TPS613223ADBVT [TI]
6µA 静态电流 1.8A 开关电流升压转换器 | DBV | 5 | -40 to 85;
| 型号： | TPS613223ADBVT |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 6µA 静态电流 1.8A 开关电流升压转换器 | DBV | 5 | -40 to 85 升压转换器 开关 光电二极管 |
| 文件： | 总35页 (文件大小：1975K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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TPS61322
ZHCSI34D –JANUARY 2018–REVISED FEBRUARY 2019
TPS61322 6.5µA 静态电流、1.8A 开关电流升压转换器
1 特性
3 说明
1
•
•
•
•
•
工作输入电压范围：0.9V 至 5.5V
TPS61322 是一款具有仅 6.5µA 静态电流的同步升压
转换器。TPS61322 可以为由碱性电池、镍氢可再充
电电池或单节锂离子电池供电的产品提供电源解决方
案。该升压转换器建立在采用同步整流的迟滞控制拓扑
基础之上，能够以最小静态电流实现最高的效率。
TPS61322 也支持使用小型外部电感器和电容器。
10mA 负载条件下进行 1.5V 输入至 2.2V 输出转换时
效率高于 90%。
输出电压范围：1.8V 至 5.5V
VOUT 引脚静态电流为 6.5µA
温度范围内输出电压精度为 ±3%
最小开关峰值电流限制：
–
–
–
–
TPS613223A 为 0.42A
TPS61322 为 0.5A
TPS613221A 和 TPS613226A 为 0.75A
TPS61322 为 1.10A
TPS61322 还可以通过外部 肖特基二极管支持 高输出
电流应用。利用与内部整流器 FET 并联的外部肖特基
二极管，TPS613222A 可以在进行 3V 输入电压至 5V
输出电压转换时提供高于 500mA 的输出电流能力。
•
10mA 负载条件下进行 1.5V 至 2.2V 转换时效率高
于 90%
•
•
热关断保护
2.9mm × 1.3mm 3 引脚 SOT 封装和 2.9mm ×
1.6mm 5 引脚 SOT 封装
使用 TPS61322 并借助 WEBENCH® 电源设计器
创建定制设计
可以在内部将输出电压设置为 1.8V 至 5.5V 范围内的
某个固定输出（单位增量为 0.1V）。因此，仅需两个
外部组件即可实现所需的输出电压。TPS61322 还具
有热关断保护功能。
•
2 应用
TPS61322 采用 2.9mm × 1.3mm 3 引脚 SOT 封装或
2.9mm × 1.6mm 5 引脚 SOT 封装。
•
•
•
•
•
1 至 3 节碱性电池或镍氢电池供电型 应用
游戏控制
器件信息(1)
平板电脑
便携式电子产品
医疗设备
器件号
TPS61322
封装
SOT-23 (3)
SOT-23 (5)
封装尺寸（标称值）
2.90mm x 1.30mm
2.90mm × 1.60mm
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
典型应用电路
VOUT
SW
VOUT
L1
C1
Battery
TPS61322xx
GND
1
本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。 有关适用的官方英文版本的最新信息，请访问 www.ti.com，其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLVSDY5
TPS61322
ZHCSI34D –JANUARY 2018–REVISED FEBRUARY 2019
www.ti.com.cn
目录
1
2
3
4
5
6
7
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Device Comparison Table..................................... 3
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4
7.2 ESD Ratings ............................................................ 4
7.3 Recommended Operating Conditions....................... 4
7.4 Thermal Information.................................................. 4
7.5 Electrical Characteristics........................................... 5
7.6 Typical Characteristics.............................................. 6
Detailed Description .............................................. 9
8.1 Overview ................................................................... 9
8.2 Functional Block Diagram ......................................... 9
8.3 Feature Description................................................... 9
9
Application and Implementation ........................ 11
9.1 Application Information............................................ 11
9.2 Typical Application ................................................. 11
9.3 System Examples ................................................... 19
10 Power Supply Recommendations ..................... 20
11 Layout................................................................... 21
11.1 Layout Guidelines ................................................. 21
11.2 Layout Examples................................................... 22
12 器件和文档支持 ..................................................... 23
12.1 器件支持 ............................................................... 23
12.2 文档支持 ............................................................... 23
12.3 接收文档更新通知 ................................................. 23
12.4 社区资源................................................................ 23
12.5 商标....................................................................... 23
12.6 静电放电警告......................................................... 23
12.7 术语表 ................................................................... 24
13 机械、封装和可订购信息....................................... 24
8
4 修订历史记录
注：之前版本的页码可能与当前版本有所不同。
Changes from Revision C (May 2018) to Revision D
Page
•
•
•
•
已删除 从 TPS61322 标题中删除了“准 GPN”并将“TPS61322xx”更改成了“TPS61322”......................................................... 1
已添加 添加了 WEBENCH 链接 ............................................................................................................................................. 1
Changed the NFET symbol in Functional Block Diagram ...................................................................................................... 9
Added Device Functional Modes.......................................................................................................................................... 10
Changes from Revision B (April 2018) to Revision C
Page
•
•
Deleted Cross Reference to Device Comparison Table and the Electrical Characteristics table footnotes regarding
device TPS61223A, that was Product Preview device in the SLVSDY5B revision. .............................................................. 3
Added graphs pertaining to TPS613223A device to the Typical Characteristics matrix. ...................................................... 6
Changes from Revision A (January 2018) to Revision B
Page
•
Deleted Cross Reference to Device Comparison Table and the Electrical Characteristics table footnotes regarding
devices TPS61221A, TPS61222A, and TPS61226A that were Product Preview devices in the SLVSDY5A revision. ........ 3
Added Figure 3, Figure 4 and Figure 5 .................................................................................................................................. 6
Added Figure 7, Figure 8, and Figure 11 ............................................................................................................................... 8
•
•
Changes from Original (September 2017) to Revision A
Page
•
2018 年 1 月生产数据发布。 .................................................................................................................................................. 1
2
Copyright © 2018–2019, Texas Instruments Incorporated
TPS61322
www.ti.com.cn
ZHCSI34D –JANUARY 2018–REVISED FEBRUARY 2019
5 Device Comparison Table
PART NUMBER
TPS61322
OUTPUT VOLTAGE
TYPICAL CURRENT LIMIT
2.2 V
3.3 V
5 V
0.75A
1.2 A
1.8 A
0.75 A
0.75 A
1.2 A
1.2 A
TPS613221A
TPS613222A
TPS613223A
2 V
TPS613224A(1)
TPS613225A(1)
TPS613226A
2.5 V
3 V
3.6 V
(1) Product Preview. Contact TI factory for more information.
