TPS61291DRVT [TI]
具有 15nA 旁路操作的低 Iq 升压转换器 | DRV | 6 | -40 to 85;
| 型号： | TPS61291DRVT |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有 15nA 旁路操作的低 Iq 升压转换器 | DRV | 6 | -40 to 85 升压转换器 开关 光电二极管 输出元件 |
| 文件： | 总26页 (文件大小：2638K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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TPS61291
ZHCSCS7A –SEPTEMBER 2014–REVISED SEPTEMBER 2014
TPS61291 支持旁路操作的低 Iq 升压转换器
1 特性
在旁路模式下，用于升压模式操作的集成分压器网络将
1
从输出端断开，并且静态电流消耗会降至仅为
•
•
•
•
•
•
•
•
•
•
•
•
•
输入电压范围 0.9V 至 5V
15nA（典型值）。
启动电压 1.5V（20mA 负载时）
引脚可选输出电压：3.3V、3V、2.5V
旁路模式静态电流典型值 15nA
升压模式静态电流典型值 5.7μA
旁路开关从 VIN 到 VOUT
在升压模式下，该器件可提供的最小输出电流为
200mA（VOUT = 3.3V，VIN = 1.8V）。 升压模式用于
需要稳定的电源电压并且无法通过输入源直接操作的系
统组件。 升压转换器基于使用同步整流的电流模式控
制器，可实现最大效率，所消耗的输出电流典型值为
5.7uA。 升压转换器启动期间，将读取 VSEL 引脚并
且集成反馈网络会将输出电压设为 2.5V、3V 或
3.3V。
VOUT = 3.3V、VIN = 1.8V 时 IOUT > 200mA
内部反馈分压器断开连接（旁路模式）
受控旁路转换功能可防止反向电流流入电池
轻负载状态下的省电模式
过热保护
旁路模式或升压模式操作都由系统通过 EN/BYP 引脚
进行控制。
冗余过压保护
小型 2mm x 2mm 小外形尺寸无引线 (SON) 6 引脚
封装
该器件集成有增强型旁路模式控制功能，可防止升压模
式操作期间存储在输出电容中的电荷倒流至输入端并给
电池充电。
2 应用
•
•
•
•
测量（燃气表、水表、智能仪表）
此器件采用小型 6 引脚 2.0mm × 2.0mm x 0.75mm
SON 封装 (DRV)。
遥控
住宅安保/家庭自动化
由单节 3V 锂锰电池或 2 节 1.5V 碱性电池供电的
应用
器件信息(1)
部件号
TPS61291
封装
SON (6)
封装尺寸（标称值）
2.00mm x 2.00mm
3 说明
(1) 如需了解所有可用封装，请见数据表末尾的可订购产品附录。
TPS61291 是引脚输出电压可选且支持集成旁路模式
的升压转换器。 进行旁路操作时，该器件可提供从输
入到系统的直接路径，并允许低功耗微控制器
(MCU)（如 MSP430）直接由单节 3V 锂锰电池或两节
碱性电池供电运行。
简化电路原理图和效率曲线
100
95
90
85
80
75
70
65
60
55
50
TPS61291
L = 3.3mH
Subsystem
VCC = 3.3V
VOUT =
VBAT / 3.3V
Step up
converter
SW
VIN
VOUT
2 x 1.5V Alkaline /
1 x 3V Li-MnO2
VBAT
COUT
MCU
(VCC = VBAT or 3.3V)
Bypass
+
-
22mF
CIN
10mF
VIN = 1.2V
VIN= 1.8V
VIN = 2.5V
VIN = 3.0V
VSEL
GND
+
-
+
-
EN/BYP
0.01
0.1
1
10
100
Output Current IOUT [mA]
1
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
English Data Sheet: SLVSBX9
TPS61291
ZHCSCS7A –SEPTEMBER 2014–REVISED SEPTEMBER 2014
www.ti.com.cn
目录
7.4 Device Functional Modes.......................................... 8
Applications and Implementation ...................... 10
8.1 Application Information............................................ 10
8.2 Typical Application .................................................. 10
Power Supply Recommendations...................... 16
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 Handling Ratings....................................................... 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information ................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Typical Characteristics.............................................. 6
Detailed Description .............................................. 7
7.1 Overview ................................................................... 7
7.2 Functional Block Diagram ......................................... 7
7.3 Feature Description................................................... 7
8
9
10 Layout................................................................... 16
10.1 Layout Guidelines ................................................. 16
10.2 Layout Example .................................................... 16
11 器件和文档支持 ..................................................... 17
11.1 器件支持 ............................................................... 17
11.2 文档支持................................................................ 17
11.3 商标....................................................................... 17
11.4 静电放电警告......................................................... 17
11.5 术语表 ................................................................... 17
12 机械封装和可订购信息 .......................................... 17
7
4 修订历史记录
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (September 2014) to Revision A
Page
•
•
•
•
Changed "Bypass Mode Operation" description ................................................................................................................... 9
Added sub-section "Controlled Transition into Bypass Mode" .............................................................................................. 9
Added NOTE to the "Application and Implementation" section. .......................................................................................... 10
Changed "List of Inductors" table ........................................................................................................................................ 11
2
Copyright © 2014, Texas Instruments Incorporated
TPS61291
www.ti.com.cn
ZHCSCS7A –SEPTEMBER 2014–REVISED SEPTEMBER 2014
5 Pin Configuration and Functions
DRV Package
6 Pin
Top View
1
2
3
6
5
4
SW
VOUT
VIN
GND
VSEL
EN/BYP
Pin Functions
PIN
I/O
DESCRIPTION
NAME
SW
NO.
