TRF7970A_14 [TI]

Multiprotocol Fully Integrated 13.56-MHz RFID and Near Field Communication (NFC) Transceiver IC;
TRF7970A_14
型号: TRF7970A_14
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Multiprotocol Fully Integrated 13.56-MHz RFID and Near Field Communication (NFC) Transceiver IC

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TRF7970A  
www.ti.com  
SLOS743B AUGUST 2011REVISED MARCH 2012  
MULTI-PROTOCOL FULLY INTEGRATED 13.56-MHz RFID/NEAR  
FIELD COMMUNICATION (NFC) TRANSCEIVER IC  
Check for Samples: TRF7970A  
1 Introduction  
1.1 Features  
1
• Supports Near Field Communication (NFC)  
Standards NFCIP-1 (ISO/IEC 18092) and  
NFCIP2 (ISO/IEC 21481)  
• Completely Integrated Protocol Handling for  
ISO15693, ISO18000-3, ISO14443A/B, and  
FeliCa  
• Integrated Encoders, Decoders, and Data  
Framing for NFC Initiator, Active and Passive  
Target Operation for All Three Bit Rates  
(106 kbps, 212 kbps, 424 kbps) and Card  
Emulation  
• RF Field Detector With Programmable Wake-Up  
Levels for NFC Passive Transponder Emulation  
Operation  
• RF Field Detector for NFC Physical Collision  
Avoidance.  
• Integrated State Machine for ISO14443A  
Anticollision (Broken Bytes) Operation  
(Transponder Emulation or NFC Passive  
Target)  
• Programmable Output Power: +20 dBm  
(100 mW), +23 dBm (200 mW)  
• Programmable I/O Voltage Levels From  
1.8 VDC to 5.5 VDC  
• Programmable System Clock Frequency  
Output (RF, RF/2, RF/4) from 13.56-MHz or  
27.12-MHz Crystal or Oscillator  
• Integrated Voltage Regulator Output for Other  
System Components (MCU, Peripherals,  
Indicators), 20 mA (Max)  
• Programmable Modulation Depth  
• Dual Receiver Architecture With RSSI for  
Elimination of "Read Holes" and Adjacent  
Reader System or Ambient In-Band Noise  
Detection  
• Programmable Power Modes for Ultra Low-  
Power System Design (Power Down <1 µA)  
• Parallel or SPI Interface (With 128-Byte FIFO)  
• Temperature Range: -40°C to 110°C  
• 32-Pin QFN Package (5 mm x 5 mm)  
• Input Voltage Range: 2.7 VDC to 5.5 VDC  
1.2 Applications  
Mobile Devices (Tablets, Handsets)  
Secure Pairing (Bluetooth, WiFi, Other Paired Wireless Networks)  
Public Transport or Event Ticketing  
Passport or Payment (POS) Reader Systems  
Short-Range Wireless Communication Tasks (Firmware Updates)  
Product Identification or Authentication  
Medical Equipment or Consumables  
Access Control, Digital Door Locks  
Sharing of Electronic Business Cards  
1.3 Description  
The TRF7970A is an integrated analog front end and data-framing device for a 13.56-MHz RFID/Near  
Field Communication system. Built-in programming options make it suitable for a wide range of  
applications for proximity and vicinity identification systems.  
It can perform in one of three modes: RFID/NFC Reader, NFC Peer, or in Card Emulation mode. Built-in  
user-configurable programming options make it suitable for a wide range of applications.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date. Products conform to  
specifications per the terms of the Texas Instruments standard warranty. Production  
processing does not necessarily include testing of all parameters.  
Copyright © 2011–2012, Texas Instruments Incorporated  
 
 
 
 
TRF7970A  
SLOS743B AUGUST 2011REVISED MARCH 2012  
www.ti.com  
The TRF7970A is configured by selecting the desired protocol in the control registers. Direct access to all  
control registers allows fine tuning of various reader parameters as needed.  
Documentation, reference designs, EVM, and TI MCU (MSP430, ARM) source code are available.  
VDD_I/O  
MUX  
PHASE&  
AMPLITUDE  
DETECTOR  
I/O_0  
RSSI  
(AUX)  
LOGIC  
GAIN  
RX_IN1  
RX_IN2  
I/O_1  
STATE  
CONTROL  
LOGIC  
RF Level  
Detector  
I/O_2  
RSSI  
(EXTERNAL)  
I/O_3  
[CONTROL  
REGISTERS&  
COMMAND  
LOGIC]  
I/O_4  
RSSI  
(MAIN)  
PHASE&  
AMPLITUDE  
DETECTOR  
I/O_5  
GAIN  
FILTER  
& AGC  
I/O_6  
DIGITIZER  
DECODER  
MCU  
INTERFACE  
VDD_PA  
TX_OUT  
VSS_PA  
I/O_7  
ISO  
PROTOCOL  
HANDLING  
IRQ  
SYS_CLK  
DATA_CLK  
VIN  
TRANSMITTER ANALOG  
FRONT END  
128 BYTE  
FIFO  
BIT  
FRAMING  
FRAMING  
SERIAL  
CONVERSION  
CRC & PARITY  
VDD_A  
BAND_GAP  
VSS_A  
VDD_RF  
VSS_RF  
EN  
EN2  
DIGITAL CONTROL  
STATE MACHINE  
ASK/OOK  
MOD  
VOLTAGE SUPPLY REGULATOR SYSTEMS  
[SUPPLY REGULATORS , REFERENCE VOLTAGES ]  
VDD_X  
VSS  
OSC_IN  
CRYSTAL / OSCILLATOR  
TIMING SYSTEM  
VSS_D  
OSC_OUT  
Figure 1-1. Block Diagram  
1.3.1 Detailed Description  
RFID/NFC Operation – Reader/Writer  
The TRF7970A is a high performance 13.56-MHz HF RFID/NFC Transceiver IC composed of an  
integrated analog front end (AFE) and a built-in data framing engine for ISO15693, ISO14443A,  
ISO14443B, and FeliCa. This includes data rates up to 848 kbps for ISO14443 with all framing and  
synchronization tasks on board (in default mode). The TRF7970A also supports NFC Tag Type 1, 2, 3,  
and 4 operations. This architecture enables the customer to build a complete cost-effective yet high-  
performance multi-protocol 13.56-MHz RFID/NFC system together with a low-cost microcontroller (for  
example, MSP430).  
Other standards and even custom protocols can be implemented by using two of the Direct Modes that  
the device offers. These Direct Modes (0 and 1) allow the user to fully control the analog front end (AFE)  
and also gain access to the raw subcarrier data or the unframed but already ISO formatted data and the  
associated (extracted) clock signal.  
The receiver system has a dual input receiver architecture. The receivers also include various automatic  
and manual gain control options. The received input bandwidth can be selected to cover a broad range of  
input subcarrier signal options.  
2
Introduction  
Copyright © 2011–2012, Texas Instruments Incorporated  
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TRF7970A  
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SLOS743B AUGUST 2011REVISED MARCH 2012  
The received signal strength from transponders, ambient sources, or internal levels is available through  
the RSSI register. The receiver output is selectable among a digitized subcarrier signal and any of the  
integrated subcarrier decoders. The selected subcarrier decoder delivers the data bit stream and the data  
clock as outputs.  
The TRF7970A also includes a receiver framing engine. This receiver framing engine performs the CRC  
or parity check, removes the EOF and SOF settings, and organizes the data in bytes for ISO14443-A/B,  
ISO15693, and FeliCa protocols. Framed data is then accessible to the microcontroller (MCU) through a  
128-byte FIFO register.  
VDD  
VDD  
VDD_X  
VDD_I/O  
TX_OUT  
Matching  
MCU  
(MSP430/ARM)  
Parallel  
or SPI  
TRF7970A  
RX_IN 1  
RX_IN2  
VSS  
VIN  
XIN  
Supply: 2.7 V – 5.5 V  
Crystal  
13.56 MHz  
Figure 1-2. Application Block Diagram  
A parallel or serial interface (SPI) can be used for the communication between the MCU and the  
TRF7970A reader. When the built-in hardware encoders and decoders are used, transmit and receive  
functions use a 128-byte FIFO register. For direct transmit or receive functions, the encoders and  
decoders can be bypassed so that the MCU can process the data in real time. The TRF7970A supports  
data communication levels from 1.8 V to 5.5 V for the MCU I/O interface. The transmitter has selectable  
output-power levels of 100 mW (+20 dBm) or 200 mW (+23 dBm) equivalent into a 50-Ω load when using  
a 5-V supply.  
The transmitter supports OOK and ASK modulation with selectable modulation depth. The TRF7970A also  
includes a data transmission engine that comprises low-level encoding for ISO15693, ISO14443A/B and  
FeliCa. Included with the transmit data coding is the automatic generation of Start Of Frame (SOF), End  
Of Frame (EOF), Cyclic Redundancy Check (CRC), or parity bits.  
Several integrated voltage regulators ensure a proper power-supply noise rejection for the complete  
reader system. The built-in programmable auxiliary voltage regulator VDD_X (pin 32), is able to deliver up to  
20 mA to supply a microcontroller and additional external circuits within the reader system.  
NFC Device Operation – Initiator  
The desired system of operation (bit rate) is achieved by selecting the option bits in control registers in the  
same way as for RFID reader operation. Also the communication to external MCU and data exchange is  
identical.  
The transmitting system comprises an RF level detector (programmable level) which is used for initial (or  
response) RF collision avoidance. The RF collision avoidance sequence is started by sending a direct  
command. If successful, the NFC initiator can send the data or commands, the MCU has loaded in the  
FIFO register. The coding of this data is done by hardware coders either in ISO14443A/B format or in  
FeliCa format. The coders also provide CRC and parity bits (if required) and automatically add preambles,  
SOF, EOF, and synchronization bytes as defined by selected protocol.  
Copyright © 2011–2012, Texas Instruments Incorporated  
Introduction  
3
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SLOS743B AUGUST 2011REVISED MARCH 2012  
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The receiver system offers same analog features (AGC, AM/PM, bandwidth selection, etc.) as described  
previously in RFID/NFC reader/writer description. The system comprises integrated decoders for passive  
targets (ISO14443A/B tag or FeliCa) or active targets (ISO14443A/B reader or FeliCa). For all this options,  
the system also supports framing including CRC and parity check and removal of SOF, EOF, and  
synchronization bytes as specified by the selected protocol.  
NFC Device Operation – Target  
The desired system of operation (bit rate) is achieved by selecting the option bits in control registers in the  
same way as for RFID reader or NFC initiator operation. Also the communication to external MCU and  
data exchange is identical.  
The activation of NFC target is done when a sufficient RF field level is detected on the antenna. The level  
needed for wake-up is selectable and is stored in non-volatile register.  
When the activation occurs, the system performs automatic power-up and waits for the first command to  
be received. Based on this command, the system knows if it should operate as passive or active target  
and at what bit rate. After activation, the receiver system offers the same analog features (for example,  
AGC, AM/PM, and bandwidth selection) as in the case of an RFID reader.  
When used as the NFC target, the chip is typically in a power down or standby mode. If EN2 = H, the chip  
keeps the supply system on. If EN2 = L and EN = L, the chip is in complete power down. To operate as  
NFC target or Tag emulator, the MCU must load a value different than zero (0) in Target Detection Level  
register (B0-B2) to enable the RF measurement system (supplied by VEXT, so it can operate also during  
complete power down and consumes only 3.5 µA). The RF measurement constantly monitors the RF  
signal on the antenna input. When the RF level on the antenna input exceeds the level defined in the in  
Target Detection Level register, the chip is automatically activated (EN is internally forced high).  
When the voltage supply system and the oscillator are started and are stable, osc_ok goes high (B6 of  
RSSI Level and Oscillator Status register) and IRQ is sent with bit B2 = 1 of IRQ register (field change).  
Bit B7 NFC Target Protocol in register directly displays the status of RF level detection (running constantly  
also during normal operation). This informs the MCU that the chip should start operation as NFC TARGET  
device. When the first command from the INITIATOR is received another IRQ sent with B6 (RX start) set  
in IRQ register. The MCU must set EN = H (confirm the power-up) in the time between the two IRQs,  
because the internal power-up ends after the second IRQ. The type and coding of the first initiator (or  
reader in the case of a tag emulator) command defines the communication protocol type that the target  
must use. Therefore, the communication protocol type is available in the NFC Target Protocol register  
immediately after receiving the first command.  
Based on the first command from the INITIATOR, the following actions are taken:  
If the first command is SENS_REQ or ALL_REQ the TARGET must enter the SDD protocol for 106-  
kbps passive communication to begin; afterward, the baud rate can be changed to 212 kbps or 424  
kbps, according to the system requirements. If bit B5 in the NFC Target Detection Level register is not  
set, the MCU handles the SDD and the command received is send to FIFO. If bit B5 is set, the internal  
SDD state machine is used. The MCU must load the ID (NFCID1) of the device in the 128-byte NFCID  
Number registers to be used by the SDD state machine. The length of the ID to use in SDD is defined  
by bits B6 and B7 of the NFC Target Detection Level register. When the SDD is complete and the  
INITIATOR sends SEL_REQ with full UID on the correct cascade level, the SDD state machine  
responds with SEL_RES to indicate that the TARGET supports the data exchange protocol. The IRQ  
(B3 set) is sent to the MCU to signal the successful end of SDD (the device is now selected as  
TARGET). The SDD state machine is than turned off. If the RF field is turned off (B7 in NFC Target  
Protocol register is low) at any time, the system sends an IRQ to the MCU with bit B2 (RF field  
change) in the IRQ register set high. This informs the MCU that the procedure was aborted and the  
system must be reset. The clock extractor is automatically activated in this mode.  
If the command is SENS_REQ or ALL_REQ and the Tag emulation bit in ISO Control register is set,  
the system emulates ISO14443A/B or FeliCa tag. The procedure does not differ from the one  
previously described for the case of a passive target at 106 kbps. The clock extractor is automatically  
activated in this mode.  
4
Introduction  
Copyright © 2011–2012, Texas Instruments Incorporated  
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Product Folder Link(s): TRF7970A  
TRF7970A  
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SLOS743B AUGUST 2011REVISED MARCH 2012  
If the first command is a POLLING request, the system becomes the TARGET in passive  
communication using 212 kbps or 424 kbps. The SDD is relatively simple and is handled by the MCU  
directly. The POLLING response is sent in one of the slots automatically calculated by the MCU (first  
slot starts 2.416 ms after end of command, and slots follow in 1.208 ms).  
If the first command is ATR_REQ, the system operatea as an active TARGET using the same  
communication speed and bit coding as used by the INITIATOR. Again, all of the replies are handled  
by MCU. The chip is only requred to time the response collision avoidance, which is done on direct  
command from MCU. When the RF field is switched on and the minimum wait time is elapsed, the chip  
sends an IRQ with B1 (RF collision avoidance finished) set high. This signals the MCU that it can send  
the reply.  
If the first command is coded as ISO14443B and the Tag emulation bit is set in the ISO Control  
register, the system enters ISO14443B emulation mode. The anticollision must be handled by the  
MCU, and the chip provides all physical level coding, decoding, and framing for this protocol.  
Active Target  
If the first command received by the RF interface defines the system as an active target, then the receiver  
selects the appropriate data decoders (ISO14443A\B reader or FeliCa) and framing option. Only the raw  
(decoded) data is forwarded to the MCU through the FIFO. SOF, EOF, preamble, sync bytes, CRC, and  
parity bytes are checked by the framer and discarded.  
The transmitting system includes an RF level detector (programmable level) that is used for RF collision  
avoidance. The RF collision avoidance sequence is started by sending a direct command. If successful,  
the NFC initiator can send the data that the MCU has loaded in the FIFO register. The coding of this data  
is done by hardware coders either in ISO14443A format (106-kbps system) or in FeliCa format for (212-  
kbps and 424-kbps systems). The coders also provide CRC and parity bits (if required) and automatically  
add preambles, SOF, EOF, and synchronization bytes as defined by selected protocol.  
Passive Target  
If the first command received by the RF interface defines the system as a passive target, then the receiver  
selects the appropriate data decoders (ISO14443A\B reader or FeliCa) and framing option. Again, only the  
raw (decoded) data is forwarded to the MCU through the FIFO; SOF, EOF, preamble, sync bytes, CRC,  
and parity bytes are checked by the framer and discarded. The receiver works same as in the case of an  
active target.  
For a passive target at 106 kbps, an internal single device detection (SDD) state machine is available and  
can perform the SDD (same as anticollision in RFID tags) as defined in ISO14443A\B. This relieves the  
MCU of the demanding task of handling the 'broken bytes'. For synchronization with the Initiator, a 13.56-  
MHz clock extractor with a glitch-free switch unit between the internal and external clock is integrated. The  
clock extractor can be disabled by the application.  
The transmit system in passive target mode is different and operates similar to the standard tag. There is  
no RF collision avoidance sequence, and encoders are used to code the data for ISO14443A\B tag (at  
106 kbps, to start) or FeliCa (at 212 kbps, to start) format. The coding system adds all of the SOF, EOF,  
CRC, parity bits, and synchronization bytes required by protocol. On the physical level, the modulation of  
the initiator's RF field is done by changing the termination impedance of the antenna between 4 Ω and  
open.  
Card Emulation  
The chip can enter this mode by setting appropriate option bits. There are two options to emulate a card.  
For ISO14443A\B, the emulation supports 106-kbps data rate to start. For ISO14443A, the anticollision  
algorithm can be performed using an internal state machine, which relieves the MCU of any real-time  
tasks. The unique ID required for anticollision is provided by the MCU after wake-up of the system.  
Copyright © 2011–2012, Texas Instruments Incorporated  
Introduction  
5
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SLOS743B AUGUST 2011REVISED MARCH 2012  
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Table 1-1. Supported Protocols  
Supported Protocols  
ISO-14443A/B  
FeliCa  
NFC  
ISO-15693,  
ISO-18000-3  
(Mode 1)  
Device  
212 kbps,  
424 kbps  
Type 1–  
Type 4  
106 kbps  
212 kbps  
424 kbps  
848 kbps  
TRF7970A  
1.4 Ordering Information  
Packaged Devices(1)  
Package Type(2)  
RHB-32  
Transport Media  
Tape and Reel  
Quantity  
TRF7970ARHBT  
250  
TRF7970ARHBR  
3000  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
Web site at www.ti.com.  
(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
6
Introduction  
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SLOS743B AUGUST 2011REVISED MARCH 2012  
1
Introduction .............................................. 1  
5.3 Receiver – Analog Section ......................... 19  
5.4 Receiver – Digital Section .......................... 21  
5.5 Oscillator Section ................................... 26  
5.6 Transmitter – Analog Section ...................... 27  
5.7 Transmitter – Digital Section ....................... 28  
1.1 Features ............................................. 1  
1.2 Applications .......................................... 1  
1.3 Description ........................................... 1  
1.4 Ordering Information ................................. 6  
Physical Characteristics ............................... 8  
2.1 Terminal Functions .................................. 8  
Electrical Specifications ............................. 11  
3.1 Absolute Maximum Ratings ........................ 11  
3.2 Recommended Operating Conditions .............. 11  
3.3 Dissipation Ratings ................................. 11  
3.4 Electrical Characteristics ........................... 12  
5.8  
Transmitter – External Power Amplifier and  
2
3
Subcarrier Detector ................................. 29  
5.9  
TRF7970A IC Communication Interface ........... 29  
5.10 Special Direct Mode for Improved MIFARE  
Compatibility ........................................ 50  
5.11 NFC Modes ......................................... 50  
5.12 Direct Commands from MCU to Reader ........... 53  
Register Description .................................. 57  
6.1 Register Preset ..................................... 57  
6.2 Register Overview .................................. 57  
6.3 Detailed Register Description ...................... 59  
System Design ......................................... 77  
7.1 Layout Considerations .............................. 77  
6
7
8
4
5
Application Schematic and Layout  
Considerations ......................................... 13  
4.1  
TRF7970A Reader System Using Parallel  
Microcontroller Interface ............................ 13  
TRF7970A Reader System Using SPI With SS  
4.2  
Mode ................................................ 14  
Detailed System Description ........................ 15  
5.1 System Block Diagram ............................. 15  
5.2 Power Supplies ..................................... 15  
7.2  
Impedance Matching TX_Out (Pin 5) to 50 ...... 77  
7.3 Reader Antenna Design Guidelines ................ 79  
Revision History ....................................... 80  
Copyright © 2011–2012, Texas Instruments Incorporated  
Contents  
7
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2 Physical Characteristics  
2.1 Terminal Functions  
RHB PACKAGE  
(TOP VIEW)  
32  
31  
30  
29  
28  
27  
26  
25  
VDD_A  
VIN  
1
2
3
4
5
6
7
8
I/0_7  
I/0_6  
I/0_5  
I/0_4  
I/0_3  
I/0_2  
I/0_1  
I/0_0  
24  
23  
22  
21  
20  
19  
18  
17  
VDD_RF  
VDD_PA  
TX_OUT  
VSS_PA  
VSS_RX  
RX_IN1  
Pad  
9
10  
11  
12  
13  
14  
15  
16  
Figure 2-1. Pin Assignments  
8
Physical Characteristics  
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SLOS743B AUGUST 2011REVISED MARCH 2012  
Table 2-1. Terminal Functions  
TERMINAL  
NAME  
(1)  
TYPE  
DESCRIPTION  
NO.  
1
VDD_A  
OUT  
SUP  
OUT  
INP  
Internal regulated supply (2.7 V to 3.4 V) for analog circuitry  
External supply input to chip (2.7 V to 5.5 V)  
Internal regulated supply (2.7 V to 5 V), normally connected to VDD_PA (pin 4)  
Supply for PA; normally connected externally to VDD_RF (pin 3)  
RF output (selectable output power, 100 mW or 200 mW, with VDD = 5 V)  
Negative supply for PA; normally connected to circuit ground  
Negative supply for RX inputs; normally connected to circuit ground  
Main RX input  
VIN  
2
VDD_RF  
VDD_PA  
TX_OUT  
VSS_PA  
VSS_RX  
RX_IN1  
RX_IN2  
VSS  
3
4
5
OUT  
SUP  
SUP  
INP  
6
7
8
9
INP  
Auxiliary RX input  
10  
11  
SUP  
OUT  
Chip substrate ground  
BAND_GAP  
Bandgap voltage (VBG = 1.6 V); internal analog voltage reference  
Selection between ASK and OOK modulation (0 = ASK, 1 = OOK) for Direct Mode 0 or 1.  
Can be configured as an output to provide the received analog signal output.  
Interrupt request  
ASK/OOK  
IRQ  
12  
13  
14  
BID  
OUT  
INP  
External data modulation input for Direct Mode 0 or 1  
Subcarrier digital data output (see registers 0x1A and 0x1B)  
Negative supply for internal analog circuits; connected to GND  
Supply for I/O communications (1.8 V to VIN) level shifter. VIN should be never exceeded.  
