TPS658310YFFR [TI]

Power Management Unit; 电源管理单元
TPS658310YFFR
型号: TPS658310YFFR
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Power Management Unit
电源管理单元

文件: 总6页 (文件大小:140K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TPS658310  
www.ti.com  
SLVSB52 NOVEMBER 2011  
Power Management Unit  
1 Introduction  
1.1 Features  
12  
Power Management Core  
Dual Input Power Path  
Switch Mode Charger  
Integrated Charge Current Sense FET  
Automatic Battery Supplement Mode  
2 Boost Converters  
1 Boost supports 2 strings of up to 6 LEDs with Internal and External Dimming Control  
1 Boost supports 1 string of 6 LEDs  
Boost Converters can also be used in Constant Voltage Mode  
LED Matrix Controller  
RGB Controller  
I2CInterface to Device for Low Latency Communication  
1.2 Applications  
Portable Applications  
1.3 Description  
The TPS658310 Power Management Unit is a broad use, multi-channel device, for portable applications.  
The device consists of an Integrated Power Path Management and Switch Mode Li-Ion Battery Charger  
that provides system power from a regulated wall adapter or a USB port. It also handles lighting  
management with integrated Backlight Boosts, LED Matrix Controller for keypad, Camera Flash LED  
Controller, Current Source and RGB channels.  
To request a full data sheet, please send an email to:  
pmu_contact@list.ti.com  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
I2C is a trademark of NPX Corporation.  
2
PRODUCTION DATA information is current as of publication date. Products conform to  
specifications per the terms of the Texas Instruments standard warranty. Production  
processing does not necessarily include testing of all parameters.  
Copyright © 2011, Texas Instruments Incorporated  
TPS658310  
SLVSB52 NOVEMBER 2011  
www.ti.com  
1.4 Block Diagram  
The simplified TPS658310 system diagram is shown in Figure 1-1.  
Multiple Pins  
FLASH LED  
CONTROLLER  
SWITCH MODE  
CHARGER  
(Integrated Sense  
LED MATRIX  
CONTROLLER  
MINIPWR  
VINT  
POWER PATH  
OVP / OCP  
REFSYS  
FET & R  
)
ISET  
ALGDIMC  
CNTPWM  
MBST_FB  
MBST_L  
BAT  
MAIN BOOST  
BKLSINK[1]  
BKLSINK[0]  
nRESET  
MBST  
Control Registers  
ABST_FB  
ABST_L  
ABSTSINK  
AUX BOOST  
AGND  
DGND  
ABST  
RGB  
PGNDBST  
Figure 1-1. Simplified System Diagram  
2
Introduction  
Copyright © 2011, Texas Instruments Incorporated  
Submit Documentation Feedback  
Product Folder Link(s): TPS658310  
 
TPS658310  
www.ti.com  
SLVSB52 NOVEMBER 2011  
2 Application Schematic  
To  
Host  
TPS658310  
SCLK  
SDAT  
nINT  
LEDM_ROW[3]  
LEDM_ROW[2]  
LEDM_ROW[1]  
LEDM_ROW[0]  
LEDM_COL[3]  
LEDM_COL[2]  
LEDM_COL[1]  
LEDM_COL[0]  
nRESET  
Adapter  
USB  
1µF  
AC  
P
1µF  
USB  
PWR  
P
PWR  
VSYS  
10µF  
RED  
GREEN  
BLUE  
MINIPWR  
VINT  
P
4.7µF  
4.7µF  
1.5µH  
VSYS  
CNTPWM  
MBST_L  
MBST  
CHG_L  
4.7µH  
47µF  
To  
Host  
VSYS  
P
BKSINK[1]  
SYS  
BKSINK[0]  
MBST_FB  
FLASHMASK  
FLASHSYNC  
FLASHSRC  
ANLGDIM  
P
1µF  
20Ω  
20Ω  
P
100nF  
P
4.7µH  
0.1µF  
ABST_L  
ABST  
ABSTSINK  
ABST_FB  
1µF  
P
PGNDBST  
P
150µF  
BAT  
TS  
AGND  
DGND  
P
P
PGNDCHG  
NTC  
P
Multiple Pins  
Pack  
NOTE: Component values shown are the minimum required.  
Figure 2-1. Application Schematic  
Copyright © 2011, Texas Instruments Incorporated  
Application Schematic  
3
Submit Documentation Feedback  
Product Folder Link(s): TPS658310  
PACKAGE OPTION ADDENDUM  
www.ti.com  
29-Feb-2012  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
TPS658310YFFR  
ACTIVE  
DSBGA  
YFF  
49  
1500  
Green (RoHS  
& no Sb/Br)  
SNAGCU Level-1-260C-UNLIM  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
IMPORTANT NOTICE  
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