TPS7B8450QDCYRQ1 [TI]
TPS7B84-Q1 150-mA, 40-V, Adjustable, Low-Dropout Regulator;型号: | TPS7B8450QDCYRQ1 |
厂家: | TEXAS INSTRUMENTS |
描述: | TPS7B84-Q1 150-mA, 40-V, Adjustable, Low-Dropout Regulator |
文件: | 总33页 (文件大小:1097K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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TPS7B84-Q1
SBVS361 –APRIL 2020
TPS7B84-Q1 150-mA, 40-V, Adjustable, Low-Dropout Regulator
1 Features
3 Description
The TPS7B84-Q1 is a low-dropout linear regulator
designed to connect to the battery in automotive
applications. The device has an input voltage range
extending to 40 V, which allows the device to
withstand transients (such as load dump) that are
anticipated in automotive systems. With only a 20-µA
quiescent current at light loads, the device is an
optimal solution for powering always-on components
such as microcontrollers (MCUs) and controller area
network (CAN) transceivers in standby systems.
1
•
AEC-Q100 qualified for automotive applications:
–
–
Temperature grade 1: –40°C to +125°C, TA
Junction temperature: –40°C to +150°C, TJ
•
•
Input voltage range: 3 V to 40 V (42 V max)
Output voltage range:
–
–
Adjustable output: 1.2 V to 18 V
Fixed output: 3.3 V and 5 V
•
•
•
Output current: up to 150 mA
Output voltage accuracy: ±1.5% (max)
Low dropout voltage:
The TPS7B84-Q1 has both fixed and adjustable
output types. The wide output voltage range allows
the device to generate the bias voltage for silicon
carbide (SiC) gate drivers and microphones as well
as power MCUs and processors.
–
255 mV (max) at 150 mA (VOUT ≥ 3.3 V)
•
•
Low quiescent current:
–
–
20 µA (typ) at light loads
5 µA (max) when disabled
The device has state-of-the-art transient response
that allows the output to quickly react to changes in
load or line (for example, during cold-crank
conditions). Additionally, the device has a novel
architecture that minimizes output overshoot when
recovering from dropout. During normal operation, the
device has a tight DC accuracy of ±1.5% over line,
load, and temperature.
Excellent line transient response:
–
–
±2% VOUT deviation during cold-crank
±2% VOUT deviation (1-V/µs VIN slew rate)
•
•
Stable with a 2.2-µF or larger capacitor
Package options:
The device is available in both a SOT223 package
and a small VSON package with wettable flanks that
facilitates a compact printed circuit board (PCB)
design. The low thermal resistance enables sustained
operation despite significant dissipation across the
device.
–
–
DRB (8-pin VSON), RθJA: 50.8ºC/W
DCY (4-pin SOT-223), RθJA: 85.5ºC/W
2 Applications
•
•
•
Reconfigurable instrument clusters
Body control modules (BCM)
Device Information(1)
Always-on battery-connected applications:
PART NUMBER
PACKAGE
VSON (8)
SOT-223 (4)
BODY SIZE (NOM)
3.00 mm × 3.00 mm
6.50 mm × 3.50 mm
–
–
Automotive gateways
TPS7B84-Q1
Remote keyless entries (RKE)
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Line Transient Response (3-V/µs VIN Slew Rate)
45
40
35
30
25
20
15
10
5
0.25
VIN
VOUT
Typical Application Schematic
0.2
0.15
0.1
IN
OUT
FB
EN
TPS7B84-Q1
0.05
0
GND
-0.05
-0.1
-0.15
-0.2
0
0
500
1000
1500
Time (ms)
2000
2500
3000
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. ADVANCE INFORMATION for pre-production products; subject to
change without notice.
TPS7B84-Q1
SBVS361 –APRIL 2020
www.ti.com
Table of Contents
7.4 Device Functional Modes........................................ 14
Application and Implementation ........................ 15
8.1 Application Information............................................ 15
8.2 Typical Application .................................................. 19
Power Supply Recommendations...................... 20
1
2
3
4
5
6
Features.................................................................. 1
8
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Typical Characteristics.............................................. 6
Detailed Description ............................................ 10
7.1 Overview ................................................................. 10
7.2 Functional Block Diagrams ..................................... 10
7.3 Feature Description................................................. 12
9
10 Layout................................................................... 20
10.1 Layout Guidelines ................................................. 20
10.2 Layout Examples................................................... 21
11 Device and Documentation Support ................. 22
11.1 Receiving Notification of Documentation Updates 22
11.2 Support Resources ............................................... 22
11.3 Trademarks........................................................... 22
11.4 Electrostatic Discharge Caution............................ 22
11.5 Glossary................................................................ 22
7
12 Mechanical, Packaging, and Orderable
Information ........................................................... 22
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
DATE
REVISION
NOTES
April 2020
*
Initial release.
2
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SBVS361 –APRIL 2020
5 Pin Configuration and Functions
DCY Package
4-Pin SOT-223
Top View
DRB Package
8-Pin VSON
Top View
IN
EN
1
2
3
OUT
FB/NC
NC
1
8
7
6
5
IN
4
GND
2
EN
NC
GND
Thermal pad
OUT
3
4
NC
Not to scale
Not to scale
Pin Functions
PIN
TYPE(1)
DESCRIPTION
NAME
EN
DCY
DRB
Enable pin. The device is disabled when the enable pin becomes lower than
the enable logic input low level (VIL).
2
4
7
I
G
I
Ground pin. Connect this pin to the thermal pad with a low-impedance
connection.
GND
FB/NC
NC
5
2
Feedback pin when using an external resistor divider or an NC pin when using
the device with a fixed output voltage.
—
__
No internal connection. Connect these pins to GND for the best thermal
performance.
3, 4, 6
__
Input power-supply voltage pin. For best transient response and to minimize
input impedance, use the recommended value or larger ceramic capacitor from
IN to ground as listed in the Recommended Operating Conditions table and the
Input Capacitor section. Place the input capacitor as close to the output of the
device as possible.