6 Pin Configuration and Functions
DBZ Package
3-Pin SOT
Top View
VOUT
GND
TPS61322xA
TPS61322
GND
SW
VOUT
SW
DBV Package
5-Pin SOT
Top View
NC
VOUT
TPS61322xA
GND
SW
NC
Pin Functions
PIN
TPS61322xA
TPS61322
TYPE
DESCRIPTION
NAME
DBZ
DBZ
DBV
1
2
3
-
3
2
1
-
2
1
4
3
5
GND
SW
PWR
PWR
PWR
-
Ground of the IC.
The switch pin of the converter. It is connected to the inductor.
Boost converter output.
VOUT
NC
No connection inside the device.
-
-
NC
-
No connection inside the device.
Copyright © 2018–2019, Texas Instruments Incorporated
3
TPS61322
ZHCSI34D –JANUARY 2018–REVISED FEBRUARY 2019
www.ti.com.cn
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
–40
–65
MAX
6.0
UNIT
V
Voltage range at terminals(2)
Operating Junction Temperature,TJ
Storage Temperature, Tstg
SW, VOUT
150
150
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
7.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
C101(2)
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
0.9
1.8
0.7
4.7
-40
NOM
MAX
5.5
UNIT
V
VIN
VOUT
L
Input voltage range
Output voltage range
5.5
V
Inductor (effective)
2.2
16
13
µH
µF
°C
COUT
TJ
Output capacitor (effective)
Operating junction temperature
100
125
7.4 Thermal Information
TPS61322
THERMAL METRIC(1)
DBZ (SOT-23)
3-PIN
322.2
107.0
65.8
DBV (SOT-23)
5-PIN
189.7
109.4
56.5
UNIT
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
7.5
33.3
ψJB
64.5
56.5
RθJC(bot)
N/A
N/A
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
4
Copyright © 2018–2019, Texas Instruments Incorporated
TPS61322
www.ti.com.cn
ZHCSI34D –JANUARY 2018–REVISED FEBRUARY 2019
7.5 Electrical Characteristics
TJ = –40°C to +125°C and VIN = 0.9 V to 5.5 V. Typical values are at VIN = 1.2 V, TJ = 25°C, unless otherwise noted
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
POWER SUPPLY
VIN
Input voltage range
0.9
5.5
V
V
Minimum voltage for
startup at VOUT pin
VVOUT_START
R
Load ≥ 250Ω ,TJ =-40°C to 85°C
0.83
6.5
0.87
Quiescent current into
VOUT pin
IQ
VOUT = 1.2×Target
10
uA
OUTPUT
TPS61322
VIN < VOUT, TJ =-40°C to 125°C
VIN < VOUT, TJ =-40°C to 125°C
VIN < VOUT, TJ =-40°C to 125°C
VIN < VOUT, TJ =-40°C to 125°C
VIN < VOUT, TJ =-40°C to 125°C
2.134
3.2
2.2
3.3
5.0
2.0
3.6
2.266
3.4
V
V
V
V
V
TPS613221A
TPS613222A
TPS613223A
TPS613226A
VOUT
4.85
1.94
3.49
5.15
2.06
3.71
Leakage current into
SW pin
ISW_LKG
VSW = VOUT = 1.2×Target
3.5
nA
POWER SWITCH
TPS61322
300
200
mΩ
mΩ
mΩ
mΩ
mΩ
mΩ
mΩ
mΩ
mΩ
mΩ
A
TPS613221A
TPS613222A
TPS613223A
TPS613226A
TPS61322
Low side switch on
resistance
RDS(on)_LS
RDS(on)_HS
ILIM
150
400
190
1300
1000
750
TPS613221A
TPS613222A
TPS613223A
TPS613226A
TPS61322
High side switch on
resistance
1680
950
0.50
0.75
1.10
0.42
0.75
0.75
1.20
1.80
0.75
1.20
1.20
1.60
2.50
1.2
TPS613221A
TPS613222A
TPS613223A
TPS613226A
A
Peak switch current
limit
A
A
1.60
A
Protection
TSD
Over-temperature
protection
TJ rising
150
20
°C
°C
Over-temperature
protection hysteresis
TSD_HYS
Copyright © 2018–2019, Texas Instruments Incorporated
5
TPS61322
ZHCSI34D –JANUARY 2018–REVISED FEBRUARY 2019
www.ti.com.cn
7.6 Typical Characteristics
TJ = 25°C unless otherwise noted.
