TVS3300DRVR [TI]
33V 平缓钳位浪涌保护器件 | DRV | 6 | -40 to 125;
| 型号： | TVS3300DRVR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 33V 平缓钳位浪涌保护器件 | DRV | 6 | -40 to 125 |
| 文件： | 总27页 (文件大小：2363K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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TVS3300
ZHCSFZ9C –FEBRUARY 2017–REVISED FEBRUARY 2018
TVS3300 33V 平缓钳位浪涌保护器件
1 特性
3 说明
1
•
保护特性符合针对工业信号线路的 1kV、42Ω IEC
TVS3300 可将高达 35A 的 IEC 61000-4-5 故障电流进
61000-4-5 浪涌测试要求
行可靠分流，以保护系统免受高功率瞬态冲击或雷击。
该器件为满足常见的工业信号线路 EMC 要求提供了解
决方案，可通过 42Ω 电阻进行耦合的方式承受最高
1kV IEC 61000-4-5 开路电压。TVS3300 使用独特的
反馈机制确保在故障期间发挥精确的平缓钳位能力，保
证系统接触电压低于 40V。精确的电压调节允许设计
人员放心地选择具有较低电压容差的系统组件，不但减
少了系统成本和复杂度，而且不损害可靠性。
•
•
•
•
35A、8/20µs 浪涌电流下的最大钳位电压为 40V
关态电压：33V
微型 1.1mm2 WCSP 和 4mm2 SON 封装
在 125°C 时，可耐受超过 4,000 次的 30A 8/20µs
浪涌电流的重复冲击
•
强大的浪涌保护
–
–
IEC61000-4-5 (8/20µs)：35A
IEC61643-321 (10/1000µs)：4A
此外，TVS3300 还采用 1mm × 1.1mm WCSP 和
2mm × 2mm SON 封装，非常适用于空间受限的 应
用，与业内标准的 SMA 和 SMB 封装相比，尺寸减小
高达 90%。极低的器件泄露电流和电容确保最大限度
地降低了对受保护线路的影响。为了确保在产品的整个
寿命期间提供可靠保护，TI 在高温环境下对 TVS3300
进行了 4000 次重复浪涌冲击测试，但器件性能未发生
任何变化。
•
低泄漏电流
–
–
27°C 下为 19nA（典型值）
85°C 下为 28nA（典型值）
•
•
低电容：130pF
集成 4 级 IEC 61000-4-2 ESD 保护
2 应用
•
•
•
•
•
•
•
工业传感器
PLC I/O 模块
24V 电源线或数字开关线
4/20mA 环路
电器
TVS3300 是 TI 的平缓钳位系列浪涌器件中的一款产
品。有关该系列的其他器件的更多信息，请参阅器件比
较表
设备信息(1)
医疗设备
器件型号
TVS3300
封装
WCSP (4)
SON (6)
封装尺寸（标称值）
1.062mm × 1.116mm
2.00mm × 2.00mm
电机驱动器
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
封装比较
对 8/20µs 浪涌事件的电压钳位响应
10
20
30
Time (ꢀs)
Traditional TVS
TI Flat-Clamp
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SLVSDO2
TVS3300
ZHCSFZ9C –FEBRUARY 2017–REVISED FEBRUARY 2018
www.ti.com.cn
目录
8.4 Reliability Testing...................................................... 9
8.5 Device Functional Modes ......................................... 9
Application and Implementation ........................ 11
9.1 Application Information............................................ 11
9.2 Typical Application ................................................. 11
1
2
3
4
5
6
7
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Device Comparison Table..................................... 3
Pin Configuration and Functions......................... 4
Specifications......................................................... 5
7.1 Absolute Maximum Ratings ...................................... 5
7.2 ESD Ratings - JEDEC .............................................. 5
7.3 ESD Ratings - IEC .................................................... 5
7.4 Recommended Operating Conditions....................... 5
7.5 Thermal Information.................................................. 5
7.6 Electrical Characteristics........................................... 6
7.7 Typical Characteristics.............................................. 7
Detailed Description .............................................. 9
8.1 Overview ................................................................... 9
8.2 Functional Block Diagram ......................................... 9
8.3 Feature Description................................................... 9
9
10 Power Supply Recommendations ..................... 12
11 Layout................................................................... 13