I/O pin for parallel communication  
MOD  
OUT  
SUP  
INP  
VSS_A  
VDD_I/O  
I/O_0  
I/O_1  
15  
16  
17  
18  
BID  
BID  
I/O pin for parallel communication  
I/O pin for parallel communication  
I/O_2  
I/O_3  
I/O_4  
I/O_5  
19  
20  
21  
22  
BID  
BID  
BID  
BID  
TX_Enable (in Special Direct Mode)  
I/O pin for parallel communication  
TX_Data (in Special Direct Mode)  
I/O pin for parallel communication  
Slave Select signal in SPI mode  
I/O pin for parallel communication  
Data clock output in Direct Mode 1 and Special Direct Mode  
I/O pin for parallel communication  
I/O_6  
I/O_7  
23  
24  
BID  
BID  
MISO for serial communication (SPI)  
Serial bit data output in Direct Mode 1 or subcarrier signal in Direct Mode 0  
I/O pin for parallel communication.  
MOSI for serial communication (SPI)  
Selection of power down mode. If EN2 is connected to VIN, then VDD_X is active during power  
down mode 2 (for example, to supply the MCU).  
EN2  
25  
26  
INP  
INP  
DATA_CLK  
Data Clock input for MCU communication (parallel and serial)  
If EN = 1 (EN2 = don't care) the system clock for MCU is configured. Depending on the crystal  
that is used, options are as follows (see register 0x09):  
SYS_CLK  
27  
OUT  
13.56-MHz crystal: Off, 3.39 MHz, 6.78 MHz, or 13.56 MHz  
27.12-MHz crystal: Off, 6.78 MHz, 13.56 MHz, or 27.12 MHz  
If EN = 0 and EN2 = 1, then system clock is set to 60 kHz  
Chip enable input (If EN = 0, then chip is in sleep or power-down mode).  
Negative supply for internal digital circuits  
Crystal or oscillator output  
EN  
28  
29  
30  
INP  
SUP  
OUT  
INP  
VSS_D  
OSC_OUT  
Crystal or oscillator input  
OSC_IN  
31  
OUT  
Crystal oscillator output  
(1) SUP = Supply, INP = Input, BID = Bidirectional, OUT = Output  
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Physical Characteristics  
9
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Table 2-1. Terminal Functions (continued)  
TERMINAL  
NAME  
(1)  
TYPE  
DESCRIPTION  
NO.  
32  
Internally regulated supply (2.7 V to 3.4 V) for digital circuit and external devices (for example,  
MCU)  
VDD_X  
Thermal Pad  
OUT  
SUP  
PAD  
Chip substrate ground  
10  
Physical Characteristics  
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3 Electrical Specifications  
(1) (2)  
3.1 Absolute Maximum Ratings  
over operating free-air temperature range (unless otherwise noted)  
VIN  
IIN  
Input voltage range  
Maximum current VIN  
-0.3 V to 6 V  
150 mA  
2 kV  
HBM (Human-Body Model)  
CDM (Charged-Device Model)  
MM (Machine Model)  
Any condition  
ESD  
Electrostatic discharge rating  
500 V  
200 V  
140°C  
TJ  
Maximum operating virtual junction temperature  
Storage temperature range  
(3)  
Continuous operation, long-term reliability  
125°C  
TSTG  
-55°C to 150°C  
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings  
only and functional operation of the device at these or any other conditions beyond those indicated under Operating Conditions are not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) All voltage values are with respect to substrate ground terminal VSS  
.
(3) The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may  
result in reduced reliability or lifetime of the device.  
3.2 Recommended Operating Conditions  
over operating free-air temperature range (unless otherwise noted)  
MIN  
2.7  
-40  
-40  
TYP  
5
MAX UNIT  
VIN  
TA  
TJ  
Operating input voltage  
5.5  
110  
125  
V
Operating ambient temperature  
Operating virtual junction temperature  
25  
25  
°C  
°C  
3.3 Dissipation Ratings  
(2)  
(1)  
POWER RATING  
A 25°C  
27 W  
θJC  
(°C/W)  
θJC  
PACKAGE  
(°C/W)  
T
T
A 85°C  
RHB (32 pin)  
31  
36.4  
1.1 W  
(1) This data was taken using the JEDEC standard high-K test PCB.  
(2) Power rating is determined with a junction temperature of 125°C. This is the point where distortion starts to increase substantially.  
Thermal management of the final PCB should strive to keep the junction temperature at or below 125°C for best performance and long-  
term reliability.  
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Electrical Specifications  
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3.4 Electrical Characteristics  
Typical operating conditions are TA = 25°C, VIN = 5 V, Full-Power mode (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
All building blocks disabled, including supply-  
voltage regulators; measured after 500-ms settling  
time (EN = 0, EN2 = 0)  
IPD1  
Supply current in Power Down Mode 1  
0.5  
5
µA  
The SYS_CLK generator and VDD_X remain active  
to support external circuitry; measured after 100-ms  
settling time (EN = 0, EN2 = 1)  
Supply current in Power Down Mode 2 (Sleep  
Mode)  
IPD2  
120  
200  
µA  
Oscillator running, supply-voltage regulators in low-  
consumption mode (EN = 1, EN2 = x)  
ISTBY  
ION1  
ION2  
Supply current in stand-by mode  
1.9  
10.5  
70  
3.5  
14  
78  
mA  
mA  
mA  
Supply current without antenna driver current  
Supply current – TX (half power)  
Oscillator, regulators, RX and AGC active, TX is off  
Oscillator, regulators, RX and AGC and TX active,  
POUT = 100 mW  
Oscillator, regulators, RX and AGC and TX active,  
POUT = 200 mW  
ION3  
Supply current – TX (full power)  
130  
150  
mA  
VPOR  
VBG  
Power-on reset voltage  
Bandgap voltage (pin 11)  
Input voltage at VIN  
1.4  
1.5  
2
2.6  
1.7  
V
V
Internal analog reference voltage  
1.6  
Regulated output voltage for analog circuitry (pin  
1)  
VDD_A  
VIN = 5 V  
3.1  
3.1  
3.5  
3.4  
3.8  
V
VDD_X  
Regulated supply for external circuitry  
Maximum output current of VDD_X  
Output voltage pin 32, VIN = 5 V  
Output current pin 32, VIN = 5 V  
Half-power mode, VIN = 2.7 V to 5.5 V  
Full-power mode, VIN = 2.7 V to 5.5 V  
3.8  
20  
12  
6
V
IVDD_Xmax  
mA  
8
4
(1)  
RRFOUT  
Antenna driver output resistance  
Ω
RRFIN  
RX_IN1 and RX_IN2 input resistance  
4
10  
20  
kΩ  
Maximum RF input voltage at RX_IN1 and  
RX_IN2  
VRF_INmax  
VRF_INmax should not exceed VIN  
3.5  
Vpp  
fSUBCARRIER= 424 kHz  
1.4  
2.1  
2.5  
3
Minimum RF input voltage at RX_IN1 and  
RX_IN2 (input sensitivity)(2)  
VRF_INmin  
mVpp  
fSUBCARRIER = 848 kHz  
fSYS_CLK  
fC  
SYS_CLK frequency  
Carrier frequency  
In power mode 2, EN = 0, EN2 = 1  
Defined by external crystal  
25  
2
60  
120  
kHz  
13.56  
MHz  
Time until oscillator stable bit is set (register  
0x0F)(3)  
tCRYSTAL  
fD_CLKmax  
VIL  
Crystal run-in time  
3
8
ms  
MHz  
V
Depends on capacitive load on the I/O lines,  
recommendation is 2 MHz(4)  
Maximum DATA_CLK frequency(4)  
Input voltage - logic low  
10  
0.2 x  
VDD_I/O  
I/O lines, IRQ, SYS_CLK, DATA_CLK, EN, EN2  
I/O lines, IRQ, SYS_CLK, DATA_CLK, EN, EN2  
0.8 x  
VDD_I/O  
VIH  
Input voltage threshold, logic high  
V
ROUT  
Output resistance I/O_0 to I/O_7  
Output resistance RSYS_CLK  
500  
200  
800  
400  
Ω
Ω
RSYS_CLK  
DATA_CLK time high or low, one half of  
DATA_CLK at 50% duty cycle  
tLO/HI  
Depends on capacitive load on the I/O lines(4)  
250  
62.5  
200  
200  
50  
ns  
ns  
ns  
tSTE,LEAD  
tSTE,LAG  
Slave select lead time, slave select low to clock  
Slave select lag time, last clock to slave Select  
high  
tSU,SI  
MOSI input data setup time  
MOSI input data hold time  
MISO input data setup time  
MISO input data hold time  
MISO output data valid time  
15  
15  
15  
15  
30  
ns  
ns  
ns  
ns  
ns  
tHD,SI  
tSU,SO  
tHD,SO  
tVALID,SO  
DATA_CLK edge to MISO valid, CL 30 pF  
50  
75  
(1) Antenna driver output resistance  
(2) Measured with subcarrier signal at RX_IN1 or RX_IN2 and measured the digital output at MOD pin with register 0x1A bit 6 = 1.  
(3) Depends on the crystal parameters and components  
(4) Recommended DATA_CLK speed is 2 MHz; higher data clock depends on the capacitive load. Maximum SPI clock speed should not  
exceed 10 MHz. This clock speed is acceptable only when external capacitive load is less than 30 pF. MISO driver has a typical output  
resistance of 400 Ω (12-ns time constant when 30-pF load used).  
12  
Electrical Specifications  
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4 Application Schematic and Layout Considerations  
4.1 TRF7970A Reader System Using Parallel Microcontroller Interface  
4.1.1 General Application Considerations  
Figure 4-1 shows the most flexible TRF7970A application schematic. Both ISO15693, ISO14443 and  
FeliCa systems can be addressed. Due to the low clock frequency on the DATA_CLK line, the parallel  
interface is the most robust way to connect the TRF7970A with the MCU.  
Figure 4-1 shows matching to a 50-Ω port, which allows connecting to a properly matched 50-Ω antenna  
circuit or RF measurement equipment (for example, a spectrum analyzer or power meter).  
4.1.2 Schematic  
Figure 4-1 shows a sample application schematic for a parallel MCU interface.  
OSC_OUT  
3
JTAG  
2
1
GND1OUT  
IN GND2  
057-014-2  
X4-1 -2  
X4-3 -4  
X4-5 -6  
X4-7 -8  
X4-9 -10  
C24 27pF  
TDO/TDI  
TDI  
TMS  
TCK  
GND  
VCC  
C23  
27pF  
OSC_IN  
4
X4  
X4  
X4  
X4  
X4  
X
GND  
GND  
RST_NMI  
R4 100R  
X4-11 4-12  
X4-13 4-14  
VCC  
X
SMA-142-0701-801/806  
X3  
(+2.7VDC - 5.5VDC)  
VIN  
C26  
C25  
2.2uF  
0.01uF  
TP  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
1
VCC  
SYS_CLK  
C19  
0.01uF  
C20  
GND  
VCC  
2
GND  
C16  
C15  
0.01uF  
C18  
2.2uF  
GND  
C17  
R5  
47k  
2.2uF  
3
X2  
RST_NMI  
TCK  
TMS  
TDI  
TDO/TDI  
2.2uF  
4
EN  
0.01uF  
TCK  
5
TMS  
RST_NMI  
C1  
GND  
6
R6  
10k  
MC-921  
GND  
GND  
7
8
1
2
3
4
5
6
7
8
24  
23  
22  
21  
20  
19  
18  
17  
0.1uF  
P4.7/TBCLK  
P4.6/TBOUTH/ACLK  
P4.5/TB2  
VDD_A  
VIN  
I/O_7  
I/O_6  
I/O_5  
I/O_4  
GND  
C6 10pF  
9
C2  
1500pF  
C13  
12pF  
GND  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
TRF7970A  
33  
VDD_RF  
VDD_PA  
TX_OUT  
VSS_PA  
VSS_RX  
RX_IN1  
L3  
1.5uH  
P4.4/TB1  
R3  
0
L2  
L1  
P4.3/TB0  
MOD  
IRQ  
ASK/OOK  
GND(PAD) I/O_3  
P4.2/TB2  
R2  
0
330nH  
150nH  
I/O_2  
I/O_1  
I/0_0  
P4.1/TB1  
C11 C10  
8
C
C7 C4  
R1  
6.8k  
C14  
68pF  
C12  
12pF  
1500pF  
C3  
GND  
P4.0/TB0  
1200pF  
27pF 100pF 220pF  
680pF  
GND  
GND  
GND  
C5  
C9  
GND GND  
TXD  
RXD  
DATA_CLK  
680pF  
1200pF  
GND  
GND  
GND  
GND  
C21  
0.01uF  
GND  
C22  
2.2uF  
GND  
Figure 4-1. Application Schematic – Parallel MCU Interface  
An MSP430F2370 (32kB Flash, 2kB RAM) is shown in Figure 4-1. Minimum MCU requirements depend  
on application requirements and coding style. If only one ISO protocol or a limited command set of a  
protocol needs to be supported, MCU Flash and RAM requirements can be significantly reduced. Be  
aware that recursive inventory and anticollision commands require more RAM than single slotted  
operations. For example, current reference firmware for ISO15693 (with host interface) is approximately  
8kB, using 512B RAM; for all supported protocols (also with same host interface) the reference firmware is  
approximately 12kB and uses a minimum of 1kB RAM. An MCU capable of running its GPIOs at  
13.56 MHz is required for Direct Mode 0 operations.  
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4.2 TRF7970A Reader System Using SPI With SS Mode  
4.2.1 General Application Considerations  
Figure 4-2 shows the TRF7970A application schematic optimized for both ISO15693 and ISO14443  
systems using the Serial Port Interface (SPI). Short SPI lines, proper isolation of radio frequency lines,  
and a proper ground area are essential to avoid interference. The recommended clock frequency on the  
DATA_CLK line is 2 MHz.  
Figure 4-2 shows matching to a 50-Ω port, which allows connecting to a properly matched 50-Ω antenna  
circuit or RF measurement equipment (for example, a spectrum analyzer or power meter).  
4.2.2 Schematic  
Figure 4-2 shows a sample application schematic for SPI with an SS mode MCU interface.  
OSC_OUT  
3
JTAG  
2
1
GND1OUT  
IN GND2  
057-014-2  
X4-1 -2  
X4-3 -4  
X4-5 -6  
X4-7 -8  
X4-9 -10  
C24 27pF  
TDO/TDI  
TDI  
TMS  
TCK  
GND  
VCC  
C23  
27pF  
OSC_IN  
4
X4  
X4  
X4  
X4  
X4  
X
GND  
GND  
RST_NMI  
X4-11 4-12  
X4-13 4-14  
R4 100R  
VCC  
(+2.7VDC - 5.5VDC)  
VIN  
X
SMA-142-0701-801/806  
X3  
C26  
C25  
2.2uF  
0.01uF  
TP  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
1
VCC  
SYS_CLK  
C19  
C20  
2.2uF  
VCC  
2
GND  
GND  
X2  
GND  
C16  
C15  
C18  
2.2uF  
C17  
R5  
47k  
3
0.01uF  
RST_NMI  
TCK  
2.2uF  
4
EN  
0.01uF  
GND  
0.01uF  
TCK  
TMS  
5
RST_NMI  
C1  
GND  
TMS  
6
R6  
10k  
MC-921  
GND  
TDI  
7
8
TDO/TDI  
1
24  
23  
22  
21  
20  
19  
18  
17  
0.1uF  
P3.1  
P4.7/TBCLK  
P4.6/TBOUTH/ACLK  
P4.5/TB2  
VDD_A  
VIN  
I/O_7  
I/O_6  
I/O_5  
I/O_4  
GND  
C6 10pF  
2
3
4
5
6
7
8
9
P3.2  
C2  
1500pF  
C13  
12pF  
TRF7970A  
33  
GND  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
P3.7  
VDD_RF  
VDD_PA  
TX_OUT  
VSS_PA  
VSS_RX  
RX_IN1  
L3  
1.5uH  
P3.0  
P4.4/TB1  
R3  
0
L2  
L1  
P3.6  
P4.3/TB0  
MOD  
IRQ  
ASK/OOK  
VCC  
GND(PAD) I/O_3  
P4.2  
P4.2  
P4.2/TB2  
R2  
0
330nH  
150nH  
I/O_2  
I/O_1  
I/0_0  
C7  
VDD_X  
P4.1/TB1  
C11 C10  
8
C
C4  
R1  
6.8k  
C14  
68pF  
C12  
12pF  
1500pF  
C3  
GND  
P4.0/TB0  
680pF  
1200pF  
27pF 100pF 220pF  
GND  
GND  
C5  
GND  
P3.0  
P3.1  
P3.2  
C9  
GND GND  
TXD  
RXD  
DATA_CLK  
680pF  
1200pF  
GND  
GND  
GND  
GND  
C21  
0.01uF  
GND  
C22  
2.2uF  
GND  
Figure 4-2. Application Schematic – SPI With SS Mode MCU Interface  
An MSP430F2370 (32kB Flash, 2kB RAM) is shown in Figure 4-2. Minimum MCU requirements depend  
on application requirements and coding style. If only one ISO protocol or a limited command set of a  
protocol needs to be supported, MCU Flash and RAM requirements can be significantly reduced and user  
should be aware that recursive inventory and anticollision commands require more RAM than single  
slotted operations. For example, current reference firmware for ISO15693 (with host interface) is  
approximately 8kB, using 512B RAM and for all supported protocols (also with same host interface) the  
reference firmware is approximately 12kB and uses a minimum of 1kB RAM. An MCU capable of running  
its GPIOs at 13.56 MHz is required for Direct Mode 0 operations.  
14  
Application Schematic and Layout Considerations  
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5 Detailed System Description  
5.1 System Block Diagram  
Figure 5-1shows a block diagram of the TRF7970A.  
VDD_I/O  
I/O_0  
MUX  
PHASE&  
AMPLITUDE  
DETECTOR  
RSSI  
(AUX)  
LOGIC  
GAIN  
RX_IN1  
RX_IN2  
I/O_1  
STATE  
CONTROL  
LOGIC  
RF Level  
Detector  
I/O_2  
RSSI  
(EXTERNAL)  
I/O_3  
[CONTROL  
REGISTERS&  
COMMAND  
LOGIC]  
I/O_4  
RSSI  
(MAIN)  
PHASE&  
AMPLITUDE  
DETECTOR  
I/O_5  
GAIN  
FILTER  
& AGC  
I/O_6  
DIGITIZER  
DECODER  
MCU  
INTERFACE  
VDD_PA  
TX_OUT  
VSS_PA  
I/O_7  
ISO  
PROTOCOL  
HANDLING  
IRQ  
SYS_CLK  
DATA_CLK  
VIN  
TRANSMITTER ANALOG  
FRONT END  
128 BYTE  
FIFO  
BIT  
FRAMING  
FRAMING  
SERIAL  
CONVERSION  
CRC & PARITY  
VDD_A  
BAND_GAP  
VSS_A  
VDD_RF  
VSS_RF  
EN  
EN2  
DIGITAL CONTROL  
STATE MACHINE  
ASK/OOK  
MOD  
VOLTAGE SUPPLY REGULATOR SYSTEMS  
[SUPPLY REGULATORS , REFERENCE VOLTAGES ]  
VDD_X  
VSS  
OSC_IN  
CRYSTAL / OSCILLATOR  
TIMING SYSTEM  
VSS_D  
OSC_OUT  
Figure 5-1. System Block Diagram  
5.2 Power Supplies  
The TRF7970A positive supply input VIN (pin 2) sources three internal regulators with output voltages  
VDD_RF, VDD_A and VDD_X. All regulators use external bypass capacitors for supply noise filtering and must  
be connected as indicated in reference schematics. These regulators provide a high power supply reject  
ratio (PSRR) as required for RFID reader systems. All regulators are supplied by VIN (pin 2).  
The regulators are not independent and have common control bits in register 0x0B for output voltage  
setting. The regulators can be configured to operate in either automatic or manual mode (register 0x0B,  
bit 7). The automatic regulator setting mode ensures an optimal compromise between PSRR and the  
highest possible supply voltage for RF output (to ensure maximum RF power output). The manual mode  
allows the user to manually configure the regulator settings.  
5.2.1 Supply Arrangements  
Regulator Supply Input: VIN  
The positive supply at VIN (pin 2) has an input voltage range of 2.7 V to 5.5 V. VIN provides the supply  
input sources for three internal regulators with the output voltages VDD_RF, VDD_A, and VDD_X. External  
bypass capacitors for supply noise filtering must be used (per reference schematics).  
NOTE  
VIN must be the highest voltage supplied to the TRF7970A.  
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RF Power Amplifier Regulator: VDD_RF  
The VDD_RF (pin 3) regulator is supplying the RF power amplifier. The voltage regulator can be set for  
either 5-V or 3-V operation. External bypass capacitors for supply noise filtering must be used (per  
reference schematics). When configured for 5-V manual-operation, the VDD_RF output voltage can be set  
from 4.3 V to 5 V in 100-mV steps. In 3-V manual-operation, the output can be programmed from 2.7 V to  
3.4 V in 100-mV steps. The maximum output current capability for 5-V operation is 150 mA and for 3-V  
operation is 100 mA.  
Analog Supply Regulator: VDD_A  
Regulator VDD_A (pin 1) supplies the analog circuits of the device. The output voltage setting depends on  
the input voltage and can be set for 5-V and 3-V operation. When configured for 5-V manual-operation,  
the output voltage is fixed at 3.4 V. External bypass capacitors for supply noise filtering must be used (per  
reference schematics). When configured for 3-V manual-operation, the VDD_A output can be set from 2.7 V  
to 3.4 V in 100-mV steps (see Table 5-2).  
Note: the configuration of VDD_A and VDD_X regulators are not independent from each other. The VDD_A  
output current should not exceed 20 mA.  
Digital Supply Regulator: VDD_X  
The digital supply regulator VDD_X (pin 32) provides the power for the internal digital building blocks and  
can also be used to supply external electronics within the reader system. When configured for 3-V  
operation, the output voltage can be set from 2.7 to 3.4 V in 100-mV steps. External bypass capacitors for  
supply noise filtering must be used (per reference schematics).  
Note: the configuration of the VDD_A and VDD_X regulators are not independent from each other. The VDD_X  
output current should not exceed 20 mA.  
The RF power amplifier regulator (VDD_RF), analog supply regulator (VDD_A) and digital supply regulator  
(VDD_X) can be configured to operate in either automatic or manual mode described in Section 5.2.2. The  
automatic regulator setting mode ensures an optimal compromise between PSRR and the highest  
possible supply voltage to ensure maximum RF power output.  
