TPS79328-Q1_技术文档

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SGLS162D − APRIL 2003 − REVISED SEPTEMBER 2007

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FEATURES

DESCRIPTION

D

Qualified For Automotive Applications

ESD Protection Exceeds 2000 V Per

The TPS793xx family of low-dropout (LDO) low-power

linear voltage regulators features high power-supply

rejection ratio (PSRR), ultralow noise, fast start-up, and

excellent line and load transient responses in a

small-outline SOT23 package. Each device in the

family is stable, with a small 2.2-µF ceramic capacitor

on the output. The TPS793xx family uses an advanced,

proprietary BiCMOS fabrication process to yield

extremely low dropout voltages (e.g., 112 mV at

200 mA, TPS79330). Each device achieves fast

start-up times (approximately 50 µs with a 0.001-µF

bypass capacitor) while consuming very low quiescent

current (170 µA typical). Moreover, when the device is

placed in standby mode, the supply current is reduced

D

MIL-STD-883, Method 3015; Exceeds 200 V

Using Machine Model (C = 200 pF, R = 0)

200-mA Low-Dropout Regulator With

Enable (EN)

Available in 1.8-V, 2.5-V, 2.8-V, 2.85-V, 3-V,

3.3-V, 4.75-V, and Adjustable Options

High Power-Supply Rejection Ratio (PSRR)

(70 dB at 10 kHz)

Ultralow Noise (32 µV)

D

Fast Start-Up Time (50 µs)

Stable With a 2.2-µF Ceramic Capacitor

Excellent Load/Line Transient

Very Low Dropout Voltage

(112 mV at Full Load, TPS79330)

5-Pin SOT23 (DBV) Package

to less than

approximately 32 µV

1

µA. The TPS79328 exhibits

of output voltage noise with a

RMS

0.1-µF bypass capacitor. Applications with analog

components that are noise sensitive, such as portable

RF electronics, benefit from the high PSRR and

low-noise features as well as the fast response time.

D

APPLICATIONS

D

VCOs

RF

Bluetooth, Wireless LAN

DBV PACKAGE

(TOP VIEW)

IN

GND

EN

1

2

5

OUT

3

4

BYPASS

Fixed Option

DBV PACKAGE

(TOP VIEW)

IN

GND

EN

1

2

6

5

OUT

FB

3

4

BYPASS

Adjustable Option

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments

semiconductor products and disclaimers thereto appears at the end of this data sheet.

Bluetooth is a trademark of Bluetooth SIG, Inc.

ꢁꢒ ꢔ ꢝꢐ ꢞ ꢀꢗ ꢔꢖ ꢝ ꢓꢀꢓ ꢟꢠ ꢡꢢ ꢣ ꢜꢤ ꢥꢟꢢꢠ ꢟꢦ ꢧꢨ ꢣ ꢣ ꢩꢠꢥ ꢤꢦ ꢢꢡ ꢪꢨꢫ ꢬꢟꢧ ꢤꢥꢟ ꢢꢠ ꢭꢤ ꢥꢩꢮ ꢁꢣ ꢢꢭꢨ ꢧꢥꢦ

ꢧ ꢢꢠ ꢡꢢꢣ ꢜ ꢥꢢ ꢦ ꢪꢩ ꢧ ꢟ ꢡꢟ ꢧ ꢤ ꢥꢟ ꢢꢠꢦ ꢪ ꢩꢣ ꢥꢯꢩ ꢥꢩ ꢣ ꢜꢦ ꢢꢡ ꢀꢩꢰ ꢤꢦ ꢗꢠꢦ ꢥꢣ ꢨꢜ ꢩꢠꢥ ꢦ ꢦꢥ ꢤꢠꢭ ꢤꢣ ꢭ ꢱ ꢤꢣ ꢣ ꢤ ꢠꢥꢲꢮ

