TPS92633-Q1 [TI]
具有热共享和非板载分级功能的汽车类三通道高侧 LED 驱动器;
| 型号： | TPS92633-Q1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有热共享和非板载分级功能的汽车类三通道高侧 LED 驱动器 驱动 驱动器 |
| 文件： | 总49页 (文件大小：5405K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS92633-Q1
ZHCSMI7A –DECEMBER 2020 –REVISED MAY 2021
具有热共享和非板载分级功能的TPS92633-Q1 三通道汽车高侧LED 驱动器
1 特性
2 应用
• 符合面向汽车应用的AEC-Q100 标准：
• 车外尾灯：尾灯、中央高位刹车灯、侧标志灯
• 车外小灯：门把手、盲点检测指示灯、充电口
• 车内灯：顶灯、阅读灯
– 温度等级1: –40 ° C 至125 ° C 、T A
• 宽输入电压范围：4.5V 至40V
• 通过外部分流电阻器实现热共享功能
• 故障模式下具有低电源电流
• 通用LED 驱动器应用
3 说明
• 三通道高精度电流调节：
TPS92633-Q1 三通道 LED 驱动器采用独特的热管理
设计，可减少器件温升。TPS92633-Q1 是由汽车电池
直接供电的线性驱动器，具有宽电压范围，每个通道可
输出高达 150mA 的满电流负载。外部分流电阻器可用
来共享输出电流并由驱动器驱动。TPS92633-Q1 还驱
动 LED 单元和非板载亮度分级电阻器，从而简化制造
过程并降低整体系统成本。它具有全面的诊断功能，包
括LED 开路、LED 接地短路和单个LED 短路检测。
– 每个通道的电流输出高达150mA
– 在整个温度范围内精度为±5%
– 通过电阻器独立设置电流
– 用于亮度控制的独立PWM 引脚
– 支持非板载亮度分级电阻
– 支持外部NTC 进行电流降额
• 低压降：
– 最大压降：150mA 时为600mV
• 诊断和保护
TPS92633-Q1 器件的连带失效功能可与其他 LED 驱
动 器 （ 如 TPS9261x-Q1 、 TPS92630/8-Q1 和
TPS92830-Q1 器件）一起工作，从而满足不同的要
求。
– LED 开路，具有自动恢复功能
– LED 接地短路，具有自动恢复功能
– 单LED 短路检测及自动恢复
– 支持诊断并具有可调阈值
– 可配置为连带失效或仅失效通道关闭的故障总线
器件信息
封装(1)
封装尺寸（标称值）
器件型号
(N-1)
– 热关断
TPS92633-Q1
HTSSOP (20)
6.50mm × 4.40mm
• 工作结温范围：–40°C 至150°C
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
4
4.5V to 40V
TPS92633-Q1
C(OUT1)
C(OUT2)
C(OUT3)
P(DEVICE) R(RESx) = 82 W
P(RESx) R(RESx) = 82 W
P(DEVICE) R(RESx) = 64.9 W
P(RESx) R(RESx) = 64.9 W
R(RES1)
R(RES2)
R(RES3)
SUPPLY
RES1
3.2
EN
IN1
IN2
IN3
C(SUPPLY)
OUT1
RES2
R(SNS1)
R(SNS2)
R(SNS3)
2.4
OUT2
RES3
OUT3
DIAGEN
PWM1
PWM2
1.6
0.8
0
R(ICTRL2)
C(IREF)
GND
LED Board
R(IREF)
IREF
R(SLS_REF)
SLS_REF
PWM3
FAULT
R(ICTRL1)
ICTRL
4
8
12 16
Supply Voltage (V)
20
24
C(ICTRL)
器件功耗
典型应用图
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLVSF65
TPS92633-Q1
ZHCSMI7A –DECEMBER 2020 –REVISED MAY 2021
www.ti.com.cn
Table of Contents
7.4 Device Functional Modes..........................................30
8 Application and Implementation..................................31
8.1 Application Information............................................. 31
8.2 Typical Applications.................................................. 31
9 Power Supply Recommendations................................38
10 Layout...........................................................................39
10.1 Layout Guidelines................................................... 39
10.2 Layout Example...................................................... 39
11 Device and Documentation Support..........................40
11.1 接收文档更新通知................................................... 40
11.2 支持资源..................................................................40
11.3 Trademarks............................................................. 40
11.4 Electrostatic Discharge Caution..............................40
11.5 Glossary..................................................................40
12 Mechanical, Packaging, and Orderable
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 4
6.1 Absolute Maximum Ratings ....................................... 4
6.2 ESD Ratings .............................................................. 4
6.3 Recommended Operating Conditions ........................4
6.4 Thermal Information ...................................................4
6.5 Electrical Characteristics ............................................5
6.6 Timing Requirements .................................................6
6.7 Typical Characteristics................................................8
7 Detailed Description......................................................12
7.1 Overview...................................................................12
7.2 Functional Block Diagram.........................................12
7.3 Feature Description...................................................12
Information.................................................................... 41
4 Revision History
注：以前版本的页码可能与当前版本的页码不同
Changes from Revision * (December 2020) to Revision A (May 2021)
Page
• 将状态从“预告信息”更改为“量产数据”....................................................................................................... 1
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5 Pin Configuration and Functions
SUPPLY
EN
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
RES1
OUT1
RES2
OUT2
RES3
OUT3
GND
IN1
IN2
IN3
Thermal
Pad
DIAGEN
PWM1
PWM2
PWM3
FAULT
IREF
SLS_REF
ICTRL
Not to scale
图5-1. PWP Package 20-Pin HTSSOP With PowerPAD™ Package Top View
表5-1. Pin Functions
PIN
I/O
DESCRIPTION
NAME
SUPPLY
EN
NO.
1
I
I
I
I
I
Device power supply.
2
Device enable pin.
IN1
3
Current input for channel 1.
Current input for channel 2.
Current input for channel 3.
IN2
4
IN3
5
Enable pin for LED open-circuit detection and single LED short detection to avoid false open
and single LED short diagnostics during low-dropout operation.
DIAGEN
6
I
PWM1
PWM2
7
8
I
I
PWM input for OUT1 and RES1 current output ON/OFF control.
PWM input for OUT2 and RES2 current output ON/OFF control.
PWM input for OUT3 and RES3 current output ON/OFF control.
Fault output, support one-fails–all-fail fault bus.
PWM3
9
I
FAULT
10
11
12
I/O
O
O
ICTRL
Resistor programmable voltage reference pin for LED binning resistor or NTC resistor.
Resistor programmable voltage reference pin for single LED short threshold.
SLS_REF
Current reference pin. A 12.3-kΩresistor is recommended to be connected between IREF
pin and ground.
IREF
13
O
GND
OUT3
RES3
OUT2
RES2
OUT1
RES1
14
15
16
17
18
19
20
Ground.
—
O
O
O
O
O
O
Current output for channel 3. A 10-nF capacitor is recommended between the pin to GND.
Current output for channel 3 with external thermal resistor.
Current output for channel 2. A 10-nF capactitor is recommended between the pin to GND.
Current output for channel 2 with external thermal resistor.
Current output for channel 1. A 10-nF capacitor is recommended between the pin to GND.
Current output for channel 1 with external thermal resistor.
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
–0.3
–0.3
–0.3
–0.3
–40
–40
MAX
UNIT
V
Supply
SUPPLY
45
V(SUPPLY)+0.3
V(SUPPLY)+0.3
V(SUPPLY)+0.3
5.5
High-voltage input
High-voltage output
Fault bus
DIAGEN, IN1, IN2, IN3, EN, PWM1, PWM2, PMW3
OUT1, OUT2, OUT3, RES1, RES2, RES3, ICTRL
FAULT
V
V
V
Low-voltage pin
TJ
SLS_REF, IREF
V
Operating junction temperature
Storage temperature
150
°C
°C
Tstg
150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
6.2 ESD Ratings
VALUE
±2000
±500
UNIT
Human-body model (HBM), per AEC Q100-002(1)
HBM ESD Classification Level
V(ESD)
Electrostatic discharge
All pins
V
Charged-device model (CDM), per AEC
Q100-011
Corner pins (SUPPLY,
RES1, FAULT, ICTRL)
±750
CDM ESD Classification Level
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
SUPPLY
IN1, IN2, IN3
EN
Device supply voltage
Sense voltage
4.5
40
V
V
V
V
V
V(SUPPLY) - V(CS_REG)
Device EN pin
0
0
0
V(SUPPLY)
V(SUPPLY)
V(SUPPLY)
PWM1, PWM2, PWM3 PWM inputs
DIAGEN
Diagnostics enable pin
OUT1, OUT2, OUT3,
RES1, RES2, RES3
Driver output
0
V(SUPPLY)
V
FAULT
ICTRL
SLS_REF
IREF
Fault bus
0
0
V(SUPPLY)
2.75
V
V
Output current control
Single LED short-circuit reference
Current reference
0
3.5
V
50
250
µA
°C
Operating ambient temperature, TA
125
–40
6.4 Thermal Information
TPS92633-Q1
THERMAL METRIC(1)
PWP
20 PINS
40.1
UNIT
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
34
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6.4 Thermal Information (continued)
TPS92633-Q1
THERMAL METRIC(1)
PWP
20 PINS
18.3
UNIT
RθJB
ψJT
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
1.1
18.2
ψJB
RθJC(bot)
5.6
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application
report.
