TUSB551RWBR [TI]
具有 1.8V 电源的 USB 3.0 单通道转接驱动器 | RWB | 12 | -40 to 85;
| 型号： | TUSB551RWBR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有 1.8V 电源的 USB 3.0 单通道转接驱动器 | RWB | 12 | -40 to 85 驱动 驱动器 |
| 文件： | 总23页 (文件大小：1481K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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TUSB551
ZHCSC54A –MARCH 2014–REVISED MARCH 2014
TUSB551 1.8V USB 3.0 单通道转接驱动器，具有均衡功能
1 特性
3 说明
1
•
由 1.8V 电源供电运行的 USB 3.0 超高速
(SuperSpeed) 转接驱动器
TUSB551 是一款第四代 USB 3.0 SuperSpeed (SS)
转接驱动器，此转接驱动器特有低功耗 1.8V 电源，出
色输出驱动性能，以及针对完全 USB3.0 兼容性的自
动 LFPS 去加重控制。 此转接驱动器在均衡器中提供
可选增益设置，以解决通道损耗问题。 这些设置由
EQ 端子控制。 为了补偿下行传输线路损耗，此输出
驱动器支持去加重和输出摆动（端子 DE 和 OS）。
这些设置可实现最佳性能、增加信号传输距离，以及在
SuperSpeed USB 路径上灵活放置 TUSB551。
•
超低功率架构：
–
–
–
有源时：< 130mW
U2/U3：< 22mW
无连接时 < 8mW
•
最优接收器均衡：
3/6/9dB
–
•
•
出色的驱动性能
自动低频率周期信号 (LFPS) 去加重控制，以满足
USB 3.0 技术规格要求
器件信息
订货编号
封装
封装尺寸
•
•
•
•
•
对主机/器件端没有要求
小封装选项
TUSB551RWBR
X2QFN (12)
1.6mm x 1.6mm
支持热插拔
静电放电 (ESD) 保护超过 ±4kV 人体模型 (HBM)
-40°C 至 85°C 工业温度范围
2 应用范围
•
•
•
•
•
•
手机
平板电脑
扩展坞
电视
通电的线缆
背板
4 简化电路原理图
1
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
English Data Sheet: SLLSEJ1
TUSB551
ZHCSC54A –MARCH 2014–REVISED MARCH 2014
www.ti.com.cn
目录
1
2
3
4
5
6
7
特性.......................................................................... 1
应用范围................................................................... 1
说明.......................................................................... 1
简化电路原理图........................................................ 1
修订历史记录 ........................................................... 2
Terminal Configuration and Functions................ 3
Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4
7.2 Handling Ratings....................................................... 4
7.3 Recommended Operating Conditions....................... 4
7.4 Thermal Information.................................................. 4
7.5 Power Supply Electrical Characteristics ................... 5
7.6 DC Electrical Characteristics .................................... 5
7.7 AC Electrical Characteristics..................................... 5
7.8 Timing Requirements/Timing Diagrams.................... 6
7.9 Switching Characteristics.......................................... 8
7.10 Typical Characteristics............................................ 8
8
9
Detailed Description .............................................. 9
8.1 Overview ................................................................... 9
8.2 Functional Block Diagram ......................................... 9
8.3 Feature Description................................................... 9
8.4 Device Functional Modes........................................ 10
Applications and Implementation ...................... 11
9.1 Application Information............................................ 11
9.2 Typical Application .................................................. 11
10 Power Supply Recommendations ..................... 13
11 Layout................................................................... 13
11.1 Layout Guidelines ................................................. 13
11.2 Layout Example .................................................... 14
12 器件和文档支持 ..................................................... 15
12.1 Trademarks........................................................... 15
12.2 Electrostatic Discharge Caution............................ 15
12.3 Glossary................................................................ 15
13 机械封装和可订购信息 .......................................... 15
5 修订历史记录
Changes from Original (March 2014) to Revision A
Page
•
已更改 从产品预览更改为生产数据......................................................................................................................................... 1
2
版权 © 2014, Texas Instruments Incorporated
TUSB551
www.ti.com.cn
ZHCSC54A –MARCH 2014–REVISED MARCH 2014
6 Terminal Configuration and Functions
RWB Package
1.6 mm x 1.6 mm
(Top View)
GND VCC
RXP
RXN
NC
3
4
5
6
12 TXP
2
1
11 TXN
10 NC
7
8
OS
9
NC
EQ
DE
Terminal Functions
TERMINAL
I/O
DESCRIPTION
NAME
VCC
NO.