ꢁꢣ ꢢ ꢭꢨꢧ ꢥ ꢟꢢ ꢠ ꢪꢣ ꢢ ꢧ ꢩ ꢦ ꢦ ꢟꢠ ꢳ ꢭꢢ ꢩ ꢦ ꢠꢢꢥ ꢠꢩ ꢧꢩ ꢦꢦ ꢤꢣ ꢟꢬ ꢲ ꢟꢠꢧ ꢬꢨꢭ ꢩ ꢥꢩ ꢦꢥꢟ ꢠꢳ ꢢꢡ ꢤꢬ ꢬ ꢪꢤ ꢣ ꢤꢜ ꢩꢥꢩ ꢣ ꢦꢮ

Copyright  2003−2007, Texas Instruments Incorporated

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www.ti.com

SGLS162D − APRIL 2003 − REVISED SEPTEMBER 2007

TPS79328

RIPPLE REJECTION

vs

OUTPUT SPECTRAL NOISE DENSITY

vs

FREQUENCY

0.3

100

90

V

= 3.8 V

I

= 200 mA

O

C

o

= 2.2 µF

0.25

0.2

80

C

(byp)

= 0.1 µF

70

60

0.15

50

40

30

I

= 1 mA

O

I

= 10 mA

O

0.1

I

= 200 mA

O

20

10

0

V

C

= 3.8 V

= 10 µF

0.05

I

o

= 0.01 µF

(byp)

0

100

1 k

10 k

100 k

10

100

1 k

10 k 100 k 1 M 10 M

f − Frequency − Hz

†

ORDERING INFORMATION

‡

§

T

J

VOLTAGE

PACKAGE

PART NUMBER

SYMBOL

1.2 to 5.5 V

1.8 V

TPS79301DBVRQ1

TPS79318DBVRQ1

TPS79325DBVRQ1

PGV1

PHH1

PGW1

PGX1

PHI1

2.5 V

¶

2.8 V

TPS79328DBVRQ1

SOT23

(DBV)

−40°C to 125°C

2.85 V

3 V

TPS793285QDBVRQ1

¶

TPS79330DBVRQ1

PGY1

PHU1

PHJ1

3.3 V

TPS793333DBVRQ1

¶

TPS793475DBVRQ1

4.75 V

†

For the most current package and ordering information, see the Package Option Addendum

at the end of this document, or see the TI web site at www.ti.com.

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

The DBVR indicates tape and reel of 3000 parts.

‡

§

¶

Product preview

2

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SGLS162D − APRIL 2003 − REVISED SEPTEMBER 2007

†

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)

Input voltage range ꢀ ꢁ ꢂꢂ ꢃ ꢄꢅꢂ ꢆ ꢇ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V

Voltage range at EN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to (V + 0.3 V)

I

Voltage range on OUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V

Peak output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . internally limited

ESD rating, Human-Body Model (HBM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV

ESD rating, Charged-Device Model (CDM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 V

Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table

Operating virtual junction temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 150°C

J

Operating ambient temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 125°C

A

Storage temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C

stg

†

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functionaloperation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied.

Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(1)

All voltage values are with respect to network ground terminal.

DISSIPATION RATING TABLE

DERATING FACTOR

T

A

≤ 25°C

T

A

= 70°C

T = 85°C

A

BOARD

PACKAGE

R

θJC

R

θJA

ABOVE T = 25°C

POWER RATING POWER RATING POWER RATING

A

‡

§

Low K

DBV

63.75°C/W

256°C/W

3.906 mW/°C

5.609 mW/°C

391 mW

561 mW

215 mW

308 mW

156 mW

224 mW

High K

178.3°C/W

‡

§

The JEDEC low K (1s) board design used to derive this data was a 3-in × 3-in, two-layer board with 2-oz copper traces on top of the board.

The JEDEC high K (2s2p) board design used to derive this data was a 3-in × 3-in, multilayer board with 1-oz internal power and ground planes and

2-oz copper traces on top and bottom of the board.

