to load transients. The delay  
in the regulator response to load changes can be two or more clock cycles before the control loop reacts to the  
change. During that time the difference between the old and the new load current must be supplied (or absorbed)  
by the output capacitance. The output capacitor impedance must be designed to be able to supply or absorb the  
delta current while maintaining the output voltage within acceptable limits. Equation 16 and Equation 17 show the  
relationship between the transient response overshoot, VOVER, the transient response undershoot, VUNDER, and  
the required output capacitance, COUT  
.
)
× ,1  
:
;
42!.  
6/6%2  
<
6/54 × #/54  
(16)  
× ,1  
:
;
)
42!.  
65.$%2  
<
(6 F 6/54 ꢁ × #/54  
).  
If  
VIN(min) > 2 × VOUT, use overshoot to calculate minimum output capacitance.  
VIN(min) < 2 × VOUT, use undershoot to calculate minimum output capacitance.  
(17)  
In this case, the minimum designed input voltage VIN(min) is greater than 2 × VOUT, so VOVER dictates the minimum  
output capacitance. Therefore, using Equation 18, the minimum output capacitance required to meet the  
transient requirement is 285 µF.  
:
;
(ꢀ42!. )² × ,1  
10 ! × ꢂ70 Æꢃ  
#
=
=
= ꢅꢅ0 J&  
/54 (≠©Æ )  
:
;
:
;
0ꢄ9ꢅ 6 × 90 ≠6  
6/54 × 6/6%2  
(18)  
9.2.3.3.2 Output Voltage Ripple  
The output voltage ripple is the second criterion. Equation 19 calculates the minimum output capacitance  
required to meet the output voltage ripple specification. This criterion is the requirement when the impedance of  
the output capacitance is dominated by ESR.  
2ꢀ00,%  
ꢁ.8ꢁ !  
#
=
=
= ꢆ8 J&  
/54 (≠©Æ )  
:
;
8 × ꢂꢃꢃ ´ꢄ∫ × ꢅꢃ ≠6  
k8 × ¶37 × 6/54 (≤©∞∞¨• )  
o
(19)  
In this case, the maximum output voltage ripple is 20 mV. Under this requirement, the minimum output  
capacitance for ripple (as calculated in Equation 19) yields 48 μF. Because this capacitance value is smaller than  
the output capacitance required to meet the transient response, select the output capacitance value based on the  
transient requirement. For this application, seven 100-µF low-ESR ceramic capacitors, and two 22-µF ceramic  
capacitors were selected to meet the transient specification with sufficient margin. Therefore COUT = 744 µF.  
With the target output capacitance value chosen, Equation 20 calculates the maximum ESR the output capacitor  
bank can have to meet the output voltage ripple specification. Equation 20 indicates the ESR should be less than  
4.9 mΩ. The ceramic capacitors each contribute approximately 3 mΩ, making the effective ESR of the output  
capacitor bank approximately 0.3 mΩ, meeting the specification with sufficient margin.  
IRIPPLE  
8×fSW×COUT  
IRIPPLE  
ꢁ.ꢂꢁ !  
ꢂ × 500 ´(∫ × 744 J&  
VOUT(ripple)  
-
ꢀ0≠6 F  
:
;
:
;
%32-!8  
=
=
= 4.9 À  
ꢁ.ꢂꢁ !  
(20)  
Additional capacitance de-ratings for aging, temperature and DC bias should be factored in, which increases the  
minimum required capacitance value. Capacitors generally have limits to the amount of ripple current they can  
handle without failing or producing excess heat. An output capacitor that can support the inductor ripple current  
must be specified. Some capacitor data sheets specify the RMS (root mean square) value of the maximum ripple  
current. Equation 21 can be used to calculate the RMS ripple current the output capacitor needs to support. For  
this application, Equation 21 yields 1.11 A.  
6/54 × (6  
; F 6/54 ꢀ  
0ꢁ9ꢂ 6 × (18 6 F 0ꢁ9ꢂ 6ꢀ  
:
). ≠°∏  
)
=
=
= 1ꢁ11 !  
#(≤≠≥ ꢀ  
12 × 6  
; × ¶37 × ,1  
12 × 18 6 × ꢂ00 ´ꢃ∫ × ꢄꢅ0 Æꢃ  
¾
¾
:
). ≠°∏  
(21)  
80  
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ZHCSDR8 MAY 2015  
9.2.3.3.3 Bus Capacitance  
The amount of bus capacitance is the third criterion. This requirement is optional. However, extra output bus  
capacitance should be considered in systems where the electrical environment is unpredictable, or not fully  
defined, or can be subject to severe events such as hot-plug events or even electrostatic discharge (ESD)  
events.  
During a hot-plug event, when a discharged load capacitor is plugged into the output of the regulator, the  
