UC1707-SP [TI]
DUAL CHANNEL POWER DRIVER; 双通道电源驱动器
| 型号： | UC1707-SP |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | DUAL CHANNEL POWER DRIVER |
| 文件： | 总15页 (文件大小：578K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
UC1707-SP
www.ti.com
SLUSAG0 –MARCH 2011
DUAL CHANNEL POWER DRIVER
Check for Samples: UC1707-SP
1
FEATURES
J OR W PACKAGE
(TOP VIEW)
•
Rad-Tolerant: 50 kRad (Si) for
5962-8761903VEA, 5962-8761903VFA
(1)
INPUT B INV.
INPUT B N.I.
LATCH DISABLE
GROUND
1
2
3
4
5
6
7
8
16 INPUT A INV.
•
QML-V Qualified, SMD
(5962-8761901VEA, 5962-8761903VEA,
5962-8761903VFA, 5962-8761901V2A)
15
14
13
12
11
10
9
INPUT A N.I.
+VIN
GROUND
GROUND
GROUND
•
•
•
•
•
•
•
•
•
•
•
Two Independent Drivers
OUTPUT A
SHUTDOWN
+VC
OUTPUT B
ANALOG STOP NON-INV.
ANALOG STOP INV.
1.5-A Totem Pole Outputs
Inverting and Non-Inverting Inputs
40-ns Rise and Fall Into 1000 pF
High-Speed, Power MOSFET Compatible
Low Cross-Conduction Current Spike
Analog Shutdown With Optional Latch
Low Quiescent Current
NOTE: All four ground pins must be connected to a
common ground.
FK PACKAGE
(TOP VIEW)
NC
INPUT A INV.
INPUT B INV.
INPUT B I.N.
INPUT A NON INV.
5-V to 40-V Operation
3
2
1
20 19
18
17
16
15
14
Thermal Shutdown Protection
16-Pin Dual-In-Line Package
4
5
LATCH DISABLE
GROUND
VIN
GROUND
NC
6
NC
GROUND
OUTPUT B
GROUND
7
8
OUTPUT A
9
10 11 12 13
SHUTDOWN
VC
(1) Radiation tolerance is a typical value based upon initial device
qualification with dose rate = 10 mrad/sec. Radiation Lot
Acceptance Testing is available - contact factory for details.
ANALOG STOP INV.
ANALOG STOP NON INV.
NC
DESCRIPTION
The UC1707 power driver is made with a high-speed Schottky process to interface between low-level control
functions and high-power switching devices–particularly power MOSFETs. The UC1707 contains two
independent channels, each of which can be activated by either a high or low input logic level signal. Each output
can source or sink up to 1.5 A as long as power dissipation limits are not exceeded.
Although each output can be activated independently with its own inputs, it can be forced low in common through
the action either of a digital high signal at the Shutdown terminal or a differential low-level analog signal. The
Shutdown command from either source can either be latching or not, depending on the status of the Latch
Disable pin.
Supply voltage for both VIN and VC can independently range from 5 V to 40 V.
TRUTH TABLE
(Each Channel)(1)
INV.
H
N.I.
OUT
H
L
H
L
L
H
H
L
L
L
L
(1) OUT = INV and N.I.
OUT = INV or N.I.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
© 2011, Texas Instruments Incorporated
UC1707-SP
SLUSAG0 –MARCH 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
BLOCK DIAGRAM
ORDERING INFORMATION(1)
ORDERABLE PART NUMBER
5962-8761901VEA
TA
PACKAGE(2)
TOP-SIDE MARKING
5962-8761901VEA
5962-8761903VEA
5962-8761903VFA
5962-8761901V2A
(J) CDIP
5962-8761903VEA
–55°C to 125°C
(W) CFP
5962-8761903VFA
(FK) LCCC
5962-8761901V2A
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
2
Submit Documentation Feedback
© 2011, Texas Instruments Incorporated
Product Folder Link(s): UC1707-SP
UC1707-SP
www.ti.com
SLUSAG0 –MARCH 2011
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
MIN
MAX UNIT
VIN
VC
Supply voltage
40
40
V
V
Collector supply voltage
Output current (each output, source or sink) steady-state
Peak transient
±500
±1
mA
A
Capacitive discharge energy
Digital inputs(1)
15
mJ
V
5.5
VIN
150
9.6
Analog stop inputs
TJ
Operating virtual-junction temperature
°C
J package
W package
FK package
J package
W package
FK package
θJC
Package thermal impedance, junction to case(2)(3)
8.3 °C/W
9.5
13
Power dissipation at Tcase = 25°C(1)
15
13
W
Operating temperature range
–55
–65
125
150
300
°C
°C
°C
Storage temperature range
Lead temperature (soldering, 10 seconds)
(1) All voltages are with respect to the four ground pins which must be connected together. All currents are positive into, negative out of the
specified terminal. Digital drive can exceed 5.5 V if input current is limited to 10 mA. Consult packaging section of databook for thermal
limitations and considerations of package.
