UC3710NG4 [TI]
High Current FET Driver; 大电流FET驱动器
| 型号： | UC3710NG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | High Current FET Driver |
| 文件： | 总6页 (文件大小：104K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
UC1710
UC2710
UC3710
High Current FET Driver
FEATURES
DESCRIPTION
• Totem Pole Output with 6A
Source/Sink Drive
The UC1710 family of FET drivers is made with a high-speed Schottky pro-
cess to interface between low-level control functions and very high-power
switching devices-particularly power MOSFET’s. These devices accept
low-current digital inputs to activate a high-current, totem pole output which
can source or sink a minimum of 6A.
• 3ns Delay
• 20ns Rise and Fall Time into 2.2nF
• 8ns Rise and Fall Time into 30nF
• 4.7V to 18V Operation
Supply voltages for both V and V can independently range from 4.7V to
IN
C
18V. These devices also feature under-voltage lockout with hysteresis.
The UC1710 is packaged in an 8-pin hermetically sealed dual in-line pack-
age for –55°C to +125°C operation. The UC2710 and UC3710 are speci-
fied for a temperature range of –40°C to +85°C and 0°C to +70°C
respectively and are available in either an 8-pin plastic dual in-line or a
5-pin, TO-220 package. Surface mount devices are also available.
• Inverting and Non-Inverting Outputs
• Under-Voltage Lockout with
Hysteresis
• Thermal Shutdown Protection
• MINIDIP and Power Packages
ORDERING INFORMATION
TEMPERATURE
RANGE
PACKAGE
TRUTH TABLE
UC1710J
UC2710DW
UC2710J
UC2710N
UC2710T
UC3710DW
UC3710N
UC3710T
–55°C to +125°C
–40°C to +85°C
8 pin CDIP
INV
H
N.I.
H
Out
L
16 pin SOIC-wide
8 pin CDIP
OUT= INV and N.I.
OUT= INV or N.I.
8 pin PDIP
L
H
H
5 pin TO220
16 pin SOIC-wide
8 pin PDIP
H
L
L
0°C to +70°C
L
L
L
5 pin TO220
BLOCK DIAGRAM
INTERNALLY CONNECTED IN T PACKAGE
OUTPUT BIAS
5
VIN
4
VC
LOGIC BIAS
3
2
Out
N.I. IN
8
TSD
Pwr Gnd
INV IN
1
7
UVLO
Logic Gnd
INTERNALLY CONNECTED IN T PACKAGE
UDG-99079
05/99
UC1710
UC2710
UC3710
ABSOLUTE MAXIMUM RATINGS
N-Package
J-Package
T-Package
Supply Voltage, Vin . . . . . . . . . . . . . . . . . . . . . . . . . . . 20V . . . . . . . . . . . . . . 20V . . . . . . . . . . . . . . 20V
Collector Supply Voltage, VC . . . . . . . . . . . . . . . . . . . . 20V . . . . . . . . . . . . . . 20V . . . . . . . . . . . . . . 20V
Operating Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18V . . . . . . . . . . . . . . 18V . . . . . . . . . . . . . . 18V
Output Current (Source or Sink)
±
Steady-State. . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 500mA. . . . . . . . . . . . 500mA . . . . . . . . . . . . . ± 1A
Digital Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3V-VIN . . . . . . . . –0.3V – VIN . . . . . . . . –0.3V – VIN
Power Dissipation at Ta=25°C . . . . . . . . . . . . . . . . . . . 1W. . . . . . . . . . . . . . . 1W. . . . . . . . . . . . . . . 3W
Power Dissipation at T (Case) = 25°C. . . . . . . . . . . . . . 2W. . . . . . . . . . . . . . . 2W. . . . . . . . . . . . . . 25W
Operating Junction Temperature. . . . . . . –55°C to +150°C . . . . –55°C to +150°C . . . . –55°C to +150°C
Storage Temperature . . . . . . . . . . . . . . . –65°C to +150°C . . . . –65°C to +150°C . . . . –65°C to +150°C
Lead Temperature (Soldering, 10 seconds) . . . . . . . 300°C . . . . . . . . . . . . 300°C . . . . . . . . . . . . 300°C
Note 1: All currents are positive into, negative out of the specified terminal.
Note 2: Consult Unitrode Integrated Circuits databook for information regarding thermal specifications
and limitations of packages.
CONNECTION DIAGRAMS
DIL-8 MINIDIP (Top View)
J or N Package
SOIC-16 (Top View)
DW Package
5-Pin TO-220 (Top View)
T Package
ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for VIN = VC = 15V, No load,
TA = TJ.
