UCC28501N [TI]

BICMOS PFC/PWM COMBINATION CONTROLLER; 的BiCMOS PFC / PWM组合控制器
UCC28501N
型号: UCC28501N
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

BICMOS PFC/PWM COMBINATION CONTROLLER
的BiCMOS PFC / PWM组合控制器

稳压器 开关式稳压器或控制器 电源电路 开关式控制器 功率因数校正 光电二极管 信息通信管理
文件: 总31页 (文件大小:561K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢅ ꢆ ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢂ ꢆ ꢀꢁ ꢁꢂ ꢃꢄ ꢅꢈ  
ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢅ ꢆ ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢂ ꢆ ꢀꢁ ꢁꢈ ꢃꢄ ꢅꢈ  
SLUS419C − AUGUST 1999 − REVISED NOVEMBER 2001  
ꢔꢕ  
used to keep input power constant with varying input  
voltage. Generation of V is accomplished using I in  
conjunction with an external single-pole filter. This not  
only reduces external parts count, but also avoids the  
use of high-voltage components, offering a lower-cost  
solution. The multiplier then divides the line current by  
FEATURES  
FF  
AC  
D
D
Combines PFC and Downstream Converter  
Controls  
Controls Boost Preregulator to Near-Unity  
Power Factor  
the square of V  
.
D
D
D
D
D
Accurate Power Limiting  
FF  
Improved Feedforward Line Regulation  
The UCC2850x PFC section incorporates a low  
offset-voltage amplifier with 7.5-V reference,  
highly-linear multiplier capable of a wide current range,  
a high-bandwidth, low offset-current amplifier, with a  
a
Peak Current-Mode Control in Second Stage  
Programmable Oscillator  
Leading-Edge/Trailing-Edge Modulation for  
Reduced Output Ripple  
novel  
noise-attenuation  
configuration,  
PWM  
comparator and latch, and a high-current output driver.  
Additional PFC features include over-voltage  
protection, zero-power detection to turn off the output  
when VAOUT is below 0.33 V and peak current and  
power limiting.  
D
Low Start-up Supply Current  
D
Synchronized Second Stage Start-Up, with  
Programmable Soft-start  
D
Programmable Second Stage Shutdown  
The dc-to-dc section relies on an error signal generated  
on the secondary-side and processes it by performing  
peak current mode control. The dc-to-dc section also  
features current limiting, a controlled soft-start, preset  
operating range with selectable options, and 50%  
maximum duty cycle.  
DESCRIPTION  
The UCC2850x family provides all of the control  
functions necessary for an active power-factor-  
corrected preregulator and a second-stage dc-to- dc  
converter. The controller achieves near-unity power  
factor by shaping the ac input line current waveform to  
correspond to the ac input-line voltage using average  
current-mode control. The dc-to-dc converter uses  
peak current-mode control to perform the step-down  
power conversion.  
The UCC28500 and UCC28502 have a wide UVLO  
threshold (16.5 V/10 V) for bootstrap bias supply  
operation. The UCC28501 and UCC28503 are  
designed with a narrow UVLO range (10.5 V/10 V) more  
suitable for fixed bias operation. The UCC28500 and  
UCC28501 have a narrow UVLO threshold for PWM  
stage (to allow operation down to 75% of nominal bulk  
voltage), while the UCC28502 and UCC38503 are  
configured for a much wider operation range for the  
PWM stage (down to 50% of bulk nominal voltage).  
The PFC stage is leading-edge modulated while the  
second stage is trailing-edge synchronized to allow for  
minimum overlap between the boost and PWM  
switches. This reduces ripple current in the bulk-output  
capacitor.In order to operate with over three-to-one  
Available in 20-pin N and DW packages.  
range of input-line voltages, a line feedforward (V ) is  
FF  
ꢕꢤ  
Copyright 2001, Texas Instruments Incorporated  
ꢠ ꢤ ꢡ ꢠꢊ ꢚꢮ ꢜꢛ ꢟ ꢧꢧ ꢥꢟ ꢝ ꢟ ꢞ ꢤ ꢠ ꢤ ꢝ ꢡ ꢩ  
1
www.ti.com  
ꢀ ꢁꢁꢂ ꢃ ꢄ ꢅ ꢅꢆ ꢀ ꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢇꢆ ꢀꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢂꢆ ꢀꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢈ  
ꢀ ꢁꢁꢈ ꢃ ꢄ ꢅ ꢅꢆ ꢀ ꢁꢁ ꢈ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁ ꢁꢈ ꢃ ꢄ ꢅ ꢂꢆ ꢀꢁ ꢁꢈ ꢃ ꢄ ꢅ ꢈ  
SLUS419C − AUGUST 1999 − REVISED NOVEMBER 2001  
}  
absolute maximum ratings over operating free-air temperature (unless otherwise noted)  
Supply Voltage VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 V  
Gate Drive Current  
Continuous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.2 A  
Pulsed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 A  
Input Voltage  
ISENSE1, ISENSE2, MOUT, VSENSE, OVP/ENBL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 V  
CAI, MOUT, CT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 V  
PKLMT, VERR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 V  
Input Current  
RSET, RT, IAC, PKLMT, ENA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 mA  
VCC (no switching) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA  
Maximum Negative Voltage GT1, GT2, PKLMT, MOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V  
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 W  
Storage temperature T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C  
stg  
Junction temperature T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 125°C  
J
Lead temperature (soldering, 10 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied.  
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
Currents are positive into, negative out of the specified terminal. Consult Packaging Section of Databook for thermal limitations and  
considerations of packages. All voltages are referenced to GND.  
AVAILABLE OPTIONS  
PFC THRESHOLD  
PACKAGED DEVICES  
UVLO2  
HYSTERESIS  
(V)  
T
J
UVLO TURN−ON  
THRESHOLD (V)  
PLASTIC DIP SMALL OUTLINE  
(N)  
(DW)  
16  
10.5  
16  
1.2  
1.2  
3.0  
3.0  
1.2  
1.2  
3.0  
3.0  
UCC28500N  
UCC28501N  
UCC28502N  
UCC28503N  
UCC38500N  
UCC38501N  
UCC38502N  
UCC38503N  
UCC28500DW  
UCC28501DW  
UCC28502DW  
UCC28503DW  
UCC38500DW  
UCC38501DW  
UCC38502DW  
UCC38503DW  
–40°C to 85°C  
0°C to 70°C  
10.5  
16  
10.5  
16  
10.5  
The DW package is available taped and reeled. Add TR suffix to device type (e.g. UCC38500DWTR)  
to order quantities of 2000 devices per reel.  
N PACKAGE  
DW PACKAGE  
(TOP VIEW)  
(TOP VIEW)  
VAOUT  
RT  
1
2
3
4
5
6
7
8
9
10  
20 VREF  
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
VAOUT  
RT  
VSENSE  
OVP/ENBL  
CT  
VREF  
VFF  
IAC  
MOUT  
ISENSE1  
CAOUT  
PKLMT  
SS2  
19  
18  
17  
16  
15  
14  
13  
12  
11  
VFF  
VSENSE  
OVP/ENBL  
CT  
IAC  
MOUT  
ISENSE1  
CAOUT  
PKLMT  
SS2  
GND  
GND  
VERR  
ISENSE2  
VCC  
VERR  
ISENSE2  
VCC  
GT1  
PWRGND  
GT1  
GT2  
GT2  
PWRGND  
2
www.ti.com  
ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢅ ꢆ ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢂ ꢆ ꢀꢁ ꢁꢂ ꢃꢄ ꢅꢈ  
ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢅ ꢆ ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢂ ꢆ ꢀꢁ ꢁꢈ ꢃꢄ ꢅꢈ  
SLUS419C − AUGUST 1999 − REVISED NOVEMBER 2001  
electrical characteristics T = 0°C to 70°C for the UCC3850X, –40°C to 85°C for the UCC2850X,  
A
T = T , VCC = 12 V, RT = 22 k, CT = 330 pF (unless otherwise noted)  
A
J
supply current  
PARAMETER  
TEST CONDITIONS  
VCC turn-on threshold –300 mV  
VCC = 12 V (no load on GT1 or GT2)  
MIN  
TYP  
150  
MAX  
300  
UNITS  
µA  
Supply current, off  
Supply current, on  
4
6
mA  
undervoltage lockout  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
VCC turn-on threshold (UCCx8500/502)  
UVLO hysteresis (UCCx8500/502)  
Shunt voltage (UCCx8500/502)  
VCC turn-on threshold (UCCx8501/503)  
VCC turn-off threshold  
15.4  
16  
6.3  
16.6  
V
V
V
V
V
V
5.8  
15.4  
9.7  
I
= 10 mA  
16.2  
10.2  
9.7  
17.0  
10.8  
VCC  
9.4  
UVLO hysteresis (UCCx8501/503)  
0.3  
0.5  
voltage amplifier  
PARAMETER  
TEST CONDITIONS  
0°C T 70°C  
MIN  
TYP  
MAX  
UNITS  
7.387  
7.35  
7.500  
7.50  
50  
7.613  
7.65  
200  
V
V
A
Input voltage  
–40°C T 85°C  
A
V
bias current  
nA  
dB  
V
SENSE  
Open loop gain  
VAOUT = 2 V to 5 V  
50  
5.3  
90  
High-level output voltage  
Low-level output voltage  
I
I
= –150 µA  
= 150 µA  
5.5  
5.6  
LOAD  
0.00  
0.05  
0.15  
V
LOAD  
PFC overvoltage protection and enable  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
VREF  
VREF  
VREF  
Over voltage reference  
V
+ 0.480 + 0.500 + 0.520  
Hysteresis  
300  
1.7  
0.1  
500  
1.9  
0.2  
600  
2.1  
0.3  
mV  
V
Enable threshold  
Enable hysteresis  
V
current amplifier  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
mV  
nA  
Input offset voltage  
V
= 0 V,  
V
V
V
V
= 3 V  
–6  
0
−50  
25  
6
−100  
100  
CM  
CAOUT  
CAOUT  
CAOUT  
CAOUT  
CAOUT  
Input bias current  
V
V
V
V
= 0 V,  
= 0 V,  
= 0 V,  
= 3 V  
CM  
Input offset current  
= 3 V  
nA  
CM  
Open loop gain  
= 2 V to 5 V  
= 3 V  
90  
90  
dB  
CM  
Common−mode rejection ratio  
High-level output voltage  
Low-level output voltage  
Gain bandwidth product  
= 0 V to 1.5 V, V  
dB  
CM  
I
I
= –120 µA  
5.6  
0.1  
7.0  
0.2  
2.5  
7.5  
0.5  
V
LOAD  
= 1 mA  
V
LOAD  
See Note 1  
MHz  
NOTES: 1. Ensured by design. Not production tested.  
2. See Figure 6 for reference variation.  
3. See Figure 5 for reference variation for VCC < 10.8 V.  
3
www.ti.com  
ꢀ ꢁꢁꢂ ꢃ ꢄ ꢅ ꢅꢆ ꢀ ꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢇꢆ ꢀꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢂꢆ ꢀꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢈ  
ꢀ ꢁꢁꢈ ꢃ ꢄ ꢅ ꢅꢆ ꢀ ꢁꢁ ꢈ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁ ꢁꢈ ꢃ ꢄ ꢅ ꢂꢆ ꢀꢁ ꢁꢈ ꢃ ꢄ ꢅ ꢈ  
SLUS419C − AUGUST 1999 − REVISED NOVEMBER 2001  
electrical characteristics T = 0°C to 70°C for the UCC3850X, –40°C to 85°C for the UCC2850X,  
A
T = T , VCC = 12 V, RT = 22 k, CT = 330 pF (unless otherwise noted)  
A
J
voltage reference  
PARAMETER  
TEST CONDITIONS  
= 0°C to 70°C  
MIN  
7.387  
7.35  
0
TYP  
7.500  
7.50  
MAX  
7.613  
7.65  
10  
UNITS  
V
T
A
Input voltage  
T
A
= –40°C to 85°C  
V
Load regulation  
Line regulation  
I
= −1 mA to −2 mA,  
See Note 2  
See Note 3  
mV  
mV  
mA  
REF  
