TPS92830QPWRQ1 [TI]

汽车类 3 通道高侧、高功率、恒流线性 LED 控制器 | PW | 28 | -40 to 125;
TPS92830QPWRQ1
型号: TPS92830QPWRQ1
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

汽车类 3 通道高侧、高功率、恒流线性 LED 控制器 | PW | 28 | -40 to 125

驱动 控制器 光电二极管 接口集成电路
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中文:  中文翻译
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TPS92830-Q1  
ZHCSGY7B OCTOBER 2017REVISED JANUARY 2018  
TPS92830-Q1 3 通道大电流线性 LED 控制器  
1 特性  
3 说明  
1
符合 AEC-Q100 标准  
在实现更佳的灯光均匀性的趋势下,高电流 LED 通常  
用于汽车前灯和后灯(配备灯光扩散器和导光板)。同  
时,为了满足严格的 EMC 和可靠性要求,线性 LED  
驱动器广泛用于汽车 应用。不过,通过集成功率晶体  
管为线性 LED 驱动器提供高电流是一项挑战。  
TPS92830-Q1 器件是一款先进的汽车级高侧恒定电流  
线性 LED 控制器,通过使用外部 N 沟道 MOSFET 提  
供高电流。该器件具有一整套用于 汽车 应用的 功能,  
并与各种 N 沟道 MOSFET 兼容。  
器件温度等级 1:环境运行温度范围为 -40°C  
125°C  
器件人体放电模型 (HBM) 静电防护 (ESD) 分类  
等级 H2  
器件组件充电模型 (CDM) ESD 分类等级 C4B  
4.5V 40V 的宽电压输入范围  
3 通道高侧电流驱动和检测  
通道独立的电流设置  
通道独立的 PWM 输入  
TPS92830-Q1 器件的每个通道可以通过感应电阻器值  
独立设置通道电流。内部精密恒定电流调节环路通过感  
应电阻器上的电压感应通道电流,并相应地控制 N 沟  
MOSFET 的栅极电压。该器件还集成了一个两级电  
荷泵,用于低压降运行。电荷泵电压足够高,可以支持  
各种 N 沟道 iMOSFETiPWM i调光i允许使用i多个  
通过 PWM 输入和电源实现 PWM 调光  
针对 EMC 优化的压摆率  
高精度 LED 驱动  
采用外部 N 沟道 MOSFET 的精密电流调节  
2.5% 容差)  
具有非板载 Bin 电阻支持的 20:1 模拟调光配置  
器件信息(1)  
具有全占空比屏蔽的精密 PWM 发生器(2% 容  
差)  
器件型号  
封装  
封装尺寸(标称值)  
用于同步的开漏 PWM 输出  
TPS92830-Q1  
TSSOP (28)  
9.70mm x 4.40mm  
保护和诊断  
(1) 要了解所有可用封装,请见数据表末尾的可订购产品附录。  
用于外部 MOSFET 热保护的可调节输出电流降  
简化原理图  
Battery  
具有自动恢复功能的 LED 灯串开路或短路诊断  
TPS92830-Q1  
针对低电压运行支持诊断并具有可调节阈值  
CP1P  
CP1N  
GND  
ISP  
多达 15 个器件的故障总线,可配置为连带失效  
或仅失效的通道关闭  
ISN1  
G1  
SENSE1  
CP2N  
CP2P  
CPOUT  
IN  
故障模式下具有较低的静态电流(每个器件小于  
0.75mA)  
ISN2  
G2  
工作结温范围:-40°C 150°C  
TSSOP 28 封装 (PW)  
SENSE2  
DIAGEN  
DERATE  
ISN3  
G3  
2 应用  
SENSE3  
PWMOUT  
FAULT  
后灯 尾灯和制动灯、后转向灯、雾灯、倒车灯  
前灯 位置灯、日间行车灯、前转向灯、近光灯  
PWM1  
PWM2  
PWM3  
FD  
FAULT Bus  
PWMCHG  
IREF  
Full Duty Cycle  
ICTRL  
Copyright © 2017, Texas Instruments Incorporated  
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,  
intellectual property matters and other important disclaimers. PRODUCTION DATA.  
English Data Sheet: SLIS178  
 
 
 
 
TPS92830-Q1  
ZHCSGY7B OCTOBER 2017REVISED JANUARY 2018  
www.ti.com.cn  
目录  
8.2 Functional Block Diagram ....................................... 14  
8.3 Feature Description................................................. 15  
8.4 Device Functional Modes........................................ 29  
Application and Implementation ........................ 30  
9.1 Application Information............................................ 30  
9.2 Typical Applications ................................................ 30  
1
2
3
4
5
6
7
特性.......................................................................... 1  
应用.......................................................................... 1  
说明.......................................................................... 1  
修订历史记录 ........................................................... 2  
说明 (续.............................................................. 4  
Pin Configuration and Functions......................... 4  
Specifications......................................................... 6  
7.1 Absolute Maximum Ratings ...................................... 6  
7.2 ESD Ratings ............................................................ 6  
7.3 Recommended Operating Conditions....................... 6  
7.4 Thermal Information.................................................. 7  
7.5 Electrical Characteristics........................................... 7  
7.6 Timing Requirements................................................ 9  
7.7 Typical Characteristics............................................ 11  
Detailed Description ............................................ 14  
8.1 Overview ................................................................. 14  
9
10 Layout................................................................... 36  
10.1 Layout Guidelines ................................................. 36  
10.2 Layout Example .................................................... 36  
11 器件和文档支持 ..................................................... 37  
11.1 接收文档更新通知 ................................................. 37  
11.2 社区资源................................................................ 37  
11.3 ....................................................................... 37  
11.4 静电放电警告......................................................... 37  
11.5 Glossary................................................................ 37  
12 机械、封装和可订购信息....................................... 37  
8
4 修订历史记录  
注:之前版本的页码可能与当前版本有所不同。  
Changes from Revision A (October 2017) to Revision B  
Page  
Changed timing specification for PWM duty cycle ................................................................................................................. 9  
Changes from Original (July 2017) to Revision A  
Page  
特性 部分中更改了电流调节和 PWM 发生器的容差............................................................................................................ 1  
Changed values for several parameters throughout the Electrical Characteristics table....................................................... 7  
Changed parameter definitions for I(DRV_source) and I(DRV_sink) in the Electrical Chaaracteristics table ..................................... 7  
Changed parameter symbols for analog dimming accuracy in the Electrical Characteristics table....................................... 8  
Changed parameter descriptions for V(OPEN_th_rising), V(OPEN_th_falling), ....................................................................................... 8  
Changed parameter descriptions for t(SG_retry_OFF) and t(OPEN_retry_OFF) in the Timing Requirements table............................... 9  
Added a condition for Typical Characteristic 6 ............................................................................................................... 11  
Deleted a condition from Typical Characteristic 8 .......................................................................................................... 12  
Deleted a Fast Power Down and Slow Power Up typical characteristic graph.................................................................... 12  
Added a Fast Power Down and Slow Power Up typical characteristic graph...................................................................... 13  
Added a condition for Typical Characteristic 17 ............................................................................................................. 13  
Added a condition for Typical Characteristic 18 .............................................................................................................. 13  
Changed heat dissipation to current distribution in Parallel MOSFET Driving..................................................................... 17  
Deleted a sentence from the PWM Dimming by Input section............................................................................................. 18  
Added resistor and capacitor reference designators............................................................................................................ 19  
Deleted percentage values for V(ICTRL_LIN_BOT) and V(ICTRL_LIN_TOP) in the Analog Dimming Topology section...................... 21  
Changed V(SG_th_rising) and V(SG_th_falling) with each other in the LED Short-to-GND Detection section .................................. 25  
Changed symbol of short-to-ground retry current to I(Retry_short) ............................................................................................ 26  
Changed symbol of LED-open retry current to I(Retry_open) in the LED Open-Circuit Auto Retry section............................... 26  
Changed some FAULT TYPE names in 4....................................................................................................................... 29  
Updated application schematic. ........................................................................................................................................... 30  
Changed the value of R8 from 75 kΩ to 76 kΩ for the PWM threshold setting ................................................................... 31  
Changed the equation for calculating K(RES_DiagEn)................................................................................................................ 31  
2
版权 © 2017–2018, Texas Instruments Incorporated  
 
TPS92830-Q1  
www.ti.com.cn  
ZHCSGY7B OCTOBER 2017REVISED JANUARY 2018  
Changed the values of R13 and R6 for ............................................................................................................................... 31  
Changed the equation for calculating K(RES_DERATE).............................................................................................................. 31  
Changed component values inthe PWM equations of the Detailed Design Procedure ....................................................... 33  
Added an application curve .................................................................................................................................................. 34  
Added text in the Layout Guidelines for keeping LED ground separate from device ground .............................................. 36  
版权 © 2017–2018, Texas Instruments Incorporated  
3
TPS92830-Q1  
ZHCSGY7B OCTOBER 2017REVISED JANUARY 2018  
www.ti.com.cn  
5 说明 (续)  
源以实现灵活性 - 内部 PWM 发生器、外部 PWM 输入或电源调光。各种专为汽车应用 设计的 诊断和保护可 帮助  
提高系统稳健性和易用性。连带失效故障总线支持 TPS92830-Q1 TPS92630-Q1TPS92638-Q1 和  
TPS9261x-Q1 系列一同运行,以满足各种故障处理要求。  
6 Pin Configuration and Functions  
PW Package  
28-Pin TSSOP  
Top View  
CP1P  
CP1N  
GND  
1
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
ISP  
2
ISN1  
3
G1  
CP2N  
CP2P  
CPOUT  
IN  
4
SENSE1  
ISN2  
5
6
G2  
7
SENSE2  
ISN3  
DIAGEN  
DERATE  
PWM1  
PWM2  
PWM3  
FD  
8
9
G3  
10  
11  
12  
13  
14  
SENSE3  
PWMOUT  
FAULT  
PWMCHG  
IREF  
ICTRL  
Not to scale  
Pin Functions  
PIN  
I/O  
DESCRIPTION  
NAME  
CP1N  
NO.  
