TPS715-Q1 [TI]

汽车类 50mA、24V、超低 IQ、低压降稳压器;
TPS715-Q1
型号: TPS715-Q1
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

汽车类 50mA、24V、超低 IQ、低压降稳压器

电源电路 线性稳压器IC
文件: 总11页 (文件大小:232K)
中文:  中文翻译
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TPS71501-Q1  
TPS71525-Q1, TPS71530-Q1  
A
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2
,
1
5
m
m
x
2
,
3
m
m
)
TPS71533-Q1, TPS71550-Q1  
www.ti.com  
SGLS272COCTOBER 2004REVISED APRIL 2007  
50-mA, 24-V, 3.2-µA Supply Current  
Low-Dropout Linear Regulators in SC70 Package  
FEATURES  
APPLICATIONS  
Ultra-Low-Power Microcontrollers  
Cellular/Cordless Handsets  
Portable/Battery-Powered Equipment  
Qualification in Accordance With  
(1)  
AEC-Q100  
Qualified for Automotive Applications  
Customer-Specific Configuration Control Can  
Be Supported Along With Major-Change  
Approval  
DESCRIPTION  
The TPS715xx low-dropout (LDO) voltage regulators  
offer the benefits of high input voltage, LDO voltage,  
low-power operation, and miniaturized packaging.  
The devices, which operate over an input range of  
2.5 V to 24 V, are stable with any capacitor  
(>0.47 µF). The LDO voltage and low quiescent  
current allow operations at extremely low power  
levels. Therefore, the devices are ideal for powering  
battery-management ICs. Specifically, since the  
devices are enabled as soon as the applied voltage  
reaches the minimum input voltage, the output is  
quickly available to power continuously operating  
battery-charging ICs.  
24-V Maximum Input Voltage  
Low 3.2-µA Quiescent Current at 50 mA  
Stable With Any Capacitor (>0.47 µF)  
50-mA Low-Dropout Regulator  
Available in 2.5 V, 3 V, 3.3 V, 5 V, and  
Adjustable (1.2 V to 15 V)  
Minimum/Maximum Specified Current Limit  
5-Pin SC70/SOT-323 (DCK) Package  
–40°C to 125°C Specified Junction  
Temperature Range  
The usual PNP pass transistor has been replaced by  
a PMOS pass element. Because the PMOS pass  
element behaves as a low-value resistor, the LDO  
voltage, typically 415 mV at 50 mA of load current, is  
directly proportional to the load current. The low  
quiescent current (3.2 µA typ) is stable over the  
entire range of output load current (0 mA to 50 mA).  
(1) Contact Texas Instruments for details. Q100 qualification data  
available on request.  
DCK PACKAGE  
(TOP VIEW)  
OUT  
TPS715xx  
MSP430  
IN  
FB/NC  
GND  
NC  
1
2
5
OUT  
IN  
Li–  
3
4
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
AVAILABLE OPTIONS(1)  
TJ  
VOLTAGE  
PACKAGE  
PART NUMBER  
SYMBOL  
ANU  
2.5 V  
SC70/SOT-323 (DCK)  
SC70/SOT-323 (DCK)  
SC70/SOT-323 (DCK)  
SC70/SOT-323 (DCK)  
SC70/SOT-323 (DCK)  
TPS71525QDCKRQ1  
TPS71530QDCKRQ1  
TPS71533QDCKRQ1  
TPS71550QDCKRQ1  
TPS71501QDCKRQ1  
3 V  
ANV  
–40°C to 125°C  
3.3 V  
5 V  
ANW  
ANX  
(Adjustable) 1.2 V–15 V  
ANS  
(1) Contact Texas Instruments for other voltage options between 1.25 V and 5.85 V.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2004–2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
TPS71501-Q1  
TPS71525-Q1, TPS71530-Q1  
TPS71533-Q1, TPS71550-Q1  
www.ti.com  
SGLS272COCTOBER 2004REVISED APRIL 2007  
ABSOLUTE MAXIMUM RATINGS  
over operating temperature range (unless otherwise noted)(1)(2)  
UNIT  
–0.3 V to 24 V  
–0.3 V to 16.5 V  
Internally limited  
2 kV  
VIN range  
VOUT range  
Peak output current  
ESD rating, HBM  
ESD rating, CDM  
500 V  
Continuous total power dissipation  
Junction temperature range, TJ  
Storage temperature range, Tstg  
See Dissipation Rating Table  
–40°C to 150°C  
–65°C to 150°C  
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating  
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) All voltage values are with respect to network ground terminal.  
