TPS650231RSBR [TI]

POWER MANAGEMENT IC FOR LI-ION POWERED SYSTEMS; 电源管理IC,适用于锂离子电池供电系统
TPS650231RSBR
型号: TPS650231RSBR
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

POWER MANAGEMENT IC FOR LI-ION POWERED SYSTEMS
电源管理IC,适用于锂离子电池供电系统

电池
文件: 总55页 (文件大小:1306K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TPS650231  
www.ti.com  
SLVSAE3 AUGUST 2010  
POWER MANAGEMENT IC FOR LI-ION POWERED SYSTEMS  
Check for Samples: TPS650231  
1
FEATURES  
DESCRIPTION  
23  
1.7 A, 90% Efficient Step-Down Converter for  
Processor Core (VDCDC1)  
The TPS650231 is an integrated Power Management  
IC for applications powered by one Li-Ion or  
Li-Polymer cell, and which require multiple power  
rails. The TPS650231 provides three highly efficient,  
step-down converters targeted at providing the core  
voltage, peripheral, I/O and memory rails in a  
processor based system. The core converter allows  
for on-the-fly voltage changes via serial interface,  
allowing the system to implement dynamic power  
savings. All three step-down converters enter a  
low-power mode at light load for maximum efficiency  
across the widest possible range of load currents.  
The TPS650231 also integrates two general-purpose  
200 mA LDO voltage regulators, which are enabled  
with an external input pin. Each LDO operates with  
an input voltage range between 1.5 V and 6.5 V,  
allowing them to be supplied from one of the  
step-down converters or directly from the battery. The  
default output voltage of the LDOs can be digitally set  
1.2 A, Up to 95% Efficient Step-Down  
Converter for System Voltage (VDCDC2)  
0.8 A, 92% Efficient Step-Down Converter for  
Memory Voltage (VDCDC3)  
30 mA LDO/Switch for Real Time Clock (VRTC)  
2 × 200 mA General-Purpose LDO  
Dynamic Voltage Management for Processor  
Core  
Preselectable LDO Voltage Using Two Digital  
Input Pins  
Externally Adjustable Reset Delay Time  
Battery Backup Functionality  
Separate Enable Pins for Inductive Converters  
I2C™ Compatible Serial Interface  
85-mA Quiescent Current  
to  
4
different voltage combinations using the  
Low Ripple PFM Mode  
DEFLDO1 and DEFLDO2 pins. The serial interface  
can be used for dynamic voltage scaling, masking  
interrupts, or for dis/enabling and setting the LDO  
output voltages. The interface is compatible with the  
Fast/Standard mode I2C specification, allowing  
transfers at up to 400 kHz. The TPS650231 is  
available in a 40-pin (RSB) QFN package or in a 49  
Thermal Shutdown Protection  
40 Pin, 5 mm × 5 mm QFN /RSB) Package or  
49 Ball 3 mm x 3 mm WCSP (YFF) package  
APPLICATIONS  
ball 3mm  
x 3mm WCSP (YFF) package, and  
Smart phones  
Netbooks / MIDs  
Portable Media Players  
operates over a free-air temperature of –40°C to  
85°C.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
3
PowerPAD is a trademark of Texas Instruments.  
I2C is a trademark of NXP Semiconductors.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2010, Texas Instruments Incorporated  
TPS650231  
SLVSAE3 AUGUST 2010  
www.ti.com  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
ORDERING INFORMATION(1)  
TA  
PACKAGE  
PACKAGE SIZE  
PART NUMBER(2)  
TPS650231RSB  
TPS650231YFF  
–40°C to 85°C  
–40°C to 85°C  
40 pin QFN (RSB)  
49 ball WCSP (YFF)  
see package drawings  
see package drawings  
E = 3.082mm ± 30µm  
D = 3.066mm ± 30µm  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
Web site at www.ti.com.  
(2) The RSB and YFF packages are available in tape and reel. Add the R suffix (TPS650231RSBR, TPS650231YFFR) to order quantities of  
3000 parts per reel. Add the T suffix (TPS650231RSBT, TPS650231YFFT) to order quantities of 250 parts per reel.  
ABSOLUTE MAXIMUM RATINGS(1)  
over operating free-air temperature range (unless otherwise noted)  
VALUE  
UNIT  
MIN  
MAX  
7
VI  
Input voltage range on all pins except AGND and PGND pins with respect to AGND  
–0.3  
V
Current at VINDCDC1, L1, PGND1, VINDCDC2, L2, PGND2, VINDCDC3, L3,  
PGND3  
2500  
mA  
Peak current at all other pins  
Operating free-air temperature  
Junction temperature  
1000  
85  
mA  
°C  
°C  
°C  
TA  
–40  
–65  
TJ  
125  
150  
Tstg  
Storage temperature  
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings  
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating  
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability  
THERMAL INFORMATION  
TPS650231  
THERMAL METRIC(1)  
RSB  
40 PINS  
32.7  
15.3  
13.6  
0.1  
YFF  
UNITS  
49 BALLS  
qJA  
Junction-to-ambient thermal resistance  
Junction-to-case (top) thermal resistance  
Junction-to-board thermal resistance  
40  
10  
qJCtop  
qJB  
15  
°C/W  
yJT  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
Junction-to-case (bottom) thermal resistance  
0.1  
14  
yJB  
5.4  
qJCbot  
1.1  
n/a  
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.  
2
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Copyright © 2010, Texas Instruments Incorporated  
Product Folder Link(s) : TPS650231  
TPS650231  
www.ti.com  
SLVSAE3 AUGUST 2010  
RECOMMENDED OPERATING CONDITIONS  
over operating free-air temperature range (unless otherwise noted)  
MIN  
NOM  
MAX UNIT  
Input voltage range step-down converters  
(VINDCDC1, VINDCDC2, VINDCDC3)  
VCC  
2.5  
6
V
Output voltage range for VDCDC1 step-down converter(1)  
0.6  
0.6  
0.6  
1.5  
1
VINDCDC1  
VINDCDC2  
VINDCDC3  
6.5  
VO  
Output voltage range for VDCDC2 step-down converter(1)  
Output voltage range for VDCDC3 step-down converter(1)  
Input voltage range for LDOs (VINLDO)  
Output voltage range for LDOs (VLDO1, VLDO2)  
Output current at L1  
V
VI  
V
VO  
VINLDO1-2  
1700  
V
IO(DCDC1)  
mA  
mH  
mF  
mF  
mA  
mH  
mF  
mF  
mA  
mH  
mF  
mF  
mF  
mF  
mF  
mA  
mF  
°C  
°C  
Inductor at L1(2)  
1.5  
10  
10  
2.2  
22  
(2)  
CI(DCDC1)  
CO(DCDC1)  
IO(DCDC2)  
Input capacitor at VINDCDC1  
(2)  
Output capacitor at VDCDC1  
Output current at L2  
1200  
800  
(2)  
Inductor at L2  
1.5  
10  
10  
2.2  
22  
(2)  
CI(DCDC2)  
CO(DCDC2)  
IO(DCDC3)  
Input capacitor at VINDCDC2  
(2)  
Output capacitor at VDCDC2  
Output current at L3  
(2)  
Inductor at L3  
1.5  
10  
10  
1
2.2  
22  
CI(DCDC3)  
CO(DCDC3)  
CI(VCC)  
Input capacitor at VINDCDC3(2)  
(2)  
Output capacitor at VDCDC3  
(2)  
Input capacitor at VCC  
(2)  
CI(VINLDO)  
CO(VLDO1-2)  
IO(VLDO1-2)  
CO(VRTC)  
TA  
Input capacitor at VINLDO  
1
(2)  
Output capacitor at VLDO1, VLDO2  
2.2  
Output current at VLDO1, VLDO2  
200  
(2)  
Output capacitor at VRTC  
4.7  
–40  
–40  
Operating ambient temperature  
85  
125  
10  
TJ  
Operating junction temperature  
Resistor from VINDCDC3, VINDCDC2, VINDCDC1 to VCC used for filtering(3)  
1
(1) When using an external resistor divider at DEFDCDC3, DEFDCDC2, DEFDCDC1  
(2) See Applications Information section for more information.  
(3) Up to 3 mA can flow into VCC when all 3 converters are running in PWM. This resistor causes the UVLO threshold to be shifted  
accordingly.  
Copyright © 2010, Texas Instruments Incorporated  
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3
Product Folder Link(s) : TPS650231  
TPS650231  
SLVSAE3 AUGUST 2010  
www.ti.com  
ELECTRICAL CHARACTERISTICS  
VINDCDC1 = VINDCDC2 = VINDCDC3 = VCC = VINLDO = 3.6 V, VBACKUP = 3 V, TA = –40°C to 85°C, typical values are  
at TA = 25°C (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
CONTROL SIGNALS : SCLK, SDAT (input)  
Rpullup at SCLK = 4.7 k, pulled to VRTC;  
For VCC = 2.5V to 5.25V  
VIH  
VIH  
VIH  
High level input voltage for the SCLK pin  
High level input voltage for the SDAT pin  
High level input voltage for the SDAT pin  
1.4  
1.69  
1.55  
0
VCC  
VCC  
VCC  
V
V
V
Rpullup at SDAT = 4.7 k, pulled to VRTC;  
For VCC = 2.5V to 5.25V  
Rpullup at SDAT = 4.7 k, pulled to VRTC;  
For VCC = 2.5V to 4.5V  
Rpullup at SCLK and SDAT = 4.7 k, pulled  
to VRTC  
VIL  
IH  
Low level input voltage  
Input bias current  
0.35  
0.1  
V
0.01  
mA  
CONTROL SIGNALS : HOT_RESET , DCDC1_EN, DCDC2_EN, DCDC3_EN, LDO_EN, DEFLDO1, DEFLDO2  
VIH  
VIL  
IIB  
High-level input voltage  
Low-level input voltage  
Input bias current  
1.3  
0
VCC  
0.4  
0.1  
35  
V
V
0.01  
30  
mA  
ms  
tglitch Deglitch time at HOT_RESET  
25  
0
CONTROL SIGNALS : LOWBAT, PWRFAIL, RESPWRON, INT, SDAT (output)  
VOH High-level output voltage  
6
V
V
VOL  
Low-level output voltage  
Duration of low pulse at RESPWRON  
Resetpwron threshold  
IIL = 5 mA  
0.3  
External capacitor 1 nF  
VRTC falling  
100  
2.4  
ms  
V
–3%  
–3%  
3%  
3%  
0.1  
Resetpwron threshold  
VRTC rising  
2.52  
0.001  
V
ILK  
leakage current  
output inactive high  
mA  
4
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Copyright © 2010, Texas Instruments Incorporated  
Product Folder Link(s) : TPS650231  
TPS650231  
www.ti.com  
SLVSAE3 AUGUST 2010  
ELECTRICAL CHARACTERISTICS  
VINDCDC1 = VINDCDC2 = VINDCDC3 = VCC = VINLDO = 3.6 V, VBACKUP = 3 V, TA = –40°C to 85°C, typical values are  
at TA = 25°C (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN TYP MAX UNIT  
SUPPLY PINS: VCC, VINDCDC1, VINDCDC2, VINDCDC3,  
VINDCDC13 (for TPS650231YFF)  
All 3 DCDC converters enabled,  
zero load, and no switching, LDOs  
enabled  
VCC = 3.6 V, VBACKUP = 3 V;  
V(VSYSIN) = 0 V  
85 100  
All 3 DCDC converters enabled,  
zero load, and no switching, LDOs  
off  
VCC = 3.6 V, VBACKUP = 3 V;  
V(VSYSIN) = 0 V  
78  
57  
90  
70  
Operating quiescent  
current, PFM  
I(q)  
mA  
DCDC1 and DCDC2 converters  
enabled, zero load, and no  
switching, LDOs off  
VCC = 3.6 V, VBACKUP = 3 V;  
V(VSYSIN) = 0 V  
DCDC1 converter enabled, zero  
load, and no switching, LDOs off  
VCC = 3.6 V, VBACKUP = 3 V;  
V(VSYSIN) = 0 V  
43  
2
55  
3
All 3 DCDC converters enabled  
and running in PWM, LDOs off  
VCC = 3.6 V, VBACKUP = 3 V;  
V(VSYSIN) = 0 V  
DCDC1 and DCDC2 converters  
enabled and running in PWM,  
LDOs off  
VCC = 3.6 V, VBACKUP = 3 V;  
V(VSYSIN) = 0 V  
II  
Current into VCC; PWM  
1.5  
2.5  
mA  
DCDC1 converter enabled and  
running in PWM, LDOs off  
VCC = 3.6 V, VBACKUP = 3 V;  
V(VSYSIN) = 0 V  
0.85  
23  
2
33  
5
VCC = 3.6 V, VBACKUP = 3 V;  
V(VSYSIN) = 0 V  
mA  
mA  
mA  
VCC = 2.6 V, VBACKUP = 3 V;  
V(VSYSIN) = 0 V  
I(q)  
Quiescent current  
All converters disabled, LDOs off  
3.5  
VCC = 3.6 V, VBACKUP = 0 V;  
V(VSYSIN) = 0 V  
43  
Shutdown supply current  
into VINDCDC1; for  
TPS650231RSB  
I(SD)  
DCDC1_EN = GND  
DCDC2_EN = GND  
DCDC3_EN = GND  
0.1  
0.1  
0.1  
0.2  
1
1
1
2
mA  
mA  
mA  
mA  
Shutdown supply current  
into VINDCDC2; for  
TPS650231RSB  
Shutdown supply current  
into VINDCDC3; for  
TPS650231RSB  
Shutdown supply current  
