TS3L4892 [TI]
16-BIT TO 8-BIT SPDT GIGABIT LAN SWITCH WITH LED SWITCH; 16位到8位SPDT千兆网卡，带LED开关开关
| 型号： | TS3L4892 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 16-BIT TO 8-BIT SPDT GIGABIT LAN SWITCH WITH LED SWITCH |
| 文件： | 总18页 (文件大小：620K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TS3L4892
16-BIT TO 8-BIT SPDT GIGABIT LAN SWITCH
WITH LED SWITCH
www.ti.com
SCDS251–MARCH 2008
1
FEATURES
RHH PACKAGE
(TOP VIEW)
•
Wide Bandwidth (BW = 1100 MHz Typ)
Low Crosstalk (XTALK = –37 dB Typ)
Low Bit-to-Bit Skew (tsk(o) = 100 ps Max)
•
•
•
Low and Flat ON-State Resistance
(rON = 4 Ω Typ, rON(flat) = 0.5 Ω Typ)
1
2
3
4
5
6
7
8
9
27
A1
A2
A3
SEL
26 2B
•
•
Low Input/Output Capacitance
(CON = 8 pF Typ)
1
1
2
2
1
1
2
2
25
3B
LED
24
2B
0
0LED
23
3B
1
Rail-to-Rail Switching on Data I/O Ports
(0 to 5 V)
0LED
22
4B
2
21
A4
A5
A6
5B
20
4B
•
•
VCC Operating Range From 3 V to 3.6 V
19
5B
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
•
ESD Performance Tested Per JESD 22
–
2000-V Human-Body Model
(A114-B, Class II)
PIN DESCRIPTION
–
1000-V Charged-Device Model (C101)
NAME
An
DESCRIPTION
Data I/O
Data I/O
APPLICATIONS
nBm
•
•
•
•
10/100/1000 Base-T Signal Switching
Differential (LVDS, LVPECL) Signal Switching
Audio/Video Switching
SEL
Select input
LED I/O port
LED I/O port
LEDx
XLEDm
Hub and Router Signal Switching
DESCRIPTION/ORDERING INFORMATION
The TS3L4892 is a 16-bit to 8-bit multiplexer/demultiplexer LAN switch with a single select (SEL) input. SEL
controls the data path of the multiplexer/demultiplexer. The device provides additional I/Os for switching status
indicating LED signals.
The device provides a low and flat ON-state resistance (rON) and an excellent ON-state resistance match. Low
input/output capacitance, high bandwidth, low skew, and low crosstalk among channels make this device suitable
for various LAN applications, such as 10/100/1000 Base-T.
This device can be used to replace mechanical relays in LAN applications. It also can be used to route signals
from a 10/100 Base-T ethernet transceiver to the RJ-45 LAN connectors in laptops or in docking stations.
ORDERING INFORMATION
TA
PACKAGE(1)(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
TK4892
–40°C to 85°C
QFN – RHH
Tape and reel
TS3L4892RHHR
(1) Package drawings, standard packing quantities, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
FUNCTION TABLE
INPUT
SEL
INPUT/OUTPUT
An
FUNCTION
L
nB1
nB2
An = nB1, LEDx = XLED1
An = nB2, LEDx = XLED2
H
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
TS3L4892
16-BIT TO 8-BIT SPDT GIGABIT LAN SWITCH
WITH LED SWITCH
www.ti.com
SCDS251–MARCH 2008
LOGIC DIAGRAM (POSITIVE LOGIC)
31
30
29
28
36
0B
1B
0B
1B
A
1
1
2
2
0
1
1
A
2
3
26
25
24
23
2B
3B
2B
3B
A
A
1
1
2
2
2
3
7
8
22
21
20
19
4B
5B
4B
5B
A
A
1
1
2
2
4
5
9
18
17
16
15
6B
7B
6B
7B
A
A
1
1
2
2
6
10
7
4
5
6
0LED
LED
LED
LED
1
0
1
2
0LED
2
12
13
14
1LED
1
1LED
2
33
32
34
2LED
1
2LED
2
27
SEL
2
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TS3L4892
16-BIT TO 8-BIT SPDT GIGABIT LAN SWITCH
WITH LED SWITCH
www.ti.com
SCDS251–MARCH 2008
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.5
–0.5
–0.5
MAX UNIT
VCC
VIN
VI/O
IIK
Supply voltage range
4.6
7
V
Control input voltage range(2)(3)
Switch I/O voltage range(2)(3)(4)
Control input clamp current
I/O port clamp current
V
7
V
VIN < 0
VI/O < 0
–50
–50
±128
±100
mA
mA
mA
mA
II/OK
II/O
ON-state switch current(5)
Continuous current through VDD or GND
Package thermal impedance(6)
Storage temperature range
θJA
31.8 °C/W
150 °C
Tstg
–65
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to ground, unless otherwise specified.