2
Charge pump first-stage flying capacitor negative output, charge pump to provide gate-drive  
voltage for external MOSFET. Connect a 10-nF flying capacitor between CP1P and CP1N.  
O
O
O
CP1P  
CP2N  
1
Charge pump first-stage flying capacitor positive output  
Charge pump second-stage flying capacitor negative output. Connect a 10-nF flying  
capacitor between CP2P and CP2N.  
4
CP2P  
5
6
9
O
O
I
Charge pump second-stage flying capacitor positive output  
CPOUT  
DERATE  
Charge-pump output voltage. Connect a 150-nF storage capacitor between CPOUT and IN.  
Voltage input for current derating. Connect to GND to disable the derate feature.  
Input pin with comparator to enable diagnostics to avoid false open-fault diagnostics when  
the device works in low-dropout mode. Use a resistor divider to set a threshold according to  
the LED forward voltage.  
DIAGEN  
8
I
Fault bus pin to support one-fails–all-fail feature. Float: one-fails–all-fail; strong pullup: only-  
fails-off  
FAULT  
FD  
17  
13  
I/O  
I
Full duty-cycle input, HIGH: 100% PWM; LOW: using external resistor-capacitor network to  
set PWM duty cycle  
4
Copyright © 2017–2018, Texas Instruments Incorporated  
TPS92830-Q1  
www.ti.com.cn  
ZHCSGY7B OCTOBER 2017REVISED JANUARY 2018  
Pin Functions (continued)  
PIN  
I/O  
DESCRIPTION  
NAME  
NO.  
26  
23  
20  
3
G1  
G2  
G3  
O
O
Channel 1 gate driver output, connect to CH 1 N-channel MOSFET gate  
Channel 2 gate driver output, connect to CH 2 N-channel MOSFET gate  
Channel 3 gate driver output, connect to CH 3 N-channel MOSFET gate  
GND  
O
GND  
Analog dimming input, modulates the regulation voltage across the current-sense resistor.  
Apply a voltage source or connect a resistor between ICTRL and GND to set the analog  
dimming ratio.  
ICTRL  
14  
I
IN  
7
I
I
Power supply for the device. LED current only flows from the external MOSFET to the LED.  
Channel 1 current-sense negative input. Connect a current-sense resistor between ISP and  
ISN1 to set the CH 1 current.  
ISN1  
27  
Channel 2 current-sense negative input. Connect a current-sense resistor between ISP and  
ISN2 to set the CH 2 current.  
ISN2  
ISN3  
24  
21  
I
I
Channel 3 current-sense negative input. Connect a current-sense resistor between ISP and  
ISN3 to set the CH 3 current.  
IREF  
15  
28  
10  
11  
12  
O
I
Internal current reference. Connect an 8-kΩ resistor between IREF and GND,  
Channel current-sense positive input. Kelvin-sense to LED sense-resistor positive node.  
Channel 1 PWM input  
ISP  
PWM1  
PWM2  
PWM3  
I
I
Channel 2 PWM input  
I
Channel 3 PWM input  
On-chip PWM generator pin for external R-C. Connect a resistor and a capacitor between  
PWMCHG and GND to set the PWM duty cycle and frequency.  
PWMCHG  
16  
I/O  
PWMOUT  
SENSE1  
SENSE2  
SENSE3  
18  
25  
22  
19  
O
High-voltage PWM open-drain output. Connect a 10-kΩ resistor between IN and PWMOUT  
Channel 1 diagnostics pin. Connect to the CH 1 MOSFET source terminal  
Channel 2 diagnostics pin. Connect to the CH 2 MOSFET source terminal  
Channel 3 diagnostics pin. Connect to the CH 3 MOSFET source terminal  
I/O  
I/O  
I/O  
Copyright © 2017–2018, Texas Instruments Incorporated  
5
TPS92830-Q1  
ZHCSGY7B OCTOBER 2017REVISED JANUARY 2018  
www.ti.com.cn  
7 Specifications  
7.1 Absolute Maximum Ratings  
over operating junction temperature range TJ= –40°C to 150°C (unless otherwise noted)(1)  
MIN  
MAX  
UNIT  
Supply voltage  
Input voltage  
IN(2)  
–0.3  
45(3)  
V
DERATE, DIAGEN, FD, ICTRL, ISN1, ISN2,  
ISN3, ISP, PWM1, PWM2, PWM3, PWMOUT,  
SENSE1, SENSE2, SENSE3(2)  
–0.3  
V(IN) + 0.3  
V
Output voltage  
CP1P, CP2P, CPOUT, G1, G2, G3(2)  
–0.3  
–0.3  
–1  
V(IN) + 10  
V
V
Current-sense voltage  
Gate-source voltage  
V(ISP) – V(ISNx)  
1
12  
V(Gx) – V(SENSEx)  
V
FAULT(2)  
CP1N, CP2N, IREF, PWMCHG(2)  
–0.3  
–0.3  
–65  
-40  
22  
V
I/O  
6
V
Storage temperature, Tstg  
Junction temperature, TJ  
150  
150  
°C  
°C  
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings  
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended  
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) All voltages are with respect to GND.  
(3) Absolute maximum voltage 45 V for 200 ms.  
7.2 ESD Ratings  
VALUE  
UNIT  
Human-body model (HBM), per AEC Q100-002(1)  
±2000  
Corner pins (CP1P,  
ICTRL, IREF, ISP)  
V(ESD)  
Electrostatic discharge  
±750  
±500  
V
Charged-device model (CDM), per AEC  
Q100-011  
Other pins  
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.  
7.3 Recommended Operating Conditions  
over operating junction temperature range TJ= –40°C to 150°C (unless otherwise noted)  
MIN  
4.5  
0
MAX  
UNIT  
V
Device supply voltage  
Sense voltage  
IN  
40  
V(IN)  
V(IN)  
V(IN)  
1
ISP  
V
PWM inputs  
PWMx  
DIAGEN  
V(ISP) – V(ISNx)  
FAULT  
PWMOUT  
ICTRL  
DERATE  
FD  
0
V
Diagnostics enable pin  
Current-sense voltage  
Fault bus  
0
V
0
V
0
20  
V
PWM open-drain output  
Analog dimming input  
Current derating input  
Full duty-cycle input  
0
V(IN)  
V(IN)  
V(IN)  
V(IN)  
V
0
V
0
V
0
V
6
Copyright © 2017–2018, Texas Instruments Incorporated  
TPS92830-Q1  
www.ti.com.cn  
ZHCSGY7B OCTOBER 2017REVISED JANUARY 2018  
7.4 Thermal Information  
TPS92830-Q1  
THERMAL METRIC(1)  
PW (TSSOP)  
28 PINS  
79.4  
UNIT  
RθJA  
Junction-to-ambient thermal resistance  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
RθJC(top)  
RθJB  
Junction-to-case (top) thermal resistance  
Junction-to-board thermal resistance  
20.1  
37.4  
ψJT  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
Junction-to-case (bottom) thermal resistance  
0.5  
ψJB  
36.9  
RθJC(bot)  
N/A  
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.  