instantaneous current demand required to charge this load capacitance is be far too rapid to be supplied by the  
control loop. Often the peak charging current can be multiple times higher than the current limit of the regulator.  
Additional output capacitance helps maintain the bus voltage within acceptable limits. For hot-plug events, the  
amount of required bus capacitance can be calculated if the load capacitance is known, based on the concept of  
conservation of charge.  
An ESD event, or even non-direct lightning surges at the primary circuit level can cause glitches at this converter  
system level. A glitch of sufficient amplitude to falsely trip OVP or UVLO can cause several clock cycles of  
disturbance. In such cases it is beneficial to design in more bus capacitance than is required by the simpler load  
transient and ripple requirements. The amount of extra bus capacitance can be calculated based on maintaining  
the output voltage within acceptable limits during the disturbance. This capacitance can be as much as required  
to fully support the load for the duration of the interrupted converter operation.  
9.2.3.4 Input Capacitor Selection  
The TPS544x25 devices require a high-quality, ceramic, type X5R or X7R, input decoupling capacitor with a  
value of at least 0.1 μF of effective capacitance on the VDD pin, relative to AGND. The power stage input  
decoupling capacitance (effective capacitance at the VIN and GND pins) must be sufficient to supply the high  
switching currents demanded when the high-side MOSFET switches on, while providing minimal input voltage  
ripple as a result. This effective capacitance includes any DC bias effects. The voltage rating of the input  
capacitor must be greater than the maximum input voltage. The capacitor must also have a ripple current rating  
greater than the maximum input current ripple to the device during full load. The input ripple current can be  
calculated using Equation 22.  
k
6
; F 6/54 o  
0ꢀ9ꢁ 6 (ꢂꢀꢁ 6 F 0ꢀ9ꢁ 6ꢃ  
6/54  
:
). ≠©Æ  
¨
¨
)
= )  
×
;
/54 ≠°∏  
×
= 30 A ×  
×
:
;
:
#). ≤≠≥  
6
6
ꢂꢀꢁ 6  
ꢂꢀꢁ 6  
:
;
:
;
). ≠©Æ  
). ≠©Æ  
= 12ꢀ2 !≤≠≥  
(22)  
The minimum input capacitance and ESR values for a given input voltage ripple specification, VIN(ripple), are  
shown in Equation 23 and Equation 24. The input ripple is composed of a capacitive portion, VRIPPLE(cap), and a  
resistive portion, VRIPPLE(esr)  
.
)
× 6/54  
;
ꢁꢂ ! × ꢂꢃ9ꢄ 6  
:
/54 ≠°∏  
#
=
=
= ꢁꢆ J&  
).(≠©Æ ꢀ  
62)00,%  
× 6  
× ¶  
;
). ≠°∏  
1ꢂꢂ ≠6 × 18 6 × ꢄꢂꢂ +ꢅ∫  
:
;
:
£°∞  
37  
(23)  
(24)  
62)00,% (%32 ꢀ  
ꢂꢃꢄ 6  
%32#). (≠°∏ ꢀ  
=
=
= 9ꢃꢅ À  
1
1
:
;
)
2)00,%  
:
;
)
+
ꢄꢂ ! + ꢄꢃ8ꢄ !  
/54 (≠°∏ ꢀ  
The value of a ceramic capacitor varies significantly over temperature and the amount of DC bias applied to the  
capacitor. The capacitance variations due to temperature can be minimized by selecting a dielectric material that  
is stable over temperature. X5R and X7R ceramic dielectrics are usually selected for power regulator capacitors  
because they have a high capacitance to volume ratio and are fairly stable over temperature. The input capacitor  
must also be selected with the DC bias taken into account. For this example design, a ceramic capacitor with at  
least a 25-V voltage rating is required to support the maximum input voltage. For this design, allow 0.1-V input  
ripple for VRIPPLE(cap), and 0.3-V input ripple for VRIPPLE(esr). Using Equation 23 and Equation 24, the minimum  
input capacitance for this design is 32 µF, and the maximum ESR is 9.4 mΩ. For this example, four 22-μF, 25-V  
ceramic capacitors and one additional 100-μF, 25-V low-ESR polymer capacitors in parallel were selected for the  
power stage. For the VDD pin, one 1-μF, 25-V ceramic capacitor was selected. The input voltage (VDD) and  
power input voltage (VIN) pins must be tied together.  
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9.2.3.5 Bootstrap Capacitor Selection  
A ceramic capacitor with a value of 0.1 μF must be connected between the BOOT and SW pins for proper  
operation. It is recommended to use a ceramic capacitor with X5R or better grade dielectric. The capacitor  
