TPS6565342RHDTQ1 [TI]
具有集成开关的汽车类 4MHz、双路 3A 降压转换器 | RHD | 28 | -40 to 125;型号: | TPS6565342RHDTQ1 |
厂家: | TEXAS INSTRUMENTS |
描述: | 具有集成开关的汽车类 4MHz、双路 3A 降压转换器 | RHD | 28 | -40 to 125 开关 转换器 |
文件: | 总62页 (文件大小:4210K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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TPS65653-Q1
ZHCSJI6 –MARCH 2019
TPS65653-Q1 双路 3A 降压转换器
1 特性
2 应用
1
•
下列性能符合 AEC-Q100 标准:
•
•
•
•
•
雷达系统 ECU
汽车音响主机和仪表组
汽车摄像头模块
环视系统 ECU
汽车显示屏
–
器件温度 1 级:-40°C 至 +125°C 的环境工作温
度范围
•
•
输入电压:2.8V 至 5.5V
两个高效降压直流/直流转换器:
–
–
–
输出电压:1V 至 3.36V
最大输出电流为每相 3A
3 说明
TPS65653-Q1 设计用于为雷达等噪声敏感型 应用提供
严格的电源规范。该器件包含两个降压直流/直流转换
器以及通用数字输出信号。该器件由 I2C 兼容串行接口
和使能信号进行控制。
可编程输出电压压摆率范围:0.5mV/µs 至
10mV/µs
–
–
4MHz 开关频率
用于降低 EMI 的扩频模式和相位交错
•
•
可配置通用输出信号(GPO、GPO2)
自动 PWM/PFM(AUTO 模式)操作可在较宽输出电
流范围内最大限度地提高效率。TPS65653-Q1 支持远
程电压检测,可补偿稳压器输出与负载点 (POL) 之间
的 IR 压降,从而提高输出电压的精度。此外,可以强
制开关时钟进入 PWM 模式以及将其与外部时钟同
步,从而最大限度地降低干扰。
I2C 兼容接口,支持标准 (100kHz)、快速
(400kHz)、快速+ (1MHz) 和高速 (3.4MHz) 模式
•
•
•
•
•
•
•
具有可编程屏蔽的中断功能
可编程电源正常信号 (PGOOD)
外部时钟输入以同步开关
输出短路和过载保护
TPS65653-Q1 器件支持可编程启动和关断延迟与排序
(包括与使能信号同步的 GPO 信号)。在启动和电压
变化期间,器件会对输出转换率进行控制,从而最大限
度地减小输出电压过冲和浪涌电流。
过热警告和保护
过压保护 (OVP) 和欠压锁定 (UVLO)
具有可湿性侧面的 28 引脚、5mm × 5mm VQFN
封装
简化原理图
器件信息
器件型号
封装
VQFN (28)
封装尺寸(标称值)
VIN
VOUT_B0
TPS65653-Q1
5.00mm × 5.00mm
VIN_B0
VIN_B1
SW_B0
FB_B0
LOAD
LOAD
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
VIN
VIN
VANA
VOUT_B1
直流/直流效率与输出电流
SW_B1
FB_B1
SDA
SCL
nINT
EN
DC/DC Efficiency vs Output Current
100
CLKIN (GPO2)
GPO
90
80
70
PGOOD
GNDs
Copyright © 2018, Texas Instruments Incorporated
60
Vin = 3.3V, Vout = 1V, AUTO
Vin = 3.3V, Vout = 1.8V, AUTO
Vin = 3.3V, Vout = 2.5V, AUTO
50
0.001
0.01
0.1
Load (A)
1
3
Fron
1
本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。 有关适用的官方英文版本的最新信息,请访问 www.ti.com,其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SLVSF06
TPS65653-Q1
ZHCSJI6 –MARCH 2019
www.ti.com.cn
目录
7.4 Device Functional Modes........................................ 29
7.5 Programming........................................................... 30
7.6 Register Maps......................................................... 33
Application and Implementation ........................ 47
8.1 Application Information............................................ 47
8.2 Typical Application .................................................. 47
Power Supply Recommendations...................... 53
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 5
6.1 Absolute Maximum Ratings ...................................... 5
6.2 ESD Ratings ............................................................ 5
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information.................................................. 6
6.5 Electrical Characteristics........................................... 6
6.6 I2C Serial Bus Timing Parameters.......................... 10
6.7 Typical Characteristics............................................ 12
Detailed Description ............................................ 13
7.1 Overview ................................................................. 13
7.2 Functional Block Diagram ....................................... 14
7.3 Feature Description ................................................ 14
8
9
10 Layout................................................................... 53
10.1 Layout Guidelines ................................................. 53
10.2 Layout Example .................................................... 54
11 器件和文档支持 ..................................................... 55
11.1 器件支持................................................................ 55
11.2 接收文档更新通知 ................................................. 55
11.3 社区资源................................................................ 55
11.4 商标....................................................................... 55
11.5 静电放电警告......................................................... 55
11.6 术语表 ................................................................... 55
7
4 修订历史记录
注:之前版本的页码可能与当前版本有所不同。
日期
修订版本
说明
2019 年 3 月
*
初始发行版
2
Copyright © 2019, Texas Instruments Incorporated
TPS65653-Q1
www.ti.com.cn
ZHCSJI6 –MARCH 2019
5 Pin Configuration and Functions
RHD Package
28-Pin VQFN With Thermal Pad
Top View
21
20
19
18
17
16
15
SW_B0
SW_B0
VIN_B0
VIN_B0
GPO
SW_B1
SW_B1
VIN_B1
VIN_B1
CLKIN
nINT
22
23
24
25
26
27
28
14
13
12
11
10
9
THERMAL PAD
PGOOD
VIN
VIN
8
1
2
3
4
5
6
7
Pin Functions
PIN
TYPE(1)
DESCRIPTION
NUMBER
NAME
NC
1
2
3
4
5
O
A
Unused. Leave this pin floating.
FB_B0
FB_B1
AGND
VANA
Output voltage feedback (positive) for Buck 0
Output voltage feedback (positive) for Buck 1
Ground
A
G
P/I
Supply voltage for analog and digital blocks. Must be connected to same node with VIN_Bx.
Programmable enable signal for regulators and GPOs. If the pin is not used, leave the pin
floating.
6
EN
D/I
7
8
9
NC
VIN
O
I
Unused. Leave this pin floating.
Unused. Connect this pin to VANA.
nINT
D/O
Open-drain interrupt output. Active LOW. If the pin is not used, connect the pin to ground.
External clock input. Alternative function is general-purpose digital output (GPO2). If the pin is not
used, leave the pin floating.
10
CLKIN
D/I/O
P/I
Input for Buck 1. The separate power pins VIN_Bx are not connected together internally -
VIN_Bx pins must be connected together in the application and be locally bypassed.
11, 12
VIN_B1
SW_B1
13, 14
15, 16
P/O
P/G
Buck 1 switch node. If the Buck 1 is not used, leave the pin floating.
Power ground for Buck 1
PGND_B1
Serial interface clock input for I2C access. Connect a pullup resistor. If the I2C interface is not
used, connect the pin to Ground.
17
SCL
D/I
Serial interface data input and output for I2C access. Connect a pullup resistor. If the I2C
interface is not used, connect the pin to Ground.
18
19
SDA
D/I/O
G
SGND
Ground
(1) A: Analog Pin, D: Digital Pin, G: Ground Pin, P: Power Pin, I: Input Pin, O: Output Pin
Copyright © 2019, Texas Instruments Incorporated
3
TPS65653-Q1
ZHCSJI6 –MARCH 2019
www.ti.com.cn
Pin Functions (continued)
PIN
TYPE(1)
DESCRIPTION
NUMBER
20, 21
NAME
PGND_B0
SW_B0
P/G
P/O
Power ground for Buck 0
Buck 0 switch node. If the Buck 0 is not used, leave the pin floating.
22, 23
Input for Buck 0. The separate power pins VIN_Bx are not connected together internally -
VIN_Bx pins must be connected together in the application and be locally bypassed.
24, 25
VIN_B0
P/I
26
27
28
GPO
PGOOD
VIN
D/O
D/O
I
General-purpose digital output. If the pin is not used, leave the pin floating.
Power-good indication signal. If the pin is not used, leave the pin floating.
Unused. Connect this pin to VANA.
Thermal
Pad
—
—
Connect to PCB ground plane using multiple vias for good thermal performance.
4
Copyright © 2019, Texas Instruments Incorporated
TPS65653-Q1
www.ti.com.cn
ZHCSJI6 –MARCH 2019
6 Specifications
6.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN
MAX
UNIT
Voltage on power connections (must use the same
VIN, VIN_Bx, VANA
input supply)
–0.3
6
V
(VIN_Bx + 0.3 V) with 6-V
maximum
SW_Bx
Voltage on buck switch nodes
–0.3
–0.3
–0.3
–0.3
V
V
V
V
(VANA + 0.3 V) with 6-V
maximum
FB_Bx
Voltage on buck voltage sense nodes
Voltage on logic pins (input or output pins)
Voltage on logic pins (input or output pins)
(VANA + 0.3 V) with 6-V
maximum
SDA, SCL, nINT, EN
PGOOD, GPO, CLKIN
(GPO2)
(VANA + 0.3 V) with 6-V
maximum
TJ-MAX
Tstg
Junction temperature
Storage temperature
−40
150
150
260
–65
°C
Maximum lead temperature (soldering, 10 seconds)
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground.
6.2 ESD Ratings
VALUE
±2000
±500
UNIT
Human-body model (HBM), per AEC Q100-002(1)
All pins
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per AEC
Q100-011
Corner pins (1, 7, 8, 14,
15, 21, 22, 28)
±750
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.3 Recommended Operating Conditions
Over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
INPUT VOLTAGE
Voltage on power connections (must use the same input
supply)
VIN, VIN_Bx, VANA
2.8
5.5
V
EN, nINT
Voltage on logic pins (input or output pins)
Voltage on logic pins (input pin)
Voltage on logic pins (output pins)
0
0
0
5.5
VANA
VANA
V
V
V
CLKIN
PGOOD, GPO, GPO2
Voltage on I2C interface, Standard (100 kHz), Fast (400
kHz), Fast+ (1 MHz), and High-Speed (3.4 MHz) Modes
0
0
1.95
V
V
SCL, SDA
Voltage on I2C interface, Standard (100 kHz), Fast (400
kHz), and Fast+ (1 MHz) Modes
VANA with 3.6-V
maximum
TEMPERATURE
TJ
Junction temperature
Ambient temperature
−40
−40
140
125
°C
°C
TA
Copyright © 2019, Texas Instruments Incorporated
5
TPS65653-Q1
ZHCSJI6 –MARCH 2019
www.ti.com.cn
6.4 Thermal Information
TPS65653-Q1
THERMAL METRIC(1)
RHD (VQFN)
28 PINS
36.7
UNIT
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJCtop
RθJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
26.6
8.9
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
0.4
ψJB
8.8
RθJCbot
2.2
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
note.
6.5 Electrical Characteristics
Limits apply over the junction temperature range –40°C ≤ TJ ≤ +140°C, specified VVANA, VVIN_Bx,VVOUT_Bx, and IOUT range,
unless otherwise noted. Typical values are at TJ = 25°C, VVANA = VVIN_Bx = 3.7 V, and VOUT = 1 V, unless otherwise noted.(1)(2)
.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
EXTERNAL COMPONENTS
Input filtering
CIN_VANA
Effective capacitance, connected from VANA
to AGND
100
10
nF
µF
capacitance for VANA
Input filtering
Effective capacitance, connected from VIN_Bx
to PGND_Bx
CIN_BUCK
capacitance for buck
regulators
1.9
10
Output filtering
COUT_BUCK
capacitance for buck
regulators, local
Effective capacitance
POL capacitance
22
22
µF
µF
Point-of-load (POL)
capacitance for buck
regulators
CPOL_BUCK
Total output capacitance, VIN_Bx ≤ 4 V and
Slew rate ≤ 3.8 mV/µs
150
100
100
µF
µF
µF
COUT-
TOTAL_BUCK
Buck output capacitance,
total (local and POL)
Total output capacitance, VIN_Bx > 4 V
Total output capacitance, Slew rate > 3.8
mV/µs
Input and output
capacitor ESR
ESRC
[1-10] MHz
2
10
mΩ
0.47
L
Inductor
Inductance of the inductor
µH
–30%
30%
DCRL
Inductor DCR
25
mΩ
BUCK REGULATORS
V(VIN_Bx)
V(VANA)
,
VIN_Bx and VANA pins must be connected to
the same supply line
Input voltage range
2.8
1
3.3
5.5
V
V
Programmable voltage range
Step size, 1 V ≤ VOUT < 1.4 V
Step size, 1.4 V ≤ VOUT ≤ 3.36 V
Output current
1
5
3.36
VOUT_Bx
Output voltage
Output current
mV
20
IOUT_Bx
3(3)
A
V
Input and Output voltage Minimum voltage between V(VIN_Bx) and
difference VOUT to fulfill the electrical characteristics
0.8
(1) All voltage values are with respect to network ground.
(2) Minimum (MIN) and Maximum (MAX) limits are specified by design, test, or statistical analysis. Typical (TYP) numbers are not verified,
but do represent the most likely norm.
(3) The maximum output current can be limited by the forward current limit ILIM FWD. The power dissipation inside the die increases the
junction temperature and limits the maximum current depending of the length of the current pulse, efficiency, board and ambient
temperature.
6
Copyright © 2019, Texas Instruments Incorporated
TPS65653-Q1
www.ti.com.cn
ZHCSJI6 –MARCH 2019
Electrical Characteristics (continued)
Limits apply over the junction temperature range –40°C ≤ TJ ≤ +140°C, specified VVANA, VVIN_Bx,VVOUT_Bx, and IOUT range,
unless otherwise noted. Typical values are at TJ = 25°C, VVANA = VVIN_Bx = 3.7 V, and VOUT = 1 V, unless otherwise noted.(1)(2)
.
PARAMETER
TEST CONDITIONS
Force PWM mode
MIN
TYP
MAX
UNIT
DC output voltage
–2%
2%
accuracy, includes
VOUT_Bx_DC
voltage reference, DC
load and line regulations,
process and temperature
PFM mode. Average output voltage level is
increased by max. 20 mV
2% + 20
mV
–2%
PWM mode, L = 0.47 µH, IOUT = 500 mA,
COUT = 22uF + 22uF
4
(GCM31CR71A226KE02)
Ripple voltage
mVp-p
PFM mode, L = 0.47 µH, IOUT = 10 mA,
COUT = 22uF + 22uF
25
(GCM31CR71A226KE02)
DCLNR
DCLDR
TLDSR
DC line regulation
IOUT = 1 A
±0.05
0.3%
±60
%/V
mV
DC load regulation in
PWM mode
VOUT_Bx = 1 V, IOUT from 0 to IOUT(max)
Transient load step
response
IOUT = 0 A to 3 A, TR = TF = 1 µs, PWM
mode, VVIN_Bx = 3.3 V, VOUT_Bx = 1 V, COUT
44 µF, L = 0.47 µH, fSW = 4 MHz
=
V(VIN_Bx) stepping 3 V ↔ 3.5 V, TR = TF = 10
µs, IOUT = IOUT(max)
TLNSR
Transient line response
±10
mV
A
Programmable range
1.5
4
Forward current limit per
phase (peak for every
switching cycle)
Step size
0.5
7.5%
7.5%
2.0
ILIM FWD
Accuracy, V(VIN_Bx) ≥ 3 V, ILIM = 4 A
Accuracy, 2.8 V ≤ V(VIN_Bx) < 3 V, ILIM = 4 A
–5%
–20%
1.6
20%
20%
3.0
ILIM NEG
Negative current limit
A
On-resistance, high-side
FET
RDS(ON) HS FET
Between VIN_Bx and SW_Bx pins (I = 1 A)
50
110
mΩ
On-resistance, low-side
FET
RDS(ON) LS FET
ƒSW
Between SW_Bx and PGND_Bx pins (I = 1 A)
PWM mode
45
4
90
mΩ
MHz
µs
Switching frequency
3.6
4.4
From ENx to VOUT_Bx = 0.35 V (slew-rate
control begins)
Start-up time (soft start)
120
SLEW_RATEx[2:0] = 010
SLEW_RATEx[2:0] = 011
SLEW_RATEx[2:0] = 100
SLEW_RATEx[2:0] = 101
SLEW_RATEx[2:0] = 110
SLEW_RATEx[2:0] = 111
10
7.5
3.8
Output voltage slew-
rate(4)
–15%
15% mV/µs
1.9
0.94
0.47
PFM-to-PWM - current
threshold(5)
IPFM-PWM
IPWM-PFM
RDIS_Bx
550
290
250
mA
mA
PWM-to-PFM - current
threshold(5)
Output pulldown
resistance
Regulator disabled
150
350
Ω
(4) The slew-rate can be limited by the current limit (forward or negative current limit), output capacitance and load current.