By default, the regulators are set in automatic regulator setting mode. In this mode, the regulators are  
automatically set every time the system is activated by setting EN input High or each time the automatic  
regulator setting bit, B7 in register 0x0B is set to a 1. The action is started on the 0 to 1 transition. This  
means that, if the user wants to re-run the automatic setting from a state in which the automatic setting bit  
is already high, the automatic setting bit (B7 in register 0x0B) should be changed: 1-0-1.  
By default, the regulator setting algorithm sets the regulator outputs to a "Delta Voltage" of 250 mV below  
VIN, but not higher than 5 V for VDD_RF and 3.4 V for VDD_A and VDD_A. The "Delta Voltage" in automatic  
regulator mode can be increased up to 400 mV (for details, see bits B0 to B2 in register 0x0B).  
Power Amplifier Supply: VDD_PA  
The power amplifier of the TRF7970A is supplied through VDD_PA(pin 4). The positive supply pin for the RF  
power amplifier is externally connected to the regulator output VDD_RF (pin 3).  
I/O Level Shifter Supply: VDD_I/O  
The TRF7970A has a separate supply input VDD_I/O (pin 16) for the built-in I/O level shifter. The supported  
input voltage ranges from 1.8 V to VIN, not exceeding 5.5 V. Pin 16 is used to supply the I/O interface pins  
(I/O_0 to I/O_7), IRQ, SYS_CLK, and DATA_CLK pins of the reader. In typical applications, VDD_I/O is  
directly connected to VDD_X, while VDD_X also supplies the MCU. This ensures that the I/O signal levels of  
the MCU match the logic levels of the TRF7970A.  
Negative Supply Connections: VSS, VSS_TX, VSS_RX, VSS_A, VSS_PA  
The negative supply connections VSS_X of each functional block are all externally connected to GND.  
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The substrate connection is VSS (pin 10), the analog negative supply is VSS_A (pin 15), the logic negative  
supply is VSS_D (pin 29), the RF output stage negative supply is VSS_PA (pin 6), and the negative supply for  
the RF receiver VSS_RX (pin 7).  
5.2.2 Supply Regulator Settings  
The input supply voltage mode of the reader needs to be selected. This is done in the Chip Status Control  
register (0x00). Bit 0 in register 0x00 selects between 5-V or 3-V input supply voltage. The default  
configuration is 5 V, which reflects an operating supply voltage range of 4.3 V to 5.5 V. If the supply  
voltage is below 4.3 V, the 3-V configuration should be used.  
The various regulators can be configured to operate in automatic or manual mode. This is done in the  
Regulator and I/O Control register (0x0B) as shown in Table 5-1 and Table 5-2.  
Table 5-1. Supply Regulator Setting: 5-V System  
(1)  
Register  
Address  
(hex)  
Option Bits Setting in Regulator Control Register  
Comments  
B7  
B6  
B5  
B4  
B3  
B2  
B1  
B0  
Automatic Mode (default)  
0B  
1
1
1
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
1
1
0
1
0
0
Automatic regulator setting 250-mV difference  
Automatic regulator setting 350-mV difference  
Automatic regulator setting 400-mV difference  
0B  
0B  
Manual Mode  
0B  
0B  
0B  
0B  
0B  
0B  
0B  
0B  
0
0
0
0
0
0
0
0
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
1
1
1
1
0
0
0
0
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
VDD_RF = 5 V, VDD_A = 3.4 V, VDD_X = 3.4 V  
VDD_RF = 4.9 V, VDD_A = 3.4 V, VDD_X = 3.4 V  
VDD_RF = 4.8 V, VDD_A = 3.4 V, VDD_X = 3.4 V  
VDD_RF = 4.7 V, VDD_A = 3.4 V, VDD_X = 3.4 V  
VDD_RF = 4.6 V, VDD_A = 3.4 V, VDD_X = 3.4 V  
VDD_RF = 4.5 V, VDD_A = 3.4 V, VDD_X = 3.4 V  
VDD_RF = 4.4 V, VDD_A = 3.4 V, VDD_X = 3.4 V  
VDD_RF = 4.3 V, VDD_A = 3.4 V, VDD_X = 3.4 V  
(1) x = Don't care  
Table 5-2. Supply Regulator Setting: 3-V System  
(1)  
Register  
Address  
(hex)  
Option Bits Setting in Regulator Control Register  
Comments  
B7  
B6  
B5  
B4  
B3  
B2  
B1  
B0  
Automatic Mode (default)  
0B  
1
1
1
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
1
1
0
1
0
0
Automatic regulator setting 250-mV difference  
Automatic regulator setting 350-mV difference  
Automatic regulator setting 400-mV difference  
0B  
0B  
Manual Mode  
0B  
0B  
0B  
0B  
0B  
0B  
0B  
0B  
0
0
0
0
0
0
0
0
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
1
1
1
1
0
0
0
0
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
VDD_RF = 3.4 V, VDD_A = 3.4 V, VDD_X = 3.4 V  
VDD_RF = 3.3 V, VDD_A = 3.3 V, VDD_X = 3.3 V  
VDD_RF = 3.2 V, VDD_A = 3.2 V, VDD_X = 3.2 V  
VDD_RF = 3.1 V, VDD_A = 3.1 V, VDD_X = 3.1 V  
VDD_RF = 3.0 V, VDD_A = 3.0 V, VDD_X = 3.0 V  
VDD_RF = 2.9 V, VDD_A = 2.9 V, VDD_X = 2.9 V  
VDD_RF = 2.8 V, VDD_A = 2.8 V, VDD_X = 2.8 V  
VDD_RF = 2.7 V, VDD_A = 2.7 V, VDD_X = 2.7 V  
(1) x = Don't care  
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The regulator configuration function adjusts the regulator outputs by default to 250 mV below VIN level, but  
not higher than 5 V for VDD_RF , 3.4 V for VDD_A and VDD_X. This ensures the highest possible supply  
voltage for the RF output stage while maintaining an adequate PSRR (power supply rejection ratio).  
To further improve the PSRR, it is possible to increase the target voltage difference across VDD_X and  
VDD_A from its default to 350 mV or even 400 mV (for details see Regulator and I/O Control register (0x0B)  
definition in Table 5-1 and Table 5-2.)  
5.2.3 Power Modes  
The chip has several power states, which are controlled by two input pins (EN and EN2) and several bits  
in the chip status control register (0x00) (see Table 5-3).  
(1)  
Table 5-3. Power Modes  
Chip  
Regulator  
Control  
Register  
(0x0B)  
Typical  
Power  
Out  
Time  
(From  
Previous  
State)  
Status  
Control  
Register  
(0x00)  
SYS_CLK  
(13.56  
MHz)  
Typical  
Current  
(mA)  
Trans-  
mitter  
SYS_CLK  
(60 kHz)  
Mode  
EN2  
EN  
Receiver  
VDD_X  
(dBm)  
Mode 4 (Full Power)  
at 5 VDC  
approx. 20-  
25 µs  
X
X
X
X
1
1
1
1
21  
20  
31  
30  
07  
07  
07  
07  
ON  
ON  
ON  
ON  
ON  
ON  
ON  
ON  
ON  
ON  
ON  
ON  
X
X
X
X
ON  
ON  
ON  
ON  
105  
68  
23  
17  
20  
14  
Mode 4 (Full Power)  
at 3.3 VDC  
Mode 3 (Half Power)  
at 5 VDC  
approx. 20-  
25 µs  
82  
Mode 3 (Half Power)  
at 3.3 VDC  
53  
approx. 20-  
25 µs  
Mode 2 at 5 VDC  
Mode 2 at 3.3 VDC  
Mode 1 at 5 VDC  
Mode 1 at 3.3 VDC  
X
X
X
X
X
1
1
1
1
1
03  
02  
01  
00  
81  
07  
00  
07  
00  
07  
OFF  
OFF  
OFF  
OFF  
OFF  
ON  
ON  
ON  
ON  
ON  
ON  
ON  
X
X
X
X
X
ON  
ON  
ON  
ON  
ON  
13  
10  
5
approx. 20-  
25 µs  
OFF  
OFF  
OFF  
3
Standby Mode at 5  
VDC  
3
4.8 ms  
Standby Mode at 3.3  
VDC  
X
1
0
1
0
0
80  
X
00  
X
OFF  
OFF  
OFF  
OFF  
OFF  
OFF  
ON  
OFF  
OFF  
X
ON  
ON  
2
Power Down Mode  
2 (Sleep)  
ON  
OFF  
0.120  
<0.001  
1.5 ms  
Start  
Power Down Mode  
1 (Total PD)  
X
X
OFF  
(1) X = Don't care  
Table 5-3 shows the configuration for the different power modes when using a 5-V or 3-V system supply.  
The main reader enable signal is pin EN. When EN is set high, all of the reader regulators are enabled,  
the 13.56-MHz oscillator is running and the SYS_CLK (output clock for external micro controller) is also  
available.  
The input pin EN2 has two functions:  
A direct connection from EN2 to VIN to ensure the availability of the regulated supply VDD_X and an  
auxiliary clock signal (60 kHz, SYS_CLK) for an external MCU. This mode (EN = 0, EN2 = 1) is  
intended for systems in which the MCU is also being supplied by the reader supply regulator (VDD_X  
)
and the MCU clock is supplied by the SYS_CLK output of the reader. This allows the MCU supply and  
clock to be available during sleep mode.  
EN2 enables the start-up of the reader system from complete power down (EN = 0, EN2 = 0). In this  
case the EN input is being controlled by the MCU (or other system device) that is without supply  
voltage during complete power down (thus unable to control the EN input). A rising edge applied to the  
EN2 input (which has an approximately 1-V threshold level) starts the reader supply system and 13.56-  
MHz oscillator (identical to condition EN = 1).  
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When user MCU is controlling EN and EN2, a delay of 5 ms between EN and EN2 must be used. If the  
MCU controls only EN, EN2 is recommended to be connected to either VIN or GND, depending on the  
application MCU requirements for VDD_X and SYS_CLK.  
NOTE  
Using EN = 1 and EN2 = 1 in parallel at start up should not be done as it can cause incorrect  
operation.  
This start-up mode lasts until all of the regulators have settled and the 13.56-MHz oscillator has stabilized.  
If the EN input is set high (EN = 1) by the MCU (or other system device), the reader stays active. If the EN  
input is not set high (EN = 0) within 100 µs after the SYS_CLK output is switched from auxiliary clock (60  
kHz) to high-frequency clock (derived from the crystal oscillator), the reader system returns to complete  
Power-Down Mode1. This option can be used to wake-up the reader system from complete Power Down  
(PD Mode 1) by using a pushbutton switch or by sending a single pulse.  
After the reader EN line is high, the other power modes are selected by control bits within the chip status  
control register (0x00). The power mode options and states are listed in Table 5-3.  
When EN is set high (or on rising edge of EN2 and then confirmed by EN = 1) the supply regulators are  
activated and the 13.56-MHz oscillator started. When the supplies are settled and the oscillator frequency  
is stable, the SYS_CLK output is switched from the auxiliary frequency of 60 kHz to the 13.56-MHz  
frequency derived from the crystal oscillator. At this point, the reader is ready to communicate and perform  
the required tasks. The MCU can then program the chip status control register 0x00 and select the  
operation mode by programming the additional registers.  
Stand-by Mode (bit 7 = 1 of register 0x00), the reader is capable of recovering to full operation in  
100 µs.  
Mode 1 (active mode with RF output disabled, bit 5 = 0 and bit 1 = 0 of register 0x00) is a low power  
mode which allows the reader to recover to full operation within 25 µs.  
Mode 2 (active mode with only the RF receiver active, bit 1 = 1 of register 0x00) can be used to  
measure the external RF field (as described in RSSI measurements paragraph) if reader-to-reader  
anticollision is implemented.  
Modes 3 and 4 (active modes with the entire RF section active, bit 5 = 1 of register 0x00) are the  
normal modes used for normal transmit and receive operations.  
5.3 Receiver – Analog Section  
5.3.1 Main and Auxiliary Receivers  
The TRF7970A has two receiver inputs: RX_IN1 (pin 8) and RX_IN2 (pin 9). Each of the input is  
connected to an external capacitive voltage divider to ensure that the modulated signal from the tag is  
available on at least one of the two inputs. This architecture eliminates any possible communication holes  
that may occur from the tag to the reader.  
The two RX inputs (RX_IN1 and RX_IN2) are multiplexed into two receivers - the main receiver and the  
auxiliary receiver. Only the main receiver is used for reception, the auxiliary receiver is used for signal  
quality monitoring. Receiver input multiplexing is controlled by bit B3 in the Chip Status Control register  
(address 0x00).  
After startup, RX_IN1 is multiplexed to the main receiver which is composed of an RF envelope detection,  
first gain and band-pass filtering stage, second gain and filtering stage with AGC. Only the main receiver  
is connected to the digitizing stage which output is connected to the digital processing block. The main  
receiver also has an RSSI measuring stage, which measures the strength of the demodulated signal  
(subcarrier signal).  
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The primary function of the auxiliary receiver is to monitor the RX signal quality by measuring the RSSI of  
the demodulated subcarrier signal (internal RSSI). After startup, RX_IN2 is multiplexed to the auxiliary  
receiver. The auxiliary receiver has an RF envelope detection stage, first gain and filtering with AGC stage  
and finally the auxiliary RSSI block.  
The default MUX setting is RX_IN1 connected to the main receiver and RX_IN2 connected to the auxiliary  
receiver. To determine the signal quality, the response from the tag is detected by the "main" (pin RX_IN1)  
and "auxiliary" (pin RX_IN2) RSSI. Both values measured and stored in the RSSI level register (address  
0x0F). The MCU can read the RSSI values from the TRF7970A RSSI register and make the decision if  
swapping the input- signals is preferable or not. Setting B3 in Chip Status Control register (address 0x00)  
to 1 connects RX_IN1 (pin 8) to the auxiliary received and RX_IN2 (pin 9) to the main receiver. This  
mechanism needs to be used to avoid reading holes.  
The main and auxiliary receiver input stages are RF envelope detectors. The RF amplitude at RX_IN1 and  
RX_IN2 should be approximately 3 VPP for a VINsupply level greater than 3.3 V. If the VIN level is lower,  
the RF input peak-to-peak voltage level should not exceed the VINlevel.  
5.3.2 Receiver Gain and Filter Stages  
The first gain and filtering stage has a nominal gain of 15 dB with an adjustable band-pass filter. The  
band-pass filter has programmable 3d-B corner frequencies between 110 kHz to 450 kHz for the high-  
pass filter and 570 kHz to 1500 kHz for the low-pass filter. After the band-pass filter, there is another gain-  
and-filtering stage with a nominal gain of 8 dB and with frequency characteristics identical to the first band-  
pass stage.  
The internal filters are configured automatically depending on the selected ISO communication standard in  
the ISO Control register (address 0x01). If required, additional fine tuning can be done by writing directly  
to the RX special setting registers (address 0x0A).  
The main receiver also has a second receiver gain and digitizer stage which is included in the AGC loop.  
The AGC loop is activated by setting the bit B2 = 1 in the Chip Status Control register (0x00). When  
activated, the AGC continuously monitors the input signal level. If the signal level is significantly higher  
than an internal threshold level, gain reduction is activated.  
By default, the AGC is frozen after the first 4 pulses of the subcarrier signal. This prevents the AGC from  
interfering with the reception of the remaining data packet. In certain situations, this AGC freeze is not  
optimal, so it can be removed by setting B0 = 1 in the RX special setting register (address 0x0A).  
Table 5-4. RX Special Setting Register (0x0A)  
Bit  
Function  
Comments  
B7  
Bandpass from 110 kHz to 570 kHz  
Appropriate for any 212-kHz subcarrier systems (for example, FeliCa)  
Appropriate for 424-kHz subcarrier systems (for example, used in  
ISO15693)  
B6  
B5  
Bandpass from 200 kHz to 900 kHz  
Bandpass from 450 kHz to 1.5 MHz  
Bandpass from 100 kHz to 1.5 MHz  
Appropriate for Manchester-coded 106-kbps 848-kHz subcarrier systems  
(for example, used in ISO14443A)  
Appropriate for highest bit rate (848 kbps) used in high-bit-rate ISO14443B.  
Gain is reduced by 7 dB.  
B4  
B3  
00 = no gain reduction  
01 = gain reduction for 5 dB  
10 = gain reduction for 10 dB  
11 = gain reduction for 15 dB  
Sets the RX digital gain reduction (changing the window of the digitizing  
comparator)  
B2  
B1  
AGC activation level change. From 5 times the minimum RX digitizing level  
to 3 times the minimum digitizing level. The minimum RX digitizing level can  
be adjusted by B2 and B3 (gain reduction)  
0 = 5 times minimum digitizing level  
1 = 3 times minimum digitizing level  
AGC action is not limited in time or to the start of receive. AGC action can  
be done any time during receive process. The AGC can only increase and,  
therefore, clips on the peak RX level during the enable period. AGC level is  
reset automatically at the beginning of each receive start frame.  
0 = AGC freeze after 16 subcarrier edges  
1 = AGC always on during receive  
B0  
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Table 5-4 shows the various settings for the receiver analog section. It is important to note that setting B4,  
B5, B6, and B7 to 0 results to a band-pass characteristic of 240 kHz to 1.4 MHz, which is appropriate for  
ISO14443B 106 kbps, ISO14443A/B data-rates of 212 kbps and 424 kbps and FeliCa 424 kbps.  
5.4 Receiver – Digital Section  
The output of the TRF7970A analog receiver block is a digitized subcarrier signal and is the input to the  
digital receiver block. This block includes a Protocol Bit Decoder section and the Framing Logic section.  
The protocol bit decoders convert the subcarrier coded signal into a serial bit stream and a data clock.  
The decoder logic is designed for maximum error tolerance. This enables the decoder section to  
successfully decode even partly corrupted subcarrier signals that otherwise would be lost due to noise or  
interference.  
In the framing logic section, the serial bit stream data is formatted in bytes. Special signals such as the  
start of frame (SOF), end of frame (EOF), start of communication, and end of communication are  
automatically removed. The parity bits and CRC bytes are also checked and removed. This "clean" data is  
then sent to the 128 byte FIFO register where it can be read by the external microcontroller system.  
Providing the data this way, in conjunction with the timing register settings of the TRF7970A means the  
firmware developer has to know about much less of the finer details of the ISO protocols to create a very  
robust application, especially in low cost platforms where code space is at a premium and high  
performance is still required.  
The start of the receive operation (successfully received SOF) sets the IRQ-flags in the IRQ and Status  
Register (0x0C). The end of the receive operation is signaled to the external system MCU by setting pin  
13 (IRQ) to high. When data is received in the FIFO, an interrupt is sent to the MCU to signal that there is  
data to be read from the FIFO. The FIFO status register (0x1C) should be used to provide the number of  
bytes that should be clocked out during the actual FIFO read.  
Any error in the data format, parity, or CRC is detected and notified to the external system by an interrupt-  
request pulse. The source condition of the interrupt request pulse is available in the IRQ status register  
(0x0C). The main register controlling the digital part of the receiver is the ISO Control register (0x01). By  
writing to this register, the user selects the protocol to be used. With each new write in this register, the  
default presets are reloaded in all related registers, so no further adjustments in other registers are  
needed for proper operation.  
NOTE  
If register setting changes are needed for fine tuning the system, they must be done after  
setting the ISO Control register (0x01).  
The framing section also supports the bit-collision detection as specified in ISO14443A. When a bit  
collision is detected, an interrupt request is sent and a flag is set in the IRQ and Status Register (0x0C).  
The position of the bit collision is written in two registers: Collision Position Register (0x0E) and partly in  
Collision Position and Interrupt Mask Register (0x0D) (bits B6 and B7).  
The collision position is presented as sequential bit number, where the count starts immediately after the  
start bit. This means a collision in the first bit of a UID would give the value 00 0001 0000 in these  
registers when their contents are combined after being read. (the count starts with 0 and the first 16 bits  
are the command code and the Number of Valid Bits (NVB) byte)  
The receive section also contains two timers. The RX wait time timer is controlled by the value in the RX  
Wait Time Register (0x08). This timer defines the time interval after the end of the transmit operation in  
which the receive decoders are not active (held in reset state). This prevents false detections resulting  
from transients following the transmit operation. The value of the RX Wait Time Register (0x08) defines  
the time in increments of 9.44 µs. This register is preset at every write to ISO Control Register (0x01)  
according to the minimum tag response time defined by each standard.  
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The RX no response timer is controlled by the RX No Response Wait Time Register (0x07). This timer  
measures the time from the start of slot in the anticollision sequence until the start of tag response. If there  
is no tag response in the defined time, an interrupt request is sent and a flag is set in the IRQ Status  
Register (0x0C). This enables the external controller to be relieved of the task of detecting empty slots.  
The wait time is stored in the register in increments of 37.76 µs. This register is also preset, automatically  
for every new protocol selection.  
The digitized output of the analog receiver is at the input of the digital portion of the receiver. This input  
signal is the subcarrier coded signal, which is a digital representation of modulation signal on the RF  
envelope.  
The digital part of the receiver consists of two sections which partly overlap. The first section contains the  
bit decoders for the various protocols. The bit decoders convert the subcarrier coded signal to a bit stream  
and also the data clock. Thus the subcarrier coded signal is transformed to serial data and the data clock  
is extracted. The decoder logic is designed for maximum error tolerance. This enables the decoders to  
successfully decode even partly corrupted (due to noise or interference) subcarrier signals.  
The second section contains the framing logic for the protocols supported by the bit decoder section. In  
the framing section, the serial bit stream data is formatted in bytes. In this process, special signals like the  
SOF (start of frame), EOF (end of frame), start of communication, end of communication are automatically  
removed. The parity bits and CRC bytes are checked and also removed. The end result is "clean or raw"  
data which is sent to the 128-byte FIFO register where it can be read out by the external microcontroller  
system.  
The start of the receive operation (successfully received SOF) sets the flags in the IRQ and Status  
register. The end of the receive operation is signaled to the external system (MCU) by sending an interrupt  
request (pin 13 IRQ). If the receive data packet is longer than 96 bytes, an interrupt is sent to the MCU  
when the received data occupies 75% of the FIFO capacity to signal that the data should be removed  
from the FIFO.  
Any error in data format, parity or CRC is detected and the external system is made aware of the error by  
an interrupt request pulse. The nature of the interrupt request pulse is available in the IRQ and Status  
register (address 0x0C). The bit coding description of this register is shown in Section 6.3.3.1. The  
information in IRQ and Status register differs if the chip is configured as RFID reader or as NFC device  
(including tag emulation). The case of NFC operation is presented in Section 5.11.  
