UC1611L [TI]

QUAD SCHOTTKY DIODE ARRAY; ？ QUAD肖特基二极管阵列


型号：	UC1611L
厂家：	TEXAS INSTRUMENTS
描述：	QUAD SCHOTTKY DIODE ARRAY ？ QUAD肖特基二极管阵列肖特基二极管
文件：	总8页 (文件大小：163K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

ꢀ ꢁꢂ ꢃꢂꢂ

ꢀ ꢁꢄ ꢃꢂꢂ

SLUS338A – JUNE 1993 – REVISED MAY 2001

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FEATURES

DESCRIPTION

Matched, Four-Diode Monolithic Array

High Peak Current

This four-diode array is designed for general

purpose use as individual diodes or as a

high-speed, high-current bridge. It is particularly

useful on the outputs of high-speed power

MOSFET drivers where Schottky diodes are

needed to clamp any negative excursions caused

by ringing on the driven line.These diodes are also

ideally suited for use as voltage clamps when

driving inductive loads such as relays and

solenoids, and to provide a path for current

free-wheeling in motor drive applications.The use

of Schottky diode technology features high

efficiency through lowered forward voltage drop

and decreased reverse recovery time.This single

monolithic chip is fabricated in both hermetic

CERDIP and copper-eaded plastic packages.

The UC1611 in ceramic is designed for –55°C to

125°C environments but with reduced peak

current capability: while the UC3611 in plastic has

higher current rating over a 0°C to 70°C ambient

temperature range.

Low-Cost MINIDIP Package

Low-Forward Voltage

Parallelable for Lower V or Higher I

Fast Recovery Time

Military Temperature Range Available

AVAILABLE OPTIONS

Packaged Devices

= T

SOIC Wide (DW)

UC1611DW

DIL (J)

UC1611J

UC3611J

DIL (N)

UC1611N

UC3611N

–55°C to 125°C

0°C to 70°C

UC3611DW

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ꢚ ꢞ ꢛ ꢚꢓ ꢔꢨ ꢖꢕ ꢙ ꢡꢡ ꢟꢙ ꢗ ꢙ ꢘ ꢞ ꢚ ꢞ ꢗ ꢛ ꢣ

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www.ti.com

ꢀ ꢁꢂꢃ ꢂꢂ

ꢀ ꢁꢄꢃ ꢂꢂ

SLUS338A – JUNE 1993 – REVISED MAY 2001

DW PACKAGE

(TOP VIEW)

J OR N PACKAGE

(TOP VIEW)

†

absolute maximum ratings over operating free-air temperature (unless otherwise noted)

Peak inverse voltage (per diode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 V

Diode-to-diode voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 V

Peak forward current

UC1611 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 A

UC3611 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 A

Power dissipation at T = 70°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 W

Storage temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C

stg

Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C

†

‡

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

Please consult packaging section of data book for thermal limitations and considerations of package.

electrical characteristics, all specifications apply to each individual diode, T = 25°C, T = T ,

(except as noted)

PARAMETER

TEST CONDITIONS

MIN

0.3

TYP

0.4

MAX UNITS

= 100 mA

= 1 A

0.7

1.2

0.1

1.0

Forward voltage drop

Leakage current

0.9

0.01

0.1

= 40 V

= 40 V,

= 100°C

Reverse recovery

Forward recovery

Junction capacitance

0.5 A forward to 0.5 A reverse

1 A forward to 1.1 V recovery

= 5V

100

NOTE: At forward currents of greater than 1.0 A, a parasitic current of approximately 10 mA may be collected by adjacent diodes.

www.ti.com

ꢀ ꢁꢂ ꢃꢂꢂ

ꢀ ꢁꢄ ꢃꢂꢂ

SLUS338A – JUNE 1993 – REVISED MAY 2001

APPLICATION INFORMATION

REVERSE CURRENT

FORWARD CURRENT

VOLTAGE

5.0

1000

500

3.0

2.0

300

200

1.0

0.5

= 125 °C

100

0.3

0.2

°C

= –55

°C

0.1

0.05

0.03

0.02

= 25

0.01

= 25

°C

= 75 °C

0.005

°C

= 125

0.003

0.002

0.001

0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0

Forward Voltage – V

Reverse Voltage – V

Figure 1

Figure 2

Figure 3. Clamp Diodes – PWMs and Drivers

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ꢀ ꢁꢂꢃ ꢂꢂ

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SLUS338A – JUNE 1993 – REVISED MAY 2001

APPLICATION INFORMATION

Figure 4. Transformer Coupled Drive Circuits

Figure 5. Linear Regulations

www.ti.com

PACKAGE OPTION ADDENDUM

www.ti.com

25-Sep-2013

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

5962-90538012A

ACTIVE

LCCC

TBD

POST-PLATE

N / A for Pkg Type

-55 to 125

5962-

90538012A

UC1611L/

883B

5962-9053801PA

5962-9053801V2A

ACTIVE

CDIP

TBD

A42

N / A for Pkg Type

-55 to 125

9053801PA

UC1611

LCCC

POST-PLATE

5962-

9053801V2A

UC1611L

QMLV

5962-9053801VPA

ACTIVE

CDIP

TBD

A42

N / A for Pkg Type

-55 to 125

9053801VPA

UC1611

UC1611J

ACTIVE

CDIP

TBD

A42

N / A for Pkg Type

-55 to 125

UC1611J

UC1611J883B

9053801PA

UC1611

UC1611L883B

ACTIVE

LCCC

TBD

POST-PLATE

N / A for Pkg Type

-55 to 125

5962-

90538012A

UC1611L/

883B

UC3611DW

ACTIVE

SOIC

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

0 to 70

UC3611DW

UC3611DWG4

Green (RoHS

& no Sb/Br)

UC3611DW

UC3611J

UC3611N

ACTIVE

CDIP

PDIP

TBD

A42

N / A for Pkg Type

0 to 70

UC3611J

UC3611N

Green (RoHS

& no Sb/Br)

CU NIPDAU

UC3611NG4

ACTIVE

PDIP

Green (RoHS

& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

0 to 70

UC3611N

UC3611Q

OBSOLETE

PLCC

TBD

Call TI

0 to 70

UC3611QTR

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

25-Sep-2013

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

⁽³⁾MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF UC1611, UC1611-SP, UC3611, UC3611M :

Catalog: UC3611, UC1611, UC3611M, UC3611

•

Military: UC1611

•

Space: UC1611-SP

•

NOTE: Qualified Version Definitions:

Catalog - TI's standard catalog product

•

Addendum-Page 2

PACKAGE OPTION ADDENDUM

www.ti.com

25-Sep-2013

Military - QML certified for Military and Defense Applications

•

Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application

Addendum-Page 3

IMPORTANT NOTICE

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changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest

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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms

and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary

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UC1611L [TI]

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