TPS70751MPWPREP [TI]

DUAL-OUTPUT LOW-DROPOUT VOLTAGE REGULATOR WITH POWER-UP SEQUENCING FOR SPLIT-VOLTAGE DSP SYSTEMS; 与上电顺序使用驳电压DSP系统双输出低压差稳压器
TPS70751MPWPREP
型号: TPS70751MPWPREP
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

DUAL-OUTPUT LOW-DROPOUT VOLTAGE REGULATOR WITH POWER-UP SEQUENCING FOR SPLIT-VOLTAGE DSP SYSTEMS
与上电顺序使用驳电压DSP系统双输出低压差稳压器

稳压器 电源电路 电源管理电路 光电二极管 输出元件 PC
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TPS70751-EP  
DUAL-OUTPUT LOW-DROPOUT VOLTAGE REGULATOR  
WITH POWER-UP SEQUENCING FOR SPLIT-VOLTAGE DSP SYSTEMS  
www.ti.com  
SLVS718DECEMBER 2006  
FEATURES  
Controlled Baseline  
Ultralow 190-µA (Typ) Quiescent Current  
1-µA Input Current During Standby  
One Assembly/Test Site, One Fabrication  
Site  
Low Noise: 65 µVrms Without Bypass  
Enhanced Diminishing Manufacturing Sources  
(DMS) Support  
Capacitor  
Quick Output Capacitor Discharge Feature  
Two Manual Reset Inputs  
Enhanced Product-Change Notification  
(1)  
Qualification Pedigree  
2% Accuracy Over Load and Temperature  
Undervoltage Lockout (UVLO) Feature  
Dual Output Voltages for Split-Supply  
Applications  
20-Pin PowerPAD™ Thin Shrink Small-Outline  
Package (TSSOP)  
Selectable Power-Up Sequencing for DSP  
Applications (See Part Number TPS708xx for  
Independently Enabled Outputs)  
Thermal Shutdown Protection  
PWP PACKAGE  
(TOP VIEW)  
Output Current Range of 250 mA on  
Regulator 1 and 125 mA on Regulator 2  
Fast Transient Response  
NC  
VIN1  
1
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
NC  
2
3.3-V/1.8-V Fixed Voltage Outputs  
VOUT1  
3
VIN1  
VOUT1  
Open-Drain Power-On Reset With 120-ms  
Delay  
4
MR1  
MR2  
EN  
VSENSE1/FB1  
PG1  
5
Open-Drain Power Good for Regulator 1  
6
RESET  
VSENSE2/FB2  
VOUT2  
(1) Component qualification in accordance with JEDEC and  
industry standards to ensure reliable operation over an  
extended temperature range. This includes, but is not limited  
to, Highly Accelerated Stress Test (HAST) or biased 85/85,  
temperature cycle, autoclave or unbiased HAST,  
7
SEQ  
GND  
VIN2  
8
9
VOUT2  
10  
VIN2  
NC  
electromigration, bond intermetallic life, and mold compound  
life. Such qualification testing should not be viewed as  
justifying use of this component beyond specified  
performance and environmental limits.  
xxxxx  
DESCRIPTION  
The TPS707xx family devices are designed to provide a complete power-management solution for TI DSP,  
processor power, ASIC, FPGA, and digital applications where dual-output voltage regulators are required. Easy  
programmability of the sequencing function makes this family ideal for any TI DSP applications with  
power-sequencing requirements. Differentiated features, such as accuracy, fast transient response, SVS  
supervisory circuit (power-on reset), manual reset inputs, and enable function, provide a complete system  
solution.  
The TPS707xx family of voltage regulators offer very low dropout (LDO) voltage and dual outputs with power-up  
sequence control, which is designed primarily for DSP applications. These devices have extremely low noise  
output performance without using any added filter bypass capacitors, and are designed to have a fast transient  
response and be stable with 10-µF low ESR capacitors.  
The TPS70751 has a fixed voltage of 3.3 V/1.8 V. Regulator 1 can support up to 250 mA and regulator 2 can  
support up to 125 mA. Separate voltage inputs allow the designer to configure the source power.  
Because the PMOS device behaves as a low-value resistor, the dropout voltage is very low (typically 83 mV on  
regulator 1) and is directly proportional to the output current. Additionally, since the PMOS pass element is a  
voltage-driven device, the quiescent current is very low and independent of output loading (maximum of 230 µA  
over the full range of output current). This LDO family also features a sleep mode; applying a high signal to EN  
(enable) shuts down both regulators, reducing the input current to 1 µA at TJ = 25°C.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PowerPAD is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2006, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
TPS70751-EP  
DUAL-OUTPUT LOW-DROPOUT VOLTAGE REGULATOR  
WITH POWER-UP SEQUENCING FOR SPLIT-VOLTAGE DSP SYSTEMS  
www.ti.com  
SLVS718DECEMBER 2006  
TPS70751 PWP  
DSP  
I/O  
3.3 V  
VOUT1  
5 V  
VIN1  
10 mF  
0.1 mF  
VSENSE1  
250 kW  
PG1  
PG1  
MR2  
MR2  
>2 V  
VIN2  
250 kW  
<0.7 V  
0.1 mF  
RESET  
RESET  
MR1  
MR1  
EN  
<0.7 V  
>2 V  
EN  
>2 V  
<0.7 V  
VSENSE2  
SEQ  
1.8 V  
Core  
VOUT2  
10 mF  
The device is enabled when the enable (EN) pin is connected to a low-level input voltage. The output voltages of  
the two regulators are sensed at the VSENSE1 and VSENSE2 pins, respectively.  
The input signal at the sequence (SEQ) pin controls the power-up sequence of the two regulators. When the  
device is enabled and SEQ is pulled high or left open, VOUT2 turns on first and VOUT1 remains off until VOUT2  
reaches approximately 83% of its regulated output voltage. At that time, VOUT1 is turned on. If VOUT2 is pulled  
below 83% (i.e., overload condition), VOUT1 is turned off. Pulling SEQ low reverses the power-up order and VOUT1  
is turned on first. SEQ is connected to an internal pullup current source.  
For each regulator, there is an internal discharge transistor to discharge the output capacitor when the regulator  
is turned off (disabled).  
The power good (PG1) pin reports the voltage conditions at VOUT1. Power good can be used to implement a  
SVS for the circuitry supplied by regulator 1.  
The TPS70751 features a RESET (SVS, POR, or power-on reset). The RESET output initiates a reset in DSP  
systems and related digital applications in the event of an undervoltage condition. RESET indicates the status of  
VOUT2 and both manual reset (MR1 and MR2) pins. When VOUT2 reaches 95% of its regulated voltage and MR1  
and MR2 are in the logic high state, RESET goes to a high-impedance state after a 120-ms delay. RESET goes  
to logic low state when VOUT2 regulated output voltage is pulled below 95% (i.e., overload condition) of its  
regulated voltage. To monitor VOUT1, the PG1 output can be connected to MR1 or MR2.  
The device has an undervoltage lockout (UVLO) circuit that prevents the internal regulators from turning on until  
VIN1 reaches 2.5 V.  
