TPS62823DLCT [TI]

采用 1.5mm x 2mm VSON-HR 封装、具有 1% 精度的 2.4V 至 5.5V 输入、3A 降压转换器 | DLC | 8 | -40 to 125;
TPS62823DLCT
型号: TPS62823DLCT
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

采用 1.5mm x 2mm VSON-HR 封装、具有 1% 精度的 2.4V 至 5.5V 输入、3A 降压转换器 | DLC | 8 | -40 to 125

开关 光电二极管 输出元件 转换器
文件: 总31页 (文件大小:2545K)
中文:  中文翻译
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TPS62821, TPS62822, TPS62823  
ZHCSHQ2B NOVEMBER 2017REVISED MAY 2018  
精度为 1% TPS6282x 5.5V1A/2A/3A 降压转换器系列  
1 特性  
3 说明  
1
DCS-Control™拓扑  
26/25mΩ 内部电源开关 (TPS62823)  
TPS6282x 是一款通用且易于使用的同步降压型直流/  
直流转换器,具有仅 4µA 的极低静态电流。此系列器  
件具有 2.4V 5.5V 的输入电压,可提供高达 3A 的  
输出电流 (TPS62823)。此产品基于 DCS-Control™拓  
扑,可实现快速瞬态响应。  
输出电流高达 3A (TPS62823)  
极低的静态电流:4µA  
典型开关频率为 2.2MHz  
反馈电压精度为 1%(完整温度范围)  
使能 (EN) 和电源正常 (PG) 引脚  
可调输出电压范围为 0.6V 4V  
100% 占空比模式  
由于具有内部基准,此产品可在 -40°C 125°C 的结  
温范围内以高达 1% 的反馈电压精度将输出电压调节  
到低至 0.6V1A/2A/3A 可扩展引脚对引脚器件系列可  
实现 BOM BOM 兼容,并可与 470nH 的小型电感  
器结合使用。  
内部软启动电路  
无缝省电模式转换  
TPS6282x 可在超轻负载时自动进入省电模式,并能保  
持高效率。  
欠压闭锁  
有源输出放电  
逐周期电流限制  
该器件 具有 电源正常信号和内部软启动电路。它能够  
100% 模式运行。在故障保护方面,它加入了断续  
电流限制以及热关断功能。  
断续短路保护  
过热保护  
使用 TPS62822 并借助 WEBENCH® 电源设计器  
创建定制设计方案  
TPS6282x 采用 2 x 1.5mm QFN-8 封装。  
器件信息(1)  
2 应用  
器件号  
TPS62821DLC  
TPS62822DLC  
TPS62823DLC  
封装  
封装尺寸(标称值)  
便携式/电池供电类设备中的 POL 电源  
工厂和楼宇自动化  
移动计算、网卡  
QFN (8)  
2.00mm x 1.50mm  
固态驱动器  
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附  
录。  
数据终端、销售终端  
服务器、投影仪、打印机  
空白  
空白  
典型应用电路原理图  
效率与输出电流间的关系  
空白  
空白  
空白  
空白  
空白  
2.4 to 5.5V  
4.7µF  
470nH  
VOUT/2A  
10µF  
SW  
VIN  
EN  
TPS62822  
R1  
R2  
Cff*  
VFB=0.6V  
1%  
FB  
PG  
PGND  
AGND  
Copyright © 2017, Texas Instruments Incorporated  
* optional  
1
本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。 有关适用的官方英文版本的最新信息,请访问 www.ti.com,其内容始终优先。 TI 不保证翻译的准确  
性和有效性。 在实际设计之前,请务必参考最新版本的英文版本。  
English Data Sheet: SLVSDV6  
 
 
TPS62821, TPS62822, TPS62823  
ZHCSHQ2B NOVEMBER 2017REVISED MAY 2018  
www.ti.com.cn  
目录  
8.4 Device Functional Modes.......................................... 8  
Application and Implementation ........................ 10  
9.1 Application Information............................................ 10  
9.2 Typical Application ................................................. 10  
1
2
3
4
5
6
7
特性.......................................................................... 1  
应用.......................................................................... 1  
说明.......................................................................... 1  
修订历史记录 ........................................................... 2  
Device Comparison Table..................................... 3  
Pin Configuration and Functions......................... 3  
Specifications......................................................... 4  
7.1 Absolute Maximum Ratings ...................................... 4  
7.2 ESD Ratings ............................................................ 4  
7.3 Recommended Operating Conditions....................... 4  
7.4 Thermal Information.................................................. 4  
7.5 Electrical Characteristics........................................... 5  
7.6 Typical Characteristics.............................................. 6  
Detailed Description .............................................. 7  
8.1 Overview ................................................................... 7  
8.2 Functional Block Diagram ......................................... 7  
8.3 Feature Description................................................... 8  
9
10 Power Supply Recommendations ..................... 21  
11 Layout................................................................... 21  
11.1 Layout Guidelines ................................................. 21  
11.2 Layout Example .................................................... 21  
12 器件和文档支持 ..................................................... 22  
12.1 器件支持 ............................................................... 22  
12.2 相关链接................................................................ 22  
12.3 接收文档更新通知 ................................................. 22  
12.4 社区资源................................................................ 22  
12.5 ....................................................................... 22  
12.6 静电放电警告......................................................... 22  
12.7 术语表 ................................................................... 22  
13 机械、封装和可订购信息....................................... 22  
8
4 修订历史记录  
注:之前版本的页码可能与当前版本有所不同。  
Changes from Revision A (February 2018) to Revision B  
Page  
已更改 将 TPS62822 TPS62823 的状态改为生产数据器件。 ......................................................................................... 22  
Changes from Original (November 2017) to Revision A  
Page  
已更改 将 TPS62821 的状态改为生产数据器件................................................................................................................ 22  
2
Copyright © 2017–2018, Texas Instruments Incorporated  
 
TPS62821, TPS62822, TPS62823  
www.ti.com.cn  
ZHCSHQ2B NOVEMBER 2017REVISED MAY 2018  
5 Device Comparison Table  
(1)  
Part Number  
TPS62821DLC  
TPS62822DLC  
TPS62823DLC  
Output Current  
Output Voltage  
1 A  
2 A  
3 A  
Adjustable  
Adjustable  
Adjustable  
(1) For fixed output voltage versions please contact your TI sales representative.  
