UC5172N [TI]
Octal Line Driver with Long Line Drive 28-PDIP 0 to 70;
| 型号： | UC5172N |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Octal Line Driver with Long Line Drive 28-PDIP 0 to 70 驱动 光电二极管 接口集成电路 驱动器 |
| 文件： | 总6页 (文件大小：263K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
UC5172
Octal Line Driver
FEATURES
DESCRIPTION
•
•
•
Eight Single-Ended Line Drivers in One
Package
The UC5172 is a single-ended octal line driver designed to meet both
standard modem control applications (EIA232E/V.28), and long line
drive applications (EIA423A/V.10/X.26). The slew rate for all 8 drivers
is controlled by a single external resistor. The slew rate and output lev-
els are independent of the power variations.
Meets Standards EIA232E/CCITT V.28,
and EIA423A/CCITT V.10/X.26
Single External Resistor Controls Slew
Rate
The UC5172 has high output current, and current balance for long line
drive applications. EOS - Output parasitic SCRs powered on and off
are 35V, well above signal levels, allowing protection devices to work.
•
•
•
•
•
•
Wide Supply Voltage Range
Tri-State Outputs
Inputs are compatible TTL+MOS logic families and are diode protected
against negative transients.
Output Short-Circuit Protection
Low Power Consumption
2kV ESD Protection on all Pins
FUNCTIONAL TABLE
INPUTS
OUTPUT
EIA232E/EIA423A
5V to 6V
EN
0
DATA
0
1
X
EOS on all Output Pins 35V under all
Output Conditions
0
-5V to -6V
1
High Z
Note 2: Minimum output swings.
•
High Current Output for Long Line
Drive, Exceeds Standards
ABSOLUTE MAXIMUM RATINGS (Note 1)
V+ (Pin 20) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15V
V- (Pin 11) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -15V
PLCC Power Dissipation, TA=25°C (Note 3) . . . . . . . . . . . . . . . . . . . 1000 mW
DIP Power Dissipation, TA=25°C (Note 3) . . . . . . . . . . . . . . . . . . . . . 1250 mW
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1.5V to +7V
Output Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -6V to +6V
Slew Rate Resistor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2k to 10kΩ
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C
Note 1: All voltages are with respect to ground, pin 18.
Note 3: Consult Packaging section of Databook for thermal limitations and
considerations of package.
CONNECTION DIAGRAMS
N PACKAGE (TOP VIEW)
Q PACKAGE (TOP VIEW)
9/96
UC5172
Unless otherwise stated these specifications hold for |V+| = |V-| = 10V,
0°C < TA < +70°C, RSRA = +10k, TA =TJ.
DC ELECTRICAL CHARACTERISTICS:
PARAMETER
POWER SUPPLY REQUIREMENTS
V+ Range
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX UNITS
9
15
-15
25
V
V- Range
-9
V
V+ Supply Current
V- Supply Current
INPUTS
I+
I-
RL = Infinite En = 0V
15
mA
mA
RL = Infinite En = 0V
-17
-25
High-Level Input Voltage
Low-Level Input Voltage
Input Clamp Voltage
High Level Input Current
Low Level Input Current
OUTPUTS
VIH
VIL
VIK
IIH
2.0
V
V
0.8
-18
40
II = -15 mA
VIH = 2.4V
VIL = 0.4V
-1.1
0.25
-8.0
V
-2
µA
µA
IIL
-200
High Level Output Voltage
EIA232E
VOH
VOL
VIN = 0.8V
En = 0.8V
RL = Inf.
RL = 3k
5.0
5.0
5.3
5.3
6.0
6.0
V
V
(EIA-423A)
RL = 450
RL = Inf.
RL = 3k
RL = 450
4.5
5.2
6.0
V
Low Level Output Voltage
EIA232E
VIN = 2.0V
En = 0.8V
-5.0
-5.0
-4.5
-5.3
-5.6
-5.4
0.2
-6.0
-6.0
-6.0
0.4
V
V
(EIA-423A)
V
Output Balance (EIA-423A)
Off-State Output Current
Short-Circuit Current
VBAL
IOZ
RL = 450, VOH - VOL = VBAL
V
±
En = 2.0V, VO = 6V, V+ = 15V, V− = -15V -100
100
µA
mA
mA
mA
IOS
En = 0V
VIN = 0V
VIN = 5V
25
25
65
70
±
Power Off Output Current
IPO
VO = 6V, V+ = V− = 0V
-100
100
at |V+| = |V-| = +10V, 0°C < TA < +70°C, TA = TJ.