AVAILABLE OPTIONS  
REGULATOR 1  
VO (V)  
REGULATOR 2  
VO (V)  
TSSOP  
(PWP)  
TJ  
–55°C to 125°C  
3.3 V  
1.8 V  
TPS70751MPWPREP  
2
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TPS70751-EP  
DUAL-OUTPUT LOW-DROPOUT VOLTAGE REGULATOR  
WITH POWER-UP SEQUENCING FOR SPLIT-VOLTAGE DSP SYSTEMS  
www.ti.com  
SLVS718DECEMBER 2006  
DETAILED BLOCK DIAGRAM – FIXED-VOLTAGE VERSION  
VIN1 (2 Pins)  
VOUT1 (2 Pins)  
10 kW  
Current  
Sense  
ENA_1  
VSENSE1  
(see Note A)  
UVLO  
Shutdown  
ENA_1  
2.5 V  
-
+
Vref  
Reference  
FB1  
GND  
Thermal  
Shutdown  
Vref  
PG1  
FB1  
0.95 ´ Vref  
Rising Edge  
Deglitch  
VIN1  
MR2  
Shutdown  
RESET  
FB2  
Falling Edge  
Delay  
Rising Edge  
Deglitch  
UV Comp  
0.95 ´ Vref  
FB2  
Falling Edge  
VIN1  
0.83 ´ Vref  
Deglitch  
ENA_1  
Power  
Sequence  
Logic  
FB1  
ENA_2  
Vref  
MR1  
Falling Edge  
Deglitch  
FB2  
0.83 ´ Vref  
-
UV Comp  
+
ENA_2  
EN  
VIN1  
VSENSE2  
ENA_2  
Current  
Sense  
(see Note A)  
10 kW  
SEQ  
(see Note B)  
VOUT2 (2 Pins)  
VIN2 (2 Pins)  
NOTES: A. For most applications, V  
and V  
should be externally connected to V  
as close as possible to the device.  
SENSE1  
SENSE2  
OUT  
For other implementations, refer to the SENSE terminal connection discussion in the Application Information section.  
B. If the SEQ terminal is floating at the input, V powers up first.  
OUT2  
3
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TPS70751-EP  
DUAL-OUTPUT LOW-DROPOUT VOLTAGE REGULATOR  
WITH POWER-UP SEQUENCING FOR SPLIT-VOLTAGE DSP SYSTEMS  
www.ti.com  
SLVS718DECEMBER 2006  
RESET TIMING DIAGRAM (WITH VIN1 POWERED UP AND MR1 AND MR2 AT LOGIC HIGH)  
VIN2  
VRES  
VRES  
(see Note A)  
t
VOUT2  
VIT+ (see Note B)  
VIT+ (see Note B)  
Threshold  
Voltage  
VIT–  
(see Note B)  
VIT–  
(see Note B)  
t
RESET  
Output  
120-ms  
Delay  
120-ms  
Delay  
Output  
Undefined  
Output  
Undefined  
t
NOTES: A. VRES is the minimum input voltage for a valid RESET. The symbol VRES is not currently listed within EIA or  
JEDEC standards for semiconductor symbology.  
B. VIT – Trip voltage is typically 5% lower than the output voltage (95% VO); VIT– to VIT+ is the hysteresis voltage.  
PG1 TIMING DIAGRAM  
VIN1  
VUVLO  
VUVLO  
VPG1  
VPG1  
(see Note A)  
t
VOUT2  
VIT+ (see Note B)  
VIT+ (see Note B)  
Threshold  
Voltage  
VIT –  
(see Note B)  
VIT–  
(see Note B)  
30 ms  
t
PG1  
Output  
Output  
Undefined  
Output  
Undefined  
t
NOTES: A. VPG1 is the minimum input voltage for a valid PG1. The symbol VPG1 is not currently listed within EIA or  
JEDEC standards for semiconductor symbology.  
B. VIT – Trip voltage is typically 5% lower than the output voltage (95% VO); VIT– to VIT+ is the hysteresis voltage.  
4
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TPS70751-EP  
DUAL-OUTPUT LOW-DROPOUT VOLTAGE REGULATOR  
WITH POWER-UP SEQUENCING FOR SPLIT-VOLTAGE DSP SYSTEMS  
www.ti.com  
SLVS718DECEMBER 2006  
TERMINAL FUNCTIONS  
TERMINAL  
NAME  
I/O  
DESCRIPTION  
NO.  
EN  
6
I
Active-low enable  
Ground  
GND  
MR1  
MR2  
NC  
8
4
5
I
I
Manual reset 1. Active low, pulled up internally.  
Manual reset 2. Active low, pulled up internally.  
No connection  
1, 11, 20  
Power good. Open-drain output, low when VOUT1 voltage is less than 95% of the nominal  
regulated voltage.  
PG1  
16  
15  
7
O
O
I
RESET  
SEQ  
Reset. Open-drain output, SVS (power-on reset) signal, active low.  
Power up sequence control: SEQ = High, VOUT2 powers up first; SEQ = Low, VOUT1 powers  
up first, SEQ terminal pulled up internally.  
VIN1  
2, 3  
9, 10  
18, 19  
12, 13  
17  
I
I
Regulator 1 input voltage  
VIN2  
Regulator 2 input voltage  
VOUT1  
O
O
I
Regulator 1 output voltage  
VOUT2  
Regulator 2 output voltage  
VSENSE1/FB1  
VSENSE2/FB2  
Regulator 1 output voltage sense/feedback 1  
Regulator 2 output voltage sense/feedback 2  
14  
I
DETAILED DESCRIPTION  
The TPS707xx low-dropout regulator family provides dual regulated output voltages for DSP applications that  
require a high-performance power-management solution. These devices provide fast transient response and  
high accuracy with small output capacitors, while drawing low quiescent current. Programmable sequencing  
provides a power solution for DSPs, without any external component requirements. This reduces the component  
cost and board space while increasing total system reliability. The TPS707xx family has an enable feature that  
puts the device in sleep mode, reducing the input currents to less than 3 µA. Other features are integrated SVS  
(power-on reset, RESET) and power good (PG1) that monitor output voltages and provide logic output to the  
system. These differentiated features provide a complete DSP power solution.  
The TPS70751, unlike many other LDOs, features very low quiescent current that remains virtually constant  
even with varying loads. Conventional LDO regulators use a PNP pass element, the base current of which is  
directly proportional to the load current through the regulator (IB = IC/β). The TPS70751 uses a PMOS transistor  
to pass current; because the gate of the PMOS is voltage driven, operating current is low and stable over the full  
load range.  
Pin Functions  
Enable (EN)  
The EN terminal is an input that enables or shuts down the device. If EN is at a voltage high signal, the device is  
in shutdown mode. When EN goes to voltage low, the device is enabled.  
Sequence (SEQ)  
The SEQ terminal is an input that programs which output voltage (VOUT1 or VOUT2) is turned on first. When the  
device is enabled and the SEQ terminal is pulled high or left open, VOUT2 turns on first and VOUT1 remains off  
until VOUT2 reaches approximately 83% of its regulated output voltage. At that time, the VOUT1 is turned on. If  
VOUT2 is pulled below 83% (i.e., overload condition), VOUT1 is turned off. This terminal has a 6-µA pullup current  
to VIN1  
.
Pulling SEQ low reverses the power-up order and VOUT1 is turned on first. For detailed timing diagrams, see  
Figure 33 and Figure 38.  
5
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TPS70751-EP  
DUAL-OUTPUT LOW-DROPOUT VOLTAGE REGULATOR  
WITH POWER-UP SEQUENCING FOR SPLIT-VOLTAGE DSP SYSTEMS  
www.ti.com  
SLVS718DECEMBER 2006  
Power Good (PG1)  
The PG1 terminal is an open-drain, active-high output terminal that indicates the status of the VOUT1 regulator.  
