TPS7A4001TDA1 [TI]
超高电压线性稳压器 | TD | 0 | -40 to 125;
| 型号： | TPS7A4001TDA1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 超高电压线性稳压器 | TD | 0 | -40 to 125 输出元件 稳压器 调节器 |
| 文件： | 总5页 (文件大小：275K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS7A4001-DIE
www.ti.com.cn
ZHCSAR1 –FEBRUARY 2013
超高电压线性稳压器
查询样品: TPS7A4001-DIE
1
特性
2
•
•
•
•
超高最大输入电压
应用范围
CMOS 逻辑电平兼容的使能引脚
与陶瓷电容器一起工作室保持稳定
内置电流值限制和热关断保护
•
由工业用总线（具有高电压瞬态）供电的微处理
器、微控制器
•
•
•
•
•
•
工业自动化
电信基础设施
车用
以太网供电 (PoE)
发光二级管 (LED) 照明
偏置电源
说明
TPS7A4001-DIE 是一款可在持续直流或瞬态输入电压下工作的极高电压耐受的线性稳压器。
TPS7A4001-DIE 提供一个与标准 CMOS 逻辑兼容的使能引脚 (EN) 以启用一个低电流关断模式。
TPS7A4001-DIE 具有热关断和电流限制功能以便在故障情况下保护系统。
此外，TPS7A4001-DIE 非常适合在电信和工业应用中从中间电压轨生成一个低压电源；它不但能够提供一个经充
分稳压的电压轨，并且可在极高和快速电压瞬态期间和保持稳压。 这些特性转化为更加简单且成本有效的电涌保护
电路而被广泛使用，其中包括PoE，偏置电源和 LED 照明。
ORDERING INFORMATION(1)
PACKAGE
DESIGNATOR
PRODUCT
PACKAGE
ORDERABLE PART NUMBER
PACKAGE QUANTITY
TPS7A4001TDA1
TPS7A4001TDA2
132
10
TPS7A4001
TD
Bare die in waffle pack(2)
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
English Data Sheet: SBVS223
TPS7A4001-DIE
ZHCSAR1 –FEBRUARY 2013
www.ti.com.cn
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
BARE DIE INFORMATION
BACKSIDE
POTENTIAL
BOND PAD
METALLIZATION COMPOSITION
BOND PAD
THICKNESS
DIE THICKNESS
BACKSIDE FINISH
10.5 mils.
Silicon with backgrind
Floating
AlTiW
760 nm
Table 1. Bond Pad Coordinates in Microns
DESCRIPTION
PAD NUMBER
X MIN
356.94
776.97
1293.12
1210.05
403.56
Y MIN
46.08
X MAX
432
Y MAX
121.14
121.14
121.14
1360.62
1360.62
OUT
FB
1
2
3
4
5
46.08
852.03
1368.18
1285.11
478.62
GND
EN
46.08
1285.56
1285.56
IN
2
Copyright © 2013, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
4-Feb-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS7A4001TDA1
TPS7A4001TDA2
ACTIVE
ACTIVE
0
0
132
10
RoHS & Green
RoHS & Green
Call TI
N / A for Pkg Type
N / A for Pkg Type
-40 to 125
-40 to 125
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
4-Feb-2021
Addendum-Page 2
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