Switch node of the converter. Connect the inductor between this pin and the input capacitor
CIN
1
I
.
Boost converter output. Connect the output capacitor COUT between this pin and GND close
to the device.
VOUT
VIN
2
3
O
Input voltage supply pin for the boost converter. Connect the input capacitor CIN between
this pin and GND as close as possible to the device.
PWR
Control pin of the device. A high level enables the boost mode operation. A low level
disables the boost converter and enables bypass mode operation. EN/BYP must be actively
terminated high or low. Usually, this pin is controlled by the MCU in the system.
EN/BYP
4
I
Output voltage selection pin. The logic level of this pin is read out during startup and
internally latched. Connect this pin only to GND, VOUT, or leave it floating.
VSEL
GND
5
6
I
PWR
Ground pin of the device.
EXPOSED
THERMAL
PAD
Not electrically connected to the IC, but must be soldered to achieve specified thermal
performance. Connect this pad to the GND pin and use it as a central GND plane.
NC
Output Voltage Setting
EN/BYP Pin
VSEL Pin at Startup
VOUT
Mode
high
high
high
low
GND
3.3V
Boost Mode Operation
VOUT
3.0V
2.5V
floating
GND / VOUT / floating
VOUT = VIN (Bypass Mode)
Bypass Mode Operation
Copyright © 2014, Texas Instruments Incorporated
3
TPS61291
ZHCSCS7A –SEPTEMBER 2014–REVISED SEPTEMBER 2014
www.ti.com.cn
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
-0.3
-0.3
-0.3
-0.3
MAX
5.5
7
UNIT
(2)
Pin Voltage Range
VIN
SW
V
EN/BYP, VOUT
VSEL
5.5
VOUT +
0.3V
Output Current
TJ
In Bypass Operation (EN/BYP = GND)
Maximum Junction Temperature
250
150
mA
°C
-40
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal GND.
6.2 Handling Ratings
MIN
MAX
UNIT
°C
Tstg
Storage temperature range
Electrostatic discharge
–65
150
Human body model (HBM) per ANSI/ESDA/JEDEC
JS-001, all pins(1)
-2
2
V(ESD)
kV
Charged device model (CDM), per JEDEC
specification JESD22-C101, all pins(2)
-0.5
0.5
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
1.5
0.9
0.9
-40
–40
NOM
MAX
UNIT
VIN
Supply voltage for startup
Supply voltage range (once device has started)
Supply voltage range for step up conversion (once device has started)
Operating ambient temperature
5
VOUT
85
V
TA
TJ
°C
Operating junction temperature
125
6.4 Thermal Information
TPS61291
THERMAL METRIC(1)
DRV (2x2 SON)
UNIT
6 PINS
71.2
93.5
46.7
2.5
RθJA
Junction-to-ambient thermal resistance
RθJCtop
RθJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
ψJB
41.1
11.1
RθJCbot
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
Copyright © 2014, Texas Instruments Incorporated
TPS61291
www.ti.com.cn
ZHCSCS7A –SEPTEMBER 2014–REVISED SEPTEMBER 2014
6.5 Electrical Characteristics
TA = –40°C to 85°C. Typical values are at TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V
SUPPLY
VIN
Startup voltage
VOUT = 3.3V, IOUT = 20mA
1.5
5
Input voltage range
Operating voltage range
0.9
IQ
Quiescent current in boost mode
VIN
IOUT = 0 mA, VEN/BYP = VIN = 1.8 V, VOUT
3.3V, device not switching
=
0.4
5.7
1.5
9
VOUT
μA
Quiescent current in bypass mode VIN
Leakage current into SW
VEN/BYP = low, VIN = 3 V, IOUT = 0 mA
VEN/BYP = low, VIN = 1.2 V, VSW = 1.2 V
VIN decreasing
0.015
0.01
0.65
140
0.5
0.5
0.9
ILkSW
μA
V
VUVLO
Undervoltage lockout threshold
Overtemperature protection
TJ rising
°C
°C
Overtemperature hysteresis
20
INPUTS
