TPS79333-EP [TI]
超低噪声、高 PSRR、快速射频、200mA 的低压降线性稳压器（增强型产品）;
| 型号： | TPS79333-EP |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 超低噪声、高 PSRR、快速射频、200mA 的低压降线性稳压器（增强型产品） 射频 电源电路 线性稳压器IC |
| 文件： | 总21页 (文件大小：786K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS79301-EP, TPS79318-EP, TPS79325-EP, TPS79328-EP
TPS793285-EP, TPS79330-EP, TPS79333-EP, TPS793475-EP
www.ti.com
SGLS163B–APRIL 2003–REVISED NOVEMBER 2006
ULTRALOW-NOISE, HIGH-PSRR, FAST RF 200-mA
LOW-DROPOUT LINEAR REGULATORS
FEATURES
DBV PACKAGE
(TOP VIEW)
•
Controlled Baseline
–
One Assembly/Test Site, One Fabrication
Site
IN
GND
EN
1
2
5
OUT
•
Enhanced Diminishing Manufacturing Sources
(DMS) Support
3
4
BYPASS
•
•
•
•
Enhanced Product-Change Notification
Fixed Option
(1)
Qualification Pedigree
DBV PACKAGE
(TOP VIEW)
200-mA Low-Dropout Regulator With EN
Available in 1.8 V, 2.5 V, 2.8 V, 2.85 V, 3 V,
3.3 V, 4.75 V, and Adjustable
IN
GND
EN
1
2
6
5
OUT
FB
•
•
•
•
•
•
High PSRR (70 dB at 10 kHz)
Ultralow Noise (32 µV)
3
4
BYPASS
Fast Start-Up Time (50 µs)
Adjustable Option
Stable With a 2.2-µF Ceramic Capacitor
Excellent Load/Line Transient
DESCRIPTION
Very Low Dropout Voltage
The TPS793xx family of low-dropout (LDO)
low-power linear voltage regulators features high
power-supply rejection ratio (PSRR), ultralow noise,
fast start-up, and excellent line and load transient
responses in a small-outline SOT23 package. Each
device in the family is stable, with a small 2.2-µF
ceramic capacitor on the output. The TPS793xx
family uses an advanced, proprietary, BiCMOS
fabrication process to yield extremely low dropout
voltages (e.g., 112 mV at 200 mA, TPS79330). Each
device achieves fast start-up times (approximately
50 µs with a 0.001-µF bypass capacitor), while
consuming very low quiescent current (170 µA
typical). Moreover, when the device is placed in
standby mode, the supply current is reduced to less
than 1 µA. The TPS79328 exhibits approximately
32 µVRMS of output voltage noise with a 0.1-µF
(112 mV at Full Load, TPS79330)
•
5-Pin SOT23 (DBV) Package
APPLICATIONS
•
•
•
VCOs
RF
Bluetooth™, Wireless LAN
(1) Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over specified
temperature range. This includes, but is not limited to, Highly
Accelerated Stress Test (HAST) or biased 85/85, temperature
cycle, autoclave or unbiased HAST, electromigration, bond
intermetallic life, and mold compound life. Such qualification
testing should not be viewed as justifying use of this
component beyond specified performance and environmental
limits.
bypass
capacitor.
