TPS92830QPWRQ1 [TI]
汽车类 3 通道高侧、高功率、恒流线性 LED 控制器 | PW | 28 | -40 to 125;型号: | TPS92830QPWRQ1 |
厂家: | TEXAS INSTRUMENTS |
描述: | 汽车类 3 通道高侧、高功率、恒流线性 LED 控制器 | PW | 28 | -40 to 125 驱动 控制器 光电二极管 接口集成电路 |
文件: | 总43页 (文件大小:2568K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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TPS92830-Q1
ZHCSGY7B –OCTOBER 2017–REVISED JANUARY 2018
TPS92830-Q1 3 通道大电流线性 LED 控制器
1 特性
3 说明
1
•
符合 AEC-Q100 标准
在实现更佳的灯光均匀性的趋势下,高电流 LED 通常
用于汽车前灯和后灯(配备灯光扩散器和导光板)。同
时,为了满足严格的 EMC 和可靠性要求,线性 LED
驱动器广泛用于汽车 应用。不过,通过集成功率晶体
管为线性 LED 驱动器提供高电流是一项挑战。
TPS92830-Q1 器件是一款先进的汽车级高侧恒定电流
线性 LED 控制器,通过使用外部 N 沟道 MOSFET 提
供高电流。该器件具有一整套用于 汽车 应用的 功能,
并与各种 N 沟道 MOSFET 兼容。
–
–
–
器件温度等级 1:环境运行温度范围为 -40°C
至 125°C
器件人体放电模型 (HBM) 静电防护 (ESD) 分类
等级 H2
器件组件充电模型 (CDM) ESD 分类等级 C4B
•
•
4.5V 至 40V 的宽电压输入范围
3 通道高侧电流驱动和检测
–
–
–
–
通道独立的电流设置
通道独立的 PWM 输入
TPS92830-Q1 器件的每个通道可以通过感应电阻器值
独立设置通道电流。内部精密恒定电流调节环路通过感
应电阻器上的电压感应通道电流,并相应地控制 N 沟
道 MOSFET 的栅极电压。该器件还集成了一个两级电
荷泵,用于低压降运行。电荷泵电压足够高,可以支持
各种 N 沟道 iMOSFET。iPWM i调光i允许使用i多个
通过 PWM 输入和电源实现 PWM 调光
针对 EMC 优化的压摆率
•
•
高精度 LED 驱动
–
采用外部 N 沟道 MOSFET 的精密电流调节
(2.5% 容差)
–
–
具有非板载 Bin 电阻支持的 20:1 模拟调光配置
器件信息(1)
具有全占空比屏蔽的精密 PWM 发生器(2% 容
差)
器件型号
封装
封装尺寸(标称值)
–
用于同步的开漏 PWM 输出
TPS92830-Q1
TSSOP (28)
9.70mm x 4.40mm
保护和诊断
(1) 要了解所有可用封装,请见数据表末尾的可订购产品附录。
–
用于外部 MOSFET 热保护的可调节输出电流降
额
简化原理图
Battery
–
–
–
具有自动恢复功能的 LED 灯串开路或短路诊断
TPS92830-Q1
针对低电压运行支持诊断并具有可调节阈值
CP1P
CP1N
GND
ISP
多达 15 个器件的故障总线,可配置为连带失效
或仅失效的通道关闭
ISN1
G1
SENSE1
CP2N
CP2P
CPOUT
IN
–
故障模式下具有较低的静态电流(每个器件小于
0.75mA)
ISN2
G2
•
•
工作结温范围:-40°C 至 150°C
TSSOP 28 封装 (PW)
SENSE2
DIAGEN
DERATE
ISN3
G3
2 应用
SENSE3
PWMOUT
FAULT
•
•
后灯 – 尾灯和制动灯、后转向灯、雾灯、倒车灯
前灯 – 位置灯、日间行车灯、前转向灯、近光灯
PWM1
PWM2
PWM3
FD
FAULT Bus
PWMCHG
IREF
Full Duty Cycle
ICTRL
Copyright © 2017, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SLIS178
TPS92830-Q1
ZHCSGY7B –OCTOBER 2017–REVISED JANUARY 2018
www.ti.com.cn
目录
8.2 Functional Block Diagram ....................................... 14
8.3 Feature Description................................................. 15
8.4 Device Functional Modes........................................ 29
Application and Implementation ........................ 30
9.1 Application Information............................................ 30
9.2 Typical Applications ................................................ 30
1
2
3
4
5
6
7
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
说明 (续).............................................................. 4
Pin Configuration and Functions......................... 4
Specifications......................................................... 6
7.1 Absolute Maximum Ratings ...................................... 6
7.2 ESD Ratings ............................................................ 6
7.3 Recommended Operating Conditions....................... 6
7.4 Thermal Information.................................................. 7
7.5 Electrical Characteristics........................................... 7
7.6 Timing Requirements................................................ 9
7.7 Typical Characteristics............................................ 11
Detailed Description ............................................ 14
8.1 Overview ................................................................. 14
9
10 Layout................................................................... 36
10.1 Layout Guidelines ................................................. 36
10.2 Layout Example .................................................... 36
11 器件和文档支持 ..................................................... 37
11.1 接收文档更新通知 ................................................. 37
11.2 社区资源................................................................ 37
11.3 商标....................................................................... 37
11.4 静电放电警告......................................................... 37
11.5 Glossary................................................................ 37
12 机械、封装和可订购信息....................................... 37
8
4 修订历史记录
注:之前版本的页码可能与当前版本有所不同。
Changes from Revision A (October 2017) to Revision B
Page
•
Changed timing specification for PWM duty cycle ................................................................................................................. 9
Changes from Original (July 2017) to Revision A
Page
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
在特性 部分中更改了电流调节和 PWM 发生器的容差............................................................................................................ 1
Changed values for several parameters throughout the Electrical Characteristics table....................................................... 7
Changed parameter definitions for I(DRV_source) and I(DRV_sink) in the Electrical Chaaracteristics table ..................................... 7
Changed parameter symbols for analog dimming accuracy in the Electrical Characteristics table....................................... 8
Changed parameter descriptions for V(OPEN_th_rising), V(OPEN_th_falling), ....................................................................................... 8
Changed parameter descriptions for t(SG_retry_OFF) and t(OPEN_retry_OFF) in the Timing Requirements table............................... 9
Added a condition for Typical Characteristic 图 6 ............................................................................................................... 11
Deleted a condition from Typical Characteristic 图 8 .......................................................................................................... 12
Deleted a Fast Power Down and Slow Power Up typical characteristic graph.................................................................... 12
Added a Fast Power Down and Slow Power Up typical characteristic graph...................................................................... 13
Added a condition for Typical Characteristic 图 17 ............................................................................................................. 13
Added a condition for Typical Characteristic 图 18 .............................................................................................................. 13
Changed heat dissipation to current distribution in Parallel MOSFET Driving..................................................................... 17
Deleted a sentence from the PWM Dimming by Input section............................................................................................. 18
Added resistor and capacitor reference designators............................................................................................................ 19
Deleted percentage values for V(ICTRL_LIN_BOT) and V(ICTRL_LIN_TOP) in the Analog Dimming Topology section...................... 21
Changed V(SG_th_rising) and V(SG_th_falling) with each other in the LED Short-to-GND Detection section .................................. 25
Changed symbol of short-to-ground retry current to I(Retry_short) ............................................................................................ 26
Changed symbol of LED-open retry current to I(Retry_open) in the LED Open-Circuit Auto Retry section............................... 26
Changed some FAULT TYPE names in 表 4....................................................................................................................... 29
Updated application schematic. ........................................................................................................................................... 30
Changed the value of R8 from 75 kΩ to 76 kΩ for the PWM threshold setting ................................................................... 31
Changed the equation for calculating K(RES_DiagEn)................................................................................................................ 31
2
版权 © 2017–2018, Texas Instruments Incorporated
TPS92830-Q1
www.ti.com.cn
ZHCSGY7B –OCTOBER 2017–REVISED JANUARY 2018
•
•
•
•
•
Changed the values of R13 and R6 for ............................................................................................................................... 31
Changed the equation for calculating K(RES_DERATE).............................................................................................................. 31
Changed component values inthe PWM equations of the Detailed Design Procedure ....................................................... 33
Added an application curve .................................................................................................................................................. 34
Added text in the Layout Guidelines for keeping LED ground separate from device ground .............................................. 36
版权 © 2017–2018, Texas Instruments Incorporated
3
TPS92830-Q1
ZHCSGY7B –OCTOBER 2017–REVISED JANUARY 2018
www.ti.com.cn
5 说明 (续)
源以实现灵活性 - 内部 PWM 发生器、外部 PWM 输入或电源调光。各种专为汽车应用 设计的 诊断和保护可 帮助
提高系统稳健性和易用性。连带失效故障总线支持 TPS92830-Q1 与 TPS92630-Q1、TPS92638-Q1 和
TPS9261x-Q1 系列一同运行,以满足各种故障处理要求。
6 Pin Configuration and Functions
PW Package
28-Pin TSSOP
Top View
CP1P
CP1N
GND
1
28
27
26
25
24
23
22
21
20
19
18
17
16
15
ISP
2
ISN1
3
G1
CP2N
CP2P
CPOUT
IN
4
SENSE1
ISN2
5
6
G2
7
SENSE2
ISN3
DIAGEN
DERATE
PWM1
PWM2
PWM3
FD
8
9
G3
10
11
12
13
14
SENSE3
PWMOUT
FAULT
PWMCHG
IREF
ICTRL
Not to scale
Pin Functions
PIN
I/O
DESCRIPTION
NAME
CP1N
NO.
