TPS62260DDCTG4 [TI]
2.25 MHz 600 mA Step Down Converter in 2x2SON/TSOT-23 Package; 2.25 MHz的600毫安降压转换器， 2x2SON / TSOT- 23封装
| 型号： | TPS62260DDCTG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 2.25 MHz 600 mA Step Down Converter in 2x2SON/TSOT-23 Package |
| 文件： | 总32页 (文件大小：1206K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS62260, TPS62261, TPS62262
www.ti.com
SLVS763–JUNE 2007
2.25 MHz 600 mA Step Down Converter in 2x2SON/TSOT-23 Package
FEATURES
DESCRIPTION
•
•
•
High Efficiency Step Down Converter
The TPS62260 device is a high efficient synchronous
step down dc-dc converter optimized for battery
powered applications. It provides up to 600-mA
output current from a single Li-Ion cell and is ideal to
power mobile phones and other portable
applications.
Output Current up to 600 mA
Wide VIN Range from 2 V to 6 V for Li-Ion
Batteries with Extended Voltage Range
•
•
•
•
•
•
•
•
2.25 MHz Fixed Frequency Operation
Power Save Mode at Light Load Currents
Output Voltage Accuracy in PWM mode ±1.5%
Typ. 15 µA Quiescent Current
With an wide input voltage range of 2 V to 6 V, the
device supports applications powered by Li-Ion
batteries with extended voltage range, two and three
cell alkaline batteries, 3.3 V and 5 V input voltage
rails.
100% Duty Cycle for Lowest Dropout
Soft Start
The TPS62260 operates at 2.25 MHz fixed switching
frequency and enters Power Save Mode operation at
light load currents to maintain high efficiency over
the entire load current range.
Voltage Positioning at Light Loads
Available in a small 2×2×0,8mm SON and
TSOT-23 package
•
Allows <1mm Solution Height
The Power Save Mode is optimized for low output
voltage ripple. For low noise applications, the device
can be forced into fixed frequency PWM mode by
pulling the MODE pin high. In the shutdown mode,
the current consumption is reduced to less than 1µA.
TPS62260 allows the use of small inductors and
capacitors to achieve a small solution size.
APPLICATIONS
•
•
•
•
PDAs, Pocket PCs
Low Power DSP Supply
Portable Media Players
POL applications
The TPS62260 is available in a very small 2×2 6 pin
SON and TSOT-23 5 pin package.
L
100
TPS62260DRV
V
VIN = 2.3 V
2.2 mH
V
IN
90
SW
OUT
VIN = 2.7 V
C
1
22 pF
C
C
R
OUT
10 mF
IN
1
EN
V
IN = 3 V
80
70
60
50
40
30
20
4.7 mF
VIN = 3.6 V
VIN = 4.5 V
FB
GND
R
2
MODE
VOUT = 1.8 V,
MODE = GND,
L = 2.2 mH,
DCR 110 mR
10
0
0.01
0.1
1
10
100
1000
IO - Output Current - mA
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007, Texas Instruments Incorporated
TPS62260, TPS62261, TPS62262
www.ti.com
SLVS763–JUNE 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
ORDERING INFORMATION
PART
OUTPUT
PACKAGE
DESIGNATOR
PACKAGE
MARKING
TA
PACKAGE(3)
ORDERING
NUMBER(1)
VOLTAGE(2)
SON 2x2-6
TSOT-23 5
SON 2x2-6
SON 2x2-6
DRV
DDC
DRV
DRV
TPS62260DRV
TPS62260DDC
TPS62261DRV
TPS62262DRV
BYK
BYP
BYL
BYM
TPS62260
adjustable
–40°C to 85°C
TPS62261
TPS62262
1.8V fix
1.2V fix
(1) The DRV (2x2-6 SON) and DDC (TSOT-23-5) packages are available in tape on reel. Add R suffix to order quantities of 3000 parts per
reel.
(2) Contact TI for other fixed output voltage options
(3) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)(1)
VALUE
–0.3 to 7
–0.3 to VIN +0.3, ≤ 7
–0.3 to 7
Internally limited
2
UNIT
Input voltage range(2)
Voltage range at EN, MODE
Voltage on SW
V
V
V
A
Peak output current
HBM Human body model
CDM Charge device model
Machine model
kV
ESD rating(3)
1
200
V
MTaximum operating junction temperature
–40 to 125
–65 to 150
°C
°C
J
Tstg
Storage temperature range
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin. The machine model is a 200-pF
capacitor discharged directly into each pin.
DISSIPATION RATINGS
PACKAGE
DRV
RθJA
POWER RATING FOR TA ≤ 25°C
DERATING FACTOR ABOVE TA = 25°C
76°C/W
250/°C
1300 mW
400 mW
13 mW/°C
4 mW/°C
DDC
RECOMMENDED OPERATING CONDITIONS
MIN
2
NOM
MAX
6
UNIT
V
VIN
Supply voltage
Output voltage range for adjustable voltage
Operating ambient temperature
Operating junction temperature
0.6
–40
–40
VIN
85
V
TA
TJ
°C
°C
125
2
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ELECTRICAL CHARACTERISTICS
Over full operating ambient temperature range, typical values are at TA = 25°C. Unless otherwise noted, specifications apply
for condition VIN = EN = 3.6V. External components CIN = 4.7µF 0603, COUT = 10µF 0603, L = 2.2µH, see the parameter
measurement information.