VCC = 10.8 V to 15 V,  
VREF = 0V  
0
10  
Short circuit current  
−20  
–25  
−50  
oscillator  
PARAMETER  
TEST CONDITIONS  
MIN  
85  
TYP  
MAX  
115  
1%  
UNITS  
Frequency, initial accuracy  
Frequency, voltage stability  
Frequency, total variation  
Ramp peak voltage  
T
A
= 25°C  
100  
kHz  
VCC = 10.8 V to 15 V  
Line, Temp  
−1%  
80  
120  
5.5  
kHz  
V
4.5  
3.5  
5
4
Ramp amplitude voltage (peak to peak)  
4.5  
V
peak current limit  
PARAMETER  
TEST CONDITIONS  
MIN  
–15  
150  
TYP  
0
MAX  
15  
UNITS  
mV  
PKLMT reference voltage  
PKLMT propagation delay  
300  
500  
ns  
multiplier  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
I
= 500 µA, VFF = 4.7 V, VAOUT = 1.25 V,  
AC  
I
I
, high-line low-power output current  
, high-line low-power output current  
0
0
–6  
–6  
−20  
−23  
MOUT  
0°C T 85°C  
A
I
= 500 µA, VFF = 4.7 V, VAOUT = 1.25 V,  
AC  
–40°C T 85°C  
MOUT  
A
µA  
I
I
I
I
, high-line high-power output current  
, low-line low-power output current  
, low-line high-power output current  
, IAC-limited output current  
I
I
I
I
I
I
I
I
= 500 µA, VFF = 4.7 V, VAOUT = 5 V  
= 150 µA, VFF = 1.4 V, VAOUT = 1.25 V  
= 150 µA, VFF = 1.4 V, VAOUT = 5 V  
= 150 µA, VFF = 1.3 V, VAOUT = 5 V  
= 300 µA, VFF = 2.8 V, VAOUT = 2.5 V  
= 150 µA, VFF = 1.4 V, VAOUT = 0.25 V  
= 500 µA, VFF = 4.7 V, VAOUT = 0.25 V  
= 500 µA, VFF = 4.7 V, VAOUT = 0.5 V,  
−70  
−10  
–90  
–19  
–300  
–300  
1
−105  
−50  
−345  
−400  
1.5  
MOUT  
MOUT  
MOUT  
MOUT  
AC  
AC  
AC  
AC  
AC  
AC  
AC  
AC  
−268  
−250  
0.5  
Gain constant (K)  
1/V  
µA  
µA  
0
–2  
0
–2  
I
, zero current  
0
–3  
MOUT  
0°C T 85°C  
A
I
= 500 µA, VFF = 4.7 V, VAOUT = 0.5 V,  
AC  
−40°C T 85°C  
0
–3.5  
µA  
A
Power limit (I  
MOUT  
× V )  
FF  
I
= 150 µA, VFF = 1.4 V, VAOUT = 5 V  
−375  
–420  
−485  
µW  
AC  
zero power  
PARAMETER  
Zero power comparator threshold  
TEST CONDITIONS  
MIN  
0.175  
TYP  
0.330  
MAX  
0.500  
UNITS  
Measured on VAOUT  
V
NOTES: 1. Ensured by design. Not production tested.  
2. See Figure 6 for reference variation.  
3. See Figure 5 for reference variation for VCC < 10.8 V .  
4
www.ti.com  
ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢅ ꢆ ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢂ ꢆ ꢀꢁ ꢁꢂ ꢃꢄ ꢅꢈ  
ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢅ ꢆ ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢂ ꢆ ꢀꢁ ꢁꢈ ꢃꢄ ꢅꢈ  
SLUS419C − AUGUST 1999 − REVISED NOVEMBER 2001  
electrical characteristics T = 0°C to 70°C for the UCC3850X, –40°C to 85°C for the UCC2850X,  
A
T = T , VCC = 12 V, RT = 22 k, CT = 330 pF (unless otherwise noted)  
A
J
PFC gate driver  
PARAMETER  
TEST CONDITIONS  
from −100 mA to –200 mA  
= 100 mA  
MIN  
TYP  
MAX  
12  
UNITS  
GT1 pull up resistance  
I
I
5
2
OUT  
GT1 pull down resistance  
10  
OUT  
C
= 1 nF,  
R
= 10 Ω  
= 10 Ω  
LOAD  
from 0.7 V to 9.0 V  
LOAD  
GT1 output rise time  
GT1 output fall time  
25  
50  
ns  
ns  
V
GT1  
C
= 1 nF,  
LOAD  
from 9.0 V to 0.7 V  
R
LOAD  
10  
50  
V
GT1  
Maximum duty cycle  
93%  
95%  
100%  
2%  
Minimum controlled duty cycle  
f = 100 kHZ  
second stage undervoltage lockout (UVLO2)  
PARAMETER  
TEST CONDITIONS  
MIN  
6.30  
TYP  
MAX  
7.30  
1.44  
7.30  
3.6  
UNITS  
PWM turn-on reference (UCCx8500/501)  
Hysteresis (UCCx8500/501)  
6.75  
1.20  
6.75  
3
V
V
V
V
0.96  
6.30  
2.4  
PWM turn−on reference (UCCx8502/503)  
Hysteresis (UCCx8502/503)  
second stage soft-start  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
–10  
MAX  
–12.5  
300  
UNITS  
µA  
SS2 charge current  
–7.3  
Input voltage (VERR)  
SS2 discharge current  
I
= 2 mA,UVLO = Low  
mV  
VERR  
ENBL = High, UVLO = Low, SS2 = 2.5 V  
3
10  
mA  
second stage duty cycle clamp  
PARAMETER  
TEST CONDITIONS  
MIN  
44%  
TYP  
MAX  
UNITS  
Maximum duty cycle  
50%  
second stage pulse-by-pulse current sense  
PARAMETER  
TEST CONDITIONS  
MIN  
0.94  
TYP  
1.05  
MAX  
UNITS  
Current sense comparator threshold  
VERR = 2.5 V measured on ISENSE2  
1.15  
V
second stage overcurrent limit  
PARAMETER  
TEST CONDITIONS  
MIN  
1.15  
TYP  
1.30  
50  
MAX  
UNITS  
V
Peak current comparator threshold  
Input bias current  
1.45  
nA  
second stage gate driver  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
12  
UNITS  
GT2 pull up resistance  
GT2 pull down resistance  
GT2 output rise time  
I
I
from −100 mA to –200 mA  
= 100 mA  
5
3
OUT  
10  
OUT  
C
V
= 1 nF,R  
= 10 Ω  
LOAD  
25  
50  
ns  
LOAD  
from 0.7 V to 9.0 V  
GT2  
GT2 output fall time  
C
= 1 nF,R  
= 10 Ω  
LOAD  
25  
50  
ns  
LOAD  
from 9.0 V to 0.7 V  
V
GT2  
NOTES: 1. Ensured by design. Not production tested.  
2. See Figure 6 for reference variation.  
3. See Figure 5 for reference variation for VCC < 10.8 V .  
5
www.ti.com  
ꢀ ꢁꢁꢂ ꢃ ꢄ ꢅ ꢅꢆ ꢀ ꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢇꢆ ꢀꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢂꢆ ꢀꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢈ  
ꢀ ꢁꢁꢈ ꢃ ꢄ ꢅ ꢅꢆ ꢀ ꢁꢁ ꢈ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁ ꢁꢈ ꢃ ꢄ ꢅ ꢂꢆ ꢀꢁ ꢁꢈ ꢃ ꢄ ꢅ ꢈ  
SLUS419C − AUGUST 1999 − REVISED NOVEMBER 2001  
pin assignments  
CAOUT: (current amplifier output) This is the output of a wide bandwidth operational amplifier that senses line  
current and commands the PFC pulse width modulator (PWM) to force the correct duty cycle. This output can  
swing close to GND, allowing the PWM to force zero duty cycle when necessary.  
CT: (oscillator timing capacitor) A capacitor from CT to GND sets the oscillator frequency according to:  
0.725  
f +  
ǒ
TǓ  
R   C  
T
GND: (ground) All voltages measured with respect to ground. VCC and VREF should be bypassed directly to  
GND with a 0.1-µF or larger ceramic capacitor. The timing capacitor discharge current also returns to this pin,  
so the lead from the oscillator timing capacitor to GND should be as short and direct as possible.  
GT1: (gate drive) The output drive for the PFC stage is a totem pole MOSFET gate driver on GT1. Use a series  
gate resistor of at least 10.5 to prevent interaction between the gate impedance and the GT1 output driver  
that might cause the GT1 to overshoot excessively. Some overshoot of the GT1 output is always expected when  
driving a capacitive load. Refer to Figure 4 for gate drive resistor selections.  
GT2: (gate drive) Same as output GT1 for the second stage output drive. Limited to 50% maximum duty cycle.  
IAC: (input ac current) This input to the analog multiplier is a current. The multiplier is tailored for very low  
distortion from this current input (I ) to MOUT, so this is the only multiplier input which should be used for  
AC  
sensing instantaneous line voltage. Recommended maximum I  
is 500 µA.  
AC  
ISENSE1: (current sense) This is the non-inverting input to the current amplifier. This input and the inverting  
input MOUT remain functional down to and below GND.  
ISENSE2: (current sense) A resistor from the source of the lower FET to ground generates the input signal for  
the peak limit control of the second stage. The oscillator ramp can also be summed into this pin, for slope  
compensation.  
MOUT: (multiplier output and current sense amplifier inverting input) The output of the analog multiplier and the  
inverting input of the current amplifier are connected together at MOUT. As the multiplier output is a current, this  
is a high impedance input so the amplifier can be configured as a differential amplifier to reject ground noise.  
Multiplier output current is given by:  
ǒVVAOUT * 1.0Ǔ  I  
IAC  
I
+
MOUT  
K   ǒVVFFǓ2  
Connect current loop compensation components between MOUT and CAOUT.  
OVP/ENBL:(over-voltage/enable) A window comparator input which disables the PFC output driver if the boost  
output is 6.67% above nominal or disables both the PFC and second stage output drivers and reset SS2 if pulled  
below 1.9 V. This input is also used to determine the active range of the second stage PWM.  
PKLMT: (PFC peak current limit) The threshold for peak limit is 0 V. Use a resistor divider from the negative side  
of the current sense resistor to VREF to level-shift this signal to a voltage corresponding to the desired  
overcurrent threshold across the current sense resistor.  
PWRGND: Ground for totem pole output drivers.  
RT: (oscillator charging current) A resistor from RT to GND is used to program oscillator charging current. A  
resistor between 10 kand 100 kis recommended. Nominal voltage on this pin is 3 V.  
6
www.ti.com  
ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢅ ꢆ ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢂ ꢆ ꢀꢁ ꢁꢂ ꢃꢄ ꢅꢈ  
ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢅ ꢆ ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢂ ꢆ ꢀꢁ ꢁꢈ ꢃꢄ ꢅꢈ  
SLUS419C − AUGUST 1999 − REVISED NOVEMBER 2001  
pin assignments (continued)  
SS2: (soft-start for PWM) SS2 is at ground for either enable low or OVP/ENBL below the UVLO2 threshold  
conditions. When enabled, SS2 charges an external capacitor with a current source. This voltage is used as  
the voltage error signal during start-up, enabling the PWM duty cycle to increase slowly. In the event of a disable  
command or a UVLO2 dropout, SS2 quickly discharges to disable the PWM.  
VAOUT: (voltage amplifier output) This is the output of the operational amplifier that regulates output voltage.  
The voltage amplifier output is internally limited to approximately 5.5 V to prevent overshoot.  
VCC: (positive supply voltage) Connect to a stable source of at least 20 mA between 12 V and 17 V for normal  
operation. Bypass VCC directly to GND to absorb supply current spikes required to charge external MOSFET  
gate capacitances. To prevent inadequate gate drive signals, the output devices are inhibited unless VCC  
exceeds the upper under-voltage lockout threshold and remains above the lower threshold.  