(2) Maximum power dissipation is a function of TJ (max), θJC, and TC. The maximum allowable power dissipation at any allowable case
temperature is PD = (TJ (max) – TC)/θJC. Operating at the absolute maximum TJ of 150°C can affect reliability.
(3) The package thermal impedance is calculated in accordance with MIL-STD-883.
ELECTRICAL CHARACTERISTICS
Unless otherwise stated, these specifications apply for TA = –55°C to 125°C; VIN = VC = 20 V. TA = TJ.
PARAMETER
Supply current
TEST CONDITIONS
MIN
TYP
12
MAX UNIT
15 mA
VIN
VC
VC
VIN = 40 V
Supply current
VC = 40 V, outputs low
5.2
7.5 mA
0.1 mA
Leakage current
Digital input low level
Digital input high level
Input current
VIN = 0, VC - 30 V, no load
0.05
0.8
V
V
2.2
VI = 0
–0.06
–1.0 mA
Input leakage
VI = 5 V
0.05
0.1 mA
IO = –50 mA
IO = –500 mA
IO = –50 mA
IO = –500 mA
2.0
V
V
C – VO Output high sat.
2.5
0.4
V
VO
Output low sat.
2.5
8761901
8761903
100
90
130
130
–10
155
1.0
150
mV
150
Analog threshold
VCM = 0 to 15 V
VCM = 0
Input bias current
–20
μA
°C
V
Thermal shutdown
Shutdown threshold
Latch disable threshold
Pin 7 input
Pin 3 input
0.4
0.8
2.2
2.2
1.2
V
© 2011, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): UC1707-SP
UC1707-SP
SLUSAG0 –MARCH 2011
www.ti.com
TYPICAL SWITCHING CHARACTERISTICS
VIN = VC = 20 V, TA = 25°C. Delays measured to 10% output change.
PARAMETER
From Inv. Input to Output
TEST CONDITIONS
OUTPUT CL =
UNIT
nF
open
1.0
50
40
40
40
2.2
60
50
50
50
Rise time delay
10% to 90% rise
Fall time delay
40
25
30
25
ns
ns
ns
90% to 10% fall
ns
From N.I. Input to Output
Rise time delay
30
25
40
40
55
40
50
50
65
50
ns
ns
ns
ns
ns
ns
ns
ns
ns
10% to 90% rise
Fall time delay
45
90% to 10% fall
25
VC cross-conduction current spike duration Output rise
25
Output fall
0
Analog shutdown delay
Digital shutdown delay
Stop non-Inv. = 0 V
Stop Inv. = 0 to 0.5 V
2 V input on Pin 7
180
180
50
4
Submit Documentation Feedback
© 2011, Texas Instruments Incorporated
Product Folder Link(s): UC1707-SP
UC1707-SP
www.ti.com
SLUSAG0 –MARCH 2011
SIMPLIFIED INTERNAL CIRCUITRY
Figure 1. Typical Digital Input Gate
Figure 2. Typical Digital Input Gate
Figure 3. Latch Disable
© 2011, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Link(s): UC1707-SP
UC1707-SP
SLUSAG0 –MARCH 2011
www.ti.com
SIMPLIFIED INTERNAL CIRCUITRY (continued)
Figure 4. Use of the Shutdown Pin
SHUTDOWN CIRCUIT DESCRIPTION
The function of the circuitry is to be able to provide a shutdown of the device. This is defined as functionality that
will drive both outputs to the low state. There are three different inputs that govern this shutdown capability.
•
•
Analog Stop Pins — The differential inputs to this comparator provide a way to execute a shutdown.