11.1 Layout Guidelines ................................................. 13
11.2 Layout Example .................................................... 13
12 器件和文档支持 ..................................................... 15
12.1 文档支持................................................................ 15
12.2 接收文档更新通知 ................................................. 15
12.3 社区资源................................................................ 15
12.4 商标....................................................................... 15
12.5 静电放电警告......................................................... 15
12.6 Glossary................................................................ 15
13 机械、封装和可订购信息....................................... 15
8
4 修订历史记录
Changes from Revision B (April 2017) to Revision C
Page
•
修订数据表以符合其他 TVSxx00 系列器件的要求.................................................................................................................. 1
Changes from Revision A (March 2017) to Revision B
Page
•
Updated standard for (10/1000 μs) from IEC 61000-4-5 to IEC 61643-321 in the Absolute Maximum Ratings table .......... 5
Changes from Original (Feb 2017) to Revision A
Page
•
•
•
•
•
已添加 SON 封装选项............................................................................................................................................................. 1
已添加 在特性 部分中添加 ±11kV 接触放电 (SON) ................................................................................................................ 1
Added Peak pulse—clamping direction specs for SON package in the Absolute Maximum Ratings table........................... 5
Added IEC 61000-4-2 contact discharge spec for SON package in the ESD Ratings - IEC table ....................................... 5
Added TA = 27°C condition to dynamic resistance in the Electrical Characteristics table ..................................................... 5
2
Copyright © 2017–2018, Texas Instruments Incorporated
TVS3300
www.ti.com.cn
ZHCSFZ9C –FEBRUARY 2017–REVISED FEBRUARY 2018
5 Device Comparison Table
Vrwm leakage
(nA)
Device
Vrwm
Vclamp at Ipp
Ipp (8/20 µs)
Package Options
Polarity
TVS0500
TVS1400
TVS1800
TVS2200
TVS2700
TVS3300
5
9.2
18.4
22.8
27.7
32.5
38
43
43
40
40
40
35
0.07
2
SON
SON
Unidirectional
Unidirectional
Unidirectional
Unidirectional
Unidirectional
Unidirectional
14
18
22
27
33
0.5
3.2
1.7
19
SON
SON
SON
WCSP, SON
Copyright © 2017–2018, Texas Instruments Incorporated
3
TVS3300
ZHCSFZ9C –FEBRUARY 2017–REVISED FEBRUARY 2018
www.ti.com.cn
6 Pin Configuration and Functions
YZF Package
4-Pin WCSP
Top View
DRV Package
6-Pin SON
Top View
1
2
1
2
3
6
5
4
GND
GND
IN
IN
IN
GND
IN
GND
IN
A
B
GND
GND
Pin Functions
PIN
TYPE
DESCRIPTION
NAME
YZF
DRV
4, 5, 6
IN
B1, B2
I
ESD and surge protected channel
Ground
1, 2, 3, exposed
thermal pad
GND
A1, A2
GND
4
Copyright © 2017–2018, Texas Instruments Incorporated
TVS3300
www.ti.com.cn
ZHCSFZ9C –FEBRUARY 2017–REVISED FEBRUARY 2018
7 Specifications
7.1 Absolute Maximum Ratings
TA = 27℃ (unless otherwise noted)(1)
MIN
MAX
35
UNIT
A
IEC 61000-4-5 Current (8/20 µs)
IEC 61000-4-5 Power (8/20 µs)
1330
4
W
A
IEC 61643-321 Current (10/1000 µs) - WCSP
Maximum
Surge
IEC 61643-321 Power (10/1000 µs) - WCSP
