TPS65266-1RHBR [TI]
2.7V 至 6.5V 输入、3A/2A/2A 三路降压转换器 | RHB | 32 | -40 to 85;型号: | TPS65266-1RHBR |
厂家: | TEXAS INSTRUMENTS |
描述: | 2.7V 至 6.5V 输入、3A/2A/2A 三路降压转换器 | RHB | 32 | -40 to 85 转换器 |
文件: | 总41页 (文件大小:2743K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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TPS65266-1
ZHCSFL3 –OCTOBER 2016
TPS65266-1 2.7V 至 6V 输入电压、3A/2A/2A 输出电流三路同步
降压转换器
1 特性
其中的 DC/DC 降压转换器集成了功率 MOSFET,用
于优化功率效率并减少外部使用的元件数量。峰值电流
模式简化了补偿并提供快速瞬态响应。高时钟频率允许
采用更小的低值电感和电容。外部补偿可支持优化环路
补偿并提供快速瞬态响应。轻载条件下,PSM 模式的
降压转换器可减少提供给系统的输入功率。出现短路或
过载故障条件时,断续模式周期性限流功能可限制
MOSFET 功耗。
1
•
工作输入电压范围:2.7V 至 6V
反馈基准电压 0.6V ± 1%
最大持续输出电流 3A/2A/2A
专用使能和软启动
•
•
•
•
•
•
•
•
•
•
支持使能引脚放电,可精确控制启动时间
轻载条件下的脉冲跳跃模式 (PSM)
断续模式下的周期性限流过载保护
可调时钟频率范围为 250kHz 至 2.4MHz
外部时钟同步
TPS65266-1 配有 电源正常监控电路,用于监视所有
转换器输出。各通道的输出电压稳压并完成排序
后,PGOOD 引脚将被置为有效。
电源正常指示器
过热保护
如果降压转换器因连续严重过载或短路导致功耗增加,
内部热保护电路将关断器件,防止器件受损。器件充分
冷却后,将自动从热关断状态中恢复。
2 应用
•
•
•
•
•
打印机和扫描仪
数字电视
器件信息(1)
机顶盒
器件型号
TPS65266-1
封装
VQFN (32)
封装尺寸(标称值)
家庭网关和接入点网络
安全监控
5.00mm x 5.00mm
(1) 要了解所有可用封装,请见数据表末尾的可订购产品附录。
3 说明
TPS65266-1 整合了 3 通道的高效同步降压转换器,
适用于 由输入电压低于 6V 的适配器或电池供电运行
的应用。
空白
简化应用电路原理图
效率与输出负载之间的关系
Vout1
Vin
VINx
LX1
100%
90%
80%
70%
60%
50%
40%
30%
20%
TPS65266-1
FB1
LX2
VINQ
Vout2
Vout3
PGOOD
ENx
FB2
LX3
SSx
ROSC
AGND
FB3
PGND
VOUT = 1.5 V
VOUT = 2.5 V
10%
0
Copyright © 2016, Texas Instruments Incorporated
0
0.5
1
1.5
2
2.5
3
Output Load (A)
D001
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SLVSDA6
TPS65266-1
ZHCSFL3 –OCTOBER 2016
www.ti.com.cn
目录
7.4 Device Functional Modes........................................ 22
Application and Implementation ........................ 23
8.1 Application Information............................................ 23
8.2 Typical Application ................................................. 23
Power Supply Recommendations...................... 31
1
2
3
4
5
6
特性.......................................................................... 1
8
9
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 5
6.1 Absolute Maximum Ratings ...................................... 5
6.2 ESD Ratings.............................................................. 5
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information.................................................. 5
6.5 Electrical Characteristics........................................... 6
6.6 Timing Requirements................................................ 7
6.7 Typical Characteristics.............................................. 8
Detailed Description ............................................ 12
7.1 Overview ................................................................. 12
7.2 Functional Block Diagram ....................................... 13
7.3 Feature Description................................................. 13
10 Layout................................................................... 31
10.1 Layout Guidelines ................................................. 31
10.2 Layout Example .................................................... 32
11 器件和文档支持 ..................................................... 33
11.1 器件支持 ............................................................... 33
11.2 接收文档更新通知 ................................................. 33
11.3 社区资源................................................................ 33
11.4 商标....................................................................... 33
11.5 静电放电警告......................................................... 33
11.6 Glossary................................................................ 33
12 机械、封装和可订购信息....................................... 33
7
4 修订历史记录
日期
修订版本
注释
2016 年 10 月
*
最初发布版本。
2
Copyright © 2016, Texas Instruments Incorporated
TPS65266-1
www.ti.com.cn
ZHCSFL3 –OCTOBER 2016
5 Pin Configuration and Functions
RHB PACKAGE
32-Pin (VQFN)
Top View
BST1 25
LX1 26
16 BST3
15 LX3
PGND1 27
VIN1 28
EN1 29
14 PGND3
13 VIN3
12 VIN2
11 PGND2
10 LX2
Thermal
Pad
EN2 30
EN3 31
GND 32
9
BST2
A. There is no electric signal down bonded to thermal pad inside IC. Exposed thermal pad must be soldered to PCB for
optimal thermal performance.
Pin Functions
PIN
DESCRIPTION
NO.
1
NAME
AGND
AGND
AGND
Analog ground pin
Analog ground pin
Analog ground pin
2
3
An open-drain output; asserts low if output voltage of bucks beyond regulation range due to thermal shutdown, over-
current, under-voltage, or ENx low.
4
PGOOD
Input voltage of converter controller and reference power supply bias. TI recommends to connect a 1-µF capacitor
from the pin to analog ground and put the capacitor as near as possible to this pin.
5
6
7
VINQ
FB2
Feedback Kelvin sensing pin for buck2 output voltage. Connect this pin to buck2 feedback resistor divider.
Error amplifier output and loop compensation pin for buck2. Connect a series resistor and capacitor to compensate
the control loop of buck converter 2 with peak current PWM mode.
COMP2
Soft-start and tracking input for buck2 converter. An internal 5.5-µA pullup current source is connected to this pin.
The soft-start time of buck2 can be programmed by connecting a capacitor between this pin and ground.
8
9
SS2
Boot strapped supply to the high-side floating gate driver in buck2 converter. Connect a capacitor (47 nF
recommended) from BST2 pin to LX2 pin.
BST2
LX2
Switching node connection to the inductor and bootstrap capacitor for buck2 converter. The voltage swing at this pin
is from a diode voltage below the ground up to VIN2 voltage.
10
11
Power ground connection of buck2. Connect PGND2 pin as close as practical to the (–) terminal of VIN2 input
ceramic capacitor.
PGND2
Copyright © 2016, Texas Instruments Incorporated
3
TPS65266-1
ZHCSFL3 –OCTOBER 2016
www.ti.com.cn
Pin Functions (continued)
PIN
DESCRIPTION
NO.
NAME
Input power supply for buck2. Connect VIN2 pin as close as practical to the (+) terminal of an input ceramic capacitor
(10 µF suggested).
12
VIN2
Input power supply for buck3. Connect VIN3 pin as close as practical to the (+) terminal of an input ceramic capacitor
(10 µF suggested).
13
14
15
16
17
18
VIN3
Power ground connection of buck3. Connect PGND3 pin as close as practical to the (–) terminal of VIN3 input
ceramic capacitor.
PGND3
LX3
Switching node connection to the inductor and bootstrap capacitor for buck3 converter. The voltage swing at this pin
is from a diode voltage below the ground up to VIN3 voltage.
Boot strapped supply to the high-side floating gate driver in buck3 converter. Connect a capacitor (47 nF
recommended) from BST3 pin to LX3 pin.
BST3
SS3
Soft-start and tracking input for buck3 converter. An internal 5.5-µA pullup current source is connected to this pin.
