TUSB321AIRWBR [TI]
支持 VCONN 的 USB Type-C 配置通道逻辑和端口控制 | RWB | 12 | -40 to 85;
| 型号： | TUSB321AIRWBR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 支持 VCONN 的 USB Type-C 配置通道逻辑和端口控制 | RWB | 12 | -40 to 85 接口集成电路 |
| 文件： | 总21页 (文件大小：909K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Sample &
Buy
Support &
Community
Product
Folder
Tools &
Software
Technical
Documents
TUSB321AI
ZHCSEB5 –OCTOBER 2015
TUSB321AI 支持 VCONN 的 USB Type-C 配置通道逻辑和端口控制
1 特性
3 说明
1
•
USB Type-C™ 规范 1.1
TUSB321AI 器件可在 USB Type-C 端口上实现 Type-
C 生态系统所需的配置通道 (CC) 逻辑。 TUSB321AI
器件使用 CC 引脚来确定端口的连接状态和电缆方
向，以及进行角色检测和 Type-C 电流模式控制。
TUSB321AI 器件可配置为下行端口 (DFP)、上行端口
(UFP) 或双角色端口 (DRP)，因此成为任何应用的理
想选择。
•
•
•
向后兼容 USB Type-C 规范 1.0
通过专用电流模式引脚支持高达 3A 的电流通告
模式配置
–
–
–
仅主机 - 下行端口 (DFP)（供电设备）
仅设备 – 上行端口 (UFP)（受电设备）
双角色端口 – DRP
•
通道配置 (CC)
根据 Type-C 规范，TUSB321AI 器件在配置为 DRP
时，会交替配置为 DFP 或 UFP。 CC 逻辑块通过监视
CC1 和 CC2 引脚上的上拉或下拉电阻，以确定何时连
接了 USB 端口、电缆的方向以及检测到的角色。 CC
逻辑根据检测到的角色来确定 Type-C 电流模式为默
认、中等还是高。 该逻辑通过实施 VBUS 检测来确定
端口在 UFP 和 DRP 模式下是否连接成功。
–
–
–
–
USB 端口连接检测
电缆方向检测
角色检测
Type-C 电流模式通告和检测（默认、中等和
高）
•
•
•
VBUS 检测
针对有源电缆提供 VCONN 支持
该器件能够在宽电源范围内工作，并且具有较低功耗。
外部开关电缆检测与
方向控制
TUSB321AI 器件适用于工业级和商业级温度范围。
•
•
•
电源电压：4.5V 至 5.5V
低电流消耗
器件信息(1)
部件号
TUSB321AI
封装
封装尺寸（标称值）
工业温度范围：–40°C 至 85°C
X2QFN (12)
1.60mm x 1.60mm
(1) 要了解所有可用封装，请见数据表末尾的可订购产品附录。
2 应用
•
•
•
•
主机、设备、双角色端口应用
移动电话
平板电脑和笔记本电脑
USB 外设
简化电路原理图
示例应用
VDD
ID
VCONN
Power Rail
VBUS
Detection
CC Logic
for Mode
Configuration
and Detection
VBUS_DET
CC1
CC2
CURRENT_MODE
VCONN_FAULT
OUT1
Controller
DIR
OUT2
PORT
GND
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SLLSER2
TUSB321AI
ZHCSEB5 –OCTOBER 2015
www.ti.com.cn
目录
7.4 Device Functional Modes........................................ 10
Application and Implementation ........................ 12
8.1 Application Information............................................ 12
8.2 Typical Application .................................................. 12
8.3 Initialization Set Up ................................................ 14
Power Supply Recommendations...................... 14
1
2
3
4
5
6
特性.......................................................................... 1
8
9
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Switching Characteristics.......................................... 6
Detailed Description .............................................. 7
7.1 Overview ................................................................... 7
7.2 Functional Block Diagram ......................................... 8
7.3 Feature Description................................................... 8
10 Layout................................................................... 14
10.1 Layout Guidelines ................................................. 14
10.2 Layout Example .................................................... 14
11 器件和文档支持 ..................................................... 15
11.1 文档支持 ............................................................... 15
11.2 社区资源................................................................ 15
11.3 商标....................................................................... 15
11.4 静电放电警告......................................................... 15
11.5 Glossary................................................................ 15
12 机械、封装和可订购信息....................................... 15
7
4 修订历史记录
日期
修订版本
注释
2015 年 10 月
*
最初发布版本。
2
Copyright © 2015, Texas Instruments Incorporated
TUSB321AI
www.ti.com.cn
ZHCSEB5 –OCTOBER 2015
5 Pin Configuration and Functions
RWB Package
12-Pin X2QFN
Top View
CC2 CC1
2 1
3
4
5
6
12
11
10
9
CURRENT_MODE
PORT
VDD
DIR
VBUS_DET
GND
ID
VCONN_FAULT
7
8
OUT1 OUT2
Pin Functions
PIN
TYPE
DESCRIPTION
NAME
CC1
NO.
1
I/O
I/O
Type-C configuration channel signal 1
Type-C configuration channel signal 2
CC2
2
Advertise VBUS current. This 3-level input is used to control current advertisement in DFP
mode or DRP mode connected as source. (See Table 2.)
L - Default Current. Pull-down to GND or leave unconnected.
M - Medium (1.5A) current. Pull-up to VDD with 500-kΩ resistor.