3

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www.ti.com

SGLS162D − APRIL 2003 − REVISED SEPTEMBER 2007

electrical characteristics over recommended operating free-air temperature range EN = V

I,

T = −40°C to 125°C, V = V

+ 1 V, I = 1 mA, C = 10 µF, C

= 0.01 µF (unless otherwise noted)

J

I

O(typ)

O

o

(byp)

PARAMETER

TEST CONDITIONS

MIN

2.7

0

TYP

MAX

UNIT

V

I

Input voltage (see Note 1)

5.5

V

I

O

Continuous output current (see Note 2)

Operating junction temperature

200

125

mA

°C

T

J

−40

0 µA < I < 200 mA,

(see Note 4)

1.22 V ≤ V ≤ 5.2 V

O

TPS79301

TPS79318

TPS79325

TPS79328

0.98 V

1.02 V

O

T = 25°C

J

1.8

2.5

2.8

2.85

3

0 µA < I < 200 mA,

2.8 V < V < 5.5 V

1.764

2.45

1.836

2.55

O

I

T = 25°C

J

0 µA < I < 200 mA,

3.5 V < V < 5.5 V

I

O

T = 25°C

J

0 µA < I < 200 mA,

3.8 V < V < 5.5 V

2.744

2.793

2.94

2.856

2.907

3.06

O

I

Output voltage

V

T = 25°C

J

TPS793285

TPS79330

TPS79333

TPS793475

0 µA < I < 200 mA,

3.85 V < V < 5.5 V

I

O

T = 25°C

J

0 µA < I < 200 mA,

4 V < V < 5.5 V

I

O

T = 25°C

J

3.3

4.75

170

0 µA ≤ I < 200 mA,

4.3 V < V < 5.5 V

3.234

4.655

3.366

4.845

220

O

I

T = 25°C

J

0 µA < I < 200 mA,

5.25 V < V < 5.5 V

I

T = 25°C

J

O

0 µA < I < 200 mA,

O

Quiescent current (GND current)

Load regulation

µA

mV

%/V

0 µA < I < 200 mA

O

0 µA < I < 200 mA,

T = 25°C

5

O

J

V

O

V

O

+ 1 V < V ≤ 5.5 V,

T = 25°C

J

0.05

Output voltage line regulation (∆V /V )

(see Note 4)

I

O

+ 1 V < V ≤ 5.5 V

0.12

I

C

(byp)

C

(byp)

C

(byp)

C

(byp)

C

(byp)

C

(byp)

C

(byp)

= 0.001 µF

= 0.0047 µF

= 0.01 µF

= 0.1 µF

55

36

BW = 200 Hz to 100 kHz,

Output noise voltage (TPS79328)

µV

RMS

I

O

= 200 mA, T = 25°C

33

J

32

= 0.001 µF

= 0.0047 µF

= 0.01 µF

50

R

L

C

o

= 14 Ω,

= 1 µF, T = 25°C

70

Start-up time (TPS79328)

µs

J

100

Output current limit

V

= 0 V,

See Note 3

285

2

600

1

mA

µA

V

O

Standby current

EN = 0 V, 2.7 V < V < 5.5 V

0.07

I

High-level enable input voltage

Low-level enable input voltage

Input current (EN)

2.7 V < V < 5.5 V

I

2.7 V < V < 5.5 V

I

0.7

1

V

EN = 0

−1

µA

Input current (FB) (TPS79301)

FB = 1.8 V

1

(1)

(2)

(3)

(4)

To calculate the minimum input voltage for your maximum output current, use the following formula:

V (min) = V (max) + V (max load)

Continuousoutput current and operating junction temperature are limited by internal protection circuitry, but it is not recommended that the device

operate under conditions beyond those specified in this table for extended periods of time.

I

O

DO

The minimum IN operating voltage is 2.7 V or V

is 200 mA.

