TUSB211RWBR [TI]
USB 2.0 480Mbps 高速信号调节器 | RWB | 12 | 0 to 70;
| 型号： | TUSB211RWBR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | USB 2.0 480Mbps 高速信号调节器 | RWB | 12 | 0 to 70 电信 电信集成电路 调节器 |
| 文件： | 总21页 (文件大小：1371K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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TUSB211, TUSB211I
ZHCSDS6D –MAY 2015–REVISED OCTOBER 2017
TUSB211 USB 2.0 高速信号调节器
1 特性
该器件采用了对 USB 低速 (LS) 和全速 (FS) 信号无感
1
知的设计，该设计正在申请专利。LS 和 FS 信号特征
不受 TUSB211 的影响。该器件只能对 HS 信号进行补
偿。
•
•
•
与 USB 2.0、OTG 2.0 和 BC 1.2 兼容
支持低速 (LS)、全速 (FS) 和高速 (HS) 信号传输
3.3V 单电源供电运行时的功耗为 55mW（典型
值）
该器件具有可编程的信号增益，可精调器件性能，从而
对连接器上的高速信号进行优化。这对于通过 USB 高
速电气兼容性测试很有帮助。
•
•
•
•
可通过外部下拉电阻选择信号增益
不会损坏 DP 和 DM 走线
可扩展解决方案 - 用于高损耗应用的 菊花链器件
紧凑型 1.6mm x 1.6mm QFN 封装
TUSB211 的封装不会损坏 DP/DM 信号路径的连续
性。这样一来，便可以针对完整 USB 通道实现零风险
系统设计。
2 应用
•
•
•
•
•
•
•
•
笔记本电脑
此外，TUSB211 符合 USB On-The-Go (OTG) 和电池
充电 (BC) 协议。
台式机
扩展坞
器件信息 (1)
手机
部件号
TUSB211
TUSB211I
封装
封装尺寸（标称值）
有源电缆、电缆扩展器
背板
X2QFN (12)
1.60mm x 1.60mm
电视
(1) 如需了解所有可用封装，请参阅产品说明书末尾的可订购产品
附录。
平板电脑
3 说明
TUSB211 是一款 USB 高速 (HS) 信号调节器，专为补
偿传输通道中的 ISI 信号损失而设计。
简化电路原理图
USB Host Implementation
Programmable Logic
Device
[Optional]
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52a
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5a
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Db5
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Host
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TUSB211
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Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SLLSEO0
TUSB211, TUSB211I
ZHCSDS6D –MAY 2015–REVISED OCTOBER 2017
www.ti.com.cn
目录
7.3 Device Functional Modes.......................................... 7
Application and Implementation .......................... 8
8.1 Application Information.............................................. 8
8.2 Typical Application ................................................... 8
Power Supply Recommendations...................... 11
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Switching Characteristics.......................................... 6
Detailed Description .............................................. 7
7.1 Overview ................................................................... 7
7.2 Functional Block Diagram ......................................... 7
8
9
10 Layout................................................................... 12
10.1 Layout Guidelines ................................................. 12
10.2 Layout Example .................................................... 12
11 器件和文档支持 ..................................................... 13
11.1 相关链接................................................................ 13
11.2 社区资源................................................................ 13
11.3 商标....................................................................... 13
11.4 静电放电警告......................................................... 13
11.5 Glossary................................................................ 13
12 机械、封装和可订购信息....................................... 13
7
4 修订历史记录
Changes from Revision C (June 2016) to Revision D
Page
•
•
•
从产品说明书中删除了器件 TUSB211-Q1.............................................................................................................................. 1
删除了特性：符合汽车应用 标准 ............................................................................................................................................ 1
删除了应用：汽车信息娱乐系统 ............................................................................................................................................. 1
Changes from Revision A (June 2015) to Revision B
Page
•
•
•
•
•
将 1 页产品说明书更改成了完整的产品说明书 ....................................................................................................................... 1
添加了特性：符合汽车应用 标准 ............................................................................................................................................ 1
删除了特性：–40°C 至 85°C 工业温度范围............................................................................................................................ 1
添加了应用：汽车信息娱乐系统 ............................................................................................................................................. 1
更改了简化原理图................................................................................................................................................................... 1
Changes from Original (May 2015) to Revision A
Page
•
将产品说明书从“产品预览”更改成了“生产”.............................................................................................................................. 1
2
Copyright © 2015–2017, Texas Instruments Incorporated
TUSB211, TUSB211I
www.ti.com.cn
ZHCSDS6D –MAY 2015–REVISED OCTOBER 2017
5 Pin Configuration and Functions
RWB Package
12 Pin (X2QFN)
Top View
ꢁ1t ꢁ1a
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3
4
12
Ç9{Ç
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2
1
11 ëw9D
10 Dbꢁ
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7
8
ꢀ 9b!_I{
Pin Functions
PIN
INTERNAL
PULLUP/PULLDOWN
I/O
DESCRIPTION
NAME
NO.