H - High (3.0A) current. Pull-up to VDD with 10-kΩ resistor.
CURRENT_MODE
3
4
I
I
Tri-level input pin to indicate port mode. The state of this pin is sampled when VDD is active.
H - DFP (Pull-up to VDD if DFP mode is desired)
PORT
NC - DRP (Leave unconnected if DRP mode is desired)
L - UFP (Pull-down or tie to GND if UFP mode is desired)
5- to 28-V VBUS input voltage. VBUS detection determines UFP attachment. One 900-kΩ
external resistor required between system VBUS and VBUS_DET pin.
VBUS_DET
5
6
I
VCONN_FAULT
O
Open-drain output and is asserted low for when VCONN over-current fault is detected.
This pin is an open drain output for communicating Type-C current mode detect when the
TUSB321AI device is in UFP mode. Default current mode detected (H); medium or high
current mode detected (L). (See Table 2.)
OUT1
OUT2
7
8
I/O
I/O
This pin is an open drain output for communicating Type-C current mode detect when the
TUSB321AI device is in UFP mode: default or medium current mode detected (H); high
current mode detected (L). (See Table 2.)
Open drain output; asserted low when the CC pins detect device attachment when port is a
source (DFP), or dual-role (DRP) acting as source (DFP).
ID
9
O
G
O
P
GND
DIR
VDD
10
11
12
Ground
DIR of plug. This open drain output indicates the detected plug orientation: Type-C plug
position 2 (H); Type-C plug position 1 (L).
Positive supply voltage
Copyright © 2015, Texas Instruments Incorporated
3
TUSB321AI
ZHCSEB5 –OCTOBER 2015
www.ti.com.cn
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
–0.3
–0.3
–0.3
–65
MAX
6.0
UNIT
Supply voltage
Control pins
VDD
V
CC1, CC2, PORT, CURRENT_MODE, ID, DIR, VCONN_FAULT
VDD + 0.3
VDD + 0.3
4
OUT1, OUT2
VBUS_DET
V
Storage temperature, Tstg
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±3000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
C101(2)
±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
4.5
4
NOM
MAX
5.5
28
UNIT
Supply voltage range,VDD
System VBUS voltage
V
V
V
5
DC Voltage range for VBUS_DET
VBUS_DET
0
4
ID, DIR, VCONN_FAULT, OUT1, OUT2,
CURRENT_MODE, CC1, CC2, PORT
DC Voltage range for control pins
0
5.5
V
Supply for active cable (With VDD at 5 V) VCONN
Operating free air temperature, TA
4.75
–40
5.5
85
V
25
°C
6.4 Thermal Information
TUSB321AI
RWB (X2QFN)
12 PINS
169.3
THERMAL METRIC(1)
UNIT
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
—
RθJC(top)
RθJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
68.1
83.4
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
2.2
ψJB
83.4
RθJC(bot)
N/A
(1) For more information about traditional and new thermal metrics, see the Semiconductor and C Package Thermal Metrics application
report, SPRA953.
4
Copyright © 2015, Texas Instruments Incorporated
TUSB321AI
www.ti.com.cn
ZHCSEB5 –OCTOBER 2015
6.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
TEST
CONDITIONS
PARAMETER
MIN
TYP
MAX
UNIT
Power Consumption
Current consumption in unattached mode when port is
I(UNATTACHED_UFP)
unconnected and waiting for connection. (VDD = 5 V, PORT
= L)
70
70
µA
µA
Current consumption in active mode. (VDD = 5 V, PORT =
L)
I(ACTIVE_UFP)
CC1 and CC2 Pins
R(CC_D)
Pulldown resistor when in UFP or DRP mode.
Pulldown resistor when in dead-battery mode
4.6
4.1
5.1
5.1
5.6
6.1
kΩ
kΩ
RCC_DB
VDD = 0V.
Voltage level range for detecting a DFP attach when
configured as a UFP and DFP is advertising default current
source capability.
VUFP_CC_USB
0.25
0.70
1.31
1.51
1.51
2.46
0.15
0.35
0.76
0.61
1.16
2.04
1.64
1.64
2.74
0.25
0.45
0.84
V
V
V
V
V
V
V
V
V
Voltage level range for detecting a DFP attach when
configured as a UFP and DFP is advertising medium (1.5
A) current source capability.
VUFP_CC_MED
Voltage level range for detecting a DFP attach when
configured as a UFP and DFP is advertising high (3 A)
current source capability.
VUFP_CC_HIGH
Voltage threshold for detecting a UFP attach when
configured as a DFP and advertising default current source
capability.
VTH(DFP_CC_USB)
VTH(DFP_CC_MED)
VTH(DFP_CC_HIGH)
VTH(AC_CC_USB)
VTH(AC_CC_MED)
VTH(AC_CC_HIGH)
1.6
1.6
Voltage threshold for detecting a UFP attach when
configured as a DFP and advertising medium current (1.5
A) source capability.
Voltage threshold for detecting a UFP attach when
configured as a DFP and advertising high current (3.0 A)
source capability.
2.6
Voltage threshold for detecting a active cable attach when
configured as a DFP and advertising default current
source.
0.20
0.40
0.80
Voltage threshold for detecting a active cable attach when
configured as a DFP and advertising medium current (1.5
A) source.
