TRS202IDWG4 [TI]
5-V DUAL RS-232 LINE DRIVER/RECEIVER WITH 【15-kV ESD PROTECTION; 5 - V双RS - 232线路驱动器/接收器，具有± 15 kV ESD保护
| 型号： | TRS202IDWG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 5-V DUAL RS-232 LINE DRIVER/RECEIVER WITH 【15-kV ESD PROTECTION |
| 文件： | 总17页 (文件大小：638K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TRS202
5-V DUAL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS808–JULY 2007
FEATURES
•
ESD Protection for RS-232 Bus Pins
±15-kV Human-Body Model (HBM)
D, DW, N, OR PW PACKAGE
(TOP VIEW)
–
•
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
1
2
3
4
5
6
7
8
C1+
V+
VCC
15 GND
16
•
•
•
•
Operates at 5-V VCC Supply
Operates up to 120 kbit/s
14
13
12
11
10
9
C1-
DOUT1
RIN1
C2+
C2-
External Capacitors . . . 4 × 0.1 μF
ROUT1
DIN1
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
V-
DOUT2
RIN2
DIN2
ROUT2
APPLICATIONS
•
•
•
•
•
•
Battery-Powered Systems
PDAs
Notebooks
Laptops
Palmtop PCs
Hand-Held Equipment
DESCRIPTION/ORDERING INFORMATION
The TRS202 device consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV
ESD protection pin-to-pin (serial-port connection pins, including GND). The device meets the requirements of
TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the
serial-port connector. The charge pump and four small external capacitors allow operation from a single 5-V
supply. The device operates at data signaling rates up to 120 kbit/s and a maximum of 30-V/μs driver output
slew rate.
ORDERING INFORMATION
TA
PACKAGE(1)(2)
ORDERABLE PART NUMBER
TRS202CN
TOP-SIDE MARKING
PREVIEW
PDIP – N
SOIC – D
Tube of 25
Tube of 40
Reel of 2500
Tube of 40
Reel of 2000
Tube of 90
Reel of 2000
Tube of 25
Tube of 40
Reel of 2500
Tube of 40
Reel of 2000
Tube of 90
Reel of 2000
TRS202CD
TRS202C
TRS202C
TRS202CDR
TRS202CDW
TRS202CDWR
TRS202CPW
TRS202CPWR
TRS202IN
0°C to 70°C
SOIC – DW
TSSOP – PW
PDIP – N
RU02C
PREVIEW
TRS202I
TRS202ID
SOIC – D
TRS202IDR
–40°C to 85°C
TRS202IDW
SOIC – DW
TRS202I
RU02I
TRS202IDWR
TRS202IPW
TSSOP – PW
TRS202IPWR
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
UNLESS OTHERWISE NOTED this document contains
Copyright © 2007, Texas Instruments Incorporated
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TRS202
5-V DUAL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS808–JULY 2007
FUNCTION TABLES
xxx
Each Driver(1)
INPUT
DIN
OUTPUT
DOUT
L
H
L
H
(1) H = high level, L = low level
Each Receiver(1)
INPUT
RIN
OUTPUT
ROUT
L
H
H
L
Open
H
(1) H = high level, L = low level,
Open = input disconnected or
connected driver off
LOGIC DIAGRAM (POSITIVE LOGIC)
11
10
12
9
14
DIN1
DIN2
DOUT1
DOUT2
RIN1
7
13
8
ROUT1
ROUT2
RIN2
2
Submit Documentation Feedback
TRS202
5-V DUAL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS808–JULY 2007
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.3
MAX
UNIT
VCC
V+
Supply voltage range(2)
Positive charge pump voltage range(2)
Negative charge pump voltage range(2)
6
14
V
V
V
VCC – 0.3
–14
V–
0.3
Drivers
–0.3
V+ + 0.3
±30
VI
Input voltage range
V
V
Receivers
Drivers
V– – 0.3
–0.3
V+ + 0.3
VCC + 0.3
Continuous
73
VO
Output voltage range
Short-circuit duration
Receivers
DOUT
DOUT
D package
DW package
N package
PW package
57
θJA
Package thermal impedance(3)(4)
°C/W
67
108
TJ
Operating virtual junction temperature
Storage temperature range
150
°C
°C
Tstg
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network GND.
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions(1)
See Figure 4
MIN
4.5
2
NOM
MAX UNIT
Supply voltage
5
5.5
V
V
V
VIH
VIL
Driver high-level input voltage
Driver low-level input voltage
Driver input voltage
DIN
DIN
DIN
0.8
5.5
30
70
85
0
–30
0
VI
V
Receiver input voltage
TRS202C
TRS202I
TA
Operating free-air temperature
°C
–40
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
Supply current
TEST CONDITIONS
No load, VCC = 5 V
MIN
TYP(2)
MAX
UNIT
ICC
8
15
mA
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 5 V, and TA = 25°C.