IEC 61643-321 Current (10/1000 µs) - DRV
IEC 61643-321 Power (10/1000 µs) - DRV
IEC 61000-4-5 Current (8/20 µs)
IEC 61000-4-5 Power (8/20 µs)
IEC 61643-321 Current (10/1000 µs)
IEC 61643-321 Power (10/1000 µs)
IEC 61000-4-4 EFT Protection
150
3.5
125
50
W
A
W
A
80
W
A
Maximum
Forward Surge
23
60
W
A
EFT
IBR
IF
80
DC Breakdown Current - DRV
10
mA
mA
°C
°C
DC Forward Current
500
125
150
TA
Ambient Operating Temperature
Storage Temperature
-40
-65
Tstg
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings - JEDEC
VALUE
UNIT
Human body model (HBM), per
±2000
ANSI/ESDA/JEDEC JS-001, all pins(1)
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per JEDEC
specification JESD22-C101, all pins(2)
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 ESD Ratings - IEC
VALUE
UNIT
IEC 61000-4-2 contact discharge
IEC 61000-4-2 air-gap discharge
±11
±30
V(ESD)
Electrostatic discharge
kV
7.4 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
PARAMETER
MIN
NOM
MAX
UNIT
VRWM
Reverse Stand-off Voltage
33
V
7.5 Thermal Information
TVS3300
THERMAL METRIC(1)
YZF (WCSP)
DRV (SON)
UNIT
4 PINS
173.8
1.7
6 PINS
70.4
RqJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
°C/W
°C/W
RqJC(top)
73.7
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
Copyright © 2017–2018, Texas Instruments Incorporated
5
TVS3300
ZHCSFZ9C –FEBRUARY 2017–REVISED FEBRUARY 2018
www.ti.com.cn
Thermal Information (continued)
TVS3300
THERMAL METRIC(1)
YZF (WCSP)
4 PINS
47.1
DRV (SON)
6 PINS
40
UNIT
RqJB
YJT
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
9.5
2.2
YJB
47.1
40.3
RqJC(bot)
N/A
11
7.6 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
19
MAX
UNIT
nA
nA
V
Measured at VIN = VRWM, TA = 27°C
Measured at VIN = VRWM, TA = 85°C
IIN = 1 mA from GND to IO
150
600
0.65
39
ILEAK
Leakage Current
28
VF
Forward Voltage
0.25
34
0.5
35.8
VBR
Break-down Voltage
IIN = 1 mA from IO to GND
V
35 A IEC 61000-4-5 Surge (8/20 µs)
from GND to IO, 27°C
VFCLAMP Forward Clamp Voltage
1
34
34
2
5
V
15 A IEC 61000-4-5 Surge (8/20 µs)
from IO to GND, VIN = 0 V before surge,
27°C
37
40
V
VCLAMP
Clamp Voltage
35 A IEC 61000-4-5 Surge (8/20 µs) from
IO to GND, VIN = 0 V before surge, 27°C
38
40
40
60
V
Calculated from VCLAMP at 15 A and 30
A surge current levels, 27°C
RDYN
8/20 µs surge dynamic resistance
mΩ
VIN = 12 V, f = 1 MHz, 30 mVpp, IO to
GND
CIN
SR
Input pin capacitance
Maximum Slew Rate
110
130
2.5
150
pF
0-VRWM rising edge, sweep rise time and
measure slew rate when IPEAK = 1 mA,
27°C
V/µs
0-VRWM rising edge, sweep rise time and
measure slew rate when IPEAK = 1 mA,
105°C
0.7
V/µs
6
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TVS3300
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ZHCSFZ9C –FEBRUARY 2017–REVISED FEBRUARY 2018
7.7 Typical Characteristics
40
40
35
30
25
20
15
10
5
Voltage
Current
Current
Voltage at -40èC
Voltage at 25èC
Voltage at 85èC
35
30
25
20
15
10
5
0
0
-50x10-6
-40x10-6
-30x10-6
Time (s)
-20x10-6
-10x10-6
0x100
100x10-6
200x10-6
Time (s)
300x10-6
400x10-6
D001
D006
图 1. 8/20 µs Surge Response at 35 A
图 2. 8/20 µs Surge Response at 35 A Across Temperature
100x10-9
180
160
140
120
100
80
90x10-9
80x10-9
70x10-9
60x10-9
50x10-9
40x10-9
30x10-9
20x10-9
10x10-9
0x100
60
Vbias = 5 V