When the VOUT1 reaches 95% of its regulated voltage, PG1 goes into a high-impedance state. PG1 goes into a  
low-impedance state when VOUT1 is pulled below 95% (i.e., overload condition), of its regulated voltage. The  
open-drain output of the PG1 terminal requires a pullup resistor.  
Manual Reset (MR1 and MR2)  
MR1 and MR2 are active-low input terminals used to trigger a reset condition. When either MR1 or MR2 is  
pulled to logic low, a POR (RESET) occurs. These terminals have a 6-µA pullup current to VIN1  
.
Sense (VSENSE1, VSENSE2  
)
The sense terminals of fixed-output options must be connected to the regulator output, and the connection  
should be as short as possible. Internally, sense connects to high-impedance wide-bandwidth amplifiers through  
a resistor-divider network, and noise pickup feeds through to the regulator output. It is essential to route the  
sense connection in such a way to minimize/avoid noise pickup. Adding RC networks between the VSENSE  
terminals and VOUT terminals to filter noise is not recommended because it can cause the regulators to oscillate.  
Feedback (FB1 and FB2)  
FB1 and FB2 are input terminals used for adjustable-output devices and must be connected to the external  
feedback resistor divider. FB1 and FB2 connections should be as short as possible. It is essential to route them  
in such a way as to minimize/avoid noise pickup. Adding RC networks between the FB terminals and VOUT  
terminals to filter noise is not recommended because it can cause the regulators to oscillate.  
RESET Indicator  
The TPS70751 features a RESET (SVS, POR, or power-on reset). RESET can be used to drive power-on reset  
circuitry or a low-battery indicator. RESET is an active-low, open-drain output that indicates the status of the  
VOUT2 regulator and both manual reset (MR1 and MR2) pins. When VOUT2 exceeds 95% of its regulated voltage,  
and MR1 and MR2 are in the high-impedance state, RESET goes to a high-impedance state after a 120-ms  
delay. RESET goes to a low-impedance state when VOUT2 is pulled below 95% (i.e., overload condition) of its  
regulated voltage. To monitor VOUT1, the PG1 output can be connected to MR1 or MR2. The open-drain output  
of RESET requires a pullup resistor. If RESET is not used, it can be left floating.  
Input Voltage (VIN1 and VIN2  
)
VIN1 and VIN2 are inputs to the regulators. Internal bias voltages are powered by VIN1  
.
Output Voltage (VOUT1 and VOUT2  
)
VOUT1 and VOUT2 are output terminals.  
6
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TPS70751-EP  
DUAL-OUTPUT LOW-DROPOUT VOLTAGE REGULATOR  
WITH POWER-UP SEQUENCING FOR SPLIT-VOLTAGE DSP SYSTEMS  
www.ti.com  
SLVS718DECEMBER 2006  
Absolute Maximum Ratings(1)  
over operating junction temperature (unless otherwise noted)  
MIN  
–0.3  
–0.3  
–0.3  
MAX UNIT  
VIN1  
7
V
7
Input voltage range(2)  
VIN2  
Voltage range at EN  
7
V
VOUT1  
VSENSE1  
,
5.5  
Output voltage  
V
VOUT2  
,
5.5  
VSENSE2  
Maximum RESET and PG1 voltage  
Maximum MR1, MR2, and SEQ voltage  
Peak output current  
7
V
V
VIN1  
Internally Limited  
See Dissipation Rating Tables  
Continuous total power dissipation  
Operating virtual junction temperature range  
Storage temperature range  
TJ  
–55  
–65  
150  
150  
2
°C  
°C  
kV  
Tstg  
ESD rating  
Human-Body Model (HBM)  
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating  
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) All voltages are tied to network ground.  
Dissipation Ratings  
AIR FLOW  
(CFM)  
DERATING  
FACTOR  
PACKAGE  
TA 25°C  
TA = 70°C  
TA = 85°C  
0
3.067 W  
4.115 W  
30.67 mW/°C  
41.15 mW/°C  
1.687 W  
2.265 W  
1.227 W  
4.646 W  
PWP(1)  
250  
(1) This parameter is measured with the recommended copper heatsink pattern on a four-layer PCB, 1-oz copper on 4-in × 4-in ground  
layer. For more information, refer to TI technical brief SLMA002.  
Recommended Operating Conditions  
MIN  
2.7  
0
MAX UNIT  
VI  
IO  
TJ  
Input voltage(1)  
6
250  
125  
125  
V
Regulator 1  
Regulator 2  
Output current  
mA  
°C  
0
Operating virtual junction temperature  
–55  
(1) To calculate the minimum input voltage for maximum output current, use VI(min) = VO(max) + VDO(max load)  
.
7
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TPS70751-EP  
DUAL-OUTPUT LOW-DROPOUT VOLTAGE REGULATOR  
WITH POWER-UP SEQUENCING FOR SPLIT-VOLTAGE DSP SYSTEMS  
www.ti.com  
SLVS718DECEMBER 2006  
Electrical Characteristics  
over recommended operating junction temperature (TJ = –55°C to 125°C), VIN1 or VIN2 = VO(nom) + 1 V, IO = 1 mA, EN = 0,  
CO = 33 µF (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
1.22  
1.8  
MAX  
UNIT  
Reference  
voltage  
2.7 V < VI < 6 V, FB connected to VO,  
TJ = 25°C  
2.8 V < VI < 6 V, TJ = 25°C  
2.8 V < VI < 6 V  
1.8-V output  
3.3-V output  
VO  
Output voltage(1)(2)  
V
1.764  
3.234  
1.836  
3.366  
230  
4.3 V < VI < 6 V, TJ = 25°C  
4.3 V < VI < 6 V  
3.3  
190  
TJ = 25°C  
Quiescent current (GND current) for regulator 1 and  
regulator 2, EN = 0 V(1)(2)  
µA  
VO + 1 V < VI 6 V, TJ = 25°C  
VO + 1 V < VI 6 V  
TJ = 25°C  
0.01%  
Output voltage line regulation (VO/VO) for regulator  
V
1 and regulator 2(3)(2)  
0.1%  
(1)  
Load regulation for VOUT1 and VOUT2  
1
65  
mV  
Regulator 1  
BW = 300 Hz to 50 kHz,  
CO = 33 µF, TJ = 25°C  
Vn  
Output noise voltage  
µVrms  
Regulator 2  
Regulator 1  
Regulator 2  
65  
1.6  
2.1  
1.1  
Output current limit  
VO = 0 V  
A
0.750  
150  
Thermal shutdown junction temperature  
°C  
µA  
dB  
EN = VI, TJ = 25°C  
EN = VI  
2
6
Regulator 1 and  
II(standby) Standby current  
Regulator 2  
Power-supply ripple rejection  
PSRR  
f = 1 kHz, CO = 33 µF, TJ = 25°C  
60  
(1) IO = 1 mA to 250 mA for regulator 1 and 1 mA to 125 mA for regulator 2  
(2) Minimum input operating voltage is 2.7 V or VO(typ) + 1 V, whichever is greater. Maximum input voltage = 6 V, minimum output current  
1 mA.  