1
Power
GND
1.8 V Power Supply.
Ground.
GND
2
Differential
input
RXP
RXN
3
4
Differential input for 5Gbps SuperSpeed positive signals.
Differential
input
Differential input for 5Gbps SuperSpeed negative signals.
Not internally connected
NC
OS
EQ
5, 9, 10
6
7
CMOS Input Sets output swing on the TX. 2-state input with integrated pull-up and pull-down resistors.
CMOS Input Sets equalizer gain on the RX. 3-state input with integrated pull-up and pull-down resistors.
Sets output de-emphasis on the TX. 3-state input with integrated pull-up and pull-down
DE
8
CMOS Input
resistors.
Differential
TXN
TXP
11
12
Differential output for 5Gbps SuperSpeed negative signals.
output
Differential
Differential output for 5Gbps SuperSpeed positive signals.
output
Copyright © 2014, Texas Instruments Incorporated
3
TUSB551
ZHCSC54A –MARCH 2014–REVISED MARCH 2014
www.ti.com.cn
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
–0.3
–0.3
MAX
UNIT
VCC Supply voltage range
2.3
1.5
V
Differential I/O
Voltage range at any input or output terminal
CMOS Inputs
V
2.3
TJ
Maximum junction temperature
105
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 Handling Ratings
MIN
MAX UNIT
TSTG
ESD
Storage temperature
Electrostatic discharge
–65
150
±4
°C
kV
V
Human Body Model (all terminals)(1)
Charged-device model (all terminals)(2)
±1250
(1) Tested in accordance with JEDEC Standard 22, Test Method A114-B.
(2) Tested in accordance with JEDEC Standard 22, Test Method C101-A.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
1.62
–40
75
NOM
MAX
1.98
85
UNIT
V
VCC
TA
Main power supply
1.8
Operating free-air temperature
AC coupling capacitor
°C
CAC
100
200
nF
7.4 Thermal Information
TUSB551
THERMAL METRIC(1)
RWB PACKAGE
UNIT
12 TERMINALS
θJA
Junction-to-ambient thermal resistance(2)
Junction-to-case (top) thermal resistance(3)
Junction-to-board thermal resistance(4)
Junction-to-top characterization parameter(5)
Junction-to-board characterization parameter(6)
175.2
71.5
40.5
2.5
θJCtop
θJB
°C/W
ψJT
ψJB
40.5
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).