DISSIPATION RATING TABLE  
DERATING FACTOR  
ABOVE TA = 25°C  
T
A 25°C  
TA = 70°C  
TA = 85°C  
BOARD  
PACKAGE  
RθJC°C/W  
RθJA°C/W  
POWER RATING POWER RATING POWER RATING  
Low-K(1)  
High-K(2)  
DCK  
DCK  
165  
165  
395  
315  
2.52 mW/°C  
3.18 mW/°C  
250 mW  
320 mW  
140 mW  
175 mW  
100 mW  
130 mW  
(1) The JEDEC Low-K (1s) board design used to derive this data was a 3-in × 3-in, two-layer board with 2-oz copper traces on top of the  
board.  
(2) The JEDEC High-K (2s2p) board design used to derive this data was a 3-in × 3-in, multilayer board with 1-oz internal power and ground  
planes and 2-oz copper traces on top and bottom of the board.  
2
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TPS71501-Q1  
TPS71525-Q1, TPS71530-Q1  
TPS71533-Q1, TPS71550-Q1  
www.ti.com  
SGLS272COCTOBER 2004REVISED APRIL 2007  
ELECTRICAL CHARACTERISTICS  
over operating junction temperature range (TJ = –40°C to 125°C), VIN = VOUT(NOM) + 1 V, IOUT = 1 mA, COUT = 1 µF (unless  
otherwise noted). Typical values are at TJ = 25°C.  
PARAMETER  
TEST CONDITIONS  
MIN TYP  
MAX UNIT  
IO = 10 mA  
IO = 50 mA  
2.5  
3
24  
V
VIN  
Input voltage(1)  
24  
VOUT voltage range (TPS71501)  
VOUT accuracy(1) over VIN, IOUT, and T VIN + 1 V VIN 24 V , 100 µA IOUT 50 mA  
1.2  
–4%  
3.2  
22  
15  
4%  
12  
V
IGND  
Ground-pin current  
0 mA IOUT 50 mA  
IOUT = 100 µA to 50 mA  
VOUT + 1 V < VIN 24 V  
µA  
mV  
mV  
VOUT/IOUT  
VOUT/VIN  
Load regulation  
(1)  
Output voltage line regulation  
20  
60  
BW = 200 Hz to 100 kHz, COUT = 10 µF,  
IOUT = 50 mA  
Vn  
Output noise voltage  
575  
µVrms  
ICL  
Output current limit  
VO = 0 V  
125  
60  
750  
750  
mA  
dB  
PSRR  
Power-supply ripple rejection  
f = 100 kHz, COUT = 10 µF  
Dropout voltage,  
VIN = VOUT(NOM) – 1 V  
VDO  
IOUT = 50 mA  
415  
mV  
(1) Minimum VIN = VOUT + VDO or the value shown for input voltage in this table, whichever is greater.  
3
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TPS71501-Q1  
TPS71525-Q1, TPS71530-Q1  
TPS71533-Q1, TPS71550-Q1  
www.ti.com  
SGLS272COCTOBER 2004REVISED APRIL 2007  
FUNCTIONAL BLOCK DIAGRAMS  
V(OUT)  
V(IN)  
Current  
Sense  
Leakage Null  
Control Circuit  
ILIM  
R1  
R2  
_
+
GND  
FB  
Vref = 1.205 V  
Bandgap  
Reference  
Figure 1. Functional Block Diagram—Adjustable Version  
V(OUT)  
V(IN)  
Current  
Sense  
Leakage Null  
Control Circuit  
ILIM  
R1  
_
+
GND  
R2  
Vref = 1.205 V  
Bandgap  
Reference  
Figure 2. Functional Block Diagram—Fixed Version  
Table 1. Terminal Functions  
TERMINAL  
NO.  
DESCRIPTION  
NAME  
FIXED  
ADJ.  
FB  
NC  
1
Adjustable version. This terminal is used to set the output voltage.  
1
2
3
4
5
No connection  
Ground  
GND  
NC  
2
3
4
5
No connection  
Input supply.  
IN  
OUT  
Output of the regulator, any output capacitor 0.47 µF can be used for stability.  
4
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TPS71501-Q1  
TPS71525-Q1, TPS71530-Q1  
TPS71533-Q1, TPS71550-Q1  
www.ti.com  
SGLS272COCTOBER 2004REVISED APRIL 2007  
TYPICAL CHARACTERISTICS  
OUTPUT VOLTAGE  
vs  
OUTPUT CURRENT  
OUTPUT VOLTAGE  
vs  
FREE-AIR TEMPERATURE  
QUIESCENT CURRENT  
vs  
FREE-AIR TEMPERATURE  
3.320  
3.315  
3.32  
3.31  
4.5  
V
V
= 4.3 V  
= 3.3 V  
IN  
OUT  
= 1 µF  
V
C
= 4.3 V  
IN  
= 1 µF  
I
= 1 mA  
OUT  
OUT  
4
I
OUT  
T
J
= 25°C  
3.30  
3.29  
3.28  
3.27  
3.26  
3.25  
3.310  
3.305  
3.300  
3.5  
3
I
= 50 mA  
OUT  
2.5  
2
V
C
= 4.3 V  
3.295  
3.290  
IN  
= 1 µF  
OUT  
0
10  
20  
30  
40  
50  
−4025 −10 5 20 35 50 65 80 95 110 125  
−40 −25 −10 5 20 35 50 65 80 95 110 125  
I
− Output Current − mA  
T
J
− Free−Air Temperature − °C  
O
T
J
− Free-Air Temperature − °C  
Figure 3.  