(5) The final PFM-to-PWM and PWM-to-PFM switchover current varies slightly and is dependent on the output voltage, input voltage and
the inductor current level.
Copyright © 2019, Texas Instruments Incorporated
7
TPS65653-Q1
ZHCSJI6 –MARCH 2019
www.ti.com.cn
Electrical Characteristics (continued)
Limits apply over the junction temperature range –40°C ≤ TJ ≤ +140°C, specified VVANA, VVIN_Bx,VVOUT_Bx, and IOUT range,
unless otherwise noted. Typical values are at TJ = 25°C, VVANA = VVIN_Bx = 3.7 V, and VOUT = 1 V, unless otherwise noted.(1)(2)
.
PARAMETER
TEST CONDITIONS
V(VIN_Bx) and V(VANA) fixed 3.7 V
Overvoltage threshold (compared to DC
MIN
TYP
MAX
UNIT
39
–53
4
50
64
–29
15
Output voltage
output voltage level, VVOUT_Bx_DC
Undervoltage threshold (compared to DC
output voltage level, VVOUT_Bx_DC
)
monitoring for PGOOD
pin and for power-good
Interrupt
mV
–40
)
Deglitch time during operation and after
voltage change
µs
µs
Gating time for PGOOD
signal after regulator
enable or voltage
change
PGOOD_MODE = 0
800
EXTERNAL CLOCK AND PLL
Nominal frequency
1
24
MHz
µs
fEXT_CLK
External input clock(6)
Nominal frequency step size
1
Required accuracy from nominal frequency
Delay for missing clock detection
Delay and debounce for clock detection
–10%
10%
1.8
20
External clock detection
Clock change delay
(internal to external)
Delay from valid clock detection to use of
external clock
600
300
µs
PLL output clock jitter
Cycle to cycle
ps, p-p
PROTECTION FUNCTIONS
Temperature rising, TDIE_WARN_LEVEL = 0
115
127
125
137
20
135
147
Thermal warning(7)
Temperature rising, TDIE_WARN_LEVEL = 1
Hysteresis
°C
°C
Temperature rising
Hysteresis
140
150
20
160
Thermal shutdown(7)
VANA overvoltage
Voltage rising
5.6
5.45
40
5.8
6.1
V
mV
V
VANAOVP
Voltage falling
5.73
5.96
Hysteresis
Voltage rising
2.51
2.5
2.63
2.6
2.75
2.7
VANA undervoltage
lockout
VANAUVLO
Voltage falling
Buck short-circuit
detection
Threshold
280
360
440
mV
LOAD CURRENT MEASUREMENT FOR BUCK REGULATORS
Current measurement
Maximum code
range
10.22
A
Resolution
LSB
20
mA
Measurement accuracy
IOUT > 1 A
<10%
PFM mode (automatically changing to PWM
mode for the measurement)
45
4
Measurement time
µs
PWM mode
CURRENT CONSUMPTION
Standby current
consumption, regulators
disabled
9
µA
(6) The external clock frequency must be selected so that buck switching frequency is above 1.7 MHz.
(7) For a given device thermal warning will always happen at a lower temperature than thermal shutdown.
8
Copyright © 2019, Texas Instruments Incorporated
TPS65653-Q1
www.ti.com.cn
ZHCSJI6 –MARCH 2019
Electrical Characteristics (continued)
Limits apply over the junction temperature range –40°C ≤ TJ ≤ +140°C, specified VVANA, VVIN_Bx,VVOUT_Bx, and IOUT range,
unless otherwise noted. Typical values are at TJ = 25°C, VVANA = VVIN_Bx = 3.7 V, and VOUT = 1 V, unless otherwise noted.(1)(2)
.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Active current
consumption, one buck
regulator enabled in auto
mode, internal RC
oscillator, PGOOD
monitoring enabled
IOUT_Bx = 0 mA, not switching
58
µA
Active current
consumption, two buck
regulators enabled in
auto mode, internal RC
oscillator, PGOOD
monitoring enabled
IOUT_Bx = 0 mA, not switching
100
15
µA
Active current
consumption during
PWM operation, one
buck regulator enabled
IOUT_Bx = 0 mA
mA
Active current
consumption during
PWM operation, two
buck regulators enabled
IOUT_Bx = 0 mA
30
2
mA
mA
PLL and clock detector
current consumption
fEXT_CLK = 1 MHz, Additional current
consumption when enabled
DIGITAL INPUT SIGNALS EN, SCL, SDA, CLKIN
VIL
VIH
Input low level
Input high level
0.4
V
1.2
10
Hysteresis of Schmitt
Trigger inputs
VHYS
80
200
mV
EN/CLKIN pulldown
resistance
EN_PD/CLKIN_PD = 1
500
kΩ
DIGITAL OUTPUT SIGNALS nINT, SDA
nINT: ISOURCE = 2 mA
SDA: ISOURCE = 20 mA
0.4
0.4
V
V
VOL
RP
Output low level
External pullup resistor
for nINT
To VIO Supply
10
kΩ
DIGITAL OUTPUT SIGNALS PGOOD, GPO, GPO2
VOL
Output low level
ISOURCE = 2 mA
0.4
V
V
Output high level,
configured to push-pull
VVANA
–
VOH
ISINK = 2 mA
VVANA
0.4
Supply voltage for
VPU
external pullup resistor,
configured to open-drain
VVANA
V
External pullup resistor,
configured to open-drain
RPU
10
kΩ
ALL DIGITAL INPUTS
ILEAK
Input current
All logic inputs over pin voltage range
−1
1
µA
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6.6 I2C Serial Bus Timing Parameters
These specifications are ensured by design. Unless otherwise noted, VIN_Bx = 3.7 V. See (1) and Figure 1.
MIN
MAX
UNIT
Standard mode
Fast mode
100
400
1
kHz
fSCL
Serial clock frequency
Fast mode+
High-speed mode, Cb = 100 pF
High-speed mode, Cb = 400 pF
Standard mode
3.4
1.7
MHz
µs
4.7
1.3
0.5
0.16
0.32
4
Fast mode
tLOW
SCL low time
Fast mode+
High-speed mode, Cb = 100 pF
High-speed mode, Cb = 400 pF
Standard mode
Fast mode
0.6
0.26
0.06
0.12
250
100
50
tHIGH
SCL high time
Data setup time
Data hold time
Fast mode+
µs
ns
ns
µs
High-speed mode, Cb = 100 pF
High-speed mode, Cb = 400 pF
Standard mode
Fast mode
tSU;DAT
tHD;DAT
tSU;STA
Fast mode+
High-speed mode
Standard mode
10
10
3450
900
Fast mode
10
Fast mode+
10
High-speed mode, Cb = 100 pF
High-speed mode, Cb = 400 pF
Standard mode
10
70
10
150
4.7
0.6
0.26
0.16
4
Setup time for a start or
a repeated start
condition
Fast mode
Fast mode+
High-speed mode
Standard mode
Fast mode
0.6
0.26
0.16
4.7
1.3
0.5
4
Hold time for a start or a
repeated start condition
tHD;STA
µs
µs
µs
Fast mode+
High-speed mode
Standard mode
Bus free time between a
stop and start condition
tBUF
Fast mode
Fast mode +
Standard mode
Fast mode
0.6
0.26
0.16
Setup time for a stop
condition
tSU;STO
Fast mode+
High-speed mode
Standard mode
1000
300
120
80
Fast mode
20
trDA
Rise time of SDA signal Fast mode+
High-speed mode, Cb = 100 pF
High-speed mode, Cb = 400 pF
ns
10
20
160
(1) Cb refers to the capacitance of one bus line.
10
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I2C Serial Bus Timing Parameters (continued)
These specifications are ensured by design. Unless otherwise noted, VIN_Bx = 3.7 V. See (1) and Figure 1.
MIN
MAX
UNIT
Standard mode
300
20 × (VDD / 5.5
Fast mode
300
120
V)
tfDA
Fall time of SDA signal
20 × (VDD / 5.5
V)
ns
Fast mode+
High-speed mode, Cb = 100 pF
High-speed mode, Cb = 400 pF
Standard mode
10
30
80
160
1000
300
120
40
Fast mode
20
trCL
Rise time of SCL signal Fast mode+
High-speed mode, Cb = 100 pF
ns
ns
10
20
10
High-speed mode, Cb = 400 pF
80
Rise time of SCL signal High-speed mode, Cb = 100 pF
after a repeated start
80
trCL1
condition and after an
acknowledge bit
High-speed mode, Cb = 400 pF
20
160
Standard mode
Fast mode
300
300
20 × (VDD / 5.5
V)
tfCL
Fall time of a SCL signal
20 × (VDD / 5.5
V)
ns
Fast mode+
120
High-speed mode, Cb = 10 – 100 pF
High-speed mode, Cb = 400 pF
10
20
40
80
Capacitive load for each
bus line (SCL and SDA)
Cb
400
50
pF
ns
Pulse width of spike
suppressed (SCL and
SDA spikes that are less
then the indicated width
are suppressed)
Standard mode, fast mode, and fast mode+
High-speed mode
tSP
10
tBUF
SDA
tHD;STA
trCL
tfDA
trDA
tSP
tLOW
tfCL
SCL
tHD;STA
tSU;STA
tSU;STO
tHIGH
tHD;DAT
S
tSU;DAT
S
RS
P
START
REPEATED
START
STOP
START
Figure 1. I2C Timing
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6.7 Typical Characteristics
Unless otherwise specified: V(VIN_Bx) = V(VANA) = 3.7 V, VOUT_Bx = 1 V, TA = 25°C, L = 0.47 µH (Murata DFE252012PD-R47M),
COUT_BUCK = 22 µF, and CPOL_BUCK = 22 µF
15
14
13
12
11
10
9
70
68
66
64
62
60
58
56
54
52
50
8
7
6
5
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
Input Voltage (V)
Input Voltage (V)
D101
D102
Regulators disabled
VOUT_Bx = 1 V
Load = 0 mA
Figure 2. Standby Current Consumption vs Input Voltage
Figure 3. Active State Current Consumption vs Input
Voltage, One Buck Regulator Enabled in PFM Mode
24
22
20
18
16
14
12
10
8
6
4
2.5
3
3.5
4
4.5
5
5.5
Input Voltage (V)
D103
VOUT_Bx = 1 V
Load = 0 mA
Figure 4. Active State Current Consumption vs Input Voltage, One Buck Regulator Enabled in Forced PWM Mode
12
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7 Detailed Description
7.1 Overview
The TPS65653-Q1 is a high-efficiency, high-performance flexible power supply device with two step-down
DC/DC converter cores (Buck0 and Buck1) for automotive applications. Table 1 lists the output characteristics of
the regulators.
Table 1. Supply Specification
OUTPUT
SUPPLY
VOUT RANGE (V)
RESOLUTION (mV)
IMAX MAXIMUM OUTPUT CURRENT (mA)
5 (1 V to 1.4 V)
20 (1.4 V to 3.36 V)
Buck0
Buck1
1 to 3.36
3000
5 (1 V to 1.4 V)
20 (1.4 V to 3.36 V)
1 to 3.36
3000
The TPS65653-Q1 also supports switching clock synchronization to an external clock (CLKIN pin). The nominal
frequency of the external clock can be from 1 MHz to 24 MHz with 1-MHz steps.
Additional features include:
•
•
Soft-start
Input voltage protection:
–
–
Undervoltage lockout
Overvoltage protection
•
Output voltage monitoring and protection:
–
–
–
Overvoltage monitoring
Undervoltage monitoring
Overload protection
•
•
Thermal warning
Thermal shutdown
The TPS65653-Q1 has one dedicated general purpose digital output (GPO) signal. CLKIN pin can be
programmed as a second GPO signal (GPO2) if external clock is not needed. The output type (open-drain or
push-pull) is programmable for the GPOs.
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7.2 Functional Block Diagram
VANA
nINT
Interrupts
Buck0
ILIM Det
Pwrgood Det
Enable/
Disable,
Delay
Control
Slew-Rate
Control
Overload and
SC Det
EN
Iload ADC
GPO
Buck1
ILIM Det
Pwrgood Det
SDA
SCL
I2C
Overload and
SC Det
Iload ADC
OTP
EPROM
Registers
PGOOD
Digital
Logic
Thermal
Monitor
UVLO
SW
Reset
Ref &
Bias
Oscillator
CLKIN (GPO2)
Copyright © 2018, Texas Instruments Incorporated
7.3 Feature Description
7.3.1 DC/DC Converters
7.3.1.1 Overview
The TPS65653-Q1 includes two step-down DC/DC converter cores. The cores are designed for flexibility; most
of the functions are programmable, thus giving a possibility to optimize the regulator operation for each
application. The buck regulators deliver 1-V to 3.36-V regulated voltage rails from a 2.8-V to 5.5-V supply
voltage.
The TPS65653-Q1 has the following features:
•
•
•
•
•
•
•
•
DVS support with programmable slew rate
Automatic mode control based on the loading (PFM or PWM mode)
Forced PWM mode option
Optional external clock input to minimize crosstalk
Optional spread-spectrum technique to reduce EMI
Phase control for optimized EMI
Synchronous rectification
Current mode loop with PI compensator
14
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Feature Description (continued)
•
•
•
•
Soft start
Power Good flag with maskable interrupt
Power Good signal (PGOOD) with selectable sources
Average output current sensing (for PFM entry and load current measurement)
The following parameters can be programmed via registers, the default values are set by OTP bits:
•
•
•
•
•
Output voltage
Forced PWM operation
Switch current limit
Output voltage slew rate
Enable and disable delays
There are two modes of operation for the buck converter, depending on the output current required: pulse-width
modulation (PWM) and pulse-frequency modulation (PFM). The converter operates in PWM mode at high load
currents of approximately 600 mA or higher. Lighter output current loads cause the converter to automatically
switch into PFM mode for reduced current consumption when forced PWM mode is disabled. The forced PWM
mode can be selected to maintain fixed switching frequency at all load current levels.
A block diagram of a single core is shown in Figure 5.
