TPS71828-30DRVT [TI]
Dual, 200mA Output, Low Noise, High PSRR Low-Dropout Linear Regulators in 2mm x 2mm SON Package; 双通道， 200mA输出，低噪声，高PSRR低压差线性稳压器，采用2mm x 2mm SON封装
| 型号： | TPS71828-30DRVT |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Dual, 200mA Output, Low Noise, High PSRR Low-Dropout Linear Regulators in 2mm x 2mm SON Package |
| 文件： | 总18页 (文件大小：326K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS718xx
TPS719xx
www.ti.com
SBVS088A–FEBRUARY 2007–REVISED MARCH 2007
Dual, 200mA Output, Low Noise, High PSRR
Low-Dropout Linear Regulators in 2mm x 2mm SON Package
FEATURES
DESCRIPTION
•
Dual, 200mA High-Performance LDOs
The TPS718xx and TPS719xx families of
low-dropout (LDO) regulators offer high
a
•
Low Total Quiescent Current: 90µA with Both
power-supply rejection ratio (PSRR), low noise, fast
start-up, and excellent line and load transient
responses while consuming a very low 90µA (typical)
at no load ground current with both LDOs enabled.
The TPS719xx also provides an active pulldown
circuit to quickly discharge output loads. The
TPS718xx and TPS719xx are stable with ceramic
capacitors and use an advanced BiCMOS fabrication
process to yield a typical dropout voltage of 230mV
at 200mA output loads. The TPS718xx and
TPS719xx also use a precision voltage reference
and feedback loop to achieve 3% overall accuracy
over all load, line, process, and temperature
variations. Both families of devices are fully specified
from TJ = –40°C to +125°C and are offered in a 2mm
× 2mm SON-6 package that is ideal for applications
such as mobile handsets and WLAN that require
good thermal dissipation while maintaining a very
small footprint.
LDOs Enabled
•
•
•
•
•
Low Noise: 70µVRMS/V
Active Output Pulldown (TPS719xx)
Independent Enables for Each LDO
PSRR: 65dB at 1kHz, 45dB at 1MHz
Available in Multiple Fixed-Output Voltage
Combinations from 0.9V to 3.6V Using
Innovative Factory EEPROM Programming
•
•
Fast Start-Up Time: 160µs
Over-Current, Over-Temperature and
Under-Voltage Protection
•
•
•
Low Dropout: 230mV at 200mA
Stable with 1µF Ceramic Output Capacitor
Available in 2mm × 2mm SON-6 Package
APPLICATIONS
•
•
•
•
Digital Cameras
Cellular Camera Phones
Wireless LAN, Bluetooth®
Handheld Products
2.7V - 6.5V
0.9V - 3.6V
1mF
TPS718xx, TPS719xx
DRV Package
VIN
VOUT
IN
OUT1
TPS718xx
TPS719xx
2mm x 2mm SON
(TOP VIEW)
1mF
On
OUT1
IN
1
2
3
6
5
4
EN1
GND
EN2
EN1
0.9V - 3.6V
1mF
Off
GND
VOUT
OUT2
OUT2
On
EN2
Off
GND
Typical Application Circuit
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Bluetooth is a registered trademark of Bluetooth SIG, Inc.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007, Texas Instruments Incorporated
TPS718xx
TPS719xx
www.ti.com
SBVS088A–FEBRUARY 2007–REVISED MARCH 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
ORDERING INFORMATION(1)
(2)(3)
PRODUCT
VOUT
TPS718xx-yywwwz
TPS719xx-yywwwz
XX is nominal output voltage for LDO1 (for example, 28 = 2.8V).
YY nominal output voltage for LDO2.
WWW is package designator.
Z is Tape & Reel quantity (R = 3000, T = 250).
Examples: TPS71918–285DRVR
XX = 18 = 1.8V, YYY = 285 = 2.85V
XXX = 185 = 1.85V, YY = 33 = 3.3V
DRV = 2mm x 2mm SON package
Z = R = 3000 piece reel
TPS719185-33DRVR
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) Both outputs are programmable from 0.9V to 3.6V in 50mV increments.