PARAMETER
Input voltage range
Output current
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY
VIN
2.3
6
600
300
150
V
VIN 2.5 V to 6 V
IOUT
VIN 2.3 V to 2.5 V
VIN 2 V to 2.3 V
mA
IOUT = 0 mA, PFM mode enabled
(MODE = GND) device not switching
15
µA
IOUT = 0 mA, PFM mode enabled
(MODE = GND) device switching, VOUT = 1.8 V,
See
18.5
IQ
Operating quiescent current
(1)
IOUT = 0 mA, switching with no load
(MODE = VIN), PWM operation, VOUT = 1.8 V,
VIN = 3 V
3.8
mA
ISD
Shutdown current
EN = GND
Falling
0.1
1.85
1.95
1
µA
UVLO
Undervoltage lockout threshold
V
Rising
ENABLE, MODE
High level input voltage, EN,
MODE
2 V ≤ VIN ≤ 6 V
1
0
VIN
0.4
1
VIH
V
Low level input voltage, EN,
MODE
2 V ≤ VIN ≤ 6 V
VIL
IIN
V
Input bias current, EN, MODE
EN, MODE = GND or VIN
0.01
µA
POWER SWITCH
High side MOSFET on-resistance
240
185
480
380
RDS(on)
VIN = VGS = 3.6 V, TA = 25°C
mΩ
A
Low side MOSFET on-resistance
Forward current limit MOSFET
high-side and low side
ILIMF
VIN = VGS = 3.6 V
0.8
1
1.2
Thermal shutdown
Increasing junction temperature
Decreasing junction temperature
140
20
TSD
°C
Thermal shutdown hysteresis
OSCILLATOR
fSW
Oscillator frequency
2 V ≤ VIN≤ 6 V
2
2.25
2.5
VIN
MHz
OUTPUT
VOUT
Adjustable output voltage range
Reference voltage
0.6
V
Vref
600
mV
MODE = VIN, PWM operation, for fixed output
Feedback voltage PWM Mode
voltage versions VFB = VOUT
2.5 V ≤ VIN ≤ 6 V, 0 mA ≤ IOUT ≤ 600 mA, See
,
–1.5%
0% 1.5%
1%
(2)
VFB
MODE = GND, device in PFM mode, voltage
Feedback voltage PFM mode
Load regulation
(1)
positioning active, See
PWM Mode
-0.5
500
%/A
µs
Time from active EN to reach 95% of VOUT
nominal
tStart Up
tRamp
Ilkg
Start-up time
VOUT ramp up time
Time to ramp from 5% to 95% of VOUT
250
µs
VIN = 3.6 V, VIN = VOUT = VSW, EN = GND,
Leakage current into SW pin
0.1
1
µA
(3)
See
(1) In PFM mode, the internal reference voltage is set to typ. 1.01×Vref. See the parameter measurement information.
(2) For VIN = VO + 0.6 V
(3) In fixed output voltage versions, the internal resistor divider network is disconnected from FB pin.
3
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PIN ASSIGNMENTS
DDC PACKAGE
(TOP VIEW)
DRV PACKAGE
(TOP VIEW)
VI
GND
EN
5
SW
FB
1
2
3
1
6
5
4
SW
MODE
FB
GND
VIN
EN
2
3
4
TERMINAL FUNCTIONS
TERMINAL
NO.
SON
2x2-6
I/O
DESCRIPTION
NO.
TSOT23-5
NAME
VIN
5
6
1
2
PWR VIN power supply pin.
PWR GND supply pin
GND
This is the enable pin of the device. Pulling this pin to low forces the device into shutdown
mode. Pulling this pin to high enables the device. This pin must be terminated.
EN
4
1
3
3
4
5
I
OUT
I
This is the switch pin and is connected to the internal MOSFET switches. Connect the
external inductor between this terminal and the output capacitor.
SW
FB
Feedback Pin for the internal regulation loop. Connect the external resistor divider to this pin.
In case of fixed output voltage option, connect this pin directly to the output capacitor
This pin is only available at SON package option. MODE pin = high forces the device to
operate in fixed frequency PWM mode. MODE pin = low enables the Power Save Mode with
automatic transition from PFM mode to fixed frequency PWM mode.
MODE
2
I
FUNCTIONAL BLOCK DIAGRAM
VIN
Current
Limit Comparator
VIN
Thermal
Shutdown
Undervoltage
Lockout1.8V
Limit
EN
High Side
PFM Comp.
+1% Voltage positioning
Reference
0.6V VREF
FB
VREF +1%
Gate Driver
Anti
Shoot-Through
Only in 2x2SON
Control
Stage
Mode
FB
MODE
Error Amp .
SW1
Softstart
VOUT RAMP
CONTROL
VREF
Integrator
PWM
Comp.
FB
Zero-Pole
AMP.
