TS5N412PWRG4 [TI]
4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER HIGH-BANDWIDTH BUS SWITCH; 4位1 - OF- 2 FET复用器/解复用器高带宽总线开关
| 型号： | TS5N412PWRG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER HIGH-BANDWIDTH BUS SWITCH |
| 文件： | 总18页 (文件大小：453K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TS5N412
4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER
HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS207–AUGUST 2005
FEATURES
APPLICATIONS
•
•
•
•
•
PCI Interface
•
Low and Flat ON-State Resistance (ron)
Characteristics Over Operating Range
(ron = 3 Ω Typ)
Differential Signal Interface
Memory Interleaving
Bus Isolation
•
•
0- to 10-V Switching on Data I/O Ports
Bidirectional Data Flow With Near-Zero
Propagation Delay
Low-Distortion Signal Gating
DBQ OR PW PACKAGE
(TOP VIEW)
•
Low Input/Output Capacitance Minimizes
Loading and Signal Distortion
(Cio(OFF) = 20 pF Max, B Port)
V
OE
S
1B1
1B2
1A
2B1
2B2
2A
1
2
3
4
5
6
7
8
16
15
CC
•
•
VCC Operating Range From 4.75 V to 5.25 V
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
14 4B1
13 4B2
12 4A
•
ESD Performance Tested Per JESD 22
11 3B1
– 2000-V Human-Body Model
(A114-B, Class II)
10
9
3B2
3A
GND
– 1000-V Charged-Device Model (C101)
•
Supports Both Digital and Analog
Applications
DESCRIPTION/ORDERING INFORMATION
The TS5N412 is a high-bandwidth FET bus switch utilizing a charge pump to elevate the gate voltage of the pass
transistor, providing a low and flat ON-state resistance (ron). The low and flat ON-state resistance allows for
minimal propagation delay and supports rail-to-rail switching on the data input/output (I/O) ports. The device also
features low data I/O capacitance to minimize capacitive loading and signal distortion on the data bus.
Specifically designed to support high-bandwidth applications, the TS5N412 provides an optimized interface
solution ideally suited for broadband communications, networking, and data-intensive computing systems.
The TS5N412 is a 4-bit 1-of-2 multiplexer/demultiplexer with a single output-enable (OE) input. The select (S)
inputs control the data path of the multiplexer/demultiplexer. When OE is low, the multiplexer/demultiplexer is
enabled and the A port is connected to the B port, allowing bidirectional data flow between ports. When OE is
high, the multiplexer/demultiplexer is disabled and a high-impedance state exists between the A and B ports.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry prevents damaging
current backflow through the device when it is powered down. The device has isolation during power off.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
TA
PACKAGE(1)
SSOP (QSOP) – DBQ
TSSOP – PW
ORDERABLE PART NUMBER
TS5N412DBQR
TOP-SIDE MARKING
YB412
Tape and reel
Tape and reel
–40°C to 85°C
TS5N412PWR
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TS5N412
4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER
HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS207–AUGUST 2005
FUNCTION TABLE
INPUTS
INPUT/OUTPUT
A
FUNCTION
OE
L
S
L
B1
B2
Z
A port = B1 port
A port = B2 port
Disconnect
L
H
X
H
LOGIC DIAGRAM (POSITIVE LOGIC)
4
7
2
3
5
6
1A
2A
1B1
SW
1B2
2B1
SW
SW
2B2
SW
9
11
10
3A
4A
3B1
3B2
SW
SW
12
14
13
4B1
4B2
SW
SW
1
S
15
OE
2
TS5N412
4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER
HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS207–AUGUST 2005
SIMPLIFIED SCHEMATIC, EACH FET SWITCH (SW)
A
B
V
CC
Charge
Pump
(1)
EN
(1) EN is the internal enable signal applied to the switch.
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.5
–0.5
–0.5
MAX
7
UNIT
V
VCC
VIN
VI/O
II/O
Supply voltage range
Control input voltage range(2)(3)
Switch I/O voltage range(2)(3)(4)
ON-state switch current(5)
7
V
11
V
±100
±100
90
mA
mA
Continuous current through VCC or GND
DBQ package
PW package
θJA
Package thermal impedance(6)
Storage temperature range
°C/W
°C
108
150
Tstg
–65
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to ground, unless otherwise specified.
(3) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(4) VI and VO are used to denote specific conditions for VI/O
(5) II and IO are used to denote specific conditions for II/O
.
.