2
Charge pump first-stage flying capacitor negative output, charge pump to provide gate-drive
voltage for external MOSFET. Connect a 10-nF flying capacitor between CP1P and CP1N.
O
O
O
CP1P
CP2N
1
Charge pump first-stage flying capacitor positive output
Charge pump second-stage flying capacitor negative output. Connect a 10-nF flying
capacitor between CP2P and CP2N.
4
CP2P
5
6
9
O
O
I
Charge pump second-stage flying capacitor positive output
CPOUT
DERATE
Charge-pump output voltage. Connect a 150-nF storage capacitor between CPOUT and IN.
Voltage input for current derating. Connect to GND to disable the derate feature.
Input pin with comparator to enable diagnostics to avoid false open-fault diagnostics when
the device works in low-dropout mode. Use a resistor divider to set a threshold according to
the LED forward voltage.
DIAGEN
8
I
Fault bus pin to support one-fails–all-fail feature. Float: one-fails–all-fail; strong pullup: only-
fails-off
FAULT
FD
17
13
I/O
I
Full duty-cycle input, HIGH: 100% PWM; LOW: using external resistor-capacitor network to
set PWM duty cycle
4
Copyright © 2017–2018, Texas Instruments Incorporated
TPS92830-Q1
www.ti.com.cn
ZHCSGY7B –OCTOBER 2017–REVISED JANUARY 2018
Pin Functions (continued)
PIN
I/O
DESCRIPTION
NAME
NO.
26
23
20
3
G1
G2
G3
O
O
Channel 1 gate driver output, connect to CH 1 N-channel MOSFET gate
Channel 2 gate driver output, connect to CH 2 N-channel MOSFET gate
Channel 3 gate driver output, connect to CH 3 N-channel MOSFET gate
GND
O
GND
—
Analog dimming input, modulates the regulation voltage across the current-sense resistor.
Apply a voltage source or connect a resistor between ICTRL and GND to set the analog
dimming ratio.
ICTRL
14
I
IN
7
I
I
Power supply for the device. LED current only flows from the external MOSFET to the LED.
Channel 1 current-sense negative input. Connect a current-sense resistor between ISP and
ISN1 to set the CH 1 current.
ISN1
27
Channel 2 current-sense negative input. Connect a current-sense resistor between ISP and
ISN2 to set the CH 2 current.
ISN2
ISN3
24
21
I
I
Channel 3 current-sense negative input. Connect a current-sense resistor between ISP and
ISN3 to set the CH 3 current.
IREF
15
28
10
11
12
O
I
Internal current reference. Connect an 8-kΩ resistor between IREF and GND,
Channel current-sense positive input. Kelvin-sense to LED sense-resistor positive node.
Channel 1 PWM input
ISP
PWM1
PWM2
PWM3
I
I
Channel 2 PWM input
I
Channel 3 PWM input
On-chip PWM generator pin for external R-C. Connect a resistor and a capacitor between
PWMCHG and GND to set the PWM duty cycle and frequency.
PWMCHG
16
I/O
PWMOUT
SENSE1
SENSE2
SENSE3
18
25
22
19
O
High-voltage PWM open-drain output. Connect a 10-kΩ resistor between IN and PWMOUT
Channel 1 diagnostics pin. Connect to the CH 1 MOSFET source terminal
Channel 2 diagnostics pin. Connect to the CH 2 MOSFET source terminal
Channel 3 diagnostics pin. Connect to the CH 3 MOSFET source terminal
I/O
I/O
I/O
Copyright © 2017–2018, Texas Instruments Incorporated
5
TPS92830-Q1
ZHCSGY7B –OCTOBER 2017–REVISED JANUARY 2018
www.ti.com.cn
7 Specifications
7.1 Absolute Maximum Ratings
over operating junction temperature range TJ= –40°C to 150°C (unless otherwise noted)(1)
MIN
MAX
UNIT
Supply voltage
Input voltage
IN(2)
–0.3
45(3)
V
DERATE, DIAGEN, FD, ICTRL, ISN1, ISN2,
ISN3, ISP, PWM1, PWM2, PWM3, PWMOUT,
SENSE1, SENSE2, SENSE3(2)
–0.3
V(IN) + 0.3
V
Output voltage
CP1P, CP2P, CPOUT, G1, G2, G3(2)
–0.3
–0.3
–1
V(IN) + 10
V
V
Current-sense voltage
Gate-source voltage
V(ISP) – V(ISNx)
1
12
V(Gx) – V(SENSEx)
V
FAULT(2)
CP1N, CP2N, IREF, PWMCHG(2)
–0.3
–0.3
–65
-40
22
V
I/O
6
V
Storage temperature, Tstg
Junction temperature, TJ
150
150
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to GND.
(3) Absolute maximum voltage 45 V for 200 ms.
7.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per AEC Q100-002(1)
±2000
Corner pins (CP1P,
ICTRL, IREF, ISP)
V(ESD)
Electrostatic discharge
±750
±500
V
Charged-device model (CDM), per AEC
Q100-011
Other pins
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
7.3 Recommended Operating Conditions
over operating junction temperature range TJ= –40°C to 150°C (unless otherwise noted)
MIN
4.5
0
MAX
UNIT
V
Device supply voltage
Sense voltage
IN
40
V(IN)
V(IN)
V(IN)
1
ISP
V
PWM inputs
PWMx
DIAGEN
V(ISP) – V(ISNx)
FAULT
PWMOUT
ICTRL
DERATE
FD
0
V
Diagnostics enable pin
Current-sense voltage
Fault bus
0
V
0
V
0
20
V
PWM open-drain output
Analog dimming input
Current derating input
Full duty-cycle input
0
V(IN)
V(IN)
V(IN)
V(IN)
V
0
V
0
V
0
V
6
Copyright © 2017–2018, Texas Instruments Incorporated
TPS92830-Q1
www.ti.com.cn
ZHCSGY7B –OCTOBER 2017–REVISED JANUARY 2018
7.4 Thermal Information
TPS92830-Q1
THERMAL METRIC(1)
PW (TSSOP)
28 PINS
79.4
UNIT
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
20.1
37.4
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
0.5
ψJB
36.9
RθJC(bot)
N/A
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
7.5 Electrical Characteristics
VIN = 5 V to 40 V, VICTRL = 3 V, VDERATE = 0 V, TJ= –40°C to 150°C,(1) (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
BIAS
Supply voltage POR, rising
threshold
V(POR_rising)
4.5
V
I(Quiescent)
I(FAULT)
Device standby current
Device current in fault mode
Reference current
PWMx = HIGH, FD = HIGH
PWMx = HIGH, FAULT = LOW
R(IREF) = 8 kΩ
3.5
0.5
99
mA
mA
µA
nF
0.75
4.3
10
I(IREF)
C(IREF)
IREF loading capacitance
R(IREF) = 8 kΩ
0
CHARGE PUMP
V(cp_drv)
Charge-pump operating voltage
6.1
8.5
V
Charge-pump switching
frequency
f(cp_sw)
2.65
MHz
C(cp_flying)
Charge-pump flying capacitor
Charge-pump storage capacitor
10
nF
nF
C(cp_storage)
150
HIGH-PRECISION LOGIC INPUTS (DIAGEN, PWMx, FD)
VIL(DIAGEN)
Input logic-low voltage, DIAGEN
1.105
1.193
1.145
1.224
1.185
1.255
V
V
Input logic-high voltage,
DIAGEN
VIH(DIAGEN)
VIL(PWMx)
VIH(PWMx)
VIL(FD)
Input logic-low voltage, PWMx
Input logic-high voltage, PWMx
Input logic-low voltage, FD
Input logic-high voltage, FD
1.094
1.176
1.105
1.186
1.128
1.212
1.133
1.216
1.161
1.248
1.161
1.246
V
V
V
V
VIH(FD)
CONSTANT-CURRENT EXTERNAL N-CHANNEL MOSFET DRIVER
Current-sense-resistor
regulation voltage
V(CS_REG_FULL)
V(ICTRL) = 3 V, V(DERATE) = 0 V
295
mV
V(ICTRL) = 3 V, V(DERATE) = 0 V,
channel accuracy
–1.5%
–2.5%
190
1.5%
2.5%
270
Current-sense-resistor
regulation-voltage accuracy
(2)(3)
∆V(CS)
V(ICTRL) = 3 V, V(DERATE) = 0 V,
device accuracy
Gate-driver current-source
capability at Gx
I(DRV_source)
230
µA
(1) External N-channel MOSFET Ciss = 200 pF, Coss = 70 pF, at VDS = 25 Vdc, VGS = 0 Vdc, f = 1 MHz, Vth= 4 V, compensation capacitor
Cgs = 4 nF
3ì V CS _REG_ x
(
)
DV CS _ Channel_ CHx = 1-
,x = 1,2,3
(
)
V
+ V CS _REG_ 2 + V CS _REG_ 3
CS _REG_1
(2)
(3)
V CS _REG _ x
(
DV CS _Device _ CHx = 1-
) ,x = 1,2,3
(
)
0.295
Copyright © 2017–2018, Texas Instruments Incorporated
7
TPS92830-Q1
ZHCSGY7B –OCTOBER 2017–REVISED JANUARY 2018
www.ti.com.cn
Electrical Characteristics (continued)
VIN = 5 V to 40 V, VICTRL = 3 V, VDERATE = 0 V, TJ= –40°C to 150°C,(1) (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Gate-driver current-sink