3
Submit Documentation Feedback
TRS202
5-V DUAL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS808–JULY 2007
DRIVER SECTION
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
TEST CONDITIONS
MIN TYP(2)
MAX UNIT
DOUT at RL = 3 kΩ to
GND,
VOH
VOL
High-level output voltage
DIN = GND
DIN = VCC
5
9
V
DOUT at RL = 3 kΩ to
GND,
Low-level output voltage
–5
–9
V
IIH
IIL
High-level input current
Low-level input current
Short-circuit output current
Output resistance
VI = VCC
15
–15
±10
200
–200
±60
μA
μA
mA
Ω
VI at 0 V
(3)
IOS
ro
VCC = 5.5 V,
VCC, V+, and V– = 0 V,
VO = 0 V
VO = ±2 V
300
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 5 V, and TA = 25°C.
(3) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
TEST CONDITIONS
MIN TYP(2)
MAX UNIT
CL = 50 to 1000 pF,
One DOUT switching,
RL = 3 kΩ to 7 kΩ,
See Figure 1
Maximum data rate
120
kbit/s
Propagation delay time,
low- to high-level output
CL = 2500 pF,
All drivers loaded,
RL = 3 kΩ,
See Figure 1
tPLH(D)
tPHL(D)
tsk(p)
2
2
μs
μs
ns
Propagation delay time,
high- to low-level output
CL = 2500 pF,
All drivers loaded,
RL = 3 kΩ,
See Figure 1
CL = 150 pF to 2500 pF,
See Figure 2
RL = 3 kΩ to 7 kΩ,
RL = 3 kΩ to 7 kΩ,
Pulse skew(3)
300
Slew rate, transition region
(see Figure 1)
CL = 50 pF to 1000 pF,
VCC = 5 V
SR(tr)
3
6
30
V/μs
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
ESD Protection
PIN
TEST CONDITIONS
TYP
UNIT
DOUT, RIN
Human-Body Model (HBM)
±15
kV
4
Submit Documentation Feedback
TRS202
5-V DUAL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS808–JULY 2007
RECEIVER SECTION
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
TEST CONDITIONS
IOH = –1 mA
MIN
3.5 VCC – 0.4
TYP(2)
MAX UNIT
VOH
VOL
VIT+
VIT–
Vhys
rI
High-level output voltage
V
Low-level output voltage
IOL = 1.6 mA
VCC = 5 V,
VCC = 5 V,
0.4
2.4
V
V
Positive-going input threshold voltage
Negative-going input threshold voltage
TA = 25°C
TA = 25°C
1.7
0.8
0.2
3
1.2
0.5
5
V
Input hysteresis (VIT+ – VIT–
)
1
7
V
Input resistance
VI = ±3 V to ±25 V
kΩ
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 5 V and TA = 25°C.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 3)
PARAMETER
TEST CONDITIONS
CL = 150 pF
MIN
TYP(2)
0.5
MAX
10
UNIT
μs
tPLH(R)
tPHL(R)
tsk(p)
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
Pulse skew(3)
CL = 150 pF
0.5
10
μs
300
ns
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 5 V and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
5
Submit Documentation Feedback
TRS202
5-V DUAL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS808–JULY 2007
PARAMETER MEASUREMENT INFORMATION
3 V
0 V
tPLH (D)
VOH
VOL
Input
1.5 V
1.5 V
RS-232
Output
Generator
50 W
(see Note B)
tPHL (D)
CL
(see Note A)
RL
3 V
-3 V
3 V
-3 V
Output
TEST CIRCUIT
VOLTAGE WAVEFORMS
6V
tPHL(D) or tPLH(D)
SR(tf) =
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 120 kbit/s, ZO = 50 W, 50% duty cycle, tr £ 10 ns, tf £ 10 ns.
Figure 1. Driver Slew Rate
3 V
RS-232
Output
1.5 V
1.5 V
Input
0 V
tPLH (D)
Generator
50 W
(see Note B)
CL
(see Note A)
tPHL (D)
RL
VOH
VOL
50%
50%
Output
TEST CIRCUIT
NOTES: A. CL includes probe and jig capacitance.
VOLTAGE WAVEFORMS
B. The pulse generator has the following characteristics: PRR = 120 kbit/s, ZO = 50 W, 50% duty cycle, tr £ 10 ns, tf £ 10 ns.
Figure 2. Driver Pulse Skew
3 V
Input
1.5 V
1.5 V
-3 V
Output
Generator
50 W
(see Note B)
tPHL (R)
tPLH (R)
CL
(see Note A)
VOH
VOL
50%
50%
Output
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 W, 50% duty cycle, tr £ 10 ns, tf £ 10 ns.
Figure 3. Receiver Propagation Delay Times
6
Submit Documentation Feedback
TRS202
5-V DUAL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS808–JULY 2007
APPLICATION INFORMATION
1
2
3
4
16
15
VCC
C1+
V+
+
-
CBYPASS
= 0.1 mF,
C1
0.1 mF,
6.3 V
+
-
C3†
0.1 mF
16 V
GND
+
-
14
13
C1-
C2+
C2-
DOUT1
RIN1
5 kW
C2
+
-
0.1 mF,
16 V
5
6
7
12
11
ROUT1
DIN1
V-
C4
-
0.1 mF,
16 V
+
10
9
DOUT2
DIN2
8
RIN2
ROUT2
5 kW
†
C3 can be connected to VCC or GND.