Voltage threshold for detecting a active cable attach when
configured as a DFP and advertising high current (3 A)
source.
Default mode pullup current source when operating in DFP
or DRP mode.
ICC(DEFAULT_P)
ICC(MED_P)
64
166
304
80
180
330
96
194
356
µA
µA
µA
Medium (1.5 A) mode pullup current source when
operating in DFP or DRP mode.
High (3 A) mode pullup current source when operating in
DFP or DRP mode.(1)
ICC(HIGH_P)
Control Pins: PORT, CURRENT_MODE, VCONN_FAULT, DIR, ID, OUT1, OUT2
Low-level control signal input voltage, (PORT,
CURRENT_MODE)
VIL
0.4
V
V
V
Mid-level control signal input voltage (PORT,
CURRENT_MODE)
VIM
0.28 × VDD
VDD - 0.3
0.56 × VDD
High-level control signal input voltage (PORT,
CURRENT_MODE)
VIH
IIH
High-level input current
–20
–10
20
10
10
µA
µA
µA
kΩ
MΩ
kΩ
IIL
Low-level input current
IID_LEAKAGE
RPU
Current leakage for ID pin.
VDD = 0V; ID = 5V
Internal pullup resistance (PORT)
Internal pulldown resistance (PORT)
Internal pulldown resistance for CURRENT_MODE pin
588
1.1
RPD
RPD(CUR)
275
Low-level signal output voltage (open-drain)
(VCONN_FAULT, ID, OUT1, OUT2, DIR)
VOL
IOL = –1.6 mA
0.4
V
(1) VDD must be 3.5 V or greater to advertise 3 A current.
Copyright © 2015, Texas Instruments Incorporated
5
TUSB321AI
ZHCSEB5 –OCTOBER 2015
www.ti.com.cn
Electrical Characteristics (continued)
over operating free-air temperature range (unless otherwise noted)
TEST
CONDITIONS
PARAMETER
MIN
TYP
MAX
UNIT
External pullup resistor on open drain IOs
RP(ODext)
200
4.7
kΩ
kΩ
kΩ
(VCONN_FAULT, ID, OUT1, OUT2, DIR)
RP(TLext)
Tri-level input external pull-up resistor (PORT)
External pull-up resistor on CURRENT_MODE pin to
advertise 1.5-A current
RP(cm_med)
500
External pull-up resistor on CURRENT_MODE pin to
advertise 3.0-A current
RP(cm_high)
10
kΩ
VBUS_DET IO Pins (Connected to System VBUS signal through external resistor)
VBUS(THR)
R(VBUS)
R(VBUS_PD)
VCONN
RON
VBUS threshold range
2.95
891
3.30
900
95
3.80
909
V
External resistor between VBUS and VBUS_DET pin
Internal pulldown resistance for VBUS_DET
KΩ
KΩ
On resistance of the VCONN power FET
Voltage tolerance on VCONN power FET
Voltage to pass through VCONN power FET
1.25
5.5
Ω
V
V
V(TOL)
V(PASS)
5.5
VCONN current limit; VCONN is disconnected above this
value
I(VCONN)
CBULK
225
10
300
375
200
mA
µF
Bulk capacitance on VCONN; placed on VDD supply
6.6 Switching Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
MIN
TYP
168
2
MAX
UNIT
ms
tCCCB_DEFAULT
tVBUS_DB
Power on default of CC1 and CC2 voltage debounce time
Debounce of VBUS_DET pin after valid V(BUS_THR) (See Figure 1.)
Power-on default of percentage of time DRP advertises DFP during a TDRP
ms
tDRP_DUTY_CYCLE
30%
The period TUSB321AI in DRP mode completes a DFP to UFP and back
advertisement.
tDRP
50
75
100
ms
V
VBUS
V
BUS_THR
t
VBUS_DB
0 V
Time
Figure 1. VBUS Detect and Debounce
6
Copyright © 2015, Texas Instruments Incorporated
TUSB321AI
www.ti.com.cn
ZHCSEB5 –OCTOBER 2015
7 Detailed Description
7.1 Overview
The USB Type-C ecosystem operates around a small form factor connector and cable that is flippable and
reversible. Because of the nature of the connector, a scheme is needed to determine the connector orientation.
Additional schemes are needed to determine when a USB port is attached and the acting role of the USB port
(DFP, UFP, DRP), as well as to communicate Type-C current capabilities. These schemes are implemented over
the CC pins according to the USB Type-C specifications. The TUSB321AI device provides Configuration Channel
(CC) logic for determining USB port attach and detach, role detection, cable orientation, and Type-C current
mode. The TUSB321AI device also contains several features such as VCONN sourcing, USB3.1 MUX direction
control, mode configuration and low standby current which make this device ideal for source or sinks in USB2.0
or USB3.1 applications.
7.1.1 Cables, Adapters, and Direct Connect Devices
Type-C Specification 1.1 defines several cables, plugs and receptacles to be used to attach ports. The
TUSB321AI device supports all cables, receptacles, and plugs. The TUSB321AI device does not support e-
marking.