IN
1
8
P
Regulated output voltage pin. A capacitor is required from OUT to ground for
stability. For best transient response, use the nominal recommended value or
larger ceramic capacitor from OUT to ground; see the Recommended
Operating Conditions table and the Output Capacitor section. Place the output
capacitor as close to output of the device as possible.
OUT
3
1
O
Thermal
pad
Thermal pad. Connect the pad to GND for the best possible thermal
performance. See the Layout section for more information.
—
Pad
—
(1) I = input; O = output; P = power; G = ground.
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
–0.3
–0.3
–0.3
–40
MAX UNIT
IN
Unregulated input
Enable input
42
V
V
EN
OUT
FB
TJ
42
VIN + 0.3(2)
20
Regulated output
Feedback
V
V
Operating junction temperature
Storage temperature
150
°C
°C
Tstg
–65
150
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions isnot implied. Exposure to absolute-maximum-rated conditions for extended periods may affect devicereliability.
(2) The absolute maximum rating is VIN + 0.3 V or 20 V, whichever is smaller.
6.2 ESD Ratings
VALUE
±2000
±500
UNIT
Human-body model (HBM), per AEC Q100-002
V(ESD)
Electrostatic discharge
All pins
V
Charged-device model (CDM), per AEC Q100-
011
Corner pins
±750
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
TYP
MAX
40
UNIT
VIN
Input voltage
3
1.2
0
V
V
VOUT
IOUT
FEN
VEN
COUT
ESR
CIN
Output voltage
18
Output current
Enable pin frequency(1)
150
5
mA
kHz
V
High voltage (I/O)
Output capacitor(2)
0
2.2
40
220
2
µF
Ω
Output capacitor ESR requirements
Input capacitor(3)
0.001
1
µF
°C
TJ
Operating junction temperature
–40
150
(1) Minimum pulse time on the EN pin is 100 µs.
(2) Effective output capacitance of 1 µF minimum required for stability.
(3) For robust EMI performance the minimum input capacitance is 500 nF.
6.4 Thermal Information
TPS7B84-Q1
THERMAL METRIC(1)(2)
DRB (VSON)
DCY
4 PINS
85.5
46.6
11.3
4.9
Unit
8 PINS
50.8
55.6
22.9
1.2
θJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
θJCtop
θJB
°C/W
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
ψJB
22.9
7.5
11
θJCbot
11
(1) The thermal data is based on the JEDEC standard high K profile,JESD 51-7. Two-signal, two-plane, four-layer board with 2-oz. copper.
The copper pad is soldered tothe thermal land pattern. Also, correct attachment procedure must be incorporated.
(2) For more information about traditional and new thermal metrics,see the Semiconductor and IC PackageThermal Metrics application
report.
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SBVS361 –APRIL 2020
6.5 Electrical Characteristics
specified at TJ = –40°C to +150°C, VIN = 13.5 V, IOUT = 0 mA, COUT = 2.2 µF, 1 mΩ < COUT ESR < 2 Ω, CIN = 1 µF, and VEN
=
2 V (unless otherwise noted); typical values are at TJ = 25°C
PARAMETER
TEST CONDITIONS
MIN
–0.75
-1
TYP
MAX
0.75
1
UNIT
%
TJ = 25ºC
VIN = VOUT + 500 mV to 40 V,
IOUT = 100 µA to 150 mA(1)(2)
VOUT
Regulated output
Line regulation
TJ = –40°C to +150ºC
%
Change in percent of output
voltage
VIN = VOUT + 500 mV to
40 V, IOUT = 100 µA
ΔVOUT(ΔVIN)
0.2
0.2
%
%
VIN = VOUT + 500 mV,
IOUT = 100 µA to 150 mA,
Change in percent of output
voltage
ΔVOUT(ΔIOUT)
Load regulation
Load regulation
VOUT ≥ 3.3 V
VIN = VOUT + 500 mV,
IOUT = 100 µA to 150 mA,
VOUT < 3.3 V
Change in percent of output
voltage
ΔVOUT(ΔIOUT)
0.3
20
%
TJ = 25ºC
17
VIN = VOUT + 500 mV to 40 V,
IOUT = 0 mA(1)
IQ
Quiescent current
µA
TJ = –40°C to +150ºC
TJ = –40°C to +150ºC
TJ = 25ºC
25
35
IOUT = 500 µA(1)
VEN = 0 V
2.5
ISHUTDOWN
Shutdown supply current (IGND
)
µA
TJ = –40°C to +150ºC
4
IOUT ≤ 1 mA, VOUT ≥ 3.3 V, VIN = VOUT(NOM) x 0.95
43
VDO
Dropout voltage fixed output
IOUT = 105 mA, VOUT ≥ 3.3 V, VIN = VOUT(NOM)
130
160
200
255
43
mV
IOUT = 150 mA, VOUT ≥ 3.3 V, VIN = VOUT(NOM)
I
OUT ≤ 1 mA, VIN = 3 V, VFB = 0.61 V(3)
IOUT = 105 mA, VIN = 3 V, VFB = 0.61 V(3)
IOUT = 150 mA, VIN = 3 V, VFB = 0.61 V(3)
Reference voltage for FB
Dropout voltage adjustable output
Dropout voltage Adjustable Output
Dropout voltage Adjustable Output
Feedback voltage
VDO
225
280
0.657
10
mV
VFB
0.643
0.65
V
nA
V
IFB
Feedback Current
VUVLO(RISING)
VUVLO(FALLING)
VUVLO(HYST)
VIL
Rising input supply UVLO
Falling input supply UVLO
VUVLO hysteresis
VIN rising
VIN falling
2.6
2.7
2.5
2.82
2.6
2.38
V
215
mV
V
Enable logic input low level
Enable logic input high level
EN pin current
0.7
VIH
2
V
IEN
VEN = VIN = 13.5 V
50
nA
mA
dB
µVRMS
°C
ICL
Output current limit
VIN = VOUT + 1 V, VOUT short to 90% x VOUT(NOM)
VIN - VOUT = 500 mV, frequency = 1 kHz, IOUT = 150 mA
VOUT = 3.3 V, BW = 10 Hz to 100 kHz
180
220
70
260
PSRR
Power-supply ripple rejection
Output noise voltage
Vn
280
175
20
TSD(SHUTDOWN)
TSD(HYST)
Junction shutdown temperature
Hysteresis of thermal shutdown
°C
(1) For adjustable devices this parameter is tested in unity gain, so resistor divider tolerances and current is not included.