should have voltage rating of 25 V or higher.  
9.2.3.6 BP6 and BP3  
According to the recommendations in , BP3 is bypassed to AGND with 2.2 μF of capacitance, and BP6 is  
bypassed to PGND with 4.7-µF of capacitance. In order for the regulator to function properly, it is important that  
these capacitors be localized to the TPS544x25 , with low-impedance return paths. See for more information.  
9.2.3.7 R-C Snubber and VIN Pin High-Frequency Bypass  
Though it is possible to operate the TPS544x25 within absolute maximum ratings without ringing reduction  
techniques, some designs may require external components to further reduce ringing levels. This example uses  
two approaches: a high frequency power stage bypass capacitor on the VIN pins, and an R-C snubber between  
the SW area and GND.  
The high-frequency VIN bypass capacitor is a lossless ringing reduction technique which helps minimizes the  
outboard parasitic inductances in the power stage, which store energy during the low-side MOSFET on-time, and  
discharge once the high-side MOSFET is turned on. For this example two 6.8-nF, 25-V, 0402 sized high-  
frequency capacitors are used. The placement of these capacitors is critical to its effectiveness. Its ideal  
placement is shown in .  
Additionally, an R-C snubber circuit is added to this example. To balance efficiency and spike levels, a 1-nF  
capacitor and a 1-Ω resistor are chosen. In this example a 1206 resistor is chosen, which is rated for 0.25 W,  
nearly twice the estimated power dissipation. See SLUP100 for more information about snubber circuits.  
9.2.3.8 Temperature Sensor  
This application design uses a surface-mount MMBT3904 for the temperature sensor, Q1. In this example, the  
sensor monitors the PCB temperature where it is generally the highest, next to the power inductor. Placement of  
the temperature sensor and routing back to the TSNS pin are critical design features to reduce noise its  
temperature measurements. In this example, the temperature sensor is placed on the VOUT side of the power  
inductor to avoid switching noise from the SW plane, and routed back to the TSNS and AGND pin. Additionally, a  
1-nF capacitor, C2, is placed from TSNS to AGND near the TSNS pin. The READ_TEMPERATURE_2 (8Eh)  
register is continually updated with the digitized temperature measurement, enabling temperature telemetry.  
Disable external temperature sensing by terminating TSNS to AGND with a 0 Ω resistor. This termination forces  
the temperature readings to –40 °C, and prevents external over-temperature fault trips.  
The switch S1 in this example can be used to switch between temperature sensor and SS resistor. Note that the  
READ_TEMPERATURE_2 value will be kept at 25°C when SS_DET_DIS in (E5h) MFR_SPECIFIC_21 is set to  
0 since the TSNS/SS pin is configured to set TON_RISE time and not used for external temperature sensing.  
9.2.3.9 Key PMBus™ Parameter Selection  
Several of the key design parameters for the TPS544x25 device can be configured via the PMBus interface, and  
stored to its non-volatile memory (NVM) for future use.  
9.2.3.9.1 Enable, UVLO and Sequencing  
The ON_OFF_CONFIG (02h) command is used to select the turn-on behavior of the converter. For this example,  
the CNTL pin was used to enable or disable the converter, regardless of the state of OPERATION (01h), as long  
as input voltage is present, and above the UVLO threshold.  
The minimum input voltage, VIN(min) , for this example is 4.5 V. The VIN_ON command was set to 4.5 V, and the  
VIN_OFF command was set to 4.0 V, giving 500 mV of hysteresis. If VIN falls below VIN_OFF, power conversion  
stops, until it is raised above VIN_ON.  
The turn-on or turn-off delay time can be set by TON_DELAY and TOFF_DELAY. Accounting for the time during  
which the COMP signal rises to the valley of the PWM ramp, the delay between enabling power conversion, and  
the rise of the output voltage is approximately 200 µs. See Soft-Start and TON_RISE Command for more  
information.  
82  
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www.ti.com.cn  