(3) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(4) VI and VO are used to denote specific conditions for VI/O
(5) II and IO are used to denote specific conditions for II/O
.
.
(6) The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS(1)
MIN
3
MAX UNIT
VCC
VIH
VIL
VI
Supply voltage
3.6
5.5
0.8
5.5
VCC
85
V
V
High-level control input voltage (SEL)
Low-level control input voltage (SEL)
Input voltage (SEL)
2
0
V
0
V
VI/O
TA
Input/output voltage
0
V
Operating free-air temperature
–40
°C
(1) All unused control inputs of the device must be held at VDD or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
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16-BIT TO 8-BIT SPDT GIGABIT LAN SWITCH
WITH LED SWITCH
www.ti.com
SCDS251–MARCH 2008
ELECTRICAL CHARACTERISTICS
for 1000 Base-T Ethernet switching over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V
(unless otherwise noted)
PARAMETER
SEL
TEST CONDITIONS(1)
IIN = –18 mA
MIN TYP(2) MAX UNIT
VIK
IIH
VCC = 3.6 V,
VCC = 3.6 V,
VCC = 3.6 V,
VCC = 3.6 V,
f = 1 M Hz,
VI = 0,
–0.7 –1.2
±1
V
µA
µA
µA
pF
pF
pF
Ω
SEL
VIN = VCC
VIN = GND
II/O = 0,
IIL
SEL
±1
ICC
CIN
Switch ON or OFF
250 500
SEL
VIN = 0
2
2.5
8
2.5
4
COFF
CON
B port
f = 1 MHz,
f = 1 MHz,
1.5 V ≤ VI ≤ VCC
Outputs open,
Outputs open,
IO = –40 mA
IO = –40 mA
IO = –40 mA
Switch OFF
Switch ON
VI = 0,
9
rON
VCC = 3 V,
VCC = 3 V,
VCC = 3 V,
,
4
6
(3)
rON(flat)
VI = 1.5 V and VCC
,
0.5
0.4
Ω
(4)
ΔrON
1.5 V ≤ VI ≤ VCC
,
1
Ω
(1) VI, VO, II, and IO refer to I/O pins. VIN refers to the control inputs.
(2) All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
(3) rON(flat) is the difference of rON in a given channel at specified voltages.
(4) ΔrON is the difference of rON from center (A4, A5) ports to any other port.
ELECTRICAL CHARACTERISTICS
for 10/100 Base-T Ethernet switching over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V
(unless otherwise noted)
PARAMETER
TEST CONDITIONS(1)
MIN
TYP(2)
MAX UNIT
VIK
SEL
SEL
SEL
VCC = 3.6 V,
VCC = 3.6 V,
VCC = 3.6 V,
VCC = 3.6 V,
f = 1 MHz,
VI = 0,
IIN = –18 mA
VIN = VCC
–0.7
–1.2
±1
V
µA
µA
µA
pF
pF
pF
Ω
IIH
IIL
VIN = GND
II/O = 0,
±1
ICC
Switch ON or OFF
250
2
500
2.5
4
CIN
SEL
VIN = 0
COFF
CON
rON
B port
f = 1 MHz,
f = 1 MHz,
1.25 V ≤ VI ≤ VCC
Outputs open,
Switch OFF
Switch ON
2.5
8
VI = 0,
Outputs open,
VCC = 3 V,
VCC = 3 V,
VCC = 3 V,
,
IO = –10 mA to –30 mA
IO = –10 mA to –30 mA
IO = –10 mA to –30 mA
4
6
1
(3)
rON(flat)
VI = 1.25 V and VCC
,
0.5
0.4
Ω
(4)
ΔrON
1.25 V ≤ VI ≤ VCC
,
Ω
(1) VI, VO, II, and IO refer to I/O pins. VIN refers to the control inputs.
(2) All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
(3) rON(flat) is the difference of rON in a given channel at specified voltages.
(4) ΔrON is the difference of rON from center (A4, A5) ports to any other port.
4
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16-BIT TO 8-BIT SPDT GIGABIT LAN SWITCH
WITH LED SWITCH
www.ti.com
SCDS251–MARCH 2008
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V, RL = 200 Ω, CL = 10 pF
(unless otherwise noted) (see Figures 4 and 5)
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
MIN
TYP(1)
MAX
UNIT
(2)
tpd
A or B
SEL
B or A
A or B
A or B
B or A
40
ps
ns
ns
ps
ps
tPZH, tPZL
0.5
0.9
15
9
tPHZ, tPLZ
SEL
(3)
tsk(o)
A or B
50
50
100
150
(4)
tsk(p)
(1) All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
(2) The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load
capacitance when driven by an ideal voltage source (zero output impedance).