(2) Power dissipation is limited to 2W for IC production testing purposes. The power dissipation can be higher during normal operation.
Please see the thermal dissipation section for more information on how much power the device can dissipate while maintaining a
junction temperature below 150℃.
(3) Dropout is not measured for VIN ≤ 3 V
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6.6 Typical Characteristics
specified at TJ = –40°C to +150°C, VIN = 13.5 V, IOUT = 100 µA, COUT = 2.2 µF, 1 mΩ < COUT ESR < 2 Ω, CIN = 1 µF, and VEN
= 2 V (unless otherwise noted)
5.015
5.01
5.005
5
0.1
0.05
0
-55èC
-40èC
0èC
25èC
85èC
125èC
150èC
150 mA
100 mA
-0.05
-0.1
-0.15
-0.2
-0.25
-0.3
4.995
4.99
4.985
4.98
4.975
-60 -40 -20
0
20 40 60 80 100 120 140 160
Temperature èC
5
10
15
20 25
Input Voltage (V)
30
35
40
VOUT = 5 V, IOUT = 150 mA
Figure 2. Line Regulation vs VIN
Figure 1. Accuracy vs Temperature
5.015
5.01
5.005
5
5.015
5.01
5.005
5
-55èC
-40èC
0èC
25èC
85èC
125èC
150èC
-55èC
-40èC
0èC
25èC
85èC
125èC
150èC
4.995
4.99
4.985
4.98
4.975
4.995
4.99
4.985
4.98
4.975
5
10
15
20 25
Input Voltage (V)
30
35
40
5
10
15
20 25
Input Voltage (V)
30
35
40
VOUT = 5 V, IOUT = 5 mA
Figure 3. Line Regulation vs VIN
VOUT = 5 V, IOUT = 1 mA
Figure 4. Line Regulation vs VIN
5.015
5.01
5.005
5
275
250
225
200
175
150
125
100
75
-55èC
-40èC
0èC
25èC
85èC
125èC
150èC
-55èC
-40èC
0èC
25èC
85èC
125èC
150èC
4.995
4.99
4.985
4.98
4.975
50
25
0
0
25
50
75
Output Current (mA)
100
125
150
0
30
60 90
Output Current (mA)
120
150
VOUT = 5 V
VIN = 3 V
Figure 5. Load Regulation vs IOUT
Figure 6. Dropout Voltage (VDO) vs IOUT
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SBVS361 –APRIL 2020
Typical Characteristics (continued)
specified at TJ = –40°C to +150°C, VIN = 13.5 V, IOUT = 100 µA, COUT = 2.2 µF, 1 mΩ < COUT ESR < 2 Ω, CIN = 1 µF, and VEN
= 2 V (unless otherwise noted)
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
IOUT = 150 mA
IOUT = 100 mA
IOUT = 50 mA
IOUT = 10 mA
IOUT = 1mA
VIN = 5.5 V
VIN = 6 V
VIN = 7 V
VIN = 10 V
VIN = 13.5 V
10
100
1k
10k 100k
Frequency (Hz)
1M
10M
10
100
1k
10k 100k
Frequency (Hz)
1M
10M
COUT = 10 µF (X7R 50 V), VOUT = 5 V
COUT = 10 µF (X7R 50 V), IOUT = 150 mA, VOUT = 5 V
Figure 7. PSRR vs Frequency and IOUT
Figure 8. PSRR vs Frequency and VIN
45
40
35
30
25
20
15
10
5
0.25
0.2
200
150
100
50
640
560
480
400
320
240
160
80
VIN
VOUT
VOUT
IOUT
0.15
0.1
0.05
0
0
-50
-0.05
-0.1
-0.15
-0.2
-100
-150
-200
0
0
0
500
1000
1500
Time (ms)
2000
2500
3000
0
0.25
0.5
0.75
1
Time (ms)
1.25
1.5
1.75
2
VOUT = 5V, IOUT = 1 mA, VIN = 13.5 V to 45 V,
slew rate = 2.7 V/µs, VEN = 3.3 V
VOUT = 5 V, IOUT = 0 mA to 100 mA, slew rate = 1 A/µs,
VEN = 3.3 V
Figure 9. Line Transients
Figure 10. Load Transient, No Load to 100 mA
10
0
650
600
550
500
450
400
350
300
250
200
150
100
50
70
480
VOUT
IOUT
VOUT
IOUT
60
50
440
400
360
320
280
240
200
160
120
80
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
40
30
20
10
0
-10
-20
-30
-40
-50
40
0
0
0
50
100
150
Time (ms)
200
250
300
350
0
50 100 150 200 250 300 350 400 450 500
Time (ms)
VOUT = 5 V, IOUT = 0 mA to 100 mA, slew rate = 1 A/µs,
VEN = 3.3 V
VOUT = 5 V, IOUT = 100 mA to 0 mA, slew rate = 1 A/µs,
VEN = 3.3 V
Figure 11. Load Transient, No Load to 100-mA Rising Edge
Figure 12. Load Transient, No Load to 100-mA Falling Edge
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Typical Characteristics (continued)
specified at TJ = –40°C to +150°C, VIN = 13.5 V, IOUT = 100 µA, COUT = 2.2 µF, 1 mΩ < COUT ESR < 2 Ω, CIN = 1 µF, and VEN
= 2 V (unless otherwise noted)
25
20
15
10
5
400
360
320
280
240
200
160
120
80
25
20
15
10
5
400
360
320
280
240
200
160
120
80
VOUT
IOUT
VOUT
IOUT
0
0
-5
-5
-10
-15
-20
-25
-10
-15
-20
-25
40
40
0
0
0
0.25 0.5 0.75
1
1.25 1.5 1.75
Time (ms)
2
2.25 2.5
0
50
100
150
Time (ms)
200
250
300
350
VOUT = 5 V, IOUT = 50 mA to 100 mA, slew rate = 0.1 A/µs,
VEN = 3.3 V
VOUT = 5 V, IOUT = 50 mA to 100 mA, slew rate = 0.1 A/µs,
VEN = 3.3 V
Figure 13. Load Transient, 50 mA to 100 mA
Figure 14. Load Transient, 50-mA to 100-mA Rising Edge
25
20
15
10
5
400
360
320
280
240
200
160
120
80
80
70
60
50
40
30
20
10
800
750
700
650
600
550
500
450
400
350
300
250
200
150