The soft-start time of buck3 can be programmed by connecting a capacitor between this pin and ground.
Error amplifier output and loop compensation pin for buck3. Connect a series resistor and capacitor to compensate
the control loop of buck converter 3 with peak current PWM mode.
COMP3
19
20
FB3
Feedback Kelvin sensing pin for buck3 output voltage. Connect this pin to buck3 feedback resistor divider.
Oscillator frequency programmable pin. Connect an external resistor to set the switching frequency.
ROSC
Analog ground common to buck controllers and other analog circuits. It must be routed separately from high-current
power grounds to the (–) terminal of bypass capacitor of input voltage VINQ.
21
22
23
AGND
FB1
Feedback Kelvin sensing pin for buck1 output voltage. Connect this pin to buck1 feedback resistor divider.
Error amplifier output and loop compensation pin for buck1. Connect a series resistor and capacitor to compensate
the control loop of buck converter 1 with peak current PWM mode.
COMP1
Soft-start and tracking input for buck1 converter. An internal 5.5-µA pullup current source is connected to this pin.
The soft-start time of buck1 can be programmed by connecting a capacitor between this pin and ground.
24
25
26
27
28
29
30
SS1
Boot strapped supply to the high-side floating gate driver in buck1 converter. Connect a capacitor (47 nF
recommended) from BST1 pin to LX1 pin.
BST1
LX1
Switching node connection to the inductor and bootstrap capacitor for buck1 converter. The voltage swing at this pin
is from a diode voltage below the ground up to VIN1 voltage.
Power ground connection of buck1. Connect PGND1 pin as close as practical to the (–) terminal of VIN1 input
ceramic capacitor.
PGND1
VIN1
EN1
Input power supply for buck1. Connect VIN1 pin as close as practical to the (+) terminal of an input ceramic capacitor
(suggest 10 µF).
Enable for buck1 converter. Float to enable. Can use this pin to adjust the input undervoltage lockup of buck1 with
resistors divider.
Enable for buck2 converter. Float to enable. Can use this pin to adjust the input undervoltage lockup of buck2 with
resistors divider.
EN2
Enable for buck3 converter. Float to enable. Can use this pin to adjust the input undervoltage lockup of buck3 with
resistors divider.
31
32
—
EN3
GND
Ground pin
Thermal
PAD
No electric connection to any signal. Soldered to the ground in PCB for better thermal performance.
4
Copyright © 2016, Texas Instruments Incorporated
TPS65266-1
www.ti.com.cn
ZHCSFL3 –OCTOBER 2016
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature (unless otherwise noted)
(1)
MIN
–0.3
–1.0
–0.3
–0.3
–0.3
–0.3
–30
MAX
7
UNIT
VIN1, VIN2, VIN3, VINQ
LX1, LX2, LX3 (maximum withstand voltage transient <20 ns)
BST1, BST2, BST3 referenced to LX1, LX2, LX3 pins respectively
EN1, EN2, EN3, PGOOD
7
7
Voltage at
V
7
FB1, FB2, FB3, COMP1 , COMP2, COMP3, SS1, SS2, SS3, ROSC
AGND, PGND1, PGND2, PGND3
3.6
0.3
125
150
TJ
Operating junction temperature
°C
°C
Tstg
Storage temperature
–55
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
±2000
±500
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2)
Electrostatic
discharge
V(ESD)
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX UNIT
VIN1, VIN2, VIN3, VINQ
2.7
–0.8
–0.1
–0.1
–0.1
–30
6
6
LX1, LX2, LX3 (maximum withstand voltage transient <20 ns)
BST1, BST2, BST3 referenced to LX1, LX2, LX3 pins respectively
EN1, EN2, EN3, PGOOD
Voltage at
6
6
V
FB1, FB2, FB3, COMP1 , COMP2, COMP3, SS1, SS2, SS3, ROSC
Operating junction temperature
3
TJ
125
°C
6.4 Thermal Information
TPS65266-1
THERMAL METRIC(1)
RHB
UNIT
32-PIN VQFN
RθJA
Junction-to-ambient thermal resistance
34.2
27.5
8.3
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
0.4
ψJB
8.3
RθJC(bot)
2.8
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Copyright © 2016, Texas Instruments Incorporated
5
TPS65266-1
ZHCSFL3 –OCTOBER 2016
www.ti.com.cn
6.5 Electrical Characteristics
TJ = –30°C to 125°C, VIN= 5 V, typical values are at TJ = 25°C, (unless otherwise noted)
PARAMETER
INPUT SUPPLY VOLTAGE
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VIN
Input voltage range
2.7
2.35
2.15
6
2.6
V
V
VIN rising
2.45
2.25
9
UVLO
VIN undervoltage lockout
Shutdown supply current
VIN falling
2.37
V
IDD(SDN)
EN1 = EN2 = EN3 = 0 V
µA
EN1 = EN2 = EN3 = 5 V,
FB1 = FB2 = FB3 = 0.8 V
IDD(Q_NSW)
790
340
340
340
µA
µA
µA
µA
EN1 = 5 V, EN2 = EN3 = 0 V,
FB1 = 0.8 V
IDD(Q_NSW1)
IDD(Q_NSW2)
IDD(Q_NSW3)
Input quiescent current without
buck1/2/3 switching
EN2 = 5 V, EN1 = EN3 = 0 V,
FB2 = 0.8 V
EN3 = 5 V, EN1 = EN2 = 0 V,
FB3 = 0.8 V
BUCK1, BUCK2, BUCK3
VFB
Feedback voltage
VCOMP = 1.2 V
0.594
0.6
1.2
0.606
1.26
V
V
VEN(XH)
VEN(XL)
IEN(X1)
IEN(X2)
IEN(hys)
ISSX
EN1/2/3 high-level input voltage
EN1/2/3 low-level input voltage
EN1/2/3 pullup current
1.1
1.7
1.15
2.1
V
ENx = 1 V
2.5
6.5
µA
µA
µA
µA
EN1/2/3 pullup current
ENx = 1.3 V
5.3
Hysteresis current
3.2
Soft-start charging current
COMP1/2/3 voltage to inductor current
4.5
5.5
G(m_PS1/2/3)
ILX = 0.5 A
10
A/V
A
(1)
Gm
I(LIMIT1)
Buck1 peak inductor current limit
Buck1 low-side sink current limit
Buck2/3 peak inductor current limit
Buck2/3 low-side sink current limit
Buck1 high-side switch resistance(2)
Buck1 low-side switch resistance(2)
Buck2 high-side switch resistance(2)
Buck2 low-side switch resistance(2)
Buck3 high-side switch resistance(2)
Buck3 low-side switch resistance(2)
3.55
2.35
4.6
1.4
3.1
1.2
45
50
60
60
60
60
5.6
3.7
I(LIMITSINK1)
I(LIMIT2/3)
A
I(LIMITSINK2/3)
Rds(on)_HS1
Rds(on)_LS1
Rds(on)_HS2
Rds(on)_LS2
Rds(on)_HS3
Rds(on)_LS3
POWER GOOD
A
VINQ = 5 V
VINQ = 5 V
VINQ = 5 V
VINQ = 5 V
VINQ = 5 V
VINQ = 5 V
mΩ
mΩ
mΩ
mΩ
mΩ
mΩ
FBx undervoltage falling
FBx undervoltage rising
92.5
95
%VREF
%VREF
µA
V(th_PG)
Feedback voltage threshold