Applications
with
analog
components that are noise sensitive, such as
portable RF electronics, benefit from the high PSRR
and low-noise features, as well as the fast response
time.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Bluetooth is a trademark of Bluetooth SIG, Inc.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003–2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TPS79301-EP, TPS79318-EP, TPS79325-EP, TPS79328-EP
TPS793285-EP, TPS79330-EP, TPS79333-EP, TPS793475-EP
www.ti.com
SGLS163B–APRIL 2003–REVISED NOVEMBER 2006
TPS79328
TPS79328
RIPPLE REJECTION
vs
OUTPUT SPECTRAL NOISE DENSITY
vs
FREQUENCY
FREQUENCY
0.3
100
90
V = 3.8 V
I
I
= 200 mA
O
C
C
= 2.2 µF
o
0.25
0.2
80
= 0.1 µF
(byp)
70
60
0.15
50
40
30
I
= 1 mA
O
I
= 10 mA
O
0.1
I
= 200 mA
O
20
10
0
V = 3.8 V
I
0.05
C
C
= 10 µF
o
= 0.01 µF
(byp)
0
100
1 k
10 k
100 k
10
100
1 k
10 k 100 k 1 M 10 M
f − Frequency − Hz
f − Frequency − Hz
AVAILABLE OPTIONS
TJ
VOLTAGE
1.2 to 5.5 V
1.8 V
PACKAGE
PART NUMBER
TPS79301DBVREP(1)
SYMBOL
PGVE
PHHE
PGWE
PGXE
PHIE
TPS79318DBVREP(1)
TPS79325DBVREP(1)
TPS79328DBVREP(1)(2)
TPS793285DBVREP(1)(2)
TPS79330DBVREP(1)(2)
TPS793333DBVREP(1)
TPS793475DBVREP(1)
TPS79301MDBVREP(1)
2.5 V
2.8 V
–40°C to 125°C
SOT23
(DBV)
2.85 V
3 V
PGYE
PHUE
PHJE
3.3 V
4.75 V
–55°C to 125°C
1.2 to 5.5 V
PMBM
(1) The DBVR indicates tape and reel of 3000 parts.
(2) Product preview
2
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TPS79301-EP, TPS79318-EP, TPS79325-EP, TPS79328-EP
TPS793285-EP, TPS79330-EP, TPS79333-EP, TPS793475-EP
www.ti.com
SGLS163B–APRIL 2003–REVISED NOVEMBER 2006
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX UNIT
Input voltage range(2)
Voltage range at EN
–0.3
6
V
V
VI +
0.3
–0.3
–0.3
Voltage on OUT
6
V
Peak output current
Internally limited
Human-Body Model (HBM)
Changed-Device Model (CDM)
2
kV
V
ESD rating
500
See Dissipation
Rating Table
Continuous total power dissipation
TJ
Operating virtual junction temperature range
–55
–65
125
150
°C
°C
Tstg Storage temperature range
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal
Dissipation Ratings
DERATING
FACTOR ABOVE
TA = 25°C
T
A ≤ 25°C
TA = 70°C
POWER
RATING
TA = 85°C
POWER
RATING
BOARD
PACKAGE
RθJC
RθJA
POWER
RATING
Low K(1)
High K(2)
DBV
DBV
63.75°C/W
63.75°C/W
256°C/W
3.906 mW/°C
5.609 mW/°C
391 mW
561 mW
215 mW
308 mW
156 mW
224 mW
178.3°C/W
(1) The JEDEC low K (1s) board design used to derive this data was a 3-in × 3-in, two layer board with 2-oz copper traces on top of the
board.
(2) The JEDEC high K (2s2p) board design used to derive this data was a 3-in × 3-in, multilayer board with 1-oz internal power and ground
planes and 2-oz copper traces on top and bottom of the board.