100
50
VOUT
IOUT
VOUT
IOUT
0
0
-10
-20
-30
-40
-50
-60
-70
-80
-5
-10
-15
-20
-25
40
0
350
0
200 400 600 800 1000 1200 1400 1600 1800 2000
0
50
100
150
200
250
300
0
Time (ms)
Time (ms)
VOUT = 5 V, IOUT = 100 mA to 50 mA, slew rate = 0.1 A/µs,
VEN = 3.3 V
VOUT = 5 V, IOUT = 0 mA to 150 mA, slew rate = 1 A/µs,
VEN = 3.3 V
Figure 15. Load Transient, 50-mA to 100-mA Falling Edge
Figure 16. Load Transient, 0 mA to 150 mA
230
20
10
600
550
500
450
400
350
300
250
200
150
100
50
VOUT
IOUT
227.5
225
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
222.5
220
217.5
215
212.5
210
0
0
25 50 75 100 125 150 175 200 225 250 275 300
Time (ms)
-60 -40 -20
0
20 40 60 80 100 120 140 160
Temperature èC
VOUT = 5 V, IOUT = 0 mA to 150 mA, slew rate = 1 A/µs,
VEN = 3.3 V
VIN = VOUT + 1 V, VOUT = 90% × VOUT(NOM)
Figure 17. Load Transient, 0-mA to 150-mA Rising Edge
Figure 18. Current Limit vs Temperature
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Typical Characteristics (continued)
specified at TJ = –40°C to +150°C, VIN = 13.5 V, IOUT = 100 µA, COUT = 2.2 µF, 1 mΩ < COUT ESR < 2 Ω, CIN = 1 µF, and VEN
= 2 V (unless otherwise noted)
40
35
30
25
20
15
10
175
150
125
100
75
-55èC
-40èC
0èC
25èC
85èC
125èC
150èC
-55èC
-40èC
0èC
25èC
85èC
125èC
150èC
50
25
0
5
10
15
20 25
Input Voltage (V)
30
35
40
0
5
10
15
Input Voltage (V)
20
25
30
35
40
Figure 19. Quiescent Current (IQ) vs VIN
Figure 20. Quiescent Current (IQ) vs VIN
1.38
1.36
1.34
1.32
1.3
2.8
2.75
2.7
Falling Threshold
Rising Threshold
Falling Threshold
Rising Threshold
2.65
2.6
1.28
1.26
1.24
1.22
1.2
2.55
2.5
2.45
2.4
-60 -40 -20
0
20 40 60 80 100 120 140 160
Temperature (èC)
-60 -40 -20
0
20 40 60 80 100 120 140 160
Temperature (èC)
VPGADJ = 0 V
Figure 21. EN Threshold vs Temperature
Figure 22. Undervoltage Lockout (UVLO) Threshold vs
Temperature
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7 Detailed Description
7.1 Overview
The TPS7B84-Q1 is a low-dropout linear regulator (LDO) designed to connect to the battery in automotive
applications. The device has an input voltage range extending to 40 V, which allows the device to withstand
transients (such as load dumps) that are anticipated in automotive systems. With only a 20-µA quiescent current
at light loads, the device is an optimal solution for powering always-on components.
The device has a state-of-the-art transient response that allows the output to quickly react to changes in the load
or line (for example, during cold-crank conditions). Additionally, the device has a novel architecture that
minimizes output overshoot when recovering from dropout. During normal operation, the device has a tight DC
accuracy of ±1.5% over line, load, and temperature.
7.2 Functional Block Diagrams
IN
OUT
Current
Limit
Thermal
Shutdown
œ
+
UVLO
FB
EN
Bandgap
GND
Figure 23. Adjustable Output Block Diagram
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Functional Block Diagrams (continued)
IN
OUT
Current
Limit
R1
Thermal
Shutdown
œ
+
UVLO
R2
EN
Bandgap
GND
Figure 24. Fixed Output Block Diagram
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7.3 Feature Description
7.3.1 Enable (EN)
The enable pin for the device is an active-high pin. The output voltage is enabled when the voltage of the enable
pin is greater than the high-level input voltage of the EN pin and disabled with the enable pin voltage is less than
the low-level input voltage of the EN pin. If independent control of the output voltage is not needed, connect the
enable pin to the input of the device.
7.3.2 Undervoltage Lockout
The device has an independent undervoltage lockout (UVLO) circuit that monitors the input voltage, allowing a
controlled and consistent turn on and off of the output voltage. To prevent the device from turning off if the input
drops during turn on, the UVLO has hysteresis as specified in the Electrical Characteristics table.
7.3.3 Thermal Shutdown
The device contains a thermal shutdown protection circuit to disable the device when the junction temperature
(TJ) of the pass transistor rises to TSD(shutdown) (typical). Thermal shutdown hysteresis assures that the device
resets (turns on) when the temperature falls to TSD(reset) (typical).