IIN
EN/BYP, input current
EN/BYP = low or EN/BYP = VIN
0.01
0.1
μA
VIN ≤ 1.5 V
0.2 ×
VIN
V
VIL
EN/BYP, input low voltage
5 V > VIN > 1.5 V
0.3
VIN ≤ 1.5 V
0.8 ×
VIN
V
VIH
EN/BYP, input high voltage
5 V > VIN > 1.5 V
VEN/BYP = high
VEN/BYP = high
1.2
VIL
VIH
IIN
VSEL, input low voltage
VSEL, input high voltage
VSEL, input current
0.3
0.1
V
V
VOUT
-
0.3
VEN/BYP = high, VSEL = VOUT = 3V
0.01
μA
POWER SWITCHES
Rectifying switch on resistance
VOUT = 3.3 V
0.6
0.4
Ω
Ω
RDS(ON) Main switch on resistance
Bypass switch on resistance
VOUT = 3.3 V
VIN = 1.8V, IOUT = 50 mA, EN/BYP = low
VOUT = 3.3V
1.2
Ω
ISW
Switch current limit
700
-2
1000
1300
+4
mA
OUTPUT
VIN = 1.8V, IOUT = 10 mA, VOUT 3.3V, 3.0V,
2.5V, EN/BYP = high
Output voltage accuracy
Line regulation
+1
%
VOUT = 3.3V, VIN = 2V to 3.0V, IOUT = 50
mA, EN/BYP = high
VOUT
+0.15
%/V
VIN = 2V, VOUT = 3.3V, IOUT = 1 mA to 200
mA, EN/BYP = high
Load regulation
-0.007
5.4
%/mA
V
VOVP
Output overvoltage protection
VOUT rising, EN/BYP = high
Copyright © 2014, Texas Instruments Incorporated
5
TPS61291
ZHCSCS7A –SEPTEMBER 2014–REVISED SEPTEMBER 2014
www.ti.com.cn
6.6 Typical Characteristics
0.14
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
VIN = 1.8V
VIN = 1.8V
VIN = 2.5V
VIN = 2.5V
0.12
VIN = 3.3V
0.1
0.08
0.06
0.04
0.02
0
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature TA [°C]
Temperature TA [°C]
C001
C001
EN/BYP = low
VSEL = low
IOUT = 0mA
EN/BYP = high
Boost mode operation
Device not switching
Figure 1. Quiescent Current IQ into VIN Pin in Bypass Mode
Figure 2. Quiescent Current IQ into VIN Pin in Boost Mode
1.6
VIN 1.8V
8
VOUT = 2.6V
VOUT = 3.1V
7
1.4
1.2
1
VOUT = 3.4V
6
5
4
3
2
1
0
0.8
0.6
0.4
0.2
0
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature TA [°C]
Temperature TA [°C]
C001
EN/BYP = high
IOUT = 0mA
Boost mode operation
Device not switching
Figure 3. Quiescent Current IQ into VOUT Pin in Boost Mode
Figure 4. RDSON Bypass Switch
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature TA [°C]
Temperature TA [°C]
C001
VOUT = 3.3V
VOUT = 3.3V
Figure 5. RDSON Main Switch
Figure 6. RDSON Rectifier Switch
6
Copyright © 2014, Texas Instruments Incorporated
TPS61291
www.ti.com.cn
ZHCSCS7A –SEPTEMBER 2014–REVISED SEPTEMBER 2014
7 Detailed Description
7.1 Overview
The TPS61291 provides two operating modes: high efficiency boost mode to generate an output voltage higher
than the input voltage and bypass mode, which connects the output of the device directly to the input.
7.2 Functional Block Diagram
Bypass
Switch
P
N
VIN
SW
VOUT
Rectifying
Switch
VOUT
VIN
Driver
N
Bypass Switch
Control
Control Logic
Main
Switch
EN/BYP
VIN
Current
Sense
Startup Circuit
Undervoltage
Lockout
Overvoltage
Protection
Thermal Shutdown
Reference Vref
BYP/EN
Vref
GND
VSEL
Voltage Error
Amplifier
integrated FB divider
network with disconnect
7.3 Feature Description
7.3.1 Bypass / Boost Mode Operation EN/BYP
The EN/BYP pin selects the operating mode of the device. With the EN/BYP pin pulled low, the device operates
in bypass mode. With a high level on the EN/BYP pin, the device operates as a boost converter. The EN/BYP
pin is usually controlled by an I/O pin of a MCU, powered from the output of the TPS61291 and should not be left
floating. See Figure 8. See also sections Boost Mode Operation and Bypass Mode Operation for more detailed
descriptions.