6.5 Electrical Characteristics
V(SUPPLY) = 5 V to 40 V, V(EN) = 5V, TJ = –40°C to +150°C unless otherwise noted
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
BIAS
V(POR_rising)
V(POR_falling)
I(SD)
Supply voltage POR rising threshold
Supply voltage POR falling threshold
Device shutdown current
3.6
3.4
14
4
V
V
3.0
V(EN) = 0 V
26
µA
I(Quiescent)
Device standby ground current
PWM = HIGH
1.5
2.5 mA
PWM = HIGH, FAULT externally pulled
LOW
I(Fault)
Device supply current in fault mode
0.21 0.330
0.45 mA
LOGIC INPUTS (EN, DIAGEN, PWM)
VIL(EN)
Input logic-low voltage, EN
Input logic-high voltage, EN
EN pulldown current
0.7
4.5
V
V
VIH(EN)
2.0
I(EN_pulldown)
VIL(DIAGEN)
VIH(DIAGEN)
VIL(PWM)
VIH(PWM)
V(EN) = 12 V
1.5
1.045
1.14
3.3
µA
V
Input logic-low voltage, DIAGEN
Input logic-high voltage, DIAGEN
Input logic-low voltage, PWM
Input logic-high voltage, PWM
1.1 1.155
1.2 1.26
1.1 1.155
V
1.045
1.14
V
1.2
1.26
V
CONSTANT-CURRENT DRIVER
I(OUTx_Tot) Device output-current for each channel
100% duty cycle
5
46
150 mA
54
50
100
200
400
TA = –40°C to +125°C, ICTRL ground
TA = –40°C to +125°C, V(ICTRL) = 0.68 V
TA = –40°C to +125°C, V(ICTRL) = 1.365 V
TA = –40°C to +125°C, V(ICTRL) = 2.75 V
95
105
mV
208
V(CS_REG)
Sense-resistor regulation voltage
Channel to channel mismatch
192
384
416
ΔV(CS_c2c) = 1 –V(CS_REGx)/Vavg(CS_REG)
V(ICTRL) = 0.68 V
,
+3
%
–3
–3
–4
ΔV(CS_c2c)
ΔV(CS_c2c) = 1 –V(CS_REGx)/Vavg(CS_REG)
V(ICTRL) = 1.365 V
,
+3
ΔV(CS_d2d) = 1 –Vavg(CS_REG)
Vnom(CS_REG), V(ICTRL) = 0.68 V
/
+4
%
Device to device mismatch
Sense-resistor range
ΔV(CS_d2d)
ΔV(CS_d2d) = 1 –Vavg(CS_REG)
Vnom(CS_REG), V(ICTRL) = 1.365 V
/
+4
–4
R(CS_REG)
0.65
20
400
600
600
900
Ω
current setting of 100 mA
current setting of 150 mA
current setting of 100 mA
current setting of 150 mA
200
300
280
400
Voltage dropout from INx to OUTx, RESx
open
mV
V(DROPOUT)
Voltage dropout from INx to RESx, OUTx
open
mV
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6.5 Electrical Characteristics (continued)
V(SUPPLY) = 5 V to 40 V, V(EN) = 5V, TJ = –40°C to +150°C unless otherwise noted
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
I(RESx)
Ratio of RESx current to total current
IREF voltage
95
%
I(RESx)/I(OUTx_Tot), V(INx) –V(RESx) > 1 V
V(IREF)
1.235
10
V
N(ICTRL)
ICTRL current output ratio
ICTRL saturated voltage
I(ICTRL)/I(IREF)
9.7
10.3
V
V(ICTRL_SAT)
V(CS_SAT)
V(CS_REG) = 400 mV
V(ICTRL) = 3 V
2.75
400
mV
V
(SUPPLY) –V(IN)
DIAGNOSTICS
V(OPEN_th_rising)
V(OPEN_th_falling)
180
300
450
420 mV
mV
LED open rising threshold, V(IN) –V(OUT)
LED open falling threshold, V(IN) –V(OUT)
Channel output short-to-ground rising
threshold
V(SG_th_rising)
V(SG_th_falling)
1.14
1.2
1.26
V
V
Channel output short-to-ground falling
threshold
0.855
0.9 0.945
N(SLS_REF)
N(OUT)
SLS_REF current output ratio
OUT voltage attenuation ratio
I(SLS_REF)/I(IREF)
0.97
3.84
1
4
1.03
4.16
V(OUT) = 3 to 14 V.
Channel output V(OUT) short-to-ground
retry current
I(Retry)
0.64
1.08 1.528 mA
I(IREF_OPEN_th)
IREF open threshold
8
0.6
µA
V
V(IREF_SHORT_th) IREF short-to-ground threshold
I(IREF_ST_Clamp) Current clamp for IREF shor-to-GND
FAULT
418
µA
VIL(FAULT)
Logic input low threshold
0.7
V
V
VIH(FAULT)
Logic input high threshold
2
t(FAULT_rising)
t(FAULT_falling)
Fault detection rising edge deglitch time
Fault detection falling edge deglitch time
10
10
3
µs
µs
mA
µA
µA
I(FAULT_pulldown) FAULT internal pulldown current
V(FAULT) = 0.4 V
V(FAULT) = 40 V
2
6
4
14
2
I(FAULT_pullup)
FAULT internal pullup current
FAULT leakage current
10
1
I(FAULT_leakage)
THERMAL PROTECTION
Thermal shutdown junction temperature
threshold
T(TSD)
157
172
15
187
°C
°C
Thermal shutdown junction temperature
hysteresis
T(TSD_HYS)
6.6 Timing Requirements
MIN
NOM
MAX UNIT
PWM rising edge delay, VIH(PWM) voltage to 10% of output when V(SUPPLY) = 12 V,
V(OUT) = 6 V, V(CS_REG) = 100 mV, R(SNSx) = 0.665 Ω and R(RESx) = 56 Ω, t1 as shown
in 图7-5
3
µs
t(PWM_delay_rising)
PWM rising edge delay, VIH(PWM) voltage to 10% of output when V(SUPPLY) = 12 V,
V(OUT) = 6V, V(CS_REG) = 50 mV, R(SNSx) = 0.665 Ω and R(RESx) = 56 Ω, t1 as shown
in 图7-5
4
µs
Output current rising from 10% to 90% when V(SUPPLY) = 12 V, V(OUT) = 6 V, V(CS_REG)
= 100 mV, R(SNSx) = 0.665 Ω and R(RESx) = 56 Ω, t2 as shown in 图7-5
2
µs
µs
t(Current_rising)
Output current rising from 10% to 90% when V(SUPPLY) = 12 V, V(OUT) = 6 V, V(CS_REG)
= 50 mV, R(SNSx) = 0.665 Ω and R(RESx) = 56 Ω, t2 as shown in 图7-5
2.5
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6.6 Timing Requirements (continued)
MIN
NOM
MAX UNIT
PWM falling edge delay, VIL(PWM) voltage to 90% of output current when V(SUPPLY) = 12
V, V(OUT) = 6 V, V(CS_REG) = 100 mV, R(SNSx) = 0.665 Ω and R(RESx) = 56 Ω, t3 as
shown in 图7-5
2.4
µs
t(PWM_delay_falling)
PWM falling edge delay, VIL(PWM) voltage to 90% of output current when V(SUPPLY) = 12
V, V(OUT) = 6 V, V(CS_REG) = 50 mV, R(SNSx) = 0.665 Ω and R(RESx) = 56 Ω, t3 as shown
in 图7-5
2.6
µs
Output current falling from 90% to 10% when V(SUPPLY) = 12 V, V(OUT) = 6 V, V(CS_REG)
= 100 mV, R(SNSx) = 0.665 Ω and R(RESx) = 56 Ω, t4 as shown in 图7-5
5
1
µs
µs
µs
t(Current_falling)
Output current falling from 90% to 10% when V(SUPPLY) = 12 V, V(OUT) = 6 V, V(CS_REG)
= 50 mV, R(SNSx) = 0.665Ω and R(RESx) = 56 Ω, t4 as shown in 图7-5
SUPPLY rising edge to 10% output current when C(IREF) = C(ICTRL)= 10 pF, V(OUT) = 6
V, V(CS_REG) = 100 mV, R(SNSx) = 0.665 Ω and R(RESx) = 56 Ω, t5 as shown in 图7-5
t(STARTUP)
85
t(IREF_deg)
IREF pin open and short to GND detection deglitch time
125
125
125
125
135
10000
300
50
µs
µs
µs
µs
µs
µs
µs
µs
µs
µs
t(OPEN_deg)
LED-open fault-deglitch time, t7 as shown in 图7-8
t(SG_deg)
Output short-to-ground detection deglitch time, t8 as shown in 图7-7
Open and Short fault recovery deglitch time, t10 as shown in 图7-8 and 图7-7
Single LED short-circuit detection deglitch time, t9 as shown in 图7-10
Single LED short-circuit failure retry interval time, t11 as shown in 图7-10
Single LED short-circuit failure retry period time, t12 as shown in 图7-10
Single LED short-circuit failure retry deglitch time, t13 as shown in 图7-10
Fault recovery delay time, t14 as shown in 图7-8, 图7-7 and 图7-10
Thermal over temperature deglitch time
t(Recover_deg)
t(SLS_deg)
t(SLS_retry_interval)
t(SLS_retry_period)
t(SLS_retry_deg)
t(FAULT_recovery)
t(TSD_deg)
50
50
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6.7 Typical Characteristics
225
225
200
175
150
125
100
75
I(OUTx_Tot) = 50 mA
I(OUTx_Tot) = 100 mA
I(OUTx_Tot) = 150 mA
I(OUTx_Tot) = 50mA
I(OUTx_Tot) = 100mA
I(OUTx_Tot) = 150mA
200
175
150
125
100
75
50
50
25
25
0
0
4
8
12 16
Supply Voltage (V)
20
24
-40
-20
0
20
40
60
80
100 120 140
Temperature (oC)
图6-1. Output Current vs Supply Voltage
图6-2. Output Current vs Temperature
225
200
175
150
125
100
75
225
200
175
150
125
100
75
I(OUTx_Tot) = 150 mA -40oC
I(OUTx_Tot) = 150 mA 25oC
I(OUTx_Tot) = 150 mA 125oC
I(OUTx_Tot) = 50 mA
I(OUTx_Tot) = 100 mA
I(OUTx_Tot) = 150 mA
50
50
25
25
0
0
0
0.4
0.8 1.2
Dropout Voltage (V)
1.6
2
0
0.4
0.8 1.2
Dropout Voltage (V)
1.6
2
图6-3. Output Current vs Dropout Voltage
图6-4. Output Current vs Dropout Voltage
0.6
0.5
0.4
0.3
0.2
0.1
0
100
10
1
Temperature = -40oC
Temperature = 25oC
Temperature = 125oC
0.1
0
0.5
1
1.5 2
ICTRL Voltage (V)
2.5
3
3.5
0.1
1 10
Input PWM Duty Cycle (%)
100
图6-5. V(CS_REG) vs ICTRL Voltage
图6-6. PWM Output Duty Cycle vs PWM Input Duty Cycle
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6.7 Typical Characteristics (continued)
Ch1 = V(SUPPLY)
Ch4 = V(OUT1)
Ch2 = V(EN)
Ch3 = V(PWM1)
Ch3 = V(PWM1)
Ch3 = V(FAULT)
Ch1 = V(SUPPLY)
Ch4 = V(OUT1)
Ch2 = V(EN)
Ch3 = V(PWM1)
Ch3 = V(PWM1)
Ch3 = V(FAULT)
Ch5 = I(OUT_Tot)
Ch5 = I(OUT_Tot)
图6-7. Power Up Sequency
图6-8. Supply Dimming at 200 Hz