capability at Gx
I(DRV_sink)
190
230
270
–0.5
11.3
2.3
µA
Gate-source negative clamp
voltage
V(GS_clamp_neg)
V(GS_clamp_pos)
I(ISNx_leakage)
–0.9
9.8
–0.7
10.4
1.3
V
V
Gate-source positive clamp
voltage
Leakage current sink on ISNx
pins
µA
INTERNAL PWM DIMMING
Internal PWM generator, rising
V(PWMCHG_th_rising)
1.45
0.78
1.48
0.8
1.51
0.82
V
V
threshold
Internal PWM generator, falling
threshold
V(PWMCHG_th_falling)
V(PWMCHG_th_hys)
I(PWMCHG)
Internal PWM generator
hysteresis
0.68
200
V
µA
V
PWM generator pullup current
V(PWMCHG) = 0 V, FD = LOW
194
40
206
0.4
Open-drain PWMOUT pulldown V(PWMCHG) = 3 V, I(PWMOUT) pullup
voltage
VOL(PWMOUT)
current = 4 mA
Open-drain PWMOUT pulldown
MOSFET rDS(on)
rDS(on)(PWMOUT)
55
90
Ω
ANALOG DIMMING
V(ICTRL_FULL)
Full-range ICTRL voltage
1.65
V
V
Upper boundary for linear
ICTRL dimming
V(ICTRL_LIN_TOP)
V(ICTRL_LIN_BOT)
1.425
75
Lower boundary for linear
ICTRL dimming
mV
V(ICTRL) = 1.35 V, V(DERATE) = 0 V,
accuracy: 1 – (V(CS_REG_x) / 0.27), x =
1, 2, 3
∆V(CS_ ICTRL_H)
∆V(CS_ ICTRL_M)
∆V(CS_ ICTRL_L)
Analog dimming accuracy
Analog dimming accuracy
–2.5%
–4%
2%
4%
V(ICTRL) = 0.75 V, V(DERATE) = 0 V,
accuracy: 1 – (V(CS_REG_x) / 0.15), x =
1, 2, 3
V(ICTRL) = 0.15 V, V(DERATE) = 0 V,
accuracy: 1 –V(CS_REG_x) / 0.03, x =
1, 2, 3
Analog dimming accuracy
–18%
0.95
18%
1.02
I(ICTRL_pullup)
ICTRL internal pullup current
0.985
mA
CURRENT DERATING
V(DERATE_FULL)
Full-range DERATE voltage
Half-range DERATE voltage
1.83
2.38
87%
58%
V
V
V(DERATE_HALF)
V(DERATE) = 1.966 V
V(DERATE) = 2.316 V
81%
51%
95%
65%
K(DERATE)
Derate dimming ratio
DIAGNOSTICS
LED open rising threshold,
device triggers open-circuit
diagnostics V(SG_th_rising), and
V(SG_th_falling) in the Electrical
Characteristics table
V(OPEN_th_rising)
V(ISNx) – V(SENSEx), x = 1, 2, 3
100
145
280
190
mV
mV
LED open falling threshold,
device releases from open-
circuit diagnostics
V(OPEN_th_falling)
V(ISNx) – V(SENSEx), x = 1, 2, 3
240
8
320
12
V(OPEN_th_hyst)
I(Retry_open)
135
10
mV
mA
LED-open retry current
8
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TPS92830-Q1
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ZHCSGY7B –OCTOBER 2017–REVISED JANUARY 2018
Electrical Characteristics (continued)
VIN = 5 V to 40 V, VICTRL = 3 V, VDERATE = 0 V, TJ= –40°C to 150°C,(1) (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Channel output VSENSEx short-
to-ground rising threshold,
device triggers short-to-ground
diagnostics
V(SG_th_rising)
0.885
0.92
0.95
V
Channel output VSENSEx short-
to-ground falling threshold,
device releases from short-to-
ground diagnostics
V(SG_th_falling)
1.17
1.215
1.26
V
Channel output VSENSEx short-
to-ground hysteresis
V(SG_th_hyst)
I(Retry_short)
295
1
mV
mA
Channel output VSENSEx short-
to-ground retry current
0.75
2
1.25
0.7
FAULT
VIL(FAULT)
VIH(FAULT)
VOL(FAULT)
VOH(FAULT)
Logic-input low threshold
Logic-input high threshold
Logic-output low threshold
Logic-output high threshold
V
V
V
V
With 500-µA external pullup
With 1-µA external pulldown
0.4
3.4
2.7
650
6.5
FAULT internal pulldown
current
I(FAULT_pulldown)
I(FAULT_pullup)
750
7.6
800
9.5
µA
µA
FAULT internal pullup current
THERMAL PROTECTION
T(TSD)
Thermal shutdown threshold
Thermal shutdown hysteresis
176
15
ºC
ºC
T(TSD_HYS)
7.6 Timing Requirements
MIN
NOM
MAX
UNIT
LED open-circuit deglitch time, described in LED open-circuit
diagnostics section
t(OPEN_deg)
t(SG_deg)
t(SG_retry_ON)
t(SG_retry_OFF)
100
125
125
125
150
150
150
µs
µs
µs
LED short-to-GND detection deglitch time, described in the LED short-
to-GND diagnostics section
100
100
Channel output SENSEx short-to-ground retry on-time, described in the
LED short-to-GND auto retry section
Channel output SENSEx short-to-ground retry off-time, described in
LED short-to-GND auto retry section
10.8
125
ms
µs
tOPEN_retry_ON) Channel output SENSEx open-circuit retry on-time
100
150
t(OPEN_retry_OF
F)
Channel output SENSEx open-circuit retry off-time
10.8
ms
PWM duty cycle generated internally, nominal 10% duty cycle, as
measured on output channel; see 图 1, T(J) = 25ºC
9.8%
10%
10%
25
10.2%
D(PWM_10)
PWM duty cycle generated internally, nominal 10% duty cycle, as
measured on output channel; see 图 1, T(J) = -40ºC to 150ºC
9.75%
10.25%
Derate current-response delay time when DERATE steps from 1.8 V to
2.4 V
td(DERATE)
µs
V(IN) = 14 V, Cs = 150 nF, CPOUT voltage reaches 18 V as shown in
Device Start-Up Delay diagram
t(CP_STARTUP)
25
µs
f(DRV_PWM)
Recommended PWM driving-frequency range
2000
Hz
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Input On-Time
PWMx
90%
90%
Channel
Current
IOUTx
Output On-Time
10%
t1
10%
t6
t2
t3
t4
t5
Copyright © 2017, Texas Instruments Incorporated
图 1. Channel-Current Output Timing Diagram
10
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ZHCSGY7B –OCTOBER 2017–REVISED JANUARY 2018
7.7 Typical Characteristics
TA = 25 ºC unless otherwise noted
300
298
296
294
292
290
300
298
296
294
292
290
-40èC
25èC
125èC
-40 -25 -10
5
20 35 50 65 80 95 110 125
4
10
16
22
28
34
40
Temperature (èC)
Supply Voltage (V)
D001
D002
V(IN) = 14 V
V(ICTRL) = 1.8 V
V(ICTRL) = 1.8 V
图 2. Full-Range Current-Sense Voltage vs Ambient
图 3. Full-Range Current-Sense Voltage vs Supply Voltage
Temperature
0.35
0.3
5
-40èC
25èC
125èC
0.25
0.2
-40èC, I(FAULT)
25èC, I(FAULT)
125èC, I(FAULT)
-40èC, I(Quiescent)
25èC, I(Quiescent)
0.15
0.1
1
125èC, I(Quiescent)
0.05
0
0.4
4
10
16
22
28
34
40
0
0.2
0.4
0.6
0.8
V(ICTRL) (V)
1
1.2
1.4
1.6
1.8
Supply Voltage (V)
D003
D001
V(IN) = 14 V
图 5. Device Current vs Supply Voltage
图 4. Current-Sense Voltage vs ICTRL Input Voltage
100%
50%
102%
96%
90%
84%
78%
72%
66%
60%
54%
48%
30%
20%
10%
5%
3%
2%
1%
0.5%
0.3%
0.2%
1%
2% 3%
5% 7% 10%
20% 30% 50%
100%
1.7
1.8
1.9
2
2.1
2.2
2.3
2.4
2.5
Input Duty Cycle
Derate Voltage (V(DERATE)
)
D002
D003
V(IN) = 14 V
f(PWM)= 200 Hz
V(ICTRL) = 1.8 V
V(IN) = 14 V
图 6. Duty Cycle of PWM Dimming-Current Output vs PWM
图 7. Current-Derating Profile; Output-Current Ratio vs
Input Duty Cycle
DERATE Voltage
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Typical Characteristics (接下页)
TA = 25 ºC unless otherwise noted
Ch. 1 = PWMCHG
V(IN) = 14 V
Ch. 2 = PWMOUT
Ch. 4 = I(OUT1)
Ch. 1 = PWM1
Ch. 4 = I(OUT1)
Ch. 2 = G1
V(IN) = 14 V
Ch. 3 = SENSE1
图 9. PWM Generator
图 8. PWM Dimming
Ch. 1 = V(IN)
Ch. 2 = G1
Ch. 3 = SENSE1
Ch. 1 = V(IN)
Ch. 2 = G1
Ch. 3 = SENSE1
Ch. 4 = I(OUT1)
Ch. 4 = I(OUT1)
图 10. Undervoltage
图 11. Transient Overvoltage
Ch. 1 = V(IN)
Ch. 2 = G1
ƒ = 15 Hz
Ch. 3 = SENSE1
Ch. 1 = V(IN)
Ch. 2 = G1
Ch. 3 = SENSE1
Ch. 4 = I(OUT1)
Ch. 4 = I(OUT1)
图 13. Superimposed Alternating Voltage
图 12. Jump Start
12
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ZHCSGY7B –OCTOBER 2017–REVISED JANUARY 2018
Typical Characteristics (接下页)
TA = 25 ºC unless otherwise noted
Ch. 1 = V(IN)
Ch. 2 = G1
Ch. 3 = SENSE1
Ch. 1 = V(IN)
Ch. 2 = G1
Ch. 3 = SENSE1
Ch. 4 = I(OUT1)
Ch. 4 = I(OUT1)
图 15. Slow Decrease, Quick Increase of Supply Voltage