Limit
RI 1
GND
Low Side
RI..N
Current
Limit Comparator
Sawtooth
Generator
2.25 MHz
Oscillator
Int. Resistor
Network
GND
4
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PARAMETER MEASUREMENT INFORMATION
L
2.2 mH
TPS62260DVR
V
OUT
V
IN
SW
FB
R
1
C
1
22 pF
C
IN
4.7 mF
EN
C
OUT
10 mF
GND
R
2
MODE
L: LPS3015 2.2 mH, 110 mW
GRM188R60J475K 4.7 mF Murata 0603 size
C
IN
C
GRM188R60J106M 10 mF Murata 0603 size
OUT
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
Output Current VOUT = 1.8 V, Power Save Mode, MODE =
GND
Figure 1
Output Current VOUT = 1.8 V, PWM Mode, MODE = VIN
Output Current VOUT = 3.3 V, PWM Mode, MODE = VIN
Figure 2
Figure 3
η
Efficiency
Output Current VOUT = 3.3 V, Power Save Mode,
MODE = GND
Figure 4
Output Current
Figure 5
Figure 6
Figure 7
Figure 8
Figure 9
Figure 10
Figure 11
Figure 12
Figure 13
Output Current
at 25°C, VOUT = 1.8 V, Power Save Mode, MODE = GND
at –40°C, VOUT = 1.8 V, Power Save Mode, MODE = GND
at 85°C, VOUT = 1.8 V, Power Save Mode, MODE = GND
at 25°C, VOUT = 1.8 V, PWM Mode, MODE = VIN
at –40°C, VOUT = 1.8 V, PWM Mode, MODE = VIN
at 85°C, VOUT = 1.8 V, PWM Mode, MODE = VIN
PWM Mode, VOUT = 1.8 V
Output Voltage Accuracy
Typical Operation
Mode Transition
Start-up Timing
MODE Pin Transition From PFM to Forced PWM Mode at
light load
Figure 14
Figure 15
MODE Pin Transition From Forced PWM to PFM Mode at
light load
Figure 16
Figure 17
Figure 18
Figure 19
Figure 20
Figure 21
Figure 22
Figure 23
Figure 24
Figure 25
Figure 26
Figure 27
Forced PWM Mode , VOUT = 1.5 V, 50 mA to 200 mA
Forced PWM Mode , VOUT = 1.5 V, 200 mA to 400 mA
PFM Mode to PWM Mode, VOUT = 1.5 V, 150 µA to 400 mA
PWM Mode to PFM Mode, VOUT = 1.5 V, 400 mA to 150 µA
PFM Mode, VOUT = 1.5 V, 1.5 mA to 50 mA
Load Transient
Line Transient
PFM Mode, VOUT = 1.5 V, 50 mA to 1.5 mA
PFM Mode to PWM Mode, VOUT = 1.8 V, 50 mA to 250 mA
PFM Mode to PWM Mode, VOUT = 1.5 V, 50 mA to 400 mA
PWM Mode to PFM Mode, VOUT = 1.5 V, 400 mA to 50 mA
PFM Mode, VOUT = 1.8 V, 50 mA
PFM Mode, VOUT = 1.8 V, 250 mA
5
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TYPICAL CHARACTERISTICS (continued)
Table of Graphs (continued)
FIGURE
PFM VOUT Ripple, VOUT = 1.8 V, 10 mA, L = 2.2µH, COUT
10µF
=
=
Figure 28
Figure 29
Typical Operation
PFM VOUT Ripple, VOUT = 1.8 V, 10 mA, L = 4.7µH, COUT
10µF
Shutdown Current into VIN
Quiescent Current
vs Input Voltage, (TA = 85°C, TA = 25°C, TA = -40°C)
vs Input Voltage, (TA = 85°C, TA = 25°C, TA = -40°C)
Figure 30
Figure 31
Figure 32
Figure 33
Static Drain Source On-State
Resistance
vs Input Voltage, (TA = 85°C, TA = 25°C, TA = -40°C)
EFFICIENCY (Power Save Mode)
EFFICIENCY (PWM Mode)
vs
vs
OUTPUT CURRENT
OUTPUT CURRENT
100
90
100
90
V
= 2.3 V
IN
V
= 2.3 V
IN
V
= 2.7 V
= 3 V
IN
80
80
V
IN
V
= 2.7 V
= 3 V
IN
70
70
V
= 3.6 V
IN
V
IN
V
= 4.5 V
V
= 3.6 V
= 4.5 V
60
50
40
60
50
40
IN
IN
V
IN
30
20
30
20
V
= 1.8 V,
OUT
V
= 1.8 V,
OUT
MODE = GND,
L = 2.2 mH,
DCR 110 mR
MODE = V
,
IN
L = 2.2 mH
10
0
10
0
0.01
0.1
1
10
100
1000
1
10
100
1000
I
- Output Current - mA
I
- Output Current - mA
O
O
Figure 1.
Figure 2.
6
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EFFICIENCY (PWM Mode)
vs
EFFICIENCY (Power Save Mode)
vs
OUTPUT CURRENT
OUTPUT CURRENT
100
90
100
90
V
= 4.2 V
IN
V
= 4.2 V
IN
V
= 3.6 V
IN
V
= 5 V
80
80
V
IN
= 3.6 V
IN
70
70
60
V
= 5 V
V
IN
= 4.5 V
IN
60
50
40
30
20
V
= 4.5 V
IN
50
40
30
20
V
OUT
MODE = V
= 3.3 V,
V
= 3.3 V,
OUT
,
MODE = GND,
L = 2.2 mH,
DCR 110 mW,
IN
L = 2.2 mH,
DCR 110 mW,
= 10 mF 0603
10
0
10
0
C
= 10 mF 0603
C
O
O
1
10
100
1000
0.01
0.1
1
10
100
1000
I
- Output Current - mA
O
I
- Output Current - mA
O
Figure 3.
Figure 4.
EFFICIENCY
vs
OUTPUT CURRENT
EFFICIENCY
vs
OUTPUT CURRENT
100
90
100
90
V
= 2.3 V
I
V
= 2.7 V
I
80
80
V
I
= 4.5 V
70
60
50
40
70
60
50
40
V
= 2.3 V
I
V
= 2.3 V
V
= 3.6 V
I
I
V
= 4.5 V
I
V
= 2.7 V
I
V
= 3.6 V
I
30
30
V
= 1.2 V,
V = 1.2 V,
O
O
MODE = V ,
I
MODE = GND,
L = 2 mH,
MIPSA2520
20
10
0
20
10
0
L = 2 mH,
MIPSA2520
C
= 10 mF 0603
C
= 10 mF 0603
O
O
0.001
0.01
0.1
1
0.0001
0.001
0.01
0.01
0.1
1
I
− Output Current − mA
I
− Output Current − mA
O
O
Figure 5.
Figure 6.
