TXB0106_10 [TI]
6-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTO-DIRECTION SENSING AND ±15-kV ESD PROTECTION; 具有自动方向感应的6位双向电压电平转换器和一个± 15 kV ESD保护型号: | TXB0106_10 |
厂家: | TEXAS INSTRUMENTS |
描述: | 6-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTO-DIRECTION SENSING AND ±15-kV ESD PROTECTION |
文件: | 总19页 (文件大小:568K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TXB0106
www.ti.com ......................................................................................................................................................................................... SCES709–SEPTEMBER 2008
6-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR
WITH AUTO-DIRECTION SENSING AND ±15-kV ESD PROTECTION
1
FEATURES
PW PACKAGE
(TOP VIEW)
•
1.2 V to 3.6 V on A Port and 1.65 to 5.5 V on
B Port (VCCA≤ VCCB
)
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
A1
B1
V
•
VCC Isolation Feature – If Either VCC Input Is at
GND, All Outputs Are in the High-Impedance
State
V
CCA
A2
CCB
B2
A3
A4
A5
A6
OE
B3
B4
•
•
•
OE Input Circuit Referenced to VCCA
B5
Low Power Consumption, 4-µA Max ICC
B6
GND
Ioff Supports Partial-Power-Down Mode
Operation
•
•
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
RGY PACKAGE
(TOP VIEW)
ESD Protection Exceeds JESD 22
–
A Port
1
16
–
–
–
2500-V Human-Body Model (A114-B)
V
V
CCB
2
3
4
5
6
7
15
14
13
12
11
10
CCA
150-V Machine Model (A115-A)
A2
A3
A4
A5
A6
B2
B3
B4
B5
B6
1500-V Charged-Device Model (C101)
Exposed
Center Pad
–
B Port
–
–
–
±15-kV Human-Body Model (A114-B)
150-V Machine Model (A115-A)
8
9
1500-V Charged-Device Model (C101)
The exposed center pad, if used, must be
connected as a secondary ground or left
electrically open.
DESCRIPTION/ORDERING INFORMATION
This 6-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to
track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB
accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation
between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCA should not exceed VCCB
.
When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.
The TXB0106 is designed so that the OE input circuit is supplied by VCCA
.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a
pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2008, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TXB0106
SCES709–SEPTEMBER 2008......................................................................................................................................................................................... www.ti.com
ORDERING INFORMATION
TA
PACKAGE(1)(2)
Reel of 1000
Reel of 2000
ORDERABLE PART NUMBER
TXB0106RGYR
TOP-SIDE MARKING
YE06
YE06
QFN – RGY
–40°C to 85°C
TSSOP – PW
TXB0106PWR
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
PIN DESCRIPTION
NO.
1
NAME
A1
FUNCTION
Input/output 1. Referenced to VCCA
.
2
VCCA
A2
A-port supply voltage. 1.2 V ≤ VCCA≤ 3.6 V, VCCA≤ VCCB.
3
Input/output 2. Referenced to VCCA
Input/output 3. Referenced to VCCA
Input/output 4. Referenced to VCCA
Input/output 5. Referenced to VCCA
Input/output 6. Referenced to VCCA
.
.
.
.
.
4
A3
5
A4
6
A5
7
A6
Output enable. Pull OE low to place all outputs in 3-state mode.
8
OE
Referenced to VCCA
.
9
GND
B6
Ground
10
11
12
13
14
15
16
Input/output 6. Referenced to VCCB
Input/output 5. Referenced to VCCB
Input/output 4. Referenced to VCCB
Input/output 3. Referenced to VCCB
Input/output 2. Referenced to VCCB
.
.
.
.
.
B5
B4
B3
B2
VCCB
B1
B-port supply voltage. 1.65 V ≤ VCCB ≤ 5.5 V.
Input/output 1. Referenced to VCCB
.
