UC1826PW [TI]

UC1826PW;
UC1826PW
型号: UC1826PW
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

UC1826PW

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中文:  中文翻译
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UC1826  
UC2826  
UC3826  
Secondary Side Average Current Mode Controller  
FEATURES  
DESCRIPTION  
The UC1826 family of average current mode controllers accurately  
accomplishes secondary side average current mode control. The sec-  
ondary side output voltage is regulated by sensing the output voltage  
and differentially sensing the AC switching current. The sensed output  
voltage drives a voltage error amplifier.The AC switching current, mon-  
itored by a current sense resistor, drives a high bandwidth, low offset  
current error amplifier. The output of the voltage error amplifier can be  
used to drive the current amplifier which filters the measured inductor  
current. Fast transient response is accomplished by utilizing voltage  
feedforward in generating the PWM ramp.  
Practical Secondary Side Control of  
Isolated Power Supplies  
1MHz Operation  
Tailored Loop Bandwidth Provides  
Excellent Noise Immunity  
Voltage Feedforward Provides  
Superior Transient Response  
Accurate Programmable Maximum  
Duty Cycle  
The UC1826 features load share, oscillator synchronization, undervolt-  
age lockout, and programmable output control. Multiple chip operation  
can be achieved by connecting up to ten UC1826 chips in parallel.The  
SHARE bus and CLKSYN bus provide load sharing and synchroniza-  
tion to the fastest oscillator respectively.With its tailored bandwidth, the  
UC1826 provides excellent noise immunity and is an ideal controller to  
achieve high power, secondary side average current mode control.  
Multiple Chips Can be Synchronized  
to Fastest Oscillator  
Wide Gain Bandwidth Product  
(70MHz, Acl>10) Current Error  
Amplifier  
Up to Ten Devices Can Easily Share  
a Common Load  
BLOCK DIAGRAM  
Pin Numbers refer to 24-pin packages.  
UDG-95013  
7/95  
UC1826  
UC2826  
UC3826  
ABSOLUTE MAXIMUM RATINGS  
Storage Temperature . . . . . . . . . . . . . . . . . . . .65°C to +150°C  
Junction Temperature . . . . . . . . . . . . . . . . . . .65°C to +150°C  
Lead Temperature (Soldering, 10 sec.) . . . . . . . . . . . . .+300°C  
All voltages with respect to VEE except where noted; all currents  
are positive into, negative out of the specified terminal.  
Consult Packaging Section of Databook for thermal limitations  
and considerations of packages.  
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20V  
Output Current Source or Sink . . . . . . . . . . . . . . . . . . . . . .0.3A  
Analog Input Voltages . . . . . . . . . . . . . . . . . . . . . . .0.3V to 7V  
ILIM, KILL, SEQ, ENBL, RUN, PWRSEN, PWROK . . . .0.3V to 7V  
CLKSYN Current Source . . . . . . . . . . . . . . . . . . . . . . . . .20mA  
RUN Current Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20mA  
SEQ Current Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20mA  
RDEAD Current Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . .20mA  
RAMP Current Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20mA  
Share Bus Voltage (voltage with respect to GND) . . .0V to 6.2V  
ADJ Voltage (voltage with respect to GND) . . . . . .0.9V to 6.3V  
VEE (voltage with respect to GND) . . . . . . . . . . . . . . . . . .1.5V  
RECOMMENDED OPERATING CONDITIONS  
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8V to 20V  
Sink/Source Output Current . . . . . . . . . . . . . . . . . . . . . .250mA  
Timing Resistor RT . . . . . . . . . . . . . . . . . . . . . . . . . .1k to 200k  
Timing Capacitor CT . . . . . . . . . . . . . . . . . . . . . . . .75pF to 2nF  
CONNECTION DIAGRAMS  
DIL-24, SOIC-24,TSSOP-24 (Top View)  
J or N, DW, PW Packages  
PLCC-28 (Top View)  
Q Package  
ELECTRICAL CHARACTERISTICS Unless otherwise stated these specifications apply for TA = 55°C to +125°C for  
UC1826; 40°C to +85°C for UC2826; and 0°C to +70°C for UC3826;VCC = 12V, VEE = GND, Output no load, CT = 345pF,  
RT = 4k, RDEAD = 1000, CRAMP = 345pF, RRAMP = 35.2kΩ, RCLKSYN = 1k, TA = TJ.  