IPG
PGOOD pin leakage
1
V(LOW_PG)
PGOOD pin low voltage
I(SINK) = 1 mA
0.4
V
(1) Lab validation result
(2) Typical value without bonding wires; from design simulation
6
Copyright © 2016, Texas Instruments Incorporated
TPS65266-1
www.ti.com.cn
ZHCSFL3 –OCTOBER 2016
Electrical Characteristics (continued)
TJ = –30°C to 125°C, VIN= 5 V, typical values are at TJ = 25°C, (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
OSCILLATOR
FSW
Switching frequency
R(OSC) = 51.1 kΩ
920
250
250
1000
1080
2400
2400
2
kHz
kHz
kHz
V
FSW(range)
F(SYNC)
F(SYNC_HI)
V(SYNC_LO)
Switching frequency
Clock sync frequency range
Clock sync high threshold
Clock sync low threshold
0.4
V
THERMAL PROTECTION
(1)
T(TRIP_OTP)
Temperature rising
Hysteresis
160
20
°C
°C
Thermal protection trip point
(1)
T(HYST_OTP)
6.6 Timing Requirements
MIN
NOM
MAX
UNIT
BUCK1, BUCK2, BUCK3
tON_MIN
Minimum on-time
80
115
ns
Gm_EA
Error amplifier transconductance
–2 µA < I(COMPX) < 2 µA
290
µS
HICCUP TIMING
tHiccup_wait
Overcurrent wait time(1)
Hiccup time before restart(1)
512
cycles
cycles
tHiccup_re
16382
POWER GOOD
tDEGLITCH(PG)_F
PGOOD falling edge deglitch time
128
cycles
cycles
tRDEGLITCH(PG)_R PGOOD rising edge deglitch time
16350
OSCILLATOR
tSYNC_w
Clock sync minimum pulse duration
80
ns
(1) Lab validation result
Copyright © 2016, Texas Instruments Incorporated
7
TPS65266-1
ZHCSFL3 –OCTOBER 2016
www.ti.com.cn
6.7 Typical Characteristics
TA = 25°C, VIN = 5 V, VOUT1 = 1.0 V, VOUT2 = 1.5 V, VOUT3 = 1.8 V FSW = 1 MHz (unless otherwise noted)
100%
90%
80%
70%
60%
50%
40%
30%
20%
10%
0
100%
90%
80%
70%
60%
50%
40%
30%
20%
10%
0
VOUT = 1 V
VOUT = 1.5 V
VOUT = 2.5 V
VOUT = 1 V
VOUT = 1.5 V
VOUT = 2.5 V
0.01
0.1
1
3
0.01
0.1
1
2
Output Load (A)
Output Load (A)
D002
D003
Figure 1. Buck1 Efficiency
Figure 2. Buck2 Efficiency
100%
90%
80%
70%
60%
50%
40%
30%
20%
10%
0
1.1
1.05
1
0.95
0.9
VOUT = 1 V
VOUT = 1.5 V
VOUT = 2.5 V
0.01
0.1
1
2
0
0.5
1
1.5
2
2.5
3
Output Load (A)
Output Load (A)
D004
D004
Figure 3. Buck3 Efficiency
Figure 4. Buck1, Load Regulation
1.6
1.55
1.5
1.9
1.85
1.8
1.45
1.4
1.75
1.7
0
0.5
1
1.5
2
0
0.5
1
1.5
2
Output Load (A)
Output Load (A)
D005
D006
Figure 5. Buck2, Load Regulation
Figure 6. Buck3, Load Regulation
8
Copyright © 2016, Texas Instruments Incorporated
TPS65266-1
www.ti.com.cn
ZHCSFL3 –OCTOBER 2016
Typical Characteristics (continued)
TA = 25°C, VIN = 5 V, VOUT1 = 1.0 V, VOUT2 = 1.5 V, VOUT3 = 1.8 V FSW = 1 MHz (unless otherwise noted)
1.08
1.04
1
1.65
IOUT 0.1 A
IOUT 1.5 A
IOUT 3 A
IOUT 0.1A
IOUT 1.0A
IOUT 2A
1.6
1.55
1.5
0.96
1.45
0.92
1.4
2.5
3
3.5
4
4.5
5
5.5
6
2.5
3
3.5
4
4.5
5
5.5
6
Input Voltage (V)
Input Voltage (V)
D007
D008
Figure 7. Buck1, Line Regulation
Figure 8. Buck2, Line Regulation
1.9
1.85
1.8
0.606
0.604
0.602
0.6
IOUT 0.1 A
IOUT 1.0 A
IOUT 2 A
0.598
0.596
0.594
1.75
1.7
2.5
3
3.5
4
4.5
5
5.5
6
-30
-10
10
30
50
70
90
110
130
Input Voltage (V)
Junction Temperature, TJ (°C)
D009
D010
Figure 9. Buck3, Line Regulation
Figure 10. Voltage Reference vs Temperature
1040
1020
1000
980
15
13
11
9
7
960
5
-30
-10
10
30
50
70
90
110
130
-30
-10
10
30
50
70
90
110
130
Junction Temperature, TJ (°C)
Junction Temperature, TJ (°C)
D011
D012
ROSC = 51.1 kΩ
VIN = 5 V
Figure 11. Oscillator Frequency vs Temperature
Figure 12. Shutdown Quiescent Current vs Temperature
Copyright © 2016, Texas Instruments Incorporated
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TPS65266-1
ZHCSFL3 –OCTOBER 2016
www.ti.com.cn
Typical Characteristics (continued)
TA = 25°C, VIN = 5 V, VOUT1 = 1.0 V, VOUT2 = 1.5 V, VOUT3 = 1.8 V FSW = 1 MHz (unless otherwise noted)
2.3
2.2
2.1
2
5.6
5.5
5.4
5.3
5.2
5.1
1.9
-30
-10
10
30
50
70
90
110
130
-30
-10
10
30
50
70
90
110
130
Junction Temperature, TJ (°C)
Junction Temperature, TJ (°C)
D013
D014
VIN = 5 V
EN = 1 V
VIN = 5 V
EN = 1.3 V
Figure 13. EN Pin Pullup Current vs Temperature, EN = 1 V
Figure 14. EN Pin Pullup Current vs Temperature, EN = 1.3 V
1.28
1.23
1.24
1.2
1.19
1.15
1.11
1.07
1.16
1.12
-30
-10
10
30
50
70
90
110
130
-30
-10
10
30
50
70
90
110
130
Junction Temperature, TJ (°C)
Junction Temperature, TJ (°C)
D015
D016
VIN = 5 V
VIN = 5 V
Figure 15. EN Pin Threshold Rising vs Temperature
Figure 16. EN Pin Threshold Falling vs Temperature
6
5.8
5.6
5.4
5.2
5
5
4.8
4.6
4.4
4.2
4
-30
-10
10
30
50
70
90
110
130
-30
-10
10
30
50
70
90
110
130
Junction Temperature, TJ (°C)
Junction Temperature, TJ (°C)
D017
D018
VIN = 5 V
VIN = 5 V
Figure 17. SS Pin Charge Current vs Temperature
Figure 18. Buck1 High-Side Current Limit vs Temperature
10
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ZHCSFL3 –OCTOBER 2016
Typical Characteristics (continued)
TA = 25°C, VIN = 5 V, VOUT1 = 1.0 V, VOUT2 = 1.5 V, VOUT3 = 1.8 V FSW = 1 MHz (unless otherwise noted)
3.5
3.3
3.1
2.9
2.7
3.5
3.3
3.1
2.9
2.7
-30
-10
10
30
50
70
90
110
130
-30
-10
10
30
50
70
90
110
130
Junction Temperature, TJ (°C)
Junction Temperature, TJ (°C)
D019
D020
VIN = 5 V
VIN = 5 V
Figure 19. Buck2 High-Side Current Limit vs Temperature
Figure 20. Buck3 High-Side Current Limit vs Temperature
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7 Detailed Description
7.1 Overview
The TPS65266-1 is a triple 3-A/2-A/2-A output current, synchronous step-down (buck) converter for applications
operating off the adaptor or battery with input voltage lower than 6 V. The feedback voltage reference for each
buck is 0.6 V. Each buck is independent with dedicated enable, soft-start, and loop compensation. The
TPS65266-1 implements a constant frequency, peak current mode control that simplifies external loop
compensation. The switch clock of buck1 is 180° out-of-phase operation from the clock of buck2 and buck3
channels to reduce input current ripple, input capacitor size and power-supply-induced noise.