into VINDCDC13; for  
TPS650231YFF  
DCDC1_EN = DCDC3_EN =  
GND  
Copyright © 2010, Texas Instruments Incorporated  
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TPS650231  
SLVSAE3 AUGUST 2010  
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ELECTRICAL CHARACTERISTICS  
VINDCDC1 = VINDCDC2 = VINDCDC3 (VINDCDC13) = VCC = VINLDO = 3.6 V, VBACKUP = 3 V, TA = –40°C to 85°C,  
typical values are at TA = 25°C (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
SUPPLY PINS: VBACKUP, VSYSIN, VRTC  
VBACKUP = 3 V, VSYSIN = 0 V;  
VCC = 2.6 V, current into VBACKUP  
I(q)  
Operating quiescent current  
Operating quiescent current  
20  
33  
3
mA  
mA  
VBACKUP < V_VBACKUP, current into  
VBACKUP  
I(SD)  
2
3
VRTC LDO output voltage  
Output current for VRTC  
VSYSIN = VBACKUP = 0 V, IO = 0 mA  
VSYSIN < 2.57 V and VBACKUP < 2.57 V  
VRTC = GND; VSYSIN = VBACKUP = 0 V  
V
IO  
30  
mA  
mA  
VRTC short-circuit current limit  
100  
Maximum output current at VRTC for  
RESPWRON = 1  
VRTC > 2.6 V, VCC = 3 V;  
VSYSIN = VBACKUP = 0 V  
30  
mA  
VO  
Output voltage accuracy for VRTC  
Line regulation for VRTC  
VSYSIN = VBACKUP = 0 V; IO = 0 mA  
VCC = VRTC + 0.5 V to 6.5 V, IO = 5 mA  
–1%  
–1%  
1%  
1%  
IO = 1 mA to 30 mA;  
VSYSIN = VBACKUP = 0 V  
Load regulation VRTC  
–3%  
1%  
Regulation time for VRTC  
Input leakage current at VSYSIN  
rDS(on) of VSYSIN switch  
rDS(on) of VBACKUP switch  
Input voltage range at VBACKUP  
Input voltage range at VSYSIN  
VSYSIN threshold  
Load change from 10% to 90%  
VSYSIN < V_VSYSIN  
10  
ms  
mA  
V
Ilkg  
2
12.5  
12.5  
3.75  
3.75  
3%  
2.73  
2.73  
–3%  
–3%  
–3%  
–3%  
V
VSYSIN falling  
VSYSIN rising  
2.55  
2.65  
2.55  
2.65  
V
VSYSIN threshold  
3%  
V
VBACKUP threshold  
VBACKUP falling  
VBACKUP falling  
3%  
V
VBACKUP threshold  
3%  
V
SUPPLY PIN: VINLDO  
I(q)  
Operating quiescent current  
Current per LDO into VINLDO  
20  
33  
1
mA  
mA  
Total current for both LDOs into VINLDO,  
VLDO = 0 V  
I(SD)  
Shutdown current  
0.1  
6
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Copyright © 2010, Texas Instruments Incorporated  
Product Folder Link(s) : TPS650231  
TPS650231  
www.ti.com  
SLVSAE3 AUGUST 2010  
ELECTRICAL CHARACTERISTICS  
VINDCDC1 = VINDCDC2 = VINDCDC3 = VCC = VINLDO = 3.6 V, VBACKUP = 3 V, TA = –40°C to 85°C, typical values are  
at TA = 25°C (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX UNIT  
VDCDC1 STEP-DOWN CONVERTER  
VI  
IO  
Input voltage range, VINDCDC1  
Maximum output current  
2.5  
6
V
1700  
mA  
mΩ  
mA  
rDS(on) P-channel MOSFET on-resistance  
Ilkg P-channel leakage current  
rDS(on) N-channel MOSFET on-resistance  
VINDCDC1 (VINDCDC13) = V(GS) = 3.6 V  
VINDCDC1 (VINDCDC13) = 6 V  
VINDCDC1 (VINDCDC13) = V(GS) = 3.6 V  
V(DS) = 6 V  
125  
261  
2
130  
7
260  
10  
mΩ  
mA  
Ilkg  
N-channel leakage current  
Forward current limit (P-channel and  
N-channel)  
2.5 V < V(VINDCDC1) < 6 V  
1.94  
1.95  
–2%  
2.19  
2.25  
2.44  
2.55  
2%  
A
fS  
Oscillator frequency  
MHz  
Fixed output voltage  
FPWMDCDC1=0  
VINDCDC1 (VINDCDC13) = 2.5 V to 6 V;  
0 mA IO 1.7 A  
All VDCDC1  
Fixed output voltage  
FPWMDCDC1=1  
VINDCDC1 (VINDCDC13) = 2.5 V to 6 V;  
0 mA IO 1.7 A  
–1%  
–2%  
–1%  
1%  
2%  
1%  
Adjustable output voltage with resistor  
divider at DEFDCDC1; FPWMDCDC1=0  
VINDCDC1 (VINDCDC13) = VDCDC1 + 0.5 V  
(min 2.5 V) to 6 V; 0 mA IO 1.7 A  
Adjustable output voltage with resistor  
divider at DEFDCDC1; FPWMDCDC1=1  
VINDCDC1 (VINDCDC13) = VDCDC1 + 0.5 V  
(min 2.5 V) to 6 V; 0 mA IO 1.7 A  
VINDCDC1 (VINDCDC13) = VDCDC1 + 0.3 V  
(min. 2.5 V) to 6 V; IO = 10 mA  
Line Regulation  
0
%/V  
Load Regulation  
Start-up time  
IO = 10 mA to 1700 mA  
0.25  
175  
750  
1
%/A  
ms  
tStart  
Time from active EN to start switching  
Time to ramp from 5% to 95% of VOUT  
145  
400  
200  
tRamp VOUT ramp-up time  
Internal resistance from L1 to GND  
1000  
ms  
MΩ  
VDCDC1 discharge resistance  
DCDC1 discharge = 1  
300  
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7
Product Folder Link(s) : TPS650231  
TPS650231  
SLVSAE3 AUGUST 2010  
www.ti.com  
ELECTRICAL CHARACTERISTICS  
VINDCDC1 = VINDCDC2 = VINDCDC3 (VINDCDC13) = VCC = VINLDO = 3.6 V, VBACKUP = 3 V, TA = –40°C to 85°C,  
typical values are at TA = 25°C (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX UNIT  
VDCDC2 STEP-DOWN CONVERTER  
VI  
Input voltage range, VINDCDC2  
2.5  
6
V
VDCDC2 = 1.2V  
1200  
IO  
Maximum output current  
mA  
VINDCDC2 = 3.7 V;  
3.3 V - 1% VDCDC2 3.3V + 1%  
1000  
rDS(on)  
Ilkg  
rDS(on)  
Ilkg  
P-channel MOSFET on-resistance  
P-channel leakage current  
VINDCDC2 = V(GS) = 3.6 V  
VINDCDC2 = 6 V  
140  
300  
2
mΩ  
mA  
N-channel MOSFET on-resistance  
N-channel leakage current  
VINDCDC2 = V(GS) = 3.6 V  
V(DS) = 6 V  
150  
7
297  
10  
mΩ  
mA  
Forward current limit (P-channel and  
N-channel)  
ILIMF  
2.5 V < VINDCDC2 < 6 V  
1.74  
1.95  
–2%  
1.94  
2.25  
2.12  
2.55  
2%  
A
fS  
Oscillator frequency  
MHz  
Adjustable output voltage with resistor  
divider at DEFDCDC2; FPWMDCDC2=0  
VINDCDC2 = VDCDC2 + 0.4 V (min 2.5 V)  
to 6 V; 0 mA IO 1.2 A  
VDCDC2  
Adjustable output voltage with resistor  
divider at DEFDCDC2; FPWMDCDC2=1  
VINDCDC2 = VDCDC2 + 0.4 V (min 2.5 V)  
to 6 V; 0 mA IO 1.2 A  
VDCDC2  
–1%  
1%  
VINDCDC2 = VDCDC2 + 0.3 V (min. 2.5 V)  
to 6 V; IO = 10 mA  
Line Regulation  
0
%/V  
Load Regulation  
IO = 10 mA to 1.2 A  
0.25  
175  
750  
1
%/A  
µs  
tStart  
Start-up time  
Time from active EN to start switching  
Time to ramp from 5% to 95% of VOUT  
145  
400  
200  
tRamp  
VOUT ramp-up time  
1000  
ms  
Internal resistance from L2 to GND  
VDCDC2 discharge resistance  
MΩ  
DCDC2 discharge =1  
300  
8
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Copyright © 2010, Texas Instruments Incorporated  
Product Folder Link(s) : TPS650231  
TPS650231  
www.ti.com  
SLVSAE3 AUGUST 2010  
ELECTRICAL CHARACTERISTICS  
VINDCDC1 = VINDCDC2 = VINDCDC3 (VINDCDC13) = VCC = VINLDO = 3.6 V, VBACKUP = 3 V, TA = –40°C to 85°C,  
typical values are at TA = 25°C (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX UNIT  
VDCDC3 STEP-DOWN CONVERTER  
VI  
Input voltage range, VINDCDC3  
2.5  
6
V
DEFDCDC3 = GND  
800  
IO  
Maximum output current  
mA  
VINDCDC3 (VINDCDC13) = 3.6 V;  
3.3V - 1% VDCDC3 3.3V + 1%  
525  
rDS(on)  
Ilkg  
rDS(on)  
Ilkg  
P-channel MOSFET on-resistance  
P-channel leakage current  
VINDCDC3 (VINDCDC13) = V(GS) = 3.6 V  
VINDCDC3 (VINDCDC13) = 6 V  
VINDCDC3 (VINDCDC13) = V(GS) = 3.6 V  
V(DS) = 6 V  
310  
0.1  
220  
7
698  
2
mΩ  
mA  
N-channel MOSFET on-resistance  
N-channel leakage current  
503  
10  
mΩ  
mA  
Forward current limit (P-channel and  
N-channel)  
2.5 V < VINDCDC3 (VINDCDC13) < 6 V  
1.28  
1.95  
–2%  
1.49  
2.25  
1.69  
2.55  
2%  
A
fS  
Oscillator frequency  
MHz  
VINDCDC3 (VINDCDC13) = 2.5 V to 6 V;  
0 mA IO 0.8 A  
VDCDC3 = 1.8V  
Fixed output voltage  
FPWMDCDC3=0  
VINDCDC3 (VINDCDC13) = 3.6 V to 6 V;  
0 mA IO 0.8 A  
VDCDC3 = 3.3V  
VDCDC3 = 1.8V  
VDCDC3 = 3.3V  
–1%  
–2%  
–1%  
–2%  
–1%  
1%  
2%  
1%  
2%  
1%  
VINDCDC3 (VINDCDC13) = 2.5 V to 6 V;  
0 mA IO 0.8 A  
Fixed output voltage  
FPWMDCDC3=1  
VINDCDC3 (VINDCDC13) = 3.6 V to 6 V;  
0 mA IO 0.8 A  
Adjustable output voltage with resistor  
divider at DEFDCDC3 FPWMDCDC3=0  
VINDCDC3 (VINDCDC13) = VDCDC3 + 0.5 V  
(min 2.5 V) to 6 V; 0 mA IO 800 mA  
Adjustable output voltage with resistor  
divider at DEFDCDC3; FPWMDCDC3=1  
VINDCDC3 (VINDCDC13) = VDCDC3 + 0.5 V  
(min 2.5 V) to 6 V; 0 mA IO 800 mA  
VINDCDC3 (VINDCDC13) = VDCDC3 + 0.3 V  
(min. 2.5 V) to 6 V; IO = 10 mA  
Line Regulation  
0
%/V  
Load Regulation  
IO = 10 mA to 800 mA  
0.25  
175  
750  
1
%/A  
µs  
tStart  
Start-up time  
Time from active EN to start switching  
Time to ramp from 5% to 95% of VOUT  
145  
400  
200  
tRamp  
VOUT ramp-up time  
1000  
ms  
Internal resistance from L3 to GND  
VDCDC3 discharge resistance  
MΩ  
DCDC3 discharge =1  
300  
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ELECTRICAL CHARACTERISTICS  
VINDCDC1 = VINDCDC2 = VINDCDC3 (VINDCDC13) = VCC = VINLDO = 3.6 V, VBACKUP = 3 V, TA = –40°C to 85°C,  
typical values are at TA = 25°C (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
VLDO1 and VLDO2 LOW DROPOUT REGULATORS  
VI  
Input voltage range for LDO1, 2  
LDO1 output voltage range  
LDO2 output voltage range  
1.5  
1
6.5  
3.15  
3.3  
V
V
V
VO(LD01)  
VO(LDO2)  
1.05  
200  
VI = 1.8 V, VO = 1.3 V  
IO  
Maximum output current for LDO1, LDO2  
mA  
mA  
VI = 1.5 V, VO = 1.3 V  
120  
65  
I(SC)  
LDO1 and LDO2 short circuit current limit V(LDO1) = GND, V(LDO2) = GND  
IO = 50 mA, VINLDO = 1.8 V  
400  
120  
150  
300  
1%  
Minimum voltage drop at LDO1, LDO2  
IO = 50 mA, VINLDO = 1.5 V  
IO = 200 mA, VINLDO = 1.8 V  
mV  
Output voltage accuracy for LDO1, LDO2 IO = 10 mA  
–2%  
–1%  
–1%  
VINLDO1, 2 = VLDO1,2 + 0.5 V  
(min. 2.5 V) to 6.5 V, IO = 10 mA  
Line regulation for LDO1, LDO2  
1%  
1%  
Load regulation for LDO1, LDO2  
Regulation time for LDO1, LDO2  
IO = 0 mA to 50 mA  
Load change from 10% to 90%  
10  
ms  
ANALOGIC SIGNALS DEFDCDC1, DEFDCDC2, DEFDCDC3  
VIH  
VIL  
High-level input voltage  
Low-level input voltage  
Input bias current  
1.3  
0
VCC  
0.1  
V
V
0.001  
0.05  
mA  
THERMAL SHUTDOWN  
T(SD) Thermal shutdown  
Thermal shutdown hysteresis  
INTERNAL UNDERVOLTAGE LOCK OUT  
Increasing junction temperature  
Decreasing junction temperature  
160  
20  
°C  
°C  
UVLO  
Internal UVLO  
VCC falling  
–2%  
2.35  
120  
2%  
1%  
V
V(UVLO_HYST)  
Internal UVLO comparator hysteresis  
mV  
VOLTAGE DETECTOR COMPARATOR INPUTS PWRFAIL_SNS, LOWBAT_SNS  
Comparator threshold  
(PWRFAIL_SNS, LOWBAT_SNS)  
LOWBAT_SNS for TPS650231RSB only  
Falling threshold  
25-mV overdrive  
–1%  
40  
1
V
Hysteresis  
50  
60  
10  
mV  
ms  
Propagation delay  
Input leakage current  
ILK  
0.001  
0.1  
mA  
POWER GOOD  
VDCDC1, VDCDC2, VDCDC3,  
VLDO1, VLDO2, decreasing  
V(PGOODF)  
V(PGOODR)  
–12%  
–7%  
–10%  
–5%  
–8%  
–3%  
VDCDC1, VDCDC2, VDCDC3,  
VLDO1, VLDO2, increasing  
10  
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PIN ASSIGNMENT FOR TPS650231RSB  
(TOP VIEW)  
40 39 38 37 36 35 34 33 32 31  
30  
SCLK  
1
2
DEFDCDC3  
VDCDC3  
PGND3  
29  
28  
27  
SDAT  
INT  
3
4
RESPWRON  
TRESPWRON  
DCDC1_EN  
DCDC2_EN  
DCDC3_EN  
LDO_EN  
LOWBAT  
L3  
26  
25  
VINDCDC3  
VINDCDC1  
L1  
5
6
24  
23  
22  
7
PGND1  
8
VDCDC1  
DEFDCDC1  
9
21  
10  
11 12 13 14 15 16 17 18 19 20  
PIN FUNCTIONS FOR TPS650231RSB  
PIN  
I/O  
DESCRIPTION  
NAME  
SWITCHING REGULATOR SECTION  
NO.  