The main register controlling the digital part of the receiver is the ISO Control register (address 0x01). By  
writing to this register, the user selects the protocol to be used. At the same time (with each new write in  
this register) the default preset in all related registers is done, so no further adjustments in other registers  
are needed for proper operation. Table 5-5 shows the coding of the ISO Control register (0x01).  
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Table 5-5. Coding of the ISO Control Register  
Bit  
Signal Name  
Function  
Comments  
1 = No RX CRC  
0 = RX CRC  
B7  
rx_crc_n  
dir_mode  
rfid  
Receiving without CRC  
0 = output is subcarrier data  
1 = output is bit stream and clock from decoder selected by ISO bits  
B6  
B5  
Direct mode type  
RFID mode  
0 = RFID reader mode  
1 = NFC or Card Emulator mode  
RFID: Mode selection  
NFC:  
0 = NFC target  
1 = NFC initiator  
B4  
B3  
B2  
iso_4  
iso_3  
iso_2  
RFID protocol, NFC target  
RFID protocol, NFC mode  
RFID protocol, Card Emulation  
RFID: Mode selection (see Table 5-6)  
NFC:  
0 = passive mode  
1 = active mode  
RFID: Mode selection  
NFC:  
0 = NFC normal modes  
1 = Card Emulation mode  
RFID: Mode selection  
NFC: Bit rate selection or Card Emulation selection (see Table 5-7)  
B1  
B0  
iso_1  
iso_0  
RFID protocol, NFC bit rate  
RFID protocol, NFC bit rate  
RFID: Mode selection  
NFC: Bit rate selection or Card Emulation selection (see Table 5-7)  
Table 5-6. Coding of the ISO Control Register For RFID Mode (B5 = 0)  
Iso_4  
Iso_3  
Iso_2  
Iso_1  
Iso_0  
Protocol  
Remarks  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
1
1
1
1
0
0
0
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
ISO15693 low bit rate, one subcarrier, 1 out of 4  
ISO15693 low bit rate, one subcarrier, 1 out of 256  
ISO15693 high bit rate, one subcarrier, 1 out of 4  
ISO15693 high bit rate, one subcarrier, 1 out of 256  
ISO15693 low bit rate, double subcarrier, 1 out of 4  
ISO15693 low bit rate, double subcarrier, 1 out of 256  
ISO15693 high bit rate, double subcarrier, 1 out of 4  
ISO15693 high bit rate, double subcarrier, 1 out of 256  
ISO14443A, bit rate 106 kbps  
Default for RFID IC  
RX bit rate when TX rate  
different than RX rate (see  
register 0x03)  
0
1
0
0
1
ISO14443 A high bit rate 212 kbps  
0
0
0
1
1
1
0
0
1
1
1
0
0
1
0
ISO14443 A high bit rate 424 kbps  
ISO14443 A high bit rate 848 kbps  
ISO14443B, bit rate 106 kbps  
RX bit rate when TX rate  
different than RX rate (see  
register 0x03)  
0
1
1
0
1
ISO14443 B high bit rate 212 kbps  
0
0
1
1
1
1
1
1
0
0
1
1
1
1
0
1
0
0
1
1
1
0
1
1
0
1
1
0
0
1
ISO14443 B high bit rate 424 kbps  
ISO14443 B high bit rate 848 kbps  
Reserved  
Reserved  
FeliCa 212 kbps  
FeliCa 424 kbps  
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Table 5-7. Coding of the ISO Control Register For NFC  
Mode (B5 = 1, B2 = 0) or Card Emulation (B5 = 1,  
B2 = 1)  
Card Emulation (B5  
Iso_1  
Iso_0  
NFC (B5 = 1, B2 = 0)  
= 1, B2 = 1)  
ISO14443A  
ISO14443B  
N/A  
0
0
1
1
0
1
0
1
N/A  
106 kbps  
212 kbps  
424 kbps  
N/A  
The framing section also supports the bit collision detection as specified in ISO14443A. In the event of a  
detected bit collision, an interrupt request is sent and flag set in the IRQ and Status registers. The position  
of the bit collision is written in two registers: the Collision Position register (0x0E) and partly in the  
Collision Position and Interrupt Mask register (0x0D), in which only the bits B7 and B6 are used for  
collision position. The collision position is presented as sequential bit number, where the counting starts  
immediately after the start bit. This means, the collision in the first bit of the UID would give value 00 0001  
0000 in the collision position registers (the counting starts with 0 and the first 16 bits are the command  
code and the NVB byte).  
The receive part also contains two timers. The RX wait time timer setting is controlled by the value in the  
RX Wait Time register (0x08). This timer defines the time after the end of transmit operation in which the  
receive decoders are not active (held in reset state). This prevents any incorrect detections from occurring  
as a result of transients following the transmit operation. The value of the RX Wait Time register defines  
this time with increments of 9.44 µs. This register is preset at every write to the ISO Control register (0x01)  
according to the minimum tag response time defined by each standard.  
The RX no response timer setting is controlled by the RX No Response Wait Time register (0x07). This  
timer measures the time from the start of slot in the anticollision sequence until the start of tag response. If  
there is no tag response in the defined time, an interrupt request is sent and a flag is set in IRQ Status  
Control register. This enables the external controller to be relieved of the task of detecting empty slots.  
The wait time is stored in the register with increments of 37.76 µs. This register is also preset,  
automatically, for every new protocol selection.  
5.4.1 Received Signal Strength Indicator (RSSI)  
The TRF7970A incorporates in total three independent RSSI building blocks: Internal Main RSSI, Internal  
Auxiliary RSSI, and External RSSI. The internal RSSI blocks are measuring the amplitude of the  
subcarrier signal; the External RSSI block measures the amplitude of the RF carrier signal at the receiver  
input.  
5.4.1.1 Internal RSSI – Main and Auxiliary Receivers  
Each receiver path has its own RSSI block to measure the envelope of the demodulated RF signal  
(subcarrier). Internal Main RSSI and Internal Auxiliary RSSI are identical however connected to different  
RF input pins. The Internal RSSI is intended for diagnostic purposes to set the correct RX path conditions.  
The Internal RSSI values can be used to adjust the RX gain settings or decide which RX path (Main or  
Auxiliary) provides the greater amplitude and hence to decide if the MUX may need to be reprogrammed  
to swap the RX input signal. The measuring system latches the peak value, so the RSSI level can be read  
after the end of each receive packet. The RSSI register values are reset with every transmission (TX) by  
the reader. This guarantees an updated RSSI measurement for each new tag response.  
The Internal RSSI has 7 steps (3 bit) with a typical increment of approximately 4 dB. The operating range  
is between 600 mVPP and 4.2 VPP with a typical step size of approximately 600 mV. Both Internal Main  
and Internal Auxiliary RSSI values are stored in the RSSI Levels and Oscillator Status register (0x0F). The  
nominal relationship between the input RF peak level and the RSSI value is shown in Figure 5-2.  
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7
6
5
4
3
2
1
0
0
0.25 0.5 0.75  
1
1.25 1.5 1.75  
2
2.25 2.5 2.75  
3
3.25 3.5 3.75  
4
4.25  
Input RF Carrier Level in VPP [V]  
Figure 5-2. Digital Internal RSSI (Main and Auxiliary) Value vs RF Input Level in VPP (V)  
This RSSI measurement is done during the communication to the Tag; this means the TX must be on.  
Bit1 in the Chip Status Control Register (0x00) defines if Internal RSSI or the External RSSI value is  
stored in the RSSI Levels and Oscillator Status Register 0x0F. Direct command 0x18 is used to trigger an  
Internal RSSI measurement.  
5.4.1.2 External RSSI  
The External RSSI is mainly used for test and diagnostic to sense the amplitude of any 13.56-MHz signal  
at the receivers RX_IN1 input. The External RSSI measurement is typically done in active mode when the  
receiver is on but transmitter output is off. The level of the RF signal received at the antenna is measured  
and stored in the RSSI Levels and Oscillator Status register 0x0F. The relationship between the voltage at  
the RX_IN1 input and the 3-bit code is shown in Figure 5-3.  
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7
6
5
4
3
2
1
0
0
25  
50  
75  
100  
125  
150  
175  
200  
225  
250  
275  
300  
325  
RF Input Voltage Level at RF_IN1 in mVPP  
Figure 5-3. Digital External RSSI Value vs RF Input Level in VPP (mV)  
The relation between the 3-bit code and the external RF field strength (A/m) sensed by the antenna must  
be determined by calculation or by experiments for each antenna design. The antenna Q-factor and  
connection to the RF input influence the result. Direct command 0x19 is used to trigger an Internal RSSI  
measurement.  
For clarity, to check the internal or external RSSI value independent of any other operation, the user must:  
Set transmitter to desired state (on or off) using Bit 5 of Chip Status Control Register (0x00)  
Set the receiver using direct command 0x17.  
Check internal or external RSSI using direct commands 0x18 or 0x19, respectively. This action places  
the RSSI value in the RSSI register  
Read the RSSI register using direct command 0x0F; values range from 0x40 to 0x7F.  
Repeat steps 1-4 as desired, as register is reset after it is read.  
5.5 Oscillator Section  
The 13.56-MHz or 27.12-MHz crystal (or oscillator) is controlled by the Chip Status Control Register  
(0x00) and the EN and EN2 terminals. The oscillator generates the RF frequency for the RF output stage  
as well as the clock source for the digital section. The buffered clock signal is available at pin 27  
(SYS_CLK) for any other external circuits. B4 and B5 inside the Modulation and SYS_CLK Register  
(0x09) can be used to divide the external SYS_CLK signal at pin 27 by 1, 2 or 4.  
Typical start-up time from complete power down is in the range of 3.5 ms.  
During Power Down Mode 2 (EN = 0, EN2 = 1) the frequency of SYS_CLK is switched to 60 kHz (typical).  
The crystal needs to be connected between pin 31 and pin 32. The external shunt capacitors values for C1  
and C2 must be calculated based on the specified load capacitance of the crystal being used. The external  
shunt capacitors are calculated as two identical capacitors in series plus the stray capacitance of the  
TRF7970A and parasitic PCB capacitance in parallel to the crystal.  
The parasitic capacitance (CS, stray and parasitic PCB capacitance) can be estimated at 4 to 5 pF  
(typical).  
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As an example, using a crystal with a required load capacitance (CL) of 18 pF, the calculation is shown in  
Equation 1.  
C1 = C2 = 2 × (CL– CS) = 2 × (18 pF – 4.5 pF) = 27 pF  
(1)  
A 27-pF capacitor must be placed on pins 30 and 31 to ensure proper crystal oscillator operation.  
CS  
TRF7970A  
C1 = C2 = 2 × (CL – CS) = 2 × (18 pF – 4.5 pF) = 27 pF  
Pin 31  
Pin 32  
A 27-pF capacitor needs to be placed on pins 30 and 31  
to ensure proper crystal oscillator operation.  
Crystal  
C1  
C2  
Figure 5-4. Crystal Block Diagram  
Any crystal used with TRF7970A should have minimum characteristics shown in Table 5-8.  
Table 5-8. Minimum Crystal Requirements  
Parameter  
Frequency  
Specification  
13.56 MHz or 27.12 MHz  
Fundamental  
Parallel  
Mode of Operation  
Type of Resonance  
Frequency Tolerance  
Aging  
±20 ppm  
< 5 ppm/year  
-40°C to 85°C  
50 Ω  
Operation Temperature Range  
Equivalent Series Resistance  
As an alternative, an external clock oscillator source can be connected to Pin 31 to provide the system  
clock; pin 32 can be left open.  
5.6 Transmitter – Analog Section  
The 13.56-MHz oscillator generates the RF signal for the PA stage. The power amplifier consists of a  
driver with selectable output resistance of nominal 4 Ω or 8 Ω. The transmit power level is set by bit B4 in  
the Chip Status Control Register (0x00). The transmit power levels are selectable between 100 mW (half  
power) or 200 mW (full power) when configured for 5-V automatic operation. The transmit power levels  
are selectable between 33 mW (half power) or 70 mW (full power) when configured for 3-V automatic  
operation.  
The ASK modulation depth is controlled by bits B0, B1, and B2 in the Modulator and SYS_CLK Control  
Register (0x09). The ASK modulation depth range can be adjusted between 7% to 30% or 100% (OOK).  
External control of the transmit modulation depth is possible by setting the ISO Control Register (0x01) to  
direct mode. While operating the TRF7970A in direct mode, the transmit modulation is made possible by  
selecting the modulation type ASK or OOK at pin 12. External control of the modulation type is made  
possible only if enabled by setting B6 in the Modulator and SYS_CLK Control Register (0x09) to 1.  
In normal operation mode, the length of the modulation pulse is defined by the protocol selected in the  
ISO Control Register (0x01). With a high-Q antenna, the modulation pulse is typically prolonged, and the  
tag detects a longer pulse than intended. For such cases, the modulation pulse length needs to be  
corrected by using the TX Pulse Length Register (0x05).  
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If the register contains all zeros, then the pulse length is governed by the protocol selection. If the register  
contains a value other than 0x00, the pulse length is equal to the value of the register multiplied by  
73.7 ns; therefore, the pulse length can be adjusted between 73.7 ns and 18.8 s in 73.7-ns increments.  
5.7 Transmitter – Digital Section  
The digital part of the transmitter is a mirror of the receiver. The settings controlled the ISO Control  
Register (0x01) are applied to the transmitter just like the receiver. In the TRF7970A default mode the  
TRF7970A automatically adds these special signals: start of communication, end of communication, SOF,  
EOF, parity bits, and CRC bytes.  
The data is then coded to modulation pulse levels and sent to the RF output stage modulation control unit.  
Similar to working with the receiver, this means that the external system MCU only has to load the FIFO  
with data and all the microcoding is done automatically, again saving the firmware developer code space  
and time. Additionally, all of the registers used for transmit parameter control are automatically preset to  
optimum values when a new selection is entered into the ISO Control register (0x01).  
Note: FIFO must be reset before starting any transmission with Direct Command 0x0F.  
There are two ways to start the transmit operation:  
Load the number of bytes to be sent into registers 0x1D and 0x1E and load the data to be sent into the  
FIFO (address 0x1F), followed by sending a transmit command (see Direct Commands section). The  
transmission then starts when the transmit command is received.  
Send the transmit command and the number of bytes to be transmitted first, and then start to send the  
data to the FIFO. The transmission starts when first data byte is written into the FIFO.  
NOTE  
If the data length is longer than the FIFO, the TRF7970A notifies the external system MCU  
when most of the data from the FIFO has been transmitted by sending an interrupt request  
with a flag in the IRQ register to indicate a FIFO low or high status. The external system  
should respond by loading the next data packet into the FIFO.  
At the end of a transmit operation, the external system MCU is notified by interrupt request (IRQ) with a  
flag in IRQ Register (0x0C) indicating TX is complete (example value = 0x80).  
The TX Length registers also support incomplete byte transmission. The high two nibbles in register 0x1D  
and the nibble composed of bits B4 through B7 in register 0x1E store the number of complete bytes to be  
transmitted. Bit B0 in register 0x1E is a flag indicating that there are also additional bits to be transmitted  
that do not form a complete byte. The number of bits is stored in bits B1 through B3 of the same register  
(0x1E).  
Some protocols have options, and there are two sublevel configuration registers to select the TX protocol  
options.  
ISO14443B TX Options register (0x02). This register controls the SOF and EOF selection and EGT  
selection for the ISO14443B protocol.  
ISO14443A High Bit Rate Options and Parity register (0x03). This register enables the use of different  
bit rates for RX and TX operations in the ISO14443 high bit rate protocol and also selects the parity  
method in the ISO14443A high bit rate protocol.  
The digital section also has a timer. The timer can be used to start the transmit operation at a specified  
time in accordance with a selected event.  
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5.8 Transmitter – External Power Amplifier and Subcarrier Detector  
The TRF7970A can be used in conjunction with an external TX power amplifier or external subcarrier  
detector for the receiver path. In this case, certain registers must be programmed as shown here:  
Bit B6 of the Regulator and I/O Control Register (0x0B) must be set to 1. This setting has two  
functions: first, to provide a modulated signal for the transmitter if needed, and second, to configure the  
TRF7970A receiver inputs for an external demodulated subcarrier input.  
Bit B3 of the Modulation and SYS_CLK Control Register (0x09) must be set to 1 (see Section 6.3.2.8).  
This function configures the ASK/OOK pin for either a digital or analog output (B3 = 0 enables a digital  
output, B3 = 1 enables an analog output). The design of an external power amplifier requires detailed  
RF knowledge. There are also readily designed and certified high-power HF reader modules on the  
market.  
5.9 TRF7970A IC Communication Interface  
5.9.1 General Introduction  
The communication interface to the reader can be configured in two ways: with a eight line parallel  
interface (D0:D7) plus DATA_CLK, or with a three or four wire Serial Peripheral Interface (SPI). The SPI  
interface uses traditional Master Out/Slave In (MOSI), Master In/Slave Out (MISO), IRQ, and DATA_CLK  
lines. The SPI can be operated with or without using the Slave Select line.  
These communication modes are mutually exclusive; that is, only one mode can be used at a time in the  
application.  
When the SPI interface is selected, the unused I/O_2, I/O_1, and I/O_0 pins must be hard-wired as shown  
in Table 5-9. At power up, the TRF7970A samples the status of these three pins and then enters one of  
the possible SPI modes.  
The TRF7970A always behaves as the slave device, and the microcontroller (MCU) behaves as the  
master device. The MCU initiates all communications with the TRF7970A, and the TRF7970A makes use  
of the Interrupt Request (IRQ) pin in both parallel and SPI modes to prompt the MCU for servicing  
attention.  
Table 5-9. Pin Assignment in Parallel and Serial Interface Connection or Direct Mode  
Pin  
DATA_ CLK  
I/O_7  
Parallel  
DATA_CLK  
A/D[7]  
Parallel (Direct Mode)  
DATA_CLK  
SPI With SS  
DATA_CLK from master  
MOSI(1) = data in (reader in)  
SPI Without SS  
DATA_CLK from master  
MOSI(1) = data in (reader in)  
(not used)  
Direct mode, data out (subcarrier  
or bit stream)  
I/O_6  
A/D[6]  
A/D[5]  
MISO(2) = data out (MCU out)  
MISO(2) = data out (MCU out)  
Direct mode, strobe – bit clock  
out  
I/O_5(3)  
See  
See  
(3)  
(3)  
I/O_4  
I/O_3  
I/O_2  
I/O_1  
I/O_0  
IRQ  
A/D[4]  
A/D[3]  
(not used)  
(not used)  
(not used)  
(not used)  
(not used)  
IRQ interrupt  
SS – slave select(4)  
(not used)  
At VDD  
(not used)  
(not used)  
At VDD  
A/D[2]  
A/D[1]  
At VDD  
At VSS  
A/D[0]  
At VSS  
At VSS  
IRQ interrupt  
IRQ interrupt  
IRQ interrupt  
(1) MOSI = Master Out, Slave In  
(2) MISO = Master In, Slave Out  
(3) I/O_5 pin is used only for information when data is put out of the chip (for example, reading 1 byte from the chip). It is necessary first to  
write in the address of the register (8 clocks) and then to generate another 8 clocks for reading out the data. The I/O_5 pin goes high  
during the second 8 clocks. But for normal SPI operations, I/O_5 pin is not used.  
(4) Slave_Select pin is active low  
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Communication is initialized by  
a
start condition, which is expected to be followed by an  
Address/Command word (Adr/Cmd). The Adr/Cmd word is 8 bits long, and its format is shown in Table 5-  
10.  
Table 5-10. Address/Command Word Bit Distribution  
Bit  
Description  
Bit Function  
Address  
Command  
0 = address  
1 = command  
B7  
Command control bit  
0
1
0 = write  
1 = read  
B6  
Read/Write  
R/W  
0
B5  
B4  
B3  
B2  
B1  
B0  
Continuous address mode  
Address/Command bit 4  
Address/Command bit 3  
Address/Command bit 2  
Address/Command bit 1  
Address/Command bit 0  
1 = Continuous mode  
R/W  
Adr 4  
Adr 3  
Adr 2  
Adr 1  
Adr 0  
0
Cmd 4  
Cmd 3  
Cmd 2  
Cmd 1  
Cmd 0  
The MSB (bit 7) determines if the word is to be used as a command or as an address. The last two  
columns of Table 5-10 show the function of the separate bits if either address or command is written. Data  
is expected once the address word is sent. In continuous-address mode (Cont. mode = 1), the first data  
that follows the address is written (or read) to (from) the given address. For each additional data, the  
address is incremented by one. Continuous mode can be used to write to a block of control registers in a  
single stream without changing the address; for example, setup of the predefined standard control  
registers from the MCU non-volatile memory to the reader. In non-continuous address mode (simple  
addressed mode), only one data word is expected after the address.  
Address Mode is used to write or read the configuration registers or the FIFO. When writing more than 12  
bytes to the FIFO, the Continuous Address Mode should be set to 1.  
The Command Mode is used to enter a command resulting in reader action (for example, initialize  
transmission, enable reader, and turn reader on or off).  
Examples of expected communications between an MCU and the TRF7970A are shown in the following  
sections.  
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5.9.1.1 Continuous Address Mode  
Table 5-11. Continuous Address Mode  
Start  
Adr x  
Data(x)  
Data(x+1)  
Data(x+2)  
Data(x+3)  
Data(x+4)  
...  
Data(x+n)  
StopCont  
Figure 5-5. Continuous Address Register Write Example Starting with Register 0x00 Using SPI With SS  
Figure 5-6. Continuous Address Register Read Example Starting with Register 0x00 Using SPI With SS  
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5.9.1.2 Noncontinuous Address Mode (Single Address Mode)  
Table 5-12. Noncontinuous Address Mode (Single Address Mode)  
Start  
Adr x  
Data(x)  
Adr y  
Data(y)  
...  
Adr z  
Data(z)  
StopSgl  
Figure 5-7. Single Address Register Write Example of Register 0x00 Using SPI With SS  
Figure 5-8. Single Address Register Read Example of Register 0x00 Using SPI With SS  
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5.9.1.3 Direct Command Mode  
Table 5-13. Direct Command Mode  
Start  
Cmd x  
(Optional data or command)  
Stop  
Figure 5-9. Direct Command Example of Sending 0x0F (Reset) Using SPI With SS  
The other Direct Command Codes from MCU to TRF7970A IC are described in Section 5.12.  
5.9.1.4 FIFO Operation  
The FIFO is a 128-byte register at address 0x1F with byte storage locations 0 to 127. FIFO data is loaded  
in a cyclical manner and can be cleared by a reset command (0x0F) (see Figure 5-9 showing this Direct  
Command).  