+ 1 V, whichever is greater. The maximum IN voltage is 5.5 V. The maximum output current

O(typ)

If V ≤ 2.5 V, then V

I(min)

= 2.7 V, V

I(max)

= 5.5 V:

O

_Oǒ_VI(max)_{* 2.7 V}Ǔ

1000

V

ǒ

Ǔ

Line Regulation (mV) + %ńV

100

If V ≥ 2.5 V, then V

I(min)

= V + 1 V, V = 5.5 V.

I(max)

O

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ꢀ ꢁꢂꢃ ꢄ ꢅ ꢅ ꢅ ꢈꢉ ꢇ ꢊ ꢋꢃ

SGLS162D − APRIL 2003 − REVISED SEPTEMBER 2007

electrical characteristics over recommended operating free-air temperature range EN = V ,

I

T = −40°C to 125°C, V = V

+ 1 V, I = 1 mA, C = 10 µF, C

= 0.01 µF (unless otherwise noted)

J

I

O(typ)

O

o

(byp)

(continued)

PARAMETER

TEST CONDITIONS

MIN

TYP

70

MAX

UNIT

f = 100 Hz, T = 25°C,

I

O

I

O

I

O

I

O

= 10 mA

J

f = 100 Hz, T = 25°C,

= 200 mA

68

J

Power-supply ripple rejection

TPS79328

dB

f = 10 kHz, T = 25°C,

70

J

f = 100 kHz, T = 25°C,

43

J

I

O

I

O

I

O

I

O

I

O

I

O

I

O

I

O

I

O

I

O

= 200 mA,

= 200 mA

= 200 mA,

= 200 mA

= 200 mA,

= 200 mA

= 200 mA,

= 200 mA

= 200 mA,

= 200 mA

T = 25°C

120

J

TPS79328

TPS793285

TPS79330

TPS79333

TPS793475

200

180

T = 25°C

J

120

112

102

77

T = 25°C

J

Dropout voltage (see Note 1)

mV

T = 25°C

J

T = 25°C

J

125

UVLO threshold

UVLO hysteresis

V

rising

2.25

2.65

V

CC

T = 25°C,

V

CC

rising

100

mV

J

(1)

IN voltage equals V

O(typ)

− 100 mV. The TPS79325 dropout voltage is limited by the input voltage range limitations.

5

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www.ti.com

SGLS162D − APRIL 2003 − REVISED SEPTEMBER 2007

FUNCTIONAL BLOCK DIAGRAM—ADJUSTABLE VERSION

V

OUT

V

IN

Current

Sense

UVLO

SHUTDOWN

ILIM

R1

_

GND

EN

+

FB

R2

UVLO

Thermal

External to

the Device

Shutdown

250 kΩ

V

ref

Bandgap

Reference

Bypass

V

IN

FUNCTIONAL BLOCK DIAGRAM—FIXED VERSION

V

IN

V

OUT

UVLO

Current

Sense

GND

EN

SHUTDOWN

ILIM

R1

R2

_

+

UVLO

Thermal

Shutdown

250 kΩ

V

ref

Bandgap

Reference

V

IN

Bypass

Terminal Functions

TERMINAL

NO.

ADJ FIXED I/O

I/O

DESCRIPTION

NAME

BYPASS

4

An external bypass capacitor connected to this terminal, in conjunction with an internal resistor, creates a

low-pass filter to further reduce regulator noise.

EN

3

I

EN is an input that enables or shuts down the device. When EN goes to a logic high, the device will be enabled.

When the device goes to a logic low, the device is in shutdown mode.

FB

5

2

1

6

N/A

2

Feedback input voltage for the adjustable device.

Regulator ground

GND

IN

1

I

Input to the device.

OUT

5

O

Regulated output of the device.

