TPS73130 [TI]

Cap-Free, NMOS, 150mA Low Dropout Regulator with Reverse Current Protection; 无电容, NMOS器,150mA低压降稳压器,具有反向电流保护
TPS73130
型号: TPS73130
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Cap-Free, NMOS, 150mA Low Dropout Regulator with Reverse Current Protection
无电容, NMOS器,150mA低压降稳压器,具有反向电流保护

稳压器
文件: 总16页 (文件大小:338K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TPS73101, TPS73115, TPS73118  
TPS73125, TPS73130, TPS73132  
TPS73133, TPS73150  
www.ti.com  
SBVS034ESEPTEMBER 2003REVISED SEPTEMBER 2004  
Cap-Free, NMOS, 150mA Low Dropout Regulator  
with Reverse Current Protection  
FEATURES  
DESCRIPTION  
Stable with No Output Capacitor or Any Value  
or Type of Capacitor  
The TPS731xx family of low-dropout (LDO) linear  
voltage regulators uses a new topology: an NMOS  
pass element in a voltage-follower configuration. This  
topology is stable using output capacitors with low  
ESR, and even allows operation without a capacitor.  
It also provides high reverse blockage (low reverse  
current) and ground pin current that is nearly constant  
over all values of output current.  
Input Voltage Range of 1.7V to 5.5V  
Ultralow Dropout Voltage: 30mV Typ  
Excellent Load Transient Response—with or  
without Optional Output Capacitor  
New NMOS Topology Provides Low Reverse  
Leakage Current  
The TPS731xx uses an advanced BiCMOS process  
to yield high precision while delivering very low  
dropout voltages and low ground pin current. Current  
consumption, when not enabled, is under 1µA and  
ideal for portable applications. The extremely low  
output noise (30µVRMS with 0.1µF CNR) is ideal for  
powering VCOs. These devices are protected by  
thermal shutdown and foldback current limit.  
Low Noise: 30µVRMS Typ (10kHz to 100kHz)  
0.5% Initial Accuracy  
1% Overall Accuracy over Line, Load, and  
Temperature  
Less Than 1µA Max IQ in Shutdown Mode  
Thermal Shutdown and Specified Min/Max  
Current Limit Protection  
DBV PACKAGE  
SOT23  
(TOP VIEW)  
Available in Multiple Output Voltage Versions  
– Fixed Outputs of 1.2V, 1.5V, 1.8V, 2.5V, 3.0V,  
3.3V, and 5.0V  
5
4
IN  
GND  
EN  
1
2
3
OUT  
– Adjustable Outputs From 1.20V to 5.5V  
– Custom Outputs Available  
NR/FB  
APPLICATIONS  
Portable/Battery-Powered Equipment  
Post-Regulation for Switching Supplies  
Noise-Sensitive Circuitry such as VCOs  
Point of Load Regulation for DSPs, FPGAs,  
ASICs, and Microprocessors  
Optional  
Optional  
VIN  
VOUT  
IN  
OUT  
TPS731xx  
EN  
GND  
NR  
Optional  
Typical Application Circuit for Fixed-Voltage Versions  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2003–2004, Texas Instruments Incorporated  
TPS73101, TPS73115, TPS73118  
TPS73125, TPS73130, TPS73132  
TPS73133, TPS73150  
www.ti.com  
SBVS034ESEPTEMBER 2003REVISED SEPTEMBER 2004  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated  
circuits be handled with appropriate precautions. Failure to observe proper handling and installation  
procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision  
integrated circuits may be more susceptible to damage because very small parametric changes could  
cause the device not to meet its published specifications.  
ORDERING INFORMATION  
SPECIFIED  
TEMPERATURE  
RANGE  
PACKAGE-LEAD  
(DESIGNATOR)(2)  
PACKAGE  
MARKING  
ORDERING  
NUMBER  
(1)  
PRODUCT  
VOUT  
TRANSPORT MEDIA,  
QUANTITY  
TPS73101DBVT  
TPS73101DBVR  
TPS73115DBVT  
TPS73115DBVR  
TPS73118DBVT  
TPS73118DBVR  
TPS73125DBVT  
TPS73125DBVR  
TPS73130DBVT  
TPS73130DBVR  
TPS73132DBVT  
TPS73132DBVR  
TPS73133DBVT  
TPS73133DBVR  
TPS73150DBVT  
TPS73150DBVR  
Tape and Reel, 250  
Tape and Reel, 3000  
Tape and Reel, 250  
Tape and Reel, 3000  
Tape and Reel, 250  
Tape and Reel, 3000  
Tape and Reel, 250  
Tape and Reel, 3000  
Tape and Reel, 250  
Tape and Reel, 3000  
Tape and Reel, 250  
Tape and Reel, 3000  
Tape and Reel, 250  
Tape and Reel, 3000  
Tape and Reel, 250  
Tape and Reel, 3000  
Adjustable  
or 1.2V(3)  
TPS73101  
TPS73115  
TPS73118  
TPS73125  
TPS73130  
TPS73132  
TPS73133  
TPS73150  
SOT23-5 (DBV)  
SOT23-5 (DBV)  
SOT23-5 (DBV)  
SOT23-5 (DBV)  
SOT23-5 (DBV)  
SOT23-5 (DBV)  
SOT23-5 (DBV)  
SOT23-5 (DBV)  
-40°C to +125°C  
-40°C to +125°C  
-40°C to +125°C  
-40°C to +125°C  
-40°C to +125°C  
-40°C to +125°C  
-40°C to +125°C  
-40°C to +125°C  
PWYQ  
T31  
1.5V  
1.8V  
2.5V  
3.0V  
3.2V  
3.3V  
5.0V  
T32  
PHWI  
T33  
T52  
T34  
T35  
(1) Custom output voltages from 1.3V to 4V in 100mV increments are available on a quick-turn basis for prototyping. Minimum order  
quantities apply; contact factory for details and availability.  