(3) If VO < 1.8 V, then VI(max) = 6 V, VI(min) = 2.7 V:  
VO(VI(max) * 2.7 V)  
Line regulation (mV) + (%ńV)   
  1000  
100  
If VO > 2.5 V, then VI(max) = 6 V, VI(min) = Vo + 1 V:  
VO[VI(max) * (VO ) 1)]  
Line regulation (mV) + (%ńV)   
  1000  
100  
8
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TPS70751-EP  
DUAL-OUTPUT LOW-DROPOUT VOLTAGE REGULATOR  
WITH POWER-UP SEQUENCING FOR SPLIT-VOLTAGE DSP SYSTEMS  
www.ti.com  
SLVS718DECEMBER 2006  
Electrical Characteristics (continued)  
over recommended operating junction temperature (TJ = –55°C to 125°C), VIN1 or VIN2 = VO(nom) + 1 V, IO = 1 mA, EN = 0,  
CO = 33 µF (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
RESET  
Minimum input voltage for valid RESET  
Trip threshold voltage  
Hysteresis voltage  
t(RESET)  
I(RESET) = 300 µA, V(RESET) 0.8 V  
VO decreasing  
1
95%  
0.5%  
120  
1.3  
V
92%  
80  
98%  
VO  
VO  
ms  
µs  
V
Measured at VO  
RESET pulse duration  
Rising-edge deglitch  
VI = 3.5 V, I(RESET) = 1 mA  
V(RESET) = 6 V  
160  
tr(RESET)  
30  
Output low voltage  
Leakage current  
0.15  
0.4  
1
µA  
PG1  
Minimum input voltage for valid PG1  
Trip threshold voltage  
Hysteresis voltage  
tf(PG1)  
IO(PG1) = 300 µA, V(PG1) 0.8 V  
VO decreasing  
1
95%  
0.5%  
30  
1.3  
V
92%  
98%  
VO  
VO  
µs  
V
Measured at VO  
Falling-edge deglitch  
VI = 2.7 V, I(PG1) = 1 mA  
V(PG1) = 6 V  
Output low voltage  
Leakage current  
0.15  
0.4  
1
µA  
EN  
High-level EN input voltage  
Low-level EN input voltage  
Input current (EN)  
SEQ  
2
–1  
2
V
V
0.7  
1
µA  
High-level SEQ input voltage  
Low-level SEQ input voltage  
SEQ pullup current source  
MR1/MR2  
V
V
0.7  
6
6
µA  
High-level MR1/MR2 input voltage  
Low-level MR1/MR2 input voltage  
MR1/MR2 pullup current source  
VOUT2  
2
V
V
0.7  
µA  
VOUT2 UV comparator – positive-going input  
threshold voltage of VOUT1 UV comparator  
83%  
VO  
80% VO  
86% VO  
V
VOUT2 UV comparator – falling-edge deglitch  
Peak output current  
VSENSE2 decreasing below threshold  
2-ms pulse width  
140  
375  
7.5  
µs  
mA  
mA  
Discharge transistor current  
VOUT1  
VOUT2 = 1.5 V  
VOUT1 UV comparator – positive-going input  
threshold voltage of VOUT1 UV comparator  
83%  
VO  
80% VO  
86% VO  
V
0.5%  
VO  
VOUT1 UV comparator – hysteresis  
mV  
VOUT1 UV comparator – falling-edge deglitch  
VSENSE1 decreasing below threshold  
IO = 250 mA, VIN1 = 3.2 V, TJ = 25°C  
IO = 250 mA, VIN1 = 3.2 V  
2-ms pulse width  
140  
83  
µs  
Dropout voltage(4)  
mV  
140  
Peak output current  
Discharge transistor current  
UVLO threshold  
750  
7.5  
mA  
mA  
V
VOUT1 = 1.5 V  
2.4  
2.65  
(4) Input voltage (VIN1 or VIN2) = VO(typ) – 100 mV. For 1.8-V regulators, the dropout voltage is limited by the input voltage range. The 3.3-V  
regulator input voltage is to 3.2 V to perform this test.  
9
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TYPICAL CHARACTERISTICS  
Table of Graphs  
FIGURE  
1, 2  
vs Output current  
Output voltage  
vs Junction temperature  
3–6  
Ground current  
vs Junction temperature  
vs Frequency  
7
Power-supply rejection ratio  
Output spectral noise density  
Output impedance  
8–11  
12–15  
16–19  
20, 21  
22, 23  
24, 25  
26, 27  
vs Frequency  
vs Frequency  
Dropout voltage  
vs Junction temperature  
Load transient response  
Line transient response  
Output voltage  
vs Time (start-up)  
vs Output current  
Equivalent series resistance  
(ESR)  
29–32  
OUTPUT VOLTAGE  
vs  
OUTPUT VOLTAGE  
vs  
OUTPUT CURRENT  
OUTPUT CURRENT  
1.802  
3.303  
3.302  
3.301  
3.3  
V
= 2.8 V  
V
= 4.3 V  
IN2  
IN1  
T = 25°C  
T = 25°C  
J
J
1.801  
V
OUT2  
V
OUT1  
1.800  
1.799  
1.798  
1.797  
3.299  
3.298  
3.297  
1.796  
1.795  
3.296  
3.295  
0
0.025  
0.05  
0.075  
0.1  
0.125  
0
0.05  
0.1  
0.15  
0.2  
0.25  
I
O
− Output Current − A  
I
O
− Output Current − A  
Figure 1.  
Figure 2.  
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OUTPUT VOLTAGE  
vs  
OUTPUT VOLTAGE  
vs  
JUNCTION TEMPERATURE  
JUNCTION TEMPERATURE  
3.35  
3.33  
3.35  
3.33  
V
= 4.3 V  
= 250 mA  
IN1  
V
= 4.3 V  
= 1 mA  
IN1  
I
O
I
O
V
OUT1  
V
OUT1  
3.31  
3.29  
3.31  
3.29  
3.27  
3.27  
3.25  
3.23  
3.25  
3.23  
−40 −25 −10  
5
20 35 50 65 80 95 110 125  
−40 −25 −10  
5
20 35 50 65 80 95 110 125  
T − Junction Temperature − °C  
J
T − Junction Temperature − °C  
J
Figure 3.  
Figure 4.  
OUTPUT VOLTAGE  
vs  
OUTPUT VOLTAGE  
vs  
JUNCTION TEMPERATURE  
JUNCTION TEMPERATURE  
1.800  
1.798  
1.799  
V
= 2.8 V  
= 1 mA  
IN2  
V
= 2.8 V  
= 125 mA  
IN2  
I
O
I
O
1.798  
1.797  
1.796  
1.795  
1.794  
1.793  
V
OUT2  
V
OUT2  
1.796  
1.794  
1.792  
1.790  
1.792  
1.791  
1.790  
1.788  
1.786  
−40 −25 −10  
5
20 35 50 65 80 95 110 125  
−40 −25 −10  
5
20 35 50 65 80 95 110 125  
T − Junction Temperature − °C  
J
T − Junction Temperature − °C  
J
Figure 5.  
Figure 6.  
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GROUND CURRENT  
vs  
JUNCTION TEMPERATURE  
210  
Regulator 1 and Regulator 2  
200  
I
I
= 1 mA  
= 1 mA  
OUT1  
OUT2  
190  
180  
170  
I
I
= 250 mA  
= 125 mA  
OUT1  
OUT2  
160  
150  
−40 −25 −10  
5
20 35 50 65 80 95 110 125  
T − Junction Temperature − °C  
J
Figure 7.  