VERR: (voltage amp error signal for the second stage) The error signal is generated by an external amplifier  
which drives this pin. This pin has an internal 4.5-V voltage clamp that limits GT2 to less than 50% duty cycle  
to ensure transformer reset in the typical application.  
VFF: (RMS feed forward signal) VFF signal is generated at this pin by mirroring one-half of I into a single pole  
AC  
external filter. At low line, the VFF voltage should be 1.4 V.  
VSENSE: (voltage amplifier inverting input) This is normally connected to a compensation network and to the  
boost converter output through a divider network.  
VREF: (voltage reference output) VREF is the output of an accurate 7.5-V voltage reference. This output is  
capable of delivering 10 mA to peripheral circuitry and is internally short-circuit current limited. VREF is disabled  
and remains at 0 V when VCC is below the UVLO threshold. Bypass VREF to GND with a 0.1-µF or larger  
ceramic capacitor for best stability.  
7
www.ti.com  
ꢀ ꢁꢁꢈ ꢃ ꢄ ꢅ ꢅꢆ ꢀ ꢁꢁ ꢈ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁ ꢁꢈ ꢃ ꢄ ꢅ ꢂꢆ ꢀꢁ ꢁꢈ ꢃ ꢄ ꢅ  
SLUS419C − AUGUST 1999 − REVISED NOVEMBER 2001  
block diagram  
ISENSE2  
8
SS2  
13  
VCC  
9
GND  
6
VERR  
7
7.5 V  
REFERENCE  
SECOND STAGE  
SOFT START  
20 VREF  
6.75 V  
UVLO2  
UVLO  
16 V/10 V  
10.5 V/10 V  
VCC  
OVP/ENBL  
4
+
1.9 V  
ENABLE  
ILIMIT  
+
10  
GT2  
R
R
4.5 V  
1.3 V  
+
1.5 V  
Q
S
PWM  
+
CLK2  
PWM 2ND STAGE  
SECTION  
PWM 2ND STAGE  
SECTION  
PFC SECTION  
8.0 V  
PFCOVP  
+
PFC SECTION  
VCC  
ZERO  
POWER  
VAOUT  
1
3
VOLTAGE  
ERROR AMP  
0.33 V  
Q
PWM  
+
OSC  
CLK1  
CLK2  
S
+
PWM  
LATCH  
CURRENT  
AMP  
12 GT1  
VSENSE  
X
÷
X
MULT  
+
R
R
+
7.5 V  
11 PWRGND  
14 PKLMT  
2
VFF 19  
CLK1  
(VFF  
)
CLK2  
ILIMIT  
OSCILLATOR  
MIRROR  
2:1  
+
IAC 18  
17  
16  
15  
2
5
UDG−98189  
MOUT ISENSE1 CAOUT  
RT  
CT  
8
www.ti.com  
ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢅ ꢆ ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢂ ꢆ ꢀꢁ ꢁꢂ ꢃꢄ ꢅꢈ  
ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢅ ꢆ ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢂ ꢆ ꢀꢁ ꢁꢈ ꢃꢄ ꢅꢈ  
SLUS419C − AUGUST 1999 − REVISED NOVEMBER 2001  
TYPICAL CHARACTERISTICS  
MULTIPLIER OUTPUT CURRENT  
MULTIPLIER GAIN  
vs.  
vs.  
VOLTAGE ERROR AMPLIFIER OUTPUT  
VOLTAGE ERROR AMPLIFIER OUTPUT  
1.5  
1.3  
1.1  
350  
300  
250  
IAC = 150  
A
µ
IAC = 150  
A
µ
200  
150  
IAC = 300  
A
µ
0.9  
0.7  
0.5  
IAC = 300  
A
µ
IAC = 500  
A
µ
100  
50  
0
A
µ
IAC = 500  
4
1
2
3
4
5
0
1
2
3
5
VAOUT − Voltage Error Amplifier Output − V  
VAOUT − Voltage Error Amplifier Output − V  
Figure 1  
Figure 2  
RECOMMENDED MINIMUM GATE RESISTANCE  
vs.  
MULTIPLIER CONSTANT POWER PERFORMANCE  
500  
SUPPLY VOLTAGE  
17  
16  
15  
14  
13  
12  
11  
10  
9
400  
VAOUT = 5 V  
300  
VAOUT = 4 V  
200  
VAOUT = 3 V  
100  
VAOUT = 2 V  
8
0
0
1
2
3
4
5
10  
12  
14  
16  
18  
20  
VCC − Supply Voltage − V  
VFF − Feedforward Voltage − V  
Figure 3  
Figure 4  
9
www.ti.com  
ꢀ ꢁꢁꢂ ꢃ ꢄ ꢅ ꢅꢆ ꢀ ꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢇꢆ ꢀꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢂꢆ ꢀꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢈ  
ꢀ ꢁꢁꢈ ꢃ ꢄ ꢅ ꢅꢆ ꢀ ꢁꢁ ꢈ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁ ꢁꢈ ꢃ ꢄ ꢅ ꢂꢆ ꢀꢁ ꢁꢈ ꢃ ꢄ ꢅ ꢈ  
SLUS419C − AUGUST 1999 − REVISED NOVEMBER 2001  
REFERENCE VOLTAGE  
vs.  
REFERENCE CURRENT  
REFERENCE VOLTAGE  
vs.  
SUPPLY VOLTAGE  
7.60  
7.55  
7.50  
7.45  
7.40  
7.510  
7.505  
7.500  
7.495  
7.490  
0
5
I
10  
15  
20  
25  
9
10  
11  
12  
13  
14  
− Reference Current − mA  
VCC − Supply Voltage − V  
VREF  
Figure 5  
Figure 6  
10  
www.ti.com  
ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢅ ꢆ ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢂ ꢆ ꢀꢁ ꢁꢂ ꢃꢄ ꢅꢈ  
ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢅ ꢆ ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢂ ꢆ ꢀꢁ ꢁꢈ ꢃꢄ ꢅꢈ  
SLUS419C − AUGUST 1999 − REVISED NOVEMBER 2001  
TYPICAL APPLICATION  
The UCC38500 series is designed to incorporate all the control functions required for a power factor correction  
circuit and a second stage dc-to-dc converter. The PFC function is implemented as a full-feature,  
average-current-mode controller integrated circuit. In addition, the input voltage feedforward function is  
implemented in a simplified manner. Current from IAC input is mirrored over to the VFF pin. By simply adding  
a resistor and capacitor (to attenuate 120-Hz ripple) a voltage is developed which is proportional to RMS line  
voltage, eliminating the need for several components normally connected to the line.  
The UCC3850x uses leading-edge modulation for the PFC stage and trailing-edge modulation for the dc-to-dc  
stage. This reduces ripple current in the output capacitor by reducing the overlap in conduction time of the PFC  
and dc-to-dc switches. Figures 7 and 8 depict the ripple current reduction in the boost switch. In addition to the  
reduced ripple current, noise immunity is improved through the current error amplifier implementation. Please  
refer to the UCC3817 datasheet (TI Literature No. SLUS395) for a detailed explanation of current error amplifier  
implementation.  
UDG−97130−1  
Figure 7. Simplified Representation of a 2−Stage PFC Power Supply  
i
CBST  
i
= i − i  
CBST D1 Q2  
Figure 8. Timing Waveforms for Synchronization Scheme  
11  
www.ti.com  
ꢀ ꢁꢁꢂ ꢃ ꢄ ꢅ ꢅꢆ ꢀ ꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢇꢆ ꢀꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢂꢆ ꢀꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢈ  
ꢀ ꢁꢁꢈ ꢃ ꢄ ꢅ ꢅꢆ ꢀ ꢁꢁ ꢈ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁ ꢁꢈ ꢃ ꢄ ꢅ ꢂꢆ ꢀꢁ ꢁꢈ ꢃ ꢄ ꢅ ꢈ  
SLUS419C − AUGUST 1999 − REVISED NOVEMBER 2001  
TYPICAL APPLICATION  
The UCC3850x is optimized to control a boost PFC stage operating in continuous conduction mode, followed  
by a dc-to-dc converter (typically a forward topology). The dc-to-dc converter is transformer isolated and  
therefore its error amplifier is located on the secondary side. For this reason the UCC3850x is configured without  
an internal error amplifier for the second power stage. The externally generated error signal is fed into the VERR  
pin typically through an opto coupler.  
The UCC3850x can be configured for voltage-mode control or current-mode control of the second stage. The  
application figure shows a typical current-mode configuration. For voltage-mode control, the ramp generated  
by CT can be fed back into the ISENSE2 pin through a voltage divider.  
One of the main system challenges in designing systems with a PFC front end is coordinating the turn-on and  
turn-off on the dc-to-dc converter. If the dc-to-dc converter is allowed to turn on before the boost converter is  
operational, it must operate at a much-reduced voltage and therefore represents a large current draw to the  
boost converter. This start-up sequencing is handled internally by the UCC3850x. The UCC3850x monitors the  
output voltage of the PFC converter and holds the dc-to-dc converter off until the output is within 10% of its  
regulation point. Once the trip point is reached the dc-to-dc section goes through a soft start sequence for a  
controlled, low stress start-up. Similarly, if the output voltage drops too low (two voltage options are available)  
the dc-to-dc converter shuts down thereby preventing overstress of the converter. For the UCC38500 and  
UCC38501, the dc-to-dc converter shuts down when the PFC output falls below 74% of its nominal value, while  
for the UCC38502 and UCC38503, the threshold is lowered to 50%.  
design example: an off-line, 100-W, power converter  
The following design example shows how to implement the UCC38500 in an off-line 100-W power converter.  
The system requires the converter to operate from a universal input of 85 V  
to 265 V  
with a 12-V, 100-W,  
RMS  
RMS  
dc output. This design example is divided into two parts. The first part is the PFC stage design and the second  
section is the dc-to-dc power stage design. The design goal of the system is to achieve an efficiency of  
approximately 80%. This is accomplished by requiring the boost regulator to be designed for an efficiency of  
95% and the dc-to-dc power stage to be designed for 85% efficiency. The efficiency of the boost converter is  
designated by variable η1 and the efficiency of the dc-to-dc converter is designated by variable η2. Figure 9  
shows the schematic of the typical application upon which this design example is based. The UCC38500 control  
device is chosen for this design because of it’s self-biasing scheme and minimum input voltage requirements  
of the dc-to-dc power stage.  
12  
www.ti.com  
ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢅ ꢆ ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢂ ꢆ ꢀꢁ ꢁꢂ ꢃꢄ ꢅꢈ  
ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢅ ꢆ ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢂ ꢆ ꢀꢁ ꢁꢈ ꢃꢄ ꢅꢈ  
SLUS419C − AUGUST 1999 − REVISED NOVEMBER 2001  
UDG−99138  
Figure 9. Typical Application Circuit  
13  
www.ti.com  
ꢀ ꢁꢁꢂ ꢃ ꢄ ꢅ ꢅꢆ ꢀ ꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢇꢆ ꢀꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢂꢆ ꢀꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢈ  
ꢀ ꢁꢁꢈ ꢃ ꢄ ꢅ ꢅꢆ ꢀ ꢁꢁ ꢈ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁ ꢁꢈ ꢃ ꢄ ꢅ ꢂꢆ ꢀꢁ ꢁꢈ ꢃ ꢄ ꢅ ꢈ  
SLUS419C − AUGUST 1999 − REVISED NOVEMBER 2001  
TYPICAL APPLICATION  
I. PFC Boost Power Stage  
LBOOST (L1 in Figure 9)  
The boost inductor value is determined by the following equations:  
Ǹ
ǒ
Ǔ
P
  0.25   2  
OUT  
h1 h2  
DI +  
,
V
IN (min)  
(1)  
(2)  
(3)  
Ǹ
V
  2  
IN (min)  
D + 1 *  
,
V
BOOST  
Ǹ
V
  2   D  
IN (min)  
L
+
BOOST  
D I   f  
S
where I, the inductor current ripple was set to approximately 25% of the peak inductor current.  
In this design example I is approximately 505 mA. Drepresents the duty cycle at the peak of low line voltage,  
V
V