(2) For the most current specification and package information, refer to the Package Option Addendum located at the end of this datasheet.  
(3) For fixed 1.2V operation, tie FB to OUT.  
ABSOLUTE MAXIMUM RATINGS  
over operating junction temperature range unless otherwise noted(1)  
TPS731xx  
-0.3 to 6.0  
UNIT  
VIN range  
V
V
V
VEN range  
-0.3 to 6.0  
VOUT range  
-0.3 to 5.5  
Peak output current  
Output short-circuit duration  
Continuous total power dissipation  
Junction temperature range, TJ  
Storage temperature range  
ESD rating, HBM  
Internally limited  
Indefinite  
See Dissipation Ratings Table  
-55 to +150  
-65 to +150  
2
°C  
°C  
kV  
V
ESD rating, CDM  
500  
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under the Electrical Characteristics  
is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.  
2
TPS73101, TPS73115, TPS73118  
TPS73125, TPS73130, TPS73132  
TPS73133, TPS73150  
www.ti.com  
SBVS034ESEPTEMBER 2003REVISED SEPTEMBER 2004  
POWER DISSIPATION RATINGS(1)  
DERATING FACTOR  
ABOVE TA = 25°C  
T
A 25°C  
TA = 70°C  
TA = 85°C  
BOARD  
PACKAGE  
RΘJC  
RΘJA  
POWER RATING POWER RATING POWER RATING  
Low-K(2)  
DBV  
DBV  
64°C/W  
64°C/W  
255°C/W  
180°C/W  
3.9mW/°C  
5.6mW/°C  
390mW  
560mW  
215mW  
310mW  
155mW  
225mW  
(3)  
High-K  
(1) See Power Dissipation in the Applications section for more information related to thermal design.  
(2) The JEDEC Low-K (1s) board design used to derive this data was a 3 inch x 3 inch, two-layer board with 2-ounce copper traces on top  
of the board.  
(3) The JEDEC High-K (2s2p) board design used to derive this data was a 3 inch x 3 inch, multilayer board with 1-ounce internal power and  
ground planes and 2-ounce copper traces on the top and bottom of the board.  
ELECTRICAL CHARACTERISTICS  
Over operating temperature range (TJ = -40°C to +125°C), VIN = VOUT(nom) + 0.5V(1), IOUT = 10mA, VEN = 1.7V, and COUT  
0.1µF, unless otherwise noted. Typical values are at TJ = 25°C.  