POWER-SUPPLY REJECTION RATIO  
POWER-SUPPLY REJECTION RATIO  
vs  
vs  
FREQUENCY  
FREQUENCY  
10  
−10  
I
C
V
= 250 mA  
I
C
V
= 10 mA  
O
O
0
−10  
−20  
= 22 µF  
= 22 µF  
−20  
−30  
−40  
O
O
OUT1  
OUT1  
−30  
−40  
−50  
−50  
−60  
−70  
−60  
−70  
−80  
−90  
−80  
−90  
10  
100  
1 k  
10 k  
100 k  
1 M  
10  
100  
1 k  
10 k  
100 k  
1 M  
f − Frequency − Hz  
f − Frequency − Hz  
Figure 8.  
Figure 9.  
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POWER-SUPPLY REJECTION RATIO  
POWER-SUPPLY REJECTION RATIO  
vs  
vs  
FREQUENCY  
FREQUENCY  
10  
−10  
I
I
C
V
= 150 mA  
O
= 10 mA  
0
−10  
−20  
O
= 22 µF  
O
C
V
= 22 µF  
−20  
O
OUT2  
OUT2  
−30  
−40  
−30  
−40  
−50  
−60  
−70  
−50  
−60  
−70  
−80  
−90  
−80  
−90  
10  
100  
1 k  
10 k  
100 k  
1 M  
10  
100  
1 k  
10 k  
100 k  
1 M  
f − Frequency − Hz  
f − Frequency − Hz  
Figure 10.  
Figure 11.  
OUTPUT SPECTRAL NOISE DENSITY  
OUTPUT SPECTRAL NOISE DENSITY  
vs  
vs  
FREQUENCY  
FREQUENCY  
10  
10  
V
V
I
= 4.3 V  
= 3.3 V  
= 10 mA  
V
V
I
= 4.3 V  
= 3.3 V  
= 250 mA  
IN1  
OUT1  
IN1  
OUT1  
O
O
1
1
0.1  
0.01  
0.1  
0.01  
100  
1 k  
10 k  
100 k  
100  
1 k  
10 k  
100 k  
f − Frequency − Hz  
f − Frequency − Hz  
Figure 12.  
Figure 13.  
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OUTPUT SPECTRAL NOISE DENSITY  
OUTPUT SPECTRAL NOISE DENSITY  
vs  
vs  
FREQUENCY  
FREQUENCY  
10  
10  
V
V
I
= 2.8 V  
= 1.8 V  
= 125 mA  
V
= 2.8 V  
= 1.8 V  
= 10 mA  
IN2  
OUT2  
IN2  
V
I
OUT2  
O
O
1
1
0.1  
0.1  
0.01  
0.01  
100  
1 k  
10 k  
100 k  
100  
1 k  
10 k  
100 k  
f − Frequency − Hz  
f − Frequency − Hz  
Figure 14.  
Figure 15.  
OUTPUT IMPEDANCE  
vs  
OUTPUT IMPEDANCE  
vs  
FREQUENCY  
FREQUENCY  
10  
100  
C
I
= 33 µF  
= 250 mA  
C
I
= 33 µF  
= 10 mA  
O
O
O
O
V
OUT1  
= 3.3 V  
V
OUT1  
= 3.3 V  
T = 25°C  
J
T = 25°C  
J
10  
1
1
0.1  
0.01  
0.1  
0.01  
10  
100  
1 k  
10 k  
100 k  
1 M  
10 M  
10  
100  
1 k  
10 k  
100 k  
1 M  
10 M  
f − Frequency − Hz  
f − Frequency − Hz  
Figure 16.  
Figure 17.  
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OUTPUT IMPEDANCE  
OUTPUT IMPEDANCE  
vs  
vs  
FREQUENCY  
FREQUENCY  
10  
100  
C
O
= 33 µF  
C = 33 µF  
O
I
O
= 125 mA  
I = 10 mA  
O
V
OUT2  
= 1.8 V  
V
OUT2  
= 1.8 V  
T = 25°C  
J
T = 25°C  
J
10  
1
1
0.1  
0.01  
0.1  
10  
10  
100  
1 k  
10 k  
100 k  
1 M  
10 M  
100  
1 k  
10 k  
100 k  
1 M  
10 M  
f − Frequency − Hz  
f − Frequency − Hz  
Figure 18.  
Figure 19.  
DROPOUT VOLTAGE  
vs  
DROPOUT VOLTAGE  
vs  
JUNCTION TEMPERATURE  
JUNCTION TEMPERATURE  
6
5
120  
C
= 33 µF  
= 3.2 V  
C
V
= 33 µF  
O
O
V
IN1  
= 3.2 V  
IN1  
100  
I
O
= 10 mA  
I
O
= 250 mA  
80  
60  
40  
4
3
2
20  
0
1
0
I
O
= 0 mA  
−40 −25 −10  
5
20 35 50 65 80 95 110 125  
−40 −25 −10  
5
20 35 50 65 80 95 110 125  
T − Junction Temperature − °C  
J
T − Junction Temperature − °C  
J
Figure 20.  
Figure 21.  
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LOAD TRANSIENT RESPONSE  
= 33 µF  
LOAD TRANSIENT RESPONSE  
= 33 µF  
C
O
C
O
T = 25°C  
T = 25°C  
250  
0
J
125  
0
J
V
OUT1  
= 3.3 V  
V
OUT2  
= 1.8 V  
20  
0
20  
0
−20  
−40  
−20  
−40  
−60  
−80  
0
0.2 0.4 0.6 0.8  
1
1.2 1.4 1.6 1.8  
2
0
0.2 0.4 0.6 0.8  
1
1.2 1.4 1.6 1.8  
2
t − Time − ms  
t − Time − ms  
Figure 22.  
Figure 23.  
LINE TRANSIENT RESPONSE  
LINE TRANSIENT RESPONSE  
3.8  
2.8  
5.3  
4.3  
50  
0
10  
0
I
O
= 125 mA  
I
O
= 250 mA  
−50  
C
= 33 µF  
O
C
V
= 33 µF  
−10  
O
V
OUT2  
OUT1  
0
20 40 60 80 100 120 140 160 180 200  
0
20 40 60 80 100 120 140 160 180 200  
t − Time − µs  
t − Time − µs  
Figure 24.  
Figure 25.  
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OUTPUT VOLTAGE  
OUTPUT VOLTAGE  
vs  
vs  
TIME (START-UP)  
TIME (START-UP)  
V
= 1.8 V  
= 33 µF  
= 125 mA  
V
C
= 3.3 V  
= 33 µF  
= 250 mA  
O
O
3
2
2
1
C
I
O
O
I
O
O
V
OUT2  
V
OUT1  
SEQ = High  
SEQ = Low  
1
0
0
−1  
5
5
0
0
−5  
−5  
0
0.2 0.4 0.6 0.8  
1
1.2 1.4 1.6 1.8  
2
0
0.2 0.4 0.6 0.8  
1
1.2 1.4 1.6 1.8  
2
t − Time − ms  
t − Time − ms  
Figure 26.  
Figure 27.  