Ch1 = V(SUPPLY)
Ch4 = V(OUT1)
Ch2 = V(EN)
Ch1 = V(SUPPLY)
Ch4 = V(OUT1)
Ch2 = V(EN)
Ch5 = I(OUT_Tot)
Ch5 = I(OUT_Tot)
图6-9. PWM Dimming at 200 Hz
图6-10. PWM Dimming at 1 kHz
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
图6-11. LED Open Protection
Ch2 = V(OUT1)
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
图6-12. LED Open Protection Recovery
Ch2 = V(OUT1)
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6.7 Typical Characteristics (continued)
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
Ch2 = V(OUT1)
Ch3 = V(FAULT)
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
Ch2 = V(OUT1)
Ch3 = V(FAULT)
图6-13. LED Short-Circuit Protection
图6-14. LED Short-Circuit Protection Recovery
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
图6-15. Single LED Short-Circuit Protection
Ch2 = V(OUT1)
Ch3 = V(FAULT)
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
Ch2 = V(OUT1)
Ch3 = V(FAULT)
图6-16. Single LED Short-Circuit Protection Recovery
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
Ch2 = V(OUT1)
Ch3 = V(FAULT)
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
Ch2 = V(OUT1)
Ch3 = V(FAULT)
DIAGEN = High
DIAGEN = High
图6-17. Transient Undervoltage
图6-18. Transient Overvoltage
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6.7 Typical Characteristics (continued)
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
Ch2 = V(OUT1)
Ch3 = V(FAULT)
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
Ch2 = V(OUT1)
Ch3 = V(FAULT)
DIAGEN = High
DIAGEN = High
图6-19. Slow Decrease and Quick Increase of Supply Voltage
图6-20. Slow Decrease and Slow Increase of Supply Voltage
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
Ch2 = V(OUT1)
Ch3 = V(FAULT)
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
Ch2 = V(OUT1)
Ch3 = V(FAULT)
DIAGEN = High
DIAGEN = High
图6-21. Superimposed Alternating Voltage 15 Hz
图6-22. Superimposed Alternating Voltage 1 kHz
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
Ch2 = V(OUT1)
Ch3 = V(FAULT)
DIAGEN = High
图6-23. Jump Start
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7 Detailed Description
7.1 Overview
The TPS92633-Q1 three-channel LED driver includes an unique thermal management design to reduce
temperature rising on the device. The TPS92633-Q1 is a linear driver directly powered by automotive batteries
with large voltage variations to output full current loads up to 150 mA per channel. The current output at each
channel can be independently set by external R(SNS) resistors. Current flows from the supply through the R(SNSx)
resistor into the integrated current regulation circuit and to the LEDs through OUTx pin and RESx pin. All three-
channel current is configurable by an external resistor connected to the ICTRL pin. Either a NTC resistor for LED
temperature monitor or a LED brightness binning resistor can be connected to ICTRL pin in same board or off-
board. The TPS92633-Q1 device supports both supply control and EN/PWM control to turn LED ON/OFF. The
LED brightness is also adjustable by voltage dutycycle applied on either SUPPLY or EN/PWM with frequency
above 100 Hz. The TPS92633 provides full diagnostics to keep the system operating reliably including LED
open/short circuit detection, single LED short circuit detection, supply POR and thermal shutdown protection.
The TPS92633-Q1 device is in a HTSSOP package with total 20 leads. The TPS92633-Q1 can be used with
other TPS9261x-Q1, TPS92630-Q1 and TPS92830-Q1 family devices together to achieve one-fails-all-fail
protection by tying all FAULT pins together as a fault bus.
7.2 Functional Block Diagram
VSUPPLY
R(SNS1)
TPS92633-Q1
IN1
SUPPLY
RES1
OUT1
EN
DIAGEN
PWM1
IN2
RES2
PWM2
PWM3
Channel 2
Channel 3
OUT2
IN3
Logic
RES3
OUT3
GND
VCC
VCC
FAULT
IREF
ICTRL
SLS_REF
+
COMP
œ
OUTx
7.3 Feature Description
7.3.1 Power Supply (SUPPLY)
7.3.1.1 Power-On Reset
The TPS92633-Q1 device has an internal power-on-reset (POR) function. When power is applied to the
SUPPLY pin, the internal POR circuit holds the device in reset state until V(SUPPLY) is above V(POR_rising)
.
7.3.1.2 Supply Current in Fault Mode
The TPS92633-Q1 device consumes minimal quiescent current, I(Fault), into SUPPLY when the FAULT pin is
externally pulled LOW. At the same time, the device shuts down all three output drivers, IREF and ICTRL.
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If device detects a fault, it pulls down the FAULT pin by an internal constant current, I(FAULT_pulldown) as a fault
indication to the fault bus.
7.3.2 Enable and Shutdown (EN)
The TPS92633-Q1 device has an enable input. When EN is low, the device is in sleep mode with ultra low
quiescent current I(SD). This low current helps to save system-level current consumption in applications where
battery voltage directly connects to the device without high-side switches.
7.3.3 Reference Current (IREF)
The TPS92633-Q1 device has IREF pin to generate a high accuracy and low temperature shift current
reference. The calculated result for I(IREF) is 100 µA when R(IREF) is 12.3 kΩ. The I(IREF) can be programmed by
external resistor, R(IREF) in the range from 25 µA to 250 µA. The voltage on the IREF pin is regulated to the
1.235 V typically, and the current output on IREF pin can be calculated by using 方程式1.
V
(IREF)
I(IREF)
=
R(IREF)
(1)
where
• V(IREF) = 1.235 V (typical)
• R(IREF) = 12.3 kΩrecommended
The R(IREF) resistor needs to be placed as close as possible to the IREF pin with a 1-nF ceramic capacitor in
parallel to achieve the noise immunity. The off-board R(IREF) setup is not allowed due to the concern of reference
current instability.
7.3.4 Constant-Current Output and Setting (INx)
The TPS92633-Q1 device is a high-side current driver for driving LEDs. The device controls each output current
through regulating the voltage drop on an external high-side current-sense resistor, R(SNSx) between SUPPLY
and INx independently for each channel. An integrated error amplifier drives an internal power transistor to
maintain the voltage drop on the current-sense resistor R(SNSx) to V(CS_REG), therefore regulates the current
output to target value. When the output current is in regulation, the current value for each channel can be
calculated by using 方程式2.
V
(CS _REG)
I(OUTx _ Tot)
=
R(SNSx)
(2)
where
• V(CS_REG) is variable according to 方程式3
• x = 1, 2 or 3 for output channel 1, 2 or 3
When the supply voltage drops below total LED string forward voltage plus required headroom voltage, the sum
of V(DROPOUT) and V(CS_REG), the TPS92633-Q1 is not able to deliver enough current output as set by the value
of R(SNSx), and the voltage across the current-sense resistor R(SNSx) is less than V(CS_REG)
.
7.3.5 Analog Current Control (ICTRL)
The TPS92633-Q1 supports analog constant current control for all three output channels together through
adjusting the V(CS_REG) voltage. As described in Constant-Current Output and Setting (INx), the TPS92633-Q1
regulates each channel output current by maintaining the voltage drop on each R(SNSx) same to V(CS_REG). The
V(CS_REG) voltage is adjustable by an external resistor on ICTRL pin. The TPS92633-Q1 outputs a constant
current, I(ICTRL), on the ICTRL pin and measures the voltage on the ICTRL pin, V(ICTRL), to determine the
V(CS_REG). The I(ICTRL) current is 10 times of the I(IREF), and the V(ICTRL) is multiplied result of I(ICTRL) and R(ICTRL)
.
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The TPS92633-Q1 internally clamps the V(ICTRL) to maximum 2.75 V. The V(CS_REG) voltage can be calculated
by using 方程式3.
I(IREF) ìR(ICTRL) ì 25
V
=
(CS _REG)
17
(3)
where
• I(IREF) is in A unit
• R(ICTRL) is in Ωunit
• V(CS_REG) is in V unit
The minimum voltage of V(CS_REF) is 50 mV typically to maintain the high accurate current output.