AGND1  
40  
17  
Analog ground. All analog ground pins are connected internally on the chip.  
Analog ground. All analog ground pins are connected internally on the chip.  
Connect the power pad to analog ground.  
AGND2  
PowerPAD™  
Input voltage for VDCDC1 step-down converter. VINDCDC1 must be connected to the same voltage  
supply as VINDCDC2, VINDCDC3, and VCC.  
VINDCDC1  
6
I
I
I
I
I
I
L1  
7
9
8
Switch pin of VDCDC1 converter. The VDCDC1 inductor is connected here.  
VDCDC1 feedback voltage sense input. Connect directly to VDCDC1  
Power ground for VDCDC1 converter.  
VDCDC1  
PGND1  
Input voltage for VDCDC2 step-down converter. VINDCDC2 must be connected to the same voltage  
supply as VINDCDC1, VINDCDC3, and VCC.  
VINDCDC2  
36  
L2  
35  
33  
34  
Switch pin of VDCDC2 converter. The VDCDC2 inductor is connected here.  
VDCDC2 feedback voltage sense input. Connect directly to VDCDC2  
Power ground for VDCDC2 converter  
VDCDC2  
PGND2  
Input voltage for VDCDC3 step-down converter. VINDCDC3 must be connected to the same voltage  
supply as VINDCDC1, VINDCDC2, and VCC.  
VINDCDC3  
5
L3  
4
2
3
Switch pin of VDCDC3 converter. The VDCDC3 inductor is connected here.  
VDCDC3 feedback voltage sense input. Connect directly to VDCDC3  
Power ground for VDCDC3 converter.  
VDCDC3  
PGND3  
Power supply for digital and analog circuitry of VDCDC1, VDCDC2, and VDCDC3 dc-dc converters. VCC  
must be connected to the same voltage supply as VINDCDC3, VINDCDC1, and VINDCDC2. VCC also  
supplies serial interface block.  
VCC  
37  
I
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PIN FUNCTIONS FOR TPS650231RSB (continued)  
PIN  
I/O  
DESCRIPTION  
NAME  
NO.  
Input signal indicating default VDCDC1 voltage, 0 = 1.2 V, 1 = 1.6 V; DEFDCDC1 can also be connected  
to a resistor divider between VDCDC1 and GND, if the output voltage of the DCDC1 converter is set in a  
range from 0.6 V to VINDCDC1 V.  
DEFDCDC1  
10  
I
Input signal indicating default VDCDC2 voltage, 0 = 1.8 V, 1 = 3.3 V; DEFDCDC2 can also be connected  
to a resistor divider between VDCDC2 and GND, if the output voltage of the DCDC2 converter is set in a  
range from 0.6 V to VINDCDC2 V.  
DEFDCDC2  
DEFDCDC3  
32  
1
I
I
Input signal indicating default VDCDC3 voltage, 0 = 1.8 V, 1 = 3.3 V; DEFDCDC3 can also be connected  
to a resistor divider between VDCDC3 and GND, if the output voltage of the DCDC3 converter is set in a  
range from 0.6 V to VINDCDC3 V.  
DCDC1_EN  
DCDC2_EN  
DCDC3_EN  
25  
24  
23  
I
I
I
VDCDC1 enable pin. A logic high enables the regulator, a logic low disables the regulator.  
VDCDC2 enable pin. A logic high enables the regulator, a logic low disables the regulator.  
VDCDC3 enable pin. A logic high enables the regulator, a logic low disables the regulator.  
LDO REGULATOR SECTION  
VINLDO  
VLDO1  
19  
20  
18  
22  
15  
16  
14  
12  
13  
I
O
O
I
Input voltage for LDO1 and LDO2  
Output voltage of LDO1  
VLDO2  
Output voltage of LDO2  
LDO_EN  
VBACKUP  
VRTC  
Enable input for LDO1 and LDO2. A Logic high enables the LDOs, a logic low disables the LDOs.  
Connect the backup battery to this input pin.  
I
O
I
Output voltage of the LDO/switch for the real time clock.  
Input of system voltage for VRTC switch.  
VSYSIN  
DEFLD01  
DEFLD02  
I
Digital input. DEFLD01 sets the default output voltage of LDO1 and LDO2.  
Digital input. DEFLD02 sets the default output voltage of LDO1 and LDO2.  
I
CONTROL AND I2C SECTION  
HOT_RESET  
TRESPWRON  
RESPWRON  
PWRFAIL  
LOW_BAT  
INT  
11  
26  
27  
31  
21  
28  
30  
29  
38  
39  
I
Push button input that reboots or wakes up the processor via RESPWRON output pin.  
Connect the timing capacitor to TRESPWRON to set the reset delay time: 1 nF 100 ms.  
Open drain system reset output.  
I
O
O
O
O
I
Open drain output. Active low when PWRFAIL comparator indicates low VBAT condition.  
Open drain output of LOW_BAT comparator.  
Open drain output  
SCLK  
Serial interface clock line  
SDAT  
I/O Serial interface data/address  
PWRFAIL_SNS  
LOWBAT_SNS  
I
I
Input for the comparator driving the PWRFAIL output.  
Input for the comparator driving the LOW_BAT output.  
12  
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FUNCTIONAL BLOCK DIAGRAM  
TPS650231RSB  
V
CC  
VSYSIN  
VBACKUP  
VRTC  
BBAT  
SWITCH  
Thermal  
Shutdown  
VINDCDC1  
L1  
DCDC1  
Buck Converter  
1700 mA  
VDCDC1  
DEFDCDC1  
PGND1  
SCLK  
SDAT  
Serial Interface  
VINDCDC2  
L2  
DCDC1_EN  
DCDC2_EN  
DCDC3_EN  
LDO_EN  
DCDC2  
Buck Converter  
1200 mA  
VDCDC2  
DEFDCDC2  
PGND2  
CONTROL  
HOT_RESET  
RESPWRON  
INT  
Dynamic  
Voltage  
Management  
VINDCDC3  
L3  
LOWBAT_SNS  
PWRFAIL_SNS  
LOW_BATT  
DCDC3  
Buck Converter  
1000 mA  
VDCDC3  
DEFDCDC3  
PGND3  
UVLO  
VREF  
OSC  
PWRFAIL  
TRESPWRON  
LDO1  
200 mA  
VLDO1  
VINLDO  
VLDO2  
DEFLDO1  
DEFLDO2  
LDO2  
200 mA  
AGND1  
AGND2  
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PIN ASSIGNMENT FOR TPS650231YFF  
(BOTTOM VIEW)  
VLDO1  
VINLDO  
VLDO2  
AGND  
VBACKUP  
DEFLDO2  
DEFLDO1  
VDCDC1  
PGND1  
A7  
A6  
A5  
LDO_EN  
DCDC2_EN  
VSYSIN  
PGND1  
PGND1  
DCDC3_EN  
Trespwron  
DCDC1_EN  
VRTC  
DEFDCDC1  
L1  
L1  
L1  
SDAT  
VDCDC2  
Vcc  
VINDCDC13  
VINDCDC13  
VINDCDC13  
A4  
DEFDCDC2  
PGND2  
PGND2  
PGND2  
L2  
L2  
L2  
VINDCDC2  
VINDCDC2  
VINDCDC2  
VDCDC3  
L3  
VINDCDC13  
A3  
A2  
PWRFAIL  
_SNS  
SCLK  
PGND3  
AGND  
L3  
/PWRFAIL  
DEFDCDC3  
PGND3  
C1  
A1  
E1  
D1  
B1  
G1  
F1  
PIN FUNCTIONS FOR TPS650231YFF  
PIN  
I/O  
DESCRIPTION  
NAME  
SWITCHING REGULATOR SECTION  
NO.  
AGND  
B1, E6  
Analog ground. All analog ground pins are connected internally on the chip.  
A3,  
A4,  
B4,  
C4  
Input voltage for VDCDC1 and VDCDC3 step-down converter. This must be connected to the same  
voltage supply as VINDCDC2 and VCC.  
VINDCDC13  
I
A5,  
B5,  
C5  
L1  
O
I
Switch pin of VDCDC1 converter. The VDCDC1 inductor is connected here.  
VDCDC1 feedback voltage sense input. Connect directly to VDCDC1  
Power ground for VDCDC1 converter.  
VDCDC1  
PGND1  
A7  
A6,  
B6,  
C6  
D1,  
D2,  
D3  
Input voltage for VDCDC2 step-down converter. VINDCDC2 must be connected to the same voltage  
supply as VINDCDC13 and VCC.  
VINDCDC2  
I
E1,  
E2, E3  
L2  
O
I
Switch pin of VDCDC2 converter. The VDCDC2 inductor is connected here.  
VDCDC2 feedback voltage sense input. Connect directly to VDCDC2  
Power ground for VDCDC2 converter  
VDCDC2  
PGND2  
E4  
F1,  
F2, F3  
L3  
A2, B3  
C3  
O
I
Switch pin of VDCDC3 converter. The VDCDC3 inductor is connected here.  
VDCDC3 feedback voltage sense input. Connect directly to VDCDC3  
Power ground for VDCDC3 converter.  
VDCDC3  
PGND3  
A1, B2  
14  
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PIN FUNCTIONS FOR TPS650231YFF (continued)  
PIN  
I/O  
DESCRIPTION  
NAME  
NO.  
Power supply for digital and analog circuitry of VDCDC1, VDCDC2, and VDCDC3 dc-dc converters. VCC  
must be connected to the same voltage supply as VINDCDC13 and VINDCDC2. VCC also supplies the  
serial interface block.  
VCC  
D4  
I
Input signal indicating default VDCDC1 voltage, 0 = 1.2 V, 1 = 1.6 V; DEFDCDC1 can also be connected  
to a resistor divider between VDCDC1 and GND, if the output voltage of the DCDC1 converter is set in a  
range from 0.6 V to VINDCDC1 V.  