PARAMETERS
VIN Supply Current
TEST CONDITIONS
VIN =18V, VC =18V, Output Low
VIN =18V, VC =18V, Output High
VIN =18V, VC =18V, Output Low
VIN =18V, VC =18V,Output High
VIN High to Low
MIN
TYP
26
MAX UNITS
35
30
5.0
8
mA
mA
mA
mA
V
21
VC Supply Current
UVLO Threshold
1.5
5.0
4.1
4.4
3.8
4.1
4.4
4.8
VIN Low to High
V
2
UC1710
UC2710
UC3710
ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for VIN = VC = 15V, No load,
TA = TJ.
PARAMETERS
TEST CONDITIONS
MIN
TYP
MAX UNITS
UVLO Threshold Hysteresis
Digital Input Low Level
Digital Input High Level
Digital Input Current
0.1
0.3
0.5
0.8
V
V
2.0
V
Digital Input = 0.0V
–70
–4.0
1.35
3.2
µA
V
Output High Sat., VC – VO
IO= –100mA
IO= –6A
2.2
4.5
0.6
4.5
V
Output Low Sat., VO
IO= 100mA
IO= 6A
0.25
3.4
V
V
Thermal Shutdown
165
°C
From Inv., Input to Output (Note 3, 4):
Rise Time Delay
CL = 0
35
35
35
20
25
85
35
35
35
15
20
85
70
70
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
CL = 2.2nF
CL = 30nF
CL = 0
70
10% to 90% Rise
Fall Time Delay
90% to 10% Fall
40
CL = 2.2nF
CL = 30nF
CL = 0
40
150
70
CL = 2.2nF
CL = 30nF
CL = 0
70
80
40
CL = 2.2nF
CL = 30nF
40
150
From N.I. Input to Output (Note 3,4):
Rise Time Delay
CL = 0
35
35
35
20
25
85
35
35
35
15
20
85
30
70
70
70
40
40
150
70
70
80
40
50
150
40
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
mA
CL = 2.2nF
CL = 30nF
CL = 0
10% to 90% Rise
Fall Time Delay
90% to 10% Fall
CL = 2.2nF
CL = 30nF
CL = 0
CL = 2.2nF
CL = 30nF
CL = 0
CL = 2.2nF
CL = 30nF
TA = 25°C (Note 5) CL = 0
Total Supply Current at 200kHz Input
Switching Frequency
Note: 3. Delay measured from 50% input change to 10% output change.
Note: 4. Those parameters with CL = 30nF are not tested in production.
Note: 5. Inv. Input pulsed at 50% duty cycle with N.I. Input = 3V. or N.I. Input pulsed at 50% duty cycle with Inv. Input = 0V.
UNITRODE CORPORATION
7 CONTINENTAL BLVD. • MERRIMACK, NH 03054
TEL. (603) 424-2410 FAX (603) 424-3460
3
PACKAGE OPTION ADDENDUM
www.ti.com
5-Sep-2011
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
5962-0152001QPA
5962-0152001VPA
5962-0152001VXA
UC1710J
ACTIVE
ACTIVE
CDIP
CDIP
JG
JG
JG
JG
JG
L
8
8
1
1
1
1
1
TBD
TBD
TBD
TBD
TBD
TBD
TBD
Call TI
A42
Call TI
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
Call TI
ACTIVE
CDIP
8
A42
ACTIVE
CDIP
8
A42
UC1710J883B
UC1710L883B
UC1710SP
ACTIVE
CDIP
8
A42
OBSOLETE
OBSOLETE
ACTIVE
TO/SOT
CDIP
20
16
8
Call TI
Call TI
J
Call TI
UC2710N
PDIP
P
50
50
50
50
40
40
50
50
50
50
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
UC2710NG4
UC2710T
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PDIP
TO-220
TO-220
SOIC
P
KC
KC
DW
DW
P
8
5
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
Green (RoHS
& no Sb/Br)
CU SN
CU SN
N / A for Pkg Type
N / A for Pkg Type
UC2710TG3
UC3710DW
UC3710DWG4
UC3710N
5
Green (RoHS
& no Sb/Br)
16
16
8
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
SOIC
Green (RoHS
& no Sb/Br)
PDIP
Green (RoHS
& no Sb/Br)
UC3710NG4
UC3710T
PDIP
P
8
Green (RoHS
& no Sb/Br)
TO-220
TO-220
KC
KC
5
Green (RoHS
& no Sb/Br)
CU SN
CU SN
N / A for Pkg Type
N / A for Pkg Type
UC3710TG3
5
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
5-Sep-2011
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF UC1710, UC1710-SP, UC3710 :
Catalog: UC3710, UC1710
•
Military: UC1710
•
Space: UC1710-SP
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Military - QML certified for Military and Defense Applications
•
Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
•
Addendum-Page 2
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