=
PARAMETER  
TEST CONDITIONS  
MIN  
1.7  
TYP  
MAX UNIT  
VIN  
Input voltage range(1)  
Internal reference (TPS73101)  
Output voltage range (TPS73101)  
Nominal  
5.5  
1.210  
V
V
V
VFB  
TJ = 25°C  
TJ = 25°C  
1.198  
VFB  
1.20  
5.5 - VDO  
+0.5  
-0.5  
VOUT  
Accuracy(1)  
%
VOUT + 0.5V VIN 5.5V;  
10 mA IOUT150mA  
VIN, IOUT, and T  
-1.0  
±0.5  
+1.0  
VOUT%/VIN  
Line regulation(1)  
VOUT(nom) + 0.5V VIN 5.5V  
1mA IOUT 150mA  
0.01  
0.002  
%/V  
VOUT%/IOUT Load regulation  
%/mA  
10mA IOUT 150mA  
0.0005  
Dropout voltage(2)  
VDO  
IOUT = 150mA  
30  
100  
500  
mV  
(VIN = VOUT (nom) - 0.1V)  
ZO(DO)  
ICL  
Output impedance in dropout  
Output current limit  
1.7 V VIN VOUT + VDO  
VOUT = 0.9 × VOUT(nom)  
VOUT = 0V  
0.25  
360  
150  
mA  
mA  
µA  
ISC  
Short-circuit current  
200  
IREV  
Reverse leakage current(3) (-IIN  
)
VEN 0.5V, 0VVIN VOUT  
0.1  
10  
550  
750  
1
IOUT = 10mA (IQ)  
IOUT = 150mA  
400  
IGND  
Ground pin current  
µA  
550  
ISHDN  
IFB  
Shutdown current (IGND  
)
VEN 0.5V, VOUT VIN 5.5  
0.02  
µA  
µA  
FB pin current (TPS73101)  
0.1  
0.3  
f = 100Hz, IOUT = 150 mA  
f = 10kHz, IOUT = 150 mA  
COUT = 10µF, No CNR  
58  
Power-supply rejection ratio  
(ripple rejection)  
PSRR  
dB  
37  
27 × VOUT  
8.5 × VOUT  
Output noise voltage  
BW = 10Hz - 100kHz  
VN  
µVRMS  
µs  
COUT = 10µF, CNR = 0.01µF  
VOUT = 3V, RL = 30Ω  
COUT = 1 µF, CNR = 0.01 µF  
tSTR  
Startup time  
600  
VEN(HI)  
VEN(LO)  
IEN(HI)  
Enable high (enabled)  
1.7  
0
VIN  
0.5  
0.1  
V
V
Enable low (shutdown)  
Enable pin current (enabled)  
VEN = 5.5V  
0.02  
160  
140  
µA  
Shutdown  
Reset  
Temp increasing  
Temp decreasing  
TSD  
TJ  
Thermal shutdown temperature  
Operating junction temperature  
°C  
°C  
-40  
125  
(1) Minimum VIN = VOUT +VDO or 1.7V, whichever isgreater.  
(2) VDO is not measured for the TPS73115 (VO(nom) = 1.5V) since minimum VIN = 1.7V.  
(3) Fixed-voltage versions only; refer to the Applications section for more information.  
3
TPS73101, TPS73115, TPS73118  
TPS73125, TPS73130, TPS73132  
TPS73133, TPS73150  
www.ti.com  
SBVS034ESEPTEMBER 2003REVISED SEPTEMBER 2004  
FUNCTIONAL BLOCK DIAGRAMS  
IN  
4MHz  
Charge Pump  
EN  
Thermal  
Protection  
Ref  
Servo  
27k  
Bandgap  
Error  
Amp  
Current  
Limit  
OUT  
8k  
GND  
R1  
R2  
R1 + R2 = 80k  
NR  
Figure 1. Fixed Voltage Version  
IN  
Table 1. Standard 1%  
Resistor Values for  
Common Output Voltages  
V
O
R
1
R
2
4MHz  
Charge Pump  
1.2V  
1.5V  
1.8V  
2.5V  
2.8V  
3.0V  
3.3V  
5.0V  
Short  
Open  
23.2k  
28.0kΩ  
39.2kΩ  
44.2kΩ  
46.4kΩ  
52.3kΩ  
78.7kΩ  
95.3kΩ  
56.2kΩ  
36.5kΩ  
33.2kΩ  
30.9kΩ  
30.1kΩ  
24.9kΩ  
EN  
Thermal  
Protection  
Ref  
Servo  
27k  
Bandgap  
Error  
Amp  
OUT  
FB  
Current  
Limit  
NOTE: V  
= (R + R )/R × 1.204;  
1 2 2  
OUT  
R
R
19kfor best  
1
2
GND  
80k  
8k  
accuracy.  
R1  
R2  
Figure 2. Adjustable Voltage Version  
4
 
 
TPS73101, TPS73115, TPS73118  
TPS73125, TPS73130, TPS73132  
TPS73133, TPS73150  
www.ti.com  
SBVS034ESEPTEMBER 2003REVISED SEPTEMBER 2004  
PIN ASSIGNMENTS  
DBV PACKAGE  
SOT23  
(TOP VIEW)  
5
4
IN  
GND  
EN  
1
2
3
OUT  
NR/FB  
TERMINAL FUNCTIONS  
TERMINAL  
SOT23  
(DBV)  
DESCRIPTION  
NAME  
PIN NO.  
IN  
1
2
3
Unregulated input supply  
Ground  
GND  
EN  
Driving the enable pin (EN) high turns on the regulator. Driving this pin low puts the regulator into shutdown  
mode. Refer to the Shutdown section under Applications Information for more details. EN can be connected to  
IN if not used.  
NR  
4
4
5
Fixed voltage versions only—connecting an external capacitor to this pin bypasses noise generated by the  
internal bandgap, reducing output noise to very low levels.  
FB  
Adjustable voltage version only—this is the input to the control loop error amplifier, and is used to set the  
output voltage of the device.  
OUT  
Output of the regulator. There are no output capacitor requirements for stability.  
