TPS62243QDDCRQ1 [TI]
DDC / 薄型小外形尺寸晶体管 (TSOT)23 封装内的 2.25MHz 300mA 降压转换器 | DDC | 5 | -40 to 125;型号: | TPS62243QDDCRQ1 |
厂家: | TEXAS INSTRUMENTS |
描述: | DDC / 薄型小外形尺寸晶体管 (TSOT)23 封装内的 2.25MHz 300mA 降压转换器 | DDC | 5 | -40 to 125 开关 光电二极管 晶体管 转换器 |
文件: | 总27页 (文件大小:2618K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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TPS62243-Q1, TPS62244-Q1
ZHCSHS4 –MARCH 2018
采用 TSOT23 封装的 TPS6224X-Q1 汽车类 2.25MHz 300mA 降压转换器
1 特性
3 说明
1
•
符合 AEC-Q100 标准,具有以下特性:
TPS6224x-Q1 系列器件是高效同步直流/直流降压转换
器,提供固定输出电压和高达 300mA 的输出电流。这
些器件为电池供电的/永远在线的汽车 应用 (如遥控免
钥匙进入 (RKE) 或被动进入被动启动 (PEPS) 钥匙和
基站)提供了低功耗优势。借助 2V-6V 的输入电压范
围,这些器件支持由锂二氧化锰 (Li-MnO2) 纽扣电
池、锂离子电池、两节 (2S) 和三节 (3S) 碱性电池、
3.3V 和 5V 输入电压轨进行供电的 应用 。TPS6224x-
Q1 在高负载电流情况下以 2.25MHz 的固定开关频率
运行,在轻负载电流情况下会进入省电模式,以便在整
个负载电流范围内保持高效率和低功耗。此省电模式针
对低输出电压纹波进行了优化。在关断模式下,电流消
耗减少至 1μA 以下。TPS6224x-Q1 允许使用小型电感
器和电容器来实现较小的解决方案尺寸,并采用 5 引
脚 TSOT23 封装。
–
器件温度 1 级:-40°C 至 125°C 的工作结温范
围
•
•
•
•
•
•
输出电流高达 300mA
VIN 范围从 2V 至 6V
在 PWM 模式下以 2.25MHz 固定频率运行
轻负载电流上的省电模式
脉宽调制 (PWM) 模式中的输出电压精度为 ±1.5%
固定输出电压
–
–
1.80V TPS62243-Q1
1.25V TPS62244-Q1
•
•
•
15μA 典型静态电流
可实现 100% 占空比,以确保最低压降
采用 TSOT 23 (5) 2.90mm × 1.60mm 封装
2 应用
器件信息(1)
•
•
•
遥控免钥匙进入 (RKE)
器件型号
封装
TSOT (5)
封装尺寸(标称值)
被动进入被动启动 (PEPS)
高级驾驶员辅助系统 (ADAS)
TPS6224X-Q1
2.90mm x 1.60mm
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
–
前置摄像头、环视和停车辅助
典型应用原理图
效率与输出电流间的关系
95
90
L1
2.2µH
TPS62244-Q1
VIN 2.0V to 6.0V
ON
OFF
VOUT 1.25V
VOUT = 1.25V
85
VIN
Up to 300mA
SW
COUT
10µF
80
75
70
65
60
CIN
EN
4.7µF
FB
GND
55
VIN = 2.3V
50
45
40
35
30
VIN = 2.7V
VIN = 3.0V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
0.01
0.1
1
IOUT [mA ]
10
100 300
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SLVSEK3
TPS62243-Q1, TPS62244-Q1
ZHCSHS4 –MARCH 2018
www.ti.com.cn
目录
8.4 Device Functional Modes.......................................... 8
Application and Implementation ........................ 10
9.1 Application Information............................................ 10
9.2 Typical Application .................................................. 10
1
2
3
4
5
6
7
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Device Comparison Table..................................... 3
Pin Configuration and Functions......................... 3
Specifications......................................................... 3
7.1 Absolute Maximum Ratings ...................................... 3
7.2 ESD Ratings.............................................................. 4
7.3 Recommended Operating Conditions....................... 4
7.4 Thermal Information.................................................. 4
7.5 Electrical Characteristics........................................... 5
7.6 Typical Characteristics.............................................. 6
Detailed Description .............................................. 7
8.1 Overview ................................................................... 7
8.2 Functional Block Diagram ......................................... 7
8.3 Feature Description................................................... 8
9
10 Power Supply Recommendations ..................... 14
11 Layout................................................................... 15
11.1 Layout Guidelines ................................................. 15
11.2 Layout Example .................................................... 15
12 器件和文档支持 ..................................................... 16
12.1 第三方产品免责声明.............................................. 16
12.2 接收文档更新通知 ................................................. 16
12.3 社区资源................................................................ 16
12.4 商标....................................................................... 16
12.5 静电放电警告......................................................... 16
12.6 Glossary................................................................ 16
13 机械、封装和可订购信息....................................... 16
13.1 Package Option Addendum .................................. 17
8
4 修订历史记录
日期
修订版本
说明
2018 年 3 月
*
初始发行版。
2
版权 © 2018, Texas Instruments Incorporated
TPS62243-Q1, TPS62244-Q1
www.ti.com.cn
ZHCSHS4 –MARCH 2018
5 Device Comparison Table
PART NUMBER(1)
TPS62243-Q1
FIXED OUTPUT VOLTAGES [V]
OPERATING MODE
1.80 V
1.25 V
PFM/PWM with automatic transition
PFM/PWM with automatic transition
TPS62244-Q1
(1) For all available packages, see the orderable addendum at the end of the data sheet.
