TPS79932YZUR [TI]
200mA, Low Quiescent Current, Ultra-Low Noise, High PSRR Low Dropout Linear Regulator; 200mA，低静态电流，超低噪声，高PSRR低压降线性稳压器
| 型号： | TPS79932YZUR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 200mA, Low Quiescent Current, Ultra-Low Noise, High PSRR Low Dropout Linear Regulator |
| 文件： | 总21页 (文件大小：456K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS799xx
www.ti.com
SBVS056G–JANUARY 2005–REVISED AUGUST 2006
200mA, Low Quiescent Current, Ultra-Low Noise, High PSRR
Low Dropout Linear Regulator
FEATURES
DESCRIPTION
•
•
•
200mA Low Dropout Regulator with EN
The TPS799xx family of low-dropout (LDO)
low-power linear regulators offer excellent AC
performance with very low ground current. High
power-supply rejection ratio (PSRR), low noise, fast
start-up, and excellent line and load transient
response are provided while consuming a very low
40µA (typical) ground current. The TPS799xx is
stable with ceramic capacitors and uses an
advanced BiCMOS fabrication process to yield
dropout voltage typically 100mV at 200mA output.
The TPS799xx uses a precision voltage reference
and feedback loop to achieve overall accuracy of 2%
over all load, line, process, and temperature
variations. It is fully specified from TJ = –40°C to
+125°C and is offered in low profile ThinSOT23,
Wafer Chip-Scale (WCSP), and 2mm × 2mm SON
packages, ideal for wireless handsets and WLAN
cards.
Low IQ: 40µA
Multiple Output Voltage Versions Available:
– Fixed Outputs of 1.2V to 4.5V Using
Innovative Factory EEPROM Programming
– Adjustable Outputs from 1.20V to 6.5V
High PSRR: 66dB at 1kHz
•
•
•
•
Ultra-low Noise: 29.5µVRMS
Fast Start-Up Time: 45µs
Stable with a Low-ESR, 2.0µF Typical Output
Capacitance
•
•
•
•
Excellent Load/Line Transient Response
2% Overall Accuracy (Load/Line/Temp)
Very Low Dropout: 100mV
ThinSOT-23, WCSP, and 2mm × 2mm SON-6
Packages
APPLICATIONS
•
•
•
•
Cellular Phones
Wireless LAN, Bluetooth™
VCOs, RF
Handheld Organizers, PDAs
TPS799xxDDC
TSOT23-5
TPS79901DDC
TSOT23-5
TPS799xxYZU
WCSP
(TOP VIEW)
TPS79901YZU
WCSP
(TOP VIEW)
(TOP VIEW)
(TOP VIEW)
C3
C1
C3
C1
5
4
5
4
1
2
3
1
2
3
IN
GND
EN
OUT
FB
IN
GND
EN
OUT
NR
IN
GND
NR
OUT
EN
IN
GND
FB
OUT
EN
B2
B2
A3
A1
A3
A1
TPS799xxDRV
2mm x 2mm SON-6
(TOP VIEW)
TPS79901DRV
2mm x 2mm SON-6
(TOP VIEW)
OUT
NR
1
2
3
OUT
FB
1
2
3
6
5
4
IN
6
5
4
IN
GND
GND
N/C
EN
N/C
EN
GND
GND
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Bluetooth is a trademark of Bluetooth SIG, Inc.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2006, Texas Instruments Incorporated
TPS799xx
www.ti.com
SBVS056G–JANUARY 2005–REVISED AUGUST 2006
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
ORDERING INFORMATION(1)
(2)
PRODUCT
VOUT
TPS799xxyyyz
XX is nominal output voltage (for example, 28 = 2.8V, 285 = 2.85V, 01 = Adjustable).(3)
YYY is package designator.
Z is package quantity.
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) Output voltages from 1.2V to 4.5V in 50mV increments are available through the use of innovative factory EEPROM programming;
minimum order quantities may apply. Contact factory for details and availability.
(3) For fixed 1.2V operation, tie FB to OUT.
ABSOLUTE MAXIMUM RATINGS
Over operating temperature range (unless otherwise noted)(1)
PARAMETER
TPS799xx
–0.3 to +7.0
UNIT
VIN range
V
V
V
VEN range
–0.3 to VIN +0.3
–0.3 to VIN +0.3
Internally limited
VOUT range
Peak output current
Continuous total power dissipation
Junction temperature range, TJ
Storage junction temperature range , TSTG
ESD rating, HBM
See Dissipation Ratings Table
–55 to +150
°C
°C
kV
V
–55 to +150
2
ESD rating, CDM
500
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
DISSIPATION RATINGS
DERATING FACTOR
BOARD
Low-K(1)
High-K(2)
Low-K(1)
High-K(2)
Low-K(1)
High-K(2)
PACKAGE
DDC
RθJC
RθJA
ABOVE TA = 25°C
TA < 25°C
360mW
500mW
390mW
530mW
715mW
1540mW
TA = 70°C
200mW
275mW
215mW
295mW
395mW
845mW
TA = 85°C
145mW
200mW
155mW
215mW
285mW
615mW
90°C/W
90°C/W
27°C/W
27°C/W
20°C/W
20°C/W
280°C/W
200°C/W
255°C/W
190°C/W
140°C/W
65°C/W
3.6mW/°C
DDC
5.0mW/°C
YZU
3.9mW/°C
YZU
5.3mW/°C
DRV
7.1mW/°C
DRV
15.4mW/°C
(1) The JEDEC low-K (1s) board used to derive this data was a 3in × 3in, two-layer board with 2-ounce copper traces on top of the board.