To Load  
IN  
VI  
OUT  
+
R
CO  
ESR  
RL  
EN  
GND  
Figure 28. Test Circuit for Typical Regions of Stability  
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TYPICAL REGION OF STABILITY  
EQUIVALENT SERIES RESISTANCE  
vs  
TYPICAL REGION OF STABILITY  
EQUIVALENT SERIES RESISTANCE  
vs  
OUTPUT CURRENT  
OUTPUT CURRENT  
10  
10  
REGION OF INSTABILITY  
REGION OF INSTABILITY  
V
C
= 3.3 V  
= 10 µF  
O
V
O
= 3.3 V  
O
C
O
= 6.8 µF  
T = 25°C  
J
T = 25°C  
J
1
1
0.1  
50 mΩ  
250 mΩ  
REGION OF INSTABILITY  
REGION OF INSTABILITY  
0.1  
0.01  
0
50  
100  
150  
200  
250  
0
50  
100  
150  
200  
250  
I
O
− Output Current − mA  
I
O
− Output Current − mA  
Figure 29.  
Figure 30.  
TYPICAL REGION OF STABILITY  
EQUIVALENT SERIES RESISTANCE(1)  
TYPICAL REGION OF STABILITY  
EQUIVALENT SERIES RESISTANCE  
vs  
(1)  
vs  
OUTPUT CURRENT  
OUTPUT CURRENT  
10  
10  
REGION OF INSTABILITY  
REGION OF INSTABILITY  
V
C
= 1.8 V  
= 6.8 µF  
O
V
C
= 1.8 V  
= 10 µF  
O
O
O
T = 25°C  
J
T = 25°C  
J
1
1
0.1  
50 mΩ  
250 mΩ  
REGION OF INSTABILITY  
REGION OF INSTABILITY  
0.1  
0.01  
0
25  
50  
75  
100  
125  
0
25  
50  
I − Output Current − mA  
O
75  
100  
125  
I
O
− Output Current − mA  
(1)  
(1)  
Equivalent series resistance (ESR) refers to the total series  
Equivalent series resistance (ESR) refers to the total series  
resistance, including the ESR of the capacitor, any series  
resistance, including the ESR of the capacitor, any series  
resistance added externally, and PWB trace resistance to C .  
O
resistance added externally, and PWB trace resistance to C .  
O
Figure 31.  
Figure 32.  
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APPLICATION INFORMATION  
Sequencing Timing Diagrams  
The following figures provide timing diagrams showing how this device functions in different configurations.  
Application Conditions Not Shown in Block Diagram  
VIN1 and VIN2 are tied to the same fixed-input voltage greater than the VUVLO, SEQ is tied to logic low, PG1 is  
tied to MR2, and MR1 is left unconnected and is, therefore, at logic high.  
TPS70751PWP  
(Fixed-Output Option)  
VI  
VOUT1  
VOUT1  
VIN1  
10 mF  
0.1 mF  
VSENSE1  
250 kW  
Pg1  
MR2  
MR2  
VIN2  
0.1 mF  
RESET  
MR1  
RESET  
MR1  
EN  
EN  
>2 V  
<0.7 V  
VSENSE2  
SEQ  
VOUT2  
VOUT2  
10 mF  
Explanation of Timing Diagram  
EN is initially high; therefore, both regulators are off and PG1 and RESET are at logic low. With SEQ at logic  
low, when EN is taken to logic low, VOUT1 turns on. VOUT2 turns on after VOUT1 reaches 83% of its regulated  
output voltage. When VOUT1 reaches 95% of its regulated output voltage, PG1 (tied to MR2) goes to logic high.  
When both VOUT1 and VOUT2 reach 95% of their respective regulated output voltages and both MR1 and MR2  
(tied to PG1) are at logic high, RESET is pulled to logic high after a 120-ms delay. When EN is returned to logic  
high, both devices power down and both PG1 (tied to MR2) and RESET return to logic low.  
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APPLICATION INFORMATION (continued)  
EN  
SEQ  
VOUT2  
95%  
83%  
95%  
83%  
VOUT1  
PG1  
MR1  
MR2  
(MR2 tied to PG1)  
RESET  
t1  
(see Note A)  
120 ms  
NOTE : A. t1 - Time at which both VOUT1 and VOUT2 are greater than the PG thresholds and MR1 is logic high.  
Figure 33. Timing When SEQ = Low  
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APPLICATION INFORMATION (continued)  
Application Conditions Not Shown in Block Diagram  
VIN1 and VIN2 are tied to the same fixed-input voltage greater than the VUVLO, SEQ is tied to logic high, PG1 is  
tied to MR2, and MR1 is left unconnected and is, therefore, at logic high.  
TPS70751PWP  
(Fixed-Output Option)  
VI  
VOUT1  
VOUT1  
VIN1  
10 mF  
0.1 mF  
VSENSE1  
250 kW  
Pg1  
MR2  
MR2  
VIN2  
0.1 mF  
RESET  
MR1  
RESET  
MR1  
EN  
EN  
>2 V  
<0.7 V  
VSENSE2  
SEQ  
VOUT2  
VOUT2  
10 mF  
Explanation of Timing Diagram  
EN is initially high; therefore, both regulators are off and PG1 and RESET are at logic low. With SEQ at logic  
high, when EN is taken to logic low, VOUT2 turns on. VOUT1 turns on after VOUT2 reaches 83% of its regulated  
output voltage. When VOUT1 reaches 95% of its regulated output voltage, PG1 (tied to MR2) goes to logic high.  
When both VOUT1 and VOUT2 reach 95% of their respective regulated output voltages and both MR1 and MR2  
(tied to PG1) are at logic high, RESET is pulled to logic high after a 120-ms delay. When EN is returned to logic  
high, both devices turn off and both PG1 (tied to MR2) and RESET return to logic low.  
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APPLICATION INFORMATION (continued)  
EN  
SEQ  
VOUT2  
95%  
83%  
95%  
83%  
VOUT1  
PG1  
MR1  
MR2  
(MR2 tied to PG1)  
RESET  
t1  
(see Note A)  
120ms  
NOTE : A. t1 - Time at which both VOUT1 and VOUT2 are greater than the PG thresholds and MR1 is logic high.  
Figure 34. Timing When SEQ = High  
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APPLICATION INFORMATION (continued)  
Application Conditions Not Shown in Block Diagram  
VIN1 and VIN2 are tied to the same fixed-input voltage greater than the VUVLO, SEQ is tied to logic high, PG1 is  
tied to MR2, and MR1 is initially at logic high but is eventually toggled.  
TPS70751PWP  
(Fixed Output Option)  
VI  
VOUT1  
VOUT1  
VIN1  
10 mF  
0.1 mF  
VSENSE1  
250 kW  
Pg1  
MR2  
MR2  
VIN2  
0.1 mF  
RESET  
RESET  
MR1  
MR1  
EN  
EN  
>2 V  
<0.7 V  
>2 V  
<0.7 V  
VSENSE2  
SEQ  
VOUT2  
VOUT2  
10 mF  
Explanation of Timing Diagram  
EN is initially high; therefore, both regulators are off and PG1 and RESET are at logic low. With SEQ at logic  
high, when EN is taken low, VOUT2 turns on. VOUT1 turns on after VOUT2 reaches 83% of its regulated output  
voltage. When VOUT1 reaches 95% of its regulated output voltage, PG1 (tied to MR2) goes to logic high. When  
both VOUT1 and VOUT2 reach 95% of their respective regulated output voltages and both MR1 and MR2 (tied to  
PG1) are at logic high, RESET is pulled to logic high after a 120-ms delay. When MR1 is taken low, RESET  
returns to logic low but the outputs remain in regulation. When MR1 is returned to logic high, since both VOUT1  
and VOUT2 remain above 95% of their respective regulated output voltages and MR2 (tied to PG1) remains at  
logic high, RESET is pulled to logic high after a 120-ms delay.  