100
90
80
70
60
50
40
2.25
2.24
2.23
2.22
2.21
2.2
2.19
2.18
2.17
2.16
2.15
30
VIN = 0.9 V
VIN = 1.2 V
VIN = 1.5 V
VIN = 0.9 V
VIN = 1.2 V
VIN = 1.5 V
VIN = 1.8 V
20
10
VIN = 1.8 V
0
0.0001
0.001
0.01
0.1
1
0.0001
0.001
0.01
0.1
1
Output Current (A)
Output Current (A)
D005
D006
TPS61322
L = 4.7 µH
TPS61322
L = 4.7 µH
Figure 1. Load Efficiency with Different Inputs
Figure 2. Load Regulation
100
3.45
3.4
95
90
85
80
75
70
65
60
55
3.35
3.3
Vin=0.9V
Vin=0.9V
Vin=1.5V
Vin=2.5V
Vin=3.0V
Vin=3.3V
Vin=1.5V
Vin=2.5V
Vin=3.0V
Vin=3.3V
3.25
50
3.2
0.0001
0.001
0.010.02 0.05 0.1 0.2 0.5
Iout (A)
1
0.0001
0.001
0.010.02 0.05 0.1 0.2 0.5
Iout (A)
1
D003
D008
TPS613221A
L = 2.2 µH
TPS613221A
L = 2.2 µH
Figure 3. Load Efficiency with Different Inputs
Figure 4. Load Regulation
5.15
100
95
90
85
80
75
70
65
60
55
50
5.1
5.05
5
Vin=0.9V
Vin=1.5V
Vin=3.0V
Vin=3.6V
Vin=4.2V
Vin=0.9V
Vin=1.5V
Vin=3.0V
Vin=3.6V
Vin=4.2V
4.95
4.9
0.0001
0.001
0.010.02 0.05 0.1 0.2 0.5
Iout (A)
1
D004
0.0001
0.001
0.010.02 0.05 0.1 0.2 0.5
Iout (A)
1
TPS613222A
L = 2.2 µH
D007
TPS613222A
L = 2.2 µH
Figure 5. Load Efficiency with Different Inputs
Figure 6. Load Regulation
6
Copyright © 2018–2019, Texas Instruments Incorporated
TPS61322
www.ti.com.cn
ZHCSI34D –JANUARY 2018–REVISED FEBRUARY 2019
Typical Characteristics (continued)
TJ = 25°C unless otherwise noted.
3.75
3.7
100
95
90
85
80
75
3.65
3.6
70
Vin=0.9V
Vin=0.9V
Vin=1.5V
Vin=2.5V
Vin=3.0V
Vin=3.3V
65
60
55
Vin=1.5V
Vin=2.5V
Vin=3.0V
Vin=3.3V
3.55
3.5
0.0001
50
0.001
0.010.02 0.05 0.1 0.2 0.5
Iout (A)
1
0.0001
0.001
0.010.02 0.05 0.1 0.2 0.5
Iout (A)
1
D006
D005
TPS613226A
L = 2.2 µH
TPS613226A
L = 2.2 µH
Figure 8. Load Regulation
Figure 7. Load Efficiency with Different Inputs
100
95
90
85
80
75
70
65
60
55
50
2.15
2.1
Vin=0.9V
Vin=1.2V
Vin=1.5V
Vin=1.8V
2.05
2
Vin=0.9V
Vin=1.2V
Vin=1.5V
Vin=1.8V
1.95
0.0001
0.001
0.005
Iout (A)
0.02 0.05 0.1 0.2
D008
0.0001
0.001
0.005
0.02 0.05 0.1 0.2
Iout (A)
D020
TPS613223A
L = 4.7 µH
TPS613223A
L = 4.7 µH
Figure 10. Load Regulation
Figure 9. Load Efficiency with Different Inputs
1500
1400
1300
1200
1100
1000
2000
1900
1800
1700
1600
1500
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Temperature (°C)
Temperature (°C)
D009
D001
TPS613221A
L = 2.2 µH
TPS613222A
L = 2.2 µH
Figure 11. Current Limit with Different Temperature
Figure 12. Current Limit with Different Temperature
Copyright © 2018–2019, Texas Instruments Incorporated
7
TPS61322
ZHCSI34D –JANUARY 2018–REVISED FEBRUARY 2019
www.ti.com.cn
Typical Characteristics (continued)
TJ = 25°C unless otherwise noted.
1500
1
0.9
0.8
0.7
0.6
0.5
1400
1300
1200
1100
1000
-60
-30
0
30
60
90
120
150
-50
-25
0
25
50
75
100
125
Temperature (°C)
D022
Temperature (°C)
D001
TPS613223A
L = 4.7 µH
TPS613226A
L = 2.2 µH
Figure 14. Current Limit with Different Temperature
Figure 13. Current Limit with Different Temperature
8
Copyright © 2018–2019, Texas Instruments Incorporated
TPS61322
www.ti.com.cn
ZHCSI34D –JANUARY 2018–REVISED FEBRUARY 2019
8 Detailed Description
8.1 Overview
The TPS61322xx is a low quiescent current, high efficiency synchronous boost converter. The TPS61322xx uses
hysteretic current control scheme. The TPS61322xx is designed for systems powered by alkaline battery, NiMH
rechargeable battery, Li-ion battery or Li-polymer battery. The input voltage range is from 0.9 V to 5.5 V. After
start-up is completed, the TPS61322xx can work with the input voltage down to 0.4 V. The TPS61322xx
consumes only 6.5-µA quiescent current and achieves high efficiency under light load conditions. The
TPS61322xx is designed as an always-on power. Higher than 90% efficiency is achieved under 10-mA load from
1.5-V input voltage to 2.2-V output voltage conversion to extend battery lifetime. The TPS613222A can support
as high as 500-mA output current from 3-V input voltage to 5-V output voltage conversion with an external
schottky diode in parallel with internal high-side MOSFET.