6 Pin Configuration and Functions  
space  
DLC Package  
8 Pin (VQFN)  
Top View  
PG  
1
2
3
4
8
7
6
5
EN  
FB  
VIN  
SW  
AGND  
NC  
PGND  
space  
Pin Functions  
PIN  
I/O  
DESCRIPTION  
NAME  
EN  
NO.  
1
I
I
Enable input (High=Enabled, Low=Disabled). Do not leave floating.  
Output voltage feedback. Connect resistive voltage divider to this pin.  
Signal ground. Internally connected to the PGND pin. Can be left floating.  
Internally not connected. Can be connected to VOUT, GND or left floating.  
Power ground  
FB  
2
AGND  
NC  
3
4
PGND  
SW  
5
Power  
Power  
Power  
O
6
Switch node, connected to the internal MOSFET switches.  
Supply voltage  
VIN  
7
PG  
8
Power good output. If unused, leave floating or connect to GND.  
Copyright © 2017–2018, Texas Instruments Incorporated  
3
TPS62821, TPS62822, TPS62823  
ZHCSHQ2B NOVEMBER 2017REVISED MAY 2018  
www.ti.com.cn  
7 Specifications  
7.1 Absolute Maximum Ratings(1)  
MIN  
-0.3  
-0.3  
-1.0  
-2.5  
MAX  
UNIT  
VIN, FB, EN, PG, NC  
SW (DC)  
6
Pin Voltage Range  
VIN + 0.3  
V
SW (DC, in current limit)  
SW (AC), less than 10ns(2)  
10  
1
Power Good Sink Current  
mA  
°C  
Operating Junction Temperature Range, TJ  
Storage temperature, Tstg  
-40  
-65  
150  
150  
°C  
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings  
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended  
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) While switching.  
7.2 ESD Ratings  
VALUE  
UNIT  
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)  
±2000  
V(ESD)  
Electrostatic discharge  
V
Charged-device model (CDM), per JEDEC specification JESD22-  
C101(2)  
±500  
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.  
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.  
7.3 Recommended Operating Conditions  
MIN  
2.4  
NOM  
MAX  
5.5  
4
UNIT  
V
Supply Voltage Range, VIN  
Output Voltage Range, VOUT  
0.6  
V
TPS62821  
TPS62822  
TPS62823  
1
Maximum Output Current, IOUT  
2
A
3
Operating Junction Temperature, TJ  
7.4 Thermal Information  
-40  
125  
°C  
TPS6282x  
THERMAL METRIC(1)  
DLC (VQFN) 8 PINS  
UNIT  
JEDEC PCB  
114.1  
90.2  
TPS6282xEVM-005  
RθJA  
Junction-to-ambient thermal resistance  
Junction-to-case (top) thermal resistance  
Junction-to-board thermal resistance  
69.9  
n/a(2)  
n/a(2)  
4.3  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
RθJC(top)  
RθJB  
43.4  
ψJT  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
Junction-to-case (bottom) thermal resistance  
6.6  
ψJB  
43.7  
44.2  
n/a  
RθJC(bot)  
n/a  
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application  
report.  
(2) Not applicable to an EVM.  
