TXS02612RTWR [TI]
SDIO PORT EXPANDER WITH VOLTAGE-LEVEL TRANSLATION; 与电压电平转换SDIO端口扩展型号: | TXS02612RTWR |
厂家: | TEXAS INSTRUMENTS |
描述: | SDIO PORT EXPANDER WITH VOLTAGE-LEVEL TRANSLATION |
文件: | 总22页 (文件大小:628K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TXS02612
www.ti.com ............................................................................................................................................................... SCES682A–MAY 2008–REVISED JULY 2008
SDIO PORT EXPANDER WITH VOLTAGE-LEVEL TRANSLATION
1
FEATURES
2
•
6-to-12 Demultiplexer/Multiplexer Allows SDIO
Port Expansion
•
ESD Performance A Port
–
–
–
2000-V Human-Body Model (A114-B)
100-V Machine Model (A115-A)
•
Built-in Level Translator Eliminates Voltage
Mismatch Between Baseband and SD Card or
SDIO Peripheral
1500-V Charged-Device Model (C101)
•
ESD Performance B Port
•
•
VCCA, VCCB0, and VCCB1 Each Operate Over Full
1.1-V to 3.6-V Range
–
±6-kV IEC 61000-4-2 ESD,
Air-Gap Discharge
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
–
±8-kV IEC 61000-4-2 ESD,
Contact Discharge
DESCRIPTION/ORDERING INFORMATION
The TXS02612 is designed to interface the cellphone baseband with external SDIO peripherals. The device
includes a 6-channel SPDT switch with voltage-level translation capability. This allows a single SDIO port to be
interfaced with two SDIO peripherals. The TXS02612 has three separate supply rails that operate over the full
range of 1.1 V to 3.6 V. This allows the baseband and SDIO peripherals to operate at different supply voltages if
required.
The select (SEL) input is used to choose between the B0 port and B1 port. When SEL = Low, B0 port is
selected; when SEL = High, B1 port is selected. SEL is referenced to VCCA. For the unselected B port, the clock
output is held low, whereas the data and command I/Os are pulled high to their respective VCCB through a 70-kΩ
resistor (±30% tolerance).
ORDERING INFORMATION
TA
PACKAGE(1)(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
YJ612
YJ612
MicroStar Junior™ BGA
Reel of 3000
Reel of 3000
TXS02612ZQSR
(VFBGA) – ZQS
QFN – RTW
–40°C to 85°C
TXS02612RTWR
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
RTW PACKAGE
(TOP VIEW)
ZQS PACKAGE TERMINAL ASSIGNMENTS
ZQS PACKAGE
(TOP VIEW)
1
2
3
4
5
1
3
2 4 5
A
B
C
D
E
DAT2A
DAT3A
CMDA
DAT0A
DAT1A
SEL
DAT3B0
DAT2B0
GND
CMDB0
VCCB0
VCCB1
DAT1B1
CMDB1
CLKB0
DAT0B0
DAT1B0
DAT0B1
CLKB1
A
B
C
D
E
24 23 22 21 20 19
VCCA
CLKA
DAT2A
GND
1
2
3
4
5
6
18 DAT0
17 VCC
B0
GND
B1
Exposed
Center Pad
DAT3A
CMDA
16 DAT1
15 DAT1
14 DAT0
13 CLK
B0
B1
B1
DAT2B1
DAT3B1
V
CCA
DAT0A
For RTW, if the exposed
center pad is used, it must
be connected to ground
or electrically open.
B1
7
8
9 10 11 12
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
MicroStar Junior is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
TXS02612
SCES682A–MAY 2008–REVISED JULY 2008 ............................................................................................................................................................... www.ti.com
APPLICATION BLOCK DIAGRAM
V
CCB0
V
V
CCB0
CCA
V
V
CCB1
CCA
DAT0
B0
DAT0A
DAT1A
DAT2A
DAT3A
CMDA
DAT0
DAT1
B1
B0
DAT1
B1
DAT2
B0
SD/MMC
Memory Card
DAT2
DAT3
B1
B0
SDIO Port
DAT3
B1
CMD
B0
CMD
B1
CLK
B0
CLKA
SEL
Clock
Logic
Digital Baseband
or Apps
Processor
V
CCB1
CLK
B1
TXS02612
NOTE:
Switch positions shown in this
diagram are for the case when
SEL = Low
SDIO Peripheral
(Bluetooth,
WLAN, DTV, etc)
2
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TXS02612
www.ti.com ............................................................................................................................................................... SCES682A–MAY 2008–REVISED JULY 2008
PIN ASSIGNMENTS
RTW PACKAGE ZQS PACKAGE
NAME
FUNCTION
TYPE
PIN NO.