The final total output current for each channel can be calculated by using 方程式 4 which is combination of 方程
式1, 方程式2 and 方程式3.
V
(IREF) ìR(ICTRL) ì 25
I(OUTx _ Tot)
=
R(IREF) ìR(SNSx) ì17
(4)
where
• V(IREF) = 1.235 V
• R(IREF) is in kΩunit
• R(ICTRL) is in Ωunit
• R(SNSx) is in Ωunit
• I(OUTx_Tot) is in mA unit
The calculated result for I(OUTx_Tot) is 147.7 mA when R(IREF) is 12.3 kΩ, R(ICTRL) is 1000 Ωand R(SNSx) is 1Ω.
7.3.5.1 Off-Board Brightness Binning Resistor
With analog current control feature, a LED brightness binning resistor can be connected to ICTRL pin to set the
output current according to LED brightness bin. The binning resistor can be placed in off-board with LED units. In
order to achieve the best performance for the noise rejection, two resistors in serial can be adopted. One resistor
is placed as closed as possible to the ICTRL pin in the same PCB board with device, and another one real
binning resistor is placed in the other PCB board with LED units together.
As 图 7-1 illustrated, the R(ICTRL1) resistor and C(ICTRL) ceramic capacitor need to be placed as close as possible
to the ICTRL pin for noise decoupling. The off-board R(ICTRL2) resistor can be placed in LED board as real
binning resistor. TI recommends a 10-nF ceramic capacitor for C(ICTRL)
.
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4.5V to 40V
TPS92633-Q1
R(RES1)
R(RES2)
R(RES3)
SUPPLY
RES1
EN
IN1
IN2
IN3
C(SUPPLY)
OUT1
RES2
R(SNS1)
R(SNS2)
R(SNS3)
OUT2
RES3
OUT3
DIAGEN
PWM1
PWM2
GND
R(IREF)
IREF
R(SLS_REF)
R(ICTRL1)
SLS_REF
PWM3
FAULT
R(ICTRL2)
ICTRL
Off-board
C(ICTRL)
*: 10nF ceramic capacitor is recommended for each OUT
图7-1. Application Schematic For Off-Board Brightness Binning Resistor
The V(CS_REG) is 50 mV typically when the ICTRL pin is short to GND.
7.3.5.2 NTC Resistor
The analog current control feature also allows to connect a NTC thermistor on ICTRL pin to achieve the LED
current derating based on measured PCB board temperature or LED unit temperature. The resistance of NTC
thermistor depends on the environment temperature. The resistance of NTC thermistor is decreasing with the
temperature rising. It leads to the decreasing of the equivalent resistance of R(ICTRL) on ICTRL pin and the output
current reduction from the calculation based on 方程式2 and 方程式3.
TI recommends to connect a resistor network including NTC thermistor (e.g. NCU18XH103F6SRB) to ICTRL pin
as illustrated in below 图 7-2. The resistor value of R1 and R2 work with NTC thermistor to adjust the equivalent
resistance curve depending on the temperature to achieve the system required current derating.
4.5V to 40V
TPS92633-Q1
R(RES1)
SUPPLY
RES1
EN
IN1
IN2
IN3
C(SUPPLY)
OUT1
RES2
R(RES2)
R(SNS1)
R(SNS2)
R(SNS3)
OUT2
R(RES3)
RES3
OUT3
DIAGEN
PWM1
PWM2
GND
R(IREF)
R(SLS_REF)
R1
IREF
SLS_REF
PWM3
FAULT
ICTRL
RNTC
R2
*: 10nF ceramic capacitor is recommended for each OUT
图7-2. Application Schematic For External NTC Thermistor
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7.3.6 Thermal Sharing Resistor (OUTx and RESx)
The TPS92633-Q1 device provides two current output paths for each channel. Current flows from the supply
through the R(SNSx) resistor into the integrated current regulation circuit and to the LEDs through OUTx pin and
RESx pin. The current output on both OUTx pin and RESx pin is independently regulated to achieve total
required current output. The summed current of OUTx and RESx is equal to the current through the R(SNSx)
resistor in the channel. The OUTx connects to anode of LEDs load in serial directly, however RESx connects to
the LEDs through an external resistor to share part of the power dissipation and reduce the thermal
accumulation in TPS92633-Q1.
The integrated independent current regulation in TPS92633-Q1 dynamically adjusts the output current on both
OUTx and RESx output to maintain the stable summed current for LED. The TPS92633-Q1 always regulates the
current output to the RESx pin as much as possible until the RESx current path is saturated, and the rest of
required current is regulated from the OUTx. As a result, the most of the current to LED outputs through the
RESx pin when the voltage dropout is relatively high between SUPPLY and LED required total forward voltage.
In the opposite case, the most of the current to LED outputs through the OUTx pin when the voltage headroom
is relatively low between SUPPLY and LED required forward voltage. 图 7-3 and 图 7-4 shows the curve of
current and power dissipation distributor depending on supply voltage when R(RESx) is 68.5 Ω.
225
200
175
150
125
100
75
8
7
6
5
4
3
2
1
0
I(OUTx) R(RESx) = 68.5 W
I(RESx) R(RESx) = 68.5 W
I(OUTx_Tot) R(RESx) = 68.5 W
P(DEVICE) R(RESx) = 68.5 W
P(RESx) R(RESx) = 68.5 W
P(TOTAL) R(RESx) = 68.5 W
50
25
0
4
8
12 16
Supply Voltage (V)
20
24
4
8
12 16
Supply Voltage (V)
20
24
图7-3. Output Current Distribution vs Supply
图7-4. Power Dissipation vs Supply Voltage
Voltage
7.3.7 PWM Control (PWMx)
The pulse width modulation (PWM) input of the TPS92633-Q1 functions as enable for the output current. When
the voltage applied on the PWM pin is higher than VIH(PWM), the relevant output current is enabled. When the
voltage applied on PWM pin is lower than VIL(PWM), the output current is disabled as well as the diagnostic
features. Besides output current enable and disable function, the PWM input of TPS92633-Q1 also supports
adjustment of the average current output for brightness control when the frequency of applied PWM signal is
higher than 100 Hz, which is out of visible frequency range of human eyes. TI recommends a 200-Hz PWM
signal with 1% to 100% duty cycle input for brightness control. Please refer to 图 7-5 for typical timming
information and 图8-4 for typical PWM dimming application.
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SUPPLY
EN
PWMx
t3
t1
tt5t
tt6t
t2
t4
IOUTx
图7-5. Power On Sequency and PWM Dimming Timing
The detailed information and value of each time period in 图7-5 is described in Timing Requirements.
The TPS92633-Q1 device has three total PWM input pins, PWM1, PWM2 and PWM3, to control each of current
output channel independently. PWM1 input controls the output channel1 for both OUT1 and RES1, PWM2 input
controls the output channel2 for both OUT2 and RES2, and PWM3 input controls the output channel3 for both
OUT3 and RES3.
7.3.8 Supply Control
The TPS92633-Q1 can support supply control to turn ON and OFF output current. When the voltage applied on
the SUPPLY pin is higher than the LED string forward voltage plus needed headroom voltage at required
current, and the PWM pin voltage is high, the output current is turned ON and well regulated. However, when the
voltage applied on the SUPPLY pin is lower than V(POR_falling), the output current is turned OFF. With this feature,
the power supply voltage in designed pattern can control the output current ON/OFF. The brightness is
adjustable if the ON/OFF frequency is fast enough. Because of the high accuracy design of PWM threshold in
TPS92633-Q1, it enables a resistor divider on the PWM pin to set the SUPPLY threshold higher than LED
forward voltage plus required headroom voltage as shown in 图 7-6. The headroom voltage is basically the
summation of V(DROPOUT) and V(CS_REG). When the voltage on the PWM pin is higher than VIH(PWM), the output
current is turned ON. However, when the voltage on the PWM is lower than VIL(PWM), the output current is turned
OFF. The SUPPLY threshold voltage can be calculated by using 方程式5.
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4.5V to 40V
TPS92633-Q1
R(RES1)
R(RES2)
R(RES3)
SUPPLY
RES1
EN
IN1
IN2
IN3
C(SUPPLY)
OUT1
RES2
R(SNS1)
R(SNS2)
R(SNS3)
OUT2
RES3
OUT3
DIAGEN
PWM1
PWM2
R(UPPER)
GND
R(IREF)
R(LOWER)
IREF
R(SLS_REF)
R(ICTRL)
SLS_REF
PWM3
FAULT
ICTRL
*: 10nF ceramic capacitor is recommended for each OUT
图7-6. Application Schematic For Supply Control LED Brightness
≈
∆
«
’
R(UPPER)
V
= V
ì 1+
∆
÷
÷
◊
(SUPPLY _PWM_ th _rising)
IH(PWM)
R(LOWER)
(5)
where
• VIH(PWM) = 1.26 V (maximum)
7.3.9 Diagnostics
The device is able to detect and protect fault from LED-string short-to-GND, LED-string open-circuit, single LED
short-circuit and junction over-temperature scenarios. It also supports one-fails–all-fail fault bus design that can
flexibly fit different regulatory requirements.
7.3.9.1 IREF Short-to-GND Detection
The TPS92633-Q1 device has IREF short-to-GND detection through monitoring the voltage on the IREF pin. The
IREF pin short-to-GND fault is reported by constantly pulling down the FAULT pin, if the IREF pin voltage, V(IREF)
is lower than V(IREF_SHORT_th) for longer than the deglitch time of t(IREF_deg). The current for all output channels
and ICTRL pin are turned off and the current out of IREF pin is clamped to I(IREF_ST_Clamp) when IREF pin short-
to-GND fault is detected.