8.2 Functional Block Diagram
2
3
SW
VOUT
VOUT
VOUT
UVLO
Gate Driver
Gate Driver
Current
Sense
Logic
PWM Control
Soft Start &
Current Limit
Control
Thermal
Shutdown
EA
1
GND
VREF
Copyright © 2017, Texas Instruments Incorporated
8.3 Feature Description
8.3.1 Soft Start
When the input voltage is applied, the high side MOSFET is turned on. The input voltage charges the output
capacitors through the inductor and the high side MOSFET. When the output capacitors are charged to 0.83-V
typical value, the TPS61322xx starts switching at 1.6-MHz fixed frequency and the high-side MOSFET is turned
off. When the output voltage goes up to typical 1.6 V, an internal soft-start control circuit ramps the reference
voltage to 0.8 V within 2 ms. In this way, the soft-start function reduces the input inrush current. After the output
voltage reaches the target value, soft start ends, and the inductor peak current is determined by the output of an
internal error amplifier. After start-up, the TPS61322xx can work with the input voltage down to 0.4 V.
Copyright © 2018–2019, Texas Instruments Incorporated
9
TPS61322
ZHCSI34D –JANUARY 2018–REVISED FEBRUARY 2019
www.ti.com.cn
Feature Description (continued)
8.3.2 Boost Controller Circuit
The TPS61322xx boost converter is controlled by a hysteretic current mode scheme. The TPS61322xx regulates
the output voltage by keeping the inductor ripple constant of 200-mA typical value and adjusting the offset of this
inductor current depending on the output load. If the required average input current is lower than average
inductor current defined by this constant ripple current, the inductor current becomes discontinuous to keep the
efficiency high under light load conditions. Figure 15 illustrates the hysteretic current operation.
The output voltage VOUT is monitored via the internal feedback network connected to a voltage error amplifier. To
regulate the output voltage, the voltage error amplifier compares this feedback voltage to the internal voltage
reference and adjusts the required offset of the inductor current accordingly.
IL
Continuous Current Operation
Discontinuous Current Operation
200mA
200mA
t
Figure 15. Hysteretic Current Operation
The TPS61322xx boost converter can increase the output load capacity by connecting an external schottky diode
from SW pin to VOUT pin. Higher than 500 mA output current is supported for 5-V output voltage applications
such as USB OTG and HDMI power supply. For such applications, an adaptive constant off time circuit will
generate the signal to turn off high-side FET. The inductor current ripple is greater than 200 mA if with this
external diode. A higher inductance can help reduce the inductor current ripple.
8.3.3 Undervoltage Lockout
An undervoltage lockout function stops operation of the converter if the input voltage drops below the typical
undervoltage lockout threshold of 0.4 V while the output voltage is still higher than 1.8 V. A hysteresis of 100 mV
is added so that the device does not switch again until the input voltage goes up to 0.5 V.
8.3.4 Current Limit Operation
The TPS61322xx employs cycle-by-cycle peak current limit operation. If the inductor peak current hits the peak
current limit ILIM, the low-side MOSFET is turned off and stops the further increase of the inductor current. In this
case the output voltage drops until power balance between the input side and output side is achieved. If the
output voltage drops below the input voltage, the inductor current will be clamped by the DCR of the inductor and
the on-resistance (Rds,on) of the high-side MOSFET.
8.3.5 Overtemperature Protection
The TPS61322xx has a built-in temperature sensor which monitors the internal junction temperature in boost
mode operation. If the junction temperature exceeds the threshold 150°C, the device stops operating. As soon as
the junction temperature drops below the shutdown temperature minus the hysteresis, typically 130°C, the device
starts operating again.
8.3.6 Device Functional Modes
•
•
Boost Controller Circuit - Continuous and discontinuous current operation
Protective mechanisms
–
–
–
Current Limit Operation
Undervoltage Lockout
Overtemperature Protection
10
Copyright © 2018–2019, Texas Instruments Incorporated
TPS61322
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ZHCSI34D –JANUARY 2018–REVISED FEBRUARY 2019
9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The TPS61322xx is designed to operates at a wide input voltage range from 0.9-V to 5.5-V. The minimum peak
switch current limit is 0.5 A for TPS61322, with 0.75 A for TPS613221A and 1.1 A for TPS613222A. The
TPS61322xx supports output voltage from 1.8 V to 5.5 V with increment of 0.1 V, refer to Device Comparison
Table for device details to select the right device for the target applications. Use the following design procedure
to select component values for the TPS61322xx.
9.2 Typical Application
9.2.1 Boost without Schottky Diode
A typical application example is the wireless mouse, which normally requires 2.2-V voltage as its supply voltage
and consumes less than 50-mA current from one-cell alkaline battery. The following design procedure can be
used to select external component values for TPS61322xx.
4.7uH
VOUT
SW
VOUT
L1
C1
Battery
22uF
TPS61322xx
GND
Copyright © 2017, Texas Instruments Incorporated
Figure 16. Typical Application Circuit without Schottky Diode
9.2.1.1 Design Requirements
Table 1. Design Requirements
PARAMETERS
Input voltage
VALUES
0.9 V to 1.6 V
2.2 V
Output voltage
Output current
50 mA
Output voltage ripple
±10 mV
Copyright © 2018–2019, Texas Instruments Incorporated
11
TPS61322
ZHCSI34D –JANUARY 2018–REVISED FEBRUARY 2019
www.ti.com.cn
9.2.1.2 Detailed Design Procedure
9.2.1.2.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the TPS61322 device with the WEBENCH® Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
•
•
•
•
Run electrical simulations to see important waveforms and circuit performance
Run thermal simulations to understand board thermal performance
Export customized schematic and layout into popular CAD formats
Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
9.2.1.2.2 Maximum Output Current
For boost converters, the maximum output current capability is determined by the input to output ratio, the
efficiency, the inductor current ripple and the current limit. The maximum output current can be estimated by
Equation 1
I LH
VIN ì ( I LIM
-
) ìh
2
IOUT (max)
=
VOUT
where
•
•
•
ILIM is the peak inductor current limit
ILH is the inductor current ripple
η is the boost converter power convert efficiency
(1)
Minimum input voltage, maximum boost output voltage and minimum current limit should be used as the worst
case condition for the estimation.