Figure 4.  
Figure 5.  
OUTPUT SPECTRAL  
NOISE DENSITY  
vs  
OUTPUT IMPEDANCE  
vs  
DROPOUT VOLTAGE  
vs  
OUTPUT CURRENT  
FREQUENCY  
FREQUENCY  
8
7
6
5
4
3
2
1
0
600  
18  
16  
14  
V
V
C
= 4.3 V  
V
V
C
= 4.3 V  
= 3.3 V  
= 1 µF  
OUT  
= 25°C  
IN  
IN  
V
= 3.2 V  
IN  
= 3.3 V  
OUT  
OUT  
I
= 1 mA  
C
OUT  
= 1 µF  
OUT  
500  
= 1 µF  
OUT  
T
J
T
J
= 125°C  
12  
10  
8
400  
300  
I
= 50 mA  
OUT  
T
J
= 25°C  
6
4
2
0
I
= 1 mA  
OUT  
200  
100  
0
T
J
= −40°C  
I
= 50 mA  
1k  
OUT  
100  
1 k  
10 k  
100 k  
10  
100  
10k 100k  
1 M 10 M  
0
10  
20  
30  
40  
50  
f − Frequency − Hz  
f − Frequency − Hz  
I
− Output Current − mA  
OUT  
Figure 6.  
Figure 7.  
Figure 8.  
TPS71501  
POWER-SUPPLY  
DROPOUT VOLTAGE  
vs  
DROPOUT VOLTAGE  
vs  
FREE-AIR TEMPERATURE  
RIPPLE REJECTION  
vs  
INPUT VOLTAGE  
FREQUENCY  
1
600  
500  
400  
300  
200  
100  
0
100  
I
= 50 mA  
OUT  
V
V
= 4.3 V  
IN  
V
= 3.2 V  
IN  
0.9  
0.8  
90  
80  
= 3.3 V  
OUT  
C
OUT  
= 10 µF  
T
= 125°C  
J
I
= 50 mA  
T = 25°C  
J
OUT  
0.7  
0.6  
70  
60  
50  
T
J
= 25°C  
I
= 1 mA  
OUT  
0.5  
0.4  
0.3  
0.2  
40  
30  
20  
T
J
= −40°C  
I
= 10 mA  
OUT  
I
= 50 mA  
OUT  
0.1  
0
10  
0
0
3
6
9
12  
15  
10  
100  
1k  
10k 100k  
1 M 10 M  
−40 −25 −10  
5
20 35 50 65 80  
110 125  
95  
V
− Input Voltage − V  
IN  
f − Frequency − Hz  
T
J
− Free-Air Temperature − °C  
Figure 9.  
Figure 10.  
Figure 11.  
5
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TPS71501-Q1  
TPS71525-Q1, TPS71530-Q1  
TPS71533-Q1, TPS71550-Q1  
www.ti.com  
SGLS272COCTOBER 2004REVISED APRIL 2007  
TYPICAL CHARACTERISTICS (continued)  
POWER UP / POWER DOWN  
LINE TRANSIENT RESPONSE  
LOAD TRANSIENT RESPONSE  
8
7
V
V
C
= 4.3 V  
IN  
V
R
C
= 3.3 V  
= 66  
= 10 µF  
V
I
C
= 3.3 V  
= 50 mA  
= 10 µF  
OUT  
OUT  
400  
200  
0
= 3.3 V  
100  
50  
OUT  
L
OUT  
= 10 µF  
OUT  
OUT  
OUT  
6
5
4
0
-200  
60  
40  
20  
0
−50  
3
V
IN  
5.3  
4.3  
2
1
0
V
6
OUT  
0
100 200 300 400 500 600 700 800 900 1000  
t − Time − µs  
0
50 100 150 200 250 300 350 400 450 500  
0
2
4
8
10 12 14 16 18 20  
t − Time − ms  
t − Time − ms  
Figure 12.  
Figure 13.  
Figure 14.  