(3) Output voltages from 0.9V to 3.6V in 50mV increments are available through the use of innovative factory EEPROM programming;
minimum order quantities may apply. Contact factory for details and availability.
ABSOLUTE MAXIMUM RATINGS(1)
Over operating temperature range (unless otherwise noted). All voltages are with respect to GND.
PARAMETER
TPS718xx, TPS719xx
–0.3 to +7.0
UNIT
Input voltage range, VIN
V
V
V
Enable voltage range, VEN1 and VEN2
Output voltage range, VOUT
Peak output current
–0.3 to VIN + 0.3V
–0.3 to +7.0
Internally limited
Indefinite
Output short-circuit duration
Junction temperature range, TJ
Storage temperature range , TSTG
Total continuous power dissipation, PDISS
ESD rating, HBM
–55 to +150
–55 to +150
°C
°C
See Dissipation Ratings Table
2
kV
V
ESD rating, CDM
500
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
DISSIPATION RATINGS
DERATING FACTOR
BOARD
PACKAGE
RθJC
RθJA
ABOVE TA = +25°C
TA < +25°C
TA = +70°C
TA = +85°C
High-K(1)
DRV
20°C/W
95°C/W
10.53mW/°C
1053mW
579mW
421mW
(1) The JEDEC high-K (2s2p) board used to derive this data was a 3in × 3in, multilayer board with 1-ounce internal power and ground
planes and 2-ounce copper traces on top and bottom of the board.
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TPS719xx
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SBVS088A–FEBRUARY 2007–REVISED MARCH 2007
ELECTRICAL CHARACTERISTICS
Over operating temperature range (TJ = –40°C to +125°C), VIN = VOUT(TYP) + 0.5V or 2.7V, whichever is greater;
IOUT = 0.5mA, VEN1 = VEN2 = VIN, COUT = 1.0µF, unless otherwise noted. Typical values are at TJ = +25°C.
PARAMETER
Input voltage range(1)
TEST CONDITIONS
MIN
2.7
TYP
MAX
6.5
UNIT
V
VIN
VOUT1, VOUT2 Output voltage range
0.9
3.6
V
Nominal
TJ = +25°C
±2.5
mV
VOUT1, VOUT2 Output accuracy
Over VIN, IOUT
Temp
,
VOUT + 0.5V ≤ VIN ≤ 6.5V
0mA ≤ IOUT ≤ 200mA
–3.0
+3.0
%
VOUT(NOM) + 0.5V ≤ VIN ≤ 6.5V,
IOUT = 5mA
∆VOUT/ ∆VIN Line regulation
∆VOUT/ ∆IOUT Load regulation
130
75
µV/V
µV/mA
mV
0mA ≤ IOUT ≤ 200mA
Dropout voltage(2)
VDO
IOUT = 200mA
230
400
(VIN = VOUT(NOM) – 0.1V)
ICL
Output current limit (per output)
VOUT = 0.9 × VOUT(NOM)
IOUT1 = IOUT2 = 0.1mA
IOUT1 = IOUT2 = 200mA
240
340
90
575
160
mA
µA
µA
IGND
Ground pin current
250
V
EN1,2 ≤ 0.4V, 2.7V ≤ VIN < 4.5V,
0.3
1.8
3.0
µA
µA
TJ = –40°C to +85°C
ISHDN
Shutdown current (IGND)
VEN1,2 ≤ 0.4V, 4.5V ≤ VIN ≤ 6.5V,
TJ = –40°C to +85°C
f = 100Hz
63
63
72
58
44
dB
dB
dB
dB
dB
f = 1kHz
Power-supply rejection ratio
VIN = 3.8V, VOUT = 2.8V,
IOUT = 200mA
PSRR
f = 10kHz
f = 100kHz
f = 1MHz
Output noise voltage
BW = 100Hz to 100kHz
VN
70 × VOUT
160
µVRMS
µs
RL = 14Ω, VOUT = 2.8V,
COUT = 1.0µF
TSTR
TSHUT
Startup time(3)
(5)
Shutdown time(4)
(TPS719xx only)
,
RL = ∞, COUT = 1.0µF,
VOUT = 2.8V
180
µs
V
IN ≤ 5.5V
1.2
6.5
6.5
V
V
Enable high (enabled)
(EN1 and EN2)
VEN(HI)
5.5V < VIN ≤ 6.5V
1.25
Enable low (shutdown)
(EN1 and EN2)
VEN(LO)
IEN
0
0.4
V
Enable pin current, enabled
(EN1 and EN2)
EN1 = EN2 = 6.5V
0.04
1.0
µA
Under-voltage lockout
Hysteresis
VIN rising
2.38
2.45
150
2.52
V
UVLO
VIN falling
mV
°C
°C
°C
Shutdown, temperature increasing
Reset, temperature decreasing
+160
+140
TSD
TJ
Thermal shutdown temperature
Operating junction temperature
–40
+125
(1) Minimum VIN = VOUT + VDO or 2.7V, whichever is greater.