Vbias = 12 V
Vbias = 20 V
Vbias = 25 V
Vbias = 33 V
40
20
0
-40
-20
0
20
40
60
80
100
-60
-40
-20
0
20
40
60
80
100 120
Temperature (èC)
Temperature (èC)
Fig3
D004
f = 1 MHz, 30 mVpp, IO to GND
图 3. Capacitance vs Temperature Across Bias
图 4. Leakage Current vs Temperature at 33 V
1.5x10-3
1x10-3
0.7
0.6
0.5
0.4
0.3
0.2
0.1
500x10-6
0x100
-500x10-6
-1x10-3
TA = -40èC
TA = 25èC
TA = 85èC
-1.5x10-3
0
-40
-2
3
8
13
18
23
28
33
38
-20
0
20
40
60
80
100 120 140
Voltage (V)
D005
Temperature (°C)
D006
图 5. I/V Curve Across Temperature
图 6. Forward Voltage vs Temperature
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TVS3300
ZHCSFZ9C –FEBRUARY 2017–REVISED FEBRUARY 2018
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Typical Characteristics (接下页)
35
40
36
32
28
24
20
16
12
8
34.8
34.6
34.4
34.2
34
4
33.8
0
-40
-60
-40
-20
0
20
40
60
80
100
-20
0
20
40
60
80
100 120 140
Temperature (èC)
Fig2
Temperature (èC)
D016
图 7. Breakdown Voltage (1 mA) vs Temperature
图 8. Max Surge Current (8/20 µs) vs Temperature
100
Leakage (-40èC)
Leakage (25èC)
Leakage (85èC)
Leakage (105èC)
Leakage (125èC)
90
80
70
60
50
40
30
20
10
0
0
0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7
3
Slew Rate (V/ms)
D009
图 9. Dynamic Leakage vs Signal Slew Rate across Temperature
8
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TVS3300
www.ti.com.cn
ZHCSFZ9C –FEBRUARY 2017–REVISED FEBRUARY 2018
8 Detailed Description
8.1 Overview
The TVS3300 is a precision clamp with a low, flat clamping voltage during transient overvoltage events like surge
and protecting the system with zero voltage overshoot.
8.2 Functional Block Diagram
IN
Voltage Level
Detection
Power FET
Driver
GND
Copyright © 2017, Texas Instruments Incorporated
8.3 Feature Description
The TVS3300 is a precision clamp that handles 35 A of IEC 61000-4-5 8/20 µs surge pulse. The flat clamping
feature helps keep the clamping voltage very low to keep the downstream circuits from being stressed. The flat
clamping feature can also help end-equipment designers save cost by opening up the possibility to use lower-
cost, lower voltage tolerant downstream ICs. The TVS3300 has minimal leakage under the standoff voltage of 33
V, making it an ideal candidate for applications where low leakage and power dissipation is a necessity. IEC
61000-4-2 and IEC 61000-4-4 ratings make it a robust protection solution for ESD and EFT events. Wide
ambient temperature range of –40°C to +125°C a good candidate for most applications. Compact packages
enable it to be used in small devices and save board area.
8.4 Reliability Testing
To ensure device reliability, the TVS3300 is characterized against 4000 repetitive pulses of 30 A IEC 61000-4-5
8/20 µs surge pulses at 125°C. The test is performed with less than 10 seconds between each pulse at high
temperature to simulate worst case scenarios for fault regulation. After each surge pulse, the TVS3300 clamping
voltage, breakdown voltage, and leakage are recorded to ensure that their is no variation or performance
degradation. By ensuring robust, reliable, high temperature protection, the TVS3300 enables fault protection in
applications that must withstand years of continuous operation with no performance change.