VCC
12
P
N/A
3.3-V power
RSTN asserted: 30 kΩ PD
FS, LS mode: 30 kΩ PD
HS mode: N/A
1.8-V LDO output. Only enabled when operating in High Speed mode.
Requires 0.1-µF external capacitor to GND to stabilize the core.
VREG
11
O
GND
10
5
P
I
N/A
Ground
Device disable/enable.
Recommend 0.1-µF external capacitor to GND to ensure clean power on
reset if not driven.
RSTN
500 kΩ PU
USB High Speed boost select via external pull down resistor.
Sampled upon power up.
Auto selects min EQ when left floating.
Does not recognize real time adjustments.
EQ
6
I
N/A
USB High Speed positive port.
Orientation independent – Can face either upstream or downstream.
D1P
D1M
D2P
2
1
7
I/O
I/O
I/O
N/A
N/A
N/A
USB High Speed negative port.
Orientation independent – Can face either upstream or downstream.
USB High Speed positive port.
Orientation independent – Can face either upstream or downstream.
USB High Speed negative port.
Orientation independent – Can face either upstream or downstream.
D2M
8
3
I/O
I
N/A
TEST
RSTN asserted: 500 kΩ PD
No function. Leave floating.
Flag indicating that channel is in High Speed mode. Asserted upon:
1. Detection of USB-IF High Speed test fixture from an unconnected
state followed by transmission of USB TEST_PACKET pattern.
2. Squelch detection following USB reset with
a successful HS
ENA_HS
9
4
O
O
RSTN asserted: 500kΩ PD
RSTN asserted: 500 kΩ PD
handshake [HS handshake is declared to be successful after single
chirp J chirp K pair where each chirp is within 18 µs – 128 µs]
De-asserted upon detection of disconnect or suspend.
Can be left floating if not needed.
Flag indicating that a USB device is attached.
Asserted from an unconnected state upon detection of DP or DM pull-up
resistor.
CD
De-asserted upon detection of disconnect.
Can be left floating if not needed.
Copyright © 2015–2017, Texas Instruments Incorporated
3
TUSB211, TUSB211I
ZHCSDS6D –MAY 2015–REVISED OCTOBER 2017
www.ti.com.cn
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
–0.3
–0.3
–65
MAX
3.8
UNIT
V
Supply voltage range
Voltage range
VCC
D1P, D1M, D2P, D2M, RSTN, EQ
3.8
V
Storage temperature, Tstg
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
UNIT
(1)
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
Charged-device model (CDM), per JEDEC specification JESD22-C101
±3000
V(ESD)
Electrostatic discharge
V
±1000
(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
3
NOM
MAX
3.6
70
UNIT
VCC
TA
Supply voltage
3.3
V
Operating free-air temperature [TUSB211]
Operating free-air temperature [TUSB211I]
0
°C
–40
85
6.4 Thermal Information
RWB
(1)
THERMAL METRIC
UNIT
12 PINS
161.6
63.3
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
75.1
ψJT
1.9
ψJB
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
75.1
RθJC(bot)
N/A
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
Copyright © 2015–2017, Texas Instruments Incorporated
TUSB211, TUSB211I
www.ti.com.cn
ZHCSDS6D –MAY 2015–REVISED OCTOBER 2017
6.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
(1)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
USB channel = HS mode. 480 Mbps
traffic. VCC supply stable
I(ACTIVE_HS)
I(IDLE_HS)
High Speed Active Current
16
12
20
mA
USB channel = HS mode. No traffic. VCC
supply stable
High Speed Idle Current
15
mA
I(SUSPEND_HS) Suspend Current
USB channel = Suspend mode.