(2) The JEDEC high-K (2s2p) board used to derive this data was a 3in × 3in, multilayer board with 1-ounce internal power and ground
planes and 2-ounce copper traces on top and bottom of the board.
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SBVS056G–JANUARY 2005–REVISED AUGUST 2006
ELECTRICAL CHARACTERISTICS
Over operating temperature range (TJ = –40°C to +125°C), VIN = VOUT(TYP) + 0.3V or 2.7V, whichever is greater; IOUT = 1mA,
VEN = VIN, COUT = 2.2µF, CNR = 0.01µF, unless otherwise noted. For TPS79901, VOUT = 3.0V.
Typical values are at TJ = +25°C.
PARAMETER
Input voltage range(1)
TEST CONDITIONS
MIN
2.7
TYP
MAX
6.5
UNIT
V
VIN
VFB
Internal reference (TPS79901)
Output voltage range (TPS79901)
1.169
VFB
1.193
1.217
V
VOUT
VOUT
6.5 – VDO
+1.0
V
Output accuracy
Nominal
Over VIN
TJ = +25°C
VOUT + 0.3V ≤ VIN ≤ 6.5V
–1.0
%
,
VOUT
Output accuracy(1)
–2.0
±1.0
+2.0
%
IOUT, Temp 500µA ≤ IOUT ≤ 200mA
VOUT(NOM) + 0.3V ≤ VIN ≤ 6.5V
500µA ≤ IOUT ≤ 200mA
∆VOUT%/ ∆VIN Line regulation(1)
∆VOUT%/ ∆IOUT Load regulation
0.02
%/V
0.002
%/mA
Dropout voltage(2)
(VIN = VOUT(NOM) – 0.1V)
VDO
VOUT < 3.3V IOUT = 200mA
100
90
175
160
mV
mV
Dropout voltage
(VIN = VOUT(NOM) – 0.1V)
VDO
VOUT ≥ 3.3V IOUT = 200mA
ICL
IGND
ISHDN
IFB
Output current limit
Ground pin current
VOUT = 0.9 × VOUT(NOM)
500µA ≤ IOUT ≤ 200mA
200
400
40
600
60
mA
µA
Shutdown current (IGND
)
VEN ≤ 0.4V, 2.7V ≤ VIN ≤ 6.5V
0.15
1.0
0.5
µA
Feedback pin current (TPS79901)
–0.5
µA
f = 100Hz
70
66
51
38
dB
Power-supply rejection ratio
VIN = 3.85V, VOUT = 2.85V,
CNR = 0.01µF, IOUT = 100mA
f = 1kHz
dB
PSRR
VN
f = 10kHz
dB
f = 100kHz
CNR = 0.01µF
CNR = none
CNR = 0.001µF
CNR = 0.047µF
CNR = 0.01µF
CNR = none
dB
10.5 x VOUT
µVRMS
µVRMS
µs
Output noise voltage
BW = 10Hz to 100kHz, VOUT = 2.8V
94 x VOUT
45
45
50
50
Startup time
µs
TSTR
VOUT = 2.85V,
µs
RL = 14Ω, COUT = 2.2µF
µs
VEN(HI)
VEN(LO)
IEN(HI)
Enable high (enabled)
Enable low (shutdown)
Enable pin current, enabled
1.2
0
VIN
0.4
1.0
V
V
VEN = VIN = 6.5V
0.03
165
µA
Shutdown, temperature
increasing
°C
TSD
Thermal shutdown temperature
Reset, temperature decreasing
145
°C
°C
V
TJ
Operating junction temperature
Under-voltage lock-out
Hysteresis
–40
+125
2.65
VIN rising
VIN falling
1.90
2.20
70
UVLO
mV
(1) Minimum VIN = VOUT + VDO or 2.7V, whichever is greater.
(2) VDO is not measured for devices with VOUT(NOM) < 2.8V because minimum VIN = 2.7V.