BALL NO.
1
3
A1
DAT2A
DAT3A
CMDA
DAT0A
DAT1A
SEL
Data bit 2. Referenced to VCCA
Data bit 3. Referenced to VCCA
.
.
I/O
I/O
B1
4
C1
D1
E1
Command bit. Referenced to VCCA
.
I/O
6
Data bit 0. Referenced to VCCA
Data bit 1. Referenced to VCCA
.
.
I/O
7
I/O
24
A2
Select pin to choose between B0 and B1. Referenced to VCCA
Depopulated
.
Input
B2
5
C2
D2
E2
VCCA
CLKA
A-port supply voltage. 1.1 V ≤ VCCA ≤ 3.6 V.
Power
Input
I/O
9
Clock input A. Referenced to VCCA.
8
DAT2B1
DAT3B0
DAT2B0
GND
Data bit 2. Referenced to VCCB1
Data bit 3. Referenced to VCCB0
Data bit 2. Referenced to VCCB0
Ground
.
.
.
22
23
2
A3
I/O
B3
I/O
C3
D3
E3
11
10
20
21
17
15
12
19
18
16
14
13
GND
Ground
DAT3B1
CMDB0
VCCB0
Data bit 3. Referenced to VCCB1
.
I/O
I/O
A4
Command bit. Referenced to VCCB0.
B4
B0-port supply voltage. 1.1 V ≤ VCCB0 ≤ 3.6 V.
B1-port supply voltage. 1.1 V ≤ VCCB1 ≤ 3.6 V.
Power
Power
I/O
C4
D4
E4
VCCB1
DAT1B1
CMDB1
CLKB0
DAT0B0
DAT1B0
DAT0B1
CLKB1
Data bit 1. Referenced to VCCB1
.
Command bit. Referenced to VCCB1
.
I/O
A5
Clock output. Referenced to VCCB0
.
Output
I/O
B5
Data bit 0. Referenced to VCCB0
Data bit 1. Referenced to VCCB0
Data bit 0. Referenced to VCCB1
.
.
.
C5
D5
E5
I/O
I/O
Clock output. Referenced to VCCB1
.
Output
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TXS02612
SCES682A–MAY 2008–REVISED JULY 2008 ............................................................................................................................................................... www.ti.com
SIMPLIFIED INTERNAL STRUCTURE
V
V
CCBx
CCA
SPEED-UP
CIRCUITRY A-to-B
GATE
R
R
1
(see Note A)
2
(see Note A)
Bx-Port
A-Port
(Data or
(Data or
Command)
Command)
SPEED-UP
CIRCUITRY B-to-A
Simplified Architecture of Command and Each Data Path
V
CCB0
V
CCB0
P-ch
N-ch
CLKA
CLK
TRANSLATOR
B0
GND
V
CCB1
V
CCB1
P-ch
N-ch
TRANSLATOR
CLK
B1
SEL
GND
Simplified Architecture of the Clock Path
A. R1 and R2 resistor values are determined based upon the logic level applied to the A port or B port, as follows:
R1 and R2 = 40 kΩ when a logic level low is applied to the A port or B port.
R1 and R2 = 4 kΩ when a logic level high is applied to the A port or B port.
R1 and R2 = 70 kΩ when the port is deselected.