TYPICAL OPERATING CIRCUIT
1.8 V
3.3 V
V
CCB
V
CCA
OE
TXB0106
1.8 -V
System
Controller
A1
A2
B1
B2
3.3-V
System
A3
A4
A5
A6
B3
B4
B5
B6
Data
Data
2
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Product Folder Link(s): TXB0106
TXB0106
www.ti.com ......................................................................................................................................................................................... SCES709–SEPTEMBER 2008
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.5
–0.5
–0.5
–0.5
MAX
4.6
UNIT
VCCA
VCCB
VI
Supply voltage range
V
V
V
V
Supply voltage range
Input voltage range(2)
Voltage range applied to any output in the high-impedance or power-off state(2)
6.5
6.5
VO
6.5
A inputs
Voltage range applied to any output in the high or low state(2)(3)
B inputs
–0.5 VCCA + 0.5
VO
V
–0.5 VCCB + 0.5
IIK
IOK
IO
Input clamp current
VI < 0
–50
–50
±50
±100
83
mA
mA
mA
mA
Output clamp current
VO < 0
Continuous output current
Continuous current through VCCA, VCCB, or GND
PW package(4)
RGY package(5)
Package thermal impedance
Storage temperature range
°C/W
°C
JA
37
Tstg
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The value of VCCA and VCCB are provided in the recommended operating conditions table.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
(5) The package thermal impedance is calculated in accordance with JESD 51-5.
RECOMMENDED OPERATING CONDITIONS(1)(2)
VCCA
VCCB
MIN
MAX UNIT
VCCA
VCCB
1.2
3.6
V
Supply voltage
1.65
5.5
Data inputs
OE
VCCI× 0.65(3)
VCCI
VIH
VIL
High-level input voltage
Low-level input voltage
1.2 V to 3.6 V
1.65 V to 5.5 V
1.65 V to 5.5 V
V
VCCA× 0.65
5.5
Data inputs
OE
1.2 V to 5.5 V
1.2 V to 3.6 V
1.2 V to 3.6 V
0
0
VCCI× 0.35(3)
V
VCCA× 0.35
40
A-port inputs
1.65 V to 5.5 V
1.65 V to 3.6 V
4.5 V to 5.5 V
Input transition
rise or fall rate
Δt/Δv
40 ns/V
30
B-port inputs
1.2 V to 3.6 V
TA
Operating free-air temperature
–40
85
°C
(1) The A and B sides of an unused data I/O pair must be held in the same state, i.e., both at VCCI or both at GND.
(2) VCCA must be less than or equal to VCCB and must not exceed 3.6 V.
(3) VCCI is the supply voltage associated with the input port.
Copyright © 2008, Texas Instruments Incorporated
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TXB0106
SCES709–SEPTEMBER 2008......................................................................................................................................................................................... www.ti.com
ELECTRICAL CHARACTERISTICS(1)(2)
over recommended operating free-air temperature range (unless otherwise noted)
TA = 25°C
TYP
–40°C to 85°C
TEST
CONDITIONS
PARAMETER
VCCA
VCCB
UNIT
V
MIN
MAX
MIN
MAX
1.2 V
1.1
VOHA
IOH = –20 µA
IOL = 20 µA
1.4 V to 3.6 V
1.2 V
VCCA– 0.4
0.9
VOLA
V
1.4 V to 3.6 V
0.4
VOHB
VOLB
II
IOH = –20 µA
IOL = 20 µA
1.65 V to 5.5 V
1.65 V to 5.5 V
1.65 V to 5.5 V
0 V to 5.5 V
0 V
VCCB– 0.4
V
V
0.4
±2
±2
±2
±2
OE
1.2 V to 3.6 V
0 V
±1
±1
±1
±1
µA
A port
B port
A or B port
Ioff
µA
µA
0 V to 3.6 V
1.2 V to 3.6 V
1.2 V
IOZ
OE = GND
1.65 V to 5.5 V
0.06
3.4
1.65 V to 5.5 V
1.4 V to 3.6 V
3.6 V
5
2
2
VI = VCCI or GND,
IO = 0
ICCA
µA
µA
0 V
0 V
5.5 V
1.2 V
1.65 V to 5.5 V
1.4 V to 3.6 V
3.6 V
5
–2
2
VI = VCCI or GND,
IO = 0
ICCB
0 V
0 V
5.5 V
1.2 V
3.5
VI = VCCI or GND,
IO = 0
ICCA + ICCB
1.65 V to 5.5 V
1.65 V to 5.5 V
µA
µA
1.4 V to 3.6 V
1.2 V
10
5
VI = VCCI or GND,
IO = 0,
OE = GND
0.05
ICCZA
1.4 V to 3.6 V
1.2 V
VI = VCCI or GND,
IO = 0,
OE = GND
3.3
ICCZB
1.65 V to 5.5 V
µA
1.4 V to 3.6 V
1.2 V to 3.6 V
5
CI
OE
1.65 V to 5.5 V
1.65 V to 5.5 V
5
5
8
5.5
6.5
10
pF
pF
A port
B port
Cio
1.2 V to 3.6 V
(1) VCCI is the supply voltage associated with the input port.