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SBVS056G–JANUARY 2005–REVISED AUGUST 2006
DEVICE INFORMATION
FUNCTIONAL BLOCK DIAGRAMS
IN
OUT
IN
OUT
Ω
400
Ω
400
µ
2
A
Ω
3.3M
Current
Limit
Current
Limit
Overshoot
Detect
Overshoot
Detect
Thermal
Shutdown
Thermal
Shutdown
EN
EN
UVLO
UVLO
Quickstart
500k
1.193V
Bandgap
1.193V
Bandgap
NR
FB
500k
GND
GND
Figure 1. Fixed Voltage Versions
Figure 2. Adjustable Voltage Versions
PIN CONFIGURATIONS
TPS799xxDDC
TSOT23-5
TPS79901DDC
TSOT23-5
TPS799xxYZU
WCSP
(TOP VIEW)
TPS79901YZU
WCSP
(TOP VIEW)
(TOP VIEW)
(TOP VIEW)
C3
A3
C1
A1
C3
C1
5
4
5
4
1
2
3
1
2
3
IN
GND
EN
OUT
FB
IN
GND
EN
OUT
NR
IN
GND
NR
OUT
EN
IN
GND
FB
OUT
B2
B2
A3
A1
EN
TPS799xxDRV
2mm x 2mm SON-6
(TOP VIEW)
TPS79901DRV
2mm x 2mm SON-6
(TOP VIEW)
OUT
NR
1
2
3
OUT
FB
1
2
3
6
5
4
IN
6
5
4
IN
GND
GND
N/C
EN
N/C
EN
GND
GND
Table 1. PIN DESCRIPTIONS
TPS799xx
NAME
IN
DDC
YZU
C3
DRV
DESCRIPTION
1
2
6
Input supply.
GND
B2
3, Pad Ground. The pad must be tied to GND.
Driving the enable pin (EN) high turns on the regulator. Driving this pin low puts the regulator
into shutdown mode. EN can be connected to IN if not used.
EN
NR
FB
3
4
4
A1
A3
A3
4
2
2
Fixed voltage versions only; connecting an external capacitor to this pin bypasses noise
generated by the internal bandgap. This allows output noise to be reduced to very low levels.
Adjustable version only; this is the input to the control loop error amplifier, and is used to set
the output voltage of the device.
Output of the regulator. A small capacitor (total typical capacitance ≥ 2.0µF ceramic) is
needed from this pin to ground to assure stability.
OUT
N/C
5
C1
—
1
5
—
Not internally connected. This pin must either be left open, or tied to GND.
4
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SBVS056G–JANUARY 2005–REVISED AUGUST 2006
TYPICAL CHARACTERISTICS
Over operating temperature range (TJ= –40°C to +125°C), VIN = VOUT(TYP) + 0.3V or 2.7V, whichever is greater; IOUT = 1mA, VEN = VIN
,
COUT = 2.2µF, CNR = 0.01µF, unless otherwise noted. For TPS79901, VOUT = 3.0V. Typical values are at TJ = +25°C.
LOAD REGULATION
LINE REGULATION
28.50
21.38
14.25
7.13
0
1.0
0.8
0.6
0.4
0.2
0
IOUT = 100mA
T
= −40°C
J
T
= +25°C
J
T
= +25°C
J
T
= −40°C
J
−
−
−
−
−
0.2
0.4
0.6
0.8
1.0
−
7.13
T
= +125°C
J
T
= +85°C
−
14.25
21.38
28.50
J
T
= +125°C
T
= +85°C
J
J
−
−
2.5
3.5
4.5
5.5
6.5
7.5
0
50
100
OUT (mA)
150
200
VIN (V)
I
Figure 3.
Figure 4.
OUTPUT VOLTAGE vs
JUNCTION TEMPERATURE
TPS799285 DROPOUT VOLTAGE vs
OUTPUT CURRENT
200
180
160
140
120
100
80
2.0
1.5
1.0
0.5
0
_
TJ = +125
C
_
TJ = +85
C
IOUT = 1mA
IOUT = 100mA
−
−
−
−
0.5
1.0
1.5
2.0
_
TJ = +25
C
IOUT = 200mA
60
40
−
_
TJ
=
40
C
20
0
0
50
100
150
200
−
−
−
40 25 15
5
20 35 50 65 80 95 110 125
(°C)
IOUT (mA)
T
J
Figure 5.
Figure 6.
TPS799285 DROPOUT VOLTAGE vs
JUNCTION TEMPERATURE
TPS79901 DROPOUT vs
INPUT VOLTAGE
110
100
90
80
70
60
50
40
30
20
10
0
200
180
160
140
120
100
80
IOUT = 200mA
IOUT = 200mA
IOUT = 100mA
60
40
20
IOUT = 1mA
0
−
−
−
40 25 15
5
20 35 50 65 80 95 110 125
2.5
3.0
3.5
4.0
4.5
5.0
5.5 6.0
6.5
7.0
VIN (V)
T
(°C)
J
Figure 7.
Figure 8.
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TYPICAL CHARACTERISTICS (continued)
Over operating temperature range (TJ= –40°C to +125°C), VIN = VOUT(TYP) + 0.3V or 2.7V, whichever is greater; IOUT = 1mA, VEN = VIN
,
COUT = 2.2µF, CNR = 0.01µF, unless otherwise noted. For TPS79901, VOUT = 3.0V. Typical values are at TJ = +25°C.