is the minimum RMS input voltage, and V  
for this design is selected to be 385 V to ensure the PFC stage regulates for the full input voltage range.  
is the controlled output voltage of the PFC stage.  
IN(min)  
BOOST  
BOOST  
Variable f represent the switching frequency. The switching frequency was selected to be 100 kHz for this  
design. The calculated boost inductor required for this design is approximately 1.7 mH.  
S
CBOOST (C2 in Figure 9)  
Two main criteria, the capacitance and the voltage rating, dictate the selection of the output capacitor. The value  
of capacitance is determined by the holdup time required for supporting the load after the input ac voltage is  
removed. Holdup is the amount of time that the output stays in regulation after the input has been removed. For  
this circuit, the desired holdup time is approximately 16 ms. Expressing the capacitor value in terms of output  
power, output voltage, and holdup time is described in equation (4):  
2   P  
  D t  
OUT  
+ ǒVBOOSTǓ  
C
BOOST  
2
2
ǒ
BOOST (min)Ǔ  
* V  
(4)  
In practice, the calculated minimum capacitor value may be inadequate because output ripple voltage  
specifications limit the amount of allowable output capacitor ESR. Attaining a sufficiently low value of ESR often  
necessitates the use of a much larger capacitor value than calculated. The amount of output capacitor ESR  
allowed is determined by dividing the maximum specified output ripple voltage by the capacitor ripple current.  
In this design, holdup time is the dominant determining factor and a 100 µF, 450 V aluminum electrolytic  
capacitor from Panasonic, part number ECOS2TB101BA, is used. The voltage rating and the low ESR of  
0.663 make it an ideal choice for this design.  
14  
www.ti.com  
ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢅ ꢆ ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢂ ꢆ ꢀꢁ ꢁꢂ ꢃꢄ ꢅꢈ  
ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢅ ꢆ ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢂ ꢆ ꢀꢁ ꢁꢈ ꢃꢄ ꢅꢈ  
SLUS419C − AUGUST 1999 − REVISED NOVEMBER 2001  
TYPICAL APPLICATION  
power switch selection (Q3 in Figure 9)  
As in any power supply design, tradeoffs between performance, cost and size are necessary. When selecting  
a power switch, it is useful to calculate the total power dissipation in the switch for several different devices at  
the switching frequencies being considered for the converter. Total power dissipation in the switch is the sum  
of switching loss and conduction loss. Switching losses are the combination of the gate charge loss, drain  
source capacitance of the MOSFET loss and turnon and turnoff losses:  
P
P
P
+ Q  
  V  
  f  
GATE  
COSS  
SW  
GATE  
GATE  
S
(5)  
OSS ǒVOFFǓ2  
C
1
2
+
  f  
S
(6)  
(7)  
1
2
  I   ǒt  
Ǔ
  f  
+
V
) t  
OFF  
L
ON  
OFF  
S
Where Q  
is the total gate charge, V  
is the gate drive voltage, f is the switching frequency, C  
OSS  
is  
GATE  
GATE  
s
the drain source capacitance of the MOSFET, t  
parameters R  
and t  
are the switching times (estimated using device  
ON  
OFF  
, Q  
and V ) and V  
is the voltage across the switch during the off time, in this case V  
GATE GD  
TH  
OFF OFF  
= V  
.
BOOST  
Conduction loss is calculated as the product of the R  
and the square of RMS current:  
of the switch (at the worst case junction temperature)  
(8)  
DS(on)  
  K   ǒIRMSǓ2  
P
+ R  
DS(on)  
COND  
where K is the temperature factor found in the manufacturer’s R  
vs junction temperature curves.  
DS(on)  
Calculating these losses and plotting against frequency gives a curve that enables the designer to determine  
either which manufacturer’s device has the best performance at the desired switching frequency, or which  
switching frequency has the least total loss for a particular power switch. For this design example an IRFP450  
HEXFET from International Rectifier is chosen because of its low R  
and its V  
rating. The IRFP450’s  
DS(on)  
DSS  
R
of 400 mand the maximum V  
of 500 V makes it an ideal choice. A comprehensive review of this  
DS(on)  
DSS  
procedure can be found in the Unitrode Power Supply Design Seminar SEM−1200, Topic 6, TI Literature No.  
SLUP117.  
More recently, faster switching insulated gate bipolar transistors (IGBTs) have become widely available.  
Depending on the system power level (and the switching frequency), use of IGBTs may make sense for the  
power switch.  
boost diode selection (D3 in Figure 9)  
In order to keep the switching losses to a minimum and meet the voltage and current requirements, a  
HFA08TB60 fast recovery diode from International Rectifier is selected for the design. This diode is rated for  
a maximum reverse voltage of 600 V and a maximum forward current of 8 A. The typical reverse recovery of  
18 ns made this diode ideal for this design.  
15  
www.ti.com  
ꢀ ꢁꢁꢂ ꢃ ꢄ ꢅ ꢅꢆ ꢀ ꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢇꢆ ꢀꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢂꢆ ꢀꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢈ  
ꢀ ꢁꢁꢈ ꢃ ꢄ ꢅ ꢅꢆ ꢀ ꢁꢁ ꢈ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁ ꢁꢈ ꢃ ꢄ ꢅ ꢂꢆ ꢀꢁ ꢁꢈ ꢃ ꢄ ꢅ ꢈ  
SLUS419C − AUGUST 1999 − REVISED NOVEMBER 2001  
TYPICAL APPLICATION  
peak current limit  
Resistor divider R14 and R29 along with current sense resistor R5, devise the peak-limit comparator of the  
UCC38500 and are used to protect the boost switch Q3 from excessive currents. Proper preparation of this  
comparator requires that it not interfere with the boost converter’s power limit or the forward converter’s  
pulse-by-pulse current limiting. For this design example the forward converter is selected to go into  
pulse-by-pulse current limiting at approximately 130% of maximum output power. The power limit of the boost  
converter is set at 140% of the maximum output power. The peak current limit for the boost stage was selected  
to engage at 150% of the maximum output power to ensure circuit stability.  
The following equation is used to select the current-sense resistor R5, where the current-sense resistor is  
selected to operate over a 1-V dynamic range (V  
). The current-sense resistor required for the design  
DYNAMIC  
needed to be approximately 0.43 .  
V
DYNAMIC  
R5 + R  
+
^ 0.43 W  
SENSE  
( )  
) 0.5   DI  
I
(9)  
PK  
The following equation is used to size resistor R14 properly by first selecting R29 to be a standard resistance  
value. For this design resistor R29 was selected to be 10 k. With a typical reference voltage (V  
gives a calculated value of approximately 1.91 kfor resistor R14.  
) of 7.5 V  
REF  
Ǹ
P
 1.5  2  
OUT  
ǒ
) DI  
Ǔ
  R5   R29  
V
 h1 h2  
IN (min)  
R14 +  
multiplier  
V
REF  
(10)  
The output of the multiplier of the UCC38500 is a signal representing the desired input line current. It is an input  
to the current amplifier, which programs the current loop to control the input current to give high power-factor  
operation. As such, the proper functioning of the multiplier is key to the success of the design. The inputs to the  
multiplier are V  
and an input voltage feed forward signal, V  
, the voltage amplifier output, I , a representation of the input rectified ac line voltage,  
VAOUT  
IAC  
. The output of the multiplier, I  
, can be expressed:  
MOUT  
VFF  
  ǒV  
K   ǒVVFFǓ2  
* 1Ǔ  
VAOUT  
I
IAC  
I
+
MOUT  
(11)  
Where K is a constant typically equal to 1 / V.  
The I signal is obtained through a high-value resistor connected between the rectified ac line and the IAC  
IAC  
pin of the UCC3850X. This resistor (R  
) is sized to provide the maximum I  
current at high line. For the  
IAC  
IAC  
UCC3850X the maximum I  
current is about 500 µA, and a higher current can drive the multiplier out of its  
IAC  
linear range. A smaller current level is functional, but noise can become an issue, especially at low input line.  
Assuming a universal line operation of 85 V to 265 V gives a R value of 750 k. Because of voltage  
RMS  
RMS  
IAC  
rating constraints of the standard 1/4-W resistor, this application requires a combination of lower value resistors  
connected in series to give the required resistance and distribute the high voltage amongst the resistors. For  
this design example two 383 kresistors are used in series.  
16  
www.ti.com  
ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢅ ꢆ ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢂ ꢆ ꢀꢁ ꢁꢂ ꢃꢄ ꢅꢈ  
ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢅ ꢆ ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢂ ꢆ ꢀꢁ ꢁꢈ ꢃꢄ ꢅꢈ  
SLUS419C − AUGUST 1999 − REVISED NOVEMBER 2001  
TYPICAL APPLICATION  
The current into the IAC pin is mirrored internally to the VFF pin where it is filtered to produce a voltage feed  
forward signal proportional to line voltage. The VFF voltage is used to keep the power stage gain constant and  
to providing input power limiting. Please refer to Texas instruments Application Note on Power Limiting with  
Sinusoidal Input TI Literature No. SLUA196, for detailed explanation on how the VFF pin provides power  
limiting. The following equation is used to determine the VFF resistor size (R  
) to provide power limiting where  
VFF  
V
is the minimum RMS input voltage and R  
is the total resistance connected between the IAC pin and  
IN(min)  
IAC  
the rectified line voltage.  
1.4 V  
R
+
^ 28.7 kW  
VFF  
V
 0.9  
IN (min)  
ǒ Ǔ  
2 R  
IAC  
(12)  
Because the VFF voltage is generated from line voltage it needs to be adequately filtered to reduce total  
harmonic distortion caused by the 120-Hz rectified line voltage. Refer to Unitrode Power Supply Design  
Seminar, SEM−700 Topic 7, Optimizing a High Power Factor Switching Preregulator, TI Literature No.  
SLUP093. A single pole filter is adequate for this design. Assuming that an allocation of 1.5% total harmonic  
distortion from this input is allowed, and that the second harmonic ripple is 66% of the input ac line voltage, the  