8.5 Device Functional Modes
8.5.1 Protection Specifications
The TVS3300 is specified according to both the IEC 61000-4-5 and IEC 61643-321 standards. This enables
usage in systems regardless of which standard is required in relevant product standards or best matches
measured fault conditions. The IEC 61000-4-5 standards requires protection against a pulse with a rise time of 8
µs and a half length of 20 µs, while the IEC 61643-321 standard requires protection against a much longer pulse
with a rise time of 10 µs and a half length of 1000 µs.
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TVS3300
ZHCSFZ9C –FEBRUARY 2017–REVISED FEBRUARY 2018
www.ti.com.cn
Device Functional Modes (接下页)
The positive and negative surges are imposed to the TVS3300 by a combinational waveform generator (CWG)
with a 2-Ω coupling resistor at different peak voltage levels. For powered on transient tests that need power
supply bias, inductances are usually used to decouple the transient stress and protect the power supply. The
TVS3300 is post tested by assuring that there is no shift in device breakdown or leakage at Vrwm
.
In addition, the TVS3300 has been tested according to IEC 61000-4-5 to pass a ±1 kV surge test through a 42-Ω
coupling resistor and a 0.5 µF capacitor. This test is a common test requirement for industrial signal I/O lines and
the TVS3300 will serve an ideal protection solution for applications with that requirement.
The TVS3300 allow integrates IEC 61000-4-2 level 4 ESD Protection and 80 A of IEC 61000-4-4 EFT Protection.
These combine to ensure that the device can protect against most transient conditions regardless of length or
type.
For more information on TI's test methods for Surge, ESD, and EFT testing, reference TI's IEC 61000-4-x
Testing Application Note
8.5.2 Minimal Derating
Unlike traditional diodes the TVS3300 has very little derating of max power dissipation and ensures robust
performance up to 125°C, shown in 图 8. Traditional TVS diodes lose up to 50% of their current carrying
capability when at high temperatures, so a surge pulse above 85°C ambient can cause failures that are not seen
at room temperature. The TVS3300 prevents this and ensures that you will see the same level of protection
regardless of temperature.
8.5.3 Transient Performance
During large transient swings, the TVS3300 will begin clamping the input signal to protect downstream
conditions. While this prevents damage during fault conditions, it can cause leakage when the intended input
signal has a fast slew rate. In order to keep power dissipation low and remove the chance of signal distortion, it
is recommended to keep the slew rate of any input signal on the TVS3300 below 2.5 V/µs at room temperature
and below 0.7 V/µs at 125°C shown in 图 9. Faster slew rates will cause the device to clamp the input signal and
draw current through the device for a few microseconds, increasing the rise time of the signal. This will not cause
any harm to the system or to the device, however if the fast input voltage swings occur regularly it can cause
device overheating.
10
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TVS3300
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ZHCSFZ9C –FEBRUARY 2017–REVISED FEBRUARY 2018
9 Application and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The TVS3300 can be used to protect any power, analog, or digital signal from transient fault conditions caused
by the environment or other electrical components.
9.2 Typical Application
图 10. TVS3300 Application Schematic
9.2.1 Design Requirements
A typical operation for the TVS3300 would be protecting an analog output module on a PLC similar to 图 10. In
this example, the TVS3300 is protecting a 4-20 mA transmitter that uses the XTR115, a standard transmitter that
has a nominal voltage of 24 V and a maximum input voltage of 40 V. Most industrial interfaces such as this
require protection against ±1 kV surge test through a 42-Ω coupling resistor and a 0.5 µF capacitor, equaling
roughly 24 A of surge current. Without any input protection, if a surge event is caused by lightning, coupling,
ringing, or any other fault condition this input voltage will rise to hundreds of volts for multiple microseconds,
violating the absolute maximum input voltage and harming the device. An ideal surge protection diode will
maximize the useable voltage range while still clamping at a safe level for the system, TI's Flat-Clamp technology
provides the best protection solution.