6 Pin Configuration and Functions
DDC Package
5-Pin SOT
Top View
VIN
GND
EN
1
2
3
5
4
SW
FB
Not to scale
Pin Functions
PIN
I/O
DESCRIPTION
NAME
NO.
This is the enable pin of the device. Pulling this pin to low forces the device into shutdown mode. Pulling
this pin to high enables the device. This pin must be terminated.
EN
3
I
Feedback Pin for the internal regulation loop. Connect the external resistor divider to this pin. In case of
fixed output voltage option, connect this pin directly to the output capacitor.
FB
4
2
5
1
I
GND
SW
VIN
PWR
O
GND supply pin.
This is the switch pin and is connected to the internal MOSFET switches. Connect the inductor to this
terminal.
PWR
VIN power supply pin.
7 Specifications
7.1 Absolute Maximum Ratings(1)
MIN
–0.3
–0.3
–0.3
MAX
UNIT
V
VI
Input voltage(2)
7
Voltage at EN
VIN + 0.3, ≤7
V
Voltage on SW
7
V
Peak output current
Maximum operating junction temperature
Storage temperature
Internally limited
A
TJ
–40
–65
150
150
°C
°C
Tstg
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
Copyright © 2018, Texas Instruments Incorporated
3
TPS62243-Q1, TPS62244-Q1
ZHCSHS4 –MARCH 2018
www.ti.com.cn
7.2 ESD Ratings
VALUE
±2000
±750
UNIT
Human-body model (HBM), per AEC Q100-002(1)
Charged-device model (CDM), per AEC Q100-011
Electrostatic
V(ESD)
V
discharge
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
V
VI
Supply voltage, VIN
2
6
300
150
4.7
Output current, 2.3V < VIN < 6V
Output current, 2V ≤ VIN ≤ 2.3V
Inductance
mA
mA
µH
µF
IOUT
L
1.5
4.7
COUT Output capacitance
10
TJ
Operating junction temperature
–40
125
°C
7.4 Thermal Information
TPS6224X-Q1
THERMAL METRIC(1)
DDC (TSOT 23)
UNIT
5 PINS
193.7
40.7
35
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
0.9
ψJB
34.7
N/A
RθJC(bot)
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
4
Copyright © 2018, Texas Instruments Incorporated
TPS62243-Q1, TPS62244-Q1
www.ti.com.cn
ZHCSHS4 –MARCH 2018
7.5 Electrical Characteristics
TJ = -40°C to 125°C, typical values are at TJ = 25°C, unless otherwise noted. Specifications apply for condition VIN = 3.6 V.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
SUPPLY
IOUT = 0 mA. Pulse frequency modulation (PFM)
mode enabled, device not switching
15
IQ
Operating quiescent current
μA
IOUT = 0 mA. PFM mode enabled, device switching,
VOUT = 1.25 V
18.5
0.1
EN = GND, TJ = 25°C
EN = GND
Falling
1
μA
10
ISD
Shutdown current
1.85
1.95
UVLO
Undervoltage lockout threshold
V
Rising
ENABLE, MODE
VIH
VIL
IIN
High-level input voltage, EN
2 V ≤ VIN ≤ 6 V
1
0
VIN
0.35
1
V
V
Low-level input voltage, EN
Input bias current, EN
2 V ≤ VIN ≤ 6 V,
EN, MODE = GND or VIN
0.01
μA
POWER SWITCH
High-side MOSFET ON-resistance
240
180
480
380
RDS(on)
VIN = VGS = 3.6 V, TJ = 25°C
VIN = VGS = 3.6 V,
mΩ
Low-side MOSFET ON-resistance
Forward current limit MOSFET high-
side and low-side
ILIMF
0.54
0.95
2.5
A
Thermal shutdown
Increasing junction temperature
Decreasing junction temperature
140
20
°C
°C
TSD
Thermal shutdown hysteresis
OSCILLATOR
ƒSW
Oscillator frequency
2 V ≤ VIN ≤ 6 V, PWM Mode
2
2.25
MHz
OUTPUT
VOUT
Output voltage
TPS62244 Q1 (fixed VOUT
)
)
1.25
1.80
600
V
V
TPS62243 Q1 (fixed VOUT
VREF