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SGLS162D − APRIL 2003 − REVISED SEPTEMBER 2007

TYPICAL CHARACTERISTICS

TPS79328

OUTPUT VOLTAGE

vs

TPS79328

GROUND CURRENT

vs

OUTPUT VOLTAGE

vs

OUTPUT CURRENT

JUNCTION TEMPERATURE

2.805

2.804

2.803

2.802

2.801

2.8

250

V

= 3.8 V

= 10 µF

= 25° C

I

V

= 3.8 V

I

C

o

C

o

= 10 µF

I

= 1 mA

O

2.8

T

J

200

150

I

= 1 mA

O

2.795

2.79

I

= 200 mA

O

2.799

100

50

0

I

= 200 mA

O

2.785

2.798

2.797

2.78

V

C

= 3.8 V

= 10 µF

I

o

2.796

2.795

2.775

−40 −25 −10 5 20 35 50 65 80 95 110 125

0

50

100

150

200

−40 −25−10 5 20 35 50 65 80 95 110 125

T

J

− Junction Temperature − °C

I

− Output Current − mA

T

J

− Junction Temperature − °C

O

Figure 1

Figure 2

Figure 3

TPS79328

OUTPUT SPECTRAL NOISE DENSITY

vs

OUTPUT SPECTRAL NOISE DENSITY

vs

FREQUENCY

0.3

1.6

V

I

C

= 3.8 V

V

C

= 3.8 V

V

C

= 3.8 V

I

O

I

1.4

1.2

1

= 200 mA

= 10 µF

= 2.2 µF

= 10 µF

o

0.25

0.2

0.25

0.2

0.15

0.1

0.05

0

= 0.1 µF

(byp)

o

(byp)

C

= 0.001 µF

(byp)

C

(byp)

= 0.0047 µF

I

= 1 mA

C

= 0.01 µF

O

0.8

0.6

0.4

0.2

0

(byp)

0.15

I

= 1 mA

O

C

= 0.1 µF

(byp)

0.1

I

= 200 mA

I

= 200 mA

O

0.05

0

100

1 k

10 k

100 k

100

1 k

10 k

100 k

100

1 k

10 k

100 k

f − Frequency − Hz

Figure 5

Figure 6

Figure 4

TPS79328

DROPOUT VOLTAGE

vs

ROOT MEAN SQUARED OUTPUT NOISE

vs

OUTPUT IMPEDANCE

vs

BYPASS CAPACITANCE

JUNCTION TEMPERATURE

FREQUENCY

180

160

140

120

100

80

60

2.5

V

= 2.7 V

V

= 3.8 V

= 10 µF

= 25° C

I

V

= 2.8 V

I

O

C

o

= 10 µF

C

I

= 200 mA

o

J

O

50

40

30

20

10

T

C

o

= 10 µF

2

I

= 200 mA

O

1.5

I

= 1 mA

O

1

60

I

= 100 mA

O

40

0.5

I

= 10 mA

O

20

BW = 100 Hz to 100

kHz

0

10

0

−40 −25−10 5 20 35 50 65 80 95 110 125

100

1 k

10 k 100 k 1 M

10 M

0.001

0.01

0.1

T

J

− Junction Temperature − °C

f − Frequency − Hz

C

(byp)

− Bypass Capacitance − µF

Figure 7

Figure 8

Figure 9

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SGLS162D − APRIL 2003 − REVISED SEPTEMBER 2007

TYPICAL CHARACTERISTICS

TPS79328

RIPPLE REJECTION

vs

TPS79328

RIPPLE REJECTION

vs

TPS79328

RIPPLE REJECTION

vs

FREQUENCY

100

90

80

70

60

50

40

100

V

C

= 3.8 V

V = 3.8 V

I

90

80

70

60

50

40

30

90

80

70

I

= 200 mA

= 2.2 µF

C

= 2.2 µF

O

o

C

= 0.01 µF

= 0.1 µF

(byp)

I

= 200 mA

O

I

= 200 mA

O

60

50

40

30

I

= 10 mA

O

I

= 10 mA

O

I

= 10 mA

O

30

20

10

0

V

C

= 3.8 V

= 10 µF

I

o

10

0

10

0

= 0.01 µF

(byp)