HS FET
CURRENT
SENSE
VIN
FB
POS
CURRENT
LIMIT
RAMP
GENERATOR
V
OUT
-
GATE
CONTROL
ERROR
AMP
SW
+
LOOP
COMP
VOLTAGE
SETTING
SLEW RATE
CONTROL
NEG
CURRENT
LIMIT
POWER
+
VDAC
-
GOOD
ZERO
CROSS
DETECT
LS FET
CURRENT
SENSE
MASTER
INTERFACE
PROGRAMMABLE
PARAMETERS
CONTROL
BLOCK
SLAVE
INTERFACE
IADC
GND
Copyright © 2016, Texas Instruments Incorporated
Figure 5. Detailed Block Diagram Showing One Core
7.3.1.2 Transition Between PWM and PFM Modes
PWM mode operation optimizes efficiency at mid to full load at the expense of light-load efficiency. The
TPS65653-Q1 converter operates in PWM mode at load current of about 600 mA or higher. At lighter load
current levels the device automatically switches into PFM mode for reduced current consumption when forced
PWM mode is disabled (AUTO mode operation). By combining the PFM and the PWM modes a high efficiency is
achieved over a wide output-load current range.
7.3.1.3 Buck Converter Load Current Measurement
Buck load current can be monitored via I2C registers. The monitored buck converter is selected with the
LOAD_CURRENT_BUCK_SELECT bit in SEL_I_LOAD register. A write to this selection register starts a current
measurement sequence. The regulator is automatically forced to PWM mode for the measurement period. The
measurement sequence is 50 µs long, maximum.
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Feature Description (continued)
TPS65653-Q1 can be configured to give out an interrupt (I_MEAS_INT bit in INT_TOP_1 register) after the load
current measurement sequence is finished. Load current measurement interrupt can be masked with
I_MEAS_MASK bit (TOP_MASK_1 register). The measurement result can be read from registers I_LOAD_1 and
I_LOAD_2. Register I_LOAD_1 bits BUCK_LOAD_CURRENT[7:0] give out the LSB bits and register I_LOAD_2
bit BUCK_LOAD_CURRENT[8] the MSB bit. The measurement result BUCK_LOAD_CURRENT[8:0] LSB is 20
mA, and maximum code value of the measurement corresponds to 10.22 A.
7.3.1.4 Spread-Spectrum Mode
Systems with periodic switching signals may generate a large amount of switching noise in a set of narrowband
frequencies (the switching frequency and its harmonics). The usual solution to reduce noise coupling is to add
EMI-filters and shields to the boards. The TPS65653-Q1 has register selectable spread-spectrum mode which
minimizes the need for output filters, ferrite beads, or chokes. In spread spectrum mode, the switching frequency
varies around the center frequency, reducing the EMI emissions radiated by the converter and associated
passive components and PCB traces (see Figure 6). This feature is available only when internal RC oscillator is
used (EN_PLL bit is 0 in PLL_CTRL register), and it is enabled with the EN_SPREAD_SPEC bit in CONFIG
register, and it affects both buck cores.
Frequency
Where a fixed frequency converter exhibits large amounts of spectral energy at the switching frequency, the spread
spectrum architecture of the TPS65653-Q1 spreads that energy over a large bandwidth.
Figure 6. Spread-Spectrum Modulation
7.3.2 Sync Clock Functionality
The TPS65653-Q1 device contains a CLKIN input to synchronize the switching clock of the buck regulators with
the external clock. The block diagram of the clocking and PLL module is shown in Figure 7. Depending on the
EN_PLL bit in PLL_CTRL register and the external clock availability, the external clock is selected and interrupt
is generated as shown in Table 2. The interrupt can be masked with SYNC_CLK_MASK bit in TOP_MASK_1
register. The nominal frequency of the external input clock is set by EXT_CLK_FREQ[4:0] bits in PLL_CTRL
register, and it can be from 1 MHz to 24 MHz with 1-MHz steps. The external clock must be inside accuracy
limits (–10%/+10%) of the selected frequency for valid clock detection.
The SYNC_CLK_INT interrupt in INT_TOP_1 register is also generated in cases where the external clock is
expected but it is not available. These cases are start-up (read OTP-to-standby transition) when EN_PLL is 1
and Buck regulator enable (standby-to-active transition) when EN_PLL is 1.
16
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Feature Description (continued)
24MHz
RC
Oscillator
Internal
24MHz
clock
CLKIN
Detector
Divider
“EXT_CLK_
FREQ“
Clock Select
Logic
CLKIN
1MHz
24MHz
PLL
“EN_PLL“
1MHz
Divider
24
Figure 7. Clock and PLL Module
Table 2. PLL Operation
DEVICE
OPERATION MODE
PLL AND CLOCK
DETECTOR STATE
INTERRUPT FOR
EXTERNAL CLOCK
EN_PLL
CLOCK
STANDBY
ACTIVE
0
0
Disabled
Disabled
No
No
Internal RC
Internal RC
When external clock
appears or disappears
Automatic change to external
clock when available
STANDBY
ACTIVE
1
1
Enabled
Enabled
When external clock
appears or disappears
Automatic change to external
clock when available
7.3.3 Power-Up
The power-up sequence for the TPS65653-Q1 is as follows:
•
VANA (and VIN_Bx) reach minimum recommended levels (VVANA > VANAUVLO). This initiates power-on-reset
(POR), OTP reading, and enables the system I/O interface. The I2C host should allow at least 1.2 ms before
writing or reading data to the TPS65653-Q1.
•
•
•
Device enters standby mode.
The host can change the default register setting by I2C if needed.
The regulators can be enabled/disabled and the GPO signals can be controlled by EN pin and by I2C
interface.
Transitions between the operating modes are shown in Modes of Operation.
7.3.4 Regulator Control
7.3.4.1 Enabling and Disabling Regulators
The regulators can be enabled when the device is in STANDBY or ACTIVE state. There are two ways for enable
and disable the buck regulators:
•
Using BUCKx_EN bit in BUCKx_CTRL_1 register (BUCKx_EN_PIN_CTRL bit is 0 in BUCKx_CTRL_1
register)
•
Using EN control pin (BUCKx_EN bit is 1 AND BUCKx_EN_PIN_CTRL bit is 1)
If the EN control pin is used for enable and disable then the delay from the control signal rising edge to start-up
is set by BUCKx_STARTUP_DELAY[3:0] bits in BUCKx_DELAY register and the delay from control signal falling
edge to shutdown is set by BUCKx_SHUTDOWN_DELAY[3:0] bits in BUCKx_DELAY register. The delays are
valid only for EN signal transitions and not for control with I2C writings to the BUCKx_EN bit.
The control of the regulator (with 0-ms delays) is shown in Table 3.
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Table 3. Regulator Control
BUCKx_EN
BUCKx_EN_PIN_CTRL
EN PIN
Don't Care
Don't Care
Low
BUCKx OUTPUT VOLTAGE
Disabled
Enable/disable control with
BUCKx_EN bit
0
1
1
1
Don't Care
0
1
1
BUCKx_VSET[7:0]
Disabled
Enable/disable control with
EN pin
High
BUCKx_VSET[7:0]
The buck regulator is enabled by the EN pin or by I2C writing as shown in Figure 8. The soft-start circuit limits the
in-rush current during start-up. When the output voltage rises to a 0.35-V level, the output voltage becomes slew-
rate controlled. If there is a short circuit at the output, and the output voltage does not increase above the 0.35-V
level in 1 ms or the output voltage drops below 0.35-V level during operation (for minimum of 1 ms), the regulator
is disabled, and BUCKx_SC_INT interrupt in INT_BUCK register is set. When the output voltage reaches the
Power-Good threshold level the BUCKx_PG_INT interrupt flag in INT_BUCK register is set. The Power-Good
interrupt flag when reaching valid output voltage can be masked using BUCKx_PGR_MASK bit in BUCK_MASK
register. The Power-Good interrupt flag can be also generated when the output voltage becomes invalid. The
interrupt mask for invalid output voltage detection is set by BUCKx_PGF_MASK bit in BUCK_MASK register. A
BUCKx_PG_STAT bit in BUCK_STAT register shows always the validity of the output voltage: 1 means valid and
0 means invalid output voltage. A PGOOD_WINDOW_BUCK bit in PGOOD_CTRL_1 register sets the detection
method for the valid buck output voltage, either undervoltage detection or undervoltage and overvoltage
detection.
Voltage decrease because of load
Voltage
BUCKx_VSET[7:0]
Powergood
Ramp
BUCKx_CTRL_2(BUCKx_SLEW_RATE[2:0])
0.6V
0.35V
Time
Resistive pull-down
(if enabled)
Soft start
Enable
BUCK_STAT(BUCKx_STAT)
BUCK_STAT(BUCKx_PG_STAT)
INT_BUCK(BUCKx_PG_INT)
nINT
0
0
0
1
0
0
1
1
1
0
1
1
0
0 1
0
0
Powergood
interrupts
Host clears
interrupts
BUCK_MASK(BUCKx_PGF_MASK) = 0
BUCK_MASK(BUCKx_PGR_MASK) = 0
Figure 8. Buck Regulator Enable and Disable
The EN input pin has an integrated pulldown resistor. The pulldown resistor is controlled with EN_PD bit in
CONFIG register.
18
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7.3.4.2 Changing Output Voltage
The output voltage of the regulator can be changed by writing to the BUCKx_VOUT register. The voltage change
for buck regulator is always slew-rate controlled, and the slew-rate is defined by the BUCKx_SLEW_RATE[2:0]
bits in BUCKx_CTRL_2 register. During voltage change the forced PWM mode is used automatically. When the
programmed output voltage is achieved, the mode becomes the one defined by load current, and the
BUCKx_FPWM bit in BUCKx_CTRL_1 register.
The voltage change and Power-Good interrupts are shown in Figure 9.
Ramp for Buck
BUCKx_CTRL2(SLEW_RATEx[2:0])
Voltage
BUCKx_VSET
Powergood
Powergood
Time
BUCK_STAT(BUCKx_STAT)
BUCK_STAT(BUCKx_PG_STAT)
INT_BUCK(BUCKx_PG_INT)
1
1
0
0
1
1
0
1
1
0
0
nINT
Powergood
interrupt
Host clears
interrupt
Powergood
interrupt
Host clears
interrupt
BUCK_MASK(BUCKx_PGF_MASK)=0
BUCK_MASK(BUCKx_PGR_MASK)=0
Figure 9. Regulator Output Voltage Change
7.3.5 Enable and Disable Sequences
The TPS65653-Q1 device supports start-up and shutdown sequencing with programmable delays for different
regulator outputs using single EN control signal. The Buck regulator is selected for delayed control with:
•
•
•
•
BUCKx_EN = 1 in BUCKx_CTRL_1 register
BUCKx_EN_PIN_CTRL = 1 in BUCKx_CTRL_1 register
BUCKx_VSET[7:0] bits in BUCKx_VOUT register defines the voltage when EN pin is high
The delay from rising edge of EN pin to the regulator enable is set by BUCKx_STARTUP_DELAY[3:0] bits in
BUCKx_DELAY register and
•
The delay from falling edge of EN pin to the regulator disable is set by BUCKx_SHUTDOWN_DELAY[3:0] bits
in BUCKx_DELAY register.
The GPO (and GPO2) digital output signals can be also controlled as a part of start-up and shutdown
sequencing with the following settings:
•
•
•
GPOx_EN = 1 in GPO_CTRL register
GPOx_EN_PIN_CTRL = 1 in GPO_CTRL register
The delay from rising edge of EN pin to the rising edge of GPO/GPO2 signal is set by
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GPOx_STARTUP_DELAY[3:0] bits in GPOx_DELAY register and
•
The delay from falling edge of EN pin to the falling edge of GPO/GPO2 signal is set by
GPOx_SHUTDOWN_DELAY[3:0] bits in GPOx_DELAY register.
An example of the start-up and shutdown sequences for the buck regulators are shown in Figure 10. The start-up
and shutdown delays for the Buck0 regulator are 1 ms and 4 ms; for the Buck1 regulator start-up and shutdown
delays are 3 ms and 1 ms. The delay settings are used only for enable/disable control with EN signal.
Typical sequence
EN
EN_BUCK0
EN_BUCK1
1ms
4ms
3ms
1ms
Sequence with short EN low and high periods
EN
Startup cntr
0
0
0
1
0
1
2
3
4
5
6
0
Shutdown cntr
EN_BUCK0
EN_BUCK1
0
1
0
1
2 0
1
2
3
4
5
1ms
4ms
3ms
1ms
Figure 10. Start-Up and Shutdown Sequencing
20
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7.3.6 Device Reset Scenarios
There are two reset methods implemented on the TPS65653-Q1:
•
•
Software reset with SW_RESET bit in RESET register
Undervoltage lockout (UVLO) reset from VANA supply
An SW reset occurs when SW_RESET bit is written 1. The bit is automatically cleared after writing. This event
disables all the regulators immediately, drives GPO and GPO2 signals low, resets all the register bits to the
default values and OTP bits are loaded (see Figure 15). I2C interface is not reset during software reset.
If VANA supply voltage falls below the UVLO threshold level then all the regulators are disabled immediately,
GPO and GPO2 signals are driven low, and all the register bits are reset to the default values. When the VANA
supply voltage transition above UVLO threshold level an internal POR occurs. OTP bits are loaded to the
registers and a startup is initiated according to the register settings.
7.3.7 Diagnosis and Protection Features
The TPS65653-Q1 is capable of providing four levels of protection features:
•
•
•
•
Information of valid regulator output voltage which sets interrupt or PGOOD signal;
Warnings for diagnosis which sets interrupt;
Protection events which are disabling the regulators; and
Faults which are causing the device to shutdown.
The TPS65653-Q1 sets the flag bits indicating what protection or warning conditions have occurred, and the
nINT pin is pulled low. nINT is released again after a clear of flags is complete. The nINT signal stays low until all
the pending interrupts are cleared.
When a fault is detected or software requested reset, it is indicated by a RESET_REG_INT interrupt flag in
INT_TOP_2 register after next start-up. If the RESET_REG_MASK is set to masked in the OTP, the interrupt is
not generated. The mask bit change with I2C does not affect, because the RESET_REG_MASK bit is loaded
from OTP during reset sequence.
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Table 4. Summary of Interrupt Signals
RECOVERY/INTERRUPT
CLEAR
EVENT
OUTCOME
INTERRUPT BIT
INTERRUPT MASK BIT
STATUS BIT
Write 1 to BUCKx_ILIM_INT bit
Interrupt is not cleared if current
limit is active
BUCK_INT
BUCKx_ILIM_INT
Buck current limit triggered
No effect
BUCKx_ILIM_MASK
BUCKx_ILIM_STAT
Buck short circuit (VOUT < 0.35
V at 1 ms after enable) or
overload (VOUT decreasing
below 0.35 V during operation,
1-ms debounce)
BUCK_INT
BUCKx_SC_INT
Regulator disable
No effect
N/A
N/A
Write 1 to BUCKx_SC_INT bit
Write 1 to TDIE_WARN_INT bit
Interrupt is not cleared if
temperature is above thermal
warning level
Thermal warning
TDIE_WARN_INT
TDIE_WARN_MASK
TDIE_WARN_STAT
Write 1 to TDIE_SD_INT bit
Interrupt is not cleared if
temperature is above thermal
shutdown level
All regulators disabled
immediately and GPO
and GPO2 are set to low
Thermal shutdown
TDIE_SD_INT
OVP_INT
N/A
N/A
TDIE_SD_STAT
OVP_STAT
All regulators disabled
immediately and GPO
and GPO2 are set to low
Write 1 to OVP_INT bit
Interrupt is not cleared if VANA
voltage is above VANAOVP level
VANA overvoltage (VANAOVP
)
Buck power good, output
voltage becomes valid
BUCK_INT
BUCKx_PG_INT
No effect
BUCKx_PGR_MASK
BUCKx_PGF_MASK
PGOOD_MASK
BUCKx_PG_STAT
BUCKx_PG_STAT
PGOOD_STAT
SYNC_CLK_STAT
N/A
Write 1 to BUCKx_PG_INT bit
Write 1 to BUCKx_PG_INT bit
Write 1 to PGOOD_INT bit
Write 1 to SYNC_CLK_INT bit
Write 1 to I_MEAS_INT bit
Buck power good, output
voltage becomes invalid
BUCK_INT
BUCKx_PG_INT
No effect
PGOOD pin changing from
active to inactive state(1)
No effect
PGOOD_INT
External clock appears or
disappears
No effect to regulators
No effect
SYNC_CLK_INT(2)
I_MEAS_INT
SYNC_CLK_MASK
I_MEAS_MASK
Load current measurement
ready
Immediate shutdown,
registers reset to default
values
Supply voltage VANAUVLO
triggered (VANA falling)
N/A
N/A
N/A
N/A
N/A
Startup, registers reset to
default values and OTP
bits loaded
Supply voltage VANAUVLO
triggered (VANA rising)
RESET_REG_INT
RESET_REG_MASK
Write 1 to RESET_REG_INT bit
Immediate shutdown
followed by power up,
registers reset to default
values
Software requested reset
RESET_REG_INT
RESET_REG_MASK
N/A
Write 1 to RESET_REG_INT bit
(1) PGOOD_STAT bit is 1 when the PGOOD pin shows valid voltages. PGOOD_POL bit in PGOOD_CTRL_1 register affects only PGOOD
pin polarity, not Power Good and PGOOD_INT interrupt polarity.
