TXB0106_10 [TI]

6-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTO-DIRECTION SENSING AND ±15-kV ESD PROTECTION; 具有自动方向感应的6位双向电压电平转换器和一个± 15 kV ESD保护
TXB0106_10
型号: TXB0106_10
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

6-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTO-DIRECTION SENSING AND ±15-kV ESD PROTECTION
具有自动方向感应的6位双向电压电平转换器和一个± 15 kV ESD保护

转换器 电平转换器
文件: 总19页 (文件大小:568K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TXB0106  
www.ti.com ......................................................................................................................................................................................... SCES709SEPTEMBER 2008  
6-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR  
WITH AUTO-DIRECTION SENSING AND ±15-kV ESD PROTECTION  
1
FEATURES  
PW PACKAGE  
(TOP VIEW)  
1.2 V to 3.6 V on A Port and 1.65 to 5.5 V on  
B Port (VCCAVCCB  
)
16  
15  
14  
13  
12  
11  
10  
9
1
2
3
4
5
6
7
8
A1  
B1  
V
VCC Isolation Feature – If Either VCC Input Is at  
GND, All Outputs Are in the High-Impedance  
State  
V
CCA  
A2  
CCB  
B2  
A3  
A4  
A5  
A6  
OE  
B3  
B4  
OE Input Circuit Referenced to VCCA  
B5  
Low Power Consumption, 4-µA Max ICC  
B6  
GND  
Ioff Supports Partial-Power-Down Mode  
Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
RGY PACKAGE  
(TOP VIEW)  
ESD Protection Exceeds JESD 22  
A Port  
1
16  
2500-V Human-Body Model (A114-B)  
V
V
CCB  
2
3
4
5
6
7
15  
14  
13  
12  
11  
10  
CCA  
150-V Machine Model (A115-A)  
A2  
A3  
A4  
A5  
A6  
B2  
B3  
B4  
B5  
B6  
1500-V Charged-Device Model (C101)  
Exposed  
Center Pad  
B Port  
±15-kV Human-Body Model (A114-B)  
150-V Machine Model (A115-A)  
8
9
1500-V Charged-Device Model (C101)  
The exposed center pad, if used, must be  
connected as a secondary ground or left  
electrically open.  
DESCRIPTION/ORDERING INFORMATION  
This 6-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to  
track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB  
accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation  
between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCA should not exceed VCCB  
.
When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.  
The TXB0106 is designed so that the OE input circuit is supplied by VCCA  
.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a  
pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2008, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
TXB0106  
SCES709SEPTEMBER 2008......................................................................................................................................................................................... www.ti.com  
ORDERING INFORMATION  
TA  
PACKAGE(1)(2)  
Reel of 1000  
Reel of 2000  
ORDERABLE PART NUMBER  
TXB0106RGYR  
TOP-SIDE MARKING  
YE06  
YE06  
QFN – RGY  
–40°C to 85°C  
TSSOP – PW  
TXB0106PWR  
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
website at www.ti.com.  
PIN DESCRIPTION  
NO.  
1
NAME  
A1  
FUNCTION  
Input/output 1. Referenced to VCCA  
.
2
VCCA  
A2  
A-port supply voltage. 1.2 V VCCA3.6 V, VCCAVCCB.  
3
Input/output 2. Referenced to VCCA  
Input/output 3. Referenced to VCCA  
Input/output 4. Referenced to VCCA  
Input/output 5. Referenced to VCCA  
Input/output 6. Referenced to VCCA  
.
.
.
.
.
4
A3  
5
A4  
6
A5  
7
A6  
Output enable. Pull OE low to place all outputs in 3-state mode.  
8
OE  
Referenced to VCCA  
.
9
GND  
B6  
Ground  
10  
11  
12  
13  
14  
15  
16  
Input/output 6. Referenced to VCCB  
Input/output 5. Referenced to VCCB  
Input/output 4. Referenced to VCCB  
Input/output 3. Referenced to VCCB  
Input/output 2. Referenced to VCCB  
.