4
Copyright © 2014, Texas Instruments Incorporated
TUSB551
www.ti.com.cn
ZHCSC54A –MARCH 2014–REVISED MARCH 2014
7.5 Power Supply Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Link in U0 with SuperSpeed data
transmission; OS = Low; DE = Low
71.65
ICC-ACTIVE Average active current
mA
Link in U0 with SuperSpeed data
transmission; OS = Floating; DE =
Low
82.35
Link has some activity, not in U1;
OS = Low
ICC-IDLE
ICC-U2U3
ICC-NC
Average current in idle state
Average current in U2/U3
35
12.20
4.3
mA
mA
mA
Link in U2 or U3
No SuperSpeed device is connected
to TXP/TXN
Average current with no connection
7.6 DC Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
VCC * 0.2
26
UNIT
3-State CMOS Inputs (EQ, DE)
VIH
VIM
VIL
VF
High-level input voltage
Mid-level input voltage
Low-level input voltage
Floating voltage
VCC * 0.8
V
V
VCC / 2
V
VIN = High impedance
VCC / 2
105
V
RPU
RPD
IIH
Internal pull-up resistance
Internal pull-down resistance
High-level input current
Low-level input current
kΩ
kΩ
µA
µA
105
VIN = 1.98V
VIN = GND
IIL
–26
2-State CMOS Inputs (OS)
VIL
VIM
VF
Low-level input voltage
VCC * 0.8
V
V
Mid-level input voltage
Floating voltage
VCC/2
VCC/2
105
VIN = High Impedance
VIN = GND
V
RPD
IIM
Internal pull-down resistance
Mid-level input current
Low-level input current
Ω
26
µA
µA
IIL
-26
7.7 AC Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Differential Receiver (RXP, RXN)
VCM-RX
Common-mode voltage bias in the
receiver (DC)
0
91
24
V
Ω
Ω
Present after a SuperSpeed device
is detected on TXP/TXN
ZRX-DIFF
ZRX-CM
Differential input impedance (DC)
72
18
120
30
Common-mode input impedance
(DC)
Present after a SuperSpeed device
is detected on TXP/TXN
Present when no SuperSpeed
device is detected on TXP/TXN.
Measured over the range of 0-
500mV with respect to GND.
ZRX-HIGH-
IMP-DC-POS
Common-mode input impedance
with termination disabled (DC)
25
150
400
kΩ
VRX-LFPS-
DET-DIFF-PP
CRX
Low Frequency Periodic Signaling
(LFPS) detect threshold
Below the minimum is squelched.
100
300
mVpp
fF
RX input capacitance to GND
At 2.5GHz
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ZHCSC54A –MARCH 2014–REVISED MARCH 2014
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AC Electrical Characteristics (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Differential Transmitter (TXP, TXN)
OS = Low, DE=Low
1050
1200
Transmitter differential voltage swing
VTX-DIFF-PP
mVpp
mVpp
(transition-bit)(1)
OS = Floating, DE=Low
VTX-DIFF-
PP-LFPS
LFPS differential voltage swing
OS = Low, Floating
800
–3
1200
–4
DE = Low, OS = Floating
DE = Floating, OS = Floating
DE = High, OS = Floating
At 2.5GHz
0
–3.5
–6
VTX-DE-
RATIO
Transmitter de-emphasis
dB
CTX
TX input capacitance to GND
1.25
120
pF
ZTX-DIFF
Differential impedance of the driver
80
20
Ω
Common-mode impedance of the
driver
Measured with respect to AC ground
over 0-500mV
ZTX-CM
ITX-SC
30
60
Ω
mA
V
TX short circuit current
TX+/- shorted to GND
Common-mode voltage bias in the
transmitter (DC)
VCM-TX
0.6
0
0.8
AC common-mode voltage swing in
active mode
VCM-TX-AC
Within U0 and within LFPS
Tested with a high-pass filter
100
10
mVpp
mVpp
mV
VTX-IDLE-
DIFF -AC-PP
VTX-CM-
ΔU1-U0
Differential voltage swing during
electrical idle
Absolute delta of DC CM voltage
during active and idle states
100
10
VTX-IDLE-
DIFF-DC
DC electrical idle differential output
voltage
Voltage must be low pass filtered to
remove any AC component
0
mV
Voltage change to allow receiver
detect
Positive voltage to sense receiver
termination
Vdetect
600
mV
(1) VTX-DIFF-PP is measured at the TX output with no load and no trace.