9.2.2 Detailed Design Procedure
If the TVS3300 is in place to protect the device, during a surge event the voltage will rise to the breakdown of the
diode at 35.8 V, and then the TVS3300 will turn on, shunting the surge current to ground. With the low dynamic
resistance of the TVS3300, large amounts of surge current will have minimal impact on the clamping voltage.
The dynamic resistance of the TVS3300 is around 40 mΩ, which means 24 A of surge current will cause a
voltage raise of 24 A × 40 mΩ = 0.96 V. Because the device turns on at 35.8 V, this means the XTR115 input will
be exposed to a maximum of 35.8 V + 0.96 V = 36.76 V during surge pulses, well within the absolute maximum
input voltage. This ensures robust protection of your circuit.
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Typical Application (接下页)
The small size of the device also improves fault protection by lowering the effect of fault current coupling onto
neighboring traces. The small form factor of the TVS3300 allows the device to be placed extremely close to the
input connector, lowering the length of the path fault current will take through the system compared to larger
protection solutions.
Finally, the low leakage of the TVS3300 will have low input power losses. At 33 V, the device will see typical 19
nA leakage for a constant power dissipation of less than 100 µW, a small quantity that will minimally effect
overall efficiency metrics and heating concerns.
9.2.3 PLC Surge Protection Reference Design
For a detailed description of the TVS3300 advantages in a PLC Analog Input Module, reference TI's Surge
Protection Reference Design for PLC Analog Input Module This document describes the considerations and
performance of the TVS3300 in a common industrial application.
9.2.4 Configuration Options
The TVS3300 can be used in either unidirectional or bidirectional configuration. By placing two TVS3300's in
series with reverse orientation bidirectional operation can be used, allowing a working voltage of ±33 V. TVS3300
operation in bidirectional will be similar to unidirectional operation, with a minor increase in breakdown voltage
and clamping voltage. The TVS3300 bidirectional performance has been characterized in the TVS3300
Configurations Characterization.
10 Power Supply Recommendations
The TVS3300 is a clamping device so there is no need to power it. To ensure the device functions properly do
not violate the recommended VIN voltage range (0 V to 33 V) .
12
版权 © 2017–2018, Texas Instruments Incorporated
TVS3300
www.ti.com.cn
ZHCSFZ9C –FEBRUARY 2017–REVISED FEBRUARY 2018
11 Layout
11.1 Layout Guidelines
The optimum placement is close to the connector. EMI during an ESD event can couple from the trace being
struck to other nearby unprotected traces, resulting in early system failures. The PCB designer must minimize
the possibility of EMI coupling by keeping any unprotected traces away from the protected traces which are
between the TVS and the connector.
Route the protected traces straight.
Eliminate any sharp corners on the protected traces between the TVS3300 and the connector by using rounded
corners with the largest radii possible. Electric fields tend to build up on corners, increasing EMI coupling.
11.2 Layout Example
图 11. TVS3300 WCSP Layout
版权 © 2017–2018, Texas Instruments Incorporated
13
TVS3300
ZHCSFZ9C –FEBRUARY 2017–REVISED FEBRUARY 2018
www.ti.com.cn
Layout Example (接下页)
GND Plane
Protected
Input
Connector
Input
GND
图 12. TVS3300 SON Layout
14
版权 © 2017–2018, Texas Instruments Incorporated
TVS3300
www.ti.com.cn
ZHCSFZ9C –FEBRUARY 2017–REVISED FEBRUARY 2018
12 器件和文档支持
12.1 文档支持
12.1.1 相关文档
如需相关文档，请参阅：
•
•
•
•
平缓钳位 TVS 评估套件
适用于 PLC 模拟输入模块的浪涌保护参考设计
《TVS3300 评估模块用户指南》
《TVS3300DRV 评估模块用户指南》
12.2 接收文档更新通知
要接收文档更新通知，请导航至 TI.com 上的器件产品文件夹。请单击右上角的提醒我 进行注册，即可每周接收产
品信息更改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
12.3 社区资源
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范，
并且不一定反映 TI 的观点；请参阅 TI 的 《使用条款》。
TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在
e2e.ti.com 中，您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。
设计支持
TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。
12.4 商标
E2E is a trademark of Texas Instruments.