4
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TXS02612
www.ti.com ............................................................................................................................................................... SCES682A–MAY 2008–REVISED JULY 2008
FUNCTION TABLE
Clock Channel
SEL
L
CLKB0
Active
Low
CLKB1
Low
OPERATION
CLKA to CLKB0
CLKA to CLKB1
H
Active
Data and Command Channel
DATxB1 or CMDxB1
SEL
L
DATxB0 or CMDxB0
Active
OPERATION
Disabled, pulled to VCCB1 through 70 kΩ DATxA to DATxB0, CMDA to CMDB0
Active DATxA to DATxB1, CMDA to CMDB1
H
Disabled, pulled to VCCB0 through 70 kΩ
ABSOLUTE MAXIMUM RATINGS(1)(2)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCCA
VCCB0 Supply voltage range(2)
VCCB1
–0.5
4.6
V
A port, B0 port,
B1 port, control inputs
VI
Input voltage range
–0.5
–0.5
VCCx + 0.5
VCCx + 0.5
V
V
Voltage range applied to any output in the high-impedance or
power-off state
A port, B0 port,
B1 port
VO
IIK
Input clamp current
Output clamp current
VI < 0
–50
–50
mA
mA
IOK
ICC
IGND
Tstg
VO < 0
/
Continuous current through VCCA, VCCB0, VCCB1, or GND
Storage temperature range
±100
150
mA
°C
–65
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
PACKAGE THERMAL IMPEDANCE
PARAMETER
UNIT
RTW package
ZQS package
66
θJA
Package thermal impedance
°C/W
171.6
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TXS02612
SCES682A–MAY 2008–REVISED JULY 2008 ............................................................................................................................................................... www.ti.com
RECOMMENDED OPERATING CONDITIONS
(1)
VCCA
VCCBx
MIN
MAX
UNIT
VCCA
VCCB0 Supply voltage
VCCB1
1.1
3.6
V
A-port I/Os
B-port I/Os
SEL, CLKA
A-port I/Os
B-port I/Os
SEL, CLKA
VCCI – 0.2
VCCI
VIH
High-level input voltage
1.1 V to 3.6 V
1.1 V to 3.6 V
1.1 V to 3.6 V
1.1 V to 3.6 V
VCCI – 0.2
VCCI
V
V
VCCA × 0.65 V
3.6
0
0
0
0.15
VIL
Low-level input voltage
0.15
VCCA × 0.35
Δt/Δv Input transition rise or fall rate CLK, SEL
TA Operating free-air temperature
(1) VCCBx refers to VCCB0 and VCCB1
10
85
ns/V
°C
–40
.
ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
TA = 25°C
TYP
TA = –40°C to 85°C
PARAMETER
TEST CONDITIONS
VCCA
VCCBx
UNIT
MIN
0.74
MAX
1.1 V
1.4 V
1.65 V
2.3 V
3 V
1.1 V
1.4 V
1.65 V
2.3 V
3 V
VCCA × 0.67
VCCA × 0.67
VCCA × 0.67
VCCA × 0.67
VOHA
(DATA &
CMD)
IOH = –20 µA,
VIBx ≥ VCCBx – 0.2 V
V
IOL = 135 µA, VIBx ≤ 0.15 V
IOL = 180 µA, VIBx ≤ 0.15 V
IOL = 220 µA, VIBx ≤ 0.15 V
IOL = 300 µA, VIBx ≤ 0.15 V
IOL = 620 µA, VIBx ≤ 0.15 V
1.1 V
1.4 V
1.65 V
2.3 V
3 V
1.1 V
1.4 V
1.65 V
2.3 V
3 V
0.35
0.35
0.45
0.55
0.70
VOLA
(DATA &
CMD)
V
V
V
V
V
1.1 V
1.4 V
1.65 V
2.3 V
3 V
1.1 V
1.4 V
1.65 V
2.3 V
3 V
0.74
VCCBx × 0.67
VCCBx × 0.67
VCCBx × 0.67
VCCBx × 0.67
0.74
VOHB
(DATA &
CMD)
IOH = –20 µA,
VIAx ≥ VCCAx – 0.2 V
IOH = – 0.5 mA
1.1 V
1.4 V
1.65 V
2.3 V
3 V
1.1 V
1.4 V
1.65 V
2.3 V
3 V
IOH = – 1 mA
1.05
VOHCLKB
IOH = – 2 mA
1.2
IOH = – 4 mA
1.75
IOH = – 8 mA
2.3
IOL = 135 µA, VIAx ≤ 0.15 V
IOL = 180 µA, VIAx ≤ 0.15 V
IOL = 220 µA, VIAx ≤ 0.15 V
IOL = 300 µA, VIAx ≤ 0.15 V
IOL = 620 µA, VIAx ≤ 0.15 V
IOL = 0.5 mA
1.1 V