The thermal time-constant of the semiconductor die is fairly short, thus the device may cycle on and off when
thermal shutdown is reached until power dissipation is reduced. Power dissipation during startup can be high
from large VIN – VOUT voltage drops across the device or from high inrush currents charging large output
capacitors. Under some conditions, the thermal shutdown protection disables the device before startup
completes.
For reliable operation, limit the junction temperature to the maximum listed in the Recommended Operating
Conditions table. Operation above this maximum temperature causes the device to exceed its operational
specifications. Although the internal protection circuitry of the device is designed to protect against thermal
overall conditions, this circuitry is not intended to replace proper heat sinking. Continuously running the device
into thermal shutdown or above the maximum recommended junction temperature reduces long-term reliability.
7.3.4 Current Limit
The device has an internal current limit circuit that protects the regulator during transient high-load current faults
or shorting events. The current limit is a brickwall scheme. In a high-load current fault, the brickwall scheme limits
the output current to the current limit (ICL). ICL is listed in the Electrical Characteristics table.
The output voltage is not regulated when the device is in current limit. When a current limit event occurs, the
device begins to heat up because of the increase in power dissipation. When the device is in brickwall current
limit, the pass transistor dissipates power [(VIN – VOUT) × ICL]. If thermal shutdown is triggered, the device turns
off. After the device cools down, the internal thermal shutdown circuit turns the device back on. If the output
current fault condition continues, the device cycles between current limit and thermal shutdown. For more
information on current limits, see the Know Your Limits application report.
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Feature Description (continued)
Figure 25 shows a diagram of the current limit.
VOUT
Brickwall
VOUT(NOM)
0 V
IOUT
IRATED
0 mA
ICL
Figure 25. Current Limit
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7.4 Device Functional Modes
7.4.1 Device Functional Mode Comparison
The Device Functional Mode Comparison table shows the conditions that lead to the different modes of
operation. See the Electrical Characteristics table for parameter values.
Table 1. Device Functional Mode Comparison
PARAMETER
OPERATING MODE
VIN
VEN
IOUT
TJ
Normal operation
Dropout operation
VIN > VOUT(nom) + VDO and VIN > VIN(min)
VIN(min) < VIN < VOUT(nom) + VDO
VEN > VEN(HI)
VEN > VEN(HI)
IOUT < IOUT(max)
IOUT < IOUT(max)
TJ < TSD(shutdown)
TJ < TSD(shutdown)
Disabled
(any true condition
disables the device)
VIN < VUVLO
VEN < VEN(LOW)
Not applicable
TJ > TSD(shutdown)
7.4.2 Normal Operation
The device regulates to the nominal output voltage when the following conditions are met:
•
•
•
•
The input voltage is greater than the nominal output voltage plus the dropout voltage (VOUT(nom) + VDO
The output current is less than the current limit (IOUT < ICL
The device junction temperature is less than the thermal shutdown temperature (TJ < TSD
The enable voltage has previously exceeded the enable rising threshold voltage and has not yet decreased to
less than the enable falling threshold
)
)
)
7.4.3 Dropout Operation
If the input voltage is lower than the nominal output voltage plus the specified dropout voltage, but all other
conditions are met for normal operation, the device operates in dropout mode. In this mode, the output voltage
tracks the input voltage. During this mode, the transient performance of the device becomes significantly
degraded because the pass transistor is in the ohmic or triode region, and acts as a switch. Line or load
transients in dropout can result in large output-voltage deviations.
When the device is in a steady dropout state (defined as when the device is in dropout, VIN < VOUT(NOM) + VDO
,
directly after being in a normal regulation state, but not during startup), the pass transistor is driven into the
ohmic or triode region. When the input voltage returns to a value greater than or equal to the nominal output
voltage plus the dropout voltage (VOUT(NOM) + VDO), the output voltage can overshoot for a short period of time
while the device pulls the pass transistor back into the linear region.
7.4.4 Disabled
The output of the device can be shutdown by forcing the voltage of the enable pin to less than the maximum EN
pin low-level input voltage (see the Electrical Characteristics table). When disabled, the pass transistor is turned
off, internal circuits are shutdown, and the output voltage is actively discharged to ground by an internal
discharge circuit from the output to ground.
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
8.1.1 Input and Output Capacitor Selection
The TPS7B84-Q1 requires an output capacitor of 2.2 µF or larger (1 µF or larger capacitance) for stability and an
equivalent series resistance (ESR) between 0.001 Ω and 2 Ω. For the best transient performance, use X5R- and
X7R-type ceramic capacitors because these capacitors have minimal variation in value and ESR over
temperature. When choosing a capacitor for a specific application, be mindful of the DC bias characteristics for
the capacitor. Higher output voltages cause a significant derating of the capacitor. For best performance, the
maximum recommended output capacitance is 220 µF.
Although an input capacitor is not required for stability, good analog design practice is to connect a capacitor
from IN to GND. Some input supplies have a high impedance, thus placing the input capacitor on the input
supply helps reduce the input impedance. This capacitor counteracts reactive input sources and improves
transient response, input ripple, and PSRR. If the input supply has a high impedance over a large range of
frequencies, several input capacitors can be used in parallel to lower the impedance over frequency. Use a
higher-value capacitor if large, fast, rise-time load transients are anticipated, or if the device is located several
inches from the input power source.
8.1.2 Adjustable Device Feedback Resistor Selection
The adjustable-version device requires external feedback divider resistors to set the output voltage. VOUT is set
using the feedback divider resistors, R1 and R2, according to the following equation:
VOUT = VFB × (1 + R1 / R2)
(1)
To ignore the FB pin current error term in the VOUT equation, set the feedback divider current to 100x the FB pin
current listed in the Electrical Characteristics table. This setting provides the maximum feedback divider series
resistance, as shown in the following equation:
R1 + R2 ≤ VOUT / (IFB × 100)
(2)
8.1.3 Feed-Forward Capacitor (CFF)
For the adjustable-voltage version device, a feed-forward capacitor (CFF) can be connected from the OUT pin to
the FB pin. CFF improves transient, noise, and PSRR performance, but is not required for regulator stability.