(3) Output skew between center port (A4 to A5) to any other port
(4) Skew between opposite transitions of the same output in a given device |tPHL – tPLH
|
DYNAMIC CHARACTERISTICS
over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted)
PARAMETER
XTALK
TEST CONDITIONS
f = 250 MHz,
TYP(1) UNIT
RL = 100 Ω,
RL = 100 Ω,
RL = 100 Ω,
See Figure 8
See Figure 9
–37
–37
dB
dB
OIRR
f = 250 MHz,
See Figure 7
BW
1100
MHz
(1) All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
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16-BIT TO 8-BIT SPDT GIGABIT LAN SWITCH
WITH LED SWITCH
www.ti.com
SCDS251–MARCH 2008
OPERATING CHARACTERISTICS
0
−2
0
−20
−4
−40
−6
−60
−8
−80
−10
−12
−100
1000
10,000
1
0.1
10
Frequency (MHz)
Figure 2. OFF Isolation vs Frequency
100
0.1
1
10
Frequency (MHz)
Figure 1. Gain vs Frequency
100
1000
10,000
6
5
4
3
2
1
0
0
−20
−40
−60
−80
−100
0
1
2
3
4
5
6
1000
10,000
1
0.1
10
Frequency (MHz)
Figure 3. Crosstalk vs Frequency
100
V
(V)
COM
Figure 4. rON (Ω) vs Vcom (V)
6
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TS3L4892
16-BIT TO 8-BIT SPDT GIGABIT LAN SWITCH
WITH LED SWITCH
www.ti.com
SCDS251–MARCH 2008
PARAMETER MEASUREMENT INFORMATION
(Enable and Disable Times)
V
CC
Input Generator
V
IN
50 Ω
50 Ω
V
G1
TEST CIRCUIT
DUT
2 × V
CC
Input Generator
50 Ω
S1
Open
GND
R
L
V
V
O
I
C
L
50 Ω
V
G2
R
L
(see Note A)
S1
2 × V
V
I
V
∆
C
R
V
TEST
L
L
CC
t
/t
3.3 V ± 0.3 V
3.3 V ± 0.3 V
200 Ω
200 Ω
GND
10 pF
10 pF
0.3 V
0.3 V
PLZ PZL
CC
t
/t
GND
V
CC
PHZ PZH
2.5 V
0 V
Output Control
1.25 V
1.25 V
(V
IN
)
V
IN
t
t
PLZ
PZL
Output
V
V
OH
Waveform 1
V
/2
/2
CC
V
O
S1 at 2 y V
CC
V
V
+ 0.3 V
OL
OL
(see Note B)
t
t
PHZ
PZH
Output
Waveform 2
S1 at GND
V
V
OH
− 0.3 V
OH
V
O
V
CC
OL
(see Note B)
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. C includes probe and jig capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω, t ≤ 2.5 ns, t ≤ 2.5 ns.
O
r
f
D. The outputs are measured one at a time, with one transition per measurement.
E.
F.
t
t
and t
and t
are the same as t
.
dis
.
PLZ
PZL
PHZ
PZH
are the same as t
en
Figure 5. Test Circuit and Voltage Waveforms
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16-BIT TO 8-BIT SPDT GIGABIT LAN SWITCH
WITH LED SWITCH
www.ti.com
SCDS251–MARCH 2008
PARAMETER MEASUREMENT INFORMATION
(Skew)
V
CC
Input Generator
V
IN
50 Ω
50 Ω
V
G1
TEST CIRCUIT
DUT
2 × V
CC
Input Generator
50 Ω
S1
Open
R
L
V
V
O
I
GND
C
L
50 Ω
V
G2
R
L
(see Note A)
S1
V
in
C
L
R
L
V
CC
TEST
t
3.3 V ± 0.3 V
3.3 V ± 0.3 V
Open
200 Ω
200 Ω
V
V
or GND
or GND
10 pF
10 pF
sk(o)
CC
t
Open
sk(p)
CC
3.5 V
Data In at
Ax or Ay
V
I
2.5 V
1.5 V
t
t
PHLx
PLHx
V
OH
Data Out at
XB or XB
V
O
O
(V + V )/2
OH
OL
3.5 V
2.5 V
1.5 V
1
2
V
OL
Input
t
t
sk(o)
sk(o)
V
OH
V
Data Out at
YB or YB
t
t
PHL
PLH
(V + V )/2
OH
OL
1
2
V
OH
V
OL
Output
(V + V )/2
OH
OL
t
t
PLHy
PHLy
V
OL
t
= |t
− t
|
sk(p)
PHL
PLH
t
= |t
− t
PLHx
| or |t
− t
PHLx
|
sk(o)
PLHy
PHLy
VOLTAGE WAVEFORMS
OUTPUT SKEW (t
VOLTAGE WAVEFORMS
PULSE SKEW [t
)
]
sk(p)
sk(o)
NOTES: A. C includes probe and jig capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω, t ≤ 2.5 ns, t ≤ 2.5 ns.