图 14. Fast Power Down and Slow Power Up
Ch. 1 = FAULT
Ch. 2 = SENSE1
Ch. 3 = SENSE2
Ch. 1 = V(IN)
Ch. 4 = I(OUT1)
Ch. 2 = G1
Ch. 3 = SENSE1
Ch. 4 = SENSE3
LED open-circuit on SENSE1
图 16. Slow Decrease and Slow Increase of Supply Voltage
图 17. LED Open-Circuit Protection and One-Fails–All-Fail
Ch. 1 = V(IN)
Ch. 2 = CP1N
Ch. 3 = CPOUT
Ch. 1 = FAULT
Ch. 4 = I(OUT1)
Ch. 2 = SENSE1
Ch. 3 = G1
LED short-to-ground on SENSE1
图 19. Device Start-Up Delay
图 18. LED Hard Short Protection and One-Fails–All-Fail
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8 Detailed Description
8.1 Overview
The TPS92830-Q1 device is an advanced automotive-grade high-side constant-current linear LED controller for
delivering high current using external N-channel MOSFETs. The device has a full set of features for automotive
applications. Each channel of the TPS92830-Q1 device sets the channel current independently by the sense-
resistor value. An internal precision constant-current regulation loop senses the channel current by the voltage
across the sense resistor and controls the gate voltage of the N-channel MOSFET accordingly. The device also
integrates a two-stage charge pump for low-dropout operation. The charge-pump voltage is high enough to
support a wide selection of N-channel MOSFETs. PWM dimming allows multiple sources for flexibility—internal
PWM generator, external PWM inputs, or power-supply dimming. Various diagnostics and protection features
specially designed for automotive applications help improve system robustness and ease of use. A one-fails–all-
fail fault bus supports TPS92830-Q1 operation together with the TPS92630-Q1, TPS92638-Q1, and TPS9261x-
Q1 family to fulfill various fault-handling requirements.
8.2 Functional Block Diagram
SUPPLY
CP1N
CP1P CP2N
CP2P
CPOUT
TPS92830-Q1
CURRENT
REGULATION
DRIVER X3
IN
Charge Pump
ICTRL
ISP
Analog
Dimming
DERATE
RSNSx
Current Sense
ISNx
DIAGEN
PWM1
PWM2
MNx
Gx
Gate Driver
Diagnostics
Clamp
Control
Logic
SENSEx
PWM3
IREF
PWMCHG
FD
PWM
Generator
Temperature
Sensor
PWMOUT
FAULT
FAULT Bus
Input / Output
GND
Copyright © 2017, Texas Instruments Incorporated
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8.3 Feature Description
The TPS92830-Q1 device uses IN voltage to generate device bias. A two-stage charge pump provides gate
driving voltage above the IN voltage for the high-side N-channel MOSFET. Each channel current is
independently set by sense resistors. The analog-dimming ICTRL input supports off-board resistors as bin-
setting resistors as well as direct voltage input. An integrated precision PWM generator could be used for PWM
dimming locally.
8.3.1 Device Bias
The TPS92830-Q1 device has internal bias-generation and power-on-reset circuits for internal bias.
8.3.1.1 Power-On-Reset (POR)
The TPS92830-Q1 device has an internal power-on-reset (POR) function. When power is applied to IN, the
internal POR holds the device in the reset condition until VIN reaches V(POR_rising)
.
When the supply rises above POR threshold V(POR_rising), the charge pump starts working. The maximum gate-
drive voltage is determined by the charge-pump voltage between CPOUT and IN.
8.3.1.2 Current Reference (IREF)
The TPS92830-Q1 device has a constant reference-voltage output on the IREF pin and uses current I(IREF) as
the internal current reference. The analog-dimming internal-pullup current on ICTRL, and the PWM-generator
internal charge current on PWMCHG, use I(IREF) as a reference current. The recommended value of reference
resistor R(IREF) for IREF is 8 kΩ.
8.3.1.3 Low-Current Fault Mode
The TPS92830-Q1 device consumes minimal quiescent current when it is in fault mode. If the FAULT voltage is
pulled low either by internal diagnostics or externally, the device performs as follows:
•
•
•
•
•
The charge pump is shut down.
All drivers are turned off with their gates internally pulled down.
The PWM generator and PWMOUT are turned off.
IREF current is turned off.
ICTRL current is turned off.
8.3.2 Charge Pump
8.3.2.1 Charge Pump Architecture
The TPS92830-Q1 device uses a two-stage charge pump to generate the high-side gate-drive voltage. The
charge pump is a voltage tripler using external flying and storage capacitors.
CP1 is the first-stage flying capacitor, connected between CP1P and CP1N, which are the positive and negative
nodes, respectively. CP2 is the second-stage flying capacitor, connected between CP2P and CP2N, which are
the positive and negative nodes, respectively. CS is the storage capacitor, connected between CPOUT and IN.
CS stores charge for the high-side gate driver.
The charge pump switches at frequency f(cp_sw) to optimize EMI performance.
Negative nodes CP1N and CP2N are driven by a 5-V driver, thus the maximum voltage on charge-pump output
node CPOUT is approximately V(IN) + V(CP_drv). The charge pump voltage across storage capacitor CS is not
dependent on V(IN)
.
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Feature Description (接下页)
VIN
CP1
CP2
Cs
CP1N
CP1P CP2N
CP2P
CPOUT
TPS92830-Q1
IN
Charge Pump
Copyright © 2017, Texas Instruments Incorporated
图 20. Charge Pump
8.3.3 Constant-Current Driving
The TPS92830-Q1 device has three independent constant-current driving channels. Each channel sets channel
current with an external high-side current-sense resistor, RSNSx. Channel current is set as V(CS_REG) / RSNSx
.
Considering that both ICTRL and DERATE voltages reduce current-sense voltage V(CS_REG) independently,
channel current can be calculated using the following equation. Each of the dimming ratios is described
separately in following sections.
V
(CS _REG _FULL) ´k(ICTRL _DIM) ´k(DERATE _DIM)
I(CHx)
=
RSNSx
(1)
8.3.3.1 High-Side Current Sense
The sense voltage across external current-sense resistor RSNSx feeds back current information to the controller.
An internal feedback control loop within the TPS92830-Q1 device regulates the external gate-overdrive voltage of
the N-channel MOS transistor to keep the sense voltage at the desired level. By setting the external current-
sense resistance value, the output current can be set individually on each channel.
8.3.3.2 High-Side Current Driving
To regulate the output current, the gate-source voltage of the external MOSFET must be regulated accordingly.
The constant-current source is used to charge and discharge the N-channel MOSFET gate. During the current-
slewing period, constant-current sourcing and sinking ensures the smooth slewing of the output current. The
control loop requires sufficient MOSFET gate capacitance to ensure loop stability. In case the MOSFET gate
capacitance is insufficient, a capacitor CGS must be added across Gx and SENSEx. TI also recommends always
putting a CSENSE of 10 nF from each of the SENSEx pins to GND, and close to the device for EMC.
When a channel is switched on, current source I(DRV_source) charges the gate of the external N-channel MOSFET.
When a channel is switched off, current sink I(DRV_sink) discharges the gate of the external MOSFET transistor
down to ground.