7.1.1.1 USB Type-C Receptacles and Plugs
Below is list of Type-C receptacles and plugs supported by the TUSB321AI device:
•
•
•
USB Type-C receptacle for USB2.0 and USB3.1 and full-featured platforms and devices
USB full-featured Type-C plug
USB2.0 Type-C plug
7.1.1.2 USB Type-C Cables
Below is a list of Type-C cables types supported by the TUSB321AI device:
•
•
•
USB full-featured Type-C cable with USB3.1 full-featured plug
USB2.0 Type-C cable with USB2.0 plug
Captive cable with either a USB full-featured plug or USB2.0 plug
7.1.1.3 Legacy Cables and Adapters
The TUSB321AI device supports legacy cable adapters as defined by the Type-C Specification. The cable
adapter must correspond to the mode configuration of the TUSB321AI device.
TUSB321AI
900 kW +1%
56 kW +5%
5.1 kW +10%
Figure 2. Legacy Adapter Implementation Circuit
7.1.1.4 Direct Connect Devices
The TUSB321AI device supports the attaching and detaching of a direct-connect device.
Copyright © 2015, Texas Instruments Incorporated
7
TUSB321AI
ZHCSEB5 –OCTOBER 2015
www.ti.com.cn
7.2 Functional Block Diagram
VDD
DIR
DIR_CTRL
DIR
Logic
CTRL
CURRENT_MODE
PORT
Tri-State
Buffer
CC1
Connection
Digital
Controller
and
Cable
Detection
VBUS_ON
CRTL_INT
CRTL_ID
CC2
CRTL_ID
CRTL_EN_N
CRTL_EN_N
VBUS_ON
CTRL
VBUS
Detection
Open Drain Output
VBUS_DET
900 kΩ ±1%
OUT1 OUT2 ID
VCONN_FAULT
GND
SYS_VBUS
7.3 Feature Description
7.3.1 Port Role Configuration
The TUSB321AI device can be configured as a downstream facing port (DFP), upstream facing port (UFP), or
dualrole port (DRP) using the tri-level PORT pin. The PORT pin should be pulled high to VDD using a pullup
resistance, low to GND or left as floated on the PCB to achieve the desired mode. This flexibility allows the
TUSB321AI device to be used in a variety of applications. The TUSB321AI device samples the PORT pin after
reset and maintains the desired mode until the TUSB321AI device is reset again. Table 1 lists the supported
features in each mode:
8
Copyright © 2015, Texas Instruments Incorporated
TUSB321AI
www.ti.com.cn
ZHCSEB5 –OCTOBER 2015
Feature Description (continued)
Table 1. Supported Features for the TUSB321AI Device by Mode
PORT PIN
HIGH
(DFP ONLY)
LOW
(UFP ONLY)
NC
(DRP)
SUPPORTED
FEATURES
Port attach and
detach
Yes
Yes
Yes
Cable orientation
Current advertisement
Current detection
Active cable detection
VCONN
Yes
Yes
-
Yes
-
Yes
Yes (DFP)
Yes (UFP)
Yes (DFP)
Yes (DFP)
Yes
Yes
-
Yes
Yes
Yes
-
-
Legacy cables
Yes
Yes
VBUS detection
Yes (UFP)
7.3.1.1 Downstream Facing Port (DFP) - Source
The TUSB321AI device can be configured as a DFP only by pulling the PORT pin high through a resistance to
VDD. In DFP mode, the TUSB321AI device constantly presents Rps on both CC. In DFP mode, the TUSB321AI
device advertises USB Type-C current based on the state of the CURRENT_MODE pin.
When configured as a DFP, the TUSB321AI can operate with older USB Type-C 1.0 devices except for a USB
Type-C 1.0 DRP device. The TUSB321AI can not operate with a USB Type-C 1.0 DRP device. This limitation is
a result of backwards compatibility problem between USB Type-C 1.1 DFP and a USB Type-C 1.0 DRP.
Please note that when TUSB321AI's VDD supply is not active, Rd will be presented on both CC pins. This will
cause another DRP or DFP device to detect the TUSB321AI as a UFP. When VDD becomes active, the
TUSB321AI will remove the Rd from CC pins and present Rp on both CC pins.
7.3.1.2 Upstream Facing Port (UFP) - Sink
The TUSB321AI device can be configured as a UFP only by pulling the PORT pin low to GND. In UFP mode, the
TUSB321AI device constantly presents pulldown resistors (Rd) on both CC pins. The TUSB321AI device
monitors the CC pins for the voltage level corresponding to the Type-C mode current advertisement by the
connected DFP. The TUSB321AI device debounces the CC pins and wait for VBUS detection before successfully
attaching. As a UFP, the TUSB321AI device detects and communicates the advertised current level of the DFP
to the system through the OUT1 and OUT2 pins.
7.3.1.3 Dual Role Port (DRP)
The TUSB321AI device can be configured to operate as a DRP when the PORT pin is left floated on the PCB. In
DRP mode, the TUSB321AI device toggles between operating as a DFP and a UFP. When functioning as a DFP
in DRP mode, the TUSB321AI device complies with all operations as defined for a DFP according to the Type-C
Specification. When presenting as a UFP in DRP mode, the TUSB321AI device operates as defined for a UFP
according to the Type-C Specification.