O
r
f
D. The outputs are measured one at a time, with one transition per measurement.
Figure 6. Test Circuit and Voltage Waveforms
8
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16-BIT TO 8-BIT SPDT GIGABIT LAN SWITCH
WITH LED SWITCH
www.ti.com
SCDS251–MARCH 2008
PARAMETER MEASUREMENT INFORMATION
EXT TRIGGER
BIAS
Network Analyzer
(HP8753ES)
V
BIAS
P1
P2
V
CC
A
0
0B
1
C
L
= 10 pF
(see Note A)
DUT
SEL
V
SEL
A. CL includes probe and jig capacitance.
Figure 7. Test Circuit for Frequency Response (BW)
Frequency response is measured at the output of the ON channel. For example, when VSEL = 0 and A0 is the
input, the output is measured at 0B1. All unused analog I/O ports are left open.
HP8753ES Setup
Average = 4
RBW = 3 kHz
VBIAS = 0.35 V
ST = 2 s
P1 = 0 dBM
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16-BIT TO 8-BIT SPDT GIGABIT LAN SWITCH
WITH LED SWITCH
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SCDS251–MARCH 2008
PARAMETER MEASUREMENT INFORMATION (continued)
EXT TRIGGER
BIAS
Network Analyzer
(HP8753ES)
V
BIAS
P1
P2
V
CC
A
A
0B
0
1
R = 100 Ω
L
1B
0B
1
1
2
1B
2B
2
1
DUT
A
A
2
R = 100 Ω
L
3B
3
1
2B
3B
2
2
SEL
V
SEL
A. CL includes probe and jig capacitance.
B. A 50-Ω termination resistor is needed to match the loading of the network analyzer.
Figure 8. Test Circuit for Crosstalk (XTALK
)
Crosstalk is measured at the output of the nonadjacent ON channel. For example, when VSEL = 0 and A0 is the
input, the output is measured at 1B1. All unused analog input (A) ports are connected to GND, and output (B)
ports are connected to GND through 50-Ω pulldown resistors.
HP8753ES Setup
Average = 4
RBW = 3 kHz
VBIAS = 0.35 V
ST = 2 s
P1 = 0 dBM
10
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16-BIT TO 8-BIT SPDT GIGABIT LAN SWITCH
WITH LED SWITCH
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SCDS251–MARCH 2008
PARAMETER MEASUREMENT INFORMATION (continued)
EXT TRIGGER
BIAS
Network Analyzer
(HP8753ES)
V
BIAS
P1
P2
V
CC
A
A
0B
1B
0
1
R = 100 Ω
L
1
1
DUT
0B
1B
2
2
SEL
V
SEL
A. CL includes probe and jig capacitance.
B. A 50-Ω termination resistor is needed to match the loading of the network analyzer.
Figure 9. Test Circuit for Off Isolation (OIRR
)
OFF isolation is measured at the output of the OFF channel. For example, when VSEL = VCC and A0 is the input,
the output is measured at 0B2. All unused analog input (A) ports are left open, and output (B) ports are
connected to GND through 50-Ω pulldown resistors.
HP8753ES Setup
Average = 4
RBW = 3 kHz
VBIAS = 0.35 V
ST = 2 s
P1 = 0 dBM
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PACKAGE OPTION ADDENDUM
www.ti.com
8-Dec-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TS3L4892RHHR
ACTIVE
VQFN
RHH
36
2500 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
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Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Dec-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TS3L4892RHHR
VQFN
RHH
36
2500
330.0
16.4
6.3
6.3
1.5
12.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Dec-2009
*All dimensions are nominal
Device
Package Type Package Drawing Pins
VQFN RHH 36
SPQ
Length (mm) Width (mm) Height (mm)
346.0 346.0 33.0
TS3L4892RHHR
2500
Pack Materials-Page 2
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logic.ti.com
power.ti.com
microcontroller.ti.com
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Logic
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