USB channel = FS mode
USB channel = LS mode
4.5
4.5
4.5
5.5
5.5
5.5
mA
mA
mA
I(FS)
I(LS)
Full-Speed Current
Low-Speed Current
Host side application. No device
attachment.
I(DISCONN)
I(RSTN)
Disconnect Power
Disable Power
4.5
4.5
5.5
5.5
mA
mA
RSTN driven low; VCC supply stable; VCC
= 3.3 V
RSTN
VIH
VIL
High level input voltage
Low-level input voltage
High level input current
Low level input current
2
0
VCC
0.8
±2
V
V
IIH
VIH = 3.6 V, VCC = 3 V, RPU enabled
VIL = 0V, VCC = 3.6 V, RPU enabled
µA
µA
IIL
±11
EQ
Level 0 EQ
0.32
2.2
kΩ
kΩ
kΩ
kΩ
Level 1 EQ
1.4
3.7
6
R(EQ)
External pulldown resistor
Level 2 EQ [MAX]
Level 3 EQ [MIN]
4.1
CD, ENA_HS
VOH
High level output voltage
Low level output voltage
IO = –50 µA
IO = 50 µA
2.4
V
V
VOL
0.4
DxP, DxM
DxP or DxM short circuited to GND
continuously for 24 hours
at TA = 25°C only
T(SHRT_GND)
DP, DM low voltage short circuit
Capacitance to GND
0
V
Measured with LCR meter and device
powered down. 1 MHz sinusoid, 30 mVpp
ripple
CIO(DXX)
5
pF
(1) (1) All typical values are at VCC = 3.3 V, and TA = 25°C.
Copyright © 2015–2017, Texas Instruments Incorporated
5
TUSB211, TUSB211I
ZHCSDS6D –MAY 2015–REVISED OCTOBER 2017
www.ti.com.cn
6.6 Switching Characteristics
over operating free-air temperature range (unless otherwise noted)
(1)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DxP, DxM
F(BR_DXX)
t(R/F_DXX)
USB channel = HS mode. 480 Mbps
traffic. VCC supply stable
Bit Rate
Rise/Fall time
480
Mbps
ps
100
CD, ENA_HS
t(EN)
Enable time
20
20
µs
µs
t(DIS)
Disable time
VCC
t(STABLE)
t(RAMP)
VCC stable before RSTN de-assertion
VCC ramp time
100
0.2
µs
100
ms
(1) (1) All typical values are at VCC = 3.3 V, and TA = 25°C.
6
版权 © 2015–2017, Texas Instruments Incorporated
TUSB211, TUSB211I
www.ti.com.cn
ZHCSDS6D –MAY 2015–REVISED OCTOBER 2017
7 Detailed Description
7.1 Overview
The TUSB211 is a USB High-Speed (HS) signal conditioner, designed to compensate for ISI signal loss in a
transmission channel. TUSB211 has a patent-pending design which is agnostic to USB Low Speed (LS) and Full
Speed (FS) signals and does not alter their signal characteristics, while HS signals are compensated. In addition,
the design is compatible with USB On-The-Go (OTG) and Battery Charging (BC) specifications.
Programmable signal gain through an external resistor permits fine tuning device performance to optimize signals
helping to pass USB HS electrical compliance tests at the connector.
The footprint of TUSB211 allows a board layout using this device such that it does not break the continuity of the
DP/DM signal traces. This permits risk free system design of a complete USB channel with flexible use of one or
multiple TUSB211 devices as needed for optimal signal integrity. This allows system designers to plan for this
device and use it only if signal integrity analysis and/or lab measurements show a need. If such a need is not
warranted, the device can be left unpopulated without any board rework.