1.4 V
1.65 V
2.3 V
3 V
1.1 V
1.4 V
1.65 V
2.3 V
3 V
0.35
0.35
0.45
0.55
0.70
0.35
0.35
0.45
0.55
0.7
VOLB
(DATA &
CMD)
1.1 V
1.4 V
1.65 V
2.3 V
3 V
1.1 V
1.4 V
1.65 V
2.3 V
3 V
IOL = 1 mA
VOLCLKB
IOL = 2 mA
IOL = 4 mA
IOL = 8 mA
6
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TXS02612
www.ti.com ............................................................................................................................................................... SCES682A–MAY 2008–REVISED JULY 2008
ELECTRICAL CHARACTERISTICS (continued)
over recommended operating free-air temperature range (unless otherwise noted)
TA = 25°C
TA = –40°C to 85°C
MIN MAX
PARAMETER
TEST CONDITIONS
SEL, CLKA
VCCA
VCCBx
UNIT
TYP
±1
±2
±2
II
1.1 V to 3.6 V
1.1 V to 3.6 V
µA
DAT, CMD
±1
1.1 V to 3.6 V
3.6 V
1.1 V to 3.6 V
0 V
12
VI = VO = Open, IO = 0,
SEL, CLK = High or Low
ICCA
12
µA
µA
0 V
3.6 V
–1
1.1 V to 3.6 V
3.6 V
1.1 V to 3.6 V
0 V
24
ICCB0 or
ICCB1
VI = VO = Open, IO = 0,
SEL, CLK = High or Low
–12
24
0 V
3.6 V
Ci
SEL, CLKA
A port
3.3 V
3.3 V
2.5
7
3.5
7.5
10
pF
pF
Cio
3.3 V
3.3 V
B port
9.5
TIMING REQUIREMENTS
TA = 25°C, VCCA = 1.2 V
VCCB = 1.2 V VCCB = 1.5 V VCCB = 1.8 V
VCCB = 2.5 V
TYP
VCCB = 3.3 V
TYP
UNIT
TYP
60
2
TYP
80
2
TYP
120
2
Push-pull driving
Command
120
2
120
2
Mbps
MHz
Open-drain driving
Push-pull driving
Push-pull driving
Data
rate
Clock
Data
30
60
17
40
80
13
60
60
120
8
60
120
8
120 Mbps
8
Push-pull
CLK
driving
Open-drain
CMD
500
500
500
500
500
ns
Pulse
duration
tw
driving
Data
CMD
17
17
13
13
8
8
8
8
8
8
Push-pull
driving
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TXS02612
SCES682A–MAY 2008–REVISED JULY 2008 ............................................................................................................................................................... www.ti.com
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted)
VCCB = 1.5 V
± 0.1 V
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 1.2 V
TYP
UNIT
MIN MAX
MIN MAX
MIN MAX
MIN MAX
Push-pull driving
Open-drain driving
Push-pull driving
Push-pull driving
60
2
80
120
120
120
2
Command
Mbps
MHz
2
2
2
Data
rate
Clock
Data
30
60
17
40
60
60
60
80
120
8
120
8
120 Mbps
Push-pull
CLK
13
8
driving
Open-drain
CMD
500
500
500
500
500
Pulse
duration
tw
ns
driving
Data
CMD
17
17
13
13
8
8
8
8
8
8
Push-pull
driving
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
VCCB = 1.5 V
± 0.1 V
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 1.2 V
TYP
UNIT
MIN MAX
MIN MAX
MIN MAX
MIN MAX
Push-pull driving
Open-drain driving
Push-pull driving
Push-pull driving
60
2
80
120
120
120
2
Command
Mbps
MHz
2
2
2
Data
rate
Clock
Data
30
60
17
40
60
60
60
80
120
8
120
120 Mbps
Push-pull
CLK
13
8
8
driving
Open-drain
CMD
500
500
500
500
500
Pulse
duration
tw
ns
driving
Data
CMD
17
17
13
13
8
8
8
8
8
8
Push-pull
driving
8
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TXS02612
www.ti.com ............................................................................................................................................................... SCES682A–MAY 2008–REVISED JULY 2008
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