In this example, assume the power efficiency is 70% at the minimum input voltage of 0.9 V. The calculated
maximum output current is 114 mA, which satisfies the application requirements.
9.2.1.2.3 Inductor Selection
Because the inductor affects steady state operation, transient behavior, and loop stability, the inductor is the
most important component in power regulator design. There are three important inductor specifications, inductor
value, saturation current, and dc resistance (DCR).
The TPS61322xx is optimized to work with inductor values between 0.7 µH and 13 µH. The inductor values
affect the switching frequency. The estimated switching frequency in continuous conduction mode(CCM) can be
calculated by Equation 2. The switching frequency ƒSW is not a constant value, which is determined by the
inductance, the inductor current ripple, the input voltage and the output voltage. The current ripple ILH is fixed to
200 mA typically, but it can be affected by the inductor value indirectly. Normally when a smaller inductor value is
applied, the inductor current ramps up and down more quickly. The current ripple becomes bigger because the
internal current comparator has delay to respond. If a smaller inductor peak current is required in applications, a
higher inductor value can be used. However, The inductor and output capacitor must be considered together for
the loop stability. The output capacitor and the inductance will influence the bandwidth and phase margin of the
converter. Consequently, with a larger inductor, a bigger capacitor normally must be used to ensure the same
L/C ratio for a stable loop. For best stability consideration, a 4.7-µH inductor is recommended for 2.2-V output
voltage application.
12
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TPS61322
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ZHCSI34D –JANUARY 2018–REVISED FEBRUARY 2019
VIN ì(VOUT -VIN ì
h)
fSW
=
LìILH ìVOUT
where
•
•
•
fSW is the switching frequency of the converter
ILH is the inductor current ripple
η is the boost converter power convert efficiency
(2)
Having selected the inductance value, follow Equation 3 to Equation 5 to calculate the inductor's peak current for
the application. Depending on different load conditions, the TPS61322xx works in continuous current mode or
discontinuous conduction mode(DCM). In different modes, the peak currents of the inductor are also different.
Equation 3 provides an easy way to estimate whether the device works in CCM or DCM. Equation 4 shows the
peak current when the device works in CCM and Equation 5 shows the peak current when the device works in
DCM.
VOUT ìIOUT ILH
>
VIN ìh
2
where
•
ILH is the inductor current ripple
•
η is the boost converter power convert efficiency
(3)
V
OUTìIOUT ILH
IL,peak
=
+
V ì
h
2
IN
where
•
•
•
IL,peak is the peak current of the inductor
ILH is the inductor current ripple
η is the boost converter power convert efficiency
(4)
(5)
IL, peak = ILH
where
•
•
IL,peak is the peak inductor.
ILH is the inductor current ripple
The saturation current of the inductor must be higher than the calculated peak inductor current, otherwise the
excessive peak current in the inductor harms the device and reduces the system reliability.
In this example, the maximum load for the boost converter is 50 mA, the minimum input voltage is 0.9 V, and the
efficiency under this condition can be estimated at 80%, so the boost converter works in continuous operation
mode by the calculation. The inductor peak current is calculated as 258 mA. To have some margin, a 4.7-µH
inductor with at least 300 mA saturation current is recommended for this application. A 10-µH inductor can be
used as well by increasing the output capacitance to higher than 22 µF to make the loop stable. Table 2 lists the
recommended inductors for TPS61322xx device.
Table 2. List of Inductors
DC
RESISTAN
CE [mΩ]
INDUCTAN SATURATION CURRENT
SIZE (L×W×H)(mm)
PART NUMBER
MANUFACTURER(1)
CE [µH]
[A]
4.7
4.7
4.7
1.7
1.5
1.5
165
141
209
2.5 × 2 × 1.2
3 × 3 × 1.5
DFE252012P-4R7M=P2 MURATA
74438335047
Wurth
2.5 × 2 × 1.2
SDEM25201B-4R7MS
CYNTEC
(1) See Third-party Products Disclaimer
Copyright © 2018–2019, Texas Instruments Incorporated
13
TPS61322
ZHCSI34D –JANUARY 2018–REVISED FEBRUARY 2019
www.ti.com.cn
9.2.1.2.4 Capacitor Selection
For better output voltage filtering, TI recommends low ESR X5R or X7R ceramic capacitors.
For the output capacitor at the VOUT pin, TI recommends small ceramic capacitors. Place the capacitors as
close as possible to the VOUT and GND pins of the device. If, for any reason, the application requires the use of
large capacitors that cannot be placed close to the device, the use of a small ceramic capacitor with a
capacitance value of 1 μF in parallel to the large one is recommended. Place this small capacitor as close as
possible to the VOUT and GND pins of the device.
Considering loop stability, for inductance of 4.7 µH, the minimal output capacitor value is 10 μF (effective value).
Refer to Table 3 for inductor and capacitor combination. Increasing the output capacitor makes the output ripple
smaller.
When selecting capacitors, ceramic capacitor’s derating effect under DC bias voltage must be considered.
Choose the right nominal capacitance by checking capacitor's DC bias characteristics. In this example,
GRM188R60J106ME84D, which is a 10-µF ceramic capacitor with high effective capacitance value at DC biased
condition, is selected for VOUT rail. Two 10-μF capacitors in parallel are recommended to get the desired effective
capacitance.