ZHCSDR8 MAY 2015  
9.2.3.9.2 Soft-Start Time  
The TON_RISE command sets the soft-start time. When selecting the soft-start time, consider the charging  
current for the output capacitors. In some applications (e.g., those with large amounts of output capacitance) this  
current can lead to problems with nuisance tripping of the overcurrent protection circuitry. To avoid nuisance  
tripping, the output capacitor charging current should be included when choosing a soft-start time, and  
overcurrent threshold. The capacitor charging current can be calculated using Equation 25  
6/54 × # /54  
ꢀ.9ꢁ 6 × 7ꢂꢂ J&  
)
#!0  
=
=
= 1ꢂ1.ꢃꢄ ≠!  
¥
ꢁ ≠≥  
33  
(25)  
With the charging current calculated, the overcurrent threshold can then be calibrated to the sum of the  
maximum load current and the output capacitor charging current plus some margin.  
In this example, the soft-start time is arbitrarily selected to be 5 ms. In this case, the charging current, ICAP  
141.36 mA.  
=
9.2.3.9.3 Overcurrent Threshold and Response  
The IOUT_OC_FAULT_LIMIT command sets the overcurrent threshold. The current limit should be set to the  
maximum load current, plus the output capacitor charging current during start-up, plus some margin for load  
transients and component variation. The amount of margin required depends on the individual application, but a  
suggested starting point is between 25% and 30%. More or less may be required. For this application, the  
maximum load current is 30 A, the output capacitor charging current is 141 mA. This design allows some extra  
margin, so an overcurrent threshold of 36 A was selected.  
The IOUT_OC_FAULT_RESPONSE command sets the desired response to an overcurrent event, which can be  
hiccup (continuously restart waiting for a 7 x soft-start time-out between re-trials) in the event of an overcurrent,  
latch-off, or continue without interruption (i.e. ignore the fault).  
9.2.3.9.4 Power Good, Output Overvoltage and Undervoltage Protection  
The VOUT_OV_WARN_LIMIT and VOUT_UV_WARN_LIMIT commands configure the PGOOD window, and  
VOUT_OV_FAULT_LIMIT and VOUT_UV_FAULT_LIMIT commands configure the output voltage fault limits.  
The VOUT_OV_FAULT_RESPONSE and VOUT_UV_FAULT_RESPONSE command sets the desired response  
to an output overvoltage and undervoltage event respectively, which can be hiccup (continuously restart waiting  
for a 7 x soft-start time-out between re-trials) in the event of a fault, latch-off, or continue without interruption (i.e.  
ignore the fault).  
Note that the VOUT_UV_FAULT_LIMIT is masked until the unit reaches the programmed output voltage. If the  
output voltage did not reach the programmed value during the soft start time UPPER limit required by  
TON_MAX_FAULT_LIMIT, the device will assert  
TON_MAX_FAULT_RESPONSE.  
a
TON_MAX fault and reponse according to  
9.2.3.10 Output Voltage Setting and Frequency Compensation Selection  
The output voltage can be set by the resistor connected from VSET to AGND with 8 possible options to set initial  
boot-up output voltage ranging from 0.80 V to 1.20 V with VOUT_SCALE_LOOP = 1. The output voltage can  
also be set by VOUT_COMMAND through the PMBus interface .  
It is required that the user program VOUT_SCALE_LOOP prior to any VOUT related commands in order for the  
proper range checking to work and to avoid Invalid Data scenarios. VOUT_SCALE_LOOP is equal to the  
feedback resistor ratio of (R9/(R5+R9)). It is limited to only 3 possible options/ratios: 1 (default, no bottom  
resistor required), 0.5, and 0.25.  
In this design, the VSET pin is pulled up to BP3, so the VOUT_COMMAND goes to the default value of 0.95V  
stored in the EEPROM. No bottom feedback resistor is needed for the output voltage range of 0.5 V to 1.5V.  
The TPS544x25 device uses voltage mode control, with input feedforward. See SLUP206 for an in-depth  
discussion of voltage-mode feedback and control. Frequency compensation can be accomplished using standard  
techniques. TI also provides a compensation calculator tool to streamline compensation design. Using the  
