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TPS79601DCQRG4 [TI]

ULTRALOW-NOISE, HIGH PSRR, FAST, RF, 1A LOW-DROPOUT LINEAR REGULATORS; 超低噪声，高PSRR ，快速， RF ， 1A低压降线性稳压器
TPS79601DCQRG4
型号： TPS79601DCQRG4
厂家： TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述：

ULTRALOW-NOISE, HIGH PSRR, FAST, RF, 1A LOW-DROPOUT LINEAR REGULATORS
超低噪声，高PSRR ，快速， RF ， 1A低压降线性稳压器

线性稳压器IC 调节器 电源电路 光电二极管 输出元件 信息通信管理
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TPS796xx  
www.ti.com  
SLVS351I–SEPTEMBER 2002–REVISED MAY 2006  
ULTRALOW-NOISE, HIGH PSRR, FAST, RF, 1A  
LOW-DROPOUT LINEAR REGULATORS  
FEATURES  
DESCRIPTION  
•
1A Low-Dropout Regulator With Enable  
The TPS796xx family of low-dropout (LDO)  
low-power linear voltage regulators features high  
power supply rejection ratio (PSRR), ultralow-noise,  
fast start-up, and excellent line and load transient  
responses in small outline, 3 × 3 SON, SOT223-6,  
and DDPAK-5 packages. Each device in the family is  
stable with a small 1µF ceramic capacitor on the  
output. The family uses an advanced, proprietary  
BiCMOS fabrication process to yield extremely low  
dropout voltages (e.g., 250mV at 1A). Each device  
achieves fast start-up times (approximately 50µs with  
a 0.001µF bypass capacitor) while consuming very  
low quiescent current (265 µA typical). Moreover,  
when the device is placed in standby mode, the  
supply current is reduced to less than 1µA. The  
TPS79630 exhibits approximately 40µVRMS of output  
voltage noise at 3.0V output, with a 0.1µF bypass  
capacitor. Applications with analog components that  
are noise sensitive, such as portable RF electronics,  
benefit from the high PSRR, low noise features, and  
the fast response time.  
•
Available in Fixed and Adjustable (1.2V to  
5.5V) Versions  
•
•
•
•
•
•
High PSRR (53dB at 10kHz)  
Ultralow-Noise (40µVRMS, TPS79630)  
Fast Start-Up Time (50µs)  
Stable With a 1µF Ceramic Capacitor  
Excellent Load/Line Transient Response  
Very Low Dropout Voltage (250mV at Full  
Load, TPS79630)  
•
3 × 3 SON, SOT223-6, and  
DDPAK-5 Packages  
APPLICATIONS  
•
•
•
•
•
RF: VCOs, Receivers, ADCs  
Audio  
Bluetooth™, Wireless LAN  
Cellular and Cordless Telephones  
Handheld Organizers, PDAs  
DRB PACKAGE  
3mm x 3mm SON  
(TOP VIEW)  
TPS79630  
RIPPLE REJECTION  
vs  
TPS79630  
OUTPUT SPECTRAL NOISE DENSITY  
vs  
FREQUENCY  
0.7  
DCQ PACKAGE  
IN  
IN  
1
2
3
4
8
7
6
5
EN  
FREQUENCY  
SOT223-6  
NC  
80  
70  
60  
50  
40  
30  
20  
10  
0
(TOP VIEW)  
OUT  
OUT  
GND  
NR  
V
= 4 V  
V
C
C
= 5.5 V  
IN  
IN  
1
2
3
4
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
EN  
IN  
GND  
OUT  
NR/FB  
C
C
= 10 µF  
= 2.2 µF  
OUT  
= 0.01 µF  
OUT  
= 0.1 µF  
NR  
I
= 1 mA  
OUT  
NR  
6
GND  
I
= 1 A  
OUT  
5
KTT (DDPAK) PACKAGE  
(TOP VIEW)  
I
= 1 mA  
OUT  
EN  
1
2
IN  
GND  
OUT  
I
= 1.5 A  
OUT  
3
4
1
10 100  
1k 10k 100k 1M 10M  
100  
1k  
10k  
100k  
NR/FB  
Frequency (Hz)  
Frequency (Hz)  
5
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Bluetooth is a trademark of Bluetooth SIG, Inc.  
All other trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2002–2006, Texas Instruments Incorporated  
TPS796xx  
www.ti.com  
SLVS351I–SEPTEMBER 2002–REVISED MAY 2006  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be  
more susceptible to damage because very small parametric changes could cause the device not to meet its published  
specifications.  
ORDERING INFORMATION(1)  
(2)  
PRODUCT  
VOUT  
TPS796xxyyyz  
XX is nominal output voltage (for example, 28 = 2.8V, 01 = Adjustable).  
YYY is package designator.  
Z is package quantity.  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) Output voltages from 1.3V to 4.9V in 100mV increments are available; minimum order quantities may apply. Contact factory for details  
and availability.  
ABSOLUTE MAXIMUM RATINGS  
over operating temperature range (unless otherwise noted)(1)  
UNIT  
VIN range  
–0.3V to 6V  
VEN range  
–0.3V to VIN + 0.3V  
6V  
VOUT range  
Peak output current  
ESD rating, HBM  
Internally limited  
2kV  
ESD rating, CDM  
500V  
Continuous total power dissipation  
Junction temperature range, TJ  
Storage temperature range, Tstg  
See Dissipation Ratings Table  
–40°C to +150°C  
–65°C to +150°C  
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating  
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
PACKAGE DISSIPATION RATINGS  
PACKAGE  
DDPAK  
BOARD  
High-K(1)  
Low-K(2)  
High-K(1)  
RθJC  
RθJA  
2°C/W  
23°C/W  
53°C/W  
40°C/W  
SOT223  
15°C/W  
1.2°C/W  
3 × 3 SON  
(1) The JEDEC high-K (2s2p) board design used to derive this data was a 3-inch × 3-inch (7,5-cm × 7,5-cm), multilayer board with 1-ounce  
internal power and ground planes and 2-ounce copper traces on top and bottom of the board.  
(2) The JEDEC low-K (1s) board design used to derive this data was a 3-inch × 3-inch (7,5-cm × 7,5-cm), two-layer board with 2-ounce  
copper traces on top of the board.  
2
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TPS796xx  
www.ti.com  
SLVS351I–SEPTEMBER 2002–REVISED MAY 2006  
ELECTRICAL CHARACTERISTICS  
over recommended operating temperature range (TJ = –40°C to +125°C), VEN = VIN,, VIN = VOUT(nom) + 1 V(1), IOUT = 1mA,  
COUT = 10µF, and CNR = 0.01µF, unless otherwise noted. Typical values are at +25°C.  