DEFDCDC1  
DEFDCDC2  
DEFDCDC3  
D5  
G3  
C1  
I
I
I
This pin needs to be connected to a resistor divider between VDCDC2 and GND. The output voltage of  
the DCDC2 converter is set in a range from 0.6 V to VINDCDC2 V.  
Input signal indicating default VDCDC3 voltage, 0 = 1.8 V, 1 = 3.3 V; DEFDCDC3 can also be connected  
to a resistor divider between VDCDC3 and GND, if the output voltage of the DCDC3 converter is set in a  
range from 0.6 V to VINDCDC3 V.  
DCDC1_EN  
DCDC2_EN  
DCDC3_EN  
F5  
F6  
G5  
I
I
I
VDCDC1 enable pin. A logic high enables the regulator, a logic low disables the regulator.  
VDCDC2 enable pin. A logic high enables the regulator, a logic low disables the regulator.  
VDCDC3 enable pin. A logic high enables the regulator, a logic low disables the regulator.  
LDO REGULATOR SECTION  
VINLDO  
VLDO1  
F7  
G7  
E7  
G6  
D7  
E5  
D6  
B7  
C7  
I
O
O
I
Input voltage for LDO1 and LDO2  
Output voltage of LDO1  
VLDO2  
Output voltage of LDO2  
LDO_EN  
VBACKUP  
VRTC  
Enable input for LDO1 and LDO2. A Logic high enables the LDOs, a logic low disables the LDOs.  
Connect the backup battery to this input pin.  
I
O
I
Output voltage of the LDO/switch for the real time clock.  
Input of system voltage for VRTC switch.  
VSYSIN  
DEFLD01  
DEFLD02  
I
Digital input. DEFLD01 sets the default output voltage of LDO1 and LDO2.  
Digital input. DEFLD02 sets the default output voltage of LDO1 and LDO2.  
I
CONTROL AND I2C SECTION  
TRESPWRON  
PWRFAIL  
SCLK  
G4  
G1  
G2  
F4  
I
O
I
Connect a 1nF capacitor from this pin to GND.  
Open drain output. Active low when PWRFAIL comparator indicates low VBAT condition.  
Serial interface clock line  
SDAT  
I/O Serial interface data/address  
Input for the comparator driving the PWRFAIL output.  
PWRFAIL_SNS  
C2  
I
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FUNCTIONAL BLOCK DIAGRAM FOR TPS650231YFF  
VSYSIN  
L3  
DCDC3  
THERMAL  
SHUTDOWN  
VDCDC3  
DEFDCDC3  
STEP -DOWN  
CONVERTER  
VCC  
VBACKUP  
VRTC  
PGND3  
BBAT  
SWITCH  
VINDCDC13  
L1  
VDCDC1  
DEFDCDC1  
DCDC1  
SCLK  
SDAT  
STEP-DOWN  
CONVERTER  
PGND1  
Serial Interface  
VINDCDC2  
DCDC1_EN  
DCDC2_EN  
DCDC3_EN  
LDO_EN  
L2  
VDCDC2  
DEFDCDC2  
DCDC2  
CONTROL  
STEP-DOWN  
CONVERTER  
Dynamic  
Voltage  
Scaling  
PGND2  
VLDO1  
VLDO1  
PWRFAIL_SNS  
/PWRFAlL  
UVLO  
VREF  
OSC  
200 mA LDO  
TRESPWRON  
AGND  
VINLDO  
DEFLDO1  
DEFLDO2  
VLDO2  
VLDO2  
200 mA LDO  
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TYPICAL CHARACTERISTICS  
Graphs were taken using the EVM with the following inductor/output capacitor combinations:  
CONVERTER  
VDCDC1  
INDUCTOR  
LQH32PN1R5  
LQH32PN2R2  
LQH32PN2R2  
OUTPUT CAPACITOR  
JMK107BJ106  
OUTPUT CAPACITOR VALUE  
2 × 10 mF  
VDCDC2  
JMK107BJ106  
2 × 10 mF  
VDCDC3  
JMK107BJ106  
2 × 10 mF  
Table 1. Table of Graphs  
FIGURE  
1, 2, 3, 4, 5, 6  
7, 8  
h
Efficiency  
vs Output current  
Output voltage  
vs Output current at 85°C  
Line transient response  
Load transient response  
VDCDC2 PFM operation  
9, 10, 11  
12, 13, 14  
15  
VDCDC2 low ripple PFM operation  
VDCDC2 PWM operation  
16  
17  
Startup VDCDC1, VDCDC2 and VDCDC3  
Startup LDO1 and LDO2  
18  
19  
Line transient response  
20, 21, 22  
23, 24, 25  
Load transient response  
DCDC1: EFFICIENCY  
vs  
DCDC1: EFFICIENCY  
vs  
OUTPUT CURRENT  
OUTPUT CURRENT  
100  
100  
V = 2.5 V  
I
T = 25°C,  
A
90  
90  
80  
70  
60  
50  
40  
30  
20  
V
= 1.2 V,  
O
PWM Mode  
V = 3 V  
I
V = 2.5 V  
I
80  
V = 3.6 V  
I
V = 3 V  
I
70  
60  
50  
40  
30  
20  
V = 4.2 V  
I
V = 3.6 V  
I
V = 5 V  
I
V = 4.2 V  
I
V = 5 V  
I
T
= 25°C,  
= 1.2 V,  
A
V
O
PFM Mode  
10  
0
10  
0
0.01  
0.1  
1
10  
100  
- Output Current - mA  
1 k  
10 k  
0.01  
0.1  
1
10  
- Output Current - mA  
100  
1 k 10 k  
I
I
O
O
Figure 1.  
Figure 2.  
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DCDC2: EFFICIENCY  
vs  
DCDC2: EFFICIENCY  
vs  
OUTPUT CURRENT  
OUTPUT CURRENT  
100  
100  
90  
T
= 25°C,  
= 1.8 V,  
V = 3 V  
I
A
90  
80  
70  
60  
50  
40  
30  
20  
V
O
PWM Mode  
80  
70  
60  
50  
40  
30  
20  
V = 2.5 V  
I
V = 3.6 V  
I
V = 2.5 V  
I
V = 3 V  
I
V = 4.2 V  
I
V = 3.6 V  
I
V = 5 V  
I
V = 4.2 V  
I
V = 5 V  
I
T
= 25°C,  
= 1.8 V,  
A
V
O
PFM Mode  
10  
0
10  
0
0.01  
0.1  
1
10  
100  
- Output Current - mA  
1 k  
10 k  
0.01  
0.1  
1
10  
100  
- Output Current - mA  
1 k  
10 k  
I
O
I
O
Figure 3.  
Figure 4.  
DCDC3: EFFICIENCY  
vs  
DCDC3: EFFICIENCY  
vs  
OUTPUT CURRENT  
OUTPUT CURRENT  
100  
90  
100  
T
= 25°C,  
= 1.8 V,  
V = 2.5 V  
I
A
90  
80  
70  
60  
50  
40  
30  
20  
V
V = 2.5 V  
I
O
PWM Mode  
80  
70  
60  
50  
40  
30  
20  
V = 3 V  
I
V = 3 V  
I
V = 3.6 V  
I
V = 3.6 V  
I
V = 4.2 V  
I
V = 4.2 V  
I
V = 5 V  
I
V = 5 V  
I
T
= 25°C,  
= 1.8 V,  
A
V
O
PFM Mode  
10  
0
10  
0
0.01  
0.1  
1
10  
100  
- Output Current - mA  
1 k  
10 k  
0.01  
0.1  
1
10  
100  
- Output Current - mA  
1 k  
10 k  
I
I
O
O
Figure 5.  
Figure 6.  
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DCDC2: OUTPUT VOLTAGE  
vs  
DCDC3: OUTPUT VOLTAGE  
vs  
OUTPUT CURRENT at 85°C  
OUTPUT CURRENT at 85°C  
3.3  
3.267  
3.234  
3.201  
3.168  
3.135  
3.4  
TA = 85°C  
VI = 3.8 V  
DEFDCDC3 = VINDCDC3  
3.35  
3.3  
VI = 3.8 V  
VI = 3.7 V  
VI = 3.7 V  
3.25  
3.2  
VI = 3.5 V  
VI = 3.6 V  
VI = 3.6 V  
VI = 3.5 V  
3.15  
3.1  
TA = 85°C  
DEFDCDC2 = VINDCDC2  
0.1  
1
10  
0.1  
1
10  
IO - Output Current - A  
IO - Output Current - A  
Figure 7.  
Figure 8.  
VDCDC1 LINE TRANSIENT RESPONSE  
VDCDC2 LINE TRANSIENT RESPONSE  
C1 High  
4.72 V  
C1 High  
4.02 V  
C1 Low  
3.72 V  
C1 Low  
3.02 V  
V = 3 V to 4 V,  
I
VI = 3.7 V to 4.7 V  
V
= 1.8 V, I = 100 mA;  
O
O
VO = 1.2 V, IO = 100 mA  
C2 Pk-Pk  
24.7 mV  
C2 Pk-Pk  
128 mV  
DEFDCDC2 = resistor divider; set for V = 1.8 V,  
O
DEFDCDC1 = GND  
PWM Mode  
PWM Mode  
C2 Mean  
1.20701 V  
C2 Mean  
1.8002 V  
Figure 9.  
Figure 10.  
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VDCDC3 LINE TRANSIENT RESPONSE  
VDCDC1 LOAD TRANSIENT RESPONSE  
C4 High  
1.56 A  
C1 High  
4.62 V  
C4 Low  
120 mA  
C1 Low  
3.62 V  
VI = 3.8 V, VO = 1.2 V,  
IO = 170 mA to 1530 mA  
V = 3.6 V to 4.6 V,  
I
C2 Pk-Pk  
166 mV  
V
= 3.3 V, I = 100 mA,  
O
C2 Pk-Pk  
91 mV  
O
DEFDCDC1 = VINDCDC3,  
PWM Mode  
C2 Mean  
3.2993 V  
C2 Mean  
1.2046 V  
Figure 11.  
Figure 12.  
VDCDC3 LOAD TRANSIENT RESPONSE  
VDCDC2 LOAD TRANSIENT RESPONSE  
VI = 3.8 V, VO = 3.3 V,  
IO = 120 mA to 720 mA  
C4 High  
720 mA  
C4 High  
1.12 A  
C4 Low  
80 mA  
C4 Low  
80 mA  
VI = 3.8 V, VO = 1.8 V,  
IO = 120 mA to 1080 mA  
C2 Pk-Pk  
194 mV  
C2 Pk-Pk  
147 mV  
C2 Mean  
3.2961 V  
C2 Mean  
1.7993 V  
Figure 13.  
Figure 14.  
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VDCDC2 OUTPUT VOLTAGE RIPPLE  
VDCDC2 OUTPUT VOLTAGE RIPPLE  
VI = 3.8 V, VO = 1.8 V,  
ILOAD = 1 mA; PFM Mode  
C2 Pk-Pk  
20.6 mV  
C2 Mean  
1.81186 V  
Figure 15.  
Figure 16.  
VDCDC2 OUTPUT VOLTAGE RIPPLE  
STARTUP VDCDC1, VDCDC2, AND VDCDC3  
mV  
Figure 17.  
Figure 18.  
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STARTUP LDO1 AND LDO2  
LDO1 LINE TRANSIENT RESPONSE  
ENABLE  
C1 High  
3.82 V  
C1 Low  
3.29 V  
VCC = 3.8 V, VI LDO = 3.3 V to 3.8 V  
VO = 2.1 V, IO = 25 mA  
LDO1  
C2 Pk-Pk  
4.2 mV  
C2 Mean  
2.10252 V  
LDO2  
Figure 19.  
LDO2 LINE TRANSIENT RESPONSE  
Figure 20.  
VRTC LINE TRANSIENT RESPONSE  
I
= 10 mA  
= 3 V  
O
I
= 25 mA  
= 3.3 V  
Ch1 = V  
Ch2 = V  
O
I
Ch1 = V  
Ch2 = V  
I
V
T
C1 High  
3.82 V  
O
V
T
C1 High  
4.51 V  
O
O
= 25oC  
O
= 25oC  
A
A
C1 Low  
3.28 V  
C1 Low  
3.99 V  
C2 PK-PK  
22.8 mV  
C2 PK-PK  
6.1 mV  
C2 Mean  
2.98454 V  
C2 Mean  
3.29828 V  
Figure 21.  
Figure 22.  
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LDO1 LOAD TRANSIENT RESPONSE  
LDO2 LOAD TRANSIENT RESPONSE  
C4 High  
184 mA  
C4 High  
180 mA  
C4 Low  
16 mA  
C4 Low  
16 mA  
VCC = 3.8 V, VI = 3.3 V, VO = 2.1 V,  
IO = 20 mA to 180 mA  
C2 Pk-Pk  
53.1 mV  
C2 Pk-Pk  
78.1 mV  
C2 Mean  
2.10024 V  
C2 Mean  
3.29606 V  
VCC = 3.8 V, VI = 3.8 V, VO = 3.3 V,  
IO = 20 mA to 180 mA  
Figure 23.  
Figure 24.  