5
TPS73101, TPS73115, TPS73118  
TPS73125, TPS73130, TPS73132  
TPS73133, TPS73150  
www.ti.com  
SBVS034ESEPTEMBER 2003REVISED SEPTEMBER 2004  
TYPICAL CHARACTERISTICS  
For all voltage versions at TJ= 25°C, VIN = VOUT(nom) + 0.5V, IOUT = 10mA, VEN = 1.7V, and COUT = 0.1µF, unless otherwise  
noted.  
LOAD REGULATION  
LINE REGULATION  
0.5  
0.4  
0.3  
0.2  
0.1  
0
0.20  
0.15  
0.10  
0.05  
0
Referred to IOUT = 10mA  
Referred to VIN = VOUT + 0.5V at IOUT = 10mA  
_
+25  
C
_
+125 C  
0.1  
0.2  
0.3  
0.4  
0.5  
0.05  
0.10  
0.15  
0.20  
_
40  
C
0
15  
30 45  
60  
75  
90 105 120 135 150  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
VIN VOUT (V)  
IOUT (mA)  
Figure 3.  
Figure 4.  
DROPOUT VOLTAGE vs OUTPUT CURRENT  
DROPOUT VOLTAGE vs TEMPERATURE  
50  
40  
30  
20  
10  
0
50  
40  
30  
20  
10  
0
TPS73125DBV  
TPS73125DBV  
_
+125  
C
_
+25  
C
_
40 C  
25  
0
30  
60  
IOUT (mA)  
90  
120  
150  
50  
0
25  
50  
75  
100  
125  
_
Temperature ( C)  
Figure 5.  
Figure 6.  
OUTPUT VOLTAGE ACCURACY HISTOGRAM  
OUTPUT VOLTAGE DRIFT HISTOGRAM  
30  
18  
16  
14  
12  
10  
8
IOUT = 10mA  
All Voltage Versions  
IOUT = 10mA  
25  
20  
15  
10  
5
6
4
2
0
0
_
VOUT Error (%)  
Worst Case dVOUT/dT (ppm/ C)  
Figure 7.  
Figure 8.  
6
TPS73101, TPS73115, TPS73118  
TPS73125, TPS73130, TPS73132  
TPS73133, TPS73150  
www.ti.com  
SBVS034ESEPTEMBER 2003REVISED SEPTEMBER 2004  
TYPICAL CHARACTERISTICS (continued)  
For all voltage versions at TJ= 25°C, VIN = VOUT(nom) + 0.5V, IOUT = 10mA, VEN = 1.7V, and COUT = 0.1µF, unless otherwise  
noted.  
GROUND PIN CURRENT vs OUTPUT CURRENT  
GROUND PIN CURRENT vs TEMPERATURE  
700  
600  
500  
400  
300  
200  
100  
0
700  
600  
500  
400  
300  
200  
100  
0
IOUT = 150mA  
VIN = 5.5V  
VIN = 4V  
VIN = 2V  
VIN = 5.5V  
VIN = 4V  
VIN = 2V  
25  
0
30  
60  
90  
120  
150  
50  
0
25  
50  
75  
100  
125  
_
I
OUT (mA)  
Temperature ( C)  
Figure 9.  
Figure 10.  
CURRENT LIMIT vs VOUT  
(FOLDBACK)  
GROUND PIN CURRENT in SHUTDOWN  
vs TEMPERATURE  
400  
350  
300  
250  
200  
150  
100  
50  
1
VENABLE = 0.5V  
VIN = VO + 0.5V  
ICL  
ISC  
0.1  
TPS73133  
0.5  
0
0.01  
25  
0
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
50  
0
25  
50  
75  
100  
125  
VOUT (V)  
_
Temperature ( C)  
Figure 11.  
CURRENT LIMIT vs VIN  
Figure 12.  
CURRENT LIMIT vs TEMPERATURE  
500  
450  
400  
350  
300  
250  
200  
150  
500  
450  
400  
350  
300  
250  
200  
150  
25  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
50  
0
25  
50  
75  
100  
125  
VIN (V)  
_
Temperature ( C)  
Figure 13.  
Figure 14.  
7
 
TPS73101, TPS73115, TPS73118  
TPS73125, TPS73130, TPS73132  
TPS73133, TPS73150  
www.ti.com  
SBVS034ESEPTEMBER 2003REVISED SEPTEMBER 2004  
TYPICAL CHARACTERISTICS (continued)  
For all voltage versions at TJ= 25°C, VIN = VOUT(nom) + 0.5V, IOUT = 10mA, VEN = 1.7V, and COUT = 0.1µF, unless otherwise  
noted.  