7.2 Functional Block Diagram
TUSB211
Low and Full
Speed Bypass
D2P
D2M
D1P
D1M
High Speed
Compensation
USB
TRANSCEIVER
ESD
PROTECTION
USB
CONNECTOR
CD
OPTIONAL
PLD
Status flags
ENA_HS
Copyright © 2016, Texas Instruments Incorporated
7.3 Device Functional Modes
7.3.1 Low Speed (LS) Mode
TUSB211 automatically detects a LS connection and does not enable signal compensation. CD pin is asserted
high.
7.3.2 Full Speed (FS) Mode
TUSB211 automatically detects a FS connection and does not enable signal compensation. CD pin is asserted
high.
7.3.3 High Speed (HS) Mode
TUSB211 automatically detects a HS connection and enables signal compensation as determined by the
configuration of the external pulldown resistance on its EQ pin. ENA_HS pin asserted high in addition to the CD
pin.
7.3.4 Disable Mode
TUSB211 can be disabled when its RSTN pin is asserted low. The USB channel is still fully operational, but there
is neither signal compensation, nor any indication from the CD pin or ENA_HS pin as to the status of the
channel.
版权 © 2015–2017, Texas Instruments Incorporated
7
TUSB211, TUSB211I
ZHCSDS6D –MAY 2015–REVISED OCTOBER 2017
www.ti.com.cn
8 Application and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The primary purpose of the TUSB211 is to re-store the signal integrity of a USB High Speed channel up to the
USB connector. The loss in signal quality stems from reduced channel bandwidth due to high loss PCB trace and
other components that contribute a capacitive load. This can cause the channel to fail the USB near end eye
mask. Proper use of the TUSB211 can help to pass this eye mask.
A secondary purpose is to use the CD pin and ENA_HS pin of the TUSB211 to control other blocks on the
customer platform if so desired.
8.2 Typical Application
A typical application is shown below. In this setup, D1P and D1M face the USB connector while D2P and D2M
face the USB transceiver. If desired, the orientation may be reversed [that is, D1 faces transceiver and D2 faces
connector].
Note that CD and ENA_HS are connected to PLDs. This is for platforms where other circuit blocks must be
modified based on the status of the USB channel. They could also be connected to LEDs to give a physical
indication of current channel status for debug purposes. If neither use is desired, they can be left floating.
Copyright © 2016, Texas Instruments Incorporated
图 1. Reference Schematic
8
版权 © 2015–2017, Texas Instruments Incorporated
TUSB211, TUSB211I
www.ti.com.cn
ZHCSDS6D –MAY 2015–REVISED OCTOBER 2017
Typical Application (接下页)
8.2.1 Design Requirements
TUSB211 requires a valid reset signal as described in the power supply recommendations section. The capacitor
C4 is not required if a microcontroller drives the RSTN pin according to recommendations.
Pin 11 VREG is an internal LDO output that requires a 0.1 μF external capacitor to GND to stabilize the core.
Pin 6 EQ requires an external pulldown resistor if EQ levels 0-2 are needed. If EQ level 3 is needed, then the EQ
pin can be left floating.
8.2.2 Detailed Design Procedure
The ideal EQ setting is dependent upon the signal chain loss characteristics of the target platform. The general
recommendation is to start with EQ level 0, and then increment to EQ level 1, and so on. if permissible.
In order for the TUSB211 to recognize any change to the EQ setting, the RSTN pin must be toggled. This is
because the EQ pin is latched on power up and the pin is ignored thereafter.
In addition, TUSB211 does not compensate for any DC attenuation in the signal path. Therefore, minimizing DC
loss (that is, resistance) in the system design, is suggested. As a consequence, this might lead to increased line
capacitance. This is acceptable because the TUSB211 can compensate for the additional capacitive load.
Placement of the device is also dependent on the application goal. 表 1 summarizes the recommendations.