GROUND PIN CURRENT vs
INPUT VOLTAGE
TPS799285 GROUND PIN CURRENT vs
JUNCTION TEMPERATURE
60
50
40
30
20
10
0
60
50
40
30
20
10
0
VIN = 3.2V
VIN = 5.0V
IOUT = 200mA
IOUT = 500mA
VIN = 2.7V
(dropout)
VOUT = 2.85V
IOUT = 200mA
VOUT = 2.85V
−
−
−
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
40 25 15
5
20 35 50 65 80 95 110 125
(°C)
T
VIN (V)
J
Figure 9.
Figure 10.
GROUND PIN CURRENT (DISABLED) vs
JUNCTION TEMPERATURE
TPS799285 POWER-SUPPLY RIPPLE REJECTION vs
FREQUENCY (VIN – VOUT = 1.0V)
90
600
500
400
300
200
100
0
VEN = 0.4V
IOUT = 100mA
80
70
60
50
40
30
20
10
0
IOUT = 1mA
IOUT = 200mA
VIN = 6.5V
VIN = 3.2V
µ
CNR = 0.01 F
µ
COUT = 2.2
F
10 100
1k
10k
100k
1M
10M
−
−
−
40 25 15
5
20 35 50 65 80 95 110 125
Frequency (Hz)
T
(°C)
J
Figure 11.
Figure 12.
6
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SBVS056G–JANUARY 2005–REVISED AUGUST 2006
TYPICAL CHARACTERISTICS (continued)
Over operating temperature range (TJ= –40°C to +125°C), VIN = VOUT(TYP) + 0.3V or 2.7V, whichever is greater; IOUT = 1mA, VEN = VIN
,
COUT = 2.2µF, CNR = 0.01µF, unless otherwise noted. For TPS79901, VOUT = 3.0V. Typical values are at TJ = +25°C.
TPS799285 POWER-SUPPLY RIPPLE REJECTION vs
FREQUENCY (VIN – VOUT = 0.5V)
TPS799285 POWER-SUPPLY RIPPLE REJECTION vs
FREQUENCY (VIN – VOUT = 0.25V)
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
IOUT = 100mA
IOUT = 1mA
IOUT = 1mA
IOUT = 200mA
IOUT = 100mA
IOUT = 200mA
100k
µ
CNR = 0.01 F
µ
CNR = 0.01 F
µ
COUT = 2.2
F
µ
COUT = 2.2 F
10 100
1k
10k
1M
10M
10 100
1k
10k
100k
1M
10M
Frequency (Hz)
Frequency (Hz)
Figure 13.
Figure 14.
TPS799285 POWER-SUPPLY RIPPLE REJECTION vs
FREQUENCY (VIN – VOUT = 1.0V)
TPS799285 POWER-SUPPLY RIPPLE REJECTION vs
FREQUENCY (VIN – VOUT = 0.25V)
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
IOUT = 1mA
IOUT = 1mA
IOUT = 200mA
IOUT = 200mA
µ
CNR = 0.01 F
µ
CNR = 0.01 F
µ
COUT = 10.0
F
µ
COUT = 10.0
F
10 100
1k
10k
100k
1M
10M
10 100
1k
10k
100k
1M
10M
Frequency (Hz)
Frequency (Hz)
Figure 15.
Figure 16.
TPS799285 POWER-SUPPLY RIPPLE REJECTION vs
FREQUENCY (VIN – VOUT = 1.0V)
POWER-SUPPLY RIPPLE REJECTION vs
VIN – VOUT, IOUT = 1mA
90
90
80
70
60
50
40
30
20
10
0
0.1kHz
1MHz
1kHz
80
70
60
50
40
30
20
10
0
IOUT = 1mA
100kHz
10kHz
IOUT = 200mA
µ
CNR = 0.01 F
COUT = 2.2 F
CNR = None
COUT = 10.0
µ
µ
F
10
100
1k
10k
100k
1M
10M
0.0
0.5 1.0
1.5
2.0
2.5
3.0
3.5
4.0
Frequency (Hz)
−
VIN VOUT (V)
Figure 17.
Figure 18.
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TYPICAL CHARACTERISTICS (continued)
Over operating temperature range (TJ= –40°C to +125°C), VIN = VOUT(TYP) + 0.3V or 2.7V, whichever is greater; IOUT = 1mA, VEN = VIN
,
COUT = 2.2µF, CNR = 0.01µF, unless otherwise noted. For TPS79901, VOUT = 3.0V. Typical values are at TJ = +25°C.
POWER-SUPPLY RIPPLE REJECTION vs
VIN – VOUT, IOUT = 100mA
POWER-SUPPLY RIPPLE REJECTION vs
VIN – VOUT, IOUT = 200mA
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
0.1kHz
0.1kHz
1kHz
1kHz
10kHz
10kHz
100kHz
100kHz
1MHz
1MHz
2.5
µ
CNR = 0.01
µ
COUT = 2.2 F
F
µ
µ
CNR = 0.01
COUT = 2.2 F
F
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0.0
0.5
1.0
1.5
2.0
3.0
3.5
4.0
−
−
VIN VOUT (V)
VIN VOUT (V)
Figure 19.
