TUSB501DRFR [TI]
USB 3.0 5Gbps 单通道转接驱动器 | DRF | 8 | -40 to 85;型号: | TUSB501DRFR |
厂家: | TEXAS INSTRUMENTS |
描述: | USB 3.0 5Gbps 单通道转接驱动器 | DRF | 8 | -40 to 85 数据传输 驱动 光电二极管 外围集成电路 驱动器 |
文件: | 总17页 (文件大小:1868K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TUSB501
www.ti.com.cn
ZHCSBD9A –AUGUST 2013–REVISED AUGUST 2013
支持均衡的 USB 3.0 单通道转接驱动器
查询样品: TUSB501
1
特性
说明
TUSB501 是一款 3rd代 3.3V USB 3.0 单通道转接驱动
2
•
积极低功耗架构(典型值):
器。 当 5Gbps 超高速 USB 信号由印刷电路板 (PCB)
或电缆传播时,信号完整性会由于损耗和符号间干扰而
降级。 TUSB501 通过采用补偿通道损耗的均衡来恢复
进入的数据,并且使用一个高差分电压来向外驱动信
号。 这样扩展了可能的通道长度,并且使系统能够符
合 USB3.0 兼容性。 TUSB501 高级状态机使得它对于
主机和器件透明。
–
–
–
126mW 有源功耗
在 U2/U3 中为 20mW
无连接时为 3mW
•
•
自动低频率周期信号 (LFPS) 去加重 (DE) 控制
出色的抖动与损耗补偿
–
–
32 英寸的 FR4 4 毫英寸带状线
长度 3m 的 30 美制电线标准 (AWG) 电缆
•
•
•
•
•
集成型终端
加电后,TUSB501 在 TX 对上定期执行接收器检测。
如果它检测到一个超高速 USB 接收器,RX 端接被启
用,TUSB501 为转接驱动做好准备。
小型 2mm × 2mm 四方扁平无引线 (QFN) 封装
可选接收器均衡、发射器去加重和输出摆动
支持热插拔
接收器均衡器具有三个由引脚 EQ 控制的增益设
置:3dB,6dB 和 9dB。 这应该在 TUSB501 之前根
据损耗量设定。 相似地,输出驱动器支持去加重和输
出摆动配置(引脚 DE 和 OS)。 这些设置使得
TUSB501 可被灵活地放置在超高速 USB 路径上,并
具有最优性能。
静电放电 (ESD) 保护 ±5kV 人体模型 (HBM)
应用范围
•
手机、计算机、扩展坞、电视、有源电缆、背板
EQ
DE OS
与之前几代产品相比,TUSB501 在全部链路状态下功
耗减少,一个更加强大的 OS 选项,经改进的接收器
均衡设置和一个智能 LFPS 控制器。 这个控制器感测
低频信号,并且自动禁用驱动器去加重,以实现 USB
3.0 兼容性。
RX+
TX+
TX-
Receiver/
Equalizer
Driver
RX-
3rd Generation
State Machine
LFPS
Controller
VCC
GND
TUSB501 被封装在小型 2mm x 2mm 四方扁平无引线
(QFN) 封装内,并在 –40°C 至 85°的工业用温度范围
内运行。
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
English Data Sheet: SLLSEG5
TUSB501
ZHCSBD9A –AUGUST 2013–REVISED AUGUST 2013
www.ti.com.cn
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
DRF PACKAGE
(TOP VIEW)
VCC
RXP
RXN
OS
1
2
3
4
8
7
6
5
DE
TXP
TXN
EQ
GND
PIN FUNCTIONS
PIN
TYPE
DESCRIPTION
NAME
RXP
RXN
TXN
NO.
2
Differential input pair for 5 Gbps SuperSpeed USB signals.
Differential output pair for 5 Gbps SuperSpeed USB signals.
3
Differential I/O
6
TXP
7
Sets the receiver equalizer gain. 3-state input with integrated pull-up and pull-
down resistors.
