TXB0304RUTR [TI]
4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTOMATIC DIRECTION SENSING; 具有自动方向感应4位双向电压电平转换
| 型号： | TXB0304RUTR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTOMATIC DIRECTION SENSING |
| 文件： | 总14页 (文件大小：614K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TXB0304
www.ti.com
SCES831C –SEPTEMBER 2011–REVISED MAY 2012
4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTOMATIC DIRECTION
SENSING
Check for Samples: TXB0304
1
FEATURES
DESCRIPTION
This 4-bit non-inverting translator uses two separate
configurable power-supply rails. The port is
•
Fully Symmetric Supply Voltages. 0.9 V to 3.6
V on A Port and 0.9 V to 3.6 V
A
•
VCC Isolation Feature – If Either VCC Input Is at
GND, All Outputs Are in the High-Impedance
State
designed to track VCCA. VCCA accepts any supply
voltage from 0.9 V to 3.6 V. The B port is designed to
track VCCB. VCCB accepts any supply voltage from 0.9
V to 3.6 V. This allows for low-voltage bidirectional
translation between 1-V, 1.2-V, 1.5-V, 1.8-V, 2.5-V
and 3.3-V voltage nodes. For the TXB0304, when the
output-enable (OE) input is low, all outputs are placed
in the high-impedance state. To ensure the high-
impedance state during power up or power down, OE
should be tied to GND through a pulldown resistor;
the minimum value of the resistor is determined by
the current-sourcing capability of the driver. The
TXB0304 is designed so that the OE input circuit is
supplied by VCCA. This device is fully specified for
partial-power-down applications using Ioff. The Ioff
circuitry disables the outputs, preventing damaging
current backflow through the device when it is
powered down.
•
•
OE Input Circuit Referenced to VCCA
Low Power Consumption, 5-μA Max (ICCA or
ICCB
)
•
•
•
Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
–
–
8000-V Human-Body Model (A114-B)
1000-V Charged-Device Model (C101)
RSV PACKAGE
(TOP VIEW)
RUT PACKAGE
(TOP VIEW)
TXB0304
TXBN0304
TXB0304
TXBN0304
A1
B1
B2
B3
B4
A1
A2
A3
A4
B1
B2
B3
B4
A2
A3
A4
A. Pull up resistors are not required on both sides for Logic I/O.
B. If pull up or pull down resistors are needed, the resistor value must be over 20 kΩ.
C. 20 kΩ is a safe recommended value, if the customer can accept higher Vol or lower Voh, smaller pull up or pull down
resistor is allowed, the draft estimation is Vol = Vccout × 1.5k/(1.5k + Rpu) and Voh = Vccout × Rdw/(1.5k + Rdw).
D. If pull up resistors are needed, please refer to the TXS0104 or contact TI.
E. For detailed information, please refer to application note SCEA043.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011–2012, Texas Instruments Incorporated
TXB0304
SCES831C –SEPTEMBER 2011–REVISED MAY 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
TA
PACKAGE(2)
RUT – MicroQFN
RSV – QFN
ORDERABLE PART NUMBER
TOP-SIDE MARKING
TXB0304RUTR
73R
ZTJ
74R
ZTK
TXB0304RSVR
–40 to 85°C
RUT – MicroQFN
RSV – QFN
TXBN0304RUTR
TXBN0304RSVR
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com.
DEVICE INFORMATION
Table 1. SIGNAL DESCRIPTIONS
PIN NO.
NAME
FUNCTION
RSV
RUT
TXB0304 TXBN0304
16
1
1
2
3
4
5
–
6
VCCA
A1
A-port supply voltage 0.9V ≤ VCCA ≤ 3.6V
Input/output 1
2
A2
Input/output 2
Referenced to VCCA
3
A3
Input/output 3
4
A4
Input/output 4
5
NC
GND
No connection; not internally connected
Ground
6,7
3-state output-mode enable. Pull OE (TXB0304) low to place all outputs in 3-state mode.