PARAMETER  
VIN Input voltage(1)  
TEST CONDITIONS  
MIN  
TYP  
MAX UNIT  
2.7  
5.5  
1.250  
1
V
V
A
VFB Internal reference (TPS79601)  
IOUT Continuous output current  
Output  
1.200 1.225  
0
voltage  
range  
TPS79601  
1.225  
5.5 – VDD  
V
TPS79601(2)  
0µA ≤ IOUT ≤ 1A, VOUT + 1V ≤ VIN ≤ 5.5V(1)  
0µA ≤ IOUT ≤ 1A, VOUT + 1V ≤ VIN ≤ 5.5V(1)  
0.98VOUT VOUT 1.02VOUT  
V
Output  
voltage  
Fixed  
VOUT < 5V  
–2.0  
–3.0  
+2.0  
+3.0  
0.12  
%
Accuracy  
Fixed  
VOUT = 5V  
0µA ≤ IOUT ≤ 1A, VOUT + 1V ≤ VIN ≤ 5.5V(1)  
VOUT + 1V ≤ VIN≤ 5.5V  
%
Output voltage line regulation  
0.05  
%/V  
mV  
(1)  
(∆VOUT%/VIN  
Load regulation (∆VOUT%/∆IOUT  
TPS79628  
)
)
0µA ≤ IOUT ≤ 1A  
5
270  
52  
IOUT = 1A  
365  
90  
TPS79628DRB IOUT = 250mA  
Dropout voltage(3)  
(VIN = VOUT (nom)– 0.1V)  
TPS79630  
TPS79633  
TPS79650  
IOUT = 1A  
250  
220  
200  
345  
325  
300  
4.2  
385  
1
mV  
IOUT = 1A  
IOUT = 1A  
Output current limit  
Ground pin current  
Shutdown current(4)  
FB pin current  
VOUT = 0V  
2.4  
A
0µA ≤ IOUT ≤ 1A  
VEN = 0V, 2.7V ≤ VIN ≤ 5.5V  
VFB = 1.225V  
265  
µA  
µA  
µA  
0.07  
1
f = 100Hz, IOUT = 10mA  
f = 100Hz, IOUT = 1A  
f = 10Hz, IOUT = 1A  
f = 100Hz, IOUT = 1A  
59  
54  
53  
42  
54  
46  
41  
40  
50  
75  
110  
Power-supply ripple  
rejection  
TPS79630  
dB  
CNR = 0.001µF  
CNR = 0.0047µF  
CNR = 0.01µF  
CNR = 0.1µF  
BW = 100Hz to 100kHz,  
IOUT = 1A  
Output noise voltage (TPS79630)  
Time, start-up (TPS79630)  
µVRMS  
CNR = 0.001µF  
CNR = 0.0047µF  
CNR = 0.01µF  
RL = 3Ω, COUT = 1µF  
µs  
EN pin current  
VEN = 0V  
–1  
1.7  
0
1
VIN  
0.7  
µA  
V
High-level enable input voltage  
Low-level enable input voltage  
2.7V ≤ VIN ≤ 5.5V  
2.7V ≤ VIN ≤ 5.5V  
V
(1) Minimum VIN = VOUT + VDO or 2.7V, whichever is greater. TPS79650 is tested at VIN = 5.5V.  
(2) Tolerance of external resistors not included in this specification.  
(3) VDO is not measured for TPS79618 and TPS79625 because minimum VIN = 2.7V.  
(4) For adjustable version, this applies only after VIN is applied; then VEN transitions high to low.  
3
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TPS796xx  
www.ti.com  
SLVS351I–SEPTEMBER 2002–REVISED MAY 2006  
FUNCTIONAL BLOCK DIAGRAM—ADJUSTABLE VERSION  
IN  
OUT  
Current  
Sense  
UVLO  
SHUTDOWN  
ILIM  
R
1
_
GND  
EN  
+
FB  
UVLO  
R
2
Thermal  
Shutdown  
Quickstart  
External to  
the Device  
Bandgap  
Reference  
1.225 V  
250 kΩ  
V
REF  
V
IN  
FUNCTIONAL BLOCK DIAGRAM—FIXED VERSION  
IN  
OUT  
UVLO  
Current  
Sense  
GND  
EN  
SHUTDOWN  
ILIM  
R
1
_
+
UVLO  
Thermal  
Shutdown  
R
2
Quickstart  
R = 40k  
2
Bandgap  
Reference  
1.225 V  
250 kΩ  
V
REF  
V
IN  
NR  
Table 1. Terminal Functions  
TERMINAL  
ADJ  
DESCRIPTION  
NAME  
FIXED  
NR  
N/A  
5
Connecting an external capacitor to this pin bypasses noise generated by the internal bandgap. This  
improves power-supply rejection and reduces output noise.  
EN  
1
1
Driving the enable pin (EN) high turns on the regulator. Driving this pin low puts the regulator into shutdown  
mode. EN can be connected to IN if not used.  
FB  
5
N/A  
This terminal is the feedback input voltage for the adjustable device.  
GND  
IN  
3, Tab  
3, Tab Regulator ground  
2
4
2
4
Unregulated input to the device.  
Output of the regulator.  
OUT  
4
Submit Documentation Feedback  
TPS796xx  
www.ti.com  
SLVS351I–SEPTEMBER 2002–REVISED MAY 2006  
TYPICAL CHARACTERISTICS  
TPS79630  
OUTPUT VOLTAGE  
vs  
TPS79628  
OUTPUT VOLTAGE  
vs  
TPS79628  
GROUND CURRENT  
vs  
OUTPUT CURRENT  
JUNCTION TEMPERATURE  
JUNCTION TEMPERATURE  
2.795  
4
350  
3.05  
V
C
= 4 V  
= 10 µF  
OUT  
= 25°C  
V
C
= 3.8 V  
V
C
= 3.8 V  
IN  
IN  
IN  
3.04  
3.03  
3.02  
3.01  
3.00  
2.99  
2.98  
2.97  
2.96  
2.95  
= 10 µF  
= 10 µF  
OUT  
OUT  
340  
330  
320  
310  
300  
290  
T
J
I
= 1 mA  
OUT  
2.790  
2.785  
I
= 1 A  
I
= 1 A  
OUT  
OUT  
2.780  
I
= 1 mA  
OUT  
2.775  
0.0  
0.2  
0.4  
0.6  
(A)  
0.8  
1.0  
−40−25−10  
5
20 35 50 65 80 95 110 125  
(°C)  
−40−25−10  
5
20 35 50 65 80 95 110 125  
(°C)  
I
T
J
T
J
OUT  
Figure 1.  