4
Copyright © 2017–2018, Texas Instruments Incorporated  
TPS62821, TPS62822, TPS62823  
www.ti.com.cn  
ZHCSHQ2B NOVEMBER 2017REVISED MAY 2018  
7.5 Electrical Characteristics  
over operating junction temperature range (TJ=-40°C to 125°C) and VIN=2.4V to 5.5V. Typical values at VIN=5V and TJ=25°C  
(unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
SUPPLY  
VIN  
Input Voltage range  
2.4  
5.5  
10  
V
EN=High, IOUT=0A, device not  
switching  
IQ  
Operating Quiescent Current  
4
µA  
ISD  
Shutdown Current  
EN=Low, TJ = -40°C to 85°C  
Falling Input Voltage  
0.05  
2.2  
0.5  
2.3  
µA  
V
Undervoltage Threshold  
Undervoltage Hysteresis  
Thermal Shutdown Threshold  
Thermal Shutdown Hysteresis  
2.1  
1.0  
VUVLO  
160  
150  
20  
mV  
Rising Junction Temperature  
TSD  
°C  
CONTROL (EN, PG)  
VH  
High-Level Threshold Voltage (EN)  
V
V
VL  
Low-Level Threshold Voltage (EN)  
Input Leakage Current (EN, PG)  
0.4  
ILKG  
EN = High, VPG = 5V  
10  
100  
nA  
Time from EN=High to 95% of VOUT  
nominal  
tSS  
Soft-Start Time  
1.25  
ms  
Rising (VFB vs regulation target)  
Falling (VFB vs regulation target)  
Rising (VFB vs regulation target)  
Falling (VFB vs regulation target)  
94%  
90%  
96%  
92%  
98%  
94%  
Power Good Lower Threshold  
Voltage  
VPGTL  
108%  
103%  
110%  
105%  
112%  
107%  
Power Good Upper Threshold  
Voltage  
VPGTH  
VPGL  
tPGD  
Power Good Logic Low Level Output  
Voltage  
IPG = -1mA  
0.4  
V
rising  
falling  
100  
20  
Power Good delay  
µs  
POWER SWITCH  
FSW  
Switching Frequency  
PWM Mode Operation  
TPS62821  
2.2  
35  
MHz  
High-Side FET ON-Resistance  
Low-Side FET ON-Resistance  
High-Side FET Current Limit  
TPS62822  
35  
RDS(on)  
mΩ  
TPS62823  
26  
TPS62821,2,3  
TPS62821  
25  
1.7  
2.7  
3.7  
2.1  
3.3  
4.3  
2.4  
3.7  
5.0  
ILIM  
TPS62822  
A
TPS62823  
OUTPUT  
ILKG_FB  
VFB  
Input Leakage Current (FB)  
Feedback Voltage Accuracy  
Output Discharge Current  
DC Load Regulation  
EN=High, VFB=0.6V  
PWM Mode  
10  
600  
400  
0.2  
50  
nA  
mV  
mA  
%/A  
%/V  
594  
75  
606  
IDIS  
EN=Low, VSW = 0.4V  
PWM Mode Operation  
PWM Mode Operation  
DC Line Regulation  
0.05  
版权 © 2017–2018, Texas Instruments Incorporated  
5
 
TPS62821, TPS62822, TPS62823  
ZHCSHQ2B NOVEMBER 2017REVISED MAY 2018  
www.ti.com.cn  
.0  
7.6 Typical Characteristics  
1. Quiescent Current  
2. Shutdown Current  
3. High-Side Switch Resistance (TPS62821/2)  
4. High-Side Switch Resistance (TPS62823)  
5. Low-Side Switch Resistance (TPS62821/2/3)  
6. Active Output Discharge Current (EN=Low)  
版权 © 2017–2018, Texas Instruments Incorporated  
6
TPS62821, TPS62822, TPS62823  
www.ti.com.cn  
ZHCSHQ2B NOVEMBER 2017REVISED MAY 2018  
8 Detailed Description  
8.1 Overview  
The TPS6282x are synchronous step-down converters based on the DCS-Control™ topology with an adaptive  
constant on-time control and a stabilized switching frequency. It operates in PWM (pulse width modulation) mode  
for medium to heavy loads and in PSM (power save mode) at light load conditions, keeping the output voltage  
ripple small. The nominal switching frequency is about 2.2MHz with a small and controlled variation over the  
input voltage range. As the load current decreases, the converter enters PSM, reducing the switching frequency  
to keep efficiency high over the entire load current range. Since combining both PWM and PSM within a single  
building block, the transition between modes is seamless and without effect on the output voltage. The devices  
offer both excellent dc voltage and fast load transient regulation, combined with a very low output voltage ripple.  
8.2 Functional Block Diagram  
space  
VPGTH  
Control Logic  
EN  
PG  
VFB  
Thermal  
Shutdown  
VPGTL  
Soft-Start  
UVLO  
VFB  
VIN  
Ramp  
VSW  
FB  
VIN  
Peak Current Detect  
errAmp  
VREF  
Comp  
HICCUP  
VSW  
Modulator  
Gate Drive  
AGND  
SW  
TON  
VIN VSW  
Zero Current Detect  
VREF  
SW  
EN  
VREF  
NC  
PGND  
Discharge  
版权 © 2017–2018, Texas Instruments Incorporated  
7
TPS62821, TPS62822, TPS62823  
ZHCSHQ2B NOVEMBER 2017REVISED MAY 2018  
www.ti.com.cn  
8.3 Feature Description  
8.3.1 Enable / Shutdown and Output Discharge  
The device starts operation, when Enable (EN) is set High. The input threshold levels are typically 0.9V for rising  
and 0.7V for falling signals. Do not leave EN floating. Shutdown is forced if EN is pulled Low with a shutdown  
current of typically 50nA. During shutdown, the internal power MOSFETs as well as the entire control circuitry are  
turned off and the output voltage is actively discharged through the SW pin by a current sink. Therefore, VIN must  
remain present for the discharge to function.  
8.3.2 Soft-Start  
About 250µs after EN goes High, the internal soft-start circuitry controls the output voltage during startup. This  
avoids excessive inrush current and ensures a controlled output voltage rise time of about 1ms. It also prevents  
unwanted voltage drops from high-impedance power sources or batteries. TPS6282x can start into a pre-biased  
output.  
8.3.3 Power Good (PG)  
The TPS6282x has a built in power good (PG) function. The PG pin goes high impedance, when the output  
voltage has reached its nominal value. Otherwise, including when disabled, in UVLO or in thermal shutdown, PG  
is Low (see 1). The PG function is formed with a window comparator, which has an upper and lower voltage  
threshold (see Electrical Characteristics). The PG pin is an open drain output that requires a pull-up resistor and  
can sink up to 1mA. If not used, the PG pin can be left floating or connected to GND.  