3-state output-mode enable. Pull OE (TXBN0304) high to place all outputs in 3-state
mode.
8
12
OE
OE
Referenced to VCCA.
9
7
8
B4
B3
Input/output 1
10
11
12
13
14
15
Input/output 2
Referenced to VCCB
Input/output 3
9
B2
10
11
–
B1
Input/output 4
VCCB
NC
NC
B-port supply voltage 0.9V ≤ VCCB ≤ 3.6V
No connection; not internally connected
No connection; not internally connected
–
2
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Copyright © 2011–2012, Texas Instruments Incorporated
Product Folder Link(s): TXB0304
TXB0304
www.ti.com
SCES831C –SEPTEMBER 2011–REVISED MAY 2012
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.5
–0.5
–0.5
–0.5
–0.5
-0.5
MAX
UNIT
VCCA
4.6
Supply voltage range
VCCB
V
4.6
4.6
A port
VI
Input voltage range
V
V
V
B port
A port
B port
A port
B port
VI < 0
VO < 0
4.6
4.6
Voltage range applied to any output in the
high-impedance or power-off state
VO
VO
4.6
–0.5
–0.5
VCCA + 0.5
VCCB + 0.5
–50
Voltage range applied to any output in the
high or low state(2)
IIK
IOK
IO
Input clamp current
mA
mA
mA
mA
°C
Output clamp current
Continuous output current
–50
±50
Continuous current through VCCA, VCCB, or GND
Storage temperature range
±100
Tstg
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The value of VCCA and VCCB are provided in the recommended operating conditions table.
THERMAL IMPEDANCE RATINGS
over operating free-air temperature range (unless otherwise noted)
UNIT
θJA Package thermal impedance
RUT package(1)
RSV package(2)
87
°C/W
184
(1) The package thermal impedance is calculated in accordance with JESD 51-7
(2) The package thermal impedance is calculated in accordance with JESD 51-5.
RECOMMENDED OPERATING CONDITIONS(1)(2)
VCCA
VCCB
MIN
0.9
MAX UNIT
VCCA
3.6
V
Supply voltage
VCCB
0.9
3.6
Data inputs
OE
0.9 V to 3.6 V
0.9 V to 3.6 V
0.9 V to 3.6 V
0.9 V to 3.6 V
0.9 V to 3.6 V
0.9 V to 3.6 V
0.9 V to 3.6 V
0.9 V to 3.6 V
0.9 V to 3.6 V VCCI × 0.65
0.9 V to 3.6 V VCCA × 0.65
VCCI
V
VIH
VIL
VO
High-level input voltage
Low-level input voltage
3.6
Data inputs
OE
0.9 V to 3.6 V
0.9 V to 3.6 V
0.9 V to 3.6 V
0.9 V to 3.6 V
0.9 V to 3.6 V
0.9 V to 3.6 V
0
0
0
0
VCCI × 0.35
V
V
VCCA × 0.35
A-port
3.6
3.6
40
40
85
Voltage range applied to any output in
the high-impedance or power-off state
B-port
A-port inputs
B-port inputs
Δt/Δv Input transition rise or fall rate
TA Operating free-air temperature
ns/V
°C
–40
(1) The A and B sides of an unused data I/O pair must be held in the same state, i.e., both at VCCI or both at GND.
(2) VCCI is the supply voltage associated with the input port.