7
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OUTPUT VOLTAGE ACCURACY
OUTPUT VOLTAGE ACCURACY (Power Save Mode)
vs
vs
OUTPUT CURRENT
OUTPUT CURRENT
1.88
1.86
1.88
1.86
1.84
1.82
1.8
PFM Mode, Voltage Positioning
PFM Mode, Voltage Positioning
1.84
1.82
V
V
= 2.3 V
= 2.7 V
= 3 V
IN
V
V
= 2.3 V
= 2.7 V
= 3 V
PWM
Mode
IN
PWM
Mode
IN
V
IN
V
1.8
IN
IN
V
V
= 3.6 V
= 4.5 V
IN
IN
V
V
= 3.6 V
= 4.5 V
IN
IN
T
= 25°C,
T = -40°C,
A
1.78
1.78
A
V
= 1.8 V,
V
= 1.8 V,
OUT
MODE = GND,
OUT
MODE = GND,
1.76
1.74
1.76
1.74
L = 2.2 mH,
C
L = 2.2 mH,
C
= 10 mF
= 10 mF
O
O
0.01
0.1
1
10
100
1000
0.01
0.1
1
10
100
1000
I
- Output Current - mA
I
- Output Current - mA
O
O
Figure 7.
Figure 8.
OUTPUT VOLTAGE ACCURACY (Power Save Mode)
OUTPUT VOLTAGE ACCURACY (PWM Mode)
vs
vs
OUTPUT CURRENT
OUTPUT CURRENT
1.88
1.854
1.836
1.818
T
= 25°C,
A
V
= 1.8 V,
OUT
1.86
1.84
1.82
1.8
MODE = V
,
IN
PFM Mode, Voltage Positioning
L = 2.2 mH
V
= 2 V
IN
PWM
Mode
1.8
V
= 2.7 V
= 3 V
IN
V
V
V
= 2.3 V
= 2.7 V
= 3 V
IN
IN
V
V
= 3.6 V
= 4.5 V
IN
IN
IN
V
1.782
T
= 85°C,
1.78
A
IN
V
= 1.8 V,
V
V
= 3.6 V
= 4.5 V
OUT
MODE = GND,
IN
IN
1.764
1.746
1.76
1.74
L = 2.2 mH,
= 10 mF
C
O
0.01
0.1
1
10
100
1000
0.01
0.1
I
1
10
100
1000
I
- Output Current - mA
- Output Current - mA
O
O
Figure 9.
Figure 10.
8
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OUTPUT VOLTAGE ACCURACY (PWM Mode)
OUTPUT VOLTAGE ACCURACY (PWM Mode)
vs
vs
OUTPUT CURRENT
OUTPUT CURRENT
1.854
1.836
1.818
1.8
1.854
1.836
1.818
T
= 85°C,
T
= -40°C,
A
A
V
= 1.8 V,
V
= 1.8 V,
OUT
MODE = V
OUT
MODE = V
,
,
IN
IN
L = 2.2 mH
L = 2.2 mH
1.8
V
= 2 V
IN
V
= 2.7 V
= 3 V
V
V
= 2.3 V
= 2.7 V
= 3 V
IN
V
IN
1.782
1.782
1.764
1.746
IN
IN
V
V
V
= 3.6 V
= 4.5 V
IN
IN
IN
V
V
= 3.6 V
= 4.5 V
IN
IN
1.764
1.746
0.01
0.1
1
10
100
1000
0.01
0.1
1
10
100
1000
I
- Output Current - mA
I
- Output Current - mA
O
O
Figure 11.
Figure 12.
MODE PIN TRANSITION FROM PFM
TO FORCED PWM MODE AT LIGHT LOAD
TYPICAL OPERATION (PWM Mode)
V
V
3.6V
IN
V
V
I
= 3.6 V
1.8V, I
150mA
10mF 0603
IN
OUT
OUT
= 1.8 V
= 10 mA
OUT
MODE
L 2.2mH, C
OUT
V
10 mV/Div
OUT
2V/Div
OUT
SW 2 V/Div
SW
2V/Div
PFM Mode
Forced PWM Mode
ICOIL 200 mA/Div
I
coil
200mA/Div
Time Base - 10 ms/Div
Time Base - 1 ms/Div
Figure 13.
Figure 14.
9
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MODE PIN TRANSITION FROM PWM
TO PFM MODE AT LIGHT LOAD
START-UP TIMING
MODE
V
= 3.6 V
EN 2 V/Div
V
V
I
= 3.6 V
IN
IN
2 V/Div
R
V
= 10 Ω
= 1.8 V
= 10 mA
Load
OUT
= 1.8 V
OUT
into C
OUT
I
IN
IN
MODE = GND
SW
SW 2 V/Div
2 V/Div
PFM Mode
Forced PWM Mode
VOUT 2 V/Div
I
COIL
200 mA/Div
I
100 mA/Div
IN
Time Base - 2.5 ms/Div
Time Base - 100 ms/Div
Figure 15.
Figure 16.
LOAD TRANSIENT
(Forced PWM Mode)
LOAD TRANSIENT
(Forced PWM Mode)
V
V
I
3.6 V
VIN 3.6 V
IN
1.5 V
50 mA to 200 mA
VOUT 50 mV/Div
VOUT 1.5 V
OUT
V
50 mV/Div
OUT
IOUT 200 mA to
OUT
MODE = V
IN
IOUT 200 mA/Div
400 mA
I
200 mA/Div
200 mA
OUT
ICOIL 500 mA/Div
I
500 mA/Div
COIL
Time Base - 20 ms/Div
Time Base - 20 ms/Div
Figure 17.
Figure 18.
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LOAD TRANSIENT
(Forced PFM Mode To PWM Mode)
LOAD TRANSIENT
(Forced PWM Mode To PFM Mode)
SW 2 V/Div
SW 2 V/Div
VIN 3.6 V
VOUT 1.5 V
V
V
IN 3.6 V
IOUT 150 mA to 400 mA
MODE = GND
OUT 1.5 V
V
OUT 50mV/Div
IOUT 150 mA to 400 mA
VOUT 50 mV/Div
MODE = GND
400 mA
400 mA
IOUT 500 mA/Div
IOUT 500 mA/Div
150 mA
150 mA
ICOIL500 mA/Div
I
500mA/Div
COILl
Time Base - 500 ms/Div
Time Base - 500 ms/Div
Figure 19.