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APPLICATION INFORMATION (continued)  
EN  
SEQ  
VOUT2  
95%  
83%  
95%  
83%  
VOUT1  
PG1  
MR1  
MR2  
(MR2 tied to PG1)  
RESET  
t1  
(see Note A)  
120 ms  
120 ms  
NOTE : A. t1 - Time at which both VOUT1 and VOUT2 are greater than the PG thresholds and MR1 is logic high.  
Figure 35. Timing When MR1 Is Toggled  
24  
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SLVS718DECEMBER 2006  
APPLICATION INFORMATION (continued)  
Application Conditions Not Shown in Block Diagram  
VIN1 and VIN2 are tied to the same fixed-input voltage greater than the VUVLO, SEQ is tied to logic high, PG1 is  
tied to MR2, and MR1 is left unconnected and is, therefore, at logic high.  
TPS70751PWP  
(Fixed-Output Option)  
VI  
VOUT1  
VOUT1  
VIN1  
10 mF  
0.1 mF  
VSENSE1  
250 kW  
Pg1  
MR2  
MR2  
VIN2  
0.1 mF  
RESET  
MR1  
RESET  
MR1  
EN  
EN  
>2 V  
<0.7 V  
VSENSE2  
SEQ  
VOUT2  
VOUT2  
10 mF  
Explanation of Timing Diagram  
EN is initially high; therefore, both regulators are off and PG1 and RESET are at logic low. With SEQ at logic  
high, when EN is taken low, VOUT2 turns on. VOUT1 turns on after VOUT2 reaches 83% of its regulated output  
voltage. When VOUT1 reaches 95% of its regulated output voltage, PG1 (tied to MR2) goes to logic high. When  
both VOUT1 and VOUT2 reach 95% of their respective regulated output voltages and both MR1 and MR2 (tied to  
PG1) are at logic high, RESET is pulled to logic high after a 120-ms delay. When a fault on VOUT1 causes it to  
fall below 95% of its regulated output voltage, PG1 (tied to MR2) goes to logic low, causing RESET to return to  
logic low. VOUT2 remains on because SEQ is high.  
25  
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APPLICATION INFORMATION (continued)  
EN  
SEQUENCE  
VOUT2  
95%  
83%  
95%  
83%  
VOUT1  
Fault on VOUT1  
PG1  
MR1  
MR2  
(MR2 tied to PG1)  
RESET  
t1  
(see Note A)  
120 ms  
NOTE : A. t1 - Time at which both VOUT1 and VOUT2 are greater than the PG thresholds and MR1 is logic high.  
Figure 36. Timing When VOUT1 Faults Out  
26  
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SLVS718DECEMBER 2006  
APPLICATION INFORMATION (continued)  
Application Conditions Not Shown in Block Diagram  
VIN1 and VIN2 are tied to the same fixed-input voltage greater than the VUVLO, SEQ is tied to logic high, PG1 is  
tied to MR2, and MR1 is left unconnected and is, therefore, at logic high.  
TPS70751PWP  
(Fixed-Output Option)  
VI  
VOUT1  
VOUT1  
VIN1  
10 mF  
0.1 mF  
VSENSE1  
250 kW  
Pg1  
MR2  
MR2  
VIN2  
0.1 mF  
RESET  
MR1  
RESET  
MR1  
EN  
EN  
>2 V  
<0.7 V  
VSENSE2  
SEQ  
VOUT2  
VOUT2  
10 mF  
Explanation of Timing Diagram  
EN is initially high; therefore, both regulators are off and PG1 and RESET are at logic low. With SEQ at logic  
high, when EN is taken low, VOUT2 turns on. VOUT1 turns on after VOUT2 reaches 83% of its regulated output  
voltage. When VOUT1 reaches 95% of its regulated output voltage, PG1 (tied to MR2) goes to logic high. When  
both VOUT1 and VOUT2 reach 95% of their respective regulated output voltages and both MR1 and MR2 (tied to  
PG1) are at logic high, RESET is pulled to logic high after a 120-ms delay. When a fault on VOUT2 causes it to  
fall below 95% of its regulated output voltage, RESET returns to logic low and VOUT1 begins to power down  
because SEQ is high. When VOUT1 falls below 95% of its regulated output voltage, PG1 (tied to MR2) returns to  
logic low.  
27  
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APPLICATION INFORMATION (continued)  
ENABLE  
SEQUENCE  
95%  
83%  
VOUT2  
Fault on VOUT2  
95%  
83%  
VOUT1  
PG1  
MR1  
MR2  
(MR2 tied to PG1)  
RESET  
t1  
120 ms  
(see Note A)  
NOTE : A. t1 - Time at which both VOUT1 and VOUT2 are greater than the PG thresholds and MR1 is logic high.  
Figure 37. Timing When VOUT2 Faults Out  
28  
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SLVS718DECEMBER 2006  
APPLICATION INFORMATION (continued)  
Split Voltage DSP Application  
Figure 38 shows a typical application where the TPS70751 is powering up a DSP. In this application, by  
grounding the SEQ pin, VOUT1(I/O) is powered up first, and then VOUT2(core) is powered up.  
TPS70751 PWP  
DSP  
I/O  
3.3 V  
VOUT1  
5 V  
VIN1  
10 mF  
0.1 mF  
250 kW  
VSENSE1  
PG1  
PG1  
MR2  
MR2  
>2 V  
<0.7 V  
VIN2  
250 kW  
0.1 mF  
RESET  
RESET  
MR1  
MR1  
EN  
>2 V  
<0.7 V  
>2 V  
EN  
<0.7 V  
VSENSE2  
SEQ  
1.8 V  
VOUT2  
Core  
10 mF  
EN  
SEQ  
VOUT2  
(Core)  
95%  
83%  
VOUT1  
(I/O)  
95%  
83%  
PG1  
RESET  
t1  
(see Note A)  
120 ms  
NOTE : A. t1 - Time at which both VOUT1 and VOUT2 are greater than the PG thresholds and MR1 is logic high.  
Figure 38. Application Timing Diagram (SEQ = Low)  
29  
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SLVS718DECEMBER 2006  
APPLICATION INFORMATION (continued)  
Figure 39 shows a typical application where the TPS70751 is powering up a DSP. In this application, by pulling  
up the SEQ pin, VOUT2(core) is powered up first, and then VOUT1(I/O) is powered up.  
TPS70751 PWP  
DSP  
I/O  
5 V  
3.3 V  
VOUT1  
VIN1  
10 mF  
0.1 mF  
250 kW  
VSENSE1  
PG1  
PG1  
MR2  
MR2  
>2 V  
<0.7 V  
VIN2  
250 kW  
0.1 mF  
RESET  
RESET  
MR1  
MR1  
>2 V  
<0.7 V  
EN  
>2 V  
<0.7 V  
EN  
VSENSE2  
SEQ  
1.8 V  
VOUT2  
Core  
10 mF  
EN  
SEQ  
VOUT2  
(Core)  
95%  
83%  
95%  
83%  
VOUT1  
(I/O)  
PG1  
RESET  
t1  
120 ms  
(see Note A)  
NOTE : A. t1 - Time at which both VOUT1 and VOUT2 are greater than the PG thresholds and MR1 is logic high.  