Copyright © 2014, Texas Instruments Incorporated
7
TPS61291
ZHCSCS7A –SEPTEMBER 2014–REVISED SEPTEMBER 2014
www.ti.com.cn
Feature Description (continued)
7.3.2 Output Voltage Selection VSEL
In boost mode operation, the device supports three internally set output voltages: 2.5V, 3V and 3.3V. Leaving the
VSEL pin open sets the output voltage to 2.5V, VSEL = VOUT to 3.0V and VSEL= GND to 3.3V. The VSEL pin
condition is detected during the startup of the boost converter and internally latched. For proper operation, it must
be connected to either GND, VOUT or left floating. Depending on the VSEL condition, an integrated feedback
divider network is selected. Changing the VSEL pin condition during operation does not change the output
voltage.
7.3.3 Feedback Divider Disconnect
In boost mode operation, the integrated feedback divider network, which is required for regulation, is connected
to the VOUT pin. To achieve the low quiescent current in bypass mode, the integrated feedback divider network
is disconnected from the output pin VOUT.
7.3.4 Undervoltage Lockout
An undervoltage lockout function stops the operation of the boost converter if the input voltage drops below the
undervoltage lockout threshold. This function is implemented in order to prevent malfunction of the boost
converter. The undervoltage lockout function has no control of the bypass switch.
7.3.5 Overtemperature Protection
The device has a built-in temperature sensor which monitors the internal junction temperature in boost mode
operation. If the junction temperature exceeds the threshold (140 °C typical), the device stops operating. As soon
as the junction temperature has decreased below the programmed threshold, it starts operating again. There is a
built-in hysteresis to avoid unstable operation at IC temperatures at the overtemperature threshold. The
overtemperature protection is not active in bypass mode operation.
7.3.6 Overvoltage Protection
In boost mode operation (EB/BYP = high), the device features a redundant over voltage protection circuit (OVP),
which is independent from the reference, the regulation loop and feedback divider network. The redundant over
voltage protection circuit limits the output voltage to typically 5.4V. The over voltage protection can only limit the
output voltage in boost mode operation, when the input voltage VIN is smaller than the output voltage VOUT
.
7.4 Device Functional Modes
7.4.1 Boost Mode Operation
The device is enabled and operates in boost mode operation when the EN/BYP pin is set high. The bypass
switch is turned off once the boost converter has started switching.
In boost mode operation, the device is controlled by a hysteretic current mode controller. This controller regulates
the output voltage by keeping the inductor ripple current constant in the range of 300 mA and adjusting the offset
of this inductor current depending on the output load. If the required average input current is lower than the
average inductor current defined by this constant ripple, the inductor current goes discontinuous to keep the
efficiency high at low load conditions. To achieve high efficiency, the power stage is realized as a synchronous
boost topology.
IL
Continuous Current Operation
IIN
Discontinuous Current Operation
Ilpp =
300 mA (typ.)
Ilpp =
300 mA (typ.)
t
Figure 7. Hysteretic Current Operation
8
Copyright © 2014, Texas Instruments Incorporated
TPS61291
www.ti.com.cn
ZHCSCS7A –SEPTEMBER 2014–REVISED SEPTEMBER 2014
Device Functional Modes (continued)
The output voltage VOUT is monitored via the integrated feedback network which is connected to the voltage error
amplifier. To regulate the output voltage, the voltage error amplifier compares this feedback voltage to the
internal voltage reference and adjusts the required offset of the inductor current accordingly.
The hysteretic current mode architecture allows fast response to load variations.
7.4.2 Bypass Mode Operation
The TPS61291 includes a P-channel MOSFET (Bypass Switch) between the VIN and VOUT pins. When the IC
is disabled (EN/BYP = low), bypass mode is activated to provide a direct, low impedance connection from the
input voltage (at the VIN pin) to the load (VOUT). The bypass switch is not impacted by undervoltage lockout, or
thermal shutdown. The bypass switch is not current-limit controlled. In bypass operation, the OVP circuit is
disabled.
7.4.3 Controlled Transition into Bypass Mode
When changing from boost mode into bypass mode, the output capacitor is usually charged up to a higher
voltage than the battery voltage VBAT. In order to prevent current flowing from the output capacitor COUT via the
bypass switch into the battery (reverse battery current), the internal bypass control circuit delays the bypass
switch activation until the output voltage VOUT has decreased to the input voltage level.