Figure 20.
LOAD TRANSIENT (PFM Mode)
LOAD TRANSIENT (PFM Mode)
SW 2 V/Div
SW 2V/Div
VIN 3.6 V
VIN 3.6 V
VOUT 1.5 V
VOUT 1.5 V
IOUT 50 mA to 1.5mA
MODE = GND
IOUT 1.5 mA to 50 mA
MODE = GND
VOUT 50 mV/Div
VOUT 50mV/Div
50 mA
50 mA
IOUT 50 mA/Div
1.5 mA
IOUT 50 mA/Div
1.5 mA
ICOIL 500 mA/Div
ICOIL 500 mA/Div
Time Base - 50 ms/Div
Time Base - 50 ms/Div
Figure 22.
Figure 21.
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LOAD TRANSIENT
(PFM Mode To PWM Mode)
LOAD TRANSIENT
(PFM Mode To PWM Mode)
SW 2 V/Div
SW 2 V/Div
VIN 3.6 V
VOUT 50 mV/Div
VOUT 1.5 V
VOUT 50 mV/Div
VIN 3.6 V
IOUT 50 mA to 400 mA
MODE = GND
VOUT 1.8 V
IOUT 50 mA to 250 mA
MODE = GND
250 mA
PWM Mode
400 mA
PFM Mode
IOUT 500 mA/Div
50 mA
IOUT 200 mA/Div
50 mA
ICOIL 500 mA/Div
ICOIL 500mA/Div
Time Base - 20 ms/Div
Time Base - 20 ms/Div
Figure 24.
Figure 23.
LOAD TRANSIENT
(PWM Mode To PFM Mode)
LINE TRANSIENT (PFM Mode)
SW 2 V/Div
V
IN 3.6V to 4.2V
500 mV/Div
VIN 3.6 V
VOUT 1.5 V
VOUT 50 mV/Div
IOUT 50 mA to 400 mA
MODE = GND
PFM Mode
IOUT 500 mA/Div
PWM Mode
400 mA
VOUT = 1.8 V
50 mV/Div
50 mA
IOUT = 50 mA
MODE = GND
ICOIL 500 mA/Div
Time Base - 20 ms/Div
Time Base - 100 ms/Div
Figure 25.
Figure 26.
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LINE TRANSIENT (PWM Mode)
TYPICAL OPERATION (PFM Mode)
VOUT 20 mV/Div
VIN 3.6V to 4.2V
500 mV/Div
VIN 3.6 V
VOUT 1.8 V, IOUT 10 mA
L 2.2 mH, COUT 10 mF
SW 2 V/Div
VOUT = 1.8 V
50 mV/Div
IOUT = 250 mA
MODE = GND
ICOIL 200 mA/Div
Time Base - 100ms/Div
Time Base - 10 ms/Div
Figure 27.
Figure 28.
SHUTDOWN CURRENT INTO VIN
vs
TYPICAL OPERATION (PFM Mode)
INPUT VOLTAGE
0.8
VIN 3.6 V; VOUT 1.8 V, IOUT 10 mA,
EN = GND
L = 4.7 mH, COUT = 10 mF 0603,
VOUT 20 mV/Div
MODE = GND
0.7
0.6
T
= 85oC
A
SW 2 V/Div
0.5
0.4
0.3
0.2
ICOIL200 mA/Div
T
= 25oC
T
= -40oC
A
A
0.1
0
Time Base - 2 ms/Div
2
2.5
3
3.5
4
4.5
5
5.5
6
V
− Input Voltage − V
IN
Figure 29.
Figure 30.
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QUIESCENT CURRENT
vs
STATIC DRAIN-SOURCE ON-STATE RESISTANCE
vs
INPUT VOLTAGE
INPUT VOLTAGE
20
0.8
MODE = GND,
EN = VIN,
Devise Not Switching
High Side Switching
0.7
0.6
0.5
18
16
T
= 85oC
A
T
= 85oC
A
= 25oC
T
= 25oC
T
A
A
14
12
10
8
0.4
0.3
0.2
0.1
0
T
= -40oC
A
T
= -40oC
A
2
2.5
3
3.5
4
4.5
5
5.5
6
2
2.5
3
3.5
4
4.5
5
V
− Input Voltage − V
V
− Input Voltage − V
IN
IN
Figure 31.
Figure 32.
STATIC DRAIN-SOURCE ON-STATE RESISTANCE
vs
INPUT VOLTAGE
0.4
Low Side Switching
0.35
0.3
T
= 85oC
A
0.25
T
= 25oC
A
0.2
0.15
0.1
0.05
0
T
= -40oC
A
2
2.5
3
3.5
4
4.5
5
V
− Input Voltage − V
IN
Figure 33.
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DETAILED DESCRIPTION
OPERATION
The TPS62260 step down converter operates with typically 2.25 MHz fixed frequency pulse width modulation
(PWM) at moderate to heavy load currents. At light load currents the converter can automatically enter Power
Save Mode and operates then in PFM mode.
During PWM operation the converter use a unique fast response voltage mode control scheme with input
voltage feed-forward to achieve good line and load regulation allowing the use of small ceramic input and output
capacitors. At the beginning of each clock cycle initiated by the clock signal, the High Side MOSFET switch is
turned on. The current flows now from the input capacitor via the High Side MOSFET switch through the
inductor to the output capacitor and load. During this phase, the current ramps up until the PWM comparator
trips and the control logic will turn off the switch. The current limit comparator will also turn off the switch in case
the current limit of the High Side MOSFET switch is exceeded. After a dead time preventing shoot through
current, the Low Side MOSFET rectifier is turned on and the inductor current will ramp down. The current flows
now from the inductor to the output capacitor and to the load. It returns back to the inductor through the Low
Side MOSFET rectifier.