PSRR (RIPPLE REJECTION) vs FREQUENCY  
PSRR (RIPPLE REJECTION) vs VIN - VOUT  
40  
35  
30  
25  
20  
15  
10  
5
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
IOUT = 100mA  
COUT = Any  
IOUT = 1mA  
µ
COUT = 1  
F
IOUT = 1mA  
COUT = 10 F  
µ
IO = 100mA  
µ
CO = 1 F  
IOUT = 1mA  
COUT = Any  
IOUT = 100mA  
COUT = 10  
Frequency = 100kHz  
µ
F
µ
COUT = 10  
F
IOUT = Any  
COUT = 0  
VOUT = 2.5V  
µ
F
0
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0  
10  
100  
1k  
10k  
100k  
1M  
10M  
VIN VOUT (V)  
Frequency (Hz)  
Figure 15.  
Figure 16.  
NOISE SPECTRAL DENSITY  
CNR = 0µF  
NOISE SPECTRAL DENSITY  
CNR = 0.01µF  
1
1
µ
COUT = 1  
F
µ
COUT = 1 F  
µ
COUT = 0  
F
0.1  
0.1  
µ
COUT = 10  
F
µ
COUT = 0  
F
µ
COUT = 10 F  
IOUT = 150mA  
IOUT = 150mA  
10 100  
0.01  
0.01  
10  
100  
1k  
10k  
100k  
1k  
10k  
100k  
Frequency (Hz)  
Frequency (Hz)  
Figure 17.  
Figure 18.  
RMS NOISE VOLTAGE vs COUT  
RMS NOISE VOLTAGE vs CNR  
60  
50  
40  
30  
20  
10  
0
140  
120  
100  
80  
VOUT = 5.0V  
VOUT = 5.0V  
VOUT = 3.3V  
VOUT = 1.5V  
VOUT = 3.3V  
VOUT = 1.5V  
60  
40  
20  
µ
CNR = 0.01 F  
µ
COUT = 0  
F
10Hz < Frequency < 100kHz  
10Hz < Frequency < 100kHz  
0
0.1  
1
10  
1p 10p 100p  
1n  
10n  
µ
COUT ( F)  
CNR (F)  
Figure 19.  
Figure 20.  
8
TPS73101, TPS73115, TPS73118  
TPS73125, TPS73130, TPS73132  
TPS73133, TPS73150  
www.ti.com  
SBVS034ESEPTEMBER 2003REVISED SEPTEMBER 2004  
TYPICAL CHARACTERISTICS (continued)  
For all voltage versions at TJ= 25°C, VIN = VOUT(nom) + 0.5V, IOUT = 10mA, VEN = 1.7V, and COUT = 0.1µF, unless otherwise  
noted.  
TPS73133  
LOAD TRANSIENT RESPONSE  
TPS73133  
LINE TRANSIENT RESPONSE  
µ
COUT = 0 F  
VIN = 3.8V  
IOUT = 150mA  
40mV/tick  
40mV/tick  
40mV/tick  
25mA/tick  
VOUT  
VOUT  
VOUT  
IOUT  
µ
COUT = 0 F  
50mV/div  
VOUT  
µ
COUT = 1 F  
µ
COUT = 100  
5.5V  
F
µ
COUT = 10 F  
50mV/div  
1V/div  
VOUT  
dVIN  
dt  
µ
= 0.5V/  
s
150mA  
4.5V  
VIN  
10mA  
µ
µ
10 s/div  
10 s/div  
Figure 21.  
Figure 22.  
TPS73133  
TURN-ON RESPONSE  
TPS73133  
TURN-OFF RESPONSE  
RL = 1k  
RL = 20  
COUT = 10  
VOUT  
µ
COUT = 0  
F
µ
F
RL = 20  
RL = 20  
1V/div  
1V/div  
1V/div  
1V/div  
µ
COUT = 1  
F
µ
COUT = 1  
F
RL = 1k  
RL = 20  
COUT = 0µF  
COUT = 10µF  
VOUT  
2V  
2V  
VEN  
0V  
0V  
VEN  
100µs/div  
100µs/div  
Figure 23.  
Figure 24.  
TPS73133  
POWER UP / POWER DOWN  
IENABLE vs TEMPERATURE  
10  
1
6
5
4
3
2
1
0
VIN  
VOUT  
0.1  
0.01  
1
2
25  
50  
0
25  
50  
75  
100  
125  
50ms/div  
_
Temperature ( C)  
Figure 25.  
Figure 26.  
9
TPS73101, TPS73115, TPS73118  
TPS73125, TPS73130, TPS73132  
TPS73133, TPS73150  
www.ti.com  
SBVS034ESEPTEMBER 2003REVISED SEPTEMBER 2004  
TYPICAL CHARACTERISTICS (continued)  
For all voltage versions at TJ= 25°C, VIN = VOUT(nom) + 0.5V, IOUT = 10mA, VEN = 1.7V, and COUT = 0.1µF, unless otherwise  
noted.  