Figure 2.  
Figure 3.  
TPS79630  
TPS79630  
TPS79630  
OUTPUT SPECTRAL NOISE  
OUTPUT SPECTRAL NOISE  
OUTPUT SPECTRAL NOISE  
DENSITY  
vs  
FREQUENCY  
DENSITY  
vs  
FREQUENCY  
DENSITY  
vs  
FREQUENCY  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
V
C
C
= 5.5 V  
V
C
C
= 5.5 V  
V
C
= 5.5 V  
IN  
IN  
IN  
= 2.2 µF  
= 10 µF  
= 10 µF  
OUT  
= 0.1 µF  
OUT  
= 0.1 µF  
OUT  
I = 1 A  
OUT  
NR  
NR  
C
NR  
= 0.01 µF  
C
NR  
= 0.1 µF  
I
= 1 mA  
OUT  
C
NR  
= 0.0047 µF  
I
= 1 mA  
OUT  
C
= 0.001 µF  
NR  
I
= 1 A  
OUT  
I
= 1.5 A  
1k  
OUT  
100  
10k  
100k  
100  
1k  
10k  
100k  
100  
1k  
10k  
100k  
Frequency (Hz)  
Frequency (Hz)  
Frequency (Hz)  
Figure 4.  
Figure 5.  
Figure 6.  
5
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TPS796xx  
www.ti.com  
SLVS351I–SEPTEMBER 2002–REVISED MAY 2006  
TYPICAL CHARACTERISTICS (continued)  
TPS79630  
ROOT MEAN SQUARED OUTPUT  
TPS79628  
DROPOUT VOLTAGE  
vs  
TPS79630  
NOISE  
vs  
BYPASS CAPACITANCE  
RIPPLE REJECTION  
vs  
JUNCTION TEMPERATURE  
FREQUENCY  
350  
300  
250  
200  
150  
100  
50  
60  
50  
40  
30  
20  
10  
0
80  
70  
60  
50  
40  
30  
20  
10  
0
VIN = 2.7 V  
V
C
C
= 4 V  
IN  
µ
COUT = 10  
F
= 10 µF  
OUT  
= 0.01 µF  
I
= 1 mA  
OUT  
IOUT = 1 A  
NR  
I
= 1 A  
OUT  
I
C
= 250 mA  
= 10 µF  
OUT  
OUT  
BW = 100 Hz to 100 kHz  
IOUT = 250 mA  
0
−40−25−10  
5
20 35 50 65 80 95 110 125  
0.001 µF  
0.0047 µF  
0.01 µF  
(µF)  
0.1 µF  
1
10  
100  
1k 10k 100k 1M 10M  
_
(
TJ  
C)  
C
NR  
Frequency (Hz)  
Figure 7.  
Figure 8.  
Figure 9.  
TPS79630  
RIPPLE REJECTION  
vs  
TPS79630  
RIPPLE REJECTION  
vs  
FREQUENCY  
FREQUENCY  
START-UP TIME  
3
2.75  
2.50  
2.25  
2
80  
70  
60  
50  
40  
30  
20  
10  
80  
70  
60  
50  
40  
30  
20  
10  
0
V
= 4 V,  
= 10 µF,  
IN  
V
C
C
= 4 V  
V
C
C
= 4 V  
IN  
= 2.2 µF  
OUT  
= 0.01 µF  
NR  
IN  
C
=
NR  
C
OUT  
I = 1.0 A  
OUT  
= 10 µF  
OUT  
= 0.1 µF  
0.0047 µF  
I
= 1 mA  
I
= 1 mA  
OUT  
OUT  
NR  
Enable  
C
=
NR  
0.001 µF  
I
= 1 A  
I
= 1 A  
OUT  
OUT  
1.75  
1.50  
1.25  
1
C
=
NR  
0.01 µF  
0.75  
0.50  
0.25  
0
0
1
0
100  
200  
300  
400  
500  
600  
10  
100  
1k 10k 100k 1M 10M  
1
10  
100  
1k 10k 100k 1M 10M  
t (ms)  
Frequency (Hz)  
Frequency (Hz)  
Figure 10.  
TPS79618  
Figure 11.  
Figure 12.  
TPS79630  
LINE TRANSIENT RESPONSE  
TPS79628  
LOAD TRANSIENT RESPONSE  
LINE TRANSIENT RESPONSE  
5
4
6
5
4
3
2
1
3
0
I
C
C
= 1 A  
V
C
C
= 3.8 V  
IN  
= 10 µF  
OUT  
= 0.01 µF  
NR  
OUT  
dv  
dt  
dv  
dt  
di  
dt  
1 V  
ms  
1 V  
ms  
1 A  
ms  
2
−1  
I
C
C
= 1 A  
= 10 µF  
OUT  
= 0.01 µF  
OUT  
+
+
+
= 10 µF  
OUT  
= 0.01 µF  
NR  
40  
20  
40  
20  
150  
75  
NR  
0
0
0
−20  
−40  
−20  
−40  
−75  
−150  
0
0
20 40 60 80 100 120 140 160 180 200  
0
20 40 60 80 100 120 140 160 180 200  
100 200 300 400 500 600 700 800 900 1000  
t (µs)  
t (µs)  
t (µs)  
Figure 13.  
Figure 14.  
Figure 15.  
6
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TPS796xx  
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SLVS351I–SEPTEMBER 2002–REVISED MAY 2006  
TYPICAL CHARACTERISTICS (continued)  
TPS79630  
DROPOUT VOLTAGE  
vs  
TPS79601  
DROPOUT VOLTAGE  
vs  
TPS79625  
POWER UP/POWER DOWN  
OUTPUT CURRENT  
INPUT VOLTAGE  
300  
250  
200  
150  
100  
50  
4.0  
3.5  
3.0  
2.5  
350  
300  
250  
200  
150  
100  
50  
V
R
C
= 2.5 V  
= 10 Ω  
= 0.01 µF  
OUT  
L
NR  
T
J
= 125°C  
T
= 125°C  
J
T
= 25°C  
J
T
J
= 25°C  
2.0  
1.5  
1.0  
0.5  
0
T
= −40°C  
J
V
IN  
T
J
= −40°C  
I
C
C
= 1 A  
= 10 µF  
OUT  
= 0.01 µF  
OUT  
V
OUT  
NR  
0
0
0
1
2
3
4
5
6
7
8
9
10  
0
100 200 300 400 500 600 700 800 9001000  
(mA)  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
I
V
(V)  
IN  
200 µs/Div  
OUT  
Figure 16.  