7.3.2 Type-C Current Mode
The TUSB321AI device supports both advertising and detection of Type-C current. When TUSB321AI is a UFP
or a DRP connected as a sink, the OUT1 and OUT2 pins are used to inform the system the detected USB Type-
C current being broadcasted by the attached DFP. When TUSB321AI device is a DFP or a DRP connected as a
source, the CURRENT_MODE pin is used to advertise the USB Type-C current. The current advertisement for
the TUSB321AI device is 500 mA (for USB2.0) or 900 mA (for USB3.1) if CURRENT_MODE pin is left
unconnected or pulled to GND. If a higher level of current is required, the CURRENT_MODE can be pulled up to
VDD through a 500-kΩ resistor to advertise medium current at 1.5 A or pulled up to VDD through a 10-kΩ resistor
to advertise high current at 3 A. Table 2 lists the Type-C current advertisements and detection.
Copyright © 2015, Texas Instruments Incorporated
9
TUSB321AI
ZHCSEB5 –OCTOBER 2015
www.ti.com.cn
Table 2. Type-C Current Advertisement and Detection
UFP or DRP acting as UFP
Current Detection
DFP or DRP acting as DFP
Current Advertisement
TYPE-C CURRENT
500 mA (USB2.0)
900 mA (USB3.1)
OUT1 = High
OUT2 = High (unattached) or Low (attached)
Default
CURRENT_MODE = L
CURRENT_MODE = M
CURRENT_MODE = H
OUT1 = Low
OUT2 = High
Medium - 1.5 A
High - 3 A
OUT1 = Low
OUT2 = Low
7.3.3 VBUS Detection
The TUSB321AI device supports VBUS detection according to the Type-C Specification. VBUS detection is used to
determine the attachment and detachment of a UFP. VBUS detection is also used to successfully resolve the role
in DRP mode.
The system VBUS voltage must be routed through a 900-kΩ resistor to the VBUS_DET pin on the TUSB321AI
device if the PORT pin is configured as a DRP or a UFP. If the TUSB321AI device is configured as a DFP and
only ever used in DFP mode, the VBUS_DET pin can be left unconnected.
7.3.4 Cable Orientation and External MUX Control
The TUSB321AI device has the ability to control an external/discrete MUX using the DIR pin. The TUSB321AI
detects the cable orientation by monitoring the voltage on the CC pins. When a voltage level within the proper
threshold is detected on CC1, the DIR pin is pulled low. When a voltage level within the proper threshold is
detected on CC2, the DIR is pulled high. If the direction polarity of the external MUX is opposite of the
TUSB321AI, the CC1/CC2 connection to USB Type-C receptacle can be reversed. The DIR pin is an open drain
output.
7.3.5 VCONN Support for Active Cables
The TUSB321AI device supplies VCONN to active cables when configured in DFP mode or in DRP acting as a
DFP mode. VCONN is provided only when the unconnected CC pin is terminated to a resistance, Ra, and after a
UFP is detected and the Attached.SRC state is entered. When in DFP mode or in DRP acting as a DFP mode, a
5-V source must be connected to the VDD pin of the TUSB321AI device after Attached.SRC. VCONN is supplied
from VDD through a low resistance power FET out to the unconnected CC pin. VCONN is removed when a
detach event is detected and the active cable is removed.
7.4 Device Functional Modes
The TUSB321AI device has three functional modes. Table 3 lists these modes:
Table 3. USB Type-C States According to TUSB321AI Functional Modes
MODES
GENERAL BEHAVIOR
PORT PIN
STATES(1)
Unattached.SNK
UFP
AttachWait.SNK
USB port unattached. ID, PORT
operational. CC pins configure
according to PORT pin.
Toggle Unattached.SNK → Unattached.SRC
AttachedWait.SRC or AttachedWait.SNK
Unattached.SRC
Unattached
DRP
DFP
UFP
DRP
AttachWait.SRC
Attached.SNK
Attached.SNK
USB port attached. All GPIOs
operational.
Active
Attached.SRC
DFP
N/A
Attached.SRC
Dead Battery
No operation. VDD not available
Default device state to UFP/SINK with Rd
(1) Required; not in sequential order.
10
Copyright © 2015, Texas Instruments Incorporated
TUSB321AI
www.ti.com.cn
ZHCSEB5 –OCTOBER 2015
7.4.1 Unattached Mode
Unattached mode is the primary mode of operation for the TUSB321AI device, because a USB port can be
unattached for a lengthy period of time. In unattached mode, VDD is available, and all IOs are operational. After
the TUSB321AI device is powered up, the part enters unattached mode until a successful attach has been
determined. Initially, right after power up, the TUSB321AI device comes up as an Unattached.SNK. The
TUSB321AI device checks the PORT pin and operates according to the mode configuration. The TUSB321AI
device toggles between the UFP and the DFP if configured as a DRP. The PORT pin is only sampled at reset or
power up.
7.4.2 Active Mode
Active mode is defined as the port being attached. In active mode, all GPIOs are operational. When in active
mode, the TUSB321AI device communicates to the AP that the USB port is attached. This happens through the
ID pin if TUSB321AI is configured as a DFP or DRP connect as source. If TUSB321AI is configured as a UFP or
a DRP connected as a sink, the OUT1 and OUT2 pins are used. The TUSB321AI device exits active mode under
the following conditions:
•
•
Cable unplug
VBUS removal if attached as a UFP
7.4.3 Dead Battery Mode
Dead battery mode is defined as VDD not active. In this mode, CC pins always default to pull-down resistors.