Associated with the FIFO are two counters and three FIFO status flags. The first counter is a 7-bit FIFO  
byte counter (bits B0 to B6 in register 0x1C) that tracks the number of bytes loaded into the FIFO. If the  
number of bytes in the FIFO is n, the register value is n (number of bytes in FIFO register). For example, if  
8 bytes are in the FIFO, the FIFO counter (Register 0x1C) has the hexadecimal value of 0x08 (binary  
value of 00001000).  
A second counter (12 bits wide) indicates the number of bytes being transmitted (registers 0x1D and  
0x1E) in a data frame. An extension to the transmission-byte counter is a 4-bit broken-byte counter also  
provided in register 0x1E (bits B0 to B3). Together these counters make up the TX length value that  
determines when the reader generates the EOF byte.  
FIFO status flags are as follows:  
FIFO overflow (bit B7 of register 0x1C) – indicates that the FIFO has more than 128 bytes loaded  
During transmission, the FIFO is checked for an almost-empty condition, and during reception for an  
almost-full condition. The maximum number of bytes that can be loaded into the FIFO in a single  
sequence is 128 bytes.  
NOTE  
The number of bytes in a frame, transmitted or received, can be greater than 128 bytes.  
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During transmission, the MCU loads the TRF7970A IC's FIFO (or during reception the MCU removes data  
from the FIFO), and the FIFO counter counts the number of bytes being loaded into the FIFO. Meanwhile,  
the byte counter keeps track of the number of bytes being transmitted. An interrupt request is generated if  
the number of bytes in the FIFO is less than 32 or greater than 96, so that MCU can send new data or  
remove the data as necessary. The MCU also checks the number of data bytes to be sent, so as to not  
surpass the value defined in TX length bytes. The MCU also signals the transmit logic when the last byte  
of data is sent or was removed from the FIFO during reception. Transmission starts automatically after the  
first byte is written into FIFO.  
Figure 5-10. Example of Checking the FIFO Status Register Using SPI With SS  
5.9.2 Parallel Interface Mode  
In parallel mode, the start condition is generated on the rising edge of the I/O_7 pin while the CLK is high.  
This is used to reset the interface logic. Figure 5-11 shows the sequence of the data, with an 8-bit address  
word first, followed by data.  
Communication is ended by:  
The StopSmpl condition, where a falling edge on the I/O_7 pin is expected while CLK is high.  
The StopCont condition, where the I/O_7 pin must have a successive rising and falling edge while CLK  
is low to reset the parallel interface and be ready for the new communication sequence.  
The StopSmpl condition is also used to terminate the direct mode.  
Figure 5-11. Parallel Interface Communication With Simple Stop Condition (StopSmpl)  
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Figure 5-12. Parallel Interface Communication with Continuous Stop Condition (StopCont)  
Figure 5-13. Example of Parallel Interface Communication with Continuous Stop Condition  
5.9.3 Reception of Air Interface Data  
At the start of a receive operation (when SOF is successfully detected), B6 is set in the IRQ Status  
register. An interrupt request is sent to the MCU at the end of the receive operation if the receive data  
string was shorter than or equal to 8 bytes. The MCU receives the interrupt request, then checks to  
determine the reason for the interrupt by reading the IRQ Status register (0x0C), after which the MCU  
reads the data from the FIFO.  
If the received packet is longer than 96 bytes, the interrupt is sent before the end of the receive operation  
when the 96th byte is loaded into the FIFO (75% full). The MCU should again read the content of the IRQ  
Status register to determine the cause of the interrupt request. If the FIFO is 75% full (as marked with flag  
B5 in IRQ Status register and by reading the FIFO Status register), the MCU should respond by reading  
the data from FIFO to make room for new incoming receive data. When the receive operation is finished,  
the interrupt is sent and the MCU must check how many words are still present in the FIFO before it  
finishes reading.  
If the reader detects a receive error, the corresponding error flag is set (framing error, CRC error) in the  
IRQ Status register, indicating to the MCU that reception was not completed correctly.  
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5.9.4 Data Transmission to MCU  
Before beginning data transmission, the FIFO should always be cleared with a reset command (0x0F).  
Data transmission is initiated with a selected command (see Section 5.12). The MCU then commands the  
reader to do a continuous write command (0x3D) starting from register 0x1D. Data written into register  
0x1D is the TX Length Byte1 (upper and middle nibbles), while the following byte in register 0x1E is the  
TX Length Byte2 (lower nibble and broken byte length) (see Table 6-34 and Table 6-35) . Note that the TX  
byte length determines when the reader sends the end of frame (EOF) byte. After the TX length bytes are  
written, FIFO data is loaded in register 0x1F with byte storage locations 0 to 127. Data transmission  
begins automatically after the first byte is written into the FIFO. The loading of TX length bytes and the  
FIFO can be done with a continuous-write command, as the addresses are sequential.  
At the start of transmission, the flag B7 (IRQ_TX) is set in the IRQ Status register, and at the end of the  
transmit operation, an interrupt is sent to inform the MCU that the task is complete.  
5.9.5 Serial Interface Communication (SPI)  
When an SPI interface is used, I/O pins I/O_2, I/O_1, and I/O_0 must be hard wired according to Table 5-  
9. On power up, the TRF7970A looks for the status of these pins and then enters into one of two possible  
SPI modes:  
SPI with Slave Select  
SPI without Slave Select  
The choice of one of these modes over another should be predicated by the available GPIOs and the  
desired control of the system.  
The serial communications work in the same manner as the parallel communications with respect to the  
FIFO, except for the following condition. On receiving an IRQ from the reader, the MCU reads the  
TRF7970A IRQ Status register to determine how to service the reader. After this, the MCU must to do a  
dummy read to clear the reader's IRQ status register. The dummy read is required in SPI mode because  
the reader's IRQ status register needs an additional clock cycle to clear the register. This is not required in  
parallel mode because the additional clock cycle is included in the Stop condition. When first establishing  
communications with the TRF7970A, the SOFT_INIT (0x03) command should be sent first from the MCU  
(see Table 5-18).  
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The procedure for a dummy read is as follows:  
1. Start the dummy read:  
(a) When using slave select (SS): set SS bit low.  
(b) When not using SS: start condition is when Data Clock is high (see Table 5-9).  
2. Send address word to IRQ status register (0x0C) with read and continuous address mode bits set to 1  
(see Table 5-9).  
3. Read 1 byte (8 bits) from IRQ status register (0x0C).  
4. Dummy-read 1 byte from register 0x0D (collision position and interrupt mask).  
5. Stop the dummy read:  
(a) When using slave select (SS): set SS bit high.  
(b) When not using SS: stop condition when Data Clock is high.  
Write Address  
Byte (0x6C)  
Read Data in  
IRQ Status Register  
Dummy Read  
DATA  
CLK  
0
1
1
0
1
1
0
0
MOSI  
MISO  
No Data Transitions (All High/Low) No Data Transitions (All High/Low)  
Ignore  
Don't Care  
B7 B6 B5 B4 B3 B2 B1 B0  
SLAVE  
SELECT  
Figure 5-14. Procedure for Dummy Read  
Figure 5-15. Example of Dummy Read Using SPI With SS  
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5.9.5.1 Serial Interface Mode Without Slave Select (SS)  
The serial interface without the slave select pin must use delimiters for the start and stop conditions.  
Between these delimiters, the address, data, and command words can be transferred. All words must be 8  
bits long with MSB transmitted first.  
Start  
Condition  
Stop  
Condition  
Data_Clock  
50 ns  
b7  
Data In  
b6  
b5  
b4  
b3  
b2  
b1  
b0  
Data Out  
Figure 5-16. SPI Without Slave Select Timing Diagram  
In this mode, a rising edge on data-in (I/O_7, pin 24) while SCLK is high resets the serial interface and  
prepares it to receive data. Data-in can change only when SCLK is low and is taken by the reader on the  
SCLK rising edge. Communication is terminated by the stop condition when the data-in falling edge occurs  
during a high SCLK period.  
5.9.5.2 Serial Interface Mode With Slave Select (SS)  
The serial interface is in reset while the Slave Select signal is high. Serial data in (MOSI) changes on the  
falling edge, and is validated in the reader on the rising edge, as shown in Figure 5-17. Communication is  
terminated when the Slave Select signal goes high.  
All words must be 8 bits long with the MSB transmitted first.  
WRITE MODE  
CKPH = 0, CKPL=0  
Data Transition is on  
READ MODE  
CKPH = 0, CKPL=0  
Data Transition is on  
tSTE,LA  
G
tSTE,LA  
G
tSTE,LEAD  
Data Clock rising edge  
MOSI Valid on Data Clock Falling Edge  
Data Clock rising edge  
MISO Valid on Data Clock Falling Edge  
1/fUCxCLK  
DATA  
CLK  
tHD,SI  
tSU,SO  
tLO/HI  
tLO/HI  
tSU,SI  
NO DATA TRANSITIONS  
(ALL HIGH/LOW)  
MOSI  
MISO  
b7  
b6...b1  
b0  
tHD,SO  
tVALID,SO  
tSTE,DIS  
DON’T CARE  
b7  
b6...  
...b1  
b0  
Figure 5-17. SPI With Slave Select Timing Diagram  
The read command is sent out on the MOSI pin, MSB first, in the first eight clock cycles. MOSI data  
changes on the falling edge, and is validated in the reader on the rising edge, as shown in Figure 5-17.  
During the write cycle, the serial data out (MISO) is not valid. After the last read command bit (B0) is  
validated at the eighth rising edge of SCLK, after half a clock cycle, valid data can be read on the MISO  
pin at the falling edge of SCLK. It takes eight clock edges to read out the full byte (MSB first). See  
Section 3.4 for electrical specifications related to Figure 5-17.  
The continuous read operation is shown in Figure 5-18.  
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Write  
Address Byte  
Read  
Data Byte 1  
Read  
Data Byte n  
DATA_CLK  
No Data Transitions  
(All High/Low)  
No Data Transitions  
(All High/Low)  
B7 B6 B5 B4 B3 B2 B1 B0  
MOSI  
MISO  
B7 B6 B5 B4 B3 B2 B1 B0  
Don't Care  
B7 B6 B5 B4 B3 B2 B1 B0  
SLAVE  
SELECT  
Figure 5-18. Continuous Read Operation Using SPI With Slave Select  
Figure 5-19. Continuous Read of Registers 0x00 Through 0x05 Using SPI With SS  
Performing Single Slot Inventory Command as an example is shown in Figure 5-20. Reader registers (in  
this example) are configured for 5 VDC in and default operation. For full sequences for other settings and  
protocols can be found here: http://www.ti.com/lit/zip/sloc240  
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Figure 5-20. Inventory Command Sent From MCU to TRF7970A  
The TRF7970A takes these bytes from the MCU and then send out Request Flags, Inventory Command  
,and Mask over the air to the ISO15693 transponder. After these three bytes have been transmitted, an  
interrupt occurs to indicate back to the reader that the transmission has been completed. In the example in  
Figure 5-21, this IRQ occurs approximately 1.6 ms after the SS line goes high after the Inventory  
command is sent out.  
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Figure 5-21. IRQ After Inventory Command  
The IRQ status register read (0x6C) yields 0x80, which indicates that TX is indeed complete. This is  
followed by dummy clock and reset of FIFO with dummy clock. Then, if a tag is in the field and no error is  
detected by the reader, a second interrupt is expected and occurs (in this example) approximately 4 ms  
after first IRQ is read and cleared.  
In the continuation of the example (see Figure 5-22), the IRQ Status Register is read using method  
previously recommended, followed by a single read of the FIFO status register, which indicates that there  
are at least 9 bytes to be read out.  
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Figure 5-22. Read IRQ Status Register After Inventory Command  
This is then followed by a continuous read of the FIFO. The first byte is (and should be) 0x00 for no error.  
The next byte is the DSFID (usually shipped by manufacturer as 0x00), then the UID, shown here up to  
the next most significant byte, the MFG code (shown as 0x07 (TI silicon)).  
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Figure 5-23. Continuous Read of FIFO After Inventory Command  
This is followed by another IRQ approximately 160 µs later, as there is still one byte in FIFO, the MSB of  
the UID, which must be retrieved. IRQ register read shows RX is complete and FIFO register status shows  
one byte available, as expected and it is the E0, indicating ISO15693 transponder.  
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Figure 5-24. Second IRQ After Inventory Command  
At this point it is good form to reset the FIFO and then read out the RSSI value of the tag. In this case the  
transponder is very close to the antenna, so value of 0x7E is recovered.  
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Figure 5-25. Reset FIFO and Read RSSI  
5.9.6 Direct Mode  
Direct mode allows the user to configure the reader in one of two ways. Direct Mode 0 (bit 6 = 0, as  
defined in ISO Control register) allows the user to use only the front-end functions of the reader,  
bypassing the protocol implementation in the reader. For transmit functions, the user has direct access to  
the transmit modulator through the MOD pin (pin 14). On the receive side, the user has direct access to  
the subcarrier signal (digitized RF envelope signal) on I/O_6 (pin 23).  
Direct Mode 1 (bit 6 = 1, as defined in ISO Control register) uses the subcarrier signal decoder of the  
selected protocol (as defined in ISO Control register). This means that the receive output is not the  
subcarrier signal but the decoded serial bit stream and bit clock signals. The serial data is available on  
I/O_6 (pin 23) and the bit clock is available on I/O_5 (pin 22). The transmit side is identical; the user has  
direct control over the RF modulation through the MOD input. This mode is provided so that the user can  
implement a protocol that has the same bit coding as one of the protocols implemented in the reader, but  
needs a different framing format.  
To select direct mode, the user must first choose which direct mode to enter by writing B6 in the ISO  
Control register. This bit determines if the receive output is the direct subcarrier signal (B6 = 0) or the  
serial data of the selected decoder. If B6 = 1, then the user must also define which protocol should be  
used for bit decoding by writing the appropriate setting in the ISO Control register.  
The reader actually enters the direct mode when B6 (direct) is set to 1 in the chip status control register.  
Direct mode starts immediately. The write command should not be terminated with a stop condition (see  
communication protocol), because the stop condition terminates the direct mode and clears B6. This is  
necessary as the direct mode uses one or two I/O pins (I/O_6, I/O_5). Normal parallel communication is  
not possible in direct mode. Sending a stop condition terminates direct mode.  
Figure 5-26 shows the different configurations available in direct mode.  
In mode 0, the reader is used as an AFE only, and protocol handling is bypassed.  
In mode 1, framing is not done, but SOF and EOF are present. This allows for a user-selectable  
framing level based on an existing ISO standard.  
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In mode 2, data is ISO-standard formatted. SOF, EOF, and error checking are removed, so the  
microprocessor receives only bytes of raw data through a 128-byte FIFO.  
Analog Front End (AFE)  
Direct Mode 0:  
Raw RF Sub-Carrier  
Data Stream  
ISO Encoders/Decoders  
14443A  
14443B  
15693  
FeliCa  
Direct Mode 1:  
Raw Digital ISO Coded  
Data Without  
Protocol Frame  
Packetization/Framing  
Microcontroller  
ISO Mode:  
Full ISO Framing  
and Error Checking  
(Typical Mode)  
Figure 5-26. User-Configurable Modes  
The steps to enter Direct Mode are listed below, using SPI with SS communication method only as one  
example, as Direct Modes are also possible with parallel and SPI without SS. The must enter Direct Mode  
0 to accommodate non-ISO standard compliant card type communications. Direct Mode can be entered at  
any time, so in the event a card type started with ISO standard communications, then deviated from the  
standard after being identified and selected, the ability to go into Direct Mode 0 becomes very useful.  
Step 1: Configure Pins I/O_0 to I/O_2 for SPI with SS  
Step 2: Set Pin 12 of the TRF7970A (ASK/OOK pin) to 0 for ASK or 1 for OOK  
Step 3: Program the TRF7970A registers  
The following registers need to be explicitly set before going into the Direct Mode.  
1. ISO Control register (0x01) to the appropriate standard  
0x02 for ISO 15693 High Data Rate (26.48 kbps)  
0x08 for ISO14443A (106 kbps)  
0x1A for FeliCa 212 kbps  
0x1B for FeliCa 424 kbps  
2. Modulator and SYS_CLK Register (0x09) to the appropriate clock speed and modulation  
0x21 for 6.78 MHz Clock and OOK (100%) modulation  
0x20 for 6.78 MHz Clock and ASK 10% modulation  
0x22 for 6.78 MHz Clock and ASK 7% modulation  
0x23 for 6.78 MHz Clock and ASK 8.5% modulation  
0x24 for 6.78 MHz Clock and ASK 13% modulation  
0x25 for 6.78 MHz Clock and ASK 16% modulation  
(See register 0x09 definition for all other possible values)  
Example register setting for ISO14443A at 106 kbps:  
ISO Control register (0x01) to 0x08  
RX No Response Wait Time register (0x07) to 0x0E  
RX Wait Time register (0x08) to 0x07  
Modulator control register (0x09) to 0x21 (or any custom modulation)  
RX Special Settings register (0x0A) to 0x20  
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Step 4: Entering Direct Mode 0  
The following registers need to be programmed to enter Direct Mode 0  
1. Set bit B6 of the Modulator and SYS_CLK Control register (0x09) to 1.  
2. Set bit B6 of the ISO Control (Register 01) to 0 for Direct Mode 0 (default its 0)  
3. Set bit B6 of the Chip Status Control register (0x00) to 1 to enter Direct Mode  
4. Send extra eight clock cycles (see Figure 5-27, this step is TRF7970A specific)  
NOTE  
It is important that the last write is not terminated with a stop condition. For SPI, this  
means that Slave Select (I/O_4) stays low.  
Sending a Stop condition terminates the Direct Mode and clears bit B6 in the Chip Status  
Control register (0x00).  
NOTE  
Access to Registers, FIFO, and IRQ is not available during Direct Mode 0.  
The reader enters the Direct Mode 0 when bit 6 of the Chip Status Control register (0x00) is set to a 1 and  
stays in Direct Mode 0 until a stop condition is sent from the microcontroller.  
NOTE  
The write command should not be terminated with a stop condition (for example, in SPI  
mode this is done by bringing the Slave Select line high after the register write), because the  
stop condition terminates the direct mode and clears bit 6 of the Chip Status Control Register  
(0x00), making it a 0.  
Figure 5-27. Entering Direct Mode 0  
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Step 5: Transmit Data Using Direct Mode  
The application now has direct control over the RF modulation through the MOD input (see Figure 5-28).  
TRF7970A  
Microcontroller  
Drive the MOD pin  
according to the data coding  
specified by the standard  
MOD  
(Pin 14)  
Decode the subcarrier  
information according  
to the standard  
I/O_6  
(Pin 23)  
Figure 5-28. Direct Control Signals  
The microcontroller is responsible for generating data according to the coding specified by the particular  
standard. The microcontroller must generate SOF, EOF, Data, and CRC. In direct mode, the FIFO is not  
used and no IRQs are generated. See the applicable ISO standard to understand bit and frame  
definitions. As an example of what the developer sees when using DM0 in an actual application, Figure 5-  
29 is presented to clearly show the relationship between the MOD pin being controlled by the MCU and  
the resulting modulated 13.56-MHz carrier signal.  
Figure 5-29. TX Sequence Out in DM0  
Step 6: Receive Data Using Direct Mode  
After the TX operation is complete, the tag responds to the request and the subcarrier data is available on  
pin I/O_6. The microcontroller needs to decode the subcarrier signal according to the standard. This  
includes decoding the SOF, data bits, CRC, and EOF. The CRC then needs to be checked to verify data  
integrity. The receive data bytes must be buffered locally.  
As an example of the receive data bits and framing level according to the ISO14443A standard is shown  
in Figure 5-30 (taken from ISO14443 specification and TRF7970A air interface).  
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?
?
?
128/fc = 9.435 µs = tb (106-kbps data rate)  
64/fc = 4.719 µs = tx time  
32/fc = 2.359 µs = t1 time  
tb = 9.44 µs  
tx = 4.72 µs  
t1 = 2.48 µs  
Sequence Y = Carrier for 9.44 µs  
Sequence Z = Pause for 2 to 3 µs,  
Carrier for Remainder of 9.44 µs  
Figure 5-30. Receive Data Bits and Framing Level  
Figure 5-31 is presented to clearly show an example of what the developer should expect on the I/O_6  
line during the RX process while in Direct Mode 0.  
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Figure 5-31. RX Sequence on I/O_6 in DM0 (Analog Capture)  
Step 7: Terminating Direct Mode 0  
After the EOF is received, data transmission is over, and Direct Mode 0 can be terminated by sending a  
Stop Condition (in the case of SPI, make the Slave Select go high). The TRF7970A is returned to default  
state.  
5.10 Special Direct Mode for Improved MIFARE Compatibility  
See the application report TRF7970A Firmware Design Hints (SLOA159).  
5.11 NFC Modes  
5.11.1 Target  
When used as the NFC target, the chip is typically in a power down or standby mode. If EN2 = H, the chip  
keeps the supply system on. If EN2 = L and EN = L the chip is in complete power down. To operate as  
NFC target or Tag emulator the MCU must load a value different than zero (0) in Target Detection Level  
register (b0-b2) which enables the RF measurement system (supplied by VEXT, so it can operate also  
during complete power down and consumes only 3.5 µA). The RF measurement constantly monitors the  
RF signal on the antenna input. When the RF level on the antenna input exceeds the level defined in the  
in Target Detection Level register, the chip is automatically activated (EN is internal forced high). The  
typical RF value that causes power-up for each value of B0 to B2 and the function of Target Detection  
Level register is listed in Table 5-14.  
NFC Target Detection Level Register (0x18) – defines level for RF level for wake-up, enables automatic  
SDD and gives information of NFCID size. This register is directly supplied by VEXT to ensure data  
retention during complete power down.  
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Table 5-14. NFC Target Detection Level Register  
Bit  
B7  
B6  
Signal Name  
Id_s1  
Function  
Comments  
NFCID1 size used in 106 kbps passive target SDD  
Id_s0  
Automatic SDD using internal state machine and ID  
stored in NFCID Number register  
B5  
Sdd_en  
1 = Enables internal SDD protocol  
B4  
B3  
B2  
B1  
B0  
N/A  
Hi_rf  
Extended range for RF measurements  
Rfdet_h2  
Rfdet_h1  
Rfdet_h0  
RF field level required for system wake-up. If all  
bits are 0, the RF level detection is switched off.  