Figure 17.  
Figure 18.  
TPS79630  
TPS79630  
TPS79630  
TYPICAL REGIONS OF STABILITY  
TYPICAL REGIONS OF STABILITY  
TYPICAL REGIONS OF STABILITY  
EQUIVALENT SERIES RESISTANCE  
EQUIVALENT SERIES RESISTANCE  
EQUIVALENT SERIES RESISTANCE  
(ESR)  
vs  
(ESR)  
vs  
(ESR)  
vs  
OUTPUT CURRENT  
OUTPUT CURRENT  
OUTPUT CURRENT  
100  
100  
10  
100  
10  
C
OUT  
= 10.0 µF  
C
OUT  
= 1 µF  
C
OUT  
= 2.2 µF  
Region of  
Instability  
Region of  
Instability  
10  
Region of  
Instability  
1
0.1  
1
0.1  
1
0.1  
Region of Stability  
Region of Stability  
Region of Stability  
0.01  
1
10 30 60 125 250 500 750 1000  
(mA)  
0.01  
0.01  
I
OUT  
1
10 30 60 125 250 500 750 1000  
(mA)  
1
10 30 60 125 250 500 750 1000  
(mA)  
I
I
OUT  
OUT  
Figure 19.  
Figure 20.  
Figure 21.  
7
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TPS796xx  
www.ti.com  
SLVS351I–SEPTEMBER 2002–REVISED MAY 2006  
APPLICATION INFORMATION  
The TPS796xx family of low-dropout (LDO)  
regulators has been optimized for use in  
noise-sensitive equipment. The device features  
extremely low dropout voltages, high PSRR, ultralow  
output noise, low quiescent current (265µA typically),  
and enable input to reduce supply currents to less  
than 1µA when the regulator is turned off.  
For example, the TPS79630 exhibits 40µVRMS of  
output voltage noise using a 0.1µF ceramic bypass  
capacitor and a 10µF ceramic output capacitor. Note  
that the output starts up slower as the bypass  
capacitance increases due to the RC time constant  
at the bypass pin that is created by the internal  
250kΩ resistor and external capacitor.  
A typical application circuit is shown in Figure 22.  
Board Layout Recommendation to Improve  
PSRR and Noise Performance  
VIN  
VOUT  
IN  
OUT  
TPS796xx  
GND  
To improve ac measurements like PSRR, output  
noise, and transient response, it is recommended  
that the board be designed with separate ground  
planes for VIN and VOUT, with each ground plane  
connected only at the ground pin of the device. In  
addition, the ground connection for the bypass  
capacitor should connect directly to the ground pin of  
the device.  
2.2µF  
1 µF  
EN  
NR  
µ
0.01 F  
Figure 22. Typical Application Circuit  
External Capacitor Requirements  
Although not required, it is good analog design  
practice to place a 0.1µF — 2.2µF capacitor near the  
input of the regulator to counteract reactive input  
sources. A 2.2µF or larger ceramic input bypass  
capacitor, connected between IN and GND and  
located close to the TPS796xx, is required for  
stability and improves transient response, noise  
rejection, and ripple rejection. A higher-value input  
capacitor may be necessary if large, fast-rise-time  
load transients are anticipated and the device is  
located several inches from the power source.  
Regulator Mounting  
The tab of the SOT223-6 package is electrically  
connected to ground. For best thermal performance,  
the tab of the surface-mount version should be  
soldered directly to a circuit-board copper area.  
Increasing the copper area improves heat  
dissipation.  
Solder pad footprint recommendations for the  
devices are presented in an application bulletin  
Solder Pad Recommendations for Surface-Mount  
Devices, literature number AB-132, available for  
download from the TI web site (www.ti.com).  
Like most low dropout regulators, the TPS796xx  
requires an output capacitor connected between  
OUT and GND to stabilize the internal control loop.  
The minimum recommended capacitor is 1µF. Any  
1µF or larger ceramic capacitor is suitable.  
Programming the TPS79601 Adjustable LDO  
Regulator  
The output voltage of the TPS79601 adjustable  
regulator is programmed using an external resistor  
divider as shown in Figure 28. The output voltage is  
calculated using Equation 1:  
The internal voltage reference is a key source of  
noise in an LDO regulator. The TPS796xx has an  
NR pin which is connected to the voltage reference  
through  
a 250kΩ internal resistor. The 250kΩ  
internal resistor, in conjunction with an external  
bypass capacitor connected to the NR pin, creates a  
low-pass filter to reduce the voltage reference noise  
and, therefore, the noise at the regulator output. In  
order for the regulator to operate properly, the  
current flow out of the NR pin must be at a minimum,  
because any leakage current creates an IR drop  
across the internal resistor, thus creating an output  
error. Therefore, the bypass capacitor must have  
minimal leakage current. The bypass capacitor  
should be no more than 0.1µF in order to ensure that  
it is fully charged during the quickstart time provided  
by the internal switch shown in the functional block  
diagram.  
R1  
R2  
ǒ Ǔ  
VOUT + VREF   1)  
(1)  
where:  
•
VREF = 1.2246V typ (the internal reference  
voltage)  
Resistors R1 and R2 should be chosen for  
approximately 40µA divider current. Lower value  
resistors can be used for improved noise  
performance, but the device wastes more power.  
Higher values should be avoided, as leakage current  
at FB increases the output voltage error.  
8
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The recommended design procedure is to choose  
R2 = 30.1kΩ to set the divider current at 40µA, C1 =  
15pF for stability, and then calculate R1 using  
Equation 2:  
Regulator Protection  
The TPS796xx PMOS-pass transistor has a built-in  
back diode that conducts reverse current when the  
input voltage drops below the output voltage (e.g.,  
during power-down). Current is conducted from the  
output to the input and is not internally limited. If  
extended reverse voltage operation is anticipated,  
external limiting might be appropriate.  
R1 + ǒVOUT Ǔ  
VREF  
*1   R2  
(2)  
In order to improve the stability of the adjustable  
version, it is suggested that a small compensation  
capacitor be placed between OUT and FB. The  
approximate value of this capacitor can be calculated  
as Equation 3:  
The TPS796xx features internal current limiting and  
thermal protection. During normal operation, the  
TPS796xx limits output current to approximately  
2.8A. When current limiting engages, the output  
voltage scales back linearly until the overcurrent  
condition ends. While current limiting is designed to  
prevent gross device failure, care should be taken  
not to exceed the power dissipation ratings of the  
package. If the temperature of the device exceeds  
approximately +165°C, thermal-protection circuitry  
shuts it down. Once the device has cooled down to  
below approximately +140°C, regulator operation  
resumes.  