The TPS92633-Q1 recovers to normal operating if the V(IREF) voltage rises up over V(IREF_SHORT_th)
.
7.3.9.2 IREF Open Detection
The TPS92633-Q1 device has IREF open detection through monitoring the current through the IREF pin. The
IREF pin open fault is reported by constantly pulling down the FAULT pin, when the current through IREF pin,
I(IREF) is lower than I(IREF_OPEN_th) for longer than the deglitch time of t(IREF_deg). The current for all output
channels and ICTRL pin are turned off when IREF pin open fault is detected.
The TPS92633-Q1 recovers to normal operating if the I(IREF) current rises up over I(IREF_OPEN_th)
.
7.3.9.3 LED Short-to-GND Detection
The TPS92633-Q1 device has LED short-to-GND detection. The LED short-to-GND detection monitors the
output voltage when the output current is enabled. Once a short-to-GND LED failure is detected, the device turns
off the faulty channel and retries automatically, regardless of the state of the PWM input. When the retry
mechanism detects the removal of the LED short-to-GND fault, the device resumes to normal operation.
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The TPS92633-Q1 monitors the V(OUTx) voltage and V(RESx) voltage of each channel and compares it with the
internal reference voltage to detect a short-to-GND failure. When V(OUTx) or V(RESx) voltage falls below
V(SG_th_falling) longer than the deglitch time of t(SG_deg), the device asserts the short-to-GND fault and pulls low the
FAULT pin. During the deglitch time period, if V(OUTx) and V(RESx) rises above V(SG_th_rising), the timer is reset.
Once the TPS92633-Q1 has asserted a short-to-GND fault, the device turns off the faulty output channel and
retries automatically with a small current. During retrying the device sources a small current I(Retry) from SUPPLY
to OUT to pull up the LED loads continuously. Once auto-retry detects output voltage rising above V(SG_th_rising)
,
it clears the short-to-GND fault and resumes to normal operation. 图 7-7 illustrates the timing for LED short-
circuit detection, protection, retry and recovery.
SUPPLY
EN
PWMx
Short
Removed
LED
Short
Short
Removed
VOUTx
IOUTx
LED
Short
tt8t
tt8t
tt8t
I(retry)
tt10
t
tt10
t
tt14t
FAULT
No external
pullup
图7-7. LED Short-to-GND Detection and Recovery Timing Diagram
The detailed information and value of each time period in 图7-7 is described in Timing Requirements.
7.3.9.4 LED Open-Circuit Detection
The TPS92633-Q1 device has LED open-circuit detection. The LED open-circuit detection monitors the output
voltage when the current output is enabled. The LED open-circuit detection is only enabled when DIAGEN is
HIGH. A short-to-battery fault is also detected and recognized as an LED open-circuit fault.
The TPS92633-Q1 monitors dropout-voltage differences between the IN and OUT pins for each LED channel
when PWM is HIGH. The voltage difference V(INx) – V(OUTx) is compared with the internal reference voltage
V(OPEN_th_rising) to detect LED open-circuit incident. When V(OUTx) rises causing V(INx) – V(OUTx) less than the
V(OPEN_th_rising) voltage and lasts longer the deglitch time of t(OPEN_deg), the device asserts an open-circuit fault.
Once a LED open-circuit failure is detected, the internal constant-current sink pulls down the FAULT pin voltage.
During the deglitch time period, when V(OUTx) falls and makes V(INx) – V(OUTx) larger than V(OPEN_th_falling), the
deglitch timer is reset.
The TPS92633-Q1 shuts down the output current regulation for the faulty channel after LED open-circuit fault is
detected. The device sources a small current I(Retry) from SUPPLY to OUT when DIAGEN input is logic High.
Once the fault condition is removed, the device resumes normal operation and releases the FAULT pin. 图 7-8
illustrates the timing for LED open-circuit detection, protection, retry and recovery.
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SUPPLY
EN
PWMx
Open
Removed
LED
Open
Open
Removed
VOUTx
LED
Open
tt7t
tt7t
tt7t
I(retry)
IOUTx
tt10
t
tt10
t
tt14t
FAULT
No external
pullup
图7-8. LED Open-Circuit Detection and Recovery Timing Diagram
The detailed information and value of each time period in 图7-8 is described in Timing Requirements.
7.3.9.5 Single LED Short-Circuit Detection (SLS_REF)
The TPS92633-Q1 device has single LED short-circuit detection. The single LED short-circuit detection monitors
the output voltage when the output current is enabled. Once a single LED short-circuit failure is detected, the
device turns off the faulty channel and retries automatically, regardless of the state of the PWM input. If the retry
mechanism detects the removal of the single LED short-circuit fault, the device resumes to normal operation.
The TPS92633-Q1 monitors the V(OUTx) voltage of each channel and internally compares the scale down voltage
of V(OUTx) with an external resistor programmable reference voltage on SLS_REF to detect a single LED short-
circuit failure. When the voltage of V(OUTx) falls below V(SLS_th_falling) longer than the deglitch time of t(SLS_deg), the
device asserts the single LED short-circuit fault and pulls low the FAULT pin. During the deglitch time period, if
the scale down voltage of V(OUTx) rises above V(SLS_th_rising), the timer is reset.
Once the TPS92633-Q1 has asserted a single LED short-circuit fault, the device turns off the faulty output
channel and retries automatically. During retrying the device sources full current from IN to OUT to pull up the
LED loads every 10 ms for 300-µs period when the PWM input is logic high for the faulty channel. Once auto-
retry detects the voltage of V(OUTx) rising above V(SLS_th_rising), it clears the single LED short-circuit fault and
resumes to normal operation. The V(SLS_th_rising) is 2.5% higher the V(SLS_th_falling). The scale down ratio for
V(OUTx) is N(OUT). 图 7-9 describes internal diagram for single LED short-circuit detection circuit. And the
V
(SLS_th_falling) threshold voltage for single LED short-circuit is calculated by using 方程式6.
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VCC
1:1
1/N
OUT1
OUT2
OUT3
œ
SLS
IREF
COMP
+
R(IREF)
1/N
œ
SLS
COMP
+
SLS_REF
R(SLS_REF)
1/N
œ
SLS
COMP
+
图7-9. Single LED Short-Circuit Detection Block Diagram
N(OUT) ìR(SLS _REF) ì V(IREF) ìN(SLS _REF)
V
=
(SLS _ th _ falling)
R(IREF)
(6)
where
• V(IREF) = 1.235 V (typical)
• R(IREF) = 12.3 kΩrecommended
• R(SLS_REF) is in kΩunit
• N(OUT) = 4 (typical)
• N(SLS_REF) = 1 (typical)
The calculated result for V(SLS_th_falling) is 5.34 V when R(IREF) is 12.3 kΩand R(SLS_REF) is 13.3 kΩ.
图7-10 illustrates the timing for single-LED short-circuit detection, protection, retry and recovery.
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SUPPLY
EN
PWMx
Single LED
Short
Removed
VOUTx
Single LED
Short
tt9t
tt9t
tt11t
tt12t
IOUTx
tt13
t
tt14t
FAULT
No external
pullup
图7-10. Single LED Short-Circuit Detection and Recovery Timing Diagram
The detail information and value of each time period in 图7-10 is described in Timing Reqquirements.
7.3.9.6 LED Open-Circuit and Single LED Short-Circuit Detection Enable (DIAGEN)
The TPS92633-Q1 device supports the DIAGEN pin with an accurate threshold to disable the LED open-circuit
and single LED short-circuit diagnostic functions. The DIAGEN pin can be used to enable or disable LED open-
circuit detection and single LED short-circuit detection based on SUPPLY pin voltage sensed by an external
resistor divider as illustrated in 图 7-11. When the voltage applied on DIAGEN pin is higher than the threshold
VIH(DIAGEN), the device enables LED open-circuit and single LED short-circuit diagnosis. When V(DIAGEN) is lower
than the threshold VIL(DIAGEN), the device disables LED open-circuit and single LED short-circuit detection.
Only LED open-circuit detection and single LED short-circuit detection can be disabled by pulling down the
DIAGEN pin. The LED short-to-GND detection and over-temperature protection cannot be turned off by pulling
down the DIAGEN pin. The SUPPLY threshold voltage can be calculated by using 方程式7.
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4.5V to 40V
TPS92633-Q1
R(RES1)
R(RES2)
R(RES3)
SUPPLY
RES1
EN
IN1
IN2
IN3
C(SUPPLY)
OUT1
RES2
R(SNS1)
R(SNS2)
R(SNS3)
OUT2
RES3
R(UPPER)
OUT3
DIAGEN
PWM1
PWM2
GND
R(LOWER)
R(IREF)
IREF
R(SLS_REF)
R(ICTRL)
SLS_REF
PWM3
FAULT
ICTRL
*: 10nF ceramic capacitor is recommended for each OUT
图7-11. Application Schematic For DIAGEN
≈
∆
«
’
R(UPPER)
V
= V
ì 1+
∆
÷
÷
◊
(SUPPLY _DIAGEN_ th _ falling)
IL(DIAGEN)
R(LOWER)
(7)
where
• VIL(DIAGEN) = 1.045 V (minimum)
7.3.9.7 Low Dropout Operation
When the supply voltage drops below LED string total forward voltage plus headroom voltage at required
current, the TPS92633-Q1 device operates in low-dropout conditions to deliver current output as close as
possible to target value. The actual current output is less than preset value due to insufficient headroom voltage
for power transistor. As a result, the voltage across the sense resistor fails to reach the regulation target. The
headroom voltage is the summation of V(DROPOUT) and V(CS_REG)
.