VRTC LOAD TRANSIENT RESPONSE  
C4 High  
21.4 mA  
C4 Low  
-1.4 mA  
C2 PK-PK  
76 mV  
C2 Mean  
2.9762 V  
V = 3.8 V  
I
Ch2 = V  
Ch4 = I  
V
T
= 3 V  
= 25oC  
O
O
O
A
Figure 25.  
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DETAILED DESCRIPTION  
VRTC OUTPUT AND OPERATION WITH OR WITHOUT BACKUP BATTERY  
The VRTC pin is an always-on output, intended to supply up to 30 mA to a permanently required rail (i.e. for a  
Real Time Clock). The TPS650231 asserts the RESPWRON signal if VRTC drops below 2.4 V. VRTC is  
selected from a priority scheme based on the VSYSIN and VBACKUP inputs.  
When the voltage at the VSYSIN pin exceeds 2.65 V, VRTC connects to the VSYSIN input via a PMOS switch  
and all other paths to VRTC are disabled. The PMOS switch drops a maximum of 375 mV at 30 mA, which  
should be considered when using VRTC. VSYSIN can be connected to any voltage source with the appropriate  
input voltage, including VCC or, if set to 3.3 V output, DCDC2 or DCDC3. When VSYSIN falls below 2.65 V or  
shorts to ground, the PMOS switch connecting VRTC and VSYSIN opens and VRTC then connects to either  
VBACKUP or the output of a dedicated 3V/30mA LDO. Texas Instruments recommends connecting VSYSIN to  
VCC or ground - VCC if a non-replaceable primary cell is connected to VBACKUP and ground if the VRTC  
output will float.  
If the PMOS switch between VSYSIN and VRTC is open and VBACKUP exceeds 2.65 V, VRTC connects to  
VBACKUP via a PMOS switch. The PMOS switch drops a maximum of 375 mV at 30 mA, which should be  
considered if using VRTC. A typical application may connect VBACKUP to a primary Li button cell, but any  
battery that provides a voltage between 2.65 V and 6 V (i.e. a single Li-Ion cell or a single boosted NiMH battery)  
is acceptable, to supply the VRTC output. In systems with no backup battery, the VBACKUP pin should be  
connected to GND.  
If the switches between VRTC and VSYSIN or VBACKUP are open, the dedicated 3-V/30-mA LDO, driven from  
VCC, connects to VRTC. This LDO is disabled if the voltage at the VSYSIN input exceeds 2.65 V.  
Inside TPS650231 there is a switch (Vmax switch) which selects the higher voltage between VCC and  
VBACKUP. This is used as the supply voltage for some basic functions. The functions powered from the output  
of the Vmax switch are:  
INT output  
RESPWRON output  
HOT_RESET input  
LOW_BATT output  
PWRFAIL output  
Enable pins for dc-dc converters, LDO1 and LDO2  
Undervoltage lockout comparator (UVLO)  
Reference system with low frequency timing oscillators  
LOW_BATT and PWRFAIL comparators  
The main 2.25-MHz oscillator, and the I2C™ interface are only powered from VCC  
.
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V
VSYSIN  
CC  
VBACKUP  
V
V
ref  
ref  
V_VSYSIN  
V_VBACKUP  
V_VSYSIN  
EN  
VRTC  
LDO  
V_VBACKUP  
priority  
#1  
priority  
#2  
priority  
#3  
VRTC  
RESPWRON  
V
ref  
A. V_VSYSIN, V_VBACKUP thresholds: falling = 2.55 V, rising = 2.65 V ±3%  
B. RESPWRON thresholds: falling = 2.4 V, rising = 2.52 V ±3%  
Figure 26.  
STEP-DOWN CONVERTERS, VDCDC1, VDCDC2, and VDCDC3  
The TPS650231 incorporates three synchronous step-down converters operating typically at 2.25MHz fixed  
frequency PWM (Pulse Width Modulation) at moderate to heavy load currents. At light load currents the  
converters automatically enter Power Save Mode and operate with PFM (Pulse Frequency Modulation). The  
VDCDC1 converter is capable of delivering 1.7A output current, the VDCDC2 converter is capable of delivering  
1.2A and the VDCDC3 converter delivers up to 800mA.  
The converter output voltages can be programmed via the DEFDCDC1, DEFDCDC2 and DEFDCDC3 pins. For  
DEFDCDC1 and DEFDCDC3, the pins can either be connected to GND, VCC or to a resistor divider between  
the output voltage and GND.  
The VDCDC1 converter defaults to 1.2V or 1.6V depending on the DEFDCDC1 configuration pin, if DEFDCDC1  
is tied to ground the default is 1.2V, if it is tied to VCC the default is 1.6V. When the DEFDCDC1 pin is  
connected to a resistor divider, the output voltage can be set in the range of 0.6V to VINDCDC1 V. See the  
application section for more details. The core voltage can be reprogrammed via the serial interface in the range  
of 0.8 V to 1.6 V with a programmable slew rate. The converter is forced into PWM operation whilst any  
programmed voltage change is underway, whether the voltage is being increased or decreased. The DEFCORE  
and DEFSLEW registers are used to program the output voltage and slew rate during voltage transitions.  
The DEFDCDC2 pin does not have the logic function in parallel and always needs to be connected with a  
resistor divider, the output voltage can be set in the range of 0.6 V to VINDCDC2 V.  
The VDCDC3 converter defaults to 1.8 V or 3.3 V depending on the DEFDCDC3 configuration pin. If DEFDCDC3  
is tied to ground, the default is 1.8 V. If it is tied to VCC, the default is 3.3 V. When the DEFDCDC3 pin is  
connected to a resistor divider, the output voltage can be set in the range of 0.6 V to VINDCDC3 V. The  
step-down converter outputs (when enabled) are monitored by Power Good comparators, the outputs of which  
are available via the serial interface. The outputs of the DC-DC converters can be optionally discharged via  
on-chip 300Ω resistors when the DC-DC converters are disabled.  
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During PWM operation the converters use a unique fast response voltage mode controller scheme with input  
voltage feed-forward to achieve good line and load regulation allowing the use of small ceramic input and output  
capacitors. At the beginning of each clock cycle initiated by the clock signal, the P-channel MOSFET switch is  
turned on and the inductor current ramps up until the comparator trips and the control logic will turn off the  
switch. The current limit comparator will also turn off the switch in case the current limit of the P-channel switch is  
exceeded. After the adaptive dead time used to prevent shoot through current, the N-channel MOSFET rectifier  
is turned on and the inductor current will ramp down. The next cycle will be initiated by the clock signal again  
turning off the N-channel rectifier and turning on the P-channel switch.  
The three DC-DC converters operate synchronized to each other, with the VDCDC1 converter as the master. A  
180° phase shift between the VDCDC1 switch turn on and the VDCDC2 and a further 90° shift to the VDCDC3  
switch turn on decreases the input RMS current and smaller input capacitors can be used. The phase of the  
three converters can be changed using the CON_CTRL register.  
POWER SAVE MODE OPERATION  
As the load current decreases, the converters enter the power save mode operation. During power save mode,  
the converters operate in a burst mode (PFM mode) with a frequency between 750 kHz and 2.25 MHz, nominal  
for one burst cycle. However, the frequency between different burst cycles depends on the actual load current  
and is typically far less than the switching frequency with a minimum quiescent current to maintain high  
efficiency.  
In order to optimize the converter efficiency at light load, the average current is monitored and if in PWM mode  
the inductor current remains below a certain threshold, then PSM is entered. The typical threshold to enter PSM  
is calculated as follows:  
VINDCDC1  
I
=
PFMDCDC1 enter  
24 W  
VINDCDC2  
I
I
=
=
PFMDCDC2 enter  
26 W  
VINDCDC3  
PFMDCDC3 enter  
39 W  
(1)  
During the power save mode the output voltage is monitored with a comparator, and by maximum skip burst  
width. As the output voltage falls below the threshold, set to the nominal VO, the P-channel switch turns on and  
the converter effectively delivers a constant current defined as follows.  
VINDCDC1  
I
=
PFMDCDC1 leave  
18 W  
VINDCDC2  
I
I
=
PFMDCDC2 leave  
20 W  
VINDCDC3  
=
PFMDCDC3 leave  
29 W  
(2)  
If the load is below the delivered current then the output voltage rises until the same threshold is crossed in the  
other direction. All switching activity ceases, reducing the quiescent current to a minimum until the output voltage  
has again dropped below the threshold. The power save mode is exited, and the converter returns to PWM mode  
if either of the following conditions are met:  
1. the output voltage drops 2% below the nominal VO due to increasing load current  
2. the PFM burst time exceeds 16 × 1/fs (7.11 ms typical).  
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These control methods reduce the quiescent current to typically 14 mA per converter, and the switching activity to  
a minimum, thus achieving the highest converter efficiency. Setting the comparator thresholds at the nominal  
output voltage at light load current results in a low output voltage ripple. The ripple depends on the comparator  
delay and the size of the output capacitor. Increasing capacitor values makes the output ripple tend to zero. The  
PSM is disabled through the I2C interface to force the individual converters to stay in fixed frequency PWM  
mode.  
LOW RIPPLE MODE  
Setting Bit 3 in register CON-CTRL to 1 enables the low ripple mode for all of the dc-dc converters if operated in  
PFM mode. For an output current less than approximately 10 mA, the output voltage ripple in PFM mode is  
reduced, depending on the actual load current. The lower the actual output current on the converter, the lower  
the output ripple voltage. For an output current above 10 mA, there is only minor difference in output voltage  
ripple between PFM mode and low ripple PFM mode. As this feature also increases switching frequency, it is  
used to keep the switching frequency above the audible range in PFM mode down to a low output current.  
SOFT START  
Each of the three converters has an internal soft start circuit that limits the inrush current during start-up. The soft  
start is realized by using a low current to initially charge the internal compensation capacitor. The soft start time  
is typically 750 ms if the output voltage ramps from 5% to 95% of the final target value. If the output is already  
precharged to some voltage when the converter is enabled, then this time is reduced proportionally. There is a  
short delay of typically 170 ms between the converter being enabled and switching activity actually starting. This  
allows the converter to bias itself properly, to recognize if the output is precharged, and if so to prevent  
discharging of the output while the internal soft start ramp catches up with the output voltage.  
100% DUTY CYCLE LOW DROPOUT OPERATION  
The TPS650231 converters offer a low input to output voltage difference while still maintaining operation with the  
use of the 100% duty cycle mode. In this mode the P-channel switch is constantly turned on. This is particularly  
useful in battery-powered applications to achieve longest operation time by taking full advantage of the whole  
battery voltage range. The minimum input voltage required to maintain dc regulation depends on the load current  
and output voltage. It is calculated as:  
  ǒr  
max ) R Ǔ  
Vin  
+ Vout  
) Iout  
max  
min  
min  
DS(on)  
L
(3)  
with:  
Ioutmax = maximum load current (Note: ripple current in the inductor is zero under these conditions)  
rDS(on)max = maximum P-channel switch rDS(on)  
RL = DC resistance of the inductor  
Voutmin = nominal output voltage minus 2% tolerance limit  
ACTIVE DISCHARGE WHEN DISABLED  
When the VDCDC1, VDCDC2, and VDCDC3 converters are disabled, due to an UVLO, DCDC_EN or  
OVERTEMP condition, it is possible to actively pull down the outputs. This feature is disabled per default and is  
individually enabled via the CON_CTRL2 register in the serial interface. When this feature is enabled, the  
VDCDC1, VDCDC2, and VDCDC3 outputs are discharged by a 300 (typical) load which is active as long as  
the converters are disabled.  
POWER GOOD MONITORING  
All three step-down converters and both the LDO1 and LDO2 linear regulators have power good comparators.  
Each comparator indicates when the relevant output voltage has dropped 10% below its target value with 5%  
hysteresis. The outputs of these comparators are available in the PGOODZ register via the serial interface. An  
interrupt is generated when any voltage rail drops below the 10% threshold. The comparators are disabled when  
the converters are disabled and the relevant PGOODZ register bits indicate that power is good.  
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LOW DROPOUT VOLTAGE REGULATORS  
The low dropout voltage regulators are designed to operate well with low value ceramic input and output  
capacitors. They operate with input voltages down to 1.5 V. The LDOs offer a maximum dropout voltage of  
300 mV at rated output current. Each LDO supports a current limit feature. Both LDOs are enabled by the  
LDO_EN pin, both LDOs can be disabled or programmed via the serial interface using the REG_CTRL and  
LDO_CTRL registers. The LDOs also have reverse conduction prevention. This allows the possibility to connect  
external regulators in parallel in systems with a backup battery. The TPS650231 step-down and LDO voltage  
regulators automatically power down when the VCC voltage drops below the UVLO threshold or when the junction  
temperature rises above 160°C.  
POWER GOOD MONITORING  
Both the LDO1 and LDO2 linear regulators have power good comparators. Each comparator indicates when the  
relevant output voltage has dropped 10% below its target value, with 5% hysteresis. The outputs of these  
comparators are available in the PGOODZ register via the serial interface. An interrupt is generated when any  
voltage rail drops below the 10% threshold. The comparators are disabled when the LDOs are disabled and the  
relevant PGOODZ register bits indicate that power is good.  