(2) Interrupt is generated during clock-detector operation and if clock is not available when clock detector is enabled.
7.3.7.1 Power-Good Information (PGOOD pin)
In addition to the interrupt-based indication of the current limit and the Power-Good level the TPS65653-Q1
device supports monitoring with PGOOD signal:
•
•
•
•
Regulator output voltage,
Input supply overvoltage,
Thermal warning and
Thermal shutdown.
Regulator output voltage monitoring (not current limit monitoring) can be selected for PGOOD indication. This
selection is individual for both buck regulators and is set by EN_PGOOD_BUCKx bits in PGOOD_CTRL_1
register. When a regulator is disabled, the monitoring is automatically masked to prevent it forcing PGOOD
inactive. A thermal warning can be also selected for PGOOD indication with EN_PGOOD_TWARN bit in
PGOOD_CTRL_2 register. The monitoring from all the output rails, thermal warning (TDIE_WARN_STAT), input
overvoltage interrupt (OVP_INT), and thermal shutdown interrupt (TDIE_SD_INT) are combined, and PGOOD
pin is active only if all the selected sources shows a valid status.
The type of output voltage monitoring for PGOOD signal is selected by PGOOD_WINDOW_x bits in
PGOOD_CTRL_1 register. If the bit is 0, only undervoltage is monitored; if the bit is 1, both undervoltage and
overvoltage are monitored.
The polarity and the output type (push-pull or open-drain) are selected by the PGOOD_POL and PGOOD_OD
bits in the PGOOD_CTRL_1 register.
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PGOOD is only active or asserted when all enabled power resource output voltages are within specified
tolerance for each requested/programmed output voltage.
PGOOD is inactive or de-asserted if any enabled power resource output voltages is outside specified tolerance
for each requested/programmed output voltage.
The device OTP setting selects either gated (that is, unusual) or continuous (that is, invalid) mode of operation.
7.3.7.1.1 PGOOD Pin Gated mode
The gated (or unusual) mode of operation is selected by setting PGOOD_MODE bit to 0 in PGOOD_CTRL_2
register.
For the gated mode of operation, PGOOD behaves as follows:
•
•
PGOOD is set to active or asserted state upon exiting OTP configuration as an initial default state.
PGOOD status is suspended or unchanged during an 800-µs gated time period, thereby gating-off the status
indication.
•
•
•
During normal power-up sequencing and requested voltage changes, PGOOD state is not changed during an
800-µs gated time period. It typically remains active or asserted for normal conditions.
During an abnormal power-up sequencing and requested voltage changes, PGOOD status could change to
inactive or de-asserted after an 800-µs gated time period if any output voltage is outside of regulation range.
Using the gated mode of operation could allow the PGOOD signal to initiate an immediate power shutdown
sequence if the PGOOD signal is wired-OR with signal connected to EN input. This type of circuit
configuration provides a smart PORz function for processor that eliminates the need for additional
components to generate PORz upon start-up and to monitor voltage levels of key voltage domains.
The fault sets corresponding fault bit 1 in PG_FAULT register. The detected fault must be cleared to continue the
PGOOD monitoring. The overvoltage and thermal shutdown are cleared by writing 1 to the OVP_INT and
TDIE_SD_INT interrupt bits in INT_TOP_1 register. The regulator fault is cleared by writing 1 to the
corresponding register bit in PG_FAULT register. The interrupts can be also cleared with VANA UVLO by
toggling the input supply. An example of PGOOD pin operation in gated mode is shown in Figure 11.
V(VANA)
VANA_UVLO
Shut
down
Read
OTP
Standby
Active
State
PGOOD pin
Clear fault
EN pin
4ms
Buck internal enable
VOUT (Buck1)
800us Timer
Buck1 internal powergood
Figure 11. PGOOD Pin Operation in Gated Mode
7.3.7.1.2 PGOOD Pin Continuous Mode
The continuous (or unvalid) mode of operation is selected by setting PGOOD_MODE bit to 1 in
PGOOD_CTRL_2 register.
For the continuous mode of operation, PGOOD behaves as follows:
•
PGOOD is set to active or asserted state upon exiting OTP configuration.
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•
•
•
PGOOD is set to inactive or de-asserted as soon as regulator is enabled.
PGOOD status begins indicating output voltage regulation status immediately and continuously.
During power-up sequencing and requested voltage changes, PGOOD will toggle between inactive or de-
asserted while output voltages are outside of regulation ranges and active or asserted when inside of
regulation ranges.
The PG_FAULT register bits are latched and maintain the fault information until host clears the fault bit by writing
1 to the bit. The PGOOD signal indicates also a thermal shutdown and input overvoltage interrupts, which are
cleared by clearing the interrupt bits.
When regulator voltage is transitioning from one target voltage to another, the PGOOD signal is set inactive.
When the PGOOD signal becomes inactive, the source for the fault can be read from PG_FAULT register. If the
invalid output voltage becomes valid again the PGOOD signal becomes active. Thus the PGOOD signal shows
all the time if the monitored output voltages are valid. The block diagram for this operation is shown in Figure 12
and an example of operation is shown in Figure 13.
The PGOOD signal can be also configured so that it maintains inactive state even when the monitored outputs
are valid but there are PG_FAULT_x bits in PG_FAULT register pending clearance. This type of operation is
selected by setting PGFAULT_GATES_PGOOD bit to 1 in PGOOD_CTRL_2 register.
EN_PGOOD
_BUCK0
Power Good
Buck0
EN_PGOOD
_BUCK1
Power Good
Buck1
PGOOD
Active high
EN_PGOOD
_TWARN
TDIE_WARN_STAT
TDIE_SD_INT
OVP_INT
Copyright © 2018, Texas Instruments Incorporated
Figure 12. PGOOD Block Diagram (Continuous Mode)
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V(VANA)
VANA_UVLO
State
Shut
down
Read
OTP
Standby
Active
PGOOD pin
EN pin
4ms
Buck1 internal enable
VOUT (Buck1)
Buck1 internal powergood
Figure 13. PGOOD Pin Operation in Continuous Mode
7.3.7.2 Warnings for Diagnosis (Interrupt)
7.3.7.2.1 Output Power Limit
The Buck regulators have programmable output peak current limits. The limits are individually programmed for
both regulators with BUCKx_ILIM[2:0] bits in BUCKx_CTRL_2 register. If the load current is increased so that the
current limit is triggered, the regulator continues to regulate to the limit current level (peak current regulation).
The voltage may decrease if the load current is higher than limit current. If the current regulation continues for 20
µs, the TPS65653-Q1 device sets the BUCKx_ILIM_INT bit in INT_BUCK register and pulls the nINT pin low.
The host processor can read BUCKx_ILIM_STAT bits in BUCK_STAT register to see if the regulator is still in
peak current regulation mode and the interrupt is cleared by writing 1 to BUCKx_ILIM_INT bit. The current limit
interrupt can be masked by setting BUCKx_ILIM_MASK bit in BUCK_MASK register to 1. The Buck overload
situation is shown in Figure 14.
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Regulator disabled
by digital
New startup if
enable is valid
Voltage
VOUTx
350mV
Resistive
pull-down
1ms
Time
Time
Current
ILIMx
20ms
0
0
1
1
0
INT_BUCK(BUCKx_ILIM_INT)
INT_BUCK(BUCKx_SC_INT)
BUCK_STAT(BUCKx_STAT)
nINT
1
0
0
1
Host clearing the interrupt by writing to flags
Figure 14. Buck Regulator Overload Situation
7.3.7.2.2 Thermal Warning
The TPS65653-Q1 device includes a protection feature against overtemperature by setting an interrupt for host
processor. The threshold level of the thermal warning is selected with TDIE_WARN_LEVEL bit in CONFIG
register.
If the TPS65653-Q1 device temperature increases above thermal warning level the device sets
TDIE_WARN_INT bit in INT_TOP_1 register and pulls the nINT pin low. The status of the thermal warning can
be read from TDIE_WARN_STAT bit in TOP_STAT register, and the interrupt is cleared by writing 1 to
TDIE_WARN_INT bit. The thermal warning interrupt can be masked by setting TDIE_WARN_MASK bit in
TOP_MASK_1 register to 1.
7.3.7.3 Protection (Regulator Disable)
If the regulator is disabled because of protection or fault (short-circuit protection, overload protection, thermal
shutdown, input overvoltage protection, or UVLO), the output power FETs are set to high-impedance mode, and
the output pulldown resistor is enabled (if enabled with BUCKx_RDIS_EN bit in BUCKx_CTRL_1 register). The
turnoff time of the output voltage is defined by the output capacitance, load current, and the resistance of the
integrated pull-down resistor. The pulldown resistors are active as long as VANA voltage is above approximately
a 1.2-V level.
7.3.7.3.1 Short-Circuit and Overload Protection
A short-circuit protection feature allows the TPS65653-Q1 to protect itself and external components against short
circuit at the output or against overload during start-up. For buck regulators the fault thresholds are about 350
mV, and the protection is triggered and the regulator is disabled if the output voltage is below the threshold level
1 ms after the regulator is enabled.
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In a similar way the overload situation is protected during normal operation. If the output voltage falls below 0.35
V and 0.3 V and remains below the threshold level for 1 ms the regulator is disabled.
In buck regulator short-circuit and overload situations the BUCKx_SC_INT bit in INT_BUCK register and the
INT_BUCKx bit in INT_TOP_1 register are set to 1, the BUCKx_STAT bit in BUCK_STAT register is set to 0, and
the nINT signal is pulled low. The host processor clears the interrupt by writing 1 to the BUCKx_SC_INT bit.
Upon clearing the interrupt the regulator makes a new start-up attempt if the regulator is in an enabled state.
7.3.7.3.2 Overvoltage Protection
The TPS65653-Q1 device monitors the input voltage from the VANA pin in standby and active operation modes.
If the input voltage rises above VANAOVP voltage level, all the regulators are disabled immediately (without
switching ramp, no shutdown delays), pulldown resistors discharge the output voltages if they are enabled
(BUCKx_RDIS_EN = 1 in BUCKx_CTRL_1 register), GPOs are set to logic low level, nINT signal is pulled low,
OVP_INT bit in INT_TOP_1 register is set to 1, and BUCKx_STAT bit in BUCK_STAT register is set to 0. The
host processor clears the interrupt by writing 1 to the OVP_INT bit. If the input voltage is above overvoltage
detection level the interrupt is not cleared. The host can read the status of the overvoltage from the OVP_STAT
bit in TOP_STAT register. Regulators cannot be enabled as long as the input voltage is above overvoltage
detection level or the overvoltage interrupt is pending.
7.3.7.3.3 Thermal Shutdown
The TPS65653-Q1 has an overtemperature protection function that operates to protect itself from short-term
misuse and overload conditions. When the junction temperature exceeds around 150°C, the regulators are
disabled immediately (without switching ramp, no shutdown delays), the TDIE_SD_INT bit in INT_TOP_1 register
is set to 1, the nINT signal is pulled low, and the device enters STANDBY. nINT is cleared by writing 1 to the
TDIE_SD_INT bit. If the temperature is above thermal shutdown level the interrupt is not cleared. The host can
read the status of the thermal shutdown from the TDIE_SD_STAT bit in TOP_STAT register. Regulators cannot
be enabled as long as the junction temperature is above thermal shutdown level or the thermal shutdown
interrupt is pending.
7.3.7.4 Fault (Power Down)
7.3.7.4.1 Undervoltage Lockout
When the input voltage falls below VANAUVLO at the VANA pin, the buck regulators are disabled immediately
(without switching ramp, no shutdown delays), and the output capacitor is discharged using the pulldown resistor,
and the TPS65653-Q1 device enters SHUTDOWN. When V(VANA) voltage is above VANAUVLO threshold level, the
device powers up to STANDBY state.
If the reset interrupt is unmasked by default (OTP bit for RESET_REG_MASK is 0 in TOP_MASK_2 register) the
RESET_REG_INT interrupt bit in INT_TOP_2 register indicates that the device has been in SHUTDOWN. The
host processor must clear the interrupt by writing 1 to the RESET_REG_INT bit. If the host processor reads the
RESET_REG_INT interrupt bit after detecting an nINT low signal, it knows that the input supply voltage has been
below VANAUVLO level (or the host has requested reset with SW_RESET bit in RESET register), and the
registers are reset to default values.
7.3.8 Operation of the GPO Signals
The TPS65653-Q1 device supports up to 2 general purpose output signals, GPO and GPO2. The GPO2 signal is
multiplexed with CLKIN signal. The selection between CLKIN and GPO2 pin function is set with CLKIN_PIN_SEL
bit in CONFIG register.
The GPO pins are configured with the following bits:
•
GPOx_OD bit in GPO_CTRL register defines the type of the output, either push-pull with V(VANA) level or open
drain
The logic level of the GPOx pin is set by EN_GPOx bit in GPO_CTRL register.
The control of the GPOs can be included to start-up and shutdown sequences. The GPO control for a sequence
with EN pin is selected by GPOx_EN_PIN_CTRL bit in GPO_CTRL register. For start-up and shutdown
sequence control see Enable and Disable Sequences.
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7.3.9 Digital Signal Filtering
The digital signals have a debounce filtering. The signal or supply is sampled with a clock signal and a counter.
This results as an accuracy of one clock period for the debounce window.
Table 5. Digital Signal Filtering
RISING EDGE
LENGTH
FALLING EDGE
LENGTH
EVENT
SIGNAL/SUPPLY
Enable/disable for BUCKx or
GPOx
EN
3 µs(1)
3 µs(1)
VANA UVLO
VANA
VANA
3 µs(1) (VANA voltage rising)
Immediate (VANA voltage falling)
VANA overvoltage
Thermal warning
Thermal shutdown
Current limit
1 µs (VANA voltage rising)
20 µs (VANA voltage falling)
TDIE_WARN_INT
TDIE_SD_INT
VOUTx_ILIM
FB_B0, FB_B1
20 µs
20 µs
20 µs
1 ms
20 µs
20 µs
20 µs
N/V
Overload
PGOOD pin and power-good
interrupt
PGOOD / FB_B0, FB_B1
6 µs
6 µs
(1) No glitch filtering, only synchronization.