7.8 Timing Requirements/Timing Diagrams
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Apply 0V to VCC, connect
Time from power applied until RX
termination
SuperSpeed termination to TX±,
apply 1.8V to VCC, and measure
when ZRX-DIFF is enabled.
tREADY
52
ms
Differential Transmitter (TXP, TXN)
20%-80% of differential voltage
tr, tf
Output rise/fall times (see Figure 3) measured 1 inch from the output
terminal
56
ps
ps
20%-80% of differential voltage
tRF-MM
Output rise/fall time mismatch
measured 1 inch from the output
terminal
2.6
6
Copyright © 2014, Texas Instruments Incorporated
TUSB551
www.ti.com.cn
ZHCSC54A –MARCH 2014–REVISED MARCH 2014
IN
Tdiff_HL
Tdiff_LH
OUT
Figure 1. Propagation Delay Timing
IN+
VEID_TH
Vcm
IN-
tidleExit
tidleEntry
OUT+
Vcm
OUT-
Figure 2. Electrical Idle Mode Exit and Entry Delay Timing
80%
20%
tr
tf
Figure 3. Output Rise and Fall Times
Copyright © 2014, Texas Instruments Incorporated
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TUSB551
ZHCSC54A –MARCH 2014–REVISED MARCH 2014
www.ti.com.cn
7.9 Switching Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Differential Transmitter (TXP, TXN)
De-Emphasis = –3.5dB Propagation
delay between 50% level at input
and output
Tdiff-LH
Tdiff-HL
,
Differential propagation delay times
(see Figure 1)
278
6
ps
ns
tidleEntry
tidleExit
,
Idle entry and exit times (see
Figure 2)
7.10 Typical Characteristics
Figure 5. After Re-Driver EQ(3dB), Input = 12”,
Output = 4”+3m Cable
Figure 4. No Re-Driver, Trace Length = 16”+3m Cable
Figure 7. After Re-Driver EQ(6dB), Input = 20”,
Output = 4”+3m Cable
Figure 6. No Re-Driver, Trace Length = 24”+3m Cable
Figure 9. After Re-Driver De = 3.5dB, EQ = 3dB, Input = 16",
Output = 20"+3m Cable
Figure 8. No Re-Driver, Trace Length = 36"+3m Cable
8
Copyright © 2014, Texas Instruments Incorporated
TUSB551
www.ti.com.cn
ZHCSC54A –MARCH 2014–REVISED MARCH 2014
8 Detailed Description
8.1 Overview
When 5Gbps SuperSpeed USB signals travel across a PCB or cable, signal integrity degrades due to loss and
inter-symbol interference. The TUSB551 recovers incoming data by applying equalization that compensates for
channel loss, and drives out signals with a high differential voltage. This extends the possible channel length,
and enables systems to pass USB 3.0 compliance.
The TUSB551 advanced state machine makes it transparent to hosts and devices. After power up, the TUSB551
periodically performs receiver detection on the TX pair. If it detects a SuperSpeed USB receiver, the RX
termination is enabled, and the TUSB551 is ready to re-drive.
The device’s ultra low-power architecture operates at a 1.8V power supply and achieves enhanced performance.
The receiver equalizer has three gain settings that are controlled by terminal EQ: 3 dB, 6 dB, and 9 dB. The
equalization should be set based on amount of insertion loss in the channel before the TUSB551. Likewise, the
output driver supports configuration of De-Emphasis and Output Swing (terminals DE and OS). The automatic
LFPS De-Emphasis control further enables the system to be USB3.0 compliant.
The TUSB551 operates over the industrial temperature range of -40ºC to 85ºC in the 1.6mm x 1.6mm X2QFN
package.
8.2 Functional Block Diagram
EQ
DE OS
Driver
RX+
RX-
TX+
TX-
Receiver
/
Equalizer
VCC
GND
Advanced
State Machine
LFPS
Controller
8.3 Feature Description
8.3.1 Receiver Equalization
The purpose of receiver equalization is to compensate for channel insertion loss and inter-symbol interference in
the system before the input of the TUSB551. The receiver overcomes these losses by attenuating the low
frequency components of the signals with respect to the high frequency components. The proper gain setting
should be selected to match the channel insertion loss before the input of the TUSB551.