1. Power Good Pin Logic  
PG Logic Status  
Device State  
FB VPGTL and VFB VPGTH  
High Impedance  
Low  
V
Enable (EN=High)  
V
FB VPGTL or VFB VPGTH  
Shutdown (EN=Low)  
UVLO  
0.7 V < VIN < VUVLO  
TJ > TSD  
Thermal Shutdown  
Power Supply Removal  
VIN < 0.7 V  
At startup, PG transitions from low to floating about 100µs after the output voltage has reached regulation. Once  
in operation, PG has a deglitch delay of about 20µs before going low. When the output voltage returns to  
regulation, the same 100µs delay occurs.  
8.3.4 Undervoltage Lockout (UVLO)  
The undervoltage lockout (UVLO) function prevents misoperation of the device, if the input voltage drops below  
the UVLO threshold. It is set to about 2.2V with a hysteresis of typically 160mV.  
8.3.5 Thermal Shutdown  
The junction temperature (TJ) of the device is monitored by an internal temperature sensor. If TJ exceeds 150°C  
(typ.), the device goes in thermal shutdown with a hysteresis of typically 20°C. Once the TJ has decreased  
enough, the device resumes normal operation.  
8.4 Device Functional Modes  
8.4.1 Pulse Width Modulation (PWM) Operation  
At load currents larger than half the inductor ripple current, the device operates in pulse width modulation in  
continuous conduction mode (CCM).  
The PWM operation is based on an adaptive constant on-time control with stabilized switching frequency. To  
achieve a stable switching frequency in a steady state condition, the on-time is calculated as:  
space  
8
版权 © 2017–2018, Texas Instruments Incorporated  
 
TPS62821, TPS62822, TPS62823  
www.ti.com.cn  
ZHCSHQ2B NOVEMBER 2017REVISED MAY 2018  
Device Functional Modes (接下页)  
VOUT  
TON  
=
× 450ns  
V
IN  
(1)  
space  
With that, the typical switching frequency is about 2.2MHz.  
8.4.2 Power Save Mode (PSM) Operation  
To maintain high efficiency at light loads, the device enters power save mode (PSM) at the boundary to  
discontinuous conduction mode (DCM). This happens when the output current becomes smaller than half of the  
inductor's ripple current. The device operates now with a fixed on-time and the switching frequency further  
decreases proportional to the load current. It can be calculated as:  
space  
2×IOUT  
fPSM  
=
V
V -V  
é
ù
TO2N  
×
IN  
IN  
OUT  
ê
ú
VOUT  
L
ë
û
(2)  
space  
In PSM, the output voltage rises slightly above the nominal target, which can be minimized using larger output  
capacitance. At duty cycles larger than 90%, the device may not enter PSM. The device maintains output  
regulation in PWM mode.  
8.4.3 Minimum Duty Cycle and 100% Mode Operation  
There is no limitation for small duty cycles, since even at very low duty cycles the switching frequency is reduced  
as needed to always ensure a proper regulation.  
If the output voltage level comes close to the input voltage, the device enters 100% mode. While the high-side  
switch is constantly turned on, the low-side switch is switched off. The difference between VIN and VOUT is  
determined by the voltage drop across the high-side FET and the dc resistance of the inductor. The minimum VIN  
that is needed to maintain a specific VOUT value is estimated as:  
space  
VIN(min) =VOUT + IOUT (RDS(on) + RDC(L)  
space  
)
(3)  
8.4.4 Current Limit and Short Circuit Protection  
The peak switch current of TPS6282x is internally limited, cycle by cycle, to a maximum dc value as specified in  
Electrical Characteristics. This prevents the device from drawing excessive current in case of externally caused  
over current or short circuit condition. Due to an internal propagation delay of about 60ns, the actual ac peak  
current can exceed the static current limit during that time.  
If the current limit threshold is reached, the device delivers its maximum output current. Detecting this condition  
for 32 switching cycles (about 13µs), the device turns off the high-side MOSFET for about 100µs which allows  
the inductor current to decrease through the low-side MOSFET's body diode and then restarts again with a soft  
start cycle. As long as the overload condition is present, the device hiccups that way, limiting the output power.  
版权 © 2017–2018, Texas Instruments Incorporated  
9
TPS62821, TPS62822, TPS62823  
ZHCSHQ2B NOVEMBER 2017REVISED MAY 2018  
www.ti.com.cn  
9 Application and Implementation  
space  
Information in the following applications sections is not part of the TI component  
specification, and TI does not warrant its accuracy or completeness. TI’s customers are  
responsible for determining suitability of components for their purposes. Customers should  
validate and test their design implementation to confirm system functionality.  
space  
9.1 Application Information  
The TPS6282x is a switched mode step-down converter, able to convert a 2.4-V to 5.5-V input voltage into a  
lower 0.6-V to 4-V output voltage, providing up to 3A continuous output current (TPS62823). It needs a very low  
amount of external components. Apart from the inductor and the output and input capacitors, additional parts are  
only needed to set the output voltage and to enable the Power Good (PG) feature.  
9.2 Typical Application  
space  
2.4 to 5.5V  
470nH  
VOUT/2A  
SW  
VIN  
EN  
VPG  
TPS62822  
C1  
R3  
R1  
R2  
Cff*  
C2  
C3*  
FB  
PG  
PGND  
AGND  
Copyright © 2017, Texas Instruments Incorporated  
* optional  
7. A typical 2.4 to 5.5-V, 2-A Power Supply  
space  
9.2.1 Design Requirements  
The following design guideline provides a range for the component selection to operate within the recommended  
operating conditions. 2 shows the components selection that was used for the measurements shown in the  
Application Curves.  