.
.
.
.
B5  
B4  
B3  
B2  
VCCB  
B1  
B-port supply voltage. 1.65 V VCCB 5.5 V.  
Input/output 1. Referenced to VCCB  
.
TYPICAL OPERATING CIRCUIT  
1.8 V  
3.3 V  
V
CCB  
V
CCA  
OE  
TXB0106  
1.8 -V  
System  
Controller  
A1  
A2  
B1  
B2  
3.3-V  
System  
A3  
A4  
A5  
A6  
B3  
B4  
B5  
B6  
Data  
Data  
2
Submit Documentation Feedback  
Copyright © 2008, Texas Instruments Incorporated  
Product Folder Link(s): TXB0106  
TXB0106  
www.ti.com ......................................................................................................................................................................................... SCES709SEPTEMBER 2008  
ABSOLUTE MAXIMUM RATINGS(1)  
over operating free-air temperature range (unless otherwise noted)  
MIN  
–0.5  
–0.5  
–0.5  
–0.5  
MAX  
4.6  
UNIT  
VCCA  
VCCB  
VI  
Supply voltage range  
V
V
V
V
Supply voltage range  
Input voltage range(2)  
Voltage range applied to any output in the high-impedance or power-off state(2)  
6.5  
6.5  
VO  
6.5  
A inputs  
Voltage range applied to any output in the high or low state(2)(3)  
B inputs  
–0.5 VCCA + 0.5  
VO  
V
–0.5 VCCB + 0.5  
IIK  
IOK  
IO  
Input clamp current  
VI < 0  
–50  
–50  
±50  
±100  
83  
mA  
mA  
mA  
mA  
Output clamp current  
VO < 0  
Continuous output current  
Continuous current through VCCA, VCCB, or GND  
PW package(4)  
RGY package(5)  
Package thermal impedance  
Storage temperature range  
°C/W  
°C  
JA  
37  
Tstg  
–65  
150  
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating  
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.  
(3) The value of VCCA and VCCB are provided in the recommended operating conditions table.  
(4) The package thermal impedance is calculated in accordance with JESD 51-7.  
(5) The package thermal impedance is calculated in accordance with JESD 51-5.  
RECOMMENDED OPERATING CONDITIONS(1)(2)  
VCCA  
VCCB  
MIN  
MAX UNIT  
VCCA  
VCCB  
1.2  
3.6  
V
Supply voltage  
1.65  
5.5  
Data inputs  
OE  
VCCI× 0.65(3)  
VCCI  
VIH  
VIL  
High-level input voltage  
Low-level input voltage  
1.2 V to 3.6 V  
1.65 V to 5.5 V  
1.65 V to 5.5 V  
V
VCCA× 0.65  
5.5  
Data inputs  
OE  
1.2 V to 5.5 V  
1.2 V to 3.6 V  
1.2 V to 3.6 V  
0
0
VCCI× 0.35(3)  
V
VCCA× 0.35  
40  
A-port inputs  
1.65 V to 5.5 V  
1.65 V to 3.6 V  
4.5 V to 5.5 V  
Input transition  
rise or fall rate  
Δt/Δv  
40 ns/V  
30  
B-port inputs  
1.2 V to 3.6 V  
TA  
Operating free-air temperature  
–40  
85  
°C  
(1) The A and B sides of an unused data I/O pair must be held in the same state, i.e., both at VCCI or both at GND.  
(2) VCCA must be less than or equal to VCCB and must not exceed 3.6 V.  
(3) VCCI is the supply voltage associated with the input port.  