amount of attenuation required by this filter is:  
1.5%  
66%  
+ 0.022  
(13)  
With a ripple frequency (f ) of 120-Hz and an attenuation of 0.022 requires that the pole of the filter (f ) be placed  
R
P
at:  
f + 120 Hz   0.022 ^ 2.6 Hz  
(14)  
P
The following equation is used to select the filter capacitor (C  
1
) required to produce the desired low pass filter.  
VFF  
C
+
^ 2.2 mF  
VFF  
2p   R  
  f  
VFF  
P
(15)  
This results in a single-pole filter, which adequately attenuates the harmonic distortion and provides power  
limiting.  
The R  
resistor is sized to provide power limiting for the circuit. The power limit is set to 140% of the  
MOUT  
maximum output power. This is done so that the power limit of the PFC stage does not interfere with power  
limiting of the dc-to-dc converter, which is set to 130% of the maximum output power. The following equations  
are used to size the R  
resistor, R19. In these equations P  
is the maximum multiplier output current, I @V  
is the power limit level, P  
is the maximum  
MOUT  
LIMIT  
OUT  
output power. I  
is the minimum current into  
MOUT(max)  
IAC  
IN(min)  
the IAC pin at low line and V  
is the maximum voltage amplifier output voltage. For this design R19  
VAOUT(max)  
and R15 need to be approximately 3.57 k.  
P
  1.4  
OUT  
P
+
LIMIT  
h1   h2  
(16)  
(17)  
  ǒV  
* 1 VǓ  
I
@ V  
IAC  
IN(min)  
VAOUT(max)  
I
+
MOUT(max)  
K   ǒVFFǓ2  
17  
www.ti.com  
ꢀ ꢁꢁꢂ ꢃ ꢄ ꢅ ꢅꢆ ꢀ ꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢇꢆ ꢀꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢂꢆ ꢀꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢈ  
ꢀ ꢁꢁꢈ ꢃ ꢄ ꢅ ꢅꢆ ꢀ ꢁꢁ ꢈ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁ ꢁꢈ ꢃ ꢄ ꢅ ꢂꢆ ꢀꢁ ꢁꢈ ꢃ ꢄ ꢅ ꢈ  
SLUS419C − AUGUST 1999 − REVISED NOVEMBER 2001  
TYPICAL APPLICATION  
Ǹ
P
  2 R  
LIMIT  
SENSE  
V
IN (min)  
R
+
MOUT  
I
MOUT(max)  
(18)  
current loop  
The UCC38500 current amplifier has the input from the multiplier applied to the inverting input. This change in  
architecture from previous Texas Instruments PFC controllers improves noise immunity in the current amplifier.  
It also adds a phase inversion into the control loop. The UCC38500 takes advantage of this phase inversion  
to implement leading-edge duty cycle modulation. Please refer to Figure 10 for the typical configuration of the  
current amplifier.  
The following equation defines the gain of the power stage, where V is the voltage swing of the oscillator ramp,  
P
4 V for the UCC38500.  
V
  R  
BOOST  
SENSE  
G (s) +  
ID  
s   L  
  V  
BOOST  
P
(19)  
In order to have a good dynamic response the crossover frequency of the current loop was set to 10% of the  
switching frequency. This can be achieved by setting the gain of the current amplifier (G ) to the inverse of  
CA  
the current loop power stage gain at the crossover frequency. This design requires that the current amplifier  
have a gain of 2.581 at 10 kHz.  
1
G
+
+ 2.581  
CA  
G (s)  
ID  
(20)  
R is the R  
resistor, previously calculated to be 3.57 k(refer to Figure 10). The gain of the current amplifier  
I
MOUT  
is R /R , so multiplying R by G gives the value of R , in this case approximately 9.09 k. Setting a zero at  
F
I
I
EA  
F
the crossover frequency and a pole at half the switching frequency to roll off the high-frequency gain completes  
the current loop compensation.  
1
C +  
Z
2p   R   f  
F
C
(21)  
(22)  
1
C +  
P
f
s
ǒ Ǔ  
2p   R   
F
2
18  
www.ti.com  
ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢅ ꢆ ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢂ ꢆ ꢀꢁ ꢁꢂ ꢃꢄ ꢅꢈ  
ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢅ ꢆ ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢂ ꢆ ꢀꢁ ꢁꢈ ꢃꢄ ꢅꢈ  
SLUS419C − AUGUST 1999 − REVISED NOVEMBER 2001  
TYPICAL APPLICATION  
C
P
C
R
Z
f
R
I
+
CAOUT  
Figure 10. Current Loop Compensation  
voltage loop  
The second major source of harmonic distortion is the ripple on the output capacitor at the second harmonic  
of the line frequency. This ripple is fed back through the error amplifier and appears as a 3rd harmonic ripple  
at the input to the multiplier. The voltage loop must be compensated not just for stability but also to attenuate  
the contribution of this ripple to the total harmonic distortion of the system (refer to Figure 11).  
C
f
V
OUT  
C
R
Z
f
R
IN  
+
R
D
V
REF  
Figure 11. Voltage Amplifier Configuration  
The gain of the voltage amplifier, G , can be determined by first calculating the amount of peak ripple present  
VA  
on the output capacitor V  
The peak value of the second harmonic voltage is given by equation (23), where  
OPK.  
f
is the frequency of the rectified line voltage. For this design f is equal to 120 Hz.  
R
R
P
IN  
+ ǒ2 p   f   C  
BOOSTǓ  
V
OPK  
  V  
R
BOOST  
(23)  
19  
www.ti.com  
ꢀ ꢁꢁꢂ ꢃ ꢄ ꢅ ꢅꢆ ꢀ ꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢇꢆ ꢀꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢂꢆ ꢀꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢈ  
ꢀ ꢁꢁꢈ ꢃ ꢄ ꢅ ꢅꢆ ꢀ ꢁꢁ ꢈ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁ ꢁꢈ ꢃ ꢄ ꢅ ꢂꢆ ꢀꢁ ꢁꢈ ꢃ ꢄ ꢅ ꢈ  
SLUS419C − AUGUST 1999 − REVISED NOVEMBER 2001  
TYPICAL APPLICATION  
In this example V  
is equal to 4 V. Assuming an allowable contribution of 0.75% (1.5% peak-to-peak) from  
OPK  
the voltage loop to the total harmonic distortion budget sets the gain equal to:  
ǒDV  
Ǔ (  
0.015  
)
VAOUT  
G
+
VA  
2   V  
OPK  
(24)  
Where V  
is the effective output voltage range of the error amplifier (5 V for the UCC38500). The network  
VAOUT  
needed to realize this filter is comprised of an input resistor, R , and feedback components C , C , and R . The  
IN  
F
Z
F
value of R is already determined because of its function as one-half of a resistor divider from V  
feeding  
IN  
OUT  
back to the voltage amplifier for output voltage regulation. In this case the value is 1.12 M. This high value was  
chosen to reduce power dissipation in the resistor. In practice, the resistor value would be realized by the use  
of two 560-kresistors in series because of the voltage rating constraints of most standard 1/4 W resistors. The  
value of C is determined by the equation:  
F
1
C
F
+ ǒ2 p   f  
INǓ  
  G  
  R  
R
VA  
(25)  
In this example C equals 150 nF. Resistor R and C generate a pole in the voltage amplifier feedback to reduce  
F
F
F
total harmonic distortion (THD). The location of the pole is found by setting the gain of the loop equation to one  
and solving for the crossover frequency. The frequency, expressed in terms of input power, is calculated by the  
equation:  
ǸP  
IN  
f
+
VI  
2p ǸDV  
  V  
  R   C  
  C  
BOOST  
F
VAOUT  
OUT  
IN  
(26)  
f
for this converter is 10 Hz. A derivation of this equation can be found in the Unitrode Power Supply Design  
VI  
Seminar SEM−1000, Topic 1, Power Factor Correction Circuit, TI Literature No. SLUP106.  
Solving for R becomes:  
F
1
R
+ ǒ2 p   f  
FǓ  
F
  C  
VI  
(27)  
Or R equals approximately 118 k.  
F
Due to the low output impedance of the voltage amplifier, capacitor C is added to improve dc regulation. To  
Z
maintain good phase margin, the zero from C is set to 10% of f . For this design, C is a 2.2-µF capacitor. The  
Z
VI  
Z
following equation is used to calculate CZ.  
1
C +  
Z
f
VI  
2p   ǒ Ǔ  R  
F
10  
(28)  
20  
www.ti.com  
ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢅ ꢆ ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢂ ꢆ ꢀꢁ ꢁꢂ ꢃꢄ ꢅꢈ  
ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢅ ꢆ ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢂ ꢆ ꢀꢁ ꢁꢈ ꢃꢄ ꢅꢈ  
SLUS419C − AUGUST 1999 − REVISED NOVEMBER 2001  
TYPICAL APPLICATION  
II. Two Switch Forward DC−to−DC Power Stage  
A two-switch forward converter topology was selected for the second stage of this design. The two-switch  
forward power converter has two major advantages over a traditional forward converter, making it ideal for this  
application. First, the FETs used in the two-switch forward required only one-half the maximum V  
as  
DS  
compared to the traditional forward converter. Second, the transformer’s reset energy is returned to the input  
through clamping diodes for higher efficiency.  
transformer turns ratio  
Equation (29) calculates the transformer turns ratio required for the two-switch forward power converter of this  
design example. It can be derived from the dc transfer function of a forward converter. V  
is the output voltage  
OUT  
of the forward converter and is 12-V for this design. V is the forward voltage drop of the secondary rectifier diode  
F
and is set to 1V. V  
is the minimum input voltage to the forward converter. The level of this voltage is  
BOOST(min)  
determined by where the control device forces the dc-to-dc converter into undervoltage lockout (UVLO). The  
UCC38500 control device is configured to drive the dc-to-dc power stage into UVLO at approximately 74% of  
the nominal boost converters output voltage. V  
for this design is approximately 285 V. D  
is 0.44  
BOOST(min)  
MAX  
and is the guaranteed maximum duty cycle of the forward converter. For this design example the calculated  
turns ratio is approximately 0.101.  
V
) V  
N
N
OUT  
BOOST(min)  
F
S
P
Transformer Turns +  
+
V
  D  
MAX  
(29)  
output inductor  
The following equations can be used to calculate the inductor required for this design example. First, the  
minimum duty cycle D , which occurs at the maximum boost voltage, needs to be calculated. The maximum  
MIN  
boost voltage is limited by the OVP trip point, which is set to approximately 425 V. For this design D  
is  
MIN  
approximately 31%. The output inductor ripple current (I ) for this design is given at 30% of the maximum load  
L
current. Next calculate the output inductor (L), where the switching frequency (f ) is 100 kHz. The calculated  
S
output inductor for this design is approximately 38 µH.  
V
) V  
F
N
N
OUT  
P
S
D
+
 