VCCB = 1.5 V
± 0.1 V
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 1.2 V
TYP
UNIT
MIN MAX
MIN MAX
MIN MAX
MIN MAX
Push-pull driving
Open-drain driving
Push-pull driving
Push-pull driving
60
2
80
120
120
120
2
Command
Mbps
MHz
2
2
2
Data
rate
Clock
Data
30
60
17
40
60
60
60
80
120
8
120
8
120 Mbps
Push-pull
CLK
13
8
driving
Open-drain
CMD
500
500
500
500
500
Pulse
duration
tw
ns
driving
Data
CMD
17
17
13
13
8
8
8
8
8
8
Push-pull
driving
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
VCCB = 1.5 V
± 0.1 V
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 1.2 V
TYP
UNIT
MIN MAX
MIN MAX
MIN MAX
MIN MAX
Push-pull driving
Open-drain driving
Push-pull driving
Push-pull driving
60
2
80
120
120
120
2
Command
Mbps
MHz
2
2
2
Data
rate
Clock
Data
30
60
17
40
60
60
60
80
120
8
120
8
120 Mbps
Push-pull
CLK
13
8
driving
Open-drain
CMD
500
500
500
500
500
Pulse
duration
tw
ns
driving
Data
CMD
17
17
13
13
8
8
8
8
8
8
Push-pull
driving
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TXS02612
SCES682A–MAY 2008–REVISED JULY 2008 ............................................................................................................................................................... www.ti.com
SWITCHING CHARACTERISTICS
TA = 25°C, VCCA = 1.2 V
VCCB = 1.2 V
TYP
5.9
VCCB = 1.5 V
TYP
4.8
VCCB = 1.8 V
TYP
4.4
VCCB = 2.5 V
TYP
4
VCCB = 3.3 V
FROM
(INPUT) (OUTPUT)
TO
TEST
CONDITIONS
PARAMETER
UNIT
TYP
4.46
140
4
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
CMDA
CMDB
CMDB
CMDA
238
5.6
214
4.8
192
4.4
159
4.1
227
5.5
201
4.1
176
3.6
137
3.2
114
3
tPD
ns
CLKA
DATA
DATB
SEL
CLKB
DATB
DATA
B-Port
5.8
4.8
4.4
4.2
6.8
4
Push-pull driving
5.6
4.8
4.4
4.1
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
13
11
10
9.4
9.1
5.7
1.5
1.3
2.6
1.5
1
trA
trB
trB
tfA
tfB
tfB
A-port rise time
B-port rise time
4.8
5.1
5.1
5.3
6.1
3.8
2.9
1.9
CLKA
CLKB
A-port fall time
B-port fall time
5.2
3.4
2.6
1.7
ns
3.4
2.8
2.6
2.6
4.2
3
2.3
1.7
CLKA
CLKB
ChA-to-ChB skew
ChB-to-ChA skew
3.1
2.1
1.6
1.2
0.4
0.4
0.3
0.4
0.4
0.4
1.7
0.3
0.3
0.3
0.3
tsk(O)
ns
Channel-to-Clock
skew
1.68
1.5
1.5
1.5
Push-pull driving
Push-pull driving
Open-drain driving
Push-pull driving
Push-pull driving
60
2
80
2
120
2
120
2
120
2
Command
Mbps
Max data rate
Clock
Data
30
60
40
80
60
60
60
MHz
120
120
120
Mbps
10
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TXS02612
www.ti.com ............................................................................................................................................................... SCES682A–MAY 2008–REVISED JULY 2008
SWITCHING CHARACTERISTICS
over operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted)
VCCB = 1.2 V
VCCB = 1.5 V
± 0.1 V
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
FROM
(INPUT) (OUTPUT)
TO
TEST
CONDITIONS
PARAMETER
UNIT
TYP
5.1
MIN
MAX
MIN
MAX
MIN
MAX
MIN MAX
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
13
777
10.6
616
13.1
13
9
756
9.2
560
9.8
9
8
684
8.5
433
6
7.5
758
8.2
375
5.2
7.8
8.4
18
CMDA
CMDB
CMDB
CMDA
210
4.5
200
4.7
tPD
ns
CLKA
DATA
DATB
SEL
CLKB
DATB
DATA
B-Port
5.1
8