Copyright © 2008, Texas Instruments Incorporated  
Submit Documentation Feedback  
3
Product Folder Link(s): TXB0106  
TXB0106  
SCES709SEPTEMBER 2008......................................................................................................................................................................................... www.ti.com  
ELECTRICAL CHARACTERISTICS(1)(2)  
over recommended operating free-air temperature range (unless otherwise noted)  
TA = 25°C  
TYP  
–40°C to 85°C  
TEST  
CONDITIONS  
PARAMETER  
VCCA  
VCCB  
UNIT  
V
MIN  
MAX  
MIN  
MAX  
1.2 V  
1.1  
VOHA  
IOH = –20 µA  
IOL = 20 µA  
1.4 V to 3.6 V  
1.2 V  
VCCA– 0.4  
0.9  
VOLA  
V
1.4 V to 3.6 V  
0.4  
VOHB  
VOLB  
II  
IOH = –20 µA  
IOL = 20 µA  
1.65 V to 5.5 V  
1.65 V to 5.5 V  
1.65 V to 5.5 V  
0 V to 5.5 V  
0 V  
VCCB– 0.4  
V
V
0.4  
±2  
±2  
±2  
±2  
OE  
1.2 V to 3.6 V  
0 V  
±1  
±1  
±1  
±1  
µA  
A port  
B port  
A or B port  
Ioff  
µA  
µA  
0 V to 3.6 V  
1.2 V to 3.6 V  
1.2 V  
IOZ  
OE = GND  
1.65 V to 5.5 V  
0.06  
3.4  
1.65 V to 5.5 V  
1.4 V to 3.6 V  
3.6 V  
5
2
2
VI = VCCI or GND,  
IO = 0  
ICCA  
µA  
µA  
0 V  
0 V  
5.5 V  
1.2 V  
1.65 V to 5.5 V  
1.4 V to 3.6 V  
3.6 V  
5
–2  
2
VI = VCCI or GND,  
IO = 0  
ICCB  
0 V  
0 V  
5.5 V  
1.2 V  
3.5  
VI = VCCI or GND,  
IO = 0  
ICCA + ICCB  
1.65 V to 5.5 V  
1.65 V to 5.5 V  
µA  
µA  
1.4 V to 3.6 V  
1.2 V  
10  
5
VI = VCCI or GND,  
IO = 0,  
OE = GND  
0.05  
ICCZA  
1.4 V to 3.6 V  
1.2 V  
VI = VCCI or GND,  
IO = 0,  
OE = GND  
3.3  
ICCZB  
1.65 V to 5.5 V  
µA  
1.4 V to 3.6 V  
1.2 V to 3.6 V  
5
CI  
OE  
1.65 V to 5.5 V  
1.65 V to 5.5 V  
5
5
8
5.5  
6.5  
10  
pF  
pF  
A port  
B port  
Cio  
1.2 V to 3.6 V  
(1) VCCI is the supply voltage associated with the input port.  
(2) VCCO is the supply voltage associated with the output port.  
TIMING REQUIREMENTS  
TA = 25°C, VCCA = 1.2 V  
VCCB = 1.8 V  
VCCB = 2.5 V  
VCCB = 3.3 V  
VCCB = 5 V  
UNIT  
TYP  
20  
TYP  
20  
TYP  
20  
TYP  
20  
Data rate  
Mbps  
ns  
tw  
Pulse duration  
Data inputs  
50  
50  
50  
50  
TIMING REQUIREMENTS  
over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted)  
VCCB = 1.8 V  
± 0.15 V  
VCCB = 2.5 V  
± 0.2 V  
VCCB = 3.3 V  
± 0.3 V  
VCCB = 5 V  
± 0.5 V  
UNIT  
MIN  
MAX  
MIN  
MAX  
MIN  
MAX  
MIN  
MAX  
Data rate  
50  
50  
50  
50 Mbps  
ns  
tw  
Pulse duration  
Data inputs  
20  
20  
20  
20  
4
Submit Documentation Feedback  
Copyright © 2008, Texas Instruments Incorporated  
Product Folder Link(s): TXB0106  
TXB0106  
www.ti.com ......................................................................................................................................................................................... SCES709SEPTEMBER 2008  
TIMING REQUIREMENTS  
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)  
VCCB = 1.8 V  
± 0.15 V  
VCCB = 2.5 V  
± 0.2 V  
VCCB = 3.3 V  
± 0.3 V  
VCCB = 5 V  
± 0.5 V  
UNIT  
MIN  
MAX  
MIN  
MAX  
MIN  
MAX  
MIN  
MAX  
Data rate  
52  
60  
60  
60 Mbps  
ns  
tw  
Pulse duration  