The TPS65266-1 has been designed for safe monotonic startup into prebiased loads. The default start-up is
when VIN is typically 2.45 V. The ENx pin has an internal pullup current source that can be used to adjust the
input voltage undervoltage lockout (UVLO) with two external resistors. In addition, the EN pin can be floating for
automatically starting up the converters with the internal pullup current.
The TPS65266-1 features PGOOD pin to supervise output voltages of buck converter. The TPS65266-1 has
power-good comparators with hysteresis, which monitor the output voltages through internal feedback voltages.
When all bucks are in regulation range and power sequence is done, PGOOD is asserted high.
The SS (soft-start/tracking) pin is used to minimize inrush currents or provide power-supply sequencing during
power up. A small-value capacitor or resistor divider should be coupled to the pin for soft start or critical power-
supply sequencing requirements.
The TPS65266-1 is protected from overload and thermal fault conditions.
At light load, TPS65266-1 automatically operates in the pulse skipping mode (PSM) to save power.
12
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7.2 Functional Block Diagram
ROSC
OSC/SYNC
Phase Shift
VIN1
VIN2
clk
clk
VIN
VIN
VIN
BST
VIN
ISNS
ISNS
en_buck2
enable
enable
en_buck1
I
BST1
LX1
SNSBST
BST2
LX2
LX
BUCK1
BUCK2
LX
PGND1
SS1
PGND2
PGND
SS
PGND
5.5 µA
5.5 µA
Comp
Comp
SS2
FB2
SS
FB1
Vref
Vref
COMP1
VINQ
COMP2
PGOOD
vfb1
Power
Good
VIN3
clk
vfb2
vfb3
VIN
BST
VIN
ISNS
en_buck3
enable
BST3
LX3
2.1 µA
3.2 µA
BUCK3
LX
EN1
PGND3
1.2 V
PGND
5.5 µA
Comp
SS3
FB3
SS
Discharge during power up
3.2 µA
en_buck1
2.1 µA
EN2
en_buck2
en_buck3
Vref
State
Machine
1.2 V
Discharge during power up
3.2 µA
COMP3
AGND
2.1 µA
VINQ
OT
EN3
1.2 V
Over
Temp
Discharge during power up
Copyright © 2016, Texas Instruments Incorporated
7.3 Feature Description
7.3.1 Adjusting the Output Voltage
The output voltage of each buck is set with a resistor divider from the output of buck to the FB pin. TI
recommends to use 1% tolerance or better resistors.
Vout
R1
FB
COMP
R2
0.6 V
Figure 21. Voltage Divider Circuit
Copyright © 2016, Texas Instruments Incorporated
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ZHCSFL3 –OCTOBER 2016
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Feature Description (continued)
0.6
R2 = R1 ì
Vout œ 0.6
(1)
To improve efficiency at light loads, consider using larger-value resistors. If the values are too high, the regulator
is more sensitive to noise. Table 1 shows the recommended resistor values.
Table 1. Output Resistor Divider Selection
Output Voltage
(V)
R1
(kΩ)
R2
(kΩ)
1
10
10
15
10
1.2
1.5
1.8
2.5
3.3
3.3
5
15
10
20
10
31.6
45.3
22.6
73.2
36.5
10
10
4.99
10
5
4.99
7.3.2 Enable and Adjusting UVLO
The EN1/2/3 pin provides electrical on and off control of the device. After the EN1/2/3 pin voltage exceeds the
threshold voltage, the device starts operation. If each ENx pin voltage is pulled below the threshold voltage, the
regulator stops switching and enters low Iq state.
The EN pin has an internal pullup current source, allowing the user to float the EN pin for enabling the device. If
an application requires controlling the EN pin, use open-drain or open-collector output logic to interface with the
pin.
The device implements internal UVLO circuitry on the VINQ pin. The device is disabled when the VINQ pin
voltage falls below the internal VIN UVLO threshold. The internal VIN UVLO threshold has a hysteresis of 200
mV. If an application requires either a higher UVLO threshold on the VINQ pin or a secondary UVLO on the
VINx, in split-rail applications, then the ENx pin can be configured as shown in Figure 22, Figure 23, and
Figure 24. When using the external UVLO function, TI recommends to set the hysteresis to be >200 mV.
The EN pin has a small pullup current Ip, which sets the default state of the pin to enable when no external
components are connected. The pullup current is also used to control the voltage hysteresis for the UVLO
function because it increases by Ih after the EN pin crosses the enable threshold. Calculate the UVLO thresholds
using Equation 2 and Equation 3.
V
VSTART
(
ENFALLING ) - VSTOP
VENRISING
R1 =
R2 =
V
IP(1- ENFALLING ) +Ih
VENRISING
(2)
R1 ì VENFALLING
VSTOP - VENFALLING + R1(Ih +Ip )
where
•
•
•
•
Ih = 3.2 µA
Ip = 2.1 µA
VENRISING = 1.2 V
VENFALLING = 1.15 V
(3)
14
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ZHCSFL3 –OCTOBER 2016
VINQ
i
h
R1
p
i
EN
R2
Figure 22. Adjustable VINQ UVLO
VIN
i
h
R1
p
i
EN
R2
Figure 23. Adjustable VIN UVLO, VINQ > 2.7 V
VINQ
VIN
i
h
R1
p
i
EN
R2
Figure 24. Adjustable VIN and VINQ UVLO
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ZHCSFL3 –OCTOBER 2016
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7.3.3 Soft-Start Time
The voltage on the respective SS pin controls the start-up of buck output. When the voltage on the SS pin is less
than the internal 0.6-V reference, the TPS65266-1 regulates the internal feedback voltage to the voltage on the
SS pin instead of 0.6 V. The SS pin can be used to program an external soft-start function or to allow output of
buck to track another supply during start-up. The device has an internal pullup current source of 5.5 μA (typical)
that charges an external soft-start capacitor to provide a linear ramping voltage at SS pin. The TPS65266-1
regulates the internal feedback voltage to the voltage on the SS pin, allowing VOUT to rise smoothly from 0 V to
its regulated voltage without inrush current. Calculate the approximate soft-start time with Equation 4.
Css(nF)ì Vref (V)
tss (ms) =
Iss(µA)
(4)
Many of the common power-supply sequencing methods can be implemented using the SSx and ENx pins.
Figure 25 shows the method implementing ratiometric sequencing by connecting the SSx pins of three buck
channels together. The regulator outputs ramp up and reach regulation at the same time. When calculating the
soft-start time, the pullup current source must be tripled in Equation 4.
EN
29
EN threshold = 1.2 V
EN1
30
EN2
31
EN3
Vout3 = 1.8 V
24
SS1
Vout2 = 1.5 V
8
SS2
Vout1 = 1.0 V
17
SS3
Css
CSS × 0.6 V
tSS
=
16.5 µA
Figure 25. Ratiometric Power-Up Using SSx Pins
Simultaneous power-supply sequencing can be implemented by connecting capacitor to SSx pin, shown in
Figure 26. Using Equation 4 and Equation 5, calculate the capacitors.