The next cycle will be initiated by the clock signal again turning off the Low Side MOSFET rectifier and turning
on the on the High Side MOSFET switch.
POWER SAVE MODE
The Power Save Mode is enabled with MODE Pin set to low level. If the load current decreases, the converter
will enter Power Save Mode operation automatically. During Power Save Mode the converter skips switching
and operates with reduced frequency in PFM mode with a minimum quiescent current to maintain high
efficiency. The converter will position the output voltage typically +1% above the nominal output voltage. This
voltage positioning feature minimizes voltage drops caused by a sudden load step.
The transition from PWM mode to PFM mode occurs once the inductor current in the Low Side MOSFET switch
becomes zero, which indicates discontinuous conduction mode.
During the Power Save Mode the output voltage is monitored with a PFM comparator. As the output voltage falls
below the PFM comparator threshold of VOUT nominal +1%, the device starts a PFM current pulse. The High
Side MOSFET switch will turn on, and the inductor current ramps up. After the On-time expires, the switch is
turned off and the Low Side MOSFET switch is turned on until the inductor current becomes zero.
The converter effectively delivers a current to the output capacitor and the load. If the load is below the delivered
current, the output voltage will rise. If the output voltage is equal or higher than the PFM comparator threshold,
the device stops switching and enters a sleep mode with typical 15µA current consumption.
If the output voltage is still below the PFM comparator threshold, a sequence of further PFM current pulses are
generated until the PFM comparator threshold is reached. The converter starts switching again once the output
voltage drops below the PFM comparator threshold.
With a fast single threshold comparator, the output voltage ripple during PFM mode operation can be kept small.
The PFM Pulse is time controlled, which allows to modify the charge transferred to the output capacitor by the
value of the inductor. The resulting PFM output voltage ripple and PFM frequency depend in first order on the
size of the output capacitor and the inductor value. Increasing output capacitor values and inductor values will
minimize the output ripple. The PFM frequency decreases with smaller inductor values and increases with larger
values.
The PFM mode is left and PWM mode entered in case the output current can not longer be supported in PFM
mode. The Power Save Mode can be disabled through the MODE pin set to high. The converter will then
operate in fixed frequency PWM mode.
Dynamic Voltage Positioning
This feature reduces the voltage under/overshoots at load steps from light to heavy load and vice versa. It is
active in Power Save Mode and regulates the output voltage 1% higher than the nominal value. This provides
more headroom for both the voltage drop at a load step, and the voltage increase at a load throw-off.
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DETAILED DESCRIPTION (continued)
Output voltage
Vout +1%
PFM Comparator
threshold
Voltage Positioning
Light load
PFM Mode
Vout (PWM)
moderate to heavy load
PWM Mode
Figure 34. Power Save Mode Operation with automatic Mode transition
100% Duty Cycle Low Dropout Operation
The device starts to enter 100% duty cycle mode once the input voltage comes close to the nominal output
voltage. In order to maintain the output voltage, the High Side MOSFET switch is turned on 100% for one or
more cycles.
With further decreasing VIN the High Side MOSFET switch is turned on completely. In this case the converter
offers a low input-to-output voltage difference. This is particularly useful in battery-powered applications to
achieve longest operation time by taking full advantage of the whole battery voltage range.
The minimum input voltage to maintain regulation depends on the load current and output voltage, and can be
calculated as:
VINmin = VOmax + IOmax × (RDS(on)max + RL)
With:
IOmax = maximum output current plus inductor ripple current
RDS(on)max = maximum P-channel switch RDSon.
RL = DC resistance of the inductor
VOmax = nominal output voltage plus maximum output voltage tolerance
Undervoltage Lockout
The undervoltage lockout circuit prevents the device from malfunctioning at low input voltages and from
excessive discharge of the battery and disables the output stage of the converter. The undervoltage lockout
threshold is typically 1.85V with falling VIN.
MODE SELECTION
The MODE pin allows mode selection between forced PWM mode and Power Save Mode.
Connecting this pin to GND enables the Power Save Mode with automatic transition between PWM and PFM
mode. Pulling the MODE pin high forces the converter to operate in fixed frequency PWM mode even at light
load currents. This allows simple filtering of the switching frequency for noise sensitive applications. In this
mode, the efficiency is lower compared to the power save mode during light loads.
The condition of the MODE pin can be changed during operation and allows efficient power management by
adjusting the operation mode of the converter to the specific system requirements.
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DETAILED DESCRIPTION (continued)
ENABLE
The device is enabled setting EN pin to high. During the start up time tStart Up the internal circuits are settled and
the soft start circuit is activated. The EN input can be used to control power sequencing in a system with various
DC/DC converters. The EN pin can be connected to the output of another converter, to drive the EN pin high
and getting a sequencing of supply rails. With EN = GND, the device enters shutdown mode in which all internal
circuits are disabled. In fixed output voltage versions, the internal resistor divider network is then disconnected
from FB pin.
SOFT START
The TPS62260 has an internal soft start circuit that controls the ramp up of the output voltage. The output
voltage ramps up from 5% to 95% of its nominal value within typical 250µs. This limits the inrush current in the
converter during ramp up and prevents possible input voltage drops when a battery or high impedance power
source is used. The soft start circuit is enabled within the start up time tStart Up
.
SHORT-CIRCUIT PROTECTION
The High Side and Low Side MOSFET switches are short-circuit protected with maximum switch current = ILIMF
.