(2) VCCO is the supply voltage associated with the output port.
TIMING REQUIREMENTS
TA = 25°C, VCCA = 1.2 V
VCCB = 1.8 V
VCCB = 2.5 V
VCCB = 3.3 V
VCCB = 5 V
UNIT
TYP
20
TYP
20
TYP
20
TYP
20
Data rate
Mbps
ns
tw
Pulse duration
Data inputs
50
50
50
50
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted)
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
Data rate
50
50
50
50 Mbps
ns
tw
Pulse duration
Data inputs
20
20
20
20
4
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TXB0106
www.ti.com ......................................................................................................................................................................................... SCES709–SEPTEMBER 2008
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
Data rate
52
60
60
60 Mbps
ns
tw
Pulse duration
Data inputs
19
17
17
17
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
UNIT
MIN
MAX
70
MIN
MAX
100
MIN
MAX
Data rate
100 Mbps
ns
tw
Pulse duration
Data inputs
14
10
10
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
UNIT
MIN
MAX
100
MIN
MAX
Data rate
100
Mbps
ns
tw
Pulse duration
Data inputs
10
10
SWITCHING CHARACTERISTICS
TA = 25°C, VCCA = 1.2 V
VCCB = 1.8 V
VCCB = 2.5 V
VCCB = 3.3 V
VCCB = 5 V
FROM
PARAMETER
TO
(OUTPUT)
UNIT
ns
(INPUT)
TYP
9.5
9.2
1
TYP
7.9
8.8
1
TYP
7.6
8.4
1
TYP
8.5
8
A
B
A
A
B
A
B
tpd
B
1
ten
OE
OE
µs
1
1
1
1
20
20
4.1
5
17
16
4.4
5
17
15
4.1
5.1
1.9
20
18
15
3.9
5.1
7
tdis
ns
trA, tfA
trB, tfB
A-port rise and fall times
B-port rise and fall times
Channel-to-channel skew
ns
ns
tSK(O)
2.4
20
1.7
20
ns
Max data rate
20
Mbps
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TXB0106
SCES709–SEPTEMBER 2008......................................................................................................................................................................................... www.ti.com
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted)
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
1.4
MAX
12.9
14.2
1
MIN
1.2
MAX
10.1
12
MIN
1.1
MAX
10
MIN
0.8
MAX
A
B
B
A
A
B
A
B
9.9
13.7
1
tpd
ten
tdis
ns
µs
ns
0.9
0.7
0.4
11.7
1
0.3
1
OE
OE
1
1
1
1
6.6
6.6
0.8
1
33
6.4
5.8
0.8
0.7
25.3
25.6
6.3
4.9
1.9
6.1
5.5
0.8
0.7
23.1
22.1
6.3
4.6
1.6
5.9
5.6
0.8
0.6
24.6
20.6
6.3
4.6
1.3
35.6
6.5
7.3
2.6
trA, tfA
trB, tfB
A-port rise and fall times
ns
ns
B-port rise and fall times
Channel-to-channel skew
tSK(O)
ns
Max data rate
50
50
50
50
Mbps
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
1.6
MAX
11
MIN
1.4
MAX
7.7
8.4
1
MIN
1.3
MAX
6.8
7.6
1
MIN
1.2
MAX
A
B
B
A
A
B
A
B
6.5
7.1
1
tpd
ten
tdis
ns
µs
ns
1.5
12
1.2
0.8
0.5
1
OE
OE
1
1
1
1
5.9
6.1
0.7
1
26.7
33.9
5.1
7.3
0.8
5.6
5.2
0.7
0.7
21.6
23.7
5
5.4
5
18.9
19.9
5
4.8
5
18.7
17.6
5
trA, tfA
trB, tfB
A-port rise and fall times
1
0.7
0.6
ns
ns
B-port rise and fall times
Channel-to-channel skew
5
0.7
3.9
0.6
3.8
0.6
tSK(O)
0.7
ns
Max data rate
52
60
60
60
Mbps
6
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Product Folder Link(s): TXB0106
TXB0106
www.ti.com ......................................................................................................................................................................................... SCES709–SEPTEMBER 2008
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
1.1
1
MAX
MIN
1
MAX
MIN
0.9
MAX
A
B
B
A
A
B
A
B
6.4
7
5.3
5.6