Figure 20.
TPS799285
TOTAL NOISE vs CNR
TPS799285
TOTAL NOISE vs COUT
200
180
160
140
120
100
80
35
30
25
20
15
10
5
IOUT = 1mA
µ
OUT = 2.2 F
C
60
40
IOUT = 1mA
20
µ
CNR = 0.01
F
0
0
0.01
0.1
1
10
0
5
10
COUT ( F)
15
20
25
CNR (nF)
µ
Figure 21.
Figure 22.
TPS799285
LINE TRANSIENT RESPONSE
TPS799285
LOAD TRANSIENT RESPONSE
VIN = 3.35V
COUT = 2.2mF
IOUT = 150mA
100mV/div
100mV/div
VOUT
µ
COUT = 10
F
20mV/div
VOUT
COUT = 10mF
VOUT
µ
COUT = 2.2
F
20mV/div
1V/div
VOUT
150mA
dVIN
dt
4.15V
µ
= 1V/
s
100mA/div
1mA
IOUT
3.15V
VIN
µ
20 s/div
20ms/div
Figure 23.
Figure 24.
8
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SBVS056G–JANUARY 2005–REVISED AUGUST 2006
TYPICAL CHARACTERISTICS (continued)
Over operating temperature range (TJ= –40°C to +125°C), VIN = VOUT(TYP) + 0.3V or 2.7V, whichever is greater; IOUT = 1mA, VEN = VIN
,
COUT = 2.2µF, CNR = 0.01µF, unless otherwise noted. For TPS79901, VOUT = 3.0V. Typical values are at TJ = +25°C.
TPS799285
TURN-ON RESPONSE
TPS799285
ENABLE RESPONSE
(VEN = VIN
)
VIN = 3.85V
Ω,
RLOAD = 19
Ω
2.85k
Ω
RLOAD = 19
COUT = 2.2
VOUT
VOUT
µ
COUT = 2.2
F
µ
F
Ω,
RLOAD = 19
Ω
2.85k
µ
COUT = 10 F
Ω
RLOAD = 2.85k
µ
µ
F
COUT = 2.2 F, 10
1V/div
4V/div
1V/div
5V/div
3.85V
VIN
VEN
0V
µ
µ
10 s/div
10 s/div
Figure 25.
Figure 26.
TPS799285
POWER-UP/POWER-DOWN
7
6
5
4
3
2
1
0
1
Ω
RL = 19
VIN
VOUT
−
50ms/div
Figure 27.
9
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SBVS056G–JANUARY 2005–REVISED AUGUST 2006
APPLICATION INFORMATION
The TPS799xx family of LDO regulators combines
the high performance required of many RF and
precision analog applications with ultra-low current
consumption. High PSRR is provided by a high gain,
high bandwidth error loop with good supply rejection
at very low headroom (VIN – VOUT). Fixed voltage
versions provide a noise reduction pin to bypass
noise generated by the bandgap reference and to
improve PSRR while a quick-start circuit fast-charges
this capacitor at startup. The combination of high
performance and low ground current also make the
TPS799xx an excellent choice for portable
applications. All versions have thermal and
over-current protection and are fully specified from
–40°C to +125°C.
The TPS799xx is designed to be stable with
standard ceramic capacitors of values 2.2µF or
larger. X5R and X7R type capacitors are best as
they have minimal variation in value and ESR over
temperature. Maximum ESR should be < 1.0Ω.
Feedback Capacitor Requirements
(TPS79901 only)
The feedback capacitor, CFB, shown in Figure 29 is
required for stability. For a parallel combination of R1
and R2 equal to 250kΩ, any value from 3pF to 1nF
can be used. Fixed voltage versions have an internal
30pF feedback capacitor which is quick-charged at
start-up. The adjustable version does not have this
quick-charge circuit, so values below 5pF should be
used to ensure fast startup; values above 47pF can
be used to implement an output voltage soft-start.
Larger value capacitors also improve noise slightly.
The TPS79901 is stable in unity-gain configuration
Figure 28 shows the basic circuit connections for
fixed voltage models. Figure 29 gives the
connections for the adjustable output version
(TPS79901). R1 and R2 can be calculated for any
output voltage using the formula in Figure 29.
Sample resistor values for common output voltages
are shown in Figure 29.
(OUT tied to FB) without CFB
.
Output Noise
In most LDOs, the bandgap is the dominant noise
source. If a noise reduction capacitor (CNR) is used
with the TPS799xx, the bandgap does not contribute
significantly to noise. Instead, noise is dominated by
the output resistor divider and the error amplifier
input. To minimize noise in a given application, use a
0.01µF noise reduction capacitor; for the adjustable
version, smaller value resistors in the output resistor
divider reduce noise. A parallel combination that
gives 2µA of divider current will have the same noise
performance as a fixed voltage version. To further
optimize noise, equivalent series resistance of the
output capacitor can be set to approximately 0.2Ω.