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7.4 Device Functional Modes
7.4.1 Modes of Operation
SHUTDOWN: The V(VANA) voltage is below VANAUVLO threshold level. All switch, reference, control, and bias
circuitry of the TPS65653-Q1 device are turned off.
READ OTP: The main supply voltage V(VANA) is above VANAUVLO level. The regulators are disabled, and the
reference and bias circuitry of the TPS65653-Q1 are enabled. The OTP bits are loaded to registers.
STANDBY: The main supply voltage V(VANA) is above VANAUVLO level. The regulators are disabled, and the
reference, control and bias circuitry of the TPS65653-Q1 are enabled. All registers can be read or
written by the host processor via the system serial interface. The regulators can be enabled if
needed.
ACTIVE:
The main supply voltage V(VANA) is above VANAUVLO level. At least one regulator is enabled. All
registers can be read or written by the host processor via the system serial interface.
The operating modes and transitions between the modes are shown in Figure 15.
SHUTDOWN
V(
< VANAUVLO
VANA)
V(
> VANAUVLO
FROM ANY STATE
VANA)
EXCEPT SHUTDOWN
READ
OTP
REG
RESET
STANDBY
2
I C RESET
REGULATOR
ENABLED
REGULATOR(S)
DISABLED
ACTIVE
Figure 15. Device Operation Modes
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7.5 Programming
7.5.1 I2C-Compatible Interface
The I2C-compatible synchronous serial interface provides access to the programmable functions and registers on
the device. This protocol uses a two-wire interface for bidirectional communications between the IC's connected
to the bus. The two interface lines are the serial data line (SDA), and the serial clock line (SCL). Every device on
the bus is assigned a unique address and acts as either a master or a slave depending on whether it generates
or receives the serial clock SCL. The SCL and SDA lines must each have a pullup resistor placed on the line and
remain HIGH even when the bus is idle. The TPS65653-Q1 supports standard mode (100 kHz), fast mode (400
kHz), fast mode plus (1 MHz), and high-speed mode (3.4 MHz).
7.5.1.1 Data Validity
The data on the SDA line must be stable during the HIGH period of the clock signal (SCL). In other words, the
state of the data line can only be changed when clock signal is LOW.
SCL
SDA
data
change
allowed
data
change
allowed
data
change
allowed
data
valid
data
valid
Figure 16. Data Validity Diagram
7.5.1.2 Start and Stop Conditions
The TPS65653-Q1 is controlled via an I2C-compatible interface. START and STOP conditions classify the
beginning and end of the I2C session. A START condition is defined as SDA transitions from HIGH to LOW while
SCL is HIGH. A STOP condition is defined as SDA transition from LOW to HIGH while SCL is HIGH. The I2C
master always generates the START and STOP conditions.
SDA
SCL
S
P
START
STOP
Condition
Condition
Figure 17. Start and Stop Sequences
The I2C bus is considered busy after a START condition and free after a STOP condition. During data
transmission the I2C master can generate repeated START conditions. A START and a repeated START
condition are equivalent function-wise. The data on SDA must be stable during the HIGH period of the clock
signal (SCL). In other words, the state of SDA can only be changed when SCL is LOW. Figure 18 shows the
SDA and SCL signal timing for the I2C-compatible bus. See the Figure 1 for timing values.
30
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Programming (continued)
tBUF
SDA
tHD;STA
trCL
tfDA
trDA
tSP
tLOW
tfCL
SCL
tHD;STA
tSU;STA
tSU;STO
tHIGH
tHD;DAT
S
tSU;DAT
S
RS
P
START
REPEATED
START
STOP
START
Figure 18. I2C-Compatible Timing
7.5.1.3 Transferring Data
Every byte put on the SDA line must be eight bits long, with the most significant bit (MSB) being transferred first.
Each byte of data has to be followed by an acknowledge bit. The acknowledge related clock pulse is generated
by the master. The master releases the SDA line (HIGH) during the acknowledge clock pulse. The TPS65653-Q1
pulls down the SDA line during the 9th clock pulse, signifying an acknowledge. The TPS65653-Q1 generates an
acknowledge after each byte has been received.
There is one exception to the acknowledge after every byte rule. When the master is the receiver, it must
indicate to the transmitter an end of data by not-acknowledging (negative acknowledge) the last byte clocked out
of the slave. This negative acknowledge still includes the acknowledge clock pulse (generated by the master),
but the SDA line is not pulled down.
NOTE
If the V(VANA) voltage is below VANAUVLO threshold level during I2C communication the
TPS65653-Q1 device does not drive SDA line. The ACK signal and data transfer to the
master is disabled at that time.
After the START condition, the bus master sends a chip address. This address is seven bits long followed by an
eighth bit which is a data direction bit (READ or WRITE). For the eighth bit, a 0 indicates a WRITE, and a 1
indicates a READ. The second byte selects the register to which the data will be written. The third byte contains
data to write to the selected register.
ACK from slave
ACK from slave
ACK from slave
START MSB Chip Address LSB
W
ACK MSB Register Address LSB ACK
MSB Data LSB
ACK STOP
SCL
SDA
START
id = 0x60
W
ACK
address = 0x40
ACK
address 0x40 data
ACK STOP
Figure 19. Write Cycle (w = write; SDA = 0). Example Device Address = 0x60
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Programming (continued)
ACK from slave
ACK from slave REPEATED START
ACK from slave Data from slave NACK from master
START MSB Chip Address LSB
W
MSB Register Address LSB
RS
MSB Chip Address LSB
R
MSB Data LSB
STOP
SCL
SDA
START
ACK
ACK
ACK
NACK
STOP
id = 0x60
W
address = 0x3F
RS
id = 0x60
R
address 0x3F data
When READ function is to be accomplished, a WRITE function must precede the READ function as shown above.
Figure 20. Read Cycle (r = read; SDA = 1). Example Device Address = 0x60
7.5.1.4 I2C-Compatible Chip Address
NOTE
The device address for the TPS65653-Q1 is 0x61.
After the START condition, the I2C master sends the 7-bit address followed by an eighth bit, read or write (R/W).
R/W = 0 indicates a WRITE and R/W = 1 indicates a READ. The second byte following the device address
selects the register address to which the data is written. The third byte contains the data for the selected register.
MSB
LSB
1
Bit 7
1
Bit 6
0
Bit 5
0
Bit 4
0
Bit 3
0
Bit 2
0
Bit 1
R/W
Bit 0
I2C Slave Address (chip address)
Here in an example with device address of 1100000Bin = 60Hex.
Figure 21. Device Address Example
7.5.1.5 Auto-Increment Feature
The auto-increment feature allows writing several consecutive registers within one transmission. Every time an 8-
bit word is sent to the TPS65653-Q1, the internal address index counter is incremented by one and the next
register is written. Table 6 shows writing sequence to two consecutive registers. Note that auto-increment feature
does not work for read.
Table 6. Auto-Increment Example
DEVICE
ADDRES WRITE
S = 0x61
MASTER
ACTION
REGISTER
ADDRESS
START
DATA
DATA
STOP
TPS6565
3-Q1
ACK
ACK
ACK
ACK
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7.6 Register Maps
7.6.1 Register Descriptions
The TPS65653-Q1 is controlled by a set of registers through the I2C-compatible interface. The device registers,
their addresses and their abbreviations are listed in Table 7. A more detailed description is given in the
DEV_REV to I_LOAD_1 sections.
An "X" indicates register bits which are updated from OTP memory during READ OTP state.
Table 7. Summary of TPS65653-Q1 Control Registers
Read /
Write
Addr
Register
D7
D6
D5
D4
D3
D2
D1
D0
0x00
0x01
DEV_REV
OTP_REV
R
DEVICE_ID[1:0]
Reserved
R
OTP_ID[7:0]
BUCK0_
EN_PIN_CT BUCK0_EN
RL
BUCK0_
CTRL_1
BUCK0_FP BUCK0_RDI
0x02
0x03
0x04
R/W
R/W
R/W
Reserved
Reserved
WM
S_EN
BUCK0_
CTRL_2
Reserved
Reserved
BUCK0_ILIM[2:0]
BUCK1_ILIM[2:0]
BUCK0_SLEW_RATE[2:0]
BUCK1_
EN_PIN_CT BUCK1_EN
RL
BUCK1_
CTRL_1
BUCK1_FP BUCK1_RDI
WM
S_EN
BUCK1_
CTRL_2
0x05
0x06
0x07
0x0C
0x0D
0x10
0x11
R/W
R/W
R/W
R/W
R/W
R/W
R/W
BUCK1_SLEW_RATE[2:0]
BUCK0_
VOUT
BUCK0_VSET[7:0]
BUCK1_VSET[7:0]
BUCK1_
VOUT
BUCK0_
DELAY
BUCK0_SHUTDOWN_DELAY[3:0]
BUCK1_SHUTDOWN_DELAY[3:0]
GPO_SHUTDOWN_DELAY[3:0]
BUCK0_STARTUP_DELAY[3:0]
BUCK1_STARTUP_DELAY[3:0]
GPO_STARTUP_DELAY[3:0]
BUCK1_
DELAY
GPO_
DELAY
GPO2_
DELAY
GPO2_SHUTDOWN_DELAY[3:0]
GPO2_
GPO2_STARTUP_DELAY[3:0]
GPO_
GPO_
CTRL
0x12
R/W
Reserved
GPO2_OD EN_PIN_CT GPO2_EN
RL
Reserved
GPO_OD
EN_PIN_CT
RL
GPO_EN
STARTUP_ SHUTDOW
CLKIN_PIN
TDIE
_WARN
_LEVEL
EN_
SPREAD
_SPEC
0x13
0x14
0x15
CONFIG
R/W
R/W
R/W
Reserved
Reserved
DELAY_SE N_DELAY_
_SEL
CLKIN_PD
EN_PD
L
SEL
PLL_CTRL
EN_PLL
Reserved
EXT_CLK_FREQ[4:0]
PGOOD_WI
NDOW_BU
CK
PGOOD_CT
RL_1
PGOOD_P
OL
PGOOD_O
D
EN_PGOOD EN_PGOOD
_BUCK1
Reserved
Reserved
Reserved
_BUCK0
PG_FAULT
_GATES_P
GOOD
PGOOD_CT
RL_2
EN_PGOOD
_TWARN
PGOOD_M
ODE
0x16
R/W
PG_FAULT PG_FAULT
0x17
0x18
0x19
0x1A
0x1B
PG_FAULT
RESET
R
Reserved
_BUCK1
_BUCK0
SW_
RESET
R/W
R/W
R/W
R/W
Reserved
PGOOD_
INT
INT_
SYNC_
TDIE_SD_I
NT
TDIE_
WARN_INT
I_MEAS_
INT
INT_TOP_1
INT_TOP_2
INT_BUCK
Reserved
OVP_INT
BUCK
CLK_INT
RESET_
REG_INT
Reserved
BUCK1_
PG_INT
BUCK1_
SC_INT
BUCK1_
ILIM_INT
BUCK0_
PG_INT
BUCK0_
SC_INT
BUCK0_
ILIM_INT
Reserved
Reserved
TDIE_
WARN_
STAT
TOP_
STAT
PGOOD_ST
AT
SYNC_CLK
_STAT
TDIE_SD
_STAT
OVP_
STAT
0x1D
0x1E
R
R
Reserved
Reserved
BUCK_STA
T
BUCK1_
STAT
BUCK1_
BUCK1_
ILIM_STAT
BUCK0_
STAT
BUCK0_
PG_STAT
BUCK0_
ILIM_STAT
Reserved
Reserved
PG_STAT
Copyright © 2019, Texas Instruments Incorporated
33
TPS65653-Q1
ZHCSJI6 –MARCH 2019
www.ti.com.cn
Register Maps (continued)
Table 7. Summary of TPS65653-Q1 Control Registers (continued)
Read /
Write
Addr
0x20
0x21
Register
D7
D6
D5
D4
D3
D2
D1
D0
TOP_
MASK_1
PGOOD_
INT_MASK
SYNC_CLK
_MASK
TDIE_WAR
N_MASK
I_MEAS_
MASK
R/W
R/W
Reserved
Reserved
Reserved
TOP_
MASK_2
RESET_
REG_MASK
Reserved
BUCK1_
ILIM_
MASK
BUCK0_
ILIM_
MASK
BUCK_MAS
K
BUCK1_PG BUCK1_PG
F_MASK R_MASK
BUCK0_PG BUCK0_PG
F_MASK R_MASK
0x22
0x24
R/W
R/W
Reserved
Reserved
LOAD_CUR
RENT_
BUCK_SEL
ECT
SEL_I_
LOAD
Reserved
Reserved
BUCK_LOA
D_CURREN
T[8]
0x25
0x26
I_LOAD_2
I_LOAD_1
R
R
BUCK_LOAD_CURRENT[7:0]
34
Copyright © 2019, Texas Instruments Incorporated
TPS65653-Q1
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ZHCSJI6 –MARCH 2019
7.6.1.1 DEV_REV
Address: 0x00
D7
D6
D5
D4
D3
D2
D1
D0
DEVICE_ID[1:0]
Reserved
Bits
7:6
Field
Type
R
Default
X
Description
DEVICE_ID[1:0]
Reserved
Device specific ID code.
5:0
R
00 0010
7.6.1.2 OTP_REV
Address: 0x01
D7
D6
D5
D4
D3
D2
D1
D0
OTP_ID[7:0]
Bits
Field
Type
Default
Description
7:0
OTP_ID[7:0]
R
X
Identification Code of the OTP EPROM Version.
7.6.1.3 BUCK0_CTRL_1
Address: 0x02
D7
D6
D5
D4
D3
D2
D1
D0
BUCK0_EN
Reserved
BUCK0_FPWM BUCK0_RDIS_ BUCK0_EN_PI
EN
N_CTRL
Bits
7:4
3
Field
Type
R/W
R/W
Default
0000
X
Description
Reserved
BUCK0_FPWM
Buck0 mode selection:
0 - Automatic transitions between PFM and PWM modes (AUTO mode)
1 - Forced to PWM operation.
2
1
0
BUCK0_RDIS_EN
R/W
R/W
R/W
1
X
X
Enable output discharge resistor (RDIS_Bx) when Buck0 is disabled:
0 - Discharge resistor disabled
1 - Discharge resistor enabled.
BUCK0_EN_PIN
_CTRL
Enable control for Buck0:
0 - only BUCK0_EN bit controls Buck0
1 - BUCK0_EN bit AND EN pin control Buck0.
BUCK0_EN
Enable Buck0 regulator:
0 - Buck0 regulator is disabled
1 - Buck0 regulator is enabled.
7.6.1.4 BUCK0_CTRL_2
Address: 0x03
D7
D6
D5
D4
D3
D2
D1
BUCK0_SLEW_RATE[2:0]
D0
Reserved
BUCK0_ILIM[2:0]
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35
TPS65653-Q1
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Bits
7:6
Field
Type
R/W
R/W
Default
Description
Reserved
00
X
5:3
BUCK0_ILIM[2:0]
Sets the switch current limit of Buck0. Can be programmed at any time during
operation:
0x0 - 1.5 A
0x1 - 2.0 A
0x2 - 2.5 A
0x3 - 3.0 A
0x4 - 3.5 A
0x5 - 4.0 A
0x6 - Reserved
0x7 - Reserved
2:0 BUCK0_SLEW_RA
TE[2:0]
R/W
X
Sets the output voltage slew rate for Buck0 regulator (rising and falling edges):
0x0 - Reserved
0x1 - Reserved
0x2 - 10 mV/µs
0x3 - 7.5 mV/µs
0x4 - 3.8 mV/µs
0x5 - 1.9 mV/µs
0x6 - 0.94 mV/µs
0x7 - 0.47 mV/µs
7.6.1.5 BUCK1_CTRL_1
Address: 0x04
D7
D6
D5
D4
D3
D2
D1
D0
Reserved
BUCK1_FPWM BUCK1_RDIS_ BUCK1_EN_PI
BUCK1_EN
EN
N_CTRL
Bits
7:4
3
Field
Type
R/W
R/W
Default
0000
X
Description
Reserved
BUCK1_FPWM
Buck1 mode selection:
0 - Automatic transitions between PFM and PWM modes (AUTO mode)
1 - Forced to PWM operation.