TPS40k Loop Compensation Tool, with 50 kHz of bandwidth, and 60 degrees of phase margin and optimizing  
based on measured results yields the following:  
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ZHCSDR8 MAY 2015  
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Table 17. Design Example Frequency Compensation Values  
RESISTOR  
VALUE (kΩ)  
10.0  
CAPACITOR  
VALUE (pF)  
1200  
R5  
R8  
C4  
C3  
C1  
0.3  
1200  
R2  
10.5  
33  
RBias  
Not Used  
The tool provides the recommended compensation components, and approximate bode plots. As a starting point,  
the crossover frequency should be set to 1/10 fSW, and the phase margin at crossover should be greater than  
45°. The resulting plots should be reviewed for a few common issues. The error amplifier gain should not hit the  
error amplifier gain bandwidth product (GBWP), nor should its mid-band gain, AMID, be greater than  
approximately 20 dB in general. Use the tool to calculate the system bode plot at different loading conditions to  
ensure that the phase does not drop below zero prior to crossover, as this condition is known as conditional  
stability.  
9.2.4 Application Curves  
100  
95  
90  
85  
80  
75  
70  
65  
60  
100  
95  
90  
85  
80  
75  
70  
65  
60  
VOUT = 0.5 V  
VOUT = 1.0 V  
VOUT = 1.5 V  
VOUT = 2.5 V  
VOUT = 3.3 V  
VOUT = 0.5 V  
VOUT = 1.0 V  
VOUT = 1.5 V  
VOUT = 2.5 V  
0
2
4
6
8
10 12 14 16 18 20 22 24 26 28 30 32  
Load Current (A)  
0
2
4
6
8
10 12 14 16 18 20 22 24 26 28 30 32  
Load Current (A)  
D001  
D001  
VIN = 5 V  
fSW = 500 kHz  
No snubber  
RBOOT = 0 Ω  
RDCR = 0.3 mΩ  
VIN = 12 V  
L = 470 nH  
fSW = 500 kHz  
No snubber  
RBOOT = 0 Ω  
RDCR = 0.3 mΩ  
L = 470 nH  
Figure 45. Efficiency vs. Load Current  
Figure 46. Efficiency vs. Load Current  
75  
400  
320  
240  
160  
80  
0.96  
0.9575  
0.955  
0.9525  
0.95  
VIN = 5 V  
VIN = 12 V  
VIN = 18 V  
60  
45  
30  
15  
0
0.9475  
0.945  
0.9425  
0.94  
0
-15  
-30  
-45  
-80  
-160  
Gain  
Phase  
-240  
1000000  
0.9375  
100  
1000  
VIN = 12 V  
10000  
Frequency (Hz)  
100000  
0
3
6
9
12  
15  
18  
21  
24  
27  
30  
Output Current (A)  
D00182  
D001  
VOUT = 0.95 V  
IOUT = 20 A  
VOUT = 0.95 V  
Figure 48. System Bode Plot  
Figure 47. Load Regulation  
84  
Copyright © 2015, Texas Instruments Incorporated  
TPS544C25, TPS544B25  
www.ti.com.cn  
ZHCSDR8 MAY 2015  
VIN = 12 V  
VOUT = 0.95 V  
IOUT = 20 A  
VIN = 12 V  
VOUT = 0.95 V  
IOUT = 20 A  
Figure 49. Startup from CNTL  
Figure 50. Shutdown from CNTL  
VIN = 12 V  
VOUT = 0.95 V  
IOUT = 0 A to 20A , 2.5 A/µs  
VIN = 12 V  
VOUT = 0.95 V  
IOUT = 20 A  
Figure 51. Transient Load  
Figure 52. DC Ripple  
版权 © 2015, Texas Instruments Incorporated  
85  
TPS544C25, TPS544B25  
ZHCSDR8 MAY 2015  
www.ti.com.cn  
VIN = 12 V  
IOUT = 0 A  
VPRE-BIAS= 0.5 V  
Natural Convection  
IOUT = 20 A  
VOUT = 0.95 V  
fSW = 500 kHz  
VIN = 12 V  
Figure 53. 50% Pre-Biased Start-Up  
Figure 54. Thermal Image  
10 Power Supply Recommendations  
These devices are designed to operate from an input voltage supply between 4.5 V and 18 V. This supply must  
be well regulated. These devices are not designed for split-rail operation. The VIN and VDD pins must be the  
same potential for accurate high-side short circuit protection. Proper bypassing of input supplies and internal  
regulators is also critical for noise performance, as is PCB layout and grounding scheme. See the  
recommendations in the Layout section.  
86  
版权 © 2015, Texas Instruments Incorporated  
TPS544C25, TPS544B25  
www.ti.com.cn  
ZHCSDR8 MAY 2015  
11 Layout  
11.1 Layout Guidelines  
Layout is a critical portion of good power supply design. 55 shows the recommended PCB layout  
configuration. A list of PCB layout considerations using these devices are listed below.  
As with any switching regulator, there are several signal paths that conduct fast switching voltages or  
currents. Minimize the loop area formed by these paths and their bypass connections.  
Bypass the VIN pins to GND with a low-impedance path. Power-stage input bypass capacitors should be as  