Push-pull driving
4.5
11
9.3
21
8.8
19
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
9.5
26
trA
trB
trB
tfA
tfB
tfB
A-port rise time
B-port rise time
2.7
1.5
1.7
1.7
1
5.8
1.7
1.3
1.3
0.9
0.9
0.8
5.9
6.6
4.9
3.4
5.2
3.2
0.58
0.23
1.68
1.7
1
6
1.8
0.8
0.8
1.3
0.6
0.5
6.1
2.9
3.3
8.2
4.3
3.2
3.2
3.9
2.2
0.63
0.22
1.82
ns
ns
CLKA
CLKB
A-port fall time
B-port fall time
5.2
6.4
0.9
0.9
0.6
0.5
2.5
2.4
3.9
3.3
3.7
1.1
0.9
6.3
3.2
CLKA
CLKB
ChA-to-ChB skew
ChB-to-ChA skew
3.1
4.1
1.9
0.32
0.27
1.47
0.47
0.24
1.66
0.63
0.22
1.77
tsk(O)
ns
Channel-to-Clock
skew
Push-pull driving
Push-pull driving
Open-drain driving
Push-pull driving
Push-pull driving
60
2
80
2
120
2
120
2
120
2
Command
Mbps
Max data rate
Clock
Data
30
60
40
80
60
60
60 MHz
120
120
120 Mbps
Copyright © 2008, Texas Instruments Incorporated
Submit Documentation Feedback
11
TXS02612
SCES682A–MAY 2008–REVISED JULY 2008 ............................................................................................................................................................... www.ti.com
SWITCHING CHARACTERISTICS
over operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
VCCB = 1.2 V
VCCB = 1.5 V
± 0.1 V
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
FROM
(INPUT) (OUTPUT)
TO
TEST
CONDITIONS
PARAMETER
UNIT
TYP
4.8
183
4
MIN
MAX
MIN
MAX
MIN
MAX
MIN MAX
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
12
726
9
8
715
7
6
686
6.4
5.7
780
6
CMDA
CMDB
CMDB
CMDA
175
4.5
4.7
4.1
8.2
2
565
13
563
9
441
5.4
392
4.5
5.8
6.3
14
tPD
ns
CLKA
DATA
DATB
SEL
CLKB
DATB
DATA
B-Port
12
8.4
7.5
17
6
Push-pull driving
9
6.4
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
22
14.8
4.5
trA
trB
trB
tfA
tfB
tfB
A-port rise time
B-port rise time
1.1
1.7
1.7
0.8
1
4
1.1
1.2
1.3
0.7
0.9
0.8
4.3
6.2
4.9
2.8
3.5
3.2
0.48
0.23
1.46
1.2
1
1.3
0.8
0.8
0.7
0.6
0.5
4.6
3.1
6.2
5.2
1.8
3.5
3.1
0.33
0.28
1.51
7.9
6.4
3.2
5.6
4.1
0.45
0.24
1.58
4.3
ns
ns
CLKA
CLKB
A-port fall time
B-port fall time
0.9
0.7
0.6
0.5
3.2
2.5
1.7
2.6
1.9
3
CLKA
CLKB
ChA-to-ChB skew
ChB-to-ChA skew
0.9
2.2
1.9
0.53
0.23
1.56
0.67
0.22
1.48
tsk(O)
ns
Channel-to-Clock
skew
Push-pull driving
Push-pull driving
Open-drain driving
Push-pull driving
Push-pull driving
60
2
80
2
120
2
120
2
120
2
Command
Mbps
Max data rate
Clock
Data
30
60
40
80
60
60
60 MHz
120
120
120 Mbps
12
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Copyright © 2008, Texas Instruments Incorporated
TXS02612
www.ti.com ............................................................................................................................................................... SCES682A–MAY 2008–REVISED JULY 2008
SWITCHING CHARACTERISTICS
over operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
VCCB = 1.2 V
VCCB = 1.5 V
± 0.1 V
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
FROM
(INPUT) (OUTPUT)
TO
TEST
CONDITIONS
PARAMETER
UNIT
TYP
4.4
143
3.8
137
4.1
4.4
4.4
7
MIN
MAX
MIN
MAX
MIN
MAX
MIN MAX
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
11
544
7.6
434
12
7.4
596
5.5
444
8
4.4
605
4.2
3.8
669
3.7
372
3.8
3.8
3.7
9
CMDA
CMDB
CMDB
CMDA
414
4.8
tPD
ns
CLKA
DATA
DATB