–7  
(3 x 10 ) x (R1 ) R2)  
C1 +  
(R1 x R2)  
(3)  
The suggested value of this capacitor for several  
resistor ratios is shown in the table below (see  
Figure 23). If this capacitor is not used (such as in a  
unity-gain configuration) then the minimum  
recommended output capacitor is 2.2µF instead of  
1µF.  
OUTPUT VOLTAGE  
VOUT  
VIN  
PROGRAMMING GUIDE  
IN  
OUT  
TPS79601  
R1  
R2  
C1  
OUTPUT  
VOLTAGE  
2.2 µF  
EN  
1 µF  
R1  
R2  
C1  
GND  
FB  
1.8 V  
3.6V  
14.0 kΩ 30.1 kΩ  
33 pF  
57.9 kΩ 30.1 kΩ 15 pF  
Figure 23. TPS79601 Adjustable LDO Regulator Programming  
9
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SLVS351I–SEPTEMBER 2002–REVISED MAY 2006  
THERMAL INFORMATION  
dissipation. The temperature rise is computed by  
multiplying the maximum expected power dissipation  
by the sum of the thermal resistances between the  
junction and the case (RθJC), the case to heatsink  
(RθCS), and the heatsink to ambient (RθSA). Thermal  
resistances are measures of how effectively an  
object dissipates heat. Typically, the larger the  
device, the more surface area available for power  
dissipation and the lower the object's thermal  
resistance.  
The amount of heat that an LDO linear regulator  
generates is directly proportional to the amount of  
power it dissipates during operation. All integrated  
circuits have  
a
maximum allowable junction  
temperature (TJmax) above which normal operation  
is not assured. A system designer must design the  
operating environment so that the operating junction  
temperature (TJ) does not exceed the maximum  
junction temperature (TJmax). The two main  
environmental variables that a designer can use to  
improve thermal performance are air flow and  
external heatsinks. The purpose of this information is  
to aid the designer in determining the proper  
operating environment for a linear regulator that is  
operating at a specific power level.  
Figure 24 illustrates these thermal resistances for (a)  
a SOT223 package mounted in a JEDEC low-K  
board, and (b) a DDPAK package mounted on a  
JEDEC high-K board.  
Equation 5 summarizes the computation:  
In general, the maximum expected power (PD(max)  
consumed by a linear regulator is computed as  
Equation 4:  
)
ǒ
θSAǓ  
T
+ T ) P max x R  
) R  
) R  
D
J
A
θJC  
θCS  
(5)  
ǒ
Ǔ
PD max + VIN(avg)* VOUT(avg)   IOUT(avg))VIN(avg)   I(Q)  
The RθJC is specific to each regulator as determined  
by its package, lead frame, and die size provided in  
the regulator's data sheet. The RθSA is a function of  
the type and size of heatsink. For example, black  
body radiator type heatsinks can have RθCS values  
ranging from 5°C/W for very large heatsinks to  
50°C/W for very small heatsinks. The RθCS is a  
function of how the package is attached to the  
heatsink. For example, if a thermal compound is  
used to attach a heatsink to a SOT223 package,  
(4)  
where:  
•
•
•
•
VIN(avg) is the average input voltage.  
VOUT(avg) is the average output voltage.  
IOUT(avg) is the average output current.  
I(Q) is the quiescent current.  
For most TI LDO regulators, the quiescent current is  
insignificant compared to the average output current;  
therefore, the term VIN(avg) × I(Q) can be neglected.  
The operating junction temperature is computed by  
adding the ambient temperature (TA) and the  
increase in temperature due to the regulator's power  
RθCS of 1°C/W is reasonable.  
T
T
A
J
A
CIRCUIT BOARD COPPER AREA  
R
θ
JC  
B
C
B
C
B
R
R
θ
CS  
A
C
θ
SA  
C
DDPAK Package  
(b)  
SOT223 Package  
(a)  
T
A
Figure 24. Thermal Resistances  
10  
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Even if no external black body radiator type heatsink  
is attached to the package, the board on which the  
regulator is mounted provides some heatsinking  
through the pin solder connections. Some packages,  
like the DDPAK and SOT223 packages, use a  
copper plane underneath the package or the circuit  
board's ground plane for additional heatsinking to  
improve their thermal performance. Computer-aided  
thermal modeling can be used to compute very  
accurate approximations of an integrated circuit's  
R
max + (125 * 55)°Cń2.5 W + 28°CńW  
θJA  
(9)  
From Figure 25, DDPAK Thermal Resistance vs  
Copper Heatsink Area, the ground plane needs to be  
1cm2 for the part to dissipate 2.5W. The operating  
environment used in the computer model to construct  
Figure 25 consisted of a standard JEDEC High-K  
board (2S2P) with a 1-oz. internal copper plane and  
ground plane. The package is soldered to a 2-oz.  
copper pad. The pad is tied through thermal vias to  
the 1-oz. ground plane. Figure 26 shows the side  
view of the operating environment used in the  
computer model.  
thermal  
performance  
in  
different  
operating  
environments (e.g., different types of circuit boards,  
different types and sizes of heatsinks, and different  
air flows, etc.). Using these models, the three  
thermal resistances can be combined into one  
thermal resistance between junction and ambient  
(RθJA). This RθJA is valid only for the specific  
operating environment used in the computer model.  
40  
No Air Flow  
35  
Equation 5 simplifies into Equation 6:  
150 LFM  
30  
T
+ T ) P max x R  
D
J
A
θJA  
(6)  
(7)  
Rearranging Equation 6 gives Equation 7:  
T –T  
+
250 LFM  
25  
J
A
R
θJA  
P max  
D
Using Equation 6 and the computer model generated  
curves shown in Figure 25 and Figure 28, a designer  
can quickly compute the required heatsink thermal  
20  
15  
resistance/board area for  
a
given ambient  
temperature, power dissipation, and operating  
environment.  
0.1  
1
10  
100  
2
Copper Heatsink Area − cm  
DDPAK Power Dissipation  
Figure 25. DDPAK Thermal Resistance vs Copper  
Heatsink Area  
The DDPAK package provides an effective means of  
managing power dissipation in surface mount  
applications. The DDPAK package dimensions are  
provided in the Mechanical Data section at the end  
of the data sheet. The addition of a copper plane  
directly underneath the DDPAK package enhances  
the thermal performance of the package.  