Latch Disable Pin — Assuming that the Shutdown pin is left open, a high on this pin disables the latching
functionality of the Analog Stop shutdown. A low on this pin enables the latching functionality of the Analog
Stop shutdown. If a shutdown occurs through the Analog Stop circuit while Latch Disable is high, then the
outputs will go low, but will return to normal operation as soon as the Analog Stop circuit allows it. If a
shutdown occurs through the Analog Stop circuit while Latch Disable is low, then the outputs will go low and
remain low even if the Analog Stop circuit no longer drives the shutdown. The outputs will remain "latched"
low (in shutdown) until the Latch Disable goes high and the Analog Stop circuit allows it to return from
shutdown or the VIN voltage is cycled to 0V and then returned above 5V.
•
Shutdown Pin — This pin serves two purposes.
1. It can be used as an output of the Analog Stop circuit.
2. It can be used as an input to force a shutdown or to force the device out of shutdown. This pin can
override both the Analog Stop circuit as well as the Latch Disable Pin. When driving hard logic levels into
the Shutdown pin, the Latch Disable functionality will be overridden and the Latch Disable will not function
as it does when used in conjunction with the Analog Stop circuit. When the Shutdown pin is high, the
outputs will be in the low state (shutdown). When the Shutdown pin is low (hard logic low) the outputs will
operate normally, regardless of the state of the Latch Disable pin or the Analog Stop pins.
In order to use the Shutdown Pin with the Latch Disable functional it is necessary to use either a diode in series
with the Shutdown signal or to use an open collector pull-up so that the Shutdown pin is not pulled low. This
configuration will allow the Latch Disable function to work with the Shutdown pin.
6
Submit Documentation Feedback
© 2011, Texas Instruments Incorporated
Product Folder Link(s): UC1707-SP
UC1707-SP
www.ti.com
SLUSAG0 –MARCH 2011
SIMPLIFIED INTERNAL CIRCUITRY (continued)
Table 1. UG1707 SHUTDOWN TRUTH TABLE
ANALOG STOP
PREVIOUS STATE OF
SHUTDOWN
LATCH DISABLE
OUTPUT
LOGIC
OUTPUT
X
X
1
0
0
0
0
X
X
X
0
0
1
X
Follows Input Logic
Low (Shutdown)
1
X
X
Open
Open
Open
Open
Low (Shutdown)
Shutdown
Normal
X
(1)Latched Shutdown
Follows Input Logic
Follows Input Logic
(1) If the output was previously in Shutdown and Latch Disable was low and stays low, then even if the Analog Stop Logic is changed or the
Shutdown pin is open, the outputs will remain in Shutdown.
Figure 5. Transformer Coupled Push-Pull MOSFET Drive Circuit
Figure 6. Current Limiting
© 2011, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Link(s): UC1707-SP
UC1707-SP
SLUSAG0 –MARCH 2011
www.ti.com
Figure 7. Over-Voltage Protection
Figure 8. Power MOSFET Drive Circuit
Figure 9. Charge Pump Circuits
8
Submit Documentation Feedback
© 2011, Texas Instruments Incorporated
Product Folder Link(s): UC1707-SP
UC1707-SP
www.ti.com
SLUSAG0 –MARCH 2011
Figure 10. Power Bipolar Drive Circuit
Figure 11. Transformer Coupled MOSFET Drive Circuit
Figure 12. Power MOSFET Drive Circuit Using Negative Bias Voltage
and Level Shifting to Ground Reference PWM
© 2011, Texas Instruments Incorporated
Submit Documentation Feedback
9
Product Folder Link(s): UC1707-SP
PACKAGE OPTION ADDENDUM
www.ti.com
28-Aug-2012
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
5962-8761901V2A
5962-8761901VEA
5962-8761903VEA
5962-8761903VFA
ACTIVE
ACTIVE
ACTIVE
ACTIVE
LCCC
CDIP
CDIP
CFP
FK
J
20
16
16
16
1
1
1
1
TBD
TBD
TBD
TBD
POST-PLATE N / A for Pkg Type
A42
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
J
W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF UC1707-SP :
Catalog: UC1707
•
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
28-Aug-2012
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Addendum-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
相关型号：
UC1707L/81040
IC 1.5 A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, CQCC20, CERAMIC, LCC-20, MOSFET Driver
TI
©2020 ICPDF网 联系我们和版权申明