2
1
0
BUCK1_RDIS_EN
R/W
R/W
R/W
1
X
X
Enable output discharge resistor (RDIS_Bx) when Buck1 is disabled:
0 - Discharge resistor disabled
1 - Discharge resistor enabled.
BUCK1_EN_PIN
_CTRL
Enable control for Buck1:
0 - only BUCK1_EN bit controls Buck1
1 - BUCK1_EN bit AND EN pin control Buck1.
BUCK1_EN
Enable Buck1 regulator:
0 - Buck1 regulator is disabled
1 - Buck1 regulator is enabled.
7.6.1.6 BUCK1_CTRL_2
Address: 0x05
D7
D6
D5
D4
D3
D2
D1
BUCK1_SLEW_RATE[2:0]
D0
Reserved
BUCK1_ILIM[2:0]
36
Copyright © 2019, Texas Instruments Incorporated
TPS65653-Q1
www.ti.com.cn
Bits
ZHCSJI6 –MARCH 2019
Field
Type
R/W
R/W
Default
Description
7:6
5:3
Reserved
00
X
BUCK1_ILIM[2:0]
Sets the switch current limit of Buck1. Can be programmed at any time during
operation:
0x0 - 1.5 A
0x1 - 2.0 A
0x2 - 2.5 A
0x3 - 3.0 A
0x4 - 3.5 A
0x5 - 4.0 A
0x6 - Reserved
0x7 - Reserved
2:0 BUCK1_SLEW_RA
TE[2:0]
R/W
X
Sets the output voltage slew rate for Buck1 regulator (rising and falling edges):
0x0 - Reserved
0x1 - Reserved
0x2 - 10 mV/µs
0x3 - 7.5 mV/µs
0x4 - 3.8 mV/µs
0x5 - 1.9 mV/µs
0x6 - 0.94 mV/µs
0x7 - 0.47 mV/µs
7.6.1.7 BUCK0_VOUT
Address: 0x06
D7
D6
D5
D4
D3
D2
D1
D0
BUCK0_VSET[7:0]
Bits
Field
Type
Default
Description
7:0 BUCK0_VSET[7:0]
R/W
X
Sets the output voltage of Buck0 regulator
Reserved, DO NOT USE
0x00 ... 0x4C
1 V - 1.4 V, 5 mV steps
0x4C - 1 V
...
0x9D - 1.4 V
1.4 V - 3.36 V, 20 mV steps
0x9E - 1.42 V
...
0xFF - 3.36 V
7.6.1.8 BUCK1_VOUT
Address: 0x07
D7
D6
D5
D4
D3
D2
D1
D0
BUCK1_VSET[7:0]
Bits
Field
Type
Default
Description
7:0 BUCK1_VSET[7:0]
R/W
X
Sets the output voltage of Buck1 regulator
Reserved, DO NOT USE
0x00 ... 0x4C
1 V - 1.4 V, 5 mV steps
0x4C - 1 V
...
0x9D - 1.4 V
1.4 V - 3.36 V, 20 mV steps
0x9E - 1.42 V
...
0xFF - 3.36 V
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7.6.1.9 BUCK0_DELAY
Address: 0x0C
D7
D6
D5
D4
D3
D2
D1
D0
BUCK0_SHUTDOWN_DELAY[3:0]
BUCK0_STARTUP_DELAY[3:0]
Bits
Field
Type
Default
Description
7:4
BUCK0_
SHUTDOWN_
DELAY[3:0]
R/W
X
Shutdown delay of Buck0 from falling edge of EN signal:
0x0 - 0 ms
0x1 - 0.5 ms (1 ms if SHUTDOWN_DELAY_SEL=1 in CONFIG register)
...
0xF - 7.5 ms (15 ms if SHUTDOWN_DELAY_SEL=1 in CONFIG register)
3:0
BUCK0_
STARTUP_
DELAY[3:0]
R/W
X
Startup delay of Buck0 from rising edge of EN signal:
0x0 - 0 ms
0x1 - 0.5 ms (1 ms if STARTUP_DELAY_SEL=1 in CONFIG register)
...
0xF - 7.5 ms (15 ms if STARTUP_DELAY_SEL=1 in CONFIG register)
7.6.1.10 BUCK1_DELAY
Address: 0x0D
D7
D6
D5
D4
D3
D2
D1
D0
D0
D0
BUCK1_SHUTDOWN_DELAY[3:0]
BUCK1_STARTUP_DELAY[3:0]
Bits
Field
Type
Default
Description
7:4
BUCK1_
SHUTDOWN_
DELAY[3:0]
R/W
X
Shutdown delay of Buck1 from falling edge of EN signal:
0x0 - 0 ms
0x1 - 0.5 ms (1 ms if SHUTDOWN_DELAY_SEL=1 in CONFIG register)
...
0xF - 7.5 ms (15 ms if SHUTDOWN_DELAY_SEL=1 in CONFIG register)
3:0
BUCK1_
STARTUP_
DELAY[3:0]
R/W
X
Startup delay of Buck1 from rising edge of EN signal:
0x0 - 0 ms
0x1 - 0.5 ms (1 ms if STARTUP_DELAY_SEL=1 in CONFIG register)
...
0xF - 7.5 ms (15 ms if STARTUP_DELAY_SEL=1 in CONFIG register)
7.6.1.11 GPO_DELAY
Address: 0x10
D7
D6
D5
D4
D3
D2
D1
GPO_SHUTDOWN_DELAY[3:0]
GPO_STARTUP_DELAY[3:0]
Bits
Field
Type
Default
Description
7:4
GPO_
R/W
X
Delay for GPO falling edge from falling edge of EN signal:
0x0 - 0 ms
0x1 - 0.5 ms (1 ms if SHUTDOWN_DELAY_SEL=1 in CONFIG register)
SHUTDOWN_
DELAY[3:0]
...
0xF - 7.5 ms (15 ms if SHUTDOWN_DELAY_SEL=1 in CONFIG register)
3:0
GPO_
STARTUP_
DELAY[3:0]
R/W
X
Delay for GPO rising edge from rising edge of EN signal:
0x0 - 0 ms
0x1 - 0.5 ms (1 ms if STARTUP_DELAY_SEL=1 in CONFIG register)
...
0xF - 7.5 ms (15 ms if STARTUP_DELAY_SEL=1 in CONFIG register)
7.6.1.12 GPO2_DELAY
Address: 0x11
D7
D6
D5
D4
D3
D2
D1
GPO2_SHUTDOWN_DELAY[3:0]
GPO2_STARTUP_DELAY[3:0]
38
Copyright © 2019, Texas Instruments Incorporated
TPS65653-Q1
www.ti.com.cn
Bits
ZHCSJI6 –MARCH 2019
Field
Type
Default
Description
7:4
GPO2_
SHUTDOWN_
DELAY[3:0]
R/W
X
Delay for GPO2 falling edge from falling edge of EN signal:
0x0 - 0 ms
0x1 - 0.5 ms (1 ms if SHUTDOWN_DELAY_SEL=1 in CONFIG register)
...
0xF - 7.5 ms (15 ms if SHUTDOWN_DELAY_SEL=1 in CONFIG register)
3:0
GPO2_
R/W
X
Delay for GPO2 rising edge from rising edge of EN signal:
STARTUP_
DELAY[3:0]
0x0 - 0 ms
0x1 - 0.5 ms (1 ms if STARTUP_DELAY_SEL=1 in CONFIG register)
...
0xF - 7.5 ms (15 ms if STARTUP_DELAY_SEL=1 in CONFIG register)
7.6.1.13 GPO_CTRL
Address: 0x12
D7
D6
D5
D4
D3
D2
D1
D0
Reserved
GPO2_OD
GPO2_EN_PIN
_CTRL
GPO2_EN
Reserved
GPO_OD
GPO_EN_PIN_
CTRL
GPO_EN
Bits
Field
Type
Default
Description
7
6
Reserved
GP02_OD
R
0
R/W
X
GPO2 signal type when configured as General Purpose Output (CLKIN pin):
0 - Push-pull output (VANA level)
1 - Open-drain output
5
4
GPO2_EN_PIN_C
TRL
R/W
R/W
X
X
Control for GPO2:
0 - Only GPO2_EN bit controls GPO2
1 - GPO2_EN bit AND EN pin control GPO2.
GPO2_EN
Output level of GPO2 signal (when configured as General Purpose Output):
0 - Logic low level
1 - Logic high level
3
2
Reserved
GPO_OD
R
0
R/W
X
GPO signal type:
0 - Push-pull output (VANA level)
1 - Open-drain output
1
0
GPO_EN_PIN_CT
RL
R/W
R/W
X
X
Control for GPO:
0 - Only GPO_EN bit controls GPO
1 - GPO_EN bit AND EN pin control GPO.
GPO_EN
Output level of GPO signal:
0 - Logic low level
1 - Logic high level
7.6.1.14 CONFIG
Address: 0x13
D7
D6
D5
D4
D3
D2
D1
D0
Reserved
STARTUP_DE SHUTDOWN_ CLKIN_PIN_SE
CLKIN_PD
EN2_PD
TDIE_WARN_
LEVEL
EN_SPREAD
_SPEC
LAY_SEL
DELAY_SEL
L
Bits
Field
Type
R/W
R/W
Default
Description
7
6
Reserved
0
STARTUP_DELAY
_SEL
X
Startup delay range from EN signals.
0 - 0 ms - 7.5 ms with 0.5 ms steps
1 - 0 ms - 15 ms with 1 ms steps
5
4
SHUTDOWN_DEL
AY_SEL
R/W
R/W
X
X
Shutdown delay range from EN signals.
0 - 0 ms - 7.5 ms with 0.5 ms steps
1 - 0 ms - 15 ms with 1 ms steps
CLKIN_PIN_SEL
CLKIN pin function:
0 - GPO2
1 - CLKIN
Copyright © 2019, Texas Instruments Incorporated
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www.ti.com.cn
Bits
Field
Type
Default
Description
3
CLKIN_PD
R/W
X
Selects the pull down resistor on the CLKIN input pin. (valid also when selected as
GPO2)
0 - Pull-down resistor is disabled.
1 - Pull-down resistor is enabled.
2
1
0
EN_PD
R/W
R/W
R/W
X
X
X
Selects the pull down resistor on the EN input pin.
0 - Pull-down resistor is disabled.
1 - Pull-down resistor is enabled.
TDIE_WARN_
LEVEL
Thermal warning threshold level.
0 - 125°C
1 - 137°C.
EN_SPREAD
_SPEC
Enable spread spectrum feature:
0 - Disabled
1 - Enabled
7.6.1.15 PLL_CTRL
Address: 0x14
D7
D6
EN_PLL
D5
D4
D3
D2
D1
D0
Reserved
Reserved
EXT_CLK_FREQ[4:0]
Bits
Field
Type
R/W
R/W
Default
Description
7
6
Reserved
EN_PLL
0
X
Selection of external clock and PLL operation:
0 - Forced to internal RC oscillator. PLL disabled.
1 - PLL is enabled in STANDBY and ACTIVE modes. Automatic external clock use
when available, interrupt generated if external clock appears or disappears.
5
Reserved
R/W
R/W
0
This bit must be set to '0'.
4:0 EXT_CLK_FREQ[4
:0]
X
Frequency of the external clock (CLKIN):
0x00 - 1 MHz
0x01 - 2 MHz
0x02 - 3 MHz
...
0x16 - 23 MHz
0x17 - 24 MHz
0x18...0x1F - Reserved
See electrical specification for input clock frequency tolerance.
7.6.1.16 PGOOD_CTRL_1
Address: 0x15
D7
D6
D5
D4
D3
D2
D1
EN_PGOOD_B EN_PGOOD_B
UCK1 UCK0
D0
PGOOD_POL
PGOOD_OD
Reserved
PGOOD_
WINDOW_BUC
K
Reserved
Bits
Field
Type
Default
Description
7
PGOOD_POL
PGOOD_OD
Reserved
R/W
X
PGOOD signal polarity.
0 - PGOOD signal high when monitored outputs are valid
1 - PGOOD signal low when monitored outputs are valid
6
R/W
X
PGOOD signal type:
0 - Push-pull output (VANA level)
1 - Open-drain output
5
4
R/W
R/W
0
PGOOD_
WINDOW_BUCK
X
Buck Output voltage monitoring method for PGOOD signal:
0 - Only undervoltage monitoring
1 - Overvoltage and undervoltage monitoring.
3:2
Reserved
R/W
00
40
Copyright © 2019, Texas Instruments Incorporated
TPS65653-Q1
www.ti.com.cn
Bits
ZHCSJI6 –MARCH 2019
Field
Type
Default
Description
PGOOD signal source control from Buck1
0 - Buck1 is not monitored
1
EN_PGOOD_BUC
K1
R/W
X
1 - Buck1 Power-Good threshold voltage monitored
0
EN_PGOOD_BUC
K0
R/W
X
PGOOD signal source control from Buck0
0 - Buck0 is not monitored
1 - Buck0 Power-Good threshold voltage monitored
7.6.1.17 PGOOD_CTRL_2
Address: 0x16
D7
D6
D5
D4
D3
D2
D1
D0
Reserved
EN_PGOOD_T PG_FAULT_G PGOOD_MOD
WARN
ATES_PGOOD
E
Bits
7:3
2
Field
Type
R/W
R/W
Default
0 0000
X
Description
Reserved
EN_PGOOD_TWA
RN
Thermal warning control for PGOOD signal:
0 - Thermal warning not monitored
1 - PGOOD inactive if thermal warning flag is active.
1
0
PG_FAULT_GATE
S_PGOOD
R/W
R/W
X
X
Type of operation for PGOOD signal:
0 - Indicates live status of monitored voltage outputs.
1 - Indicates status of PG_FAULT register, inactive when at least one PG_FAULT_x
bit is inactive.
PGOOD_MODE
Operating mode for PGOOD signal:
0 - Gated mode
1 - Continuous mode
7.6.1.18 PG_FAULT
Address: 0x17
D7
D6
D5
D4
D3
D2
D1
PG_FAULT_BU PG_FAULT_BU
CK1 CK0
D0
Reserved
Bits
7:2
1
Field
Type
R/W
R/W
Default
00 0000
0
Description
Reserved
PG_FAULT_BUCK
1
Source for PGOOD inactive signal:
0 - Buck1 has not set PGOOD signal inactive.
1 - Buck1 is selected for PGOOD signal and it has set PGOOD signal inactive. This bit
can be cleared by writing '1' to this bit when Buck1 output is valid.
0
PG_FAULT_BUCK
0
R/W
0
Source for PGOOD inactive signal:
0 - Buck0 has not set PGOOD signal inactive.
1 - Buck0 is selected for PGOOD signal and it has set PGOOD signal inactive. This bit
can be cleared by writing '1' to this bit when Buck0 output is valid.