PARAMETER  
Current Error Amplifier  
TEST CONDITIONS  
MIN  
TYP  
MAX UNITS  
Ib  
0.5  
3
3
5
µA  
mV  
mV  
dB  
MHz  
V
Vio  
TA = +25°C  
0.75  
Over Temperature  
Avo  
60  
45  
90  
70  
GBW (Note 2)  
Acl = 10, RIN = 1k, CC = 15pF, f = 200kHz (Note 1)  
Vol  
IO = 1mA, Voltage above VEE  
IO = 0mA  
0.5  
3.8  
3.5  
Voh  
V
IO = 1mA  
V
Voltage Error Amplifier  
Ib  
0.5  
90  
3
5
µA  
mV  
dB  
Vio  
Avo  
60  
2
UC1826  
UC2826  
UC3826  
ELECTRICAL CHARACTERISTICS (cont.) Unless otherwise stated these specifications apply for TA = 55°C to  
+125°C for UC1826; 40°C to +85°C for UC2826; and 0°C to +70°C for UC3826;VCC = 12V, VEE = GND, Output no load, CT =  
345pF, RT = 4k, RDEAD = 1000, CRAMP = 345pF, RRAMP = 35.2kΩ, RCLKSYN = 1k, TA = TJ.  
PARAMETER  
Voltage Error Amplifier (cont.)  
GBW (Note 2)  
TEST CONDITION  
MIN  
TYP  
MAX UNITS  
f = 200kHz  
7
MHz  
Vol  
IO = 175mA, Volts above VEE  
ILIM = 3V  
0.6  
3.15  
100  
V
V
Voh  
2.85  
3
Voh-ILIM  
Tested ILIM = 0.5V, 1.0V, 2.0V  
100  
mV  
2X Amplifier and Share Amplifier  
V offset (b; y = mx + b)  
GAIN (m; y = mx + b)  
GBW (Note 2)  
RSHARE  
20  
mV  
V
Slope with AVOUT = 1V and 2V  
1.98  
2.02  
100  
200  
0
kHZ  
kΩ  
mV  
V
VCC = 0, VSHARE/ISHARE  
Total Offset  
Vol  
Negative supply is VEE, GND Open,VAO = GND  
VAO = Voltage Amp Vol, Volts above VEE  
IO = 0mA, ILIM = 3V, VAO = Voltage Amp Voh  
IO = 1mA, ILIM = 3V, VAO = Voltage Amp Voh  
75  
0.2  
5.7  
5.7  
75  
0.6  
6.3  
6.3  
0.45  
6
Voh  
V
6
V
Adjust Amplifier  
Vio  
gm  
Vol  
40  
60  
0.1  
1
80  
0.3  
1.1  
mV  
mS  
V
IO = 2µA to 2µA, CADJ = 0.1µF  
IOUT = 0  
0.9  
0.85  
5.7  
IOUT = 2µA  
1
1.15  
6.3  
V
Voh  
IOUT = 0, VSHARE = 6.5V  
IOUT = −2µA, VSHARE = 6.5V  
6
V
5.7  
6
6.3  
V
Oscillator  
Frequency  
450  
72  
2
500  
76  
550  
80  
kHz  
%
Max Duty Cycle  
OSC Ramp Amplitude  
Ramp Saturation  
Clock Driver/SYNC (CLKSYN)  
Vol  
2.2  
2.4  
0.8  
V
IO = 10mA, OSC = 0V  
0.44  
V
0.02  
3.6  
3.5  
25  
0.2  
V
V
Voh  
RCLKSYN = 200Ω  
V
ISOURCE  
mA  
k
RCLKSYN  
VCC = 0, VCLKSYN/ICLKSYN  
10  
VTH  
1.5  
V
VREF Comparator  
Turn-on Threshold  
4.65  
0.4  
V
V
Hysteresis  
VCC Comparator  
Turn-on Threshold  
Hysteresis  
7.9  
8.4  
0.4  
8.9  
0.4  
V
V
PWR Sense Comparator  
Voltage Threshold  
1.25  
0.3  
4
V
V
V
Vol  
IO = 1mA  
Voh  
IO = −100µA  
KILL Comparator  
Voltage Threshold  
3
V
3
UC1826  
UC2826  
UC3826  
ELECTRICAL CHARACTERISTICS (cont.) Unless otherwise stated these specifications apply for TA = 55°C to  
+125°C for UC1826; 40°C to +85°C for UC2826; and 0°C to +70°C for UC3826;VCC = 12V, VEE = GND, Output no load, CT =  
345pF, RT = 4k, RDEAD = 1000, CRAMP = 345pF, RRAMP = 35.2kΩ, RCLKSYN = 1k, TA = TJ.  