2. List of Components  
REFERENCE  
DESCRIPTION  
5.5-V, step-down converter  
MANUFACTURER  
TPS6282xDLC, Texas Instruments  
XFL4015-471MEB, Coilcraft  
JMK107BB7475MA-T, Taiyo Yuden  
GRM188Z71A106MA73D, MuRata  
GRM1885C1H121JA01D, MuRata  
Standard  
IC  
L1  
C1  
470 nH ±20%, 7.6mΩ DCR, 6.6A ISAT  
4.7 µF ±20%, 6.3V, ceramic, 0603, X7R  
10 µF ±20%, 10V, ceramic, 0603, X7R  
120pF ±5%, 50V, 0603  
C2, C3  
Cff  
R1, R2  
R3  
Depending on VOUT, chip, 0603  
100-kΩ, chip, 0603, 0.1W, 1%  
Standard  
10  
版权 © 2017–2018, Texas Instruments Incorporated  
 
TPS62821, TPS62822, TPS62823  
www.ti.com.cn  
ZHCSHQ2B NOVEMBER 2017REVISED MAY 2018  
9.2.2 Detailed Design Procedure  
9.2.2.1 Custom Design With WEBENCH® Tools  
Click here to create a custom design using the TPS62822 device with the WEBENCH® Power Designer.  
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.  
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.  
3. Compare the generated design with other possible solutions from Texas Instruments.  
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time  
pricing and component availability.  
In most cases, these actions are available:  
Run electrical simulations to see important waveforms and circuit performance  
Run thermal simulations to understand board thermal performance  
Export customized schematic and layout into popular CAD formats  
Print PDF reports for the design, and share the design with colleagues  
Get more information about WEBENCH tools at www.ti.com/WEBENCH.  
9.2.2.2 Setting the Adjustable Output Voltage  
While the device regulates the feedback voltage to 0.6V, the output voltage is specified from 0.6 to 4V. A  
resistive divider (from VOUT to FB to AGND) sets the actual output voltage of the TPS6282x. 公式 4 and 公式 5  
calculate the values of the resistors. IFB is recommended to be in the range of 5µA, but can differ if needed.  
space  
0.6V  
R2 =  
IFB  
(4)  
space  
VOUT  
R1 =  
- R2  
IFB  
(5)  
space  
3 shows standard resistor values for typical output voltages.  
space  
3. Feedback Resistor Values for Typical Output Voltages  
VOUT (V)  
1.0  
R1 (kΩ)  
R2 (kΩ)  
100  
100  
200  
475  
732  
150  
100  
100  
150  
162  
1.2  
1.8  
2.5  
3.3  
space  
9.2.2.3 Output Filter Selection  
The TPS6282x is internally compensated and optimized for a range of output filter component values, which is  
specified in 4. Using these values simplifies the output filter component selection. Checked cells represent  
combinations that are proven for stability by simulation and lab test. Further combinations are possible, but  
should be checked for each individual application.  
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11  
 
 
 
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ZHCSHQ2B NOVEMBER 2017REVISED MAY 2018  
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150 µF  
4. Recommended LC Output Filter Combinations(1)  
4.7 µF  
10 µF  
22 µF  
47 µF  
100 µF  
0.33 µH  
0.47 µH  
1.0 µH  
1.5 µH  
(2)  
(3)  
(3)  
(3)  
(1) The values in the table are the nominal values of inductors and ceramic capacitors. The effective capacitance can vary depending on  
package size, voltage rating and dielectric material (typical variations are from +20% to -50%).  
(2) This combination is recommended as the standard value for most of all applications.  
(3) Cff is recommended for large COUT values.  
9.2.2.4 Inductor Selection  
The TPS6282x is designed to work with inductors of 470nH nominal and can be used with 1µH inductors as well.  
The inductor has to be selected for adequate saturation current and a low dc resistance (DCR). The minimum  
inductor current rating, that is needed under static load conditions is calculated using 公式 6 and 公式 7.  
space  
DIL(max)  
Ipeak(max) = IL(min) = IOUT(max)  
+
2
(6)  
space  
VOUT  
æ
ç
ö
÷
1-  
ç
ç
ç
ç
è
÷
÷
÷
÷
ø
V
IN  
DIL(max) =VOUT  
L
(min) ×fSW  
(7)  
space  
This calculation gives the minimum saturation current of the inductor needed and an additional margin is  
recommended to cover dynamic overshoot due to startup or load transients. Inductors are available in different  
dimensions. Choosing the smallest size might result in less efficiency due to larger DCR and ac losses. The  
following inductors have been tested with the TPS6282x:  
5. List of Recommended Inductors  
Nominal  
INDUCTANCE  
Saturation Current and DC  
Resistance  
(1)  
TYPE  
Dimensions [mm]  
Manufacturer(2)  
max. ISAT [A](3)  
max. RDC [mΩ]  
HTEN20161T-R47MDR  
HTEH20121T-R47MSR  
DFE201610E - R47M  
DFE201210S - R47M  
TFM201610ALM-R47MTAA  
TFM201610ALC-R47MTAA  
XFL4015-471ME  
0.47  
0.47  
0.47  
0.47  
0.47  
0.47  
0.47  
4.8  
4.6  
4.8  
4.8  
5.1  
5.2  
6.6  
32  
25  
2.0 x 1.6 x 1.0  
2.0 x 1.2 x 1.0  
2.0 x 1.6 x 1.0  
2.0 x 1.2 x 1.0  
2.0 x 1.6 x 1.0  
2.0 x 1.6 x 1.0  
4.0 x 4.0 x 1.6  
Cyntec  
Cyntec  
muRata  
muRata  
TDK  
32  
32  
34  
25  
TDK  
8.36  
Coilcraft  
(1) Inductance Tolerance ±20%  
(2) See Third-party Products disclaimer.  