close as physically possible to the VIN and GND pins. Additionally, a high-frequency bypass capacitor in 0402  
package on the VIN pins can help to reduce switching spikes, which can be tucked right underneath the IC on  
the other side of the PCB to keep a minimum loop.  
BP6 bypass capacitor carries large switching current for gate driver. Bypassing the BP6 pin to GND with a  
low-impedance path is very critical to the stable operation of the TPS544x25 devices. Place BP6 high-  
frequency bypass capacitors as close as possible to the device pins, with a minimum return loop back to  
ground.  
The VDD and BP3 also require good local bypassing. Place bypass capacitors as close as possible to the  
device pins, with a minimum return loop back to ground and this return loop should be kept away from fast  
switching voltage and main current path, as well as BP6 current path. Poor bypassing on VDD and BP3 can  
degrade the performance of the regulator.  
Keep signal components local to the device, and place them as close as possible to the pins to which they  
are connected. These components include the feedback resistors, the RT resistor, the VSET resistor, the SS  
resistor, as well as ADDR0 and ADDR1 resistors. These components should also be kept away from fast  
switching voltage and current paths. Those components can be terminated to GND with minimum return loop  
or bypassed to a separate low impedance analog ground (AGND) copper area, which is isolated from fast  
switching voltage and current paths and has single connection to PGND on the thermal tab via AGND pin.  
See 55 for placement recommendation.  
The PGND pin (pin 26) must be directly connected to the thermal pad of the device on the PCB, with a low-  
noise, low-impedance path to ensure accurate current monitoring.  
Minimize the SW copper area for best noise performance. Route sensitive traces away from SW and BOOT,  
as these nets contain fast switching voltages, and lend easily to capacitive coupling.  
Snubber component placement is critical to its effectiveness of ringing reduction. These components should  
be on the same layer as the TPS544x25 devices, and be kept as close as possible to the SW and GND  
copper areas.  
The VIN and VDD pins must be the same potential for accurate short circuit protection, but high frequency  
switching noise on the VDD pin can degrade performance. VDD should be connected to VIN through a trace  
from the input copper area. Optionally form a small low-pass R-C between VIN and VDD, with the VDD  
bypass capacitor (1 µF) and a 0-2 Ω resistor between VIN and VDD. See 55.  
Route the VOUTS+ and VOUTS– lines from the output capacitor bank at the load back to the device pins as  
a tightly coupled differential pair. It is critical that these traces be kept away from switching or noisy areas  
which can add differential-mode noise.  
Routing of the temperature sensor traces is critical to the noise performance of temperature monitoring. Keep  
these traces away from switching areas or high current paths on the layout. It is also recommended to use a  
small 1-nF capacitor from TSNS/SS to AGND to improve the noise performance of temperature readings.  
版权 © 2015, Texas Instruments Incorporated  
87  
TPS544C25, TPS544B25  
ZHCSDR8 MAY 2015  
www.ti.com.cn  
11.2 Layout Example  
(A)  
(B)  
(C)  
(Not to scale)  
VIN  
(L)  
(K)  
C
COMP2  
GND  
R
COMP1  
R
BOT  
R
TOP  
DIFFO  
FB  
GND  
(N)  
R
COMP2  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
C
(D)  
COMP2  
C
COMP3  
COMP  
Thermal Pad  
PGOOD  
TSNS/SS  
AGND  
R
PG  
(J)  
(I)  
V
OUTSœ  
(M)  
R
SYNC  
SYNC/RESET_B  
RT  
R
SNSœ  
R
RT  
(H)  
C
AGND  
BOOT  
R
SNS+  
TSNS  
AGND  
Q
TSNS  
R
BOOT  
V
OUTS+  
Optional  
RC  
(E)  
Address  
Resistors  
VOUT  
Snubber  
L1  
(G)  
(F)  
CNTL  
PMBus  
Signal Communication  
(A) Connect to AGND with setting resistor or pull up to BP3 if not used.  
(B) Bypass for internal regulators BP3, BP6, VDD. Use multiple vias to reduce parasitic inductance  
(C) Place VIN bypass capacitors as close as possible to device, with best high frequency capacitor closest to VIN and  
GND pins  