Table 3. List of Inductor and Capacitor
INDUCTAN
CE [µH]
CAPACITANCE [µF]
LOAD [mA]
PACKAGE
PART NUMBER
MANUFACTURER(1)
1.0
2 × 10
2 × 10
22
50
50
50
0603
0603
0805
GRM188R60J106ME84D MURATA
GRM188R60J106ME84D MURATA
GRM21BZ71A226ME15 MURATA
2.2
4.7
(1) See Third-party Products Disclaimer
9.2.1.3 Application Curves
SW
1V/Div
SW
1V/Div
VOUT(2.2V Offset)
10mV/Div
VOUT(2.2V Offset)
10mV/Div
Inductor Current
50mA/Div
Inductor Current
200mA/Div
VIN = 1.2V
TPS61322
IOUT = 0.1 mA
VIN = 1.2 V
TPS61322
IOUT = 50 mA
Figure 17. Switching Waveform at Light Load
Figure 18. Switching Waveform at Heavy Load
14
Copyright © 2018–2019, Texas Instruments Incorporated
TPS61322
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ZHCSI34D –JANUARY 2018–REVISED FEBRUARY 2019
VIN
VIN
500mV/Div
1V/Div
SW
2V/Div
SW
1V/Div
VOUT(2.2V Offset)
10mV/Div
VOUT
1V/Div
Inductor Current
200mA/Div
Inductor Current
100mA/Div
VIN = 1.2 V
TPS61322
Rload = 250 Ω
VIN = 1.2 V to 1.5 V
TPS61322
IOUT = 50 mA
Figure 19. Start-up by VIN
Figure 20. Line Transient
IOUT
IOUT
50mA/Div
50mA/Div
SW
SW
2V/Div
2V/Div
VOUT(2.2V Offset)
20mV/Div
VOUT(2.2V Offset)
50mV/Div
Inductor Current
200mA/Div
Inductor Current
200mA/Div
VIN = 1.2 V
TPS61322
IOUT = 10 mA to 50 mA
VIN = 1.2 V
TPS61322
IOUT = 10 mA to 100 mA
Figure 21. Load Transient
Figure 22. Load Transient
100
95
90
85
80
75
70
65
60
55
50
L = 2.2 mH
L = 4.7 mH
L = 10 mH
0.0001
0.001
0.01
0.1
Output Current (A)
D007
Wurth Electronics, 74438335XXX family
2.2 µH, 4.7 µH, 10 µH
VIN = 1.2 V
TPS61322
Figure 23. Efficiency with Different Inductance
Copyright © 2018–2019, Texas Instruments Incorporated
15
TPS61322
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www.ti.com.cn
9.2.2 Boost with Schottky Diode
Another typical application example is the USB OTG which normally requires 5-V output as its supply voltage
and consumes as high as 500-mA current. The following design procedure can be used to select external
component values for this application.
R1
C2
D1
5.0V, 500mA
2.2uH
VOUT
SW
VOUT
L1
C1
Battery
22uF
TPS613222A
GND
Figure 24. Typical Application Circuit with Schottky Diode
9.2.2.1 Design Requirements
Table 4. Design Requirements
PARAMETERS
Input voltage
VALUES
3 V to 4.35 V
5 V
Output voltage
Output vurrent
500 mA
± 25 mV
Output voltage ripple
9.2.2.2 Detailed Design Procedure
9.2.2.2.1 Inductor Selection
The peak current is calculated according to Equation 4 and Equation 5.The saturation current of the inductor
must be higher than the calculated peak inductor current.
In this example, the maximum load for the boost converter is 500 mA, and the minimum input voltage is 3 V.
Assuming the efficiency under this condition is 90%, and a typical 2.2-µH inductor is adopted in this application,
so the boost converter works in continuous operation mode by the calculation. The current ripple is 500mA and
the inductor peak current is calculated as 1.18 A. To leave some margin, a 2.2-µH inductor with at least 1.4-A
saturation current is recommended for this application.Table 5 lists the recommended inductors for TPS613222A
device.
Table 5. List of Inductors
DC
RESISTAN
CE [mΩ]
INDUCTAN SATURATION CURRENT
SIZE (L×W×H) (mm)
PART NUMBER
MANUFACTURER(1)
CE [µH]
[A]
2.2
2.2
2.2
2.3
2.4
2.5
82
89
75
2.5 × 2 × 1.2
2.5 × 2 × 1
DFE252012F-2R2M
MURATA
HMLQ25201T-2R2MSR CYNTEC
HMME32251B--2R2MS CYNTEC
3.2 × 2.5 × 1.2
(1) See Third-party Products Disclaimer
16
Copyright © 2018–2019, Texas Instruments Incorporated
TPS61322
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ZHCSI34D –JANUARY 2018–REVISED FEBRUARY 2019
9.2.2.2.2 Schottky Diode Selection
The high switching frequency of TPS61322xx demands a high-speed rectifying switch for optimum efficiency.
Ensure that the average and peak current rating of the diode exceeds the average output current and peak
inductor current. In addition, the reverse breakdown voltage of the diode must exceed the maximum output
voltage of the converter. A snubber circuit consisting of a resistor R1 and a capacitor C2 is needed if the
Schottky diode D1 is soldered. The capacitance of C2 must be larger than triple times of the diode capacitance.
The typical value of the resistor R1 is 5 Ω, and the typical value of the capacitor C2 is 120 pF.
9.2.2.2.3 Capacitor Selection
Refer to Capacitor Selection for the detailed design steps.Table 6 lists the recommended inductor and capacitor
combination. Three 10-μF capacitors in parallel are recommended to get the desired effective capacitance.