(3) ΔL/L30%  
12  
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TPS62821, TPS62822, TPS62823  
www.ti.com.cn  
ZHCSHQ2B NOVEMBER 2017REVISED MAY 2018  
9.2.2.5 Output Capacitor Selection  
The output voltage range of TPS6282x is 0.6V to 4V. While stability is a first criteria for the output filter selection  
(L and COUT), the output capacitor value also determines transient response behavior and ripple of VOUT. The  
recommended typical value for the output capacitor is 2x10µF (or 1x 22µF) and can be small ceramic capacitors  
with low equivalent series resistance (ESR). For lower VOUT (VOUT 2V) and where only moderate load  
transients are present, 10µF can be sufficient. In either case a minimum effective output capacitance of 5µF  
should be present.  
To keep low resistance and to get a narrow capacitance variation with temperature, it is recommended to use  
X7R or X5R dielectric. Using an even higher value has advantages like smaller voltage ripple and tighter output  
voltage accuracy in PSM.  
9.2.2.6 Input Capacitor Selection  
For typical application, an input capacitor of 4.7µF is sufficient and recommended. A larger value reduces input  
current ripple further. The input capacitor buffers the input voltage for transient events and also decouples the  
converter from the supply. A low ESR ceramic capacitor is recommended for best filtering and should be placed  
between VIN and PGND as close as possible to those pins. In either case a minimum effective input capacitance  
of 3µF should be present.  
9.2.2.7 Feed-forward Capacitor Selection  
To improve regulation speed, TPS6282x preferably operates with a feed-forward capacitor, connected between  
VOUT and FB. The appropriate value is calculated using 公式 8.  
space  
12ms  
Cff  
=
R2  
(8)  
space  
Therewith, for typical values of feedback resistors (R2=100kΩ), the feed-forward capacitance is 120pF.  
44 and 45 show the results of a frequency domain analysis for both use cases, with and without a feed-  
forward capacitor. The larger unity gain frequency, caused by the feed forward capacitor, results in a significant  
improvement of the transient response.  
版权 © 2017–2018, Texas Instruments Incorporated  
13  
 
TPS62821, TPS62822, TPS62823  
ZHCSHQ2B NOVEMBER 2017REVISED MAY 2018  
www.ti.com.cn  
9.2.3 Application Curves  
VIN=5V, VOUT=1.8V, TA=25°C, BOM = 2, (unless otherwise noted)  
100% mode  
100% mode  
8. Efficiency TPS62821 at VOUT=3.3V  
9. Efficiency TPS62821 at VOUT=3.3V  
100% mode  
100% mode  
10. Efficiency TPS62822 at VOUT=3.3V  
11. Efficiency TPS62822 at VOUT=3.3V  
100% mode  
100% mode  
12. Efficiency TPS62823 at VOUT=3.3V  
13. Efficiency TPS62823 at VOUT=3.3V  
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14  
TPS62821, TPS62822, TPS62823  
www.ti.com.cn  
ZHCSHQ2B NOVEMBER 2017REVISED MAY 2018  
14. Efficiency TPS62821 at VOUT=1.8V  
16. Efficiency TPS62822 at VOUT=1.8V  
18. Efficiency TPS62823 at VOUT=1.8V  
15. Efficiency TPS62821 at VOUT=1.8V  
17. Efficiency TPS62822 at VOUT=1.8V  
19. Efficiency TPS62823 at VOUT=1.8V  
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15  
TPS62821, TPS62822, TPS62823  
ZHCSHQ2B NOVEMBER 2017REVISED MAY 2018  
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20. Efficiency TPS62821 at VOUT=1V  
21. Efficiency TPS62821 at VOUT=1V  
22. Efficiency TPS62822 at VOUT=1V  
23. Efficiency TPS62822 at VOUT=1V  
24. Efficiency TPS62823 at VOUT=1V  
25. Efficiency TPS62823 at VOUT=1V  
16  
版权 © 2017–2018, Texas Instruments Incorporated  
TPS62821, TPS62822, TPS62823  
www.ti.com.cn  
ZHCSHQ2B NOVEMBER 2017REVISED MAY 2018  
26. Efficiency TPS62821 at VOUT=0.6V  
28. Efficiency TPS62822 at VOUT=0.6V  
30. Efficiency TPS62823 at VOUT=0.6V  
27. Efficiency TPS62821 at VOUT=0.6V  
29. Efficiency TPS62822 at VOUT=0.6V  
31. Efficiency TPS62823 at VOUT=0.6V  