Css1
Css2
Css3
=
=
Vout1 Vout2 Vout3
(5)
16
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ZHCSFL3 –OCTOBER 2016
EN
29
30
31
EN threshold = 1.2 V
EN1
EN2
EN3
Vout3 = 1.8 V
Vout2 = 1.5 V
24
8
SS1
SS2
SS3
Css1
Css2
Css3
Vout1 = 1.0 V
17
CSS3 × 0.6 V
5.5µA
tSS
=
Figure 26. Simultaneous Startup Sequence Using SSx Pins
7.3.4 Power-Up Sequencing
The TPS65266-1 has a dedicated enable pin and soft-start pin for each converter. The converter enable pins are
biased by a current source that allows for easy sequencing by the addition of an external capacitor. Enable pins
have a discharge function, which ensures power-up sequencing is effective at quickly powering down and up
status. Disabling the converter with an active pulldown transistor on the ENs pin allows for a predictable power-
down timing operation. Figure 27 shows the timing diagram of a typical buck power-up sequence with connecting
a capacitor at ENx pin.
When VINQ pin voltage rises to about 1 V, the internal EN turns on and a typical 1.4-µA current is charging ENx
pin from input supply. If any of the EN pin voltages reaches 0.5 V when powered up, three EN pin discharge
functions are triggered and keep 2 ms with discharge resistor around 1.2 kΩ to GND, then a 2.1-µA pullup
current is sourcing ENx. After ENx pin voltage reaches to ENx enabling threshold, 3.2-µA hysteresis current
sources to the pin to improve noise sensitivity.
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About 1 V
ëLbv
Lnꢁernal 9b
EN Threshold
9b Çꢀresꢀold
1.2ë
0.ꢂ ë
9bx
ENx Rise Time
Dictated by CEN
t = CENx × 1.2 V / 2.1 µA
Discharge time 2 ms
t = CENx × 0.5 V / 1.4 µA
About 1.7 V
0.6 ë
{{x
Pre-Bias Startup
ëhÜÇx
Soft Start Rise Time
Dictated by CSS
PGOOD Deglitch Time 16350 cycles
t = CSSx × 0.6 V / 5.5 µA
tDhh5
Figure 27. Startup Power Sequence
7.3.5 Bootstrap Voltage and BST-LX UVLO
Each high-side MOSFET driver is biased from the floating bootstrap capacitor, CB, shown in Figure 28, which is
normally recharged during each cycle through an internal low-side MOSFET or the body diode of a low-side
MOSFET when the high-side MOSFET turns off. The boot capacitor is charged when the BST pin voltage is less
than VIN and BST-LX voltage is below regulation. The recommended value of this ceramic capacitor is 47 nF. TI
recommends a ceramic capacitor with an X7R- or X5R-grade dielectric with a voltage rating of 10 V or higher
because of the stable characteristics over temperature and voltage.
To improve dropout, the device is designed to operate at 100% duty cycle as long as the BST to LX pin voltage
is greater than the BST-LX UVLO threshold, which is typically 2.1 V. When the voltage between BST and LX
drops below the BST-LX UVLO threshold, the high-side MOSFET is turned off and the low-side MOSFET is
turned on allowing the boot capacitor to be recharged.
18
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ZHCSFL3 –OCTOBER 2016
VINQ
VINx
LDO
(VBSTx-VLXx)
nBootUV
+2.1 V
BSTx
High-side
MOSFET
nBootUV
PWM
CB
UVLO
Bias
Buck Controller
Gate Driver
LXx
Low-side
MOSFET
nBootUV
PWM
BootUV
Protection
Gate Driver
Clk
Copyright © 2016, Texas Instruments Incorporated
Figure 28. Bootstrap Voltage and Diagram
7.3.6 Out of Phase Operation
To reduce input ripple current, the switch clock of buck1 is 180° out-of-phase from the clock of buck2 and buck3.
This enables the system by having less input current ripple to reduce input capacitors’ size, cost, and EMI.
7.3.7 Output Overvoltage Protection (OVP)
The device incorporates an OVP circuit to minimize output voltage overshoot. When the output is overloaded, the
error amplifier compares the actual output voltage to the internal reference voltage. If the FB pin voltage is lower
than the internal reference voltage for a considerable time, the output of the error amplifier demands maximum
output current. After the condition is removed, the regulator output rises and the error amplifier output transitions
to the steady-state voltage. In some applications with small output capacitance, the load can respond faster than
the error amplifier. This leads to the possibility of an output overshoot. Each buck compares the FB pin voltage to
the OVP threshold. If the FB pin voltage is greater than the OVP threshold, the high-side MOSFET is turned off
preventing current from flowing to the output and minimizing output overshoot. When the FB voltage drops lower
than the OVP threshold, the high-side MOSFET turns on at the next clock cycle.
7.3.8 Slope Compensation
To prevent the subharmonic oscillations when the device operates at duty cycles greater than 50%, the
TPS65266-1 adds built-in slope compensation, which is a compensating ramp to the switch current signal.
7.3.9 Overcurrent Protection
The device is protected from overcurrent conditions by cycle-by-cycle current limiting on both the high-side
MOSFET and low-side MOSFET.
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7.3.9.1 High-Side MOSFET Overcurrent Protection
The device implements current mode control, which uses the COMP pin voltage to control the turn off of the
high-side MOSFET and the turn-on of the low-side MOSFET on a cycle-by-cycle basis. Each cycle the switch
current and the current reference generated by the COMP pin voltage are compared, when the peak switch
current intersects the current reference, the high-side switch is turned off.
7.3.9.2 Low-Side MOSFET Overcurrent Protection
While the low-side MOSFET is turned on, its conduction current is monitored by the internal circuitry. During
normal operation the low-side MOSFET sources current to the load. At the end of every clock cycle, the low-side
MOSFET sourcing current is compared to the internally set low-side sourcing current limit. If the low-side
sourcing current is exceeded, the high-side MOSFET is not turned on and the low-side MOSFET stays on for the
next cycle. The high-side MOSFET is turned on again when the low-side current is below the low-side sourcing
current limit at the start of a cycle.
The low-side MOSFET may also sink current from the load. If the low-side sinking current limit is exceeded, the
low-side MOSFET is turned off immediately for the rest of that clock cycle. In this scenario, both MOSFETs are
off until the start of the next cycle.
Furthermore, if an output overload condition (as measured by the COMP pin voltage) has lasted for more than
the hiccup wait time, which is programmed for 512 cycles (typical) shown in Figure 29, the device shuts down
itself and restarts after the hiccup time of 16382 cycles (typical). The hiccup mode helps to reduce the device
power dissipation under a severe overcurrent condition.
OCP peak inductor current threshold
OC limiting (waiting) time
512 cycles (typical)
hiccup time
16382 cycles (typical)
Soft-start time
t = Css × 0.6 V / 5.5 µA
Output over loading
iL
Inductor Current
Soft-start is reset after OC waiting time
About 1.7 V
0.6 V
OC fault removed, soft-start and output recovery
SS
SS Pin Voltage
Output OC circuit
Vout
Output Voltage
Figure 29. Overcurrent Protection
7.3.10 Power Good
The PGOOD pin is an open-drain output. After the feedback voltage of each buck is higher than 95% (rising) of
the internal voltage reference, the PGOOD pin pulldown is deasserted and the pin floats. TI recommends to use
a pullup resistor between the values of 10 kΩ and 100 kΩ to a voltage source that is 5.0 V or less.
The PGOOD pin is pulled low when any feedback voltage of a buck is lower than 92.5% (falling) of the nominal
internal reference voltage. Also, the PGOOD is pulled low if the input voltage is undervoltage locked up, thermal
shutdown is asserted, the EN pin is pulled low, or the converter is in a soft-start period.
20
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7.3.11 Adjustable Switching Frequency
The ROSC pin can be used to set the switching frequency by connecting a resistor to GND. The switching
frequency of the device is adjustable from 250 kHz to 2.4 MHz.