TPS73101  
RMS NOISE VOLTAGE vs CADJ  
TPS73101  
IFBvs TEMPERATURE  
60  
55  
50  
45  
40  
35  
30  
25  
20  
160  
140  
120  
100  
80  
60  
VOUT = 2.5V  
40  
µ
COUT = 0 F  
R1 = 39.2k  
20  
10Hz < Frequency < 100kHz  
0
10p  
100p  
1n  
10n  
25  
50  
0
25  
50  
75  
100  
125  
CFB (F)  
_
Temperature ( C)  
Figure 27.  
Figure 28.  
TPS73101  
TPS73101  
LOAD TRANSIENT, ADJUSTABLE VERSION  
LINE TRANSIENT, ADJUSTABLE VERSION  
CFB = 10nF  
VOUT = 2.5V  
CFB = 10nF  
R1 = 39.2k  
µ
COUT = 0  
F
µ
COUT = 0 F  
VOUT  
VOUT  
50mV/div  
50mV/div  
100mV/div  
100mV/div  
µ
COUT = 10  
F
VOUT  
µ
COUT = 10  
F
VOUT  
4.5V  
150mA  
3.5V  
VIN  
10mA  
IOUT  
µ
µ
5 s/div  
25 s/div  
Figure 29.  
Figure 30.  
10  
TPS73101, TPS73115, TPS73118  
TPS73125, TPS73130, TPS73132  
TPS73133, TPS73150  
www.ti.com  
SBVS034ESEPTEMBER 2003REVISED SEPTEMBER 2004  
APPLICATION INFORMATION  
The TPS731xx belongs to a family of new generation  
LDO regulators that use an NMOS pass transistor to  
achieve ultra-low-dropout performance, reverse cur-  
rent blockage, and freedom from output capacitor  
constraints. These features, combined with low noise  
and an enable input, make the TPS731xx ideal for  
portable applications. This regulator family offers a  
wide selection of fixed output voltage versions and an  
adjustable output version. All versions have thermal  
and over-current protection, including foldback cur-  
rent limit.  
INPUT AND OUTPUT CAPACITOR  
REQUIREMENTS  
Although an input capacitor is not required for stab-  
ility, it is good analog design practice to connect a  
0.1µF to 1µF low ESR capacitor across the input  
supply near the regulator. This counteracts reactive  
input sources and improves transient response, noise  
rejection, and ripple rejection. A higher-value capaci-  
tor may be necessary if large, fast rise-time load  
transients are anticipated or the device is located  
several inches from the power source.  
Figure 31 shows the basic circuit connections for the  
fixed voltage models. Figure 32 gives the connections  
for the adjustable output version (TPS73101).  
The TPS731xx does not require an output capacitor  
for stability and has maximum phase margin with no  
capacitor. It is designed to be stable for all available  
types and values of capacitors. In applications where  
VIN - VOUT < 0.5V and multiple low ESR capacitors  
are in parallel, ringing may occur when the product of  
COUT and total ESR drops below 50nF. Total ESR  
includes all parasitic resistances, including capacitor  
ESR and board, socket, and solder joint resistance.  
In most applications, the sum of capacitor ESR and  
trace resistance will meet this requirement.  
Optional input capacitor.  
May improve source  
impedance, noise, or PSRR.  
Optional output capacitor.  
May improve load transient,  
noise, or PSRR.  
VIN  
VOUT  
IN  
OUT  
TPS731xx  
GND  
EN  
NR  
Optional bypass  
capacitor to reduce  
output noise.  
OUTPUT NOISE  
A precision band-gap reference is used to generate  
the internal reference voltage, VREF. This reference is  
the dominant noise source within the TPS731xx and  
it generates approximately 32µVRMS (10Hz to  
100kHz) at the reference output (NR). The regulator  
control loop gains up the reference noise with the  
same gain as the reference voltage, so that the noise  
voltage of the regulator is approximately given by:  
Figure 31. Typical Application Circuit for  
Fixed-Voltage Versions  
Optional input capacitor.  
May improve source  
impedance, noise, or PSRR.  
Optional output capacitor.  
May improve load transient,  
noise, or PSRR.  
VOUT  
VREF  
(R1 ) R2)  
VN + 32mVRMS  
 
+ 32mVRMS  
 
R2  
VIN  
VOUT  
IN  
OUT  
FB  
(1)  
TPS731xx  
R1  
R2  
CFB  
Since the value of VREF is 1.2V, this relationship  
reduces to:  
EN  
GND  
mVRMS  
V
ǒ Ǔ  
VN(mVRMS) + 27  
  VOUT(V)  
Optional capacitor  
reduces output noise.  
(2)  
(R1 + R2)  
×
1.204  
VOUT  
=
R
2
for the case of no CNR  
.