7.5 Electrical Characteristics  
VIN = 5 V to 40 V, VICTRL = 3 V, VDERATE = 0 V, TJ= –40°C to 150°C,(1) (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
BIAS  
Supply voltage POR, rising  
threshold  
V(POR_rising)  
4.5  
V
I(Quiescent)  
I(FAULT)  
Device standby current  
Device current in fault mode  
Reference current  
PWMx = HIGH, FD = HIGH  
PWMx = HIGH, FAULT = LOW  
R(IREF) = 8 k  
3.5  
0.5  
99  
mA  
mA  
µA  
nF  
0.75  
4.3  
10  
I(IREF)  
C(IREF)  
IREF loading capacitance  
R(IREF) = 8 kΩ  
0
CHARGE PUMP  
V(cp_drv)  
Charge-pump operating voltage  
6.1  
8.5  
V
Charge-pump switching  
frequency  
f(cp_sw)  
2.65  
MHz  
C(cp_flying)  
Charge-pump flying capacitor  
Charge-pump storage capacitor  
10  
nF  
nF  
C(cp_storage)  
150  
HIGH-PRECISION LOGIC INPUTS (DIAGEN, PWMx, FD)  
VIL(DIAGEN)  
Input logic-low voltage, DIAGEN  
1.105  
1.193  
1.145  
1.224  
1.185  
1.255  
V
V
Input logic-high voltage,  
DIAGEN  
VIH(DIAGEN)  
VIL(PWMx)  
VIH(PWMx)  
VIL(FD)  
Input logic-low voltage, PWMx  
Input logic-high voltage, PWMx  
Input logic-low voltage, FD  
Input logic-high voltage, FD  
1.094  
1.176  
1.105  
1.186  
1.128  
1.212  
1.133  
1.216  
1.161  
1.248  
1.161  
1.246  
V
V
V
V
VIH(FD)  
CONSTANT-CURRENT EXTERNAL N-CHANNEL MOSFET DRIVER  
Current-sense-resistor  
regulation voltage  
V(CS_REG_FULL)  
V(ICTRL) = 3 V, V(DERATE) = 0 V  
295  
mV  
V(ICTRL) = 3 V, V(DERATE) = 0 V,  
channel accuracy  
–1.5%  
–2.5%  
190  
1.5%  
2.5%  
270  
Current-sense-resistor  
regulation-voltage accuracy  
(2)(3)  
V(CS)  
V(ICTRL) = 3 V, V(DERATE) = 0 V,  
device accuracy  
Gate-driver current-source  
capability at Gx  
I(DRV_source)  
230  
µA  
(1) External N-channel MOSFET Ciss = 200 pF, Coss = 70 pF, at VDS = 25 Vdc, VGS = 0 Vdc, f = 1 MHz, Vth= 4 V, compensation capacitor  
Cgs = 4 nF  
3ì V CS _REG_ x  
(
)
DV CS _ Channel_ CHx = 1-  
,x = 1,2,3  
(
)
V
+ V CS _REG_ 2 + V CS _REG_ 3  
(
)
CS _REG_1  
(
)
(
)
(
)
(2)  
(3)  
V CS _REG _ x  
(
DV CS _Device _ CHx = 1-  
) ,x = 1,2,3  
(
)
0.295  
Copyright © 2017–2018, Texas Instruments Incorporated  
7
TPS92830-Q1  
ZHCSGY7B OCTOBER 2017REVISED JANUARY 2018  
www.ti.com.cn  
Electrical Characteristics (continued)  
VIN = 5 V to 40 V, VICTRL = 3 V, VDERATE = 0 V, TJ= –40°C to 150°C,(1) (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
Gate-driver current-sink  
capability at Gx  
I(DRV_sink)  
190  
230  
270  
–0.5  
11.3  
2.3  
µA  
Gate-source negative clamp  
voltage  
V(GS_clamp_neg)  
V(GS_clamp_pos)  
I(ISNx_leakage)  
–0.9  
9.8  
–0.7  
10.4  
1.3  
V
V
Gate-source positive clamp  
voltage  
Leakage current sink on ISNx  
pins  
µA  
INTERNAL PWM DIMMING  
Internal PWM generator, rising  
V(PWMCHG_th_rising)  
1.45  
0.78  
1.48  
0.8  
1.51  
0.82  
V
V
threshold  
Internal PWM generator, falling  
threshold  
V(PWMCHG_th_falling)  
V(PWMCHG_th_hys)  
I(PWMCHG)  
Internal PWM generator  
hysteresis  
0.68  
200  
V
µA  
V
PWM generator pullup current  
V(PWMCHG) = 0 V, FD = LOW  
194  
40  
206  
0.4  
Open-drain PWMOUT pulldown V(PWMCHG) = 3 V, I(PWMOUT) pullup  
voltage  
VOL(PWMOUT)  
current = 4 mA  
Open-drain PWMOUT pulldown  
MOSFET rDS(on)  
rDS(on)(PWMOUT)  
55  
90  
ANALOG DIMMING  
V(ICTRL_FULL)  
Full-range ICTRL voltage  
1.65  
V
V
Upper boundary for linear  
ICTRL dimming  
V(ICTRL_LIN_TOP)  
V(ICTRL_LIN_BOT)  
1.425  
75  
Lower boundary for linear  
ICTRL dimming  
mV  
V(ICTRL) = 1.35 V, V(DERATE) = 0 V,  
accuracy: 1 – (V(CS_REG_x) / 0.27), x =  
1, 2, 3  
V(CS_ ICTRL_H)  
V(CS_ ICTRL_M)  
V(CS_ ICTRL_L)  
Analog dimming accuracy  
Analog dimming accuracy  
–2.5%  
–4%  
2%  
4%  
V(ICTRL) = 0.75 V, V(DERATE) = 0 V,  
accuracy: 1 – (V(CS_REG_x) / 0.15), x =  
1, 2, 3  
V(ICTRL) = 0.15 V, V(DERATE) = 0 V,  
accuracy: 1 –V(CS_REG_x) / 0.03, x =  
1, 2, 3  
Analog dimming accuracy  
–18%  
0.95  
18%  
1.02  
I(ICTRL_pullup)  
ICTRL internal pullup current  
0.985  
mA  
CURRENT DERATING  
V(DERATE_FULL)  
Full-range DERATE voltage  
Half-range DERATE voltage  
1.83  
2.38  
87%  
58%  
V
V
V(DERATE_HALF)  
V(DERATE) = 1.966 V  
V(DERATE) = 2.316 V  
81%  
51%  
95%  
65%  
K(DERATE)  
Derate dimming ratio  
DIAGNOSTICS  
LED open rising threshold,  
device triggers open-circuit  
diagnostics V(SG_th_rising), and  
V(SG_th_falling) in the Electrical  
Characteristics table  
V(OPEN_th_rising)  
V(ISNx) – V(SENSEx), x = 1, 2, 3  
100  
145  
280  
190  
mV  
mV  
LED open falling threshold,  
device releases from open-  
circuit diagnostics  
V(OPEN_th_falling)  
V(ISNx) – V(SENSEx), x = 1, 2, 3  
240  
8
320  
12  
V(OPEN_th_hyst)  
I(Retry_open)  
135  
10  
mV  
mA  
LED-open retry current  
8
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Electrical Characteristics (continued)  
VIN = 5 V to 40 V, VICTRL = 3 V, VDERATE = 0 V, TJ= –40°C to 150°C,(1) (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
Channel output VSENSEx short-  
to-ground rising threshold,  
device triggers short-to-ground  
diagnostics  
V(SG_th_rising)  
0.885  
0.92  
0.95  
V
Channel output VSENSEx short-  
to-ground falling threshold,  
device releases from short-to-  
ground diagnostics  
V(SG_th_falling)  
1.17  
1.215  
1.26  
V
Channel output VSENSEx short-  
to-ground hysteresis  
V(SG_th_hyst)  
I(Retry_short)  
295  
1
mV  
mA  
Channel output VSENSEx short-  
to-ground retry current  
0.75  
2
1.25  
0.7  
FAULT  
VIL(FAULT)  
VIH(FAULT)  
VOL(FAULT)  
VOH(FAULT)  
Logic-input low threshold  
Logic-input high threshold  
Logic-output low threshold  
Logic-output high threshold  
V
V
V
V
With 500-µA external pullup  
With 1-µA external pulldown  
0.4  
3.4  
2.7  
650  
6.5  
FAULT internal pulldown  
current  
I(FAULT_pulldown)  
I(FAULT_pullup)  
750  
7.6  
800  
9.5  
µA  
µA  
FAULT internal pullup current  
THERMAL PROTECTION  
T(TSD)  
Thermal shutdown threshold  
Thermal shutdown hysteresis  
176  
15  
ºC  
ºC  
T(TSD_HYS)  
7.6 Timing Requirements  
MIN  
NOM  
MAX  
UNIT  
LED open-circuit deglitch time, described in LED open-circuit  
diagnostics section  
t(OPEN_deg)  
t(SG_deg)  
t(SG_retry_ON)  
t(SG_retry_OFF)  
100  
125  
125  
125  
150  
150  
150  
µs  
µs  
µs  
LED short-to-GND detection deglitch time, described in the LED short-  
to-GND diagnostics section  
100  
100  
Channel output SENSEx short-to-ground retry on-time, described in the  
LED short-to-GND auto retry section  
Channel output SENSEx short-to-ground retry off-time, described in  
LED short-to-GND auto retry section  
10.8  
125  
ms  
µs  
tOPEN_retry_ON) Channel output SENSEx open-circuit retry on-time  
100  
150  
t(OPEN_retry_OF  
F)  
Channel output SENSEx open-circuit retry off-time  
10.8  
ms  
PWM duty cycle generated internally, nominal 10% duty cycle, as  
measured on output channel; see 1T(J) = 25ºC  
9.8%  
10%  
10%  
25  
10.2%  
D(PWM_10)  
PWM duty cycle generated internally, nominal 10% duty cycle, as  
measured on output channel; see 1T(J) = -40ºC to 150ºC  
9.75%  
10.25%  
Derate current-response delay time when DERATE steps from 1.8 V to  
2.4 V  
td(DERATE)  
µs  
V(IN) = 14 V, Cs = 150 nF, CPOUT voltage reaches 18 V as shown in  
Device Start-Up Delay diagram  
t(CP_STARTUP)  
25  
µs  
f(DRV_PWM)  
Recommended PWM driving-frequency range  
2000  
Hz  
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Input On-Time  
PWMx  
90%  
90%  
Channel  
Current  
IOUTx  
Output On-Time  
10%  
t1  
10%  
t6  
t2  
t3  
t4  
t5  
Copyright © 2017, Texas Instruments Incorporated  
1. Channel-Current Output Timing Diagram  
10  
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7.7 Typical Characteristics  
TA = 25 ºC unless otherwise noted  
300  
298  
296  
294  
292  
290  
300  
298  
296  
294  
292  
290  
-40èC  
25èC  
125èC  
-40 -25 -10  
5
20 35 50 65 80 95 110 125  
4
10  
16  
22  
28  
34  
40  
Temperature (èC)  
Supply Voltage (V)  
D001  
D002  
V(IN) = 14 V  
V(ICTRL) = 1.8 V  
V(ICTRL) = 1.8 V  
2. Full-Range Current-Sense Voltage vs Ambient  
3. Full-Range Current-Sense Voltage vs Supply Voltage  
Temperature  
0.35  
0.3  
5
-40èC  
25èC  
125èC  
0.25  
0.2  
-40èC, I(FAULT)  
25èC, I(FAULT)  
125èC, I(FAULT)  
-40èC, I(Quiescent)  
25èC, I(Quiescent)  
0.15  
0.1  
1
125èC, I(Quiescent)  
0.05  
0
0.4  
4
10  
16  
22  
28  
34  
40  
0
0.2  
0.4  
0.6  
0.8  
V(ICTRL) (V)  
1
1.2  
1.4  
1.6  
1.8  
Supply Voltage (V)  
D003  
D001  
V(IN) = 14 V  
5. Device Current vs Supply Voltage  
4. Current-Sense Voltage vs ICTRL Input Voltage  
100%  
50%  
102%  
96%  
90%  
84%  
78%  
72%  
66%  
60%  
54%  
48%  
30%  
20%  
10%  
5%  
3%  
2%  