If the TPS92633-Q1 is designed to operate in low-dropout condition, the open-circuit diagnostics and single LED
short-circuit detection must be disabled by pulling the DIAGEN pin voltage lower than VIL(DIAGEN). Otherwise, the
TPS92633-Q1 detects an open-circuit fault or single LED short-circuit fault and reports a fault on the FAULT pin.
The DIAGEN pin is used to avoid false diagnostics due to low supply voltage.
7.3.9.8 Over-Temperature Protection
The TPS92633-Q1 device monitors device junction temperature. When the junction temperature reaches
thermal shutdown threshold T(TSD), the output shuts down. Once the junction temperature falls below T(TSD)
–
T(TSD_HYS), the device recovers to normal operation. During over-temperature protection, the FAULT pin is pulled
low.
7.3.10 FAULT Bus Output With One-Fails–All-Fail
During normal operation, The FAULT pin of TPS92633-Q1 is weakly pulled up by an internal pullup current
source, I(FAULT_pullup). If any fault scenario occurs, the FAULT pin is strongly pulled low by the internal pulldown
current sink, I(FAULT_pulldown) to report out the fault alarm.
Meanwhile, the TPS92633-Q1 also monitors the FAULT pin voltage internally. If the FAULT pin of the TPS92633-
Q1 is pulled low by external current sink below VIL(FAULT), the current output is turned off even though there is no
fault detected on owned outputs. The device does not resume to normal operation until the FAULT pin voltage
rises above VIH(FAULT)
.
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Based on this feature, the TPS92633-Q1 device is able to construct a FAULT bus by tying FAULT pins from
multiple TPS92633-Q1 devices to achieve one-fails-all-fail function as 图 7-12 showing. The lower side
TPS92633-Q1 (B) detects any kind of LED fault and pulls low the FAULT pin. The low voltage on FAULT pin is
detected by upper side TPS926133-Q1 (A) because the FAULT pins are connected of two devices. The upper
side TPS92633-Q1 (A) turns off all output current for each channel as a result. If the FAULT pins of each
TPS92633-Q1 are all connected to drive the base of an external PNP transistor as illustrated in 图7-13, the one-
fails–all-fail function is disabled and only the faulty channel is turned off.
TPS92633-Q1
A
TPS92633-Q1
A
VCC
VCC
VSUPPLY
VSUPPLY
10 kΩ
20 kΩ
20 kΩ
FAULT
FAULT
10 kΩ
Logic
Logic
10 kΩ
TPS92633-Q1
B
VCC
TPS92633-Q1
B
VCC
FAULT
FAULT
Logic
Logic
图7-13. FAULT Bus For One-Fails-Others-On
图7-12. FAULT Bus For One-Fails-All-Fail
Application
Application
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7.3.11 FAULT Table
表7-1. FAULT Table With DIAGEN = HIGH (Full Function)
FAULT BUS
STATUS
DETECTION CONTROL DEGLITCH
FAULT
ACTION
FAULT HANDLING
ROUTINE
FAULT
RECOVERY
FAULT TYPE
MECHANISM
INPUT
TIME
Device turns all output
off. IREF current clamps
Constant-
current
pulldown
IREF short-to-
GND
V(IREF)
V(IREF_SHORT_th)
<
EN = H
t(IREF_deg)
to I(IREF_ST_Clamp)
.
Auto recovery
Auto recovery
ICTRL current output
are turned off.
Constant-
current
pulldown
Device turns all output
off. ICTRL current are
turned off too.
I(IREF)
<
IREF open
EN = H
t(IREF_deg)
I(IREF_OEPN_th)
No detection
No detection
SLS_REF short-
to-GND
EN = H
EN = H
N/A
N/A
No Action
No Action
V(SLS_th_falling)= 0 V.
Auto recovery
Auto recovery
Disable single-LED
short-circuit detection.
SLS_REF open
ICTRL short-to-
GND
No detection
No detection
EN = H
EN = H
N/A
N/A
No Action
No Action
V(CS_REG) = 50 mV.
V(CS_REG) = 400 mV.
Auto recovery
Auto recovery
ICTRL open
Device turns failed
output off and retries
with constant current
I(retry), ignoring the PWM
input.
FAULT = H
EN = H
and
PWMx = H
Constant-
current
pulldown
Open-circuit or
short-to-supply
V
(IN) –V(OUT)
<
t(OPEN_deg)
Auto recovery
Auto recovery
V(OPEN_th_rising)
V(OUT)
V(SG_th_falling)
OR
V(RES)
V(SG_th_falling)
<
Device turns failed
output off and retries
with constant current
I(retry), ignoring the PWM
input.
EN = H
and
PWMx = H
Constant-
current
pulldown
Short-to-ground
t(SG_deg)
<
Device turns failed
output off and retries
every 10 ms by turning
output on for 300 µs
when PWM input is
logic high.
V
(IN) –V(OUT)
>
V(OPEN_th_falling)
&
V(SG_th_falling)
< V(OUT)
EN = H
and
PWMx = H
Constant-
current
pulldown
Single LED short-
circuit
t(SLS_deg)
Auto recovery
<
V(SLS_th_falling)
Constant-
current
pulldown
Device turns all output
channels off, SLS_REF Auto recovery
and ICTRL off.
Over-temperature TJ > T(TSD)
Fault is detected
EN = H
t(TSD_deg)
Device turns off remained channels in operation.
FAULT = L
No fault is
detected
Device turns all output channels off, IREF, SLS_REF and ICTRL off.
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表7-2. FAULT Table With DIAGEN = LOW (Full Function)
FAULT BUS
STATUS
DETECTION CURRENT DEGLITCH
FAULT HANDLING
ROUTINE
FAULT
RECOVERY
FAULT TYPE
FAULT BUS
MECHANISM
OUTPUT
TIME
Device turns all output
off. IREF current clamps
Constant-
current
pulldown
IREF short-to-
GND
V(IREF)
V(IREF_SHORT_th)
<
EN = H
t(IREF_deg)
to I(IREF_ST_Clamp)
.
Auto recovery
Auto recovery
ICTRL current output
are turned off.
Constant-
current
pulldown
Device turns all output
off. ICTRL current are
turned off too.
I(IREF)
<
IREF open
EN = H
t(IREF_deg)
I(IREF_OPEN_th)
No detection
No detection
SLS_REF short-
to-GND
EN = H
EN = H
N/A
N/A
No Action
No Action
V(SLS_th_falling)= 0 V.
Auto recovery
Auto recovery
Disable single-LED
short-circuit detection.
SLS_REF open
ICTRL short-to-
GND
No detection
No detection
EN = H
EN = H
N/A
N/A
No Action
No Action
V(CS_REG) = 50 mV.
V(CS_REG) = 400 mV.
Auto recovery
Auto recovery
FAULT= H
ICTRL open
Open-circuit or
short-to-supply
Ignored
Single LED short-
circuit
V(OUT)
V(SG_th_falling)
OR
V(RES)
V(SG_th_falling)
<
Device turns output off
and retries with constant
current I(retry), ignoring
the PWM input.
EN = H
and
PWMx = H
Constant-
current
pulldown
Short-to-ground
t(SG_deg)
Auto recovery
<
Constant-
current
pulldown
Device turns all output
channels off, SLS_REF Auto recovery
and ICTRL off.
Over-temperature TJ > T(TSD)
EN = H
t(TSD_deg)
FAULT= L
Fault is detected
Device turns all output channels off and keeps retry on the failed channels.
Device turns all output channels off, IREF, SLS_REF and ICTRL off.
No fault is
detected
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7.3.12 LED Fault Summary
表7-3. LED Connection Fault Summary
Case 1
Case 2
Case 3
Case 4
LED Short-to-GND Fault
LED Short-to-GND Fault
LED Open Fault
LED Open Fault
Case 5
Case 6
Case 7
Case 8
Single-LED-Short Fault
No Fault
No Fault
LED Open Fault
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7.3.13 IO Pins Inner Connection
SUPPLY
SUPPLY
EN
PWMx
GND
GND
图7-14. EN Pin
图7-15. PWM1, PWM2 and PWM3 Pins
SUPPLY
SUPPLY
DIAGEN
FAULT
GND
GND
图7-16. DIAGEN Pin
图7-17. FAULT Pin
SUPPLY
INx
ICTRL
OUTx
GND
GND
图7-18. ICTRL pin
图7-19. OUT1, OUT2 and OUT3 Pins
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INx
SUPPLY
RESx
INx
GND
OUTx
图7-20. RES1, RES2 and RES3 Pins
图7-21. IN1, IN2 and IN3 Pins
SUPPLY
SUPPLY
2 kꢀ
4 kꢀ
IREF
SLS_REF
GND
GND
图7-22. IREF Pin
图7-23. SLS_REF Pin
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7.4 Device Functional Modes
7.4.1 Undervoltage Lockout, V(SUPPLY) < V(POR_rising)
When the device is in undervoltage lockout status, the TPS92633-Q1 device disables all functions until the
supply rises above the V(POR_rising) threshold.
7.4.2 Normal Operation V(SUPPLY) ≥4.5 V
The device drives an LED string in normal operation. With enough voltage drop across SUPPLY and OUT, the
device is able to drive the output in constant-current mode.
7.4.3 Low-Voltage Dropout Operation
When the device drives an LED string in low-dropout operation, if the V(DROPOUT) is less than the open-circuit
detection threshold, the device may report a false open-circuit fault or single LED short-circuit fault. TI
recommends only enabling the open-circuit detection and single LED short-circuit detection when SUPPLY
voltage is enough higher than LED string voltage to avoid a false open-circuit detection.
7.4.4 Fault Mode
When the device detects any fault, the device tries to pull down the FAULT pin with a constant current. If the
FAULT bus is pulled down, the device switches to fault mode and consumes a fault current of I(Fault)
.
