TPS92667QPHPRQ1 [TI]
具有高级诊断功能的汽车类低噪声 16 通道 LED 矩阵管理器 | PHP | 48 | -40 to 125;
| 型号： | TPS92667QPHPRQ1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有高级诊断功能的汽车类低噪声 16 通道 LED 矩阵管理器 | PHP | 48 | -40 to 125 |
| 文件： | 总16页 (文件大小：1562K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS92667-Q1
ZHCSRB9 –DECEMBER 2022
TPS92667-Q1 具有高级诊断功能的汽车类低噪声16
通道LED 矩阵管理器
1 特性
3 说明
• 符合面向汽车应用的AEC-Q100 标准
TPS92667 LED 矩阵管理器器件通过提供单个像素级
LED 控制来实现完全动态的自适应照明解决方案。该
器件的 4 个串联集成开关各有 4 个子灯串，可绕过单
个 LED。各个子灯串允许器件接受单个或多个电流
源。
– 1 级：–40°C 至+125°C 环境温度
– 器件HBM 分类等级H1C
– 器件CDM 分类等级C5
• 功能安全型
– 可提供用于功能安全系统设计的文档
• 16 个集成旁路开关
TPS92667 具有内部低噪声 LVDS 接收器输入，用于
由 TPS92664 或 TPS92665 器件提供的系统时钟。多
点通用异步接收器发送器 (UART) 串行接口与
TPS92664、TPS92665、TPS92662x 和 TPS92663x
器件兼容。
– 可编程10 位PWM 调光
– 可编程压摆率控制
– LED 开路检测和保护
• UART 串行通信
TPS92667 包含寄存器，可用于对灯串中单个 LED 的
相移和脉冲宽度进行编程以及报告 LED 开路、短路故
障和功能参数。
– 用于外部系统时钟的LVDS 时钟接收器
– 兼容上一代LMM
– 兼容CAN 收发器
封装信息
封装(1)
2 应用
封装尺寸（标称值）
器件型号
• 汽车前照灯系统
• ADB 或无眩光远光灯
• 连续转向、动画日间行车灯
PHP（HTQFP、
48）
TPS92667-Q1
7.00mm × 7.00mm
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
VBAT
BOOST
BUCK
TPS92667
CP_TOP
CP_BOT
CLKx / SYNC
from
664 or 665
SYNC
CLK_H
CLK_L
MCU
….. ….. …..
UART
RX
TX
CAN
CAN
5V
UART
ECU
4 x 4
series
switches
VDD
GND
简化版应用
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLUSF57
TPS92667-Q1
ZHCSRB9 –DECEMBER 2022
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内容
5.3 Trademarks.................................................................3
5.4 Electrostatic Discharge Caution..................................3
5.5 术语表......................................................................... 3
6 Mechanical, Packaging, and Orderable Information....4
6.1 封装选项附录.............................................................. 5
6.2 卷带封装信息.............................................................. 6
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 修订历史记录.....................................................................2
5 Device and Documentation Support..............................3
5.1 接收文档更新通知....................................................... 3
5.2 支持资源......................................................................3
4 修订历史记录
注：以前版本的页码可能与当前版本的页码不同
日期
修订版本
说明
December 2022
*
初始发行版
Copyright © 2022 Texas Instruments Incorporated
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5 Device and Documentation Support
5.1 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
5.2 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
5.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
5.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
5.5 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
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6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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6.1 封装选项附录
封装信息
状态(1)
环保计划(2)
铅/焊球镀层(4)
MSL 峰值温度(3)
工作温度(°C)
-40 至125
器件标识(5) (6)
可订购器件
封装类型
封装图
引脚
包装数量
环保（符合
RoHS 标准，