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17  
TPS62821, TPS62822, TPS62823  
ZHCSHQ2B NOVEMBER 2017REVISED MAY 2018  
www.ti.com.cn  
32. Output Voltage Accuracy (Load Regulation)  
33. Output Voltage Accuracy (Line Regulation)  
34. Switching Frequency vs Output Current  
35. Switching Frequency vs Input Voltage  
COUT=2x10µF  
36. Typical Operation PWM  
IOUT=1A  
COUT=2x10µF  
IOUT=0.1A  
37. Typical Operation PSM  
18  
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TPS62821, TPS62822, TPS62823  
www.ti.com.cn  
ZHCSHQ2B NOVEMBER 2017REVISED MAY 2018  
COUT=2x10µF  
38. Startup into 0.6-Ohm (TPS62823)  
COUT=2x10µF  
39. Startup at No Load  
COUT=2x10µF  
40. Active Output Discharge at load 1.8-Ohm  
COUT=2x10µF  
41. Active Output Discharge at No Load  
COUT=2x10µF  
Cff=120pF  
COUT=2x10µF  
Cff=120pF  
42. Load Transient Response, 50mA to 1A, TPS62822  
43. Load Transient Response, 1A to 2A, TPS62822  
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19  
TPS62821, TPS62822, TPS62823  
ZHCSHQ2B NOVEMBER 2017REVISED MAY 2018  
www.ti.com.cn  
COUT=2x10µF  
CFF=120pF  
COUT=2x10µF  
no CFF  
45. Frequency Response (TPS62823), IOUT=3A  
44. Frequency Response (TPS62823), IOUT=3A  
46. Overload Response of TPS62823  
47. Overload Response of TPS62823 (Hiccup cycle)  
48. Device Temperature Rise on TPS62823 EVM at IOUT=3A  
20  
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TPS62821, TPS62822, TPS62823  
www.ti.com.cn  
ZHCSHQ2B NOVEMBER 2017REVISED MAY 2018  
10 Power Supply Recommendations  
The TPS6282x is designed to operate from a 2.4-V to 5.5-V input voltage supply. The input power supply's  
output current needs to be rated according to the output voltage and the output current of the power rail  
application.  
11 Layout  
11.1 Layout Guidelines  
The recommended PCB layout for the TPS6282x is shown below. It ensures best electrical and optimized  
thermal performance considering the following important topics:  
- The input capacitor(s) must be placed as close as possible to the VIN and PGND pins of the device. This  
provides low resistive and inductive paths for the high di/dt input current.  
- The SW node connection from the IC to the inductor conducts alternating high currents. It should be kept short.  
- The VOUT regulation loop is closed with COUT and its ground connection. To avoid load regulation and EMI  
noise, the loop should be kept short.  
- The FB node is sensitive to dv/dt signals. Therefore the resistive divider should be placed close to the FB and  
AGND pins.  
For more detailed information about the actual EVM solution, see the EVM users guide.  
11.2 Layout Example  
space  
space  
space  
VOUT  
L1  
VIN  
C1  
C2 C3  
GND  
GND  
R2  
R1  
Cff  
49. TPS6282x Board Layout  
版权 © 2017–2018, Texas Instruments Incorporated  
21  
TPS62821, TPS62822, TPS62823  
ZHCSHQ2B NOVEMBER 2017REVISED MAY 2018  
www.ti.com.cn  
12 器件和文档支持  
12.1 器件支持  
12.1.1 第三方产品免责声明  
TI 发布的与第三方产品或服务有关的信息,不能构成与此类产品或服务或保修的适用性有关的认可,不能构成此类  
产品或服务单独或与任何 TI 产品或服务一起的表示或认可。  
12.2 相关链接  
下表列出了快速访问链接。类别包括技术文档、支持和社区资源、工具和软件,以及立即订购快速访问。  
6. 相关链接  
器件  
产品文件夹  
请单击此处  
请单击此处  
请单击此处  
立即订购  
请单击此处  
请单击此处  
请单击此处  
技术文档  
请单击此处  
请单击此处  
请单击此处  
工具与软件  
请单击此处  
请单击此处  
请单击此处  
支持和社区  
请单击此处  
请单击此处  
请单击此处  
TPS62821  
TPS62822  
TPS62823  
12.3 接收文档更新通知  
要接收文档更新通知,请导航至 TI.com.cn 上的器件产品文件夹。单击右上角的通知我 进行注册,即可每周接收产  
品信息更改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。  
12.4 社区资源  
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商按照原样提供。这些内容并不构成 TI 技术规范,  
并且不一定反映 TI 的观点;请参阅 TI 《使用条款》。  
TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在  
e2e.ti.com 中,您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。  
设计支持  
TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。  
12.5 商标  
DCS-Control, E2E are trademarks of Texas Instruments.  
All other trademarks are the property of their respective owners.  