To determine the ROSC resistance for a given switching frequency, use Equation 6 or the curve in Figure 30. To
reduce the solution size, the user should set the switching frequency as high as possible, but consider the
tradeoffs of the supply efficiency and minimum controllable on-time.
ƒosc (kHz) = 46657 ì R(kW)œ0.976
(6)
2400
2200
2000
1800
1600
1400
1200
1000
800
600
400
200
0
0
20 40 60 80 100 120 140 160 180 200 220
ROSC (kO)
D021
Figure 30. ROSC vs Switching Frequency
When an external clock applies to the ROSC pin, the internal phase locked loop (PLL) has been implemented to
allow internal clock synchronizing to an external clock between 250 kHz and 2.4 MHz. To implement the clock
synchronization feature, connect a square wave clock signal to the ROSC pin with a duty cycle between 20% to
80%. The clock signal amplitude must transition lower than 0.4 V and higher than 2.0 V. The start of the
switching cycle is synchronized to the falling edge of the ROSC pin.
In applications where both resistor mode and synchronization mode are needed, the device can be configured as
shown in Figure 31. Before an external clock is present, the device works in resistor mode and ROSC resistor
sets the switching frequency. When an external clock is present, the synchronization mode overrides the resistor
mode. The first time the ROSC pin is pulled above the ROSC high threshold (2.0 V), the device switches from
the resistor mode to the synchronization mode and the ROSC pin becomes high impedance as the PLL starts to
lock onto the frequency of the external clock. TI does not recommended to switch from synchronization mode
back to resistor mode because the internal switching frequency drops to 100 kHz first before returning to the
switching frequency set by ROSC resistor.
Mode
Selection
IC
ROSC
ROSC
Figure 31. Works With Resistor Mode and Synchronization Mode
7.3.12 PSM
The TPS65266-1 can enter high-efficiency PSM operation at light load current.
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When a controller is enabled for PSM operation, the peak inductor current is sensed and compared with 250-mA
current typically. Because the integrated current comparator catches the peak inductor current only, the average
load current entering PSM varies with the applications and external output filters. In PSM, the sensed peak
inductor current is clamped at 250 mA (see Figure 32).
When a controller operates in PSM, the inductor current is not allowed to reverse. The reverse current
comparator turns off the low-side MOSFET when the inductor current reaches 0, preventing it from reversing and
going negative.
Due to the delay in the circuit and current comparator tdly (typical 50 nS at VIN = 5 V), the real peak inductor
current threshold to turn off high-side power MOSFET could shift higher depending on inductor inductance and
input/output voltages. Calculate the threshold of peak inductor current to turn off high-side power MOSFET with
Equation 7.
V
IN - VOUT
ILPEAK = 250 mA +
x tdly
L
(7)
When the charge accumulated on VOUT capacitor is more than loading need, COMP pin voltage drops to low
voltage driven by error amplifier. There is an internal comparator at COMP pin. If comp voltage is < 0.35 V, the
power stage stops switching to save power.
250 mA
Turn off
high-side Power MOSFET
Inductor
Current Peak
Current
Sensing
x1
Current Comparator
Delay: tdly
IL_Peak
Inductor Peak Current
Figure 32. PSM Current Comparator
7.3.13 Thermal Shutdown
The internal thermal shutdown circuitry forces the device to stop switching if the junction temperature exceeds
160°C typically. The device reinitiates the power-up sequence when the junction temperature drops below 140°C
typically.
7.4 Device Functional Modes
7.4.1 Operation With VIN < 2.6 V (Minimum VIN)
The device operates with input voltages above 2.6 V. The maximum UVLO voltage is 2.6 V and will operate at
input voltages above 2.6 V. The typical UVLO voltage is 2.45 V and the device may operate at input voltages
above that point. The device also may operate at lower input voltages, the minimum UVLO voltage is 2.35 V
(rising) and 2.15V (falling). At input voltages below the UVLO minimum voltage, the devices will not operate.
7.4.2 Operation With EN Control
The enable rising edge threshold voltage is 1.2 V typical and 1.26 V maximum. With EN held below that voltage
the device is disabled and switching is inhibited. The IC quiescent current is reduced in this state. When input
voltage is above the UVLO threshold and the EN voltage is increased above the rising edge threshold, the
device becomes active. Switching is enabled, and the soft start sequence is initiated. The device will start at the
soft start time determined by the external soft start capacitor as shown in Figure 35 to Figure 37.
22
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ZHCSFL3 –OCTOBER 2016
8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The device is a triple-synchronous step-down DC/DC converter. It is typically used to convert a higher DC
voltage to lower DC voltages with a continuously available output current of 3 A/2 A/2 A. The following design
procedure can be used to select component values for the TPS65266-1. This section presents a simplified
discussion of the design process.
8.2 Typical Application
R1
0
C1
0.047 µF
U1
VIN1
VIN 3.3 V
VIN
L1
28
12
13
25
26
VOUT1 1.0 V 3 A
VOUT1
BST1
LX1
C5
C7
22 µF
C8
22 µF
C9
22 µF
C2
22 µF
C3
22 µF
C4
2.2 µH
VIN2
VIN3
VFB1
DNI
R5
15.0 kΩ
DNI
C6
R3
R6
22
23
FB1
VFB1
VFB2
VFB3
GND
GND
9.1 kΩ
10.0 kΩ
1000 pF
COMP1
C10
0.047 µF
L2GND
5
GND
VOUT2 1.5 V 2 A
VOUT1
VINQ
R7
9
BST2
LX2
C11
2.2 µF
C15
0 Ω
C12
22 µF
C13
22 µF
2.2 µH
VFB2
10
DNI
R11
10.0 kΩ
C14
R12
GND
29
30
31
6
7
DNI
R10
GND
GND
C16
15.0 kΩ
EN1
EN2
EN3
EN1
EN2
EN3
FB2
20 kΩ
COMP2
1000 pF
GND
GND
R13
16
15
C17
BST3
LX3
0
L3
0.047 µF
VOUT3 1.8 V 2 A
VOUT1
C21
C18
22 µF
C19
22 µF
24
8
2.2 µH
SS1
SS2
SS3
VFB3
19
18
4
FB3
COMP3
PGOOD
DNI
R16
10.0 kΩ
C20
R15
R17
17
GND
GND
20 kΩ
C25
20.0 kΩ
R9
1000 pF
VIN
C22
0.01 µF
C23
0.01 µF
C24
0.01 µF
100 kΩ
1
2
GND
AGND
AGND
AGND
AGND
AGND
DNI
20
3
21
32
GND
ROSC
SYN
GND
27
11
PGND1
PGND2
PGND3
PAD
R18
51.1 kΩ
14 GND
33
TPS65266RHB
GND
GND
Copyright © 2016, Texas Instruments Incorporated
Figure 33. Typical Application Schematic
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Typical Application (continued)
8.2.1 Design Requirements
This example details the design of a triple-synchronous step-down converter. The designer must know a few
parameters to start the design process. These parameters are typically determined at the system level. For this
example, start with the following known parameters in Table 2.
Table 2. Design Parameters
Parameter
Value
Vout1
Iout1
Vout2
Iout2
Vout3
Iout3
1.0 V
3 A
1.5 V
2 A
1.8 V
2 A
Transient response 1-A load step
Input voltage
±5%
5.0 V normal, 2.7 to 6 V
Output voltage ripple
Switching frequency
±1%
1 MHz
8.2.2 Detailed Design Procedure
8.2.2.1 Output Inductor Selection
To calculate the value of the output inductor, use Equation 8. LIR is a coefficient that represents the amount of
inductor ripple current relative to the maximum output current. The inductor ripple current is filtered by the output
capacitor. Therefore, choosing high inductor ripple currents impact the selection of the output capacitor because
the output capacitor must have a ripple current rating equal to or greater than the inductor ripple current. In
general, the inductor ripple value is at the discretion of the designer; however, LIR is normally from 0.1 to 0.3 for
the majority of applications.