SEL
CLKB
DATB
DATA
B-Port
11
7
4.5
Push-pull driving
8
5.5
13
4.1
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
18
10.5
2.6
trA
trB
trB
tfA
tfB
tfB
A-port rise time
B-port rise time
1.4
6.3
5.2
1.1
3.6
3.1
0.41
0.41
2.11
0.75
1.91
1.67
0.58
1.04
0.92
2.2
7.7
6.4
1.9
5.4
4.2
0.43
0.24
1.47
0.74
1.34
1.27
0.58
0.87
0.79
2.2
6.1
4.9
2
1.06
0.95
0.9
0.7
0.83
0.76
0.57
0.57
0.49
2.8
3.2
4.2
ns
ns
CLKA
CLKB
A-port fall time
B-port fall time
3.2
2.6
0.61
0.66
0.56
1.9
1.9
4.3
3.2
0.39
0.2
1.3
3.4
3
CLKA
CLKB
ChA-to-ChB skew
ChB-to-ChA skew
2.2
1.9
0.59
0.19
1.25
0.68
0.18
1.21
tsk(O)
ns
Channel-to-Clock
skew
Push-pull driving
Push-pull driving
Open-drain driving
Push-pull driving
Push-pull driving
60
2
80
2
120
2
120
2
120
2
Command
Mbps
Max data rate
Clock
Data
30
60
40
80
60
60
60 MHz
120
120
120 Mbps
Copyright © 2008, Texas Instruments Incorporated
Submit Documentation Feedback
13
TXS02612
SCES682A–MAY 2008–REVISED JULY 2008 ............................................................................................................................................................... www.ti.com
SWITCHING CHARACTERISTICS
over operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
VCCB = 1.2 V
VCCB = 1.5 V
± 0.1 V
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
FROM
(INPUT) (OUTPUT)
TO
TEST
CONDITIONS
PARAMETER
UNIT
TYP
4.4
116
4.2
112
4.1
4.3
7.9
6.4
1.1
6.2
5.2
1
MIN
MAX
MIN
MAX
MIN
MAX
MIN MAX
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
11
432
7.5
349
12
7
477
5.4
4.1
506
3.8
347
4.4
4
3.3
533
3
CMDA
CMDB
CMDB
CMDA
363
7.8
324
3.5
3.8
3
tPD
ns
CLKA
DATA
DATB
SEL
CLKB
DATB
DATA
B-Port
11
6.8
Push-pull driving
7.8
16
5.4
3.4
8.8
1.7
4.2
3.3
1.6
3.2
2.2
0.57
0.19
1.22
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
11.5
1.8
7.6
trA
trB
trB
tfA
tfB
tfB
A-port rise time
B-port rise time
0.57
1.96
1.67
0.53
0.95
0.92
1.7
7.7
6.4
1.6
5.2
4.1
0.36
0.3
1.61
0.57
1.43
1.26
0.52
0.8
0.56
0.95
0.91
0.53
0.63
0.56
0.53
0.71
0.76
0.56
0.58
0.49
1.8
3.1
6.1
ns
ns
CLKA
CLKB
A-port fall time
B-port fall time
4.9
2.5
1.6
1.6
3.4
3.1
0.39
0.45
1.7
4.1
2.9
CLKA
CLKB
ChA-to-ChB skew
ChB-to-ChA skew
0.79
3.2
1.9
0.39
0.19
1.34
0.65
0.18
1.14
tsk(O)
ns
Channel-to-Clock
skew
Push-pull driving
Push-pull driving
Open-drain driving
Push-pull driving
Push-pull driving
60
2
80
2
120
2
120
2
120
2
Command
Mbps
Max data rate
Clock
Data
30
60
40
80
60
60
60 MHz
120
120
120 Mbps
OPERATING CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
VCCA
1.2 V
1.5 V
1.8 V
VCCB
1.8 V
2.5 V
3.3 V
PARAMETER
TEST CONDITIONS
UNIT
1.2 V
TYP
14.5
1.5 V
TYP
12.9
2.5 V
TYP
13.4
3.3 V
TYP
15
TYP
A-port input, B-port
output
12.1
Data
&
CMD
CpdA
B-port input, A-port
output
20.7
23.2
14.1
0.1
20.7
23.4
12.2
0.1
21
22
23.2
25.5
14.4
0.1
CL = 0, f = 10 MHz,
tr = tr = 1 ns,
OE = Outputs Enabled
pF
A-port input, B-port
output
23.6
11.5
0.1
24.5
12.9
0.1
Data
&
CMD
B-port input, A-port
output
CpdB
A-port input, B-port
output
OE = Outputs Disabled
pF
pF
A-port input, B-port
output
0.4
0.4
0.4
0.5
0.7
CpdA
CpdB
CL = 0, f = 10 MHz,
tr = tr = 1 ns,
OE = Outputs Enabled
Clock
B-port input, A-port
output