3
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TPS79301-EP, TPS79318-EP, TPS79325-EP, TPS79328-EP
TPS793285-EP, TPS79330-EP, TPS79333-EP, TPS793475-EP
www.ti.com
SGLS163B–APRIL 2003–REVISED NOVEMBER 2006
ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range, EN = VI, TJ = –55 to 125°C and TJ = –40 to 125°C, VI = VO(typ)
1 V, IO = 1 mA, Co = 10 µF, C(byp) = 0.01 µF (unless otherwise noted)
+
PARAMETER
Input voltage(1)
Continuous output current(2)
TEST CONDITIONS
MIN
2.7
0
TYP
MAX
5.5
UNIT
V
VI
IO
TJ
200
125
mA
°C
Operating junction temperature
–55
0 µA < IO < 200 mA,
1.22 V ≤ VO ≤ 5.2 V
TJ = –40 to 125°C,
0.98 Vo
0.97 Vo
1.02 Vo
(3)
(3)
TPS79301
0 µA < IO < 200 mA,
1.22 V ≤ VO ≤ 5.2 V
TJ = –55 to 125°C,
1.025
Vo
TJ = 25°C
1.8
2.5
2.8
2.85
3
TPS79318
TPS79325
TPS79328
0 µA < IO < 200 mA,
TJ = 25°C
2.8 V < VI < 5.5 V
3.5 V < VI < 5.5 V
3.8 V < VI < 5.5 V
3.85 V < VI < 5.5 V
4 V < VI < 5.5 V
1.764
2.45
1.836
2.55
0 µA < IO < 200 mA,
TJ = 25°C
Output voltage
V
0 µA < IO < 200 mA,
TJ = 25°C
2.744
2.793
2.94
2.856
2.907
3.06
TPS793285
TPS79330
TPS79333
TPS793475
0 µA < IO < 200 mA,
TJ = 25°C
0 µA < IO < 200 mA,
TJ = 25°C
3.3
4.75
170
0 µA < IO < 200 mA,
TJ = 25°C
4.3 V < VI < 5.5 V
3.234
4.655
3.366
4.845
220
0 µA < IO < 200 mA,
0 µA < IO < 200 mA,
0 µA < IO < 200 mA
0 µA < IO < 200 mA,
5.25 V < VI < 5.5 V
TJ = 25°C
Quiescent current (GND current)
Load regulation
µA
mV
%/V
TJ = 25°C
TJ = 25°C
5
VO + 1 V < VI ≤ 5.5 V,
VO + 1 V < VI ≤ 5.5 V
0.05
Output voltage line regulation (∆VO/VO)(4)
0.12
C(byp) = 0.001 µF
C(byp) = 0.0047 µF
C(byp) = 0.01 µF
C(byp) = 0.1 µF
55
36
BW = 200 Hz to 100 kHz,
IO = 200 mA, TJ = 25°C
Output noise voltage (TPS79328)
Time, start-up (TPS79328)
µVRMS
33
32
C(byp) = 0.001 µF
C(byp) = 0.0047 µF
C(byp) = 0.01 µF
50
RL = 14 Ω,
Co = 1 µF, TJ = 25°C
70
µs
100
Output current limit
VO = 0 V(3)
285
2
600
1
mA
µA
V
Standby current
EN = 0 V,
2.7 V < VI < 5.5 V
0.07
High-level enable input voltage
Low-level enable input voltage
Input current (EN)
2.7 V < VI < 5.5 V
2.7 V < VI < 5.5 V
EN = 0
0.7
1
V
–1
µA
(1) To calculate the minimum input voltage for your maximum output current, use the following formula:
VI(min) = VO(max) + VDO (max load)
(2) Continuous output current and operating junction temperature are limited by internal protection circuitry, but it is not recommended that
the device operate under conditions beyond those specified in this table for extended periods of time.
(3) The minimum IN operating voltage is 2.7 V or VO(typ) + 1 V, whichever is greater. The maximum IN voltage is 5.5 V. The maximum
output current is 200 mA.
(4) If VO ≤ 2.5 V, then VImin = 2.7 VO,ǒVVImImaxax=*5.52.V7:VǓ
V
ǒ
Ǔ
Line Reg. (mV) + %ńV
1000
100
If VO ≥ 2.5 V, then VImin = VO + 1 V, VImax = 5.5 V.