(2) VDO is not measured for devices with VOUT(NOM) < 2.8V because minimum VIN = 2.7V.
(3) Time from VEN = 1.25V to VOUT = 95% (VOUT(NOM)).
(4) Time from VEN = 0.4V to VOUT = 5% (VOUT(NOM)).
(5) See Shutdown section in the Applications Information for more details.
3
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TPS719xx
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SBVS088A–FEBRUARY 2007–REVISED MARCH 2007
DEVICE INFORMATION
TPS719 only
60W
Bandgap
UVLO
Current
Limit
Thermal
Shutdown
2.5mA
OUT1
OUT2
EN1
Enable and
Power
Control
Logic
EN2
Thermal
2.5mA
Shutdown
Current
IN
Limit
UVLO
Bandgap
60W
TPS719 only
GND
Figure 1. Functional Block Diagram
DRV PACKAGE
2mm × 2mm SON
(TOP VIEW)
OUT1
IN
1
2
3
6
5
4
EN1
GND
EN2
GND
OUT2
Table 1. PIN DESCRIPTIONS
TPS718xx, TPS719xx
NAME
OUT1
IN
NO.
DESCRIPTION
1
2
3
Output of Regulator 1. A small ceramic capacitor (typically ≥ 1µF) is needed from this pin to ground to assure stability.
Input supply to both regulators.
OUT2
Output of Regulator 2. A small ceramic capacitor (typically ≥ 1µF) is needed from this pin to ground to assure stability.
Enable pin for Regulator 2. Driving the Enable pin (EN2) high turns on Regulator 2. Driving this pin low puts Regulator 2
into shutdown mode, reducing operating current.
EN2
GND
EN1
4
5
6
Ground. Thermal pad should also be connected to ground.
Enable pin for Regulator 1. Driving the Enable pin (EN1) high turns on Regulator 1. Driving this pin low puts Regulator 1
into shutdown mode, reducing operating current.
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TPS719xx
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SBVS088A–FEBRUARY 2007–REVISED MARCH 2007
TYPICAL CHARACTERISTICS
Over operating temperature range (TJ = –40°C to +125°C), VIN = VOUT(TYP) + 0.5V or 2.7V, whichever is greater; IOUT = 0.5mA,
VEN1 = VEN2 = VIN, COUT = 1.0µF, unless otherwise noted. Typical values are at TJ = +25°C.
LINE REGULATION
LINE REGULATION
4
3
0
-1
-2
-3
-4
-5
TJ = +85°C
IOUT = 5mA
IOUT = 200mA
TJ = +125°C
2
TJ = +25°C
TJ = -40°C
1
TJ = +25°C
0
-1
-2
-3
-4
TJ = +85°C
TJ = -40°C
TJ = +125°C
2.5
3.5
4.5
5.5
6.5
2.5
3.5
4.5
5.5
6.5
VIN (V)
VIN (V)
Figure 2.
Figure 3.