AC ELECTRICAL CHARACTERISTICS:
PARAMETER
Output Slew Rate
SYMBOL
TEST CONDITIONS
RSRA = 2k
MIN
7.6
7.6
1.5
1.5
TYP
8.5
8.5
1.7
1.7
0.8
0.5
2.0
1.0
MAX UNITS
tR
tF
9.4
9.4
1.9
1.9
2.0
2.0
7.0
7.0
V/µs
V/µs
Vµs
V/µs
µs
RL = 450, CL = 50pF
RSRA = 10k
Output Slew Rate
tR
tF
RL = 450, CL = 50pF
RSRA = 10k
Propagation Output
to High Impedance
tHz
tLz
tzH
tzL
RL = 450, CL = 50pF
RSRA = 10k
µs
Propagation High
Impedance to Output
ms
RL = 450, CL = 50pF
µs
2
UC5172
AC PARAMETER TEST CIRCUIT AND WAVEFORMS
AC CHARACTERISTICS
Driver Slew Rate
Driver tR & tF (10-90%) EIA-423A Mode
APPLICATIONS
Slew Rate Programming
to adjacent circuits in an interconnection. The recom-
mended output characteristics for cable length and data
rates can be found in EIA standard EIA-423A. Approxima-
tions of these standards are given by the following equa-
tions:
Slew rate for the UC5172 is set up by a single external re-
sistor connected between the SRA pin and ground. Slew
rate adjustments can be approximated by using the fol-
lowing formula:
Max. Data Rate = 300/t (For data rates 1k to 100k bit/s)
Max. Cable Length (feet) = 100 x t (Max. length 4000
feet)
20
RSRA
V/µs =
(RSRA in kΩ)
where t is the transition time from 10% to 90% of the out-
put swing in microseconds. For data rates below 1k bit/s,
t may be up to 300 microseconds.
The slew rate resistor can vary between 2k and 10kΩ
which allows slew rates between 10 to 2.2V/µs, respec-
tively. The relationship between slew rate and RSRA is
shown in the typical characteristics.
The UC5172 has been used in applications up to
460KBPS.
Waveshaping of the output lets the user control the level
of interference (near-end crosstalk) that may be coupled
3
UC5172
APPLICATIONS
Specific Layout Notes
Filter connectors or transzorbs should be used to reduce
the RFI/EMI, protecting the system from static (ESD), and
electrical overstress (EOS). A filter connector or capacitor
will reduce the ESD pulse by 90% typically. A cable
dragged across a carpet and connected to a system can
easily be charged to over 25,000 volts. This is a metal to
metal contact when the cable is connected to the system
(no resistance), currents exceed 80 amps with less than a
nanosecond rise time. A transzorb provides two functions,
the device capacitance inherently acts as a filter capaci-
tor, and the device clamps the ESD and EOS pulses
which would pass through the capacitor and destroy the
devices. The recommended transzorb for the UC5172 is
P6KEIOCA.
The UC5172 layout must have bulk bypassing close to
the device. Peak slew current is greater than 500mA
when all eight drivers slew at once in the same direction.
Some applications mount the UC5172 on a bulkhead or
isolated plane for RFI/FCC/VDE reasons. If bulk bypass-
ing is not used, the -10V supply may go above -8.5 volts,
causing the slew rate control circuit to become unstable.
The UC5172 can have output oscillation at 100kHz if the
+10V supply is applied before the -10V supply. This has
been a problem in some terminal designs where the +10V
was developed from the flyback, which can result in a
500ms difference in the application of the supplies at
power up.
General Layout Notes
The drivers and receivers should be mounted close to the
system common ground point, with the ground reference
tied to the common point to reduce RFI/EMI.
*Transzorb is a trademark of General Semiconductor
Industries.
UNITRODE INTEGRATED CIRCUITS
7 CONTINENTAL BLVD. • MERRIMACK, NH 03054
TEL. (603) 424-2410 • FAX 603) 424-3460
4
PACKAGE OPTION ADDENDUM
www.ti.com
2-Mar-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
PDIP
PLCC
Drawing
UC5172N
NRND
NRND
N
28
28
TBD
TBD
Call TI
Call TI
Call TI
Call TI
UC5172QTR
FN
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
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