NOTES: A . Resistor values shown are nominal.
B . Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be
connected as shown.
Figure 4. Typical Operating Circuit and Capacitor Values
Capacitor Selection
The capacitor type used for C1–C4 is not critical for proper operation. The TRS202 requires 0.1-μF capacitors,
although capacitors up to 10 μF can be used without harm. Ceramic dielectrics are suggested for the 0.1-μF
capacitors. When using the minimum recommended capacitor values, make sure the capacitance value does
not degrade excessively as the operating temperature varies. If in doubt, use capacitors with a larger (e.g., 2×)
nominal value. The capacitors' effective series resistance (ESR), which usually rises at low temperatures,
influences the amount of ripple on V+ and V–.
Use larger capacitors (up to 10 μF) to reduce the output impedance at V+ and V–.
Bypass VCC to ground with at least 0.1 μF. In applications sensitive to power-supply noise generated by the
charge pumps, decouple VCC to ground with a capacitor the same size as (or larger than) the charge-pump
capacitors (C1–C4).
Electrostatic Discharge (ESD) Protection
TI TRS202 devices have standard ESD protection structures incorporated on the pins to protect against
electrostatic discharges encountered during assembly and handling. In addition, the RS232 bus pins (driver
outputs and receiver inputs) of these devices have an extra level of ESD protection. Advanced ESD structures
were designed to successfully protect these bus pins against ESD discharge of ±15 kV when powered down.
7
Submit Documentation Feedback
TRS202
5-V DUAL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS808–JULY 2007
APPLICATION INFORMATION (continued)
ESD Test Conditions
Stringent ESD testing is performed by TI, based on various conditions and procedures. Please contact TI for a
reliability report that documents test setup, methodology, and results.
Human-Body Model (HBM)
The HBM of ESD testing is shown in Figure 5. Figure 6 shows the current waveform that is generated during a
discharge into a low impedance. The model consists of a 100-pF capacitor, charged to the ESD voltage of
concern, and subsequently discharged into the device under test (DUT) through a 1.5-kΩ resistor.
RD
1.5 kW
CS
+
DUT
VHBM
-
100 pF
Figure 5. HBM ESD Test Circuit
1.5
VHBM = 2 kV
DUT = 10-V, 1-W Zener Diode
|
1.0
0.5
0.0
0
50
100
150
200
Time - ns
Figure 6. Typical HBM Current Waveform
Machine Model (MM)
The MM ESD test applies to all pins using a 200-pF capacitor with no discharge resistance. The purpose of the
MM test is to simulate possible ESD conditions that can occur during the handling and assembly processes of
manufacturing. In this case, ESD protection is required for all pins, not just RS-232 pins. However, after PC
board assembly, the MM test no longer is as pertinent to the RS-232 pins.
8
Submit Documentation Feedback
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2007
PACKAGING INFORMATION
Orderable Device
TRS202CD
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRS202CDG4
TRS202CDR
SOIC
SOIC
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRS202CDRG4
TRS202CDW
TRS202CDWG4
TRS202CDWR
TRS202CDWRG4
TRS202CPW
TRS202CPWG4
TRS202CPWR
TRS202CPWRG4
TRS202ID
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
DW
DW
DW
DW
PW
PW
PW
PW
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
SOIC
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRS202IDG4
TRS202IDR
SOIC
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRS202IDRG4
TRS202IDW
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
DW
DW
DW
DW
PW
PW
PW
PW
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRS202IDWG4
TRS202IDWR
TRS202IDWRG4
TRS202IPW
SOIC
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRS202IPWG4
TRS202IPWR
TRS202IPWRG4
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2007
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
TRS202CDR
TRS202CDWR
TRS202CPWR
TRS202IDR
SOIC
SOIC
D
16
16
16
16
16
16
2500
2000
2000
2500
2000
2000
330.0
330.0
330.0
330.0
330.0
330.0
16.4
16.4
12.4
16.4
16.4
12.4
6.5
10.75
7.0
10.3
10.7
5.6
2.1
2.7
1.6
2.1
2.7
1.6
8.0
12.0
8.0
16.0
16.0
12.0
16.0
16.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
DW
PW
D
TSSOP
SOIC
6.5
10.3
10.7
5.6
8.0
TRS202IDWR
TRS202IPWR
SOIC
DW
PW
10.75
7.0
12.0
8.0
TSSOP
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TRS202CDR
TRS202CDWR
TRS202CPWR
TRS202IDR
SOIC
SOIC
D
16
16
16
16
16
16
2500
2000
2000
2500
2000
2000
333.2
346.0
346.0
333.2
346.0
346.0
345.9
346.0
346.0
345.9
346.0
346.0
28.6
33.0
29.0
28.6
33.0
29.0
DW
PW
D
TSSOP
SOIC
TRS202IDWR
TRS202IPWR
SOIC
DW
PW
TSSOP
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
Logic
Military
Power Mgmt
Microcontrollers
RFID
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
RF/IF and ZigBee® Solutions www.ti.com/lprf
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明