7.6.1.19 RESET
Address: 0x18
D7
D6
D5
D4
D3
D2
D1
D0
Reserved
SW_RESET
Bits
7:1
0
Field
Type
R/W
R/W
Default
000 0000
0
Description
Reserved
SW_RESET
Software commanded reset. When written to 1, the registers will be reset to default
values, OTP memory is read, and the I2C interface is reset.
The bit is automatically cleared.
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www.ti.com.cn
7.6.1.20 INT_TOP_1
Address: 0x19
D7
D6
D5
D4
D3
D2
D1
D0
PGOOD_INT
Reserved
BUCK_INT
SYNC_CLK_IN TDIE_SD_INT TDIE_WARN_I
OVP_INT
I_MEAS_INT
T
NT
Bits
Field
Type
Default
Description
7
PGOOD_INT
R/W
0
Latched status bit indicating that the PGOOD pin has changed from active to inactive.
Write 1 to clear interrupt.
6
5
Reserved
R
R
0
0
BUCK_INT
Interrupt indicating that Buck1 and/or Buck0 have a pending interrupt. The reason for
the interrupt is indicated in INT_BUCK register.
This bit is cleared automatically when INT_BUCK register is cleared to 0x00.
4
3
SYNC_CLK_INT
TDIE_SD_INT
R/W
R/W
0
0
Latched status bit indicating that the external clock has appeared or disappeared.
Write 1 to clear interrupt.
Latched status bit indicating that the die junction temperature has exceeded the
thermal shutdown level. The regulators have been disabled if they were enabled and
GPO and GPO2 signals are driven low. The regulators cannot be enabled if this bit is
active. The actual status of the thermal shutdown is indicated by TDIE_SD_STAT bit in
TOP_STAT register.
Write 1 to clear interrupt.
2
1
TDIE_WARN_INT
OVP_INT
R/W
R/W
0
0
Latched status bit indicating that the die junction temperature has exceeded the
thermal warning level. The actual status of the thermal warning is indicated by
TDIE_WARN_STAT bit in TOP_STAT register.
Write 1 to clear interrupt.
Latched status bit indicating that the input voltage has exceeded the over-voltage
detection level. The regulators have been disabled if they were enabled and GPO and
GPO2 signals are driven low. The actual status of the over-voltage is indicated by
OVP_STAT bit in TOP_STAT register.
Write 1 to clear interrupt.
0
I_MEAS_INT
R/W
0
Latched status bit indicating that the load current measurement result is available in
I_LOAD_1 and I_LOAD_2 registers.
Write 1 to clear interrupt.
7.6.1.21 INT_TOP_2
Address: 0x1A
D7
D6
D5
D4
D3
D2
D1
D0
Reserved
RESET_REG_I
NT
Bits
7:1
0
Field
Type
R/W
R/W
Default
000 0000
0
Description
Reserved
RESET_REG_INT
Latched status bit indicating that either VANA supply voltage has been below
undervoltage threshold level or the host has requested a reset using SW_RESET bit in
RESET register. The regulators have been disabled, and registers are reset to default
values and the normal startup procedure is done.
Write 1 to clear interrupt.
7.6.1.22 INT_BUCK
Address: 0x1B
D7
D6
BUCK1_PG
_INT
D5
D4
D3
D2
D1
D0
Reserved
BUCK1_SC
_INT
BUCK1_ILIM
_INT
Reserved
BUCK0_PG
_INT
BUCK0_SC
_INT
BUCK0_ILIM
_INT
42
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Bits
ZHCSJI6 –MARCH 2019
Field
Type
R/W
R/W
Default
Description
7
6
Reserved
0
0
BUCK1_PG_INT
Latched status bit indicating that Buck1 Power-Good event has been detected.
Write 1 to clear.
5
4
BUCK1_SC_INT
BUCK1_ILIM_INT
R/W
R/W
0
0
Latched status bit indicating that the Buck1 output voltage has been over 1 ms below
short-circuit threshold level.
Write 1 to clear.
Latched status bit indicating that the Buck1 output current limit has been active.
Write 1 to clear.
3
2
Reserved
R/W
R/W
0
0
BUCK0_PG_INT
Latched status bit indicating that Buck0 Power-Good event has been detected.
Write 1 to clear.
1
0
BUCK0_SC_INT
BUCK0_ILIM_INT
R/W
R/W
0
0
Latched status bit indicating that the Buck0 output voltage has been over 1 ms below
short-circuit threshold level.
Write 1 to clear.
Latched status bit indicating that the Buck0 output current limit has been active.
Write 1 to clear.
7.6.1.23 TOP_STAT
Address: 0x1D
D7
D6
D5
D4
D3
D2
D1
D0
PGOOD_STAT
Reserved
SYNC_CLK
_STAT
TDIE_SD
_STAT
TDIE_WARN
_STAT
OVP_STAT
Reserved
Bits
Field
PGOOD_STAT
Type
Default
Description
7
R
0
Status bit indicating the status of PGOOD pin:
0 - PGOOD pin is inactive
1 - PGOOD pin is active
6:5
4
Reserved
R
R
00
0
SYNC_CLK_STAT
Status bit indicating the status of external clock (CLKIN):
0 - External clock frequency is valid
1 - External clock frequency is not valid.
3
2
1
0
TDIE_SD_STAT
R
R
R
R
0
0
0
0
Status bit indicating the status of thermal shutdown:
0 - Die temperature below thermal shutdown level
1 - Die temperature above thermal shutdown level.
TDIE_WARN
_STAT
Status bit indicating the status of thermal warning:
0 - Die temperature below thermal warning level
1 - Die temperature above thermal warning level.
OVP_STAT
Reserved
Status bit indicating the status of input overvoltage monitoring:
0 - Input voltage below overvoltage threshold level
1 - Input voltage above overvoltage threshold level.
7.6.1.24 BUCK_STAT
Address: 0x1E
D7
D6
D5
D4
D3
D2
D1
D0
BUCK1_STAT
BUCK1_PG
_STAT
Reserved
BUCK1_ILIM
_STAT
BUCK0_STAT
BUCK0_PG
_STAT
Reserved
BUCK0_ILIM
_STAT
Bits
Field
Type
Default
Description
7
BUCK1_STAT
R
0
Status bit indicating the enable/disable status of Buck1:
0 - Buck1 regulator is disabled
1 - Buck1 regulator is enabled.
6
BUCK1_PG_STAT
R
0
Status bit indicating Buck1 output voltage validity (raw status)
0 - Buck1 output voltage is valid.
1 - Buck1 output voltage is invalid.
Copyright © 2019, Texas Instruments Incorporated
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Bits
5
Field
Type
R
Default
Description
Reserved
0
0
4
BUCK1_ILIM
_STAT
R
Status bit indicating Buck1 current limit status (raw status)
0 - Buck1 output current is below current limit level
1 - Buck1 output current limit is active.
3
2
BUCK0_STAT
BUCK0_PG_STAT
Reserved
R
R
0
0
Status bit indicating the enable/disable status of Buck0:
0 - Buck0 regulator is disabled
1 - Buck0 regulator is enabled.
Status bit indicating Buck0 output voltage validity (raw status)
0 - Buck0 output voltage is valid.
1 - Buck0 output voltage is invalid.
1
0
R
R
0
0
BUCK0_ILIM
_STAT
Status bit indicating Buck0 current limit status (raw status)
0 - Buck0 output current is below current limit level
1 - Buck0 output current limit is active.
7.6.1.25 TOP_MASK_1
Address: 0x20
D7
D6
D5
D4
D3
D2
D1
D0
PGOOD_INT_
MASK
Reserved
SYNC_CLK
_MASK
Reserved
TDIE_WARN
_MASK
Reserved
I_LOAD_
READY_MASK
Bits
Field
Type
Default
Description
7
PGOOD_INT
_MASK
R/W
X
Masking for Power-Good interrupt (PGOOD_INT in INT_TOP_1 register):
0 - Interrupt generated
1 - Interrupt not generated.
This bit does not affect PGOOD_STAT status bit in TOP_STAT register.
6:5
4
Reserved
R/W
R/W
00
X
SYNC_CLK
_MASK
Masking for external clock detection interrupt (SYNC_CLK_INT in INT_TOP_1
register):
0 - Interrupt generated
1 - Interrupt not generated.
This bit does not affect SYNC_CLK_STAT status bit in TOP_STAT register.
3
2
Reserved
R/W
R/W
0
TDIE_WARN
_MASK
X
Masking for thermal warning interrupt (TDIE_WARN_INT in INT_TOP_1 register):
0 - Interrupt generated
1 - Interrupt not generated.
This bit does not affect TDIE_WARN_STAT status bit in TOP_STAT register.
1
0
Reserved
R/W
R/W
0
I_MEAS
_MASK
X
Masking for load current measurement ready interrupt (MEAS_INT in INT_TOP_1
register).
0 - Interrupt generated
1 - Interrupt not generated.
7.6.1.26 TOP_MASK_2
Address: 0x21
D7
D6
D5
D4
D3
D2
D1
D0
Reserved
RESET_REG
_MASK
Bits
7:1
0
Field
Type
R/W
R/W
Default
000 0000
X
Description
Reserved
RESET_REG
_MASK
Masking for register reset interrupt (RESET_REG_INT in INT_TOP_2 register):
0 - Interrupt generated
1 - Interrupt not generated.
This change of this bit by I2C writing has no effect because it will be read from OTP
memory during reset.
44
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7.6.1.27 BUCK_MASK
Address: 0x22
D7
D6
D5
D4
D3
D2
D1
D0
BUCK1_PGF
_MASK
BUCK1_PGR
_MASK
Reserved
BUCK1_ILIM
_MASK
BUCK0_PGF
_MASK
BUCK0_PGR
_MASK
Reserved
BUCK0_ILIM
_MASK
Bits
Field
Type
Default
Description
7
BUCK1_PGF_MAS
K
R/W
X
Masking of Power Good invalid detection for Buck1 power good interrupt
(BUCK1_PG_INT in INT_BUCK register):
0 - Interrupt generated
1 - Interrupt not generated.
This bit does not affect BUCK1_PG_STAT status bit in BUCK_STAT register.
6
BUCK1_PGR_MAS
K
R/W
X
Masking of Power Good valid detection for Buck1 Power Good interrupt
(BUCK1_PG_INT in INT_BUCK register):
0 - Interrupt generated
1 - Interrupt not generated.
This bit does not affect BUCK1_PG_STAT status bit in BUCK_STAT register.
5
4
Reserved
R
0
BUCK1_ILIM
_MASK
R/W
X
Masking for Buck1 current limit detection interrupt (BUCK1_ILIM_INT in INT_BUCK
register):
0 - Interrupt generated
1 - Interrupt not generated.
This bit does not affect BUCK1_ILIM_STAT status bit in BUCK_STAT register.
3
2
BUCK0_PGF_MAS
K
R/W
R/W
X
X
Masking of Power Good invalid detection for Buck0 power good interrupt
(BUCK0_PG_INT in INT_BUCK register):
0 - Interrupt generated
1 - Interrupt not generated.
This bit does not affect BUCK0_PG_STAT status bit in BUCK_STAT register.
BUCK0_PGR_MAS
K
Masking of Power Good valid detection for Buck0 power good interrupt
(BUCK0_PG_INT in INT_BUCK register):
0 - Interrupt generated
1 - Interrupt not generated.
This bit does not affect BUCK0_PG_STAT status bit in BUCK_STAT register.
1
0
Reserved
R
0
BUCK0_ILIM
_MASK
R/W
X
Masking for Buck0 current limit detection interrupt (BUCK0_ILIM_INT in INT_BUCK
register):
0 - Interrupt generated
1 - Interrupt not generated.
This bit does not affect BUCK0_ILIM_STAT status bit in BUCK_STAT register.
7.6.1.28 SEL_I_LOAD
Address: 0x24
D7
D6
D5
D4
D3
D2
D1
D0
Reserved
LOAD_CURRE
NT_BUCK
_SELECT
Bits
7:1
0
Field
Type
R/W
R/W
Default
000 0000
0
Description
Reserved
LOAD_CURRENT_
BUCK_SELECT
Start the current measurement on the selected regulator:
0 - Buck0
1 - Buck1
The measurement is started when register is written.
7.6.1.29 I_LOAD_2
Address: 0x25
D7
D6
D5
D4
D3
D2
D1
D0
Reserved
BUCK_LOAD_
CURRENT[8]
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Bits
7:1
0
Field
Type
R
Default
000 0000
0
Description
Reserved
BUCK_LOAD_
CURRENT[8]
R
This register describes the MSB bit of the average load current on selected regulator
with a resolution of 20 mA per LSB and maximum 10.22-A current.
7.6.1.30 I_LOAD_1
Address: 0x26
D7
D6
D5
D4
D3
D2
D1
D0
BUCK_LOAD_CURRENT[7:0]
Bits
Field
Type
Default
Description
7:0
BUCK_LOAD_
CURRENT[7:0]
R
0000 0000 This register describes 8 LSB bits of the average load current on selected regulator
with a resolution of 20 mA per LSB and maximum 10.22-A current.
46
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ZHCSJI6 –MARCH 2019
8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The TPS65653-Q1 is a power management unit including two step-down regulators and two general-purpose
digital output signals.
8.2 Typical Application
L0
VOUT_B0
VIN
LOAD
VIN_B0
VIN_B1
SW_B0
FB_B0
CIN_BUCK0
CIN_BUCK1
COUT_BUCK0
COUT_POL0
VIN
VIN
L1
VOUT_B1
LOAD
SW_B1
FB_B1
VANA
CANA
SDA
SCL
nINT
EN
COUT_BUCK1
COUT_POL1
CLKIN (GPO2)
GPO
PGOOD
GNDs
Copyright © 2019, Texas Instruments Incorporated
Figure 22. TPS65653-Q1 Typical Application
8.2.1 Design Requirements
8.2.1.1 Inductor Selection
The inductors L0 and L1 are shown in the Typical Application. The inductance and DCR of the inductor affects the
control loop of the buck regulator. TI recommends using inductors similar to those listed in Table 8. Pay attention
to the saturation current and temperature rise current of the inductor. Check that the saturation current is higher
than the peak current limit and the temperature rise current is higher than the maximum expected rms output
current. For the minimum effective inductance to ensure good performance at maximum peak output current over
the operating temperature range refer to Electrical Characteristics. DC resistance of the inductor must be less
than 0.05 Ω for good efficiency at high-current condition. The inductor AC loss also affects conversion efficiency.
Higher Q factor at switching frequency usually gives better efficiency at light load to middle load. Shielded
inductors are preferred as they radiate less noise.
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Typical Application (continued)
Table 8. Recommended Inductors
RATED DC CURRENT
ISAT maximum (typical) /
ITEMP maximum (typical) (A)
DCR
MANUFACTURER
Murata
PART NUMBER
VALUE
DIMENSIONS L × W × H (mm)
2.5 × 2 × 1.2
typical / maximum (mΩ)
DFE252012PD-
R47M
0.47 µH (20%)
5.2 (–) / 4 (–)(1)
— / 27
40 / 46
Tayo Yuden
MDMK2020TR47M 0.47 µH (20%)
MV
2 × 2 ×1.2
4.2 (4.8) / 2.3 (2.45)
(1) Operating temperature range is up to 125°C including self temperature rise.
8.2.1.2 Buck Input Capacitor Selection
The input capacitors CIN_BUCK0 and CIN_BUCK1 are shown in the Typical Application. A ceramic input bypass
capacitor of 10 μF is required for each phase of the regulator. Place the input capacitor as close as possible to
the VIN_Bx pin and PGND_Bx pin of the device. A larger value or higher voltage rating improves the input
voltage filtering. Use X7R type of capacitors, not Y5V or F. Also the DC bias characteristics capacitors must be
considered. Minimum effective input capacitance to ensure good performance is 1.9 μF per buck input at
maximum input voltage including tolerances, ambient temperature range and aging. This is assuming that there
are at least 22 μF of additional capacitance common for all the power input pins on the system power rail. See
Table 9.