Internal reference voltage
mV
PWM operation, 2 V ≤ VIN ≤ 6 V, in fixed output
–1.5%
–1.5%
0% 1.5%
voltage versions VFB = VOUT, See (1) ,TJ = 25°C
Feedback voltage
PWM operation, 2 V ≤ VIN ≤ 6 V, in fixed output
2.5%
0%
(1)
VFB
voltage versions VFB = VOUT, See
Feedback voltage PFM mode
Load regulation
Device in PFM mode
PWM mode
–0.5
%/A
μs
tStart up
tRamp
Start-up time
Time from active EN to reach 95% of VOUT nominal
Time to ramp from 5% to 95% of VOUT
500
250
VOUT ramp UP time
μs
VIN = 3.6 V, VIN = VOUT = VSW, EN = GND, TJ =
25°C(2)
0.1
1
Ilkg
Leakage current into SW pin
μA
(2)
VIN = 3.6 V, VIN = VOUT = VSW, EN = GND,
10
(1) For VIN = VO+ 0.6
(2) The internal resistor divider network is disconnected from FB pin.
版权 © 2018, Texas Instruments Incorporated
5
TPS62243-Q1, TPS62244-Q1
ZHCSHS4 –MARCH 2018
www.ti.com.cn
7.6 Typical Characteristics
表 1. Table of Graphs
FIGURE
图 1
Shutdown Current into VIN
Quiescent Current
vs Input Voltage
vs Input Voltage
图 2
图 3
Static Drain-Source On-State Resistance vs Input Voltage
图 4
20
18
16
14
12
10
10
TJ = -40°C
TJ = 0°C
TJ = 25°C
TJ = 85°C
TJ = 115°C
TJ = 125°C
MODE = GND,
EN = VIN,
Device Not Switching
TJ = 85oC
1
0.1
TJ = 25oC
0.01
0.001
TJ = -40oC
2
2.5
3
3.5
4
4.5
5
5.5
6
VIN [V]
SLVS
8
6
2
2.5
3
3.5
4
4.5
5
5.5
V
− Input Voltage − V
IN
图 1. Shutdown Current vs Input Voltage
图 2. Quiescent Current vs Input Voltage
500
450
400
350
300
250
200
150
100
50
400
350
300
250
200
150
100
50
TJ = -40°C
TJ = -40°C
TJ
TJ
=
=
25°C
85°C
TJ
TJ
=
=
25°C
85°C
TJ = 125°C
TJ = 125°C
0
0
2
2.5
3
3.5
4
VIN [V]
4.5
5
5.5
6
2
2.5
3
3.5
4
VIN [V]
4.5
5
5.5
6
图 3. High Side Switch Static Drain-Source
图 4. Low Side Switch Static Drain-Source
On-State Resistance vs Input Voltage
On-State Resistance vs Input Voltage
6
版权 © 2018, Texas Instruments Incorporated
TPS62243-Q1, TPS62244-Q1
www.ti.com.cn
ZHCSHS4 –MARCH 2018
8 Detailed Description
8.1 Overview
The TPS6224X-Q1 step-down converter typically operates with 2.25-MHz fixed-frequency pulse width modulation
(PWM) at moderate to heavy load currents. At light load currents, the converter can automatically enter power
save mode and then operates in PFM mode.
During PWM operation, the converter uses a unique fast-response voltage-mode control scheme with input
voltage feed-forward to achieve good line and load regulation, allowing the use of small ceramic input and output
capacitors. At the beginning of each clock cycle initiated by the clock signal, the high-side MOSFET switch is
turned on. The current then flows from the input capacitor through the high-side MOSFET switch through the
inductor to the output capacitor and load. During this phase, the current ramps up until the PWM comparator trips
and the control logic turns off the switch. The current limit comparator also turns off the switch if the current limit
of the high-side MOSFET switch is exceeded. After a dead time preventing shoot-through current, the low-side
MOSFET rectifier is turned on and the inductor current ramps down. The current then flows from the inductor to
the output capacitor and to the load. It returns back to the inductor through the low-side MOSFET rectifier.