Comparator output is displayed in NFC Target  
Protocol register B7 (rf_h)  
Default: reset to 00 at POR on VEXT (not on POR based on VDD_X), not reset at EN = 0  
Table 5-15. Bits B0 to B3 of the NFC Target Detection Level Register  
b0 B1 B2  
RF Vpp  
RF Vpp  
000  
001  
010  
011  
100  
101  
110  
111  
B3 = 0  
B3 = 1  
Not active  
Not active  
480 mV  
1500 mV  
350 mV  
700 mV  
250 mV  
500 mV  
220 mV  
450 mV  
190 mV  
400 mV  
180 mV  
320 mV  
170 mV  
280 mV  
When the voltage supply system and the oscillator are started and is stable, the osc_ok goes high (B6 of  
RSSI Level and Oscillator Status register) and IRQ is sent with bit B2 = 1 of IRQ register (field change).  
Bit B7 NFC Target Protocol in register directly displays the status of RF level detection (running constantly  
also during normal operation). This informs the MCU that the chip should start operation as an NFC  
TARGET device.  
When the first command from the INITIATOR is received another IRQ sent with B6 (RX start) set in IRQ  
register. The MCU must set EN = H (confirm the power-up) in the time between the two IRQs as the  
internal power-up ends after the second IRQ. The type and coding of the first initiator (or reader in the  
case of a tag emulator) command define the communication protocol type which the target must use. So  
the communication protocol type is available in the NFC Target Protocol register immediately after  
receiving the first command. The coding of the NFC Target Protocol register is described next.  
NFC Target Protocol Register (0x19) – displays the bit rate and protocol type (active or passive)  
transmitted by initiator in the first command. It also displays the comparator outputs of both RF level  
detectors.  
Table 5-16. NFC Target Protocol Register  
Bit  
Signal Name  
Function  
Comments  
The wake-up level is defined by bits b0-b3 of NFC  
Target Detection Level register  
B7  
Rf_h  
1 = RF level is above the set wake-up level  
1 = RF level is above the RF collision avoidance  
level.  
The collision avoidance level is defined by bits b0-  
b2 of NFC Low Field Detection Level register  
B6  
B5  
B4  
Rf_l  
N/A  
1 = FeliCa type  
0 = ISO14443A type  
The first initiator command had physical level  
coding like FeliCa or like ISO14443A  
FeliCa  
The first initiator/reader command was SENS_REQ  
or ALL_REQ  
B3  
Pas106  
Passive target 106 kbps or tag emulation  
Tag emulation ISO14443B  
B2  
B1  
Pas14443B  
Nfcbr1  
The first reader command was of ISO14443B type  
00 = N/A  
01 = 106 kbps  
10 = 212 kbps  
11 = 424 kbps  
Bit rate of first received command  
B0  
Nfcbr0  
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Default: reset to 00 at POR and EN = L. B0 to B4 are automatically reset after MCU read operation. B6  
and B7 continuously display the RF level comparator outputs.  
Based on the first command from INITIATOR following actions are taken:  
If the first command is SENS_REQ or ALL_REQ, the TARGET must enter the SDD protocol for 106  
kbps passive communication. If bit B5 in NFC Target Detection Level register is not set, the MCU  
handles the SDD and the command received is send to FIFO. If bit B5 is set, the internal SDD state  
machine is used. The MCU must load the ID (NFCID1) of the device in the 128 bytes deep NFCID  
Number registers to be used by the SDD state machine. The length of the ID which should be used in  
SDD is defined by bits B6 and B7 of the NFC Target Detection Level register. When the SDD is  
complete and the INITIATOR sends SEL_REQ with full UID on the correct cascade level the SDD  
state machine responds with SEL_RES indicating the TARGET supports the data exchange protocol.  
The IRQ (B3 set) is send to MCU to signal successful end of SDD (the device is now selected as  
TARGET). The SDD state machine is than turned off. If the RF field is turned off (B7 in the NFC Target  
Protocol register goes low) at any time, the system sends an IRQ to the MCU with bit B2 (RF field  
change) in the IRQ register set high. This informs the MCU that the procedure was aborted and the  
system must be reset. The clock extractor is automatically activated in this mode.  
If the command is SENS_REQ or ALL_REQ and the Tag emulation bit in ISO Control register is set,  
the system emulates an ISO14443A tag. The procedure does not differ from the one previously  
described for a passive target at 106 kbps. The clock extractor is automatically activated in this mode.  
If the first command is a POLLING request, the system becomes a TARGET in passive communication  
using 212 kbps or 424 kbps. The SDD is relatively simple and is handled by the MCU directly. The  
POLLING response is sent in one of the slots automatically calculated by the MCU (first slot starts  
2.416 ms after the end of the command and slots follow in 1.208 ms).  
If the first command is ATR_REQ, the system operates as an active TARGET using the same  
communication speed and bit coding as used by the INITIATOR. Again, all of the replies are handled  
by MCU. The chip is only required to time the response collision avoidance, which is done on direct  
command from MCU. When the RF field is switched on and the minimum wait time is elapsed, the chip  
sends an IRQ with B1 (RF collision avoidance finished) set high. This signals the MCU that it can send  
the reply.  
If the first command is coded as ISO14443B and the Tag emulation bit is set in the ISO Control  
register, the system enters ISO14443B emulator mode. The anticollision must be handled by the MCU,  
and the chip provides all physical level coding, decoding, and framing for this protocol.  
Table 5-17 shows the function of the IRQ and Status register in NFC and Tag emulation. This register is  
preset to 0 at POR = H or EN = L and at each write to ISO Control. It is also automatically reset at the end  
of read phase. The reset also removes the IRQ flag.  
(1)  
Table 5-17. IRQ and Status Register (0x0C) for NFC and Card Emulation Operation  
Bit  
Signal Name  
Function  
Comments  
Signals the TX is in progress. The flag is set at the start of  
TX but the interrupt request is sent when TX is finished.  
B7  
Irq_tx  
IRQ set due to end of TX  
Signals that RX SOF was received and RX is in progress.  
The flag is set at the start of RX but the interrupt request is  
sent when RX is finished  
B6  
Irg_srx  
IRQ set due to RX start  
B5  
B4  
B3  
B2  
Irq_fifo  
Irq_err1  
Irq_sdd  
Irq_rf  
Signals the FIFO is 1/3 > FIFO > 2/3  
Protocol error  
Signals FIFO high or low  
Any protocol error  
SDD finished  
SDD (passive target at 106 kbps) successfully finished  
Sufficient RF signal level for operation was reached or lost  
RF field change  
The system has finished collision avoidance and the  
minimum wait time is elapsed.  
B1  
B0  
Irq_col  
RF collision avoidance finished  
RF collision avoidance not finished  
successfully  
The external RF field was present so the collision avoidance  
could not be carried out.  
Irq_col_err  
(1) Displays the cause of IRQ and TX/RX status  
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5.11.2 Initiator  
The chip is fully controlled by the MCU as in RFID reader operation. The MCU activates the chip and  
writes the mode selection in the ISO Control register. The MCU uses RF collision avoidance commands,  
so it is relieved of any real-time task. The normal transmit and receive procedure (through the FIFO) are  
used to communicate with the TARGET device as described in Section 5.9.  
5.12 Direct Commands from MCU to Reader  
5.12.1 Command Codes  
Table 5-18. Address/Command Word Bit Distribution  
Command Code  
0x00  
Command  
Comments  
Idle  
0x03  
Software Initialization  
Same as Power on Reset  
0x04  
Perform RF Collision Avoidance  
Perform response RF Collision Avoidance  
Perform response RF Collision Avoidance (n = 0)  
Reset  
0x05  
0x06  
0x0F  
0x10  
Transmission without CRC  
0x11  
Transmission with CRC  
0x12  
Delayed Transmission without CRC  
Delayed Transmission with CRC  
End of Frame/Transmit Next Time Slot  
Close Slot Sequence  
0x13  
0x14  
ISO15693  
0x15  
0x16  
Block Receiver  
0x17  
Enable Receiver  
0x18  
Test external RF (RSSI at RX input with TX on)  
Test internal RF (RSSI at RX input with TX off)  
Receiver Gain Adjust  
0x19  
0x1A  
The command code values from Table 5-18 are substituted in Table 5-19, Bits 0 through 4. Also, the  
most-significant bit (MSB) in Table 5-19 must be set to 1. ( Table 5-19 is same as Table 5-10, shown  
here again for user clarity).  
Table 5-19. Address/Command Word Bit Distribution  
Bit  
Description  
Bit Function  
Address  
Command  
0 = address  
1 = command  
B7  
Command control bit  
0
1
0 = write  
1 = read  
B6  
Read/Write  
R/W  
0
B5  
B4  
B3  
B2  
B1  
B0  
Continuous address mode  
Address/Command bit 4  
Address/Command bit 3  
Address/Command bit 2  
Address/Command bit 1  
Address/Command bit 0  
1 = Continuous mode  
R/W  
Adr 4  
Adr 3  
Adr 2  
Adr 1  
Adr 0  
0
Cmd 4  
Cmd 3  
Cmd 2  
Cmd 1  
Cmd 0  
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The MSB determines if the word is to be used as a command or address. The last two columns of  
Table 5-19 show the function of each bit, depending on whether address or command is written.  
Command mode is used to enter a command resulting in reader action (initialize transmission, enable  
reader, and turn reader on or off).  
5.12.1.1 Software Initialization (0x03)  
This command starts a Power on Reset.  
5.12.1.2 Initial RF Collision Avoidance (0x04)  
This command executes the initial collision avoidance and sends out IRQ after 5 ms from establishing RF  
field (so the MCU can start sending commands/data). If the external RF field is present (higher than the  
level set in NFC Low Field Detection Level register (0x16)) then the RF field can not be switched on and  
hence a different IRQ is returned.  
5.12.1.3 Response RF Collision Avoidance (0x05)  
This command executes the response collision avoidance and sends out IRQ after 75 µs from establishing  
RF field (so the MCU can start sending commands/data). If the external RF field is present (higher than  
the level set in NFC Low Field Detection Level register (0x16)) then the RF field can not be switched on  
and hence a different IRQ is returned.  
5.12.1.4 Response RF Collision Avoidance (0x06, n = 0)  
This command executes the response collision avoidance without random delay. It sends out IRQ after 75  
µs from establishing RF field (so the MCU can start sending commands/data). If the external RF field is  
present (higher than the level set in NFC Low Field Detection Level register (0x16)) then the RF field can  
not be switched on and hence a different IRQ is returned.  
5.12.1.5 Reset (0x0F)  
The reset command clears the FIFO contents and FIFO status register (0x1C). It also clears the register  
storing the collision error location (0x0E).  
5.12.1.6 Transmission With CRC (0x11)  
The transmission command must be sent first, followed by transmission length bytes, and FIFO data. The  
reader starts transmitting after the first byte is loaded into the FIFO. The CRC byte is included in the  
transmitted sequence.  
5.12.1.7 Transmission Without CRC (0x10)  
Same as Section 5.12.1.6 with CRC excluded.  
5.12.1.8 Delayed Transmission With CRC (0x13)  
The transmission command must be sent first, followed by the transmission length bytes, and FIFO data.  
The reader transmission is triggered by the TX timer.  
5.12.1.9 Delayed Transmission Without CRC (0x12)  
Same as Section 5.12.1.8 with CRC excluded.  
5.12.1.10 Transmit Next Time Slot (0x14)  
When this command is received, the reader transmits the next slot command. The next slot sign is defined  
by the protocol selection.  
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5.12.1.11 Block Receiver (0x16)  
The block receiver command puts the digital part of receiver (bit decoder and framer) in reset mode. This  
is useful in an extremely noisy environment, where the noise level could otherwise cause a constant  
switching of the subcarrier input of the digital part of the receiver. The receiver (if not in reset) would try to  
catch a SOF signal, and if the noise pattern matched the SOF pattern, an interrupt would be generated,  
falsely signaling the start of an RX operation. A constant flow of interrupt requests can be a problem for  
the external system (MCU), so the external system can stop this by putting the receive decoders in reset  
mode. The reset mode can be terminated in two ways. The external system can send the enable receiver  
command. The reset mode is also automatically terminated at the end of a TX operation. The receiver can  
stay in reset after end of TX if the RX wait time register (0x08) is set. In this case, the receiver is enabled  
at the end of the wait time following the transmit operation.  
5.12.1.12 Enable Receiver (0x17)  
This command clears the reset mode in the digital part of the receiver if the reset mode was entered by  
the block receiver command.  
5.12.1.13 Test Internal RF (RSSI at RX Input With TX ON) (0x18)  
The level of the RF carrier at RF_IN1 and RF_IN2 inputs is measured. Operating range between 300 mVP  
and 2.1 VP (step size is 300 mV). The two values are displayed in the RSSI levels register (0x0F). The  
command is intended for diagnostic purposes to set correct RF_IN levels. Optimum RFIN input level is  
approximately 1.6 VP or code 5 to 6. The nominal relationship between the RF peak level and RSSI code  
is shown in Table 5-20 and in Section 5.4.1.1.  
NOTE  
If the command is executed immediately after power-up and before any communication with  
a tag is performed, the command must be preceded by Enable RX command. The Check RF  
commands require full operation, so the receiver must be activated by Enable RX or by a  
normal Tag communication for the Check RF command to work properly.  
Table 5-20. Test Internal RF Peak Level to RSSI Codes  
RF_IN1 [mVPP  
Decimal Code  
Binary Code  
]
300  
1
600  
2
900  
3
1200  
4
1500  
5
1800  
6
2100  
7
001  
010  
011  
001  
101  
011  
111  
5.12.1.14 Test External RF (RSSI at RX Input with TX OFF) (0x19)  
This command can be used in active mode when the RF receiver is switched on but RF output is switched  
off. This means bit B1 = 1 in Chip Status Control Register. The level of RF signal received on the antenna  
is measured and displayed in the RSSI Levels register (0x0F). The relation between the 3 bit code and the  
external RF field strength [A/m] must be determinate by calculation or by experiments for each antenna  
type as the antenna Q and connection to the RF input influence the result. The nominal relation between  
the RF peak to peak voltage in the RF_IN1 input and RSSI code is shown in Table 5-21 and in  
Section 5.4.1.2.  
NOTE  
If the command is executed immediately after power-up and before any communication with  
a tag is performed, the command must be preceded by an Enable RX command. The Check  
RF commands require full operation, so the receiver must be activated by Enable RX or by a  
normal Tag communication for the Check RF command to work properly.  
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Table 5-21. Test External RF Peak Level to RSSI Codes  
RF_IN1 [mVPP  
Decimal Code  
Binary Code  
]
40  
1
60  
2
80  
3
100  
4
140  
5
180  
6
300  
7
001  
010  
011  
001  
101  
011  
111  
5.12.1.15 Receiver Gain Adjust (0x1A)  
This command should be executed when the MCU determines that no TAG response is coming and when  
the RF and receivers are switched ON. When this command is received, the reader observes the digitized  
receiver output. If more than two edges are observed in 100 ms, the window comparator voltage is  
increased. The procedure is repeated until the number of edges (changes of logical state) of the digitized  
reception signal is less than 2 (in 100 ms). The command can reduce the input sensitivity in 5-dB  
increments up to 15 dB. This command ensures better operation in a noisy environment. The gain setting  
is reset to maximum gain at EN = 0 and POR = 1.  
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6 Register Description  
6.1 Register Preset  
After power-up and the EN pin low-to-high transition, the reader is in the default mode. The default  
configuration is ISO15693, single subcarrier, high data rate, 1-out-of-4 operation. The low-level option  
registers (0x02 to 0x0B) are automatically set to adapt the circuitry optimally to the appropriate protocol  
parameters. When entering another protocol (by writing to the ISO Control register 0x01), the low-level  
option registers (0x02 to 0x0B) are automatically configured to the new protocol parameters. After  
selecting the protocol, it is possible to change some low-level register contents if needed. However,  
changing to another protocol and then back, reloads the default settings, and so then the custom settings  
must be reloaded.  
The Clo0 and Clo1 register (0x09) bits, which define the microcontroller frequency available on the  
SYS_CLK pin, are the only two bits in the configuration registers that are not cleared during protocol  
selection.  
6.2 Register Overview  
Table 6-1. Register Definitions  
Address  
Register  
Read/Write  
Main Control Registers  
0x00  
Chip Status Control  
ISO Control  
R/W  
R/W  
0x01  
Protocol Sub-Setting Registers  
0x02  
0x03  
ISO14443B TX options  
ISO14443A high bit rate options  
TX timer setting, H-byte  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
W
0x04  
0x05  
TX timer setting, L-byte  
0x06  
TX pulse-length control  
0x07  
RX no response wait  
0x08  
RX wait time  
0x09  
Modulator and SYS_CLK control  
RX Special Setting  
0x0A  
0x0B  
Regulator and I/O control  
Special Function Register, Preset 0x00  
Special Function Register, Preset 0x00  
Adjustable FIFO IRQ Levels Register  
Reserved  
0x10  
0x11  
0x14  
0x15  
0x16  
NFC Low Field Detection Level  
NFCID1 Number (up to 10 bytes wide)  
NFC Target Detection Level  
NFC Target Protocol  
0x17  
0x18  
R/W  
R/W  
0x19  
Status Registers  
0x0C  
IRQ status  
R
R/W  
R
0x0D  
0x0E  
0x0F  
Collision position and interrupt mask register  
Collision position  
RSSI levels and oscillator status  
R
RAM  
0x12  
0x13  
RAM  
RAM  
R/W  
R/W  
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Table 6-1. Register Definitions (continued)  
Address  
Test Registers  
0x1A  
Register  
Read/Write  
Test Register. Preset 0x00  
Test Register. Preset 0x00  
R/W  
R/W  
0x1B  
FIFO Registers  
0x1C  
FIFO status  
TX length byte1  
TX length byte2  
FIFO I/O register  
R
0x1D  
R/W  
R/W  
R/W  
0x1E  
0x1F  
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6.3 Detailed Register Description  
6.3.1 Main Configuration Registers  
6.3.1.1 Chip Status Control Register (0x00)  
Table 6-2. Chip Status Control Register (0x00)  
Function: Control of Power mode, RF on/off, AGC, AM/PM, Direct Mode  
Default: 0x01, preset at EN = L or POR = H  
Bit  
Name  
Function  
1 = Standby Mode  
0 = Active Mode  
Description  
Standby mode keeps all supply regulators, 13.56-MHz SYS_CLK oscillator  
running. (typical start-up time to full operation 100 µs)  
B7  
stby  
Active Mode (default)  
Provides user direct access to AFE (Direct Mode 0) or allows user to add their  
own framing (Direct Mode 1). Bit 6 of ISO Control register must be set by user  
before entering Direct Mode 0 or 1.  
1 = Direct Mode 0 or 1  
B6  
B5  
B4  
direct  
rf_on  
0 = Direct Mode 2 (default) Uses SPI or parallel communication with automatic framing and ISO decoders  
1 = RF output active  
Transmitter on, receivers on  
Transmitter off  
0 = RF output not active  
TX_OUT (pin 5) = 8-Ω output impedance P = 100 mW (20 dBm) at 5 V, P = 33  
mW (+15 dBm) at 3.3 V  
1 = half output power  
0 = full output power  
rf_pwr  
TX_OUT (pin 5) = 4-Ω output impedance P = 200 mW (+23 dBm) at 5 V, P =  
70 mW(+18 dBm) at 3.3 V  
1 = selects Aux RX input  
0 = selects Main RX input  
1 = AGC on  
RX_IN2 input is used  
B3  
B2  
pm_on  
agc_on  
RX_IN1 input is used  
Enables AGC (AGC gain can be set in register 0x0A)  
AGC block is disabled  
0 = AGC off  
1 = Receiver activated for  
Forced enabling of receiver and TX oscillator. Used for external field  
external field measurement measurement.  
B1  
B0  
rec_on  
vrs5_3  
0 = Automatic Enable  
Allows enable of the receiver by Bit 5 of this register (0x00)  
1 = 5 V operation  
0 = 3 V operation  
Selects the VIN voltage range  
6.3.1.2 ISO Control Register (0x01)  
Table 6-3. ISO Control Register (0x01)  
Function: Controls the selection of ISO Standard protocol, Direct Mode and Receive CRC  
Default: 0x02 (ISO15693 high bit rate, one subcarrier, 1 out of 4); it is preset at EN = L or POR = H  
Bit  
Name  
Function  
Description  
0 = RX CRC (CRC is present in the response)  
1 = no RX CRC (CRC is not present in the response)  
B7  
rx_crc_n  
CRC Receive selection  
0 = Direct Mode 0  
1 = Direct Mode 1  
B6  
B5  
dir_mode  
rfid  
Direct mode type selection  
RFID / Reserved  
0 = RFID Mode 1 = NFC or Card Emulation Mode  
RFID: See Table 6-4 for B0:B4 settings based on ISO protocol desired by  
application  
B4  
iso_4  
RFID / NFC Target  
NFC: 0 = target, 1 = initiator  
B3  
B2  
B1  
B0  
iso_3  
iso_2  
iso_1  
iso_0  
RFID / NFC Mode  
RFID / Card Emulation  
RFID / NFC bit rate  
RFID / NFC bit rate  
NFC : 0 = passive mode, 1 = active mode  
NFC : 0 = NFC Normal Modes, 1 = Card Emulation Mode  
NFC: 0 = bit rate selection or card emulation selection, see Table 6-5  
NFC: 0 = bit rate selection or card emulation selection, see Table 6-5  
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Table 6-4. ISO Control Register ISO_x Settings, RFID Mode  
ISO_4  
ISO_3  
ISO_2  
ISO_1  
ISO_0  
Protocol  
Remarks  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
ISO15693 low bit rate, 6.62 kbps, one subcarrier, 1 out of 4  
ISO15693 low bit rate, 6.62 kbps, one subcarrier, 1 out of 256  
ISO15693 high bit rate, 26.48 kbps, one subcarrier, 1 out of 4  
ISO15693 high bit rate, 26.48 kbps, one subcarrier, 1 out of 256  
ISO15693 low bit rate, 6.67 kbps, double subcarrier, 1 out of 4  
ISO15693 low bit rate, 6.67 kbps, double subcarrier, 1 out of 256  
ISO15693 high bit rate, 26.69 kbps, double subcarrier, 1 out of 4  
Default for reader  
ISO15693 high bit rate, 26.69 kbps, double subcarrier,  
1 out of 256  
0
0
1
1
1
(1)  
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
0
0
1
1
0
0
0
0
1
1
1
1
0
1
0
0
0
0
1
1
0
0
1
1
1
0
1
1
0
1
0
1
0
1
0
1
1
0
0
1
ISO14443A RX bit rate, 106 kbps  
ISO14443A RX high bit rate, 212 kbps  
ISO14443A RX high bit rate, 424 kbps  
ISO14443A RX high bit rate, 848 kbps  
ISO14443B RX bit rate, 106 kbps  
ISO14443B RX high bit rate, 212 kbps  
ISO14443B RX high bit rate, 424 kbps  
ISO14443B RX high bit rate, 848 kbps  
Reserved  
RX bit rate  
(1)  
RX bit rate  
Reserved  
FeliCa 212 kbps  
FeliCa 424 kbps  
(1) For ISO14443A/B, when bit rate of TX is different than RX, settings can be done in register 0x02 or 0x03.  