1%  
0.5%  
0.3%  
0.2%  
1%  
2% 3%  
5% 7% 10%  
20% 30% 50%  
100%  
1.7  
1.8  
1.9  
2
2.1  
2.2  
2.3  
2.4  
2.5  
Input Duty Cycle  
Derate Voltage (V(DERATE)  
)
D002  
D003  
V(IN) = 14 V  
f(PWM)= 200 Hz  
V(ICTRL) = 1.8 V  
V(IN) = 14 V  
6. Duty Cycle of PWM Dimming-Current Output vs PWM  
7. Current-Derating Profile; Output-Current Ratio vs  
Input Duty Cycle  
DERATE Voltage  
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Typical Characteristics (接下页)  
TA = 25 ºC unless otherwise noted  
Ch. 1 = PWMCHG  
V(IN) = 14 V  
Ch. 2 = PWMOUT  
Ch. 4 = I(OUT1)  
Ch. 1 = PWM1  
Ch. 4 = I(OUT1)  
Ch. 2 = G1  
V(IN) = 14 V  
Ch. 3 = SENSE1  
9. PWM Generator  
8. PWM Dimming  
Ch. 1 = V(IN)  
Ch. 2 = G1  
Ch. 3 = SENSE1  
Ch. 1 = V(IN)  
Ch. 2 = G1  
Ch. 3 = SENSE1  
Ch. 4 = I(OUT1)  
Ch. 4 = I(OUT1)  
10. Undervoltage  
11. Transient Overvoltage  
Ch. 1 = V(IN)  
Ch. 2 = G1  
ƒ = 15 Hz  
Ch. 3 = SENSE1  
Ch. 1 = V(IN)  
Ch. 2 = G1  
Ch. 3 = SENSE1  
Ch. 4 = I(OUT1)  
Ch. 4 = I(OUT1)  
13. Superimposed Alternating Voltage  
12. Jump Start  
12  
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Typical Characteristics (接下页)  
TA = 25 ºC unless otherwise noted  
Ch. 1 = V(IN)  
Ch. 2 = G1  
Ch. 3 = SENSE1  
Ch. 1 = V(IN)  
Ch. 2 = G1  
Ch. 3 = SENSE1  
Ch. 4 = I(OUT1)  
Ch. 4 = I(OUT1)  
15. Slow Decrease, Quick Increase of Supply Voltage  
14. Fast Power Down and Slow Power Up  
Ch. 1 = FAULT  
Ch. 2 = SENSE1  
Ch. 3 = SENSE2  
Ch. 1 = V(IN)  
Ch. 4 = I(OUT1)  
Ch. 2 = G1  
Ch. 3 = SENSE1  
Ch. 4 = SENSE3  
LED open-circuit on SENSE1  
16. Slow Decrease and Slow Increase of Supply Voltage  
17. LED Open-Circuit Protection and One-Fails–All-Fail  
Ch. 1 = V(IN)  
Ch. 2 = CP1N  
Ch. 3 = CPOUT  
Ch. 1 = FAULT  
Ch. 4 = I(OUT1)  
Ch. 2 = SENSE1  
Ch. 3 = G1  
LED short-to-ground on SENSE1  
19. Device Start-Up Delay  
18. LED Hard Short Protection and One-Fails–All-Fail  
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8 Detailed Description  
8.1 Overview  
The TPS92830-Q1 device is an advanced automotive-grade high-side constant-current linear LED controller for  
delivering high current using external N-channel MOSFETs. The device has a full set of features for automotive  
applications. Each channel of the TPS92830-Q1 device sets the channel current independently by the sense-  
resistor value. An internal precision constant-current regulation loop senses the channel current by the voltage  
across the sense resistor and controls the gate voltage of the N-channel MOSFET accordingly. The device also  
integrates a two-stage charge pump for low-dropout operation. The charge-pump voltage is high enough to  
support a wide selection of N-channel MOSFETs. PWM dimming allows multiple sources for flexibility—internal  
PWM generator, external PWM inputs, or power-supply dimming. Various diagnostics and protection features  
specially designed for automotive applications help improve system robustness and ease of use. A one-fails–all-  
fail fault bus supports TPS92830-Q1 operation together with the TPS92630-Q1, TPS92638-Q1, and TPS9261x-  
Q1 family to fulfill various fault-handling requirements.  
8.2 Functional Block Diagram  
SUPPLY  
CP1N  
CP1P CP2N  
CP2P  
CPOUT  
TPS92830-Q1  
CURRENT  
REGULATION  
DRIVER X3  
IN  
Charge Pump  
ICTRL  
ISP  
Analog  
Dimming  
DERATE  
RSNSx  
Current Sense  
ISNx  
DIAGEN  
PWM1  
PWM2  
MNx  
Gx  
Gate Driver  
Diagnostics  
Clamp  
Control  
Logic  
SENSEx  
PWM3  
IREF  
PWMCHG  
FD  
PWM  
Generator  
Temperature  
Sensor  
PWMOUT  
FAULT  
FAULT Bus  
Input / Output  
GND  
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8.3 Feature Description  
The TPS92830-Q1 device uses IN voltage to generate device bias. A two-stage charge pump provides gate  
driving voltage above the IN voltage for the high-side N-channel MOSFET. Each channel current is  
independently set by sense resistors. The analog-dimming ICTRL input supports off-board resistors as bin-  
setting resistors as well as direct voltage input. An integrated precision PWM generator could be used for PWM  
dimming locally.  
8.3.1 Device Bias  
The TPS92830-Q1 device has internal bias-generation and power-on-reset circuits for internal bias.  
8.3.1.1 Power-On-Reset (POR)  
The TPS92830-Q1 device has an internal power-on-reset (POR) function. When power is applied to IN, the  
internal POR holds the device in the reset condition until VIN reaches V(POR_rising)  
.
When the supply rises above POR threshold V(POR_rising), the charge pump starts working. The maximum gate-  
drive voltage is determined by the charge-pump voltage between CPOUT and IN.  
8.3.1.2 Current Reference (IREF)  
The TPS92830-Q1 device has a constant reference-voltage output on the IREF pin and uses current I(IREF) as  
the internal current reference. The analog-dimming internal-pullup current on ICTRL, and the PWM-generator  
internal charge current on PWMCHG, use I(IREF) as a reference current. The recommended value of reference  
resistor R(IREF) for IREF is 8 kΩ.  
8.3.1.3 Low-Current Fault Mode  
The TPS92830-Q1 device consumes minimal quiescent current when it is in fault mode. If the FAULT voltage is  
pulled low either by internal diagnostics or externally, the device performs as follows:  
The charge pump is shut down.  
All drivers are turned off with their gates internally pulled down.  
The PWM generator and PWMOUT are turned off.  
IREF current is turned off.  
ICTRL current is turned off.  
8.3.2 Charge Pump  
8.3.2.1 Charge Pump Architecture  
The TPS92830-Q1 device uses a two-stage charge pump to generate the high-side gate-drive voltage. The  
charge pump is a voltage tripler using external flying and storage capacitors.  
CP1 is the first-stage flying capacitor, connected between CP1P and CP1N, which are the positive and negative  
nodes, respectively. CP2 is the second-stage flying capacitor, connected between CP2P and CP2N, which are  
the positive and negative nodes, respectively. CS is the storage capacitor, connected between CPOUT and IN.  
CS stores charge for the high-side gate driver.  
The charge pump switches at frequency f(cp_sw) to optimize EMI performance.  
Negative nodes CP1N and CP2N are driven by a 5-V driver, thus the maximum voltage on charge-pump output  
node CPOUT is approximately V(IN) + V(CP_drv). The charge pump voltage across storage capacitor CS is not  
dependent on V(IN)  
.
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Feature Description (接下页)  
VIN  
CP1  
CP2  
Cs  
CP1N  
CP1P CP2N  
CP2P  
CPOUT  
TPS92830-Q1  
IN  
Charge Pump  
Copyright © 2017, Texas Instruments Incorporated  
20. Charge Pump  
8.3.3 Constant-Current Driving  
The TPS92830-Q1 device has three independent constant-current driving channels. Each channel sets channel  
current with an external high-side current-sense resistor, RSNSx. Channel current is set as V(CS_REG) / RSNSx  
.
Considering that both ICTRL and DERATE voltages reduce current-sense voltage V(CS_REG) independently,  
channel current can be calculated using the following equation. Each of the dimming ratios is described  
separately in following sections.  
V
(CS _REG _FULL) ´k(ICTRL _DIM) ´k(DERATE _DIM)  
I(CHx)  
=
RSNSx  
(1)  
8.3.3.1 High-Side Current Sense  
The sense voltage across external current-sense resistor RSNSx feeds back current information to the controller.  
An internal feedback control loop within the TPS92830-Q1 device regulates the external gate-overdrive voltage of  
the N-channel MOS transistor to keep the sense voltage at the desired level. By setting the external current-  
sense resistance value, the output current can be set individually on each channel.  
8.3.3.2 High-Side Current Driving  
To regulate the output current, the gate-source voltage of the external MOSFET must be regulated accordingly.  
The constant-current source is used to charge and discharge the N-channel MOSFET gate. During the current-  
slewing period, constant-current sourcing and sinking ensures the smooth slewing of the output current. The  
control loop requires sufficient MOSFET gate capacitance to ensure loop stability. In case the MOSFET gate  
capacitance is insufficient, a capacitor CGS must be added across Gx and SENSEx. TI also recommends always  
putting a CSENSE of 10 nF from each of the SENSEx pins to GND, and close to the device for EMC.  
When a channel is switched on, current source I(DRV_source) charges the gate of the external N-channel MOSFET.  
When a channel is switched off, current sink I(DRV_sink) discharges the gate of the external MOSFET transistor  
down to ground.  