无锑/溴）
LEVEL3-260C-168
HR
TPS92667QPHPRQ1
ACTIVE
HTQFP
PHP
48
1000
Cu NiPdAu
TPS92667Q
(1) 销售状态值定义如下：
正在供货：建议用于新设计的产品器件。
限期购买：TI 已宣布器件即将停产，但仍在购买期限内。
NRND：不建议用于新设计。为支持现有客户，器件仍在生产，但TI 不建议在新设计中使用此器件。
PRE_PROD：未发布的器件，尚未投产，未向大众市场供货，也未在网络上供应，样片不可用。
预发布：器件已发布，但未投产。可能提供样片，也可能无法提供样片。
已停产: TI 已停止生产该器件。
空白
(2) 环保计划- 规划的环保分级包括：无铅(RoHS)，无铅（RoHS 豁免）或绿色（RoHS，无锑/溴）- 如需了解最新供货信息及更多产品内容详情，请访问http://www.ti.com/productcontent。
待定：无铅/绿色转换计划尚未确定。
无铅(RoHS)：TI 所说的“无铅”或“无Pb”是指半导体产品符合针对所有6 种物质的现行RoHS 要求，包括要求铅的重量不超过同质材料总重量的0.1%。因在设计时就考虑到了高温
焊接要求，因此TI 的无铅产品适用于指定的无铅作业。
无铅（RoHS 豁免）：该元件在以下两种情况下可享受RoHS 豁免：1) 芯片和封装之间使用铅基倒装芯片焊接凸点；2) 芯片和引线框之间使用铅基芯片粘合剂。否则，元件将根据上述规
定视为无铅（符合RoHS）。
绿色（RoHS，无锑/溴）：TI 将“绿色”定义为无铅（符合RoHS 标准）、无溴(Br) 和无锑(Sb) 基阻燃剂（Br 或Sb 在同质材料中的质量不超过总质量的0.1%）
空白
(3) MSL，峰值温度-- 湿敏等级额定值（符合JEDEC 工业标准分级）和峰值焊接温度。
空白
(4) 铅/焊球镀层- 可订购器件可能有多种镀层材料选项。各镀层选项用垂直线隔开。如果铅/焊球镀层值超出最大列宽，则会折为两行。
空白
(5) 器件上可能还有与标识、批次跟踪代码或环境分级相关的标记。
空白
(6) 括号内将包含多个器件标识。不过，器件上仅显示括号中以“~”隔开的其中一个器件标志。如果某一行缩进，说明该行续接上一行，这两行合在一起表示该器件的完整器件标识。
重要信息和免责声明：本页面上提供的信息代表TI 在提供该信息之日的认知和观点。TI 的认知和观点基于第三方提供的信息，TI 不对此类信息的正确性做任何声明或保证。TI 正在致力于更好地整合第三方信息。
TI 已经并将继续采取合理的措施来提供有代表性且准确的信息，但是可能尚未对引入的原料和化学制品进行破坏性测试或化学分析。TI 和TI 供应商认为某些信息属于专有信息，因此可能不会公布其CAS 编号及
其它受限制的信息。
在任何情况下，TI 对由此类信息产生的责任决不超过本文档中发布的TI 每年销售给客户的TI 器件总购买价。
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6.2 卷带封装信息
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
卷带
宽度W1
（mm）
A0
（mm）
B0
（mm）
K0
（mm）
P1
（mm）
W
Pin1
象限
卷带
直径（mm）
封装
类型
SPQ
器件
封装图
引脚
（mm）
TPS92667QPHPRQ1
HTQFP
PHP
48
1000
330
16.4
9.6
9.6
1.5
12
16
Q2
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TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
SPQ
长度（mm） 宽度（mm）
336.6 336.6
高度（mm）
器件
封装类型
HTQFP
封装图
PHP
引脚
48
TPS92667QPHPRQ1
1000
31.8
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PACKAGE OUTLINE
PowerPAD TM HTQFP - 1.2 mm max height
PHP0048L
SCALE 1.900
PPLLAASSTTICICQQUUAADDFFLLAATTPPAACCKK
7.2
6.8
B
NOTE 3
37
48
PIN 1 ID
1
36
7.2
6.8
9.2
TYP
8.8
NOTE 3
12
25
13
24
A
0.27
48X
44X 0.5
0.17
0.08
C A B
4X 5.5
1.2 MAX
C
SEATING PLANE
SEE DETAIL A
0.08
(0.13)
TYP
13
24
12
25
0.25
(1)
GAGE PLANE
5.00
4.23
49
0.75
0.45
0.15
0.05
0 -7
A
16
1
36
DETAIL A
TYPICAL
48
37
5.00
4.23
4X (0.25) NOTE 5
4226599/A 05/2021
PowerPAD is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MS-026.
5. Feature may not be present.
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EXAMPLE BOARD LAYOUT
PowerPADTM HTQFP - 1.2 mm max height
PHP0048L
PLASTIC QUAD FLATPACK
( 6.5)
NOTE 10
(5)
SYMM
48
37
SOLDER MASK
DEFINED PAD
48X (1.6)
1
36
48X (0.3)
(5)
SYMM
49
(1.1 TYP)
(8.5)
44X (0.5)
12
25
(R0.05) TYP
(
0.2) TYP
VIA
METAL COVERED
BY SOLDER MASK
13
24
(1.1 TYP)
SEE DETAILS
(8.5)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4226599/A 05/2021
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. See technical brief, Powerpad thermally enhanced package,
Texas Instruments Literature No. SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged
or tented.