Recommended CFF values are listed in the Recommended Operating Conditions table. A higher capacitance CFF
can be used; however, the startup time increases. For a detailed description of CFF tradeoffs, see the Pros and
Cons of Using a Feedforward Capacitor with a Low-Dropout Regulator application report.
CFF and R1 form a zero in the loop gain at frequency fZ, while CFF, R1, and R2 form a pole in the loop gain at
frequency fP. CFF zero and pole frequencies can be calculated from the following equations:
fZ = 1 / (2 × π × CFF × R1)
(3)
(4)
fP = 1 / (2 × π × CFF × (R1 || R2))
8.1.4 Dropout Voltage
Dropout voltage (VDO) is defined as the input voltage minus the output voltage (VIN – VOUT) at the rated output
current (IRATED), where the pass transistor is fully on. IRATED is the maximum IOUT listed in the Recommended
Operating Conditions table. The pass transistor is in the ohmic or triode region of operation, and acts as a switch.
The dropout voltage indirectly specifies a minimum input voltage greater than the nominal programmed output
voltage at which the output voltage is expected to stay in regulation. If the input voltage falls to less than the
nominal output regulation, then the output voltage falls as well.
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Application Information (continued)
For a CMOS regulator, the dropout voltage is determined by the drain-source on-state resistance (RDS(ON)) of the
pass transistor. Therefore, if the linear regulator operates at less than the rated current, the dropout voltage for
that current scales accordingly. Use Equation 5 to calculate the RDS(ON) of the device.
VDO
RDS(ON)
=
IRATED
(5)
8.1.5 Reverse Current
Excessive reverse current can damage this device. Reverse current flows through the intrinsic body diode of the
pass transistor instead of the normal conducting channel. At high magnitudes, this current flow degrades the
long-term reliability of the device.
Conditions where reverse current can occur are outlined in this section, all of which can exceed the absolute
maximum rating of VOUT ≤ VIN + 0.3 V.
•
•
•
If the device has a large COUT and the input supply collapses with little or no load current
The output is biased when the input supply is not established
The output is biased above the input supply
If reverse current flow is expected in the application, external protection is recommended to protect the device.
Reverse current is not limited in the device, so external limiting is required if extended reverse voltage operation
is anticipated.
8.1.6 Power Dissipation (PD)
Circuit reliability requires consideration of the device power dissipation, location of the circuit on the printed circuit
board (PCB), and correct sizing of the thermal plane. The PCB area around the regulator must have few or no
other heat-generating devices that cause added thermal stress.
To first-order approximation, power dissipation in the regulator depends on the input-to-output voltage difference
and load conditions. Equation 6 calculates power dissipation (PD).
PD = (VIN – VOUT) × IOUT
(6)
NOTE
Power dissipation can be minimized, and therefore greater efficiency can be achieved, by
correct selection of the system voltage rails. For the lowest power dissipation use the
minimum input voltage required for correct output regulation.
For devices with a thermal pad, the primary heat conduction path for the device package is through the thermal
pad to the PCB. Solder the thermal pad to a copper pad area under the device. This pad area must contain an
array of plated vias that conduct heat to additional copper planes for increased heat dissipation.
The maximum power dissipation determines the maximum allowable ambient temperature (TA) for the device.
According to Equation 7, power dissipation and junction temperature are most often related by the junction-to-
ambient thermal resistance (RθJA) of the combined PCB and device package and the temperature of the ambient
air (TA).
TJ = TA + (RθJA × PD)
(7)
Thermal resistance (RθJA) is highly dependent on the heat-spreading capability built into the particular PCB
design, and therefore varies according to the total copper area, copper weight, and location of the planes. The
junction-to-ambient thermal resistance listed in the Thermal Information table is determined by the JEDEC
standard PCB and copper-spreading area, and is used as a relative measure of package thermal performance.
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Application Information (continued)
8.1.6.1 Thermal Performance vs Copper Area
The most used thermal resistance parameter RθJA is highly dependent on the heat-spreading capability built into
the particular PCB design, and therefore varies according to the total copper area, copper weight, and location of
the planes. The RθJA recorded in the TBD table is determined by the JEDEC standard as shown in Figure 26,
PCB, and copper-spreading area, and is only used as a relative measure of package thermal performance. Note
that for a well-designed thermal layout, RθJA is actually the sum of the package junction-to-case (bottom) thermal
resistance (RθJCbot) plus the thermal resistance contribution by the PCB copper.
Mold
Compound
Die
Wire
Die
Attach
2oz
Signal
Trace
Lead
Frame
Internal Signal
or power plane
1oz copper
Thermal
Pad or Tab
of the LDO
Internal
GND plane
1oz copper
Bottom
Relief
2oz copper
Thermal
Vias
Figure 26. JEDEC Standard 2s2p PCB
Figure 27 and Figure 28 show the functions of RθJA and ψJB versus copper area and thickness. These plots are
generated with a 101.6-mm x 101.6-mm x 1.6-mm PCB of two and four layers. For the four-layer board, the inner
planes use a 1-oz copper thickness. Outer layers are simulated with both a 1-oz and 2-oz copper thickness. A
TBD array of thermal vias of 300-µm drill diameter and 25-µm Cu plating is located beneath the thermal pad of
the device. The thermal vias connect the top layer, the bottom layer and, in the case of the 4-layer board, the first
inner GND plane. Each of the layers has a copper plane of equal area.