2 oz. Copper Solder Pad  
with 25 Thermal Vias  
1 oz. Copper  
Power Plane  
To illustrate, the TPS72525 in a DDPAK package  
was chosen. For this example, the average input  
voltage is 5V, the output voltage is 2.5V, the average  
output current is 1A, the ambient temperature 55°C,  
the air flow is 150 LFM, and the operating  
environment is the same as documented below.  
Neglecting the quiescent current, the maximum  
average power is calculated as Equation 8:  
1 oz. Copper  
Ground Plane  
Thermal Vias, 0.3 mm  
Diameter, 1,5 mm Pitch  
Figure 26. DDPAK Thermal Resistance  
(
)
P max + 5 * 2.5 V x 1 A + 2.5 W  
D
(8)  
From the data in Figure 27 and rearranging  
Equation 6, the maximum power dissipation for a  
different ground plane area and a specific ambient  
temperature can be computed.  
Substituting TJmax for TJ into Equation 6 gives  
Equation 9:  
11  
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5
180  
160  
No Air Flow  
T
A
= 55°C  
140  
120  
100  
250 LFM  
4
3
150 LFM  
80  
60  
40  
No Air Flow  
2
20  
0
1
0.1  
1
10  
0.1  
1
10  
100  
2
2
PCB Copper Area − in  
Copper Heatsink Area − cm  
Figure 28. SOT223 Thermal Resistance vs PCB  
Area  
Figure 27. Maximum Power Dissipation vs  
Copper Heatsink Area  
From the data in Figure 28 and rearranging  
Equation 6, the maximum power dissipation for a  
different ground plane area and a specific ambient  
temperature can be computed (see Figure 29).  
SOT223 Power Dissipation  
The SOT223 package provides an effective means  
of managing power dissipation in surface mount  
applications. The SOT223 package dimensions are  
provided in the Mechanical Data section at the end  
of the data sheet. The addition of a copper plane  
directly underneath the SOT223 package enhances  
the thermal performance of the package.  
6
T
A
= 25°C  
5
4
To illustrate, the TPS72525 in a SOT223 package  
was chosen. For this example, the average input  
voltage is 3.3V, the output voltage is 2.5V, the  
average output current is 1A, the ambient  
temperature 55°C, no air flow is present, and the  
operating environment is the same as documented  
below. Neglecting the quiescent current, the  
maximum average power is calculated as  
Equation 10:  
2
4 in PCB Area  
3
2
2
0.5 in PCB Area  
1
0
(
)
P max + 3.3 * 2.5 V x 1 A + 800 mW  
D
(10)  
Substituting TJmax for TJ into Equation 6 gives  
Equation 11:  
0
25  
50  
75  
100  
125  
150  
R
max + (125 * 55)°Cń800 mW + 87.5°CńW  
θJA  
T
A
(°C)  
(11)  
Figure 29. SOT223 Power Dissipation  
From Figure 28, RθJA vs PCB Copper Area, the  
ground plane needs to be 0.55in2 for the part to  
dissipate 800mW. The operating environment used  
to construct Figure 28 consisted of a board with 1-oz.  
copper planes. The package is soldered to a 1-oz.  
copper pad on the top of the board. The pad is tied  
through thermal vias to the 1-oz. ground plane.  
12  
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solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in  
connection with such use.  
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products  
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any  
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.  
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Amplifiers  
Data Converters  
DSP  
Applications  
Audio  
amplifier.ti.com  
dataconverter.ti.com  
dsp.ti.com  
www.ti.com/audio  
Automotive  
Broadband  
Digital Control  
Military  
www.ti.com/automotive  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
interface.ti.com  
logic.ti.com  
Logic  
Power Mgmt  
Microcontrollers  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
microcontroller.ti.com  
www.ti.com/lpw  
Low Power  
Wireless  
Telephony  
www.ti.com/telephony  
Video & Imaging  
Wireless  
www.ti.com/video  
www.ti.com/wireless  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2007, Texas Instruments Incorporated  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,  
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.  
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s  
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this  
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily  
performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should  
provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask  
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services  
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such  
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under  
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is  
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an  
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service  
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business  
practice. TI is not responsible or liable for any such statements.  
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would  
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement  
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications  
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related  
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any  
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its  
representatives against any damages arising out of the use of TI products in such safety-critical applications.  
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are  
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military  
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is  
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in  
connection with such use.  
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products  
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any  
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.  
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Amplifiers  
Data Converters  
DSP  
Applications  
Audio  
amplifier.ti.com  
dataconverter.ti.com  
dsp.ti.com  
www.ti.com/audio  
Automotive  
Broadband  
Digital Control  
Military  
www.ti.com/automotive  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
interface.ti.com  
logic.ti.com  
Logic  
Power Mgmt  
Microcontrollers  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
microcontroller.ti.com  
www.ti.com/lpw  
Low Power  
Wireless  
Telephony  
www.ti.com/telephony  
Video & Imaging  
Wireless  
www.ti.com/video  
www.ti.com/wireless  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2007, Texas Instruments Incorporated  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,  
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.  
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s  
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this  
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily  
performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should  
provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask  
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services  
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such  
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under  
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is  
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an  
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service  
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business  
practice. TI is not responsible or liable for any such statements.  
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would  
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement  
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications  
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related  
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any  
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its  
representatives against any damages arising out of the use of TI products in such safety-critical applications.  
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are  
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military  
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is  
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in  
connection with such use.  
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products  
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any  
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.  
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Amplifiers  
Data Converters  
DSP  
Applications  
Audio  
amplifier.ti.com  
dataconverter.ti.com  
dsp.ti.com  
www.ti.com/audio  
Automotive  
Broadband  
Digital Control  
Military  
www.ti.com/automotive  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
interface.ti.com  
logic.ti.com  
Logic  
Power Mgmt  
Microcontrollers  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
microcontroller.ti.com  
www.ti.com/lpw  
Low Power  
Wireless  
Telephony  
www.ti.com/telephony  
Video & Imaging  
Wireless  
www.ti.com/video  
www.ti.com/wireless  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2007, Texas Instruments Incorporated  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,  
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.  
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s  
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this  
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily  
performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should  
provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask  
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services  
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such  
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under  
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is  
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an  
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service  
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business  
practice. TI is not responsible or liable for any such statements.  
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would  
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement  
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications  
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related  
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any  
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its  
representatives against any damages arising out of the use of TI products in such safety-critical applications.  
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are  
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military  
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is  
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in  
connection with such use.  
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products  
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any  
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.  