The current in the switches is monitored by current limit comparators. Once the current in the High Side
MOSFET switch exceeds the threshold of it's current limit comparator, it turns off and the Low Side MOSFET
switch is activated to ramp down the current in the inductor and High Side MOSFET switch. The High Side
MOSFET switch can only turn on again, once the current in the Low Side MOSFET switch has decreased below
the threshold of its current limit comparator.
THERMAL SHUTDOWN
As soon as the junction temperature, TJ, exceeds 140°C (typical) the device goes into thermal shutdown. In this
mode, the High Side and Low Side MOSFETs are turned-off. The device continues its operation when the
junction temperature falls below the thermal shutdown hysteresis.
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APPLICATION INFORMATION
L1
2.2 µH
VOUT 1.2V
600 mA
TPS62262DRV
2.3V to 6V
VIN =
VIN
EN
SW
CIN
4.7µF
COUT
10 µF
FB
GND
MODE
Figure 35. TPS62260 Fixed 1.2-V Output
L
1
TPS62260DRV
2.2 mH
V
1.2 V
OUT
V
IN
SW
FB
C
R
1
22 pF
1
C
IN
C
360 kW
OUT
EN
4.7 mF
10 mF
GND
R
2
360 kW
MODE
Figure 36. TPS62260DRV Adjustable 1.2-V Output
L1
2.2 µH
VOUT 1.5 V
600 mA
TPS62260DRV
VIN = 2.3V to 6V
VIN
SW
R1
540 kΩ
CIN
4.7µF
EN
C1
22pF
COUT
10 µF
FB
GND
R2
360 kΩ
MODE
Figure 37. TPS62260 Fixed 1.5-V Output
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APPLICATION INFORMATION (continued)
L1
2.2 µH
VOUT 1.8 V
600 mA
TPS62261DRV
2.3V to 6V
VIN =
VIN
EN
SW
CIN
4.7µF
COUT
10 µF
FB
GND
MODE
Figure 38. TPS62261 Fixed 1.8-V Output
OUTPUT VOLTAGE SETTING
The output voltage can be calculated to:
R
1
ǒ1 ) Ǔ
V
+ V
OUT
REF
R
2
with an internal reference voltage VREF typical 0.6V.
To minimize the current through the feedback divider network, R2 should be 180 kΩ or 360 kΩ. The sum of R1
and R2 should not exceed ~1MΩ, to keep the network robust against noise. An external feed forward capacitor
C1 is required for optimum load transient response. The value of C1 should be in the range between 22pF and
33pF.
Route the FB line away from noise sources, such as the inductor or the SW line.
OUTPUT FILTER DESIGN (INDUCTOR AND OUTPUT CAPACITOR)
The TPS62260 is designed to operate with inductors in the range of 1.5µH to 4.7µH and with output capacitors
in the range of 4.7µF to 22µF. The part is optimized for operation with a 2.2µH inductor and 10µF output
capacitor.
Larger or smaller inductor values can be used to optimize the performance of the device for specific operation
conditions. For stable operation, the L and C values of the output filter may not fall below 1µH effective
inductance and 3.5µF effective capacitance.
Inductor Selection
The inductor value has a direct effect on the ripple current. The selected inductor has to be rated for its dc
resistance and saturation current. The inductor ripple current (∆IL) decreases with higher inductance and
increases with higher VI or VO.
The inductor selection has also impact on the output voltage ripple in PFM mode. Higher inductor values will
lead to lower output voltage ripple and higher PFM frequency, lower inductor values will lead to a higher output
voltage ripple but lower PFM frequency.
Equation 1 calculates the maximum inductor current in PWM mode under static load conditions. The saturation
current of the inductor should be rated higher than the maximum inductor current as calculated with Equation 2.
This is recommended because during heavy load transient the inductor current will rise above the calculated
value.
Vout
Vin
1 *
DI + Vout
L
L ƒ
(1)
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APPLICATION INFORMATION (continued)
DI
L
I
+ I
)
outmax
Lmax
2
(2)
With:
f = Switching Frequency (2.25MHz typical)
L = Inductor Value
∆IL = Peak to Peak inductor ripple current
ILmax = Maximum Inductor current
A more conservative approach is to select the inductor current rating just for the switch current limit ILIMF of the
converter.
Accepting larger values of ripple current allows the use of lower inductance values, but results in higher output
voltage ripple, greater core losses, and lower output current capability.
The total losses of the coil have a strong impact on the efficiency of the DC/DC conversion and consist of both
the losses in the dc resistance (R(DC)) and the following frequency-dependent components:
•
•
•
•
The losses in the core material (magnetic hysteresis loss, especially at high switching frequencies)
Additional losses in the conductor from the skin effect (current displacement at high frequencies)
Magnetic field losses of the neighboring windings (proximity effect)
Radiation losses
Table 1. List of Inductors
DIMENSIONS [mm3]
2.5x2.0x1.0max
2.5x2.0x1.2max
2.5x2.0x1.0max
2.5x2.0x1.2max
3x3x1.5max
Inductance µH
INDUCTOR TYPE
MIPS2520D2R2
SUPPLIER
FDK
2.0
2.0
2.2
2.2
2.2
MIPSA2520D2R2
KSLI-252010AG2R2
LQM2HPN2R2MJ0L
LPS3015 2R2
FDK
Htachi Metals
Murata
Coilcraft
Output Capacitor Selection
The advanced fast-response voltage mode control scheme of the TPS62260 allows the use of tiny ceramic
capacitors. Ceramic capacitors with low ESR values have the lowest output voltage ripple and are
recommended. The output capacitor requires either an X7R or X5R dielectric. Y5V and Z5U dielectric
capacitors, aside from their wide variation in capacitance over temperature, become resistive at high
frequencies.