The next cycle is initiated by the clock signal again turning off the low-side MOSFET rectifier and turning on the
high-side MOSFET switch.
8.2 Functional Block Diagram
VIN
Current
Limit Comparator
VIN
Thermal
Shutdown
Undervoltage
Lockout 1.8 V
Limit
EN
High Side
PFM Comparator
Reference
0.6 V VREF
FB
VREF
Gate Driver
Anti-Shoot-Through
Control
Stage
Error Amplifier
Integrator
SW1
Softstart
VOUT RAMP
CONTROL
VREF
FB
FB
PWM
Comp.
Zero-Pole
AMP.
Limit
RI 1
GND
Low Side
RI..N
Current
Limit Comparator
2.25 MHz
Oscillator
Sawtooth
Generator
Internal Resistor
Network
GND
Copyright © 2016, Texas Instruments Incorporated
版权 © 2018, Texas Instruments Incorporated
7
TPS62243-Q1, TPS62244-Q1
ZHCSHS4 –MARCH 2018
www.ti.com.cn
8.3 Feature Description
8.3.1 Undervoltage Lockout
The undervoltage lockout circuit prevents the device from malfunctioning at low input voltages and from
excessive discharge of the battery and disables the output stage of the converter. The undervoltage lockout
threshold is typically 1.85 V with falling VIN.
8.3.2 Enable
The device is enabled by setting the EN pin to high. During the start-up time (tStart up), the internal circuits are
settled and the soft-start circuit is activated. The EN input can be used to control power sequencing in a system
with various DC-DC converters. The EN pin can be connected to the output of another converter, to drive the EN
pin high and sequence supply rails. With EN pin = GND, the device enters shutdown mode in which all circuits
are disabled. In fixed-output voltage versions, the internal resistor divider network is then disconnected from FB
pin.
8.3.3 Thermal Shutdown
As soon as the junction temperature, TJ, exceeds 140°C (typical) the device goes into thermal shutdown. In this
mode, the high-side and low-side MOSFETs are turned off. The device continues its operation when the junction
temperature falls below the thermal shutdown hysteresis.
8.4 Device Functional Modes
8.4.1 Soft Start
The TPS6224X-Q1 device has an internal soft-start circuit that controls the ramp up of the output voltage. The
output voltage ramps up from 5% to 95% of its nominal value within typical 250 μs. This limits the inrush current
in the converter during ramp up and prevents possible input voltage drops when using a battery or high
impedance power source. The soft-start circuit is enabled within the start-up time, tStart up
.
8.4.2 Power Save Mode
The power save mode is enabled. If the load current decreases, the converter enters power save mode operation
automatically. During power save mode, the converter skips switching and operates with reduced frequency in
PFM mode with a minimum-quiescent current to maintain high efficiency.
The transition from PWM mode to PFM mode occurs once the inductor current in the low-side MOSFET switch
becomes zero, which indicates discontinuous conduction mode.
During the power save mode, a PFM comparator monitors the output voltage. As the output voltage falls below
the PFM comparator threshold of VOUT nominal, the device starts a PFM current pulse. The high-side MOSFET
switch turns on, and the inductor current ramps up. After the on-time expires, the switch turns off and the low-
side MOSFET switch turns on until the inductor current becomes zero.
The converter effectively delivers a current to the output capacitor and the load. If the load is below the delivered
current, the output voltage rises. If the output voltage is equal to or greater than the PFM comparator threshold,
the device stops switching and enters a sleep mode with typical 15-μA current consumption.
If the output voltage is still below the PFM comparator threshold, a sequence of further PFM current pulses are
generated until the PFM comparator threshold is reached. The converter starts switching again once the output
voltage drops below the PFM comparator threshold.
With a fast single-threshold comparator, the output-voltage ripple during PFM mode operation can be kept to a
minimum. The PFM pulse is time controlled, allowing the user to modify the charge transferred to the output
capacitor by the value of the inductor. The resulting PFM output voltage ripple and PFM frequency both depend
on the size of the output capacitor and the inductor value. Increasing output capacitor values and inductor values
minimize the output ripple. The PFM frequency decreases with smaller inductor values and increases with larger
values.
If the output current cannot be supported in PFM mode, the device exits PFM mode and enters PWM mode.
8
版权 © 2018, Texas Instruments Incorporated
TPS62243-Q1, TPS62244-Q1
www.ti.com.cn
ZHCSHS4 –MARCH 2018
Device Functional Modes (接下页)
Output voltage
VOUT nominal
PWM + PFM
moderate to heavy load
PWM Mode
Light load
PFM Mode
图 5. Power Save Mode
8.4.2.1 100% Duty Cycle Low Dropout Operation
The device starts to enter 100% duty-cycle mode once the input voltage comes close to the nominal output
voltage. To maintain the output voltage, the high-side MOSFET switch is turned on 100% for one or more cycles.