表 1. TUSB211 Platform Placement Guideline
PLATFORM GOAL
Pass USB Near End Mask
SUGGESTED TUSB211 PLACEMENT
Close to measurement point
Pass USB Far End Eye Mask
Close to USB PHY
Cascade multiple 211s to improve device enumeration
Midway between each USB interconnect
注
USB-IF certification tests for High Speed eye masks require the mandated use of the
USB-IF developed test fixtures. These test fixtures do not require the use of oscilloscope
probes. Instead they use SMA cables. More information can be found at the USB-IF
Compliance Updates Page. It is located under the ‘Electricals’ section, ID 86 dated March
2013.
The following procedure must be followed before using any oscilloscope compliance software to construct a USB
High Speed Eye Mask:
8.2.2.1 For a Host Side Application
1. Configure the TUSB211 to the desired EQ setting
2. Power on (or toggle the RSTN pin if already powered on) the TUSB211
3. Using SMA cables, connect the oscilloscope and the USB-IF host-side test fixture to the TUSB211
4. Enable the host to transmit USB TEST_PACKET
5. Execute the oscilloscope’s USB compliance software.
6. Repeat the above steps in order to re-test TUSB211 with a different EQ setting
版权 © 2015–2017, Texas Instruments Incorporated
9
TUSB211, TUSB211I
ZHCSDS6D –MAY 2015–REVISED OCTOBER 2017
www.ti.com.cn
8.2.2.2 For a Device Side Application
1. Configure the TUSB211 to the desired EQ setting
2. Power on (or toggle the RSTN pin if already powered on) the TUSB211
3. Connect a USB host, the USB-IF device-side test fixture, and USB device to the TUSB211. Ensure that the
USB-IF device test fixture is configured to the ‘INIT’ position
4. Allow the host to enumerate the device
5. Enable the device to transmit USB TEST_PACKET
6. Using SMA cables, connect the oscilloscope to the USB-IF device-side test fixture and ensure that the
device-side test fixture is configured to the ‘TEST’ position.
7. Execute the oscilloscope’s USB compliance software.
8. Repeat the above steps in order to re-test TUSB211 with a different EQ setting
8.2.3 Application Curves
2m USB 3.0 cable
USB-IF SMA Fixture
TUSB211
EVM
Agilent
16 GHz
Scope
TEST_PACKET
transmission
USB Host
A
B
A
图 2. Eye Diagram Bench Setup
0.4
0.4
0.2
0.0
0.2
0.0
-0.2
-0.4
-0.2
-0.4
0
0.5
1
Time (ns)
1.5
2
0
0.5
1
Time (ns)
1.5
2
图 3. TUSB211 Disabled
图 4. EQ Level 0
10
版权 © 2015–2017, Texas Instruments Incorporated
TUSB211, TUSB211I
www.ti.com.cn
ZHCSDS6D –MAY 2015–REVISED OCTOBER 2017
0.4
0.4
0.2
0.0
0.2
0.0
-0.2
-0.4
-0.2
-0.4
0
0.5
1
Time (ns)
1.5
2
0
0.5
1
Time (ns)
1.5
2
图 5. EQ Level 1
图 6. EQ Level 2
0.4
0.2
0.0
-0.2
-0.4
0
0.5
1
Time (ns)
1.5
2
图 7. EQ Level 3
9 Power Supply Recommendations
On power up, the interaction of the RSTN pin and power on ramp could result in digital circuits not being set
correctly. The device should not be enabled until the power on ramp has settled to 3 V or higher to guarantee a
correct power on reset of the digital circuitry. If RSTN cannot be held low by microcontroller or other circuitry until
the power on ramp has settled, then an external capacitor from the RSTN pin to GND is required to hold the
device in the low power reset state.
The RC time constant should be larger than five times of the power on ramp time (0 to VCC). With a typical
internal pullup resistance of 500 kΩ, the recommended minimum external capacitance is calculated as:
[Ramp Time x 5] ÷ [500 kΩ]
(1)
版权 © 2015–2017, Texas Instruments Incorporated
11
TUSB211, TUSB211I
ZHCSDS6D –MAY 2015–REVISED OCTOBER 2017
www.ti.com.cn
10 Layout
10.1 Layout Guidelines
There is no need to break the USB signal trace. Thus, even with the TUSB211 powered down, or not populated,
the USB link is still fully operational. To avoid the need for signal vias, routing the High Speed traces directly
underneath the TUSB211 package, as illustrated in the PCB land pattern shown in 图 8, is recommended.