This configuration maximizes phase margin in the
control loop, reducing total output noise by up to
10%.
Input and Output Capacitor Requirements
Although an input capacitor is not required for
stability, it is good analog design practice to connect
a 0.1µF to 1µF low ESR capacitor across the input
supply near the regulator. This will counteract
reactive input sources and improve transient
response, noise rejection, and ripple rejection. A
higher-value capacitor may be necessary if large,
fast rise-time load transients are anticipated or the
device is located several inches from the power
source. If source impedance is not sufficiently low, a
0.1µF input capacitor may be necessary to ensure
stability.
Optional input capacitor.
May improve source
impedance, noise, or PSRR.
Optional input capacitor.
(R1 + R2)
×
1.193
VOUT
=
May improve source
R2
impedance, noise, or PSRR.
VIN
VOUT
IN
OUT
TPS799xx
GND
VIN
VOUT
IN
OUT
FB
TPS799xx
µ
2.2
F
R1
R2
CFB
EN
NR
µ
2.2
F
Ceramic
EN
GND
Ceramic
VEN
Optional bypass capacitor
to reduce output noise
and increase PSRR.
VEN
Figure 28. Typical Application Circuit for
Fixed Voltage Versions
Figure 29. Typical Application Circuit for
Adjustable Voltage Version
10
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Noise can be referred to the feedback point (FB pin)
Startup
such that with CNR
= 0.01µF total noise is
Fixed voltage versions of the TPS799xx use a
quick-start circuit to fast-charge the noise reduction
capacitor, CNR, if present (see Functional Block
Diagrams, Figure 1). This allows the combination of
very low output noise and fast start-up times. The
NR pin is high impedance so a low leakage CNR
capacitor must be used; most ceramic capacitors are
appropriate in this configuration.
approximately given by Equation 1:
10.5mVRMS
VN =
x VOUT
V
(1)
The TPS79901 adjustable version does not have the
noise-reduction pin available, so ultra-low noise
operation is not possible. Noise can be minimized
according to the above recommendations.
Note that for fastest startup, VIN should be applied
first, then the enable pin (EN) driven high. If EN is
tied to IN, startup will be somewhat slower. Refer to
Figure 25 and Figure 26 in the Typical
Characteristics section. The quick-start switch is
closed for approximately 135µs. To ensure that CNR
is fully charged during the quick-start time, a 0.01µF
or smaller capacitor should be used.
Board Layout Recommendations to Improve
PSRR and Noise Performance
To improve ac performance such as PSRR, output
noise, and transient response, it is recommended
that the board be designed with separate ground
planes for VIN and VOUT, with each ground plane
connected only at the GND pin of the device. In
addition, the ground connection for the bypass
capacitor should connect directly to the GND pin of
the device.
Transient Response
As with any regulator, increasing the size of the
output capacitor will reduce over/undershoot
magnitude but increase duration of the transient
response. In the adjustable version, adding CFB
between OUT and FB will improve stability and
transient response. The transient response of the
TPS799xx is enhanced by an active pull-down that
engages when the output overshoots by
approximately 5% or more when the device is
enabled. When enabled, the pull-down device
behaves like a 350Ω resistor to ground.
Internal Current Limit
The TPS799xx internal current limit helps protect the
regulator during fault conditions. During current limit,
the output will source a fixed amount of current that
is largely independent of output voltage. For reliable
operation, the device should not be operated in
current limit for extended periods of time.
The PMOS pass element in the TPS799xx has a
built-in body diode that conducts current when the
voltage at OUT exceeds the voltage at IN. This
current is not limited, so if extended reverse voltage
operation is anticipated, external limiting may be
appropriate.
Under-Voltage Lock-Out (UVLO)
The TPS799xx utilizes an under-voltage lock-out
circuit to keep the output shut off until internal
circuitry is operating properly. The UVLO circuit has
a de-glitch feature so that it will typically ignore
undershoot transients on the input if they are less
than 50µs duration.
Shutdown
The enable pin (EN) is active high and is compatible
with standard and low voltage TTL-CMOS levels.
When shutdown capability is not required, EN can be
connected to IN.
Minimum Load
The TPS799xx is stable and well-behaved with no
output load. To meet the specified accuracy, a
minimum load of 500µA is required. Below 500µA at
junction temperatures near +125°C, the output can
drift up enough to cause the output pull-down to turn
on. The output pull-down will limit voltage drift to 5%
typically but ground current could increase by
approximately 50µA. In typical applications, the
junction cannot reach high temperatures at light
loads since there is no appreciable dissipated power.
The specified ground current would then be valid at
no load in most applications.
Dropout Voltage
The TPS799xx uses a PMOS pass transistor to
achieve low dropout. When (VIN – VOUT) is less than
the dropout voltage (VDO), the PMOS pass device is
in its linear region of operation and the
input-to-output resistance is the RDS, ON of the PMOS
pass element. Because the PMOS device behaves
like a resistor in dropout, VDO will approximately
scale with output current.