16
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TPS92830-Q1
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ZHCSGY7B –OCTOBER 2017–REVISED JANUARY 2018
Feature Description (接下页)
SUPPLY
STOP
TPS92830-Q1
IN
ISP
CPOUT
CP2P
RSNS1
ISN1
CP2N
CP1P
MN1
G1
CP1N
FD
CGS
IREF
SENSE1
CSENSE
PWMCHG
PWMOUT
Copyright © 2017, Texas Instruments Incorporated
图 21. MOSFET Gate Capacitance Compensation
8.3.3.3 Gate Overdrive Voltage Protection
A bidirectional clamp is used to protect the gate-source path of the external N-channel MOSFETs from
overstress conditions. Gate-source voltage V(GS) is clamped between V(GS_clamp_neg) and V(GS_clamp_pos) for
MOSFET protection.
8.3.3.4 High-Precision Current Regulation
The TPS92830-Q1 device has a high-precision current-regulation loop. Its precision is at the maximum when the
voltage across the current-sense resistor is set to maximum. The analog-dimming or current-derating function
reduces the current-sense voltage, thus decreasing current-regulation accuracy.
8.3.3.5 Parallel MOSFET Driving
The TPS92830-Q1 device is designed to support parallel N-channel MOSFETs driving within the same channel.
To balance heat dissipation, multiple MOSFETs could be paralleled together. A ballast resistor for each MOSFET
is recommended to balance current distribution among parallel MOSFETs.
Larger variation on threshold mismatches requires larger ballast resistors. V(TH_MISMATCH) is the threshold for
mismatches within the same batch of MOSFETs. I(CH_MISMATCH) is the allowed mismatch current between the
parallel channels. Typically, I(CH_MISMATCH) can be set to 10% of full-range current. The ballast resistor value is set
as calculated in the following equation.
V
(TH_MISMATCH)
R(Ballast)
=
I(CH_MISMATCH)
(2)
The ballast resistor typically ranges from hundreds of milliohms to several ohms depending on the channel
current and MOSFET threshold-voltage variations.
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Feature Description (接下页)
SUPPLY
TPS92830-Q1
IN
ISP
RSNSx
ISNx
Gx
MN1
MN2
MN3
FAULT
SENSEx
GND
Copyright © 2017, Texas Instruments Incorporated
图 22. Parallel MOSFET Driving
8.3.4 PWM Dimming
The TPS92830-Q1 device supports a variety of PWM dimming methods, including PWM supply dimming,
external PWM dimming by inputs, and internal PWM dimming by the internal PWM generator. Each PWM cycle
should allow enough positive cycle time for gate charging and enough negative cycle time for gate discharging in
order to achieve an accurate PWM dimming duty cycle.
8.3.4.1 Supply Dimming
In the case of supply dimming, the supply of the whole LED driver module is PWM dimmed, for example by
body-control-module (BCM) high-side switches. The TPS92830-Q1 device supports supply dimming with a short
power-on delay. Device supply VIN should be always equal to V(ISP) to ensure that the charge pump voltage is
high enough to turn on the MOSFET.
When supply dimming is used, it is recommended to be used together with PWM input, so that the channel is
only turned on when the input voltage is above the device UVLO threshold. By keeping enough delay time
between device power up and channel turnon, output current spikes can be avoided to ease EMC design.
8.3.4.2 PWM Dimming by Input
Each channel has individual PWM dimming by inputs.
The internal thresholds for PWM1–PWM3 are designed with high precision. With external resistor dividers, each
channel threshold can be set flexibly and independently.
8.3.4.3 Internal Precision PWM Generator
The TPS92830-Q1 device has an integrated precision PWM generator for on-chip PWM dimming as shown in .
The device supports open-drain PWMOUT for synchronization between devices. Each device can be connected
as a master, generating PWM, or as a slave, relying on external PWM sources. An external RC circuit precisely
sets the duty cycle of the PWM generator across a wide duty-cycle range. Variation of the capacitor value affects
the output frequency but not the duty cycle.
The PWM generator uses reference current 2 × I(IREF) as the internal charge current, I(PWMCHG)
.
18
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Feature Description (接下页)
When V(PWMCHG) increases above rising threshold V(PWMCHG_th_rising), the constant-current source is turned off and
V(PWMCHG) decays through the external resistor-capacitor circuit. The PWM output is set LOW. The PWMCHG
threshold is set to V(PWMCHG_th_falling). When V(PWMCHG) decreases below falling threshold V(PWMCHG_th_falling), the
constant-current source is turned on again to charge up the external capacitor. The PWM output is HIGH and the
threshold is set to V(PWMCHG_th_rising)
.
TAIL
STOP
TPS92830-Q1
IN
ISP
CPOUT
CP2P
RSNS1
ISN1
CP2N
CP1P
MN1
G1
CP1N
FD
SENSE1
IREF
PWMCHG
PWMOUT
GND
Copyright © 2017, Texas Instruments Incorporated
图 23. PWM Generator Dual-Brightness Configuration
An external resistor R(PWMEXT) and capacitor C(PWMEXT) are used to set the PWM cycle time.
≈
∆
’
V PWMCHG _ th _ falling -I(PWMCHG ìR(PWMEXT
(
)
)
)
)
÷
t(PWM_ ON = R(PWMEXT ìC(PWMEXT) ìln
)
)
∆
«
÷
◊
V PWMCHG _ th _rising -I(PWMCHG ìR(PWMEXT
(
)
)
(3)
(4)
≈
∆
’
÷
V PWMCHG _ th _rising
(
)
)
t(PWM_ OFF = R(PWMEXT ìC(PWMEXT) ìln
)
)
∆
«
÷
◊
V PWMCHG _ th _ falling
(
1
f(PWMEXT
=
)
»
…
ÿ
Ÿ
Ÿ
⁄
≈
∆
’
÷
≈
’
÷
V PWMCHG_ th _ falling -I(PWMCHG ìR(PWMEXT
∆ V PWMCHG_ th _rising -I(PWMCHG ìR(PWMEXT
V PWMCHG_ th _rising
(
)
)
)
)
(
)
)
∆
R(PWMEXT ìC(PWMEXT) ì ln
+ ln
)
…
÷
∆ V PWMCHG_ th _ falling
÷
(
)
)
(
«
«
◊
◊
(5)
≈
∆
’
÷
V PWMCHG _ th _ falling -I(PWMCHG ìR(PWMEXT
(
)
)
)
)
ln
∆ V PWMCHG _ th _rising -I(PWMCHG ìR(PWMEXT
÷
(
)
)
«
◊
D(PWMEXT
=
)
≈
∆
’
÷
≈
∆
’
÷
V PWMCHG _ th _ falling -I(PWMCHG ìR(PWMEXT
V(PWMCHG _ th _rising
∆ V(PWMCHG _ th _ falling
(
)
)
)
)
)
ln
+ ln
∆ V PWMCHG _ th _rising -I(PWMCHG ìR(PWMEXT
÷
÷
(
)
)
)
«
◊
«
◊
(6)
19
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Feature Description (接下页)
PWM OFF
V(th_PWM_rising)
V(th_PWM_falling)
PWM ON
t
ON-time
t(PWM_ON)
OFF-time
t(PWM_OFF)
图 24. PWM Dimming Profile
8.3.4.4 Full Duty-Cycle Switch
The TPS92830-Q1 device can flexibly switch between the internal PWM modulation mode and the 100% duty-
cycle mode by using the FD input. Once V(FD) is higher than threshold VIH(FD), the internal PWM generator is
bypassed and output is merely controlled by the PWM inputs.
If FD is HIGH, the PWMCHG current source is turned off and V(PWMCHG) decays to GND through the external
resistor-capacitor circuit. When FD falls below the threshold, V(PWMCHG) increases from GND due to the internal
charge current.
If FD is HIGH, PWM generator oscillation stops, and PWMOUT is controlled by PWM1 only.
External PWM inputs and internal PWM inputs are combined together for channel PWM dimming, or external
PWM inputs can be used as channel enable inputs.
PWMx
FD
PWMx
FD
Channelx
PWM
PWMCHG
PWM
Generator
PWMOUT
PWM1
Copyright © 2017, Texas Instruments Incorporated
图 25. PWM Dimming Internal Block Diagram
20
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Feature Description (接下页)
表 1. Truth Table When Driving With PWM
PWMx
FD
PWMCHG
CHANNELx PWM
LOW
HIGH
HIGH
X
X
LOW
HIGH
HIGH
LOW
X
R-C
PWM generated with RC
表 2. Truth Table When Driving With PWMOUT
PWM1
FD
PWMCHG
PWMOUT
LOW
LOW
HIGH
HIGH
X
X
HIGH
LOW
X
HIGH
R-C
PWM generated with RC
8.3.5 Analog Dimming
The TPS92830-Q1 device has a linear analog input pin, ICTRL, for output-current dimming. Voltage across the
sense resistors is linearly reduced if the ICTRL input voltage V(ICTRL) decreases. Analog dimming can be used for
brightness control, LED bin brightness correction, and thermal protection with a thermistor. ICTRL also supports
off-board connection for LED binning and thermistor connection.
8.3.5.1 Analog Dimming Topology
Voltage at the ICTRL pin, V(ICTRL), is used for analog dimming control. To set V(ICTRL), either a reference input
voltage can be applied or a resistor between ICTRL and GND can be used.
When V(ICTRL) is greater than V(ICTRL_FULL), analog dimming is not enabled; thus the analog dimming ratio is at
100%.