With further decreasing VIN the high-side MOSFET switch is turned on completely. In this case, the converter
offers a low input-to-output voltage difference. This is particularly useful in battery-powered applications to
achieve longest operation time by taking full advantage of the entire battery voltage range.
The minimum input voltage to maintain regulation depends on the load current and output voltage, and can be
calculated as:
VINmin = VOmax + IOmax (RDS(on)max + RL)
where
•
•
•
•
IOmax = maximum output current plus inductor ripple current
RDS(on)max = maximum P-channel switch RDS(on)
RL = DC resistance of the inductor
VOmax = nominal output voltage plus maximum output voltage tolerance
(1)
8.4.3 Short-Circuit Protection
The high-side and low-side MOSFET switches are short-circuit protected with maximum switch current equal to
ILIMF. The current in the switches is monitored by current limit comparators. Once the current in the high-side
MOSFET switch exceeds the threshold of its current limit comparator, it turns off and the low-side MOSFET
switch is activated to ramp down the current in the inductor and high-side MOSFET switch. The high-side
MOSFET switch can only turn on again once the current in the low-side MOSFET switch has decreased below
the threshold of its current limit comparator.
版权 © 2018, Texas Instruments Incorporated
9
TPS62243-Q1, TPS62244-Q1
ZHCSHS4 –MARCH 2018
www.ti.com.cn
9 Application and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The following section discusses the design of the external components to complete the power supply design by
using typical applications as a reference.
9.2 Typical Application
L1
2.2µH
TPS62244-Q1
VIN 2.0V to 6.0V
VOUT 1.25V
VIN
Up to 300mA
SW
ON
COUT
10µF
CIN
4.7µF
EN
OFF
FB
GND
图 6. TPS62244Q1, Fixed 1.25 V VOUT
L1
2.2µH
TPS62243-Q1
VIN 2.0V to 6.0V
ON
OFF
VOUT 1.80V
Up to 300mA
COUT
10µF
VIN
SW
CIN
4.7µF
EN
FB
GND
图 7. TPS62243Q1, Fixed 1.80 V VOUT
9.2.1 Design Requirements
The device operates over an input voltage range from 2 V to 6 V. The output voltage setting is fixed.
9.2.2 Detailed Design Procedure
表 2 shows the list of components for the Application Curves. Users must verify and validate these components
for suitability with their application before using the components.
表 2. List of Components
VALUE
COMPONENT REFERENCE
PART NUMBER
GRM188R60J475K
GRM188R60J106M
LPS3015
MANUFACTURER(1)
Murata
4.7 μF, 6.3 V. X5R Ceramic
10 μF, 6.3 V. X5R Ceramic
2.2 μH, 110 mΩ
CIN
COUT
L1
Murata
Coilcraft
(1) See Third-party Products Disclaimer
10
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TPS62243-Q1, TPS62244-Q1
www.ti.com.cn
ZHCSHS4 –MARCH 2018
9.2.2.1 Output Filter Design (Inductor and Output Capacitor)
The TPS6224X-Q1 device is designed to operate with inductors in the range of 1.5 μH to 4.7 μH and with output
capacitors in the range of 4.7 μF to 22 μF. The device is optimized for operation with a 2.2-μH inductor and
10‑μF output capacitor.
Larger or smaller inductor values can be used to optimize the performance of the device for specific operation
conditions. For stable operation, the L and C values of the output filter may not fall below 1-μH effective
Inductance and 3.5-μF effective capacitance.
9.2.2.1.1 Inductor Selection
The inductor value has a direct effect on the ripple current. The selected inductor must be rated for its DC
resistance and saturation current (表 3). The inductor ripple current (ΔIL) decreases with higher inductance and
increases with higher VI or VO.
The inductor selection also has an impact on the output voltage ripple in the PFM mode. Higher inductor values
lead to lower-output voltage ripple and higher PFM frequency, and lower inductor values lead to a higher-output
voltage ripple with lower PFM frequency.
公式 2 calculates the maximum inductor current in PWM mode under static load conditions. The saturation
current of the inductor should be rated higher than the maximum inductor current as calculated with 公式 3. This
is the recommendation because during heavy-load transients the inductor current rises above the calculated
value.
VOUT
1-
V
IN
DIL = VOUT
´
L ´ ƒ
(2)
DIL
ILmax = IOUTmax
+
2
where
•
•
•
•
ƒ = Switching frequency (2.25-MHz typical)
L = Inductor value
ΔIL = Peak-to-Peak inductor ripple current
ILmax = Maximum inductor current
(3)
A more conservative approach is to select the inductor current rating just for the maximum switch current limit
ILIMF of the converter.