PARAMETER  
Sequence Comparator  
TEST CONDITION  
MIN  
TYP  
MAX UNITS  
Voltage Threshold  
SEQ SAT  
2.5  
V
V
IO = 10mA  
IO = 10mA  
0.25  
Enable Comparator  
Voltage Threshold  
RUN SAT  
2.5  
0.2  
V
V
Reference  
VREF  
TA = 25°C  
4.95  
4.9  
5
5.05  
5.1  
15  
V
VCC = 15V  
10 < VCC < 20  
0 < IO < 10mA  
VREF = 0V  
V
Line Regulation  
Load Regulation  
Short Circuit I  
Output Stage  
Rise Time  
3
3
mV  
mV  
mA  
15  
30  
60  
90  
CL = 100pF  
CL = 100pF  
10  
10  
20  
20  
ns  
ns  
V
Fall Time  
Voh  
VCC > 11V, IO = −10mA  
IO = 200mA  
8.0  
7.8  
8.4  
8.8  
V
Vol  
IO = 200mA  
3.0  
0.5  
V
IO = 10mA  
V
Virtual Ground  
VGND VEE  
VEE is externally supplied, GND is floating  
and used as Signal GND.  
0.2  
0.75  
21  
V
Icc  
Icc (run)  
30  
mA  
Note 1: Guaranteed by design. Not 100% tested in production.  
Note 2: Unless otherwise specified all voltages are with respect to GND. Currents are positive into, negative out of the  
specified terminal.  
PIN DESCRIPTIONS  
ADJ: The output of the transconductance (gm = 0.1mS) the current amplifier gain. This pin needs a 0.1µF capaci-  
amplifier adjusts the control voltage to maintain equal cur- tor to compensate the amplifier.  
rent sharing. The chip sensing the highest output current  
CA-, CA+: The inverting and non-inverting inputs to the  
will have its output clamped to 1V. A resistor divider  
current error amplifier. This amplifier needs a capacitor  
between VREF and ADJ drives the control voltage (VA+)  
between CA- and CAO to set its dominant pole.  
for the voltage amplifier. Each slave unit’s ADJ voltage  
CAO: The output of the current error amplifier which is  
internally clamped to 4V. It is internally connected to the  
inverting input of the PWM comparator.  
increases (to a maximum of 6V) its control voltage (VA+)  
until its load current is equal to the master. The 60mV  
input offset on the gm amplifier guarantees that the unit  
sensing the highest load current is chosen as the master.  
The 60mV offset is guaranteed by design to be greater  
than the inherent offset of the gm amplifier and the buffer  
amplifier. While the 60mV offset represents an error in  
current sharing, the gain of the current and 2X amplifiers  
reduces it to only 30mV. The total current sense gain is  
CLKSYN: The clock and synchronization pin for the  
oscillator. This is a bidirectional pin that can be used to  
synchronize several chips to the fastest oscillator. Its  
input synchronization threshold is 1.4V. The CLKSYN  
voltage is 3.6V when the oscillator capacitor CT is being  
discharged, otherwise it is 0V.  
4
UC1826  
UC2826  
UC3826  
PIN DESCRIPTIONS (cont.)  
ENBL: The active low input with a 2.5V threshold VCC and GND to accomplish feedforward. The PWM  
enables the output to switch. SEQ and RUN are driven output drives this pin. When the output is high, the tran-  
low when ENBL is above its 2.5V threshold.  
sistor is off enabling the charging of the RAMP capacitor.  
When the output transitions low, the transistor is turned  
on discharging the RAMP capacitor. The voltage at  
RAMP rises from 0.2V to near 4V at maximum duty  
cycle. Although this is an exponential ramp at high VCC  
voltage the ramp appears linear.  
GND: The signal ground used for the voltage sense  
amplifier, current error amplifier, current error amplifier,  
voltage reference, 2X amplifier, and share amplifier. The  
output sink transistor is wired directly to this pin.  
KILL: The active low input with a 3.0V threshold stops  
the output from switching. Once this function is activated  
RUN must be cycled low by driving KILL above 3.0V and  
either resetting the power to the chip (VCC) or resetting  
the ENBL signal.  
RDEAD: The pin that programs the maximum duty cycle  
by connecting a resistor between it and OSC. The maxi-  
mum duty cycle is decreased by increasing this resistor  
value which increases the discharge time. The dead  
time, the time when the output is low, is 2 RDEAD CT.  