Data inputs  
19  
17  
17  
17  
TIMING REQUIREMENTS  
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)  
VCCB = 2.5 V  
± 0.2 V  
VCCB = 3.3 V  
± 0.3 V  
VCCB = 5 V  
± 0.5 V  
UNIT  
MIN  
MAX  
70  
MIN  
MAX  
100  
MIN  
MAX  
Data rate  
100 Mbps  
ns  
tw  
Pulse duration  
Data inputs  
14  
10  
10  
TIMING REQUIREMENTS  
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)  
VCCB = 3.3 V  
± 0.3 V  
VCCB = 5 V  
± 0.5 V  
UNIT  
MIN  
MAX  
100  
MIN  
MAX  
Data rate  
100  
Mbps  
ns  
tw  
Pulse duration  
Data inputs  
10  
10  
SWITCHING CHARACTERISTICS  
TA = 25°C, VCCA = 1.2 V  
VCCB = 1.8 V  
VCCB = 2.5 V  
VCCB = 3.3 V  
VCCB = 5 V  
FROM  
PARAMETER  
TO  
(OUTPUT)  
UNIT  
ns  
(INPUT)  
TYP  
9.5  
9.2  
1
TYP  
7.9  
8.8  
1
TYP  
7.6  
8.4  
1
TYP  
8.5  
8
A
B
A
A
B
A
B
tpd  
B
1
ten  
OE  
OE  
µs  
1
1
1
1
20  
20  
4.1  
5
17  
16  
4.4  
5
17  
15  
4.1  
5.1  
1.9  
20  
18  
15  
3.9  
5.1  
7
tdis  
ns  
trA, tfA  
trB, tfB  
A-port rise and fall times  
B-port rise and fall times  
Channel-to-channel skew  
ns  
ns  
tSK(O)  
2.4  
20  
1.7  
20  
ns  
Max data rate  
20  
Mbps  
Copyright © 2008, Texas Instruments Incorporated  
Submit Documentation Feedback  
5
Product Folder Link(s): TXB0106  
TXB0106  
SCES709SEPTEMBER 2008......................................................................................................................................................................................... www.ti.com  
SWITCHING CHARACTERISTICS  
over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted)  
VCCB = 1.8 V  
± 0.15 V  
VCCB = 2.5 V  
± 0.2 V  
VCCB = 3.3 V  
± 0.3 V  
VCCB = 5 V  
± 0.5 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
MIN  
1.4  
MAX  
12.9  
14.2  
1
MIN  
1.2  
MAX  
10.1  
12  
MIN  
1.1  
MAX  
10  
MIN  
0.8  
MAX  
A
B
B
A
A
B
A
B
9.9  
13.7  
1
tpd  
ten  
tdis  
ns  
µs  
ns  
0.9  
0.7  
0.4  
11.7  
1
0.3  
1
OE  
OE  
1
1
1
1
6.6  
6.6  
0.8  
1
33  
6.4  
5.8  
0.8  
0.7  
25.3  
25.6  
6.3  
4.9  
1.9  
6.1  
5.5  
0.8  
0.7  
23.1  
22.1  
6.3  
4.6  
1.6  
5.9  
5.6  
0.8  
0.6  
24.6  
20.6  
6.3  
4.6  
1.3  
35.6  
6.5  
7.3  
2.6  
trA, tfA  
trB, tfB  
A-port rise and fall times  
ns  
ns  
B-port rise and fall times  
Channel-to-channel skew  
tSK(O)  
ns  
Max data rate  
50  
50  
50  
50  
Mbps  
SWITCHING CHARACTERISTICS  
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)  
VCCB = 1.8 V  
± 0.15 V  
VCCB = 2.5 V  
± 0.2 V  
VCCB = 3.3 V  
± 0.3 V  
VCCB = 5 V  
± 0.5 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
MIN  
1.6  
MAX  
11  
MIN  
1.4  
MAX  
7.7  
8.4  
1
MIN  
1.3  
MAX  
6.8  
7.6  
1
MIN  
1.2  
MAX  
A
B
B
A
A
B
A
B
6.5  
7.1  
1
tpd  
ten  
tdis  
ns  
µs  
ns  
1.5  
12  
1.2  
0.8  
0.5  
1
OE  
OE  
1
1
1
1
5.9  
6.1  
0.7  
1
26.7  
33.9  
5.1  
7.3  
0.8  
5.6  
5.2  
0.7  
0.7  
21.6  
23.7  
5
5.4  
5
18.9  
19.9  
5
4.8  
5
18.7  
17.6  
5
trA, tfA  
trB, tfB  
A-port rise and fall times  
1
0.7  
0.6  
ns  
ns  
B-port rise and fall times  
Channel-to-channel skew  
5
0.7  
3.9  
0.6  
3.8  
0.6  