6
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TPS71501-Q1  
TPS71525-Q1, TPS71530-Q1  
TPS71533-Q1, TPS71550-Q1  
www.ti.com  
SGLS272COCTOBER 2004REVISED APRIL 2007  
APPLICATION INFORMATION  
The TPS715xx family of LDO regulators has been optimized for ultra-low power applications such as the  
MSP430 microcontroller. Its ultralow supply current maximizes efficiency at light loads and its high input voltage  
range makes it suitable for supplies such as unconditioned solar panels.  
4
5
V
I
IN  
OUT  
V
O
C1  
3
NC  
0.1 µF  
1
NC/FB  
0.47 µF  
GND  
2
Figure 15. Typical Application Circuit (Fixed Voltage Version)  
External Capacitor Requirements  
Although not required, a 0.047-µF or larger input bypass capacitor, connected between IN and GND and located  
close to the device, is recommended to improve transient response and noise rejection of the power supply as a  
whole. A higher-value input capacitor may be necessary if large, fast-rise-time load transients are anticipated  
and the device is located several inches from the power source.  
The TPS715xx requires an output capacitor connected between OUT and GND to stabilize the internal control  
loop. Any capacitor (including ceramic and tantalum) 0.47 µF properly stabilizes this loop.  
Power Dissipation and Junction Temperature  
To ensure reliable operation, worst-case junction temperature should not exceed 125°C. This restriction limits  
the power dissipation the regulator can handle in any given application. To ensure the junction temperature is  
within acceptable limits, calculate the maximum allowable dissipation, PD(max), and the actual dissipation, PD,  
which must be less than or equal to PD(max)  
.
The maximum-power-dissipation limit is determined using the following equation:  
T max * T  
J
+
A
P
D(max)  
R
qJA  
(1)  
where:  
TJmax = Maximum allowable junction temperature  
θJA = Thermal resistance junction-to-ambient for the package (see the Dissipation Ratings table)  
R
TA = Ambient temperature  
The regulator dissipation is calculated using:  
+ ǒVI * V  
Ǔ
P
  I  
D
O
O
(2)  
Power dissipation resulting from quiescent current is negligible.  
7
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TPS71501-Q1  
TPS71525-Q1, TPS71530-Q1  
TPS71533-Q1, TPS71550-Q1  
www.ti.com  
SGLS272COCTOBER 2004REVISED APRIL 2007  
APPLICATION INFORMATION (continued)  
Regulator Protection  
The TPS715xx PMOS-pass transistor has a built-in back diode that conducts reverse current when the input  
voltage drops below the output voltage (e.g., during power down). Current is conducted from the output to the  
input and is not internally limited. If extended reverse voltage operation is anticipated, external limiting might be  
appropriate.  
The TPS715xx features internal current limiting. During normal operation, the TPS715xx limits output current to  
approximately 500 mA. When current limiting engages, the output voltage scales back linearly until the  
overcurrent condition ends. Take care not to exceed the power dissipation ratings of the package.  
Programming the TPS71501 Adjustable LDO Regulator  
The output voltage of the TPS71501 adjustable regulator is programmed using an external resistor divider as  
shown in Figure 16. The output voltage is calculated using:  
R1  
R2  
  ǒ1 ) Ǔ  
V
+ V  
O
ref  
(3)  
where:  
VREF = 1.205 V typ (the internal reference voltage)  
Resistors R1 and R2 should be chosen for approximately 1.5-µA divider current. Lower value resistors can be  
used for improved noise performance, but the solution consumes more power. Higher resistor values should be  
avoided as leakage current into/out of FB across R1/R2 creates an offset voltage that artificially  
increases/decreases the feedback voltage and thus erroneously decreases/increases VO. The recommended  
design procedure is to choose R2 = 1 Mto set the divider current at 1.5 µA and then calculate R1 using:  
V
O
R1 +  
* 1   R2  
ǒ Ǔ  
V
ref  
(4)  
TPS71501  
IN  
OUTPUT VOLTAGE  
PROGRAMMING GUIDE  
V
I
0.1 µF  
OUTPUT  
R1  
R2  
VOLTAGE  
OUT  
V
O
1 MΩ  
1 MΩ  
1 MΩ  
1.8 V  
0.499 MΩ  
1.33 MΩ  
3.16 MΩ  
R1  
R2  
0.47 µF  
2.8 V  
FB  
5 V  
GND  
Figure 16. TPS71501 Adjustable LDO Regulator Programming  
8
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PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2007  
PACKAGING INFORMATION  
Orderable Device  
TPS71501QDCKRQ1  
TPS71525QDCKRQ1  
TPS71530QDCKRQ1  
TPS71533QDCKRQ1  
TPS71550QDCKRQ1  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SC70  
DCK  
5
5
5
5
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SC70  
SC70  
SC70  
SC70  
DCK  
DCK  
DCK  
DCK  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
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to Customer on an annual basis.  
Addendum-Page 1  
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