LOAD REGULATION UNDER LIGHT LOADS
LOAD REGULATION
4
5
0
TJ = +85°C
TJ = +25°C
2
0
-5
-10
-15
-20
-25
-30
-35
-40
-2
-4
-6
-8
-10
TJ = -40°C
TJ = +125°C
TJ = +85°C
TJ = +25°C
TJ = -40°C
TJ = +125°C
0
1
2
3
4
5
0
50
100
150
200
IOUT (mA)
IOUT (mA)
Figure 4.
Figure 5.
OUTPUT VOLTAGE vs
TEMPERATURE
DROPOUT VOLTAGE vs
OUTPUT CURRENT
2.805
2.800
2.795
2.790
2.785
2.780
2.775
2.770
2.765
2.760
350
IOUT = 5mA
TJ = +125°C
TJ = +85°C
300
250
200
150
100
50
IOUT = 0.1mA
IOUT = 200mA
TJ = +25°C
TJ = -40°C
0
-40 -25 -10
5
20 35 50 65 80 95 110 125
0
50
100
150
200
TJ (°C)
IOUT (mA)
Figure 6.
Figure 7.
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TPS719xx
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SBVS088A–FEBRUARY 2007–REVISED MARCH 2007
TYPICAL CHARACTERISTICS (continued)
Over operating temperature range (TJ = –40°C to +125°C), VIN = VOUT(TYP) + 0.5V or 2.7V, whichever is greater; IOUT = 0.5mA,
VEN1 = VEN2 = VIN, COUT = 1.0µF, unless otherwise noted. Typical values are at TJ = +25°C.
GROUND PIN CURRENT vs
OUTPUT CURRENT
GROUND PIN CURRENT vs
INPUT VOLTAGE
200
160
120
80
60
50
40
30
20
10
0
TJ = +125°C
IOUT = 1mA
TJ = +25°C
TJ = +85°C
TJ = -40°C
40
0
0
50
100
150
200
2.5
3.5
4.5
5.5
6.5
IOUT (mA)
VIN (V)
Figure 8.
Figure 9.
GROUND PIN CURRENT vs
TEMPERATURE (BOTH LDOs ENABLED)
SHUTDOWN CURRENT vs
INPUT VOLTAGE
140
120
100
80
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
IOUT = 0mA
TJ = +125°C
TJ = -40°C
60
TJ = +85°C
40
TJ = +25°C
20
0
-40 -25 -10
5
20 35 50 65 80 95 110 125
2.5
3.5
4.5
5.5
6.5
TJ (°C)
VIN (V)
Figure 10.
Figure 11.
CURRENT LIMIT vs
INPUT VOLTAGE
POWER-SUPPLY RIPPLE REJECTION vs
FREQUENCY (VIN– VOUT = 0.5V)
90
450
100mA
80
70
60
50
40
30
20
10
0
425
400
375
350
325
300
275
250
5mA
200mA
TJ = +125°C
TJ = +85°C
TJ = +25°C
TJ = -40°C
10
100
1k
10k
100k
1M
10M
2.5
3.5
4.5
5.5
6.5
Frequency (Hz)
VIN (V)
Figure 12.
Figure 13.
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TPS719xx
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SBVS088A–FEBRUARY 2007–REVISED MARCH 2007
TYPICAL CHARACTERISTICS (continued)
Over operating temperature range (TJ = –40°C to +125°C), VIN = VOUT(TYP) + 0.5V or 2.7V, whichever is greater; IOUT = 0.5mA,
VEN1 = VEN2 = VIN, COUT = 1.0µF, unless otherwise noted. Typical values are at TJ = +25°C.
POWER-SUPPLY RIPPLE REJECTION vs
FREQUENCY (VIN– VOUT = 1V)
POWER-SUPPLY RIPPLE REJECTION vs
INPUT VOLTAGE
90
80
70
60
50
40
30
20
10
0
80
70
60
50
40
30
20
10
0
100mA
1kHz
5mA
10kHz
100kHz
1MHz
200mA
VOUT = 2.80V
IOUT = 5mA
10
100
1k
10k
100k
1M
10M
3.0
3.2
3.4
3.6
3.8
4.0
VIN (V)
Frequency (Hz)
Figure 14.
Figure 15.