EQ
DE
OS
5
Sets the output de-emphasis gain. 3-state input with integrated pull-up and pull-
down resistors.
CMOS Input
Power
8
4
Sets the output swing (differential voltage amplitude). 2-state input with an
integrated pull-down resistor.
VCC
GND
1
3.3-V power supply
Reference ground
Thermal Pad
2
Copyright © 2013, Texas Instruments Incorporated
TUSB501
www.ti.com.cn
ZHCSBD9A –AUGUST 2013–REVISED AUGUST 2013
DEVICE CONFIGURATION
Table 1. Control Pin Effects (Typical Values)
PIN
DESCRIPTION
LOGIC STATE
Low
GAIN
3 dB
6 dB
9 dB
EQ
Equalization Amount
Floating
High
OUTPUT DIFFERENTIAL VOLTAGE
FOR THE TRANSITION BIT
PIN
DESCRIPTION
LOGIC STATE
Low
930 mVpp
Output Swing
Amplitude
OS
High
1300 mVpp
(1)
DE-EMPHASIS RATIO
PIN
DESCRIPTION
LOGIC STATE
FOR OS = LOW
0 dB
FOR OS = HIGH
–2.6 dB
Low
Floating
High
De-Emphasis
Amount
DE
–3.5 dB
–5.9 dB
–6.2 dB
–8.3 dB
(1) Typical values
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
–0.5
–0.5
–0.5
MAX
UNIT
(2)
Supply voltage range
VCC
4
4
V
V
V
Differential I/O
CMOS inputs
Voltage range at any input or output
terminal
VCC + 0.5
±5
(3)
Human body model (all pins)
Electrostatic discharge
kV
(4)
Charged-device model (all pins)
±1.5
Storage temperature, TSTG
–65
-40
150
°C
°C
Maximum junction temperature, TJ
105
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to the GND terminals.
(3) Tested in accordance with JEDEC Standard 22, Test Method A114-B.
(4) Tested in accordance with JEDEC Standard 22, Test Method C101-A.
THERMAL INFORMATION
TUSB501
THERMAL METRIC(1)
UNITS
DRF
102.4
90.3
21.2
70
θJA
Junction-to-ambient thermal resistance
θJC(top)
θJB
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
°C/W
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
ψJB
3.6
θJC(bottom)
70.2
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Copyright © 2013, Texas Instruments Incorporated
3
TUSB501
ZHCSBD9A –AUGUST 2013–REVISED AUGUST 2013
www.ti.com.cn
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN
3
NOM
MAX
UNIT
V
VCC
TA
Main power supply
3.3
3.6
85
Operating free-air temperature
AC coupling capacitor
–40
75
°C
CAC
100
200
nF
POWER SUPPLY CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP(1)
MAX(2)
UNIT
Link in U0 with SuperSpeed USB
data transmission, OS = Low
38.1
ICC-ACTIVE Average active current
mA
Link in U0 with SuperSpeed USB
data transmission, OS = High
43.8
65
Link has some activity, not in U0,
OS = Low
ICC-IDLE
ICC-U2U3
ICC-NC
Average current in idle state
Average current in U2/U3
29.8
6.1
mA
mA
mA
Link in U2 or U3
No SuperSpeed USB device is
connected to TXP, TXN
Average current with no connection
1.3
OS = Low
OS = High
126
145
PD
Power Dissipation in U0
mW
234
(1) TYP values use VCC = 3.3 V, TA = 25°C.
(2) MAX values use VCC = 3.6 V, TA = –40°C.