4
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TPS79301-EP, TPS79318-EP, TPS79325-EP, TPS79328-EP
TPS793285-EP, TPS79330-EP, TPS79333-EP, TPS793475-EP
www.ti.com
SGLS163B–APRIL 2003–REVISED NOVEMBER 2006
ELECTRICAL CHARACTERISTICS (continued)
over recommended operating free-air temperature range, EN = VI, TJ = –55 to 125°C and TJ = –40 to 125°C, VI = VO(typ)
1 V, IO = 1 mA, Co = 10 µF, C(byp) = 0.01 µF (unless otherwise noted)
+
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Input current (FB) (TPS79301)
FB = 1.8 V
1
µA
f = 100 Hz, TJ = 25°C,
f = 100 Hz, TJ = 25°C,
f = 10 Hz, TJ = 25°C,
f = 100 Hz, TJ = 25°C,
IO = 200 mA,
IO = 10 mA
IO = 200 mA
IO = 200 mA
IO = 200 mA
TJ = 25°C
70
68
Power-supply ripple
rejection
TPS79328
dB
70
43
120
TPS79328
TPS793285
TPS79330
TPS79333
TPS793475
IO = 200 mA
200
200
200
180
IO = 200 mA,
TJ= 25°C
TJ = 25°C
TJ = 25°C
TJ = 25°C
120
112
102
77
IO = 200 mA
IO = 200 mA,
Dropout voltage(5)
mV
IO = 200 mA
IO = 200 mA,
IO = 200 mA
IO = 200 mA,
IO = 200 mA
125
UVLO threshold
UVLO hysteresis
VCC rising
2.25
2.65
V
TJ = 25°C
VCC rising
100
mV
(5) IN voltage equals VO(typ)– 100 mV; The TPS79325 dropout voltage is limited by the input voltage range limitations.
5
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TPS79301-EP, TPS79318-EP, TPS79325-EP, TPS79328-EP
TPS793285-EP, TPS79330-EP, TPS79333-EP, TPS793475-EP
www.ti.com
SGLS163B–APRIL 2003–REVISED NOVEMBER 2006
DEVICE INFORMATION
FUNCTIONAL BLOCK DIAGRAM – ADJUSTABLE VERSION
V
OUT
V
IN
Current
Sense
UVLO
SHUTDOWN
ILIM
R1
_
GND
EN
+
FB
R2
UVLO
Thermal
External to
the Device
Shutdown
250 kΩ
V
ref
Bandgap
Reference
Bypass
V
IN
FUNCTIONAL BLOCK DIAGRAM – FIXED VERSION
V
IN
V
OUT
UVLO
Current
Sense
GND
EN
SHUTDOWN
ILIM
R1
R2
_
+
UVLO
Thermal
Shutdown
250 kΩ
V
ref
Bandgap
Reference
V
IN
Bypass
TERMINAL FUNCTIONS
TERMINAL
I/O
DESCRIPTION
NAME
ADJ
FIXED
An external bypass capacitor, connected to this terminal, in conjunction with an internal
resistor, creates a low-pass filter to further reduce regulator noise.
BYPASS
4
4
Enable input that enables or shuts down the device. When EN goes to a logic high, the
device is enabled. When the device goes to a logic low, the device is in shutdown mode.
EN
3
3
I
I
FB
5
2
1
6
N/A
2
Feedback input voltage for the adjustable device
Regulator ground
GND
IN
1
I
Input to the device
OUT
5
O
Regulated output of the device
6
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TPS79301-EP, TPS79318-EP, TPS79325-EP, TPS79328-EP
TPS793285-EP, TPS79330-EP, TPS79333-EP, TPS793475-EP
www.ti.com
SGLS163B–APRIL 2003–REVISED NOVEMBER 2006
TYPICAL CHARACTERISTICS
TPS79328
OUTPUT VOLTAGE
vs
TPS79328
OUTPUT VOLTAGE
vs
TPS79328
GROUND CURRENT
vs
OUTPUT CURRENT
JUNCTION TEMPERATURE
JUNCTION TEMPERATURE
2.805
2.8
2.805
2.804
2.803
2.802
2.801
2.8
250
200
V = 3.8 V
I
V = 3.8 V
I
C
T
= 10 µF
= 25° C
o
C
o
= 10 µF
I
= 1 mA
O
J
I
= 1 mA
O
2.795
2.79
I
= 200 mA
O
150
2.799
100
50
0
I
= 200 mA
O
2.785
2.798
2.797
2.78
V = 3.8 V
= 10 µF
I
2.796
C
o
2.795
0
2.775
−40 −25 −10 5 20 35 50 65 80 95 110 125
50
100
150
200
−40 −25−10 5 20 35 50 65 80 95 110 125
T
J
− Junction Temperature − °C
I
− Output Current − mA
T
J
− Junction Temperature − °C
O
Figure 1.