7.4.4 Operation at Output Overload
If the peak inductor current reaches the internal switch current limit threshold in boost mode operation, the main
switch is turned off to stop a further increase of the input current. In this case the output voltage will decrease
since the device cannot provide sufficient power to maintain the set output voltage. If the output voltage drops
below the input voltage, the backgate diode of the rectifying switch gets forward biased and current starts to flow
through it. Because this diode cannot be turned off, the load current is only limited by the remaining DC
resistance. As soon as the overload condition is removed, the converter automatically resumes normal operation
and enters the appropriate soft start mode depending on the operating conditions.
7.4.5 Startup
After the EN/BYP pin is tied high, the device starts to operate. If the input voltage is not high enough to supply
the control circuit properly, a startup oscillator starts to operate the switches. During this phase, the switching
frequency is controlled by the oscillator and the switch current is limited. As soon as the device has built up the
output voltage to about 1.8 V, high enough for supplying the control circuit, the device switches to its normal
hysteretic current mode operation.
Copyright © 2014, Texas Instruments Incorporated
9
TPS61291
ZHCSCS7A –SEPTEMBER 2014–REVISED SEPTEMBER 2014
www.ti.com.cn
8 Applications and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The TPS61291 is a boost converter with pin selectable output voltages and an integrated bypass mode. In
bypass operation, the device provides a direct path from the input to the system and allows a low power micro
controller (MCU) to operate directly from a single 3V Li-MnO2 battery or dual alkaline battery cells. In bypass
mode, the quiescent current consumption is typically only 15nA and supports low power modes of MCUs such as
the MSP430. In boost mode operation, the device provides a regulated output voltage (e.g. 3.3V) to supply
circuits which require a higher voltage than provided by the battery. See Figure 8.
The device also extends battery life in applications which can run partially directly from the battery, but need a
boost conversion to maintain sufficient system voltage when the battery voltage drops due to discharge. In this
case, the system runs off the battery in bypass mode operation until the battery voltage trips the minimum
system operating voltage. Then the system turns on the boost converter, providing a sufficient output voltage
down to the cut off voltage of the battery. See Figure 9 and Figure 26.
8.2 Typical Application
TPS61291
L = 3.3mH
Subsystem
VCC = 3.3V
VOUT =
VBAT / 3.3V
Step up
converter
SW
VIN
VOUT
2 x 1.5V Alkaline /
1 x 3V Li-MnO2
COUT
MCU
(VCC = VBAT or 3.3V)
Bypass
+
22mF
CIN
-
VSEL
GND
+
-
10mF
+
-
EN/BYP
Figure 8. Typical Application Circuit with Regulated 3.3V VOUT / VBAT
System
TPS61291
L = 3.3mH
VOUT =
VBAT / 2.5V
Step up
converter
SW
VIN
MCU + ADC
Subsystem
VOUT
2 x 1.5V Alkaline /
1 x 3V Li-MnO2
VBAT
COUT
Bypass
+
-
CIN
NC
Minimum VCC for System: 2.2V
Bypass Mode:
VOUT = VBAT (for VBAT > 2.2V)
Boost Mode:
VOUT = 2.5V (for VBAT < 2.2V)
VSEL
GND
+
-
EN/BYP set high
@ VBAT = 2.2V
+
-
EN/BYP
Figure 9. Bypass Mode / Boost Mode Operation to Maintain Sufficient System Voltage
8.2.1 Design Requirements
The TPS61291 is a highly integrated boost converter. The output voltage is set internally via a VSEL pin without
any additional components. For operation, only an input capacitor, output capacitor, and an inductor are required.
Table 1 shows the components used for the application characteristic curves.
10
Copyright © 2014, Texas Instruments Incorporated
TPS61291
www.ti.com.cn
ZHCSCS7A –SEPTEMBER 2014–REVISED SEPTEMBER 2014
Typical Application (continued)
Table 1. Components for Application Characteristic Curves(1)
Reference
Description
Value
Manufacturer
Low Iq Boost Converter with
Bypass Operation
TPS61291
Texas Instruments
CIN
COUT
L
Input capacitor
Output capacitor
Inductor
10µF
22µF
3.3µH
Murata
Murata
Coilcraft
GRM219R61A106KE44D
GRM21BR60J226ME39L
LPS3314 3R3
(1) See the Third-Party Products Disclaimer in the Device Support section.