1
4.7
4.4
1
tpd
ten
tdis
ns
µs
ns
0.6
0.3
1
OE
OE
1
1
1
5
4.8
0.8
0.6
16.9
21.8
3.6
4.9
0.4
4.9
4.5
0.6
0.7
15
4.5
4.4
0.5
0.6
13.8
15.2
3.5
3.2
0.3
17.9
3.6
3.9
0.3
trA, tfA
trB, tfB
A-port rise and fall times
ns
ns
B-port rise and fall times
Channel-to-channel skew
tSK(O)
ns
Max data rate
70
100
100
Mbps
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
0.9
MAX
MIN
0.8
MAX
A
B
B
A
A
B
A
B
4.9
5.4
1
4
4
tpd
ten
tdis
ns
µs
ns
0.5
0.2
1
OE
OE
1
1
4.5
4.1
0.5
0.7
13.9
17.3
3
4.1
4
12.4
14.4
3
trA, tfA
trB, tfB
A-port rise and fall times
0.5
0.6
ns
ns
B-port rise and fall times
Channel-to-channel skew
3.9
0.4
3.2
0.3
tSK(O)
ns
Max data rate
100
100
Mbps
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SCES709–SEPTEMBER 2008......................................................................................................................................................................................... www.ti.com
OPERATING CHARACTERISTICS
TA = 25°C
VCCA
1.2 V
5 V
1.2 V
1.8 V
1.5 V
1.8 V
1.8 V
VCCB
2.5 V
2.5 V
2.5 V
5 V
3.3 V
PARAMETER
TEST CONDITIONS
UNIT
3.3 V
to
1.8 V
5 V
TYP
TYP
TYP
TYP
TYP
TYP
TYP
A-port input, B-port output
B-port input, A-port output
A-port input, B-port output
B-port input, A-port output
A-port input, B-port output
B-port input, A-port output
A-port input, B-port output
B-port input, A-port output
9
12
8
11
7
11
7
11
7
11
7
11
8
11
CL = 0, f = 10 MHz,
tr = tf = 1 ns,
OE = VCCA
(outputs enabled)
CpdA
CpdB
CpdA
CpdB
pF
pF
35
26
27
27
27
27
28
26
19
18
18
18
20
21
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.03
0.03
CL = 0, f = 10 MHz,
tr = tf = 1 ns,
OE = GND
(outputs disabled)
8
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TXB0106
www.ti.com ......................................................................................................................................................................................... SCES709–SEPTEMBER 2008
PRINCIPLES OF OPERATION
Applications
The TXB0106 can be used in level-translation applications for interfacing devices or systems operating at
different interface voltages with one another.
Architecture
The TXB0106 architecture (see Figure 1) does not require a direction-control signal to control the direction of
data flow from A to B or from B to A. In a dc state, the output drivers of the TXB0106 can maintain a high or low,
but are designed to be weak, so that they can be overdriven by an external driver when data on the bus starts
flowing the opposite direction.
The output one shots detect rising or falling edges on the A or B ports. During a rising edge, the one shot turns
on the PMOS transistors (T1, T3) for a short duration, which speeds up the low-to-high transition. Similarly,
during a falling edge, the one shot turns on the NMOS transistors (T2, T4) for a short duration, which speeds up
the high-to-low transition. The typical output impedance during output transition is 70 Ω at VCCO = 1.2 V to 1.8 V,
50 Ω at VCCO = 1.8 V to 3.3 V and 40 Ω at VCCO = 3.3 V to 5 V.
V
CCA
V
CCB
One
T1
Shot
4k
One
T2
Shot
A
B
One
T3
Shot
4k
One
T4
Shot
Figure 1. Architecture of TXB0106 I/O Cell
Input Driver Requirements
Typical IIN vs VIN characteristics of the TXB0106 are shown in Figure 2. For proper operation, the device driving
the data I/Os of the TXB0106 must have drive strength of at least ±2 mA.