An internal 27kresistor in series with the noise  
reduction pin (NR) forms a low-pass filter for the  
voltage reference when an external noise reduction  
capacitor, CNR, is connected from NR to ground. For  
CNR = 10nF, the total noise in the 10Hz to 100kHz  
bandwidth is reduced by a factor of ~3.2, giving the  
approximate relationship:  
Figure 32. Typical Application Circuit for  
Adjustable-Voltage Versions  
R1 and R2 can be calculated for any output voltage  
using the formula shown in Figure 32. Sample re-  
sistor values for common output voltages are shown  
in Figure 2. For best accuracy, make the parallel  
combination of R1 and R2 approximately 19k.  
mVRMS  
V
ǒ Ǔ  
VN(mVRMS) + 8.5  
  VOUT(V)  
(3)  
11  
for CNR = 10nF.  
 
 
TPS73101, TPS73115, TPS73118  
TPS73125, TPS73130, TPS73132  
TPS73133, TPS73150  
www.ti.com  
SBVS034ESEPTEMBER 2003REVISED SEPTEMBER 2004  
This noise reduction effect is shown as RMS Noise  
Voltage vs CNR in the Typical Characteristics section.  
DROPOUT VOLTAGE  
The TPS731xx uses an NMOS pass transistor to  
achieve extremely low dropout. When (VIN - VOUT) is  
less than the dropout voltage (VDO), the NMOS pass  
device is in its linear region of operation and the  
input-to-output resistance is the RDS-ON of the NMOS  
pass element.  
The TPS73101 adjustable version does not have the  
noise-reduction pin available. However, connecting a  
feedback capacitor, CFB, from the output to the FB pin  
will reduce output noise and improve load transient  
performance.  
The TPS731xx uses an internal charge pump to  
develop an internal supply voltage sufficient to drive  
the gate of the NMOS pass element above VOUT. The  
charge pump generates ~250µV of switching noise at  
~4MHz; however, charge-pump noise contribution is  
negligible at the output of the regulator for most  
For large step changes in load current, the TPS731xx  
requires a larger voltage drop across it to avoid  
degraded transient response. The boundary of this  
transient dropout region is approximately twice the dc  
dropout. Values of VIN - VOUT above this line insure  
normal transient response.  
values of IOUT and COUT  
.
Operating in the transient dropout region can cause  
an increase in recovery time. The time required to  
recover from a load transient is a function of the  
magnitude of the change in load current rate, the rate  
of change in load current, and the available head-  
room (VIN to VOUT voltage drop). Under worst-case  
conditions [full-scale instantaneous load change with  
(VIN - VOUT) close to dc dropout levels], the TPS731xx  
can take a couple of hundred microseconds to return  
to the specified regulation accuracy.  
BOARD LAYOUT RECOMMENDATION TO  
IMPROVE PSRR AND NOISE PERFORMANCE  
To improve ac performance such as PSRR, output  
noise, and transient response, it is recommended that  
the PCB be designed with separate ground planes for  
VIN and VOUT, with each ground plane connected only  
at the GND pin of the device. In addition, the ground  
connection for the bypass capacitor should connect  
directly to the GND pin of the device.  
TRANSIENT RESPONSE  
INTERNAL CURRENT LIMIT  
The low open-loop output impedance provided by the  
NMOS pass element in a voltage follower configur-  
ation allows operation without an output capacitor for  
many applications. As with any regulator, the addition  
of a capacitor (nominal value 1µF) from the output pin  
to ground will reduce undershoot magnitude but  
increase duration. In the adjustable version, the  
addition of a capacitor, CFB, from the output to the  
adjust pin will also improve the transient response.  
The TPS731xx internal current limit helps protect the  
regulator during fault conditions. Foldback current  
helps to protect the regulator from damage during  
output short-circuit conditions by reducing current  
limit when VOUT drops below 0.5V. See Figure 11 in  
the Typical Characteristics section for a graph of IOUT  
vs VOUT  
.
SHUTDOWN  
The TPS731xx does not have active pull-down when  
the output is over-voltage. This allows applications  
that connect higher voltage sources, such as alter-  
nate power supplies, to the output. This also results  
in an output overshoot of several percent if the load  
current quickly drops to zero when a capacitor is  
connected to the output. The duration of overshoot  
can be reduced by adding a load resistor. The  
overshoot decays at a rate determined by output  
capacitor COUT and the internal/external load resist-  
ance. The rate of decay is given by:  
The Enable pin is active high and is compatible with  
standard TTL-CMOS levels. VEN below 0.5V (max)  
turns the regulator off and drops the ground pin  
current to approximately 10nA. When shutdown capa-  
bility is not required, the Enable pin can be connected  
to VIN. When a pull-up resistor is used, and operation  
down to 1.8V is required, use pull-up resistor values  
below 50 k.  
(Fixed voltage version)  
VOUT  
dVńdt +  
COUT   80kW  
(4)  
12  
TPS73101, TPS73115, TPS73118  
TPS73125, TPS73130, TPS73132  
TPS73133, TPS73150  
www.ti.com  
SBVS034ESEPTEMBER 2003REVISED SEPTEMBER 2004  
(Adjustable voltage version)  
reliability, thermal protection should trigger at least  
35°C above the maximum expected ambient con-  
dition of your application. This produces a worst-case  
junction temperature of 125°C at the highest ex-  
pected ambient temperature and worst-case load.  