Table 6. List of Inductor and Capacitor
INDUCTAN
CE [µH]
CAPACITANCE [µF]
LOAD [mA]
PACKAGE
PART NUMBER
MANUFACTURER(1)
1
3 × 10
3 × 10
2 × 22
500
500
500
0603
0603
0805
GRM188R60J106ME84D
GRM188R60J106ME84D
GRM21BZ71A226ME15
MURATA
MURATA
MURATA
2.2
4.7
(1) See Third-party Products Disclaimer
9.2.2.3 Application Curves
VIN = 3.6 V
TPS613222A
IOUT = 100 mA
VIN = 3.6 V
TPS613222A
IOUT = 0.1 mA
Figure 26. Switching Waveform at Heavy Load
Figure 25. Switching Waveform at Light Load
VIN = 3.6 V
TPS613222A
Rload = 250 Ω
VIN = 3.6 V
TPS613222A
IOUT = 500 mA
Figure 28. Start-up by VIN
Figure 27. Switching Waveform at Heavy Load
Copyright © 2018–2019, Texas Instruments Incorporated
17
TPS61322
ZHCSI34D –JANUARY 2018–REVISED FEBRUARY 2019
www.ti.com.cn
VIN = 2.7 V to 4.3 V
TPS613222
A
IOUT = 500 mA
VIN = 2.7 V to 4. V
TPS613222A
IOUT = 500 mA
Figure 30. Line Regulation
Figure 29. Line Transient
VIN = 3.6 V
TPS613222A
IOUT = 10 mA to 500 mA
VIN = 3.6 V
TPS613222A
IOUT = 0 mA to 500 mA
Figure 31. Load Transient
Figure 32. Load Regulation
5.15
5.1
5.05
5
100
90
80
70
60
VIN=1.5V
VIN=1.5V
VIN=2.5V
VIN=3.0V
VIN=3.6V
VIN=4.2V
VIN=2.5V
VIN=3.0V
VIN=3.6V
VIN=4.2V
4.95
4.9
50
0.0001
0.001
0.010.02 0.05 0.1 0.2 0.5
Iout (A)
1
0.0001
0.001
0.010.02 0.05 0.1 0.2 0.5
Iout (A)
1
D011
D012
TPS613222A
L = 2.2 µH
D1:ZLLS410TA
TPS613222A
L = 2.2 µH
D1:ZLLS410TA
Figure 33. Efficiency with Different Input Voltage
Figure 34. Load Regulation
18
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TPS61322
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ZHCSI34D –JANUARY 2018–REVISED FEBRUARY 2019
9.3 System Examples
TPS61322xx can be easily shut down with an external switch Q1 as shown in Figure 35. The switch can be
mechanical switch, a P-channel MOSFET, or a PNP transistor. For a mechanical switch, there is no control logic
circuit needed to turn on or turn off the switch.
D1
(optional for large current)
L1
2.2 µH
Q1
SW
VOUT
VOUT
C2
Battery
22 µF
2.2 µF
TPS6132xx
C1
GND
Copyright © 2017, Texas Instruments Incorporated
Figure 35. True Shutdown for TPS61322xx
9.3.1 Detail Design Schematics
The Figure 36 shows the application circuit when the power supply of the micro controller unit (MCU) is not less
than the battery voltage. The Figure 37 shows the application circuit when the power supply of the micro
controller unit (MCU) is less than the battery voltage
D1
D1
(optional for large current)
(optional for large current)
Q1
L1 2.2 µH
L1 2.2 µH
Q1
SW
VOUT
VOUT
SW
VOUT
VOUT
C2
C2
Battery
22 µF
Battery
22 µF
2.2 µF
2.2 µF
TPS6132xx
C1
TPS6132xx
C1
R1
R1
V_MCU
V_MCU
GND
GND
GPIO
Q2
GPIO
MCU
MCU
Copyright © 2017, Texas Instruments Incorporated
Copyright © 2017, Texas Instruments Incorporated
Figure 36. True Shutdown, V_MCU Voltage No Less than
Battery Voltage
Figure 37. True Shutdown, V_MCU Voltage Less than
Battery Voltage
Copyright © 2018–2019, Texas Instruments Incorporated
19
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ZHCSI34D –JANUARY 2018–REVISED FEBRUARY 2019
www.ti.com.cn
10 Power Supply Recommendations
The TPS61322xx is designed to operate from an input voltage supply range between 0.9 V to 5.5 V. The power
supply can be alkaline battery, NiMH rechargeable battery, Li-Mn battery or rechargeable Li-ion battery. The
input supply must be well regulated with the rating of the TPS61322xx.
20
Copyright © 2018–2019, Texas Instruments Incorporated
TPS61322
www.ti.com.cn
ZHCSI34D –JANUARY 2018–REVISED FEBRUARY 2019
11 Layout
11.1 Layout Guidelines
As for all switching power supplies, the layout is an important step in the design, especially at high peak currents
and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as
well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground
paths. Place the output capacitor, as well as the inductor, as close as possible to the device.
Copyright © 2018–2019, Texas Instruments Incorporated
21
TPS61322
ZHCSI34D –JANUARY 2018–REVISED FEBRUARY 2019
www.ti.com.cn
11.2 Layout Examples
A large ground plane on the top and bottom is good for thermal performance.
GND
VOUT
SW
VOUT
GND
VOUT
SW
TPS61322xA
VIN
VIN
VOUT
GND
GND
Figure 39. TPS61322xA DBZ Package Layout
Figure 38. TPS61322 Layout
GND
VIN
NC
VOUT
TPS61322xA
VOUT
SW
GND
NC
Figure 40. TPS61322xA DBV Package Layout
22
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TPS61322
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ZHCSI34D –JANUARY 2018–REVISED FEBRUARY 2019
12 器件和文档支持
12.1 器件支持
12.1.1 第三方产品免责声明
TI 发布的与第三方产品或服务有关的信息，不能构成与此类产品或服务或保修的适用性有关的认可，不能构成此类
产品或服务单独或与任何 TI 产品或服务一起的表示或认可。
12.1.2 开发支持
12.1.2.1 使用 WEBENCH® 工具创建定制设计
单击此处，使用 TPS61322 器件并借助 WEBENCH® 电源设计器创建定制设计。
1. 首先输入输入电压 (VIN)、输出电压 (VOUT) 和输出电流 (IOUT) 要求。
2. 使用优化器拨盘优化该设计的关键参数，如效率、尺寸和成本。
3. 将生成的设计与德州仪器 (TI) 的其他可行的解决方案进行比较。
WEBENCH 电源设计器可提供定制原理图以及罗列实时价格和组件供货情况的物料清单。
在多数情况下，可执行以下操作：
•
•
•
•
运行电气仿真，观察重要波形以及电路性能
运行热性能仿真，了解电路板热性能
将定制原理图和布局方案以常用 CAD 格式导出
打印设计方案的 PDF 报告并与同事共享
有关 WEBENCH 工具的详细信息，请访问 www.ti.com.cn/WEBENCH。
12.2 文档支持
12.2.1 相关文档
请参阅如下相关文档：
《TPS61322-BMC001 评估模块用户指南》
12.3 接收文档更新通知
要接收文档更新通知，请导航至 TI.com.cn 上的器件产品文件夹。单击右上角的通知我 进行注册，即可每周接收产
品信息更改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
12.4 社区资源
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范，
并且不一定反映 TI 的观点；请参阅 TI 的 《使用条款》。
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.5 商标
E2E is a trademark of Texas Instruments.