MIN  
V
BOOST(max)  
(30)  
(31)  
P
  0.3  
OUT  
V
DI +  
L
OUT  
ǒV  
Ǔ ǒ  
MINǓ  
) V   1 * D  
OUT  
F
L +  
DI   f  
L
S
(32)  
21  
www.ti.com  
ꢀ ꢁꢁꢂ ꢃ ꢄ ꢅ ꢅꢆ ꢀ ꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢇꢆ ꢀꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢂꢆ ꢀꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢈ  
ꢀ ꢁꢁꢈ ꢃ ꢄ ꢅ ꢅꢆ ꢀ ꢁꢁ ꢈ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁ ꢁꢈ ꢃ ꢄ ꢅ ꢂꢆ ꢀꢁ ꢁꢈ ꢃ ꢄ ꢅ ꢈ  
SLUS419C − AUGUST 1999 − REVISED NOVEMBER 2001  
TYPICAL APPLICATION  
output capacitor  
The following equations can be used to estimate the minimum output capacitance and the capacitor’s maximum  
allowable equivalent series resistance (ESR), where C is the minimum output capacitance and t is the  
OUT  
S
period of the switching frequency. V  
is the maximum allowable output ripple voltage, selected as  
OUT  
approximately 1% of the output voltage. For this design, the minimum calculated output capacitance is 170 µF  
and the maximum allowable ESR is 96 m. A Panasonic HFQ 1800-µF electrolytic capacitor with an ESR of  
0.048 is used.  
ǒV  
Ǔ
ǒ Ǔ2  
  t  
S
  ǒD  
Ǔ
) V  
OUT  
F
MAX  
1
8
C
+
 