Copyright © 2011–2012, Texas Instruments Incorporated
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TXB0304
SCES831C –SEPTEMBER 2011–REVISED MAY 2012
www.ti.com
ELECTRICAL CHARACTERISTICS
TA = 25°C
MIN TYP
–40°C to 85°C
PARAMETER
VOHA
VOLA
VOHB
TEST CONDITIONS
VCCA
VCCB
UNIT
MAX
MIN MAX
0.9 x
VCCA
IOH = –20 μA
0.9 V to 3.6 V
0.9 V to 3.6 V
V
V
V
IOL = 20 μA
0.2
0.9 x
VCCB
IOH = –20 μA
0.9 V to 3.6 V
VOLB
II
IOL = 20 μA
0.9 V to 3.6 V
0.9 V to 3.6 V
0 V to 3.6 V
0 V
0.2
±2
±2
±2
±2
5
V
OE
VI = VCCI or GND
0.9 V to 3.6 V
0 V
±1
±1
±1
±1
μA
A port
B port
A or B port
VI or VO = 0 to 3.6 V
VI or VO = 0 to 3.6 V
OE = GND
Ioff
μA
0.9 V to 3.6 V
0.9 V to 3.6 V
0.9 V to 3.6 V
0.9 V to 3.6 V
0.9 V to 3.6 V
IOZ
0.9 V to 3.6 V
0.9 V to 3.6 V
0.9 V to 3.6 V
0.9 V to 3.6 V
μA
μA
μA
μA
ICCA
ICCB
ICCA + ICCB
VI = VCCI or GND, IO = 0
VI = VCCI or GND, IO = 0
VI = VCCI or GND, IO = 0
5
10
VI = VCCI or GND,
IO = 0, OE = GND
ICCZA
0.9 V to 3.6 V
0.9 V to 3.6 V
5
5
μA
VI = VCCI or GND,
IO = 0, OE = GND
ICCZB
0.9 V to 3.6 V
0.9 V to 3.6 V
0.9 V to 3.6 V
0.9 V to 3.6 V
μA
Ci
OE
3
6.7
6.7
pF
A port
B port
Cio
0.9 V to 3.6 V
0.9 V to 3.6 V
pF
TIMING REQUIREMENTS
over recommended operating free-air temperature range (unless otherwise noted)
VCCA
VCCB
MIN MAX UNIT
50 Mbps
CL = 15 pF
CL = 15 pF
CL = 15 pF
CL = 30 pF
CL = 30 pF
CL = 30 pF
CL = 50 pF
CL = 50 pF
CL = 100 pF
CL = 100 pF
0.9 to 3.6 V
1.2 to 3.6 V
1.8 to 3.6 V
0.9 to 3.6 V
1.2 to 3.6 V
1.8 to 3.6 V
1.2 to 3.6 V
1.8 to 3.6 V
1.2 to 3.6 V
1.8 to 3.6 V
0.9 to 3.6 V
1.2 to 3.6 V
1.8 to 3.6 V
0.9 to 3.6 V
1.2 to 3.6 V
1.8 to 3.6 V
1.2 to 3.6 V
1.8 to 3.6 V
1.2 to 3.6 V
1.8 to 3.6 V
100 Mbps
140 Mbps
40 Mbps
90 Mbps
Data rate
130 Mbps
80 Mbps
120 Mbps
70 Mbps
100 Mbps
4
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Copyright © 2011–2012, Texas Instruments Incorporated
Product Folder Link(s): TXB0304
TXB0304
www.ti.com
SCES831C –SEPTEMBER 2011–REVISED MAY 2012
SWITCHING CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
TYP
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
VCCA
VCCB
MIN
MAX
UNIT
TA
=
25°C
18.9
7.5
3.7
19.5
7.8
3.8
8
A
A
A
A
A
A
A
A
A
A
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
A
A
A
A
A
A
A
A
A
A
A
B
A
B
CL = 15
CL = 15
CL = 15
CL = 30
CL = 30
CL = 30
CL = 50
CL = 50
CL = 100
CL = 100
CL = 15
CL = 15
CL = 15
CL = 30
CL = 30
CL = 30
CL = 50
CL = 50
CL = 100
CL = 100
CL = 15
CL = 15
CL = 15
CL = 15
CL = 15
CL = 15
0.9-3.6
1.2-3.6
1.8-3.6
0.9-3.6
1.2-3.6
1.8-3.6
1.2-3.6
1.8-3.6
1.2-3.6
1.8-3.6
0.9-3.6
1.2-3.6
1.8-3.6
0.9-3.6
1.2-3.6
1.8-3.6
1.2-3.6
1.8-3.6
1.2-3.6
1.8-3.6
0.9-3.6
0.9-3.6
0.9-3.6
0.9-3.6
0.9-3.6
0.9-3.6
0.9-3.6
1.2-3.6
1.8-3.6
0.9-3.6
1.2-3.6