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8 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification, and TI
does not warrant its accuracy or completeness. TI’s customers are responsible for determining
suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
8.1 Application Information
In automotive lighting applications, thermal performance and LED diagnostics are always design challenges for
linear LED drivers.
The TPS92633-Q1 device is capable of detecting LED open-circuit, LED short-circuits and single-LED short-
circuit. To increase current driving capability, the TPS92633-Q1 device supports using an external shunt resistor
to help dissipate heat as following section Thermal Sharing Resistor describes. This method provides a low-cost
solution of using external resistors to minimize thermal accumulation on the device itself due to large voltage
difference between input voltage and LED string forward voltage, while still keeping high accuracy of the total
current output.
8.2 Typical Applications
8.2.1 BCM Controlled Rear Lamp with One-Fails-All-Fail Setup
The multiple TPS92633-Q1 devices are capable to drive different functions for automotive rear lamp including
stop, turn indicator, tail, fog, reverse and center-high-mounted-stop-lamp. The One-Fails-all-Fail single lamp
mode can be easily achieved by FAULT bus by shorting the FAULT pins.
BCM_STOP
TPS92633-Q1
10nF
10nF
10nF
R(RES1)
R(RES2)
R(RES3)
C(SUPPLY)
SUPPLY
RES1
10kΩ
EN
IN1
IN2
IN3
OUT1
RES2
R(SNS1)
R(SNS2)
R(SNS3)
OUT2
R1
R2
RES3
OUT3
DIAGEN
PWM1
PWM2
1nF
R3
R4
GND
R(IREF)
IREF
R(SLS_REF)
SLS_REF
PWM3
FAULT
20kΩ
R(ICTRL)
ICTRL
1nF
图8-1. Typical Application Schematic
8.2.1.1 Design Requirements
Input voltage range is from 9 V to 16 V, and a total 9 LEDs, with 3 LEDs in each string required to achieve stop
function. The LED maximum forward voltage, VF_MAX is 2.5 V for each LED, however the minimum forward
voltage, VF_MIN is 1.9 V. The current requirement for each LED, I(LED) is 140 mA. The LED brightness and
ON/OFF control is manipulated by body control module, BCM, directly by connecting and disconnecting the
power supply to the LED load. Single-LED short-circuit detection is also required.
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8.2.1.2 Detailed Design Procedure
STEP 1: Determine the reference current setting resistor, R(IREF), by using 方程式8.
V
(IREF)
R(IREF)
=
I(IREF)
(8)
where
• V(IREF) = 1.235 V (typical)
• I(IREF) = 100 µA (recommended)
TI recommends 100 µA current for reference current, I(IREF) if the ICTRL resistor is placed in the same board
with TPS92633-Q1. The calculated result for R(IREF) is 12.3 kΩwhen I(IREF) = 100 µA.
STEP 2: Design the ICTRL resistor, R(ICTRL), for setting the regulation voltage, V(CS_REG) by using 方程式9.
V
(CS _REG) ì17
R(ICTRL)
=
I(IREF) ì 25
(9)
where
• V(CS_REG) = 100 mV (recommended)
• I(IREF) = 100 µA (recommended)
TI recommends 100 mV for reference voltage across current sensing resistor, R(SNSx) if the ICTRL pin is not
used for driving off-board binning resistor or NTC resistor. The calculated result for R(ICTRL) is 680 Ω when
V(CS_REG) = 100 mV.
STEP 3: Determine the current sensing resistor, R(SNSx), by using 方程式10.
V
(IREF) ìR(ICTRL) ì 25
R(SNSx)
=
R(IREF) ìI(OUTx _ Tot) ì17
(10)
where
• V(IREF) = 1.235 V (typical)
• R(ICTRL) = 680 Ω
• R(IREF) = 12.3 kΩ
• I(OUTx_Tot) = 140 mA
According to design requirements, output current for each channel is same so that the R(SNS1) = R(SNS2)
=
R(SNS3) = 0.717 Ω. Two resistors in parallel are required to achieve equivalent 0.717-Ω resistance because
0.717 Ωis not a standard decade resistance value.
STEP 4: Design the current distribution between I(OUTx) and I(RESx), and calculate the current sharing resistor,
R(RESx) by using 方程式 11. The R(RESx) value actually decides the current distribution for I(OUTx) path and I(RESx)
path, basic principle is to design the R(RESx) to consume appropriate 50% total power dissipation at typical
supply operating voltage.
V
- V
(OUTx)
(SUPPLY)
R(RESx)
=
I(OUTx _ Tot) ì0.5
(11)
where
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• V(SUPPLY) = 12 V (typical)
• I(OUTx_Tot) = 140 mA
The calculated result for R(RESx) resistor value including R(RES1), R(RES2) and R(RES3) is 75 Ω when V(OUTx) is
typical 3 × 2.2 V = 6.6 V.
STEP 5: Design the single-LED short-circuit threshold voltage and calculate the value of R(SLS_REF) resistor for
setting single-LED short-circuit threshold by using 方程式12.
The total forward voltage for three LEDs in serial is 3 × 2.5 V = 7.5-V maximum and 3 × 1.9 V = 5.7-V minimum.
Once anyone of three LEDs is defective with short-circuit behavior, the total forward voltage for remaining two
LEDs in serial is 2 × 2.5 V = 5-V maximum and 2 × 1.9 V = 3.8-V minimum. So the 5.3 V is selected to be
threshold for single-LED short-circuit, V(SLS_th_falling)
.
V
(SLS _ th _ falling) ìR(IREF)
R(SLS _REF)
=
N(OUT) ì V(IREF) ìN(SLS _REF)
(12)
where
• V(IREF) = 1.235 V (typical)
• R(IREF) = 12.3 kΩ
• N(OUT) = 4
• N(SLS_REF) = 1
The calculated result for R(SLS_REF) is 13.3 kΩfor V(SLS_th_falling) is 5.34 V.
STEP 6: Design the threshold voltage of SUPPLY to enable the LED open-circuit and single-LED short-circuit
diagnostics, and calculate voltage divider resistor value for R1 and R2 on DIAGEN pin.
The maximum forward voltage of LED-string is 3 × 2.5 V = 7.5 V. To avoid the open-circuit fault or single-LED
short-circuit reported in low-dropout operation conditions, additional headroom between SUPPLY and OUTx
needs to be considered. The TPS92633-Q1 device must disable open-circuit detection and single-LED short-
circuit detection when the supply voltage is below LED-string maximum forward voltage plus V(OPEN_th_rising) and
V(CS_REG). The voltage divider resistor, R1 and R2 value can be calculated by 方程式13.
≈
’
÷
◊
V
+ V
+ V
(OUTx)
(OPEN_ th_rising)
(CS _REG)
R =
-1 ìR
∆
∆
«
÷
1
2
V
IL(DIAGEN)
(13)
where
• V(OPEN_th_rising) = 210 mV (maximum)
• V(CS_REG) = 100 mV
• VIL(DIAGEN) = 1.045 V (minimum)
• R2 = 10 kΩ(recommended)
The calculated result for R1 is 64.9 kΩwhen V(OUTx) maximum voltage is 7.5 V and V(CS_REG) is 100 mV.
STEP 7: Design the threshold voltage of SUPPLY to turn on and off each channel of LED, and calculate voltage
divider resistor value for R3 and R4 on PWM input pin.
The minimum forward voltage of LED-string is 3 × 1.9 V = 5.7 V. To make sure the current output on each of
LED-string is normal, each LED-string needs to be turned off when SUPPLY voltage is lower than LED minimum
required forward voltage plus dropout voltage between INx to OUTx and V(CS_REG). The voltage divider resistor,
R3 and R4 value can be calculated by 方程式14.
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≈
’
÷
◊
V
+ V
+ V
(DROPOUT)
(CS _REG) (OUTx)
R =
-1 ìR
∆
∆
«
÷
3
4
V
IH(PWM)
(14)
where
• V(DROPOUT) = 300 mV (typical)
• V(CS_REG) = 100 mV
• VIH(PWM) = 1.26 V (maximum)
• R4 = 10 kΩ(recommended)
The calculated result for R3 is 38.3 kΩwhen V(OUTx) minimum voltage is 5.7 V and V(CS_REG) is 100 mV.
8.2.1.3 Application Curves
Ch1 = V(SUPPLY)
Ch4 = V(DIAGEN)
Ch2 = V(EN)
Ch3 = V(PWM1)
Ch6 = I(OUT_Tot)
Ch1 = V(SUPPLY)
Ch4 = V(DIAGEN)
Ch2 = V(EN)
Ch3 = V(PWM1)
Ch6 = I(OUT_Tot)
Ch5 = V(OUT1)
Ch5 = V(OUT1)
图8-2. Supply Dimming 80% Brightness
图8-3. Supply Dimming 20% Brightness
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8.2.2 Independent PWM Controlled Rear Lamp with Off Board LED and Binning Resistor
The TPS92633-Q1 device is able to drive the each current output channel independently by PWM input at
PWM1, PWM2 and PWM3 pins. The LED and LED binning resistor can be placed in different PCB to the
TPS92633-Q1 device. The LED binning resistor is connected to the ICTRL pin to set the LED current
accordingly.