14
13.9
13.8
13.8
13.7
14
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Copyright © 2008, Texas Instruments Incorporated
TXS02612
www.ti.com ............................................................................................................................................................... SCES682A–MAY 2008–REVISED JULY 2008
PARAMETER MEASUREMENT INFORMATION
V
CCI
V
CCO
V
CCI
V
CCO
DUT
DUT
IN
IN
OUT
OUT
1 MΩ
1 MΩ
15 pF
15 pF
DATA RATE, PULSE DURATION, PROPAGATION DELAY,
OUTPUT RISE AND FALL TIME MEASUREMENT USING
AN OPEN-DRAIN DRIVER
DATA RATE, PULSE DURATION, PROPAGATION DELAY,ENABLE/DISABLE
OUTPUT RISE AND FALL TIME MEASUREMENT USING
A PUSH-PULL DRIVER
t
w
V
CCI
V
CCI
/2
V
CCI
/2
Input
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
V
CCA
Output
Control
V
CCI
V /2
CCA
V /2
CCA
V /2
CCO
Input
V /2
CCO
(low-level
enabling)
0 V
V
0 V
t
t
PLH
PHL
t
t
PLZ
PZL
Output
Waveform 1
V
OH
CCO
0.8 x V
CCO
V
/2
CCO
Output
V
/2
V
CCI
/2
CCI
CMD and DATA
(see Note B)
0.2 x V
0.2 x
V
CCO
CCO
V
OL
V
OL
t
t
r
f
VOLTAGE WAVEFORMS
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
ENABLE AND DISABLE TIMES
NOTES:
A.
C
L
includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is lo,wexcept when disabled by the output control.
Waveform
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50Ω, dv/dt≥ 1 V/ns.
O
D. The outputs are measured one at a time, with one transition per measurement.
E.
F.
t
t
t
and t
P HZ dis
and t
are the same as t .
P LZ
P ZL
P LH
are the same as t .
en
P ZH
G.
H.
I.
and t are the same as t .
P HL pd
V
V
is the V
associated with the input port.
CC
CCI
is the V
associated with the output port.
CC
CCO
J. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
Copyright © 2008, Texas Instruments Incorporated
Submit Documentation Feedback
15
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
TXS02612RTWR
TXS02612ZQSR
Status (1)
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
QFN
RTW
24
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
BGA MI
CROSTA
R JUNI
OR
ZQS
24
2500 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Aug-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
TXS02612RTWR
TXS02612ZQSR
QFN
RTW
ZQS
24
24
3000
2500
330.0
330.0
12.4
12.4
4.3
3.3
4.3
3.3
1.5
1.6
8.0
8.0
12.0
12.0
Q2
Q1
BGA MI
CROSTA
R JUNI
OR
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Aug-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TXS02612RTWR
TXS02612ZQSR
QFN
RTW
ZQS
24
24
3000
2500
346.0
340.5
346.0
338.1
29.0
20.6
BGA MICROSTAR
JUNIOR
Pack Materials-Page 2
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相关型号:
TXS100ZA
Input voltage range 36ˇ75V DC Single 80ˇ100A output 1500V DC I/O electrical strength test voltage
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DC-DC Regulated Power Supply Module, 1 Output, 150W, Hybrid, 2.400 X 3.450 INCH, 0.500 INCH HEIGHT, 3/4 BRICK PACKAGE-14
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TXS100ZA-1H
DC-DC Regulated Power Supply Module, 1 Output, 150W, Hybrid, 2.400 X 3.450 INCH, 0.500 INCH HEIGHT, 3/4 BRICK PACKAGE-14
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