UNDERVOLTAGE LOCKOUT  
The undervoltage lockout circuit for the five regulators on the TPS650231 prevents the device from  
malfunctioning at low-input voltages and from excessive discharge of the battery. It disables the converters and  
LDOs. The UVLO circuit monitors the VCC pin, the threshold is set internally to 2.35 V with 5% (120 mV)  
hysteresis. Note that when any of the dc-dc converters are running, there is an input current at the VCC pin,  
which is up to 3 mA when all three converters are running in PWM mode. This current needs to be taken into  
consideration if an external RC filter is used at the VCC pin to remove switching noise from the TPS650231  
internal analog circuitry supply.  
POWER-UP SEQUENCING  
The TPS650231 power-up sequencing is designed to be entirely flexible and customer driven. This is achieved  
by providing separate enable pins for each switch-mode converter, and a common enable signal for the LDOs.  
The relevant control pins are described in Table 2.  
Table 2. Control Pins and Status Outputs for DC-DC Converters  
PIN NAME  
I/O  
FUNCTION  
Defines the default voltage of the VDCDC3 switching converter. DEFDCDC3 = 0 defaults VDCDC3 to 1.8 V,  
DEFDCDC3 = VCC defaults VDCDC3 to 3.3 V.  
DEFDCDC3  
I
Feedback pin of the VDCDC2 switching converter, connected to a resistive divider. The output voltage can be set  
between 0.6V and VINDCDC2 V.  
DEFDCDC2  
DEFDCDC1  
I
I
Defines the default voltage of the VDCDC1 switching converter. DEFDCDC1 = 0 defaults VDCDC1 to 1.2 V,  
DEFDCDC1 = VCC defaults VDCDC1 to 1.6 V.  
DCDC3_EN  
DCDC2_EN  
DCDC1_EN  
I
I
I
Set DCDC3_EN = 0 to disable and DCDC3_EN = 1 to enable the VDCDC3 converter  
Set DCDC2_EN = 0 to disable and DCDC2_EN = 1 to enable the VDCDC2 converter  
Set DCDC1_EN = 0 to disable and DCDC1_EN = 1 to enable the VDCDC1 converter  
TPS650231RSB only:  
The HOT_RESET pin generates a reset (RESPWRON) for the processor.HOT_RESET does not alter any  
TPS650231 settings except the output voltage of VDCDC1. Activating HOT_RESET sets the voltage of VDCDC1  
to its default value defined with the DEFDCDC1 pin. HOT_RESET is internally de-bounced by the TPS650231.  
HOT_RESET  
I
TPS650231RSB only:  
RESPWRON is held low when power is initially applied to the TPS650231. The VRTC voltage is monitored:  
RESWPRON is low when VRTC < 2.4 V and remains low for a time defined by the external capacitor at the  
TRESPWRON pin. RESPWRON can also be forced low by activation of the HOT_RESET pin.  
RESPWRON  
O
I
TRESPWRON  
Connect a capacitor here to define the RESET time at the RESPWRON pin (1 nF typically gives 100 ms).  
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SYSTEM RESET + CONTROL SIGNALS  
The RESPWRON signal can be used as a global reset for the application. It is an open drain output. The  
RESPWRON signal is generated according to the power good comparator of VRTC, and remains low for tnrespwron  
seconds after VRTC has risen above 2.52 V (falling threshold is 2.4 V, 5% hysteresis). tnrespwron is set by an  
external capacitor at the TRESPWRON pin. 1 nF gives typically 100 ms. RESPWRON is also triggered by the  
HOT_RESET input. This input is internally debounced, with a filter time of typically 30 ms.  
The PWRFAIL and LOW_BAT signals are generated by two voltage detectors using the PWRFAIL_SNS and  
LOWBAT_SNS input signals. Each input signal is compared to a 1 V threshold (falling edge) with 5% (50 mV)  
hysteresis.  
The DCDC1 converter is reset to its default output voltage defined by the DEFDCDC1 input, when HOT_RESET  
is asserted. Other I2C registers are not affected. Generally, the DCDC1 converter is set to its default voltage with  
one of these conditions: HOT_RESET active, VRTC lower than its threshold voltage, undervoltage lockout  
(UVLO) condition, or RESPWRON active.  
The RESPWRON, HOT_RESET, LOW_BAT and LOWBAT_SNS pins are not available in TPS650231YFF.  
DEFLDO1 and DEFLDO2  
These two pins are used to set the default output voltage of the two 200 mA LDOs. The digital value applied to  
the pins is latched during power up and determines the initial output voltage according to Table 3. The voltage of  
both LDOs can be changed during operation with the I2C interface as described in the interface description.  
Table 3.  
DEFLDO2  
DEFLDO1  
VLDO1  
1.3 V  
2.8 V  
1.3 V  
2.1 V  
VLDO2  
3.3 V  
3.3 V  
1.8 V  
3.3 V  
0
0
1
1
0
1
0
1
Interrupt Management and the INT Pin  
The INT pin combines the outputs of the PGOOD comparators from each dc-dc converter and the LDOs. The  
INT pin is used as a POWER_OK pin to indicate when all enabled supplies are in regulation. The INT pin  
remains active (low state) during power up as long as all enabled power rails are below their regulation limit.  
Once the last enabled power rail is within regulation, the INT pin transitions to a high state.  
During operation, if one of the enabled supplies goes out of regulation, INT transitions to a low state, and the  
corresponding bit in the PGOODZ register goes high. If the supply goes back to its regulation limits, INT  
transitions back to a high state.  
While INT is in an active low state, reading the PGOODZ register via the I2C bus forces INT into a high-Z state.  
Since this pin requires an external pull-up resistor, the INT pin transitions to a logic high state even though the  
supply in question is still out of regulation. The corresponding bit in the PGOODZ register still indicates that the  
power rail is out of regulation.  
Interrupts can be masked using the MASK register; default operation is not to mask any DCDC or LDO interrupts  
since this provides the POWER_OK function. If none of the DCDC converters or LDOs are enabled, /INT defaults  
to a low state independently of the settings of the MASK register.  
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TIMING DIAGRAMS  
Figure 27. HOT_RESET Timing (TPS650231RSB only)  
2.35V  
1.9V  
1.2V  
2.47V  
1.9V  
V
CC  
0.8V  
UVLO*  
VRTC  
2.52V  
2.4V  
3.0V  
RESPWRON  
DCDCx_EN  
tNRESPWRON  
Ramp within  
800 μs  
V
DCDCx  
O
slope depending  
on load  
LDO_EN  
V
LDOx  
O
VSYSIN=VBACKUP=GND;  
VINLDO=V  
CC  
*... internal signal  
Figure 28. Power-Up and Power-Down Timing  
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Figure 29. DVS Timing  
SERIAL INTERFACE  
The serial interface is compatible with the standard and fast mode I2C specifications, allowing transfers at up to  
400 kHz. The interface adds flexibility to the power supply solution, enabling most functions to be programmed to  
new values depending on the instantaneous application requirements and charger status to be monitored.  
Register contents remain intact as long as VCC remains above 2 V. The TPS650231 has a 7-bit address:  
1001000, other addresses are available upon contact with the factory. Attempting to read data from the register  
addresses not listed in this section results in FFh being read out.  
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For normal data transfer, DATA is allowed to change only when CLK is low. Changes when CLK is high are  
reserved for indicating the start and stop conditions. During data transfer, the data line must remain stable  
whenever the clock line is high. There is one clock pulse per bit of data. Each data transfer is initiated with a start  
condition and terminated with a stop condition. When addressed, the TPS650231 device generates an  
acknowledge bit after the reception of each byte. The master device (microprocessor) must generate an extra  
clock pulse that is associated with the acknowledge bit. The TPS650231 device must pull down the DATA line  
during the acknowledge clock pulse so that the DATA line is a stable low during the high period of the  
acknowledge clock pulse. The DATA line is a stable low during the high period of the acknowledge–related clock  
pulse. Setup and hold times must be taken into account. During read operations, a master must signal the end of  
data to the slave by not generating an acknowledge bit on the last byte that was clocked out of the slave. In this  
case, the slave TPS650231 device must leave the data line high to enable the master to generate the stop  
condition  
DATA  
CLK  
Data Line  
Stable;  
Data Valid  
Change  
of Data  
Allowed  
Figure 30. Bit Transfer on the Serial Interface  
CE  
DATA  
CLK  
S
P
START Condition  
STOP Condition  
Figure 31. START and STOP Conditions  
SCLK  
SDAT  
A6  
A5  
A4  
A0  
ACK  
0
R7  
R6  
R5  
R0 ACK  
0
D7  
D6  
D5  
D0 ACK  
R/W  
0
0
Register Address  
Stop  
Start  
Slave Address  
Data  
Note: SLAVE = TPS650231  
Figure 32. Serial I/f WRITE to TPS650231 Device  
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SCLK  
SDAT  
A6  
A0  
R/W ACK  
R7  
R0 ACK  
0
A6  
A0  
R/W ACK  
D7  
D0 ACK  
0
0
1
0
Slave  
Drives  
the Data  
Stop  
Register  
Address  
Master  
Drives  
ACK and Stop  
Start  
Slave Address  
Slave Address  
Repeated  
Start  
Note: SLAVE = TPS650231  
Figure 33. Serial I/f READ from TPS650231: Protocol A  
SCLK  
SDA  
A6  
A0  
R/W ACK  
R7  
R0 ACK  
A6  
A0  
R/W ACK D7  
D0  
ACK  
0
0
0
1
0
Stop Start  
Stop  
Slave  
Drives  
the Data  
Register  
Address  
Master  
Drives  
ACK and Stop  
Start  
Slave Address  
Slave Address  
Note: SLAVE = TPS650231  
Figure 34. Serial I/f READ from TPS650231: Protocol B  
DATA  
t
(BUF)  
t
h(STA)  
t
(LOW)  
t
r
t
f
CLK  
t
t
t
(HIGH)  
su(STA)  
t
su(STO)  
h(STA)  
t
t
su(DATA)  
h(DATA)  
STO  
STA  
STA  
STO  
Figure 35. Serial I/f Timing Diagram  
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MIN MAX UNIT  
Operating conditions:  
VINDCDC1 = VINDCDC2 = VINDCDC3 = VCC = VINLDO = 2.5V to 5.5V,  
VBACKUP = 3.0V,  
TA = -40 °C to +85 °C  
fMAX  
Clock frequency  
400  
kHz  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
twH(HIGH)  
twL(LOW)  
tR  
Clock high time  
600  
Clock low time  
1300  
DATA and CLK rise time  
300  
300  
tF  
DATA and CLK fall time  
th(STA)  
tsu(DATA)  
th(DATA)  
tsu(DATA)  
tsu(STO)  
t(BUF)  
Hold time (repeated) START condition (after this period the first clock pulse is generated)  
600  
600  
Setup time for repeated START condition  
Data input hold time  
100  
Data input setup time  
100  
STOP condition setup time  
Bus free time  
600  
1300  
VERSION. Register Address: 00h (read only)  
VERSION  
B7  
B6  
B5  
B4  
B3  
B2  
B1  
B0  
Bit name and  
function  
0
0
1
0
0
0
1
1
Read/Write  
R
R
R
R
R
R
R
R
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PGOODZ. Register Address: 01h (read only)  
PGOODZ  
B7  
B6  
B5  
B4  
B3  
B2  
B1  
B0  
Bit name and  
function  
LOWBATTZ  
PGOODZ  
VDCDC1  
PGOODZ  
VDCDC2  
PGOODZ  
VDCDC3  
PGOODZ  
LDO2  
PGOODZ  
LDO1  
PWRFAILZ  
LOWBATT  
LOWBATTZ  
R
PGOODZ  
VDCDC1  
PGOODZ  
VDCDC2  
PGOODZ  
VDCDC3  
PGOODZ  
LDO2  
PGOODZ  
LDO1  
Set by signal  
PWRFAIL  
Default value  
loaded by:  
PGOOD  
VDCDC1  
PGOOD  
VDCDC2  
PGOOD  
VDCDC3  
PGOOD  
LDO2  
PGOOD  
LDO1  
PWRFAILZ  
R
Read/Write  
R
R
R
R
R
R
Bit 7 PWRFAILZ:  
0 = indicates that the PWRFAIL_SNS input voltage is above the 1-V threshold.  
1 = indicates that the PWRFAIL_SNS input voltage is below the 1-V threshold.  
Bit 6 LOWBATTZ:  
0 = indicates that the LOWBATT_SNS input voltage is above the 1-V threshold.  
1 = indicates that the LOWBATT_SNS input voltage is below the 1-V threshold.  
Bit 5 PGOODZ VDCDC1:  
0 = indicates that the VDCDC1 converter output voltage is within its nominal range. This bit is zero if  
the VDCDC1 converter is disabled.  
1 = indicates that the VDCDC1 converter output voltage is below its target regulation voltage  
Bit 4 PGOODZ VDCDC2:  
0 = indicates that the VDCDC2 converter output voltage is within its nominal range. This bit is zero if  
the VDCDC2 converter is disabled.  
1 = indicates that the VDCDC2 converter output voltage is below its target regulation voltage  
Bit 3 PGOODZ VDCDC3: .  