Figure 2.
Figure 3.
TPS79328
TPS79328
TPS79328
OUTPUT SPECTRAL NOISE DENSITY
OUTPUT SPECTRAL NOISE DENSITY
vs
OUTPUT SPECTRAL NOISE DENSITY
vs
vs
FREQUENCY
FREQUENCY
FREQUENCY
0.3
1.6
0.3
V = 3.8 V
I
V = 3.8 V
V = 3.8 V
I
I
1.4
1.2
1
I
= 200 mA
O
C
C
= 2.2 µF
C = 10 µF
o
o
0.25
0.2
0.25
0.2
0.15
0.1
0.05
0
C = 10 µF
o
= 0.1 µF
C = 0.1 µF
(byp)
(byp)
C
= 0.001 µF
(byp)
C
= 0.0047 µF
= 0.01 µF
(byp)
C
I
= 1 mA
(byp)
0.8
0.6
0.4
0.2
0
O
0.15
I
= 1 mA
O
C
= 0.1 µF
(byp)
0.1
I
= 200 mA
O
I = 200 mA
O
0.05
0
100
1 k
10 k
100 k
100
1 k
10 k
100 k
100
1 k
10 k
100 k
f − Frequency − Hz
f − Frequency − Hz
f − Frequency − Hz
Figure 4.
Figure 5.
Figure 6.
TPS79328
DROPOUT VOLTAGE
vs
ROOT MEAN SQUARED OUTPUT NOISE
vs
OUTPUT IMPEDANCE
vs
BYPASS CAPACITANCE
FREQUENCY
60
2.5
JUNCTION TEMPERATURE
V = 3.8 V
= 10 µF
= 25° C
I
V
I
C
= 2.8 V
= 200 mA
= 10 µF
180
160
140
120
100
80
O
C
o
V = 2.7 V
I
= 10 µF
O
50
40
30
20
10
T
J
C
o
o
2
1.5
I
= 200 mA
O
I
= 1 mA
O
1
I
= 100 mA
O
60
0.5
40
BW = 100 Hz to 100
kHz
I
= 10 mA
O
20
0
0
10
0.001
0.01
0.1
100
1 k
10 k 100 k 1 M
10 M
0
C
(byp)
− Bypass Capacitance − µF
−40 −25−10 5 20 35 50 65 80 95 110 125
f − Frequency − Hz
T
J
− Junction Temperature − °C
Figure 7.
Figure 8.
Figure 9.
7
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TPS79301-EP, TPS79318-EP, TPS79325-EP, TPS79328-EP
TPS793285-EP, TPS79330-EP, TPS79333-EP, TPS793475-EP
www.ti.com
SGLS163B–APRIL 2003–REVISED NOVEMBER 2006
TYPICAL CHARACTERISTICS (continued)
TPS79328
RIPPLE REJECTION
vs
TPS79328
RIPPLE REJECTION
vs
TPS79328
RIPPLE REJECTION
vs
FREQUENCY
FREQUENCY
FREQUENCY
100
90
80
70
60
50
40
30
100
90
80
70
60
50
40
100
90
V = 3.8 V
V = 3.8 V
I
I
I
= 200 mA
C
o
= 2.2 µF
C = 2.2 µF
o
O
C
(byp)
= 0.01 µF
C
(byp)
= 0.1 µF
I
= 200 mA
O
80
I
= 200 mA
O
70
60
50
40
30
I
= 10 mA
O
I
= 10 mA
O
I
= 10 mA
O
30
20
20
20
10
0
V = 3.8 V
= 10 µF
I
C
C
o
10
0
10
0
= 0.01 µF
(byp)
100
10
1 k
10 k 100 k 1 M 10 M
10
100
1 k
10 k 100 k 1 M 10 M
10
100
1 k
10 k 100 k 1 M 10 M
f − Frequency − Hz
Figure 11.
TPS79328
f − Frequency − Hz
Figure 12.
TPS79328
f − Frequency − Hz
Figure 10.