8.3.2 De-Emphasis Control and Output Swing
The differential driver output provides selectable de-emphasis and output swing control in order to achieve
USB3.0 compliance. The TUSB551 offers a unique way to adjust output de-emphasis and transmitter swing
based on the OS and DE terminals. The level of de-emphasis required in the system depends on the channel
length after the output of the re-driver.
Copyright © 2014, Texas Instruments Incorporated
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ZHCSC54A –MARCH 2014–REVISED MARCH 2014
www.ti.com.cn
Feature Description (continued)
Figure 10. Transmitter Differential Voltage, OS=Floating
8.3.3 Automatic LFPS Detection
The TUSB551 features an intelligent low frequency periodic signaling (LFPS) controller. The controller senses
the low frequency signals and automatically disables the driver de-emphasis, for full USB3.0 compliance.
8.4 Device Functional Modes
8.4.1 Receiver Equalization Settings
TERMINAL
DESCRIPTION
LOGIC STATE
Low
GAIN
3 dB
6 dB
9 dB
EQ
Equalization amount
Floating (NC)
High
8.4.2 De-Emphasis Control Settings
DE-EMPHASIS RATIO
TERMINAL
INTERNAL TIE
LOGIC STATE
FOR OS = LOW
FOR OS = FLOATING
Low
Floating (NC)
High
0 dB
-2 dB
-4 dB
0 dB
-3.5 dB
-6 dB
DE
De-emphasis amount
8.4.3 Output Swing Control Settings
TERMINAL
INTERNAL TIE
LOGIC STATE
OUTPUT DIFFERENTIAL VOLTAGE
1050 mVpp
Low
Output swing amplitude,
DE = Low
OS
Floating (NC)
1200 mVpp
10
Copyright © 2014, Texas Instruments Incorporated
TUSB551
www.ti.com.cn
ZHCSC54A –MARCH 2014–REVISED MARCH 2014
9 Applications and Implementation
9.1 Application Information
One example of the TUSB551 used in a Host application on transmit and receive channels is shown below. The
re-driver is needed on the transmit path to pass transmitter compliance due to loss between the Host and
connector. The re-driver uses it’s equalization to recover the insertion loss and re-drive the signal with boosted
swing down the remaining channel, through the USB3.0 cable, and into the device PCB. Additionally, the
TUSB551 is needed on the receive channel for the Host to pass receiver jitter tolerance. The re-driver recovers
the loss from the Device PCB, connector, and USB 3.0 cable and re-drives the signal going into the Host
receiver. The equalization, output swing, and de-emphasis settings are dependent upon the type of USB3.0
signal path and end application.
Figure 11. Application for Host Systems
9.2 Typical Application
9.2.1 Transmit and Receive Channels
The TUSB551 is placed in the transmitter channel and connected to a USB3 Type-A connector. This particular
example shows the polarity swapped on the RXP/N and TXP/N differential pairs. The positive signal may be
routed to RXN as long as the corresponding output, TXN, is routed to the positive terminal on the connector
(SSTXP). This allows routing to be done without crossing the differential pair signals and using extra vias. The
EQ and DE terminals must be pulled up, pulled down, or left floating depending on the amount of equalization or
de-emphasis that is desired. The OS terminal must be pulled down or left floating depending on the required
output swing. In this example, the EQ terminal is pulled low through a resistor and the OS and DE terminals are
left floating.
Figure 12. Transmitter Channel Implementation with Differential Pair Polarity Swapped
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ZHCSC54A –MARCH 2014–REVISED MARCH 2014
www.ti.com.cn
Typical Application (continued)
The TUSB551 is placed in the receiver channel and connected to a USB3 Type-A connector. This example
shows the polarity matched, and the TUSB551 footprint is rotated so the trace routing of the differential pairs will
not overlap. The EQ and DE terminals must be pulled up, pulled down, or left floating depending on the amount
of equalization or de-emphasis that is desired. The OS terminal must be pulled down or left floating depending
on the required output swing. In this example, the EQ and OS terminals are left floating and the DE terminal is
pulled up through a resistor.