Accepting larger values of ripple current allows the use of low inductance values, but results in higher output
voltage ripple, greater core losses, and lower output current capability.
The total losses of the coil strongly impact the efficiency of the DC-DC conversion and consist of both the losses
in the DC resistance (R(DC)) and the following frequency-dependent components:
•
•
•
•
The losses in the core material (magnetic hysteresis loss, especially at high switching frequencies)
Additional losses in the conductor from the skin effect (current displacement at high frequencies)
Magnetic field losses of the neighboring windings (proximity effect)
Radiation losses
表 3. List of Inductors
INDUCTANCE (μH)
DIMENSIONS (mm)
2.5 × 2 × 1
PART NUMBER
MIPS2520D2R2
MANUFACTURER(1)
FDK
2
2
2.5 × 2 × 1.2
2.5 × 2 × 1
MIPSA2520D2R2
KSLI-252010AG2R2
LQM2HPN2R2MJ0L
LPS3015
FDK
2.2
2.2
2.2
Hitachi Metals
Murata
2.5 × 2 × 1.2
3 × 3 × 1.4
Coilcraft
(1) See Third-party Products Disclaimer
版权 © 2018, Texas Instruments Incorporated
11
TPS62243-Q1, TPS62244-Q1
ZHCSHS4 –MARCH 2018
www.ti.com.cn
9.2.2.1.2 Output Capacitor Selection
The advanced fast-response voltage-mode control scheme of the TPS6224X-Q1 device allows the use of tiny
ceramic capacitors. Ceramic capacitors with low-ESR values have the lowest-output voltage ripple and are
recommended. The output capacitor requires either an X7R or X5R dielectric. Y5V and Z5U dielectric capacitors,
aside from their wide variation in capacitance over temperature, become resistive at high frequencies.
At nominal load current, the device operates in PWM mode and the RMS ripple current is calculated as in 公式 4:
VOUT
1-
V
1
IN
´
IRMSC
= VOUT
´
OUT
L ´ ƒ
2´ 3
(4)
At nominal load current, the device operates in PWM mode and the overall output voltage ripple is the sum of the
voltage spike caused by the output capacitor ESR plus the voltage ripple caused by charging and discharging the
output capacitor as in 公式 5:
VOUT
1-
æ
ç
è
ö
÷
ø
V
1
IN
D VOUT = VOUT
´
´
+ ESR
L ´ ƒ
8´ COUT ´ ƒ
(5)
At light load currents, the converter operates in power save mode and the output voltage ripple depends on the
output capacitor and inductor value. Larger output capacitor and inductor values minimize the voltage ripple in
PFM mode and tighten DC output accuracy in PFM mode.
9.2.2.1.3 Input Capacitor Selection
The buck converter has a natural pulsating input current; therefore, a low-ESR input capacitor is required for best
input voltage filtering and minimizing the interference with other circuits caused by high-input voltage spikes. For
most applications, a 4.7-μF to 10-μF ceramic capacitor is recommended (表 4). Because ceramic capacitors lose
up to 80% of their initial capacitance at 5 V, TI recommends using a 10-μF input capacitor for input voltages
greater than 4.5 V. The input capacitor can be increased without any limit for better input voltage filtering.
Take care when using only small ceramic input capacitors. When a ceramic capacitor is used at the input, and
the power is being supplied through long wires, such as from a wall adapter, a load step at the output, or VIN step
on the input, can induce ringing at the VIN pin. The ringing can couple to the output and be mistaken as loop
instability, or could even damage the part by exceeding the maximum ratings.
表 4. List of Capacitors
CAPACITANCE (µF)
DIMENSIONS (mm)
0603: 1.6 × 0.8 × 0.8
0603: 1.6 × 0.8 × 0.8
PART NUMBER
MANUFACTURER(1)
Murata
4.7
10
GRM188R60J475K
GRM188R60J106M69D Murata
(1) See Third-party Products Disclaimer
12
版权 © 2018, Texas Instruments Incorporated
TPS62243-Q1, TPS62244-Q1
www.ti.com.cn
ZHCSHS4 –MARCH 2018
9.2.3 Application Curves
The conditions for below application curves are VIN = 3.0V, VOUT= 1.25V and the components listed in 表 2,
unless otherwise noted.