·
·
ILIM: A voltage on this pin programs the voltage error  
amplifier’s Voh clamp. The voltage error amplifier output  
represents the average output current.The Voh clamp con-  
sequently limits the output current. If ILIM is tied to VREF, it  
defaults to 3.0V. A voltage less than 3.0V connected to  
ILIM clamps the voltage error amplifier at this voltage and  
consequently limits the maximum output current.  
The CT capacitance should be increased by approxi-  
mately 40pF to account for parasitic capacitance.  
RUN: This is an open collector logic output that signifies  
when the chip is operational. RUN is pulled high to VREF  
through an external resistor when VCC is greater than  
8.4V, VREF is greater than 4.65V, SEQ is greater than  
2.5V, and KILL lower than 3.0V. RUN connected to the  
VA+ pin and to a capacitor to ground adds an RC rise  
time on the VA+ pin initiating a soft start.  
OSC:The oscillator ramp (not to be confused with PWM  
ramp) pin has a capacitor CT to ground and two resistors  
in series RT and RDEAD to VREF. The total resistance of  
RT and RDEAD divided by VREF VOSC sets exponential  
charge current. The oscillator charges from 1.2V to 3.4V  
until the output transitions low. At this time an open col-  
lector transistor is turned on and discharges the CT  
capacitor through RDEAD.  
SEQ: The sequence pin allows the sequencing of startup  
for multiple units. A resistor between VREF and SEQ and  
a capacitor between SEQ and GND create a unique RC  
rise time for each unit which sequences the output startup.  
SHARE:The nearly DC voltage representing the average  
output current. This pin is wired directly to all SHARE  
pins and is the load share bus.  
The charge time is approximately TCHARGE = 2(RT +  
RDEAD) CT when the RDEAD resistor is used.  
·
VA-, VA+: The inverting and non-inverting inputs to the  
voltage error amplifier.  
The dead time is approximately TDISCHARGE = 2  
CT.  
·
RDEAD  
·
1
VAO: The output of the voltage error amplifier. Its Voh is  
clamped with the ILIM pin.  
(1) Frequency ≈  
TCHARGE + TDISCHARGE  
TCHARGE  
VCC: The input voltage to the chip. The chip is opera-  
tional between 8.4V and 20V.  
(2) Maximum Duty Cycle ≈  
TCHARGE + TDISCHARGE  
VEE: The negative supply voltage to the chip which pow-  
ers the lower voltage rail for all amplifiers. The chip is  
operational if VEE is connected to GND or if GND is  
floating. When voltage is applied externally to VEE, GND  
becomes a virtual ground because of an internal diode  
between VEE and GND. The GND current flows through  
the forward biased diode and out VEE. GND is always  
the signal ground from which the voltage reference and  
all amplifier inputs are referenced.  
The CT capacitance should be increased by approxi-  
mately 40pF to account for parasitic capacitance.  
OUT: The output of the PWM driver. It has an upper  
clamp of 8.5V. The peak current sink and source are  
250mA. All UVLO, SEQ, ENBL, and KILL logic either  
enable or disable the output driver.  
PWRSEN: This pin is the input to the PWROK comparator.  
PWROK: The output pin from the PWROK comparator. It  
has a 300µA current source output when driven high.  
VREF: The reference voltage equal to 5.0V.  
RAMP: An open collector that can sink 20mA to dis-  
charge the oscillator capacitor. An RC is tied between  
5
UC1826  
UC2826  
UC3826  
UDG-95014-1  
Figure 1. Oscillator Block with External Connections  
CIRCUIT DESCRIPTION:  
PWM Oscillator: The chip has two pins that set RC time delay of 2  
CT  
(RDEAD + RT). After exceeding this  
· ·  
constants. The resistor and capacitor tied to RAMP cre- threshold, the RS flip-flop is set driving CLKSYN high  
ate the ramp used as the input to the PWM comparator. and RDEAD low which discharges CT. At this time and  
When the output pin OUT is high, RAMP charges until it open collector transistor is turned on and discharges CT  
passes the PWM comparator threshold. The output is  
then driven low and RAMP is discharged. The resistors  
and capacitor on the OSC pin are used to set the PWM shown in Figure 2. Equations to attain frequency and  
capacitor through RDEAD with a RC time delay of 2  
·
CT  
RDEAD. The oscillator and ramp waveforms are  
·
operating frequency and its maximum duty cycle.  
maximum duty cycle are listed under the OSC pin  
description.  