Figure 39. Application Timing Diagram (SEQ = High)  
30  
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SLVS718DECEMBER 2006  
APPLICATION INFORMATION (continued)  
Input Capacitor  
For a typical application, an input bypass capacitor (0.1 µF through 1 µF) is recommended. This capacitor filters  
any high-frequency noise generated in the line. For fast transient condition where droop at the input of the LDO  
may occur due to high inrush current, it is recommended to place a larger capacitor at the input as well. The size  
of this capacitor is dependant on the output current and response time of the main power supply, as well as the  
distance to the VI pins of the LDO.  
Output Capacitor  
As with most LDO regulators, the TPS70751 requires an output capacitor connected between OUT and GND to  
stabilize the internal control loop. The minimum recommended capacitance values are 10-µF ceramic capacitors  
with an equivalent series resistance (ESR) between 50 mand 2.5 , or 6.8-µF tantalum capacitors with ESR  
between 250 mand 4 . Solid tantalum electrolytic, aluminum electrolytic, and multilayer ceramic capacitors  
with capacitance values greater than 10 µF are all suitable, provided they meet the requirements previously  
described. Larger capacitors provide a wider range of stability and better load transient response. The following  
is a partial listing of surface-mount capacitors usable with the TPS70751 for fast transient response application.  
This information, along with the ESR graphs, is included to assist in selection of suitable capacitance for the  
user's application. When it is necessary to achieve low height requirements along with high output current and/or  
high load capacitance, several higher ESR capacitors can be used in parallel to meet the previous guidelines.  
VALUE  
22 µF  
33 µF  
47 µF  
68 µF  
MFR.  
Kemet  
Sanyo  
Sanyo  
Sanyo  
MAX ESR  
345 mΩ  
100 mΩ  
100 mΩ  
45 mΩ  
PART NO.  
7495C226K0010AS  
10TPA33M  
6TPA47M  
10TPC68M  
ESR and Transient Response  
LDOs typically require an external output capacitor for stability. In fast transient response applications,  
capacitors are used to support the load current the while the LDO amplifier is responding. In most applications,  
one capacitor is used to support both functions.  
Besides its capacitance, every capacitor also contains parasitic impedances. These parasitic impedances are  
resistive as well as inductive. The resistive impedance is called ESR, and the inductive impedance is called  
equivalent series inductance (ESL). The equivalent schematic diagram of any capacitor can, therefore, be drawn  
as shown in Figure 40.  
RESR  
LESL  
C
Figure 40. ESR and ESL  
In most cases one can neglect the effect of inductive impedance ESL. Therefore, the following application  
focuses mainly on the parasitic resistance ESR.  
31  
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SLVS718DECEMBER 2006  
Figure 41 shows the output capacitor and its parasitic impedances in a typical LDO output stage.  
IO  
LDO  
-
RESR  
VESR  
+
+
VI  
VO  
RLOAD  
-
CO  
Figure 41. LDO Output Stage With Parasitic Resistances ESR  
In steady state (dc state condition), the load current is supplied by the LDO (solid arrow) and the voltage across  
the capacitor is the same as the output voltage [V(CO) = VO]. This means no current is flowing into the CO  
branch. If IO suddenly increases (transient condition), the following occurs.  
The LDO is not able to supply the sudden current need due to its response time (t1 in Figure 42). Therefore,  
capacitor CO provides the current for the new load condition (dashed arrow). CO now acts like a battery with an  
internal resistance, ESR. Depending on the current demand at the output, a voltage drop occurs at RESR. This  
voltage is shown as VESR in Figure 41.  
When CO is conducting current to the load, initial voltage at the load will be VO = V(CO) – VESR. Due to the  
discharge of CO, the output voltage VO drops continuously until the response time t1 of the LDO is reached and  
the LDO resumes supplying the load. From this point, the output voltage starts rising again until it reaches the  
regulated voltage. This period is shown as t2 in Figure 42.  
The figure also shows the impact of different ESRs on the output voltage. The left brackets show different levels  
of ESRs, where number 1 displays the lowest and number 3 displays the highest ESR.  
From the previous paragraphs, these conclusions can be drawn:  
The higher the ESR, the larger the droop at the beginning of load transient.  
The smaller the output capacitor, the faster the discharge time and the bigger the voltage droop during the  
LDO response period.  
Conclusion  
To minimize the transient output droop, capacitors must have a low ESR and be large enough to support the  
minimum output voltage requirement.  
32  
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SLVS718DECEMBER 2006  
IO  
VO  
1
2
ESR 1  
ESR 2  
3
ESR 3  
t1  
t2  
Figure 42. Correlation of Different ESRs and Their Influence to the Regulation of VO  
at a Load Step From Low-to-High Output Current  
Regulator Protection  
Both TPS70751 PMOS-pass transistors have built-in back diodes that conduct reverse currents when the input  
voltage drops below the output voltage (e.g., during power down). Current is conducted from the output to the  
input and is not internally limited. When extended reverse voltage is anticipated, external limiting may be  
appropriate.  
The TPS70751 also features internal current limiting and thermal protection. During normal operation, the  
TPS70751 regulator 1 limits output current to approximately 1.6 A (typ) and regulator 2 limits output current to  
approximately 750 mA (typ). When current limiting engages, the output voltage scales back linearly until the  
overcurrent condition ends. While current limiting is designed to prevent gross device failure, care should be  
taken not to exceed the power dissipation ratings of the package. If the temperature of the device exceeds  
150°C (typ), thermal-protection circuitry shuts it down. Once the device has cooled below 130°C (typ),  
regulator operation resumes.  
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SLVS718DECEMBER 2006  
Power Dissipation and Junction Temperature  
Specified regulator operation is ensured to a junction temperature of 125°C; the maximum junction temperature  
should be restricted to 125°C under normal operating conditions. This restriction limits the power dissipation the  
regulator can handle in any given application. To ensure the junction temperature is within acceptable limits,  
calculate the maximum allowable dissipation, PD(max), and the actual dissipation, PD, which must be less than or  
equal to PD(max)  
.
The maximum-power-dissipation limit is determined using the following equation:  
T max * T  
J
+
A
P
D(max)  
R
qJA  
Where:  
TJmax = Maximum allowable junction temperature  
θJA = Thermal resistance junction-to-ambient for the package, i.e., 32.6°C/W for the 20-terminal PWP  
R
with no airflow  
TA = Ambient temperature  
The regulator dissipation is calculated using:  
+ ǒVI * V  
Ǔ
P
  I  
D
O
O
Power dissipation resulting from quiescent current is negligible. Excessive power dissipation triggers the thermal  
protection circuit.  
34  
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PACKAGE OPTION ADDENDUM  
www.ti.com  
18-Sep-2008  
PACKAGING INFORMATION  
Orderable Device  
TPS70751MPWPREP  
V62/07610-01XE  
Status (1)  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
HTSSOP  
PWP  
20  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
HTSSOP  
PWP  
20  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF TPS70751-EP :  
Catalog: TPS70751  
NOTE: Qualified Version Definitions:  
Catalog - TI's standard catalog product  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
TPS70751MPWPREP HTSSOP PWP  
20  
2000  
330.0  
16.4  
6.95  
7.1  
1.6  
8.0  
16.0  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
HTSSOP PWP 20  
SPQ  
Length (mm) Width (mm) Height (mm)  
367.0 367.0 38.0  
TPS70751MPWPREP  
2000  
Pack Materials-Page 2  
IMPORTANT NOTICE  
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TI

TPS70802PWPG4

具有电源正常指示和独立使能功能的 250mA、双通道低压降稳压器 | PWP | 20 | -40 to 125
TI