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Amplifiers  
Data Converters  
DSP  
Applications  
Audio  
amplifier.ti.com  
dataconverter.ti.com  
dsp.ti.com  
www.ti.com/audio  
Automotive  
Broadband  
Digital Control  
Military  
www.ti.com/automotive  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
interface.ti.com  
logic.ti.com  
Logic  
Power Mgmt  
Microcontrollers  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
microcontroller.ti.com  
www.ti.com/lpw  
Low Power  
Wireless  
Telephony  
www.ti.com/telephony  
Video & Imaging  
Wireless  
www.ti.com/video  
www.ti.com/wireless  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2007, Texas Instruments Incorporated  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,  
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.  
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s  
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this  
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily  
performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should  
provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask  
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services  
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such  
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under  
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is  
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an  
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service  
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business  
practice. TI is not responsible or liable for any such statements.  
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would  
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement  
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications  
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related  
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any  
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its  
representatives against any damages arising out of the use of TI products in such safety-critical applications.  
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are  
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military  
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is  
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in  
connection with such use.  
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products  
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any  
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.  
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Amplifiers  
Data Converters  
DSP  
Applications  
Audio  
amplifier.ti.com  
dataconverter.ti.com  
dsp.ti.com  
www.ti.com/audio  
Automotive  
Broadband  
Digital Control  
Military  
www.ti.com/automotive  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
interface.ti.com  
logic.ti.com  
Logic  
Power Mgmt  
Microcontrollers  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
microcontroller.ti.com  
www.ti.com/lpw  
Low Power  
Wireless  
Telephony  
www.ti.com/telephony  
Video & Imaging  
Wireless  
www.ti.com/video  
www.ti.com/wireless  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2007, Texas Instruments Incorporated  
PACKAGE OPTION ADDENDUM  
www.ti.com  
16-Mar-2007  
PACKAGING INFORMATION  
Orderable Device  
TPS79601DCQ  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOT-223  
DCQ  
6
6
6
6
5
5
5
5
5
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
TPS79601DCQG4  
TPS79601DCQR  
TPS79601DCQRG4  
TPS79601KTT  
SOT-223  
SOT-223  
SOT-223  
DCQ  
DCQ  
DCQ  
KTT  
KTT  
KTT  
KTT  
KTT  
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
OBSOLETE DDPAK/  
TO-263  
TBD  
Call TI  
CU SN  
CU SN  
CU SN  
CU SN  
Call TI  
TPS79601KTTR  
TPS79601KTTRG3  
TPS79601KTTT  
TPS79601KTTTG3  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
DDPAK/  
TO-263  
500 Green (RoHS &  
no Sb/Br)  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
DDPAK/  
TO-263  
500 Green (RoHS &  
no Sb/Br)  
DDPAK/  
TO-263  
50 Green (RoHS &  
no Sb/Br)  
DDPAK/  
TO-263  
50 Green (RoHS &  
no Sb/Br)  
TPS79613DRBR  
TPS79613DRBT  
TPS79618DCQ  
PREVIEW  
PREVIEW  
ACTIVE  
SON  
SON  
DRB  
DRB  
DCQ  
8
8
6
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
SOT-223  
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
TPS79618DCQG4  
TPS79618DCQR  
TPS79618DCQRG4  
TPS79618KTT  
ACTIVE  
ACTIVE  
ACTIVE  
SOT-223  
SOT-223  
SOT-223  
DCQ  
DCQ  
DCQ  
KTT  
KTT  
KTT  
KTT  
KTT  
DCQ  
DCQ  
DCQ  
DCQ  
KTT  
KTT  
6
6
6
5
5
5
5
5
6
6
6
6
5
5
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
OBSOLETE DDPAK/  
TO-263  
TBD  
Call TI  
CU SN  
CU SN  
CU SN  
CU SN  
Call TI  
TPS79618KTTR  
TPS79618KTTRG3  
TPS79618KTTT  
TPS79618KTTTG3  
TPS79625DCQ  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
DDPAK/  
TO-263  
500 Green (RoHS &  
no Sb/Br)  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
DDPAK/  
TO-263  
500 Green (RoHS &  
no Sb/Br)  
DDPAK/  
TO-263  
50 Green (RoHS &  
no Sb/Br)  
DDPAK/  
TO-263  
50 Green (RoHS &  
no Sb/Br)  
SOT-223  
SOT-223  
SOT-223  
SOT-223  
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
TPS79625DCQG4  
TPS79625DCQR  
TPS79625DCQRG4  
TPS79625KTT  
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
OBSOLETE DDPAK/  
TO-263  
TBD  
Call TI  
Call TI  
TPS79625KTTR  
ACTIVE  
DDPAK/  
500 Green (RoHS &  
CU SN  
Level-2-260C-1 YEAR  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
16-Mar-2007  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
TO-263  
no Sb/Br)  
TPS79625KTTRG3  
TPS79625KTTT  
TPS79625KTTTG3  
TPS79628DCQ  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
DDPAK/  
TO-263  
KTT  
KTT  
KTT  
DCQ  
DCQ  
DCQ  
DCQ  
DRB  
DRB  
DRB  
DRB  
KTT  
KTT  
KTT  
KTT  
KTT  
DCQ  
DCQ  
DCQ  
DCQ  
KTT  
KTT  
KTT  
KTT  
KTT  
5
5
5
6
6
6
6
8
8
8
8
5
5
5
5
5
6
6
6
6
5
5
5
5
5
500 Green (RoHS &  
no Sb/Br)  
CU SN  
CU SN  
CU SN  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
DDPAK/  
TO-263  
50 Green (RoHS &  
no Sb/Br)  
DDPAK/  
TO-263  
50 Green (RoHS &  
no Sb/Br)  
SOT-223  
SOT-223  
SOT-223  
SOT-223  
SON  
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
TPS79628DCQG4  
TPS79628DCQR  
TPS79628DCQRG4  
TPS79628DRBR  
TPS79628DRBRG4  
TPS79628DRBT  
TPS79628DRBTG4  
TPS79628KTT  
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SON  
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SON  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SON  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
OBSOLETE DDPAK/  
TO-263  
TBD  
Call TI  
CU SN  
CU SN  
CU SN  
CU SN  
Call TI  
TPS79628KTTR  
TPS79628KTTRG3  
TPS79628KTTT  
TPS79628KTTTG3  
TPS79630DCQ  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
DDPAK/  
TO-263  
500 Green (RoHS &  