Figure 13. Receive Channel Implementation
9.2.1.1 Design Requirements
DESIGN PARAMETER
Input Voltage Range
Output Voltage Range
Equalization
EXAMPLE VALUE
100 mV to 1200 mV
1050 mV to 1200 mV
3, 6, 9 dB
De-Emphasis
0, –3.5, –6 dB (OS Floating)
1.8 V nominal supply
VCC
9.2.1.2 Detailed Design Procedure
To begin the design process, determine the following:
•
•
•
Equalization (EQ) setting
De-Emphasis (DE) setting
Output Swing Amplitude (OS) setting
The equalization should be set based on the insertion loss in the pre-channel (channel before the TUSB551
device). The input voltage to the device is able to have a large range because of the receiver sensitivity and the
available EQ settings. The EQ terminal can be pulled high through a resistor to VCC, low through a resistor to
ground, or left floating. The application schematic above shows the implementation. See Device Functional
Modes section for EQ values.
The De-Emphasis setting should be set based on the length and characteristics of the post channel (channel
after the TUSB551 device). Output de-emphasis can be tailored using the DE terminal. This terminal should be
pulled high through a resistor to VCC, low through a resistor to ground, or left floating. The application schematic
above shows the implementation. See Device Functional Modes section for DE values.
12
Copyright © 2014, Texas Instruments Incorporated
TUSB551
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ZHCSC54A –MARCH 2014–REVISED MARCH 2014
The output swing setting can also be configured based on the amplitude needed to pass the compliance test.
This setting will also be based on the length of interconnect or cable the TUSB551 is driving. This terminal
should be pulled low through a resistor to ground or left floating. The application schematic above shows the
implementation. See Device Functional Modes section for OS values.
9.2.1.3 Application Performance Plot
Figure 14. TX Compliance Test with TUSB551 EQ = 3dB OS = 1050mV DE = 0dB
10 Power Supply Recommendations
This device is designed to operate with a 1.8V supply. If using a higher voltage system power supply such as
VBUS, a voltage regulator can be used to step down to 1.8V. Decoupling capacitors may be used to reduce
noise and improve power supply integrity.
11 Layout
11.1 Layout Guidelines
•
The 100nF capacitors on the TXP and SSTXN nets should be placed close to the USB connector (Type A,
Type B, and so forth).
•
The ESD and EMI protection devices (if used) should also be placed as close as possible to the USB
connector.
•
•
Place voltage regulators as far away as possible from the differential pairs.
In general, the large bulk capacitors associated with each power rail should be placed as close as possible to
the voltage regulators.
•
•
It is recommended that small decoupling capacitors for the 1.8V power rail be placed close to the TUSB551
as shown below.
The SuperSpeed differential pair traces for RXP/N and TXP/N must be designed with a characteristic
impedance of 90Ω ±10%. The PCB stack-up and materials will determine the width and spacing needed for a
characteristic impedance of 90Ω.
•
•
The SuperSpeed differential pair traces should be routed parallel to each other as much as possible. It is
recommended the traces be symmetrical.
In order to minimize cross talk, it is recommended to keep high speed signals away from each other. Each
pair should be separated by at least 5 times the signal trace width. Separating with ground will also help
Copyright © 2014, Texas Instruments Incorporated
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Layout Guidelines (continued)
minimize cross talk.
•
•
•
Route all differential pairs on the same layer adjacent to a solid ground plane.
Do not route differential pairs over any plane split.
Adding test points will cause impedance discontinuity and will therefore negatively impact signal performance.
If test points are used, they should be placed in series and symmetrically. They must not be placed in a
manner that causes stub on the differential pair.