When V(ICTRL) is between V(ICTRL_LIN_BOT) and V(ICTRL_LIN_TOP), the analog dimming ratio is directly proportional to
V(ICTRL). The analog dimming ratio can be calculated using the following equation. V(ICTRL_LIN_BOT) and
V(ICTRL_LIN_TOP) represent the ICTRL voltage boundaries of the linear region.
V ICTRL
(
)
k(ICTRL _DIM
=
ì100%
)
1.475 V
(7)
When VICTRL is between V(ICTRL_LIN_TOP) and V(ICTRL_FULL) or between V(ICTRL_LIN_BOT) and 0, analog dimming is in
a transition region, and linearity is not assured. Thus it is not recommended to use ICTRL in these regions.
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www.ti.com.cn
k(DERATE_Dim)
100%
Linear Region
Full Range Region
0%
0.075V
1.25V
1.475V V(ICTRL_FULL)
V(ICTRL_MAX)
V(ICTRL)
Copyright © 2017, Texas Instruments Incorporated
图 26. Analog Dimming Ratio
8.3.5.2 Internal High-Precision Pullup Current Source
An internal precision pullup current I(ICTRL_pullup) is provided within the device to minimize external component
count. I(ICTRL_pullup) uses current reference I(IREF) as reference. With the internal pullup current source, only an
external resistor between the ICTRL pin and GND is needed to set the ICTRL voltage and the analog dimming
ratio.
If a voltage source or resistor divider is used, the internal pullup current must be taken into account to set the
analog dimming ratio accurately.
The pullup current source pulls the ICTRL pin voltage up to input voltage V(IN) if the ICTRL pin is unconnected.
When ICTRL is not used, it is recommended to leave the ICTRL pin floating.
I(ICTRL_pullup)
ICTRL
Analog
Dimming
TPS92830-Q1
Copyright © 2017, Texas Instruments Incorporated
图 27. Internal High-Precision Pullup Current Source
22
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ZHCSGY7B –OCTOBER 2017–REVISED JANUARY 2018
8.3.6 Output Current Derating
The TPS92830-Q1 device has an integrated output-current derating function. Voltage across the sensing
resistors is reduced if DERATE input voltage VDERATE increases. The output current derating function can be
used for supply overvoltage protection and thermal protection with a thermistor. The DERATE current curves are
divided into 32 steps between 100% and 50% with hysteresis.
In the case where DERATE is used for battery voltage sensing, the resistor-divider ratio can be set in a typical
application as follows.
•
•
In the normal supply-voltage range, for example, (9 V–16 V), the output-current-derating function is disabled.
In the overvoltage range, for example, (18 V–24 V), the output current starts to derate and reaches 50%
when VIN is at 24 V.
•
When the voltage is even higher, for example, (24 V–26 V), the output current is saturated at 50%.
8.3.6.1 Output-Current Derating Topology
Voltage at the DERATE pin, V(DERATE), is used for output-current-derating control. To set the V(DERATE) voltage, a
resistor divider on supply voltage VIN is typically used for supply overvoltage protection.
•
•
•
When VDERATE is lower than V(DERATE_FULL), output current derating is not enabled; thus, output-current
derating ratio k(DERATE_Dim) is at 100%.
When VDERATE is higher than V(DERATE_HALF), output current derating is limited to 50%; thus, output-current
derating ratio k(DERATE_Dim) is at 50%.
When V(DERATE) is between V(DERATE_FULL) and V(DERATE_HALF), the output-current-derating ratio is negatively
proportional to V(DERATE) with 32 steps. Current derating is rounded to the next-lower step. The output-current-
derating ratio can be calculated using the following equations.
V DERATE _HALF - V DERATE _FULL
(
)
(
)
V DERATE _ STEP
=
(
)
32
(8)
(9)
≈
∆
’
÷
V DERATE - V DERATE _FULL
50%
32
(
)
(
)
k
= 100% -
ì
DERATE _Dim
(
)
∆
«
÷
◊
V DERATE _ STEP
(
)
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TPS92830-Q1
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www.ti.com.cn
Output Current Derating Ratio
100%
32 steps
50%
0%
V(DERATE_FULL)
V(DERATE_HALF)
V(DERATE)
Copyright © 2017, Texas Instruments Incorporated
图 28. Output-Current Derating Profile
8.3.7 Diagnostics and Fault
The TPS92830-Q1 device provides advanced diagnostics and fault protection methods for automotive exterior
lighting systems. The device is able to detect and protect from LED output short-to-GND as well as from LED
output open-circuit scenarios. The device also supports a one-fails–all-fail fault bus that could flexibly fit different
legislative requirements.
24
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TPS92830-Q1
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SUPPLY
TPS92830-Q1
ISP
Rsnsx
MNx
ISNx
Gx
SENSEx
FAULT
GND
Copyright © 2017, Texas Instruments Incorporated
SUPPLY
TPS92830-Q1
ISP
RSNSx
ISNx
MNx
Gx
SENSEx
FAULT
GND
Copyright © 2017, Texas Instruments Incorporated
图 29. LED Open and Short Scenarios
8.3.7.1 LED Short-to-GND Detection
The TPS92830-Q1 device has channel-independent LED short-to-GND detection. Short-to-GND detection is only
enabled during channel on-time. Once an LED short-to-GND failure is detected, the device turns off the faulty
channel and retries automatically. If the auto-retry mechanism detects that the LED short-to-GND fault has been
removed, the device resumes normal operation. section
The device monitors voltage V(SENSEx) and compares it with the internal reference voltage to detect short-to-GND
failures. If the period during which V(SENSEx) falls below V(SG_th_rising) is longer than the deglitch time of t(SG_deg), the
device asserts a short-to-GND fault on this channel. During the deglitch time period, if VSENSEx rises above
V(SG_th_falling), the timer is reset.
If a fault is detected, a constant-current source pulls the fault bus down. If FAULT is low, all devices connected to
the fault bus are off in the fault mode.
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8.3.7.2 LED Short-to-GND Auto Retry
Once the channel has asserted a short-to-GND fault, it automatically retries periodically. In PWM mode, the
device sources I(Retry_short) through the SENSEx pin to pull up the LED loads with a pulse duration of t(SG_retry_ON)
The device waits for t(SG_retry_OFF) until the next retry pulse. Once auto retry detects that the short-to-GND fault is
removed, the device resumes normal operation. During auto retry mode, the device ignores PWM inputs.
.
8.3.7.3 LED Open-Circuit Detection
The TPS92830-Q1 device has channel-independent LED open-circuit detection. Once an LED open-circuit failure
is detected, the device turns off the faulty channel and retries automatically. If the retry mechanism detects that
the LED open-circuit fault is removed, the device resumes normal operation.
The device monitors MOSFET dropout voltage differences between the ISNx and SENSEx pins. Voltage
difference V(ISNx) – V(SENSEx) is compared with internal reference voltage V(OPEN_th_rising) to detect an LED open-
circuit failure. If V(ISNx) – V(SENSEx) falls below the V(OPEN_th_rising) voltage and it stays there longer than the deglitch
time of t(OPEN_deg), the device asserts an open-load fault on this channel. During the deglitching time period, if
V(ISNx) – V(SENSEx) rises above V(OPEN_th_falling), the deglitch timer is reset.
In normal operation, the N-channel MOSFET operates in the saturation region with a gate-source voltage close
to its threshold voltage. In this case, the drain-source voltage of the N-channel MOSFET is typically much higher
than open-circuit threshold V(OPEN_th_rising). In the LED open-circuit condition, the N-channel MOSFET operates in
the linear region with a gate-source voltage much higher than its threshold voltage. The N-channel MOSFET is
fully on.
If a fault is detected, a constant-current source pulls the fault bus down. If the FAULT pin is low, all devices
connected to the fault bus are off in the fault mode.
8.3.7.4 LED Open-Circuit Auto Retry
Once the channel has asserted an open-circuit fault, it automatically retries periodically. The device sources
I(Retry_open) through the SENSEx pin to pull up the LED loads with a pulse duration of t(OPEN_retry_ON). In PWM
mode, the device waits for t(OPEN_retry_OFF) until the next retry pulse. Once auto retry detects that the open-circuit
fault has been removed, the device resumes normal operation. During auto retry mode, the device ignores PWM
inputs. In the open-circuit scenario, the retry current cannot find a path to ground; thus, total current consumption
does not increase.
8.3.7.5 Dropout-Mode Diagnostics
When the input voltage is not high enough to keep the external N-channel MOSFET in the constant-current
saturation region, the TPS92830-Q1 device tries to regulate current by driving the external N-channel MOSFET
in the linear region. This state is called the dropout mode, because voltage across the sense resistor is not able
to reach the regulation threshold.
In dropout mode, LED open-circuit detection must be disabled via the DIAGEN input. Otherwise, the dropout
mode would be treated as an LED open-circuit fault. The DIAGEN pin is used to avoid false diagnostics on an
output channel due to low supply voltage.
When the DIAGEN voltage is low, the LED open-circuit detection is ignored. When the DIAGEN voltage is high,
LED open-circuit detection resumes normal operation.
In dropout mode, the MOSFET is driven at maximum gate-source voltage to regulate current to the desired
value. When the supply voltage increases, the MOSFET gate voltage is pulled down internally by a control loop.
If the supply-voltage slew rate is fast, a high-current pulse can be observed on the LED for a short period of time.