10

100

1 k

10 k 100 k 1 M 10 M

10

100

1 k

10 k 100 k 1 M 10 M

10

100

1 k

10 k 100 k 1 M 10 M

f − Frequency − Hz

Figure 10

Figure 11

Figure 12

TPS79328

OUTPUT VOLTAGE, ENABLE VOLTAGE

TPS79328

vs

LINE TRANSIENT RESPONSE

LOAD TRANSIENT RESPONSE

TIME (START-UP)

V

C

= 3.8 V

I

4.8

3.8

4

20

= 10 µF

o

2

0

V

= 3.8 V

I

0

= 2.8 V

O

−20

I

= 200 mA

= 2.2 µF

= 25°C

O

I

= 200 mA

C

O

o

−40

300

C

= 2.2 µF

T

J

o

C

(byp)

= 0.001 µF

= 0.01 µF

dv

dt

⁰µ^.4s^V

(byp)

+

di

dt

0.02A

µs

20

0

3

2

1

0

+

200

100

C

= 0.0047 µF

= 0.01 µF

(byp)

1mA

-20

C

(byp)

0

50 100 150200 250 300 350 400 450 500

0

10 20 30 40 50 60 70 80 90 100

0

20 40 60 80 100 120 140 160 180 200

t − Time − µs

Figure 15

Figure 13

Figure 14

TPS79301

DROPOUT VOLTAGE

vs

DC DROPOUT VOLTAGE

vs

OUTPUT CURRENT

POWER UP / POWER DOWN

INPUT VOLTAGE

200

250

200

150

100

V

= 3 V

O

R

L

= 15 Ω

T

= 125°C

= 25°C

J

150

100

T

J

= 125°C

T

J

T

J

= 25°C

V

I

V

O

50

0

T

= −40°C

T

J

= −55°C

J

50

0

I

= 200 mA

3

O

1s/div

2.5

3.5

4

4.5

5

0

20 40 60 80 100 120 140 160 180 200

V − Input Voltage − V

I

− Output Current − mA

O

Figure 16

Figure 17

Figure 18

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SGLS162D − APRIL 2003 − REVISED SEPTEMBER 2007

TYPICAL CHARACTERISTICS

TYPICAL REGIONS OF STABILITY

EQUIVALENT SERIES RESISTANCE (ESR) EQUIVALENT SERIES RESISTANCE (ESR)

TYPICAL REGIONS OF STABILITY

MINIMUM REQUIRED INPUT VOLTAGE

vs

OUTPUT VOLTAGE

OUTPUT CURRENT

4

100

10

100

10

I

= 200 mA

C

o

I

= 2.2 µF

= 5.5 V, V ≥ 1.5 V

O

C

V

= 10 µF

= 5.5 V

= −40°C to 125°C

o

I

T

J

= 125°C

V

T

O

= −40°C to 125°C

T

J

T

J

= 25°C

Region of Instability

T

J

= −40°C

3

1

2.8

0.1

Region of Stability

2

0.01

1.5 1.75

2

2.25 2.5 2.75

3

3.25 3.5

0

0.02

0.04

0.06

0.08

0.2

0

0.02

0.04

0.06

0.08

0.2

V

− Output Voltage − V

I

− Output Current − A

O

I

− Output Current − A

O

Figure 19

Figure 20

Figure 21

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SGLS162D − APRIL 2003 − REVISED SEPTEMBER 2007

APPLICATION INFORMATION

The TPS793xx family of low-dropout (LDO) regulators has been optimized for use in noise-sensitive battery-operated

equipment. The device features low dropout voltages, high PSRR, ultralow output noise, low quiescent current (170 µA

typical), and enable input to reduce supply currents to less than 1 µA when the regulator is turned off.

A typical application circuit is shown in Figure 22.

TPS793xx

1

V

I

IN

4

5

BYPASS

OUT

V

O

3

0.1 µF

0.01 µF

EN

+

2.2 µF

GND

2

Figure 22. Typical Application Circuit

EXTERNAL CAPACITOR REQUIREMENTS

A 0.1-µF or larger ceramic input bypass capacitor, connected between IN and GND and located close to the TPS793xx,

is required for stability and improves transient response, noise rejection, and ripple rejection. A higher-value electrolytic

input capacitor may be necessary if large, fast rise time, load transients are anticipated and the device is located several

inches from the power source.