WEBENCH is a registered trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.6 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
版权 © 2018–2019, Texas Instruments Incorporated
23
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www.ti.com.cn
12.7 术语表
SLYZ022 — TI 术语表。
这份术语表列出并解释术语、缩写和定义。
13 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更，恕不另行通知，且
不会对此文档进行修订。如需获取此数据表的浏览器版本，请查阅左侧的导航栏。
24
版权 © 2018–2019, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
23-Feb-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS613221ADBVR
TPS613221ADBVT
TPS613222ADBVR
TPS613222ADBVT
TPS613223ADBVR
TPS613223ADBVT
TPS613226ADBVR
TPS613226ADBVT
TPS61322DBZR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBZ
DBZ
DBZ
5
5
5
5
5
5
5
5
3
3
3
3000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
NIPDAU | SN
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Call TI
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
1N4L
1N4L
1N5L
1N5L
1NRL
1NRL
1N6L
1N6L
1EME
1EME
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
NIPDAU | SN
NIPDAU | SN
NIPDAU | SN
NIPDAU | SN
NIPDAU | SN
NIPDAU | SN
NIPDAU | SN
SN
TPS61322DBZT
250
RoHS & Green
TBD
SN
XTPS61322DBZT
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
23-Feb-2023
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
13-May-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS613221ADBVR
TPS613221ADBVT
TPS613222ADBVR
TPS613222ADBVR
TPS613222ADBVT
TPS613222ADBVT
TPS613223ADBVR
TPS613223ADBVR
TPS613223ADBVT
TPS613223ADBVT
TPS613226ADBVR
TPS613226ADBVT
TPS61322DBZR
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBZ
DBZ
5
5
5
5
5
5
5
5
5
5
5
5
3
3
3000
250
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
178.0
178.0
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
9.0
9.0
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.15
3.15
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
2.77
2.77
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.22
1.22
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
3000
3000
250
250
3000
3000
250
250
3000
250
3000
250
TPS61322DBZT
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
13-May-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS613221ADBVR
TPS613221ADBVT
TPS613222ADBVR
TPS613222ADBVR
TPS613222ADBVT
TPS613222ADBVT
TPS613223ADBVR
TPS613223ADBVR
TPS613223ADBVT
TPS613223ADBVT
TPS613226ADBVR
TPS613226ADBVT
TPS61322DBZR
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBZ
DBZ
5
5
5
5
5
5
5
5
5
5
5
5
3
3
3000
250
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
180.0
180.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
180.0
180.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
18.0
18.0
3000
3000
250
250
3000
3000
250
250
3000
250
3000
250
TPS61322DBZT
Pack Materials-Page 2
PACKAGE OUTLINE
DBZ0003A
SOT-23 - 1.12 mm max height
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR
C
2.64
2.10
1.12 MAX
1.4
1.2
B
A
0.1 C
PIN 1
INDEX AREA
1
0.95
(0.125)
3.04
2.80
1.9
3
(0.15)
NOTE 4
2
0.5
0.3
3X
0.10
0.01
(0.95)
TYP
0.2
C A B
0.25
GAGE PLANE
0.20
0.08
TYP
0.6
0.2
TYP
SEATING PLANE
0 -8 TYP
4214838/D 03/2023
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.
4. Support pin may differ or may not be present.
www.ti.com
EXAMPLE BOARD LAYOUT
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X (0.95)
2
(R0.05) TYP
(2.1)
LAND PATTERN EXAMPLE
SCALE:15X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214838/D 03/2023
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X(0.95)
2
(R0.05) TYP
(2.1)
SOLDER PASTE EXAMPLE
BASED ON 0.125 THICK STENCIL
SCALE:15X
4214838/D 03/2023
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
www.ti.com
PACKAGE OUTLINE
DBV0005A
SOT-23 - 1.45 mm max height
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR
C
3.0
2.6
0.1 C
1.75
1.45
1.45
0.90
B
A
PIN 1
INDEX AREA
1
2
5
(0.1)
2X 0.95
1.9
3.05
2.75
1.9
(0.15)
4
3
0.5
5X
0.3
0.15
0.00
(1.1)
TYP
0.2
C A B
NOTE 5
0.25
GAGE PLANE
0.22
0.08
TYP
8
0
TYP
0.6
0.3
TYP
SEATING PLANE
4214839/G 03/2023
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.25 mm per side.
5. Support pin may differ or may not be present.
www.ti.com
EXAMPLE BOARD LAYOUT
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
3
2X (0.95)
4
(R0.05) TYP
(2.6)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
EXPOSED METAL
EXPOSED METAL
0.07 MIN
ARROUND
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214839/G 03/2023
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
3
2X(0.95)
4
(R0.05) TYP
(2.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4214839/G 03/2023
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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