TPS650330-Q1 [TI]
TPS650330-Q1 Automotive Camera PMIC;型号: | TPS650330-Q1 |
厂家: | TEXAS INSTRUMENTS |
描述: | TPS650330-Q1 Automotive Camera PMIC 集成电源管理电路 |
文件: | 总9页 (文件大小:1150K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Support &
Community
Product
Folder
Order
Now
Tools &
Software
Technical
Documents
TPS650330-Q1
SLVSF40 –APRIL 2019
TPS650330-Q1 Automotive Camera PMIC
1 Device Overview
1.1 Features
1
– Spread-Spectrum Clock (SSC) generation for
reduced EMI
– 2.3-MHz Forced fixed switching frequency PWM
operation
• Qualified for automotive applications
• AEC-Q100 grade 1 qualified
– -40°C to +125°C ambient operating temperature
range
• Three step-down converters:
• One low dropout (LDO) regulator:
– VIN range from 3.0 V to 5.5 V
– Low noise
– BUCK1 VIN range from 4 V to 18.3 V
– BUCK1 output current up to 1500-mA
– BUCK2 and BUCK3 VIN range from 3.0 V to 5.5
V
– Adjustable output voltage via I2C
– Up to 300-mA output current
• 4.0-mm × 4.0-mm 24-Pin VQFN with wettable
flanks
– BUCK2 and BUCK3 output current up to 1200-
mA
1.2 Applications
•
Automotive camera modules
–
–
–
–
–
Surround view camera modules
Rear view camera modules
Driver monitor camera modules
Power over coax (POC) camera modules
E-Mirror camera modules
1.3 Description
The TPS650330-Q1 device is a highly integrated power management IC for automotive camera modules.
This device combines three step down converters and one low-dropout (LDO) regulator. The BUCK1 step-
down converter has an input voltage range up to 18.3 V for connections to Power over Coax (PoC). All
converters operate in a forced fixed-frequency PWM mode. The LDO can supply 300 mA and operate with
an input voltage range from 3.0 V to 5.5 V. The step-down converters and the LDO have separate voltage
inputs that enable maximum design and sequencing flexibility.
The TPS650330-Q1 is available in a 24-pin VQFN package (4.0 mm × 4.0 mm).
Table 1-1. Device Information(1)
PART NUMBER
TPS650330-Q1
PACKAGE
BODY SIZE (NOM)
4.0 mm × 4.0 mm
VQFN (24)
(1) For all available packages, see the orderable addendum at the end of the data sheet.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCT PREVIEW Information. Product in design phase of
development. Subject to change or discontinuance without notice.
TPS650330-Q1
SLVSF40 –APRIL 2019
www.ti.com
1.4 Application Circuit
VIN = 4V to 18.3V
BUCK1
(1.5 A)
3.3 V
MCU
(Optional)
BUCK2
1.8 V
Serializer
(1200 mA)
Camera PMIC
BUCK3
1.2 V
Camera
Sensor
Module
(1200 mA)
2.8 V
LDO
(300 mA)
I2C
SLAVE
Figure 1-1. TPS650330-Q1 Application Circuit
2
Device Overview
Copyright © 2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: TPS650330-Q1
TPS650330-Q1
www.ti.com
SLVSF40 –APRIL 2019
Table of Contents
1
2
Device Overview ......................................... 1
3
Device and Documentation Support................. 5
1.1 Features .............................................. 1
1.2 Applications........................................... 1
1.3 Description............................................ 1
1.4 Application Circuit .................................... 2
Revision History ......................................... 4
3.1
Receiving Notification of Documentation Updates ... 5
3.2 Community Resources ............................... 5
3.3 Trademarks ........................................... 5
3.4 Electrostatic Discharge Caution ...................... 5
3.5 Glossary .............................................. 5
Copyright © 2019, Texas Instruments Incorporated
Table of Contents
3
Submit Documentation Feedback
Product Folder Links: TPS650330-Q1
TPS650330-Q1
SLVSF40 –APRIL 2019
www.ti.com
2 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
DATE
REVISION
NOTES
November 2017
*
Initial Release
4
Revision History
Copyright © 2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: TPS650330-Q1
TPS650330-Q1
www.ti.com
SLVSF40 –APRIL 2019
3 Device and Documentation Support
3.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the
upper right corner, click on Alert me to register and receive a weekly digest of any product information that
has changed. For change details, review the revision history included in any revised document.
3.2 Community Resources
3.2.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES
NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR
SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR
SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
3.3 Trademarks
All trademarks are the property of their respective owners.
3.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
3.5 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
Copyright © 2019, Texas Instruments Incorporated
Device and Documentation Support
5
Submit Documentation Feedback
Product Folder Links: TPS650330-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Aug-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
PTPS65033000RGERQ1
ACTIVE
VQFN
RGE
24
3000
TBD
Call TI
Call TI
-40 to 125
TPS65033000QRGERQ1
TPS65033000QRGETQ1
PREVIEW
PREVIEW
VQFN
VQFN
RGE
RGE
24
24
3000
250
TBD
TBD
Call TI
Call TI
Call TI
Call TI
-40 to 125
-40 to 125
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Aug-2020
Addendum-Page 2
GENERIC PACKAGE VIEW
RGE 24
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
Images above are just a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4204104/H
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third
party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,
damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable
warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2020, Texas Instruments Incorporated
相关型号:
©2020 ICPDF网 联系我们和版权申明