POWER-SUPPLY RIPPLE REJECTION vs
INPUT VOLTAGE
OUTPUT SPECTRAL NOISE DENSITY vs
FREQUENCY
80
70
60
50
40
30
20
10
0
10
VOUT = 2.80V
10kHz
1kHz
1
100kHz
1MHz
0.1
VOUT = 2.80V
IOUT = 200mA
0.01
100
1k
10k
100k
3.0
3.2
3.4
3.6
3.8
4.0
VIN (V)
Frequency (Hz)
Figure 16.
Figure 17.
LINE TRANSIENT RESPONSE
LOAD TRANSIENT RESPONSE
IOUTmin = 3mA
dVIN
6.5V
dt
dIOUT
dt
= 1V/ms
= 200mA/ms
250mA/div
10mV/div
IOUT1
3.3V
1V/div
VIN
VOUT1
VOUT1
10mV/div
10mV/div
VOUT2
VOUT2
10mV/div
20ms/div
10ms/div
Figure 18.
Figure 19.
7
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TPS719xx
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TYPICAL CHARACTERISTICS (continued)
Over operating temperature range (TJ = –40°C to +125°C), VIN = VOUT(TYP) + 0.5V or 2.7V, whichever is greater; IOUT = 0.5mA,
VEN1 = VEN2 = VIN, COUT = 1.0µF, unless otherwise noted. Typical values are at TJ = +25°C.
TPS719 ENABLE RESPONSE
POWER-UP/POWER-DOWN
IOUT = 200mA
VIN
6.5V
0V
EN1, EN2
4V/div
1V/div
VOUT
VOUT1
VOUT2
1V/div
1V/div
40ms/div
400ms/div
Figure 20.
Figure 21.
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TPS719xx
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SBVS088A–FEBRUARY 2007–REVISED MARCH 2007
APPLICATION INFORMATION
The TPS718xx/TPS719xx belong to a family of new
generation LDO regulators that use innovative
circuitry to achieve ultra-wide bandwidth and high
loop gain, resulting in extremely high PSRR (up to
1MHz) at very low headroom (VIN – VOUT). These
features, combined with low noise, two independent
enables, low ground pin current and ultra-small
packaging, make this part ideal for portable
applications. This family of regulators offer
sub-bandgap output voltages, current limit and
thermal protection, and is fully specified from –40°C
to +125°C.
Board Layout Recommendations to Improve
PSRR and Noise Performance
To improve ac performance such as PSRR, output
noise, and transient response, it is recommended
that the board be designed with separate ground
planes for VIN and VOUT, with each ground plane
connected only at the GND pin of the device. In
addition, the ground connection for the output
capacitor should connect directly to the GND pin of
the device. High ESR capacitors may degrade
PSRR.
Figure 22 shows the basic circuit connections.
Internal Current Limit
2.7V - 6.5V
0.9V - 3.6V
1mF
The TPS718xx/TPS719xx internal current limits help
protect the regulator during fault conditions. During
current limit, the output sources a fixed amount of
current that is largely independent of output voltage.
For reliable operation, the device should not be
operated in a current limit state for extended periods
of time.
VIN
VOUT
IN
OUT1
TPS718xx
TPS719xx
1mF
On
EN1
0.9V - 3.6V
1mF
Off
VOUT
OUT2
On
EN2
The
PMOS
pass
element
in
the
Off
GND
TPS718xx/TPS719xx has a built-in body diode that
conducts current when the voltage at OUT exceeds
the voltage at IN. This current is not limited, so if
extended reverse voltage operation is anticipated,
external limiting to 5% of rated output current may be
appropriate.
Figure 22. Typical Application Circuit
Input and Output Capacitor Requirements
Shutdown
Although an input capacitor is not required for
stability, it is good analog design practice to connect
a 0.1µF to 1.0µF low equivalent series resistance
(ESR) capacitor across the input supply near the
regulator. This capacitor counteracts reactive input
sources and improves transient response, noise
The enable pin (EN) is active high and is compatible
with standard and low voltage, TTL-CMOS levels.