The oscillator block diagram with external wiring is  
shown in Figure 1. OSC has a capacitor (CT) to ground  
and two resistors in series (RT and RDEAD) to VREF.The  
As shown in Figure 3, several oscillators are synchro-  
nized to the highest free running frequency by connect-  
total resistance of RT and RDEAD divided by VREF ing 100pF capacitors in series with each CLKSYN pin  
VOSC sets the exponential charge current. The oscillator  
and connecting the other side of the capacitors together  
charges from 1.2V to a 3.4V threshold with an RC time forming the CLKSYN bus. The CLKSYN bus is then  
pulled down to ground with a resistance of approximately  
10k. Referring to Figure 1, the synchronization threshold  
is 1.4V. The oscillator blanks any synchronization pulse  
3.0-  
that occurs when OSC is below 2.5V. This allows units,  
once they discharge below 2.5V, to continue through the  
OSC  
1.0  
current discharge and subsequent charge cycles  
whether or not other units on the CLKSYN bus are still  
CLKSYN  
synchronizing.This requires the frequency of all free run-  
ning oscillators to be within 40% of each other to guaran-  
OUT  
tee synchronization.  
CAO  
Grounds, Voltage Sensing and Current Sensing: The  
RAMP  
voltage is sensed directly at the load. Proper load shar-  
ing requires the same sensed voltage for each power  
supply connected in parallel. Referring to Figure 4, the  
Figure 2. Oscillator and PWM Output Waveform  
6
UC1826  
UC2826  
UC3826  
CIRCUIT BLOCK DESCRIPTION (cont.)  
Figure 4 shows one recommended voltage and current  
sensing scheme when VEE is connected to GND. The  
signal ground is the negative sense point for the output  
voltage and the positive sense point for the output cur-  
rent. VEE is the negative supply for the current sense  
amplifier. When it is separated from GND, it extends the  
current sense amplifier’s common mode input voltage  
range to include VEE which is approximately 0.7V  
below ground.The resistor RADJ is used for load sharing.  
The unit which is the master will force VADJ to 1.0V.  
Therefore, the regulated voltage being sensed is actually  
RADJ  
· (R1 + RADJ  
VSP VSM = (VREF VADJ)  
+ VADJ  
)
VSM = 0V, VADJ = 1V (master), VREF = 5V  
RADJ  
VSP = 4  
(
)
+ 1V  
·
R1 + RADJ  
The voltage at ADJ on the slave chips will increase forc-  
ing their load currents to increase to match the master.  
UDG-95015  
The AC frequency response of the voltage error amplifier  
is shown in Figure 5.  
Figure 3. Oscillator Synchronization  
Connection Diagram  
positive sense voltage (VSP) connects to the voltage  
error amplifier inverting terminal (VA-), the return lead for  
the on-chip reference is used as the negative sense  
(VSM). The current is sensed across the shunt resistor,  
RS. The voltage across the shunt resistor is level shifted  
up so that the maximum voltage across Rs corresponds  
to the voltage error amplifier Voh.  
m ≈  
Figure 5. AC Frequency Response of the Voltage  
Error Amplifier  
Startup and Shutdown: Isolated power up can be  
accomplished using the UCC1889. Application Note  
U-149 is available for additional information.  
The UC1826 offers several features that enhance startup  
and shutdown. Soft start is accomplished by connecting  
RUN to VA+ and a capacitor to ground. The resulting RC  
rise time on the VA+ pin initiates a soft start. It can also  
be accomplished by connecting RUN to ILIM.When RUN  
is low it will command zero load current, guaranteeing a  
soft start. The undervoltage lockout (UVLO) is a logical  
AND of ENBL < 2.5V, SEQ > 2.5V, VCC > 8.4V and  
UDG-95016  
Figure 4.Voltage and Current Sense VEE Tied to GND  
7
UC1826  
UC2826  
UC3826  
CIRCUIT BLOCK DESCRIPTION (cont.)  
VREF > 4.65V.The block diagram shows that the thresh- Current Control Loop: The current error amplifier (CEA)  
olds are set by comparators. By placing an RC divider on needs its loop compensated externally. The zero crossing  
the SEQ pin, the enabling of multiple chips can be can be calculated with Equation 3.  
sequenced with different RC time constants. Similarly,  
different RC time constants on the ENBL pins can  
1
(3) Frequency (0dB) =  
2π RINV  
CCOMP  
·
sequence shutdown. The UVLO keeps the output from  
switching; however the internal reference starts up with  
VCC less than 8.4V. The KILL input shuts down the  
switching of the chip. This can be used in conjunction  
with an overvoltage comparator for overvoltage protec-  
tion. In order to restart the chip after KILL has been initi-  
ated, the chip must be powered down and then back up.  