tSK(O)  
0.7  
ns  
Max data rate  
52  
60  
60  
60  
Mbps  
6
Submit Documentation Feedback  
Copyright © 2008, Texas Instruments Incorporated  
Product Folder Link(s): TXB0106  
TXB0106  
www.ti.com ......................................................................................................................................................................................... SCES709SEPTEMBER 2008  
SWITCHING CHARACTERISTICS  
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)  
VCCB = 2.5 V  
± 0.2 V  
VCCB = 3.3 V  
± 0.3 V  
VCCB = 5 V  
± 0.5 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
MIN  
1.1  
1
MAX  
MIN  
1
MAX  
MIN  
0.9  
MAX  
A
B
B
A
A
B
A
B
6.4  
7
5.3  
5.6  
1
4.7  
4.4  
1
tpd  
ten  
tdis  
ns  
µs  
ns  
0.6  
0.3  
1
OE  
OE  
1
1
1
5
4.8  
0.8  
0.6  
16.9  
21.8  
3.6  
4.9  
0.4  
4.9  
4.5  
0.6  
0.7  
15  
4.5  
4.4  
0.5  
0.6  
13.8  
15.2  
3.5  
3.2  
0.3  
17.9  
3.6  
3.9  
0.3  
trA, tfA  
trB, tfB  
A-port rise and fall times  
ns  
ns  
B-port rise and fall times  
Channel-to-channel skew  
tSK(O)  
ns  
Max data rate  
70  
100  
100  
Mbps  
SWITCHING CHARACTERISTICS  
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)  
VCCB = 3.3 V  
± 0.3 V  
VCCB = 5 V  
± 0.5 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
MIN  
0.9  
MAX  
MIN  
0.8  
MAX  
A
B
B
A
A
B
A
B
4.9  
5.4  
1
4
4
tpd  
ten  
tdis  
ns  
µs  
ns  
0.5  
0.2  
1
OE  
OE  
1
1
4.5  
4.1  
0.5  
0.7  
13.9  
17.3  
3
4.1  
4
12.4  
14.4  
3
trA, tfA  
trB, tfB  
A-port rise and fall times  
0.5  
0.6  
ns  
ns  
B-port rise and fall times  
Channel-to-channel skew  
3.9  
0.4  
3.2  
0.3  
tSK(O)  
ns  
Max data rate  
100  
100  
Mbps  
Copyright © 2008, Texas Instruments Incorporated  
Submit Documentation Feedback  
7
Product Folder Link(s): TXB0106  
TXB0106  
SCES709SEPTEMBER 2008......................................................................................................................................................................................... www.ti.com  
OPERATING CHARACTERISTICS  
TA = 25°C  
VCCA  
1.2 V  
5 V  
1.2 V  
1.8 V  
1.5 V  
1.8 V  
1.8 V  
VCCB  
2.5 V  
2.5 V  
2.5 V  
5 V  
3.3 V  
PARAMETER  
TEST CONDITIONS  
UNIT  
3.3 V  
to  
1.8 V  
5 V  
TYP  
TYP  
TYP  
TYP  
TYP  
TYP  
TYP  
A-port input, B-port output  
B-port input, A-port output  
A-port input, B-port output  
B-port input, A-port output  
A-port input, B-port output  
B-port input, A-port output  
A-port input, B-port output  
B-port input, A-port output  
9
12  
8
11  
7
11  
7
11  
7
11  
7
11  
8
11  
CL = 0, f = 10 MHz,  
tr = tf = 1 ns,  
OE = VCCA  
(outputs enabled)  
CpdA  
CpdB  
CpdA  
CpdB  
pF  
pF  
35  
26  
27  
27  
27  
27  
28  
26  
19  
18  
18  
18  
20  
21  
0.01  
0.01  
0.01  
0.01  
0.01  
0.01  
0.01  
0.01  
0.01  
0.01  
0.01  
0.01  
0.01  
0.01  
0.01  
0.01  
0.01  
0.01  
0.01  
0.01  
0.01  
0.01  
0.01  
0.01  
0.01  
0.01  
0.03  
0.03  
CL = 0, f = 10 MHz,  
tr = tf = 1 ns,  
OE = GND  
(outputs disabled)  
8