8.2.2 Detailed Design Procedure
The external components have to fulfill the needs of the application but also the stability criteria of the device's
control loop. The TPS61291 is optimized to work within a range of L and C combinations. The LC output filter
inductance and capacitance must be considered together. The output capacitor sets the corner frequency of the
converter while the inductor creates a Right-Half-Plane-Zero degrading the stability of the converter.
Consequently with a larger inductor a bigger capacitor has to be used to guarantee a stable loop. Table 2 shows
the output filter component selection.
Table 2. Recommended LC Output Filter Combinations
Output capacitor value [µF](2)
Output voltage
Inductor value [µH](1)
[V]
22
22 + 10
2 x 22
(3)
3.3
4.7
2.2
3.3
√
√
√
√
√
√
3.3 / 3.0
√
√
2.5
(3)
√
(1) Inductor tolerance and current de-rating is anticipated. The effective inductance can vary by 20% and -30%.
(2) Capacitance tolerance and bias voltage de-rating is anticipated. The effective capacitance can vary by 20% and -50%.
(3) This LC combination is the standard value and recommended for most applications.
8.2.2.1 Inductor Selection
The device is optimized to operate with a 3.3µH inductor value. Other inductor values can be used, per Table 2.
The maximum inductor current can be approximated by the ILMAX, from Equation 1. For proper operation, the
inductor needs to be rated for a saturation current which is higher than the switch current limit of typically 1A.
Table 3 lists inductors that have been tested with the TPS61291.
V
OUT ´IOUT
ILmax : =
+150 mA continuous current operation
discontinuous current operation
Table 3. List of Inductors(1)
0.8´ V
IN
ILmax : = 300 mA
(1)
INDUCTANCE
DIMENSIONS [mm3]
3.3 x 3.3 x 1.3
2.95 x 2.95 x 1.4
3 x 2.5 x 1.5
TYPE
LPS3314
SUPPLIER
3.3
3.3
3.3
3.3
3.3
3.3
Coilcraft
LPS3015
VLF302515
MDMK2020T3R3M
DFE252012
74438335033
TDK
Taiyo Yuden
Toko
2 x 2 x 1.2
2.5 x 2.0 x 1.2
3.0 x 3.0 x 1.5
Würth
(1) See the Third-Party Products Disclaimer in the Device Support section.
Copyright © 2014, Texas Instruments Incorporated
11
TPS61291
ZHCSCS7A –SEPTEMBER 2014–REVISED SEPTEMBER 2014
www.ti.com.cn
8.2.2.2 Input and Output Capacitor Selection
For best output and input voltage filtering, low ESR X5R or X7R ceramic capacitors are recommended. The input
capacitor minimizes input voltage ripple, suppresses input voltage spikes and provides a stable system rail for
the device. At least a 10μF or larger input capacitor is recommended for operation. In applications in which the
power source (e.g. certain battery chemistries) shows an internal resistance characteristic, a larger input
capacitor might be used to buffer the supply voltage for the TPS61291. The recommended typical output
capacitor value is 22 μF and can vary as outlined in the output filter selection Table 2.
12
Copyright © 2014, Texas Instruments Incorporated
TPS61291
www.ti.com.cn
ZHCSCS7A –SEPTEMBER 2014–REVISED SEPTEMBER 2014
8.2.3 Application Curves
100
100
95
90
85
80
75
70
65
60
55
50
95
90
85
80
75
70
65
60
55
50
VIN = 1.2V
VIN = 1.8V
VIN = 2.5V
VIN = 2.7V
VIN = 1.2V
VIN= 1.8V
VIN = 2.5V
VIN = 3.0V
0.01
0.1
1
10
100
0.01
0.1
1
10
100
Output Current IOUT [mA]
Output Current IOUT [mA]
C002
C002
EN/BYP = high
L = 3.3µH
VSEL = VOUT
EN/BYP = high
L = 3.3µH
VSEL = GND
Figure 11. Efficiency vs IOUT, VOUT = 3.0V
Figure 10. Efficiency vs IOUT, VOUT = 3.3V