0 = indicates that the VDCDC3 converter output voltage is within its nominal range. This bit is zero if  
the VDCDC3 converter is disabled and during a DVM controlled output voltage transition  
1 = indicates that the VDCDC3 converter output voltage is below its target regulation voltage  
Bit 2 PGOODZ LDO2:  
0 = indicates that the LDO2 output voltage is within its nominal range. This bit is zero if LDO2 is  
disabled.  
1 = indicates that LDO2 output voltage is below its target regulation voltage  
Bit 1 PGOODZ LDO1  
0 = indicates that the LDO1 output voltage is within its nominal range. This bit is zero if LDO1 is  
disabled.  
1 = indicates that the LDO1 output voltage is below its target regulation voltage  
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MASK. Register Address: 02h (read/write)  
Default Value: C0h  
MASK  
B7  
B6  
B5  
B4  
B3  
B2  
B1  
B0  
Bit name and  
function  
MASK  
PWRFAILZ  
MASK  
LOWBATTZ  
MASK  
VDCDC1  
MASK  
VDCDC2  
MASK  
VDCDC3  
MASK  
LDO2  
MASK  
LDO1  
Default  
1
1
0
0
0
0
0
0
Default value  
loaded by:  
UVLO  
R/W  
UVLO  
R/W  
UVLO  
R/W  
UVLO  
R/W  
UVLO  
R/W  
UVLO  
R/W  
UVLO  
R/W  
Read/Write  
The MASK register can be used to mask particular fault conditions from appearing at the INT pin. MASK<n> = 1  
masks PGOODZ<n>.  
REG_CTRL. Register Address: 03h (read/write)  
Default Value: FFh  
The REG_CTRL register is used to disable or enable the power supplies via the serial interface. The contents of  
the register are logically AND’ed with the enable pins to determine the state of the supplies. A UVLO condition  
resets the REG_CTRL to 0xFF, so the state of the supplies defaults to the state of the enable pin. The  
REG_CTRL bits are automatically reset to default when the corresponding enable pin is low.  
REG_CTRL  
B7  
B6  
B5  
B4  
B3  
B2  
B1  
B0  
Bit name and  
function  
VDCDC1  
ENABLE  
VDCDC2  
ENABLE  
VDCDC3  
ENABLE  
LDO2  
ENABLE  
LDO1  
ENABLE  
Default  
1
1
1
1
1
1
1
1
Set by signal  
DCDC1_ENZ DCDC2_ENZ DCDC3_ENZ  
LDO_ENZ  
LDO_ENZ  
Default value  
loaded by:  
UVLO  
R/W  
UVLO  
R/W  
UVLO  
R/W  
UVLO  
R/W  
UVLO  
R/W  
Read/Write  
Bit 5 VDCDC1 ENABLE  
DCDC1 Enable. This bit is logically AND’ed with the state of the DCDC1_EN pin to turn on the DCDC1  
converter. Reset to 1 by a UVLO condition, the bit can be written to 0 or 1 via the serial interface. The  
bit is reset to 1 when the pin DCDC1_EN is pulled to GND, allowing DCDC1 to turn on when  
DCDC1_EN returns high.  
Bit 4 VDCDC2 ENABLE  
DCDC2 Enable. This bit is logically AND’ed with the state of the DCDC2_EN pin to turn on the DCDC2  
converter. Reset to 1 by a UVLO condition, the bit can be written to 0 or 1 via the serial interface. The  
bit is reset to 1 when the pin DCDC2_EN is pulled to GND, allowing DCDC2 to turn on when  
DCDC2_EN returns high.  
Bit 3 VDCDC3 ENABLE  
DCDC3 Enable. This bit is logically AND’ed with the state of the DCDC3_EN pin to turn on the DCDC3  
converter. Reset to 1 by a UVLO condition, the bit can be written to 0 or 1 via the serial interface. The  
bit is reset to 1 when the pin DCDC3_EN is pulled to GND, allowing DCDC3 to turn on when  
DCDC3_EN returns high.  
Bit 2 LDO2 ENABLE  
LDO2 Enable. This bit is logically AND’ed with the state of the LDO2_EN pin to turn on LDO2. Reset to  
1 by a UVLO condition, the bit can be written to 0 or 1 via the serial interface. The bit is reset to 1 when  
the pin LDO_EN is pulled to GND, allowing LDO2 to turn on when LDO_EN returns high.  
Bit 1 LDO1 ENABLE  
LDO1 Enable. This bit is logically AND’ed with the state of the LDO1_EN pin to turn on LDO1. Reset to  
1 by a UVLO condition, the bit can be written to 0 or 1 via the serial interface. The bit is reset to 1 when  
the pin LDO_EN is pulled to GND, allowing LDO1 to turn on when LDO_EN returns high.  
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CON_CTRL. Register Address: 04h (read/write)  
Default Value: B1h  
CON_CTRL  
B7  
B6  
B5  
B4  
B3  
B2  
B1  
B0  
Bit name and  
function  
DCDC2  
PHASE1  
DCDC2  
PHASE0  
DCDC3  
PHASE1  
DCDC3  
PHASE0  
LOW  
RIPPLE  
FPWM  
DCDC2  
FPWM  
DCDC1  
FPWM  
DCDC3  
Default  
1
0
1
1
0
0
0
0
Default value  
loaded by:  
UVLO  
R/W  
UVLO  
R/W  
UVLO  
R/W  
UVLO  
R/W  
UVLO  
R/W  
UVLO  
R/W  
UVLO  
R/W  
UVLO  
R/W  
Read/Write  
The CON_CTRL register is used to force any or all of the converters into forced PWM operation, when low  
output voltage ripple is vital. It is also used to control the phase shift between the three converters in order to  
minimize the input rms current, hence reduce the required input blocking capacitance. The DCDC1 converter is  
taken as the reference and consequently has a fixed zero phase shift.  
DCDC2 CONVERTER  
DELAYED BY  
DCDC3 CONVERTER  
DELAYED BY  
CON_CTRL<7:6>  
CON_CTRL<5:4>  
00  
01  
10  
11  
zero  
00  
01  
10  
11  
zero  
1/4 cycle  
1/2 cycle  
3/4 cycle  
1/4 cycle  
1/2 cycle  
3/4 cycle  
Bit 3 LOW RIPPLE:  
0 =  
1 =  
PFM mode operation optimized for high efficiency for all converters  
PFM mode operation optimized for low output voltage ripple for all converters  
Bit 2 FPWM DCDC2:  
0 =  
1 =  
DCDC2 converter operates in PWM / PFM mode  
DCDC2 converter is forced into fixed frequency PWM mode  
Bit 1 FPWM DCDC1:  
0 =  
1 =  
DCDC1 converter operates in PWM / PFM mode  
DCDC1 converter is forced into fixed frequency PWM mode  
Bit 0 FPWM DCDC3:  
0 =  
1 =  
DCDC3 converter operates in PWM / PFM mode  
DCDC3 converter is forced into fixed frequency PWM mode  
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CON_CTRL2. Register Address: 05h (read/write)  
Default Value: 40h  
CON_CTRL2  
B7  
GO  
0
B6  
B5  
B4  
B3  
B2  
B1  
B0  
Bit name and  
function  
Core adj  
allowed  
DCDC2  
discharge  
DCDC1  
discharge  
DCDC3  
discharge  
Default  
1
0
0
0
0
0
0
Default value  
loaded by:  
UVLO +  
DONE  
RESET(1)  
UVLO  
R/W  
UVLO  
R/W  
UVLO  
R/W  
Read/Write  
R/W  
R/W  
The CON_CTRL2 register can be used to take control the inductive converters.  
RESET(1): CON_CTRL2[6] is reset to its default value by one of these events:  
undervoltage lockout (UVLO)  
HOT_RESET pulled low  
RESPWRON active  
VRTC below threshold  
Bit 7  
GO:  
0 = no change in the output voltage for the DCDC1 converter  
1 = the output voltage of the DCDC1 converter is changed to the value defined in DEFCORE with  
the slew rate defined in DEFSLEW. This bit is automatically cleared when the DVM transition is  
complete. The transition is considered complete in this case when the desired output voltage  
code has been reached, not when the VDCDC1 output voltage is actually in regulation at the  
desired voltage.  
Bit 6  
CORE ADJ Allowed:  
0 = the output voltage is set with the I2C register  
1 = DEFDCDC1 is either connected to GND or VCC or an external voltage divider. When  
connected to GND or VCC, VDCDC1 defaults to 1.2 V or 1.6 V respectively at start-up  
Bit 2– 0 0 = the output capacitor of the associated converter is not actively discharged when the converter is  
disabled  
1 = the output capacitor of the associated converter is actively discharged when the converter is  
disabled. This decreases the fall time of the output voltage at light load  
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DEFCORE. Register Address: 06h (read/write  
Default Value: 14h/1Eh  
DEFCORE  
B7  
B6  
B5  
B4  
CORE4  
1
B3  
B2  
B1  
B0  
Bit name and  
function  
CORE3  
CORE2  
CORE1  
CORE0  
Default  
0
0
0
DEFDCDC1 DEFDCDC1 DEFDCDC1 DEFDCDC1  
Default value  
loaded by:  
RESET(1)  
R/W  
RESET(1)  
R/W  
RESET(1)  
R/W  
RESET(1)  
R/W  
RESET(1)  
R/W  
Read/Write  
RESET(1): DEFCORE is reset to its default value by one of these events:  
undervoltage lockout (UVLO)  
HOT_RESET pulled low  
RESPWRON active  
VRTC below threshold  
CORE4 CORE3 CORE2 CORE1 CORE0  
VDCDC1  
0.8 V  
CORE4  
CORE3  
CORE2  
CORE1 CORE0  
VDCDC1  
1.2 V  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0.825 V  
0.85 V  
0.875 V  
0.9 V  
1.225 V  
1.25 V  
1.275 V  
1.3 V  
0.925 V  
0.95 V  
0.975 V  
1 V  
1.325 V  
1.35 V  
1.375 V  
1.4 V  
1.025 V  
1.05 V  
1.075 V  
1.1 V  
1.425 V  
1.45 V  
1.475 V  
1.5 V  
1.125 V  
1.15 V  
1.175 V  
1.525 V  
1.55 V  
1.6 V  
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DEFSLEW. Register Address: 07h (read/write)  
Default Value: 06h  
DEFSLEW  
B7  
B6  
B5  
B4  
B3  
B2  
SLEW2  
1
B1  
SLEW1  
1
B0  
SLEW0  
0
Bit name and  
function  
Default  
Default value  
loaded by:  
UVLO  
R/W  
UVLO  
R/W  
UVLO  
R/W  
Read/Write  
SLEW2  
SLEW1  
SLEW0  
VDCDC1 SLEW RATE  
0.225 mV/ms  
0.45 mV/ms  
0.9 mV/ms  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
1.8 mV/ms  
3.6 mV/ms  
7.2 mV/ms  
14.4 mV/ms  
Immediate  
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LDO_CTRL. Register Address: 08h (read/write)  
Default Value: set with DEFLDO1 and DEFLDO2  
LDO_CTRL  
B7  
B6  
LDO2_2  
DEFLDOx  
UVLO  
B5  
LDO2_1  
DEFLDOx  
UVLO  
B4  
LDO2_0  
DEFLDOx  
UVLO  
B3  
B2  
LDO1_2  
DEFLDOx  
UVLO  
B1  
LDO1_1  
DEFLDOx  
UVLO  
B0  
LDO1_0  
DEFLDOx  
UVLO  
Bit name and  
function  
RSVD  
RSVD  
Default  
Default value  
loaded by:  
Read/Write  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
The LDO_CTRL registers can be used to set the output voltage of LDO1 and LDO2. LDO_CTRL[7] and  
LDO_CTRL[3] are reserved and should always be written to 0.  
The default voltage is set with DEFLDO1 and DEFLDO2 pins as described in Table 3.  
LDO2 OUTPUT  
VOLTAGE  
LDO1 OUTPUT  
VOLTAGE  
LDO2_2  
LDO2_1  
LDO2_0  
LDO1_2  
LDO1_1  
LDO1_0  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
1.05 V  
1.2 V  
1.3 V  
1.8 V  
2.5 V  
2.8 V  
3.0 V  
3.3 V  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
1 V  
1.1 V  
1.3 V  
2.1 V  
2.2 V  
2.6 V  
2.8 V  
3.15 V  
DESIGN PROCEDURE  
Inductor Selection for the DC-DC Converters  
Each of the converters in the TPS650231 typically use a 2.2 mH output inductor. Larger or smaller inductor  
values are used to optimize the performance of the device for specific operation conditions. The selected  
inductor has to be rated for its dc resistance and saturation current. The dc resistance of the inductance  
influences directly the efficiency of the converter. Therefore, an inductor with lowest dc resistance should be  
selected for highest efficiency.  
For a fast transient response, a 2.2-mH inductor in combination with a 22-mF output capacitor is recommended.  
Equation 4 calculates the maximum inductor current under static load conditions. The saturation current of the  
inductor should be rated higher than the maximum inductor current as calculated with Equation 4. This is needed  
because during heavy load transient the inductor current rises above the value calculated under Equation 4.  
Vout  
Vin  
1 *  
DI + Vout   
L
L   ƒ  
(4)  
(5)  
DI  
L
I
+ I  
)
outmax  
Lmax  
2
with:  
f = Switching Frequency (2.25 MHz typical)  
L = Inductor Value  
ΔIL = Peak-to-Peak inductor ripple current  
ILMAX = Maximum Inductor current  
The highest inductor current occurs at maximum Vin.  