no Sb/Br)  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
DDPAK/  
TO-263  
500 Green (RoHS &  
no Sb/Br)  
DDPAK/  
TO-263  
50 Green (RoHS &  
no Sb/Br)  
DDPAK/  
TO-263  
50 Green (RoHS &  
no Sb/Br)  
SOT-223  
SOT-223  
SOT-223  
SOT-223  
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
TPS79630DCQG4  
TPS79630DCQR  
TPS79630DCQRG4  
TPS79630KTT  
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
OBSOLETE DDPAK/  
TO-263  
TBD  
Call TI  
CU SN  
CU SN  
CU SN  
CU SN  
Call TI  
TPS79630KTTR  
TPS79630KTTRG3  
TPS79630KTTT  
TPS79630KTTTG3  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
DDPAK/  
TO-263  
500 Green (RoHS &  
no Sb/Br)  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
DDPAK/  
TO-263  
500 Green (RoHS &  
no Sb/Br)  
DDPAK/  
TO-263  
50 Green (RoHS &  
no Sb/Br)  
DDPAK/  
TO-263  
50 Green (RoHS &  
no Sb/Br)  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
16-Mar-2007  
Orderable Device  
TPS79633DCQ  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOT-223  
DCQ  
6
6
6
6
5
5
5
5
5
6
6
6
6
8
8
8
8
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
TPS79633DCQG4  
TPS79633DCQR  
TPS79633DCQRG4  
TPS79633KTT  
SOT-223  
SOT-223  
SOT-223  
DCQ  
DCQ  
DCQ  
KTT  
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
OBSOLETE DDPAK/  
TO-263  
TBD  
Call TI  
CU SN  
CU SN  
CU SN  
CU SN  
Call TI  
TPS79633KTTR  
TPS79633KTTRG3  
TPS79633KTTT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
DDPAK/  
TO-263  
KTT  
500 Green (RoHS &  
no Sb/Br)  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
DDPAK/  
TO-263  
KTT  
500 Green (RoHS &  
no Sb/Br)  
DDPAK/  
TO-263  
KTT  
50 Green (RoHS &  
no Sb/Br)  
TPS79633KTTTG3  
TPS79650DCQ  
DDPAK/  
TO-263  
KTT  
50 Green (RoHS &  
no Sb/Br)  
SOT-223  
SOT-223  
SOT-223  
SOT-223  
SON  
DCQ  
DCQ  
DCQ  
DCQ  
DRB  
DRB  
DRB  
DRB  
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
TPS79650DCQG4  
TPS79650DCQR  
TPS79650DCQRG4  
TPS79650DRBR  
TPS79650DRBRG4  
TPS79650DRBT  
TPS79650DRBTG4  
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SON  
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SON  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SON  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
Addendum-Page 3  
PACKAGE OPTION ADDENDUM  
www.ti.com  
16-Mar-2007  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 4  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
15-May-2007  
TAPE AND REEL INFORMATION  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
15-May-2007  
Device  
Package Pins  
Site  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) (mm) Quadrant  
(mm)  
330  
330  
330  
330  
330  
180  
330  
330  
330  
330  
180  
(mm)  
8
TPS79601DCQR  
TPS79618DCQR  
TPS79625DCQR  
TPS79628DCQR  
TPS79628DRBR  
TPS79628DRBT  
TPS79630DCQR  
TPS79633DCQR  
TPS79650DCQR  
TPS79650DRBR  
TPS79650DRBT  
DCQ  
DCQ  
DCQ  
DCQ  
DRB  
DRB  
DCQ  
DCQ  
DCQ  
DRB  
DRB  
6
6
6
6
8
8
6
6
6
8
8
HNT  
HNT  
HNT  
HNT  
MLA  
MLA  
HNT  
HNT  
HNT  
MLA  
MLA  
6.8  
6.8  
6.8  
6.8  
3.3  
3.3  
6.8  
6.8  
6.8  
3.3  
3.3  
7.3  
7.3  
7.3  
7.3  
3.3  
3.3  
7.3  
7.3  
7.3  
3.3  
3.3  
1.88  
1.88  
1.88  
1.88  
1.1  
8
8
8
8
8
8
8
8
8
8
8
12  
12  
12  
12  
12  
12  
12  
12  
12  
12  
12  
Q3  
Q3  
Q3  
Q3  
Q2  
Q2  
Q3  
Q3  
Q3  
Q2  
Q2  
8
8
8
12  
12  
8
1.1  
1.88  
1.88  
1.88  
1.1  
8
8
12  
12  
1.1  
TAPE AND REEL BOX INFORMATION  
Device  
Package  
Pins  
Site  
Length (mm) Width (mm) Height (mm)  
TPS79601DCQR  
TPS79618DCQR  
TPS79625DCQR  
TPS79628DCQR  
TPS79628DRBR  
TPS79628DRBT  
TPS79630DCQR  
TPS79633DCQR  
TPS79650DCQR  
TPS79650DRBR  
DCQ  
DCQ  
DCQ  
DCQ  
DRB  
DRB  
DCQ  
DCQ  
DCQ  
DRB  
6
6
6
6
8
8
6
6
6
8
HNT  
HNT  
HNT  
HNT  
MLA  
MLA  
HNT  
HNT  
HNT  
MLA  
358.0  
358.0  
358.0  
358.0  
346.0  
190.0  
358.0  
358.0  
358.0  
346.0  
335.0  
335.0  
335.0  
335.0  
346.0  
212.7  
335.0  
335.0  
335.0  
346.0  
35.0  
35.0  
35.0  
35.0  
29.0  
31.75  
35.0  
35.0  
35.0  
29.0  
Pack Materials-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
15-May-2007  
Device  
Package  
Pins  
Site  
Length (mm) Width (mm) Height (mm)  
TPS79650DRBT  
DRB  
8
MLA  
190.0  
212.7  
31.75  
Pack Materials-Page 3  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,  
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.  
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s  
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this  
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily  
performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should  
provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask  
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services  
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such  
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under  
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is  
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an  
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service  
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business  
practice. TI is not responsible or liable for any such statements.  
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would  
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement  
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications  
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related  
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any  
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its  
representatives against any damages arising out of the use of TI products in such safety-critical applications.  
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are  
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military  
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is  
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in  
connection with such use.  
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products  
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any  
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.  
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Amplifiers  
Data Converters  
DSP  
Applications  
Audio  
amplifier.ti.com  
dataconverter.ti.com  
dsp.ti.com  
www.ti.com/audio  
Automotive  
Broadband  
Digital Control  
Military  
www.ti.com/automotive  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
interface.ti.com  
logic.ti.com  
Logic  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
www.ti.com/telephony  
www.ti.com/video  
microcontroller.ti.com  
www.ti-rfid.com  
www.ti.com/lpw  
Telephony  
Low Power  
Wireless  
Video & Imaging  
Wireless  
www.ti.com/wireless  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2007, Texas Instruments Incorporated  

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