V
- Vout
Io ì LIR
V out
inmax
L =
ì
Vinmax ì ƒsw
(8)
For the output filter inductor, it is important that the RMS current and saturation current ratings not be exceeded.
The RMS and peak inductor current can be found from Equation 10 and Equation 11.
V
- Vout
L
Vout
inmax ì ƒsw
- Vout
inmax
Iripple
=
ì
V
(9)
Vout ì (V
)
2
inmax
(
)
Vinmax ì L ì ƒsw
ILrms = IO2 +
12
(10)
(11)
Iripple
ILpeak = Iout
+
The current flowing through the inductor is the inductor ripple current plus the output current. During power-up,
faults, or transient load conditions, the inductor current can increase above the calculated peak inductor current
level calculated previously. In transient conditions, the inductor current can increase up to the switch current limit
of the device. For this reason, the most conservative approach is to specify an inductor with a saturation current
rating equal to or greater than the switch current limit rather than the peak inductor current.
8.2.2.2 Output Capacitor Selection
The three primary considerations for selecting the value of the output capacitor are: the output capacitor
determines the modulator pole, the output voltage ripple, and how the regulator responds to a large change in
load current. The output capacitance must be selected based on the most stringent of these three criteria.
24
Copyright © 2016, Texas Instruments Incorporated
TPS65266-1
www.ti.com.cn
ZHCSFL3 –OCTOBER 2016
The first criterion is the desired response to a large change in the load current. The output capacitor needs to
supply the load with current when the regulator cannot. This situation would occur if there are desired hold-up
times for the regulator where the output capacitor must hold the output voltage above a certain level for a
specified amount of time after the input power is removed. The regulator is also temporarily not able to supply
sufficient output current if there is a large, fast increase in the current needs of the load such as a transition from
no load to full load. The regulator usually needs two or more clock cycles for the control loop to see the change
in load current and output voltage and adjust the duty cycle to react to the change. The output capacitor must be
sized to supply the extra current to the load until the control loop responds to the load change. The output
capacitance must be large enough to supply the difference in current for two clock cycles while only allowing a
tolerable amount of droop in the output voltage. Equation 12 shows the minimum output capacitance necessary
to accomplish this.
2ì DIout
ƒsw ì DVout
Co =
where
•
•
•
ΔIout is the change in output current.
ƒSW is the regulator's switching frequency.
ΔVout is the allowable change in the output voltage.
(12)
Equation 13 calculates the minimum output capacitance needed to meet the output voltage ripple specification.
1
1
Co >
ì
Voripple
8ì ƒsw
Ioripple
where
•
•
•
ƒSW is the switching frequency.
Vripple is the maximum allowable output voltage ripple.
Iripple is the inductor ripple current.
(13)
Equation 14 calculates the maximum ESR an output capacitor can have to meet the output voltage ripple
specification.
Voripple
RESR
<
Ioripple
(14)
Additional capacitance deratings for aging, temperature, and DC bias should be factored in, which increase this
minimum value. Capacitors generally have limits to the amount of ripple current they can handle without failing or
producing excess heat. An output capacitor that can support the inductor ripple current must be specified. Some
capacitor data sheets specify the root mean square (RMS) value of the maximum ripple current. Equation 15 can
be used to calculate the RMS ripple current the output capacitor needs to support.
Vout ì (V
- Vout )
inmax
Icorms
=
12 ì Vinmax ì L ì ƒsw
(15)
8.2.2.3 Input Capacitor Selection
The TPS65266-1 requires a high-quality ceramic, type X5R or X7R, input decoupling capacitor of at least 10 μF
of effective capacitance on the VIN input voltage pins. In some applications, additional bulk capacitance may also
be required for the VIN input. The effective capacitance includes any DC bias effects. The voltage rating of the
input capacitor must be greater than the maximum input voltage. The capacitor must also have a ripple current
rating greater than the maximum input current ripple of the TPS65266-1. Calculate the input ripple current using
Equation 16.
V
- Vout
Vout
(
ì
)
inmin
I
= Iout
ì
inrms
V
V
inmin
inmin
(16)
Copyright © 2016, Texas Instruments Incorporated
25
TPS65266-1
ZHCSFL3 –OCTOBER 2016
www.ti.com.cn
The value of a ceramic capacitor varies significantly over temperature and the amount of DC bias applied to the
capacitor. The capacitance variations due to temperature can be minimized by selecting a dielectric material that
is stable over temperature. X5R and X7R ceramic dielectrics are usually selected for power regulator capacitors
because they have a high capacitance-to-volume ratio and are fairly stable over temperature. The output
capacitor must also be selected with the DC bias taken into account. The capacitance value of a capacitor
decreases as the DC bias across a capacitor increases. The input capacitance value determines the input ripple
voltage of the regulator. Calculate the input voltage ripple using Equation 17.
Ioutmax ì 0.25
Cin ì ƒsw
DV =
in
(17)
8.2.2.4 Loop Compensation
The TPS65266-1 incorporates a peak current mode control scheme. The error amplifier is a transconductance
amplifier with a gain of 290 µS. A typical type II compensation circuit adequately delivers a phase margin
between 30° and 90°. Cb adds a high-frequency pole to attenuate high-frequency noise when needed. To
calculate the external compensation components, follow these steps.
1. Select switching frequency, ƒSW, that is appropriate for application depending on L and C sizes, output ripple,
EMI, and so forth. Switching frequency between 500 kHz to 1.5 MHz gives best trade-off between
performance and cost. To optimize efficiency, lower switching frequency is desired.
2. Set up crossover frequency, ƒc, which is typically between 1 / 5 and 1 / 20 of ƒSW
.
3. RC can be determined by:
2p ì ƒC ì VO ì CO
GmœEA ì Vref ì GmœPS
RC
=
where
•
•
Gm_EA is the error amplifier gain (290 µS).
Gm_PS is the power stage voltage to current conversion gain (10 A/V).
(18)
1
ƒp =
CO ì RL ì 2p
4. Calculate CC by placing a compensation zero at or before the dominant pole
RL ì CO
CC
=
RC
(19)
(20)
5. Optional Cb can be used to cancel the zero from the ESR associated with CO.
RESR ì CO
Cb =
RC
6. Type III compensation can be implemented with the addition of one capacitor, C1. This allows for slightly
higher loop bandwidths and higher phase margins. If used, C1 is calculated from Equation 21.