16  
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Feature Description (接下页)  
SUPPLY  
STOP  
TPS92830-Q1  
IN  
ISP  
CPOUT  
CP2P  
RSNS1  
ISN1  
CP2N  
CP1P  
MN1  
G1  
CP1N  
FD  
CGS  
IREF  
SENSE1  
CSENSE  
PWMCHG  
PWMOUT  
Copyright © 2017, Texas Instruments Incorporated  
21. MOSFET Gate Capacitance Compensation  
8.3.3.3 Gate Overdrive Voltage Protection  
A bidirectional clamp is used to protect the gate-source path of the external N-channel MOSFETs from  
overstress conditions. Gate-source voltage V(GS) is clamped between V(GS_clamp_neg) and V(GS_clamp_pos) for  
MOSFET protection.  
8.3.3.4 High-Precision Current Regulation  
The TPS92830-Q1 device has a high-precision current-regulation loop. Its precision is at the maximum when the  
voltage across the current-sense resistor is set to maximum. The analog-dimming or current-derating function  
reduces the current-sense voltage, thus decreasing current-regulation accuracy.  
8.3.3.5 Parallel MOSFET Driving  
The TPS92830-Q1 device is designed to support parallel N-channel MOSFETs driving within the same channel.  
To balance heat dissipation, multiple MOSFETs could be paralleled together. A ballast resistor for each MOSFET  
is recommended to balance current distribution among parallel MOSFETs.  
Larger variation on threshold mismatches requires larger ballast resistors. V(TH_MISMATCH) is the threshold for  
mismatches within the same batch of MOSFETs. I(CH_MISMATCH) is the allowed mismatch current between the  
parallel channels. Typically, I(CH_MISMATCH) can be set to 10% of full-range current. The ballast resistor value is set  
as calculated in the following equation.  
V
(TH_MISMATCH)  
R(Ballast)  
=
I(CH_MISMATCH)  
(2)  
The ballast resistor typically ranges from hundreds of milliohms to several ohms depending on the channel  
current and MOSFET threshold-voltage variations.  
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Feature Description (接下页)  
SUPPLY  
TPS92830-Q1  
IN  
ISP  
RSNSx  
ISNx  
Gx  
MN1  
MN2  
MN3  
FAULT  
SENSEx  
GND  
Copyright © 2017, Texas Instruments Incorporated  
22. Parallel MOSFET Driving  
8.3.4 PWM Dimming  
The TPS92830-Q1 device supports a variety of PWM dimming methods, including PWM supply dimming,  
external PWM dimming by inputs, and internal PWM dimming by the internal PWM generator. Each PWM cycle  
should allow enough positive cycle time for gate charging and enough negative cycle time for gate discharging in  
order to achieve an accurate PWM dimming duty cycle.  
8.3.4.1 Supply Dimming  
In the case of supply dimming, the supply of the whole LED driver module is PWM dimmed, for example by  
body-control-module (BCM) high-side switches. The TPS92830-Q1 device supports supply dimming with a short  
power-on delay. Device supply VIN should be always equal to V(ISP) to ensure that the charge pump voltage is  
high enough to turn on the MOSFET.  
When supply dimming is used, it is recommended to be used together with PWM input, so that the channel is  
only turned on when the input voltage is above the device UVLO threshold. By keeping enough delay time  
between device power up and channel turnon, output current spikes can be avoided to ease EMC design.  
8.3.4.2 PWM Dimming by Input  
Each channel has individual PWM dimming by inputs.  
The internal thresholds for PWM1–PWM3 are designed with high precision. With external resistor dividers, each  
channel threshold can be set flexibly and independently.  
8.3.4.3 Internal Precision PWM Generator  
The TPS92830-Q1 device has an integrated precision PWM generator for on-chip PWM dimming as shown in .  
The device supports open-drain PWMOUT for synchronization between devices. Each device can be connected  
as a master, generating PWM, or as a slave, relying on external PWM sources. An external RC circuit precisely  
sets the duty cycle of the PWM generator across a wide duty-cycle range. Variation of the capacitor value affects  
the output frequency but not the duty cycle.  
The PWM generator uses reference current 2 × I(IREF) as the internal charge current, I(PWMCHG)  
.
18  
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Feature Description (接下页)  
When V(PWMCHG) increases above rising threshold V(PWMCHG_th_rising), the constant-current source is turned off and  
V(PWMCHG) decays through the external resistor-capacitor circuit. The PWM output is set LOW. The PWMCHG  
threshold is set to V(PWMCHG_th_falling). When V(PWMCHG) decreases below falling threshold V(PWMCHG_th_falling), the  
constant-current source is turned on again to charge up the external capacitor. The PWM output is HIGH and the  
threshold is set to V(PWMCHG_th_rising)  
.
TAIL  
STOP  
TPS92830-Q1  
IN  
ISP  
CPOUT  
CP2P  
RSNS1  
ISN1  
CP2N  
CP1P  
MN1  
G1  
CP1N  
FD  
SENSE1  
IREF  
PWMCHG  
PWMOUT  
GND  
Copyright © 2017, Texas Instruments Incorporated  
23. PWM Generator Dual-Brightness Configuration  
An external resistor R(PWMEXT) and capacitor C(PWMEXT) are used to set the PWM cycle time.  
V PWMCHG _ th _ falling -I(PWMCHG ìR(PWMEXT  
(
)
)
)
)
÷
t(PWM_ ON = R(PWMEXT ìC(PWMEXT) ìln  
)
)
«
÷
V PWMCHG _ th _rising -I(PWMCHG ìR(PWMEXT  
(
)
)
(3)  
(4)  
÷
V PWMCHG _ th _rising  
(
)
)
t(PWM_ OFF = R(PWMEXT ìC(PWMEXT) ìln  
)
)
«
÷
V PWMCHG _ th _ falling  
(
1
f(PWMEXT  
=
)
»
ÿ
Ÿ
Ÿ
÷
÷
V PWMCHG_ th _ falling -I(PWMCHG ìR(PWMEXT  
V PWMCHG_ th _rising -I(PWMCHG ìR(PWMEXT  
V PWMCHG_ th _rising  
(
)
)
)
)
(
)
)
R(PWMEXT ìC(PWMEXT) ì ln  
+ ln  
)
÷
V PWMCHG_ th _ falling  
÷
(
)
)
(
«
«
(5)  
÷
V PWMCHG _ th _ falling -I(PWMCHG ìR(PWMEXT  
(
)
)
)
)
ln  
V PWMCHG _ th _rising -I(PWMCHG ìR(PWMEXT  
÷
(
)
)
«
D(PWMEXT  
=
)
÷
÷
V PWMCHG _ th _ falling -I(PWMCHG ìR(PWMEXT  
V(PWMCHG _ th _rising  
V(PWMCHG _ th _ falling  
(
)
)
)
)
)
ln  
+ ln  
V PWMCHG _ th _rising -I(PWMCHG ìR(PWMEXT  
÷
÷
(
)
)
)
«
«
(6)  
19  
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Feature Description (接下页)  
PWM OFF  
V(th_PWM_rising)  
V(th_PWM_falling)  
PWM ON  
t
ON-time  
t(PWM_ON)  
OFF-time  
t(PWM_OFF)  
24. PWM Dimming Profile  
8.3.4.4 Full Duty-Cycle Switch  
The TPS92830-Q1 device can flexibly switch between the internal PWM modulation mode and the 100% duty-  
cycle mode by using the FD input. Once V(FD) is higher than threshold VIH(FD), the internal PWM generator is  
bypassed and output is merely controlled by the PWM inputs.  
If FD is HIGH, the PWMCHG current source is turned off and V(PWMCHG) decays to GND through the external  
resistor-capacitor circuit. When FD falls below the threshold, V(PWMCHG) increases from GND due to the internal  
charge current.  
If FD is HIGH, PWM generator oscillation stops, and PWMOUT is controlled by PWM1 only.  
External PWM inputs and internal PWM inputs are combined together for channel PWM dimming, or external  
PWM inputs can be used as channel enable inputs.  
PWMx  
FD  
PWMx  
FD  
Channelx  
PWM  
PWMCHG  
PWM  
Generator  
PWMOUT  
PWM1  
Copyright © 2017, Texas Instruments Incorporated  
25. PWM Dimming Internal Block Diagram  
20  
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Feature Description (接下页)  
1. Truth Table When Driving With PWM  
PWMx  
FD  
PWMCHG  
CHANNELx PWM  
LOW  
HIGH  
HIGH  
X
X
LOW  
HIGH  
HIGH  
LOW  
X
R-C  
PWM generated with RC  
2. Truth Table When Driving With PWMOUT  
PWM1  
FD  
PWMCHG  
PWMOUT  
LOW  
LOW  
HIGH  
HIGH  
X
X
HIGH  
LOW  
X
HIGH  
R-C  
PWM generated with RC  
8.3.5 Analog Dimming  
The TPS92830-Q1 device has a linear analog input pin, ICTRL, for output-current dimming. Voltage across the  
sense resistors is linearly reduced if the ICTRL input voltage V(ICTRL) decreases. Analog dimming can be used for  
brightness control, LED bin brightness correction, and thermal protection with a thermistor. ICTRL also supports  
off-board connection for LED binning and thermistor connection.  
8.3.5.1 Analog Dimming Topology  
Voltage at the ICTRL pin, V(ICTRL), is used for analog dimming control. To set V(ICTRL), either a reference input  
voltage can be applied or a resistor between ICTRL and GND can be used.  
When V(ICTRL) is greater than V(ICTRL_FULL), analog dimming is not enabled; thus the analog dimming ratio is at  
100%.  
When V(ICTRL) is between V(ICTRL_LIN_BOT) and V(ICTRL_LIN_TOP), the analog dimming ratio is directly proportional to  
V(ICTRL). The analog dimming ratio can be calculated using the following equation. V(ICTRL_LIN_BOT) and  
V(ICTRL_LIN_TOP) represent the ICTRL voltage boundaries of the linear region.  
V ICTRL  
(
)
k(ICTRL _DIM  
=
ì100%  
)
1.475 V  
(7)  
When VICTRL is between V(ICTRL_LIN_TOP) and V(ICTRL_FULL) or between V(ICTRL_LIN_BOT) and 0, analog dimming is in  
a transition region, and linearity is not assured. Thus it is not recommended to use ICTRL in these regions.  