When shutdown capability is not required, EN can be
connected to IN. The TPS719 with internal active
output pulldown circuitry discharges the output with a
time constant (t) of:
rejection, and ripple rejection.
A
higher-value
capacitor may be necessary if large, fast rise-time
load transients are anticipated or if the device is
located close to the power source. If source
impedance is not sufficiently low, a 0.1µF input
capacitor may be necessary to ensure stability.
60 ´ RL
´ COUT
t = 3
60 + RL
with:
•
RL = output load resistance
COUT = Output capacitance
The TPS718xx/TPS719xx are designed to be stable
with standard ceramic capacitors of values 1.0µF or
larger at the output. X5R- and X7R-type capacitors
are best because they have minimal variation in
value and ESR over temperature. Maximum ESR
should be <1.0Ω.
•
Dropout Voltage
The TPS718xx/TPS719xx use
transistor to achieve low dropout. When (VIN – VOUT
a
PMOS pass
)
is less than the dropout voltage (VDO), the PMOS
pass device is in its linear region of operation and
the input-to-output resistance is the RDS(ON) of the
PMOS pass element. VDO approximately scales with
output current because the PMOS device behaves
like a resistor in dropout.
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As with any linear regulator, PSRR and transient
response are degraded as (VIN – VOUT) approaches
dropout. This effect is shown in Figure 13 and
Figure 14 in the Typical Characteristics section.
Any tendency to activate the thermal protection
circuit indicates excessive power dissipation or an
inadequate heatsink. For reliable operation, junction
temperature should be limited to +125°C maximum.
To estimate the margin of safety in a complete
design (including heatsink), increase the ambient
temperature until the thermal protection is triggered;
use worst-case loads and signal conditions. For good
reliability, thermal protection should trigger at least
+35°C above the maximum expected ambient
condition of your particular application. This
Transient Response
As with any regulator, increasing the size of the
output capacitor will reduce over/undershoot
magnitude but increase duration of the transient
response.
configuration produces
temperature of +125°C at the highest expected
a
worst-case junction
Under-Voltage Lock-Out (UVLO)
ambient temperature and worst-case load.
The TPS718xx/TPS719xx utilize an under-voltage
lock-out circuit to keep the output shut off until
internal circuitry is operating properly. The UVLO
circuit has a de-glitch feature so that it typically
ignores undershoot transients on the input if they are
less than 50µs duration. On the TPS719xx, the
active pulldown discharges VOUT when the device is
in UVLO off condition. However, the input voltage
needs to be greater than 0.8V for active pulldown to
work.
The
internal
protection
circuitry
of
the
TPS718xx/TPS719xx has been designed to protect
against overload conditions. It was not intended to
replace proper heatsinking. Continuously running the
TPS718xx/TPS719xx
into
thermal
shutdown
degrades device reliability.
Power Dissipation
The ability to remove heat from the die is different for
each package type, presenting different
Minimum Load
considerations in the printed circuit board (PCB)
layout. The PCB area around the device that is free
of other components moves the heat from the device
to the ambient air. Performance data for JEDEC low-
and high-K boards are given in the Dissipation
Ratings table. Using heavier copper increases the
effectiveness in removing heat from the device. The
addition of plated through-holes to heat-dissipating
layers also improves the heatsink effectiveness.
The TPS718xx/TPS719xx are stable with no output
load. Traditional PMOS LDO regulators suffer from
lower loop gain at very light output loads. The
TPS718xx/TPS719xx
employ
an
innovative,
low-current mode circuit under very light or no-load
conditions, resulting in improved output voltage
regulation performance down to zero output current.
THERMAL INFORMATION
Thermal Protection
Power dissipation depends on input voltage and load
conditions. Power dissipation (PD) is equal to the
product of the output current times the voltage drop
across the output pass element (VIN to VOUT), as
shown in Equation 1:
Thermal protection disables the output when the
junction temperature rises to approximately +160°C,
allowing the device to cool. When the junction
temperature cools to approximately +140°C the
output circuitry is again enabled. Depending on
power dissipation, thermal resistance, and ambient
temperature, the thermal protection circuit may cycle
on and off. This cycling limits the dissipation of the
regulator, protecting it from damage due to
overheating.