At the same time, the current-sense voltage may exceed the normal operating range and damage internal
circuitry. A parallel diode or a current-limiting resistor less than 1 kΩ is recommended to clamp the voltage
across the sensing resistor in the case of a large pulse current.
26
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TPS92830-Q1
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ZHCSGY7B –OCTOBER 2017–REVISED JANUARY 2018
SUPPLY
TPS92830-Q1
RSNSx
ISP
ISNx
Gx
SENSEx
FAULT
GND
Copyright ©2017, Texas Instruments Incorporated
图 30. Resistor and Diode for Sense-Resistor Protection
8.3.7.6 Overtemperature Protection
The TPS92830-Q1 device monitors device junction temperature. When the junction temperature reaches the
thermal shutdown threshold T(TSD), all outputs shut down and the charge pump also stops working. Once the
junction temperature falls below T(TSD)
– T(TSD_HYS), the device resumes normal operation. During
overtemperature protection, the FAULT bus is pulled low.
8.3.7.7 FAULT Bus Output With One-Fails–All-Fail
The TPS92830-Q1 device has a FAULT bus for diagnostics output. It also supports a one-fails–all-fail function
with other TPS92830-Q1, TPS9261x-Q1, TPS92630-Q1, or TPS92638-Q1 devices.
In normal operation, FAULT is weakly pulled up by internal pullup current source I(FAULT_pullup) to a voltage higher
than VOH(FAULT). If any fault scenario occurs, the FAULT bus is strongly pulled low by internal pulldown current
source I(FAULT_pulldown). Once V(FAULT) falls below VIL(FAULT) , all outputs are shut down for protection. The faulty
channel keeps retrying until the fault condition is removed. The charge pump is shut down, and current
consumption is also reduced to I(FAULT) to save quiescent current.
If FAULT is externally pulled up with a current higher than I(FAULT_pulldown), the one-fails–all-fail function is disabled
̅
and only the faulty channel is turned off. The charge pump remains operating normally, and the device is in
normal operation mode. The FAULT bus is able to support up to 15 pieces of TPS92830-Q1, TPS92630-Q1,
TPS92638-Q1, or TPS9261x-Q1 devices.
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8.3.7.8 Fault Table
表 3. Fault Table With DIAGEN = HIGH
FAULT
HANDLING
ROUTINE
DETECTION
MECHANISM
CHANNEL
STATE
FAULT
RECOVERY
FAULT TYPE
DEGLITCH TIME
FAULT BUS
FAULT FLOATING
All channels
VISNx – VSENSEx
V(OPEN_th_rising)
<
turned off. Pulsed
pullup retry of
faulty channel.
LED open-circuit
On
On
t(OPEN_deg)
All channels
LED short-to-
GND
turned off. Pulsed
pullup retry of
faulty channel.
VSENSEx < V(SG_th_rising)
t(SG_deg)
Constant-current
pulldown
Auto recover
All channels
turned off. Faulty
channel pulsed
pullup retry of
faulty channel.
LED short-to-
battery
VISNx – VSENSEx
V(OPEN_th_rising)
<
On or off
On or off
t(OPEN_deg)
All channels
turned off.
Overtemperature
TJ > T(TSD)
FAULT EXTERNALLY PULLED UP
Only faulty
channel turned
off. Pulsed pullup
retry of faulty
channel.
VISNx – V SENSEx
LED open-circuit
<
On
On
t(OPEN_deg)
V(OPEN_th_rising)
Only faulty
channel turned
off. Pulsed pullup
retry of faulty
channel.
LED short-to-
Externally pulled
up with internal
constant-current
pulldown
V SENSEx < V(SG_th_rising)
t(SG_deg)
GND
Auto recover
Only faulty
channel turned
off. Pulsed pullup
retry of faulty
channel.
LED short-to-
battery
V ISNx – V(SENSEx)
V(OPEN_th_rising)
<
On or off
On or off
t(OPEN_deg)
All channels
turned off.
Overtemperature
TJ > T(TSD)
FAULT EXTERNALLY PULLED DOWN
All outputs disabled
28
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FAULT TYPE
ZHCSGY7B –OCTOBER 2017–REVISED JANUARY 2018
表 4. Fault Table With DIAGEN = LOW
FAULT
HANDLING
ROUTINE
DETECTION
MECHANISM
CHANNEL
STATE
FAULT
RECOVERY
DEGLITCH TIME
FAULT BUS
FAULT FLOATING
LED open-circuit
Ignored
Ignored
On
Ignored
t(SG_deg)
Ignored
Ignored
Ignored
All channels
LED short-to-
GND
Constant current turned off. Pulsed
pull down
V(SENSEx) < V(SG_th_rising)
Auto recover
pullup retry of
faulty channel.
LED short-to-
battery
Ignored
Ignored
Ignored
Ignored
Ignored
Ignored
Constant current All channels
pull down turned off.
Overtemperature
TJ > T(TSD)
On or off
Auto recover
FAULT EXTERNALLY PULLED UP
LED open-circuit
Ignored
Ignored
On
Ignored
t(SG_deg)
Ignored
Ignored
Ignored
Only faulty
channel turned
off. Pulsed pullup Auto recover
retry of faulty
channel.
Externally pulled
up with internal
constant current
pulled down
LED short-to-
GND
V(SENSEx) < V(SG_th_rising)
LED short-to-
battery
Ignored
Ignored
Ignored
Ignored
Ignored
Ignored
Externally pulled
up with internal
constant current
pulled down
All channels
turned off.
Overtemperature
TJ > T(TSD)
On or off
Auto recover
FAULT EXTERNALLY PULLED LOW
All outputs
All outputs
disabled
All outputs
disabled
All outputs
disabled
All outputs
disabled
All outputs
disabled
All outputs disabled
disabled
8.4 Device Functional Modes
8.4.1 Undervoltage Lockout, V(IN) < V(UVLO)
When the device is in undervoltage lockout mode, the TPS92830-Q1 device disables all functions until the supply
rises above the UVLO-rising threshold. The device pulls down the Gx outputs. Other outputs are in the high-
impedance state.
8.4.2 Normal Operation (V(IN) ≥ 4.5 V, V(IN) > V(LED) + 0.5 V)
The device drives an LED string in normal operation. A 0.5-V minimal dropout voltage is typically more than
enough to maintain LED current regulation.
8.4.3 Low-Voltage Dropout
When the device drives an LED string in low-dropout mode, even with the MOSFETs fully turned on the output
current may not reach target value. The device reports an LED open-circuit failure if DIAGEN is HIGH.
8.4.4 Fault Mode (Fault Is Detected)
When the device detects an open or shorted LED, the device tries to pull down the FAULT pin with a constant
current. If the fault bus is pulled down, the device switches to fault mode and consumes a fault current of I(FAULT)
.
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9 Application and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
In automotive applications, linear LED drivers are preferable for various applications, especially exterior lighting,
for their simplicity and electromagnetic compatibility. This section provides a few examples to show the design
process for different features.
9.2 Typical Applications
9.2.1 Typical Application for Automotive Exterior Lighting With One-Fails–All-Fail
Various functions of exterior lighting may use the following circuit. Here is a typical application circuit for a turn
indicator. A TPS92830-Q1 drives a total of nine LEDs with 3s3p configuration at 300 mA each.
图 31. TPS92830-Q1 Typical Application Circuit For Automotive Exterior Lighting
9.2.1.1 Design Requirements
With the wide range of battery voltages in modern automotive systems, it is a common requirement among car
OEMs to turn LEDs off when the battery voltage is below the minimal voltage threshold, for example, 6 V.
When the battery voltage is between 6 V and 9 V, LEDs may not achieve full brightness due to low input voltage.
Although a linear LED driver may drive in low-dropout mode, it is required not to treat the low-dropout mode as
an open-circuit fault and to report a false error.
30
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Typical Applications (接下页)
When battery voltage ranges between 9 V and 16 V, the LED driver works in normal mode with the one-fails–all-
fail feature. If any LED strings fail with an open circuit or short circuit, the TPS92830-Q1 device pulls down the
fault bus. All devices connected to the same fault bus turn off their outputs.
When the battery voltage is above 18 V, the TPS92830-Q1 device is able to detect the overvoltage and derate
the output current to reduce the power dissipation of the MOSFETs and prevent thermal damage.
9.2.1.2 Detailed Design Procedure
Fixed Parameters
•
•
•
•
Charge pump flying capacitor C6 = 10 nF
Charge pump flying capacitor C8 = 10 nF
R(IREF) = 8 kΩ
Charge pump storage capacitor C10 = 150 nF
Current Setting
•
•
I(LED) = 300 mA
R(SNS)= V(CS_REG) / I(LED) = 0.983 Ω
PWM Threshold Setting
•
•
•
•
PWM enables when V(IN) > 6 V
K(RES_PWM) = VIH(PWMx, max) / 6 V
K(RES_PWM) = R15 / (R15 + R8)
Set R15 = 20 kΩ, R8 = 76 kΩ
DiagEN Setting (Enables LED-Open Detection When V(IN) > 9 V
•
•
•
K(RES_DiagEN) = VIH(DIAGEN, max) / 9 V
K(RES_DiagEn) = R13 / (R6 + R13)
Set R13 = 10 kΩ, R6 = 62 kΩDiagEN setting
DERATE Setting (Reduces Current Output When V(IN) > 18 V
•
•
•
K(RES_DERATE) = V(DERATE_FULL, min) / 18 V
K(RES_DERATE) = R7 / (R7+ R14)
Set R7 = 10 kΩ, R14 = 95 kΩ
To deliver 300 mA with a single MOSFET package, the designer must consider the maximum thermal-dissipation
condition. The power dissipation of a MOSFET is usually at its peak when input voltage is at 16 V in a full-
brightness condition. Assume the minimal LED forward voltage at 300 mA is 6 V.