Dead battery means:
● TUSB321AI in UFP with 5.1 kΩ ±20% pull-down resistors
Copyright © 2015, Texas Instruments Incorporated
11
TUSB321AI
ZHCSEB5 –OCTOBER 2015
www.ti.com.cn
8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The TUSB321AI device is a Type-C configuration channel logic and port controller. The TUSB321AI device can
detect when a Type-C device is attached, what type of device is attached, the orientation of the cable, and power
capabilities (both detection and broadcast). The TUSB321AI device can be used in a source application (DFP) or
in a sink application (UFP).
8.2 Typical Application
8.2.1 DFP Mode
Figure 3 shows the TUSB321AI device configured as a DFP.
USB3 Host and
PMIC
DM
DP
USB VBUS Switch
System VBUS
PS_EN
VOUT
VIN
EN
FAULT#
PS_FAULT#
VDD_5V
VCC_3.3V
DM
DP
150uF
100uF
100nF
VBUS
900K
A12
B1
B2
200K
10K
200K
4.7K
RXP2
RXN2
TXP2
TXN2
VBUS_DET
A11
A10
A9
B3
B4
B5
PORT
CURRENT_MODE
CC1
A8
CC2
CC1
A7
B6
B7
B8
TUSB321AI
CC2
ID
ID
A6
A5
VCONN_FAULT#
FAULT#
A4
A3
A2
A1
B9
TXN1
TXP1
RXN1
RXP1
B10
B11
B12
VCC_3.3V
VCC_3.3V
10K
100nF
SEL
TXP2
TXN2
B0P
B0N
RXP2
RXN2
100nF
B1P
B1N
A0P
A0N
SSTXP
SSTXN
100nF
TXN1
TXP1
A1P
A1N
SSRXP
SSRXN
C0P
C0N
RXN1
RXP1
100nF
C1P
C1N
OEN
Figure 3. DFP Mode Schematic
12
Copyright © 2015, Texas Instruments Incorporated
TUSB321AI
www.ti.com.cn
ZHCSEB5 –OCTOBER 2015
Typical Application (continued)
8.2.1.1 Design Requirements
For this design example, use the parameters listed in Table 4:
Table 4. Design Requirements for DFP Mode
DESIGN PARAMETER
VALUE
5 V
VDD (4.5 V to 5.5 V)
DFP
Type-C port type (UFP, DFP, or DRP)
PORT pin is pulled up
Advertised Type-C Current (Default, 1.5 A, 3 A)
VCONN Support
3 A
Yes
8.2.1.2 Detailed Design Procedure
The TUSB321AI device supports a VDD in the range of 4.5 to 5.5 V. In this particular case, VDD is set to 5 V. A
100-nF capacitor is placed near VDD. Also, a 100 µF is used to meet the USB Type-C bulk capacitance
requirement of 10 µF to 220 µF.
The TUSB321AI current advertisement is determined by the state of the CURRENT_MODE pin. In this particular
example, 3 A advertisement is desired so the CURRENT_MODE pin is pulled high to VDD through 10-kΩ resistor.
The DIR pin is used to control the MUX for connecting the USB3 SS signals to the appropriate pins on the USB
Type-C receptacle. In this particular case, a HD3SS3212 is used as the MUX. In order to minimize crossing in
routing the USB 3.1 SS signals to the USB Type C connector, the connection of CC1 and CC2 to the
TUSB321AI is swapped.
The Type-C port mode is determined by the state of the PORT pin. When the PORT pin is pulled high, the
TUSB321AI device is in DFP mode.
The VBUS_DET pin must be connected through a 900-kΩ resistor to VBUS on the Type-C that is connected. This
large resistor is required to protect the TUSB321AI device from large VBUS voltage that is possible in present day
systems. This resistor along with internal pulldown keeps the voltage observed by the TUSB321AI device in the
recommended range.
The USB3.1 specification requires the bulk capacitance on VBUS based on UFP or DFP. When operating the
TUSB321AI device in a DFP mode, a bulk capacitance of at least 120 µF is required. In this particular case, a
150-µF capacitor was chosen.
8.2.1.3 Application Curve
Figure 4. Application Curve for DFP Mode
Copyright © 2015, Texas Instruments Incorporated
13
TUSB321AI
ZHCSEB5 –OCTOBER 2015
www.ti.com.cn
8.3 Initialization Set Up
The general power-up sequence for the TUSB321AI device is as follows:
1. System is powered off (device has no VDD). The TUSB321AI device is configured internally in UFP mode
with Rds on CC pins.
2. VDD ramps – POR circuit.
3. The TUSB321AI device enters unattached mode and determines the voltage level from the PORT pin. This
determines the mode in which the TUSB321AI device operates (DFP, UFP, DRP).
4. The TUSB321AI device monitors the CC pins as a DFP and VBUS for attach as a UFP.
5. The TUSB321AI device enters active mode when attach has been successfully detected.
9 Power Supply Recommendations
The TUSB321AI device has a wide power supply range from 4.5 to 5.5 V. The TUSB321AI device can be run off
of a system power such as a battery.
10 Layout
10.1 Layout Guidelines
1. An extra trace (or stub) is created when connecting between more than two points. A trace connecting pin A6
to pin B6 will create a stub because the trace also has to go to the USB Host. Ensure that:
–
–
A stub created by short on pin A6 (DP) and pin B6 (DP) at Type-C receptacle does not exceed 3.5 mm.
A stub created by short on pin A7 (DM) and pin B7 (DM) at Type-C receptacle does not exceed 3.5 mm.