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k(DERATE_Dim)  
100%  
Linear Region  
Full Range Region  
0%  
0.075V  
1.25V  
1.475V V(ICTRL_FULL)  
V(ICTRL_MAX)  
V(ICTRL)  
Copyright © 2017, Texas Instruments Incorporated  
26. Analog Dimming Ratio  
8.3.5.2 Internal High-Precision Pullup Current Source  
An internal precision pullup current I(ICTRL_pullup) is provided within the device to minimize external component  
count. I(ICTRL_pullup) uses current reference I(IREF) as reference. With the internal pullup current source, only an  
external resistor between the ICTRL pin and GND is needed to set the ICTRL voltage and the analog dimming  
ratio.  
If a voltage source or resistor divider is used, the internal pullup current must be taken into account to set the  
analog dimming ratio accurately.  
The pullup current source pulls the ICTRL pin voltage up to input voltage V(IN) if the ICTRL pin is unconnected.  
When ICTRL is not used, it is recommended to leave the ICTRL pin floating.  
I(ICTRL_pullup)  
ICTRL  
Analog  
Dimming  
TPS92830-Q1  
Copyright © 2017, Texas Instruments Incorporated  
27. Internal High-Precision Pullup Current Source  
22  
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8.3.6 Output Current Derating  
The TPS92830-Q1 device has an integrated output-current derating function. Voltage across the sensing  
resistors is reduced if DERATE input voltage VDERATE increases. The output current derating function can be  
used for supply overvoltage protection and thermal protection with a thermistor. The DERATE current curves are  
divided into 32 steps between 100% and 50% with hysteresis.  
In the case where DERATE is used for battery voltage sensing, the resistor-divider ratio can be set in a typical  
application as follows.  
In the normal supply-voltage range, for example, (9 V–16 V), the output-current-derating function is disabled.  
In the overvoltage range, for example, (18 V–24 V), the output current starts to derate and reaches 50%  
when VIN is at 24 V.  
When the voltage is even higher, for example, (24 V–26 V), the output current is saturated at 50%.  
8.3.6.1 Output-Current Derating Topology  
Voltage at the DERATE pin, V(DERATE), is used for output-current-derating control. To set the V(DERATE) voltage, a  
resistor divider on supply voltage VIN is typically used for supply overvoltage protection.  
When VDERATE is lower than V(DERATE_FULL), output current derating is not enabled; thus, output-current  
derating ratio k(DERATE_Dim) is at 100%.  
When VDERATE is higher than V(DERATE_HALF), output current derating is limited to 50%; thus, output-current  
derating ratio k(DERATE_Dim) is at 50%.  
When V(DERATE) is between V(DERATE_FULL) and V(DERATE_HALF), the output-current-derating ratio is negatively  
proportional to V(DERATE) with 32 steps. Current derating is rounded to the next-lower step. The output-current-  
derating ratio can be calculated using the following equations.  
V DERATE _HALF - V DERATE _FULL  
(
)
(
)
V DERATE _ STEP  
=
(
)
32  
(8)  
(9)  
÷
V DERATE - V DERATE _FULL  
50%  
32  
(
)
(
)
k
= 100% -  
ì
DERATE _Dim  
(
)
«
÷
V DERATE _ STEP  
(
)
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Output Current Derating Ratio  
100%  
32 steps  
50%  
0%  
V(DERATE_FULL)  
V(DERATE_HALF)  
V(DERATE)  
Copyright © 2017, Texas Instruments Incorporated  
28. Output-Current Derating Profile  
8.3.7 Diagnostics and Fault  
The TPS92830-Q1 device provides advanced diagnostics and fault protection methods for automotive exterior  
lighting systems. The device is able to detect and protect from LED output short-to-GND as well as from LED  
output open-circuit scenarios. The device also supports a one-fails–all-fail fault bus that could flexibly fit different  
legislative requirements.  
24  
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SUPPLY  
TPS92830-Q1  
ISP  
Rsnsx  
MNx  
ISNx  
Gx  
SENSEx  
FAULT  
GND  
Copyright © 2017, Texas Instruments Incorporated  
SUPPLY  
TPS92830-Q1  
ISP  
RSNSx  
ISNx  
MNx  
Gx  
SENSEx  
FAULT  
GND  
Copyright © 2017, Texas Instruments Incorporated  
29. LED Open and Short Scenarios  
8.3.7.1 LED Short-to-GND Detection  
The TPS92830-Q1 device has channel-independent LED short-to-GND detection. Short-to-GND detection is only  
enabled during channel on-time. Once an LED short-to-GND failure is detected, the device turns off the faulty  
channel and retries automatically. If the auto-retry mechanism detects that the LED short-to-GND fault has been  
removed, the device resumes normal operation. section  
The device monitors voltage V(SENSEx) and compares it with the internal reference voltage to detect short-to-GND  
failures. If the period during which V(SENSEx) falls below V(SG_th_rising) is longer than the deglitch time of t(SG_deg), the  
device asserts a short-to-GND fault on this channel. During the deglitch time period, if VSENSEx rises above  
V(SG_th_falling), the timer is reset.  
If a fault is detected, a constant-current source pulls the fault bus down. If FAULT is low, all devices connected to  
the fault bus are off in the fault mode.  
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8.3.7.2 LED Short-to-GND Auto Retry  
Once the channel has asserted a short-to-GND fault, it automatically retries periodically. In PWM mode, the  
device sources I(Retry_short) through the SENSEx pin to pull up the LED loads with a pulse duration of t(SG_retry_ON)  
The device waits for t(SG_retry_OFF) until the next retry pulse. Once auto retry detects that the short-to-GND fault is  
removed, the device resumes normal operation. During auto retry mode, the device ignores PWM inputs.  
.
8.3.7.3 LED Open-Circuit Detection  
The TPS92830-Q1 device has channel-independent LED open-circuit detection. Once an LED open-circuit failure  
is detected, the device turns off the faulty channel and retries automatically. If the retry mechanism detects that  
the LED open-circuit fault is removed, the device resumes normal operation.  
The device monitors MOSFET dropout voltage differences between the ISNx and SENSEx pins. Voltage  
difference V(ISNx) – V(SENSEx) is compared with internal reference voltage V(OPEN_th_rising) to detect an LED open-  
circuit failure. If V(ISNx) – V(SENSEx) falls below the V(OPEN_th_rising) voltage and it stays there longer than the deglitch  
time of t(OPEN_deg), the device asserts an open-load fault on this channel. During the deglitching time period, if  
V(ISNx) – V(SENSEx) rises above V(OPEN_th_falling), the deglitch timer is reset.  
In normal operation, the N-channel MOSFET operates in the saturation region with a gate-source voltage close  
to its threshold voltage. In this case, the drain-source voltage of the N-channel MOSFET is typically much higher  
than open-circuit threshold V(OPEN_th_rising). In the LED open-circuit condition, the N-channel MOSFET operates in  
the linear region with a gate-source voltage much higher than its threshold voltage. The N-channel MOSFET is  
fully on.  
If a fault is detected, a constant-current source pulls the fault bus down. If the FAULT pin is low, all devices  
connected to the fault bus are off in the fault mode.  
8.3.7.4 LED Open-Circuit Auto Retry  
Once the channel has asserted an open-circuit fault, it automatically retries periodically. The device sources  
I(Retry_open) through the SENSEx pin to pull up the LED loads with a pulse duration of t(OPEN_retry_ON). In PWM  
mode, the device waits for t(OPEN_retry_OFF) until the next retry pulse. Once auto retry detects that the open-circuit  
fault has been removed, the device resumes normal operation. During auto retry mode, the device ignores PWM  
inputs. In the open-circuit scenario, the retry current cannot find a path to ground; thus, total current consumption  
does not increase.  
8.3.7.5 Dropout-Mode Diagnostics  
When the input voltage is not high enough to keep the external N-channel MOSFET in the constant-current  
saturation region, the TPS92830-Q1 device tries to regulate current by driving the external N-channel MOSFET  
in the linear region. This state is called the dropout mode, because voltage across the sense resistor is not able  
to reach the regulation threshold.  
In dropout mode, LED open-circuit detection must be disabled via the DIAGEN input. Otherwise, the dropout  
mode would be treated as an LED open-circuit fault. The DIAGEN pin is used to avoid false diagnostics on an  
output channel due to low supply voltage.  
When the DIAGEN voltage is low, the LED open-circuit detection is ignored. When the DIAGEN voltage is high,  
LED open-circuit detection resumes normal operation.  
In dropout mode, the MOSFET is driven at maximum gate-source voltage to regulate current to the desired  
value. When the supply voltage increases, the MOSFET gate voltage is pulled down internally by a control loop.  
If the supply-voltage slew rate is fast, a high-current pulse can be observed on the LED for a short period of time.  
At the same time, the current-sense voltage may exceed the normal operating range and damage internal  
circuitry. A parallel diode or a current-limiting resistor less than 1 kΩ is recommended to clamp the voltage  
across the sensing resistor in the case of a large pulse current.  
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SUPPLY  
TPS92830-Q1  
RSNSx  
ISP  
ISNx  
Gx  
SENSEx  
FAULT  
GND  
Copyright ©2017, Texas Instruments Incorporated  
30. Resistor and Diode for Sense-Resistor Protection  
8.3.7.6 Overtemperature Protection  
The TPS92830-Q1 device monitors device junction temperature. When the junction temperature reaches the  
thermal shutdown threshold T(TSD), all outputs shut down and the charge pump also stops working. Once the  
junction temperature falls below T(TSD)  
– T(TSD_HYS), the device resumes normal operation. During  
overtemperature protection, the FAULT bus is pulled low.  