TPS79328
OUTPUT VOLTAGE, ENABLE VOLTAGE
LINE TRANSIENT RESPONSE
LOAD TRANSIENT RESPONSE
vs
V = 3.8 V
I
TIME (START-UP)
4.8
20
C
o
= 10 µF
0
4
3.8
−20
2
0
V = 3.8 V
I
I
C
C
= 200 mA
= 2.2 µF
O
V
= 2.8 V
O
−40
300
o
I
C
T
= 200 mA
= 2.2 µF
= 25°C
O
= 0.01 µF
dv
dt
0µ.4sV
(byp)
di
+
0.02A
o
20
0
+
µs
dt
J
C
(byp)
= 0.001 µF
200
100
3
2
1
0
1mA
-20
C
= 0.0047 µF
= 0.01 µF
(byp)
0
0
50 100 150200 250 300 350 400 450 500
0
10 20 30 40 50 60 70 80 90 100
C
(byp)
t − Time − µs
t − Time − µs
0
20 40 60 80 100 120 140 160 180 200
t − Time − µs
Figure 13.
Figure 14.
Figure 15.
TPS79301
DROPOUT VOLTAGE
vs
POWER UP / POWER DOWN
DC DROPOUT VOLTAGE
vs
OUTPUT CURRENT
V
= 3 V
O
R
L
= 15 Ω
250
200
150
100
INPUT VOLTAGE
200
T
= 125°C
= 25°C
J
150
100
T
J
= 125°C
V
T = 25°C
J
I
T
J
V
O
T
= −55°C
J
50
0
50
0
T
= −40°C
J
1s/div
I
= 200 mA
3
O
0
20 40 60 80 100 120 140 160 180 200
2.5
3.5
4
4.5
5
I
− Output Current − mA
O
V − Input Voltage − V
I
Figure 16.
Figure 17.
Figure 18.
8
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TPS79301-EP, TPS79318-EP, TPS79325-EP, TPS79328-EP
TPS793285-EP, TPS79330-EP, TPS79333-EP, TPS793475-EP
www.ti.com
SGLS163B–APRIL 2003–REVISED NOVEMBER 2006
TYPICAL CHARACTERISTICS (continued)
MINIMUM REQUIRED INPUT VOLTAGE
vs
TYPICAL REGIONS OF STABILITY
EQUIVALENT SERIES RESISTANCE (ESR) EQUIVALENT SERIES RESISTANCE (ESR)
TYPICAL REGIONS OF STABILITY
OUTPUT VOLTAGE
vs
vs
4
OUTPUT CURRENT
OUTPUT CURRENT
I
= 200 mA
O
100
10
100
10
T
J
= 125°C
C
= 2.2 µF
o
C
= 10 µF
o
V = 5.5 V, V ≥ 1.5 V
I
O
V = 5.5 V
I
T
J
= 25°C
T
J
= −40°C to 125°C
T = −40°C to 125°C
J
T
J
= −40°C
Region of Instability
Region of Instability
3
2.8
1
1
0.1
0.1
Region of Stability
Region of Stability
2
1.5 1.75
2
2.25 2.5 2.75
3
3.25 3.5
0.01
0.01
V
− Output Voltage − V
0
0.02
0.04
0.06
0.08
0.2
O
0
0.02
0.04
0.06
0.08
0.2
I
− Output Current − A
O
I
− Output Current − A
O
Figure 19.
Figure 20.
Figure 21.
9
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TPS79301-EP, TPS79318-EP, TPS79325-EP, TPS79328-EP
TPS793285-EP, TPS79330-EP, TPS79333-EP, TPS793475-EP
www.ti.com
SGLS163B–APRIL 2003–REVISED NOVEMBER 2006
APPLICATION INFORMATION
The TPS793xx family of low-dropout (LDO) regulators has been optimized for use in noise-sensitive
battery-operated equipment. The device features extremely low dropout voltages, high PSRR, ultralow output
noise, low quiescent current (170 µA typically), and enable-input to reduce supply currents to less than 1 µA
when the regulator is turned off.
A typical application circuit is shown in Figure 22.