•
•
Avoid 90 degree turns in traces. The use of bends in differential traces should be kept to a minimum. When
bends are used, the number of left and right bends should be as equal as possible and the angle of the bend
should be ≥ 135 degrees. This will minimize any length mismatch caused by the bends and therefore
minimize the impact bends have on EMI.
Match the etch lengths of the differential pair traces. There should be less than 5 mils difference between a
SS differential pair signal and its complement. The USB 2.0 differential pairs should not exceed 50 mils
relative trace length difference.
•
•
The etch lengths of the differential pair groups do not need to match (i.e. the length of the RXP/N pair to that
of the TXP/N pair), but all trace lengths should be minimized.
Minimize the use of vias in the differential pair paths as much as possible. If this is not practical, make sure
that the same via type and placement are used for both signals in a pair. Any vias used should be placed as
close as possible to the TUSB551 device.
•
•
To ease routing, the polarity of the SS differential pairs can be swapped. This means that TXP can be routed
to TXN or RXN can be routed to RXP.
Do not place power fuses across the differential pair traces.
11.2 Layout Example
Figure 15. TUSB551 PCB Layout Example
14
Copyright © 2014, Texas Instruments Incorporated
TUSB551
www.ti.com.cn
ZHCSC54A –MARCH 2014–REVISED MARCH 2014
12 器件和文档支持
12.1 Trademarks
All trademarks are the property of their respective owners.
12.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.3 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms and definitions.
13 机械封装和可订购信息
以下页中包括机械封装和可订购信息。 这些信息是针对指定器件可提供的最新数据。 这些数据会在无通知且不对
本文档进行修订的情况下发生改变。 要获得这份数据表的浏览器版本，请查阅左侧的导航栏。
Copyright © 2014, Texas Instruments Incorporated
15
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Copyright © 2014, 德州仪器半导体技术（上海）有限公司
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TUSB551RWBR
ACTIVE
X2QFN
RWB
12
3000 RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 85
51
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
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TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2021
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TUSB551RWBR
X2QFN
RWB
12
3000
180.0
8.4
1.8
1.8
0.61
4.0
8.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2021
*All dimensions are nominal
Device
Package Type Package Drawing Pins
X2QFN RWB 12
SPQ
Length (mm) Width (mm) Height (mm)
213.0 191.0 35.0
TUSB551RWBR
3000
Pack Materials-Page 2
PACKAGE OUTLINE
RWB0012A
X2QFN - 0.4 mm max height
SCALE 6.500
PLASTIC QUAD FLATPACK - NO LEAD
1.65
1.55
B
A
PIN 1 INDEX AREA
1.65
1.55
C
0.4 MAX
SEATING PLANE
0.05 C
2X 1.2
SYMM
(0.13)
TYP
0.05
0.00
6X 0.4
3
6
2
1
7
8
SYMM
2X
0.4
0.4
8X
0.2
12
9
0.25
0.15
12X
0.6
4X
0.4
0.07
0.05
C B A
C
4221631/B 07/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
RWB0012A
X2QFN - 0.4 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(1.3)
6X (0.4)
9
12
4X (0.7)
2X (0.4)
1
8
SYMM
(1.5)
7
2
8X (0.5)
3
6
SYMM
(R0.05) TYP
12X (0.2)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:30X
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
METAL
SOLDER MASK
OPENING
EXPOSED METAL
EXPOSED METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4221631/B 07/2017
NOTES: (continued)
3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).
www.ti.com
EXAMPLE STENCIL DESIGN
RWB0012A
X2QFN - 0.4 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(1.3)
6X (0.4)
12
9
4X (0.67)
2X (0.4)
1
2
8
SYMM
(1.5)
7
8X
METAL
8X (0.5)
3
6
(R0.05) TYP
SYMM
12X (0.2)
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
PADS 1,2,7 & 8
96% PRINTED SOLDER COVERAGE BY AREA
SCALE:50X
4221631/B 07/2017
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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