100
95
90
85
80
75
70
65
60
55
50
3.399
3.366
3.333
3.300
3.267
VIN = 1.2V
VIN = 1.8V
VIN = 2.2V
VIN = 1.2V
VIN = 1.8V
VIN = 2.5V
VIN = 3.0V
0.01
0.1
1
10
100
0.01
0.1
1
10
100
Output Current IOUT [mA]
Output Current IOUT[mA]
C001
C006
EN/BYP = high
L = 3.3µH
VSEL = open
EN/BYP = high
L = 3.3µH
VSEL = GND
Figure 12. Efficiency vs IOUT, VOUT = 2.5V
Figure 13. Output Voltage vs Output Current VOUT = 3.3V
3.090
3.060
3.030
3.000
2.970
2.575
2.550
2.525
VIN = 1.2V
VIN = 1.2V
VIN = 1.8V
VIN = 2.5V
VIN = 1.8V
2.500
VIN = 2.2V
2.475
0.01
0.1
1
10
100
0.01
0.1
1
10
100
Output Current IOUT [mA]
Output Current IOUT [mA]
C005
C004
EN/BYP = high
L = 3.3µH
VSEL = VOUT
EN/BYP = high
L = 3.3µH
VSEL = open
Figure 14. Output Voltage vs Output Current VOUT = 3.0V
Figure 15. Output Voltage vs Output Current VOUT = 2.5V
Copyright © 2014, Texas Instruments Incorporated
13
TPS61291
ZHCSCS7A –SEPTEMBER 2014–REVISED SEPTEMBER 2014
www.ti.com.cn
35
30
25
20
15
10
5
0.600
0.500
0.400
TA = 25°C
TA = -40°C
TA = 85°C
0.300
VOUT = 2.5V
VOUT = 3.0V
VOUT = 3.3V
0.200
0.100
0.000
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0.9
1.4
1.9
2.4
2.9
Input Voltage VIN [V]
Input Voltage VIN [V]
C001
EN/BYP = high
L = 3.3µH
ISW = 1000mA (typical)
Boost mode operation
VOUT = 3.3 V
IOUT = 0 mA
L = 3.3 µH
COUT = 22 µF
Device switching
Figure 16. Maximum Output Current
Figure 17. Supply Current vs. VIN, VOUT = 3.3V, IOUT = 0mA
35
30
25
20
15
10
5
30
TA = 25°C
TA = -40°C
TA = 85°C
TA = 25°C
TA = -40°C
25
TA = 85°C
20
15
10
5
0
0
0.9
1.4
1.9
2.4
2.9
0.9
1.4
1.9
2.4
Input Voltage VIN [V]
Input Voltage VIN [V]
VOUT = 3.0 V
IOUT = 0 mA
L = 3.3 µH
COUT = 22 µF
VOUT = 2.5 V
IOUT = 0 mA
L = 3.3 µH
COUT = 22 µF
Device switching
Device switching
Figure 18. Supply Current vs. VIN, VOUT = 3.0V, IOUT = 0mA
Figure 19. Supply Current vs. VIN, VOUT = 2.5V, IOUT = 0mA
VIN = 2.0 V
L = 3.3 µH
COUT = 22 µF
VSEL = GND
EN/BYP = high
VIN = 1.8 V
VOUT = 3.3 V
VSEL = GND
L = 3.3 µH
COUT = 22 µF
IOUT = 150 mA
EN/BYP = high
VOUT = 3.3 V
IOUT = 15mA
Figure 20. Discontinuous Conduction Mode Operation,
VOUT = 3.3V
Figure 21. Continuous Conduction Mode Operation,
VOUT = 3.3V
14
Copyright © 2014, Texas Instruments Incorporated
TPS61291
www.ti.com.cn
ZHCSCS7A –SEPTEMBER 2014–REVISED SEPTEMBER 2014
VIN = 1.8V
VOUT = 3.3V
L = 3.3µH
COUT = 22 µF
VSEL = GND
VIN = 1.8V
L = 3.3µH
COUT = 22 µF
VSEL = GND
VOUT = 3.3V
ILOAD 20mA /150mA
ILOAD 1mA/200mA
Figure 22. Load Transient Response
Figure 23. AC Load Sweep
Boost operation
Bypass switch activation
when VOUT is discharged to VIN level
Bypass mode
VIN = 2.5V/3V
VOUT = 3.3V
L = 3.3µH
COUT = 22 µF
Load =100Ω
VIN = 2.0V
L = 3.3µH
COUT = 22 µF
RLOAD = 1kΩ
VSEL = GND
VOUT = 3.3V
VSEL = GND
Figure 24. Line Transient Response
Figure 25. Boost Mode / Bypass Mode Transition
VIN
VOUT = 2.5V
VOUT
tracks VIN
VIN < 2.2V
EN/BYP control
IL
VIN = 0.9V to 3V
VOUT = 2.5V
VSEL = Open
ILOAD = 5mA
VIN = 2.0V
L = 3.3µH
COUT = 22 µF
EN/BYP externally controlled
Bypass / Boost mode operation
VOUT = 3.3V
VSEL = GND
RLOAD = 100Ω
Figure 26. Bypass / Boost Mode Operation
Figure 27. Startup in Boost Mode
Copyright © 2014, Texas Instruments Incorporated
15
TPS61291
ZHCSCS7A –SEPTEMBER 2014–REVISED SEPTEMBER 2014
www.ti.com.cn
9 Power Supply Recommendations
The input power supply needs to have a current rating according to the supply voltage, output voltage and output
current of the TPS61291.