1.8-3.6
1.2-3.6
1.8-3.6
1.2-3.6
1.8-3.6
0.9-3.6
1.2-3.6
1.8-3.6
0.9-3.6
1.2-3.6
1.8-3.6
1.2-3.6
1.8-3.6
1.2-3.6
1.8-3.6
0.9-3.6
0.9-3.6
0.9-3.6
0.9-3.6
0.9-3.6
0.9-3.6
30
11.5
4.8
34
11.9
5.2
12.3
5.4
13.5
6
ns
4
8.6
4.5
18.9
7.5
3.7
19.5
7.8
3.8
8
tpd
30
11.5
5
34
11.9
5.2
12.3
5.4
13.5
6
ns
ns
4
8.6
4.5
173
213
172
169
ten
OE
OE
ns
ns
ns
ns
tdis
trB, tfB
t s, t s
B-port rise and fall times
A-port rise and fall times
2.95
3.1
Channel-to-channel
skew
tSK(O)
CL = 15
0.9-3.6
0.9-3.6
0.15
ns
OPERATING CHARACTERISTICS
TA = 25°C
VCCA, VCCB
0.9 V to 3.6 V
PARAMETER
TEST CONDITIONS
UNIT
TYP
34
A-port input, B-port output
CpdA
pF
pF
pF
pF
B-port input, A-port output
34
CL = 0, f = 10 MHz, tr = tf = 1 ns, OE = VCCA (outputs enabled)
CL = 0, f = 10 MHz, tr = tf = 1 ns, OE = GND (outputs disabled)
A-port input, B-port output
B-port input, A-port output
A-port input, B-port output
B-port input, A-port output
A-port input, B-port output
B-port input, A-port output
34
CpdB
CpdA
CpdB
34
0.01
0.01
0.01
0.01
Copyright © 2011–2012, Texas Instruments Incorporated
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TXB0304
SCES831C –SEPTEMBER 2011–REVISED MAY 2012
www.ti.com
REVISION HISTORY
Changes from Revision B (September 2011) to Revision C
Page
•
Added package pin out diagram notes. ................................................................................................................................ 1
6
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Copyright © 2011–2012, Texas Instruments Incorporated
Product Folder Link(s): TXB0304
PACKAGE OPTION ADDENDUM
www.ti.com
7-May-2012
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
TXB0304RSVR
TXB0304RUTR
TXBN0304RSVR
TXBN0304RUTR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
UQFN
UQFN
UQFN
UQFN
RSV
RUT
RSV
RUT
16
12
16
12
3000
3000
3000
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Aug-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TXB0304RSVR
TXB0304RUTR
TXBN0304RSVR
TXBN0304RSVR
TXBN0304RUTR
UQFN
UQFN
UQFN
UQFN
UQFN
RSV
RUT
RSV
RSV
RUT
16
12
16
16
12
3000
3000
3000
3000
3000
177.8
180.0
177.8
330.0
180.0
12.4
9.5
2.0
1.9
2.8
2.3
2.8
2.9
2.3
0.7
0.75
0.7
4.0
4.0
4.0
4.0
4.0
12.0
8.0
Q1
Q1
Q1
Q1
Q1
12.4
12.4
8.4
2.0
12.0
12.0
8.0
2.1
0.75
0.75
1.95
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Aug-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TXB0304RSVR
TXB0304RUTR
TXBN0304RSVR
TXBN0304RSVR
TXBN0304RUTR
UQFN
UQFN
UQFN
UQFN
UQFN
RSV
RUT
RSV
RSV
RUT
16
12
16
16
12
3000
3000
3000
3000
3000
202.0
180.0
202.0
180.0
202.0
201.0
180.0
201.0
180.0
201.0
28.0
30.0
28.0
30.0
28.0
Pack Materials-Page 2
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