PMOSFET = I LED ì V - VF Diode - VF LED,min - V CS _REG = 300mA ì(16 - 0.7 - 6 - 0.295) = 2.702W
IN
(
)
(
)
(
)
(
)
(
)
(
)
(10)
MOSFET package and layout design must be considered to dissipate 2.702 W at maximum ambient
temperature, usually 85°C.
The TPS92830 device can support a variety of N-channel MOSFETs in the markets. Adding a capacitor between
the gate and source increases the loop phase margin. The recommended total capacitance at Gx is greater than
4 nF.
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Typical Applications (接下页)
9.2.1.3 Application Curves
Ch. 1 = V(IN)
Ch .2 = V(FAULT)
Ch. 3 = V(SENSE2)
Ch. 4 = I(OUT2)
IN HIGH = 14 V, LOW = 0 V, with reverse
blocking diode
Pulse duration = 300 µs, period = 2 ms
图 32. BCM PWM Dimming Curve
9.2.2 High-Precision Dual-Brightness PWM Generation
9.2.2.1 Dual-Brightness Application
Automotive lighting often reuses the same LEDs for different functions with different brightness, for example,
daytime running lights (DRL) and position lights, or stop and tail lights. Analog dimming by changing the constant
current may affect LED color temperature. PWM dimming could easily achieve the dimming ratio with the same
color temperature.
The TPS92830-Q1 device provides a precision PWM generator with a synchronization PWMOUT output. Its
integrated high-precision PWM generator ensures homogeneity across different devices.
32
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Typical Applications (接下页)
SUPPLY
TPS92830-Q1
TPS92830-Q1
IN
IN
ISP
ISP
CPOUT
CP2P
CPOUT
CP2P
RSNS1
RSNS1
ISN1
ISN1
CP2N
CP1P
CP2N
CP1P
MN1
MN1
G1
G1
CP1N
FD
CP1N
FD
SENSE1
SENSE1
FD
PWM
PWM1
PWMOUT
IREF
PWMx
IREF
PWMCHG
FAULT
PWMCHG
FAULT
RPWM
CPWM
Copyright © 2017, Texas Instruments Incorporated
图 33. PWM Generator Master-Slave Configuration
9.2.2.2 Design Requirements
When full duty-cycle (FD) is HIGH, the output is at 100% duty cycle.
When full duty-cycle (FD) is LOW, the output is at 10% duty cycle and 250 Hz.
9.2.2.3 Detailed Design Procedure
PWM Equations
•
•
•
RPU = 10 kΩ
CPWM = 105.5 nF
RPWM = 55.5 kΩ
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Typical Applications (接下页)
9.2.2.4 Application Curve
Ch. 1 = V(PWMCHG)
Ch. 4 = I(OUT2_1)
Ch. 2 = V(PWMOUT)
Ch. 3 = I(OUT1_1)
Ch. 1 = V(PWMCHG)
Ch. 4 = I(OUT2_1)
Ch. 2 = V(PWMOUT)
Ch. 3 = I(OUT1_1)
图 34. Dual Brightness With Integrated High-Precision
图 35. Dual Brightness With Integrated High-Precision
PWM Generator at Full Duty-cycle
PWM Generator at 10% Duty-cycle
9.2.3 Driving High-Current LEDs With Parallel MOSFETs
Thermal performance is one key consideration in automotive exterior driving, especially for a linear LED driver.
Due to large variations of automotive battery voltage, a linear LED driver must accommodate thermal dissipation
with a worst-case scenario, which is high ambient temperature and high battery voltage.
LED driver thermal dissipation performance merely depends on the package and PCB thermal dissipation area.
However, if the thermal dissipation performance of a single MOSFET is not able to support the required LED
string current, multiple MOSFETs in parallel are able to dissipate heat for high-current applications.
When a MOSFET is in the saturation region as a current-control device, its current output strongly depends on its
threshold. MOSFET threshold Vth can vary from one device to another. When MOSFETs are in parallel, even a
small threshold mismatch could lead to imbalance of current distribution.
With an integrated charge pump, the TPS92830-Q1 device provides sufficient headroom even when the supply
voltage is as low as 5 V. Thus adding ballast resistors between the N-channel MOSFET source and the LED
string introduces negative feedback for each parallel MOSFET path to balance the current flows.
表 5. Thermal Measurement of Parallel MOSFETs
WITHOUT CURRENT BALLAST
WITH 1-Ω BALLAST RESISTOR
WITH 3-Ω BALLAST RESISTOR
Resistor
MOSFET1
Temperature (ºC)
105.7
85.3
82.8
87.6
85.9
84.2
85.3
MOSFET2
Temperature (ºC)
76.1
84.8
MOSFET3
Temperature (ºC)
34
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www.ti.com.cn
ZHCSGY7B –OCTOBER 2017–REVISED JANUARY 2018
V(IN)= 16 V, I(Total) = 964 mA, TA= 25 ºC.
SUPPLY
TPS92830-Q1
IN
ISP
RSNSx
ISNx
Gx
MN1
MN2
MN3
FAULT
SENSEx
GND
Copyright © 2017, Texas Instruments Incorporated
图 36. Parallel MOSFET Driving
9.2.3.1 Application Curves
Without Ballast Resistors
With 1-W Ballast Resistors
With 3-W Ballast Resistors
图 37. Thermal Images of Parallel MOSFETs With Various Ballast Resistors
版权 © 2017–2018, Texas Instruments Incorporated
35
TPS92830-Q1
ZHCSGY7B –OCTOBER 2017–REVISED JANUARY 2018
www.ti.com.cn
10 Layout
10.1 Layout Guidelines
The TPS92830-Q1 device relies on external MOSFETs to dissipate heat for high-current applications. To
effectively dissipate heat on MOSFETs and LEDs, TI recommends to use 0.071-mm-thick (2-oz.) copper PCBs
or metal-based boards. Make the thermal dissipation area with copper as large as possible. Place thermal vias
on the thermal dissipation area to further improve the thermal dissipation capability. The current path starts from
IN through the sense-resistors, MOSFETs, and LEDs to GND. Wide traces are helpful to reduce parasitic
resistance along the current path as shown in the layout example below.
Place capacitors, especially charge pump capacitors, close to the device to make the current path as short as
possible. TI suggests keeping the LED high-current ground path separate from device ground. TI also
recommends kelvin-connection to the connector. The following layout example shows the recommended
guidelines.
10.2 Layout Example
IN
TPS92830-Q1
1
2
28
27
26
25
24
23
22
21
20
19
18
17
16
15
CP1P
CP1N
GND
ISP
ISN1
G1
GND
3
4
CP2N
CP2P
CPOUT
IN
SENSE1
ISN2
5
6
G2
SENSE2
ISN3
7
DIAGEN
8
DIAGEN
DERATE
DERATE
PWM1
9
G3
10
11
12
13
14
SENSE3
PWM1
PWM2
PWM3
FD
PWM2
PWM3
FD
PWMOUT
FAULT
PWMCHG
IREF
ICTRL
Copyright © 2017, Texas Instruments Incorporated
图 38. TPS92830-Q1 Example Layout Diagram
36
版权 © 2017–2018, Texas Instruments Incorporated
TPS92830-Q1
www.ti.com.cn
ZHCSGY7B –OCTOBER 2017–REVISED JANUARY 2018
11 器件和文档支持
11.1 接收文档更新通知
要接收文档更新通知,请导航至TI.com 上的器件产品文件夹。单击右上角的通知我进行注册,即可每周接收产品信
息更改摘要。
11.2 社区资源
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范,
并且不一定反映 TI 的观点;请参阅 TI 的 《使用条款》。
TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在
e2e.ti.com 中,您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。
设计支持
TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。
11.3 商标
E2E is a trademark of Texas Instruments.
11.4 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止 MOS 门极遭受静电损
伤。
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是针对指定器件提供的最新数据。本数据随时可能发生变更并且
不对本文档进行修订,恕不另行通知。要获得这份数据表的浏览器版本,请查阅左侧的导航窗格。
版权 © 2017–2018, Texas Instruments Incorporated
37
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS92830QPWRQ1
ACTIVE
TSSOP
PW
28
2000 RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 125
TPS92830
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jul-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS92830QPWRQ1
TSSOP
PW
28
2000
330.0
16.4
6.9
10.2
1.8
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jul-2019
*All dimensions are nominal
Device
Package Type Package Drawing Pins
TSSOP PW 28
SPQ
Length (mm) Width (mm) Height (mm)
350.0 350.0 43.0
TPS92830QPWRQ1
2000
Pack Materials-Page 2
重要声明和免责声明
TI 均以“原样”提供技术性及可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资
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