1
C1 =
2p ì R1 ì ƒc
(21)
26
Copyright © 2016, Texas Instruments Incorporated
TPS65266-1
www.ti.com.cn
ZHCSFL3 –OCTOBER 2016
LX
VOUT
iL
RESR
RL
Current Sense
I/V Converter
Gm_PS = 10 A / V
Co
C1
R1
FB
Vfb
EA
COMP
V
= 0.6 V
ref
R2
Rc
Cc
Gm_EA = 290 µS
Cb
Copyright © 2016, Texas Instruments Incorporated
Figure 34. DC/DC Loop Compensation
8.2.3 Application Curves
Figure 35. Buck1, Soft-Start, Iout = 3 A
Figure 36. Buck2, Soft-Start, Iout = 2 A
Copyright © 2016, Texas Instruments Incorporated
27
TPS65266-1
ZHCSFL3 –OCTOBER 2016
www.ti.com.cn
Figure 38. Buck1, Output Voltage Ripple, Iout = 3 A
Figure 37. Buck3, Soft-Start, Iout = 2 A
Figure 39. Buck2, Output Voltage Ripple, Iout = 2 A
Figure 40. Buck3, Output Voltage Ripple, Iout = 2 A
SR = 0.25 A/µs
SR = 0.25 A/µs
Figure 41. Buck1, Load Transient, 0.75 to 1.5 A
Figure 42. Buck1, Load Transient, 1.5 to 2.25 A
28
Copyright © 2016, Texas Instruments Incorporated
TPS65266-1
www.ti.com.cn
ZHCSFL3 –OCTOBER 2016
SR = 0.25 A/µs
SR = 0.25 A/µs
Figure 43. Buck2, Load Transient, 0.5 to 1.0 A
Figure 44. Buck2, Load Transient, 1.0 to 1.5 A
SR = 0.25 A/µs
SR = 0.25 A/µs
Figure 45. Buck3, Load Transient, 0.5 to 1.0 A
Figure 46. Buck3, Load Transient, 1.0 to 1.5 A
Figure 47. Buck1, Hiccup and Recovery
Figure 48. Buck2, Hiccup and Recovery
Copyright © 2016, Texas Instruments Incorporated
29
TPS65266-1
ZHCSFL3 –OCTOBER 2016
www.ti.com.cn
Figure 50. 180° Out of Phase
Figure 49. Buck3, Hiccup and Recovery
30
Copyright © 2016, Texas Instruments Incorporated
TPS65266-1
www.ti.com.cn
ZHCSFL3 –OCTOBER 2016
9 Power Supply Recommendations
The devices are designed to operate from an input voltage supply range between 2.7 and 6 V. This input power
supply should be well regulated. If the input supply is located more than a few inches from the TPS65266-1
converter, additional bulk capacitance may be required in addition to the ceramic bypass capacitors. An
electrolytic capacitor with a value of 47 μF is a typical choice.
10 Layout
10.1 Layout Guidelines
The TPS65266-1 supports a 2-layer PCB layout, shown in Figure 51.
Layout is a critical portion of good power supply design. See Figure 51 for a PCB layout example. The top
contains the main power traces for VIN, VOUT, and LX. The top layer also has connections for the remaining
pins of the TPS65266-1 and a large top-side area filled with ground. The top-layer ground area should be
connected to the bottom layer ground using vias at the input bypass capacitor, the output filter capacitor, and
directly under the TPS65266-1 device to provide a thermal path from the exposed thermal pad land to ground.
The bottom layer acts as ground plane connecting analog ground and power ground.
For operation at full-rated load, the top-side ground area together with the bottom-side ground plane must
provide an adequate heat dissipating area. Several signals paths conduct fast changing currents or voltages that
can interact with stray inductance or parasitic capacitance to generate noise or degrade the power supplies'
performance. To help eliminate these problems, the VIN pin should be bypassed to ground with a low-ESR
ceramic bypass capacitor with X5R or X7R dielectric. Take care to minimize the loop area formed by the bypass
capacitor connections, the VIN pins, and the ground connections. The VIN pin must also be bypassed to ground
using a low-ESR ceramic capacitor with X5R or X7R dielectric.
Because the LX connection is the switching node, the output inductor should be located close to the LX pins, and
the area of the PCB conductor minimized to prevent excessive capacitive coupling. The output filter capacitor
ground should use the same power ground trace as the VIN input bypass capacitor. Try to minimize this
conductor length while maintaining adequate width. The small signal components should be grounded to the
analog ground path.
The FB and COMP pins are sensitive to noise so the resistors and capacitors should be located as close as
possible to the IC and routed with minimal lengths of trace. Place the additional external components
approximately as shown in Figure 51.
Copyright © 2016, Texas Instruments Incorporated
31
TPS65266-1
ZHCSFL3 –OCTOBER 2016
www.ti.com.cn
10.2 Layout Example
VOUT1
VOUT3
BST1
LX1
BST3
LX3
PGND3
PGND1
VIN1
EN1
VIN3
VIN2
PGND2
LX2
VIN
VIN
EN2
EN3
AGND
BST2
VOUT2
TOPSIDE
GROUND
AREA
0.010-inch Diameter
Thermal VIA to Ground Plane
VIA to Ground Plane
Figure 51. PCB Layout
32
版权 © 2016, Texas Instruments Incorporated
TPS65266-1
www.ti.com.cn
ZHCSFL3 –OCTOBER 2016
11 器件和文档支持
11.1 器件支持
11.1.1 相关器件
器件型号
说明
备注
TPS65261
4.5V 至 18V 三路降压,均配有输入电压电 三通道降压 3A/2A/2A 输出电流, 通过 开漏 RESET 信号监视输入电源故
TPS65261-1
源故障指示灯
障,支持自动电源排序
三路降压 3A/1A/1A 输出电流,支持自动电源排序
双路 LDO:
TPS65262
4.5V 至 18V 三路降压,具有双路可调
TPS65262-1
LDO
TPS65262,200mA/100mA
TPS65262-1,350mA/150mA
TPS65263
4.5V 至 18V 三路降压,具有 I2C 接口
三路降压 3A/2A/2A 输出电流,I2C 控制的动态电压调节 (DVS)
11.2 接收文档更新通知
如需接收文档更新通知,请访问 www.ti.com.cn 网站上的器件产品文件夹。点击右上角的提醒我 (Alert me) 注册
后,即可每周定期收到已更改的产品信息。有关更改的详细信息,请查阅已修订文档中包含的修订历史记录。
11.3 社区资源
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.4 商标
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止 MOS 门极遭受静电损
伤。
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 机械、封装和可订购信息
以下页中包括机械、封装和可订购信息。这些信息是针对指定器件可提供的最新数据。这些数据会在无通知且不对
本文档进行修订的情况下发生改变。欲获得该数据表的浏览器版本,请查阅左侧的导航栏。
版权 © 2016, Texas Instruments Incorporated
33
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Copyright © 2016, 德州仪器半导体技术(上海)有限公司
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS65266-1RHBR
TPS65266-1RHBT
ACTIVE
VQFN
VQFN
RHB
32
32
3000 RoHS & Green
250 RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
-40 to 85
-40 to 85
TPS
65266-1
ACTIVE
RHB
NIPDAU
TPS
65266-1
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Addendum-Page 2
GENERIC PACKAGE VIEW
RHB 32
5 x 5, 0.5 mm pitch
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
Images above are just a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224745/A
www.ti.com
PACKAGE OUTLINE
RHB0032E
VQFN - 1 mm max height
S
C
A
L
E
3
.
0
0
0
PLASTIC QUAD FLATPACK - NO LEAD
5.1
4.9
B
A
PIN 1 INDEX AREA
(0.1)
5.1
4.9
SIDE WALL DETAIL
20.000
OPTIONAL METAL THICKNESS
C
1 MAX
SEATING PLANE
0.08 C
0.05
0.00
2X 3.5
(0.2) TYP
3.45 0.1
9
EXPOSED
THERMAL PAD
16
28X 0.5
8
17
SEE SIDE WALL
DETAIL
2X
SYMM
33
3.5
0.3
0.2
32X
24
0.1
C A B
C
1
0.05
32
25
PIN 1 ID
(OPTIONAL)
SYMM
0.5
0.3
32X
4223442/B 08/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
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EXAMPLE BOARD LAYOUT
RHB0032E
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(
3.45)
SYMM
32
25
32X (0.6)
1
24
32X (0.25)
(1.475)
28X (0.5)
33
SYMM
(4.8)
(
0.2) TYP
VIA
8
17
(R0.05)
TYP
9
16
(1.475)
(4.8)
LAND PATTERN EXAMPLE
SCALE:18X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4223442/B 08/2019
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
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EXAMPLE STENCIL DESIGN
RHB0032E
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
4X ( 1.49)
(0.845)
(R0.05) TYP
32
25
32X (0.6)
1
24
32X (0.25)
28X (0.5)
(0.845)
SYMM
33
(4.8)
17
8
METAL
TYP
16
9
SYMM
(4.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 33:
75% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:20X
4223442/B 08/2019
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
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