TPS793xx
1
V
I
IN
4
5
BYPASS
OUT
V
O
3
0.1 µF
0.01 µF
EN
+
2.2 µF
GND
2
Figure 22. Typical Application Circuit
External Capacitor Requirements
A 0.1-µF or larger ceramic input bypass capacitor, connected between IN and GND and located close to the
TPS793xx, is required for stability and improves transient response, noise rejection, and ripple rejection. A
higher-value electrolytic input capacitor may be necessary if large, fast-rise-time load transients are anticipated
and the device is located several inches from the power source.
Like all LDOs, the TPS793xx requires an output capacitor connected between OUT and GND to stabilize the
internal control loop. The minimum recommended capacitance is 2.2-µF. Any 2.2-µF or larger ceramic capacitor
is suitable, provided the capacitance does not vary significantly over temperature.
The internal voltage reference is a key source of noise in an LDO regulator. The TPS793xx has a BYPASS pin
that is connected to the voltage reference through a 250-kΩ internal resistor. The 250-kΩ internal resistor, in
conjunction with an external bypass capacitor connected to the BYPASS pin, creates a low pass filter to reduce
the voltage reference noise and, therefore, the noise at the regulator output. In order for the regulator to operate
properly, the current flow out of the BYPASS pin must be at a minimum, because any leakage current creates
an IR drop across the internal resistor, thus, creating an output error. Therefore, the bypass capacitor must have
minimal leakage current.
For example, the TPS79328 exhibits only 32 µVRMS of output voltage noise using a 0.1-µF ceramic bypass
capacitor and a 2.2-µF ceramic output capacitor. Note that the output starts up slower as the bypass
capacitance increases due to the RC time constant at the BYPASS pin that is created by the internal 250-kΩ
resistor and external capacitor.
Board Layout Recommendation to Improve PSRR and Noise Performance
To improve ac measurements like PSRR, output noise, and transient response, it is recommended that the
board be designed with separate ground planes for VIN and VOUT, with each ground plane connected only at the
GND pin of the device. In addition, the ground connection for the bypass capacitor should connect directly to the
GND pin of the device.
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TPS793285-EP, TPS79330-EP, TPS79333-EP, TPS793475-EP
www.ti.com
SGLS163B–APRIL 2003–REVISED NOVEMBER 2006
APPLICATION INFORMATION (continued)
Power Dissipation and Junction Temperature
Specified regulator operation is ensured to a junction temperature of 125°C; the maximum junction temperature
should be restricted to 125°C under normal operating conditions. This restriction limits the power dissipation the
regulator can handle in any given application. To ensure the junction temperature is within acceptable limits,
calculate the maximum allowable dissipation, PD(max), and the actual dissipation, PD, which must be less than or
equal to PD(max)
.
The maximum power dissipation limit is determined using the following equation:
T max * T
J
+
A
P
D(max)
R
θJA
(1)
Where:
TJmax = Maximum allowable junction temperature
RθJA = Thermal resistance, junction to ambient, for the package, see the dissipation rating table
TA = Ambient temperature
The regulator dissipation is calculated using:
+ ǒVI * V
Ǔ
P
I
D
O
O
(2)
Power dissipation resulting from quiescent current is negligible. Excessive power dissipation triggers the thermal
protection circuit.