2. A 100-nF capacitor should be placed as close as possible to the TUSB321AI VDD pin.
10.2 Layout Example
Figure 5. TUSB321AI Layout
14
版权 © 2015, Texas Instruments Incorporated
TUSB321AI
www.ti.com.cn
ZHCSEB5 –OCTOBER 2015
11 器件和文档支持
11.1 文档支持
11.2 社区资源
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.3 商标
E2E is a trademark of Texas Instruments.
USB Type-C is a trademark of USB Implementers Forum.
All other trademarks are the property of their respective owners.
11.4 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损
伤。
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 机械、封装和可订购信息
以下页中包括机械、封装和可订购信息。 这些信息是针对指定器件可提供的最新数据。 这些数据会在无通知且不
对本文档进行修订的情况下发生改变。 欲获得该数据表的浏览器版本，请查阅左侧的导航栏。
版权 © 2015, Texas Instruments Incorporated
15
重要声明
德州仪器(TI) 及其下属子公司有权根据 JESD46 最新标准, 对所提供的产品和服务进行更正、修改、增强、改进或其它更改， 并有权根据
JESD48 最新标准中止提供任何产品和服务。客户在下订单前应获取最新的相关信息, 并验证这些信息是否完整且是最新的。所有产品的销售
都遵循在订单确认时所提供的TI 销售条款与条件。
TI 保证其所销售的组件的性能符合产品销售时 TI 半导体产品销售条件与条款的适用规范。仅在 TI 保证的范围内，且 TI 认为 有必要时才会使
用测试或其它质量控制技术。除非适用法律做出了硬性规定，否则没有必要对每种组件的所有参数进行测试。
TI 对应用帮助或客户产品设计不承担任何义务。客户应对其使用 TI 组件的产品和应用自行负责。为尽量减小与客户产品和应 用相关的风险，
客户应提供充分的设计与操作安全措施。
TI 不对任何 TI 专利权、版权、屏蔽作品权或其它与使用了 TI 组件或服务的组合设备、机器或流程相关的 TI 知识产权中授予 的直接或隐含权
限作出任何保证或解释。TI 所发布的与第三方产品或服务有关的信息，不能构成从 TI 获得使用这些产品或服 务的许可、授权、或认可。使用
此类信息可能需要获得第三方的专利权或其它知识产权方面的许可，或是 TI 的专利权或其它 知识产权方面的许可。
对于 TI 的产品手册或数据表中 TI 信息的重要部分，仅在没有对内容进行任何篡改且带有相关授权、条件、限制和声明的情况 下才允许进行
复制。TI 对此类篡改过的文件不承担任何责任或义务。复制第三方的信息可能需要服从额外的限制条件。
在转售 TI 组件或服务时，如果对该组件或服务参数的陈述与 TI 标明的参数相比存在差异或虚假成分，则会失去相关 TI 组件 或服务的所有明
示或暗示授权，且这是不正当的、欺诈性商业行为。TI 对任何此类虚假陈述均不承担任何责任或义务。
客户认可并同意，尽管任何应用相关信息或支持仍可能由 TI 提供，但他们将独力负责满足与其产品及在其应用中使用 TI 产品 相关的所有法
律、法规和安全相关要求。客户声明并同意，他们具备制定与实施安全措施所需的全部专业技术和知识，可预见 故障的危险后果、监测故障
及其后果、降低有可能造成人身伤害的故障的发生机率并采取适当的补救措施。客户将全额赔偿因 在此类安全关键应用中使用任何 TI 组件而
对 TI 及其代理造成的任何损失。
在某些场合中，为了推进安全相关应用有可能对 TI 组件进行特别的促销。TI 的目标是利用此类组件帮助客户设计和创立其特 有的可满足适用
的功能安全性标准和要求的终端产品解决方案。尽管如此，此类组件仍然服从这些条款。
TI 组件未获得用于 FDA Class III（或类似的生命攸关医疗设备）的授权许可，除非各方授权官员已经达成了专门管控此类使 用的特别协议。
只有那些 TI 特别注明属于军用等级或“增强型塑料”的 TI 组件才是设计或专门用于军事/航空应用或环境的。购买者认可并同 意，对并非指定面
向军事或航空航天用途的 TI 组件进行军事或航空航天方面的应用，其风险由客户单独承担，并且由客户独 力负责满足与此类使用相关的所有
法律和法规要求。
TI 已明确指定符合 ISO/TS16949 要求的产品，这些产品主要用于汽车。在任何情况下，因使用非指定产品而无法达到 ISO/TS16949 要
求，TI不承担任何责任。
产品
应用
www.ti.com.cn/telecom
数字音频
www.ti.com.cn/audio
www.ti.com.cn/amplifiers
www.ti.com.cn/dataconverters
www.dlp.com
通信与电信
计算机及周边
消费电子
能源
放大器和线性器件
数据转换器
DLP® 产品
DSP - 数字信号处理器
时钟和计时器
接口
www.ti.com.cn/computer
www.ti.com/consumer-apps
www.ti.com/energy
www.ti.com.cn/dsp
工业应用
医疗电子
安防应用
汽车电子
视频和影像
www.ti.com.cn/industrial
www.ti.com.cn/medical
www.ti.com.cn/security
www.ti.com.cn/automotive
www.ti.com.cn/video
www.ti.com.cn/clockandtimers
www.ti.com.cn/interface
www.ti.com.cn/logic
逻辑
电源管理
www.ti.com.cn/power
www.ti.com.cn/microcontrollers
www.ti.com.cn/rfidsys
www.ti.com/omap
微控制器 (MCU)
RFID 系统
OMAP应用处理器
无线连通性
www.ti.com.cn/wirelessconnectivity
德州仪器在线技术支持社区
www.deyisupport.com
IMPORTANT NOTICE
邮寄地址： 上海市浦东新区世纪大道1568 号，中建大厦32 楼邮政编码： 200122
Copyright © 2015, 德州仪器半导体技术（上海）有限公司
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TUSB321AIRWBR
ACTIVE
X2QFN
RWB
12
3000 RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 85
7A
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OUTLINE
RWB0012A
X2QFN - 0.4 mm max height
SCALE 6.500
PLASTIC QUAD FLATPACK - NO LEAD
1.65
1.55
B
A
PIN 1 INDEX AREA
1.65
1.55
C
0.4 MAX
SEATING PLANE
0.05 C
2X 1.2
SYMM
(0.13)
TYP