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Application Information (continued)
115
105
95
85
75
65
55
45
35
25
4 Layer PCB, 1 oz copper
4 Layer PCB, 2 oz copper
2 Layer PCB, 1 oz copper
2 Layer PCB, 2 oz copper
0
10
20
30
40
50
60
70
80
90 100
Cu Area Per Layer (cm2)
Figure 27. RθJA vs Copper Area 2s2p DRB Package
26
4 Layer PCB, 1 oz copper
4 Layer PCB, 2 oz copper
2 Layer PCB, 1 oz copper
2 Layer PCB, 2 oz copper
22
24
20
18
16
14
12
0
10
20
30
40
50
60
70
80
90 100
Cu Area Per Layer (cm2)
Figure 28. R ψJB vs Copper Area 2s2p DRB Package
8.1.7 Estimating Junction Temperature
The JEDEC standard now recommends the use of psi (Ψ) thermal metrics to estimate the junction temperatures
of the linear regulator when in-circuit on a typical PCB board application. These metrics are not thermal
resistance parameters and instead offer a practical and relative way to estimate junction temperature. These psi
metrics are determined to be significantly independent of the copper area available for heat-spreading. The
Thermal Information table lists the primary thermal metrics, which are the junction-to-top characterization
parameter (ψJT) and junction-to-board characterization parameter (ψJB). These parameters provide two methods
for calculating the junction temperature (TJ). As described in , use the junction-to-top characterization parameter
(ψJT) with the temperature at the center-top of device package (TT) to calculate the junction temperature. As
described in , use the junction-to-board characterization parameter (ψJB) with the PCB surface temperature 1 mm
from the device package (TB) to calculate the junction temperature.
TJ = TT + ψJT × PD
where:
•
•
PD is the dissipated power
TT is the temperature at the center-top of the device package
(8)
TJ = TB + ψJB × PD
where
•
TB is the PCB surface temperature measured 1 mm from the device package and centered on the package
edge
(9)
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Application Information (continued)
For detailed information on the thermal metrics and how to use them, see the Semiconductor and IC Package
Thermal Metrics application report.
8.2 Typical Application
Figure 29 shows a typical application circuit for the TPS7B84-Q1. Use different values of external components,
depending on the end application. An application may require a larger output capacitor during fast load steps in
order to prevent a reset from occurring. TI recommends a low-ESR ceramic capacitor with a dielectric of type
X5R or X7R.
TPS7B84xx-Q1
VI
Vo
V
bat
V
reg
10 …F
0.1 …F
R2
R1
FB
GND
Figure 29. Typical Application Schematic for the TPS7B84-Q1
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Typical Application (continued)
8.2.1 Design Requirements
For this design example, use the parameters listed in Table 2 as the input parameters.
Table 2. Design Parameters
DESIGN PARAMETER
Input voltage range
Output voltage
EXAMPLE VALUE
6 V to 40 V
5 V
Output current
100 mA
10 µF
Output capacitor
8.2.2 Detailed Design Procedure
8.2.2.1 Input Capacitor
The device requires an input decoupling capacitor, the value of which depends on the application. The typical
recommended value for the decoupling capacitor is 1 µF. The voltage rating must be greater than the maximum
input voltage.
8.2.2.2 Output Capacitor
The device requires an output capacitor to stabilize the output voltage. The capacitor value must be between 2.2
µF and 200 µF and the ESR range must be between 1 mΩ and 2 Ω. For this design a low ESR, 10-µF ceramic
capacitor was used to improve transient performance.
9 Power Supply Recommendations
This device is designed for operation from an input voltage supply with a range between 3 V and 40 V. This input
supply must be well regulated. If the input supply is located more than a few inches from the TPS7B84-Q1, add
an electrolytic capacitor with a value of 22 µF and a ceramic bypass capacitor at the input.
10 Layout
10.1 Layout Guidelines
For best overall performance, place all circuit components on the same side of the circuit board and as near as
practical to the respective LDO pin connections. Place ground return connections to the input and output
capacitor, and to the LDO ground pin as close as possible to each other, connected by a wide, component-side,
copper surface. The use of vias and long traces to the input and output capacitors is strongly discouraged and
negatively affects system performance. TI also recommends a ground reference plane either embedded in the
PCB itself or located on the bottom side of the PCB opposite the components. This reference plane serves to
assure accuracy of the output voltage, shield noise, and behaves similarly to a thermal plane to spread (or sink)
heat from the LDO device when connected to the thermal pad. In most applications, this ground plane is
necessary to meet thermal requirements.
10.1.1 Package Mounting
Solder pad footprint recommendations for the TPS7B84-Q1 are available at the end of this document and at
www.ti.com.
10.1.2 Board Layout Recommendations to Improve PSRR and Noise Performance
As depicted in Figure 30 and Figure 31, place the input and output capacitors close to the device for the layout of
the TPS7B84-Q1. In order to enhance the thermal performance, place as many vias as possible around the
device. These vias improve the heat transfer between the different GND planes in the PCB.
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Layout Guidelines (continued)
To improve ac performance such as PSRR, output noise, and transient response, TI recommends a board
design with separate ground planes for VIN and VOUT, with each ground plane connected only at the GND pin
of the device. In addition, the ground connection for the output capacitor must connect directly to the GND pin of
the device.
Minimize equivalent series inductance (ESL) and ESR in order to maximize performance and ensure stability.
Place each capacitor as close as possible to the device and on the same side of the PCB as the regulator itself.
Do not place any of the capacitors on the opposite side of the PCB from where the regulator is installed. TI
strongly discourages the use of vias and long traces to connect the capacitors because they may impact system
performance negatively and even cause instability.
If possible, and to ensure the maximum performance specified in this document, use the same layout pattern
used for the TPS7B84-Q1 evaluation board, available at www.ti.com.