Like all low dropout regulators, the TPS793xx requires an output capacitor connected between OUT and GND to stabilize

the internal control loop. The minimum recommended capacitance is 2.2 µF. Any 2.2-µF or larger ceramic capacitor is

suitable, provided the capacitance does not vary significantly over temperature.

The internal voltage reference is a key source of noise in an LDO regulator. The TPS793xx has a BYPASS pin that is

connected to the voltage reference through a 250-kΩ internal resistor. The 250-kΩ internal resistor, in conjunction with an

external bypass capacitor connected to the BYPASS pin, creates a low-pass filter to reduce the voltage reference noise

and, therefore, the noise at the regulator output. In order for the regulator to operate properly, the current flow out of the

BYPASS pin must be at a minimum, because any leakage current creates an IR drop across the internal resistor, thus

creating an output error. Therefore, the bypass capacitor must have minimal leakage current.

For example, the TPS79328 exhibits only 32 µV

of output voltage noise using a 0.1-µF ceramic bypass capacitor and

RMS

a 2.2-µF ceramic output capacitor. Note that the output starts up slower as the bypass capacitance increases due to the

RC time constant at BYPASS that is created by the internal 250-kΩ resistor and external capacitor.

BOARD LAYOUT RECOMMENDATION TO IMPROVE PSRR AND NOISE PERFORMANCE

To improve ac measurements such as PSRR, output noise, and transient response, it is recommended that the board be

designed with separate ground planes for V and V

, with each ground plane connected only at the GND pin of the

OUT

IN

device. In addition, the ground connection for the bypass capacitor should connect directly to the GND pin of the device.

10

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SGLS162D − APRIL 2003 − REVISED SEPTEMBER 2007

APPLICATION INFORMATION

POWER DISSIPATION AND JUNCTION TEMPERATURE

Specified regulator operation is assured to a junction temperature of 125°C; the maximum junction temperature should be

restricted to 125°C under normal operating conditions. This restriction limits the power dissipation the regulator can handle

in any given application. To ensure the junction temperature is within acceptable limits, calculate the maximum allowable

dissipation, P

, and the actual dissipation, P , which must be less than or equal to P

.

D(max)

D

D(max)

The maximum power dissipation limit is determined using the following equation:

T max * T

J

A

P

+

(1)

D(max)

R

θJA

Where:

T max = Maximum allowable junction temperature

J

R

= Thermal resistance, junction-to-ambient, for the package (see the dissipation rating table)

θJA

T = Ambient temperature.

A

The regulator dissipation is calculated using:

₊ǒ_VI_* V

Ǔ

P

I

(2)

D

O

Power dissipation resulting from quiescent current is negligible. Excessive power dissipation triggers the thermal protection

circuit.

PROGRAMMING THE TPS79301 ADJUSTABLE LDO REGULATOR

The output voltage of the TPS79301 adjustable regulator is programmed using an external resistor divider as shown in

Figure 23. The output voltage is calculated using:

R1

R2

ǒ_{1 )}Ǔ

(3)

V

+ V

O

ref

Where:

V

= 1.2246 V typ (internal reference voltage)

ref

Resistors R1 and R2 should be chosen for approximately 50-µA divider current. Lower-value resistors can be used for

improved noise performance, but the solution consumes more power. Higher resistor values should be avoided, as leakage

current into/out of FB across R1/R2 creates an offset voltage that artificially increases/decreases the feedback voltage and,

thus, erroneously decreases/increases V . The recommended design procedure is to choose R2 = 30.1 kΩ to set the

O

divider current at 50 µA, C1 = 15 pF for stability, and then calculate R1 using:

V

O

R1 +

* 1 R2

ǒ Ǔ

(4)

V

ref

In order to improve the stability of the adjustable version, it is suggested that a small compensation capacitor be placed

between OUT and FB. For voltages <1.8 V, the value of this capacitor should be 100 pF. For voltages >1.8 V, the

approximate value of this capacitor can be calculated as:

*7

(3 x 10 ) (R1 ) R2)

C1 +

(5)

(R1 R2)

The suggested value of this capacitor for several resistor ratios is shown in Figure 23. If this capacitor is not used (such

as in a unity-gain configuration) or if an output voltage <1.8 V is chosen, the minimum recommended output capacitor is

4.7 µF instead of 2.2 µF.