VOUT  
dVńdt +  
(
)
COUT   80kW ø R1 ) R2  
(5)  
REVERSE CURRENT  
The internal protection circuitry of the TPS731xx has  
been designed to protect against overload conditions.  
It was not intended to replace proper heatsinking.  
Continuously running the TPS731xx into thermal  
shutdown will degrade device reliability.  
The NMOS pass element of the TPS731xx provides  
inherent protection against current flow from the  
output of the regulator to the input when the gate of  
the pass device is pulled low. To ensure that all  
charge is removed from the gate of the pass element,  
the enable pin must be driven low before the input  
voltage is removed. If this is not done, the pass  
element may be left on due to stored charge on the  
gate.  
POWER DISSIPATION  
The ability to remove heat from the die is different for  
each package type, presenting different consider-  
ations in the PCB layout. The PCB area around the  
device that is free of other components moves the  
heat from the device to the ambient air. Performance  
data for JEDEC low- and high-K boards are shown in  
the Power Dissipation Ratings table. Using heavier  
copper will increase the effectiveness in removing  
heat from the device. The addition of plated  
through-holes to heat-dissipating layers will also im-  
prove the heat-sink effectiveness.  
After the enable pin is driven low, no bias voltage is  
needed on any pin for reverse current blocking. Note  
that reverse current is specified as the current flowing  
out of the IN pin due to voltage applied on the OUT  
pin. There will be additional current flowing into the  
OUT pin due to the 80kinternal resistor divider to  
ground (see Figure 1 and Figure 2).  
For the TPS73101, reverse current may flow when  
VFB is more than 1.0V above VIN.  
Power dissipation depends on input voltage and load  
conditions. Power dissipation is equal to the product  
of the output current times the voltage drop across  
the output pass element (VIN to VOUT):  
THERMAL PROTECTION  
Thermal protection disables the output when the  
junction temperature rises to approximately 160°C,  
allowing the device to cool. When the junction tem-  
perature cools to approximately 140°C, the output  
circuitry is again enabled. Depending on power dissi-  
pation, thermal resistance, and ambient temperature,  
the thermal protection circuit may cycle on and off.  
This limits the dissipation of the regulator, protecting  
it from damage due to overheating.  
PD  
(VIN VOUT  
)
IOUT  
(6)  
Power dissipation can be minimized by using the  
lowest possible input voltage necessary to assure the  
required output voltage.  
Package Mounting  
Solder pad footprint recommendations for the  
TPS731xx are presented in Application Bulletin  
Solder Pad Recommendations for Surface-Mount De-  
vices (AB-132), available from the Texas Instruments  
web site at www.ti.com.  
Any tendency to activate the thermal protection circuit  
indicates excessive power dissipation or an inad-  
equate heatsink. For reliable operation, junction tem-  
perature should be limited to 125°C maximum. To  
estimate the margin of safety in a complete design  
(including heatsink), increase the ambient tempera-  
ture until the thermal protection is triggered; use  
worst-case loads and signal conditions. For good  
13  
PACKAGE OPTION ADDENDUM  
www.ti.com  
30-Sep-2004  
PACKAGING INFORMATION  
ORDERABLE DEVICE  
STATUS(1)  
PACKAGE TYPE  
PACKAGE DRAWING  
PINS  
PACKAGE QTY  
TPS73101DBVR  
TPS73101DBVT  
TPS73115DBVR  
TPS73115DBVT  
TPS73118DBVR  
TPS73118DBVT  
TPS73125DBVR  
TPS73125DBVT  
TPS73130DBVR  
TPS73130DBVT  
TPS73132DBVR  
TPS73132DBVT  
TPS73133DBVR  
TPS73133DBVT  
TPS73150DBVR  
TPS73150DBVT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOP  
SOP  
SOP  
SOP  
SOP  
SOP  
SOP  
SOP  
SOP  
SOP  
SOP  
SOP  
SOP  
SOP  
SOP  
SOP  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
3000  
250  
3000  
250  
3000  
250  
3000  
250  
3000  
250  
3000  
250  
3000  
250  
3000  
250  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to discontinue  
any product or service without notice. Customers should obtain the latest relevant information before placing  
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms  
and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
deems necessary to support this warranty. Except where mandated by government requirements, testing of all  
parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for  
their products and applications using TI components. To minimize the risks associated with customer products  
and applications, customers should provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,  
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process  
in which TI products or services are used. Information published by TI regarding third-party products or services  
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.  
Use of such information may require a license from a third party under the patents or other intellectual property  
of the third party, or a license from TI under the patents or other intellectual property of TI.  
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of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for  
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Resale of TI products or services with statements different from or beyond the parameters stated by TI for that  
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Copyright 2004, Texas Instruments Incorporated  

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