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Copyright © 2008, Texas Instruments Incorporated  
Product Folder Link(s): TXB0106  
TXB0106  
www.ti.com ......................................................................................................................................................................................... SCES709SEPTEMBER 2008  
PRINCIPLES OF OPERATION  
Applications  
The TXB0106 can be used in level-translation applications for interfacing devices or systems operating at  
different interface voltages with one another.  
Architecture  
The TXB0106 architecture (see Figure 1) does not require a direction-control signal to control the direction of  
data flow from A to B or from B to A. In a dc state, the output drivers of the TXB0106 can maintain a high or low,  
but are designed to be weak, so that they can be overdriven by an external driver when data on the bus starts  
flowing the opposite direction.  
The output one shots detect rising or falling edges on the A or B ports. During a rising edge, the one shot turns  
on the PMOS transistors (T1, T3) for a short duration, which speeds up the low-to-high transition. Similarly,  
during a falling edge, the one shot turns on the NMOS transistors (T2, T4) for a short duration, which speeds up  
the high-to-low transition. The typical output impedance during output transition is 70 at VCCO = 1.2 V to 1.8 V,  
50 at VCCO = 1.8 V to 3.3 V and 40 at VCCO = 3.3 V to 5 V.  
V
CCA  
V
CCB  
One  
T1  
Shot  
4k  
One  
T2  
Shot  
A
B
One  
T3  
Shot  
4k  
One  
T4  
Shot  
Figure 1. Architecture of TXB0106 I/O Cell  
Input Driver Requirements  
Typical IIN vs VIN characteristics of the TXB0106 are shown in Figure 2. For proper operation, the device driving  
the data I/Os of the TXB0106 must have drive strength of at least ±2 mA.  
Copyright © 2008, Texas Instruments Incorporated  
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9
Product Folder Link(s): TXB0106  
 
TXB0106  
SCES709SEPTEMBER 2008......................................................................................................................................................................................... www.ti.com  
I
IN  
V /4 k  
T
V
IN  
(V V )/4 k  
T
D
A. VT is the input threshold voltage of the TXB0106 (typically VCCI/ 2).  
B. VD is the supply voltage of the external driver.  
Figure 2. Typical IIN vs VIN Curve  
Power Up  
During operation, ensure that VCCA VCCB at all times. During power-up sequencing, VCCA VCCB does not  
damage the device, so any power supply can be ramped up first. The TXB0106 has circuitry that disables all  
output ports when either VCC is switched off (VCCA/B = 0 V).  
Enable and Disable  
The TXB0106 has an OE input that is used to disable the device by setting OE = low, which places all I/Os in the  
high-impedance (Hi-Z) state. The disable time (tdis) indicates the delay between when OE goes low and when the  
outputs actually get disabled (Hi-Z). The enable time (ten) indicates the amount of time the user must allow for the  
one-shot circuitry to become operational after OE is taken high.  