95
90
85
80
75
70
65
60
55
50
45
40
35
30
1.312
1.300
1.288
1.275
1.262
1.250
1.238
1.225
1.212
1.200
1.188
VOUT = 1.25V
VIN = 2.3V
VIN = 2.7V
VIN = 3.0V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
VIN = 2.3V
VIN = 2.7V
VIN = 3.0V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
0.01
0.1
1
IOUT [mA ]
10
100 300
0.001
0.01
0.1
1
IOUT [mA ]
10
100 300
图 8. Efficiency vs Output Current, VOUT = 1.25V
图 9. Output Voltage vs Output Current 1.25V VOUT
95
90
85
80
75
70
65
60
55
50
45
40
35
30
1.890
1.872
1.854
1.836
1.818
1.800
1.782
1.764
1.746
1.728
1.710
VIN = 2.3V
VIN = 2.7V
VIN = 3.0V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
VIN = 2.3V
VIN = 2.7V
VIN = 3.0V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
0.01
0.1
1
IOUT [mA ]
10
100 300
0.001
0.01
0.1
1
IOUT [mA ]
10
100 300
图 10. Efficiency vs Output Current, VOUT = 1.8V
图 11. Output Voltage vs Output Current, VOUT = 1.8V
VIN = 3V
RLoad = 100Ω
VOUT = 1.25V
VIN = 3V
IOUT = 150mA
VOUT = 1.25V
图 12. Start-Up Timing
图 13. Typical PWM Mode Operation
版权 © 2018, Texas Instruments Incorporated
13
TPS62243-Q1, TPS62244-Q1
ZHCSHS4 –MARCH 2018
www.ti.com.cn
VIN = 3V
IOUT = 25mA
VOUT = 1.25V
VIN = 3V
IOUT = 1mA to 25mA to 1mA
Rise / Fall Time 1µs
VOUT = 1.25V
图 14. Typical PFM Mode Operation
图 15. Load Transient PFM Mode
VIN = 3V
IOUT = 5mA to 150mA to 5mA
Rise / Fall Time 1µs
VOUT = 1.25V
VIN = 2.3V to 2.7V to 2.3V
Rise / Fall Time 10µs
IOUT = 25mA
VOUT = 1.25V
图 16. Load Transient PFM / PWM Mode
图 17. Line Transient PFM Mode
10 Power Supply Recommendations
The TPS6224X-Q1 device has no special requirements for its input power supply. The input power supply output
current must be rated according to the supply voltage, output voltage, and output current of the TPS6224X-Q1.
14
版权 © 2018, Texas Instruments Incorporated
TPS62243-Q1, TPS62244-Q1
www.ti.com.cn
ZHCSHS4 –MARCH 2018
11 Layout
11.1 Layout Guidelines
As for all switching power supplies, the layout is an important step in the design. Proper function of the device
demands careful attention to PCB layout. To get the specified performance, the board layout must be carefully
done. If not carefully done, the regulator could show poor line or load regulation, and additional stability issues as
well as EMI problems. 图 18 shows an example of layout design with the TLV62242-Q1 device.
•
Providing a low-inductance, low-impedance ground path is critical. Therefore, use wide and short traces for
the main current paths. The input capacitor as well as the inductor and output capacitor must be placed as
close as possible to the IC pins.
•
•
The FB line must be connected directly to the output capacitor and the FB line must be routed away from
noisy components and traces (for example, the SW line).
Because of the small package of this converter and the overall small solution size, the thermal performance of
the PCB layout is important. For good thermal performance, PCB design of at least four layers is
recommended.
11.2 Layout Example
VIN
VIN
GND
EN
SW
U1
FB
GND
VOUT
图 18. Suggested Layout for Fixed Output Voltage
版权 © 2018, Texas Instruments Incorporated
15
TPS62243-Q1, TPS62244-Q1
ZHCSHS4 –MARCH 2018
www.ti.com.cn
12 器件和文档支持
12.1 第三方产品免责声明
TI 发布的与第三方产品或服务有关的信息,不能构成与此类产品或服务或保修的适用性有关的认可,不能构成此类
产品或服务单独或与任何 TI 产品或服务一起的表示或认可。
12.2 接收文档更新通知
要接收文档更新通知,请导航至 TI.com.cn 上的器件产品文件夹。请单击右上角的提醒我 进行注册,即可每周接收
产品信息更改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。
12.3 社区资源
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范,
并且不一定反映 TI 的观点;请参阅 TI 的 《使用条款》。
TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在
e2e.ti.com 中,您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。
设计支持
TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。
12.4 商标
E2E is a trademark of Texas Instruments.