(D) Kelvin connect to TPS544C25 VOUTS– and VOUTS+ pins  
(E) Sense point should be directly at the load  
(F) For best efficiency, use a heavy weight copper and place these planes on multiple PCB layers  
(G) Minimize SW area for least noise. Keep sensitive traces away from SW and BOOT on all layers  
(H) AGND and PGND are only connected together on Thermal Pad.  
(I) Optional SYNC/RESET_B Signal. Pull up to BP3 if not used.  
(J) Pull up to BP6 or external voltage to use PGOOD.  
(K) Maintain feedback and compensation network components localized to the device.  
(L) Internal AGND Plane to reduce the BP3 and VDD bypass parasitics.  
(M) Connect AGND to Thermal Pad  
(N) Connect PGND to Thermal Pad  
55. PCB Layout Recommendation  
11.2.1 Mounting and Thermal Profile Recommendation  
Proper mounting technique adequately covers the exposed thermal tab with solder. Excessive heat during the  
reflow process can affect electrical performance. 56 shows the recommended reflow oven thermal profile.  
Proper post-assembly cleaning is also critical to device performance. See SLUA271 for more information.  
88  
版权 © 2015, Texas Instruments Incorporated  
TPS544C25, TPS544B25  
www.ti.com.cn  
ZHCSDR8 MAY 2015  
Layout Example (接下页)  
tP  
TP  
TL  
TS(max)  
TS(min)  
tL  
rRAMP(up)  
rRAMP(down)  
tS  
t25P  
Time (s)  
25  
56. Recommended Reflow Oven Thermal Profile  
18. Recommended Thermal Profile Parameters  
PARAMETER  
MIN  
TYP  
MAX  
UNIT  
RAMP UP AND RAMP DOWN  
rRAMP(up)  
Average ramp-up rate, TS(max) to TP  
Average ramp-down rate, TP to TS(max)  
3
6
°C/s  
°C/s  
rRAMP(down)  
PRE-HEAT  
TS  
Pre-heat temperature  
150  
60  
200  
180  
°C  
s
tS  
Pre-heat time, TS(min) to TS(max)  
REFLOW  
TL  
TP  
tL  
Liquidus temperature  
217  
°C  
°C  
s
Peak temperature  
260  
150  
40  
Time maintained above liquidus temperature, TL  
Time maintained within 5 °C of peak temperature, TP  
Total time from 25 °C to peak temperature, TP  
60  
20  
tP  
s
t25P  
480  
s
版权 © 2015, Texas Instruments Incorporated  
89  
TPS544C25, TPS544B25  
ZHCSDR8 MAY 2015  
www.ti.com.cn  
12 器件和文档支持  
12.1 器件支持  
12.1.1 开发支持  
12.1.1.1 德州仪器 (TI) Fusion Digital Power Designer  
德州仪器 (TI) Digital Power Designer 能够为 TPS544x25器件提供全面支持。Fusion digital Power Designer 是一  
款图形用户界面 (GUI),可使用德州仪器 (TI) USB-to-GPIO 适配器通过 PMBus 配置并监控器件。  
单击此链接下载德州仪器 (TI) Fusion Digital Power Designer 软件包。  
57. 使用 Fusion Digital Power Designer 进行器件监控  
90  
版权 © 2015, Texas Instruments Incorporated  
TPS544C25, TPS544B25  
www.ti.com.cn  
ZHCSDR8 MAY 2015  
器件支持 (接下页)  
58. 使用 Fusion Digital Power Designer 进行器件配置  
12.1.1.2 TPS40k 环路补偿工具  
TPS544x25 器件受德州仪器 (TI) TPS40k 环路补偿工具 支持。该电子表格工具可用于计算具有电压模式控制功能  
的器件的频率补偿组件。  
12.2 相关链接  
下面的表格列出了快速访问链接。类别包括技术文档、支持与社区资源、工具和软件,以及申请样片或购买产品的  
快速链接。  
19. 相关链接  
器件  
产品文件夹  
请单击此处  
请单击此处  
样片与购买  
请单击此处  
请单击此处  
技术文档  
请单击此处  
请单击此处  
工具和软件  
请单击此处  
请单击此处  
支持和社区  
请单击此处  
请单击此处  
TPS544C25  
TPS544B25  
12.3 社区资源  
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商按照原样提供。这些内容并不构成 TI 技术规范,  
并且不一定反映 TI 的观点;请参阅 TI 《使用条款》。  
TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在  
e2e.ti.com 中,您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。  
设计支持  
TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。  
12.4 商标  
SWIFT, NexFET, E2E are trademarks of Texas Instruments.  
PMBus is a trademark of SMIF, Inc..  
All other trademarks are the property of their respective owners.  
版权 © 2015, Texas Instruments Incorporated  
91  
TPS544C25, TPS544B25  
ZHCSDR8 MAY 2015  
www.ti.com.cn  
12.5 静电放电警告  
这些装置包含有限的内置 ESD 保护。 存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止 MOS 门极遭受静电损  
伤。  
12.6 Glossary  
SLYZ022 TI Glossary.  
This glossary lists and explains terms, acronyms, and definitions.  
13 机械、封装和可订购信息  
以下页中包括机械封装、封装和可订购信息。这些信息是针对指定器件可提供的最新数据。这些数据会在无通知且  
不对本文档进行修订的情况下发生改变。欲获得该数据表的浏览器版本,请查阅左侧的导航栏。  
92  
版权 © 2015, Texas Instruments Incorporated  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Dec-2020  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
2500  
250  
(1)  
(2)  
(3)  
(4/5)  
(6)  
TPS544B25RVFR  
TPS544B25RVFT  
TPS544C25RVFR  
TPS544C25RVFT  