Pullup or Pulldown Resistors on I/O Lines  
The TXB0106 is designed to drive capacitive loads of up to 70 pF. The output drivers of the TXB0106 have low  
dc drive strength. If pullup or pulldown resistors are connected externally to the data I/Os, their values must be  
kept higher than 50 kto ensure that they do not contend with the output drivers of the TXB0106.  
For the same reason, the TXB0106 should not be used in applications such as I2C or 1-Wire where an  
open-drain driver is connected on the bidirectional data I/O. For these applications, use a device from the TI  
TXS01xx series of level translators.  
10  
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Copyright © 2008, Texas Instruments Incorporated  
Product Folder Link(s): TXB0106  
TXB0106  
www.ti.com ......................................................................................................................................................................................... SCES709SEPTEMBER 2008  
PARAMETER MEASUREMENT INFORMATION  
2 × V  
CCO  
S1  
50 kW  
Open  
From Output  
Under Test  
From Output  
Under Test  
15 pF  
1 MW  
15 pF  
50 kW  
TEST  
/t  
S1  
2 × V  
LOAD CIRCUIT FOR  
ENABLE/DISABLE  
TIME MEASUREMENT  
LOAD CIRCUIT FOR MAX DATA RATE,  
PULSE DURATION PROPAGATION  
DELAY OUTPUT RISE AND FALL TIME  
MEASUREMENT  
t
PZL PLZ  
CCO  
t
/t  
Open  
PHZ PZH  
V
CCI  
Input  
V
CCI  
/2  
V
CCI  
/2  
0 V  
t
t
PLH  
PHL  
t
w
V
V
OH  
0.9 y V  
CCO  
V
CCI  
Output  
V
/2  
V
/2  
CCO  
CCO  
0.1 y V  
CCO  
V
CCI  
/2  
V
CCI  
/2  
OL  
Input  
t
f
t
r
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
A. C includes probe and jig capacitance.  
L
B. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, Z = 50 , dv/dt 1 V/ns.  
O
C. The outputs are measured one at a time, with one transition per measurement.  
D.  
E.  
F.  
t
V
V
and t  
are the same as t .  
PLH  
PHL pd  
is the V associated with the input port.  
CC  
CCI  
is the V associated with the output port.  
CCO  
CC  
G. All parameters and waveforms are not applicable to all devices.  
Figure 3. Load Circuits and Voltage Waveforms  
Copyright © 2008, Texas Instruments Incorporated  
Submit Documentation Feedback  
11  
Product Folder Link(s): TXB0106  
PACKAGE OPTION ADDENDUM  
www.ti.com  
21-Dec-2009  
PACKAGING INFORMATION  
Orderable Device  
TXB0106PWR  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
TSSOP  
PW  
16  
16  
16  
16  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TXB0106PWRG4  
TXB0106RGYR  
TXB0106RGYRG4  
TSSOP  
VQFN  
VQFN  
PW  
RGY  
RGY  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF TXB0106 :  
Automotive: TXB0106-Q1  
NOTE: Qualified Version Definitions:  
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
30-Jul-2010  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
TXB0106PWR  
TXB0106RGYR  
TSSOP  
VQFN  
PW  
16  
16  
2000  
3000  
330.0  
330.0  
12.4  
12.4  
6.9  
3.8  
5.6  
4.3  
1.6  
1.5  
8.0  
8.0  
12.0  
12.0  
Q1  
Q1  
RGY  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
30-Jul-2010  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
TXB0106PWR  
TXB0106RGYR  
TSSOP  
VQFN  
PW  
16  
16  
2000  
3000  
346.0  
346.0  
346.0  
346.0  
29.0  
29.0  
RGY  
Pack Materials-Page 2  
MECHANICAL DATA  
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
9,80  
9,60  
A MAX  
A MIN  
7,70  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
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