As with any linear regulator, PSRR and transient
response are degraded as (VIN – VOUT) approaches
dropout. This effect is shown in Figure 18 through
Figure 20 in the Typical Characteristics section.
11
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SBVS056G–JANUARY 2005–REVISED AUGUST 2006
The internal protection circuitry of the TPS799xx has
been designed to protect against overload
conditions. It was not intended to replace proper
heatsinking. Continuously running the TPS799xx into
thermal shutdown will degrade device reliability.
Thermal Information
Thermal Protection
Thermal protection disables the output when the
junction temperature rises to approximately +165°C,
allowing the device to cool. When the junction
temperature cools to approximately +145°C the
output circuitry is again enabled. Depending on
power dissipation, thermal resistance, and ambient
temperature, the thermal protection circuit may cycle
on and off. This cycling limits the dissipation of the
regulator, protecting it from damage due to
overheating.
Power Dissipation
The ability to remove heat from the die is different for
each
package
type,
presenting
different
considerations in the PCB layout. The PCB area
around the device that is free of other components
moves the head from the device to the ambient air.
Performance data for JEDEC low- and high-K boards
are given in the Dissipation Ratings table. Using
heavier copper will increase the effectiveness in
removing heat from the device. The addition of
plated through-holes to heat-dissipating layers will
also improve the heatsink effectiveness.
Any tendency to activate the thermal protection
circuit indicates excessive power dissipation or an
inadequate heatsink. For reliable operation, junction
temperature should be limited to +125°C maximum.
To estimate the margin of safety in a complete
design (including heatsink), increase the ambient
temperature until the thermal protection is triggered;
use worst-case loads and signal conditions. For good
reliability, thermal protection should trigger at least
+35°C above the maximum expected ambient
condition of your particular application. This
Power dissipation depends on input voltage and load
conditions. Power dissipation is equal to the product
of the output current time the voltage drop across the
output pass element, as shown in Equation 2:
ǒ
Ǔ
PD + VIN*VOUT @ IOUT
(2)
configuration produces
temperature of +125°C at the highest expected
ambient temperature and worst-case load.
a
worst-case junction
Package Mounting
Solder pad footprint recommendations for the
TPS799xx are available from the Texas Instruments'
web site at www.ti.com.
1,060
0,960
1,427
1,327
(d = 0.30 ±0.05)
0,625 Max
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. NanoStaräpackage configuration.
NanoStar is a trademark of Texas Instruments.
Figure 30. YZU Wafer Chip-Scale Package Dimensions (in mm)
12
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PACKAGE OPTION ADDENDUM
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12-Sep-2006
PACKAGING INFORMATION
Orderable Device
TPS79901DDCR
TPS79901DDCRG4
TPS79901DDCT
TPS79901DDCTG4
TPS79901DRVR
TPS79901DRVRG4
TPS79901DRVT
TPS79901DRVTG4
TPS79901YZUR
TPS79901YZUT
TPS79912YZUR
TPS79912YZUT
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TO/SOT
DDC
5
5
5
5
6
6
6
6
5
5
5
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TO/SOT
TO/SOT
TO/SOT
SON
DDC
DDC
DDC
DRV
DRV
DRV
DRV
YZU
YZU
YZU
YZU
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SON
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DSBGA
DSBGA
DSBGA
DSBGA
3000 Green (RoHS &
no Sb/Br)
SNAGCU
SNAGCU
SNAGCU
SNAGCU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
250 Green (RoHS &
no Sb/Br)
3000 Green (RoHS &
no Sb/Br)
250 Green (RoHS &
no Sb/Br)
TPS79913DDCR
TPS79913DDCT
TPS79913YZUR
PREVIEW
PREVIEW
ACTIVE
TO/SOT
TO/SOT
DSBGA
DDC
DDC
YZU
5
5
5
3000
250
TBD
TBD
Call TI
Call TI
Call TI
Call TI
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
TPS79913YZUT
TPS79915DDCR
TPS79915DDCRG4
TPS79915DDCT
TPS79915DDCTG4
TPS79915YZUR
TPS79915YZUT
TPS79918DDCR
TPS79918DDCRG4
TPS79918DDCT
TPS79918DDCTG4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DSBGA
TO/SOT
TO/SOT
TO/SOT
TO/SOT
DSBGA
DSBGA
TO/SOT
TO/SOT
TO/SOT
TO/SOT
YZU
DDC
DDC
DDC
DDC
YZU
YZU
DDC
DDC
DDC
DDC
5
5
5
5
5
5
5
5
5
5
5
250 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
250 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
12-Sep-2006
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
no Sb/Br)
TPS79918DRVR
TPS79918DRVRG4
TPS79918DRVT
TPS79918DRVTG4
TPS79918YZUR
TPS79918YZUT
TPS799195DRVR
TPS799195DRVRG4
TPS799195DRVT
TPS799195DRVTG4
TPS79919YZUR
TPS79919YZUT
TPS79925DDCR
TPS79925DDCRG4
TPS79925DDCT
TPS79925DDCTG4
TPS79925YZUR
TPS79925YZUT
TPS79926YZUR
TPS79926YZUT
TPS79927DDCR
TPS79927DDCRG4
TPS79927DDCT
TPS79927DDCTG4