PD = (VIN - VOUT) x IOUT
(1)
Package Mounting
Solder pad footprint recommendations for the
TPS718xx/TPS719xxx are available from the Texas
Instruments web site at www.ti.com.
10
Submit Documentation Feedback
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
microcontroller.ti.com
www.ti.com/lpw
Low Power
Wireless
Telephony
www.ti.com/telephony
Video & Imaging
Wireless
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
18-May-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
SON
SON
SON
SON
SON
SON
SON
Drawing
TPS71812-33DRVR
TPS71812-33DRVT
TPS71828-30DRVR
TPS71828-30DRVT
TPS71913-28DRVR
TPS71913-28DRVT
TPS71926-15DRVR
PREVIEW
PREVIEW
PREVIEW
PREVIEW
PREVIEW
PREVIEW
ACTIVE
DRV
6
6
6
6
6
6
6
3000
250
TBD
TBD
TBD
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
DRV
DRV
3000
250
DRV
DRV
3000
250
DRV
DRV
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS71926-15DRVRG4
TPS71926-15DRVT
TPS71926-15DRVTG4
TPS71928-28DRVR
TPS71928-28DRVRG4
TPS71928-28DRVT
TPS71928-28DRVTG4
TPS71933-28DRVR
TPS71933-28DRVRG4
TPS71933-28DRVT
TPS71933-28DRVTG4
TPS71933-33DRVR
TPS71933-33DRVRG4
TPS71933-33DRVT
TPS71933-33DRVTG4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SON
SON
SON
SON
SON
SON
SON
SON
SON
SON
SON
SON
SON
SON
SON
DRV
DRV
DRV
DRV
DRV
DRV
DRV
DRV
DRV
DRV
DRV
DRV
DRV
DRV
DRV
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-May-2007
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
17-May-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-May-2007
Device
Package Pins
Site
NSE
NSE
NSE
NSE
NSE
NSE
NSE
NSE
Reel
Diameter Width
(mm)
Reel
A0 (mm)
2.2
B0 (mm)
2.2
K0 (mm)
1.2
P1
W
Pin1
(mm) (mm) Quadrant
(mm)
TPS71926-15DRVR
TPS71926-15DRVT
TPS71928-28DRVR
TPS71928-28DRVT
TPS71933-28DRVR
TPS71933-28DRVT
TPS71933-33DRVR
TPS71933-33DRVT
DRV
DRV
DRV
DRV
DRV
DRV
DRV
DRV
6
6
6
6
6
6
6
6
177
8
4
4
4
4
4
4
4
4
8
8
8
8
8
8
8
8
PKGORN
T2TR-MS
P
177
177
177
177
177
177
177
8
8
8
8
8
8
8
2.2
2.2
1.2
PKGORN
T2TR-MS
P
2.2
2.2
1.2
PKGORN
T2TR-MS
P
2.2
2.2
1.2
PKGORN
T2TR-MS
P
2.2
2.2
1.2
PKGORN
T2TR-MS
P
2.2
2.2
1.2
PKGORN
T2TR-MS
P
2.2
2.2
1.2
PKGORN
T2TR-MS
P
2.2
2.2
1.2
PKGORN
T2TR-MS
P
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
TPS71926-15DRVR
TPS71926-15DRVT
DRV
DRV
6
6
NSE
NSE
195.0
195.0
200.0
200.0
45.0
45.0
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
17-May-2007
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
TPS71928-28DRVR
TPS71928-28DRVT
TPS71933-28DRVR
TPS71933-28DRVT
TPS71933-33DRVR
TPS71933-33DRVT
DRV
DRV
DRV
DRV
DRV
DRV
6
6
6
6
6
6
NSE
NSE
NSE
NSE
NSE
NSE
195.0
195.0
195.0
195.0
195.0
195.0
200.0
200.0
200.0
200.0
200.0
200.0
45.0
45.0
45.0
45.0
45.0
45.0
Pack Materials-Page 3
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
RFID
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lpw
Telephony
Low Power
Wireless
Video & Imaging
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
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