Open core inductors have a soft saturation characteristic, and they can usually handle higher inductor currents  
versus a comparable shielded inductor.  
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A more conservative approach is to select the inductor current rating just for the maximum switch current of the  
TPS650231 (2 A for the VDCDC1 and VDCDC2 converters, and 1.5 A for the VDCDC3 converter). The core  
material from inductor to inductor differs and has an impact on the efficiency especially at high switching  
frequencies.  
See Table 4 and the typical applications for possible inductors.  
Table 4. Tested Inductors  
DEVICE  
INDUCTOR  
VALUE  
TYPE  
COMPONENT SUPPLIER  
2.2 mH  
2.2 mH  
2.2 mH  
2.2 mH  
1.5 mH  
LPS4012-222LMB  
VLCF4020T-2R2N1R7  
LQH32PN2R2NN0  
PSI25201T-2R2  
Coilcraft  
TDK  
All Converters  
Murata  
Cyntec  
Murata  
For DCDC2 or  
DCDC3  
For DCDC1  
LQH32PN1R5NN0  
Output Capacitor Selection  
The advanced Fast Response voltage mode control scheme of the inductive converters implemented in the  
TPS650231 allow the use of small ceramic capacitors with a typical value of 10 mF for each converter without  
having large output voltage under and overshoots during heavy load transients. Ceramic capacitors having low  
ESR values have the lowest output voltage ripple and are recommended. See Table 5 for recommended  
components.  
If ceramic output capacitors are used, the capacitor RMS ripple current rating always meets the application  
requirements. Just for completeness, the RMS ripple current is calculated as:  
V
out  
1 -  
V
1
in  
x
I
= V  
x
RMSCout  
out  
L x ¦  
2 x Ö3  
(6)  
At nominal load current, the inductive converters operate in PWM mode. The overall output voltage ripple is the  
sum of the voltage spike caused by the output capacitor ESR plus the voltage ripple caused by charging and  
discharging the output capacitor:  
V
out  
1 -  
V
in  
1
DV  
= V  
x
x
+ ESR  
out  
out  
(
)
L x ¦  
8 x C  
x ¦  
out  
(7)  
Where the highest output voltage ripple occurs at the highest input voltage Vin.  
At light load currents, the converters operate in PSM and the output voltage ripple is dependent on the output  
capacitor value. The output voltage ripple is set by the internal comparator delay and the external capacitor. The  
typical output voltage ripple is less than 1% of the nominal output voltage.  
Input Capacitor Selection  
Because of the nature of the buck converter having a pulsating input current, a low ESR input capacitor is  
required for best input voltage filtering and minimizing the interference with other circuits caused by high input  
voltage spikes. Each dc-dc converter requires a 10-mF ceramic input capacitor on its input pin VINDCDCx. The  
input capacitor is increased without any limit for better input voltage filtering. The VCC pin is separated from the  
input for the dc-dc converters. A filter resistor of up to 10R and a 1-mF capacitor is used for decoupling the VCC  
pin from switching noise. Note that the filter resistor may affect the UVLO threshold since up to 3 mA can flow via  
this resistor into the VCC pin when all converters are running in PWM mode.  
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Table 5. Possible Capacitors  
CAPACITOR VALUE  
CASE SIZE  
COMPONENT SUPPLIER  
TDK C2012X5R0J226MT  
Taiyo Yuden JMK212BJ226MG  
Taiyo Yuden JMK212BJ106M  
TDK C2012X5R0J106M  
COMMENTS  
Ceramic  
Ceramic  
Ceramic  
Ceramic  
Ceramic  
22 mF  
22mF  
0805  
0805  
0805  
0805  
0603  
10 mF  
10 mF  
10 mF  
Taiyo Yuden JMK107BJ106  
Output Voltage Selection  
The DEFDCDC1, DEFDCDC2 and DEFDCDC3 pins are used to set the output voltage for each step-down  
converter. For DEFDCDC1 and DEFDCDC3 there are default voltages defined when the pin is tied to a logic low  
or logic high signal. See Table 6for the default voltages if the pins are pulled to GND or to Vcc. If a different  
voltage is needed, an external resistor divider can be added to the DEFDCDCx pin as shown in Figure 36.  
The output voltage of VDCDC1 is set with the I2C interface. If the voltage is changed from the default, using the  
DEFCORE register, the output voltage only depends on the register value. Any resistor divider at DEFDCDC1  
will not change the voltage set with the register. It is not recommended to change the divider ratio of a resistor  
divider connected at DEFDCDC1 or DEFDCDC3 during operation as the internal logic may detect a logic high  
signal in error during the change from a high voltage to a lower voltage and will scale the output to the voltage  
defined by DEFDCDCx = HIGH. As DEFDCDC2 does not have these default fixed voltages, the resistor divider  
can be changed during operation.  
Table 6.  
PIN  
LEVEL  
VCC  
DEFAULT OUTPUT VOLTAGE  
1.6 V  
1.2 V  
3.3 V  
1.8 V  
DEFDCDC1  
GND  
VCC  
DEFDCDC3  
GND  
This function is not available on the DCDC2 converter. DEFDCDC2 always needs to be connected to a resistive  
divider as shown below.  
Using an external resistor divider at DEFDCDCx:  
1 Ω  
V
V
(bat)  
CC  
1 mF  
VDCDC3  
L3  
V
O
VINDCDC3  
DCDC3_EN  
L
C
I
C
O
R1  
R2  
DEFDCDC3  
AGND PGND  
Figure 36. External Resistor Divider  
When a resistor divider is connected to DEFDCDCx, the output voltage can be set from 0.6 V up to the input  
voltage V(bat). The total resistance (R1+R2) of the voltage divider should be kept in the 1-MΩ range in order to  
maintain a high efficiency at light load.  
V(DEFDCDCx) = 0.6 V  
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V
OUT  
R1 + R2  
R2  
V
= V  
x
- R2  
R1 = R2 x  
OUT  
DEFDCDCx  
(
)
V
DEFDCDCx  
(8)  
VRTC Output  
It is recommended that a 4.7-mF (minimum) capacitor be added to the VRTC pin.  
LDO1 and LDO2  
The LDOs in the TPS650231 are general-purpose LDOs which are stable using ceramics capacitors. The  
minimum output capacitor required is 2.2 mF. The LDOs output voltage can be changed to different voltages  
between 1 V and 3.3 V using the I2C interface. The supply voltage for the LDOs needs to be connected to the  
VINLDO pin, giving the flexibility to connect the lowest voltage available in the system and provides the highest  
efficiency.  
TRESPWRON  
This is the input to a capacitor that defines the reset delay time after the voltage at VRTC rises above 2.52 V.  
The timing is generated by charging and discharging the capacitor with a current of 2 mA between a threshold of  
0.25 V and 1 V for 128 cycles. A 1-nF capacitor gives a delay time of 100 ms.  
(1 V - 0.25 V) x C(reset)  
t(reset) = 2 x 128 x  
(
)
2 mA  
(9)  
Where:  
t(reset) is the reset delay time  
C(reset) is the capacitor connected to the TRESPWRON pin  
VCC-Filter  
An RC filter connected at the VCC input is used to keep noise from the internal supply for the bandgap and other  
analog circuitry. A typical value of 1 Ω and 1 mF is used to filter the switching spikes, generated by the dc-dc  
converters. A larger resistor than 10 Ω should not be used because the current into VCC of up to 3 mA causes a  
voltage drop at the resistor causing the undervoltage lockout circuitry connected at VCC internally to switch off  
too early.  
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APPLICATION INFORMATION  
Typical Configuration for the Texas Instruments® TMS320DM644x DaVinci Processors  
TPS650231  
Reset Condition of DCDC1  
If DEFDCDC1 is connected to ground and DCDC1_EN is pulled high after VINDCDC1 is applied, the output  
voltage of DCDC1 defaults to 1.225V instead of 1.2V (high by 2%). Figure 37 illustrates the problem.  
VCC/VINDCDC1  
DCDC1_EN  
1.225 V  
1.225 V  
1.225 V  
VDCDC1  
Figure 37. Default DCDC1  
Workaround 1: Tie DCDC1_EN to VINDCDC1 (Figure 38)  
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VCC/VINDCDC1  
DCDC1_EN  
1.20 V  
1.20 V  
1.20 V  
VDCDC1  
Figure 38. Workaround 1  
Workaround 2: Write the correct voltage to the DEF_CORE register via I2C. This can be done before or after the  
converter is enabled. If written before the enable, the only bit changed is DEF_CORE[0]. The voltage will be  
1.2V, however, when the enable is pulled high (Figure 39).  
VCC/VINDCDC1  
DCDC1_EN  
I2C Bus  
DEF_CORE  
VDCDC1  
??  
??  
0x1F  
0x1F 0x1E  
0x10  
0x11  
1.225 V  
0x10  
1.20 V  
1.20 V  
Write DEF_CORE to 0x10  
Pull DCDC1_EN High  
Pull DCDC1_EN High  
Write DEF_CORE to 0x10  
Write CON_CTRL [7] to 1  
Figure 39. Workaround 2  
Workaround 3: Generate a HOT_RESET after enabling DCDC1 (Figure 40)  
VCC/VINDCDC1  
DCDC1_EN  
HOT_RESET  
1.225 V  
1.20 V  
1.225 V  
1.20 V  
VDCDC1  
Figure 40. Workaround 3  
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DIFFERENCES OF TPS650231 VERSUS TPS65023 and TPS65023B  
ITEM  
DESCRIPTION  
TPS65023  
TPS65023B  
TPS650231  
Minimum 1.65V;  
Vcc = 2.5V to 5.25V  
Minimum 1.65V;  
Vcc = 2.5V to 5.25V  
VIH  
High level input voltage for the SDAT pin  
Minimum 1.3V  
Minimum 1.4V,  
Vcc = 2.5V to 5.25V  
Minimum 1.4V,  
Vcc = 2.5V to 5.25V  
VIH  
VIL  
High level input voltage for the SCLK pin  
Minimum 1.3V  
Maximum 0.4V  
Low level input voltage for SCLK and  
SDAT pin  
Maximum 0.35V  
Maximum 0.35V  
th(DATA)  
Data input hold time  
Minimum 300ns  
Minimum 300ns  
1.8V  
Minimum 100ns  
Minimum 100ns  
1.8V  
Minimum 100ns  
Minimum 100ns  
2.1V  
tsu(DATA)  
Data input setup time  
LDO1 voltage for setting LDO1_[2..0] = 011  
1) DEFDCDC2=LOW:  
Vo=1.8V  
2) DEFDCDC2=HIGH:  
Vo=3.3V  
1) DEFDCDC2=LOW:  
Vo=1.8V  
2)DEFDCDC2=HIGH:  
Vo=3.3V  
0.6V feedback input only  
(allows voltage scaling  
with external resistor  
divider without  
DEFDCDC2 pin functionality  
3) 0.6V feedback input  
3)0.6V feedback input  
restrictions)  
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PACKAGE OPTION ADDENDUM  
www.ti.com  
4-Sep-2010  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
TPS650231RSBR  
TPS650231RSBT  
TPS650231YFFR  
TPS650231YFFT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
WQFN  
WQFN  
DSBGA  
DSBGA  
RSB  
RSB  
YFF  
YFF  
40  
40  
49  
49  
3000  
250  
Green (RoHS  
& no Sb/Br)  
Call TI  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Purchase Samples  
Green (RoHS  
& no Sb/Br)  
Call TI  
Request Free Samples  
Purchase Samples  
3000  
250  
Green (RoHS  
& no Sb/Br)  
SNAGCU Level-1-260C-UNLIM  
SNAGCU Level-1-260C-UNLIM  
Green (RoHS  
& no Sb/Br)  
Request Free Samples  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
8-Sep-2010  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
TPS650231RSBR  
TPS650231RSBT  
TPS650231YFFR  
TPS650231YFFT  
WQFN  
WQFN  
DSBGA  
DSBGA  
RSB  
RSB  
YFF  
YFF  
40  
40  
49  
49  
3000  
250  
330.0  
330.0  
180.0  
180.0  
12.4  
12.4  
8.4  
5.25  
5.25  
3.3  
5.25  
5.25  
3.3  
1.1  
1.1  
8.0  
8.0  
4.0  
4.0  
12.0  
12.0  
8.0  
Q2  
Q2  
Q1  
Q1  
3000  
250  
0.75  
0.75  
8.4  
3.3  
3.3  
8.0  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
8-Sep-2010  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
TPS650231RSBR  
TPS650231RSBT  
TPS650231YFFR  
TPS650231YFFT  
WQFN  
WQFN  
DSBGA  
DSBGA  
RSB  
RSB  
YFF  
YFF  
40  
40  
49  
49  
3000  
250  
340.5  
340.5  
190.5  
190.5  
338.1  
338.1  
212.7  
212.7  
20.6  
20.6  
31.8  
31.8  
3000  
250  
Pack Materials-Page 2  
X: Max = 3132 µm, Min = 3032 µm  
Y: Max = 3116 µm, Min = 3016 µm  
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相关型号:

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