12.6 静电放电警告  
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可  
能会损坏集成电路。  
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可  
能会导致器件与其发布的规格不相符。  
12.7 术语表  
SLYZ022 TI 术语表。  
这份术语表列出并解释术语、缩写和定义。  
13 机械、封装和可订购信息  
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更,恕不另行通知,且  
不会对此文档进行修订。如需获取此数据表的浏览器版本,请查阅左侧的导航栏。  
22  
版权 © 2017–2018, Texas Instruments Incorporated  
PACKAGE OPTION ADDENDUM  
www.ti.com  
14-Jul-2023  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
TPS62821DLCR  
TPS62821DLCT  
TPS62822DLCR  
TPS62822DLCT  
TPS62823DLCR  
TPS62823DLCT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
VSON-HR  
VSON-HR  
VSON-HR  
VSON-HR  
VSON-HR  
VSON-HR  
DLC  
DLC  
DLC  
DLC  
DLC  
DLC  
8
8
8
8
8
8
3000 RoHS & Green  
250 RoHS & Green  
3000 RoHS & Green  
250 RoHS & Green  
3000 RoHS & Green  
250 RoHS & Green  
Call TI | NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
A1  
A1  
A2  
A2  
A3  
A3  
Samples  
Samples  
Samples  
Samples  
Samples  
Samples  
Call TI | NIPDAU  
Call TI  
Call TI  
Call TI  
Call TI  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
14-Jul-2023  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
5-Jul-2023  
TAPE AND REEL INFORMATION  
REEL DIMENSIONS  
TAPE DIMENSIONS  
K0  
P1  
W
B0  
Reel  
Diameter  
Cavity  
A0  
A0 Dimension designed to accommodate the component width  
B0 Dimension designed to accommodate the component length  
K0 Dimension designed to accommodate the component thickness  
Overall width of the carrier tape  
W
P1 Pitch between successive cavity centers  
Reel Width (W1)  
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE  
Sprocket Holes  
Q1 Q2  
Q3 Q4  
Q1 Q2  
Q3 Q4  
User Direction of Feed  
Pocket Quadrants  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
TPS62821DLCR  
TPS62821DLCT  
TPS62823DLCR  
TPS62823DLCT  
VSON-  
HR  
DLC  
DLC  
DLC  
DLC  
8
8
8
8
3000  
250  
180.0  
180.0  
180.0  
180.0  
8.4  
8.4  
8.4  
8.4  
1.8  
1.8  
1.8  
1.8  
2.25  
2.25  
2.25  
2.25  
1.15  
1.15  
1.15  
1.15  
4.0  
4.0  
4.0  
4.0  
8.0  
8.0  
8.0  
8.0  
Q1  
Q1  
Q1  
Q1  
VSON-  
HR  
VSON-  
HR  
3000  
250  
VSON-  
HR  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
5-Jul-2023  
TAPE AND REEL BOX DIMENSIONS  
Width (mm)  
H
W
L
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
TPS62821DLCR  
TPS62821DLCT  
TPS62823DLCR  
TPS62823DLCT  
VSON-HR  
VSON-HR  
VSON-HR  
VSON-HR  
DLC  
DLC  
DLC  
DLC  
8
8
8
8
3000  
250  
182.0  
182.0  
182.0  
182.0  
182.0  
182.0  
182.0  
182.0  
20.0  
20.0  
20.0  
20.0  
3000  
250  
Pack Materials-Page 2  
GENERIC PACKAGE VIEW  
DLC 8  
2.0 x 1.5 mm, 0.5 mm pitch  
VSON-HR - 1 mm max height  
PLASTIC SMALL OUTLINE - NO LEAD  
Images above are just a representation of the package family, actual package may vary.  
Refer to the product data sheet for package details.  
4224379/A  
PACKAGE OUTLINE  
VSON-HR - 1 mm max height  
PLASTIC SMALL OUTLINE- NO LEAD  
DLC0008A  
1.6  
1.4  
A
B
2.1  
1.9  
PIN 1 INDEX AREA  
1 MAX  
C
SEATING PLANE  
0.08 C  
0.05  
0.00  
(0.1) TYP  
SYMM  
6X 0.5  
4
5
SYMM  
2X  
1.5  
8
1
0.3  
0.2  
8X  
0.1  
0.05  
C A B  
C
0.4  
0.3  
8X  
4223754/A 06/2017  
NOTES:  
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing  
per ASME Y14.5M.  
2. This drawing is subject to change without notice.  
www.ti.com  
EXAMPLE BOARD LAYOUT  
VSON-HR - 1 mm max height  
PLASTIC SMALL OUTLINE- NO LEAD  
DLC0008A  
8X (0.55)  
8X (0.25)  
SYMM  
1
8
6X (0.5)  
SYMM  
5
4
(R0.05) TYP  
(1.35)  
LAND PATTERN EXAMPLE  
EXPOSED METAL SHOWN  
SCALE: 30X  
SOLDER MASK  
OPENING  
0.05 MAX  
ALL AROUND  
0.05 MIN  
ALL AROUND  
METAL  
METAL UNDER  
SOLDER MASK  
SOLDER MASK  
OPENING  
EXPOSED METAL  
EXPOSED METAL  
NON- SOLDER MASK  
DEFINED  
SOLDER MASK  
DEFINED  
SOLDER MASK DETAILS  
4223754/A 06/2017  
NOTES: (continued)  
3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).  
www.ti.com  
EXAMPLE STENCIL DESIGN  
VSON-HR - 1 mm max height  
PLASTIC SMALL OUTLINE- NO LEAD  
DLC0008A  
8X (0.55)  
8X (0.25)  
SYMM  
1
8
6X (0.5)  
SYMM  
5
4
(R0.05) TYP  
(1.35)  
SOLDER PASTE EXAMPLE  
BASED ON 0.1 mm THICK STENCIL  
SCALE: 30X  
4223754/A 06/2017  
NOTES: (continued)  
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate  
design recommendations.  
www.ti.com  
重要声明和免责声明  
TI“按原样提供技术和可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资源,  
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保。  
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任:(1) 针对您的应用选择合适的 TI 产品,(2) 设计、验  
证并测试您的应用,(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。  
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您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成  
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TI 提供的产品受 TI 的销售条款ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改  
TI 针对 TI 产品发布的适用的担保或担保免责声明。  
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邮寄地址:Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2023,德州仪器 (TI) 公司  

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