OUT  
L   DV  
OUT  
(33)  
(34)  
DV  
OUT  
ESR +  
DI  
L
R
SENSE2  
The dc-to-dc power converter is designed for peak current mode control. R  
is the resistor that senses  
SENSE2  
the current in the forward converter. The sense resistor in Figure 9 is referred to as R4. The following equations  
can be used to calculate R . Where I is the magnetizing current of the transformer used in the step-down  
SENSE2  
M
converter and V  
is the output voltage of the boost stage. D is the typical duty ratio of the forward converter.  
BOOST  
V
is the peak current sense comparator voltage that is typically 1.15 V. For this design example L  
ISENSE2_peak  
M
is approximately 8 mH and the R  
is approximately 1 .  
SENSE2  
V
BOOST  
D
I
+
 
M
L
f
M
S
(35)  
V
ISENSE2_peak  
R
+
SENSE2  
N
DI  
S
P
L
ǒ
  1.3Ǔ  
I
)
) I  
OUT(max)  
M
2
N
(36)  
soft-start  
The UCC38500 has soft-start circuitry to allow for a controlled ramp of the second stage’s duty cycle during  
start-up. This is accomplished through the SS2 circuitry described earlier in this data sheet. Equation (37)  
calculates the approximate capacitance needed based on the designer’s soft-start requirements. Where I  
SS2  
is the soft-start charging current, which is typically 10 µA. t is the desired soft start time, which was selected  
to be approximately 5 ms for this example. The calculated soft-start capacitor (C ) for this example is  
SS  
approximately 10 nF.  
I
  D t  
ISS2  
C
+
SS  
4.5  
slope compensation  
(37)  
When designing with peak current-mode control, slope compensation may be necessary to prevent instability.  
In this design, the magnetizing current provided more than enough slope compensation. If slope compensation  
is needed with external components, please refer to Unitrode/Texas Instruments Application Note, Practical  
Considerations in Current Mode Power Supplies, TI Literature No. SLUA110.  
22  
www.ti.com  
ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢅ ꢆ ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢂ ꢆ ꢀꢁ ꢁꢂ ꢃꢄ ꢅꢈ  
ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢅ ꢆ ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢂ ꢆ ꢀꢁ ꢁꢈ ꢃꢄ ꢅꢈ  
SLUS419C − AUGUST 1999 − REVISED NOVEMBER 2001  
TYPICAL APPLICATION  
control loop  
Figure 12 shows the control block diagram for the typical application shown in Figure 9. G (s) is the  
C
compensation network’s transfer function (TF), G  
(s) is the opto-isolator TF, G (s) is the control-to-output  
OPTO  
CO  
TF, and H(s) is the divider TF. The following equations can be used to estimate the frequency response of each  
gain block, where f is the frequency, where the optoisolator is −3 dB from its dc operating point, and  
OPTO_pole  
V
is the reference voltage of the TL431 shunt regulator. R  
represents the typical load impedance  
REF_TL431  
LOAD  
for the design.  
R13  
R36  
1
G
(s) +  
 
OPTO  
s
1 )  
2p f  
OPTO_pole  
(38)  
s   R35   C14 ) 1  
s   C14   R31   1 ) s   R35   C15  
R13  
R36  
1
s
G (s) +  
 
 
C
(
(
))  
1 )  
2p f  
OPTO_pole  
(39)  
(40)  
V
VREF_TL431  
R27  
R27 ) R31  
H(s) +  
+
V
OUT  
1 ) ǒs   C  
Ǔ
ǒ
  ESR Ǔ  
V
R
LOAD  
N
OUT  
OUT  
P
G
(s) +  
+
 
