TPS62A01-Q1 [TI]
采用 SOT563 封装的汽车类、2.5V 至 5.5V 输入、1A 输出降压转换器;
| 型号： | TPS62A01-Q1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 采用 SOT563 封装的汽车类、2.5V 至 5.5V 输入、1A 输出降压转换器 转换器 |
| 文件： | 总13页 (文件大小：1219K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS62A01-Q1
ZHCSRN9 – FEBRUARY 2023
TPS62A01-Q1、TPS62A01A-Q1 采用 SOT563 封装的 2.5V 至 5.5V、1A 汽车类降压
转换器
1 特性
3 说明
•
•
输入电压范围为 2.5V 至 5.5V
TPS62A01-Q1 系列器件是同步降压直流/直流转换
器，经过优化可实现高效率和紧凑型解决方案尺寸。这
些器件集成了可提供高达 1 A 输出电流的开关。在中
等负载至重负载情况下，这些器件将以 2.4MHz 开关频
率在脉宽调制 (PWM) 模式下运行。在轻载情况下，这
些器件自动进入节能模式 (PSM)，从而在整个负载电
流范围内保持高效率。关断时，电流消耗量也最低。该
器件系列的 TPS62A01A-Q1 型号在整个负载电流范围
内以强制 PWM 模式运行。
符合面向汽车应用的 AEC-Q100 标准
– 器件温度等级 1：–40°C 至 +125°C TA
可调输出电压范围：0.6V 至 VIN
100mΩ 和 67mΩ 低 RDSON 开关
小于 25µA 的静态电流
•
•
•
•
•
•
•
•
•
•
•
•
•
1.5% 反馈精度（-40°C 至 150°C）
100% 模式运行
2.4MHz 开关频率
支持节电模式或 PWM 选项
电源正常状态输出引脚
TPS62A01-Q1 器件通过一个外部电阻分压器提供可调
节输出电压。内部软启动电路可限制启动期间的浪涌电
流。内置的其他特性包括过流保护、热关断保护和电源
正常指示。这些器件采用 SOT-563 封装。
短路保护 (HICCUP)
内部软启动
有源输出放电
封装信息
热关断保护
器件型号
封装(1)
封装尺寸（标称值）
采用 1.60mm × 1.60mm SOT563 封装
TPS62A01-Q1
TPS62A01A-Q1
DRL（SOT-563，
6）
2 应用
1.60mm × 1.60mm
•
•
•
前置摄像头
(1) 要了解所有可用封装，请见数据表末尾的可订购产品附录。
环视系统 ECU
汽车仪表组显示器
VIN
2.5V t 5.5V
TPS62A01
100
95
90
85
80
75
70
65
60
55
L1
1µH
VOUT
1.8V / 1A
VIN
SW
FB
R1
C3*
200kQ
GND
EN
VIN
R4
499kQ
R2
100kQ
PG
VPG
典型应用
50
VIN = 5V
VIN = 3.3V
45
40
100µ
1m
10m
Load (A)
100m
1
D005
D033
效率与输出电流间的关系曲线（电压为 1.8VOUT 时）
本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLUSF67
TPS62A01-Q1
ZHCSRN9 – FEBRUARY 2023
www.ti.com.cn
4 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,
generate code, and develop solutions are listed below.
4.1 Device Support
4.1.1 第三方产品免责声明
TI 发布的与第三方产品或服务有关的信息，不能构成与此类产品或服务或保修的适用性有关的认可，不能构成此
类产品或服务单独或与任何 TI 产品或服务一起的表示或认可。
4.2 Documentation Support
4.2.1 Related Documentation
Texas Instruments, Semiconductor and IC Package Thermal Metrics Application Report
4.3 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
4.4 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅 TI
的《使用条款》。
4.5 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
4.6 静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理
和安装程序，可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参
数更改都可能会导致器件与其发布的规格不相符。
4.7 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
5 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2023 Texas Instruments Incorporated
2
Submit Document Feedback
Product Folder Links: TPS62A01-Q1
TPS62A01-Q1
ZHCSRN9 – FEBRUARY 2023
www.ti.com.cn
5.1 Tape and Reel Information
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
Reel
Diameter
(mm)
Reel
Width W1
(mm)
Package
Type
Package
Drawing
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
Device
Pins
SPQ
TPS62A01QDRLRQ1
SOT-5X3
DRL
DRL
6
6
4000
4000
180.0
180.0
8.4
8.4
2.0
2.0
1.8
1.8
0.75
0.75
4.0
4.0
8.0
80
Q3
Q3
TPS62A01AQDRLRQ1 SOT-5X3
Copyright © 2023 Texas Instruments Incorporated
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Product Folder Links: TPS62A01-Q1
TPS62A01-Q1
ZHCSRN9 – FEBRUARY 2023
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TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
Device
Package Type
SOT-5X3
Package Drawing Pins
SPQ
Length (mm) Width (mm)
Height (mm)
TPS62A01QDRLRQ1
TPS62A01AQDRLRQ1
DRL
DRL
6
6
4000
210.0
210.0
185.0
185.0
35.0
SOT-5X3
4000
35.0
Copyright © 2023 Texas Instruments Incorporated
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Product Folder Links: TPS62A01-Q1
TPS62A01-Q1
ZHCSRN9 – FEBRUARY 2023
www.ti.com.cn
PACKAGE OUTLINE
DRL0006A
SOT - 0.6 mm max height
S
C
A
L
E
8
.