DC ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
0.6
UNIT
3-State CMOS Inputs (EQ, DE)
VIH
VIM
VIL
VF
High-level input voltage
Mid-level input voltage
Low-level input voltage
Floating voltage
2.8
V
V
VCC / 2
V
VIN = High impedance
VCC / 2
190
V
RPU
RPD
IIH
Internal pull-up resistance
Internal pull-down resistance
High-level input current
Low-level input current
kΩ
kΩ
µA
µA
190
VIN = 3.6 V
36
IIL
VIN = GND, VCC = 3.6 V
-36
2
2-State CMOS Input (OS)
VIH
VIL
VF
High-level input voltage
V
V
Low-level input voltage
Floating voltage
0.5
26
VIN = High impedance
GND
270
V
RPD
IIH
Internal pull-down resistance
High-level input current
Low-level input current
kΩ
µA
µA
VIN = 3.6 V
VIN = GND
IIL
-1
4
Copyright © 2013, Texas Instruments Incorporated
TUSB501
www.ti.com.cn
ZHCSBD9A –AUGUST 2013–REVISED AUGUST 2013
AC ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Differential Receiver (RXP, RXN)
Input differential voltage swing
AC-coupled differential peak-to-peak
signal
VDIFF-pp
VCM-RX
ZRX-DIFF
ZRX-CM
100
1200
mVpp
V
Common-mode voltage bias in the
receiver (DC)
3.3
Present after a SuperSpeed USB
device is detected on TXP/TXN
Differential input impedance (DC)
72
18
91
120
30
Ω
Ω
Common-mode input impedance
(DC)
Present after a SuperSpeed USB
device is detected on TXP, TXN
22.8
Present when no SuperSpeed USB
device is detected on TXP, TXN.
Measured over the range of 0-500
mV with respect to GND.
ZRX-HIGH-
IMP-DC-POS
Common-mode input impedance
with termination disabled (DC)
25
35
kΩ
VRX-LFPS-
DET-DIFF-pp
Low Frequency Periodic Signaling
(LFPS) Detect Threshold
Below the minimum is squelched
100
300
mVpp
Differential Transmitter (TXP, TXN)
OS = Low, No load
OS = High, No load
930
Transmitter differential voltage swing
(transition-bit)
VTX-DIFF-PP
mVpp
dB
1300
VTX-DE-
RATIO
CTX
Transmitter de-emphasis
DE = Floating, OS = Low
At 2.5 GHz
-3.5
TX input capacitance to GND
1.25
93
pF
ZTX-DIFF
ZTX-CM
ITX-SC
Differential impedance of the driver
75
125
31.25
60
Ω
Common-mode impedance of the
driver
Measured with respect to AC ground
over 0-500 mV
18.75
Ω
mA
V
TX short circuit current
TX ± shorted to GND
Common-mode voltage bias in the
transmitter (DC)
VCM-TX
1.2
0
2.5
AC common-mode voltage swing in
active mode
VCM-TX-AC
Within U0 and within LFPS
Tested with a high-pass filter
100
10
mVpp
mVpp
mV
VTX-IDLE-
DIFF -AC-pp
VTX-CM-
Differential voltage swing during
electrical idle
Absolute delta of DC CM voltage
during active and idle states
Restrict the test condition to meet
100 mV
100
12
DeltaU1-U0
VTX-idle-diff- DC electrical idle differential output
voltage
Voltage must be low pass filtered to
remove any AC component
0
mV
DC
Differential Transmitter (TXP, TXN)
Output rise, fall time
see Figure 4
20%-80% of differential voltage
measured 1 inch from the output pin
tR, tF
80
ps
ps
20%-80% of differential voltage
measured 1 inch from the output pin
tRF-MM
Output Rise, Fall time mismatch
20
De-emphasis = -3.5 dB propagation
delay between 50% level at input
and output
tdiff-LH
tdiff-HL
,
Differential propagation delay
see Figure 2
290
3.6
ps
ns
tidleEntry
tidleExit
,
Idle entry and exit times
see Figure 3
Copyright © 2013, Texas Instruments Incorporated
5
TUSB501
ZHCSBD9A –AUGUST 2013–REVISED AUGUST 2013
www.ti.com.cn
AC ELECTRICAL CHARACTERISTICS (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Timing
Apply 0 V to VCC, connect
Time from power applied until RX
termination
SuperSpeed USB termination to
TX±, apply 3.3 V to VCC, and
measure when ZRX-DIFF is enabled.
tREADY
9
ms
Jitter
TJTX-EYE
DJTX
(1) (2)
(3)
Total jitter
0.213
0.197
0.016
UI
EQ = Floating, OS = High,
DE = High
See Figure 1.