8.3.7.7 FAULT Bus Output With One-Fails–All-Fail  
The TPS92830-Q1 device has a FAULT bus for diagnostics output. It also supports a one-fails–all-fail function  
with other TPS92830-Q1, TPS9261x-Q1, TPS92630-Q1, or TPS92638-Q1 devices.  
In normal operation, FAULT is weakly pulled up by internal pullup current source I(FAULT_pullup) to a voltage higher  
than VOH(FAULT). If any fault scenario occurs, the FAULT bus is strongly pulled low by internal pulldown current  
source I(FAULT_pulldown). Once V(FAULT) falls below VIL(FAULT) , all outputs are shut down for protection. The faulty  
channel keeps retrying until the fault condition is removed. The charge pump is shut down, and current  
consumption is also reduced to I(FAULT) to save quiescent current.  
If FAULT is externally pulled up with a current higher than I(FAULT_pulldown), the one-fails–all-fail function is disabled  
̅
and only the faulty channel is turned off. The charge pump remains operating normally, and the device is in  
normal operation mode. The FAULT bus is able to support up to 15 pieces of TPS92830-Q1, TPS92630-Q1,  
TPS92638-Q1, or TPS9261x-Q1 devices.  
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8.3.7.8 Fault Table  
3. Fault Table With DIAGEN = HIGH  
FAULT  
HANDLING  
ROUTINE  
DETECTION  
MECHANISM  
CHANNEL  
STATE  
FAULT  
RECOVERY  
FAULT TYPE  
DEGLITCH TIME  
FAULT BUS  
FAULT FLOATING  
All channels  
VISNx – VSENSEx  
V(OPEN_th_rising)  
<
turned off. Pulsed  
pullup retry of  
faulty channel.  
LED open-circuit  
On  
On  
t(OPEN_deg)  
All channels  
LED short-to-  
GND  
turned off. Pulsed  
pullup retry of  
faulty channel.  
VSENSEx < V(SG_th_rising)  
t(SG_deg)  
Constant-current  
pulldown  
Auto recover  
All channels  
turned off. Faulty  
channel pulsed  
pullup retry of  
faulty channel.  
LED short-to-  
battery  
VISNx – VSENSEx  
V(OPEN_th_rising)  
<
On or off  
On or off  
t(OPEN_deg)  
All channels  
turned off.  
Overtemperature  
TJ > T(TSD)  
FAULT EXTERNALLY PULLED UP  
Only faulty  
channel turned  
off. Pulsed pullup  
retry of faulty  
channel.  
VISNx – V SENSEx  
LED open-circuit  
<
On  
On  
t(OPEN_deg)  
V(OPEN_th_rising)  
Only faulty  
channel turned  
off. Pulsed pullup  
retry of faulty  
channel.  
LED short-to-  
Externally pulled  
up with internal  
constant-current  
pulldown  
V SENSEx < V(SG_th_rising)  
t(SG_deg)  
GND  
Auto recover  
Only faulty  
channel turned  
off. Pulsed pullup  
retry of faulty  
channel.  
LED short-to-  
battery  
V ISNx – V(SENSEx)  
V(OPEN_th_rising)  
<
On or off  
On or off  
t(OPEN_deg)  
All channels  
turned off.  
Overtemperature  
TJ > T(TSD)  
FAULT EXTERNALLY PULLED DOWN  
All outputs disabled  
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FAULT TYPE  
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4. Fault Table With DIAGEN = LOW  
FAULT  
HANDLING  
ROUTINE  
DETECTION  
MECHANISM  
CHANNEL  
STATE  
FAULT  
RECOVERY  
DEGLITCH TIME  
FAULT BUS  
FAULT FLOATING  
LED open-circuit  
Ignored  
Ignored  
On  
Ignored  
t(SG_deg)  
Ignored  
Ignored  
Ignored  
All channels  
LED short-to-  
GND  
Constant current turned off. Pulsed  
pull down  
V(SENSEx) < V(SG_th_rising)  
Auto recover  
pullup retry of  
faulty channel.  
LED short-to-  
battery  
Ignored  
Ignored  
Ignored  
Ignored  
Ignored  
Ignored  
Constant current All channels  
pull down turned off.  
Overtemperature  
TJ > T(TSD)  
On or off  
Auto recover  
FAULT EXTERNALLY PULLED UP  
LED open-circuit  
Ignored  
Ignored  
On  
Ignored  
t(SG_deg)  
Ignored  
Ignored  
Ignored  
Only faulty  
channel turned  
off. Pulsed pullup Auto recover  
retry of faulty  
channel.  
Externally pulled  
up with internal  
constant current  
pulled down  
LED short-to-  
GND  
V(SENSEx) < V(SG_th_rising)  
LED short-to-  
battery  
Ignored  
Ignored  
Ignored  
Ignored  
Ignored  
Ignored  
Externally pulled  
up with internal  
constant current  
pulled down  
All channels  
turned off.  
Overtemperature  
TJ > T(TSD)  
On or off  
Auto recover  
FAULT EXTERNALLY PULLED LOW  
All outputs  
All outputs  
disabled  
All outputs  
disabled  
All outputs  
disabled  
All outputs  
disabled  
All outputs  
disabled  
All outputs disabled  
disabled  
8.4 Device Functional Modes  
8.4.1 Undervoltage Lockout, V(IN) < V(UVLO)  
When the device is in undervoltage lockout mode, the TPS92830-Q1 device disables all functions until the supply  
rises above the UVLO-rising threshold. The device pulls down the Gx outputs. Other outputs are in the high-  
impedance state.  
8.4.2 Normal Operation (V(IN) 4.5 V, V(IN) > V(LED) + 0.5 V)  
The device drives an LED string in normal operation. A 0.5-V minimal dropout voltage is typically more than  
enough to maintain LED current regulation.  
8.4.3 Low-Voltage Dropout  
When the device drives an LED string in low-dropout mode, even with the MOSFETs fully turned on the output  
current may not reach target value. The device reports an LED open-circuit failure if DIAGEN is HIGH.  
8.4.4 Fault Mode (Fault Is Detected)  
When the device detects an open or shorted LED, the device tries to pull down the FAULT pin with a constant  
current. If the fault bus is pulled down, the device switches to fault mode and consumes a fault current of I(FAULT)  
.
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9 Application and Implementation  
Information in the following applications sections is not part of the TI component  
specification, and TI does not warrant its accuracy or completeness. TI’s customers are  
responsible for determining suitability of components for their purposes. Customers should  
validate and test their design implementation to confirm system functionality.  
9.1 Application Information  
In automotive applications, linear LED drivers are preferable for various applications, especially exterior lighting,  
for their simplicity and electromagnetic compatibility. This section provides a few examples to show the design  
process for different features.  
9.2 Typical Applications  
9.2.1 Typical Application for Automotive Exterior Lighting With One-Fails–All-Fail  
Various functions of exterior lighting may use the following circuit. Here is a typical application circuit for a turn  
indicator. A TPS92830-Q1 drives a total of nine LEDs with 3s3p configuration at 300 mA each.  
31. TPS92830-Q1 Typical Application Circuit For Automotive Exterior Lighting  
9.2.1.1 Design Requirements  
With the wide range of battery voltages in modern automotive systems, it is a common requirement among car  
OEMs to turn LEDs off when the battery voltage is below the minimal voltage threshold, for example, 6 V.  
When the battery voltage is between 6 V and 9 V, LEDs may not achieve full brightness due to low input voltage.  
Although a linear LED driver may drive in low-dropout mode, it is required not to treat the low-dropout mode as  
an open-circuit fault and to report a false error.  
30  
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Typical Applications (接下页)  
When battery voltage ranges between 9 V and 16 V, the LED driver works in normal mode with the one-fails–all-  
fail feature. If any LED strings fail with an open circuit or short circuit, the TPS92830-Q1 device pulls down the  
fault bus. All devices connected to the same fault bus turn off their outputs.  
When the battery voltage is above 18 V, the TPS92830-Q1 device is able to detect the overvoltage and derate  
the output current to reduce the power dissipation of the MOSFETs and prevent thermal damage.  
9.2.1.2 Detailed Design Procedure  
Fixed Parameters  
Charge pump flying capacitor C6 = 10 nF  
Charge pump flying capacitor C8 = 10 nF  
R(IREF) = 8 kΩ  
Charge pump storage capacitor C10 = 150 nF  
Current Setting  
I(LED) = 300 mA  
R(SNS)= V(CS_REG) / I(LED) = 0.983 Ω  
PWM Threshold Setting  
PWM enables when V(IN) > 6 V  
K(RES_PWM) = VIH(PWMx, max) / 6 V  
K(RES_PWM) = R15 / (R15 + R8)  
Set R15 = 20 kΩ, R8 = 76 kΩ  
DiagEN Setting (Enables LED-Open Detection When V(IN) > 9 V  
K(RES_DiagEN) = VIH(DIAGEN, max) / 9 V  
K(RES_DiagEn) = R13 / (R6 + R13)  
Set R13 = 10 kΩ, R6 = 62 kΩDiagEN setting  
DERATE Setting (Reduces Current Output When V(IN) > 18 V  
K(RES_DERATE) = V(DERATE_FULL, min) / 18 V  
K(RES_DERATE) = R7 / (R7+ R14)  
Set R7 = 10 kΩ, R14 = 95 kΩ  
To deliver 300 mA with a single MOSFET package, the designer must consider the maximum thermal-dissipation  
condition. The power dissipation of a MOSFET is usually at its peak when input voltage is at 16 V in a full-  
brightness condition. Assume the minimal LED forward voltage at 300 mA is 6 V.  
PMOSFET = I LED ì V - VF Diode - VF LED,min - V CS _REG = 300mA ì(16 - 0.7 - 6 - 0.295) = 2.702W  
)
(
IN  
(
)
(
)
(
)
(
)
(
)
(
)
(10)  
MOSFET package and layout design must be considered to dissipate 2.702 W at maximum ambient  
temperature, usually 85°C.  
