UCC27201A-DIE [TI]
120V 升压、3A 峰值电流、高频、高侧/低侧驱动器;
| 型号： | UCC27201A-DIE |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 120V 升压、3A 峰值电流、高频、高侧/低侧驱动器 驱动 驱动器 |
| 文件： | 总6页 (文件大小：346K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
UCC27201A-DIE
www.ti.com.cn
ZHCSA66 –AUGUST 2012
高效、高侧/低侧驱动器
1
特性
•
驱动两个
高端/低端配置的 N 通道金属氧化物半导体场效应
晶体管 (MOSFET)
应用范围
•
•
•
•
•
•
•
针对电信、数据通信和商业市场的电源
半桥式应用和全桥式转换器
隔离式总线架构
•
•
•
•
最大引导电压
最大 VDD 电压
片载 RD 自举二极管
两开关正激式转换器
有源钳位正激式转换器
高压同步降压型转换器
D 类音频放大器
针对高侧和
低侧驱动器的欠压闭锁
说明
UCC27201A 是一款系列高频 N 通道 MOSFET 驱动器，此驱动器包括一个自举二极管和具有旨在实现最大的控制
灵活性具有独立输入的
高侧/低侧驱动器。 这可在半桥式、全桥式、两开关正激式和有源钳位正激式转换器中实现 N 通道 MOSFET 控
制。 低侧和高侧栅极驱动器是独立控制的，并在彼此的接通和关断之间实现了至 1ns 的匹配。 UCC27201A 基于
广泛使用的 UCC27201 驱动器，但进行了一些改进。 为了提升嘈杂电源环境中的性能，UCC27201A 运用了一种
增强型 ESD 输入结构，而且能够在其 HS 引脚上耐受 －18V （最大值） 的电压。
ORDERING INFORMATION(1)
PACKAGE
DESIGNATOR
PRODUCT
PACKAGE
ORDERABLE PART NUMBER
PACKAGE QUANTITY
UCC27201ATDA2
UCC27201ATDA3
10
UCC27201A
TD
Bare die in gel pack(2)
120
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2012, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
English Data Sheet: SLUSB70
UCC27201A-DIE
ZHCSA66 –AUGUST 2012
www.ti.com.cn
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
BARE DIE INFORMATION
BACKSIDE
POTENTIAL
BOND PAD
METALLIZATION COMPOSITION
BOND PAD
THICKNESS
DIE THICKNESS
BACKSIDE FINISH
10.5 mils.
Silicon with backgrind
GND
Al-Cu (0.5%)
598 nm
2
Copyright © 2012, Texas Instruments Incorporated
UCC27201A-DIE
www.ti.com.cn
ZHCSA66 –AUGUST 2012
Table 1. Bond Pad Coordinates in Microns(1)
DESCRIPTION
PAD NUMBER
X MIN
167.58
102.24
135
Y MIN
1863
X MAX
401.58
246.24
235.8
Y MAX
2007
VDD
HB
1
2
1175.94
629.82
62.82
1447.74
886.32
170.82
312.93
527.22
1346.67
1482.66
1619.46
2009.7
HO
HS
3
4
59.58
302.58
1281.6
1281.6
1300.5
1300.5
1300.5
1281.6
HI
5
1180.8
1180.8
1199.7
1199.7
1199.7
1077.3
212.13
426.42
1245.87
1381.86
1518.66
1908.9
LI
6
GND
GND
GND
LO
7
8
9
10
(1) Substrate GND.
Copyright © 2012, Texas Instruments Incorporated
3
PACKAGE OPTION ADDENDUM
www.ti.com
1-Sep-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
UCC27201ATDA2
UCC27201ATDA3
ACTIVE
ACTIVE
0
0
10
RoHS & Green
RoHS & Green
Call TI
N / A for Pkg Type
N / A for Pkg Type
0 to 0
0 to 0
Samples
Samples
120
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
1-Sep-2022
OTHER QUALIFIED VERSIONS OF UCC27201A-DIE :
Automotive : UCC27201A-Q1
•
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Addendum-Page 2
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