12.5 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更，恕不另行通知和修
订此文档。如欲获取此数据表的浏览器版本，请参阅左侧的导航。
版权 © 2017–2018, Texas Instruments Incorporated
15
PACKAGE OPTION ADDENDUM
www.ti.com
28-Sep-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TVS3300DRVR
TVS3300YZFR
ACTIVE
ACTIVE
WSON
DRV
YZF
6
4
3000 RoHS & Green
3000 RoHS & Green
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
17JH
15K
DSBGA
SNAGCU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
28-Sep-2021
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Feb-2018
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TVS3300DRVR
TVS3300YZFR
WSON
DRV
YZF
6
4
3000
3000
180.0
180.0
8.4
8.4
2.3
2.3
1.15
0.72
4.0
2.0
8.0
8.0
Q2
Q1
DSBGA
1.17
1.22
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Feb-2018
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TVS3300DRVR
TVS3300YZFR
WSON
DRV
YZF
6
4
3000
3000
210.0
182.0
185.0
182.0
35.0
20.0
DSBGA
Pack Materials-Page 2
GENERIC PACKAGE VIEW
DRV 6
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
Images above are just a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4206925/F
PACKAGE OUTLINE
DRV0006A
WSON - 0.8 mm max height
SCALE 5.500
PLASTIC SMALL OUTLINE - NO LEAD
2.1
1.9
A
B
PIN 1 INDEX AREA
2.1
1.9
0.8
0.7
C
SEATING PLANE
0.08 C
(0.2) TYP
0.05
0.00
1
0.1
EXPOSED
THERMAL PAD
3
4
6
2X
7
1.3
1.6 0.1
1
4X 0.65
0.35
0.25
6X
PIN 1 ID
(OPTIONAL)
0.3
0.2
6X
0.1
C A
C
B
0.05
4222173/B 04/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
DRV0006A
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
6X (0.45)
6X (0.3)
(1)
1
7
6
SYMM
(1.6)
(1.1)
4X (0.65)
4
3
SYMM
(1.95)
(R0.05) TYP
(
0.2) VIA
TYP
LAND PATTERN EXAMPLE
SCALE:25X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4222173/B 04/2018
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations are shown.
www.ti.com
EXAMPLE STENCIL DESIGN
DRV0006A
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
SYMM
7
6X (0.45)
METAL
1
6
6X (0.3)
(0.45)
SYMM
4X (0.65)
(0.7)
4
3
(R0.05) TYP
(1)
(1.95)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD #7
88% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:30X
4222173/B 04/2018
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
PACKAGE OUTLINE
YZF0004
DSBGA - 0.625 mm max height
SCALE 14.000
DIE SIZE BALL GRID ARRAY
A
B
E
BALL A1
CORNER
D
0.625 MAX
C
SEATING PLANE
0.05 C
BALL TYP
0.35
0.15
0.5
B
A
SYMM
0.5
D: Max = 1.146 mm, Min =1.086 mm
E: Max = 1.092 mm, Min =1.032 mm
1
2
0.35
0.25
SYMM
4X
0.015
C A B
4223221/A 08/2016
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
YZF0004
DSBGA - 0.625 mm max height
DIE SIZE BALL GRID ARRAY
(0.5)
4X ( 0.245)
1
2
A
B
SYMM
(0.5)
SYMM
LAND PATTERN EXAMPLE
SCALE:40X
0.05 MAX
0.05 MIN
(
0.245)
METAL
METAL UNDER
SOLDER MASK
(
0.245)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4223221/A 08/2016
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009).
www.ti.com
EXAMPLE STENCIL DESIGN
YZF0004
DSBGA - 0.625 mm max height
DIE SIZE BALL GRID ARRAY
(0.5) TYP
4X ( 0.25)
(R0.05) TYP
2
1
A
B
SYMM
(0.5) TYP
METAL
TYP
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:50X
4223221/A 08/2016
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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Copyright © 2022，德州仪器 (TI) 公司
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