The TPS92830 device can support a variety of N-channel MOSFETs in the markets. Adding a capacitor between  
the gate and source increases the loop phase margin. The recommended total capacitance at Gx is greater than  
4 nF.  
版权 © 2017–2018, Texas Instruments Incorporated  
31  
TPS92830-Q1  
ZHCSGY7B OCTOBER 2017REVISED JANUARY 2018  
www.ti.com.cn  
Typical Applications (接下页)  
9.2.1.3 Application Curves  
Ch. 1 = V(IN)  
Ch .2 = V(FAULT)  
Ch. 3 = V(SENSE2)  
Ch. 4 = I(OUT2)  
IN HIGH = 14 V, LOW = 0 V, with reverse  
blocking diode  
Pulse duration = 300 µs, period = 2 ms  
32. BCM PWM Dimming Curve  
9.2.2 High-Precision Dual-Brightness PWM Generation  
9.2.2.1 Dual-Brightness Application  
Automotive lighting often reuses the same LEDs for different functions with different brightness, for example,  
daytime running lights (DRL) and position lights, or stop and tail lights. Analog dimming by changing the constant  
current may affect LED color temperature. PWM dimming could easily achieve the dimming ratio with the same  
color temperature.  
The TPS92830-Q1 device provides a precision PWM generator with a synchronization PWMOUT output. Its  
integrated high-precision PWM generator ensures homogeneity across different devices.  
32  
版权 © 2017–2018, Texas Instruments Incorporated  
TPS92830-Q1  
www.ti.com.cn  
ZHCSGY7B OCTOBER 2017REVISED JANUARY 2018  
Typical Applications (接下页)  
SUPPLY  
TPS92830-Q1  
TPS92830-Q1  
IN  
IN  
ISP  
ISP  
CPOUT  
CP2P  
CPOUT  
CP2P  
RSNS1  
RSNS1  
ISN1  
ISN1  
CP2N  
CP1P  
CP2N  
CP1P  
MN1  
MN1  
G1  
G1  
CP1N  
FD  
CP1N  
FD  
SENSE1  
SENSE1  
FD  
PWM  
PWM1  
PWMOUT  
IREF  
PWMx  
IREF  
PWMCHG  
FAULT  
PWMCHG  
FAULT  
RPWM  
CPWM  
Copyright © 2017, Texas Instruments Incorporated  
33. PWM Generator Master-Slave Configuration  
9.2.2.2 Design Requirements  
When full duty-cycle (FD) is HIGH, the output is at 100% duty cycle.  
When full duty-cycle (FD) is LOW, the output is at 10% duty cycle and 250 Hz.  
9.2.2.3 Detailed Design Procedure  
PWM Equations  
RPU = 10 kΩ  
CPWM = 105.5 nF  
RPWM = 55.5 kΩ  
版权 © 2017–2018, Texas Instruments Incorporated  
33  
TPS92830-Q1  
ZHCSGY7B OCTOBER 2017REVISED JANUARY 2018  
www.ti.com.cn  
Typical Applications (接下页)  
9.2.2.4 Application Curve  
Ch. 1 = V(PWMCHG)  
Ch. 4 = I(OUT2_1)  
Ch. 2 = V(PWMOUT)  
Ch. 3 = I(OUT1_1)  
Ch. 1 = V(PWMCHG)  
Ch. 4 = I(OUT2_1)  
Ch. 2 = V(PWMOUT)  
Ch. 3 = I(OUT1_1)  
34. Dual Brightness With Integrated High-Precision  
35. Dual Brightness With Integrated High-Precision  
PWM Generator at Full Duty-cycle  
PWM Generator at 10% Duty-cycle  
9.2.3 Driving High-Current LEDs With Parallel MOSFETs  
Thermal performance is one key consideration in automotive exterior driving, especially for a linear LED driver.  
Due to large variations of automotive battery voltage, a linear LED driver must accommodate thermal dissipation  
with a worst-case scenario, which is high ambient temperature and high battery voltage.  
LED driver thermal dissipation performance merely depends on the package and PCB thermal dissipation area.  
However, if the thermal dissipation performance of a single MOSFET is not able to support the required LED  
string current, multiple MOSFETs in parallel are able to dissipate heat for high-current applications.  
When a MOSFET is in the saturation region as a current-control device, its current output strongly depends on its  
threshold. MOSFET threshold Vth can vary from one device to another. When MOSFETs are in parallel, even a  
small threshold mismatch could lead to imbalance of current distribution.  
With an integrated charge pump, the TPS92830-Q1 device provides sufficient headroom even when the supply  
voltage is as low as 5 V. Thus adding ballast resistors between the N-channel MOSFET source and the LED  
string introduces negative feedback for each parallel MOSFET path to balance the current flows.  
5. Thermal Measurement of Parallel MOSFETs  
WITHOUT CURRENT BALLAST  
WITH 1-Ω BALLAST RESISTOR  
WITH 3-Ω BALLAST RESISTOR  
Resistor  
MOSFET1  
Temperature (ºC)  
105.7  
85.3  
82.8  
87.6  
85.9  
84.2  
85.3  
MOSFET2  
Temperature (ºC)  
76.1  
84.8  
MOSFET3  
Temperature (ºC)  
34  
版权 © 2017–2018, Texas Instruments Incorporated  
TPS92830-Q1  
www.ti.com.cn  
ZHCSGY7B OCTOBER 2017REVISED JANUARY 2018  
V(IN)= 16 V, I(Total) = 964 mA, TA= 25 ºC.  
SUPPLY  
TPS92830-Q1  
IN  
ISP  
RSNSx  
ISNx  
Gx  
MN1  
MN2  
MN3  
FAULT  
SENSEx  
GND  
Copyright © 2017, Texas Instruments Incorporated  
36. Parallel MOSFET Driving  
9.2.3.1 Application Curves  
Without Ballast Resistors  
With 1-W Ballast Resistors  
With 3-W Ballast Resistors  
37. Thermal Images of Parallel MOSFETs With Various Ballast Resistors  
版权 © 2017–2018, Texas Instruments Incorporated  
35  
TPS92830-Q1  
ZHCSGY7B OCTOBER 2017REVISED JANUARY 2018  
www.ti.com.cn  
10 Layout  
10.1 Layout Guidelines  
The TPS92830-Q1 device relies on external MOSFETs to dissipate heat for high-current applications. To  
effectively dissipate heat on MOSFETs and LEDs, TI recommends to use 0.071-mm-thick (2-oz.) copper PCBs  
or metal-based boards. Make the thermal dissipation area with copper as large as possible. Place thermal vias  
on the thermal dissipation area to further improve the thermal dissipation capability. The current path starts from  
IN through the sense-resistors, MOSFETs, and LEDs to GND. Wide traces are helpful to reduce parasitic  
resistance along the current path as shown in the layout example below.  
Place capacitors, especially charge pump capacitors, close to the device to make the current path as short as  
possible. TI suggests keeping the LED high-current ground path separate from device ground. TI also  
recommends kelvin-connection to the connector. The following layout example shows the recommended  
guidelines.  
10.2 Layout Example  
IN  
TPS92830-Q1  
1
2
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
CP1P  
CP1N  
GND  
ISP  
ISN1  
G1  
GND  
3
4
CP2N  
CP2P  
CPOUT  
IN  
SENSE1  
ISN2  
5
6
G2  
SENSE2  
ISN3  
7
DIAGEN  
8
DIAGEN  
DERATE  
DERATE  
PWM1  
9
G3  
10  
11  
12  
13  
14  
SENSE3  
PWM1  
PWM2  
PWM3  
FD  
PWM2  
PWM3  
FD  
PWMOUT  
FAULT  
PWMCHG  
IREF  
ICTRL  
Copyright © 2017, Texas Instruments Incorporated  
38. TPS92830-Q1 Example Layout Diagram  
36  
版权 © 2017–2018, Texas Instruments Incorporated  
TPS92830-Q1  
www.ti.com.cn  
ZHCSGY7B OCTOBER 2017REVISED JANUARY 2018  
11 器件和文档支持  
11.1 接收文档更新通知  
要接收文档更新通知,请导航至TI.com 上的器件产品文件夹。单击右上角的通知我进行注册,即可每周接收产品信  
息更改摘要。  
11.2 社区资源  
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商按照原样提供。这些内容并不构成 TI 技术规范,  
并且不一定反映 TI 的观点;请参阅 TI 《使用条款》。  
TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在  
e2e.ti.com 中,您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。  
设计支持  
TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。  
11.3 商标  
E2E is a trademark of Texas Instruments.  
11.4 静电放电警告  
这些装置包含有限的内置 ESD 保护。 存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止 MOS 门极遭受静电损  
伤。  
11.5 Glossary  
SLYZ022 TI Glossary.  
This glossary lists and explains terms, acronyms, and definitions.  
12 机械、封装和可订购信息  
以下页面包含机械、封装和可订购信息。这些信息是针对指定器件提供的最新数据。本数据随时可能发生变更并且  
不对本文档进行修订,恕不另行通知。要获得这份数据表的浏览器版本,请查阅左侧的导航窗格。  
版权 © 2017–2018, Texas Instruments Incorporated  
37  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Dec-2020  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
TPS92830QPWRQ1  
ACTIVE  
TSSOP  
PW  
28  
2000 RoHS & Green  
NIPDAU  
Level-3-260C-168 HR  
-40 to 125  
TPS92830  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
5-Jul-2019  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
TPS92830QPWRQ1  
TSSOP  
PW  
28  
2000  
330.0  
16.4  
6.9  
10.2  
1.8  
12.0  
16.0  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
5-Jul-2019  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
TSSOP PW 28  
SPQ  
Length (mm) Width (mm) Height (mm)  
350.0 350.0 43.0  
TPS92830QPWRQ1  
2000  
Pack Materials-Page 2  
重要声明和免责声明  
TI 均以原样提供技术性及可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资  
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