(2)
(3)
Deterministic jitter
UI
(2) (4)
(3)
RJTX
Random jitter
UI
(1) Includes RJ at 10-12
.
(2) Measured at the ends of reference channel in Figure 1 with K28.5 pattern, VID = 1000 mVpp, 5 Gbps, -3.5 dB de-emphasis from source.
(3) UI = 200 ps.
(4) Rj calculated as 14.069 times the RMS random jitter for 10-12 BER.
spacer
PARAMETER MEASUREMENT INFORMATION
Jitter
Measurement
A
TUSB501
AWG
Up to 3m
(30AWG)
1"-6"
24"
4"
Figure 1. Jitter Measurement Setup
spacer
IN
Tdiff_HL
Tdiff_LH
OUT
Figure 2. Propagation Delay
6
Copyright © 2013, Texas Instruments Incorporated
TUSB501
www.ti.com.cn
ZHCSBD9A –AUGUST 2013–REVISED AUGUST 2013
PARAMETER MEASUREMENT INFORMATION (continued)
IN+
Vcm
IN-
VRX-LFPS-DET-DIFF-pp
tidleExit
tidleEntry
OUT+
Vcm
OUT-
Figure 3. Electrical Idle Mode Exit and Entry Delay
spacer
80%
20%
tr
t
f
Figure 4. Output Rise and Fall Times
spacer
Transition
bit
Transition
bit
Consecutive bits
DE =0dB
Consecutive bits
415mV
DE =-3.5dB
DE =-6.2dB
VTX-DIFF-PP
0V
DE =-6.2dB
DE =-3.5dB
DE =0dB
-415mV
0ps
200ps
400ps
600ps
800ps
1000ps
1200ps
Figure 5. Transmitter Differential Voltage, OS = L
Copyright © 2013, Texas Instruments Incorporated
7
TUSB501
ZHCSBD9A –AUGUST 2013–REVISED AUGUST 2013
www.ti.com.cn
PARAMETER MEASUREMENT INFORMATION (continued)
Figure 6. Input for Typical Output Measurement at TUSB501 at TA = 25°C
8
Copyright © 2013, Texas Instruments Incorporated
TUSB501
www.ti.com.cn
ZHCSBD9A –AUGUST 2013–REVISED AUGUST 2013
PARAMETER MEASUREMENT INFORMATION (continued)
Figure 7. Typical Output Eye for Jitter Measurement Setup in Figure 1
at TA = 25°C, DE = HIGH, OS = HIGH, EQ = NC
Copyright © 2013, Texas Instruments Incorporated
9
TUSB501
ZHCSBD9A –AUGUST 2013–REVISED AUGUST 2013
www.ti.com.cn
REVISION HISTORY
Changes from Original (August 2013) to Revision A
Page
•
Changed 从产品预览改为生产数据 ....................................................................................................................................... 1
10
Copyright © 2013, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TUSB501DRFR
ACTIVE
WSON
DRF
8
3000 RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 85
T501
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
28-Jul-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TUSB501DRFR
WSON
DRF
8
3000
180.0
8.4
2.3
2.3
1.15
4.0
8.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
28-Jul-2019
*All dimensions are nominal
Device
Package Type Package Drawing Pins
WSON DRF
SPQ
Length (mm) Width (mm) Height (mm)
210.0 185.0 35.0
TUSB501DRFR
8
3000
Pack Materials-Page 2
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