0.05
0.00
6X 0.4
3
6
2
1
7
8
SYMM
2X
0.4
0.4
8X
0.2
12
9
0.25
0.15
12X
0.6
4X
0.4
0.07
0.05
C B A
C
4221631/B 07/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
RWB0012A
X2QFN - 0.4 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(1.3)
6X (0.4)
9
12
4X (0.7)
2X (0.4)
1
8
SYMM
(1.5)
7
2
8X (0.5)
3
6
SYMM
(R0.05) TYP
12X (0.2)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:30X
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
METAL
SOLDER MASK
OPENING
EXPOSED METAL
EXPOSED METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4221631/B 07/2017
NOTES: (continued)
3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).
www.ti.com
EXAMPLE STENCIL DESIGN
RWB0012A
X2QFN - 0.4 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(1.3)
6X (0.4)
12
9
4X (0.67)
2X (0.4)
1
2
8
SYMM
(1.5)
7
8X
METAL
8X (0.5)
3
6
(R0.05) TYP
SYMM
12X (0.2)
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
PADS 1,2,7 & 8
96% PRINTED SOLDER COVERAGE BY AREA
SCALE:50X
4221631/B 07/2017
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
重要声明和免责声明
TI 均以“原样”提供技术性及可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资
源，不保证其中不含任何瑕疵，且不做任何明示或暗示的担保，包括但不限于对适销性、适合某特定用途或不侵犯任何第三方知识产权的暗示
担保。
所述资源可供专业开发人员应用TI 产品进行设计使用。您将对以下行为独自承担全部责任：(1) 针对您的应用选择合适的TI 产品；(2) 设计、
验证并测试您的应用；(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。所述资源如有变更，恕不另行通知。TI 对您使用
所述资源的授权仅限于开发资源所涉及TI 产品的相关应用。除此之外不得复制或展示所述资源，也不提供其它TI或任何第三方的知识产权授权
许可。如因使用所述资源而产生任何索赔、赔偿、成本、损失及债务等，TI对此概不负责，并且您须赔偿由此对TI 及其代表造成的损害。
TI 所提供产品均受TI 的销售条款 (http://www.ti.com.cn/zh-cn/legal/termsofsale.html) 以及ti.com.cn上或随附TI产品提供的其他可适用条款的约
束。TI提供所述资源并不扩展或以其他方式更改TI 针对TI 产品所发布的可适用的担保范围或担保免责声明。IMPORTANT NOTICE
邮寄地址：上海市浦东新区世纪大道 1568 号中建大厦 32 楼，邮政编码：200122
Copyright © 2020 德州仪器半导体技术（上海）有限公司
相关型号：
TUSB321RWBR
支持 VCONN 的 USB Type-C 配置通道逻辑和端口控制 | RWB | 12 | 0 to 70Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TUSB322I
支持 VCONN 的 USB Type-C 配置通道逻辑和端口控制Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TUSB322IRWBR
支持 VCONN 的 USB Type-C 配置通道逻辑和端口控制 | RWB | 12 | -40 to 85Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TUSB3410
USB TO SERIAL PORT CONTROLLERWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TUSB3410-Q1
USB To Serial Port ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TUSB3410IRHB
500mA, Low Quiescent Current, Ultra-Low Noise, High PSRR Low Dropout Linear RegulatorWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TUSB3410IRHBG4
500mA, Low Quiescent Current, Ultra-Low Noise, High PSRR Low Dropout Linear RegulatorWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TUSB3410IRHBR
500mA, Low Quiescent Current, Ultra-Low Noise, High PSRR Low Dropout Linear RegulatorWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TUSB3410IRHBRG4
500mA, Low Quiescent Current, Ultra-Low Noise, High PSRR Low Dropout Linear RegulatorWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TUSB3410IRHBT
500mA, Low Quiescent Current, Ultra-Low Noise, High PSRR Low Dropout Linear RegulatorWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TUSB3410IVF
500mA, Low Quiescent Current, Ultra-Low Noise, High PSRR Low Dropout Linear RegulatorWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TUSB3410IVFG4
500mA, Low Quiescent Current, Ultra-Low Noise, High PSRR Low Dropout Linear RegulatorWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
©2020 ICPDF网 联系我们和版权申明