11

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SGLS162D − APRIL 2003 − REVISED SEPTEMBER 2007

APPLICATION INFORMATION

TPS79301

OUTPUT VOLTAGE

PROGRAMMING GUIDE

V

I

IN

1 µF

OUTPUT

VOLTAGE

R1

R2

C1

≥ 2 V

EN

OUT

V

O

C1

31.6 kΩ 30.1 kΩ 22 pF

51 kΩ 30.1 kΩ 15 pF

59 kΩ 30.1 kΩ 15 pF

2.5 V

3.3 V

3.6 V

R1

R2

≤ 0.7 V

1 µF

BYPASS FB

GND

0.01 µF

Figure 23. TPS79301 Adjustable LDO Regulator Programming

REGULATOR PROTECTION

The TPS793xx PMOS-pass transistor has a built-in back diode that conducts reverse current when the input voltage drops

below the output voltage (e.g., during power down). Current is conducted from the output to the input and is not internally

limited. If extended reverse voltage operation is anticipated, external limiting might be appropriate.

The TPS793xx features internal current limiting and thermal protection. During normal operation, the TPS793xx limits

output current to approximately 400 mA. When current limiting engages, the output voltage scales back linearly until the

overcurrent condition ends. While current limiting is designed to prevent gross device failure, care should be taken not to

exceed the power dissipation ratings of the package or the absolute maximum voltage ratings of the device. If the

temperature of the device exceeds approximately 165°C, thermal-protection circuitry shuts it down. Once the device has

cooled down to below approximately 140°C, regulator operation resumes.

12

PACKAGE OPTION ADDENDUM

www.ti.com

5-Nov-2007

PACKAGING INFORMATION

Orderable Device

Status ⁽¹⁾

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

Drawing

TPS79301DBVRQ1

TPS79318DBVRQ1

TPS79325DBVRQ1

TPS793285QDBVRQ1

ACTIVE

SOT-23

DBV

6

5

3000

TBD

CU

Level-1-220C-UNLIM

DBV

3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TPS79333DBVRQ1

TPS793475DBVRQ1

ACTIVE

SOT-23

DBV

5

3000

TBD

CU

Level-1-220C-UNLIM

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 1

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Products

Amplifiers

Data Converters

DSP

Applications

Audio

amplifier.ti.com

dataconverter.ti.com

dsp.ti.com

www.ti.com/audio

Automotive

Broadband

Digital Control

Military

www.ti.com/automotive

www.ti.com/broadband

www.ti.com/digitalcontrol

www.ti.com/military

Interface

interface.ti.com

logic.ti.com

Logic

Power Mgmt

Microcontrollers

RFID

power.ti.com

Optical Networking

Security

www.ti.com/opticalnetwork

www.ti.com/security

www.ti.com/telephony

www.ti.com/video

microcontroller.ti.com

www.ti-rfid.com

www.ti.com/lpw

Telephony

Low Power

Wireless

Video & Imaging

Wireless

www.ti.com/wireless

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型号：	TPS79328-Q1
厂家：	TEXAS INSTRUMENTS
描述：	ULTRALOW-NOISE HIGH-PSRR FAST-RF 200-mA LOW-DROPOUT LINEAR REGULATORS 超低噪声，高PSRR FAST -RF 200 mA低压降线性稳压器稳压器
文件：	总16页 (文件大小：308K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TPS79328-Q1 [TI]

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