Table 6-5. ISO Control Register ISO_x Settings,  
NFC Mode (B5 = 1, B2 = 0) or Card Emulation (B5 = 1,  
B2 = 1)  
NFC  
(B5 = 1, B2 = 0)  
Card Emulation  
(B5 = 1, B2 = 1)  
ISO_1  
ISO_0  
0
0
1
1
0
1
0
1
N/A  
ISO14443A  
ISO14443B  
N/A  
106 kbps  
212 kbps  
424 kbps  
N/A  
60  
Register Description  
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6.3.2 Control Registers – Sub Level Configuration Registers  
6.3.2.1 ISO14443B TX Options Register (0x02)  
Table 6-6. ISO14443B TX Options Register (0x02)  
Function: Selects the ISO subsets for ISO14443B – TX  
Default: 0x00 at POR = H or EN = L  
Bit  
B7  
B6  
B5  
Name  
egt2  
egt1  
egt0  
Function  
Description  
TX EGT time select MSB  
TX EGT time select  
Three bit code defines the number of etu (0-7) which separate two characters.  
ISO14443B TX only  
TX EGT time select LSB  
1 = EOF0 length 11 etu  
0 = EOF0 length 10 etu  
B4  
B3  
B2  
eof_l0  
sof_l1  
sof _l0  
1 = SOF1 length 03 etu  
0 = SOF1 length 02 etu  
ISO14443B TX only  
1 = SOF0 length 11 etu  
0 = SOF0 length 10 etu  
1 = EGT after each byte  
0 = EGT after last byte is  
omitted  
B1  
B0  
l_egt  
1 = ISO14443A Layer 4  
compliant (in SAK  
Auto SDD_SAK response)  
0 = not Layer 4 compliant  
(in SAK response)  
for use with Auto SDD configuration, makes B6 in ISO14443A response 1 or 0,  
indicating Layer 4 compliance (or not), for all other cases, this bit is unused  
6.3.2.2 ISO14443A High-Bit-Rate and Parity Options Register (0x03)  
Table 6-7. ISO14443A High-Bit-Rate and Parity Options Register (0x03)  
Function: Selects the ISO subsets for ISO14443A – TX  
Default: 0x00 at POR = H or EN = L, and at each write to ISO Control register  
Bit  
B7  
B6  
Name  
dif_tx_br  
tx_br1  
Function  
Description  
TX bit rate different than RX  
bit rate enable  
Valid for ISO14443A/B high bit rate  
tx_br1 = 0, tx_br = 0 106 kbps  
tx_br1 = 0, tx_br = 1 212 kbps  
tx_br1 = 1, tx_br = 0 424 kbps  
tx_br1 = 1, tx_br = 1 848 kbps  
TX bit rate  
B5  
tx_br0  
1 = parity odd except last  
byte which is even for TX  
B4  
B3  
parity-2tx  
parity-2rx  
For 14443A high bit rate, coding and decoding  
1 = parity odd except last  
byte which is even for RX  
B2  
B1  
B0  
Unused  
Unused  
Unused  
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6.3.2.3 TX Timer High Byte Control Register (0x04)  
Table 6-8. TX Timer High Byte Control Register (0x04)  
Function: For Timings  
Default: 0xC2 at POR = H or EN = L, and at each write to ISO Control register  
Bit  
Name  
Function  
Description  
B7  
tm_st1  
Timer Start Condition  
tm_st1 = 0, tm_st0 = 0 beginning of TX SOF  
tm_st1 = 0, tm_st0 = 1 end of TX SOF  
tm_st1 = 1, tm_st0 = 0 beginning of RX SOF  
tm_st1 = 1, tm_st0 = 1 end of RX SOF  
B6  
tm_st0  
Timer Start Condition  
B5  
B4  
B3  
B2  
B1  
B0  
tm_lengthD  
tm_lengthC  
tm_lengthB  
tm_lengthA  
tm_length9  
tm_length8  
Timer Length MSB  
Timer Length  
Timer Length  
Timer Length  
Timer Length  
Timer Length LSB  
6.3.2.4 TX Timer Low Byte Control Register (0x05)  
Table 6-9. TX Timer Low Byte Control Register (0x05)  
Function: For Timings  
Default: 0x00 at POR = H or EN = L, and at each write to ISO Control register  
Bit  
B7  
B6  
B5  
B4  
B3  
B2  
B1  
B0  
Name  
Function  
Timer Length MSB  
Timer Length  
Description  
tm_length7  
tm_length6  
tm_length5  
tm_length4  
tm_length3  
tm_length2  
tm_length1  
tm_length0  
Defines the time when delayed transmission is started.  
RX wait range is 590 ns to 9.76 ms (1 to 16383)  
Step size is 590 ns  
Timer Length  
Timer Length  
Timer Length  
All bits low = timer disabled (0x00)  
Timer Length  
Timer Length  
Preset 0x00 for all other protocols  
Timer Length LSB  
62  
Register Description  
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6.3.2.5 TX Pulse Length Control Register (0x06)  
The length of the modulation pulse is defined by the protocol selected in the ISO Control register 0x01.  
With a high Q antenna, the modulation pulse is typically prolonged, and the tag detects a longer pulse  
than intended. For such cases, the modulation pulse length can be corrected by using the TX pulse length  
register 0x06. If the register contains all zeros, then the pulse length is governed by the protocol selection.  
If the register contains a value other than 0x00, the pulse length is equal to the value of the register in  
73.7-ns increments. This means the range of adjustment can be 73.7 ns to 18.8 µs.  
Table 6-10. TX Pulse Length Control Register (0x06)  
Function: Controls the length of TX pulse  
Default: 0x00 at POR = H or EN = L and at each write to ISO Control register.  
Bit  
B7  
B6  
B5  
B4  
B3  
B2  
B1  
Name  
Pul_p2  
Pul_p1  
Pul_p0  
Pul_c4  
Pul_c3  
Pul_c2  
Pul_c1  
Function  
Description  
Pulse length MSB  
The pulse range is 73.7 ns to 18.8 µs (1….255), step size 73.7 ns.  
All bits low (00): pulse length control is disabled.  
The following default timings are preset by the ISO Control register (0x01):  
9.44 µs ISO15693 (TI Tag-It HF-I)  
11 µs Reserved  
2.36 µs ISO14443A at 106 kbps  
1.4 µs ISO14443A at 212 kbps  
B0  
Pul_c0  
Pulse length LSB  
737 ns ISO14443A at 424 kbps  
442 ns ISO14443A at 848 kbps; pulse length control disabled  
6.3.2.6 RX No Response Wait Time Register (0x07)  
The RX No Response timer is controlled by the RX NO Response Wait Time Register 0x07. This timer  
measures the time from the start of slot in the anticollision sequence until the start of tag response. If there  
is no tag response in the defined time, an interrupt request is sent and a flag is set in IRQ status control  
register 0x0C. This enables the external controller to be relieved of the task of detecting empty slots. The  
wait time is stored in the register in increments of 37.76 µs. This register is also preset, automatically, for  
every new protocol selection.  
Table 6-11. RX No Response Wait Time Register (0x07)  
Function: Defines the time when "no response" interrupt is sent; only for ISO15693  
Default: 0x0E at POR = H or EN = L and at each write to ISO Control register  
Bit  
B7  
B6  
B5  
B4  
B3  
B2  
B1  
Name  
Function  
Description  
NoResp7  
NoResp6  
NoResp5  
NoResp4  
NoResp3  
NoResp2  
NoResp1  
No response MSB  
Defines the time when "no response" interrupt is sent. It starts from the end of  
TX EOF. RX no response wait range is 37.76 µs to 9628 µs (1 to 255), step  
size is: 37.76 µs.  
The following default timings are preset by the ISO Control register (0x01):  
390 µs Reserved  
529 µs for all protocols supported, but not listed here  
604 µs Reserved  
755 µs ISO15693 high data rate (TI Tag-It HF-I)  
1812 µs ISO15693 low data rate (TI Tag-It HF-I)  
B0  
NoResp0  
No response LSB  
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6.3.2.7 RX Wait Time Register (0x08)  
The RX-wait-time timer is controlled by the value in the RX wait time register 0x08. This timer defines the  
time after the end of the transmit operation in which the receive decoders are not active (held in reset  
state). This prevents incorrect detections resulting from transients following the transmit operation. The  
value of the RX wait time register defines this time in increments of 9.44 µs. This register is preset at  
every write to ISO Control register 0x01 according to the minimum tag response time defined by each  
standard.  
Table 6-12. RX Wait Time Register (0x08)  
Function: Defines the time after TX EOF when the RX input is disregarded for example, to block out electromagnetic disturbance  
generated by the responding card.  
Default: 0x1F at POR = H or EN = L and at each write toISO control register.  
Bit  
B7  
B6  
B5  
B4  
B3  
B2  
B1  
Name  
Rxw7  
Rxw6  
Rxw5  
Rxw4  
Rxw3  
Rxw2  
Rxw1  
Function  
Description  
Defines the time after the TX EOF during which the RX input is ignored. Time  
starts from the end of TX EOF.  
RX wait range is 9.44 µs to 2407 µs (1 to 255), Step size 9.44 µs.  
The following default timings are preset by the ISO Control register (0x01):  
9.44 µs FeliCa  
RX wait time  
66 µs ISO14443A and B  
180 µs Reserved  
B1  
Rxw0  
293 µs ISO15693 (TI Tag-It HF-I)  
64  
Register Description  
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6.3.2.8 Modulator and SYS_CLK Control Register (0x09)  
The frequency of SYS_CLK (pin 27) is programmable by the bits B4 and B5 of this register. The frequency  
of the TRF7970A system clock oscillator is divided by 1, 2 or 4 resulting in available SYS_CLK  
frequencies of 13.56 MHz or 6.78 MHz or 3.39 MHz.  
The ASK modulation depth is controlled by bits B0, B1 and B2. The range of ASK modulation is 7% to  
30% or 100% (OOK). The selection between ASK and OOK (100%) modulation can also be done using  
direct input OOK (pin 12). The direct control of OOK/ASK using OOK pin is only possible if the function is  
enabled by setting B6 = 1 (en_ook_p) in this register (0x09) and the ISO Control Register (0x01, B6 = 1).  
When configured this way, the MOD (pin 14) is used as input for the modulation signal.  
Table 6-13. Modulator and SYS_CLK Control Register (0x09)  
Function: Controls the modulation input and depth, ASK / OOK control and clock output to external system (MCU)  
Default: 0x91 at POR = H or EN = L, and at each write to ISO control register, except Clo1 and Clo0.  
Bit  
Name  
Function  
Description  
B7  
27MHz  
Enables 27.12-MHz crystal  
Default = 1 (enabled)  
Enable ASK/OOK pin (pin 12) for "on the fly change" between any preselected  
ASK modulation as defined by B0 to B2 and OOK modulation:  
1 = Enables external  
selection of ASK or OOK  
modulation  
0 = Default operation as  
defined in B0 to B2 (0x09)  
B6  
B5  
en_ook_p  
If B6 is 1, pin 12 is configured as follows:  
1 = OOK modulation  
0 = Modulation as defined in B0 to B2 (0x09)  
SYS_CLK Output SYS_CLK Output  
Clo1  
Clo0  
(if 13.56-MHz  
(if 27.12-MHz  
crystal is used)  
SYS_CLK output frequency  
MSB  
crystal is used)  
Clo1  
0
0
1
1
0
1
0
1
Disabled  
3.39 MHz  
6.78 MHz  
13.56 MHz  
Disabled  
6.78 MHz  
13.56 MHz  
27.12 MHz  
SYS_CLK output frequency  
LSB  
B4  
B3  
Clo0  
1 = Sets pin 12 (ASK/OOK)  
as an analog output  
0 = Default  
For test and measurement purpose. ASK/OOK pin 12 can be used to monitor  
the analog subcarrier signal before the digitizing with DC level equal to AGND.  
en_ana  
Pm2  
Pm1  
Pm0  
Mod Type and %  
ASK 10%  
B2  
B1  
B0  
Pm2  
Pm1  
Pm0  
Modulation depth MSB  
Modulation depth  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
OOK (100%)  
ASK 7%  
ASK 8.5%  
ASK 13%  
ASK 16%  
Modulation depth LSB  
ASK 22%  
ASK 30%  
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Register Description  
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6.3.2.9 RX Special Setting Register (Address 0x0A)  
Table 6-14. RX Special Setting Register (Address 0x0A)  
Function: Sets the gains and filters directly  
Default: 0x40 at POR = H or EN = L, and at each write to the ISO Control register 0x01. When bits B7, B6, B5 and B4 are all zero, the  
filters are set for ISO14443B (240 kHz to 1.4 MHz).  
Bit  
B7  
B6  
Name  
C212  
C424  
Function  
Description  
Bandpass 110 kHz to 570 kHz  
Bandpass 200 kHz to 900 kHz  
Appropriate for 212-kHz subcarrier system (FeliCa)  
Appropriate for 424-kHz subcarrier used in ISO15693  
Appropriate for Manchester-coded 848-kHz subcarrier used in ISO14443A  
and B  
B5  
M848  
Bandpass 450 kHz to 1.5 MHz  
Bandpass 100 kHz to 1.5 MHz  
Gain reduced for 18 dB  
B4  
B3  
hbt  
Appropriate for highest bit rate (848 kbps) used in high-bit-rate ISO14443  
gd1  
00 = Gain reduction 0 dB  
01 = Gain reduction for 5 dB  
10 = Gain reduction for 10 dB  
11 = Gain reduction for 15 dB  
Sets the RX gain reduction, and reduces sensitivity  
B2  
gd2  
AGC activation level changed from five times the digitizing level to three  
times the digitizing level.  
1 = 3x  
0 = 5x  
B1  
agcr  
AGC activation level change  
AGC action can be done any time during receive process. It is not limited  
to the start of receive ("max hold").  
1 = continuously – no time limit  
B0  
no-lim  
AGC action is not limited in time  
0 = 8 subcarrier pulses  
The first four steps of the AGC control are comparator adjustment. The second three steps are real gain  
reduction done automatically by AGC control. The AGC is turned on after TX.  
The first gain and filtering stage following the RF envelope detector has a nominal gain of 15 and the 3-dB  
band-pass frequencies are adjustable in the range from 100 kHz to 400 kHz for high pass and 600 kHz to  
1.5 MHz for low pass. The next gain and filtering stage has a nominal gain of 8 and the frequency  
characteristic identical to first stage. The filter setting is done automatically with internal preset for each  
new selection of communication standard in ISO Control register (0x01). Additional corrections can be  
done by directly writing into the RX Special Setting register 0x0A.  
The second receiver gain stage and digitizer stage are included in the AGC loop. The AGC loop can be  
activated by setting the bit B2 = 1 (agc-on) in Chip Status Control register 0x00. If activated the AGC  
monitors the signal level at the input of digitizing stage. If the signal level is significantly higher than the  
digitizing threshold level, the gain reduction is activated. The signal level, at which the action is started, is  
by default five times the digitizing threshold level. It can be reduced to three times the digitizing level by  
setting bit B1 = 1 (agcr) in RX Special Setting register (0x0A).  
The AGC action is fast and it typically finishes after four subcarrier pulses. By default the AGC action is  
blocked after first few pulses of subcarrier signal so AGC cannot interfere with signal reception during rest  
of data packet. In certain cases, this is not optimal, so this blocking can be removed by setting B0 = 1  
(no_lim) in RX Special Setting register (0x0A).  
NOTE  
The setting of bits B4, B5, B6 and B7 to zero selects bandpass characteristic of 240 kHz to  
1.4 MHz. This is appropriate for ISO14443B, FeliCa protocol, and ISO14443A higher bit  
rates 212 kbps and 424 kbps.  
66  
Register Description  
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6.3.2.10 Regulator and I/O Control Register (0x0B)  
Table 6-15. Regulator and I/O Control Register (0x0B)  
Function: Control the three voltage regulators  
Default: 0x87 at POR = H or EN = L  
Bit  
Name  
Function  
Description  
0 = Manual settings; see B0  
to B2 in Table 6-16 and  
Table 6-17  
1 = Automatic setting; see  
Table 6-18 and Table 6-19  
Auto system sets VDD_RF = VIN – 250 mV and VDD_A = VIN – 250 mV and  
VDD_X= VIN – 250 mV, but not higher than 3.4 V.  
B7  
auto_reg  
Internal peak detectors are disabled, receiver inputs (RX_IN1 and RX_IN2)  
accept externally demodulated subcarrier. At the same time ASK/OOK pin 12  
becomes modulation output for external TX amplifier.  
Support for external power  
amplifier  
B6  
B5  
en_ext_pa  
io_low  
When B5 = 1, maintains the output driving capabilities of the I/O pins connected  
to the level shifter under low voltage operation. Should be set 1 when VDD_I/O  
voltage is between 1.8 V to 2.7 V.  
1 = enable low peripheral  
communication voltage  
B4  
B3  
B2  
B1  
B0  
Unused  
Unused  
vrs2  
No function  
No function  
Default is 0.  
Default is 0.  
Voltage set MSB voltage  
set LSB  
Vrs3_5 = L: VDD_RF, VDD_A, VDD_X range 2.7 V to 3.4 V; see Table 6-16 through  
Table 6-19  
vrs1  
vrs0  
Table 6-16. Supply-Regulator Setting – Manual 5-V System  
Option Bits Setting in Control Register  
Register  
Action  
B7  
B6  
B5  
B4  
B3  
B2  
B1  
B0  
00  
0B  
0B  
0B  
0B  
0B  
0B  
0B  
0B  
0B  
1
5-V system  
0
0
0
0
0
0
0
0
0
Manual regulator setting  
1
1
1
1
0
0
0
0
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
VDD_RF = 5 V, VDD_A = 3.5 V, VDD_X = 3.4 V  
VDD_RF = 4.9 V, VDD_A = 3.5 V, VDD_X = 3.4 V  
VDD_RF = 4.8 V, VDD_A = 3.5 V, VDD_X = 3.4 V  
VDD_RF = 4.7 V, VDD_A = 3.5 V, VDD_X = 3.4 V  
VDD_RF = 4.6 V, VDD_A = 3.5 V, VDD_X = 3.4 V  
VDD_RF = 4.5 V, VDD_A = 3.5 V, VDD_X = 3.4 V  
VDD_RF = 4.4 V, VDD_A = 3.5 V, VDD_X = 3.4 V  
VDD_RF = 4.3 V, VDD_A = 3.5 V, VDD_X = 3.4 V  
Table 6-17. Supply-Regulator Setting – Manual 3-V System  
Option Bits Setting in Control Register  
Register  
Action  
B7  
B6  
B5  
B4  
B3  
B2  
B1  
B0  
00  
0B  
0B  
0B  
0B  
0B  
0B  
0B  
0B  
0B  
0
3-V system  
0
0
0
0
0
0
0
0
0
Manual regulator setting  
1
1
1
1
0
0
0
0
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
VDD_RF = 3.4 V, VDD_A and VDD_X = 3.4 V  
VDD_RF = 3.3 V, VDD_A and VDD_X = 3.3 V  
VDD_RF = 3.2 V, VDD_A and VDD_X = 3.2 V  
VDD_RF = 3.1 V, VDD_A and VDD_X = 3.1 V  
VDD_RF = 3.0 V, VDD_A and VDD_X = 3.0 V  
VDD_RF = 2.9 V, VDD_A and VDD_X = 2.9 V  
VDD_RF = 2.8 V, VDD_A and VDD_X = 2.8 V  
VDD_RF = 2.7 V, VDD_A and VDD_X = 2.7 V  
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Table 6-18. Supply-Regulator Setting – Automatic 5-V System  
Option Bits Setting in Control Register  
Register  
Action  
B7  
B6  
B5  
B4  
B3  
B2  
B1  
B0  
1
00  
0B  
0B  
0B  
5-V system  
(1)  
1
1
1
x
1
1
0
1
Automatic regulator setting 250-mV difference  
Automatic regulator setting 350-mV difference  
Automatic regulator setting 400-mV difference  
x
x
0
0
(1) x = don't care  
Table 6-19. Supply-Regulator Setting – Automatic 3-V System  
Option Bits Setting in Control Register  
Register  
B7  
Action  
B6  
B5  
B4  
B3  
B2  
B1  
B0  
0
00  
3-V system  
(1)  
0B  
0B  
0B  
1
1
1
x
1
1
0
1
Automatic regulator setting 250-mV difference  
Automatic regulator setting 350-mV difference  
Automatic regulator setting 400-mV difference  
x
x
0
0
(1) x = don't care  
6.3.3 Status Registers  
6.3.3.1 IRQ Status Register (0x0C)  
Table 6-20. IRQ Status Register (0x0C)  
Function: Information available about TRF7970A IRQ and TX/RX status  
Default: 0x00 at POR = H or EN = L, and at each write to the ISO Control Register 0x01. It is also automatically reset at the end of a read  
phase. The reset also removes the IRQ flag.  
Bit  
Name  
Function  
Description  
Signals that TX is in progress. The flag is set at the start of TX but the interrupt  
request (IRQ = 1) is sent when TX is finished.  
B7  
Irq_tx  
IRQ set due to end of TX  
Signals that RX SOF was received and RX is in progress. The flag is set at the  
start of RX but the interrupt request (IRQ = 1) is sent when RX is finished.  
B6  
B5  
B4  
Irg_srx  
Irq_fifo  
Irq_err1  
IRQ set due to RX start  
Signals the FIFO is 1/3 >  
FIFO > 2/3  
Signals FIFO high or low  
Indicates receive CRC error only if B7 (no RX CRC) of ISO Control register is  
set to 0.  
CRC error  
B3  
B2  
Irq_err2  
Irq_err3  
Parity error  
Indicates parity error for ISO14443A  
Indicates framing error  
Byte framing or EOF error  
Collision error for ISO14443A and ISO15693 single subcarrier. Bit is set if more  
then 6 or 7 (as defined in register 0x01) are detected inside one bit period of  
ISO14443A 106 kbps. Collision error bit can also be triggered by external  
noise.  
B1  
B0  
Irq_col  
Collision error  
No response within the "No-response time" defined in RX No-response Wait  
Time register (0x07). Signals the MCU that next slot command can be sent.  
Only for ISO15693.  
Irq_noresp  
No-response timeinterrupt  
To reset (clear) the register 0x0C and the IRQ line, the register must be read. During Transmit the  
decoder is disabled, only bits B5 and B7 can be changed. During Receive only bit B6 can be changed, but  
does not trigger the IRQ line immediately. The IRQ signal is set at the end of Transmit and Receive  
phase.  