10 Layout
10.1 Layout Guidelines
As for all switching power supplies, the layout is an important step in the design. Care must be taken in board
layout to get the specified performance. If the layout is not carefully done, the regulator could show poor line
and/or load regulation, stability issues as well as EMI problems. It is critical to provide a low inductance, low
impedance ground path. Therefore, use wide and short traces for the main current paths. In a boost converter,
the ripple current on the output is larger than the ripple current on the input. The output capacitor needs to be
placed as close as possible between the VOUT and the GND pins. The input capacitor should be placed as
close as possible to the VIN and GND pins. Place the inductor close by the IC and connect it with short and thick
traces to the IC. Avoid current loops to minimize radiated noise and stray fields. The exposed thermal pad of the
package and the GND pin must be connected. See Figure 28 for the recommended PCB layout.
10.2 Layout Example
Area: ~ 51 mm2
VIN
VOUT
GND
GND
U1
L
COUT
CIN
Figure 28. Recommended PCB Layout
16
版权 © 2014, Texas Instruments Incorporated
TPS61291
www.ti.com.cn
ZHCSCS7A –SEPTEMBER 2014–REVISED SEPTEMBER 2014
11 器件和文档支持
11.1 器件支持
11.1.1 第三方产品免责声明
TI 发布的与第三方产品或服务有关的信息，不能构成与此类产品或服务或保修的适用性有关的认可，不能构成此类
产品或服务单独或与任何 TI 产品或服务一起的表示或认可。
11.2 文档支持
11.2.1 相关文档ꢀ
《TPS61291EVM-569 用户指南》，SLVUA29
11.3 商标
11.4 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损
伤。
11.5 术语表
SLYZ022 — TI 术语表。
这份术语表列出并解释术语、首字母缩略词和定义。
12 机械封装和可订购信息
以下页中包括机械封装和可订购信息。 这些信息是针对指定器件可提供的最新数据。 这些数据会在无通知且不对
本文档进行修订的情况下发生改变。 欲获得该数据表的浏览器版本，请查阅左侧的导航栏。
版权 © 2014, Texas Instruments Incorporated
17
PACKAGE OPTION ADDENDUM
www.ti.com
24-Mar-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS61291DRVR
TPS61291DRVT
ACTIVE
ACTIVE
WSON
WSON
DRV
DRV
6
6
3000 RoHS & Green
250 RoHS & Green
Call TI | NIPDAU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
-40 to 85
-40 to 85
PC4I
PC4I
Samples
Samples
NIPDAU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
24-Mar-2023
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Jun-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS61291DRVR
TPS61291DRVT
WSON
WSON
DRV
DRV
6
6
3000
250
180.0
180.0
8.4
8.4
2.3
2.3
2.3
2.3
1.15
1.15
4.0
4.0
8.0
8.0
Q2
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Jun-2016
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS61291DRVR
TPS61291DRVT
WSON
WSON
DRV
DRV
6
6
3000
250
210.0
210.0
185.0
185.0
35.0
35.0
Pack Materials-Page 2
GENERIC PACKAGE VIEW
DRV 6
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
Images above are just a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4206925/F
PACKAGE OUTLINE
DRV0006A
WSON - 0.8 mm max height
SCALE 5.500
PLASTIC SMALL OUTLINE - NO LEAD
2.1
1.9
A
B
PIN 1 INDEX AREA
2.1
1.9
0.8
0.7
C
SEATING PLANE
0.08 C
(0.2) TYP
0.05
0.00
1
0.1
EXPOSED
THERMAL PAD
3
4
6
2X
7
1.3
1.6 0.1
1
4X 0.65
0.35
0.25
6X
PIN 1 ID
(OPTIONAL)
0.3
0.2
6X
0.1
C A
C
B
0.05
4222173/B 04/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
DRV0006A
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
6X (0.45)
6X (0.3)
(1)
1
7
6
SYMM
(1.6)
(1.1)
4X (0.65)
4
3
SYMM
(1.95)
(R0.05) TYP
(
0.2) VIA
TYP
LAND PATTERN EXAMPLE
SCALE:25X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4222173/B 04/2018
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations are shown.
www.ti.com
EXAMPLE STENCIL DESIGN
DRV0006A
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
SYMM
7
6X (0.45)
METAL
1
6
6X (0.3)
(0.45)
SYMM
4X (0.65)
(0.7)
4
3
(R0.05) TYP
(1)
(1.95)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD #7
88% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:30X
4222173/B 04/2018
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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