TPS79927DRVR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SON
SON
DRV
DRV
DRV
DRV
YZU
YZU
DRV
DRV
DRV
DRV
YZU
YZU
DDC
DDC
DDC
DDC
YZU
YZU
YZU
YZU
DDC
DDC
DDC
DDC
DRV
6
6
6
6
5
5
6
6
6
6
5
5
5
5
5
5
5
5
5
5
5
5
5
5
6
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DSBGA
DSBGA
SON
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
250 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SON
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DSBGA
DSBGA
TO/SOT
TO/SOT
TO/SOT
TO/SOT
DSBGA
DSBGA
DSBGA
DSBGA
TO/SOT
TO/SOT
TO/SOT
TO/SOT
SON
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
250 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS &
no Sb/Br)
SNAGCU
SNAGCU
SNAGCU
SNAGCU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
250 Green (RoHS &
no Sb/Br)
3000 Green (RoHS &
no Sb/Br)
250 Green (RoHS &
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
12-Sep-2006
Orderable Device
TPS79927DRVRG4
TPS79927DRVT
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SON
DRV
6
6
6
5
5
5
5
5
5
6
6
6
6
5
5
5
5
5
5
6
6
6
6
5
5
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SON
SON
DRV
DRV
YZU
YZU
DDC
DDC
DDC
DDC
DRV
DRV
DRV
DRV
YZU
YZU
DDC
DDC
DDC
DDC
DRV
DRV
DRV
DRV
YZU
YZU
DDC
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS79927DRVTG4
TPS79927YZUR
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DSBGA
DSBGA
TO/SOT
TO/SOT
TO/SOT
TO/SOT
SON
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
TPS79927YZUT
250 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
TPS799285DDCR
TPS799285DDCRG4
TPS799285DDCT
TPS799285DDCTG4
TPS799285DRVR
TPS799285DRVRG4
TPS799285DRVT
TPS799285DRVTG4
TPS799285YZUR
TPS799285YZUT
TPS79928DDCR
TPS79928DDCRG4
TPS79928DDCT
TPS79928DDCTG4
TPS79928DRVR
TPS79928DRVRG4
TPS79928DRVT
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SON
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DSBGA
DSBGA
TO/SOT
TO/SOT
TO/SOT
TO/SOT
SON
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
250 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SON
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS79928DRVTG4
TPS79928YZUR
SON
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DSBGA
DSBGA
TO/SOT
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
TPS79928YZUT
250 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
TPS79930DDCR
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
12-Sep-2006
Orderable Device
TPS79930DDCRG4
TPS79930DDCT
TPS79930DDCTG4
TPS79930YZUR
TPS79930YZUT
TPS79932YZUR
TPS79932YZUT
TPS79933DDCR
TPS79933DDCRG4
TPS79933DDCT
TPS79933DDCTG4
TPS79933DRVR
TPS79933DRVRG4
TPS79933DRVT
TPS79933DRVTG4
TPS79933YZUR
TPS79933YZUT
TPS79945YZUR
TPS79945YZUT
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TO/SOT
DDC
5
5
5
5
5
5
5
5
5
5
5
6
6
6
6
5
5
5
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TO/SOT
TO/SOT
DSBGA
DSBGA
DSBGA
DSBGA
TO/SOT
TO/SOT
TO/SOT
TO/SOT
SON
DDC
DDC
YZU
YZU
YZU
YZU
DDC
DDC
DDC
DDC
DRV
DRV
DRV
DRV
YZU
YZU
YZU
YZU
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS &
no Sb/Br)
SNAGCU
SNAGCU
SNAGCU
SNAGCU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
250 Green (RoHS &
no Sb/Br)
3000 Green (RoHS &
no Sb/Br)
250 Green (RoHS &
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SON
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DSBGA
DSBGA
DSBGA
DSBGA
3000 Green (RoHS &
no Sb/Br)
SNAGCU
SNAGCU
SNAGCU
SNAGCU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
250 Green (RoHS &
no Sb/Br)
3000 Green (RoHS &
no Sb/Br)
250 Green (RoHS &
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
Addendum-Page 4
PACKAGE OPTION ADDENDUM
www.ti.com
12-Sep-2006
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 5
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
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and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
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Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
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Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
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Amplifiers
amplifier.ti.com
www.ti.com/audio
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dataconverter.ti.com
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dsp.ti.com
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www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
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interface.ti.com
logic.ti.com
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power.ti.com
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microcontroller.ti.com
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Wireless
www.ti.com/wireless
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Copyright 2006, Texas Instruments Incorporated
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