Copyright © 2008, Texas Instruments Incorporated
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Product Folder Link(s): TXB0106
TXB0106
SCES709–SEPTEMBER 2008......................................................................................................................................................................................... www.ti.com
I
IN
V /4 k
T
V
IN
–(V – V )/4 k
T
D
A. VT is the input threshold voltage of the TXB0106 (typically VCCI/ 2).
B. VD is the supply voltage of the external driver.
Figure 2. Typical IIN vs VIN Curve
Power Up
During operation, ensure that VCCA ≤ VCCB at all times. During power-up sequencing, VCCA ≥ VCCB does not
damage the device, so any power supply can be ramped up first. The TXB0106 has circuitry that disables all
output ports when either VCC is switched off (VCCA/B = 0 V).
Enable and Disable
The TXB0106 has an OE input that is used to disable the device by setting OE = low, which places all I/Os in the
high-impedance (Hi-Z) state. The disable time (tdis) indicates the delay between when OE goes low and when the
outputs actually get disabled (Hi-Z). The enable time (ten) indicates the amount of time the user must allow for the
one-shot circuitry to become operational after OE is taken high.
Pullup or Pulldown Resistors on I/O Lines
The TXB0106 is designed to drive capacitive loads of up to 70 pF. The output drivers of the TXB0106 have low
dc drive strength. If pullup or pulldown resistors are connected externally to the data I/Os, their values must be
kept higher than 50 kΩ to ensure that they do not contend with the output drivers of the TXB0106.
For the same reason, the TXB0106 should not be used in applications such as I2C or 1-Wire where an
open-drain driver is connected on the bidirectional data I/O. For these applications, use a device from the TI
TXS01xx series of level translators.
10
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Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TXB0106
TXB0106
www.ti.com ......................................................................................................................................................................................... SCES709–SEPTEMBER 2008
PARAMETER MEASUREMENT INFORMATION
2 × V
CCO
S1
50 kW
Open
From Output
Under Test
From Output
Under Test
15 pF
1 MW
15 pF
50 kW
TEST
/t
S1
2 × V
LOAD CIRCUIT FOR
ENABLE/DISABLE
TIME MEASUREMENT
LOAD CIRCUIT FOR MAX DATA RATE,
PULSE DURATION PROPAGATION
DELAY OUTPUT RISE AND FALL TIME
MEASUREMENT
t
PZL PLZ
CCO
t
/t
Open
PHZ PZH
V
CCI
Input
V
CCI
/2
V
CCI
/2
0 V
t
t
PLH
PHL
t
w
V
V
OH
0.9 y V
CCO
V
CCI
Output
V
/2
V
/2
CCO
CCO
0.1 y V
CCO
V
CCI
/2
V
CCI
/2
OL
Input
t
f
t
r
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
A. C includes probe and jig capacitance.
L
B. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, Z = 50 Ω, dv/dt ≥ 1 V/ns.
O
C. The outputs are measured one at a time, with one transition per measurement.
D.
E.
F.
t
V
V
and t
are the same as t .
PLH
PHL pd
is the V associated with the input port.
CC
CCI
is the V associated with the output port.
CCO
CC
G. All parameters and waveforms are not applicable to all devices.
Figure 3. Load Circuits and Voltage Waveforms
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Product Folder Link(s): TXB0106
PACKAGE OPTION ADDENDUM
www.ti.com
21-Dec-2009
PACKAGING INFORMATION
Orderable Device
TXB0106PWR
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TSSOP
PW
16
16
16
16
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TXB0106PWRG4
TXB0106RGYR
TXB0106RGYRG4
TSSOP
VQFN
VQFN
PW
RGY
RGY
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TXB0106 :
Automotive: TXB0106-Q1
•
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TXB0106PWR
TXB0106RGYR
TSSOP
VQFN
PW
16
16
2000
3000
330.0
330.0
12.4
12.4
6.9
3.8
5.6
4.3
1.6
1.5
8.0
8.0
12.0
12.0
Q1
Q1
RGY
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TXB0106PWR
TXB0106RGYR
TSSOP
VQFN
PW
16
16
2000
3000
346.0
346.0
346.0
346.0
29.0
29.0
RGY
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
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