Programming the TPS79301 Adjustable LDO Regulator
The output voltage of the TPS79301 adjustable regulator is programmed using an external resistor divider as
shown in Figure 23. The output voltage is calculated using:
R1
R2
ǒ1 ) Ǔ
V
+ V
O
ref
(3)
Where:
Vref = 1.2246 V typical (the internal reference voltage)
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TPS793285-EP, TPS79330-EP, TPS79333-EP, TPS793475-EP
www.ti.com
SGLS163B–APRIL 2003–REVISED NOVEMBER 2006
APPLICATION INFORMATION (continued)
Programming the TPS79301 Adjustable LDO Regulator (continued)
Resistors R1 and R2 should be chosen for approximately 50-µA divider current. Lower-value resistors can be
used for improved noise performance, but the solution consumes more power. Higher resistor values should be
avoided as leakage current into/out of FB across R1/R2 creates an offset voltage that artificially
increases/decreases the feedback voltage and, thus, erroneously decreases/increases VO. The recommended
design procedure is to choose R2 = 30.1 kΩ to set the divider current at 50 µA, C1 = 15 pF for stability, and then
calculate R1 using:
V
O
R1 +
* 1 R2
ǒ Ǔ
V
ref
(4)
In order to improve the stability of the adjustable version, it is suggested that a small compensation capacitor be
placed between OUT and FB. For voltages <1.8 V, the value of this capacitor should be 100 pF. For voltages
>1.8 V, the approximate value of this capacitor can be calculated as:
–7
(3 x 10 ) x (R1 ) R2)
C1 +
(R1 x R2)
(5)
The suggested value of this capacitor for several resistor ratios is shown in the table below. If this capacitor is
not used (such as in a unity-gain configuration) or if an output voltage <1.8 V is chosen, then the minimum
recommended output capacitor is 4.7 µF instead of 2.2 µF.
TPS79301
OUTPUT VOLTAGE
PROGRAMMING GUIDE
V
I
IN
1 µF
OUTPUT
R1
R2
C1
≥ 2 V
VOLTAGE
EN
OUT
V
O
C1
31.6 kΩ 30.1 kΩ 22 pF
51 kΩ 30.1 kΩ 15 pF
59 kΩ 30.1 kΩ 15 pF
2.5 V
3.3 V
3.6 V
R1
R2
≤ 0.7 V
1 µF
BYPASS FB
GND
0.01 µF
Figure 23. TPS79301 Adjustable LDO Regulator Programming
Regulator Protection
The TPS793xx features internal current limiting and thermal protection. During normal operation, the TPS793xx
limits output current to approximately 400 mA. When current limiting engages, the output voltage scales back
linearly until the overcurrent condition ends. While current limiting is designed to prevent gross device failure,
care should be taken not to exceed the power dissipation ratings of the package or the absolute maximum
voltage ratings of the device. If the temperature of the device exceeds approximately 165°C, thermal-protection
circuitry shuts it down. Once the device has cooled down to below approximately 140°C, regulator operation
resumes.
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PACKAGE OPTION ADDENDUM
www.ti.com
6-Feb-2009
PACKAGING INFORMATION
Orderable Device
TPS79301DBVREP
TPS79301MDBVREP
TPS79318DBVREP
TPS79325DBVREP
TPS79333DBVREP
TPS793475DBVREP
V62/03634-01YE
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOT-23
DBV
6
6
5
5
5
5
6
5
5
5
5
6
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
V62/03634-02XE
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
V62/03634-03XE
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
V62/03634-07XE
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
V62/03634-08XE
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
V62/03634-09XE
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
6-Feb-2009
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TPS79301-EP, TPS79318-EP, TPS79325-EP, TPS79333-EP, TPS793475-EP :
Catalog: TPS79301, TPS79318, TPS79325, TPS79333, TPS793475
Automotive: TPS79301-Q1, TPS79318-Q1, TPS79325-Q1, TPS79333-Q1, TPS793475-Q1
•
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
21-Jun-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS79301MDBVREP
TPS79318DBVREP
TPS79325DBVREP
TPS79333DBVREP
TPS793475DBVREP
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
6
5
5
5
5
3000
3000
3000
3000
3000
179.0
180.0
180.0
180.0
180.0
8.4
9.0
9.0
9.0
9.0
3.2
3.2
3.2
3.2
3.2
3.2
1.4
1.4
1.4
1.4
1.4
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
3.15
3.15
3.15
3.15
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
21-Jun-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS79301MDBVREP
TPS79318DBVREP
TPS79325DBVREP
TPS79333DBVREP
TPS793475DBVREP
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
6
5
5
5
5
3000
3000
3000
3000
3000
203.0
182.0
182.0
182.0
182.0
203.0
182.0
182.0
182.0
182.0
35.0
20.0
20.0
20.0
20.0
Pack Materials-Page 2
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