UC1846VTD1 [TI]
DIE 中的航天级、40V 输入、1.5A 双路输出 500kHz PWM 控制器 | TD | 0 | -55 to 125;
| 型号： | UC1846VTD1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | DIE 中的航天级、40V 输入、1.5A 双路输出 500kHz PWM 控制器 | TD | 0 | -55 to 125 控制器 开关 |
| 文件： | 总6页 (文件大小：366K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
UC1846-DIE
www.ti.com.cn
ZHCSAG1 –NOVEMBER 2012
电流模式脉宽调制 (PWM) 控制器
1
特性
•
•
•
•
•
自动前馈补偿
•
•
•
•
•
具有宽共模范围的差分电流感测放大器
可编程逐脉冲电流限制
双脉冲抑制
欠压闭锁
推挽配置中的自动对称校正
增强型负载响应特性
软启动功能
关断端子
针对模块化电源系统的并行运行功能
说明
UC1846 控制集成电路 (IC) 在保持最小外部部件数量的同时提供执行定频、电流模式控制机制所需的全部特性。
这个技术的出色性能可在改进的线路稳压、增强型负载响应特性，和一个更简单、易于设计的控制环路中测得。 拓
扑优势在保持电流均流的基础上包含固有逐脉冲电流限制功能、针对推挽转换器的自动对称校正和电源模块的并行
功能。
除了软启动功能外，保护电路还包括内置欠压闭锁和可编程电流限制。 还提供关断功能，此功能启动一个具有自动
重启的完全关断或者将电源锁存。
其它特性包括完全锁存运行，双脉冲抑制和期限调节功能。
在关闭状态下，UC1846 特有低输出。
ORDERING INFORMATION(1)
PACKAGE
DESIGNATOR
PRODUCT
PACKAGE
ORDERABLE PART NUMBER
PACKAGE QUANTITY
UC1846VTD1
UC1846VTD2
100
10
UC1846
TD
Bare die in waffle pack(2)
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2012, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
English Data Sheet: SGLS409
UC1846-DIE
ZHCSAG1 –NOVEMBER 2012
www.ti.com.cn
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
BARE DIE INFORMATION
BACKSIDE
POTENTIAL
BOND PAD
METALLIZATION COMPOSITION
BOND PAD
THICKNESS
DIE THICKNESS
BACKSIDE FINISH
10.5 mils.
Silicon with backgrind
Floating
AlCu2
2000 nm
2
Copyright © 2012, Texas Instruments Incorporated
UC1846-DIE
www.ti.com.cn
ZHCSAG1 –NOVEMBER 2012
Table 1. Bond Pad Coordinates in Microns
DESCRIPTION
PAD NUMBER
X MIN
2174.24
2235.2
1996.44
1635.76
467.36
289.56
142.24
157.48
157.48
157.48
772.16
1346.2
1341.12
1920.24
2255.52
2214.88
Y MIN
1661.16
2026.92
2219.96
2219.96
2219.96
2219.96
1671.32
1270
X MAX
Y MAX
1767.84
2133.6
2326.64
2326.64
2326.64
2326.64
1778
C/S SS
VREF
C/S-
1
2
2280.92
2341.88
2103.12
1742.44
574.04
396.24
248.92
264.16
264.16
264.16
889
3
C/S+
E/A+
E/A-
4
5
6
COMP
CT
7
8
1376.68
1046.48
279.4
RT
9
939.8
Sync
A Out
GND
VC
10
11
12
13
14
15
16
172.72
213.36
81.28
350.52
208.28
645.16
350.52
426.72
1214.12
1463.04
1468.12
2037.08
2362.2
2321.56
472.44
213.36
320.04
1107.44
B Out
VIN
Shutdown
Copyright © 2012, Texas Instruments Incorporated
3
PACKAGE OPTION ADDENDUM
www.ti.com
25-Mar-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
UC1846VTD1
UC1846VTD2
ACTIVE
ACTIVE
0
0
100
10
RoHS & Green
RoHS & Green
Call TI
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Mar-2022
OTHER QUALIFIED VERSIONS OF UC1846-DIE :
Enhanced Product : UC1846-EP
•
Space : UC1846-SP
•
NOTE: Qualified Version Definitions:
Enhanced Product - Supports Defense, Aerospace and Medical Applications
•
Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
•
Addendum-Page 2
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Copyright © 2022，德州仪器 (TI) 公司
相关型号：
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