The input filter capacitor supplies current to the high-side FET switch in the first half of each cycle and reduces
voltage ripple imposed on the input power source. A ceramic capacitor's low ESR provides the best noise filtering
of the input voltage spikes due to this rapidly changing current. Select an input filter capacitor with sufficient
ripple current rating. In addition ferrite can be used in front of the input capacitor to reduce the EMI.
Table 9. Recommended Buck Input Capacitor (X7R Dielectric)
DIMENSIONS L × W × H
(mm)
VOLTAGE
RATING
MANUFACTURER
PART NUMBER
VALUE
CASE SIZE
Murata
GCM21BR71A106KE22
10 µF (10%)
0805
2 × 1.25 × 1.25
10 V
8.2.1.3 Buck Output Capacitor Selection
The output capacitor COUT_BUCK0 and COUT_BUCK1 are shown in Typical Application. A ceramic local output
capacitor of 22 μF is required per buck. Use ceramic capacitors, X7R type; do not use Y5V or F. DC bias voltage
characteristics of ceramic capacitors must be considered. The output filter capacitor smooths out current flow
from the inductor to the load, helps maintain a steady output voltage during transient load changes and reduces
output voltage ripple. These capacitors must be selected with sufficient capacitance and sufficiently low ESR and
ESL to perform these functions. Minimum effective output capacitance to ensure good performance is 10 μF per
buck including the DC voltage rolloff, tolerances, aging, and temperature effects.
The output voltage ripple is caused by the charging and discharging of the output capacitor and also due to its
RESR. The RESR is frequency dependent (as well as temperature dependent); make sure the value used for
selection process is at the switching frequency of the part. See Table 10.
POL capacitors can be used to improve load transient performance and to decrease the ripple voltage. A higher
output capacitance improves the load step behavior and reduces the output voltage ripple as well as decreases
the PFM switching frequency. However, output capacitance higher than 100 μF per buck is not necessarily of any
benefit. Note that the output capacitor may be the limiting factor in the output voltage ramp, see Specifications for
maximum output capacitance for different slew-rate settings. For large output capacitors, the output voltage might
be slower than the programmed ramp rate at voltage transitions, because of the higher energy stored on the
output capacitance. Also at start-up, the time required to charge the output capacitor to target value might be
longer. At shutdown the output voltage is discharged to 0.6 V level using forced-PWM operation. This can
increase the input voltage if the load current is small and the output capacitor is large compared to input
capacitor. Below 0.6 V level the output capacitor is discharged by the internal discharge resistor and with large
capacitor more time is required to settle VOUT down as a consequence of the increased time constant.
48
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ZHCSJI6 –MARCH 2019
Table 10. Recommended Buck Output Capacitors (X7R Dielectric)
MANUFACTURER
PART NUMBER
VALUE
CASE SIZE
DIMENSIONS L × W × H
(mm)
VOLTAGE RATING
Murata
GCM31CR71A226KE02
22 µF (10%)
1206
3.2 × 1.6 × 1.6
10 V
8.2.2 Detailed Design Procedure
The performance of the TPS65653-Q1 device depends greatly on the care taken in designing the printed circuit
board (PCB). The use of low-inductance and low serial-resistance ceramic capacitors is strongly recommended,
while proper grounding is crucial. Attention must be given to decoupling the power supplies. Decoupling
capacitors must be connected close to the device and between the power and ground pins to support high peak
currents being drawn from system power rail during turnon of the switching MOSFETs. Keep input and output
traces as short as possible, because trace inductance, resistance, and capacitance can easily become the
performance limiting items. The separate buck regulator power pins VIN_Bx are not connected together
internally. Connect the VIN_Bx power connections together outside the package using power plane construction.
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8.2.3 Application Curves
Measurements are done using typical application set up with connections shown in Figure 22. Graphs may not
reflect the OTP default settings. Unless otherwise specified: V(VIN_Bx) = V(VANA) = 3.7 V, VOUT_Bx = 1 V, TA = 25°C,
L = 0.47 µH (Murata DFE252012PD-R47M), COUT_BUCK = 22 µF, and CPOL_BUCK = 22 µF.
100
90
80
70
60
50
40
100
90
80
70
60
50
40
Vin = 5V, AUTO
Vin = 3.3V, AUTO
Vin = 5V, FPWM
Vin = 3.3V, FPWM
Vout=1V
Vout=1.8V
Vout=2.5V
0.001
0.01
0.1
1
3
0.001
0.01
0.1
1
3
Output Current (A)
Output Current (A)
BUCK
BUCK
VOUT = 1.8 V
VIN = 3.3 V
Figure 24. Buck Efficiency in Forced PWM Mode
Figure 23. Buck Efficiency in PFM/PWM and Forced PWM
Mode
100
90
80
70
60
1.02
1.015
1.01
1.005
1
0.995
0.99
0.985
0.98
Vout=1V
Vout=1.8V
Vout=2.5V
50
Vin = 3.3V, FPWM
Vin = 5.5V, FPWM
40
0.001
0.01
0.1
1
3
0
0.5
1
1.5
2
2.5
3
Output Current (A)
Output Current (A)
BUCK
BUCK
VIN = 5 V
Figure 25. Buck Efficiency in Forced PWM Mode
VOUT = 1 V
Figure 26. Buck Output Voltage vs Load Current in Forced
PWM Mode
1.02
1.015
1.01
1.005
1
1.02
1.016
1.012
1.008
1.004
1
0.996
0.992
0.988
0.984
0.98
0.995
0.99
0.985
0.98
Vin = 3.3V, AUTO
Vin = 3.3V, AUTO
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
Output Current (A)
1
2.5
3
3.5
4
4.5
5
5.5
Input Voltage (V)
BUCK
BUCK
VOUT = 1 V
VOUT = 1 V
Load = 1 A
Figure 27. Buck Output Voltage vs Load Current in
PFM/PWM Mode
Figure 28. Buck Output Voltage vs Input Voltage in PWM
Mode
50
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ZHCSJI6 –MARCH 2019
1.014
1.008
1.002
0.996
0.99
0.984
PWM
PFM
0.978
-40
-20
0
20
40
60
80
100 120 140
Temperature (èC)
4mhz
Load = 1 A (PWM) and 0.1 A (PFM)
Figure 29. Buck Output Voltage vs Temperature
Slew-rate = 10 mV/µs
ILOAD = 0 A
VOUT = 1 V
Figure 30. Buck Start-Up With EN1, Forced PWM Mode
Slew-rate = 10 mV/µs
RLOAD = 1 Ω
VOUT = 1 V
Slew-rate = 10 mV/µs
RLOAD = 1 Ω
VOUT = 1 V
Figure 31. Buck Start-Up with EN1, Forced PWM Mode
Figure 32. Buck Shutdown With EN1, Forced PWM Mode
IOUT = 500 mA
IOUT = 10 mA
Figure 34. Buck Output Voltage Ripple,
Forced PWM Mode
Figure 33. Buck Output Voltage Ripple, PFM Mode
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Figure 36. Buck Transient From PWM-to-PFM Mode
Figure 35. Buck Transient From PFM-to-PWM Mode
IOUT = 0.1 A → 2 A → 0.1 A
TR = TF = 400 ns
IOUT = 0.1 A → 2 A → 0.1 A
TR = TF = 400 ns
Figure 38. Buck Transient Load Step Response, Forced
PWM Mode
Figure 37. Buck Transient Load Step Response, AUTO
Mode
VOUT(200mV/div)
VOUT(200mV/div)
Time (400 µs/div)
Time (400 µs/div)
Figure 39. Buck VOUT Transition from 0.6 V to 1.4 V With
Different Slew Rate Settings
Figure 40. Buck VOUT Transition from 1.4 V to 0.6 V With
Different Slew Rate Settings
52
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Figure 41. Buck Start-up With Short on Output
9 Power Supply Recommendations
The device is designed to operate from an input voltage supply range between 2.8 V and 5.5 V. The VANA input
and VIN_Bx buck inputs must be connected together, and they must use the same input supply. This input
supply must be well regulated and able to withstand maximum input current and maintain stable voltage without
voltage drop even at load transition condition. The resistance of the input supply rail must be low enough that the
input current transient does not cause too high a drop in the TPS65653-Q1 supply voltage that can cause false
UVLO fault triggering. If the input supply is located more than a few inches from the TPS65653-Q1 additional
bulk capacitance may be required in addition to the ceramic bypass capacitors.
10 Layout
10.1 Layout Guidelines
The high frequency and large switching currents of the TPS65653-Q1 make the choice of layout important. Good
power supply results only occur when care is given to proper design and layout. Layout affects noise pickup and
generation and can cause a good design to perform with less-than-expected results. With a range of output
currents from milliamps to several amps, good power supply layout is much more difficult than most general PCB
design. Use the following steps as a reference to ensure the device is stable and maintains proper voltage and
current regulation across its intended operating voltage and current range.
1. Place CIN as close as possible to the VIN_Bx pin and the PGND_Bx pin. Route the VIN trace wide and thick
to avoid IR drops. The trace between the positive node of the input capacitor and the VIN_Bx pin(s) of
TPS65653-Q1, as well as the trace between the negative node of the input capacitor and power PGND_Bx
pin(s), must be kept as short as possible. The input capacitance provides a low-impedance voltage source
for the switching converter. The inductance of the connection is the most important parameter of a local
decoupling capacitor — parasitic inductance on these traces must be kept as small as possible for proper
device operation. The parasitic inductance can be reduced by using a ground plane as close as possible to
top layer by using thin dielectric layer between top layer and ground plane.
2. The output filter, consisting of L and COUT, converts the switching signal at SW_Bx to the noiseless output
voltage. It must be placed as close as possible to the device keeping the switch node small, for best EMI
behavior. Route the traces between the output capacitors of the TPS65653-Q1 and the input capacitors of
the load direct and wide to avoid losses due to the IR drop.
3. Input for analog blocks (VANA and AGND) must be isolated from noisy signals. Connect VANA directly to a
quiet system voltage node and AGND to a quiet ground point where no IR drop occurs. Place the decoupling
capacitor as close as possible to the VANA pin.
4. If remote voltage sensing can be used for the load, connect the TPS65653-Q1 feedback pins FB_Bx to the
respective sense pins on the load capacitor. The sense lines are susceptible to noise. They must be kept
away from noisy signals such as PGND_Bx, VIN_Bx, and SW_Bx, as well as high bandwidth signals such as
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Layout Guidelines (continued)
the I2C. Avoid both capacitive and inductive coupling by keeping the sense lines short and direct, and close
to each other. Run the lines in a quiet layer. Isolate them from noisy signals by a voltage or ground plane if
possible. If series resistors are used for load current measurement, place them after connection of the
voltage feedback.
5. PGND_Bx, VIN_Bx and SW_Bx must be routed on thick layers. They must not surround inner signal layers
which are not able to withstand interference from noisy PGND_Bx, VIN_Bx and SW_Bx.
Due to the small package of this converter and the overall small solution size, the thermal performance of the
PCB layout is important. Many system-dependent issues such as thermal coupling, airflow, added heat sinks and
convection surfaces, and the presence of other heat-generating components affect the power dissipation limits of
a given component. Proper PCB layout, focusing on thermal performance, results in lower die temperatures.
Wide power traces come with the ability to sink dissipated heat. This can be improved further on multi-layer PCB
designs with vias to different planes. This results in reduced junction-to-ambient (RθJA) and junction-to-board
(RθJB) thermal resistances, thereby reducing the device junction temperature, TJ. TI strongly recommends
performance of a careful system-level 2D or full 3D dynamic thermal analysis at the beginning product design
process by using a thermal modeling analysis software.
10.2 Layout Example
VOUT0
VOUT1
COUT0
COUT1
GND
L1
L0
21 20 19
17
16
18
15
14
SW_B0
SW_B1
SW_B1
VIN_B1
22
23
13
12
SW_B0
VIN_B0
VIN_B0
CIN0
CIN1
29
AGND
24
VIN
25
VIN
GND
GND
11
VIN_B1
CLKIN
nINT
10
9
GPO
26
27
PGOOD
8
VIN
28
VIN
VIN
VIN
1
2
3
4
5
6
7
VIN
CANA
AGND
Figure 42. TPS65653-Q1 Board Layout
54
版权 © 2019, Texas Instruments Incorporated
TPS65653-Q1
www.ti.com.cn
ZHCSJI6 –MARCH 2019
11 器件和文档支持
11.1 器件支持
11.1.1 第三方产品免责声明
TI 发布的与第三方产品或服务有关的信息,不能构成与此类产品或服务或保修的适用性有关的认可,不能构成此类
产品或服务单独或与任何 TI 产品或服务一起的表示或认可。
11.2 接收文档更新通知
要接收文档更新通知,请导航至 TI.com.cn 上的器件产品文件夹。单击右上角的通知我 进行注册,即可每周接收产
品信息更改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。
11.3 社区资源
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范,
并且不一定反映 TI 的观点;请参阅 TI 的 《使用条款》。
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.4 商标
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
11.6 术语表
SLYZ022 — TI 术语表。
这份术语表列出并解释术语、缩写和定义。
版权 © 2019, Texas Instruments Incorporated
55
PACKAGE OPTION ADDENDUM
www.ti.com
23-Jun-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS6565342RHDRQ1
TPS6565342RHDTQ1
ACTIVE
VQFN
VQFN
RHD
28
28
3000 RoHS & Green
250 RoHS & Green
NIPDAU | SN
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
-40 to 125
-40 to 125
TPS6565
342-Q1
Samples
Samples
ACTIVE
RHD
NIPDAU | SN
TPS6565
342-Q1
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
23-Jun-2023
Addendum-Page 2
PACKAGE OUTLINE
RHD0028W
VQFN - 1 mm max height
S
C
A
L
E
2
.
5
0
0
PLASTIC QUAD FLATPACK - NO LEAD
5.1
4.9
B
A
PIN 1 INDEX AREA
5.1
4.9
0.1 MIN
(0.05)
A
-
A
2
5
.
0
0
0
SECTION A-A
TYPICAL
C
1 MAX
SEATING PLANE
0.08
0.05
0.00
3.4 0.1
(0.2) TYP
8
14
EXPOSED
THERMAL PAD
24X 0.5
7
15
A
SYMM
A
4X
3
1
21
0.3
28X
0.2
0.1
C A B
28
22
PIN 1 ID
(OPTIONAL)
SYMM
0.05
0.65
0.45
28X
4222120/B 02/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
RHD0028W
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(
3.4)
SYMM
22
28
28X (0.75)
1
21
28X (0.25)
(1.45)
SYMM
(4.65)
(0.5) TYP
15
7
(R0.05) TYP
(
0.2) TYP
VIA
8
14
(1.45)
(4.65)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
SOLDER MASK
OPENING
METAL EDGE
EXPOSED
METAL
EXPOSED
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4222120/B 02/2018
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
www.ti.com
EXAMPLE STENCIL DESIGN
RHD0028W
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
SYMM
(0.84) TYP
28
22
METAL
TYP
28X (0.75)
1
21
28X (0.25)
(0.84)
TYP
SYMM
(4.65)
24X (0.5)
7
15
(R0.05) TYP
8
14
4X ( 1.47)
(4.65)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD
75% PRINTED SOLDER COVERAGE BY AREA
SCALE:20X
4222120/B 02/2018
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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TI“按原样”提供技术和可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资源,
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邮寄地址:Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023,德州仪器 (TI) 公司
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