Although the land pattern shown below has matched trace width to pad width, optimal impedance control is
based on the user's own PCB stack-up. It is recommended to maintain 90 Ω differential routing underneath the
device.
All dimensions are in millimetres (mm).
10.2 Layout Example
图 8. DP and DM Routing Underneath Device Package
12
版权 © 2015–2017, Texas Instruments Incorporated
TUSB211, TUSB211I
www.ti.com.cn
ZHCSDS6D –MAY 2015–REVISED OCTOBER 2017
11 器件和文档支持
11.1 相关链接
下表列出了快速访问链接。类别包括技术文档、支持和社区资源、工具和软件以及立即订购快速访问。
表 2. 相关链接
器件
产品文件夹
请单击此处
请单击此处
立即订购
请单击此处
请单击此处
技术文档
请单击此处
请单击此处
工具和软件
请单击此处
请单击此处
支持和社区
请单击此处
请单击此处
TUSB211
TUSB211I
11.2 社区资源
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范，
并且不一定反映 TI 的观点；请参阅 TI 的 《使用条款》。
TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在
e2e.ti.com 中，您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。
设计支持
TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。
11.3 商标
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损
伤。
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。这些数据如有变更，恕不另行通知
和修订此文档。如欲获取此产品说明书的浏览器版本，请参阅左侧的导航。
版权 © 2015–2017, Texas Instruments Incorporated
13
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TUSB211IRWBR
TUSB211RWBR
ACTIVE
ACTIVE
X2QFN
X2QFN
RWB
RWB
12
12
3000 RoHS & Green
3000 RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
-40 to 85
0 to 70
I1
NIPDAU
C1
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Jan-2021
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TUSB211IRWBR
TUSB211RWBR
X2QFN
X2QFN
RWB
RWB
12
12
3000
3000
179.0
180.0
8.4
8.4
1.8
1.8
1.8
1.8
0.61
0.61
4.0
4.0
8.0
8.0
Q2
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Jan-2021
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TUSB211IRWBR
TUSB211RWBR
X2QFN
X2QFN
RWB
RWB
12
12
3000
3000
213.0
213.0
191.0
191.0
35.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
RWB0012A
X2QFN - 0.4 mm max height
SCALE 6.500
PLASTIC QUAD FLATPACK - NO LEAD
1.65
1.55
B
A
PIN 1 INDEX AREA
1.65
1.55
C
0.4 MAX
SEATING PLANE
0.05 C
2X 1.2
SYMM
(0.13)
TYP
0.05
0.00
6X 0.4
3
6
2
1
7
8
SYMM
2X
0.4
0.4
8X
0.2
12
9
0.25
0.15
12X
0.6
4X
0.4
0.07
0.05
C B A
C
4221631/B 07/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
RWB0012A
X2QFN - 0.4 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(1.3)
6X (0.4)
9
12
4X (0.7)
2X (0.4)
1
8
SYMM
(1.5)
7
2
8X (0.5)
3
6
SYMM
(R0.05) TYP
12X (0.2)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:30X
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
METAL
SOLDER MASK
OPENING
EXPOSED METAL
EXPOSED METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4221631/B 07/2017
NOTES: (continued)
3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).
www.ti.com
EXAMPLE STENCIL DESIGN
RWB0012A
X2QFN - 0.4 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(1.3)
6X (0.4)
12
9
4X (0.67)
2X (0.4)
1
2
8
SYMM
(1.5)
7
8X
METAL
8X (0.5)
3
6
(R0.05) TYP
SYMM
12X (0.2)
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
PADS 1,2,7 & 8
96% PRINTED SOLDER COVERAGE BY AREA
SCALE:50X
4221631/B 07/2017
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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