A pulse on the ENBL pin also accomplishes this without  
actually removing voltage to the VCC pin.  
RINV is the input resistance at the inverting terminal CA-  
CCOMP is the capacitance between CA- and CAO.  
Although it is only unity gain stable for a BW of 7MHz,  
the amplifier is typically configured with a differential gain  
of at least 10, allowing the amplifier to operate with suffi-  
cient phase margin at a GBW of 70MHz. A closed loop  
gain of 10 attenuates the output by 20.8dB  
1
20.8 = 20log  
·
Load Sharing: Load sharing is accomplished similarly to  
the UC1907 except it has the added constraint of using  
the sensed current for average current mode control.The  
sensed current for the UC1826 has an AC component  
that is amplified and then averaged. The voltage error  
amplifier represents this average current. The voltage  
error amplifier output is the current command signal and  
its voltage represents the average output load current.  
The ILIM pin programs the upper clamp voltage of this  
amplifier and consequently the maximum load current. A  
gain of 2 amplifier connected between the voltage error  
amplifier output and the share amplifier input increases  
the current share resolution and noise margin. The aver-  
age current is used as an input to a source only load  
share buffer amplifier. The output of this amplifier is the  
current share bus. The IC with the highest sensed cur-  
rent will have the highest voltage on the current share  
bus and consequently act as the master.The 60mV input  
offset guarantees that the unit sensing the highest load  
current is chosen as the master.  
11  
to the inverting terminal assuring stability. The amplifier’s  
gain fed back into the inverting terminal is less than unity  
at 7MHz, where the phase margin begins to roll off. See  
Figure 6 for a typical Bode plot.  
β
m
The adjust amplifier is used by the remaining (slave) ICs  
to adjust their respective references high in order to bal-  
ance each IC’s load current.The master’s ADJ pin will be  
at its 1.0V clamp and connected back to the non-invert-  
ing voltage error amplifier input through a high value  
resistor. This requires the user to initially calculate the  
control voltage with the ADJ pin at 1.0V.  
Figure 6. Current Error Amplifier Bode Plot  
The current error amplifier bandwidth is rolled off and  
controlled by the voltage error amplifier output.The maxi-  
mum load current is limited to approximately the maxi-  
mum voltage across the shunt resistor (maximum of  
200mV) divided by RS:  
VREF can be adjusted 150mV to 300mV which compen-  
sates for 5% unit to unit reference mismatch and external  
resistor mismatch. RADJ will typically be 10 to 30 times  
larger than R1.This also attenuates the overall variation of  
the ADJ clamp of 1V ±100mV by a factor of 10 to 30, con-  
tributing only a 3mV to 10mV additional delta to VREF.  
Refer to the UC3907 Application Note U-130 for further  
information on parallel power supply load sharing.  
VRs  
(4) IMAXload =  
RS  
ILIM sets the maximum current limit by setting the Voh  
clamp on the voltage error amplifier. If ILIM is not set to  
limit the Voh to be equal to the maximum voltage across  
RS, VAO must be attenuated to match the maximum volt-  
8
UC1826  
UC2826  
UC3826  
CIRCUIT BLOCK DESCRIPTION (cont.)  
age VRS across the shunt resistor. By attenuating the Design Example: Figure 7 is an open loop test that lets  
maximum voltage at VAO to be equal to VRS, the current the user test the circuit blocks discussed without having  
control loop keeps the load from exceeding its current to build an entire control loop. The pulse width can be  
limit. If the ILIM pin is connected to VREF, the Voh is set  
varied by either the VADJ or the VISENSE inputs. Figure 8  
at 3.0V. The maximum current limit clamp can be shows an isolated power supply using the UC1826 sec-  
reduced by reducing the voltage on ILIM to less than ondary side average current mode controller.  
3.0V as described in the ILIM pin description.  
UDG-95017-1  
Figure 7. Open Loop Circuit  
9
UC1826  
UC2826  
UC3826  
UNITRODE INTEGRATED CIRCUITS  
7 CONTINENTAL BLVD. • MERRIMACK, NH 03054  
TEL. 603-424-2410 • FAX 603-424-3460  
10  
IMPORTANT NOTICE  
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TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
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TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
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Copyright 1999, Texas Instruments Incorporated  

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