ACTIVE  
LQFN-CLIP  
LQFN-CLIP  
LQFN-CLIP  
LQFN-CLIP  
RVF  
40  
40  
40  
40  
RoHS-Exempt  
& Green  
NIPDAU  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
TPS544B25  
ACTIVE  
ACTIVE  
ACTIVE  
RVF  
RoHS-Exempt  
& Green  
NIPDAU  
NIPDAU  
NIPDAU  
TPS544B25  
TPS544C25  
TPS544C25  
RVF  
2500  
250  
RoHS-Exempt  
& Green  
RVF  
RoHS-Exempt  
& Green  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Dec-2020  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE OUTLINE  
RVF0040A  
LQFN-CLIP - 1.52 mm max height  
S
C
A
L
E
2
.
0
0
0
PLASTIC QUAD FLATPACK - NO LEAD  
5.1  
4.9  
A
B
PIN 1 INDEX AREA  
7.1  
6.9  
C
1.52  
1.32  
SEATING PLANE  
0.08 C  
0.05  
0.00  
2X 3.5  
(0.2) TYP  
3.3 0.1  
EXPOSED  
THERMAL PAD  
36X 0.5  
13  
20  
12  
21  
41  
SYMM  
2X  
5.3 0.1  
5.5  
32  
1
0.3  
40X  
0.2  
40  
33  
PIN 1 ID  
(OPTIONAL)  
0.1  
C A B  
SYMM  
0.05  
0.5  
0.3  
40X  
4222989/B 10/2017  
NOTES:  
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing  
per ASME Y14.5M.  
2. This drawing is subject to change without notice.  
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.  
4. Reference JEDEC registration MO-220.  
www.ti.com  
EXAMPLE BOARD LAYOUT  
RVF0040A  
LQFN-CLIP - 1.52 mm max height  
PLASTIC QUAD FLATPACK - NO LEAD  
(3.3)  
6X (1.4)  
40  
33  
40X (0.6)  
1
32  
40X (0.25)  
2X  
(1.12)  
36X (0.5)  
6X  
(1.28)  
(6.8)  
(5.3)  
41  
SYMM  
(R0.05) TYP  
(
0.2) TYP  
VIA  
12  
21  
13  
20  
SYMM  
(4.8)  
LAND PATTERN EXAMPLE  
SCALE:12X  
0.07 MAX  
ALL AROUND  
0.07 MIN  
ALL AROUND  
SOLDER MASK  
OPENING  
METAL  
SOLDER MASK  
OPENING  
METAL UNDER  
SOLDER MASK  
NON SOLDER MASK  
DEFINED  
SOLDER MASK  
DEFINED  
(PREFERRED)  
SOLDER MASK DETAILS  
4222989/B 10/2017  
NOTES: (continued)  
5. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature  
number SLUA271 (www.ti.com/lit/slua271).  
www.ti.com  
EXAMPLE STENCIL DESIGN  
RVF0040A  
LQFN-CLIP - 1.52 mm max height  
PLASTIC QUAD FLATPACK - NO LEAD  
SYMM  
(0.815) TYP  
40  
33  
40X (0.6)  
1
41  
32  
40X (0.25)  
(1.28)  
TYP  
36X (0.5)  
(0.64)  
TYP  
SYMM  
(6.8)  
(R0.05) TYP  
8X  
(1.08)  
12  
21  
METAL  
TYP  
20  
13  
8X (1.43)  
(4.8)  
SOLDER PASTE EXAMPLE  
BASED ON 0.125 mm THICK STENCIL  
EXPOSED PAD  
71% PRINTED SOLDER COVERAGE BY AREA  
SCALE:18X  
4222989/B 10/2017  
NOTES: (continued)  
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate  
design recommendations.  
www.ti.com  
重要声明和免责声明  
TI 均以原样提供技术性及可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资  
源,不保证其中不含任何瑕疵,且不做任何明示或暗示的担保,包括但不限于对适销性、适合某特定用途或不侵犯任何第三方知识产权的暗示  
担保。  
所述资源可供专业开发人员应用TI 产品进行设计使用。您将对以下行为独自承担全部责任:(1) 针对您的应用选择合适的TI 产品;(2) 设计、  
验证并测试您的应用;(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。所述资源如有变更,恕不另行通知。TI 对您使用  
所述资源的授权仅限于开发资源所涉及TI 产品的相关应用。除此之外不得复制或展示所述资源,也不提供其它TI或任何第三方的知识产权授权  
许可。如因使用所述资源而产生任何索赔、赔偿、成本、损失及债务等,TI对此概不负责,并且您须赔偿由此对TI 及其代表造成的损害。  
TI 所提供产品均受TI 的销售条款 (http://www.ti.com.cn/zh-cn/legal/termsofsale.html) 以及ti.com.cn上或随附TI产品提供的其他可适用条款的约  
束。TI提供所述资源并不扩展或以其他方式更改TI 针对TI 产品所发布的可适用的担保范围或担保免责声明。IMPORTANT NOTICE  
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具有 PMBus 和频率同步功能的 4.5V 至 18V、30A 同步 SWIFT™ 降压转换器

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TI

TPS544C25RVFR

具有 PMBus 和频率同步功能的 4.5V 至 18V、30A 同步 SWIFT™ 降压转换器 | RVF | 40 | -40 to 125

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TI

TPS544C25RVFT

具有 PMBus 和频率同步功能的 4.5V 至 18V、30A 同步 SWIFT™ 降压转换器 | RVF | 40 | -40 to 125

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TI

TPS544C26

4V 至 16V、35A SVID 和 I²C 同步降压转换器

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TI

TPS544C26RXXR

4V 至 16V、35A SVID 和 I²C 同步降压转换器

| RXX | 37 | -40 to 125

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TI

TPS5450

5-A, WIDE INPUT RANGE, STEP-DOWN SWIFT CONVERTER

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TI

TPS5450-EP

5-A, WIDE INPUT RANGE, STEP-DOWN SWIFT™ CONVERTER

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TI

TPS5450-Q1

5-A, WIDE INPUT RANGE, STEP-DOWN SWIFT™ CONVERTER

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