10. Size of metal pad may vary due to creepage requirement.
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EXAMPLE STENCIL DESIGN
PowerPADTM HTQFP - 1.2 mm max height
PHP0048L
PLASTIC QUAD FLATPACK
(5)
BASED ON
0.125 THICK STENCIL
SEE TABLE FOR
SYMM
DIFFERENT OPENINGS
FOR OTHER STENCIL
THICKNESSES
48
37
48X (1.6)
1
36
48X (0.3)
(8.5)
(5)
BASED ON
0.125 THICK
STENCIL
SYMM
49
44X (0.5)
12
25
(R0.05) TYP
METAL COVERED
BY SOLDER MASK
24
13
(8.5)
SOLDER PASTE EXAMPLE
EXPOSED PAD
100% PRINTED SOLDER COVERAGE BY AREA
SCALE:8X
STENCIL
THICKNESS
SOLDER STENCIL
OPENING
0.1
5.59 X 5.59
5.00 X 5.00 (SHOWN)
4.56 X 4.56
0.125
0.150
0.175
4.23 X 4.23
4226599/A 05/2021
NOTES: (continued)
11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
12. Board assembly site may have different recommendations for stencil design.
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PACKAGE OPTION ADDENDUM
www.ti.com
9-Dec-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS92667QPHPRQ1
ACTIVE
HTQFP
PHP
48
1000 RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 125
TPS92667Q
Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
GENERIC PACKAGE VIEW
PHP 48
7 x 7, 0.5 mm pitch
TQFP - 1.2 mm max height
QUAD FLATPACK
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4226443/A
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PACKAGE OUTLINE
PHP0048L
PowerPADTM HTQFP - 1.2 mm max height
SCALE 1.900
PLASTIC QUAD FLATPACK
7.2
6.8
B
NOTE 3
37
48
PIN 1 ID
1
36
7.2
6.8
9.2
TYP
8.8
NOTE 3
12
25
13
24
A
0.27
48X
44X 0.5
0.17
0.08
C A B
4X 5.5
1.2 MAX
C
SEATING PLANE
SEE DETAIL A
(0.13)
TYP
0.08
13
24
12
25
0.25
(1)
GAGE PLANE
5.00
4.23
49
0.75
0.45
0.15
0.05
0 -7
A
16
1
36
DETAIL A
TYPICAL
48
37
5.00
4.23
4X (0.25) NOTE 5
4226599/A 05/2021
PowerPAD is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MS-026.
5. Feature may not be present.
www.ti.com
EXAMPLE BOARD LAYOUT
PHP0048L
PowerPADTM HTQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
(
6.5)
NOTE 10
(5)
SYMM
48
37
SOLDER MASK
DEFINED PAD
48X (1.6)
1
36
48X (0.3)
(5)
SYMM
49
(1.1 TYP)
(8.5)
44X (0.5)
12
25
(R0.05) TYP
(
0.2) TYP
VIA
METAL COVERED
BY SOLDER MASK
13
24
(1.1 TYP)
SEE DETAILS
(8.5)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4226599/A 05/2021
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. See technical brief, Powerpad thermally enhanced package,
Texas Instruments Literature No. SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged
or tented.
10. Size of metal pad may vary due to creepage requirement.
www.ti.com
EXAMPLE STENCIL DESIGN
PHP0048L
PowerPADTM HTQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
(5)
BASED ON
0.125 THICK STENCIL
SEE TABLE FOR
SYMM
DIFFERENT OPENINGS
FOR OTHER STENCIL
THICKNESSES
48
37
48X (1.6)
1
36
48X (0.3)
(8.5)
(5)
BASED ON
0.125 THICK
STENCIL
SYMM
49
44X (0.5)
12
25
(R0.05) TYP
METAL COVERED
BY SOLDER MASK
24
13
(8.5)
SOLDER PASTE EXAMPLE
EXPOSED PAD
100% PRINTED SOLDER COVERAGE BY AREA
SCALE:8X
STENCIL
THICKNESS
SOLDER STENCIL
OPENING
0.1
5.59 X 5.59
5.00 X 5.00 (SHOWN)
4.56 X 4.56
0.125
0.150
0.175
4.23 X 4.23
4226599/A 05/2021
NOTES: (continued)
11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
12. Board assembly site may have different recommendations for stencil design.
www.ti.com
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