(6) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions(1)
MIN
4.75
2
MAX UNIT
VCC
VIH
VIL
Supply voltage
5.25
5.25
0.8
10
V
V
High-level control input voltage
Low-level control input voltage
Data input/output voltage
Operating free-air temperature
0
V
VI/O
TA
0
V
–40
85
°C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
3
TS5N412
4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER
HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS207–AUGUST 2005
Electrical Characteristics(1)
over recommended operating free-air temperature range, (unless otherwise noted)
PARAMETER
Control inputs
TEST CONDITIONS
MIN TYP(2)
MAX
10
UNIT
µA
IIN
VCC = 5.25 V,
VCC = 5.25 V,
VCC = 0 V,
VIN = 0 to VCC
VO = 0 to 10 V,
VI = 0,
Switch OFF,
VIN = VCC or GND
10
10
10
10
35
(3)
IOZ
µA
VO = Open,
VI = 0 to 10 V
II/O = 0,
Switch ON or OFF,
ICC
Cin
VCC = 5.25 V,
VCC = 5 V,
VIN = VCC or GND
mA
pF
Control inputs
A port
VIN = 10 V or 0
Switch OFF,
VIN = VCC or GND,
VCC = 5 V,
VI/O = 10 V or 0
VI/O = 10 V or 0
VI/O = 10 V or 0
Cio(OFF)
pF
Switch OFF,
VIN = VCC or GND,
B port
VCC = 5 V,
VCC = 5 V,
20
80
Switch ON,
VIN = VCC or GND,
Cio(ON)
pF
VI = 0,
IO = 50 mA
IO = –50 mA
IO = –50 mA
3
7.5
7.5
VCC = 4.75 V,
TYP at VCC = 5 V
(4)
ron
VI = 8 V,
VI = 10 V,
Ω
12.5
(1) VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins
(2) All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C.
(3) For I/O ports, the parameter IOZ includes the I/O leakage current.
(4) Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is
determined by the lower of the voltages of the two (A or B) terminals.
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
VCC = 5 V
± 0.25 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN MAX
(1)
tpd
A or B
S
B or A
A
3
200
200
200
200
200
ns
ns
tpd(s)
ten
S
B
ns
ns
OE
S
A or B
B
tdis
OE
A or B
(1) The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load
capacitance, when driven by an ideal voltage source (zero output impedance).
Dynamic Characteristics
over recommended operating free-air temperature range, VCC = 5 V ± 5% (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN TYP(1) MAX
UNIT
Bandwidth (BW)(2) RL = 50 Ω, VI = 0.632 V (P-P),
See Figure 4
25
MHz
OFF isolation
RL = 50 Ω, VI = 0.632 V (P-P),
f = 25 MHz,
f = 25 MHz,
See Figure 5
See Figure 6 and Figure 7
–50
–50
dB
dB
(OISO
)
Crosstalk (XTALK
)
RL = 50 Ω, VI = 0.632 V (P-P),
(1) All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C.
(2) Bandwidth is the frequency at which the gain is –3 dB below the DC gain.
4
TS5N412
4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER
HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS207–AUGUST 2005
TYPICAL PERFORMANCE
6
5
4
3
2
1
0
T
A
= 25°C
0
1
2
3
4
5
6
7
8
9
10
V − V
I
Figure 1. Typical ron vs VI, VCC = 5 V and IO = –50 mA
0
0
−1
−2
−3
−4
−5
−6
Gain
−10
−20
−30
−40
−50
−60
Phase
0.1
1
10
100
500
f − Frequency − MHz
Figure 2. Frequency Response vs Bandwidth
5
TS5N412
4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER
HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS207–AUGUST 2005
TYPICAL PERFORMANCE
140
120
100
80
0
−20
Phase
Gain
−40
60
−60
40
20
−80
0
−20
−40
−60
−100
−120
100
0.1
1
10
f − Frequency − MHz
500
Figure 3. Frequency Response vs OFF Isolation
160
140
120
100
80
0
−20
Phase
Gain
−40
−60
60
−80
40
−100
−120
20
0
0.1
1
10
100
500
f − Frequency − MHz
Figure 4. Frequency Response vs Crosstalk
6
TS5N412
4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER
HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS207–AUGUST 2005
PARAMETER MEASUREMENT INFORMATION
V
CC
Input Generator
V
IN
50 Ω
50 Ω
V
G1
TEST CIRCUIT
DUT
2 y V
CC
Input Generator
50 Ω
S1
Open
GND
R
L
V
I
V
O
50 Ω
V
G2
C
L
R
L
(see Note A)
S1
Open
V
I
C
V
∆
R
V
TEST
†
L
L
CC
t
5 V ± 0.25 V
5 V ± 0.25 V
5 V ± 0.25 V
100 Ω
100 Ω
100 Ω
V
CC
35 pF
35 pF
35 pF
pd(s)
t
/t
2 y V
GND
0.3 V
0.3 V
PLZ PZL
CC
t
/t
GND
V
CC
PHZ PZH
†
t
is measured with Demux inputs at opposite voltage levels, i.e. V = 5 V, V = GND.