10.2 Layout Examples
GND
EN
VIN
VOUT
Denotes a via
Figure 30. SOT-223 (DCY) Layout
OUT
IN
EN
FB/NC
GND
Denotes a via
Figure 31. VSON (DRB) Layout
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11 Device and Documentation Support
11.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
11.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
6-May-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
PTPS7B8401QWDRBRQ1
PTPS7B8433QWDRBRQ1
PTPS7B8450QWDRBRQ1
ACTIVE
SON
SON
SON
DRB
8
8
8
3000
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
-40 to 150
-40 to 150
-40 to 150
ACTIVE
ACTIVE
DRB
DRB
3000
3000
TPS7B8401QWDRBRQ1
TPS7B8433QWDRBRQ1
TPS7B8450QWDRBRQ1
PREVIEW
PREVIEW
PREVIEW
SON
SON
SON
DRB
DRB
DRB
8
8
8
3000
3000
3000
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
-40 to 150
-40 to 150
-40 to 150
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
6-May-2020
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
TPS7B84-Q1
www.ti.com
SBVS361 –APRIL 2020
PACKAGE OUTLINE
DRC0010U
VSON - 1 mm max height
SCALE 4.000
PLASTIC SMALL OUTLINE - NO LEAD
3.1
2.9
B
A
PIN 1 INDEX AREA
3.1
2.9
0.1 MIN
(0.13)
S
C
A
S
E
C
30.
I
0
N
0
A
-
SECTION A-A
TYPICAL
1.0
0.8
C
SEATING PLANE
0.08 C
0.05
0.00
1.65 0.1
2X (0.5)
4X (0.25)
(0.2) TYP
EXPOSED
THERMAL PAD
5
6
(0.16) TYP
A
A
2X
2
11
SYMM
2.4 0.1
10
1
8X 0.5
0.3
0.2
10X
SYMM
10X
PIN 1 ID
(OPTIONAL)
0.1
C A B
C
0.05
0.5
0.3
4225163/A 07/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.
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Product Folder Links: TPS7B84-Q1
TPS7B84-Q1
SBVS361 –APRIL 2020
www.ti.com
EXAMPLE BOARD LAYOUT
DRC0010U
VSON - 1 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
(1.65)
(0.5)
10X (0.6)
1
10
10X (0.25)
11
(2.4)
SYMM
(3.4)
(0.95)
8X (0.5)
6
5
(R0.05) TYP
( 0.2) VIA
TYP
(0.25)
(0.575)
SYMM
(2.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:20X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
EXPOSED METAL
EXPOSED METAL
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4225163/A 07/2019
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
24
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Copyright © 2020, Texas Instruments Incorporated
Product Folder Links: TPS7B84-Q1
TPS7B84-Q1
www.ti.com
SBVS361 –APRIL 2020
EXAMPLE STENCIL DESIGN
DRC0010U
VSON - 1 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
2X (1.5)
(0.5)
SYMM
EXPOSED METAL
TYP
11
10X (0.6)
1
10
(1.53)
10X (0.25)
2X
(1.06)
SYMM
(0.63)
8X (0.5)
6
5
(R0.05) TYP
4X (0.34)
4X (0.25)
(2.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 11:
80% PRINTED SOLDER COVERAGE BY AREA
SCALE:25X
4225163/A 07/2019
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
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Submit Documentation Feedback
25
Product Folder Links: TPS7B84-Q1
PACKAGE OUTLINE
VSON - 1 mm max height
DRB0008J
PLASTIC QUAD FLAT PACK- NO LEAD
3.1
2.9
B
A
PIN 1 INDEX AREA
3.1
2.9
0.1 MIN
(0.13)
SECTION A-A
TYPICAL
1 MAX
C
SEATING PLANE
0.08 C
0.05
0.00
1.75
1.55
(0.2) TYP
6X 0.65
(0.19)
4
5
SYMM
9
2.5
2.3
1.95
1
8
0.36
0.26
8X
PIN 1 ID
(OPTIONAL)
0.1
0.05
C A B
C
SYMM
0.5
0.3
8X
4225036/A 06/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
VSON - 1 mm max height
DRB0008J
PLASTIC QUAD FLAT PACK- NO LEAD
(2.8)
(1.65)
8X (0.6)
8X (0.31)
SYMM
1
8
6X (0.65)
SYMM
9
(1.95) (2.4)
(0.95)
(R0.05) TYP
4
5
(Ø 0.2) VIA
TYP
(0.575)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 20X
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
METAL
SOLDER MASK
OPENING
EXPOSED METAL
EXPOSED METAL
SOLDER MASK
OPENING
METAL
NON- SOLDER MASK
SOLDER MASK
DEFINED
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4225036/A 06/2019
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
VSON - 1 mm max height
DRB0008J
PLASTIC QUAD FLAT PACK- NO LEAD
(2.8)
2X
(1.51)
8X (0.6)
8X (0.31)
SYMM
1
8
2X
(1.06)
6X (0.65)
SYMM
(1.95)
(0.63)
9
(R0.05) TYP
4
5
METAL
TYP
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD
81% PRINTED COVERAGE BY AREA
SCALE: 20X
4225036/A 06/2019
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
PACKAGE OPTION ADDENDUM
www.ti.com
6-Nov-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
PTPS7B8401QWDRBRQ1
PTPS7B8433QWDRBRQ1
PTPS7B8450QWDRBRQ1
TPS7B8401QWDRBRQ1
ACTIVE
ACTIVE
SON
SON
SON
SON
DRB
DRB
DRB
DRB
8
8
8
8
3000
3000
3000
3000
TBD
TBD
TBD
Call TI
Call TI
Call TI
-40 to 150
-40 to 150
-40 to 150
-40 to 150
Call TI
Call TI
ACTIVE
Call TI
PREVIEW
Green (RoHS
& no Sb/Br)
NIPDAU
Level-2-260C-1 YEAR
7B8401
TPS7B8433QDCYRQ1
TPS7B8433QWDRBRQ1
TPS7B8450QDCYRQ1
TPS7B8450QWDRBRQ1
PREVIEW
PREVIEW
PREVIEW
PREVIEW
SOT-223
SON
DCY
DRB
DCY
DRB
4
8
4
8
2500
3000
2500
3000
Green (RoHS
& no Sb/Br)
NIPDAU
NIPDAU
NIPDAU
NIPDAU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
-40 to 150
-40 to 150
-40 to 150
-40 to 150
7B8433
7B8433
7B8450
7B8450
Green (RoHS
& no Sb/Br)
SOT-223
SON
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
6-Nov-2020
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
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TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
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