BCM_TURN
TPS92633-Q1
10nF
10nF
10nF
R(RES1)
R(RES2)
R(RES3)
C(SUPPLY)
SUPPLY
RES1
10kΩ
EN
IN1
IN2
IN3
OUT1
RES2
R(SNS1)
R1
R2
R(SNS2)
R(SNS3)
OUT2
RES3
OUT3
DIAGEN
PWM1
PWM2
R(ICTRL2)
1nF
MCU
GPIO
GPIO
GPIO
GPIO
GND
R(IREF)
R(ICTRL1)
1nF
IREF
SLS_REF
PWM3
FAULT
ICTRL
20kΩ
VCC
图8-4. Typical Application Schematic
8.2.2.1 Design Requirements
Input voltage range is from 9 V to 16 V, and a total 6 LEDs, with 2 LEDs in each string required to achieve turn
indicator function. The LED maximum forward voltage, VF_MAX is 2.5 V for each LED, however the minimum
forward voltage, VF_MIN is 1.9 V. The binning resistor for LED is placed with LED units together in another PCB
out of LED driver board. The LED current is 50 mA, 75 mA and 100 mA depending on the brightness bin. Each
current output channel is independently controlled by MCU through individual GPIO. Single-LED short-circuit
detection is not required.
8.2.2.2 Detailed Design Procedure
TI recommends to short the SLS_REF pin to GND when single-LED short-circuit is not required.
STEP 1: Determine the reference current setting resistor, R(IREF), by using 方程式15.
V
(IREF)
R(IREF)
=
I(IREF)
(15)
where
• V(IREF) = 1.235 V (typical)
• I(IREF) = 200 µA (recommended for off-board binning resistor)
TI recommends 200-µA current for reference current, I(IREF) if the ICTRL resistor is placed in the other board with
TPS92633-Q1. The calculated result for R(IREF) is 6.19 kΩwhen I(IREF) = 200 µA.
STEP 2: Design the ICTRL resistor, R(ICTRL1) and R(ICTRL2), for setting the regulation voltage, V(CS_REG), by using
方程式16.
V
(CS _REG) ì17
R(ICTRL1) + R(ICTRL2)
=
I(IREF) ì 25
(16)
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where
• I(IREF) = 200 µA (recommended for off-board binning resistor)
TI recommends 80 mV, 120 mV and 160 mV or reference voltage across current sensing resistor, R(SNSx), for
three different brightness binning LED. The calculated result for R(ICTRL1) and R(ICTRL2) for different brightness
bin LED is listed in 表 8-1. It is recommended to choose as large as possible R(ICTRL1) to achieve the highest
noise immunity.
STEP 3: Determine the current sensing resistor, R(SNSx), by using 方程式17.
V
(IREF) ìR(ICTRL) ì 25
R(SNSx)
=
R(IREF) ìI(OUTx _ Tot) ì17
(17)
where
• V(IREF) = 1.235 V (typical)
• R(IREF) = 6.19 kΩ
According to design requirements, output current for each channel is same so that the R(SNS1) = R(SNS2)
(SNS3). The calculated result for R(SNSx) is listed in 表8-1.
=
R
表8-1. Calculated Resistor Table
LED Brightness Group A
LED Brightness Group B
LED Brightness Group C
I(OUTx_Tot)
V(CS_REG)
R(ICTRL1) + R(ICTRL2)
R(ICTRL1)
50 mA
80 mV
272 Ω
75 mA
120 mV
408 Ω
270 Ω
140 Ω
1.6 Ω
100 mA
160 mV
544 Ω
R(ICTRL2)
2 Ω
274 Ω
R(SNSx)
STEP 4: Design the current distribution between I(OUTx) and I(RESx) and calculate the current sharing resistor,
R(RESx), by using 方程式 18. The R(RESx) value actually decides the current distribution for I(OUTx) path and I(RESx)
path, basic principle is to design the R(RESx) to consume appropriate 50% total power dissipation at typical
supply operating voltage.
V
- V
(OUTx)
(SUPPLY)
R(RESx)
=
I(OUTx _ Tot) ì0.5
(18)
where
• V(SUPPLY) = 12 V (typical)
• I(OUTx_Tot) = 100 mA (maximum)
The calculated result for R(RESx) resistor value including R(RES1), R(RES2) and R(RES3) is 152 Ω when V(OUTx) is
typical 2 × 2.2 V = 4.4 V.
STEP 5: Design the threshold voltage of SUPPLY to enable the LED open-circuit and single-LED short-circuit
diagnostics, and calculate voltage divider resistor value for R1 and R2 on DIAGEN pin.
The maximum forward voltage of LED-string is 2 × 2.5 V = 5 V. To avoid the open-circuit fault reported in low-
dropout operation conditions, additional headroom between SUPPLY and OUTx needs to be considered. The
TPS92633-Q1 device must disable open-circuit detection when the supply voltage is below LED-string maximum
forward voltage plus V(OPEN_th_rising) and V(CS_REG). The voltage divider resistor, R1 and R2 value can be
calculated by 方程式19.
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≈
’
÷
◊
V
+ V
+ V
(OUTx)
(OPEN_ th_rising)
(CS _REG)
R =
-1 ìR
∆
∆
«
÷
1
2
V
IL(DIAGEN)
(19)
where
• V(OPEN_th_rising) = 210 mV (maximum)
• V(CS_REG) = 160 mV (maximum)
• VIL(DIAGEN) = 1.045 V (minimum)
• R2 = 10 kΩ(recommended)
The calculated result for R1 is 41.2 kΩ when V(OUTx) maximum voltage is 5 V and V(CS_REG) is 160 mV
maximum.
8.2.2.3 Application Curves
Ch1 = V(SUPPLY)
Ch4 = V(DIAGEN)
Ch2 = V(EN)
Ch3 = V(PWM1)
Ch6 = I(OUT_Tot)
Ch1 = V(SUPPLY)
Ch4 = V(DIAGEN)
Ch2 = V(EN)
Ch3 = V(PWM1)
Ch6 = I(OUT_Tot)
Ch5 = V(OUT1)
Ch5 = V(OUT1)
图8-5. PWM Dimming 80% Dutycycle at 200 Hz
图8-6. PWM Dimming 20% Dutycycle at 600 Hz
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9 Power Supply Recommendations
The TPS92633-Q1 is designed to operate from an automobile electrical power system within the range specified
in Power Supply. The V(SUPPLY) input must be protected from reverse voltage and load dump condition over 40
V. The impedance of the input supply rail must be low enough that the input current transient does not cause
drop below LED string required forward voltage. If the input supply is connected with long wires, additional bulk
capacitance may be required in addition to normal input capacitor.
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10 Layout
10.1 Layout Guidelines
Thermal dissipation is the primary consideration for TPS92633-Q1 layout.
• TI recommends large thermal dissipation area in both top and bottom layers of PCB. The copper pouring
area in same layer with TPS92633-Q1 footprint should directly cover the thermal pad land of the device with
wide connection as much as possible. The copper pouring in opposite PCB layer or inner layers should be
connected to thermal pad directly through multiple thermal vias.
• TI recommends to place R(RESx) resistors away from the TPS92633-Q1 device with more than 20-mm
distance because R(RESx) resistors are dissipating some amount of the power as well as the TPS92633-Q1. It
is better to place two heat source components apart to reduce the thermal accumulation concentrated at
small PCB area. The large copper pouring area is also required surrounding the R(RESx) resistors for helping
thermal dissipating.
The noise immunity is the secondary consideration for TPS92633-Q1 layout.
• TI recommends to place the noise decoupling capacitors for SUPPLY, ICTRL and IREF pins as close as
possible to the pins.
• TI recommends to place the R(SNSx) resistor as close as possible to the INx pins with the shortest PCB track
to SUPPLY pin.
10.2 Layout Example
GND
GND
R(RES1)
C(SUPPLY)
LED String1
GND
SUPPLY
EN
RES1
OUT1
R(RNS1)
IN1
RES2
OUT2
R(RES2)
R(RNS2)
IN2
IN3
RES3
LED String2
R(RNS3)
DIAGEN
PWM1
PWM2
PWM3
FUALT
OUT3
GND
DIAGEN
PWM1
PWM2
PWM3
FUALT
IREF
SLS_REF
R(RES3)
ICTRL
LED String3
GND
GND
图10-1. TPS92633-Q1 Example Layout Diagram
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11 Device and Documentation Support
11.1 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
11.2 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
11.3 Trademarks
PowerPAD™ is a trademark of TI.
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
11.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
11.5 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
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12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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重要声明和免责声明
TI 提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，不保证没
有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担保。
这些资源可供使用TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的TI 产品，(2) 设计、验
证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。这些资源如有变更，恕不另行通知。TI 授权您仅可
将这些资源用于研发本资源所述的TI 产品的应用。严禁对这些资源进行其他复制或展示。您无权使用任何其他TI 知识产权或任何第三方知
识产权。您应全额赔偿因在这些资源的使用中对TI 及其代表造成的任何索赔、损害、成本、损失和债务，TI 对此概不负责。
TI 提供的产品受TI 的销售条款(https:www.ti.com/legal/termsofsale.html) 或ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI
提供这些资源并不会扩展或以其他方式更改TI 针对TI 产品发布的适用的担保或担保免责声明。重要声明
邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2021，德州仪器(TI) 公司
PACKAGE OPTION ADDENDUM
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7-Jun-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS92633QPWPRQ1
ACTIVE
HTSSOP
PWP
20
2000 RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 125
92633Q
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
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TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS92633QPWPRQ1 HTSSOP PWP
20
2000
330.0
16.4
6.95
7.0
1.4
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Jun-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
HTSSOP PWP 20
SPQ
Length (mm) Width (mm) Height (mm)
356.0 356.0 35.0
TPS92633QPWPRQ1
2000
Pack Materials-Page 2
重要声明和免责声明
TI“按原样”提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，
不保证没有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担
保。
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验
证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。
这些资源如有变更，恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。
您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成
本、损失和债务，TI 对此概不负责。
TI 提供的产品受 TI 的销售条款或 ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改
TI 针对 TI 产品发布的适用的担保或担保免责声明。
TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE
邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
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