0
0
0
PLASTIC SMALL OUTLINE
1.7
1.5
PIN 1
ID AREA
A
1
6
4X 0.5
1.7
1.5
2X
1
NOTE 3
4
3
1.3
1.1
0.3
6X
0.05
TYP
0.00
B
0.1
0.6 MAX
0.18
C
SEATING PLANE
0.05 C
6X
0.08
SYMM
SYMM
0.27
0.15
6X
0.1
0.05
C A B
0.4
0.2
6X
4223266/C 12/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MO-293 Variation UAAD
www.ti.com
Copyright © 2023 Texas Instruments Incorporated
Submit Document Feedback
5
Product Folder Links: TPS62A01-Q1
TPS62A01-Q1
ZHCSRN9 – FEBRUARY 2023
www.ti.com.cn
EXAMPLE BOARD LAYOUT
DRL0006A
SOT - 0.6 mm max height
PLASTIC SMALL OUTLINE
6X (0.67)
SYMM
1
6
6X (0.3)
SYMM
4X (0.5)
4
3
(R0.05) TYP
(1.48)
LAND PATTERN EXAMPLE
SCALE:30X
0.05 MIN
AROUND
0.05 MAX
AROUND
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDERMASK DETAILS
4223266/A 09/2016
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
Copyright © 2023 Texas Instruments Incorporated
6
Submit Document Feedback
Product Folder Links: TPS62A01-Q1
TPS62A01-Q1
ZHCSRN9 – FEBRUARY 2023
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EXAMPLE STENCIL DESIGN
DRL0006A
SOT - 0.6 mm max height
PLASTIC SMALL OUTLINE
6X (0.67)
SYMM
1
6
6X (0.3)
SYMM
4X (0.5)
4
3
(R0.05) TYP
(1.48)
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:30X
4223266/A 09/2016
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
www.ti.com
Copyright © 2023 Texas Instruments Incorporated
Submit Document Feedback
7
Product Folder Links: TPS62A01-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
14-May-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
XPS62A01AQDRLRQ1
XPS62A01QDRLRQ1
ACTIVE
ACTIVE
SOT-5X3
SOT-5X3
DRL
DRL
6
6
4000
4000
TBD
TBD
Call TI
Call TI
Call TI
-40 to 125
-40 to 125
Samples
Samples
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
14-May-2023
OTHER QUALIFIED VERSIONS OF TPS62A01-Q1, TPS62A01A-Q1 :
Catalog : TPS62A01, TPS62A01A
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Addendum-Page 2
PACKAGE OUTLINE
DRL0006A
SOT - 0.6 mm max height
S
C
A
L
E
8
.
0
0
0
PLASTIC SMALL OUTLINE
1.7
1.5
PIN 1
ID AREA
A
1
6
4X 0.5
1.7
1.5
2X 1
NOTE 3
4
3
1.3
1.1
0.3
6X
0.05
TYP
0.00
B
0.1
0.6 MAX
C
SEATING PLANE
0.05 C
0.18
0.08
6X
SYMM
SYMM
0.27
0.15
6X
0.1
0.05
C A B
0.4
0.2
6X
4223266/C 12/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MO-293 Variation UAAD
www.ti.com
EXAMPLE BOARD LAYOUT
DRL0006A
SOT - 0.6 mm max height
PLASTIC SMALL OUTLINE
6X (0.67)
SYMM
1
6
6X (0.3)
SYMM
4X (0.5)
4
3
(R0.05) TYP
(1.48)
LAND PATTERN EXAMPLE
SCALE:30X
0.05 MIN
AROUND
0.05 MAX
AROUND
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDERMASK DETAILS
4223266/C 12/2021
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
7. Land pattern design aligns to IPC-610, Bottom Termination Component (BTC) solder joint inspection criteria.
www.ti.com
EXAMPLE STENCIL DESIGN
DRL0006A
SOT - 0.6 mm max height
PLASTIC SMALL OUTLINE
6X (0.67)
SYMM
1
6
6X (0.3)
SYMM
4X (0.5)
4
3
(R0.05) TYP
(1.48)
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:30X
4223266/C 12/2021
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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Copyright © 2023，德州仪器 (TI) 公司
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TPS63000DRC
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