B1 B2
pds
Output
Control
V
CC
V /2
CC
V /2
CC
(V )
IN
0 V
t
t
PLZ
PZL
Output
Waveform 1
V
V
OH
Output
Control
(V
V
CC
V /2
CC
S1 at 2 × V
V + V
∆
OL
V /2
CC
V /2
CC
CC
)
(see Note B)
IN
OL
0 V
t
t
PZH
PHZ
t
t
PLH
PHL
Output
Waveform 2
S1 at GND
V
OH
V
V
OH
V
OH
− V
∆
V /2
CC
Output
V /2
CC
V /2
CC
0 V
(see Note B)
OL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES (t
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
)
pd(s)
NOTES: A. C includes probe and jig capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω, t < 25 ns, t < 25 ns.
O
r
f
D. The outputs are measured one at a time, with one transition per measurement.
E.
F.
G.
t
t
t
and t
and t
and t
are the same as t
.
dis
.
PLZ
PZL
PLH
PHZ
PZH
PHL
are the same as t
en
are the same as t
. The tpd propagation delay is the calculated RC time constant of the typical ON-state resistance
pd(s)
of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance).
H. All parameters and waveforms are not applicable to all devices.
Figure 5. Test Circuit and Voltage Waveforms
7
TS5N412
4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER
HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS207–AUGUST 2005
PARAMETER MEASUREMENT INFORMATION
V
CC
Network Analyzer
50 W
B1
B2
Channel ON: B1 to A
A
Network Analyzer Setup
Source
Signal
Source Power = 0 dBM
(632-mV P-P at 50-W load)
GND
DC Bias = 350 mV
50 W
Figure 6. Bandwidth (BW)
V
CC
Network Analyzer
50 W
B1
B2
Channel OFF: B2 to A
A
Source
Signal
Network Analyzer Setup
50 W
Source Power = 0 dBM
GND
(632-mV P-P at 50-W load)
50 W
DC Bias = 350 mV
Figure 7. OFF Isolation (OISO
)
V
CC
Network Analyzer
50 W
B1
B2
Channel ON: B1 to A
Channel OFF: B2 to A
A
Source
Signal
Network Analyzer Setup
50 W
Source Power = 0 dBM
GND
(632-mV P-P at 50-W load)
50 W
DC Bias = 350 mV
Figure 8. Crosstalk (XTALK
)
8
TS5N412
4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER
HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS207–AUGUST 2005
PARAMETER MEASUREMENT INFORMATION (continued)
V
+
Network Analyzer
50 W
Channel ON: 1B1 to 1A,
2B1 to 2A
1B1
2B1
1A
2A
Source
Signal
Network Analyzer Setup
50 W
Source Power = 0 dBM
(632 mV P-P at 50 W load)
50 W
DC Bias = 350 mV
GND
Figure 9. Adjacent Channel Crosstalk (XTALK
)
9
TS5N412
4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER
HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS207–AUGUST 2005
MECHANICAL DATA
DBQ (R-PDSO-G**)
0.012 (0,30)
0.008 (0,20)
0.025 (0,64)
24
0.005 (0,13)
13
0.157 (3,99) 0.244 (6,20)
0.008 (0,20) NOM
0.150 (3,81)
0.228 (5,80)
Gauge Plane
1
12
A
0.010 (0,25)
0°−8°
0.035 (0,89)
0.016 (0,40)
0.069 (1,75) MAX
Seating Plane
0.004 (0,10)
0.010 (0,25)
0.004 (0,10)
PINS **
16
20
24
28
DIM
0.197
(5,00)
0.344
(8,74)
0.344
(8,74)
0.394
(10,01)
A MAX
0.189
(4,80)
0.337
(8,56)
0.337
(8,56)
0.386
(9,80)
A MIN
M0−137
VARIATION
D
AB
AD
AE
AF
4073301/F 02/2002
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO−137.
10
TS5N412
4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER
HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS207–AUGUST 2005
MECHANICAL DATA
PW (R-PDSO-G**)
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°−ā8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
7,70
9,80
9,60
A MAX
A MIN
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
11
PACKAGE OPTION ADDENDUM
www.ti.com
24-May-2007
PACKAGING INFORMATION
Orderable Device
TS5N412DBQR
TS5N412DBQRE4
TS5N412DBQRG4
TS5N412PW
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SSOP/
QSOP
DBQ
16
16
16
16
16
16
16
16
16
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SSOP/
QSOP
DBQ
DBQ
PW
PW
PW
PW
PW
PW
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SSOP/
QSOP
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TS5N412PWE4
TS5N412PWG4
TS5N412PWR
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TS5N412PWRE4
TS5N412PWRG4
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TS5N412PWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
*All dimensions are nominal
Device
Package Type Package Drawing Pins
TSSOP PW 16
SPQ
Length (mm) Width (mm) Height (mm)
346.0 346.0 29.0
TS5N412PWR
2000
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
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