 
CO  
V
R
N
s
1 ) ǒs   C  
Ǔ
ǒ
LOAD Ǔ  
C
SENSE2  
  R  
OUT  
(41)  
V
BOOST  
V
C
V
OUT  
V
REF_TL431  
G (s)  
C
G
(s)  
CO  
Σ
H(s)  
Figure 12. UCC38500 Control Block  
23  
www.ti.com  
ꢀ ꢁꢁꢂ ꢃ ꢄ ꢅ ꢅꢆ ꢀ ꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢇꢆ ꢀꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢂꢆ ꢀꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢈ  
ꢀ ꢁꢁꢈ ꢃ ꢄ ꢅ ꢅꢆ ꢀ ꢁꢁ ꢈ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁ ꢁꢈ ꢃ ꢄ ꢅ ꢂꢆ ꢀꢁ ꢁꢈ ꢃ ꢄ ꢅ ꢈ  
SLUS419C − AUGUST 1999 − REVISED NOVEMBER 2001  
TYPICAL APPLICATION  
Figure 13 shows the circuitry for the voltage feedback loop. D13 is a TL431 shunt regulator that functions as  
an operational amplifier, providing feedback control.  
V
BOOST  
V
V = V  
OUT  
C
ERR  
G
(s)  
CO  
Q5  
V
REF  
R36  
R16  
H11AV1  
D14  
6
5
R13  
1
PGND2  
R31  
2
3
C14  
R35  
4
C15  
U3  
D13  
SGND  
R27  
UDG−01091  
Figure 13. UCC38500 Feedback Loop  
Initially the designer must select the resistor values for the divider gain H(s). Equation (42) is used to determine  
resistor size. Selecting R27 to be a standard value of 10-krequires R31 to be approximately 38.3 k.  
R27 ǒV  
REFǓ  
* V  
OUT  
R31 +  
V
REF  
(42)  
It is important to correctly bias the TL431 and the optoisolator for proper operation. Zener diode D14 and a  
depletion mode J-FET, Q5, supply the bias voltage for the TL431. Resistors R16 and R13 provide the minimum  
bias currents for the TL431 and the optoisolator respectively and can be calculated with the following equations.  
Where I  
is the minimum optoisolation current, and V  
is the maximum voltage seen at the VERR  
OP(min)  
VERR(max)  
pin of the UCC38500. VERR has an internal clamp that limits this pin to 4.5 V. V is the typical forward voltage  
of the diode in the opto isolator, and I  
F
is the minimum cathode current of the TL431. For the  
TL431(min)  
components used in this design example R13 is calculated to be approximately 2.0 kand R16 was calculated  
to be approximately 680 . The optoisolator is configured to have dc gain of approximately 20 dB and the  
optoisolator −3 dB point is approximately 8 kHz. Figure 14 shows the frequency response of the optoisolator.  
24  
www.ti.com  
ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢅ ꢆ ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁꢁ ꢂ ꢃꢄ ꢅ ꢂ ꢆ ꢀꢁ ꢁꢂ ꢃꢄ ꢅꢈ  
ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢅ ꢆ ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁꢁ ꢈ ꢃꢄ ꢅ ꢂ ꢆ ꢀꢁ ꢁꢈ ꢃꢄ ꢅꢈ  
SLUS419C − AUGUST 1999 − REVISED NOVEMBER 2001  
TYPICAL APPLICATION  
V
F
R16 +  
R13 +  
I
TL431 (min)  
(43)  
(44)  
V
* V  
REF  
VERR (max)  
I
OP (min)  
To compensate the loop, it is necessary to estimate or measure the control-to-output gain’s frequency response  
(s). The frequency response for G (s) was measured with a network analyzer and the measured  
G
CO  
CO  
frequency response is shown in Figure 15.  
POWER STAGE CONTROL-TO-OUTPUT TRANSFER  
OPTOISOLATOR TRANSFER FUNCTION  
FUNCTION (GAIN AND PHASE)  
(GAIN AND PHASE)  
vs.  
vs.  
FREQUENCY  
FREQUENCY  
50  
40  
180  
144  
108  
72  
60  
180  
40  
20  
0
120  
60  
GAIN  
30  
20  
GAIN  
10  
36  
0
0
0
−10  
−20  
−36  
−72  
−60  
−20  
−120  
PHASE  
−30  
−40  
−50  
−108  
−144  
−180  
−40  
−60  
PHASE  
−180  
100  
1 k  
10 k  
100 k  
100  
1 k  
10 k  
100 k  
f − Frequency − Hz  
f − Frequency − Hz  
Figure 14  
Figure 15  
After determining the frequency response of G (s) it is necessary to define some closed loop frequency  
CO  
response design goals. The following equation describes the frequency response of the loop gain (T(s) ) of  
dB  
the system in decibels. Typically, the loop is designed to crossover at a frequency below one-sixth of the  
switching frequency. In order for this design example to have good transient response, the design goal is to have  
the loop gain crossover at approximately 1 kHz, which is less than one-sixth of the switching frequency. The  
gain crossover frequency for this design example is referenced as f .  
C
T(s) dB + G (s) ) G (s) ) H(s)  
C
CO  
(45)  
The compensation network that is used (G (s)) has three poles and one zero. One pole occurs at the origin,  
C
and a second pole is caused by the limitations of the opto-isolator. The third pole is set to attenuate the  
high-frequency gain and needs to be set to one-half of the switching frequency. The zero is set at the desired  
crossover frequency.  
The following equations can be used to select R35, C14 and C15, where G (s), G  
(s), and H(s) are the  
CO  
OPTO  
gains in decibels (dB) of each control block at the desired f . From the graphs in Figures 14 and 15 it can be  
C
observed at the desired crossover frequency G (s) is approximately 0 dB and G  
(s) is approximately  
CO  
OPTO  
25  
www.ti.com  
ꢀ ꢁꢁꢂ ꢃ ꢄ ꢅ ꢅꢆ ꢀ ꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢇꢆ ꢀꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢂꢆ ꢀꢁ ꢁꢂ ꢃ ꢄ ꢅ ꢈ  
ꢀ ꢁꢁꢈ ꢃ ꢄ ꢅ ꢅꢆ ꢀ ꢁꢁ ꢈ ꢃꢄ ꢅ ꢇ ꢆ ꢀꢁ ꢁꢈ ꢃ ꢄ ꢅ ꢂꢆ ꢀꢁ ꢁꢈ ꢃ ꢄ ꢅ ꢈ  
SLUS419C − AUGUST 1999 − REVISED NOVEMBER 2001  
23 dB. Therefore the compensation circuitry needs to have a gain of −23 dB at the desired crossover frequency.  
For this example R35 is calculated at approximately 18.2 k. Capacitor C14 is estimated to be approximately  
10 nF and C15 is calculated at approximately 180 pF.  
V
REF  
H(s) + 20logƪ ƫ  
V
OUT  
(46)  
ǒ
Ǔ
*GCO(s) dB)GOPTO(s) dB)H(s) dB  
R35 + R31   10  
(47)  
1
C14 +  
ǒ
CǓ  
2p   R35   f  
(48)  
1
C15 +  
f
SW  
2
ǒ
Ǔ
2p   R35   
(49)  
Figure 16 shows the frequency response of the compensation network G (s) and Figure 17 shows the  
C
measured frequency response of the loop gain T(s). The frequency response characteristics in Figure 17 show  
that f is approximately 1.5 kHz with a phase margin of about 55 degrees. The gain margin is approximately  
C
50 dB.  
FEEDBACK CONTROL TRANSFER FUNCTION  
TOTAL LOOP TRANSFER FUNCTION  
(GAIN AND PHASE)  
vs.  
(GAIN AND PHASE)  
vs.  
FREQUENCY  
FREQUENCY  
60  
180  
60  
180  
COMPENSATION  
PHASE  
40  
20  
0
120  
60  
40  
20  
0
LOOP PHASE  
120  
60  
0
0
COMPENSATION  
GAIN  
−60  
−20  
−20  
−60  
LOOP GAIN  
−120  
−40  
−60  
−120  
−40  
−60  
−180  
−180  
100 k  
100  
1 k  
10 k  
100 k  
100  
1 k  
10 k  
f − Frequency − Hz  
f − Frequency − Hz  
Figure 16  
Figure 17  
26  
www.ti.com  
PACKAGE OPTION ADDENDUM  
www.ti.com  
18-Feb-2005  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
SOIC  
SOIC  
PDIP  
SOIC  
SOIC  
PDIP  
SOIC  
SOIC  
PDIP  
SOIC  
SOIC  
PDIP  
SOIC  
SOIC  
PDIP  
SOIC  
SOIC  
PDIP  
SOIC  
SOIC  
PDIP  
SOIC  
SOIC  
PDIP  
Drawing  
DW  
DW  
N
UCC28500DW  
UCC28500DWTR  
UCC28500N  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
25  
2000  
20  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
CU SNPB  
CU SNPB  
CU SNPB  
CU SNPB  
CU SNPB  
CU SNPB  
CU SNPB  
CU SNPB  
CU SNPB  
CU SNPB  
CU SNPB  
CU SNPB  
CU SNPB  
CU SNPB  
CU SNPB  
CU SNPB  
CU SNPB  
CU SNPB  
CU SNPB  
CU SNPB  
CU SNPB  
CU SNPB  
CU SNPB  
CU SNPB  
Level-2-220C-1 YEAR  
Level-2-220C-1 YEAR  
Level-NA-NA-NA  
UCC28501DW  
UCC28501DWTR  
UCC28501N  
DW  
DW  
N
25  
Level-2-220C-1 YEAR  
Level-2-220C-1 YEAR  
Level-NA-NA-NA  
2000  
20  
UCC28502DW  
UCC28502DWTR  
UCC28502N  
DW  
DW  
N
25  
Level-2-220C-1 YEAR  
Level-2-220C-1 YEAR  
Level-NA-NA-NA  
2000  
20  
UCC28503DW  
UCC28503DWTR  
UCC28503N  
DW  
DW  
N
25  
Level-2-220C-1 YEAR  
Level-2-220C-1 YEAR  
Level-NA-NA-NA  
2000  
20  
UCC38500DW  
UCC38500DWTR  
UCC38500N  
DW  
DW  
N
25  
Level-2-220C-1 YEAR  
Level-2-220C-1 YEAR  
Level-NA-NA-NA  
2000  
20  
UCC38501DW  
UCC38501DWTR  
UCC38501N  
DW  
DW  
N
25  
Level-2-220C-1 YEAR  
Level-2-220C-1 YEAR  
Level-NA-NA-NA  
2000  
20  
UCC38502DW  
UCC38502DWTR  
UCC38502N  
DW  
DW  
N
25  
Level-2-220C-1 YEAR  
Level-2-220C-1 YEAR  
Level-NA-NA-NA  
2000  
20  
UCC38503DW  
UCC38503DWTR  
UCC38503N  
DW  
DW  
N
25  
Level-2-220C-1 YEAR  
Level-2-220C-1 YEAR  
Level-NA-NA-NA  
2000  
20  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional  
product content details.  
None: Not yet available Lead (Pb-Free).  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,  
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
18-Feb-2005  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to discontinue  
any product or service without notice. Customers should obtain the latest relevant information before placing  
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms  
and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
deems necessary to support this warranty. Except where mandated by government requirements, testing of all  
parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for  
their products and applications using TI components. To minimize the risks associated with customer products  
and applications, customers should provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,  
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process  
in which TI products or services are used. Information published by TI regarding third-party products or services  
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.  
Use of such information may require a license from a third party under the patents or other intellectual property  
of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without  
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction  
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for  
such altered documentation.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that  
product or service voids all express and any implied warranties for the associated TI product or service and  
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.  
Following are URLs where you can obtain information on other Texas Instruments products and application  
solutions:  
Products  
Applications  
Audio  
Amplifiers  
amplifier.ti.com  
www.ti.com/audio  
Data Converters  
dataconverter.ti.com  
Automotive  
www.ti.com/automotive  
DSP  
dsp.ti.com  
Broadband  
Digital Control  
Military  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
Logic  
interface.ti.com  
logic.ti.com  
Power Mgmt  
Microcontrollers  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
www.ti.com/telephony  
www.ti.com/video  
microcontroller.ti.com  
Telephony  
Video & Imaging  
Wireless  
www.ti.com/wireless  
Mailing Address:  
Texas Instruments  
Post Office Box 655303 Dallas, Texas 75265  
Copyright 2005, Texas Instruments Incorporated  

相关型号:

UCC28501NG4

IC 1.2 A POWER FACTOR CONTROLLER WITH POST REGULATOR, 120 kHz SWITCHING FREQ-MAX, PDIP20, GREEN, PLASTIC, DIP-20, Switching Regulator or Controller
TI

UCC28502

BiCMOS PFC/PWM Combination Controller
TI

UCC28502DW

BICMOS PFC/PWM COMBINATION CONTROLLER
TI

UCC28502DWTR

BICMOS PFC/PWM COMBINATION CONTROLLER
TI

UCC28502DWTRG4

1.2A POWER FACTOR CONTROLLER WITH POST REGULATOR, 120kHz SWITCHING FREQ-MAX, PDSO20, GREEN, PLASTIC, SOIC-20
TI

UCC28502N

BICMOS PFC/PWM COMBINATION CONTROLLER
TI

UCC28502NG4

IC 1.2 A POWER FACTOR CONTROLLER WITH POST REGULATOR, 120 kHz SWITCHING FREQ-MAX, PDIP20, GREEN, PLASTIC, DIP-20, Switching Regulator or Controller
TI

UCC28503

BiCMOS PFC/PWM Combination Controller
TI

UCC28503DW

BICMOS PFC/PWM COMBINATION CONTROLLER
TI

UCC28503DWG4

BiCMOS PFC/PWM COMBINATION CONTROLLER
TI

UCC28503DWTR

BICMOS PFC/PWM COMBINATION CONTROLLER
TI

UCC28503DWTRG4

1.2A POWER FACTOR CONTROLLER WITH POST REGULATOR, 120kHz SWITCHING FREQ-MAX, PDSO20, GREEN, PLASTIC, SOIC-20
TI