At nominal load current, the device operates in PWM mode and the RMS ripple current is calculated as:
Vout
Vin
L ƒ
1 *
1
I
+ Vout
RMSCout
Ǹ
2 3
(3)
At nominal load current, the device operates in PWM mode and the overall output voltage ripple is the sum of
the voltage spike caused by the output capacitor ESR plus the voltage ripple caused by charging and
discharging the output capacitor:
Vout
Vin
L ƒ
1 *
1
ǒ
) ESRǓ
DVout + Vout
8 Cout ƒ
(4)
At light load currents, the converter operates in Power Save Mode and the output voltage ripple is dependent on
the output capacitor and inductor value. Larger output capacitor and inductor values minimize the voltage ripple
in PFM mode and tighten DC output accuracy in PFM mode.
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Input Capacitor Selection
An input capacitor is required for best input voltage filtering, and minimizing the interference with other circuits
caused by high input voltage spikes. For most applications, a 4.7µF to 10µF ceramic capacitor is recommended.
Because ceramic capacitor loses up to 80% of its initial capacitance at 5 V, it is recommended that 10µF input
capacitors be used for input voltages > 4.5V. The input capacitor can be increased without any limit for better
input voltage filtering. Take care when using only small ceramic input capacitors. When a ceramic capacitor is
used at the input and the power is being supplied through long wires, such as from a wall adapter, a load step at
the output or VIN step on the input can induce ringing at the VIN pin. This ringing can couple to the output and
be mistaken as loop instability or could even damage the part by exceeding the maximum ratings.
Table 2. List of Capacitors
CAPACITANCE
4.7µF
TYPE
SIZE
SUPPLIER
Murata
GRM188R60J475K
GRM188R60J106M69D
0603 1.6x0.8x0.8mm3
0603 1.6x0.8x0.8mm3
10µF
Murata
LAYOUT CONSIDERATIONS
Figure 39. Suggested Layout for Fixed Output Voltage Options
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VOUT
GND
C1
R1
VIN
C
OUT
L
U
Figure 40. Suggested Layout for Adjustable Output Voltage Version
As for all switching power supplies, the layout is an important step in the design. Proper function of the device
demands careful attention to PCB layout. Care must be taken in board layout to get the specified performance. If
the layout is not carefully done, the regulator could show poor line and/or load regulation, stability issues as well
as EMI problems. It is critical to provide a low inductance, impedance ground path. Therefore, use wide and
short traces for the main current paths. The input capacitor should be placed as close as possible to the IC pins
as well as the inductor and output capacitor.
Connect the GND Pin of the device to the PowerPAD™ of the PCB and use this pad as a star point. Use a
common Power GND node and a different node for the Signal GND to minimize the effects of ground noise.
Connect these ground nodes together to the PowerPAD (star point) underneath the IC. Keep the common path
to the GND PIN, which returns the small signal components and the high current of the output capacitors as
short as possible to avoid ground noise. The FB line should be connected right to the output capacitor and
routed away from noisy components and traces (e.g., SW line).
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PACKAGE OPTION ADDENDUM
www.ti.com
23-Jul-2007
PACKAGING INFORMATION
Orderable Device
TPS62260DDCR
TPS62260DDCRG4
TPS62260DDCT
TPS62260DDCTG4
TPS62260DRVR
TPS62260DRVRG4
TPS62260DRVT
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TO/SOT
DDC
5
5
5
5
6
6
6
6
6
6
6
6
6
6
6
6
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TO/SOT
TO/SOT
TO/SOT
SON
DDC
DDC
DDC
DRV
DRV
DRV
DRV
DRV
DRV
DRV
DRV
DRV
DRV
DRV
DRV
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SON
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS62260DRVTG4
TPS62261DRVR
TPS62261DRVRG4
TPS62261DRVT
SON
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SON
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SON
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS62261DRVTG4
TPS62262DRVR
TPS62262DRVRG4
TPS62262DRVT
SON
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SON
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SON
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS62262DRVTG4
SON
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
23-Jul-2007
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Jul-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Jul-2007
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
179
179
179
179
179
179
179
179
179
(mm)
TPS62260DDCR
TPS62260DDCT
TPS62260DDCT
TPS62260DRVR
TPS62260DRVT
TPS62261DRVR
TPS62261DRVT
TPS62262DRVR
TPS62262DRVT
DDC
DDC
DDC
DRV
DRV
DRV
DRV
DRV
DRV
5
5
5
6
6
6
6
6
6
NSE
MLA
NSE
NSE
NSE
NSE
NSE
NSE
NSE
8
8
8
8
8
8
8
8
8
3.2
3.2
3.2
2.2
2.2
2.2
2.2
2.2
2.2
3.2
3.2
3.2
2.2
2.2
2.2
2.2
2.2
2.2
1.4
1.4
1.4
1.2
1.2
1.2
1.2
1.2
1.2
4
4
4
4
4
4
4
4
4
8
8
8
8
8
8
8
8
8
Q3
Q3
Q3
Q2
Q2
Q2
Q2
Q2
Q2
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
TPS62260DDCR
TPS62260DDCT
TPS62260DDCT
TPS62260DRVR
TPS62260DRVT
TPS62261DRVR
TPS62261DRVT
TPS62262DRVR
TPS62262DRVT
DDC
DDC
DDC
DRV
DRV
DRV
DRV
DRV
DRV
5
5
5
6
6
6
6
6
6
NSE
MLA
NSE
NSE
NSE
NSE
NSE
NSE
NSE
195.0
195.0
195.0
195.0
195.0
195.0
195.0
195.0
195.0
200.0
200.0
200.0
200.0
200.0
200.0
200.0
200.0
200.0
45.0
45.0
45.0
45.0
45.0
45.0
45.0
45.0
45.0
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Jul-2007
Pack Materials-Page 3
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
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TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
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Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
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practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
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representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
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TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
RFID
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lpw
Telephony
Low Power
Wireless
Video & Imaging
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
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