12.5 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止 MOS 门极遭受静电损
伤。
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更,恕不另行通知,也
不会对此文档进行修订。如欲获取此数据表的浏览器版本,请参阅左侧的导航。
16
版权 © 2018, Texas Instruments Incorporated
TPS62243-Q1, TPS62244-Q1
www.ti.com.cn
ZHCSHS4 –MARCH 2018
13.1 Package Option Addendum
13.1.1 Packaging Information
Package
Type
Package
Drawing
Package
Qty
Lead/Ball
Finish(3)
(1)
(2)
(4)
Orderable Device
TPS62243QDDCRQ1
TPS62244QDDCRQ1
Status
Pins
Eco Plan
MSL Peak Temp
Op Temp (°C)
Device Marking(5)(6)
SOT-23-
THIN
Green (RoHS & no
Sb/Br)
PREVIEW
PREVIEW
DDC
DDC
5
5
3000
3000
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
–40 to 115
–40 to 115
1I3Z
1I2Z
SOT-23-
THIN
Green (RoHS & no
Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
space
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest
availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the
requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified
lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used
between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by
weight in homogeneous material)
space
(3) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the
finish value exceeds the maximum column width.
space
(4) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
space
(5) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
space
(6) Multiple Device markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief
on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third
parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for
release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
版权 © 2018, Texas Instruments Incorporated
17
TPS62243-Q1, TPS62244-Q1
ZHCSHS4 –MARCH 2018
www.ti.com.cn
13.1.2 Tape and Reel Information
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
Reel
Diameter
(mm)
Reel
Width W1
(mm)
Package
Type
Package
Drawing
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
Device
Pins
SPQ
SOT-23-
THIN
TPS62243QDDCRQ1
TPS62244QDDCRQ1
DDC
DDC
5
5
3000
3000
179.0
179.0
8.4
8.4
3.2
3.2
3.2
3.2
1.4
1.4
4.0
4.0
8.0
8.0
Q3
Q3
SOT-23-
THIN
18
版权 © 2018, Texas Instruments Incorporated
TPS62243-Q1, TPS62244-Q1
www.ti.com.cn
ZHCSHS4 –MARCH 2018
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
Device
Package Type
Package Drawing Pins
SPQ
3000
3000
Length (mm) Width (mm)
Height (mm)
35.0
TPS62243QDDCRQ1
TPS62244QDDCRQ1
SOT-23-THIN
SOT-23-THIN
DDC
DDC
5
5
203.0
203.0
2.3.0
2.3.0
35.0
版权 © 2018, Texas Instruments Incorporated
19
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS62243QDDCRQ1
TPS62244QDDCRQ1
ACTIVE SOT-23-THIN
ACTIVE SOT-23-THIN
DDC
DDC
5
5
3000 RoHS & Green
3000 RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
-40 to 125
-40 to 125
1I3Z
1I2Z
NIPDAU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Dec-2020
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS62243QDDCRQ1
TPS62244QDDCRQ1
SOT-
23-THIN
DDC
DDC
5
5
3000
3000
180.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
SOT-
180.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
23-THIN
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Dec-2020
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS62243QDDCRQ1
TPS62244QDDCRQ1
SOT-23-THIN
SOT-23-THIN
DDC
DDC
5
5
3000
3000
213.0
213.0
191.0
191.0
35.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
DDC0005A
SOT-23 - 1.1 max height
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR
3.05
2.55
1.1
0.7
1.75
1.45
0.1 C
B
A
PIN 1
INDEX AREA
5
1
NOTE 4
(0.15)
0.95
3.05
2.75
1.9
2
3
(0.2)
4
0.1
TYP
0.0
0.5
0.3
5X
0.2
C A B
0.25
GAGE PLANE
0.20
0.12
TYP
0 -8 TYP
C
SEATING PLANE
0.6
0.3
TYP
4220752/A 03/2023
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC MO-193.
4. Support pin may differ or may not be present.
www.ti.com
EXAMPLE BOARD LAYOUT
DDC0005A
SOT-23 - 1.1 max height
SMALL OUTLINE TRANSISTOR
SYMM
5X (1.1)
5X (0.6)
1
5
SYMM
2
3
4X (0.95)
4
(R0.05) TYP
(2.7)
LAND PATTERN EXAMPLE
EXPLOSED METAL SHOWN
SCALE:15X
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
0.07 MIN
ARROUND
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
SOLDERMASK DETAILS
4220752/A 03/2023
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DDC0005A
SOT-23 - 1.1 max height
SMALL OUTLINE TRANSISTOR
SYMM
5X (1.1)
5X (0.6)
1
5
SYMM
2
3
4X(0.95)
4
(R0.05) TYP
(2.7)
SOLDER PASTE EXAMPLE
BASED ON 0.125 THICK STENCIL
SCALE:15X
4220752/A 03/2023
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
www.ti.com
重要声明和免责声明
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