68  
Register Description  
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Table 6-21. IRQ Status Register (0x0C) for NFC and Card Emulation Operation  
Function: Information available about TRF7970A IRQ and TX/RX status  
Default: 0x00 at POR = H or EN = L, and at each write to the ISO Control Register 0x01. It is also automatically reset at the end of a read  
phase. The reset also removes the IRQ flag.  
Bit  
Name  
Function  
Description  
Signals that TX is in progress. The flag is set at the start of TX but the interrupt  
request (IRQ = 1) is sent when TX is finished.  
B7  
Irq_tx  
IRQ set due to end of TX  
Signals that RX SOF was received and RX is in progress. The flag is set at the  
start of RX but the interrupt request (IRQ = 1) is sent when RX is finished.  
B6  
B5  
Irg_srx  
Irq_fifo  
IRQ set due to RX start  
Signals the FIFO is 1/3 >  
FIFO > 2/3  
Signals FIFO high or low  
B4  
B3  
B2  
Irq_err1  
Irq_sdd  
Irq_rf  
Protocol error  
Any protocol error  
SDD completed  
RF field change  
SDD (passive target at 106 kbps) successfully finished  
Sufficient RF signal level for operation was reached or lost  
RF collision avoidance  
finished  
The system has finished collision avoidance and the minimum wait time is  
elapsed.  
B1  
B0  
Irq_col  
RF collision avoidance not  
finished successfully  
The external RF field was present so the collision avoidance could not be  
carried out.  
Irq_col_err  
6.3.3.2 Collision Position Register (0x0D) and Interrupt Mask Register (0x0E)  
Table 6-22. Collision Position Register (0x0D) and Interrupt Mask Register (0x0E)  
Default: 0x3E at POR = H and EN = L. Collision bits reset automatically after read operation.  
Bit  
B7  
B6  
B5  
B4  
B3  
Name  
Col9  
Function  
Description  
Bit position of collision MSB Supports ISO14443A  
Bit position of collision  
Col8  
En_irq_fifo  
En_irq_err1  
En_irq_err2  
Interrupt enable for FIFO  
Interrupt enable for CRC  
Interrupt enable for Parity  
Default = 1  
Default = 1  
Default = 1  
Interrupt enable for Framing  
error or EOF  
B2  
B1  
B0  
En_irq_err3  
En_irq_col  
Default = 1  
Default = 1  
Default = 0  
Interrupt enable for collision  
error  
Enables no-response  
interrupt  
En_irq_noresp  
Table 6-23. Collision Position Register (0x0E)  
Function: Displays the bit position of collision or error  
Default: 0x00 at POR = H and EN = L. Automatically reset after read operation.  
Bit  
B7  
B6  
B5  
B4  
B3  
B2  
B1  
B0  
Name  
Col7  
Col6  
Col5  
Col4  
Col3  
Col2  
Col1  
Col0  
Function  
Description  
Bit position of collision MSB  
ISO14443A mainly supported, in the other protocols this register shows the bit  
position of error. Either frame, SOF/EOF, parity or CRC error.  
Bit position of collision LSB  
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6.3.3.3 RSSI Levels and Oscillator Status Register (0x0F)  
Table 6-24. RSSI Levels and Oscillator Status Register (0x0F)  
Function: Displays the signal strength on both reception channels and RF amplitude during RF-off state. The RSSI values are valid from  
reception start till start of next transmission.  
Bit  
Name  
Function  
Description  
B7  
Unused  
Crystal oscillator stable  
indicator  
B6  
osc_ok  
13.56-MHz frequency stable (200 µs)  
MSB RSSI value of auxiliary  
RX (RX_IN2)  
B5  
B4  
B3  
rssi_x2  
rssi_x1  
rssi_x0  
Auxiliary channel is by default RX_IN2. The input can be swapped by B3 = 1  
(Chip State Control register 0x00). If "swapped", the Auxiliary channel is  
connected to RX_IN1 and, hence, the Auxiliary RSSI represents the signal level  
at RX_IN2.  
Auxiliary channel RSSI  
MSB RSSI value of auxiliary  
RX (RX_IN2)  
MSB RSSI value of main  
RX (RX_IN1)  
B2  
B1  
B0  
rssi_2  
rssi_1  
rssi_0  
Active channel is default and can be set with option bit B3 = 0 of chip state  
control register 0x00.  
Main channel RSSI  
LSB RSSI value of main RX  
(RX_IN1)  
RSSI measurement block is measuring the demodulated envelope signal (except in case of direct  
command for RF amplitude measurement described later in direct commands section). The measuring  
system is latching the peak value, so the RSSI level can be read after the end of receive packet. The  
RSSI value is reset during next transmit action of the reader, so the new tag response level can be  
measured. The RSSI levels calculated to the RF_IN1 and RF_IN2 are presented in Section 5.4.1.1 and  
Section 5.4.1.2. The RSSI has 7 steps (3 bits) with 4-dB increment. The input level is the peak to peak  
modulation level of RF signal measured on one side envelope (positive or negative).  
6.3.3.4 Special Functions Register (0x10)  
Table 6-25. Special Functions Register (0x10)  
Function: User configurable options for ISO14443A specific operations  
Bit  
B7  
B6  
Name  
Function  
Description  
Reserved  
Reserved  
Reserved  
Reserved  
Disables parity checking for  
ISO14443A  
B5  
B4  
B3  
B2  
par43  
0 = 18.88 µs  
1 = 37.77 µs  
next_slot_37us  
Sp_dir_mode  
4_bit_RX  
Sets the time grid for next slot command in ISO15693  
Bit stream transmit for  
MIFARE at 106 kbps  
Enables direct mode for transmitting ISO14443A data, bypassing the FIFO and  
feeding the data bit stream directly onto the encoder.  
0 = normal receive  
1 = 4-bit receive  
Enable 4-bit replay for example, ACK, NACK used by some cards; for example,  
MIFARE Ultralight  
0 = anticollision framing  
(0x93, 0x95, 0x97)  
1 = normal framing (no  
broken bytes)  
Disable anticollision frames for 14443A (this bit should be set to 1 after  
anticollision is finished)  
B1  
B0  
14_anticoll  
col_7_6  
0 = 7 subcarrier pulses  
1 = 6 subcarrier pulses  
Selects the number of subcarrier pulses that trigger collision error in the  
14443A - 106 kbps  
70  
Register Description  
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6.3.3.5 Special Functions Register (0x11)  
Table 6-26. Special Functions Register (0x11)  
Function: Indicate IRQ status for RX operations.  
Bit  
B7  
B6  
B5  
B4  
B3  
B2  
B1  
Name  
Function  
Description  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Copy of the RX start signal  
(Bit 6) of the IRQ Status  
Register (0x0C)  
Signals the RX SOF was received and the RX is in progress. IRQ when RX is  
completed.  
B0  
irg_srx  
6.3.3.6 Adjustable FIFO IRQ Levels Register (0x14)  
Table 6-27. Adjustable FIFO IRQ Levels Register (0x14)  
Function: Adjusts level at which FIFO indicates status by IRQ  
Default: 0x00 at POR = H and EN = L  
Bit  
B7  
B6  
B5  
B4  
B3  
Name  
Function  
Description  
Reserved  
Reserved  
Reserved  
Reserved  
Wlh_1  
Reserved  
Reserved  
Reserved  
Reserved  
Wlh_1  
Wlh_0  
IRQ Level  
124  
0
0
1
1
0
1
0
1
FIFO high IRQ level (during  
RX)  
120  
112  
96  
B2  
B1  
B0  
Wlh_0  
Wll_1  
Wll_0  
Wll_1  
Wll_0  
IRQ Level  
0
0
1
1
0
1
0
1
4
8
16  
32  
FIFO low IRQ level (during  
TX)  
6.3.3.7 NFC Low Field Level Register (0x16)  
Table 6-28. NFC Low Field Level Register (0x16)  
Function: Defines level for RF collision avoidance  
Default: 0x00 at POR = H and EN = L.  
Bit  
B7  
B6  
B5  
B4  
B3  
B2  
B1  
B0  
Name  
Clex_dis  
Hash6  
Function  
Description  
Disable clock extractor  
NFC passive 106-kbps and ISO14443A card emulation  
N/A  
N/A  
N/A  
N/A  
Hash5  
Hash4  
Hash3  
Rfdet_I2  
Rfdet_I1  
Rfdet_I0  
RF field level for RF  
collision avoidance  
Comparator output is displayed in B6 of the NFC Target Protocol register  
(0x19)  
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6.3.3.8 NFCID1 Number Register (0x17)  
This register is used to hold the ID of the TRF7970A for use during card emulation and NFC peer-to-peer  
target operations.  
The procedure for writing the ID into register 0x17 is the following:  
1. Write bits 5, 6, and 7 in register 0x18 to enable SDD anticollision (bit 5), and set bit 6 and 7 to select  
the ID length of 4, 7, or 10 bytes.  
2. Write the ID into register 0x17. This should be done using write continuous mode with 4, 7, or 10 bytes  
(according to what was set in register 0x18 bits 6 and 7).  
6.3.3.9 NFC Target Detection Level Register (0x18)  
Table 6-29. NFC Target Detection Level Register (0x18)  
Function: Defines level for RF wake up, enables automatic SDD and gives NFCID size. This register is supplied by Vin to ensure data  
retention during complete power down.  
Default: 0x00 at POR on Vin (not POR based on VDD_X) and not reset at EN = 0  
Bit  
Name  
Function  
Description  
NFCID1 Size  
Id_s1  
Id_s0  
(bytes)  
B7  
Id_s1  
0
0
1
1
0
1
0
1
4
NFCID1 size used in 106-  
kbps passive target SDD  
7
10  
B6  
Id_s0  
Not allowed  
Automatic SDD using internal state machine and ID stored in the NFCID1  
Number register (0x17)  
B5  
B4  
B3  
Sdd_en  
N/A  
Extended range for RF  
measurements  
Hi_rf  
B2  
B1  
B0  
Rfdet_h2  
Rfdet_h1  
Rfdet_h0  
RF field level required for  
system wakeup. If all bits  
are 0, then the RF level  
detection is off.  
Comparator output is displayed in B7 of the NFC Target Protocol register  
(0x19)  
72  
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6.3.3.10 NFC Target Protocol Register (0x19)  
This register is used (when read) to display the bit rate and protocol type when an NFC/RFID  
Initiator/Reader is presented. An example use of this scenario would be when the TRF7970A is placed  
into card emulation (Type A or Type B) and another TRF7970A or NFC device (polling for other NFC  
devices) is presented to the TRF7970A in card emulation mode. The IRQ indicates that a field was  
detected (IRQ Status = 0x04) or that Auto SDD has completed (IRQ Status = 0x08, if configured for  
AutoSDD).  
If Auto SDD is set and 0x04 is returned in IRQ status, then this register can be read out to see which  
commands are coming in for gaining knowledge of the polling cycle sequence. Then, when the correct first  
matching command (that is, REQA or REQB) is issued from Reader or Initiator, if AutoSDD is set, the IRQ  
fires and the IRQ Status is 0x08, indicating completion of the SDD. The next IRQ should return 0x40 as  
status, the Register 0x19 can be checked to make sure it is correct value (that is, 0xC9 for Type A at 106  
kpbs or 0xC5 for Type B at 106 kbps) indicating there are bytes in the FIFO and a read of the FIFO status  
indicates how many bytes to read out. For example, after AutoSDD is completed, there are four bytes in  
the FIFO, and these should be the RATS command coming in from the reader, which the MCU controlling  
the TRF7970A in Card Emulation mode must respond to. If AutoSDD is not set, as another example with  
the TRF7970A in ISO14443B Card Emulation mode, then the field detect happens as previously described  
and IRQs also fire to indicate RX is complete (0x40). This register must be checked and compared against  
case statement structure that is set up for the value of this register to be 0xC5, indicating that an  
ISO14443B command at 106 kbps was issued. When this register (0x19) is 0xC5, then the FIFO Status  
can be read and should hold a value of 0x03, and when read, be the REQB command (0x05, 0x00, 0x00);  
the controlling MCU must respond with the ATQB response. The next steps for either of these examples  
follow the revelent portions of the ISO14443-3 or -4 standards, then the NFC Forum specifications,  
depending on the system use case or application.  
Table 6-30. NFC Target Protocol Register (0x19)  
Function: Displays the bit rate and protocol type (active or passive) transmitted by initiator in first command. It also displays the comparator  
outputs of both RF level detectors.  
Default: 0x00 at POR = H and EN = L. B0 – B4 are automatically reset after MCU read operation. B6 and B7 continuously display the RF  
level comparator outputs.  
Bit  
Name  
Function  
Description  
RF level is above the wake- The wakeup level is defined by bits B0 to B2 in the NFC Target Detection Level  
B7  
Rf_h  
up level setting  
register (0x18)  
RF level is above the RF  
collision avoidance level  
setting  
The collision avoidance level is defined by bits B0 – B2 in the register 0x16  
(NFC Low Field Detection Level)  
B6  
Rf_l  
B5  
B4  
Reserved  
FeliCa  
Reserved  
Reserved  
1 = FeliCa  
0 = ISO14443A  
The first initiator command had physical level coding of FeliCa or ISO14443A  
Passive target at 106 kbps  
or transponder emulation  
B3  
Pas_106  
The first initiator/reader command was SENS_REQ or ALL_REQ  
The first reader command was ISO14443B  
ISO14443B transponder  
emulation  
B2  
B1  
Pas_14443B  
NFCBR1  
00 = Reserved  
01 = 106 kbps  
10 = 212 kbps  
11 = 424 kbps  
Bit rate of first received  
command  
B0  
NFCBR0  
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6.3.4 Test Registers  
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6.3.4.1 Test Register (0x1A)  
Table 6-31. Test Register (0x1A) (for Test or Direct Use)  
Default: 0x00 at POR = H and EN = L.  
Bit  
B7  
B6  
Name  
Function  
Subcarrier Input  
Description  
OOK Pin becomes decoder digital input  
OOK_Subc_In  
MOD_Subc_Out Subcarrier Output  
MOD Pin becomes receiver subcarrier output  
Direct TX modulation and  
RX reset  
B5  
B4  
B3  
MOD_Direct  
o_sel  
MOD Pin becomes receiver subcarrier output  
o_sel = L: Second Stage output used for analog out and digitizing  
o_sel = H: Second Stage output used for analog out and digitizing  
First stage output selection  
Second stage gain -6 dB,  
HP corner frequency/2  
low2  
First stage gain -6 dB, HP  
corner frequency/2  
B2  
B1  
B0  
low1  
zun  
Input followers test  
AGC test, AGC level is  
seen on rssi_210 bits  
Test_AGC  
6.3.4.2 Test Register 0x1B  
Table 6-32. Test Register (0x1B) (for Test or Direct Use)  
Default: 0x00 at POR = H and EN = L. When a test_dec or test_io is set IC is switched to test mode. Test Mode persists until a stop  
condition arrives. At stop condition the test_dec and test_io bits are cleared.  
Bit  
B7  
B6  
B5  
B4  
B3  
B2  
B1  
B0  
Name  
Function  
Description  
test_rf_level  
RF level test  
test_io1  
test_io0  
test_dec  
clock_su  
I/O test  
Not implemented  
Decoder test mode  
Coder clock 13.56 MHz  
For faster test of coders  
74  
Register Description  
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6.3.5 FIFO Control Registers  
6.3.5.1 FIFO Status Register (0x1C)  
Table 6-33. FIFO Status Register (0x1C)  
Function: Number of bytes available to be read from FIFO (= N number of bytes, in hexadecimal)  
Bit  
B7  
B6  
B5  
B4  
B3  
B2  
B1  
B0  
Name  
Foverflow  
Fb6  
Function  
FIFO overflow error  
FIFO bytes fb[6]  
FIFO bytes fb[5]  
FIFO bytes fb[4]  
FIFO bytes fb[3]  
FIFO bytes fb[2]  
FIFO bytes fb[1]  
FIFO bytes fb[0]  
Description  
Bit is set when FIFO has more than 128 bytes presented to it  
Fb5  
Fb4  
Fb3  
Fb2  
Bits B0:B6 indicate how many bytes that are in the FIFO to be read out (= N  
number of bytes, in hex)  
Fb1  
Fb0  
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6.3.5.2 TX Length Byte1 Register (0x1D), TX Length Byte2 Register (0x1E)  
Table 6-34. TX Length Byte1 Register (0x1D)  
Function: High 2 nibbles of complete, intended bytes to be transferred through FIFO  
Register default is set to 0x00 at POR and EN = 0. It is also automatically reset at TX EOF  
Bit  
Name  
Function  
Description  
Number of complete byte  
bn[11]  
B7  
Txl11  
Number of complete byte  
bn[10]  
B6  
B5  
B4  
B3  
B2  
B1  
B0  
Txl10  
Txl9  
Txl8  
Txl7  
Txl6  
Txl5  
Txl4  
High nibble of complete, intended bytes to be transmitted  
Number of complete byte  
bn[9]  
Number of complete byte  
bn[8]  
Number of complete byte  
bn[7]  
Number of complete byte  
bn[6]  
Middle nibble of complete, intended bytes to be transmitted  
Number of complete byte  
bn[5]  
Number of complete byte  
bn[4]  
Table 6-35. TX Length Byte2 Register (0x1E)  
Function: Low nibbles of complete bytes to be transferred through FIFO; Information about a broken byte and number of bits to be  
transferred from it  
Default: 0x00 at POR and EN = 0. It is also automatically reset at TX EOF  
Bit  
Name  
Function  
Description  
Number of complete byte  
bn[3]  
B7  
Txl3  
Number of complete byte  
bn[2]  
B6  
B5  
B4  
B3  
B2  
Txl2  
Txl1  
Txl0  
Bb2  
Bb1  
Low nibble of complete, intended bytes to be transmitted  
Number of complete byte  
bn[1]  
Number of complete byte  
bn[0]  
Broken byte number of bits  
bb[2]  
Broken byte number of bits Number of bits in the last broken byte to be transmitted.  
bb[1]  
It is taken into account only when broken byte flag is set.  
Broken byte number of bits  
bb[0]  
B1  
B0  
Bb0  
Bbf  
Broken byte flag  
B0 = 1, indicates that last byte is not complete 8 bits wide.  
76  
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7 System Design  
7.1 Layout Considerations  
Keep all decoupling capacitors as close to the IC as possible, with the high-frequency decoupling  
capacitors (10 nF) closer than the low-frequency decoupling capacitors (2.2 µF).  
Place ground vias as close as possible to the ground side of the capacitors and reader IC pins to minimize  
possible ground loops.  
It is not recommend to use any inductor sizes below 0603, as the output power can be compromised. If  
smaller inductors are necessary, output performance must be confirmed in the final application.  
Pay close attention to the required load capacitance of the crystal, and adjust the two external shunt  
capacitors accordingly. Follow the recommendations of the crystal manufacturer for those values.  
There should be a common ground plane for the digital and analog sections. The multiple ground sections  
or islands should have vias that tie the different sections of the planes together.  
Ensure that the exposed thermal pad at the center of the reader IC is properly laid out. It should be tied to  
ground to help dissipate any heat from the package.  
All trace line lengths should be made as short as possible, particularly the RF output path, crystal  
connections, and control lines from the reader to the microprocessor. Proper placement of the TRF7970A,  
microprocessor, crystal, and RF connection/connector help facilitate this.  
Avoid crossing of digital lines under RF signal lines. Also, avoid crossing of digital lines with other digital  
lines when possible. If the crossings are unavoidable, 90° crossings should be used to minimize coupling  
of the lines.  
Depending on the production test plan, consider possible implementations of test pads or test vias for use  
during testing. The necessary pads or vias should be placed in accordance with the proposed test plan to  
enable easy access to those test points.  
If the system implementation is complex (for example, if the RFID reader module is a subsystem of a  
greater system with other modules (Bluetooth, WiFi, microprocessors, and clocks), special considerations  
should be taken to ensure that there is no noise coupling into the supply lines. If needed, special filtering  
or regulator considerations should be used to minimize or eliminate noise in these systems.  
For more information/details on layout considerations, see the TRF796x HF-RFID Reader Layout Design  
Guide (SLOA139).  
7.2 Impedance Matching TX_Out (Pin 5) to 50  
The output impedance of the TRF7970A when operated at full power out setting is nominally 4 + j0 (4 Ω  
real). This impedance must be matched to a resonant circuit and TI recommends matching circuit from  
4 to 50 , as commercially available test equipment (for example, spectrum analyzers, power meters,  
and network analyzers) are 50-systems. An impedance-matching reference circuit can be seen in  
Figure 7-1 and Figure 7-2. This section explains how the values were calculated.  
Starting with the 4-source, the process of going from 4 to 50 can be represented on a Smith Chart  
simulator (available from http://www.fritz.dellsperger.net/). The elements are combined where appropriate  
(see Figure 7-1).  
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Figure 7-1. Impedance Matching Circuit  
This yields the Smith Chart Simulation shown in Figure 7-2.  
Figure 7-2. Smith Chart Simulation  
78  
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Resulting power out can be measured with a power meter or spectrum analyzer with power meter function  
or other equipment capable of making a "hot" measurement. Observe maximum power input levels on test  
equipment and use attenuators whenever available to avoid damage to equipment. Expected output  
power levels under various operating conditions are shown in Table 6-2.  
7.3 Reader Antenna Design Guidelines  
For HF antenna design considerations using the TRF7970A, see these documents:  
Antenna Matching for the TRF7960 RFID Reader (SLOA135)  
TRF7960TB HF RFID Reader Module User's Guide (SLOU297)  
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8 Revision History  
Revision  
Comments  
SLOS743  
Initial release  
SLOS743A  
Changed Figure 4-1, Figure 4-2, and Figure 5-17.  
Changed Section 5.9.6, Step 5 and Step 6, including adding figures.  
Changed Table 6-6, Table 6-13, and Table 6-33.  
Added paragraph for NFC Target Protocol Register (0x19) to cover use with two examples.  
SLOS743B  
Section 5.9.1.4, Fixed typo.  
Section 6.3.3.1, Changed bit B5.  
Section 6.3.1.1, Changed bit B3.  
Section 6.3.5.2, Changed high, middle, low nibble descriptions.  
80  
Revision History  
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PACKAGE OPTION ADDENDUM  
www.ti.com  
17-Mar-2012  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
TRF7970ARHBR  
TRF7970ARHBT  
TRF7970ATB  
ACTIVE  
ACTIVE  
ACTIVE  
QFN  
QFN  
RHB  
RHB  
32  
32  
0
3000  
250  
1
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-2-260C-1 YEAR  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-2-260C-1 YEAR  
TBD  
Call TI  
Call TI  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
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Addendum-Page 1  
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